Curable composition for inkjet and air cavity formation, electronic component, and method for manufacturing electronic component

Abstract

Provided is a curable composition for an inkjet and air cavity formation from which a cured material layer having a high aspect ratio can be formed, and with which adhesiveness and sealing properties can be enhanced.　A curable composition for an inkjet and air cavity formation according to the present invention contains: a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group; and a thermosetting compound not having a (meth)acryloyl group and having a cyclic ether group, wherein the content of the thermosetting compound is at least 5 wt% with respect to 100 wt% of the curable composition for an inkjet and air cavity formation, and when a B-staged product is obtained by irradiating the curable composition for an inkjet and air cavity formation with light having a wavelength of 365 nm so that the illuminance is 2,000 mW / cm2, the viscosity of the B-staged product at 40ºC is 2.5×102 Pa∙s to 3.0×106 Pa∙s.

Description

Curable composition for inkjet printing and for forming air cavities, electronic component, and method for manufacturing electronic component

[0001] The present invention relates to a curable composition for inkjet printing and for forming air cavities, which is applied using an inkjet device. The present invention also relates to an electronic component using the curable composition and a method for producing an electronic component.

[0002] A communication filter has an air cavity (space) formed by an RDL layer and a metal, etc. Conventionally, the air cavity has been formed using a sheet material such as a photosensitive polyimide resin sheet or an epoxy resin sheet (for example, see Patent Document 1 below).

[0003] JP 2010-278971 A

[0004] Conventional methods for forming air cavities using sheet materials have high manufacturing costs and complicated manufacturing processes. Furthermore, when molding the periphery of the filter structure with resin, the resin can penetrate the sheet material and enter the air cavity. To ensure the reliability of communication filters, it is necessary to prevent resin from entering the air cavity, and therefore, better sealing performance is required. If air cavities could be formed successfully using methods other than sheet materials, this would contribute to lower manufacturing costs and simplify the manufacturing process.

[0005] One such method is to apply a curable composition to a predetermined area using an inkjet device and then cure the applied curable composition to form an air cavity. For example, if the top surface of a first member (lower member) and the side or bottom surface of a second member (upper member) can be bonded together with a cured product layer of the curable composition, an air cavity can be formed between the first member, the second member, and the cured product layer. The performance of an inkjet curable composition used in air cavity applications requires the ability to increase the aspect ratio of the cured product layer, the ability to increase the adhesive strength between the first and second members and the cured product layer, and the ability to improve sealing properties.

[0006] However, it is difficult to form a cured layer with a large aspect ratio using conventional curable compositions for inkjet. It is also difficult to increase the adhesive strength between a cured layer of the curable composition and a member using conventional curable compositions for inkjet. Furthermore, with conventional curable compositions for inkjet, the curable composition may come into contact with electronic components arranged around a member, such as a communication filter, resulting in a decrease in sealing ability. For this reason, it is difficult to use conventional curable compositions for inkjet to form air cavities.

[0007] An object of the present invention is to provide a curable composition for inkjet printing and for forming air cavities, which can form a cured product layer having a large aspect ratio and have improved adhesiveness and sealing properties. Another object of the present invention is to provide an electronic component and a method for producing an electronic component using the curable composition.

[0008] According to a broad aspect of the present invention, there is provided a curable composition for inkjet printing and for forming air cavities, which comprises a photocurable compound having a (meth)acryloyl group or a vinyl group but not having a cyclic ether group, and a thermosetting compound having no (meth)acryloyl group but having a cyclic ether group, wherein the content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition for inkjet printing and for forming air cavities, and the curable composition is irradiated with light having a wavelength of 365 nm at an illuminance of 2000 mW / cm. ２ When a curable composition for inkjet printing and for forming air cavities is irradiated so as to obtain a B-stage product, the viscosity of the B-stage product at 40° C. is 2.5×10 ２ Pa・s or more 3.0×10 ６ The present invention provides a curable composition for inkjet printing and for forming air cavities (hereinafter, sometimes abbreviated as "curable composition") having a viscosity of 1 Pa·s or less.

[0009] In a specific aspect of the curable composition according to the present invention, the photocurable compound includes a first photocurable compound having one (meth)acryloyl group and one vinyl group in total, and a second photocurable compound having two or more (meth)acryloyl groups and two or more vinyl groups in total.

[0010] In a specific aspect of the curable composition according to the present invention, the first photocurable compound is a photocurable compound having one (meth)acryloyl group, and the second photocurable compound is a photocurable compound having two or more (meth)acryloyl groups.

[0011] In a specific aspect of the curable composition according to the present invention, the curable composition does not contain or contains a photo- and thermo-curable compound having a (meth)acryloyl group and a cyclic ether group, and when the curable composition does not contain the photo- and thermo-curable compound, the content of the second photo-curable compound is 5% by weight or more and 25% by weight or less based on 100% by weight of the photo-curable compound; and when the curable composition contains the photo- and thermo-curable compound, the content of the second photo-curable compound is 4% by weight or more and 20% by weight or less based on 100% by weight of the total content of the photo- and thermo-curable compound and the photo- and thermo-curable compound.

[0012] In a specific aspect of the curable composition according to the present invention, the curable composition includes a thermal curing agent.

[0013] In a specific aspect of the curable composition according to the present invention, the thermal curing agent includes an amine compound.

[0014] According to a broad aspect of the present invention, there is provided an electronic component comprising a first member, a second member, and an adhesive portion bonding an upper surface of the first member to a side surface or a lower surface of the second member, wherein an air cavity is formed by the first member, the second member, and the adhesive portion, and the adhesive portion is a cured product of the above-mentioned curable composition for inkjet printing and for forming an air cavity.

[0015] In a specific aspect of the electronic component according to the present invention, the ratio of the height of the adhesive portion to the width of the adhesive portion is 1.0 or greater.

[0016] According to a broad aspect of the present invention, there is provided a method for manufacturing an electronic component, comprising: a coating step of applying the above-mentioned curable composition onto the surface of a first member using an inkjet device to form a curable composition layer; a photo-curing step of irradiating light to promote curing of the curable composition layer to form a B-staged product layer; and a thermal curing step of thermally curing the B-staged product layer by heating, wherein in the coating step and the photo-curing step, coating and photo-curing are repeated in the thickness direction of the curable composition layer to form a B-staged product layer in contact with the side surface or bottom surface of a second member.

[0017] The curable composition for inkjet printing and for forming air cavities according to the present invention contains a photocurable compound having a (meth)acryloyl group or a vinyl group but not a cyclic ether group, and a thermosetting compound having a cyclic ether group but not a (meth)acryloyl group. The content of the thermosetting compound is 5 wt% or more in 100 wt% of the curable composition for inkjet printing and for forming air cavities according to the present invention. The curable composition for inkjet printing and for forming air cavities according to the present invention is cured by irradiating light with a wavelength of 365 nm at an illuminance of 2000 mW / cm. ２ When a curable composition for inkjet printing and for forming air cavities was irradiated so as to obtain a B-stage product, the viscosity of the B-stage product at 40° C. was 2.5×10 ２ Pa・s or more 3.0×10 ６ The curable composition for inkjet printing and for forming an air cavity according to the present invention has the above-mentioned configuration, and therefore can form a cured product layer with a large aspect ratio and can improve adhesion and sealing properties.

[0018] Fig. 1 is a cross-sectional view schematically illustrating an electronic component obtained using the curable composition for inkjet printing and for forming air cavities according to the first embodiment of the present invention. Figs. 2(a) to 2(c) are cross-sectional views illustrating each step of the method for producing the electronic component shown in Fig. 1. Figs. 3(d) to 3(g) are cross-sectional views illustrating each step of the method for producing the electronic component shown in Fig. 1.

[0019] The present invention will be described in detail below.

[0020] (Curable composition for inkjet printing and for forming an air cavity) The curable composition for inkjet printing and for forming an air cavity according to the present invention (hereinafter sometimes abbreviated as "curable composition") is used by being applied using an inkjet device. The curable composition according to the present invention differs from curable compositions applied by screen printing and from curable compositions applied by a dispenser.

[0021] The curable composition according to the present invention comprises a photocurable compound having a (meth)acryloyl group or a vinyl group but not having a cyclic ether group, and a thermosetting compound having a cyclic ether group but not having a (meth)acryloyl group, wherein the content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition according to the present invention.

[0022] In this specification, the above-mentioned "photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group" may be referred to as "(A) photocurable compound".

[0023] In this specification, the above-mentioned "thermosetting compound having no (meth)acryloyl group and having a cyclic ether group" may be referred to as "(B) thermosetting compound."

[0024] Therefore, the curable composition according to the present invention contains (A) a photocurable compound and (B) a thermosetting compound, and the content of (B) the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition according to the present invention.

[0025] In the curable composition according to the present invention, light having a wavelength of 365 nm is applied at an illuminance of 2000 mW / cm ２ When the curable composition was irradiated so as to obtain a B-staged product, the viscosity of the B-staged product at 40°C was 2.5 x 10 ２ Pa・s or more 3.0×10 ６ It is less than Pa·s.

[0026] The curable composition according to the present invention, having the above-described configuration, can form a cured product layer with a large aspect ratio and can enhance adhesion and sealing properties. The curable composition according to the present invention can form a cured product layer with a large height-to-width ratio. Because the curable composition according to the present invention can form a cured product layer with a large aspect ratio, the distance between the bonded members (the distance between the first member and the second member) can be controlled to a desired distance. Furthermore, the curable composition according to the present invention can further increase the adhesive strength between the bonded members (the first member and the second member) and the cured product of the curable composition (the adhesive joint). Therefore, the curable composition according to the present invention can effectively form an air cavity between, for example, the first member (the lower member), the second member (the upper member), and the adhesive joint formed by the cured product of the curable composition. Furthermore, electronic components having an air cavity formed using the curable composition according to the present invention are less likely to peel between the first and second members and the adhesive joint even when subjected to a reflow process.

[0027] The curable composition according to the present invention may or may not contain a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group.

[0028] In this specification, the above-mentioned "photo- and thermo-curable compound having a (meth)acryloyl group and a cyclic ether group" may be referred to as "(C) photo- and thermo-curable compound."

[0029] The curable composition is a photo- and thermosetting composition because it contains (A) a photocurable compound and (B) a thermosetting compound. The curable composition is preferably used by being cured by irradiation with light and then cured by heating.

[0030] Light with a wavelength of 365 nm and an illuminance of 2000 mW / cm ２ The curable composition for inkjet printing and for forming air cavities is irradiated so as to obtain a B-stage product. The viscosity of the B-stage product at 40°C is 2.5 × 10 ２ Pa・s or more 3.0×10 ６The viscosity of the B-staged product at 40°C is 2.5 x 10 ２ If the viscosity is less than Pa s, it may be difficult to form a cured product layer with a large aspect ratio or to improve sealing properties. ６ If the temperature exceeds this range, it may be difficult to improve the adhesiveness or the sealing property.

[0031] The viscosity of the B-staged product at 40°C is preferably 3.0 x 10 ３ Pa s or more, more preferably 4.0 × 10 ３ Pa s or more, more preferably 5.0 × 10 ３ Pa s or more, more preferably 7.5 × 10 ３ Pa s or more, particularly preferably 1.0 × 10 ４ Pa s or more, most preferably 2.0 × 10 ４ The viscosity of the B-staged product at 40°C is preferably 1.0 x 10 ６ Pa s or less, more preferably 3.0 × 10 ５ Pa s or less, more preferably 1.0 × 10 ５ When the viscosity of the B-staged product at 40°C is equal to or higher than the lower limit, a cured product layer having a large aspect ratio can be more satisfactorily formed, and the sealing property can be further improved. When the viscosity of the B-staged product at 40°C is equal to or lower than the upper limit, the adhesiveness and sealing property can be further improved. The viscosity of the B-staged product at 40°C is 7.5 x 10 ３ Pa s or less, and may be 6.5 × 10 ３ It may be Pa·s or less.

[0032] More specifically, the B-staged product for measuring the viscosity at 40°C is a product having an illumination intensity of 2000 mW / cm at a wavelength of 365 nm. ２ The cumulative light intensity was 20,000 mJ / cm ２ The curable composition for inkjet printing and for forming air cavities can be obtained by irradiating the curable composition for inkjet printing and for forming air cavities with light of the above formula.

[0033] The viscosity of the B-staged product at 40°C is measured using a viscoelasticity measuring device (for example, the "ARES Viscoelasticity Measuring Device" manufactured by TA Instruments) under the conditions of 40°C, measurement plate: parallel plates with a diameter of 8 mm, and a frequency of 1 Hz. In this specification, the viscosity of the B-staged product refers to the complex viscosity (η*).

[0034] Methods for adjusting the viscosity of the B-staged product at 40° C. within a preferred range include, for example, appropriately selecting the type of (A) photocurable compound, adjusting the contents of a first photocurable compound and a second photocurable compound, which will be described later, etc. In particular, from the viewpoint of adjusting the viscosity of the B-staged product at 40° C. to the above-mentioned lower limit or higher, it is preferable to increase the content of the second photocurable compound.

[0035] Hereinafter, each component contained in the curable composition will be described in detail. In this specification, "(meth)acryloyl" means one or both of "acryloyl" and "methacryloyl", and "(meth)acrylate" means one or both of "acrylate" and "methacrylate". In addition, in this specification, the CH ２ The ═CH group is not included in the vinyl group.

[0036] <(A) Photocurable Compound> The curable composition contains (A) a photocurable compound. The (A) photocurable compound is a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group. The (A) photocurable compound may have a (meth)acryloyl group, may have a vinyl group, or may have both a (meth)acryloyl group and a vinyl group. The (meth)acryloyl group and the vinyl group are photocurable functional groups. The (A) photocurable compound does not have, for example, an epoxy group (cyclic ether group). Only one type of (A) photocurable compound may be used, or two or more types may be used in combination.

[0037] From the viewpoint of more effectively exerting the effects of the present invention, it is preferable that the (A) photocurable compound includes a first photocurable compound having one (meth)acryloyl group and one vinyl group in total, and it is preferable that the (A) photocurable compound includes a second photocurable compound having two or more (meth)acryloyl groups and two or more vinyl groups in total. The first photocurable compound has one (meth)acryloyl group and no vinyl groups, or has no (meth)acryloyl groups and one vinyl group. The second photocurable compound may have two, three, or more (meth)acryloyl groups and two or more vinyl groups in total.

[0038] From the viewpoint of further effectively exerting the effects of the present invention, it is more preferable that the (A) photocurable compound includes a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group, and a second photocurable compound having a total of two or more (meth)acryloyl groups and one vinyl group. The first photocurable compound and the second photocurable compound may each be used alone or in combination of two or more.

[0039] From the viewpoint of more effectively exerting the effects of the present invention and forming a curable composition layer with high precision, it is preferable that the (A) photocurable compound has a (meth)acryloyl group. It is preferable that the (A) photocurable compound is a (meth)acrylate compound. From the viewpoint of more effectively exerting the effects of the present invention and forming a curable composition layer with high precision, it is preferable that the first photocurable compound is a photocurable compound having one (meth)acryloyl group, and it is preferable that the second photocurable compound is a photocurable compound having two or more (meth)acryloyl groups. That is, it is preferable that the first photocurable compound is a monofunctional (meth)acrylate compound, and it is preferable that the second photocurable compound is a polyfunctional (meth)acrylate compound.

[0040] Examples of the monofunctional (meth)acrylate compound that is the first photocurable compound include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, methoxy Examples of the acrylates include diethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, isodecyl (meth)acrylate, isononyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono(meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, and stearyl (meth)acrylate.

[0041] The second photocurable compound may be a difunctional (meth)acrylate compound or a trifunctional (meth)acrylate compound. The second photocurable compound may be a tri- or higher functional (meth)acrylate compound or a tetra- or higher functional (meth)acrylate compound. The second photocurable compound may be a (meth)acrylate compound having two (meth)acryloyl groups or a (meth)acrylate compound having three (meth)acryloyl groups. The second photocurable compound may be a (meth)acrylate compound having three or more (meth)acryloyl groups or a (meth)acrylate compound having four or more (meth)acryloyl groups. The second photocurable compound may be a (meth)acrylate compound having 10 or less (meth)acryloyl groups.

[0042] Examples of the bifunctional (meth)acrylate compound include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propanediol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, ethoxylated bisphenol A, ethoxylated bisphenol B, ethoxylated bisphenol C ... B, ethoxylated bisphenol C, ethoxylated bisphenol A, ethoxylated bisphenol B, ethoxylated bisphenol B, ethoxylated bisphenol C, ethoxylated bisphenol A, ethoxylated bisphenol B, ethoxylated bisphenol B, ethoxylated bisphenol C, ethoxylated bisphenol B, ethoxylated bisphenol C, ethoxylated bisphenol B, ethoxylated bisphenol C, ethoxylated Examples of the di(meth)acrylate include ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, urethane (meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0043] Examples of the trifunctional (meth)acrylate compound include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.

[0044] Examples of the tetrafunctional (meth)acrylate compound include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.

[0045] Examples of the pentafunctional (meth)acrylate compound include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0046] Examples of the hexafunctional (meth)acrylate compound include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0047] Examples of the photocurable compound (A) having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide.

[0048] The content of the photocurable compound (A) in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and particularly preferably 15% by weight or more. The content of the photocurable compound (A) in 100% by weight of the curable composition is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 65% ​​by weight or less, even more preferably 60% by weight or less, even more preferably 50% by weight or less, and particularly preferably 40% by weight or less. When the content of the photocurable compound (A) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0049] The content of the first photocurable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less. When the content of the first photocurable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0050] When the curable composition does not contain (C) the photo- and thermosetting compound, the content of the first photo-curable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 20% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less. When the content of the first photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0051] When the curable composition contains (C) a photo- and thermosetting compound, the content of the first photo-curable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the content of the first photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0052] The content of the second photocurable compound in 100% by weight of the curable composition is preferably 1% by weight or more, more preferably 2% by weight or more, even more preferably 3% by weight or more, and preferably 25% by weight or less, more preferably 15% by weight or less, and even more preferably 10% by weight or less. When the content of the second photocurable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0053] When the curable composition does not contain (C) the photo- and thermosetting compound, the content of the second photo-curable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 6% by weight or more, even more preferably 7% by weight or more, and preferably 25% by weight or less, more preferably 20% by weight or less, and even more preferably 15% by weight or less. When the content of the second photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0054] When the curable composition contains (C) a photo- and thermosetting compound, the content of the second photo-curable compound in 100% by weight of the curable composition is preferably 4% by weight or more, more preferably 5% by weight or more, even more preferably 6% by weight or more, and preferably 20% by weight or less, more preferably 18% by weight or less, and even more preferably 16% by weight or less. When the content of the second photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0055] In 100% by weight of the curable composition, the total content of the first photocurable compound and the second photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, and preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0056] When the curable composition does not contain (C) a photo- and heat-curable compound, the total content of the first photo- and second photo-curable compounds in 100% by weight of the curable composition is preferably 10% by weight or more, more preferably 15% by weight or more, and even more preferably 20% by weight or more. When the curable composition does not contain (C) a photo- and heat-curable compound, the total content of the first photo- and second photo-curable compounds in 100% by weight of the curable composition is preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is equal to or greater than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0057] When the curable composition contains (C) a photo- and heat-curable compound, the total content of the first photo- and second photo-curable compounds in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, and even more preferably 15% by weight or more. When the curable composition contains (C) a photo- and heat-curable compound, the total content of the first photo- and second photo-curable compounds in 100% by weight of the curable composition is preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is equal to or greater than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0058] In 100% by weight of the photocurable compound (A), the content of the first photocurable compound is preferably 25% by weight or more, more preferably 30% by weight or more, even more preferably 35% by weight or more, and preferably 90% by weight or less, more preferably 80% by weight or less, and even more preferably 75% by weight or less. When the content of the first photocurable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0059] The content of the second photocurable compound in 100% by weight of the (A) photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, and preferably 60% by weight or less, more preferably 55% by weight or less, and even more preferably 50% by weight or less. When the content of the second photocurable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0060] When the curable composition does not contain (C) the photo- and thermosetting compound, the content of the second photo-curable compound is preferably 5 wt% or more, more preferably 10 wt% or more, and preferably 25 wt% or less, more preferably 20 wt% or less, based on 100 wt% of the photo-curable compound (A). When the content of the second photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0061] When the curable composition contains the photo- and thermo-curable compound (C), the content of the second photo-curable compound is preferably 4% by weight or more, more preferably 10% by weight or more, and preferably 20% by weight or less, more preferably 15% by weight or less, based on 100% by weight of the total content of the photo- and thermo-curable compound (A) and the photo- and thermo-curable compound (C). When the content of the second photo-curable compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0062] <(B) Thermosetting Compound> The curable composition contains (B) a thermosetting compound. The (B) thermosetting compound is a thermosetting compound that does not have a (meth)acryloyl group and has a cyclic ether group. The cyclic ether group is a thermosetting functional group. Only one type of (B) thermosetting compound may be used, or two or more types may be used in combination.

[0063] Examples of the cyclic ether group contained in the (B) thermosetting compound include an epoxy group, etc. The (B) thermosetting compound may have only one type of cyclic ether group, or may have two or more types of cyclic ether groups.

[0064] From the viewpoint of more effectively exerting the effects of the present invention and from the viewpoint of forming a curable composition layer with high precision, the cyclic ether group in the (B) thermosetting compound is preferably an epoxy group. The (B) thermosetting compound preferably has an epoxy group. The (B) thermosetting compound is preferably an epoxy compound.

[0065] The (B) thermosetting compound may include a first thermosetting compound having one cyclic ether group, or may include a second thermosetting compound having two or more cyclic ether groups. The (B) thermosetting compound may include an epoxy compound having one epoxy group (monofunctional epoxy compound), or may include an epoxy compound having two or more epoxy groups (polyfunctional epoxy compound). The first thermosetting compound and the second thermosetting compound may each be used alone or in combination of two or more.

[0066] From the viewpoint of more effectively exerting the effects of the present invention, the (B) thermosetting compound preferably contains an epoxy compound having two or more epoxy groups, and more preferably is an epoxy compound having two or more epoxy groups.

[0067] From the viewpoint of further effectively exerting the effects of the present invention, the (B) thermosetting compound preferably contains an epoxy compound having two epoxy groups, and more preferably is an epoxy compound having two epoxy groups.

[0068] Examples of the epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.

[0069] From the viewpoint of exerting the effects of the present invention, particularly from the viewpoint of increasing the adhesive strength between the members to be adhered and the cured product (adhesive portion) of the curable composition, the content of the thermosetting compound (B) is 5 wt % or more in 100 wt % of the curable composition.

[0070] In 100% by weight of the curable composition, the content of the (B) thermosetting compound is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 50% by weight or less, more preferably 40% by weight or less, and even more preferably 35% by weight or less. When the content of the (B) thermosetting compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited, and the adhesive strength between the bonded members and the cured product (adhesive portion) of the curable composition can be further increased.

[0071] In 100% by weight of the curable composition, the total content of the (A) photocurable compound and the (B) thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, even more preferably 17% by weight or more, particularly preferably 20% by weight or more, and most preferably 30% by weight or more. In 100% by weight of the curable composition, the total content of the (A) photocurable compound and the (B) thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the total content is equal to or greater than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0072] <(C) Photo- and Thermo-Curable Compound> The curable composition may or may not contain a (C) photo- and thermo-curable compound. The (C) photo- and thermo-curable compound is a photo- and thermo-curable compound having a (meth)acryloyl group and a cyclic ether group. From the viewpoint of further increasing the adhesive strength between the adhesion target member and the cured product (adhesive portion) of the curable composition, it is preferable that the curable composition contains a (C) photo- and thermo-curable compound. The (meth)acryloyl group is a photo-curable functional group, and the cyclic ether group is a thermo-curable functional group. Only one type of (C) photo- and thermo-curable compound may be used, or two or more types may be used in combination.

[0073] The photo- and thermosetting compound (C) may have one (meth)acryloyl group or two or more (meth)acryloyl groups.

[0074] Examples of the cyclic ether group contained in the (C) photo- and thermosetting compound include an epoxy group, etc. The (C) photo- and thermosetting compound may have only one type of cyclic ether group or two or more types.

[0075] From the viewpoint of more effectively exerting the effects of the present invention and more effectively increasing the adhesive strength between the members to be adhered and the cured product (adhesive joint) of the curable composition, the cyclic ether group of the photo- and thermosetting compound (C) is preferably an epoxy group, and the photo- and thermosetting compound (C) preferably has a (meth)acryloyl group and an epoxy group.

[0076] The (C) photo- and thermosetting compound may have one, two, or more than two cyclic ether groups. The (C) photo- and thermosetting compound may have one, two, or more than two epoxy groups.

[0077] (C) Examples of the photo- and thermosetting compound include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0078] The (C) photo- and thermosetting compound preferably contains glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether. The (C) photo- and thermosetting compound more preferably contains 4-hydroxybutyl acrylate glycidyl ether. In this case, the effects of the present invention can be more effectively exhibited, and the adhesive strength between the members to be adhered and the cured product (adhesive portion) of the curable composition can be further increased.

[0079] In 100% by weight of the curable composition, the content of (C) the photo- and thermosetting compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 70% by weight or less, more preferably 65% ​​by weight or less, and even more preferably 60% by weight or less. When the content of (C) the photo- and thermosetting compound is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited, and the adhesive strength between the members to be adhered and the cured product of the curable composition (adhesive portion) can be further increased.

[0080] In 100% by weight of the curable composition, the total content of (A) the photocurable compound and (C) the photo- and thermosetting compound is preferably 15% by weight or more, more preferably 20% by weight or more, even more preferably 30% by weight or more, and preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the total content is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited, and the adhesive strength between the bonded members and the cured product (adhesive portion) of the curable composition can be further increased.

[0081] In 100% by weight of the curable composition, the total content of (B) the thermosetting compound and (C) the photo- and thermosetting compound is preferably 17% by weight or more, more preferably 20% by weight or more, even more preferably 25% by weight or more, preferably 70% by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the total content is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited, and the adhesive strength between the bonded members and the cured product (adhesive portion) of the curable composition can be further increased.

[0082] <Photopolymerization initiator> The curable composition preferably contains a photopolymerization initiator. The photopolymerization initiator may be used alone or in combination of two or more.

[0083] Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0084] The photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.Examples of the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1 aminoacetophenone compounds such as 2-methylanthraquinone, ... Thioxanthone compounds such as thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzil dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanol oxime ester compounds such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyloxime); and titanocene compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium.The photoradical polymerization initiators may be used alone or in combination of two or more.

[0085] A photopolymerization initiation aid may be used together with the above-mentioned photoradical polymerization initiator. Examples of the photopolymerization initiation aid include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Photopolymerization initiation aids other than these may also be used. The above-mentioned photopolymerization initiation aids may be used alone or in combination of two or more.

[0086] Furthermore, titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals) that have absorption in the visible light region may be used to promote the photoreaction.

[0087] Examples of the photocationic polymerization initiator include sulfonium salts, iodonium salts, metallocene compounds, benzoin tosylate, etc. The photocationic polymerization initiator may be used alone or in combination of two or more.

[0088] The content of the photopolymerization initiator in 100% by weight of the curable composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, and preferably 30% by weight or less, more preferably 20% by weight or less, even more preferably 10% by weight or less.

[0089] <Thermal Curing Agent> The curable composition preferably contains a thermal curing agent. The thermal curing agents may be used alone or in combination of two or more.

[0090] Examples of the heat curing agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. Modified polyamine compounds such as amine-epoxy adducts may also be used as the heat curing agent. Other heat curing agents may also be used.

[0091] The amine compound refers to a compound having one or more primary, secondary, or tertiary amino groups. Examples of the amine compound include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives. Furthermore, the amine compound may be an adduct such as an epoxy compound-added polyamine (a reaction product of an epoxy compound and a polyamine), a Michael addition polyamine (a reaction product of an α,β-unsaturated ketone and a polyamine), a Mannich addition polyamine (a condensate of a polyamine with formalin and a phenol), a thiourea-added polyamine (a reaction product of thiourea and a polyamine), or a ketone-blocked polyamine (a reaction product of a ketone compound and a polyamine [ketimine]).

[0092] Examples of the aliphatic polyamine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0093] Examples of the alicyclic polyamine include menthene diamine, isophorone diamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0094] Examples of the aromatic polyamine include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0095] Examples of the hydrazide include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.

[0096] Examples of the guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, α-2,5-dimethylguanide, α,ω-diphenyldiguanidide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0097] Examples of the phenol compound include polyhydric phenol compounds, such as phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, naphthalene skeleton-containing phenol novolac resins, xylylene skeleton-containing phenol novolac resins, dicyclopentadiene skeleton-containing phenol novolac resins, and fluorene skeleton-containing phenol novolac resins.

[0098] Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0099] The heat curing agent is preferably a heat curing agent other than an acid anhydride. Acid anhydrides are compounds that are relatively volatile. Therefore, by using a heat curing agent other than an acid anhydride, contamination of electronic components caused by volatilization of the heat curing agent can be suppressed. Furthermore, by using a heat curing agent other than an acid anhydride, the adhesive strength between the bonded members and the cured product (adhesive portion) of the curable composition can be further increased.

[0100] The heat curing agent preferably contains an amine compound, and is preferably an amine compound. The amine compound is preferably an aromatic amine compound. In this case, the adhesive strength between the bonded members and the cured product (adhesion portion) of the curable composition can be further increased.

[0101] In 100% by weight of the curable composition, the content of the heat curing agent is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and preferably 40% by weight or less, more preferably 30% by weight or less, even more preferably 25% by weight or less.

[0102] <Curing Accelerator> The curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more.

[0103] Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organic metal salts, phosphorus compounds, and urea compounds.

[0104] The content of the curing accelerator in 100% by weight of the curable composition is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and preferably 10% by weight or less, more preferably 5% by weight or less.

[0105] <Solvent> The curable composition may or may not contain a solvent. The solvent may be used alone or in combination of two or more.

[0106] Examples of the solvent include water and organic solvents.

[0107] From the viewpoint of further enhancing the removability of residues, the solvent is preferably an organic solvent.

[0108] Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0109] From the viewpoint of further increasing the thickness precision of the curable composition layer, the smaller the content of the solvent in the curable composition, the better.

[0110] When the curable composition contains the solvent, the content of the solvent is preferably 5 wt % or less, more preferably 1 wt % or less, and even more preferably 0.5 wt % or less, based on 100 wt % of the curable composition. It is most preferable that the curable composition does not contain the solvent.

[0111] <Other Components> The curable composition may contain components other than the above-described components. The other components are not particularly limited, but examples thereof include an adhesion aid such as a coupling agent, a filler, a leveling agent, an antifoaming agent, and a polymerization inhibitor.

[0112] (Other Details of Curable Composition) The curable composition is applied using an inkjet device, and is therefore generally liquid at 25°C. The viscosity of the curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 160 mPa·s or more, preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, and still more preferably 1500 mPa·s or less. From the viewpoints of further increasing the thickness accuracy of the curable composition layer and further reducing the likelihood of voids occurring in the curable composition layer, it is particularly preferable that the viscosity of the curable composition at 25°C and 10 rpm be 160 mPa·s or more and 1600 mPa·s or less.

[0113] The viscosity is measured at 25° C. using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

[0114] The curable composition is exposed to light with a wavelength of 365 nm at an illuminance of 2000 mW / cm ２ When the curable composition for inkjet printing and for forming air cavities is irradiated so as to obtain a B-staged product, it is preferable that the curable composition can form a B-staged product having a height to width ratio (height / width) (aspect ratio) of 1.0 or more. The curable composition is preferably capable of forming a B-staged product having a height to width ratio (height / width) of 1.5 or more, more preferably a B-staged product having a height / width ratio of 2.0 or more, and even more preferably a B-staged product having a height / width ratio of 2.5 or more. When the curable composition is capable of forming a B-staged product having a height / width ratio of 1.0 or more, a cured product layer having a large height / width ratio (aspect ratio) can be formed, and adhesion and sealability can be further improved. The height / width ratio may be 100 or less, 50 or less, 10 or less, or 5.0 or less.

[0115] The B-staged product for measuring the ratio (height / width) can be formed by the following method: The curable composition is applied using an inkjet device to form a curable composition layer (application step). Then, the curable composition is applied to a substrate at an illuminance of 2000 mW / cm at a wavelength of 365 nm. ２ The cumulative light intensity was 200 mJ / cm ２ The curable composition layer is irradiated with light of 1000 nm to advance the curing of the curable composition layer and form a B-staged product (B-staged product layer) (photocuring step). In the coating step and the photocuring step, coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-staged product (B-staged product layer).

[0116] The curable composition according to the present invention can form a cured layer having a large height-to-width ratio. The curable composition according to the present invention can be suitably used to form a cured layer having a height-to-width ratio (height / width) (aspect ratio) of 1.0 or more (use of the curable composition for forming a cured layer having a height-to-width ratio (height / width) (aspect ratio) of 1.0 or more). The height / width ratio of the cured layer is preferably 1.5 or more, more preferably 2.0 or more, and even more preferably 2.5 or more, and may be 100 or less, 50 or less, 10 or less, or 5.0 or less.

[0117] The curable composition can be used to bond a first member and a second member, and can also form an air cavity. The curable composition can be used to manufacture an electronic component having an air cavity. The curable composition is preferably a curable composition used to bond the upper surface of the first member to the side or lower surface of the second member, and more preferably a curable composition used to bond the upper surface of the first member to the side surface of the second member. In this case, the curable composition may be a curable composition used to bond the upper surface of the first member to the side surface and upper surface of the second member.

[0118] The first member and the second member will be described in detail later.

[0119] (Electronic component and manufacturing method of electronic component) The electronic component according to the present invention comprises a first member, a second member, and an adhesive portion bonding an upper surface of the first member to a side surface or a lower surface of the second member, and an air cavity is formed by the first member, the second member, and the adhesive portion. In the electronic component according to the present invention, the adhesive portion is a cured product of the above-mentioned curable composition for inkjet printing and for forming an air cavity.

[0120] The method for manufacturing the electronic component preferably includes the following steps (1) to (3): (1) a coating step of applying the above-described curable composition onto the surface of a first member using an inkjet device to form a curable composition layer; (2) a photocuring step of irradiating the curable composition layer with light to promote curing, thereby forming a B-staged product layer; and (3) a thermal curing step of thermally curing the B-staged product layer by heating.

[0121] In the method for manufacturing an electronic component, it is preferable that in the coating step and the photocuring step, coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-staged product layer in contact with the side surface or bottom surface of the second member.

[0122] Specific embodiments of the present invention will be described below with reference to the drawings. Note that in the drawings, the size, thickness, shape, etc. may differ from the actual size, thickness, shape, etc. for the sake of convenience of illustration.

[0123] FIG. 1 is a cross-sectional view schematically showing an electronic component obtained using the curable composition for inkjet printing and for forming air cavities according to the first embodiment of the present invention.

[0124] The electronic component 10 shown in FIG. 1 includes a first member 1, a second member 2, an adhesive portion 3, solder balls 41, a resin sheet 42, connection terminals 43, and a molded resin portion 44. The adhesive portion 3 is a cured product of the curable composition described above. The adhesive portion 3 is a photo- and thermally cured product of the curable composition described above. The adhesive portion 3 bonds the top surface of the first member 1 to the side and top surfaces of the second member 2. The adhesive portion 3 is disposed on the top surface of the first member 1. The adhesive portion 3 is disposed on the side surface of the second member 2 and also on the top surface of the second member 2. The adhesive portion 3 is disposed on a portion of the top surface of the first member 1 and on a portion of the side surface and the entire top surface of the second member 2. The adhesive portion 3 is not disposed on the bottom surface of the second member 2. An air cavity R is formed by the first member 1, the second member 2, and the adhesive portion 3. The molded resin portion 44 is disposed on the outer surface of the adhesive portion 3 .

[0125] In the electronic component 10, the first member 1 is a circuit board and the second member 2 is a semiconductor chip. The electronic component 10 is a communication filter.

[0126] In the electronic component, the adhesive portion may or may not be disposed on the upper surface of the second member. Also, in the electronic component, the adhesive portion may or may not be disposed on the lower surface of the second member. In the electronic component, the adhesive portion may or may not be disposed on the lower surface of the second member, but not on a side surface.

[0127] An example of a method for manufacturing the electronic component shown in FIG. 1 will be described with reference to FIGS. 2(a) to 2(c) and FIGS. 3(d) to 3(g).

[0128] 2(a), a curable composition layer 3A is formed by applying a curable composition using an inkjet device onto the surface of a first member 1 (application step). The curable composition is applied to the upper surface of the first member 1 to form a curable composition layer 3A. The curable composition is ejected from an ejection unit 51 of the inkjet device.

[0129] 2(b), the curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to proceed with curing of the curable composition layer 3A, thereby forming a B-staged product layer 3B (photo-curing step). The B-staged product layer 3B is a pre-cured product layer of the curable composition.

[0130] In the method for producing an electronic component, after applying the curable composition to a specific region, the entire applied curable composition may be irradiated with light to form a B-staged product layer. In the method for producing an electronic component, the applied curable composition may be irradiated with light every time multiple drops of the curable composition are applied to form a B-staged product layer. In the method for producing an electronic component, the applied curable composition may be irradiated with light every time one drop of the curable composition is applied to form a B-staged product layer.

[0131] After the photocuring step, it is determined whether or not to repeat the coating step and the photocuring step. If the coating step and the photocuring step are repeated, the curable composition is coated on the surface side of the formed B-staged material layer opposite to the first member side.

[0132] 2(c) and 3(d) are diagrams showing the second coating step and the second photocuring step, respectively. As shown in FIG. 2(c), an inkjet device is used to coat a curable composition on the surface of the B-staged material layer 3B opposite the first member 1 side, thereby forming a curable composition layer 3A on the surface of the B-staged material layer 3B. Next, as shown in FIG. 3(d), light is irradiated onto the coated curable composition layer 3A from a light irradiation unit 52 of the inkjet device, thereby forming a B-staged material layer 3B.

[0133] 2 and 3, the coating step and the photo-curing step are performed twice in the thickness direction of the curable composition layer, as shown in Figures 2(a) and 2(b) and as shown in Figures 2(c) and 3(d). By performing the coating step and the photo-curing step multiple times in the thickness direction of the curable composition layer, the thickness of the B-staged product layer can be increased, and the ratio (height (thickness) / width) (aspect ratio) of the B-staged product layer can be increased. The coating step and the photo-curing step may each be performed two or more times, or three or more times.

[0134] In the above coating step and photo-curing step, coating and photo-curing are repeated to form a B-stage compound layer 3B in contact with the side surface of the second member 2, as shown in Fig. 3(e). In Fig. 3(e), a B-stage compound layer 3B in contact with the side surface and top surface of the second member 2 is formed.

[0135] Next, the B-staged material layer 3B is thermally cured by heating (thermal curing step). The laminated structure including the first member 1, the second member 2, and the B-staged material layer 3B obtained in FIG. 3(e) is heated to thermally cure the B-staged material layer 3B. This forms the adhesive portion 3 as shown in FIG. 3(f). The adhesive portion 3 is a photo- and thermo-cured layer of the curable composition.

[0136] Next, as shown in FIG. 3( g ), a resin is placed on the outside of the adhesive portion 3 to form a molded resin portion 44 .

[0137] In this manner, the electronic component 10 shown in FIG. 1 can be obtained.

[0138] In the photo-curing step, ultraviolet light is preferably irradiated. The irradiance and irradiation time of the ultraviolet light in the photo-curing step can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition. The irradiance of the ultraviolet light in the photo-curing step is, for example, 1000 mW / cm ２ or more, 5000 mW / cm ２ or more, and may be 10,000 mW / cm ２ or less, and 8000 mW / cm ２ The irradiation time of ultraviolet light in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.

[0139] The heating temperature and heating time in the thermal curing step can be appropriately changed depending on the composition of the curable composition and the thickness of the B-staged product layer. The heating temperature in the thermal curing step may be, for example, 100° C. or higher, 120° C. or higher, and 250° C. or lower, or 200° C. or lower. The heating time in the thermal curing step may be, for example, 5 minutes or longer, 30 minutes or longer, or 600 minutes or shorter, or 300 minutes or shorter.

[0140] The ratio of the height of the adhesive portion to the width of the adhesive portion (height / width) is preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and particularly preferably 2.5 or more. When the ratio (height / width) is equal to or greater than the lower limit, the adhesiveness and sealing properties can be further improved. The upper limit of the ratio (height / width) is not particularly limited. The ratio (height / width) of the adhesive portion may be 100 or less, 50 or less, 10 or less, or 5.0 or less. From the viewpoint of miniaturizing the resulting electronic component, the ratio (height / width) is preferably 5.0 or less.

[0141] The width, height, shape, etc. of the adhesive portion can be changed as appropriate.

[0142] The width of the adhesive portion is preferably the width of the adhesive portion at the contact surface between the surface of the first member and the adhesive portion. At the contact surface between the surface of the first member and the adhesive portion, the width of the adhesive portion may be 50 μm or more, 100 μm or more, 150 μm or more, 250 μm or less, 230 μm or less, or 200 μm or less.

[0143] The height of the adhesive portion is preferably the distance from the contact surface between the surface of the first member and the adhesive portion to the maximum height position of the adhesive portion. The distance from the contact surface between the surface of the first member and the adhesive portion to the maximum height position of the adhesive portion may be 100 μm or more, 200 μm or more, 300 μm or more, 500 μm or less, 450 μm or less, or 400 μm or less.

[0144] The first member may be a circuit board or the like.

[0145] The second member may be a semiconductor chip or the like.

[0146] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples.

[0147] The following materials were prepared:

[0148] ((A) Photocurable Compounds) Monofunctional (meth)acrylate compound 1: 2-ethylhexyl acrylate ("AEH" manufactured by Nippon Shokubai Co., Ltd.) Monofunctional (meth)acrylate compound 2: isobornyl acrylate ("IBOA" manufactured by Nippon Shokubai Co., Ltd.) Bifunctional (meth)acrylate compound 1: ethoxylated bisphenol diacrylate A ("ABE-300" manufactured by Shin-Nakamura Chemical Co., Ltd.) Bifunctional (meth)acrylate compound 2: tricyclodecane dimethanol diacrylate ("IRR-214K" manufactured by Daicel-Allnex Co., Ltd.) Bifunctional (meth)acrylate compound 3: polyester urethane acrylate ("UA4400" manufactured by Shin-Nakamura Chemical Co., Ltd.) Trifunctional (meth)acrylate compound: trimethylolpropane triacrylate ("TMPTA" manufactured by Daicel-Allnex Co., Ltd.) Hexafunctional (meth)acrylate compound: dipentaerythritol hexaacrylate ("DPHA" manufactured by Daicel Allnex Co., Ltd.)

[0149] ((B) Thermosetting Compounds) Difunctional epoxy compound 1: bisphenol A type epoxy compound ("YD127" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Difunctional epoxy compound 2: glycidylamine type epoxy compound ("JER630" manufactured by Mitsubishi Chemical Corporation) Difunctional epoxy compound 3: bisphenol F type epoxy compound ("YDF-170" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Difunctional epoxy compound 4: dicyclopentadiene dimethanol diglycidyl ether ("EP-4088S" manufactured by ADEKA Corporation)

[0150] ((C) Photo- and thermosetting compound) 4-hydroxybutyl acrylate glycidyl ether ("4HBAGE" manufactured by Nippon Kasei Co., Ltd.)

[0151] (Photopolymerization initiators) Photopolymerization initiator 1: 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one ("Irgacure 379" manufactured by BASF) Photopolymerization initiator 2: 2-(dimethylamino)-1-(4-morpholinophenyl)-2-benzyl-1-butanone ("Irgacure 369" manufactured by BASF)

[0152] (Thermal Curing Agents) Thermal Curing Agent 1: 1,3-bis(3-aminophenoxy)benzene ("APBN" manufactured by Mitsui Chemicals, Inc.) Thermal Curing Agent 2: 4,4'-diaminodiphenyl ether ("4,4'-DADPE" manufactured by Mitsui Fine Chemicals, Inc.)

[0153] (Coupling Agent) 3-methacryloxypropyltrimethoxysilane ("KBM503" manufactured by Shin-Etsu Chemical Co., Ltd.)

[0154] (Examples 1 to 22 and Comparative Examples 1 to 5) The components shown in Tables 1 to 5 were blended in the amounts shown in Tables 1 to 5 and mixed uniformly to obtain curable compositions for inkjet printing and for forming air cavities (curable compositions).

[0155] (Evaluation) (1) Viscosity of B-staged product at 40°C The obtained curable composition was measured using an illuminance meter (Ushio Inc.'s "UIT-201") at a wavelength of 365 nm, and the illuminance was 2000 mW / cm. ２ The sample was irradiated with light for 10 seconds using an exposure device (ultra-high pressure mercury lamp, ORC Manufacturing Co., Ltd., "JL-4300-3") adjusted to a cumulative light dose of 20,000 mJ / cm ２ The viscosity of the resulting B-staged product at 40°C was measured using a viscoelasticity measuring device (TA Instruments' "ARES Viscoelasticity Measuring Device") at 40°C, measurement plates: parallel plates with a diameter of 8 mm, and a frequency of 1 Hz.

[0156] (2) Formability of a cured product layer with a large aspect ratio A semiconductor wafer (thickness: 0.7 mm) was prepared. The obtained curable composition was applied to the surface of this semiconductor wafer using an inkjet device to form a curable composition layer (coating step). Next, the curable composition layer was irradiated with light to promote curing of the curable composition layer and form a B-staged product layer (photocuring step). Note that the light irradiation in the photocuring step was performed using a UV-LED lamp with a main wavelength of 365 nm at 2000 mW / cm. ２ × 0.1 seconds (integrated light amount 200 mJ / cm ２ ) conditions. In the coating step and the photocuring step, coating and photocuring were repeated in the thickness direction of the curable composition layer to form a B-staged product layer. The obtained B-staged product layer was observed at 20x magnification using a laser microscope (Olympus Corporation, "OLS4000"), and the ratio (height / width) (aspect ratio) was determined. The formability of a cured product layer with a large aspect ratio was evaluated according to the following criteria. The width of the formed B-staged product layer was 100 μm. Therefore, for example, a B-staged product layer with an aspect ratio of 2.5 means a B-staged product layer with a height of 250 μm and a width of 100 μm.

[0157] <Criteria for determining the formability of a cured product layer with a large aspect ratio> ◯: A B-staged product layer with an aspect ratio of 2.5 or more can be formed. ○: A B-staged product layer with an aspect ratio of 2.0 or more and less than 2.5 can be formed. Δ: A B-staged product layer with an aspect ratio of 1.0 or more and less than 2.0 can be formed. ×: A B-staged product layer with an aspect ratio of less than 1.0 can be formed.

[0158] (3) Adhesion (die shear strength at 260°C) The obtained curable composition was applied to the surface of a silicon wafer using a spin coater to form a curable composition layer with a thickness of 20 μm. The curable composition layer was measured at 25°C with an illuminance of 2000 mW / cm at 365 nm using an illuminometer (Ushio Inc.'s "UIT-201") ２ The film was irradiated with light for 10 seconds using an exposure device (ultra-high pressure mercury lamp, ORC Manufacturing Co., Ltd., "JL-4300-3") adjusted to a cumulative light dose of 20,000 mJ / cm ２). In this way, a B-stage compound layer was formed on the surface of the silicon wafer. Next, a silicon bare chip (3 mm long x 3 mm wide x 750 μm thick) representing a semiconductor chip was placed on the B-stage compound layer using a die bonder, and pressure was applied at 40°C and 0.1 MPa for 1 second to obtain a laminate (1) of the silicon wafer, the B-stage compound layer, and the silicon bare chip. Next, the laminate (1) was placed in an oven at 170°C and heated for 1 hour to thermally cure the B-stage compound layer. In this way, a laminate (2) of the silicon wafer, the adhesive portion (photo- and thermosetting layer of the curable composition), and the silicon bare chip was obtained. The die shear strength of the laminate (2) was measured at a test temperature of 260°C using a die shear strength measuring device (Dage Corporation's "Dage Series 4000").

[0159] <Criteria for determining adhesiveness (die shear strength at 260°C)> ○: Die shear strength at 260°C is 20 N or more △: Die shear strength at 260°C is 11 N or more but less than 20 N ×: Die shear strength at 260°C is less than 11 N

[0160] (4) Sealing Properties (Moisture Absorption Reflow Test and Molding Test) A structure was prepared in which 40 electronic components (semiconductor chips) measuring 1 mm length x 1 mm width x 0.25 mm thickness were mounted in a 4-row x 10-column arrangement on a BGA substrate (0.3 mm thick, organic substrate). A commercially available solder resist was applied to the surface of the structure. The BGA substrate corresponds to the first component described below, and the electronic components correspond to the second component described below.

[0161] Preparation of an electronic component for evaluation: The obtained curable composition was applied to the surface of a first member using an inkjet device to form a curable composition layer (application step). Next, the curable composition layer was irradiated with light to promote curing of the curable composition layer and form a B-staged product layer (photocuring step). Note that the light irradiation in the photocuring step was performed using a UV-LED lamp with a main wavelength of 365 nm at 2000 mW / cm. ２The coating process and the photo-curing process were performed under conditions of 150°C, 3 MPa, and 300 seconds. The coating process and the photo-curing process were repeated in the thickness direction of the curable composition layer to form a B-staged product layer in contact with the side surface of the second member. In this way, a laminate structure including a first member, a second member, and a B-staged product layer was obtained. Next, the obtained laminate structure was placed in an oven at 170°C and heated for 1 hour to thermally cure the B-staged product layer (thermal curing process). In this way, a laminate structure including a first member, a second member, and an adhesive portion (photo- and thermo-cured product layer of the curable composition) was obtained. Next, a resin was placed on the outside of the adhesive portion, and a molded resin portion was formed under conditions of 150°C, 3 MPa, and 300 seconds, thereby obtaining an electronic component for evaluation.

[0162] Moisture absorption reflow test and molding test: The obtained evaluation electronic components were left for 168 hours under conditions of 85°C and humidity 85% RH to absorb moisture. Next, the evaluation electronic components were passed through a solder reflow oven (preheat 150°C x 100 seconds, reflow [maximum temperature 260°C]) for 5 cycles. Next, the evaluation electronic components were observed using an ultrasonic imaging device (Hitachi Construction Machinery Finetech Co., Ltd.'s "mi-scope hyper II") to confirm whether the molding resin had penetrated into the air cavity of the evaluation electronic components. The sealing properties (moisture absorption reflow test and molding test) were evaluated according to the following criteria.

[0163] <Evaluation criteria for sealability (moisture absorption reflow test and molding test)> ◯: Of 40 electronic components for evaluation, the number of electronic components for evaluation in which the mold resin had infiltrated into the air cavity was 0. △: Of 40 electronic components for evaluation, the number of electronic components for evaluation in which the mold resin had infiltrated into the air cavity was 1 to 10. ×: Of 40 electronic components for evaluation, the number of electronic components for evaluation in which the mold resin had infiltrated into the air cavity was 11 or more.

[0164] The compositions and results are shown in Tables 1 to 5 below.

[0165]

[0166]

[0167]

[0168]

[0169]

[0170] REFERENCE SIGNS LIST 1... First member 2... Second member 3... Adhesion part 3A... Curable composition layer 3B... B-staged product layer 10... Electronic component 41... Solder ball 42... Resin sheet 43... Connection terminal 44... Molded resin part 51... Discharge part 52... Light irradiation part R... Air cavity

Claims

1. a photocurable compound having a (meth)acryloyl group or a vinyl group and no cyclic ether group; a thermosetting compound that does not have a (meth)acryloyl group and has a cyclic ether group, the content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition for inkjet and for forming an air cavity, Light with a wavelength of 365 nm and an illuminance of 2000 mW / cm ２ When a curable composition for ink-jet printing and for forming an air cavity is irradiated so as to obtain a B-stage product, the viscosity of the B-stage product at 40° C. is 2.5×10 ２ Pa・s or more 3.0×10 ６ The curable composition for inkjet use and for forming an air cavity has a viscosity of 0.1 Pa·s or less.

2. 2. The curable composition for inkjet and air cavity formation according to claim 1, wherein the photocurable compound comprises a first photocurable compound having one (meth)acryloyl group and one vinyl group in total, and a second photocurable compound having two or more (meth)acryloyl groups and two or more vinyl groups in total.

3. the first photocurable compound is a photocurable compound having one (meth)acryloyl group, The curable composition for ink jet and for forming an air cavity according to claim 2 , wherein the second photocurable compound is a photocurable compound having two or more (meth)acryloyl groups.

4. The composition does not contain or contains a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group, In the case where the photo- and heat-curable compound is not included, the content of the second photo-curable compound is 5% by weight or more and 25% by weight or less in 100% by weight of the photo-curable compound, 4. The curable composition for inkjet and air cavity formation according to claim 2 or 3, wherein, when the curable composition contains the photo- and thermo-curable compound, the content of the second photo-curable compound is 4 wt % or more and 20 wt % or less in a total content of the photo-curable compound and the photo- and thermo-curable compound (100 wt %).

5. The curable composition for ink-jet printing and for forming an air cavity according to any one of claims 1 to 3, further comprising a thermal curing agent.

6. The curable composition for inkjet and air cavity formation described in claim 4, which contains a thermal curing agent.

7. The curable composition for ink-jet and air cavity formation according to claim 5 , wherein the thermal curing agent comprises an amine compound.

8. The curable composition for inkjet and air cavity formation according to claim 6, wherein the heat curing agent comprises an amine compound.

9. A first member; A second member; and an adhesive portion that bonds an upper surface of the first member to a side surface or a lower surface of the second member; an air cavity is formed by the first member, the second member, and the adhesive portion; An electronic component, wherein the adhesive portion is a cured product of the curable composition for inkjet printing and for forming an air cavity according to any one of claims 1 to 3.

10. The electronic component according to claim 9 , wherein a ratio of the height of the bonded portion to the width of the bonded portion is 1.0 or greater.

11. a coating step of coating the curable composition according to any one of claims 1 to 3 on a surface of a first member using an inkjet device to form a curable composition layer; a photocuring step of irradiating the curable composition layer with light to cause curing to proceed, thereby forming a B-staged product layer; and a heat curing step of heat curing the B-staged material layer by heating. A method for manufacturing an electronic component, wherein in the coating step and the photocuring step, coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-staged material layer in contact with the side or bottom surface of a second component.