Power supply unit for aerosol generator, and aerosol generator

Abstract

In the present invention, a power supply unit (110) of an inhalation device (100) comprises: a power supply unit (111C) that is capable of supplying electric power to a heating unit (121C) for heating a stick-type base material (150) and / or an aroma source (131); and a sensor FPC (73) on which a stick detection sensor (12), an inhalation sensor (13), a case temperature sensor (14), signal wiring (733), and ground wiring (734) are mounted. The sensor FPC (73) has a first region (A1) that is close to the heating unit (121C), and a second region (A2) that is further from the heating unit (121C) than the first region (A1). In the sensor FPC (73), the wiring density in the first region (A1) is lower than the wiring density in the second region (A2).

Description

Technical Field

[0004] ,

[0006] , , ,

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[0001] The present disclosure relates to a power supply unit of an aerosol generating device and an aerosol generating device.

Background Art

[0002] An aerosol generating device houses a power supply, a heating unit, a plurality of sensors, and a circuit board on which the sensors and a control device are mounted, etc. inside a case. Further, in an aerosol generating device, a flexible printed circuit board may be used in order to achieve miniaturization. For example, Patent Document 1 describes an aerosol generating device including a rigid board and a flexible printed circuit board.

Prior Art Documents

Patent Documents

[0003] <​​​​​​​​​​​​​​​​​​​​​​ The power supply unit of the aerosol generating apparatus of this disclosure is A power supply capable of supplying power to a heating unit that heats at least one of an aerosol source and a flavor source, A flexible printed circuit board on which one or more elements and / or wiring are mounted, A power supply unit for an aerosol generating apparatus, comprising: The flexible printed circuit board has a first region close to the heating element and a second region further from the heating element than the first region. The flexible printed circuit board has a first wiring layer and a second wiring layer laminated on it. In each of the first and second wiring layers, the wiring density of the first region is lower than the wiring density of the second region. Ground wiring is formed in the first and second regions of the first wiring layer, and in the first and second regions of the second wiring layer. At least a portion of the aforementioned ground wiring is formed in a mesh pattern, The first region of the first wiring layer and the second wiring layer, and / or the second region of the first wiring layer and the second wiring layer, have solid regions formed in which at least one mesh-like mesh portion is closed. Vias are formed in the solid region to connect the ground wiring of the first wiring layer and the ground wiring of the second wiring layer.

[0007] The aerosol generating apparatus of this disclosure is A heating unit that heats at least one of the aerosol source and the flavor source, A power supply capable of supplying power to the heating section, A flexible printed circuit board on which one or more elements and / or wiring are mounted, an aerosol generating apparatus comprising, The flexible printed circuit board has a first region close to the heating element and a second region further from the heating element than the first region. The flexible printed circuit board has a first wiring layer and a second wiring layer laminated on it. In each of the first and second wiring layers, the wiring density of the first region is lower than the wiring density of the second region. Ground wiring is formed in the first and second regions of the first wiring layer, and in the first and second regions of the second wiring layer. At least a portion of the aforementioned ground wiring is formed in a mesh pattern, The first region of the first wiring layer and the second wiring layer, and / or the second region of the first wiring layer and the second wiring layer, have solid regions formed in which at least one mesh-like mesh portion is closed. Vias are formed in the solid region to connect the ground wiring of the first wiring layer and the ground wiring of the second wiring layer. [Effects of the Invention]

[0008] According to this disclosure, high energy efficiency can be achieved. [Brief explanation of the drawing]

[0009] [Figure 1] FIG. 1 is a schematic diagram schematically showing a first configuration example (suction device 100A) of the suction device. [Figure 2] FIG. 2 is a schematic diagram schematically showing a second configuration example (suction device 100B) of the suction device. [Figure 3] FIG. 3 is an overall perspective view of a suction device 100 which is an embodiment of the suction device of the present disclosure. [Figure 4] FIG. 4 is a perspective view of the internal unit 10 as seen from the front right side. [Figure 5] FIG. 5 is a perspective view of the internal unit 10 as seen from the front left side. [Figure 6] FIG. 6 is an exploded perspective view of the internal unit 10. [Figure 7] FIG. 7 is a cross-sectional perspective view of the heater assembly 30. [Figure 8] FIG. 8 is a block diagram simply showing the electrical connection of the main elements of the internal unit 10. [Figure 9] FIG. 9 is a developed view of the surface of the sensor FPC 73. [Figure 10] FIG. 10 is a developed view of the back surface of the sensor FPC 73. [Figure 11] FIG. 11 is a cross-sectional view of the first wiring layer 73L1 as seen from the surface side of the sensor FPC 73. [Figure 12] FIG. 12 is a cross-sectional view of the second wiring layer 73L2 as seen from the surface side of the sensor FPC 73. [Figure 13] FIG. 13 is a perspective view of a main part in the vicinity of the sensor FPC 73 as seen from the upper obliquely right front direction. [Figure 14] FIG. 14 is a perspective view of a main part in the vicinity of the sensor FPC 73 as seen from the upper obliquely left rear direction.

MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, a suction device, control method, and program according to one embodiment of the present disclosure will be described with reference to the drawings. First, two applicable configuration examples (the first configuration example and the second configuration example) of the suction device of the present disclosure will be described. In the following, identical or similar elements will be denoted by the same or similar reference numerals, and their descriptions may be omitted or simplified as appropriate.

[0011] <<1. Example of Suction Device Configuration>> A suction device is a device that generates a substance to be aspirated by the user. In the following explanation, the substance generated by the suction device is assumed to be an aerosol. Alternatively, the substance generated by the suction device may be a gas.

[0012] (1) First example configuration Figure 1 is a schematic diagram illustrating a first configuration example of a suction device. As shown in Figure 1, the suction device 100A according to this configuration example includes a power supply unit 110, a cartridge 120, and a flavoring cartridge 130. The power supply unit 110 includes a power supply unit 111A, a sensor unit 112A, a notification unit 113A, a storage unit 114A, a communication unit 115A, and a control unit 116A. The cartridge 120 includes a heating unit 121A, a liquid induction unit 122, and a liquid storage unit 123. The flavoring cartridge 130 includes a flavor source 131 and a mouthpiece 124. Air passages 180 are formed in the cartridge 120 and the flavoring cartridge 130.

[0013] The power supply unit 111A stores power. Then, based on the control by the control unit 116A, the power supply unit 111A supplies power to each component of the suction device 100A. The power supply unit 111A may be composed of a rechargeable battery, such as a lithium-ion secondary battery.

[0014] The sensor unit 112A acquires various information related to the suction device 100A. For example, the sensor unit 112A is composed of a pressure sensor such as a condenser microphone, a flow sensor, or a temperature sensor, and acquires values ​​associated with suction by the user. As another example, the sensor unit 112A is composed of an input device such as a button or switch that accepts information input from the user.

[0015] The notification unit 113A notifies the user of information. The information that the notification unit 113A notifies the user of includes, for example, the State of Charge (SOC) indicating the charging status of the power supply unit 111A, the preheating time during suction, and various other information such as the period during which suction is possible. The notification unit 113A is composed of, for example, a light-emitting device that emits light, a display device that displays an image, a sound output device that emits sound, or a vibration device that vibrates.

[0016] The memory unit 114A stores various information for the operation of the suction device 100A. The memory unit 114A is composed of a non-volatile storage medium such as flash memory.

[0017] The communication unit 115A is a communication interface capable of performing communication in accordance with any wired or wireless communication standard. Examples of such communication standards include those using Wi-Fi®, Bluetooth®, BLE (Bluetooth Low Energy®), NFC (Near Field Communication), or LPWA (Low Power Wide Area).

[0018] The control unit 116A functions as both an arithmetic processing unit and a control device, controlling the overall operation of the suction device 100A according to various programs. The control unit 116A is implemented by electronic circuits such as a CPU (Central Processing Unit) or a microprocessor.

[0019] The liquid storage unit 123 stores the aerosol source. An aerosol is generated when the aerosol source is atomized. The aerosol source is, for example, a polyhydric alcohol such as glycerin and propylene glycol, or a liquid such as water. The aerosol source may contain tobacco-derived or non-tobacco-derived flavoring components. If the inhalation device 100A is a medical inhaler such as a nebulizer, the aerosol source may contain a drug.

[0020] The liquid guide unit 122 guides and holds the aerosol source, which is a liquid stored in the liquid storage unit 123, from the liquid storage unit 123. The liquid guide unit 122 is, for example, a wick formed by twisting a fibrous material such as glass fiber or a porous material such as porous ceramic. In this case, the aerosol source stored in the liquid storage unit 123 is guided by the capillary effect of the wick.

[0021] The heating unit 121A generates an aerosol by heating the aerosol source, thereby atomizing it. In the example shown in Figure 1, the heating unit 121A is configured as a coil and is wound around the liquid guide unit 122. When the heating unit 121A generates heat, the aerosol source held in the liquid guide unit 122 is heated and atomized, generating an aerosol. The heating unit 121A generates heat when power is supplied from the power supply unit 111A. For example, power may be supplied to the heating unit 121A when the sensor unit 112A detects that the user has started suctioning and / or that predetermined information has been input. Power may then be stopped when the sensor unit 112A detects that the user has finished suctioning and / or that predetermined information has been input. The user's suction operation on the suction device 100A can be detected, for example, based on the pressure (internal pressure) inside the suction device 100A detected by the suction sensor exceeding a predetermined threshold.

[0022] Flavoring source 131 is a component for imparting flavor components to the aerosol. Flavoring source 131 may contain flavor components derived from tobacco or non-tobacco.

[0023] The air passage 180 is a passage for air drawn in by the user. The air passage 180 has a tubular structure with an air inlet 181, which is the entrance for air into the air passage 180, and an air outlet 182, which is the exit for air from the air passage 180, at both ends. In the middle of the air passage 180, a liquid guide unit 122 is located on the upstream side (closer to the air inlet 181) and a flavor source 131 is located on the downstream side (closer to the air outlet 182). Air drawn in from the air inlet 181 by the user is mixed with the aerosol generated by the heating unit 121A and transported to the air outlet 182 through the flavor source 131, as shown by arrow 190. When the mixed fluid of aerosol and air passes through the flavor source 131, flavor components contained in the flavor source 131 are imparted to the aerosol.

[0024] The mouthpiece 124 is a component that the user holds in their mouth during suction. The mouthpiece 124 has an air outlet 182. By holding the mouthpiece 124 in their mouth and suctioning, the user can take in a mixed fluid of aerosol and air into their oral cavity.

[0025] The above describes an example configuration of the suction device 100A. Of course, the configuration of the suction device 100A is not limited to the above, and it can take various configurations as exemplified below.

[0026] For example, the inhalation device 100A does not necessarily have to include a flavoring cartridge 130. In that case, a mouthpiece 124 is provided on the cartridge 120.

[0027] As another example, the suction device 100A may contain multiple types of aerosol sources. Multiple types of aerosols generated from multiple types of aerosol sources may be mixed in the air channel 180 and undergo a chemical reaction to generate even more types of aerosols.

[0028] Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121A. For example, the means for atomizing the aerosol source may be vibration atomization or induction heating.

[0029] (2) Second example configuration Figure 2 is a schematic diagram illustrating a second configuration example of the suction device. As shown in Figure 2, the suction device 100B according to this configuration example includes a power supply unit 111B, a sensor unit 112B, a notification unit 113B, a storage unit 114B, a communication unit 115B, a control unit 116B, a heating unit 121B, a housing unit 140, and a heat insulation unit 144. In the first configuration example, the suction device 100A had a separate power supply unit 110 housing the power supply unit 111A and a separate heating unit 121A, but in the second configuration example, the suction device 100B has the power supply unit 111B and the heating unit 121B integrated into one unit. In other words, the suction device 100B of the second configuration example can also be described as a power supply unit with a built-in heating unit.

[0030] Each of the power supply unit 111B, sensor unit 112B, notification unit 113B, storage unit 114B, communication unit 115B, and control unit 116B is substantially identical to the corresponding component included in the suction device 100A according to the first configuration example.

[0031] The housing section 140 has an internal space 141 and holds the stick-type substrate 150 while housing a portion of the stick-type substrate 150 in the internal space 141. The housing section 140 has an opening 142 that communicates the internal space 141 with the outside and accommodates the stick-type substrate 150 inserted into the internal space 141 from the opening 142. For example, the housing section 140 is a cylindrical body with the opening 142 and bottom 143 as its base, defining a columnar internal space 141. An air passage is connected to the housing section 140 to supply air to the internal space 141. An air inlet, which is the air entrance to the air passage, is located, for example, on the side of the suction device 100. An air outlet, which is the air exit from the air passage to the internal space 141, is located, for example, on the bottom 143.

[0032] The stick-type base material 150 includes a base material portion 151 and a mouthpiece portion 152. The base material portion 151 includes an aerosol source. The aerosol source includes flavoring components derived from tobacco or non-tobacco. If the inhalation device 100B is a medical inhaler such as a nebulizer, the aerosol source may also include a drug. The aerosol source may be a liquid such as glycerin and polyhydric alcohols such as propylene glycol, and water, which include flavoring components derived from tobacco or non-tobacco, or it may be a solid which includes flavoring components derived from tobacco or non-tobacco. When the stick-type base material 150 is held in the housing portion 140, at least a part of the base material portion 151 is housed in the internal space 141, and at least a part of the mouthpiece portion 152 protrudes from the opening 142. When the user puts the mouthpiece portion 152 protruding from the opening 142 in their mouth and inhales, air flows into the internal space 141 via an air passage (not shown) and reaches the user's mouth together with the aerosol generated from the base material portion 151.

[0033] In the example shown in Figure 2, the heating element 121B is configured as a film and is positioned to cover the outer circumference of the housing element 140. When the heating element 121B generates heat, the base material portion 151 of the stick-shaped base material 150 is heated from the outer circumference, and an aerosol is generated.

[0034] The heat insulating section 144 prevents heat transfer from the heating section 121B to other components. For example, the heat insulating section 144 is made of a vacuum insulating material or an aerogel insulating material.

[0035] The above describes an example configuration of the suction device 100B. Of course, the configuration of the suction device 100B is not limited to the above, and it can take various configurations as exemplified below.

[0036] As an example, the heating element 121B may be configured in a blade shape and positioned to protrude from the bottom 143 of the housing 140 into the internal space 141. In this case, the blade-shaped heating element 121B is inserted into the base material portion 151 of the stick-shaped base material 150 and heats the base material portion 151 of the stick-shaped base material 150 from the inside. As another example, the heating element 121B may be positioned to cover the bottom 143 of the housing 140. Furthermore, the heating element 121B may be configured as a combination of two or more of the following: a first heating element covering the outer circumference of the housing 140, a blade-shaped second heating element, and a third heating element covering the bottom 143 of the housing 140.

[0037] As another example, the housing section 140 may include an opening and closing mechanism, such as a hinge, that opens and closes a part of the outer shell forming the internal space 141. The housing section 140 may then house the stick-shaped base material 150 inserted into the internal space 141 while clamping it by opening and closing the outer shell. In this case, the heating section 121B may be provided at the clamping location in the housing section 140 and may heat the stick-shaped base material 150 while pressing it.

[0038] Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121B. For example, the means for atomizing the aerosol source may be induction heating. In that case, the suction device 100B has at least an electromagnetic induction source, such as a coil that generates a magnetic field, instead of the heating unit 121B. The susceptor that generates heat by induction heating may be provided in the suction device 100B or may be included in the stick-type substrate 150.

[0039] Furthermore, the suction device 100B may further include a heating unit 121A, a liquid induction unit 122, a liquid storage unit 123, and an air passage 180 according to the first configuration example, and the air passage 180 may supply air to the internal space 141. In this case, the mixed fluid of aerosol generated by the heating unit 121A and air flows into the internal space 141, is further mixed with the aerosol generated by the heating unit 121B, and reaches the user's oral cavity.

[0040] <<2. Example of the configuration of the suction device of this disclosure>> Next, we will describe an embodiment of a suction device (hereinafter referred to as suction device 100) in which the configuration of the suction device of this disclosure is applied to the suction device 100B of the second configuration example described above. Although a detailed explanation will be omitted, some of the configuration of the suction device 100 described below can also be applied to the suction device 100A of the first configuration example.

[0041] Figure 3 is an overall perspective view of the suction device 100. In the following explanation, the insertion and removal direction of the stick-type substrate 150 from the suction device 100 is defined as the vertical direction, the sliding direction of the shutter 23 (described later) is defined as the front-back direction, and the direction perpendicular to the vertical and front-back directions is defined as the left-right direction. Also, as shown in the figure, the front is Fr, the rear is Rr, the left side is L, the right side is R, the top is U, and the bottom is D.

[0042] The suction device 100 is preferably small enough to fit in the hand, and for example, it has a rod shape. For example, the user holds the suction device 100 with one hand while touching the surface of the suction device 100 with their fingertips. The shape of the suction device 100 is not limited to a rod shape, but can be any shape (for example, a rounded, roughly rectangular parallelepiped shape or an egg shape).

[0043] The suction device 100 comprises an internal unit 10 (see Figures 4 to 6) and a case 20 that constitutes the external appearance of the suction device 100. The case 20 has a lower case 21 and an upper case 22. A part of the internal unit 10 is housed in the lower case 21, and the entire internal unit 10 is housed in the case 20 by placing the upper case 22 over the lower case 21 from above.

[0044] The top surface of the suction device 100 is provided with an opening 27 (see Figures 4 to 6) through which a stick-type substrate 150 is inserted and removed, and a shutter 23 that can slide in the front-rear direction. The opening 27 is located on the rear side of the top surface of the suction device 100. The shutter 23 can selectively take an open state (front position) that opens the opening 27 and allows insertion and removal of the stick-type substrate 150, and a closed state (rear position) that positions the shutter 23 above the opening 27 and closes the opening 27. When inserting the stick-type substrate 150 into the opening 27, the user opens the shutter 23.

[0045] A shutter detection sensor 11 (see Figure 4) is provided near the shutter 23. The shutter detection sensor 11 detects whether or not the shutter 23 is in the open state. The shutter detection sensor 11 is an example of the sensor unit 112B of the suction device 100B shown in Figure 2.

[0046] Furthermore, a USB (Universal Serial Bus) port 26 (see Figure 4) is provided on the upper surface of the suction device 100, adjacent to the opening 27. In the open state described above, the shutter 23 blocks the USB port 26. On the other hand, in the closed state described above, the shutter 23 does not block the USB port 26, and the USB port 26 is open. The USB port 26 is configured to be electrically connectable to an external power supply (not shown) capable of supplying power to charge the power supply unit 111C (see Figure 4). The USB port 26 is, for example, a receptacle into which a plug can be inserted. As an example, in this embodiment, the USB port 26 is a USB Type-C shaped receptacle.

[0047] The front of the suction device 100 is provided with an operating section 24 and a light-emitting section 25. The operating section 24 is located below the light-emitting section 25. More specifically, the operating section 24 and the light-emitting section 25 are components of an internal unit 10 housed in a case 20, and are configured such that parts of the operating section 24 and the light-emitting section 25 are exposed through an opening formed on the front of the case 20. The light-emitting section 25 is an example of a notification section 113B of the suction device 100B shown in Figure 2.

[0048] The operation unit 24 is a button-type switch that can be operated by the user and is an input device that accepts information from the user. The operation unit 24 is connected to the main board 50 (see Figures 4-6), which will be described later. When the user presses the operation unit 24, for example, the MCU (Micro Controller Unit) 1 (see Figures 4-6) or the heating unit 121C (see Figure 7) is activated. The MCU 1 functions as the control unit 116B in the suction device 100B. In addition to its function as the control unit 116B in the suction device 100B, the MCU 1 may also have the function of a communication unit 115B integrated into it. Furthermore, the MCU 1 may consist of one IC or two or more ICs. For example, the discharge control to the heating unit 121C and the charging control to the power supply unit 111C may be performed by one IC or by separate ICs.

[0049] The light-emitting section 25 is composed of light-emitting elements such as LEDs (Light Emitting Diodes). More specifically, the light-emitting section 25 has a plurality of LEDs 251 (see Figure 6) provided on the main substrate 50, and a transparent cover 250 that covers the plurality of LEDs 251 and transmits the light from the LEDs 251. A part of the transparent cover 250 is exposed through an opening formed on the front surface of the case 20. In this embodiment, for example, the plurality of LEDs 251 are configured to emit light in multiple colors, including blue, yellow, and red. The number of light-emitting elements can be set arbitrarily, and for example, the light-emitting section 25 may have only one light-emitting element.

[0050] The light-emitting unit 25 emits light in a predetermined light-emitting pattern in response to a command from the MCU 1 to notify the user of predetermined information. Here, the light-emitting pattern can be, for example, the color of the light emitted, but is not limited to this; it may also be, for example, the intensity of the illumination (in other words, brightness), or the illumination pattern (for example, blinking at predetermined time intervals). The predetermined information is, for example, operation information indicating whether the power of the suction device 100 is on or off.

[0051] Next, the internal unit 10 of the suction device 100 of this embodiment will be described with reference to Figures 4 to 8. Figure 4 is a perspective view of the internal unit 10 seen from the front right, Figure 5 is a perspective view of the internal unit 10 seen from the front left, Figure 6 is an exploded perspective view of the internal unit 10, Figure 7 is a cross-sectional perspective view of the heater assembly 30, and Figure 8 is a block diagram that simply shows the electrical connections of the main elements of the internal unit 10. Note that the internal unit 10 is obtained by removing the case 20 and shutter 23 from the suction device 100.

[0052] The internal unit 10 comprises a chassis 40, a main board 50, a vibration device 60, a heater assembly 30, a power supply unit 111C, a power supply board 71, a peripheral FPC 72, a sensor FPC 73, and various sensors. The peripheral FPC 72 and sensor FPC 73 are flexible circuit boards. Flexible circuit boards are pliable, include conductive wiring and / or signal wiring, and can mount electronic components (elements) such as resistors and chips. Flexible circuit boards generally have a thickness of 100 μm to 600 μm. The power supply board 71 may be a flexible circuit board, a rigid board (described later), or a combination of a flexible board and a rigid board, but here, as an example, it will be described using a flexible circuit board.

[0053] (Chassis) As shown in the exploded perspective view of Figure 6, the chassis 40 includes a power supply holder 41 for holding the power supply unit 111C, a board holder 42 for holding the main board 50, and a heater holder 43 for holding the heater assembly 30. The power supply holder 41 is located at the bottom of the chassis 40, while the board holder 42 and the heater holder 43 are located at the top of the chassis 40.

[0054] The power supply holder 41 has a cylindrical shape with a part of its side cut out, in other words, a roughly semi-cylindrical shape. The power supply holder 41 has a bottom wall portion 401, a side wall portion 402 that has an arc shape and rises upward from the bottom wall portion 401, and an upper wall portion 403 provided at the upper end of the side wall portion 402. The power supply unit 111C is arranged in the space enclosed by the bottom wall portion 401, the side wall portion 402, and the upper wall portion 403.

[0055] The substrate holder 42 is provided on a vertical wall 404 that rises upward from the upper wall 403 of the power supply holder 41. The substrate holder 42 is provided on one side (in this case, the front side) of the vertical wall 404 in the front-rear direction and holds the main substrate 50.

[0056] The heater holding portion 43 is located on the opposite side (in this case, the rear side) of the vertical wall portion 404 from the substrate holding portion 42 in the front-rear direction. The heater holding portion 43 has a space enclosed by the vertical wall portion 404, a pair of left and right wall portions 405 extending from the vertical wall portion 404 in the front-rear direction, and the upper surface of the upper wall portion 403 of the power supply holding portion 41, and the heater assembly 30 is placed in this space.

[0057] (Main board) The main board 50 is a rigid board with multiple electronic components (elements) mounted on both sides. Rigid boards are not flexible and generally have a thickness of 300 μm to 1,600 μm. The main board 50 has an MCU 1, LED 251, charging IC (Integrated Circuit) 81, boost DC / DC converter 82, etc. mounted on it. The main board 50 is held in the board holder portion 42 of the chassis 40 so that the element mounting surface faces in the front-to-back direction. Figure 6 shows only the front surface 501 (in this case, the front) of the main board 50. Therefore, the charging IC 81 and boost DC / DC converter 82 mounted on the back surface 502 (in this case, the rear) are not shown.

[0058] A power connection section 51, which is electrically connected to the power supply unit 111C, is provided in the lower region of the surface 501 of the main circuit board 50. The power connection section 51 is electrically connected to the power supply unit 111C via a circuit board connection section 710 of the power supply circuit board 71. The power supply unit 111C is a cylindrical lithium-ion secondary battery and is an example of the power supply unit 111B of the suction device 100B shown in Figure 2.

[0059] As shown in Figure 6, the power supply unit 111C is provided with a positive electrode tab 111a and a negative electrode tab 111b. The power supply unit 111C is positioned in the power supply holder 41 of the chassis 40 such that the positive electrode tab 111a and the negative electrode tab 111b are positioned towards the front. The power supply board 71 is positioned in front of the power supply unit 111C and the main board 50 and extends in the vertical direction. Referring also to Figure 8, the power supply board 71 has positive electrode tab connectors 711a and negative electrode tab connectors 711b connected to the positive electrode tab 111a and negative electrode tab 111b of the power supply unit 111C, respectively, and the board connector 710 is electrically connected to the power supply connector 51 of the main board 50. Power from the power supply unit 111C is transmitted to the main board 50 through conductive tracks formed on the power supply board 71 and supplied to various electronic components, such as the boost DC / DC converter 82. The power supply board 71 is also provided with a power supply temperature sensor 16. The power supply temperature sensor 16 is a sensor that detects the temperature of the power supply unit 111C. The power supply temperature sensor 16 is, for example, a thermistor. The power supply temperature sensor 16 is an example of the sensor unit 112B of the suction device 100B shown in Figure 2.

[0060] A USB port 26 is provided in the upper area of ​​the back surface 502 of the main board 50. The USB port 26 is electrically connected to the charging IC 81 by wiring formed on the main board 50.

[0061] As shown in Figure 8, the back surface 502 of the main board 50 is provided with a charging IC 81, a boost DC / DC converter 82, and heater connection sections 57a and 57b. The charging IC 81 controls charging by supplying power input from the USB port 26 to the power supply unit 111C (charging). The boost DC / DC converter 82 boosts the power supplied from the power supply unit 111C and generates power to be supplied to the heating unit 121C via the heating switch 85. The heating switch 85 is, for example, a FET (Field Effect Transistor).

[0062] The heater connection sections 57a and 57b are connected to the substrate connection section 121a, which extends from the bottom of the heater assembly 30, and power is supplied to the heating section 121C of the heater assembly 30. As a result, power is supplied to the heating section 121C of the heater assembly 30 from the power supply unit 111C via the main substrate 50.

[0063] (vibration device) The vibration device 60 is composed of a vibration element, such as a vibration motor. As shown in Figure 6, the vibration device 60 is located in the power supply holding section 41 of the chassis 40, between the upper surface of the power supply unit 111C and the upper wall section 403. The lead wires 61 of the vibration device 60 are connected to the peripheral FPC 72. The vibration device 60 vibrates in a predetermined vibration pattern in response to a command from the MCU 1 to notify the user of predetermined information. For example, when heating of the stick-type substrate 150 starts or ends, the vibration device 60 vibrates in a predetermined vibration pattern to notify the user of the start or end of heating. The vibration device 60 is an example of the notification section 113B of the suction device 100B in Figure 2.

[0064] (Heater assembly) As shown in Figure 7, the heater assembly 30 comprises a heating section 121C, a housing section 140C, and a heat insulating section 144C. The heating section 121C is, for example, a film heater, which is wound around the outer circumference of the housing section 140C. The heating section 121C and the substrate connection section 121a may also be composed of a single heater FPC.

[0065] Furthermore, the heater assembly 30 is provided with a stick guide 31. The stick guide 31 is located on the upper part of the heater assembly 30 and guides the insertion and removal of the stick-shaped base material 150 into the housing section 140C. The stick guide 31 is a cylindrical member with an opening 27 and constitutes part of the housing section 140C.

[0066] Furthermore, the heater assembly 30 is provided with a heater temperature sensor 15 capable of detecting the temperature of the heating section 121C. More specifically, the heater temperature sensor 15 is provided between the heating section 121C and the heat insulating section 144C, in contact with or close to the heating section 121C. The heater temperature sensor 15 is, for example, a thermistor.

[0067] (Sensor FPC) As shown in Figure 6, the sensor FPC 73 is positioned between the vertical wall portion 404 of the heater holding portion 43 and the heater assembly 30. One or more elements and / or wiring are mounted on the sensor FPC 73. In this embodiment, the sensor FPC 73 is equipped with a stick detection sensor 12, a suction sensor 13, and a case temperature sensor 14. The stick detection sensor 12, suction sensor 13, and case temperature sensor 14 are examples of the sensor portion 112B of the suction device 100B in Figure 2.

[0068] The stick detection sensor 12 is a sensor capable of detecting the stick-shaped substrate 150 housed in the housing section 140. In this embodiment, the stick detection sensor 12 is an optical sensor capable of detecting the stick-shaped substrate 150 based on the amount of reflected light from light irradiated onto the housing section 140. Here, the amount of light is a concept that includes luminous flux, illuminance, luminous flux exitance, luminous intensity, and luminance. The optical sensor is, for example, an IR (Infrared Rays) sensor.

[0069] The suction sensor 13 is a sensor that detects the user's puffing action (suction action). The suction sensor 13 is composed of, for example, a condenser microphone, a pressure sensor, a puff thermistor, etc. The suction sensor 13 is located near the stick guide 31 in the sensor FPC 73.

[0070] The case temperature sensor 14 is a sensor that detects the temperature of the case 20. The case temperature sensor 14 is, for example, a thermistor. The case temperature sensor 14 is positioned adjacent to the inner surface of the case 20 in the sensor FPC 73.

[0071] Furthermore, the sensor FPC 73 is provided with a heater temperature sensor connection portion 731 that connects to the heater temperature sensor 15 of the heater assembly 30. The heater temperature sensor connection portion 731 is located at the bottom of the sensor FPC 73. More specifically, a lead wire 15a is connected to the heater temperature sensor 15, and the heater temperature sensor connection portion 731 connects to the lead wire 15a that extends from the bottom of the heater assembly 30.

[0072] The stick detection sensor 12, suction sensor 13, case temperature sensor 14, and heater temperature sensor connection section 731 are connected to the board connection section 730 via signal wiring formed on the sensor FPC 73. The board connection section 730 is connected to the sensor FPC connection section 55, which is located in the central region of the surface 501 of the main board 50. As a result, the detection results of each sensor are output to the MCU 1 or the like, which is mounted on the main board 50. The sensor FPC 73 will be explained in more detail later.

[0073] In the suction device 100 configured in this way, when the shutter detection sensor 11 detects that the shutter 23 is open and the stick detection sensor 12 detects the stick-type substrate 150, the MCU 1 starts heating the heating unit 121C. When the user puts the suction nozzle 152 of the stick-type substrate 150 in their mouth and sucks, aerosol is supplied to the user's mouth from the aerosol source of the stick-type substrate 150 heated by the heating unit 121C. The suction sensor 13 detects the number of suctions, and the MCU 1 stops heating after a predetermined number of suctions or after a predetermined time has elapsed. While the suction device 100 is heating, the case temperature sensor 14, heater temperature sensor 15, and power supply temperature sensor 16 detect their respective temperatures, and if abnormal heating is determined, the MCU 1 stops or suppresses heating of the heating unit 121C. The user can also operate the operation unit 24 to, for example, check the SOC of the power supply unit 111C. The light-emitting unit 25 (LED 251) and the vibration device 60 notify the user of various information, such as the State of Charge (SOC) of the power supply unit 111C and error indications. If the SOC of the power supply unit 111C decreases, the user can charge the power supply unit 111C by connecting an external power supply to the USB port 26.

[0074] Next, the sensor FPC73 will be described in detail with reference to Figures 9 and 10. Figure 9 is an unfolded view of the front surface of the sensor FPC73, and Figure 10 is an unfolded view of the back surface of the sensor FPC73. The dotted lines in Figures 9 and 10 are fold lines.

[0075] The sensor FPC 73 has a roughly rectangular main body 751 that is longer in the vertical direction than in the horizontal direction, an upper right extension 752 extending to the right from the top of the main body 751, a lower right extension 753 extending to the right from the bottom of the main body 751 and then bending upward, a lower extension 754 extending further downward from the bottom of the main body 751, an upper extension 755 extending further upward from the top of the main body 751, an upper right extension 756 extending to the right from the upper extension 755, and an upper left extension 757 extending to the left from the upper extension 755. The upper left extension 757 is longer than the upper right extension 756, and as shown in Figure 6, when the sensor FPC 73 is folded and housed in the case 20 (hereinafter referred to as the housed state), the tip (left end) of the upper left extension 757 is configured to face the main body 751.

[0076] As mentioned above, the sensor FPC 73 is equipped with a stick detection sensor 12, a suction sensor 13, and a case temperature sensor 14, and is connected to the sensor FPC connection part 55 of the main board 50 at the board connection part 730. More specifically, the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 are mounted on the surface of the sensor FPC 73 (the surface that forms the rear surface of the main body part 751), as shown in Figure 9.

[0077] The stick detection sensors 12 are positioned approximately symmetrically on either the upper right extension 756 or the upper left extension 757, with one sensor on each side of the upper extension 755. When housed, the stick detection sensors 12 are positioned on the outer circumference of the stick guide 31 and detect the stick-shaped base material 150 housed in the housing section 140.

[0078] The suction sensor 13 is positioned at the tip (left end) of the upper left extension 757. In the housing state, the suction sensor 13 is positioned on the outer circumference of the stick guide 31 and detects changes in air pressure and temperature as the air flows from the vicinity of the opening 27 to the housing 140 in conjunction with the puffing operation (suction operation).

[0079] The case temperature sensor 14 is located at the tip (upper end) of the right lower extension 753. When housed, the case temperature sensor 14 is close to the wall surface of the case 20 and detects the temperature of the case 20. The two stick detection sensors 12 and the suction sensor 13 are located in approximately the same vertical direction (longitudinal direction of the sensor FPC), whereas the case temperature sensor 14 is located in a different vertical direction, specifically downwards in this embodiment.

[0080] As shown in Figure 10, the board connection portion 730 is mounted on the back surface of the sensor FPC 73 (the surface that forms the front surface of the main body portion 751). The board connection portion 730 is located at the tip (right end) of the upper right extension portion 752, that is, between the vertical positions of the two stick detection sensors 12 and the suction sensor 13 and the vertical position of the case temperature sensor 14.

[0081] By mounting the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 on a sensor FPC 73, which is a flexible circuit board that is thinner and more flexible than a rigid substrate, the rigid main board 50 can be miniaturized. Furthermore, these sensors 12 to 14 are connected collectively to the sensor FPC connection part 55 of the main board 50 at the board connection part 730 via signal wiring 738 and 739 formed on the sensor FPC 73. Therefore, the connection parts of each sensor 12 to 14 to the main board 50 can be standardized, and the rigid main board 50 can be miniaturized.

[0082] The connection point 730 of the sensor FPC 73 and the sensor FPC connection point 55 of the main board 50 are preferably connected by a connector 19 consisting of a plug (male connector) and a receptacle (female connector). This facilitates the connection process. As shown in Figure 8, the sensor FPC connection point 55 is connected to the MCU 1 via signal wiring formed on the main board 50.

[0083] In this embodiment, the sensor FPC 73 was equipped with three sensors: a stick detection sensor 12, a suction sensor 13, and a case temperature sensor 14. However, other elements may be mounted in place of or along with these sensors, as long as one or more elements and / or wiring are mounted. Other elements may include, for example, a power supply temperature sensor 16, or elements other than sensors. In other words, regardless of the type of sensor, the sensor FPC 73 only needs to be equipped with one or more elements and / or wiring, and the connection to the main board 50 should be common.

[0084] Furthermore, even if the sensor placement positions (longitudinal direction of the sensor FPC) are different, it is preferable that the connection parts to the main board 50 are common. In this embodiment, the case temperature sensor 14, which is positioned at different locations in the vertical direction (longitudinal direction of the sensor FPC) for the two stick detection sensors 12 and the suction sensor 13, is also connected to the sensor FPC connection part 55 of the main board 50 via the board connection part 730.

[0085] In this case, it is preferable that the connection portion to the main board 50 is located between the sensor located at one end and the sensor located at the other end in the longitudinal direction of the sensor FPC. In this embodiment, the board connection portion 730 is located between the vertical position (longitudinal direction of the sensor FPC) of the two stick detection sensors 12 and the suction sensor 13 and the vertical position (longitudinal direction of the sensor FPC) of the case temperature sensor 14. This makes it possible to equalize the length of the signal wiring from each sensor to the board connection portion 730.

[0086] Furthermore, as shown in Figure 8, the suction sensor 13 and the case temperature sensor 14 are supplied with the same input voltage VCC1. Therefore, the suction sensor 13 and the case temperature sensor 14 can be connected to the signal wiring 738 with the same potential and connected to the main board 50 with the same electrical contact 55a. In this way, by mounting sensors connected to the signal wiring with the same potential on the sensor FPC 73, the same electrical contact 55a can be used in the sensor FPC connection section 55, eliminating the need to provide multiple electrical contacts for each sensor in the sensor FPC connection section 55, and thus the main board 50 can be miniaturized.

[0087] Furthermore, in this embodiment, the heater temperature sensor 15, which is connected to the sensor FPC 73 via lead wire 15a, is supplied with the same input voltage VCC1 as the suction sensor 13 and the case temperature sensor 14, is connected to a signal wiring with the same potential, and is connected to the main board 50 with the same electrical contact 55a. This allows for further miniaturization of the main board 50.

[0088] Furthermore, the two stick detection sensors 12 are supplied with an input voltage VCC2. Therefore, the two stick detection sensors 12 can be connected to the signal wiring 739 with the same potential and connected to the main board 50 with the same electrical contact 55b. The input voltage VCC2 of the two stick detection sensors 12 and the input voltage VCC1 of the suction sensor 13 and case temperature sensor 14 may be the same or different. If the input voltages VCC1 and VCC2 are the same, the electrical contacts 55a and 55b may be common or different. On the other hand, if the input voltages VCC1 and VCC2 are different, the electrical contacts 55a and 55b must be different. In this way, even sensors with different input voltages can be mounted on the sensor FPC 73 and the connection to the main board 50 can be common by using different electrical contacts.

[0089] The sensor FPC 73 is a multilayer wiring board in which a first wiring layer 73L1 and a second wiring layer 73L2 are stacked. Figure 11 is a cross-sectional view of the first wiring layer 73L1 as seen from the surface side of the sensor FPC 73, and Figure 12 is a cross-sectional view of the second wiring layer 73L2 as seen from the surface side of the sensor FPC 73.

[0090] In the sensor FPC 73, the first wiring layer 73L1 and the second wiring layer 73L2 are stacked such that the first wiring layer 73L1 is closer to the back side (front side of the main body 751) than the second wiring layer 73L2, and the second wiring layer 73L2 is closer to the front side (rear side of the main body 751) than the first wiring layer 73L1.

[0091] As shown in Figure 6 and Figures 11 to 14, the sensor FPC 73 has a first region A1 that is close to the heating section 121C and a second region A2 that is further from the heating section 121C than the first region A1. In this embodiment, the first region A1 is the main body 751, and the second region A2 is the upper extension 755, the upper right extension 756, and the upper left extension 757.

[0092] As shown in Figure 6, and in Figures 13 and 14, the sensor FPC 73 has a first region A1 positioned between the heating section 121C and the rigid substrate main substrate 50, with the first region A1 positioned to face the heating section 121C.

[0093] Furthermore, the first region A1 of the sensor FPC73 is a plane facing the main board 50.

[0094] Furthermore, the sensor FPC73 is positioned such that the second region A2 is closer to the suction port 152 than to the heating section 121C.

[0095] As shown in Figures 11 and 12, printed wiring 732, including signal wiring 733 and ground wiring 734, is formed on the first wiring layer 73L1 and the second wiring layer 73L2. The printed wiring 732 is formed of a thin metal film of a conductive material. In this embodiment, the printed wiring 732 is formed of a thin copper film. Generally, metals used as conductive materials, including copper, have a higher thermal conductivity than resins and the like.

[0096] The signal wiring 733 formed in the first wiring layer 73L1 and the second wiring layer 73L2 constitutes the aforementioned signal wiring 738 and signal wiring 739. The signal wiring 733 formed in the first wiring layer 73L1 and the second wiring layer 73L2 includes a first signal wiring 733a connecting the substrate connection part 730 and the stick detection sensor 12, a second signal wiring 733b connecting the substrate connection part 730 and the suction sensor 13, a third signal wiring 733c connecting the substrate connection part 730 and the case temperature sensor 14, and a fourth signal wiring 733d connecting the substrate connection part 730 and the heater temperature sensor connection part 731.

[0097] The first signal wiring 733a connects to each of the two stick detection sensors 12, passing from the board connection portion 730 through the upper right extension portion 752, the main body portion 751, and the upper extension portion 755, and then through the upper right extension portion 756 or the upper left extension portion 757.

[0098] The second signal wiring 733b connects to the suction sensor 13 by passing from the board connection portion 730 through the upper right extension portion 752, the main body portion 751, the upper extension portion 755, and the upper left extension portion 757.

[0099] The third signal wiring 733c connects to the case temperature sensor 14 by passing from the board connection portion 730 through the upper right extension portion 752, near the right end of the main body portion 751, and the lower right extension portion 753.

[0100] The fourth signal wiring 733d connects to the heater temperature sensor connection part 731, passing from the board connection part 730 through the upper right extension part 752, near the right end of the main body part 751, and the lower extension part 754.

[0101] The first signal lines 733a to the fourth signal lines 733d are formed in the first wiring layer 73L1 and the second wiring layer 73L2, and the first signal lines 733a to the fourth signal lines 733d in the first wiring layer 73L1 and the first signal lines 733a to the fourth signal lines 733d in the second wiring layer 73L2 are connected via vias.

[0102] Furthermore, in the sensor FPC 73, the wiring density of the first region A1, which includes the signal wiring 733 and the ground wiring 734, is lower than the wiring density of the second region A2.

[0103] More specifically, in both the first wiring layer 73L1 and the second wiring layer 73L2, the wiring density in the first region A1 is lower than that in the second region A2.

[0104] In this way, by making the wiring density of the first region A1, which is closer to the heating element 121C, lower than the wiring density of the second region A2, which is further from the heating element 121C, in the sensor FPC 73, the amount of heat generated in the heating element 121C that is dissipated from the sensor FPC 73 can be reduced, thereby achieving high energy efficiency.

[0105] Furthermore, in both the first wiring layer 73L1 and the second wiring layer 73L2, the wiring density of the first region A1 is lower than that of the second region A2. This further reduces the amount of heat generated in the heating section 121C that is dissipated from the sensor FPC 73, thereby achieving higher energy efficiency.

[0106] As mentioned above, the sensor FPC 73 has a first region A1 positioned between the heating unit 121C and the rigid substrate main board 50, with the first region A1 positioned to face the heating unit 121C. This prevents the heat generated in the heating unit 121C from being shielded by the sensor FPC 73 positioned between the heating unit 121C and the main board 50, thereby suppressing its transmission to the main board 50 and elements such as the MCU 1 mounted on the main board 50.

[0107] Furthermore, since the sensor FPC73 is positioned so that the first region A1 with low wiring density faces the heating section 121C, the heat generated in the heating section 121C is better shielded by the sensor FPC73, resulting in higher energy efficiency.

[0108] Furthermore, since the first region A1 of the sensor FPC 73 is a plane facing the main board 50, the suction device 100 and the power supply unit 110 can be miniaturized.

[0109] On the other hand, since the sensor FPC 73 is positioned such that the second region A2 with high wiring density is closer to the intake port 152 than to the heating section 121C, the integration density of the sensor FPC 73 can be improved while suppressing the transfer of heat generated in the heating section 121C to the main board 50 and elements such as the MCU 1 mounted on the main board 50.

[0110] The stick detection sensor 12 is mounted on the surface of the sensor FPC 73, that is, on the side of the second wiring layer 73L2 in the stacking direction of the first wiring layer 73L1 and the second wiring layer 73L2. When viewed from the stacking direction of the first wiring layer 73L1 and the second wiring layer 73L2, the wiring density of the region of the first wiring layer 73L1 that overlaps with the stick detection sensor 12 is higher than the wiring density of the first region A1. In this embodiment, the ground wiring 734 in the region of the first wiring layer 73L1 that overlaps with the stick detection sensor 12 is not a mesh pattern, but a solid pattern in which the wiring material is coated over the entire ground region.

[0111] Therefore, the area of ​​the first wiring layer 73L1 that overlaps with the stick detection sensor 12 becomes more rigid due to the wiring material, making it less prone to bending. This prevents the sensor FPC 73 from bending due to the weight of the stick detection sensor 12.

[0112] Furthermore, ground wiring 734 is formed in the first region A1 and the second region A2 of the first wiring layer 73L1, and in the first region A1 and the second region A2 of the second wiring layer 73L2.

[0113] Thus, since ground wiring 734 is formed in both the first region A1 and the second region A2 of the first wiring layer 73L1, and in both the first region A1 and the second region A2 of the second wiring layer 73L2, sensors 12 to 14 can be easily connected to the ground wiring 734 regardless of whether they are mounted on the front or back surface of the sensor FPC 73, thereby improving the flexibility of placement of sensors 12 to 14 in the sensor FPC 73.

[0114] The ground wiring 734 formed in the first region A1 and the second region A2 of the first wiring layer 73L1, and in the first region A1 and the second region A2 of the second wiring layer 73L2, is formed in a mesh pattern in at least a portion of it. In this embodiment, it is formed in a diagonal grid mesh pattern. The mesh shape of the ground wiring 734 may be a hexagonal honeycomb mesh, a rectangular mesh, or a mesh with many circles cut out.

[0115] This allows the wiring density of the mesh-like ground wiring 734 to be easily and freely set by changing the mesh coarseness of the mesh-like ground wiring 734.

[0116] In the mesh portion of the ground wiring 734, a solid region 734a is formed where at least one mesh portion of the mesh is closed. The solid region 734a formed in the mesh portion of the ground wiring 734 of the first wiring layer 73L1 and the solid region 734a formed in the mesh portion of the ground wiring 734 of the second wiring layer 73L2 are formed in regions that overlap in the stacking direction of the first wiring layer 73L1 and the second wiring layer 73L2. Vias 734b are provided in the solid region 734a to connect the ground wiring 734 of the first wiring layer 73L1 and the ground wiring 734 of the second wiring layer.

[0117] As a result, the ground wiring 734 of the first wiring layer 73L1 and the ground wiring 734 of the second wiring layer 73L2 are formed facing each other, but they are conductive through via 734b, thus reducing the capacitance generated by the opposing ground wiring 734 of the first wiring layer 73L1 and the ground wiring 734 of the second wiring layer 73L2.

[0118] Furthermore, by forming a solid region 734a in the mesh-like portion of the ground wiring 734 of the first wiring layer 73L1 and the mesh-like portion of the ground wiring 734 of the second wiring layer 73L2, and providing vias 734b in this solid region 734a, vias 734b can be easily provided, making it possible to more freely set the wiring density of the mesh-like portion of the ground wiring 734 of the first wiring layer 73L1 and the mesh-like portion of the ground wiring 734 of the second wiring layer 73L2.

[0119] Multiple solid regions 734a are formed in each of the first wiring layer 73L1 and the second wiring layer 73L2, and vias 734b are provided in multiple solid regions 734a. Therefore, multiple vias 734b are formed in the first wiring layer 73L1 and the second wiring layer 73L2.

[0120] This makes it possible to further reduce the capacitance generated by the ground wiring 734 of the first wiring layer 73L1 and the ground wiring 734 of the second wiring layer 73L2, which are opposite each other.

[0121] In this embodiment, signal wiring 733 and ground wiring 734 are formed in the right lower extension portion 753. In the sensor FPC 73, the wiring density of the first region A1, which includes the signal wiring 733 and ground wiring 734, is lower than the wiring density of the right lower extension portion 753. More specifically, in the first wiring layer 73L1 and the second wiring layer 73L2, the wiring density of the first region A1 is lower than the wiring density of the right lower extension portion 753.

[0122] Furthermore, signal wiring 733 and ground wiring 734 are formed in the upper right extension 752. In the sensor FPC 73, the wiring density of the first region A1, which includes the signal wiring 733 and ground wiring 734, is lower than the wiring density of the upper right extension 752. More specifically, in the first wiring layer 73L1 and the second wiring layer 73L2, the wiring density of the first region A1 is lower than the wiring density of the upper right extension 752.

[0123] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to these examples. It is clear to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of the present invention. Furthermore, the components of the above embodiments may be combined in any way without departing from the spirit of the invention.

[0124] For example, the positions of the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 in the sensor FPC73 are not limited to these and can be changed as appropriate.

[0125] Furthermore, for example, the suction device 100A may further include a heating unit for heating the flavor source 131 in addition to the heating unit 121A, and the first region A1 may be a region close to the heating unit for heating the flavor source 131.

[0126] This specification contains at least the following information. Note that the components etc. in parentheses indicate those corresponding to the embodiments described above, but are not limited thereto.

[0127] (1) A power supply (power supply unit 111A to 111C) capable of supplying power to a heating unit (heating unit 121A to 121C) that heats at least one of the aerosol source (stick-type substrate 150) and the flavor source (flavor source 131), A flexible printed circuit board (sensor FPC73) on which one or more elements (stick detection sensor 12, suction sensor 13, case temperature sensor 14) and / or wiring (signal wiring 733, ground wiring 734) are mounted, A power supply unit (power supply unit 110) of an aerosol generating device (suction device 100, 100A, 100B) comprising, The flexible printed circuit board has a first region (first region A1) close to the heating element and a second region (second region A2) further from the heating element than the first region. In the flexible printed circuit board, the wiring density of the first region is lower than that of the second region. Power supply unit for an aerosol generator.

[0128] According to (1), in a flexible printed circuit board, by making the wiring density of the first region, which is close to the heating element, lower than the wiring density of the second region, which is further from the heating element than the first region, the amount of heat generated in the heating element that is dissipated from the flexible printed circuit board can be reduced, thereby achieving high energy efficiency.

[0129] (2) A power supply unit for the aerosol generating apparatus described in (1), The flexible printed circuit board has a first wiring layer (first wiring layer 73L1) and a second wiring layer (second wiring layer 73L2) laminated on it. In each of the first and second wiring layers, the wiring density of the first region is lower than the wiring density of the second region. Power supply unit for an aerosol generator.

[0130] According to (2), in both the first and second wiring layers, the wiring density in the first region is lower than that in the second region. Therefore, the heat generated in the heating section is less likely to be dissipated from the flexible printed circuit board, resulting in higher energy efficiency.

[0131] (3) A power supply unit for the aerosol generating apparatus described in (2), Sensors (stick detection sensor 12, suction sensor 13, case temperature sensor 14) are mounted on the side of the flexible printed circuit board facing the second wiring layer in the stacking direction of the first wiring layer and the second wiring layer. The wiring density of the region of the first wiring layer that overlaps with the sensor, as viewed from the stacking direction, is higher than the wiring density of the first region. Power supply unit for an aerosol generator.

[0132] According to (3), the region of the first wiring layer that overlaps with the sensor in the stacking direction becomes more rigid due to the wiring material, making it less prone to bending. This suppresses the bending of the flexible printed circuit board due to the weight of the sensor.

[0133] (4) A power supply unit for the aerosol generating apparatus described in (2) or (3), Ground wiring (ground wiring 734) is formed in the first region and the second region of the first wiring layer, and in the first region and the second region of the second wiring layer. Power supply unit for an aerosol generator.

[0134] According to (4), since ground wiring is formed in both the first and second regions of the first wiring layer, and in both the first and second regions of the second wiring layer, the sensor can be easily connected to the ground wiring regardless of whether the sensor is mounted on the front or back surface of the flexible printed circuit board, thereby improving the degree of freedom in placing the sensor on the flexible printed circuit board.

[0135] (5) A power supply unit for the aerosol generating apparatus described in (4), A via (via 734b) is formed in the first region of the first wiring layer and the second wiring layer, and / or in the second region of the first wiring layer and the second wiring layer, connecting the ground wiring of the first wiring layer and the ground wiring of the second wiring layer. Power supply unit for an aerosol generator.

[0136] According to (5), the ground wiring of the first wiring layer and the ground wiring of the second wiring layer are formed opposite each other, but since they are conductive via vias, the capacitance generated by the opposing ground wiring of the first wiring layer and the ground wiring of the second wiring layer can be reduced.

[0137] (6) A power supply unit for the aerosol generating apparatus described in (5), Multiple vias are formed in the first wiring layer and the second wiring layer. Power supply unit for an aerosol generator.

[0138] According to (6), since multiple vias are formed in the first and second wiring layers, the capacitance generated by the ground wiring of the first and second wiring layers that face each other can be further reduced.

[0139] (7) A power supply unit for the aerosol generating apparatus described in (4), At least a portion of the ground wiring is formed in a mesh shape, Power supply unit for an aerosol generator.

[0140] According to (7), since at least a portion of the ground wiring is formed in a mesh pattern, the wiring density of the ground wiring can be easily and freely set by changing the mesh coarseness of the mesh-like ground wiring.

[0141] (8) A power supply unit for the aerosol generating apparatus described in (7), The first region of the first wiring layer and the second wiring layer, and / or the second region of the first wiring layer and the second wiring layer, have a solid region (solid region 734a) formed in which at least one mesh-like mesh portion is closed. A via (via 734b) is formed in the solid region to connect the ground wiring of the first wiring layer and the ground wiring of the second wiring layer. Power supply unit for an aerosol generator.

[0142] According to (8), the ground wiring of the first wiring layer and the ground wiring of the second wiring layer are formed facing each other, but they are conductive via vias, so the capacitance generated by the opposing ground wiring of the first wiring layer and the ground wiring of the second wiring layer can be reduced. Furthermore, by forming solid areas in the mesh-like portions of the ground wiring of the first wiring layer and the ground wiring of the second wiring layer, vias can be easily provided, making it possible to set the wiring density of the mesh-like portions of the ground wiring of the first wiring layer and the ground wiring of the second wiring layer more freely.

[0143] (9) A power supply unit for the aerosol generating apparatus described in (8), Multiple vias are formed in the first wiring layer and the second wiring layer. Power supply unit for an aerosol generator.

[0144] According to (9), since multiple vias are formed in the first and second wiring layers, the capacitance generated by the ground wiring of the first and second wiring layers that are opposite each other can be further reduced.

[0145] (10) A power supply unit for an aerosol generating apparatus as described in any of (1) to (9), The aforementioned flexible printed circuit board is The first region is arranged to face the heating section, Power supply unit for an aerosol generator.

[0146] According to (10), since the flexible printed circuit board is arranged so that the first region with low wiring density faces the heating section, the heat generated in the heating section is better shielded by the flexible printed circuit board, and higher energy efficiency can be achieved.

[0147] (11) A power supply unit for the aerosol generating apparatus described in (10), The aforementioned flexible printed circuit board is The second region is positioned closer to the suction port (suction port 152) of the aerosol generator than the heating section. Power supply unit for an aerosol generator.

[0148] According to (11), the flexible printed circuit board is arranged such that the second region with high wiring density is closer to the intake port of the aerosol generator than to the heating section. This suppresses the heat generated in the heating section from being dissipated from the flexible printed circuit board while improving the integration density of the flexible printed circuit board.

[0149] (12) A power supply unit for an aerosol generating apparatus as described in any of (1) to (11), The aerosol generating device is further equipped with a rigid board (main board 50) on which a controller (MCU1) is mounted, The aforementioned flexible printed circuit board is The first region is positioned between the heating element and the rigid substrate. Power supply unit for an aerosol generator.

[0150] According to (12), the heat generated in the heating section is shielded by the flexible printed circuit board placed between the heating section and the rigid substrate, thereby preventing it from being transmitted to the rigid substrate and elements such as controllers mounted on the rigid substrate.

[0151] (13) A power supply unit for the aerosol generating apparatus described in (12), The first region is a plane facing the rigid substrate. Power supply unit for an aerosol generator.

[0152] According to (13), the first region of the flexible printed circuit board is a plane facing the rigid substrate, which allows for miniaturization of the power supply unit of the aerosol generator.

[0153] (14) A heating section (heating section 121A~121C) that heats at least one of the aerosol source (stick-type substrate 150) and the flavor source (flavor source 131), A power supply (power supply unit 111A~111C) capable of supplying power to the heating unit, A flexible printed circuit board (sensor FPC73) on which one or more elements (stick detection sensor 12, suction sensor 13, case temperature sensor 14) and / or wiring (signal wiring 733, ground wiring 734) are mounted, an aerosol generating device (suction device 100, 100A, 100B) comprising, The flexible printed circuit board has a first region (first region A1) close to the heating element and a second region (second region A2) further from the heating element than the first region. In the flexible printed circuit board, the wiring density of the first region is lower than that of the second region. Aerosol generator.

[0154] According to (14), in a flexible printed circuit board, by making the wiring density of the first region, which is close to the heating element, lower than the wiring density of the second region, which is further from the heating element than the first region, the amount of heat generated in the heating element that is dissipated from the flexible printed circuit board can be reduced, thereby achieving high energy efficiency. [Explanation of Symbols]

[0155] 1. MCU (Controller) 12 Stick detection sensor (element, sensor) 13. Suction sensor (element, sensor) 14 Case temperature sensor (element, sensor) 50 Main board (rigid board) 73 Sensor FPC (Flexible Printed Circuit Board) 73L1 1st wiring layer 73L2 2nd wiring layer 733 Signal wiring (wiring) 734 Ground wiring (wiring) 734a Solid area 734b Beer 100, 100A, 100B Suction device (aerosol generator) 110 Power Supply Unit 111A~111C Power supply section (power supply) 121A~121C Heating part 131 Flavor source 150 Stick-type substrate (aerosol source) 152 Mouthpiece A1 1st area A2 2nd area

Claims

1. A power supply capable of supplying power to a heating unit that heats at least one of an aerosol source and a flavor source, A flexible printed circuit board on which one or more elements and / or wiring are mounted, A power supply unit for an aerosol generating apparatus, comprising: The flexible printed circuit board has a first region close to the heating element and a second region further from the heating element than the first region. The flexible printed circuit board has a first wiring layer and a second wiring layer laminated on it. In each of the first and second wiring layers, the wiring density of the first region is lower than the wiring density of the second region. Ground wiring is formed in the first region and the second region of the first wiring layer, and in the first region and the second region of the second wiring layer. At least a portion of the aforementioned ground wiring is formed in a mesh pattern, The first region of the first wiring layer and the second wiring layer, and / or the second region of the first wiring layer and the second wiring layer, have solid areas formed in which at least one mesh-like mesh portion is closed. In the solid region, vias are formed to connect the ground wiring of the first wiring layer and the ground wiring of the second wiring layer. Power supply unit for an aerosol generator.

2. A power supply unit for an aerosol generating apparatus according to claim 1, A sensor is mounted on the side of the flexible printed circuit board facing the second wiring layer in the stacking direction of the first wiring layer and the second wiring layer. The wiring density of the region of the first wiring layer that overlaps with the sensor, as viewed from the stacking direction, is higher than the wiring density of the first region. Power supply unit for an aerosol generator.

3. A power supply unit for an aerosol generating apparatus according to claim 1, Multiple vias are formed in the first wiring layer and the second wiring layer. Power supply unit for an aerosol generator.

4. A power supply unit for an aerosol generating apparatus according to any one of claims 1 to 3, The aforementioned flexible printed circuit board is The first region is arranged to face the heating section, Power supply unit for an aerosol generator.

5. A power supply unit for an aerosol generating apparatus according to claim 4, The aforementioned flexible printed circuit board is The second region is positioned closer to the inlet of the aerosol generator than the heating section. Power supply unit for an aerosol generator.

6. A power supply unit for an aerosol generating apparatus according to any one of claims 1 to 3, The system further comprises a rigid substrate on which a controller for controlling the aerosol generating device is mounted, The aforementioned flexible printed circuit board is The first region is positioned between the heating element and the rigid substrate. Power supply unit for an aerosol generator.

7. A power supply unit for an aerosol generating apparatus according to claim 6, The first region is a plane facing the rigid substrate. Power supply unit for an aerosol generator.

8. A heating unit that heats at least one of the aerosol source and the flavor source, A power supply capable of supplying power to the heating section, A flexible printed circuit board on which one or more elements and / or wiring are mounted, an aerosol generating apparatus comprising, The flexible printed circuit board has a first region close to the heating element and a second region further from the heating element than the first region. The flexible printed circuit board has a first wiring layer and a second wiring layer laminated on it. In each of the first and second wiring layers, the wiring density of the first region is lower than the wiring density of the second region. Ground wiring is formed in the first region and the second region of the first wiring layer, and in the first region and the second region of the second wiring layer. At least a portion of the aforementioned ground wiring is formed in a mesh pattern, The first region of the first wiring layer and the second wiring layer, and / or the second region of the first wiring layer and the second wiring layer, have solid areas formed in which at least one mesh-like mesh portion is closed. In the solid region, vias are formed to connect the ground wiring of the first wiring layer and the ground wiring of the second wiring layer. Aerosol generator.

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