Multilayer ceramic capacitor

Abstract

The present invention provides a multilayer ceramic capacitor (1) with which it is possible to improve stability when mounting on a substrate, and in which contact by a case with the multilayer ceramic capacitor (1) is suppressed.　In the multilayer ceramic capacitor (1), 0.26 ≤ the length in the width direction (W) of a main surface horizontal part of a WT surface (MH1) / the length in the width direction (W) of an external electrode (20) ≤ 0.56, 0.26 ≤ the length in the lamination direction (T) of a side surface horizontal part of the WT surface (SH1) / the length in the lamination direction (T) of the external electrode (20) ≤ 0.56, the main surface horizontal part of the WT surface (MH1) is positioned closer to a main surface (M) than a shoulder part of the WT surface (C1), the side surface horizontal part of the WT surface (SH1) is positioned closer to a side surface (S) than a shoulder part of the WT surface (C3), 0.26 ≤ the length in the length direction (L) of a main surface horizontal part of an LT surface (MH2) / the length in the length direction (L) of the external electrode (20) ≤ 0.56, the main surface horizontal part of the LT surface (MH2) is positioned closer to the main surface (S) than the shoulder part of the LT surface (C2) and a non-horizontal part of the LT surface (MH2), 0.26 ≤ the length of a side surface horizontal part of a WL surface (SH3) / the length in the length direction (L) of the external electrode (20) ≤ 0.56, and the side surface horizontal part of the WL surface (SH3) is positioned closer to the side surface (S) than the shoulder part of the WL surface (C3) and a non-horizontal part of the WL surface (N2).

Description

Multilayer ceramic capacitors

[0001] The present invention relates to a multilayer ceramic capacitor.

[0002] Patent Document 1 and other publications disclose a display module including a flexible housing, a plurality of non-flexible substrates housed in the housing, and a flexible substrate connecting the plurality of substrates. Because this display module is flexible as a whole, it can be used even in a bent state. Furthermore, the non-flexible substrate is connected to the display module, and electronic components are mounted on the substrate. These electronic components include a multilayer ceramic capacitor.

[0003] Japanese Patent Application Laid-Open No. 2008-306244

[0004] In recent years, flexible modules such as display modules have become thinner. In a thin flexible module, when a flexible housing is bent, the housing may come into contact with a multilayer ceramic component mounted on a substrate. If the multilayer ceramic capacitor comes into contact with the housing, the multilayer ceramic capacitor may be damaged. Therefore, an object of the present invention is to provide a multilayer ceramic capacitor that can improve stability when mounted on a substrate and that prevents the housing from coming into contact with the multilayer ceramic capacitor.

[0005] a multilayer ceramic capacitor comprising: a laminate including a plurality of laminated dielectric layers and a plurality of internal electrode layers, the laminate having first and second main surfaces opposing each other in a lamination direction, first and second side surfaces opposing each other in a width direction perpendicular to the lamination direction, and first and second end surfaces opposing each other in a length direction perpendicular to the lamination direction and the width direction; and external electrodes arranged on the first end surfaces and the second end surfaces and connected to the internal electrode layers, the external electrodes extending to at least a part of the first main surface, second main surface, first side surface, and second side surface, respectively; a cross section parallel to the width direction and the lamination direction is defined as a WT cross section, a cross section parallel to the length direction and the lamination direction is defined as an LT cross section, and a cross section parallel to the width direction and the length direction is defined as a WL cross section; and when viewed in the WT cross section, the external electrodes have a WT surface main surface horizontal portion, a WT surface side surface horizontal portion, and a WT surface shoulder portion connecting the WT surface main surface horizontal portion and the WT surface side surface horizontal portion, 0.26≦length in the width direction of the WT surface horizontal portion of the main surface / length in the width direction of the external electrode≦0.56; 0.26≦length in the stacking direction of the WT surface horizontal portion of the side surface / length in the stacking direction of the external electrode≦0.56; the WT surface horizontal portion of the main surface is located closer to the main surface than the WT surface shoulder; the WT surface horizontal portion of the side surface is located closer to the side surface than the WT surface shoulder; when viewed from the LT cross section, the external electrode has an LT surface horizontal portion of the main surface, an LT surface end surface horizontal portion, an LT surface shoulder connecting the LT surface horizontal portion of the main surface and the LT surface end surface horizontal portion, and an LT surface non-horizontal portion connecting the LT surface horizontal portion of the main surface and the laminate; 0.26≦length in the length direction of the LT surface horizontal portion of the main surface / length in the length direction of the external electrode≦0.56; The horizontal portion of the LT surface main surface is located closer to the main surface than the LT surface shoulder and the non-horizontal portion of the LT surface, and when viewed from the WL cross section, the external electrode has a horizontal portion of the WL surface side, a horizontal portion of the WL surface end surface, a WL surface shoulder connecting the horizontal portion of the WL surface side and the horizontal portion of the WL surface end surface, and a non-horizontal portion of the WL surface connecting the horizontal portion of the WL surface side and the laminate, wherein 0.26≦length of the horizontal portion of the WL surface side / length in the longitudinal direction of the external electrode≦0.56, and the horizontal portion of the WL surface side is located closer to the side than the WL surface shoulder and the non-horizontal portion of the WL surface.

[0006] According to the present invention, it is possible to provide a multilayer ceramic capacitor that can improve stability when mounted on a substrate and that prevents the multilayer ceramic capacitor from coming into contact with a housing.

[0007] 1 is a perspective view of a multilayer ceramic capacitor of the present invention; 2 is a cross-sectional view taken along line II in FIG. 1; 3 is a cross-sectional view taken along line II-II in FIG. 1; 4 is a diagram schematically showing a WT cross-section of an external electrode; 5 is a diagram for explaining a horizontal portion; 6 is a diagram schematically showing an LT cross-section of a multilayer ceramic capacitor; 7 is a diagram schematically showing an LW cross-section of a multilayer ceramic capacitor;

[0008] An example of an embodiment of the present invention will be described below with reference to the accompanying drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0009] <External Shape of Multilayer Ceramic Capacitor> An outline of the external appearance of a multilayer ceramic capacitor 1 will be described with reference to Fig. 1. Fig. 1 is a perspective view showing the multilayer ceramic capacitor 1 of this embodiment. The multilayer ceramic capacitor 1 includes a laminate 2 and external electrodes 20. The external electrodes 20 include a first external electrode 20a and a second external electrode 20b.

[0010] <Definition of Directions> Figures 1 to 7 show the L direction, W direction, and T direction. The L direction is the length direction L of the multilayer ceramic capacitor 1. The W direction is the width direction W of the multilayer ceramic capacitor 1. The T direction is the stacking direction T of the multilayer ceramic capacitor 1. Therefore, the cross section shown in Figure 2 is called an LT cross section, and the cross section shown in Figure 3 is called a WT cross section. The length direction L, width direction W, and stacking direction T do not necessarily have to be orthogonal to each other. The length direction L, width direction W, and stacking direction T may intersect each other.

[0011] <External Shape of Laminate> As shown in FIG. 1, the laminate 2 has a substantially rectangular parallelepiped shape. The laminate has two main surfaces M, two end surfaces E, and two side surfaces S. The main surfaces M are surfaces facing the stacking direction T. The end surfaces E are surfaces facing the length direction L. The side surfaces S are surfaces facing the width direction W. The two main surfaces M are referred to as a first main surface M1 and a second main surface M2. The two end surfaces E are referred to as a first end surface E1 and a second end surface E2. The two side surfaces S are referred to as a first side surface S1 and a second side surface S2.

[0012] It is preferable that the ridges and corners of the laminate 2 are rounded. A ridge is a portion where two surfaces of the laminate 2 intersect. A corner is a portion where three surfaces of the laminate 2 intersect.

[0013] <Size of Laminate> The size of the laminate 2 is not particularly limited. As an example, the length in the length direction L of the laminate 2 can be 0.05 mm or more and 1.00 mm or less. The length in the stacking direction T of the laminate 2 can be 0.10 mm or more and 0.50 mm or less. The length in the width direction W of the laminate 2 can be 0.10 mm or more and 0.50 mm or less. The length of each part of the laminate 2 can be measured with a micrometer or an optical microscope. Note that the length in the length direction L does not necessarily have to be longer than the length in the width direction W.

[0014] <Horizontal Portions of External Electrodes> In the multilayer ceramic capacitor 1 of this embodiment, horizontal portions H having a predetermined shape are provided on the external electrodes 20. Specifically, main surface horizontal portions MH, side surface horizontal portions SH, and end surface horizontal portions EH are provided on the external electrodes 20. These horizontal portions H will be described later.

[0015] <Internal Structure of Laminate> The internal structure of the laminate 2 will be described with reference to Fig. 2. Fig. 2 is a cross-sectional view of the multilayer ceramic capacitor shown in Fig. 1 taken along line II. The laminate 2 includes a plurality of dielectric layers 4 and a plurality of internal electrode layers 10. The plurality of dielectric layers 4 and the plurality of internal electrode layers 10 are stacked on top of each other in the stacking direction T.

[0016] <Inner layer portion and outer layer portion> The laminate 2 has an inner layer portion IL and an outer layer portion OL in the stacking direction T. The outer layer portion OL includes a first outer layer portion OL1 and a second outer layer portion OL2. The first outer layer portion OL1 and the second outer layer portion OL2 are arranged to sandwich the inner layer portion IL in the stacking direction T.

[0017] The inner layer portion IL includes some of the dielectric layers 4 and the inner electrode layers 10. In the inner layer portion IL, the inner electrode layers 10 are arranged facing each other with the dielectric layer 4 interposed therebetween. The inner layer portion IL is the portion where capacitance is formed and essentially functions as a capacitor. For this reason, the inner layer portion IL is also called the effective portion.

[0018] The first outer layer portion OL1 is disposed on the first main surface M1 side of the laminate 2. The second outer layer portion OL2 is disposed on the second main surface M2 side of the laminate 2. Specifically, the first outer layer portion OL1 is disposed between the first main surface M1 and an internal electrode layer 10 of the plurality of internal electrode layers 10 that is closest to the first main surface M1. The second outer layer portion OL2 is disposed between the second main surface M2 and an internal electrode layer 10 of the plurality of internal electrode layers 10 that is closest to the second main surface M2. The first outer layer portion OL1 and the second outer layer portion OL2 do not include an internal electrode layer 10. The first outer layer portion OL1 and the second outer layer portion OL2 include the remaining dielectric layers 4 of the plurality of dielectric layers 4 excluding the dielectric layer 4 for the internal layer portion IL. The first outer layer portion OL1 and the second outer layer portion OL2 function as protective layers for the internal layer portion IL.

[0019] <Dielectric Layers> The dielectric layers 4 include outer dielectric layers 5 and inner dielectric layers 6. <Outer Dielectric Layers> The outer dielectric layers 5 are the dielectric layers 4 that constitute the first outer portion OL1 and the second outer portion OL2 of the dielectric layers 4. The outer dielectric layers 5 are disposed between the first main surface M1 and the internal electrode layer 10 closest to the first main surface M1, and between the second main surface M2 and the internal electrode layer 10 closest to the second main surface M2.

[0020] <Inner dielectric layer> The inner dielectric layer 6 is a dielectric layer 4 located between the internal electrode layers 10 and constituting the inner layer portion IL together with the internal electrode layers 10. The inner dielectric layer 6 is disposed between a first internal electrode layer 10a and a second internal electrode layer 10b described below.

[0021] <Number of Dielectric Layers> The number of dielectric layers 4 stacked in the laminate 2 can be, for example, from 10 to 2000. This number of dielectric layers 4 includes the number of outer dielectric layers 5 and the number of inner dielectric layers 6.

[0022] <Thickness of Dielectric Layer> Of the dielectric layers 4, the outer dielectric layer 5 may have a thickness of, for example, 10 μm or more and 100 μm or less, and the inner dielectric layer 6 may have a thickness of, for example, 0.8 μm or more and 3.0 μm or less.

[0023] <Material of Dielectric Layer> The material of the dielectric layer 4 is, for example, BaTiO ３ , CaTiO ３ , SrTiO ３、 CaZrO ３ or TiO ２ The material of the dielectric layer 4 may be a dielectric ceramic containing, for example, a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound, added to the above-mentioned dielectric ceramic in a content less than that of the main component.

[0024] <Internal electrode layers> The internal electrode layers 10 include a first internal electrode layer 10a and a second internal electrode layer 10b. The first internal electrode layer 10a is the internal electrode layer 10 connected to the first external electrode 20a. The second internal electrode layer 10b is the internal electrode layer 10 connected to the second external electrode 20b. The first internal electrode layer 10a extends from the first end face E1 toward the second end face E2. The second internal electrode layer 10b extends from the second end face E2 toward the first end face E1.

[0025] <Facing portion and lead-out portion> The first internal electrode layer 10a and the second internal electrode layer 10b each have a facing electrode portion 11 and a lead-out electrode portion 12. The facing electrode portion 11 is a portion of the internal electrode layer 10 where the first internal electrode layer 10a and the second internal electrode layer 10b face each other in the stacking direction T. The lead-out electrode portion 12 is a portion of the internal electrode layer 10 that is led out from the facing electrode portion 11 to the end face E1 or the end face E2 of the laminate 2.

[0026] The opposing electrode portion 11 of the first internal electrode layer 10a is referred to as the first opposing electrode portion 11a, and the lead electrode portion 12 of the first internal electrode layer 10a is referred to as the first lead electrode portion 12a. The first lead electrode portion 12a is a portion led from the first opposing electrode portion 11a to the first end face E1 of the laminate 2. Similarly, the opposing electrode portion 11 of the second internal electrode layer 10b is referred to as the second opposing electrode portion 11b, and the lead electrode portion 12 of the second internal electrode layer 10b is referred to as the second lead electrode portion 12b. The second lead electrode portion 12b is a portion led from the second opposing electrode portion 11b to the second end face E2 of the laminate 2.

[0027] <Number of Internal Electrode Layers> The number of the internal electrode layers 10 can be, for example, from 10 to 1000. This number of the internal electrode layers 10 includes the number of the first internal electrode layers 10a and the number of the second internal electrode layers 10b.

[0028] <Thickness of Internal Electrode Layer> The thickness of the internal electrode layer 10 can be set to, for example, 0.3 μm or more and 0.4 μm or less.

[0029] <Material of Internal Electrode Layer> The material of the internal electrode layer 10 can be, for example, metals such as Ni, Cu, Ag, Pd, and Au, or alloys of Ni and Cu, alloys of Ag and Pd, etc. In addition, the material of the internal electrode layer 10 may contain dielectric particles of the same composition as the ceramic contained in the dielectric layer 4.

[0030] <Electrode opposing portion> The divisions of the laminate 2 in the length direction L will be described. The laminate 2 has electrode opposing portions LF and end gap portions EG in the length direction L. The end gap portion EG includes a first end gap portion EG1 and a second end gap portion EG2. The electrode opposing portion LF is a portion where the first internal electrode layer 10a and the second internal electrode layer 10b oppose each other in the stacking direction T. In other words, the electrode opposing portion LF is a portion where the first opposing electrode portion 11a and the second opposing electrode portion 11b oppose each other in the stacking direction T. The electrode opposing portion LF is located in the center portion in the length direction L of the laminate 2. The electrode opposing portion LF is a portion where electrostatic capacitance is formed and essentially functions as a capacitor. For this reason, the electrode opposing portion LF is also referred to as an effective portion.

[0031] <End gap portion> The end gap portion EG is a portion where the first internal electrode layer 10a and the second internal electrode layer 10b do not face each other in the stacking direction T. Specifically, in the stacking direction T, a portion where the first internal electrode layer 10a is arranged and the second internal electrode layer 10b is not arranged is a first end gap portion EG1. Similarly, a portion where the second internal electrode layer 10b is arranged and the first internal electrode layer 10a is not arranged is a second end gap portion EG2.

[0032] The first end gap EG1 corresponds to the portion where the first lead electrode 12a is arranged, and the second end gap EG2 corresponds to the portion where the second lead electrode 12b is arranged. The first end gap EG1 functions as a lead electrode to the first end face E1 of the first internal electrode layer 10a, and the second end gap EG2 functions as a lead electrode to the second end face E2 of the second internal electrode layer 10b. The end gap EG is a section in the length direction L, and is therefore also called an L gap.

[0033] The length of the end gap portion EG in the longitudinal direction L can be set to, for example, 5 μm or more and 30 μm or less.

[0034] <External Electrodes> The external electrodes include a first external electrode 20a and a second external electrode 20b. <First External Electrode> The first external electrode 20a is an external electrode arranged on the first end face E1 of the laminate 2. The first external electrode 20a is electrically connected to the first internal electrode layer 10a.

[0035] <Second External Electrode> The second external electrode 20b is an external electrode arranged on the second end face E2 of the laminate 2. The second external electrode 20b is electrically connected to the second internal electrode layer 10b.

[0036] <External electrodes on each surface> The external electrode 20 extends from the end surface E to parts of the two main surfaces M and to parts of the two side surfaces S. The part of the external electrode 20 that is arranged on the end surface E is referred to as an end surface external electrode 25. The part of the external electrode 20 that is arranged on part of the main surface M is referred to as a main surface external electrode 26. The part of the external electrode 20 that is arranged on part of the side surface S is referred to as a side surface external electrode 27.

[0037] Specifically, the portion of the first external electrode 20a arranged on the first end face E1 is referred to as the first end face external electrode 25a. The portion of the first external electrode 20a arranged on a part of the first main face M1 or a part of the second main face M2 is referred to as the first main face external electrode 26a. The portion of the first external electrode 20a arranged on a part of the first side face S1 or a part of the second side face S2 is referred to as the first side face external electrode 27a.

[0038] Similarly to the first external electrode 20a, the portion of the second external electrode 20b that is arranged on the second end face E2 is referred to as a second end face external electrode 25b. The portion of the second external electrode 20b that is arranged on a part of the first main face M1 or a part of the second main face M2 is referred to as a second main face external electrode 26b. The portion of the second external electrode 20b that is arranged on a part of the first side face S1 or a part of the second side face S2 is referred to as a second side face external electrode 27b.

[0039] <Horizontal Portions of External Electrodes> The aforementioned main surface horizontal portions MH are provided on the first main surface external electrode 26 a and the second main surface external electrode 26 b. Furthermore, the end surface horizontal portions EH are provided on the first end surface external electrode 25 a and the second end surface external electrode 25 b.

[0040] <Layer Structure of External Electrode> The layer structure of the external electrode 20 will be described with reference to FIG. 2 . The external electrode 20 includes three layers: a base electrode layer 21, an inner plating layer 23, and a top plating layer 24. These layers are arranged in this order from the end surface E of the laminate 2: the base electrode layer 21, the inner plating layer 23, and the top plating layer 24. Specifically, the first external electrode 20a includes a first base electrode layer 21a, a first inner plating layer 23a, and a first top plating layer 24a. Similarly, the second external electrode 20b includes a second base electrode layer 21b, a second inner plating layer 23b, and a second top plating layer 24b. In describing the external electrode 20, the direction away from the end surface E of the laminate 2 may be referred to as "up." For example, in the above-mentioned base electrode layer 21 and resin electrode layer 22, the resin electrode layer 22 may be described as being arranged on the base electrode layer 21.

[0041] <Base Electrode Layer> The first base electrode layer 21a is disposed on and covers the first end face E1 of the laminate 2. The first base electrode layer 21a may extend from the first end face E1 to a portion of the first main surface M1, a portion of the second main surface M2, a portion of the first side surface S1, and a portion of the second side surface S2.

[0042] Similarly, the second base electrode layer 21b is disposed on and covers the second end face E2 of the laminate 2. The second base electrode layer 21b may extend from the second end face E2 to a portion of the second main face M1, a portion of the second main face M2, a portion of the first side face S1, and a portion of the second side face S2.

[0043] <Fired Layer> The base electrode layer 21 can be a fired layer containing metal and glass. The fired layer is a layer formed by applying a conductive paste containing metal and glass to the laminate by a dipping method and firing the applied paste. The firing to form the fired layer may be performed after firing the internal electrode layer, or may be performed simultaneously with firing the internal electrode layer. The fired layer may also be a multi-layer structure.

[0044] The metal contained in the fired layer contains Cu as a main component. The metal may contain at least one selected from metals such as Ni, Ag, Pd, and Au, or alloys such as Ag-Pd alloys, as a main component, or may contain the metal as a component other than the main component.

[0045] The glass contained in the fired layer may be a glass component containing at least one selected from B, Si, Ba, Mg, Al, Li, etc. As a specific example, borosilicate glass may be used.

[0046] Alternatively, the base electrode layer 21 may be a resin layer containing conductive particles and a thermosetting resin. The resin layer may be formed on the fired layer described above, or may be formed directly on the laminate without forming a fired layer.

[0047] The resin layer is a layer formed by applying a conductive paste containing conductive particles and a thermosetting resin to the laminate by a coating method and then firing the layer. The resin layer may be fired after firing the internal electrode layer or simultaneously with firing the internal electrode layer. The resin layer may also be a multi-layered layer.

[0048] The thickness of each of the base electrode layers 21 as the fired layer or resin layer is not particularly limited, and may be 1 μm or more and 10 μm or less.

[0049] The base electrode layer 21 may also be a thin film layer of 1 μm or less formed by depositing metal particles using a thin film forming method such as sputtering or vapor deposition.

[0050] <Inner Plating Layer> The inner plating layer 23 is disposed on the base electrode layer 21 and covers at least a portion of the base electrode layer 21. The inner plating layer 23 includes at least one selected from metals such as Cu, Ni, Ag, Pd, and Au, and alloys such as an Ag—Pd alloy.

[0051] <Surface Plated Layer> The surface plated layer 24 is disposed on the inner plated layer 23 and covers at least a portion of the inner plated layer 23. The surface plated layer 24 contains a metal such as Sn, for example.

[0052] The inner plating layer 23 is preferably a Ni plating layer, and the top plating layer 24 is preferably a Sn plating layer. The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting the ceramic electronic component. The Sn plating layer can improve the wettability of the solder when mounting the ceramic electronic component, making mounting easier. By using a Sn plating layer as the top plating layer 24, the wettability of the solder to the external electrode 20 can be improved.

[0053] <Internal Structure of the Laminate (WT Cross Section)> The internal structure of the laminate 2, particularly the internal structure as viewed from the second end face E2, will be described with reference to Figure 3. Figure 3 is a cross-sectional view of the multilayer ceramic capacitor shown in Figure 1 taken along line II-II. The laminate 2 has an electrode facing portion WF and a side gap portion SG in which the internal electrode layers 10 face each other in the width direction W. The side gap portion SG includes a first side gap SG1 and a second side gap SG2. The first side gap SG1 and the second side gap SG2 are arranged to sandwich the electrode facing portion WF. The first side gap SG1 is located between the electrode facing portion WF and the first side face S1, and the second side gap SG2 is located between the electrode facing portion WF and the second side face S2.

[0054] Specifically, the first side gap SG1 is located between the end of the internal electrode layer 10 on the first side surface S1 side and the first side surface S1, and the second side gap SG2 is located between the end of the internal electrode layer 10 on the second side surface S2 side and the second side surface S2. The first side gap SG1 and the second side gap SG2 do not include the internal electrode layer 10, but include only the dielectric layer 4. The first side gap SG1 and the second side gap SG2 function as protective layers for the internal electrode layer 10. The side gap SG is a section in the width direction W, and is therefore also called a W gap.

[0055] The length of the side gap portion SG in the width direction W can be set to, for example, one tenth of the length of the laminate 2 in the width direction W, or 5 μm or more and 30 μm or less.

[0056] <Horizontal Portions of External Electrodes> The aforementioned main surface horizontal portions MH are provided on the first main surface external electrode 26 a and the second main surface external electrode 26 b, as in the description based on Fig. 2. Furthermore, the side surface horizontal portions SH are provided on the first side surface external electrode 27 a and the second side surface external electrode 27 b.

[0057] <Size of Multilayer Ceramic Capacitor> The length in the longitudinal direction L of the entire multilayer ceramic capacitor 1, including the laminate 2 and the external electrodes 20, can be, for example, 0.2 mm or more and 2.0 mm or less. The length in the lamination direction T of the entire multilayer ceramic capacitor 1 can be, for example, 0.1 mm or more and 1.2 mm or less. The length in the width direction W of the entire multilayer ceramic capacitor 1 can be, for example, 0.1 mm or more and 1.2 mm or less.

[0058] In this embodiment, the multilayer ceramic capacitor 1 is a two-terminal capacitor, but the multilayer ceramic capacitor 1 is not limited to two terminals and may be a multi-terminal capacitor having three or more terminals.

[0059] <Shape of External Electrode> In the multilayer ceramic capacitor 1 of this embodiment, the external electrode 20 has a horizontal portion H. The length of the horizontal portion H satisfies a predetermined ratio. Furthermore, the portion of the external electrode 20 other than the horizontal portion H is located lower than the horizontal portion H, i.e., closer to the inside of the laminate 2. This improves the stability of the multilayer ceramic capacitor 1 of this embodiment when it is mounted on a substrate. Furthermore, the multilayer ceramic capacitor 1 of this embodiment can prevent the housing from coming into contact with the multilayer ceramic capacitor 1.

[0060] <Explanation of Terms> In the following description, in addition to the horizontal portion H, the terms shoulder portion C, non-horizontal portion N, and laminate shoulder portion K are used. The horizontal portion H includes a main surface horizontal portion MH, a side surface horizontal portion SH, and an end surface horizontal portion EH. The main surface horizontal portion MH includes a WT surface main surface horizontal portion MH1 and an LT surface main surface horizontal portion MH2. The side surface horizontal portion SH includes a WT surface side surface horizontal portion SH1 and a WL surface side surface horizontal portion SH3. The end surface horizontal portion EH includes an LT surface end surface horizontal portion EH2 and a WL surface end surface horizontal portion EH3. The shoulder portion C includes a WT surface shoulder C1, an LT surface shoulder C2, and a WL surface shoulder C3. The non-horizontal portion N includes an LT surface non-horizontal portion N1 and a WL surface non-horizontal portion N2. The laminate corner K includes a WT laminate shoulder K1, a LT laminate shoulder K2, and a WL laminate shoulder K3.

[0061] First, an overview of the horizontal portion H and other components will be described with reference to the drawings. Fig. 4 is a diagram schematically showing a WT cross section of the external electrode 20. Fig. 6 is a diagram schematically showing an LT cross section of the multilayer ceramic capacitor 1. Fig. 7 is a diagram schematically showing an LW cross section of the multilayer ceramic capacitor 1.

[0062] <WT cross section> The WT cross section will be described with reference to Figure 4. <Horizontal portion> The external electrode 20 has a WT surface horizontal portion MH1 in the main surface external electrode 26. The WT surface horizontal portion MH1 is provided on each of the first main surface M1 and the second main surface M2 (shown in Figure 1) of the laminate 2. Therefore, two WT surface horizontal portions MH1 are included in the WT cross section. The WT surface horizontal portion MH1 includes a portion that is approximately horizontal to the main surface M of the laminate 2.

[0063] Furthermore, the external electrode 20 has a WT surface side horizontal portion SH1 on the side surface external electrode 27. The WT surface side horizontal portion SH1 is provided on each of the first side surface S1 and the second side surface S2 (shown in FIG. 1) of the laminate 2. Therefore, two WT surface side horizontal portions SH1 are included in the WT cross section. The WT surface side horizontal portion SH1 includes a portion that is approximately horizontal to the side surface S of the laminate 2. A detailed definition of the horizontal portion H will be explained later with reference to FIG. 5.

[0064] <Shoulder> The external electrode 20 has a WT surface shoulder C1. The WT surface shoulder C1 is a portion connecting the WT surface horizontal portion MH1 of the main surface and the WT surface horizontal portion SH1 of the end surface. Specifically, the WT surface shoulder C1 is the external electrode 20 located in the corner region R1 shown in FIG. 4. This corner region R1 is a region defined by lines L1 and L2. Line L1 is a line extending parallel to the stacking direction T from the end of the WT surface horizontal portion MH1 of the main surface in the width direction W. Line L2 is a line extending parallel to the width direction W from the end of the WT surface horizontal portion SH1 of the side surface in the stacking direction T. The WT surface shoulder C1 is located on each of the four ridgelines of the laminate 2. Therefore, four WT surface shoulders C1 are included in the WT cross section.

[0065] <Details of the Horizontal Portion> The horizontal portion H will be described with reference to FIG. 5 . FIG. 5 is an enlarged view of the WT cross section for illustrating the horizontal portion H. FIG. 5 is an enlarged view of region R4 in FIG. 4 . That is, FIG. 5 shows an enlarged view of the WT plane main surface horizontal portion MH1. Point P1 shown in FIG. 5 indicates the position of the external electrode 20 closest to the first main surface M1 in the WT cross section. In other words, point P1 indicates the position of the outermost external electrode 20 on the first main surface M1 side in the WT cross section. Point P2 shown in FIG. 5 indicates a position that is located a length D1 from point P1 toward the interior of the laminate 2, parallel to the stacking direction T. The WT plane main surface horizontal portion MH1 is the external electrode 20 located between points P1 and P2. More specifically, the WT plane main surface horizontal portion MH1 is the external electrode 20 located between a line passing through point P1 and parallel to the first main surface M1 and a line passing through point P2 and parallel to the first main surface M1 in the WT cross section. The length D1 can be set to 0.5 μm or more and 3 μm or less.

[0066] In the above explanation, the horizontal portion H has been explained using the horizontal portion MH1 of the WT plane principal surface as an example. This explanation also applies to the other horizontal portions H. In other words, the horizontal portion H is the external electrode 20 that belongs to the range from the point of the external electrode 20 on each surface that is closest to that surface to a position a predetermined distance from that point toward the interior of the laminate 2. The above-mentioned predetermined distances for the six horizontal portions H shown above will be described below.

[0067] The WT surface main surface horizontal portion MH1 is a portion of the WT surface that extends 0.5 μm or more and 3.0 μm or less inward from the point on the WT surface closest to the main surface M. The WT surface side surface horizontal portion SH1 is a portion of the WT surface that extends 0.5 μm or more and 3.0 μm or less inward from the point on the WT surface closest to the side surface S. The LT surface main surface horizontal portion MH2 is a portion of the LT surface that extends 0.5 μm or more and 2.5 μm or less inward from the point on the LT surface closest to the main surface M. The LT surface end surface horizontal portion EH2 is a portion of the LT surface that extends 0.5 μm or more and 4.0 μm or less inward from the point on the LT surface closest to the end surface E. The WL surface side surface horizontal portion SH3 is a portion of the WT surface that extends 0.5 μm or more and 2.5 μm or less inward from the point on the WT surface closest to the side surface S. The horizontal end surface EH3 of the WL plane is a portion extending from the point on the WT plane closest to the end surface E to the inside by 0.5 μm to 4.0 μm.

[0068] As described above, the horizontal portion H does not refer only to a portion of the external electrode 20 that is horizontal in the strict sense. The horizontal portion H refers to the external electrode 20 that is included in the above-mentioned range, including a portion that is horizontal in the strict sense.

[0069] <LT plane> The planes other than the WT plane will be described below. First, the LT plane will be described. FIG. 6 is a diagram schematically showing the LT cross section of the multilayer ceramic capacitor 1. In FIG. 6, details of only the external electrodes 20 arranged on the first end face E1 are shown. However, the external electrodes 20 arranged on the second end face E2 are the same as the external electrodes 20 arranged on the first end face E1.

[0070] On the LT plane, the external electrode 20 has an LT plane main surface horizontal portion MH2 and an LT plane end surface horizontal portion EH2 as horizontal portions H. The LT plane main surface horizontal portion MH2 exists in the main surface external electrode 26 arranged on the first main surface M1 and the main surface external electrode 26 arranged on the second main surface M2. The LT plane end surface horizontal portion EH2 exists in the end surface external electrode 25 arranged on the first end surface E1.

[0071] The ranges of the horizontal portion MH2 of the LT plane main surface and the horizontal portion EH2 of the LT plane end surface are as described above. That is, the horizontal portion MH2 of the LT plane main surface is a portion of the external electrode 20 that extends a predetermined length inward from the point closest to the main surface M. Furthermore, the horizontal portion EH2 of the LT plane end surface is a portion of the external electrode 20 that extends a predetermined length inward from the point closest to the end surface E.

[0072] <Shoulder Portion> Furthermore, on the LT plane, the external electrode 20 has an LT plane shoulder portion C2. The LT plane shoulder portion C2 is a portion connecting the LT plane main surface horizontal portion MH2 and the LT plane end surface horizontal portion EH2. Similar to the WT plane shoulder C1 described above, the LT plane shoulder portion C2 is the external electrode 20 existing in the range defined by lines L3 and L4 shown in FIG. 6 . Here, line L3 is a line extending parallel to the stacking direction T from the end of the LT plane main surface horizontal portion MH2 on the side of the first end surface E1. Line L4 is a line extending parallel to the length direction L from the end of the LT plane end surface horizontal portion EH2. The LT plane shoulder portion C2 exists on each of the four ridgelines of the laminate 2. Therefore, four LT plane shoulder portions C2 are included in the LT cross section.

[0073] <Non-horizontal portion> Furthermore, in the LT plane, the external electrode 20 has an LT plane non-horizontal portion N1. The LT plane non-horizontal portion N1 is the external electrode 20 that exists in the range from the end of the LT plane main surface horizontal portion MH2 on the second end face E2 side to the end P3 on the second end face E2 side of the external electrode 20. The LT plane non-horizontal portion N1 is provided in the LT plane on the first main face M1 side and the second main face M2 side.

[0074] <LT laminate shoulder portion> Next, the LT laminate corner portion K2 will be described. The LT laminate corner portion K2 is a corner portion of the laminate 2 that contacts the external electrode 20 that connects the LT surface horizontal main surface portion MH2 and the LT surface end surface horizontal portion EH2. In other words, the LT laminate corner portion K2 is a corner portion of the laminate 2 that contacts the LT surface shoulder portion C2.

[0075] Specifically, the LT laminate corner K2 is the laminate 2 existing in the corner region R2 shown in Fig. 6. This corner region R2 is the region defined by the above-mentioned lines L3 and L4. The LT laminate corner K2 exists on each of the four ridgelines of the laminate 2. Therefore, four LT laminate corners K2 are included in the LT cross section.

[0076] <WL Surface> Next, the WL surface will be described. Fig. 7 is a diagram schematically showing a WL cross section of the multilayer ceramic capacitor 1. Fig. 7 shows details of only the external electrodes 20 arranged on the first end face E1. However, the external electrodes 20 arranged on the second end face E2 are similar to the external electrodes 20 arranged on the first end face E1.

[0077] The arrangement of the external electrodes 20 on the WL plane is the same as the arrangement of the external electrodes 20 on the LT plane described above. On the WL plane, the external electrodes 20 have, as horizontal portions H, WL plane side surface horizontal portions SH3 and WL plane end surface horizontal portions EH3. The WL plane side surface horizontal portions SH3 are present in the side surface external electrodes 27 arranged on the first side surface S1 and the side surface external electrodes 27 arranged on the second side surface S2. Furthermore, the WL plane end surface horizontal portions EH3 are present in the end surface external electrodes 25 arranged on the first end surface E1.

[0078] The ranges of the WL plane side surface horizontal portion SH3 and the WL plane end surface horizontal portion EH3 are as described above. That is, the WL plane side surface horizontal portion SH3 is a portion of the external electrode 20 that extends a predetermined length inward from the point closest to the side surface S. Furthermore, the WL plane end surface horizontal portion EH3 is a portion of the external electrode 20 that extends a predetermined length inward from the point closest to the end surface E.

[0079] <Shoulder Portion> The external electrode 20 also has a WL surface shoulder portion C3 on the WL surface. The WL surface shoulder portion C3 is a portion connecting the WL surface side horizontal portion SH3 and the WL surface end horizontal portion EH3. Similar to the WT surface shoulder C1 and LT surface shoulder C2 described above, the WL surface shoulder portion C3 is an external electrode 20 located in the range defined by lines L5 and L6 shown in FIG. 7 . Here, line L5 is a line extending parallel to the width direction W from the end of the WL surface side horizontal portion SH3 on the side of the first end surface E1. Line L6 is a line extending parallel to the length direction L from the end of the WL surface end horizontal portion EH3. The WL surface shoulder portion C3 is located on each of the four ridgelines of the laminate 2. Therefore, four WL surface shoulder portions C3 are included in the WL cross section.

[0080] <Non-horizontal portion> Furthermore, on the WL surface, the external electrode 20 has a WL surface non-horizontal portion N2. The WL surface non-horizontal portion N2 is the external electrode 20 that exists on the WL surface in a range from the end of the WL surface side surface horizontal portion SH3 on the second end surface E2 side to an end P4 on the second end surface E2 side of the external electrode 20. The WL surface non-horizontal portion N2 is provided on the WL surface on the first side surface S1 side and the second side surface S2 side.

[0081] <WL laminate shoulder> Next, the WL laminate shoulder K3 will be described. The WL laminate shoulder K3 is a corner of the laminate 2 that contacts the external electrode 20 connecting the WL surface side horizontal portion SH3 and the WL surface end horizontal portion EH3. In other words, the WL laminate shoulder K3 is a corner of the laminate 2 that contacts the WL surface shoulder C3.

[0082] Specifically, the WL laminate shoulder K3 is the laminate 2 located in the corner region R3 shown in Figure 7. This corner region R3 is the region defined by the lines L5 and L6 described above. The WL laminate shoulder K3 is located on each of the four ridgelines of the laminate 2. Therefore, four WL laminate shoulders K3 are included in the WL cross section.

[0083] The features of the ceramic capacitor 1 of this embodiment will be described. <Feature 1> The ceramic capacitor 1 of this embodiment has the following features (1-1) to (1-11) as feature 1. (1-1): When viewed from the WT surface, the external electrode 20 has a WT surface horizontal main surface portion MH1, a WT surface side horizontal portion SH1, and a WT surface shoulder portion C1 connecting the WT surface horizontal main surface portion MH1 and the WT surface side horizontal portion SH1. (1-2): The relationship between the length D2 of the WT surface horizontal main surface portion MH1 in the width direction W and the length D3 of the external electrode 20 in the width direction W is 0.26≦. (1-3): The relationship between the length D4 of the WT surface horizontal main surface portion SH1 in the stacking direction T and the length D5 of the external electrode 20 in the stacking direction T is 0.26≦. (1-4): The WT surface horizontal main surface portion MH1 is located closer to the main surface M than the WT surface shoulder C1. (1-5): The WT plane side surface horizontal portion SH1 is located closer to the side surface S than the WT plane shoulder C1. (1-6): When viewed in the LT cross section, the external electrode 20 has an LT plane main surface horizontal portion MH2, an LT plane end surface horizontal portion EH2, an LT plane shoulder C2 connecting the LT plane main surface horizontal portion MH2 and the LT plane end surface horizontal portion EH2, and an LT plane non-horizontal portion N1 connecting the LT plane main surface horizontal portion MH2 and the laminate 2. (1-7): 0.26≦length D6 of the LT plane main surface horizontal portion MH2 in the longitudinal direction L / length D7 of the external electrode 20 in the longitudinal direction L≦0.56. (1-8): The LT plane main surface horizontal portion MH2 is located closer to the main surface M than the LT plane shoulder C2 and the LT plane non-horizontal portion N1. (1-9): When viewed from the WL cross section, the external electrode 20 has a WL plane side surface horizontal portion SH3, a WL plane end surface horizontal portion EH3, a WL plane shoulder portion C3 connecting the WL plane side surface horizontal portion SH3 and the WL plane end surface horizontal portion EH3, and a WL plane non-horizontal portion N2 connecting the WL plane side surface horizontal portion SH3 and the laminate 2. (1-10): 0.26≦length D8 of the WL cross section main surface horizontal portion SH3 in the longitudinal direction L / length D7 of the external electrode 20 in the longitudinal direction L≦0.56. (1-11): The WL plane side surface horizontal portion SH3 is located closer to the side surface S than the WL plane shoulder C3 and the WL plane non-horizontal portion N2.

[0084] <Length Relationship> The length relationships included in Feature 1 will be described with reference to the drawings. First, (1-2) and (1-3) will be described with reference to FIG. 4. In FIG. 4, the length in the width direction W of the WT plane horizontal main surface portion MH1 is indicated by D2. Furthermore, the length in the width direction W of the external electrode 20 is indicated by D3. The WT plane horizontal main surface portion MH1 of this embodiment satisfies 0.26≦D2 / D3≦0.56. Similarly, in FIG. 4, the length in the stacking direction T of the WT plane horizontal main surface portion SH1 is indicated by D4. Furthermore, the length in the stacking direction T of the external electrode 20 is indicated by D5. The WT plane horizontal main surface portion SH1 of this embodiment satisfies 0.26≦D4 / D5≦0.56.

[0085] (1-7) will be described with reference to Fig. 6. In Fig. 6, the length in the longitudinal direction L of the horizontal portion MH2 of the LT plane main surface is indicated by D6. Furthermore, the length in the longitudinal direction L of the external electrode 20 is indicated by D7. The horizontal portion MH2 of the LT plane main surface of this embodiment satisfies 0.26≦D6 / D7≦0.56.

[0086] (1-10) will be described with reference to Fig. 7. In Fig. 7, D8 denotes the length in the longitudinal direction L of the horizontal portion SH3 of the WL cross section principal surface. Furthermore, D7 denotes the length in the longitudinal direction L of the external electrode 20. The horizontal portion SH3 of the WL cross section principal surface of this embodiment satisfies 0.26 ≦ D8 / D7 ≦ 0.56.

[0087] <Positional Relationships> The positional relationships included in Feature 1 will be described with reference to the drawings. First, (1-4) and (1-5) will be described with reference to FIG. 4. As shown in FIG. 4, the WT surface main surface horizontal portion MH1 is located closer to the main surface M than the WT surface shoulder portion C1. Here, being located closer to the main surface M means being located further outward in the stacking direction T. Also, as shown in FIG. 4, the WT surface side surface horizontal portion SH1 is located closer to the side surface S than the WT surface shoulder C1. Here, being located closer to the side surface S means being located further outward in the width direction W.

[0088] Next, (1-8) will be described with reference to Fig. 6. As shown in Fig. 6, the horizontal main surface portion MH2 of the LT plane is located closer to the main surface M than the shoulder portion C2 of the LT plane and the non-horizontal portion N1 of the LT plane. Here, being located closer to the main surface M means being located further outward in the stacking direction.

[0089] Next, (1-11) will be described with reference to Fig. 7. As shown in Fig. 7, the horizontal side surface portion SH3 of the WL surface is located closer to the side surface S than the shoulder portion C3 of the WL surface and the non-horizontal portion N2 of the WL surface. Here, being located closer to the side surface S means being located further outward in the width direction W.

[0090] <Effects of Feature 1> The multilayer ceramic capacitor 1 of this embodiment can achieve the following two effects by combining (1-1) to (1-11). That is, the multilayer ceramic capacitor 1 of this embodiment can increase stability when mounted on a substrate. This is because it has the horizontal portion H of a predetermined length.

[0091] Furthermore, the multilayer ceramic capacitor 1 of this embodiment can prevent the housing from coming into contact with the multilayer ceramic capacitor 1 despite deformation of the housing in all directions. For example, consider a case where the housing is provided with a substrate and the multilayer ceramic capacitor 1 is mounted on the substrate. If the housing is flexible, there is a risk that the bent housing will come into contact with the multilayer ceramic capacitor 1 mounted on the substrate. The multilayer ceramic capacitor 1 of this embodiment has a WT surface shoulder C1, an LT surface shoulder C2, a WL surface shoulder C3, an LT surface non-horizontal portion N1, and a WL surface non-horizontal portion N2. These portions satisfy the predetermined positional relationship with the horizontal portion H as described above. Therefore, the multilayer ceramic capacitor 1 of this embodiment can prevent the housing from coming into contact with the multilayer ceramic capacitor 1 due to deformation of the housing.

[0092] <Feature 2> Next, feature 2 will be described. As feature 2, the ceramic capacitor 1 of this embodiment has the following (2-1) to (2-3). First, as a premise of (2-1) to (2-3), the WT laminate shoulder K1, the WT surface shoulder C1, the LT laminate shoulder K2, the LT surface shoulder C2, the WL laminate shoulder K3, and the WL surface shoulder C3 are each curved. (2-1): The radius of curvature of the WT laminate shoulder K1 is larger than the radius of curvature of the WT surface shoulder C1. (2-2): The radius of curvature of the LT laminate shoulder K2 is larger than the radius of curvature of the LT surface shoulder C2. (2-3): The radius of curvature of the WL laminate shoulder K3 is larger than the radius of curvature of the WL surface shoulder C3.

[0093] Fig. 4 shows the WT laminate shoulder K1 and the WT surface shoulder C1, Fig. 6 shows the LT laminate shoulder K2 and the LT surface shoulder C2, and Fig. 7 shows the WL laminate shoulder K3 and the WL surface shoulder C3. As shown in each figure, the radius of curvature of the laminate corner K is larger than the radius of curvature of the corresponding shoulder C.

[0094] <Effects of Feature 2> The multilayer ceramic capacitor 1 of this embodiment can achieve the following effects by combining (2-1) to (2-3). In the ceramic capacitor 1 of this embodiment, angularity of the corners in the external shape is suppressed. This is because the radius of curvature of the shoulder portions C of the external electrodes 20 is increased. In addition, the overall volume of the ceramic capacitor 1 is suppressed. This is because the angularity of the corners in the external shape is suppressed. As a result, it is possible to further suppress the housing from coming into contact with the multilayer ceramic capacitor 1 due to deformation of the housing.

[0095] <Feature 3> Next, feature 3 will be described. As feature 3, the ceramic capacitor 1 of this embodiment has the following features (3-1) to (3-3).

[0096] <Effects of Feature 3> (3-1): The radius of curvature of the WT surface shoulder C1 is 10 μm or more and 20 μm or less. (3-2): The radius of curvature of the LT surface shoulder C2 is 10 μm or more and 20 μm or less. (3-3): The radius of curvature of the WL surface shoulder C3 is 10 μm or more and 20 μm or less.

[0097] <Effects of Feature 3> The multilayer ceramic capacitor 1 of this embodiment can achieve the following effects by combining (3-1) to (3-3): In the ceramic capacitor 1 of this embodiment, by setting the radius of curvature of the shoulder portions C to a value within a predetermined range, the thickness of the external electrodes 20 does not become too thin at the shoulder portions C, and angularity of the external electrodes 20 can be suppressed. This makes it possible to further suppress contact of the housing with the multilayer ceramic capacitor 1 due to deformation of the housing while ensuring the conductivity of the external electrodes 20.

[0098] <Feature 4> Next, feature 4 will be described. As feature 4, the ceramic capacitor 1 of this embodiment has the following (4-1) to (4-3). (4-1): The radius of curvature of the WT laminate shoulder portion K1 is 8 μm or more and 16 μm or less. (4-2): The radius of curvature of the LT laminate shoulder portion K2 is 8 μm or more and 16 μm or less. (4-3): The radius of curvature of the WL laminate shoulder portion K3 is 8 μm or more and 16 μm or less.

[0099] <Effects of Feature 4> The multilayer ceramic capacitor 1 of this embodiment can achieve the following effects by combining (4-1) to (4-3). In the ceramic capacitor 1 of this embodiment, by setting the radius of curvature of the shoulder K of the laminate to a value within a predetermined range, it becomes easier to set the radius of curvature of the shoulder C located outside it to a desired range. This makes it possible to further prevent the housing from coming into contact with the multilayer ceramic capacitor 1 due to deformation of the housing.

[0100] <Method for manufacturing multilayer ceramic capacitor> A manufacturing method will now be described. The multilayer ceramic capacitor 1 of this embodiment can be manufactured by a method similar to the general flow of the manufacturing process for a conventional multilayer ceramic capacitor 1. In order to form the desired horizontal portions H, shoulder portions C, and non-horizontal portions N, for example, a method in which the external electrode layers 20 are formed and then polished can be exemplified.

[0101] In order to form the desired corners K of the laminate, the laminate 2 may be polished after it is formed.

[0102] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments and various changes and modifications are possible.

[0103] <1> A laminate including a plurality of laminated dielectric layers and a plurality of internal electrode layers, the laminate having a first main surface and a second main surface opposing each other in a lamination direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the lamination direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the lamination direction and the width direction; and external electrodes arranged on the first end surface and the second end surface and connected to the internal electrode layers, the external electrodes extending to at least a part of the first main surface, second main surface, first side surface, and second side surface, respectively, a cross section parallel to the width direction and the lamination direction is defined as a WT cross section, a cross section parallel to the length direction and the lamination direction is defined as an LT cross section, and a cross section parallel to the width direction and the length direction is defined as a WL cross section, and when viewed from the WT cross section, the external electrodes have a WT surface main surface horizontal portion, a WT surface side surface horizontal portion, and a WT surface shoulder portion connecting the WT surface main surface horizontal portion and the WT surface side surface horizontal portion, 0.26≦length in the width direction of the WT surface horizontal portion of the main surface / length in the width direction of the external electrode≦0.56; 0.26≦length in the stacking direction of the WT surface horizontal portion of the side surface / length in the stacking direction of the external electrode≦0.56; the WT surface horizontal portion of the main surface is located closer to the main surface than the WT surface shoulder; the WT surface horizontal portion of the side surface is located closer to the side surface than the WT surface shoulder; when viewed from the LT cross section, the external electrode has an LT surface horizontal portion of the main surface, an LT surface end surface horizontal portion, an LT surface shoulder connecting the LT surface horizontal portion of the main surface and the LT surface end surface horizontal portion, and an LT surface non-horizontal portion connecting the LT surface horizontal portion of the main surface and the laminate; 0.26≦length in the length direction of the LT surface horizontal portion of the main surface / length in the length direction of the external electrode≦0.56; a multilayer ceramic capacitor in which the horizontal portion of the LT plane main surface is located closer to the main surface than the LT plane shoulder and the non-horizontal portion of the LT plane, and when viewed from the WL cross section, the external electrode has a horizontal portion of the WL plane side surface, a horizontal portion of the WL plane end surface, a WL plane shoulder connecting the horizontal portion of the WL plane side surface and the horizontal portion of the WL plane end surface, and a non-horizontal portion connecting the horizontal portion of the WL plane side surface and the laminate, wherein 0.26≦length of the horizontal portion of the WL plane side surface / length in the length direction of the external electrode≦0.56, and the horizontal portion of the WL plane side surface is located closer to the side surface than the WL plane shoulder and the non-horizontal portion of the WL plane.

[0104] <2> The multilayer ceramic capacitor according to <1>, wherein, when viewed in the WT cross section, a portion of the laminate where the main surface and the side surface intersect is a WT laminate shoulder; when viewed in the LT cross section, a portion of the laminate where the main surface and the end surface intersect is a LT laminate shoulder; when viewed in the WL cross section, a portion of the laminate where the side surface and the end surface intersect is a WL laminate shoulder; a radius of curvature of the WT laminate shoulder is larger than that of the WT surface shoulder; a radius of curvature of the LT laminate shoulder is larger than that of the LT surface shoulder; and a radius of curvature of the WL laminate shoulder is larger than that of the WL surface shoulder.

[0105] <3> The multilayer ceramic capacitor according to <2>, wherein the radius of curvature of the WT area laminate shoulder is greater than the radius of curvature of the WT surface shoulder by 1.25% or more and 2% or less, the radius of curvature of the LT area laminate shoulder is greater than the radius of curvature of the LT surface shoulder by 1.25% or more and 2% or less, and the radius of curvature of the WL area laminate shoulder is greater than the radius of curvature of the WL surface shoulder by 1.25% or more and 2% or less.

[0106] <4> The multilayer ceramic capacitor according to any one of <1> to <3>, wherein the radius of curvature of the WT surface shoulder portion is 10 μm or more and 20 μm or less, the radius of curvature of the LT surface shoulder portion is 10 μm or more and 20 μm or less, and the radius of curvature of the WL surface shoulder portion is 10 μm or more and 20 μm or less.

[0107] <5> The multilayer ceramic capacitor according to <2> or <3>, wherein the radius of curvature of the WT laminate shoulder is 8 μm or more and 16 μm or less, the radius of curvature of the LT laminate shoulder is 8 μm or more and 16 μm or less, and the radius of curvature of the WL laminate shoulder is 8 μm or more and 16 μm or less.

[0108] <6> The multilayer ceramic capacitor according to any one of <1> to <5>, wherein the external electrodes have a base electrode layer, an inner plating layer covering the base electrode layer, and a top plating layer covering the inner plating layer, the inner plating layer including a Ni plating layer, and the top plating layer including a Sn plating layer.

[0109] 1 Laminated cell conductor 2 Laminated body 4 Dielectric layer 5 Outer dielectric layer 6 Inner dielectric layer 10 Internal electrode layer 11 Counter electrode portion 12 Lead-out electrode portion 20 External electrode 21 Ground electrode layer 22 Resin electrode layer 23 Inner dielectric layer 24 Surface dielectric layer 25 End surface external electrode 26 Main surface external electrode 27 Side surface external electrode IL Inner layer portion OL Outer layer portion LF Electrode counter portion EG End gear portion WF Electrode counter portion SG Side gear portion M Main surface E End surface S Side surface T Lamination direction L Length direction W Width direction H Horizontal portion MH, main surface horizontal portion SH, side surface horizontal portion EH, end surface horizontal portion C, shoulder N, non-horizontal portion K, laminate body corner MH1, WT surface main surface horizontal portion SH1, WT surface side surface horizontal portion C1, WT surface shoulder MH2, LT surface main surface horizontal portion EH2, LT surface end surface horizontal portion C2, LT surface shoulder N1, LT surface non-horizontal portion SH3, WL surface side surface horizontal portion EH3, WL surface end surface horizontal portion C3, WL surface shoulder N2, WL surface non-horizontal portion K1, WT surface laminate body shoulder K2, LT surface laminate body shoulder K3, WL surface laminate body shoulder

Claims

1. A plurality of dielectric layers and a plurality of internal electrode layers are stacked, a laminate having a first main surface and a second main surface opposed to each other in a stacking direction, a first side surface and a second side surface opposed to each other in a width direction perpendicular to the stacking direction, and a first end surface and a second end surface opposed to each other in a length direction perpendicular to the stacking direction and the width direction; an external electrode disposed on the first end surface and the second end surface and connected to the internal electrode layer; the external electrodes each extend to at least a portion of the first main surface, the second main surface, the first side surface, and the second side surface; A cross section parallel to the width direction and the stacking direction is a WT cross section, a cross section parallel to the length direction and the stacking direction is a LT cross section, and a cross section parallel to the width direction and the length direction is a WL cross section, When viewed in the WT cross section, the external electrode has a WT surface main surface horizontal portion, a WT surface side horizontal portion, and a WT surface shoulder portion connecting the WT surface main surface horizontal portion and the WT surface side horizontal portion, 0.26≦width direction length of the horizontal portion of the WT surface main surface / width direction length of the external electrode≦0.56, 0.26≦length of the horizontal portion of the WT surface in the lamination direction / length of the external electrode in the lamination direction≦0.56, the WT surface main surface horizontal portion is located closer to the main surface than the WT surface shoulder portion, the WT surface side horizontal portion is located closer to the side surface than the WT surface shoulder portion, When viewed from the LT cross section, the external electrode has an LT plane main surface horizontal portion, an LT plane end surface horizontal portion, an LT plane shoulder portion connecting the LT plane main surface horizontal portion and the LT plane end surface horizontal portion, and an LT plane non-horizontal portion connecting the LT plane main surface horizontal portion and the laminate, 0.26≦length in the longitudinal direction of the horizontal portion of the LT plane principal surface / length in the longitudinal direction of the external electrode≦0.56, the horizontal portion of the LT plane main surface is located closer to the main surface than the shoulder portion of the LT plane and the non-horizontal portion of the LT plane, When viewed from the WL cross section, the external electrode has a WL surface horizontal portion, a WL surface end surface horizontal portion, a WL surface shoulder portion connecting the WL surface side surface horizontal portion and the WL surface end surface horizontal portion, and a WL surface non-horizontal portion connecting the WL surface side surface horizontal portion and the laminate, 0.26≦length of the horizontal portion of the WL plane side surface / length in the longitudinal direction of the external electrode≦0.56, The WL surface side horizontal portion is located on the WL surface shoulder portion and the WL surface non-horizontal portion. Multilayer ceramic capacitor.

2. When viewed from the WT cross section, a portion where the main surface and the side surface intersect in the laminate is defined as a WT cross section laminate shoulder portion, When viewed from the LT cross section, a portion where the main surface and the end surface intersect in the laminate is defined as an LT surface laminate shoulder portion; When viewed from the WL cross section, a portion where the side surface and the end surface intersect in the laminate is defined as a WL cross section laminate shoulder portion; The radius of curvature of the WT surface layer shoulder is greater than the radius of curvature of the WT surface shoulder; The radius of curvature of the LT surface layer shoulder is greater than the radius of curvature of the LT surface shoulder; The radius of curvature of the shoulder of the WL surface layer is greater than the radius of curvature of the shoulder of the WL surface; The multilayer ceramic capacitor according to claim 1 .

3. The radius of curvature of the WT surface layer shoulder is greater than the radius of curvature of the WT surface shoulder by 1.25% to 2%; The radius of curvature of the LT surface layer shoulder is greater than the radius of curvature of the LT surface shoulder by 1.25% to 2%; The radius of curvature of the shoulder of the WL surface layer is greater than the radius of curvature of the shoulder of the WL surface by 1.25% to 2%. The multilayer ceramic capacitor according to claim 2 .

4. The radius of curvature of the WT surface shoulder is 10 μm or more and 20 μm or less, The radius of curvature of the LT surface shoulder is 10 μm or more and 20 μm or less, The radius of curvature of the shoulder portion of the WL surface is 10 μm or more and 20 μm or less. The multilayer ceramic capacitor according to claim 1 .

5. The radius of curvature of the shoulder of the WT laminate is 8 μm or more and 16 μm or less, The radius of curvature of the shoulder of the LT laminate is 8 μm or more and 16 μm or less, The radius of curvature of the shoulder of the WL surface laminate is 8 μm or more and 16 μm or less. The multilayer ceramic capacitor according to claim 2 or 3.

6. The external electrode has a base electrode layer, an inner plating layer covering the base electrode layer, and a surface plating layer covering the inner plating layer, The inner plating layer includes a Ni plating layer, The surface plating layer includes a Sn plating layer. The multilayer ceramic capacitor according to claim 1 .