Information processing device and control device

Abstract

This information processing device comprises a first coil, a second coil which is disposed alongside a surface around which the first coil is wound, and which receives a signal transmitted from the first coil, by magnetic field coupling, and a calculating unit which calculates a state of a substance by detecting a state of communication between the first coil and the second coil, wherein the substance is disposed between the first coil and the second coil, and the state of communication is associated with a change in the substance. The information processing device comprises the first coil, the second coil which receives the signal transmitted from the first coil, by magnetic field coupling, a supporting unit for supporting the first coil and the second coil, and the calculating unit which detects the state of communication between the first coil and the second coil, and calculates the state of the substance, separate from the supporting unit, that is disposed between the first coil and the second coil, wherein the state of communication and the state of the substance are associated in advance.

Description

Information processing device and control device

[0001] The present invention relates to an information processing device and a control device.

[0002] A pressure sensor is described in Patent Document 1. [Prior art documents] [Patent documents] [Patent document 1] JP-A-6-137978 General disclosure

[0003] In a first aspect of the present invention, an information processing device comprises a first coil, a second coil arranged in line along the surface on which the first coil is wound and receiving a signal transmitted from the first coil by magnetic field coupling, and a calculation unit that calculates the state of a substance by detecting the state of communication between the first coil and the second coil, wherein a substance is arranged between the first coil and the second coil, and the state of communication is related to a change in the substance.

[0004] The calculation unit may detect a change in the communication state, calculate the change in the state of the substance, and output the result. The first coil and the calculation unit may be integrated as a first chip separate from the second coil. The calculation unit may be disposed inside the first coil. The first coil may be movably disposed based on a volume change of the substance disposed therebetween, and the calculation unit may calculate a value based on the volume change of the substance. The information processing device may transmit information on the state of the substance calculated by the calculation unit to the outside using at least one of the first coil and the second coil. The information processing device according to claim 1, wherein the second coil is disposed on a second chip separate from the first coil.

[0005] A control device comprising the above-mentioned information processing device and a control unit that controls the state of the substance, wherein the control unit may control the state of the substance based on information on the state of the substance calculated by the calculation unit.

[0006] In a second aspect of the present invention, an information processing device includes a first coil, a second coil that receives a signal transmitted from the first coil by magnetic field coupling, a support unit that supports the first coil and the second coil, and a calculation unit that detects the state of communication between the first coil and the second coil and is separate from the support unit and calculates the state of a substance disposed between the first coil and the second coil, and the state of communication and the state of the substance are pre-associated.

[0007] The above summary of the invention does not list all of the features of the present invention, and subcombinations of these features may also be inventions.

[0008] 1A and 1B are schematic diagrams showing a control device 10 according to the present embodiment; an information processing device 20 having two separate chips 100 and 200; an equivalent circuit showing the characteristics of the transmitting coil 110 of the chip 100 and the receiving coil 212 of the chip 200; a side view of the information processing device 20; a schematic diagram showing the relationship between the material 82 calculated by the information processing device 20 and the chips 100 and 200; an example of the relationship between the communication distance x and the coupling coefficient k; and an example of the voltage induced in the receiving coil 212. an information processing device 22 having two separate chips 102 and 202; another information processing device 24 having two separate chips 100 and 200; another information processing device 25 having two separate chips 100 and 200; an information processing device 26 having three or more separate chips; and another information processing device 27 having two separate chips 100 and 200. 1A and 1B are schematic diagrams showing an information processing device 28 having three or more separate chips; 1C are schematic diagrams showing an information processing device 29 using a chip 100 and a control unit 30 other than the chip; 1D are diagrams showing other examples of the outer shape of a chip 90; 1E are diagrams showing other examples of the outer shape of a chip 92;

[0009] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention as claimed. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0010] 1 is a schematic diagram of a control device 10 according to this embodiment. The control device 10 includes an information processing device 20 having a plurality of chips 60, a control unit 30 that controls the state of a substance, an operation unit 40 that is operated by a user, and a display unit 50 that displays the state of the substance, etc.

[0011] The information processing device 20 calculates the state of a substance using multiple chips 60 and functions as a measurement unit. The control unit 30 controls the state of the substance based on the information on the state of the substance calculated by the information processing device 20. The control unit 30, operation unit 40, and display unit 50 may be an information processing device such as a personal computer. Calculating the state of a substance means calculating one or more values ​​or amounts of change for, for example, volume, temperature, vibration, pressure, electromagnetic waves, volume, humidity, etc.

[0012] 2 is a schematic diagram of an information processing device 20 having two separate chips 100 and 200. The information processing device 20 includes a support member 70, and chips 100 and 200 supported on the support member 70 with a gap 80 between them. The chips 100 and 200 communicate with each other through magnetic field coupling. Communication through magnetic field coupling is a transmission method that uses the principle of electromagnetic induction to transmit information. Communication through magnetic field coupling also includes communication through inductive coupling and communication through magnetic field resonance or magnetic field resonance that utilizes the resonance phenomenon of transmitting and receiving coils.

[0013] The chip 100 includes a transmitting coil 110, a transmitting circuit 120 that supplies signals to the transmitting coil 110, an arithmetic circuit 130 that performs calculations related to the signals, a memory unit 132 that stores a table 134 related to the signals, a receiving coil 112, a receiving circuit 122 that detects signals generated in the receiving coil 112, and a power supply 140 that supplies power to the arithmetic circuit 130 and the like.

[0014] The chip 100 has a rectangular plate-like outer shape. In the chip 100, the transmitter coil 110 and receiver coil 112 are arranged to surround the outer periphery of the chip body, and are approximately rectangular. In addition, the transmitter circuit 120, arithmetic circuit 130, receiver circuit 122, and power supply 140 are arranged inside the transmitter coil 110 and receiver coil 112. The surfaces on which the transmitter coil 110 and receiver coil 112 are wound are parallel to the main surface of the chip 100.

[0015] The power supply 140 has at least one of a power receiving function for receiving power from outside the chip, a power storage function for storing power inside the chip, and a power generation function for generating power inside the chip. The arithmetic circuit 130 may be formed by, for example, a CPU.

[0016] Similarly, chip 200 includes a transmitting coil 210, a transmitting circuit 220, an arithmetic circuit 230, a memory unit 232 that stores table 234, a receiving coil 212, a receiving circuit 222, and a power supply 240. In this embodiment, chip 200 has the same configuration as chip 100 unless otherwise specified, and therefore description thereof will be omitted.

[0017] As shown in Figure 2, chips 100 and 120 are positioned close to each other, enabling wireless communication between the coils using magnetic field coupling. The above-described configuration of chips 100 and 120 is formed on a semiconductor substrate and molded with resin to form an IC. The length of one side of chips 100 and 120 and the coils can be reduced to approximately 300 μm, and the distance between coils on adjacent chips can be reduced to approximately 40 μm.

[0018] 3 is an equivalent circuit showing the characteristics of the transmitter coil 110 of the chip 100 and the receiver coil 212 of the chip 200. The receiver voltage Vrx is obtained by multiplying the first-order differential waveform of the transmitter current Itx by the second-order low-pass filter characteristics on the transmitter and receiver sides. The transmitter low-pass filter characteristics are represented by the resistance Rtx, capacitance Ctx, and inductance Ltx, while the receiver low-pass filter characteristics are represented by the resistance Rrx, capacitance Crx, and inductance Lrx. The amplitude of the receiver voltage Vrx is proportional to the transmitter current Itx and the coupling coefficient k.

[0019] For example, when transmitting a signal from chip 100 to chip 200, arithmetic circuit 130 of chip 100 reads the signal to be transmitted from memory unit 132 and causes current Itx corresponding to the signal to flow from transmission circuit 120 to transmission coil 110. A voltage Vrx is generated in reception coil 212 of chip 200 due to inductive coupling with transmission coil 110, and reception circuit 222 detects this voltage Vrx, which is then read as a signal by arithmetic circuit 230.

[0020] FIG. 4 is a schematic side view of the information processing device 20. The chip 100 has a long hole 154 on its side surface. A flat protrusion 152 provided on a connecting member 74 disposed on a support member 70 is inserted into the long hole 154. This allows the chip 100 to move in the x direction in the figure, which is the direction of the main surface of the chip 100. Meanwhile, the chip 200 is fixed to the connecting member 74 disposed on the support member 70. Therefore, the chip 100 moves relatively closer to or farther away from the chip 200 in the direction of their main surfaces. In this case, it is preferable that the chips do not come into contact even when they are closest to each other, i.e., that a gap 80 exists.

[0021] FIG. 5 schematically shows the relationship between the material 82 computed by the information processing device 20 and the chips 100 and 200. An example of the material 82 is a material whose volume changes with temperature or pressure. The material 82 is sandwiched between the opposing sides of the chips 100 and 200. For example, the material 82 may be attached to both sides. State 310 is a steady state, in which the material 82 is sandwiched between the chips 100 and 200 with an initial width L0. When the material 82 expands from the steady state to a width L1, the chip 100 moves away from the chip 200, as shown in state 312. On the other hand, when the material 82 contracts from the steady state to a width L2, the chip 100 moves toward the chip 200, as shown in state 314.

[0022] Fig. 6 shows an example of the relationship between the communication distance x and the coupling coefficient k. As shown in Fig. 6, if the coil diameter D is constant, the coupling coefficient k decreases monotonically with the communication distance x. Here, there is a positive correlation between the coupling coefficient k and the voltage Vr on the receiving side generated by magnetic field coupling.

[0023] Fig. 7 shows an example of the voltage induced in the receiving coil 212. Fig. 7 shows the case where one rectangular pulse signal is transmitted from the chip 100. The dashed line corresponds to state 310 in Fig. 4, which is the steady state, and the solid line corresponds to state 312.

[0024] 7, positive induced voltages V0 and V1 are induced in the receiving coil 212 in response to the rising edges of the rectangular pulse signal, and negative induced voltages −V0 and −V1 are induced in response to the falling edges of the signal. The absolute values ​​of these induced voltages are smaller in state 312 where the chips are far apart than in state 310 where the chips are close together (V0>V1).

[0025] Therefore, if the relationship between the voltage Vr on the receiving side and the distance x' between the chips is stored in advance as a numerical value in table 234, arithmetic circuit 230 can calculate the distance x' between chip 100 and chip 200 by referring to table 234 based on the voltage Vr detected by receiving circuit 222. Here, distance x' is the communication distance x minus the outer periphery of the chip that is outside the coils. Because the relative position of each coil with respect to the outer periphery of the chip is fixed, calculating distance x' between chip 100 and chip 200 makes it possible to calculate the expansion and contraction as an example of the state of material 82, and as a result, the increase or decrease in volume.

[0026] In other words, what is calculated is not the state of support member 70, but the state of material 82 present between chip 100 and chip 200, which is separate from support member 70. Note that, as voltage Vr on the receiving side, either the positive induced voltage corresponding to the rising edge of the pulse signal or the negative induced voltage corresponding to the falling edge may be used, or the difference between them may be used, or the average value of them may be used.

[0027] The arithmetic circuit 230 sets the received signal to High when the induced positive voltage exceeds a predetermined threshold, and sets the received signal to Low when the induced negative voltage subsequently falls below the predetermined threshold. This allows digital signals to be transmitted and received between the chips 100 and 200. The predetermined threshold can be set slightly lower than the voltage expected to be excited on the receiving side when the chips 100 and 200 are at their furthest distance from each other, for example. In addition, the magnitude of the induced voltage can be considered to be the strength of the received signal, and can also be considered to be an example of the communication state.

[0028] As described above, according to this embodiment, the state of the substance 82 present between the chips 100 and 200 can be measured based on the voltage Vr associated with the distance x' between the chips. The chips 100 and 200 can be miniaturized because they communicate without using wiring. Furthermore, the distance between the chips 100 and 200 can be narrowed, making it possible to measure detailed changes in the state of the substance 82.

[0029] The chip 200 may use the transmitting coil 210 to transmit a signal indicating the state of the substance 82, which is the result of the calculation performed by the arithmetic circuit 230, to an external device, for example, the control unit 30 of the control device 10. The control device 10 may display the received signal on the display unit 50 so that the state of the substance 82 can be visually recognized by the user.

[0030] In this case, the chip 200 may transmit information specific to the chip 200, such as the position where the chip 200 is disposed and identification information assigned to the chip 200, in addition to the signal indicating the state of the substance 82. The position, identification information, etc. may be stored in advance in the storage unit 232, and may be read out by the arithmetic circuit 230. Furthermore, the calculation results may be output to the outside via multiple chips 60 by sequentially transmitting and receiving the results between three or more adjacent chips 60 in a so-called bucket brigade manner.

[0031] 7 shows an example in which one rectangular pulse signal is transmitted and received, but the signal is not limited to this. For example, a triangular wave may be used, and the number of pulses may be multiple. Furthermore, the signal may be a signal in which information specific to the chip 100, such as an identification number stored in the memory unit 132 of the chip 100, is expressed by the width and number of pulses. In this case, the pulse period is preferably, for example, about 0.2 ns, which is short enough to detect changes in the state of the material 82.

[0032] In the above description, table 234 shows an example of the relationship between voltage Vr on the receiving side and distance x' between the chips. Alternatively, if there is a correlation, such as a monotonic increase or decrease, between the expansion and contraction of material 82 and another physical quantity, table 234 showing the relationship between voltage Vr on the receiving side and the physical quantity may be used to calculate the physical quantity as the state of material 82. For example, if material 82 has the property of expanding more as its temperature increases, table 234 may be used to associate voltage Vr on the receiving side with the temperature of material 82 in advance, and arithmetic circuit 230 may calculate and output the temperature of material 82 from the received voltage Vr by referring to table 234.

[0033] Table 234 may relate the values ​​using a mathematical formula instead of a numerical value. Furthermore, table 234 may be externally rewritable. Furthermore, arithmetic circuit 230 may output a change in state instead of the state itself, such as the width of material 82, shown in table 234. For example, table 234 may relate the receiving-side voltage V1 in state 312 relative to the receiving-side voltage V0 in state 310 in FIG. 5 , and the difference in width (L1 - L0) of material 82 in those states, and arithmetic circuit 230 may output the width difference (L1 - L0) as the change in state of material 82. In this way, arithmetic unit 230 may store multiple formulas or tables for calculating the state of material 82, and may select one or more of them as appropriate. Furthermore, arithmetic unit 230 may calculate multiple values, such as temperature and pressure, for the same change in state of material 82.

[0034] 8 is a schematic diagram of another information processing device 22 having two separate chips 102 and 202. In the information processing device 22, the same components as those in the information processing device 20 are designated by the same reference numerals and will not be described.

[0035] The chip 102 of the information processing device 22 includes a transmitting coil 110, a transmitting circuit 120 that supplies signals to the transmitting coil 110, a memory unit 132 that stores a table 134 related to the signals, and a power supply 140 that supplies power to the arithmetic circuit 130, etc. On the other hand, the chip 202 includes an arithmetic circuit 230 that performs calculations related to the signals, a memory unit 232 that stores a table 234 related to the signals, a receiving coil 212, a receiving circuit 222 that detects signals generated in the receiving coil 212, and a power supply 240 that supplies power to the arithmetic circuit 230, etc.

[0036] Chip 102 is a transmitting chip, and chip 202 is a receiving chip, and communication is performed from chip 102 to chip 202 by magnetic field coupling. Information processing device 22 can also calculate the state of the material present in gap 80 based on the receiving voltage Vr, which is based on the distance between chips 102 and 202.

[0037] 9 is a schematic diagram of another information processing device 24 having two separate chips 100 and 200. In the information processing device 24, the same components as those in the information processing device 20 are given the same reference numerals and descriptions thereof will be omitted.

[0038] In the information processing device 24, a flange portion 78 is provided on the bottom surface of the chip 100 via a columnar connecting member 76. The support member 70 is provided with a wall portion 160 that houses the flange portion 78, and a lid portion 162 that is provided on the upper surface of the wall portion 160 and protrudes further toward the connecting member 76 than the wall portion 160. Gaps are provided in the X and Y directions between the wall portion 160 and the flange portion 78, and between the lid portion 162 and the connecting member 76. Therefore, the chip 100 can move freely in the X and Y directions, i.e., in the direction of the main surface of the chip 100, as long as the wall portion 160 and the flange portion 78, or the lid portion 162 and the connecting member 76, do not come into contact with each other. Furthermore, because the opening of the lid portion 162 is narrower than the flange portion 78, the flange portion 78 can be prevented from slipping out of the opening.

[0039] In the information processing device 24, the state of the material present in the gap 80 between the chips 100 and 200 can also be measured based on the distance between them. Furthermore, if the chips 100 and 200 are structured to be vibrable in the Y direction, the coupling coefficient k also changes depending on the misalignment of the chips 100 and 200 in the Y direction, so the state of the material in the Y direction can also be measured.

[0040] 10 is a schematic diagram of another information processing device 25 having two separate chips 100 and 200. In the information processing device 25, the same components as those in the information processing device 20 are given the same reference numerals and descriptions thereof will be omitted.

[0041] In the information processing device 25, a flange portion 78 is provided on the bottom surface of the chip 100 via a columnar connecting member 76. A shaft 156 extends in the Y direction from the connecting member 76 and is inserted into a bearing 158 provided on the chip 100. This allows the chip 100 to rotate around the shaft 156 within the XZ plane.

[0042] In the information processing device 25, when the main surface of the chip 100 rotates up or down from a steady state in the XY plane, the coupling coefficient k changes. Therefore, in the information processing device 25, by previously correlating the voltage Vr induced on the receiving side with the angle θ of rotation, the angle θ can be calculated from the voltage Vr. Furthermore, if there is a specific correlation between the state of matter between the chips 100 and 200 and the angle θ of the chip 100, by previously correlating them, the state of the matter can be calculated from the voltage Vr. In this case, the voltage Vr and the state of the matter may also be directly correlated.

[0043] The chips 100 and 102 are movable in the information processing devices 20, 22, 24, and 25. Alternatively, the chips 200 and 202 may be movable.

[0044] 11 is a schematic diagram of an information processing device 26 having three or more separate chips. The information processing device 26 has nine chips arranged in groups of three in the X and Y directions. Each of the nine chips 60 to 68 may be any one of the chips 100, 102, 200, and 202 shown in FIGS. 2 and 8.

[0045] Of the nine chips, any one may be movable and any one may be fixed. For example, every other chip may be movable and fixed. Specifically, chips 60, 62, 64, 66, and 68 may be movable, and chips 61, 63, 65, and 67 may be fixed. An example of a movable mechanism is shown in FIG. 9.

[0046] In the above example of movable and fixed chips, if chip 64 moves in the X direction, the coupling coefficient k between chip 63 and / or chip 65, which are adjacent to chip 64 on both sides in the X direction, changes. If chip 64 moves in the Y direction, the coupling coefficient k between chip 64 and chip 61 and / or chip 67, which are adjacent to chip 64 on both sides in the Y direction, changes. Therefore, the information processing device 26 can detect the movement of chip 64 in both the X and Y directions. Therefore, by using the method described in the information processing device 20, the states of matter between chip 64 and other chips adjacent to it in the X and Y directions can be calculated.

[0047] As described above, chip 64 communicates with multiple chips, for example, chips 61, 63, 65, and 67. In this case, communication may be performed in a time-division manner in a predetermined order. Furthermore, the signal to be communicated may include information that identifies the chip itself or that identifies its position relative to chip 64. This information may be stored in the storage unit of each chip. As described above, since the pulse period is on the order of sub-nanoseconds, even when communication is performed in a time-division manner, changes in the state of a substance can be calculated with a time resolution of the order of microseconds.

[0048] In the information processing device 26, the movable mechanism shown in Fig. 4 or 10 may be used instead of the movable mechanism shown in Fig. 9. Furthermore, the movable mechanisms shown in Fig. 4, 9, and 10 may be mixed for each chip.

[0049] 12 is a schematic diagram of another information processing device 27 having two separate chips 100 and 200. In the information processing device 27, the same components as those in the information processing device 20 are denoted by the same reference numerals, and the description thereof will be omitted.

[0050] In the information processing device 27, the chip 100 and the chip 200 are fixed on the support member 70 with a gap 80 between them. That is, the relative positions of the chip 100 and the chip 200 are fixed.

[0051] When a material 82 having a magnetic permeability different from that of the surroundings, for example, air, enters the gap 80, the voltage Vr induced on the receiving side changes compared to when there is no material 82. For example, if the magnetic permeability of the material 82 is greater than that of air, the voltage Vr increases as the volume of the material 82 that enters the gap 80 increases.

[0052] Therefore, the voltage Vr on the receiving side and the amount of material 82 inserted into gap 80 in the Y direction in the figure are associated in advance and stored in storage unit 232 as table 234. As a result, in information processing device 27, as in information processing device 20, by communication from chip 100 to chip 200 via magnetic field coupling, arithmetic circuit 230 calculates the insertion position as a state of material 82 based on voltage Vr induced in chip 200. In addition, while information processing device 20 etc. detects voltage Vr based on the positions of chip 100 and chip 200, it can be said that information processing device 27 detects voltage Vr based on the magnetic permeability between chip 100 and chip 200.

[0053] 13 is a schematic diagram of an information processing device 28 having three or more separate chips. The information processing device 28 has 49 chips, arranged in groups of seven in the X and Z directions. Each of the 49 chips may be any of the chips 100, 102, 200, and 202 shown in FIGS. 2 and 8, but their relative positions are fixed.

[0054] The information processing device 28 is disposed, for example, along one side of a container containing a liquid 84. In addition, the liquid 84 is an example of the substance 82. The Z direction in Fig. 13 indicates the vertically upward direction.

[0055] As a result, when the liquid 84 fills from liquid level A to liquid level B, the air between the adjacent chips in the vicinity is replaced by the liquid 84. For example, between the chip 60 and the chip 63 adjacent in the X direction, there is air when the liquid level is A, but when the liquid level is B, the space is about half filled with the liquid 84. Therefore, by using the method described for the information processing device 27, the information processing device 28 can calculate the position of the liquid level, which is an example of the state of matter between the chip 60 and the chip 63 adjacent in the X direction.

[0056] The liquid level calculation in the information processing device 28 can also use the chips 60 and 61 adjacent in the Z direction. Furthermore, the information processing device 28 may calculate the position of the liquid level using both the result of calculation using the chips 60 and 63 adjacent in the X direction and the result of calculation using the chips 60 and 61 adjacent in the Z direction. Furthermore, by using the chips 60, 61, 62, 63, 64, and 65 aligned in the X and Z directions, the liquid level can be measured more accurately even when the liquid level remains tilted for a certain period of time, such as with a highly viscous liquid 84.

[0057] 14 is a schematic diagram of an information processing device 29 using the chip 100 and a control unit 30 other than the chip. In the information processing device 29, the same components as those in the information processing device 20 are given the same reference numerals and will not be described.

[0058] The information processing device 29 includes a chip 100, a control unit 30 other than the chip, and a coil 12 connected to the control unit 30 and extending to a position adjacent to the chip 100. This allows the chip 100 and the control unit 30 to communicate by magnetic field coupling. In this case, as with the information processing device 20, the state of the material between the chip 100 and the coil 12 can be calculated. Note that in the information processing device 29, the chip 100 may be on the transmitting side and the control unit 30 on the receiving side, or the control unit 30 may be on the transmitting side and the chip 100 on the receiving side.

[0059] FIG. 15 shows another example of the outer shape of the chip 90. In FIGS. 1 to 14, the chip is rectangular and the coil is also approximately rectangular. The chip and coil may have other shapes. For example, like the chip 90, the outer shape may be a hexagonal plate, and the coil may also be approximately hexagonal. The arrangement of multiple chips 90 may also be honeycomb-shaped.

[0060] Fig. 16 shows another example of the outer shape of the chip 92. In the example of Fig. 16, the chip 92 has a circular plate-like outer shape, and the coil is also circular.

[0061] The timing of starting and ending the calculation of the substance state may be specified by the user using the operation unit 40. Alternatively, a timer may be provided in the transmitting chip to transmit a signal at predetermined time intervals, and a voltage may be induced in the receiving chip in response to the signal, which then performs calculations based on the induced voltage. The results of the calculations may be output each time a calculation is performed, or may be stored in the memory unit 232 of the receiving chip 200 and output all at once at predetermined times.

[0062] The substance 82 disposed between adjacent chips may be gas, liquid, or solid. If there is some correlation between the state of the substance 82 and the state of communication between adjacent chips, by relating them in advance, it is possible to calculate the state of the substance 82 from the state of communication as described above. In addition to the volume described above, examples of the state of the substance 82 include temperature, vibration, pressure, electromagnetic waves, volume, and humidity.

[0063] In FIG. 7 , an example of the voltage Vr induced on the receiving side has been described as the communication state for calculating the state of the substance 82. However, the communication state is not limited to this. For example, the communication state may be a current flowing in the receiving circuit due to the voltage Vr. As yet another example, the communication state may be the "amplitude of waveform distortion."

[0064] The control unit 30 of the control device 10 controls the state of the substance 82 based on the state or change in state of the substance 82 calculated by the information processing device 20 or the like. That is, a feedback system can be configured. For example, in the example of FIG. 13 , the control unit 30 may receive liquid level information from the information processing device 29 and control the amount of inflow and / or outflow of the liquid 84 into the container in which the information processing device 29 is provided. Alternatively, the control unit 30 of the control device 10 may control the position of the movable tip 100 or the magnitude of the transmitted current based on the state or change in state of the substance 82 calculated by the information processing device 20 or the like.

[0065] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0066] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order.

[0067] 10 Control device, 12 Coil, 20, 22, 24, 25, 26, 27, 28, 29 Information processing device, 30 Control unit, 40 Operation unit, 50 Display unit, 60, 61, 62, 63, 64, 65, 66, 67, 68, 90, 92, 100, 102, 200, 202 Chip, 70 Support member, 72, 74, 76 Connection member, 78 Flange portion, 80 Gap, 82 Substance, 84 Liquid, 110, 210 Transmitting coil, 112, 212 Receiving coil, 120, 220 Transmitting circuit, 122, 222 Receiving circuit, 130, 230 Arithmetic circuit, 132, 232 Memory unit, 134, 234 Table, 140, 240 Power supply, 152 Protrusion, 154 Slot, 156 Shaft, 158 bearing, 160 wall portion, 162 lid portion

Claims

1. An information processing device comprising: a first coil; a second coil arranged in parallel along a surface around which the first coil is wound and which receives a signal transmitted from the first coil by magnetic field coupling; and a calculation unit which calculates a state of a substance by detecting a state of communication between the first coil and the second coil, wherein the substance is arranged between the first coil and the second coil, and the state of communication is related to a change in the substance.

2. The information processing device according to claim 1, wherein said calculation unit detects a change in the state of said communication, calculates and outputs the change in the state of said substance.

3. The information processing device according to claim 1, wherein the first coil and the calculation unit are integrated as a first chip separate from the second coil.

4. The information processing device according to claim 3, wherein the calculation unit is disposed inside the first coil.

5. An information processing device according to claim 1, wherein the first coil is arranged to be movable based on a change in the volume of the substance placed therebetween, and the calculation unit calculates a value based on the change in volume of the substance.

6. The information processing device according to claim 1, wherein information on the state of the substance calculated by said calculation unit is transmitted to the outside using at least one of said first coil and said second coil.

7. The information processing device according to claim 1, wherein the second coil is provided on a second chip separate from the first coil.

8. A control device comprising: an information processing device according to claim 1; and a control unit for controlling the state of the substance, wherein the control unit controls the state of the substance based on information on the state of the substance calculated by the calculation unit.

9. An information processing device comprising: a first coil; a second coil that receives a signal transmitted from the first coil by magnetic field coupling; a support unit that supports the first coil and the second coil; and a calculation unit, separate from the support unit, that detects a state of communication between the first coil and the second coil and calculates a state of a material disposed between the first coil and the second coil, wherein the state of communication and the state of the material are pre-associated.