Power supply unit for aerosol generation device, and aerosol generation device

Abstract

An inhalation device (100) comprises: a power source unit (111C) that supplies power to a heating unit (121C); a DC / DC boost converter (82) and / or a heating switch (85); a charging IC (81); and a main board (50) on which the charging IC (81), a power supply connection unit (51), and the DC / DC boost converter (82) and / or the heating switch (85) are installed. The DC / DC boost converter (82) and / or the heating switch (85) is / are disposed closer to the power supply connection unit (51) than the charging IC (81). A power supply voltage measurement pin (Ps) of the charging IC (81) is connected, at a position closer to the power supply connection unit (51) than a power supply connection pin (Ps), to power supply wiring (520) connecting the power supply connection unit (51) and a power supply connection pin (Pb) via voltage measurement wiring (521).

Description

Power supply unit for aerosol generating device, and aerosol generating device

[0001] The present disclosure relates to a power supply unit for an aerosol generating device and an aerosol generating device.

[0002] The aerosol generator generally heats the aerosol source by adjusting the power supplied from a power source to a predetermined heating power using a power converter and supplying the adjusted power to a heater. The aerosol generator is also configured to be repeatedly rechargeable when the SOC of the power source decreases.

[0003] For example, the aerosol generating device described in Patent Document 1 describes that the power from a power source is boosted by a DC / DC converter and supplied to a heater to heat an aerosol-forming article, and that the DC / DC converter is equipped with a feedback pin for adjusting the output voltage.

[0004] Japan Special Table No. 2020-518236

[0005] In such an aerosol generating device, it is preferable to place both the heating element that heats the aerosol source and the charging IC that controls charging near the power source. Among the heating elements, the power converter and the heating switch in particular require a large current for heating, so it is preferable to eliminate power loss. On the other hand, it is also preferable to measure the power supply voltage for controlling charging near the power source when using the charging IC. In other words, the further the measurement point is from the power source, the greater the wiring resistance, resulting in a decrease in the accuracy of charging control.

[0006] The present disclosure provides a power supply unit for an aerosol generation device that can maintain charging control accuracy while improving heating efficiency, and an aerosol generation device.

[0007] The present disclosure provides a power supply unit for an aerosol generating device comprising: a power supply that supplies power to a heating section that heats an aerosol source; a power conversion device that converts power from the power supply and supplies heating power to the heating section and / or a heating switch that controls the supply of power to the heating section; a charging IC that receives power from an external power supply and controls the supply of charging power to the power supply; and a substrate that mounts the charging IC, a power connection section to which power from the power supply is supplied, and the power conversion device and / or the heating switch, wherein the charging IC has a power supply voltage measurement pin that measures the voltage of the power supply, and a power connection pin to which the voltage of the power supply is input, and at least one of the power conversion device and / or the heating switch is positioned closer to the power supply connection section than the charging IC, and the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection section than the power connection pin in the power supply wiring that connects the power supply connection section and the power connection pin via a voltage measurement wiring.

[0008] The present disclosure also provides a power supply unit for an aerosol generating device, comprising: a power supply that supplies power to a heating section that heats an aerosol source; a power conversion device that converts power from the power supply and supplies heating power to the heating section and / or a heating switch that controls the supply of power to the heating section; a charging IC that receives power from an external power supply and controls the supply of charging power to the power supply; and a substrate that mounts the charging IC, a power connection section to which power from the power supply is supplied, and the power conversion device and / or the heating switch, wherein the charging IC has a power supply voltage measurement pin that measures the voltage of the power supply, and a power connection pin to which the voltage of the power supply is input, and the wiring distance between at least one of the power conversion device and / or the heating switch and the power connection section is shorter than the wiring distance between the charging IC and the power connection section, and the power supply voltage measurement pin of the charging IC is connected to a position closer to the power connection section than the power connection pin in the power wiring that connects the power connection section and the power connection pin via a voltage measurement wiring.

[0009] The present disclosure also provides an aerosol generating device comprising: a heating unit that heats an aerosol source; a power supply that supplies power to the heating unit; a power conversion device that converts power from the power supply and supplies heating power to the heating unit and / or a heating switch that controls the supply of power to the heating unit; a charging IC that receives power from an external power supply and controls the supply of charging power to the power supply; and a substrate that mounts the charging IC, a power connection unit to which power from the power supply is supplied, and the power conversion device and / or the heating switch, wherein the charging IC has a power supply voltage measurement pin that measures the voltage of the power supply, and a power connection pin to which the voltage of the power supply is input, and at least one of the power conversion device and the heating switch is positioned closer to the power supply connection unit than the charging IC, and the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection unit than the power connection pin of the power supply wiring that connects the power supply connection unit and the power connection pin via a voltage measurement wiring.

[0010] According to the present disclosure, it is possible to maintain the accuracy of charging control while improving heating efficiency.

[0011] FIG. 1 is a schematic diagram showing a first configuration example of a suction device (suction device 100A). FIG. 2 is a schematic diagram showing a second configuration example of a suction device (suction device 100B). FIG. 3 is a perspective view of an entire suction device 100, which is an embodiment of a suction device according to the present disclosure. FIG. 4 is a perspective view of an internal unit 10 as seen from the front right side. FIG. 5 is a perspective view of the internal unit 10 as seen from the front left side. FIG. 6 is an exploded perspective view of the internal unit 10. FIG. 7 is a cross-sectional perspective view of a heater assembly 30. FIG. 8 is a block diagram simply illustrating the electrical connections of the main elements of the internal unit 10. FIG. 9 is a view showing elements mounted on a front surface 501 of a main board 50. FIG. 10 is a view showing elements mounted on a back surface 502 of a main board 50. FIG. 11 is a view showing the flow of power during heating in FIG. 10. FIG. 12 is a view showing the flow of power during charging in FIG. 10. FIG. 13 is a diagram showing the main conductive tracks of the first conductive layer L1 to the tenth conductive layer L10 provided on the main substrate 50. As shown in FIG.

[0012] A suction device, a control method, and a program according to an embodiment of the present disclosure will be described below with reference to the drawings. First, two configuration examples (a first configuration example and a second configuration example) to which the configuration of the suction device of the present disclosure can be applied will be described. Note that, in the following, identical or similar elements will be denoted by identical or similar reference numerals, and their description may be omitted or simplified as appropriate.

[0013] <<1. Configuration Example of Inhalation Device>> The inhalation device is a device that generates a substance to be inhaled by a user. In the following description, the substance generated by the inhalation device is described as an aerosol. Alternatively, the substance generated by the inhalation device may be a gas.

[0014] (1) First Configuration Example Fig. 1 is a schematic diagram illustrating a first configuration example of an inhalation device. As shown in Fig. 1, an inhalation device 100A according to this configuration example includes a power supply unit 110, a cartridge 120, and a flavor imparting cartridge 130. The power supply unit 110 includes a power supply unit 111A, a sensor unit 112A, a notification unit 113A, a memory unit 114A, a communication unit 115A, and a control unit 116A. The cartridge 120 includes a heating unit 121A, a liquid guide unit 122, and a liquid storage unit 123. The flavor imparting cartridge 130 includes a flavor source 131 and a mouthpiece 124. An air flow path 180 is formed in the cartridge 120 and the flavor imparting cartridge 130.

[0015] The power supply unit 111A stores electric power. The power supply unit 111A supplies electric power to each component of the suction device 100A under the control of the control unit 116A. The power supply unit 111A may be configured by, for example, a rechargeable battery such as a lithium ion secondary battery.

[0016] The sensor unit 112A acquires various types of information related to the suction device 100A. As one example, the sensor unit 112A is configured with a pressure sensor such as a condenser microphone, a flow rate sensor, a temperature sensor, or the like, and acquires values ​​associated with suction by the user. As another example, the sensor unit 112A is configured with an input device such as a button or a switch that accepts information input from the user.

[0017] The notification unit 113A notifies the user of information. The information notified to the user by the notification unit 113A includes, for example, various information such as the SOC (State Of Charge) indicating the charge state of the power supply unit 111A, the preheating time for suction, the period during which suction is possible, etc. The notification unit 113A is configured, for example, by a light-emitting device that emits light, a display device that displays images, a sound output device that outputs sound, or a vibration device that vibrates.

[0018] The storage unit 114A stores various types of information for the operation of the suction device 100 A. The storage unit 114A is configured by a non-volatile storage medium such as a flash memory, for example.

[0019] The communication unit 115A is a communication interface capable of performing communication in accordance with any wired or wireless communication standard, such as Wi-Fi (registered trademark), Bluetooth (registered trademark), BLE (Bluetooth Low Energy (registered trademark)), NFC (Near Field Communication), or LPWA (Low Power Wide Area).

[0020] The control unit 116A functions as an arithmetic processing unit and a control unit, and controls the overall operation of the suction device 100A in accordance with various programs. The control unit 116A is realized by an electronic circuit such as a CPU (Central Processing Unit) or a microprocessor.

[0021] The liquid reservoir 123 stores an aerosol source. The aerosol source is atomized to generate an aerosol. The aerosol source is a liquid, such as a polyhydric alcohol, such as glycerin or propylene glycol, or water. The aerosol source may contain a tobacco-derived or non-tobacco-derived flavor component. When the inhalation device 100A is a medical inhaler, such as a nebulizer, the aerosol source may contain a drug.

[0022] The liquid guide portion 122 guides and holds the aerosol source, which is a liquid stored in the liquid storage portion 123, from the liquid storage portion 123. The liquid guide portion 122 is, for example, a wick formed by twisting a fiber material such as glass fiber or a porous material such as porous ceramic. In this case, the aerosol source stored in the liquid storage portion 123 is guided by the capillary effect of the wick.

[0023] The heating unit 121A generates aerosol by heating the aerosol source and atomizing the aerosol source. In the example shown in FIG. 1 , the heating unit 121A is configured as a coil and wound around the liquid guide unit 122. When the heating unit 121A generates heat, the aerosol source held in the liquid guide unit 122 is heated and atomized, generating aerosol. The heating unit 121A generates heat when power is supplied from the power supply unit 111A. For example, power may be supplied to the heating unit 121A when the sensor unit 112A detects that the user has started inhaling and / or that predetermined information has been input. Then, power supply to the heating unit 121A may be stopped when the sensor unit 112A detects that the user has stopped inhaling and / or that predetermined information has been input. Note that the user's inhalation operation on the inhalation device 100A can be detected, for example, based on the pressure (internal pressure) within the inhalation device 100A detected by a suction sensor exceeding a predetermined threshold.

[0024] The flavor source 131 is a component for imparting flavor components to the aerosol. The flavor source 131 may include tobacco-derived or non-tobacco-derived flavor components.

[0025] The air flow path 180 is a path for air inhaled by the user. The air flow path 180 has a tubular structure with an air inlet 181, which is an entrance for air into the air flow path 180, and an air outlet 182, which is an exit for air from the air flow path 180, at both ends. A liquid guide section 122 is disposed on the upstream side (closer to the air inlet 181) of the air flow path 180, and a flavor source 131 is disposed on the downstream side (closer to the air outlet 182). Air flowing in through the air inlet 181 as the user inhales is mixed with the aerosol generated by the heating section 121A and, as shown by arrow 190, is transported through the flavor source 131 to the air outlet 182. When the mixed fluid of the aerosol and air passes through the flavor source 131, flavor components contained in the flavor source 131 are imparted to the aerosol.

[0026] Mouthpiece 124 is a member that is held in the mouth by the user when inhaling. Air outlet holes 182 are arranged in mouthpiece 124. By holding mouthpiece 124 in the mouth and inhaling, the user can take in the mixed fluid of the aerosol and air into the oral cavity.

[0027] The above describes an example of the configuration of the suction device 100A. Of course, the configuration of the suction device 100A is not limited to the above, and various configurations such as those exemplified below may be used.

[0028] As an example, the inhalation device 100A may not include the flavoring cartridge 130. In that case, the cartridge 120 is provided with the mouthpiece 124.

[0029] As another example, the inhalation device 100A may include multiple types of aerosol sources. Multiple types of aerosols generated from the multiple types of aerosol sources may be mixed in the air flow path 180 and undergo a chemical reaction to generate additional types of aerosols.

[0030] Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121 A. For example, the means for atomizing the aerosol source may be vibration atomization or induction heating.

[0031] (2) Second Configuration Example Fig. 2 is a schematic diagram illustrating a second configuration example of a suction device. As shown in Fig. 2, a suction device 100B according to this configuration example includes a power supply unit 111B, a sensor unit 112B, a notification unit 113B, a memory unit 114B, a communication unit 115B, a control unit 116B, a heating unit 121B, a housing unit 140, and an insulating unit 144. In the suction device 100A according to the first configuration example, the power supply unit 110 housing the power supply unit 111A and the heating unit 121A are separate entities. However, in the suction device 100B according to the second configuration example, the power supply unit 111B and the heating unit 121B are integrated. In other words, the suction device 100B according to the second configuration example can also be said to be a power supply unit with a built-in heating unit.

[0032] Each of the power supply unit 111B, sensor unit 112B, notification unit 113B, memory unit 114B, communication unit 115B, and control unit 116B is substantially identical to the corresponding components included in the suction device 100A according to the first configuration example.

[0033] The storage unit 140 has an internal space 141 and holds the stick-shaped substrate 150 while accommodating a portion of the stick-shaped substrate 150 in the internal space 141. The storage unit 140 has an opening 142 that connects the internal space 141 to the outside and accommodates the stick-shaped substrate 150 inserted into the internal space 141 through the opening 142. For example, the storage unit 140 is a cylindrical body with the opening 142 and a bottom 143 as its bottom surface, and defines a columnar internal space 141. An air flow path that supplies air to the internal space 141 is connected to the storage unit 140. An air inlet, which is an air inlet to the air flow path, is arranged, for example, on a side surface of the suction device 100. An air outlet, which is an air outlet from the air flow path to the internal space 141, is arranged, for example, on the bottom 143.

[0034] The stick-shaped substrate 150 includes a substrate portion 151 and a mouthpiece portion 152. The substrate portion 151 includes an aerosol source. The aerosol source includes a tobacco-derived or non-tobacco-derived flavor component. When the inhalation device 100B is a medical inhaler such as a nebulizer, the aerosol source may include a medicament. The aerosol source may be, for example, a liquid such as a polyhydric alcohol, such as glycerin or propylene glycol, or water, containing a tobacco-derived or non-tobacco-derived flavor component, or a solid containing a tobacco-derived or non-tobacco-derived flavor component. When the stick-shaped substrate 150 is held in the storage portion 140, at least a portion of the substrate portion 151 is housed in the internal space 141, and at least a portion of the mouthpiece portion 152 protrudes from the opening 142. When a user holds the mouthpiece portion 152 protruding from the opening 142 in their mouth and inhales, air flows into the internal space 141 via an air flow path (not shown) and reaches the user's mouth along with the aerosol generated from the substrate portion 151.

[0035] 2, the heating unit 121B is configured in a film shape and is arranged to cover the outer periphery of the storage unit 140. When the heating unit 121B generates heat, the substrate unit 151 of the stick-shaped substrate 150 is heated from the outer periphery, and an aerosol is generated.

[0036] The heat insulating section 144 prevents heat transfer from the heating section 121B to other components. For example, the heat insulating section 144 is made of a vacuum heat insulating material, an aerogel heat insulating material, or the like.

[0037] The above is a description of an example of the configuration of the suction device 100B. Of course, the configuration of the suction device 100B is not limited to the above, and various configurations such as those exemplified below may be used.

[0038] As one example, the heating unit 121B may be configured in a blade shape and disposed so as to protrude from the bottom 143 of the storage unit 140 into the internal space 141. In this case, the blade-shaped heating unit 121B is inserted into the substrate 151 of the stick-shaped substrate 150 and heats the substrate 151 of the stick-shaped substrate 150 from the inside. As another example, the heating unit 121B may be disposed so as to cover the bottom 143 of the storage unit 140. Furthermore, the heating unit 121B may be configured as a combination of two or more of a first heating unit covering the outer periphery of the storage unit 140, a blade-shaped second heating unit, and a third heating unit covering the bottom 143 of the storage unit 140.

[0039] As another example, the accommodation unit 140 may include an opening / closing mechanism such as a hinge that opens and closes a portion of the outer shell that forms the internal space 141. The accommodation unit 140 may then open and close the outer shell to accommodate the stick-shaped substrate 150 inserted into the internal space 141 while clamping it. In this case, the heating unit 121B may be provided at the clamping location in the accommodation unit 140 and heat the stick-shaped substrate 150 while pressing it.

[0040] Furthermore, the means for atomizing the aerosol source is not limited to heating by the heating unit 121B. For example, the means for atomizing the aerosol source may be induction heating. In that case, the suction device 100B has at least an electromagnetic induction source such as a coil that generates a magnetic field, instead of the heating unit 121B. A susceptor that generates heat by induction heating may be provided in the suction device 100B, or may be included in the stick-shaped substrate 150.

[0041] Furthermore, the suction device 100B may further include the heating unit 121A, the liquid guide unit 122, the liquid storage unit 123, and the air flow path 180 according to the first configuration example, and the air flow path 180 may supply air to the internal space 141. In this case, the mixed fluid of the aerosol and air generated by the heating unit 121A flows into the internal space 141 and is further mixed with the aerosol generated by the heating unit 121B, and reaches the oral cavity of the user.

[0042] <<2. Configuration Example of Suction Device According to the Present Disclosure>> Next, an embodiment of a suction device (hereinafter referred to as suction device 100) in which the configuration of the suction device according to the present disclosure is applied to the suction device 100B of the second configuration example described above will be described. Note that, although a specific description will be omitted, part of the configuration of the suction device 100 described in detail below can also be applied to the suction device 100A of the first configuration example.

[0043] 3 is an overall perspective view of the suction device 100. In the following description, the direction in which the stick-shaped substrate 150 is inserted into or removed from the suction device 100 is defined as the up-down direction, the sliding movement direction of the shutter 23 (described later) as the front-rear direction, and the direction perpendicular to the up-down direction and the front-rear direction as the left-right direction. As shown in the figure, the front is defined as Fr, the rear as Rr, the left side as L, the right side as R, the top as U, and the bottom as D.

[0044] The suction device 100 is preferably sized to fit in the hand, and has, for example, a rod shape. For example, a user holds the suction device 100 in one hand while touching the surface of the suction device 100 with the fingertip. The shape of the suction device 100 is not limited to a rod shape, and it may have any shape (for example, a rounded, approximately rectangular parallelepiped shape or an egg shape).

[0045] The suction device 100 includes an internal unit 10 (see FIGS. 4 to 6 ) and a case 20 that forms the exterior of the suction device 100. The case 20 has a lower case 21 and an upper case 22. A portion of the internal unit 10 is housed in the lower case 21, and the entire internal unit 10 is housed in the case 20 by placing the upper case 22 over the lower case 21 from above.

[0046] The top surface of the suction device 100 is provided with an opening 27 (see FIGS. 4 to 6) through which the stick-shaped substrate 150 is inserted and removed, and a shutter 23 that can slide back and forth. The opening 27 is located on the rear side of the top surface of the suction device 100. The shutter 23 selectively takes an open state (front position) that opens the opening 27 to allow the stick-shaped substrate 150 to be inserted and removed, and a closed state (rear position) that positions the shutter 23 above the opening 27 to close the opening 27. When inserting the stick-shaped substrate 150 into the opening 27, the user opens the shutter 23.

[0047] A shutter detection sensor 11 (see FIG. 4) is provided near the shutter 23. The shutter detection sensor 11 detects whether the shutter 23 is open or not. The shutter detection sensor 11 is an example of the sensor unit 112B of the suction device 100B in FIG. 2.

[0048] Furthermore, a USB (Universal Serial Bus) port 26 (see FIG. 4) is provided on the top surface of the suction device 100 adjacent to the opening 27. In the open state described above, the shutter 23 blocks the USB port 26. On the other hand, in the closed state described above, the shutter 23 does not block the USB port 26, and the USB port 26 is open. The USB port 26 is configured to be electrically connectable to an external power source (not shown) capable of supplying power to charge the power supply unit 111C (see FIG. 4). The USB port 26 is, for example, a receptacle into which a mating plug can be inserted. As an example, in this embodiment, the USB port 26 is a USB Type-C receptacle.

[0049] An operation unit 24 and a light-emitting unit 25 are provided on the front surface of the suction device 100. The operation unit 24 is disposed below the light-emitting unit 25. More specifically, the operation unit 24 and the light-emitting unit 25 are components of the internal unit 10 housed in the case 20, and are configured so that parts of the operation unit 24 and the light-emitting unit 25 are exposed from openings formed on the front surface of the case 20. The light-emitting unit 25 is an example of the notification unit 113B of the suction device 100B in FIG. 2 .

[0050] The operation unit 24 is a button-type switch that can be operated by the user and is an input device that accepts information input from the user. The operation unit 24 is connected to the main board 50 (see FIGS. 4 to 6), which will be described later. When the user presses the operation unit 24, for example, the MCU (Micro Controller Unit) 1 (see FIGS. 4 to 6) or the heating unit 121C (see FIG. 7) is activated. The MCU 1 functions as the control unit 116B in the suction device 100B. The MCU 1 may also have the function of the communication unit 115B in addition to the function of the control unit 116B in the suction device 100B. Furthermore, the MCU 1 may be composed of a single IC or two or more ICs. For example, the discharge control for the heating unit 121C and the charge control for the power supply unit 111C may be performed by a single IC or by separate ICs.

[0051] The light-emitting unit 25 is composed of light-emitting elements such as LEDs (Light Emitting Diodes). More specifically, the light-emitting unit 25 includes a plurality of LEDs 251 (see FIG. 6 ) provided on the main board 50, and a transparent cover 250 that covers the plurality of LEDs 251 and transmits light from the LEDs 251. A portion of the transparent cover 250 is exposed through an opening formed in the front surface of the case 20. In this embodiment, for example, the plurality of LEDs 251 are configured to be able to emit light in a plurality of colors including blue, yellow, and red. The number of light-emitting elements can be set arbitrarily, and the light-emitting unit 25 may have only one light-emitting element, for example.

[0052] The light-emitting unit 25 emits light in a predetermined light-emitting manner in response to a command from the MCU 1 to notify the user of predetermined information. Here, the light-emitting manner may be, for example, a light color, but is not limited to this and may be, for example, a lighting intensity (in other words, brightness) or a lighting pattern (for example, blinking at a predetermined time interval). Furthermore, the predetermined information may be, for example, operational information indicating whether the power of the suction device 100 is on or not.

[0053] Next, the internal unit 10 of the suction device 100 of this embodiment will be described with reference to Figures 4 to 6. Figure 4 is a perspective view of the internal unit 10 as seen from the front right side, Figure 5 is a perspective view of the internal unit 10 as seen from the front left side, Figure 6 is an exploded perspective view of the internal unit 10, Figure 7 is a cross-sectional perspective view of the heater assembly 30, and Figure 8 is a block diagram simply showing the electrical connections of the main elements of the internal unit 10. Note that the internal unit 10 is the suction device 100 with the case 20 and shutter 23 removed.

[0054] The internal unit 10 includes a chassis 40, a main board 50, a vibration device 60, a heater assembly 30, a power supply unit 111C, a power supply board 71, a peripheral FPC (Flexible Printed Circuit) 72, a sensor FPC 73, and various sensors. The power supply board 71, the peripheral FPC 72, and the sensor FPC 73 are flexible circuit boards. Flexible circuit boards are flexible, include conductive wiring and / or signal wiring, and can mount electronic components (elements) such as resistors and chips. Flexible circuit boards generally have a thickness of 100 μm to 600 μm. The power supply board 71 may be a flexible circuit board, a rigid board (described later), or a combination of a flexible board and a rigid board. However, a flexible circuit board will be described here as an example.

[0055] 6 , the chassis 40 has a power supply holding portion 41 that holds the power supply unit 111C, a board holding portion 42 that holds the main board 50, and a heater holding portion 43 that holds the heater assembly 30. The power supply holding portion 41 is located in the lower part of the chassis 40, and the board holding portion 42 and the heater holding portion 43 are located in the upper part of the chassis 40.

[0056] The power supply holding unit 41 has a cylindrical shape with a portion of the side cut out, in other words, a substantially semi-cylindrical shape. The power supply holding unit 41 has a bottom wall 401, an arc-shaped side wall 402 standing upward from the bottom wall 401, and an upper wall 403 provided at the upper end of the side wall 402. The power supply unit 111C is disposed in a space surrounded by the bottom wall 401, the side wall 402, and the upper wall 403.

[0057] The board holding portion 42 is provided on a standing wall portion 404 that stands upward from the upper wall portion 403 of the power supply holding portion 41. The board holding portion 42 is provided on one side (here, the front side) of the standing wall portion 404 in the front-rear direction, and holds the main board 50.

[0058] The heater holding portion 43 is provided on the opposite side (here, rear side) of the standing wall portion 404 from the substrate holding portion 42 in the front-rear direction. The heater holding portion 43 has a space surrounded by the standing wall portion 404, a pair of left and right wall portions 405 extending in the front-rear direction from the standing wall portion 404, and the upper surface of the upper wall portion 403 of the power supply holding portion 41, and the heater assembly 30 is disposed in this space.

[0059] (Main Board) The main board 50 is a rigid board with multiple electronic components (elements) mounted on both sides. Rigid boards are not flexible and generally have a thickness of 300 μm to 1,600 μm. The main board 50 is mounted with an MCU 1, LED 251, a charging IC (Integrated Circuit) 81, a step-up DC / DC converter 82, a protection IC 83, heating switches 85 and 86, an operational amplifier 87, and the like. The main board 50 is held by the board holder 42 of the chassis 40 with the element-mounted surface facing forward and backward.

[0060] 9 is a diagram showing elements mounted on the surface 501 of the main substrate 50. As shown in FIG. 9, a power supply connector 51 that is electrically connected to the power supply unit 111C is provided at the right end in the lower region of the surface 501 of the main substrate 50. The power supply connector 51 has a positive electrode side connector 51a that is provided lower than the negative electrode side connector 51b. The power supply connector 51 is electrically connected to the power supply unit 111C via the power supply substrate 71. The power supply unit 111C is a cylindrical lithium ion secondary battery and is an example of the power supply unit 111B of the suction device 100B in FIG. 2.

[0061] As shown in FIG. 6 , the power supply unit 111C is provided with a positive electrode tab 111a and a negative electrode tab 111b. The power supply unit 111C is disposed in the power supply holding portion 41 of the chassis 40 with the positive electrode tab 111a and the negative electrode tab 111b disposed forward. The power supply board 71 is disposed in front of the power supply unit 111C and the main board 50 and extends vertically. The power supply board 71 is connected to the positive electrode tab 111a and the negative electrode tab 111b of the power supply unit 111C and also to the power supply connection portion 51 of the main board 50. Power from the power supply unit 111C is transmitted to the main board 50 through conductive tracks formed on the power supply board 71 and supplied to various electronic components, such as the step-up DC / DC converter 82 and the protection IC 83. The power supply board 71 also includes a power supply temperature sensor 16. The power supply temperature sensor 16 detects the temperature of the power supply unit 111C. The power supply temperature sensor 16 is, for example, a thermistor. The power supply temperature sensor 16 is an example of the sensor unit 112B of the suction device 100B in FIG.

[0062] 9, in the lower region of the surface 501 of the main board 50, the MCU 1 is mounted to the left of the power supply connection portion 51, and the protection IC 83 is mounted above the MCU 1 near the power supply connection portion 51. Referring also to FIG. 8, the protection IC 83 protects the power supply unit 111C by stopping the charging or discharging of the power supply unit 111C in the event of overcharging, over-discharging, or overcurrent during charging or discharging of the power supply unit 111C.

[0063] Fig. 10 is a diagram showing elements mounted on the back surface 502 of the main substrate 50. As shown in Fig. 10, a USB port 26 is provided in an upper region of the back surface 502 of the main substrate 50. The USB port 26 is electrically connected to the charging IC 81 by wiring formed on the main substrate 50.

[0064] A charging IC 81 is mounted near the right side in the central region of the back surface 502 of the main substrate 50. Heater connectors 57a and 57b are provided in the center of the lower region, and a low-potential-side heating switch 86 (N-channel FET in the figure) is mounted to the right of the heater connectors 57a and 57b. Also mounted on the back surface 502 of the main substrate 50, from left to right, between the charging IC 81 and the heater connectors 57a and 57b are a high-potential-side heating switch 85 (P-channel FET in the figure), a step-up DC / DC converter 82, and an operational amplifier 87. The charging IC 81 controls charging by supplying (charging) power input from the USB port 26 to the power supply unit 111C. The step-up DC / DC converter 82 boosts the power supplied from the power supply unit 111C to generate power to be supplied to the heating unit 121C (see FIG. 7) via the heating switches 85 and 86. The heating switches 85, 86 are, for example, field effect transistors (FETs). In this way, while the power supply connection part 51 is provided on the front surface 501, by mounting the step-up DC / DC converter 82 and heating elements such as the heating switches 85, 86 on the back surface 502, it is possible to arrange the heating elements and the power supply connection part 51 closer to each other. Since the protection IC 83 described above is prone to errors at high temperatures, by mounting it on the surface opposite the heating element, which is a heat-generating element, it is possible to prevent deterioration in control accuracy.

[0065] A board connection part 121a extending from below the heater assembly 30 is connected to the heater connection parts 57a and 57b, and supplies power to the heating part 121C of the heater assembly 30. As a result, power is supplied to the heating part 121C of the heater assembly 30 from the power supply part 111C via the main board 50.

[0066] As shown in FIG. 8 , the operational amplifier 87 is connected to the heater connectors 57 a and 57 b. While detailed description is omitted, the operational amplifier 87 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage input to the non-inverting input terminal to measure the resistance of the heating element 121C. The MCU 1 acquires the temperature of the heating element 121C based on the voltage input from the operational amplifier 87. By placing the operational amplifier 87 on the same surface as the heating element in this way, the signal-to-noise ratio (SNR) for measuring the heater resistance can be improved. Furthermore, to reduce drift errors due to heat generation, the operational amplifier 87 may be, for example, a zero-drift amplifier.

[0067] (Vibration Device) The vibration device 60 is composed of a vibration element such as a vibration motor. As shown in FIG. 6 , the vibration device 60 is disposed in the power supply holding portion 41 of the chassis 40, between the upper surface of the power supply unit 111C and the upper wall portion 403. The lead wires 61 of the vibration device 60 are connected to the peripheral FPC 72. The vibration device 60 vibrates in a predetermined vibration mode in response to a command from the MCU 1 to notify the user of predetermined information. For example, when heating of the stick-shaped substrate 150 starts or ends, the vibration device 60 vibrates in a predetermined vibration mode to notify the user of the start or end of heating. The vibration device 60 is an example of the notification unit 113B of the suction device 100B in FIG. 2 .

[0068] 7, the heater assembly 30 includes a heating section 121C, a housing section 140C, and a heat insulating section 144C. The heating section 121C is, for example, a film heater, and is wound around the outer periphery of the housing section 140C. The heating section 121C and the board connection section 121a may be formed by a single heater FPC.

[0069] The heater assembly 30 is also provided with a stick guide 31. The stick guide 31 is provided on the upper part of the heater assembly 30 and guides the insertion and removal of the stick-shaped substrate 150 into the housing portion 140C. The stick guide 31 is a cylindrical member that has an opening 27 and constitutes a part of the housing portion 140C.

[0070] The heater assembly 30 is also provided with a heater temperature sensor 15 capable of detecting the temperature of the heating portion 121C. More specifically, the heater temperature sensor 15 is provided between the heating portion 121C and the heat insulating portion 144C, in contact with or in close proximity to the heating portion 121C. The heater temperature sensor 15 is, for example, a thermistor.

[0071] 6, the sensor FPC 73 is disposed between the standing wall portion 404 of the heater holding portion 43 and the heater assembly 30. The sensor FPC 73 is equipped with the stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14. The stick detection sensor 12, the suction sensor 13, and the case temperature sensor 14 are an example of the sensor unit 112B of the suction device 100B in FIG.

[0072] The stick detection sensor 12 is a sensor capable of detecting the stick-shaped substrate 150 housed in the housing section 140C. In this embodiment, the stick detection sensor 12 is an optical sensor capable of detecting the stick-shaped substrate 150 based on the amount of reflected light of light irradiated onto the housing section 140C. Here, the term "amount of light" is a concept that includes luminous flux, illuminance, luminous emittance, luminous intensity, brightness, etc. The optical sensor is, for example, an IR (Infrared Rays) sensor.

[0073] The suction sensor 13 is a sensor that detects a puffing action (inhalation action) by the user. The suction sensor 13 is configured by, for example, a condenser microphone, a pressure sensor, a thermistor, etc. The suction sensor 13 is provided in the sensor FPC 73 near the stick guide 31.

[0074] The case temperature sensor 14 is a sensor that detects the temperature of the case 20. The case temperature sensor 14 is, for example, a thermistor. The case temperature sensor 14 is disposed adjacent to the inner surface of the case 20 on the sensor FPC 73.

[0075] The sensor FPC 73 is also provided with a heater temperature sensor connection 731 that connects to the heater temperature sensor 15 of the heater assembly 30. The heater temperature sensor connection 731 is provided on the lower part of the sensor FPC 73. More specifically, a lead wire 15a is connected to the heater temperature sensor 15, and the heater temperature sensor connection 731 is connected to the lead wire 15a that extends from below the heater assembly 30.

[0076] The stick detection sensor 12, suction sensor 13, case temperature sensor 14, and heater temperature sensor connection part 731 are connected to the board connection part 730 via conductive tracks formed on the sensor FPC 73. The board connection part 730 is connected to the sensor FPC connection part 55 provided in the central region of the surface 501 of the main board 50. As a result, the detection results of each sensor are output to the MCU 1 mounted on the main board 50, etc.

[0077] In the suction device 100 configured in this manner, when the shutter detection sensor 11 detects the open state of the shutter 23 and the stick detection sensor 12 detects the stick-shaped substrate 150, the MCU 1 begins heating the heating unit 121C. When a user holds the suction mouthpiece 152 of the stick-shaped substrate 150 in their mouth and inhales, aerosol is supplied into the user's mouth from the aerosol source of the stick-shaped substrate 150 heated by the heating unit 121C. The suction sensor 13 detects the number of suctions, and the MCU 1 stops heating after a predetermined number of suctions or after a predetermined time has elapsed. While the suction device 100 is heating, the case temperature sensor 14, heater temperature sensor 15, and power supply temperature sensor 16 detect their respective temperatures. If abnormal heating is determined, the MCU 1 stops or suppresses heating of the heating unit 121C. The user can also operate the operation unit 24 to, for example, check the SOC of the power supply unit 111C. The light-emitting unit 25 (LED 251) and the vibration device 60 notify the user of various information such as the SOC of the power supply unit 111C, error indications, etc. If the SOC of the power supply unit 111C decreases, the user can connect an external power source to the USB port 26 to charge the power supply unit 111C.

[0078] (Details of the Main Board) Details of the main board 50 will be described below with reference to FIGS. 8 and 11 to 13. FIG. 11 is a diagram showing the flow of power during heating in FIG. 10, and FIG. 12 is a diagram showing the flow of power during charging in FIG. 10. FIGS. 11 and 12 show the main board 50 as viewed from the rear surface 502, with the power supply connector 51 (positive electrode connector 51a) provided on the front surface 501 indicated by a dashed line. Note that FIG. 9 shows the power supply connector 51 as viewed with the front surface 501 facing forward, and therefore the position of the power supply connector 51 is apparently reversed compared to FIGS. 11 and 12, which show the power supply connector 51 as viewed with the rear surface 502 facing forward. The heating switch 86 is omitted in FIGS. 11 and 12 because it overlaps with the power supply connector 51.

[0079] The positional relationship of the elements mounted on the main board 50 has been described above, but when these elements are viewed with the power supply connection part 51 as the reference, the step-up DC / DC converter 82 and heating elements such as the heating switches 85 and 86 are arranged closer to the power supply connection part 51 than the charging IC 81, which is a charging element. In terms of wiring distance, these elements are arranged so that the wiring distance connecting the power supply connection part 51 and heating elements such as the step-up DC / DC converter 82 and the heating switches 85 and 86 is shorter than the wiring distance connecting the power supply connection part 51 and the charging IC 81, which is a charging element.

[0080] The white arrow 58 in Figure 11 indicates the flow of power during discharge, and the power of the power supply unit 111C input from the positive electrode side connection unit 51a of the power supply connection unit 51 to the power supply connection pin Pb flows counterclockwise through the heating unit connection pin Po of the step-up DC / DC converter 82 and the high-potential side heating switch 85, and is supplied to the heater connection unit 57a.

[0081] The white arrow 59 in Figure 12 indicates the flow of power during charging, and the power supplied from the USB port 26 to the charging IC 81 flows downward from the power connection pin Pb of the charging IC 81 and through the positive side connection part 51a of the power connection part 51.

[0082] 13 is a diagram showing the main conductive tracks of the first conductive layer L1 to the tenth conductive layer L10 provided on the main substrate 50. In FIG. 13, the first conductive layer L1 is a conductive track exposed on the back surface 502, and the tenth conductive layer L10 is a conductive track exposed on the front surface 501. The first conductive layer L1 is connected to a charging IC 81, a step-up DC / DC converter 82, a heating switch 85, and the like, which are mounted on the back surface 502. Parts of the tenth conductive layer L10 (the lower ends of conductive tracks 810 and 820 described below) form a positive electrode side connection portion 51a and a negative electrode side connection portion 51b.

[0083] The conductive track 810 of the tenth conductive layer L10, which serves as the positive electrode side connection portion 51a, is connected to the conductive tracks 809 to 805 of the ninth conductive layer L9 to the fifth conductive layer L5, which are formed at the same position. The conductive track 805 of the fifth conductive layer L5 extends upward on the substrate and is connected to the conductive track 804 of the fourth conductive layer L4. The conductive track 804 of the fourth conductive layer L4 has a length approximately half the vertical length of the conductive track 805, and is connected at its lower part to the conductive track 803a of the third conductive layer L3 and at its upper part to the conductive track 803b of the third conductive layer L3. The conductive tracks of different conductive layers are connected to each other via vias (not shown).

[0084] The conductive track 803a on the third conductive layer L3 is connected to the power supply connection pin Pb (see FIG. 11) of the step-up DC / DC converter 82 via the conductive rack 802a on the second conductive layer L2 and the conductive track 801a on the first conductive layer L1, which are formed at the same position. That is, the conductive tracks 801a to 803a and 804 to 810 constitute the power supply wiring 510 during discharge, which is part of the open arrow 58 in FIG. 11.

[0085] The conductive track 803b on the third conductive layer L3 is connected to the power connection pin Pb (see FIG. 11) of the charging IC 81 via the conductive rack 802b on the second conductive layer L2 and the conductive track 801b on the first conductive layer L1, which are formed at the same position. That is, the conductive tracks 801b to 803b and 804 to 810 form the power supply wiring 520 during charging, which is indicated by the open arrow 59 in FIG. 12.

[0086] In this way, the power supply wiring 520 connecting the positive electrode side connection portion 51a and the power supply connection pin Pb of the charging IC 81, and the power supply wiring 510 connecting the positive electrode side connection portion 51a and the power supply connection pin Pb of the step-up DC / DC converter 82 share the conductive tracks (804 to 810) in multiple conductive layers (L4 to L10). As a result, when heating and charging are not performed simultaneously, part of the conductive tracks can be shared by the power supply wiring and the charging wiring, thereby making it possible to reduce the size of the main board 50.

[0087] The conductive track 820 of the tenth conductive layer L10, which becomes the negative electrode side connecting portion 51b, extends upward and is connected to a ground wiring formed over a wide area from the tenth conductive layer L10 to the first conductive layer L1. The description of the ground wiring is omitted.

[0088] Because a large current flows through the wiring during heating and charging, it is preferable to shorten both the power supply wiring 510 during heating and the power supply wiring 520 during charging. Therefore, it is preferable to place the heating elements, such as the step-up DC / DC converter 82 and heating switches 85 and 86, and the charging IC 81, which is the charging element, near the power supply connection part 51. However, in order to make the main board 50 smaller, it is necessary to place one of them away from the power supply connection part 51.

[0089] It is necessary to eliminate power loss during heating, and it is preferable to place the heating element preferentially close to the power supply connection part 51. On the other hand, when measuring the power supply voltage for controlling charging, the charging IC 81 also preferably measures close to the power supply connection part 51. In other words, the further the measurement point is from the power supply, the greater the wiring resistance becomes, and the lower the accuracy of charging control becomes.

[0090] Therefore, in the present disclosure, heating elements such as the step-up DC / DC converter 82 and heating switches 85, 86 are arranged closer to the power supply connection section 51 than the charging IC 81, which is the charging element, and the power supply voltage is measured not using the power supply voltage obtained from the power supply connection pin Pb of the charging IC 81, but by providing a power supply voltage measurement pin Ps on the charging IC 81 and obtaining the power supply voltage from near the power supply connection section 51 via the voltage measurement wiring 521, thereby improving the measurement accuracy of the power supply voltage.

[0091] More specifically, as shown in FIG. 11 , the charging IC 81 is provided with a power supply voltage measurement pin Ps. As shown in FIG. 13 , the power supply voltage measurement pin Ps is connected to a signal track 521b on the seventh conductive layer L7 through a via 521a that penetrates from the first conductive layer L1 to the sixth conductive layer L6. The signal track 521b extends downward from the via 521a and is connected to a conductive track 807. The signal track 521b is then connected to the positive electrode connection portion 51a (conductive track 810) through a conductive track 808 on the eighth conductive layer L8 and a conductive track 809 on the ninth conductive layer L9, which are formed in the same position. That is, the power supply voltage measurement pin Ps of the charging IC 81 is connected to the conductive tracks 807 to 810 through the via 521a and signal track 521b that constitute the voltage measurement wiring 521.

[0092] 8 , the power supply voltage measurement pin Ps of the charging IC 81 is connected to a power supply wiring 520 that connects the positive electrode connection 51a and the power supply connection pin Pb via the voltage measurement wiring 521 at a position closer to the power supply connection 51 than the power supply connection pin Pb. Therefore, the charging IC 81 can utilize the power supply voltage at a position closer to the positive electrode connection 51a on the power supply wiring 520 rather than utilizing the power supply voltage input to the power supply connection pin Pb of the charging IC 81. This allows the step-up DC / DC converter 82 and / or heating elements such as the heating switches 85 and 86 to be disposed closer to the power supply connection 51 than the charging IC 81, thereby improving heating efficiency and maintaining charging control accuracy. Since the voltage measurement wiring 521 is a measurement wiring and does not need to carry a large current like the power supply wiring 510, it can be a thin wiring and can be disposed without being large.

[0093] In the above embodiment, the signal track 521b is formed on the seventh conductive layer L7, which is a layer between the front surface 501 and the back surface 502. However, this is not limiting and the signal track 521b may be provided on a layer closer to the positive electrode side connection portion 51a, for example, the ninth conductive layer L9. In this case, the via 521a penetrates from the first conductive layer L1 to the eighth conductive layer L8. The signal track 521b is formed on the ninth conductive layer L9 and connected to the conductive track 809 on the ninth conductive layer L9. That is, the power supply voltage measurement pin Ps is connected to the signal track 521b on the ninth conductive layer L9 through the via 521a that penetrates from the first conductive layer L1 to the eighth conductive layer L8. The signal track 521b extends downward from the via 521a, is connected to the conductive track 809, and is connected to the positive electrode side connection portion 51a (conductive track 810) on the tenth conductive layer L10, which is formed in the same position. That is, the power supply voltage measurement pin Ps of the charging IC 81 is connected to the conductive tracks 809 and 810 through the via 521 a and the signal track 521 b that constitute the voltage measurement wiring 521 .

[0094] The signal track 521b may also be provided on the tenth conductive layer L10. By forming the signal track 521b on a layer between the front surface 501 and the back surface 502, the voltage measurement wiring 521 can be formed by utilizing the interface of the multilayer structure even when there is not enough space on the device mounting surface of the main substrate 50. On the other hand, by providing the signal track 521b on the tenth conductive layer L10, the power supply voltage can be acquired at a position closer to the positive electrode side connection portion 51a. Alternatively, the signal track 521b may be provided on both the layer between the front surface 501 and the back surface 502 and the layer (tenth conductive layer L10) on which the positive electrode side connection portion 51a is provided, and the signal tracks 521b on these layers may be connected to each other by vias, and the signal track 521b may be connected to the positive electrode side connection portion 51a on the front surface 501 (tenth conductive layer L10) on which the positive electrode side connection portion 51a is provided.

[0095] 8 and 10, the step-up DC / DC converter 82 is also provided with a feedback pin Pf that measures the output voltage from the heating unit connection pin Po to the heating switch 85. More specifically, as shown in FIG. 13, the feedback pin Pf of the step-up DC / DC converter 82 is connected to a signal track 515b on the second conductive layer L2 through a via 515a that penetrates the first conductive layer L1. The signal track 515b extends diagonally downward from the via 515a toward the heating switch 85 and is connected to the heating switch 85 through a via 515c that penetrates the first conductive layer L1. Of the multiple vias in the wiring between the heating unit connection pin Po and the heating switch 85, the via 515c is closer to the heating switch 85 than the other elements. Examples of the other elements include capacitors C1 to C3 shown in FIG. 8. The capacitors C1 to C3 are each connected in parallel to the heating unit connection pin Po and the ground terminal of the step-up DC / DC converter 82. The capacitors C1 to C3 are electrically connected to the heating unit connection pin Po on the first conductive layer L1, and are also connected to vias 515d, 515e, and 515f that pass through the first conductive layer L1. The vias 515d, 515e, and 515f are connected to ground.

[0096] For feedback control, it is desirable for the step-up DC / DC converter 82 to detect the power supply voltage at a position as close as possible to the heater connection portion 57a, and since the output voltage is measured through a via that is closer to the heating switch 85 than other elements out of the multiple vias in the wiring between the heating portion connection pin Po and the heating switch 85, the control accuracy of the heating voltage can be improved. From this perspective, it is preferable that the feedback pin Pf obtains the output voltage through the via that is closest to the heating switch 85 out of the multiple vias. This further improves the control accuracy of the heating voltage.

[0097] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention.

[0098] This specification describes at least the following items. Note that the components in parentheses correspond to those in the above-described embodiment, but are not limited to these.

[0099] (1) A power supply unit (power supply unit 110, suction device 100B, 100) for an aerosol generation device, comprising: a power supply (power supply units 111A to 111C) that supplies power to heating units (heating units 121A to 121C) that heat an aerosol source (stick-shaped substrate 150); a power conversion device (step-up DC / DC converter 82) that converts power from the power supply and supplies heating power to the heating units and / or a heating switch (heating switch 85) that controls the power supply to the heating units; a charging IC (charging IC 81) that receives power from an external power supply and controls the supply of charging power to the power supply; and a substrate (main substrate 50) that mounts the charging IC, a power connection unit (power connection unit 51) to which power from the power supply is supplied, and the power conversion unit and / or the heating switch, wherein the charging IC has a power supply voltage measurement pin (power supply voltage measurement pin Ps) that measures the voltage of the power supply, and a power supply connection pin (power supply connection pin Pb) to which the voltage of the power supply is input, A power supply unit for an aerosol generating device, wherein at least one of the power conversion device and / or the heating switch is positioned closer to the power supply connection part than the charging IC, and the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection part than the power supply connection pin in the power supply wiring (power supply wiring 520) connecting the power supply connection part and the power supply connection pin via a voltage measurement wiring (voltage measurement wiring 521).

[0100] According to (1), by arranging a heating element such as a power converter or a heating switch near the power supply connection, the power supply wiring through which a large current flows can be shortened, thereby reducing power loss and improving heating efficiency. Meanwhile, although the charging IC is arranged farther away from the heating element due to space constraints, the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection than the power supply connection pin on the power supply wiring connecting the power supply connection and the power supply connection pin via the voltage measurement wiring. Therefore, rather than using the power supply voltage input to the power connection pin, the charging IC can utilize the power supply voltage at a position closer to the power supply connection on the power supply wiring through which a large current flows. This improves heating efficiency and maintains charging control accuracy. Furthermore, since the voltage measurement wiring is used for measurement purposes and does not need to carry a large current like the power supply wiring, it can be thin and can be arranged without being large.

[0101] (2) A power supply unit (power supply unit 110, suction device 100B, 100) for an aerosol generation device, comprising: a power supply (power supply units 111A to 111C) that supplies power to heating units (heating units 121A to 121C) that heat an aerosol source (stick-shaped substrate 150); a power conversion device (step-up DC / DC converter 82) that converts power from the power supply and supplies heating power to the heating units and / or a heating switch (heating switch 85) that controls the power supply to the heating units; a charging IC (charging IC 81) that receives power from an external power supply and controls the supply of charging power to the power supply; and a substrate (main substrate 50) that mounts the charging IC, a power connection unit (power connection unit 51) to which power from the power supply is supplied, and the power conversion unit and / or the heating switch, wherein the charging IC has a power supply voltage measurement pin (power supply voltage measurement pin Ps) that measures the voltage of the power supply, and a power supply connection pin (power supply connection pin Pb) to which the voltage of the power supply is input, A power supply unit for an aerosol generating device, wherein the wiring distance between at least one of the power conversion device and / or the heating switch and the power supply connection part is shorter than the wiring distance between the charging IC and the power supply connection part, and the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection part than the power supply connection pin in the power supply wiring (power supply wiring 520) connecting the power supply connection part and the power supply connection pin via a voltage measurement wiring (voltage measurement wiring 521).

[0102] According to (2), the wiring distance between a heating element, such as a power converter or a heating switch, and the power supply connection is shorter than the wiring distance between the charging IC and the power supply connection, allowing for the shortening of the power supply wiring through which a large current flows. This reduces power loss and improves heating efficiency. Meanwhile, although the wiring distance between the charging IC and the power supply connection is long due to space constraints, the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection than the power supply connection pin on the power supply wiring connecting the power supply connection and the power supply connection pin via the voltage measurement wiring. Therefore, rather than using the power supply voltage input to the power connection pin, the charging IC can utilize the power supply voltage at a position closer to the power supply connection on the power supply wiring through which a large current flows. This improves heating efficiency and maintains charging control accuracy. Since the voltage measurement wiring is for measurement purposes and does not need to carry a large current like the power supply wiring, it can be thin and can be placed without being large.

[0103] (3) A power supply unit for an aerosol generating device described in (1) or (2), wherein the substrate has a first surface (rear surface 502) on which the power conversion device and / or the heating switch are mounted, and a second surface (front surface 501) opposite the first surface on which the power supply connection portion is mounted.

[0104] According to (3), by arranging the heating element such as the power conversion device or heating switch and the power supply connection part on different sides of the substrate, it is possible to arrange the heating element and the power supply connection part closer to each other.

[0105] (4) A power supply unit for the aerosol generating device described in (3), wherein the voltage measurement wiring includes a via (via 521a) connecting the first surface and the second surface, and wiring (signal track 521b) formed on at least one of the first surface and the second surface.

[0106] According to (4), the voltage measurement wiring can be formed simply.

[0107] (5) The power supply unit of the aerosol generation device according to (4), wherein the voltage measurement wiring is connected to the power supply connection portion on the second surface.

[0108] According to (5), the power supply voltage can be utilized at a position close to the power supply connection portion.

[0109] (6) A power supply unit for an aerosol generating device according to (3), wherein the substrate has a multilayer structure, and the voltage measurement wiring includes wiring formed in a layer between the first surface and the second surface.

[0110] According to (6), even if there is not enough space on the surface of the substrate, the voltage measurement wiring can be formed by utilizing the interface of the multilayer structure.

[0111] (7) A power supply unit for an aerosol generating device described in any one of (1) to (6), wherein the power conversion device has a heating unit connection pin (heating unit connection pin Po) that supplies power to the heating unit via the heating switch, and a feedback pin (feedback pin Pf) that measures the output voltage from the heating unit connection pin to the heating switch, wherein a plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch, an element is electrically connected to one of the plurality of vias, and the feedback pin obtains the output voltage through a via of the plurality of vias that is closer to the heating switch than the via to which the element is electrically connected.

[0112] According to (7), the power conversion device wants to detect the power supply voltage at a position as close to the heating unit as possible for feedback control, and since the output voltage is measured through one of the multiple vias in the wiring between the heating unit connection pin and the heating switch that is closer to the heating switch than other elements, the accuracy of heating control can be improved.

[0113] (8) The power supply unit of the aerosol generating device according to (7), wherein the elements are capacitors (capacitors C1 to C3).

[0114] According to (8), it is possible to suppress an inrush current from flowing through the power conversion device.

[0115] (9) The power supply unit of the aerosol generating device according to (8), wherein the capacitor is connected to the heating unit connection pin and ground.

[0116] According to (9), it is possible to suppress an inrush current from flowing through the power conversion device.

[0117] (10) A power supply unit for an aerosol generating device described in any one of (1) to (9), wherein the power conversion device has a heating unit connection pin (heating unit connection pin Po) that supplies power to the heating unit via the heating switch, and a feedback pin (feedback pin Pf) that measures the output voltage from the heating unit connection pin to the heating switch, wherein a plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch, and the feedback pin obtains the output voltage through one of the plurality of vias that is closest to the heating switch.

[0118] According to (10), the power conversion device wants to detect the power supply voltage at a position as close to the heating unit as possible for feedback control, and since the output voltage is measured through the via that is closest to the heating switch among the multiple vias in the wiring between the heating unit connection pin and the heating switch, the accuracy of heating control can be improved.

[0119] (11) A power supply unit for an aerosol generating device described in any one of (1) to (10), wherein the power conversion device has a power supply connection pin (power supply connection pin Pb) to which the voltage of the power supply is input, the substrate has a multi-layer structure, and the power supply wiring (power supply wiring 520) connecting the power supply connection part and the power supply connection pin of the charging IC and the power supply wiring (power supply wiring 510) connecting the power supply connection part and the power supply connection pin of the power conversion device share wiring in multiple layers.

[0120] According to (11), when heating and charging are not performed simultaneously, part of the wiring can be shared by the power supply wiring and the charging wiring, thereby making it possible to reduce the size of the substrate.

[0121] (12) A power supply unit for an aerosol generating device described in any one of (3) to (6), comprising an operational amplifier (operational amplifier 87) for measuring the resistance of the heating section, the operational amplifier being mounted on the first surface.

[0122] According to (12), the signal-to-noise ratio (SNR) for measuring the heater resistance value is more important than the drift error due to heat generation, so placing the amplifier on the same surface as the heating element improves the SNR.

[0123] (13) A power supply unit for an aerosol generating device according to any one of (3) to (6) and (12), comprising a protection IC (protection IC 83) for protecting the power supply, the protection IC being arranged on the second surface.

[0124] According to (13), since the protection IC is prone to errors when heated to high temperatures, deterioration of control accuracy can be suppressed by mounting it on the side opposite to the heating element, which is a heat-generating element.

[0125] (14) An aerosol generating device (inhalation device 100A, 100B, 100) comprising: a heating unit (heating unit 121A-121C) that heats an aerosol source (stick-shaped substrate 150); a power supply (power supply unit 111A-111C) that supplies power to the heating unit; a power conversion device (step-up DC / DC converter 82) that converts power from the power supply and supplies heating power to the heating unit and / or a heating switch (heating switch 85) that controls the power supply to the heating unit; a charging IC (charging IC 81) that receives power from an external power supply and controls the power supply to be supplied with charging power to the power supply; and a substrate (main substrate 50) that mounts the charging IC, a power supply connection unit (power supply connection unit 51) to which power from the power supply is supplied, and the power conversion device and / or the heating switch, wherein the charging IC has a power supply voltage measurement pin (power supply voltage measurement pin Ps) that measures the voltage of the power supply, and a power supply connection pin (power supply connection pin Pb) to which the voltage of the power supply is input, An aerosol generating device in which at least one of the power conversion device and the heating switch is positioned closer to the power supply connection part than the charging IC, and the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection part than the power supply connection pin in the power supply wiring (power supply wiring 520) that connects the power supply connection part and the power supply connection pin via a voltage measurement wiring (voltage measurement wiring 521).

[0126] According to (11), by arranging a heating element such as a power converter or a heating switch near the power supply connection, the power supply wiring through which a large current flows can be shortened, thereby reducing power loss and improving heating efficiency. Meanwhile, although the charging IC is arranged farther away from the heating element due to space constraints, the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection than the power supply connection pin on the power supply wiring connecting the power supply connection and the power supply connection pin via the voltage measurement wiring. Therefore, rather than using the power supply voltage input to the power connection pin, the charging IC can utilize the power supply voltage at a position closer to the power supply connection on the power supply wiring through which a large current flows. This improves heating efficiency and maintains charging control accuracy. Since the voltage measurement wiring is a measurement wiring and does not need to carry a large current like the power supply wiring, it can be a thin wiring and can be arranged without being large.

[0127] DESCRIPTION OF SYMBOLS 50 Main board (board) 51 Power supply connection part 81 Charging IC 82 Step-up DC / DC converter (power conversion device) 83 Protection IC 85 Heating switch 87 Operational amplifier (amplifier) ​​100A Suction device (aerosol generation device) 100 Suction device (aerosol generation device, power supply unit) 100B Suction device (aerosol generation device, power supply unit) 110 Power supply unit 111A Power supply part (power supply) 111B Power supply part (power supply) 111C Power supply part (power supply) 121A Heating part 121B Heating part 121C Heating part 150 Stick-shaped substrate (aerosol source) 501 Surface (second surface) 502 Back surface (first surface) 510 Power supply wiring (power supply wiring connecting the power supply connection part and the power supply connection pin of the power conversion device) 520 Power supply wiring (power supply wiring connecting the power supply connection part and the power supply connection pin of the charging IC) 521 Voltage measurement wiring 521a Via 521b Signal track (wiring) C1 to C3 Capacitor Pf Feedback pin Ps Power supply voltage measurement pin Pb Power supply connection pin Po Heating unit connection pin

Claims

1. a power supply that supplies power to a heating unit that heats the aerosol source; a power converter that converts power from the power source and supplies heating power to the heating unit and / or a heating switch that controls power supply to the heating unit; a charging IC that receives power from an external power source and controls the power source to supply charging power; a power supply unit for an aerosol generating device, the power supply unit comprising: a board on which the charging IC, a power supply connection portion to which power from the power supply is supplied, the power conversion device and / or the heating switch are mounted; The charging IC is a power supply voltage measurement pin for measuring the voltage of the power supply; a power supply connection pin to which the voltage of the power supply is input, At least one of the power conversion device and / or the heating switch is disposed closer to the power supply connection part than the charging IC, A power supply unit for an aerosol generating device, wherein the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection part than the power supply connection pin in the power supply wiring connecting the power supply connection part and the power supply connection pin via a voltage measurement wiring.

2. a power supply that supplies power to a heating unit that heats the aerosol source; a power converter that converts power from the power source and supplies heating power to the heating unit and / or a heating switch that controls power supply to the heating unit; a charging IC that receives power from an external power source and controls the power source to supply charging power; a power supply unit for an aerosol generating device, the power supply unit comprising: a board on which the charging IC, a power supply connection portion to which power from the power supply is supplied, the power conversion device and / or the heating switch are mounted; The charging IC is a power supply voltage measurement pin for measuring the voltage of the power supply; a power supply connection pin to which the voltage of the power supply is input, a wiring distance between at least one of the power conversion device and / or the heating switch and the power supply connection part is shorter than a wiring distance between the charging IC and the power supply connection part; A power supply unit for an aerosol generating device, wherein the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection part than the power supply connection pin in the power supply wiring connecting the power supply connection part and the power supply connection pin via a voltage measurement wiring.

3. A power supply unit for the aerosol generating device according to claim 1 or 2, The substrate is a first surface on which the power converter and / or the heating switch are mounted; A power supply unit for an aerosol generating device having a second surface opposite the first surface, on which the power supply connection portion is mounted.

4. A power supply unit for the aerosol generating device according to claim 3, A power supply unit for an aerosol generating device, wherein the voltage measurement wiring includes a via connecting the first surface and the second surface, and wiring formed on at least one of the first surface and the second surface.

5. A power supply unit for the aerosol generating device according to claim 4, A power supply unit of an aerosol generating device, wherein the voltage measurement wiring is connected to the power supply connection portion on the second surface.

6. A power supply unit for the aerosol generating device according to claim 3, the substrate has a multilayer structure; A power supply unit for an aerosol generating device, wherein the voltage measurement wiring includes wiring formed in a layer between the first surface and the second surface.

7. A power supply unit for the aerosol generating device according to claim 1 or 2, The power conversion device is a heating unit connection pin for supplying power to the heating unit via the heating switch; a feedback pin for measuring an output voltage from the heating unit connection pin to the heating switch; a plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch; an element is electrically connected to any one of the plurality of vias; A power supply unit for an aerosol generating device, in which the feedback pin obtains the output voltage through one of the plurality of vias that is closer to the heating switch than the via to which the element is electrically connected.

8. A power supply unit for the aerosol generating device according to claim 7, The power supply unit of the aerosol generating device, wherein the element is a capacitor.

9. A power supply unit for the aerosol generating device according to claim 8, A power supply unit for an aerosol generating device, wherein the capacitor is connected to the heating portion connection pin and ground.

10. A power supply unit for the aerosol generating device according to claim 1 or 2, The power conversion device is a heating unit connection pin for supplying power to the heating unit via the heating switch; a feedback pin for measuring an output voltage from the heating unit connection pin to the heating switch; a plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch; A power supply unit for an aerosol generating device, wherein the feedback pin obtains the output voltage through one of the plurality of vias that is closest to the heating switch.

11. A power supply unit for the aerosol generating device according to claim 1 or 2, The power conversion device is a power supply connection pin to which the voltage of the power supply is input; the substrate has a multilayer structure; A power supply unit for an aerosol generating device, in which the power supply wiring connecting the power supply connection unit and the power supply connection pin of the charging IC and the power supply wiring connecting the power supply connection unit and the power supply connection pin of the power conversion device share wiring in multiple layers.

12. A power supply unit for the aerosol generating device according to claim 3, an operational amplifier for measuring the resistance of the heating unit; The operational amplifier is a power supply unit of the aerosol generating device mounted on the first surface.

13. A power supply unit for the aerosol generating device according to claim 3, a protection IC for protecting the power supply; The power supply unit of the aerosol generating device, wherein the protection IC is arranged on the second surface.

14. a heating unit that heats the aerosol source; a power source for supplying power to the heating unit; a power converter that converts power from the power source and supplies heating power to the heating unit and / or a heating switch that controls power supply to the heating unit; a charging IC that receives power from an external power source and controls the power source to supply charging power; a substrate on which the charging IC, a power supply connection portion to which power from the power supply is supplied, the power conversion device and / or the heating switch are mounted, The charging IC is a power supply voltage measurement pin for measuring the voltage of the power supply; a power supply connection pin to which the voltage of the power supply is input, At least one of the power conversion device and the heating switch is disposed closer to the power supply connection part than the charging IC, An aerosol generating device in which the power supply voltage measurement pin of the charging IC is connected to a position closer to the power supply connection portion than the power supply connection pin on the power supply wiring connecting the power supply connection portion and the power supply connection pin via a voltage measurement wiring.