Substrate processing system and movable maintenance device

Abstract

This substrate processing system comprises a substrate processing device, a maintenance device, and a control device. The substrate processing device includes a substrate processing module and a vacuum transfer module. The vacuum transfer module includes a vacuum transfer chamber having a first opening and a second opening, the vacuum transfer chamber being connected to the substrate processing module via the first opening, and a first flat motor configured to move at least one magnetically levitated moving body along a first plane in the vacuum transfer chamber. The maintenance device includes a standby chamber connected to the vacuum transfer chamber via the second opening, and a second flat motor configured to move the at least one magnetically levitated moving body along a second plane extending from the first plane into the standby chamber. The control device is configured to control the first flat motor and the second flat motor to replace a magnetically levitated moving body, among the at least one magnetically levitated moving body, that is in operation in the vacuum transport chamber with a magnetically levitated moving body for replacement, among the at least one magnetically levitated moving body, that is present in the standby chamber.

Description

Substrate processing system and mobile maintenance device

[0001] The present disclosure relates to a substrate processing system and a mobile maintenance device.

[0002] Patent Literature 1 discloses a substrate processing system including multiple chambers, a transfer chamber connecting the chambers, and a substrate transfer device provided in the transfer chamber. The substrate transfer device includes a planar motor provided in the transfer chamber and having an array of coils, a transfer unit that moves on the planar motor, and a controller that controls the energization of the coils. The transfer unit includes a first base having an array of first magnets and moving on the planar motor, a second base having an array of second magnets and moving on the planar motor and disposed coaxially with the first base, and an arm that extends and retracts by rotating the second base relative to the first base.

[0003] Patent document 2 discloses a transport chamber having a first opening communicating with an adjacent chamber, a planar motor having arranged coils, a moving body that moves on the planar motor and has a valve body that closes the first opening, and a control unit that controls the flow of electricity through the coil.

[0004] JP 2022-133867 A JP 2022-143380 A

[0005] The technology according to the present disclosure allows maintenance of a substrate processing apparatus having a magnetic levitation vacuum transfer chamber to be performed without opening the chamber to the atmosphere.

[0006] One aspect of the present disclosure is a substrate processing system including a substrate processing apparatus, a maintenance apparatus, and a control device, wherein the substrate processing apparatus includes a substrate processing module and a vacuum transfer module, the vacuum transfer module being a vacuum transfer chamber having a first opening and a second opening, the vacuum transfer chamber being connected to the substrate processing module via the first opening, and a first planar motor configured to move at least one magnetically levitated mobile body along a first plane within the vacuum transfer chamber, the maintenance apparatus including a waiting chamber connected to the vacuum transfer chamber via the second opening, and a second planar motor configured to move the at least one magnetically levitated mobile body along a second plane extending from the first plane into the waiting chamber, and the control device is configured to control the first planar motor and the second planar motor to replace one of the at least one magnetically levitated mobile body currently in operation within the vacuum transfer chamber with a replacement one of the at least one magnetically levitated mobile body currently in the waiting chamber.

[0007] According to the present disclosure, maintenance of a substrate processing apparatus having a magnetic levitation vacuum transfer chamber can be performed without opening the apparatus to the atmosphere.

[0008] 11 is a system configuration diagram showing an example of a substrate processing system according to the present embodiment. FIG. 12 is a plan view showing an outline of the configuration of a substrate processing apparatus provided in the substrate processing system of FIG. 1. FIG. 13 is a perspective view showing an outline of a magnetic levitation substrate transport unit provided in the substrate processing apparatus of FIG. 2. FIG. 14 is a diagram for explaining the driving principle of the magnetic levitation substrate transport unit. FIG. 15 is a perspective view showing an outline of a magnetic levitation gate valve provided in the substrate processing apparatus of FIG. 2. FIG. 16 is a plan view showing an outline of the configuration of a maintenance apparatus provided in the substrate processing system of FIG. 1. FIG. 17 is a longitudinal sectional view showing an outline of the configuration of a maintenance apparatus provided in the substrate processing system of FIG. 1. FIG. 18 is a plan view showing another example of the maintenance apparatus. FIG. 19 is a system configuration diagram showing an example of a substrate processing system according to another embodiment. FIG. 19 is a plan view showing an outline of the configuration of a maintenance apparatus provided in the substrate processing system of FIG. 9. FIG. 19 is a plan view showing another example of the maintenance apparatus. FIG. 19 is a perspective view showing an outline of a magnetic levitation cleaning unit housed in the maintenance apparatus of FIG. 11. FIG. 19 is a plan view showing another example of the maintenance apparatus. FIG. 19 is a side view showing an example of a support member for a magnetic levitation monitoring unit. FIG. 19 is a plan view showing another example of the maintenance apparatus.

[0009] In a manufacturing process for semiconductor devices and the like, various processes such as film formation and etching are performed on substrates such as semiconductor wafers (hereinafter referred to as "wafers") in a vacuum atmosphere (reduced pressure atmosphere). These processes are performed in a substrate processing apparatus.

[0010] The substrate processing apparatus includes a substrate processing chamber having a reduced pressure therein and performing the above-described processing on a substrate, and a vacuum transfer chamber having a reduced pressure therein and a substrate transfer unit for transferring a substrate between the substrate processing chamber and the vacuum transfer module. In one embodiment, the vacuum transfer module is configured to transfer a substrate under reduced pressure or a vacuum environment, and includes the vacuum transfer chamber and the substrate transfer unit disposed within the vacuum transfer chamber.

[0011] The substrate transport unit in the vacuum transport chamber may be of a magnetic levitation type, which is configured to move on a planar motor having an array of coils and has a support for supporting the substrate.

[0012] The substrate processing apparatus also includes a gate valve that opens and closes an opening that connects the substrate processing chamber and the vacuum transfer chamber. A magnetically levitated gate valve may be used as this gate valve. Like the magnetically levitated substrate transfer unit, the magnetically levitated gate valve is configured to move on a planar motor, but unlike the magnetically levitated substrate transfer unit, it has a valve body that closes the opening. The valve body of the magnetically levitated gate valve is also provided with a seal member that seals the opening when it is closed.

[0013] The magnetic levitation type substrate transport unit described above transports processed substrates, so the contact surface with the substrate becomes dirty and needs to be cleaned. Furthermore, the magnetic levitation type gate valve becomes contaminated by the processing of the substrate, so it needs to be cleaned, and the sealing member wears out and needs to be replaced.

[0014] Cleaning of a magnetic levitation unit, i.e., a magnetic levitation moving body, such as the magnetic levitation substrate transport unit described above, or replacement of a sealing member, is performed, for example, by an operator replacing the entire magnetic levitation unit with a previously used, i.e., unused, unit. This replacement by an operator requires the vacuum transfer chamber to be opened to the atmosphere. However, if the vacuum transfer chamber is opened to the atmosphere, it takes a long time to return the vacuum transfer chamber to its pre-open state after replacement, which can reduce productivity.

[0015] Similarly, if the vacuum transfer chamber is opened to the atmosphere for maintenance other than replacement of the magnetically levitated moving body of the vacuum transfer chamber, productivity may decrease.

[0016] Therefore, the technology disclosed herein performs maintenance on a substrate processing apparatus having a vacuum transfer chamber configured so that a magnetically levitated moving body can move inside, that is, a magnetically levitated vacuum transfer chamber, without opening it to the atmosphere.

[0017] Hereinafter, a substrate processing system and a maintenance apparatus according to the present embodiment will be described with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0018] <Substrate Processing System> Fig. 1 is a system configuration diagram showing an example of a substrate processing system according to this embodiment. Fig. 2 is a plan view showing an outline of the configuration of a substrate processing apparatus included in the substrate processing system of Fig. 1. Fig. 3 is a perspective view showing an outline of a substrate transport unit provided in the substrate processing apparatus of Fig. 2. Fig. 4 is a diagram for explaining the driving principle of the substrate transport unit. Fig. 5 is a perspective view showing an outline of a gate valve provided in the substrate processing apparatus of Fig. 2.

[0019] The substrate processing system 1 of FIG. 1 includes a plurality of substrate processing apparatuses 2, a plurality of maintenance apparatuses 3, and a control apparatus 4.

[0020] In each substrate processing apparatus 2, the substrate W is subjected to processes including, for example, a film forming process, a cleaning process, and other desired gas processes such as plasma processing.

[0021] 2, the substrate processing apparatus 2 has a configuration in which an atmospheric section 10 and a decompression section 11 are integrally connected via load lock modules 20 and 21. The atmospheric section 10 includes an atmospheric module that performs desired processing on substrates W in an atmospheric pressure atmosphere. The decompression section 11 includes a decompression module that performs desired processing on substrates W in a decompression atmosphere.

[0022] The load lock modules 20 and 21 are provided to connect an atmospheric transfer module 30 (described later) in the atmospheric section 10 to a vacuum transfer module 40 (described later) in the reduced pressure section 11 via gate valves 22 and 23, respectively. The load lock modules 20 and 21 are configured to temporarily hold a substrate W. The load lock modules 20 and 21 are also configured so that the interior thereof can be switched between an atmospheric pressure atmosphere and a reduced pressure atmosphere (vacuum atmosphere).

[0023] The atmospheric section 10 has an atmospheric transfer module 30 equipped with a substrate transfer mechanism 50 described below, and a load port 32 on which is placed a FOUP 31 capable of storing a plurality of substrates W. Note that an orienter module (not shown) for adjusting the horizontal orientation of the substrate W, a storage module (not shown) for storing a plurality of substrates W, and the like may be provided adjacent to the atmospheric transfer module 30.

[0024] The atmospheric transfer module 30 has a housing with a substantially rectangular parallelepiped shape, and the interior of the housing is maintained at atmospheric pressure. A plurality of, for example, five load ports 32 are arranged side by side on one side that constitutes the long side of the housing of the atmospheric transfer module 30. The load lock modules 20 and 21 are arranged side by side on the other side that constitutes the long side of the housing of the atmospheric transfer module 30.

[0025] A substrate transport mechanism 50 for transporting a substrate W is provided inside the atmospheric transfer module 30. The substrate transport mechanism 50 has a transport arm 51 that holds and moves the substrate W, a rotary table 52 that rotatably supports the transport arm 51, and a rotary table 53 on which the rotary table 52 is mounted. Also, a guide rail 54 extending in the longitudinal direction of the atmospheric transfer module 30 is provided inside the atmospheric transfer module 30. The rotary table 53 is provided on the guide rail 54, and the substrate transport mechanism 50 is configured to be movable along the guide rail 54.

[0026] The decompression unit 11 includes a vacuum transfer module 40 and a substrate processing module 60. The vacuum transfer module 40 is provided adjacent to the substrate processing module 60 and transfers the substrate W under a vacuum atmosphere. The substrate processing module 60 performs processing such as film formation on the substrate W under a vacuum atmosphere therein.

[0027] A plurality of substrate processing modules 60 are connected to one vacuum transfer module 40. Although six substrate processing modules 60 are connected in the example shown in Fig. 2, the number of connected substrate processing modules is not limited to six, and fewer or more than six substrate processing modules 60 may be connected.

[0028] The vacuum transfer module 40 includes a vacuum transfer chamber 40a, and the substrate processing module 60 includes a substrate processing chamber 60a. The vacuum transfer chamber 40a and the substrate processing chamber 60a are each configured to be able to maintain a reduced pressure atmosphere (vacuum atmosphere) inside.

[0029] The vacuum transfer chamber 40a is connected to the load lock modules 20 and 21. In one embodiment, the vacuum transfer module 40 transfers the substrate W transferred to the load lock module 20 to one of the substrate processing modules 60, where the substrate W is subjected to the desired substrate processing, and then transferred to the load lock module 21.

[0030] The vacuum transfer chamber 40a also has a first opening 41 and a second opening 42. The vacuum transfer chamber 40a is connected to the substrate processing module 60, specifically to the substrate processing chamber 60a, via the first opening 41. The first opening 41 connects the internal space of the vacuum transfer chamber 40a to the internal space of the substrate processing chamber 60a. The second opening 42 connects the internal space of the vacuum transfer chamber 40a to the outside of the substrate processing apparatus 2. For example, as described below, the vacuum transfer chamber 40a is connected to a maintenance device 3, specifically to a standby chamber, via the second opening 42. In this case, the second opening 42 connects the internal space of the vacuum transfer chamber 40a to the internal space of the standby chamber.

[0031] The vacuum transfer chamber 40a is provided with a first planar motor, ie, a planar motor 43. In one embodiment, the vacuum transfer chamber 40a is provided with a magnetic levitation substrate transfer unit 70 and a magnetic levitation gate valve 80 as magnetic levitation moving bodies, and the vacuum transfer chamber 40a is also provided with a gate valve 90.

[0032] Planar motor 43 is configured to move at least one magnetically levitated mobile body along the bottom surface, which serves as a first plane, within vacuum transfer chamber 40 a. In this example, planar motor 43 is provided on the bottom surface of vacuum transfer chamber 40 a and is configured to move magnetically levitated substrate transfer unit 70 and magnetically levitated gate valve 80 along the bottom surface.

[0033] The magnetic levitation type substrate transport unit 70 (hereinafter sometimes referred to as the "transport unit 70") supports and transports the substrate W. The magnetic levitation type gate valve 80 (hereinafter sometimes referred to as the "gate valve 80") opens and closes the first opening 41. The gate valve 90 opens and closes the second opening 42.

[0034] As shown in FIG. 3 , the transport unit 70 includes an end effector 72 a, two links 72 b, and two bases 72 c. The end effector 72 a holds a substrate W. Each link 72 b connects the end effector 72 a to the base 72 c. One end of the link 72 b is connected to the end effector 72 a so as to be rotatable about a vertical rotation axis 72 d. The other end of the link 72 b is connected to the base 72 c so as to be rotatable about a vertical rotation axis 72 e. The two links 72 b can move forward and backward while maintaining the orientation of the end effector 72 a by changing the distance D between the two rotation axes 72 e (the two bases 72 c). As shown in FIG. 4 , a plurality of permanent magnets 72 f are arranged on the base 72 c. The base 72 c moves on the planar motor 43 due to a magnetic field generated by a coil 43 a (described later) of the planar motor 43.

[0035] A plurality of coils 43a are arranged in the planar motor 43. The coils 43a generate a magnetic field when a current is supplied to them. The current supply to the coils 43a is controlled by the control device 4.

[0036] With this configuration, the control device 4 controls the current (specifically, the current value) of each coil 43a of the planar motor 43, thereby controlling the position, orientation, and levitation amount of the base 72c.

[0037] Furthermore, the control device 4 can move or rotate the transport unit 70 by, for example, controlling the energization of each coil 43 a of the planar motor 43 so that the position of the base 72 c is at a desired position. That is, the control device 4 can move the substrate W held by the end effector 72 a of the transport unit 70 by, for example, controlling the energization of each coil 43 a of the planar motor 43.

[0038] In the vacuum transfer chamber 40a, the end effector 72a receives the substrate W held in the load lock module 20 and transfers it to the desired substrate processing module 60 (specifically, the substrate processing chamber 60a). After the desired substrate processing has been performed in the substrate processing module 60, the end effector 72a holds the substrate W and transfers it to the load lock module 21.

[0039] As shown in FIG. 5 , the gate valve 80 has a valve element 81a and a base 81b. The valve element 81a is a member that closes the first opening 41 and is formed to be larger than the first opening 41 and smaller than the second opening 42. The valve element 81a is provided with a seal member 81c that seals the portion of the first opening 41 that is closed by the valve element 81a. The seal member 81c is, for example, an O-ring. The valve element 81a is connected to a base 81b. Similar to the base 72c, multiple permanent magnets (not shown) are arranged on the base 81b. The magnetic field generated by the coil 43a of the planar motor 43 causes the base 81b to move on the planar motor 43.

[0040] With this configuration, the control device 4 controls the current (specifically, the current value) of each coil 43a of the planar motor 43, thereby controlling the position, orientation, and levitation amount of the base 81b.

[0041] Furthermore, the control device 4 can move or rotate the gate valve 80 by, for example, controlling the energization of the coils 43 a of the planar motor 43 so that the position of the base 81 b is a desired position. That is, the control device 4 can open and close the first opening 41 with the valve element 81 a of the gate valve 80 by, for example, controlling the energization of the coils 43 a of the planar motor 43.

[0042] Each maintenance device 3 is used to replace the transport unit 70. In one embodiment, the maintenance device 3 is movable. In another embodiment, the maintenance device 3 is self-propelled. In this case, the maintenance device 3 is configured to self-propel under the control of an internal or external controller. Note that the maintenance device 3 does not have to be movable and may be permanently installed in, for example, the vacuum transport module 40. Under the control of the control device 4, each maintenance device 3 moves to the position of the substrate processing apparatus 2 having the transport unit 70 that needs to be replaced and is connected to the vacuum transfer chamber 40a of the substrate processing apparatus 2 via the second opening 42. Once the replacement of the transport unit 70 is complete, the maintenance device 3 is disconnected from the substrate processing apparatus 2 under the control of the control device 4. In other words, the maintenance device 3 is detachably connected to the substrate processing apparatus 2. The maintenance device 3 also stores one or more unused transport units 70 in a standby chamber, which will be described later. Furthermore, as will be described later, the maintenance device 3 includes a planar motor similar to the planar motor 71 in the standby chamber.

[0043] By controlling the planar motor 43 of the substrate processing apparatus 2 and the planar motor of the maintenance apparatus 3 (specifically, the energization of these coils) using the control device 4, it is possible to: move a transport unit 70 that needs to be replaced from the vacuum transfer chamber 40a of the substrate processing apparatus 2 to the standby chamber of the maintenance apparatus 3; and move a pre-used, i.e., unused, transport unit 70 from the standby chamber of the maintenance apparatus 3 to the vacuum transfer chamber 40a of the substrate processing apparatus 2. This allows the used transport unit 70 in the vacuum transfer chamber 40a of the substrate processing apparatus 2 to be exchanged for the pre-used transport unit 70. In other words, the control device 4 can exchange the operating transport unit 70 in the vacuum transfer chamber 40a for a replacement transport unit 70 in the standby chamber of the maintenance apparatus 3. Details of the maintenance apparatus 3 will be described later.

[0044] The control device 4 processes computer-executable instructions that cause the substrate processing apparatus 2 and the maintenance apparatus 3 to perform the various processes described in this disclosure. The control device 4 may be configured to control each element of the substrate processing apparatus 2 and the maintenance apparatus 3 to perform the various processes described herein. In one embodiment, a part or all of the control device 4 may be included in at least one of the substrate processing apparatus 2 and the maintenance apparatus 3. The control device 4 may include a processing unit 4a1, a storage unit 4a2, and a communication interface 4a3. The control device 4 is realized, for example, by a computer 4a. The processing unit 4a1 may be configured to read a program from the storage unit 4a2 and execute the read program to perform various control operations. This program may be stored in the storage unit 4a2 in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit 4a2 and read from the storage unit 4a2 by the processing unit 4a1 for execution. The medium may be various storage media readable by the computer 4a, or a communication line connected to the communication interface 4a3. The processing unit 4a1 may be a CPU (Central Processing Unit). The storage unit 4a2 may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface 4a3 may communicate with the substrate processing apparatus 2 and the maintenance apparatus 3 via a communication line such as a LAN (Local Area Network).

[0045] <Maintenance Device 3> FIGS. 6 and 7 are a plan view and a vertical cross-sectional view, respectively, showing the outline of the configuration of the maintenance device 3. FIG.

[0046] As shown in FIG. 6 , the maintenance device 3 includes a standby chamber 100. The standby chamber 100 is connected to the vacuum transfer chamber 40a of the vacuum transfer module 40 via the second opening 42. In this example, the standby chamber 100 is detachably connected to the vacuum transfer chamber 40a. The standby chamber 100 also houses a transport unit 70 before use. The standby chamber 100 may have two storage spaces K1 and K2 separated by a partition wall 101. In the maintenance device 3, for example, the transport unit 70 before use is housed in the storage space K1, and the transport unit 70 after use is housed in the storage space K2.

[0047] The standby chamber 100 is provided with an opening 102 that connects the standby chamber 100 to the vacuum transfer chamber 40 a via the second opening 42 , and a gate valve 103 that opens and closes the opening 102 .

[0048] The waiting chamber 100 is also provided with a planar motor 104. The planar motor 104 is a second planar motor configured to move at least one magnetically levitated moving body along the bottom surface of the waiting chamber 100, which serves as a second plane extending from the bottom surface of the vacuum transfer chamber 40a, serving as a first plane, into the waiting chamber 100. In this example, the planar motor 104 is provided on the bottom surface, i.e., the floor surface 105, of the waiting chamber 100 and is configured to move the transfer unit 70 along the floor surface 105. For example, the planar motor 104 has multiple coils (not shown) arranged therein, similar to the planar motor 43 described above. The control device 4 controls the energization of the coils of the planar motor 104, thereby moving the moving body 72. Of the walls forming opening 102 of waiting chamber 100, lower wall surface 102a may be made flush with floor surface 105 of waiting chamber 100, and planar motor 104 may also be provided on lower wall surface 102a forming opening 102. Similarly, the lower wall surface forming second opening 42 of vacuum transfer chamber 40a may be made flush with floor surface of vacuum transfer chamber 40a, and planar motor 43 may also be provided on lower wall surface forming second opening 42.

[0049] 7, the maintenance device 3 further includes an equipment room 110. An exhaust mechanism 111 and a gas supply mechanism 112 are provided in the equipment room 110. The exhaust mechanism 111 and the gas supply mechanism 112 are controlled by the control device 4.

[0050] The exhaust mechanism 111 is connected to the waiting chamber 100 and exhausts the waiting chamber 100. The exhaust mechanism 111 includes, for example, a pressure adjustment valve (not shown) and a vacuum pump (not shown). The vacuum pump may include a turbomolecular pump, a roughing pump, or a combination thereof. The exhaust mechanism 111 can reduce the pressure inside the waiting chamber 100 to a predetermined vacuum level.

[0051] The exhaust mechanism 111 is also connected to the opening 102. After the maintenance device 3 and the vacuum transfer chamber 40a are connected, the exhaust mechanism 111 evacuates the connection portion between them. This allows the connection portion to be depressurized to a predetermined vacuum level before the gate valve 103 is opened.

[0052] A protrusion for alignment may be provided on either the side of the vacuum transfer chamber 40a connected to the maintenance device 3 or the side of the maintenance device 3 connected to the vacuum transfer chamber 40a, and a recess into which the protrusion fits may be provided on the other side.

[0053] Furthermore, at least one of a seal member surrounding the second opening 42 on the side surface of the vacuum transfer chamber 40a connected to the maintenance device 3 and a seal member surrounding the opening 102 on the side surface of the maintenance device 3 connected to the vacuum transfer chamber 40a may be provided. This seal member or these seal members can increase the airtightness of the connection portion between the second opening 42 and the opening 102.

[0054] The gas supply mechanism 112 is connected to the waiting chamber 100 and supplies an inert gas such as nitrogen gas to the waiting chamber 100. The gas supply mechanism 112 includes, for example, an on-off valve (not shown) and a flow rate adjustment valve (not shown). The gas supply mechanism 112 can maintain the pressure inside the waiting chamber 100 at a higher pressure than the outside. This can prevent particles from entering the waiting chamber 100.

[0055] A communication unit (not shown) for communicating between the transport unit 70 and an external device may be provided in the equipment room 110. The communication unit is, for example, a wireless communication circuit for performing wireless communication between the transport unit 70 and the external device.

[0056] Furthermore, the maintenance device 3 has a movement mechanism 120. The movement mechanism 120 has a main body 121 and wheels 122. A power source such as a battery, a power source, a steering mechanism, etc. are provided within the main body 121. The wheels 122 rotate due to the power source within the main body 121, and move the maintenance device 3 in a direction controlled by the steering mechanism within the main body 121.

[0057] <Transport Unit 70 Replacement Flow> Next, a description will be given of an example of a transport unit 70 replacement flow using the substrate processing system 1. Note that the transport unit 70 is replaced, for example, periodically.

[0058] (Step S1: Connection of Maintenance Apparatus 3) For example, first, the control device 4 connects the substrate processing apparatus 2 having the transport unit 70 that needs to be replaced to the maintenance device 3 that accommodates the transport unit 70 before use.

[0059] Specifically, the control device 4 controls the movement mechanism 120 of the maintenance device 3 to connect the vacuum transfer chamber 40a, which houses the transfer unit 70 that needs to be replaced and is kept in a reduced pressure atmosphere (vacuum atmosphere), to the standby chamber 100, which houses the transfer unit 70 before use. This connects the second opening 42, in which the gate valve 90 is closed, to the opening 102, in which the gate valve 103 is closed.

[0060] Next, the control device 4 controls the exhaust mechanism 111 to exhaust the space K3 (see FIG. 7 ) surrounded by the gate valves 90 and 103 at the connection portion between the second opening 42 and the opening 102, creating a reduced pressure atmosphere (vacuum atmosphere). Furthermore, if the inside of the waiting chamber 100 is not a reduced pressure atmosphere (vacuum atmosphere), the control device 4 controls the exhaust mechanism 111 and the like to create a reduced pressure atmosphere (vacuum atmosphere) inside the waiting chamber 100. Thereafter, the control device 4 opens the gate valves 90 and 103. As a result, the vacuum transfer chamber 40a and the waiting chamber 100, each in a reduced pressure atmosphere (vacuum atmosphere), communicate with each other via the second opening 42, specifically via the second opening 42 and the opening 102.

[0061] (Step S2: Transporting used transport unit 70) Next, the control device 4 controls the planar motors 43 and 104 to move the used transport unit 70 in the vacuum transport chamber 40a through the second opening 42 and into the standby chamber 100 of the maintenance device 3. Specifically, the control device 4 controls the planar motor 43 to move the used transport unit 70 in the vacuum transport chamber 40a to the vicinity of the second opening 42. Next, the control device 4 controls the planar motors 71 and 104 to move the used transport unit 70 in the vacuum transfer chamber 40a through the second opening 42 and the opening 102 in this order and into the standby chamber 100. Thereafter, the control device 4 controls the planar motor 104 to move the used transport unit 70 to the storage space K2.

[0062] (Step S3: Transporting the transport unit 70 before use) Next, the control device 4 controls the planar motors 43, 104 to move the transport unit 70 before use in the standby chamber 100 of the maintenance device 3 into the vacuum transport chamber 40a via the second opening 42. Specifically, the control device 4 controls the planar motor 104 to move the transport unit 70 before use that has been housed in the housing space K1 to the vicinity of the opening 102. Next, the control device 4 controls the planar motors 43, 104 to move the transport unit 70 before use in the standby chamber 100 through the opening 102 and the second opening 42 in this order into the vacuum transport chamber 40a.

[0063] The control device 4 executes steps S2 and S3 to replace the transfer unit in the vacuum transfer chamber 40a.

[0064] (Step S4: Disconnecting the Maintenance Apparatus 3) Thereafter, the control device 4 disconnects the substrate processing apparatus 2 from the maintenance apparatus 3.

[0065] Specifically, the control device 4 closes the gate valves 90 and 103. Next, the control device 4 introduces a gas such as the atmosphere into a pipe (not shown) communicating with the aforementioned space K3, thereby returning the space K3 to atmospheric pressure. Then, the control device 4 controls the movement mechanism 120 of the maintenance device 3 to move the maintenance device 3, which contains the used transport unit 70, away from the substrate processing apparatus 2 and return it to the standby position.

[0066] The transport unit 70 after use in the maintenance device 3 is replaced with a transport unit 70 before use by an operator, for example, at the standby position after the gate valve 103 is opened.

[0067] Effect of this Embodiment In the above embodiment, the control device 4 controls the planar motors 43 and 104 to move the used transport unit 70 in the vacuum transfer chamber 40a of the substrate processing apparatus 2 to the standby chamber 100 via the second opening 42 that connects the vacuum transfer chamber 40a to the standby chamber 100 of the maintenance apparatus 3. The control device 4 also controls the planar motors 43 and 104 to move the used transport unit 70 in the standby chamber 100 to the vacuum transfer chamber 40a via the second opening 42 that connects the vacuum transfer chamber 40a to the standby chamber 100. This swaps the used transport unit 70 in the standby chamber 100 with the used transport unit 70 in the vacuum transfer chamber 40a. That is, in this embodiment, the control device 4 controls the planar motors 43 and 104 to swap the operating transport unit 70 in the vacuum transfer chamber 40a with the replacement urine transport unit 70 in the standby chamber 100. Thus, according to this embodiment, the magnetic levitation type transport unit 70 installed in the vacuum transport chamber 40a can be replaced as maintenance of the vacuum transport chamber 40a without opening the vacuum transport chamber 40a to the atmosphere.

[0068] Furthermore, in this embodiment, the maintenance apparatuses 3 are shared among the substrate processing apparatuses 2. Therefore, the cost required for the entire substrate processing system 1 can be prevented from increasing.

[0069] The replaced transport unit 70 before use and the used transport unit 70 may be of the same type or different types. The used transport unit 70 may be replaced by a transport unit 70 before use that has specifications that match the processing conditions after the replacement of the transport unit 70 and stored in the maintenance device 3. This allows the replacement with an appropriate transport unit 70 without opening the inside of the vacuum transport chamber 40a to the atmosphere.

[0070] <Other Embodiments> The maintenance device 3 in the above-described embodiments accommodates a pre-used transfer unit 70. Alternatively, as shown in Fig. 8, the maintenance device 3 may accommodate a pre-used gate valve 80. By using this maintenance device 3, the gate valve 80 can be replaced without opening the vacuum transfer chamber 40a to the atmosphere.

[0071] The maintenance device 3 may house both a pre-used transfer unit 70 and a pre-used gate valve 80. By using this maintenance device 3, the transfer unit 70 and the gate valve 80 can be replaced at the same time without opening the vacuum transfer chamber 40a to the atmosphere.

[0072] The pre-use gate valve 80 and the used gate valve 80 to be replaced may be of the same type or different types. The pre-use gate valve 80 may be stored in the maintenance device 3 with specifications (e.g., plasma resistance, heat resistance, corrosion resistance, etc.) that match the processing conditions after the replacement of the gate valve 80, and may be replaced with the used gate valve 80. This allows the replacement with an appropriate gate valve 80 without opening the vacuum transfer chamber 40a to the atmosphere. Specifically, the replacement with a gate valve 80 having an appropriate type of seal member 81c can be performed efficiently without opening the vacuum transfer chamber 40a to the atmosphere.

[0073] 9, the substrate processing system 1 may include a plurality of maintenance devices 5 in addition to the plurality of maintenance devices 3, etc. Note that the substrate processing system 1 may include the maintenance device 5 without including the maintenance device 3.

[0074] Each maintenance device 5 is used for maintenance of the vacuum transfer chamber 40a other than replacement of the magnetic levitation type moving body. In one embodiment, the maintenance device 5 is movable. In one embodiment, the maintenance device 5 is self-propelled. In this case, the maintenance device 5 is configured to self-propel under the control of an internal or external controller. Note that the maintenance device 5 does not have to be movable, and may be permanently installed in the vacuum transfer module 40, for example. Under the control of the control device 4, each maintenance device 5 moves to the position of the vacuum transfer chamber 40a of the substrate processing apparatus 2 to be maintained, and is connected to the vacuum transfer chamber 40a via the second opening 42.

[0075] 10, the maintenance device 5 is configured similarly to the maintenance device 3. However, unlike the maintenance device 3, the maintenance device 5 accommodates a magnetic levitation type recovery unit 200, which serves as a magnetic levitation type maintenance unit that waits in the waiting chamber 100 in the substrate processing mode, in the waiting chamber 100. The number of magnetic levitation type recovery units 200 (hereinafter sometimes referred to as "recovery unit 200") accommodated in the maintenance device 5 is at least one.

[0076] The recovery unit 200 is a magnetically levitated mobile body that moves when current is applied to the coils of the planar motors 43 and 104. The recovery unit 200 is configured to recover, to the standby chamber 100, at least one of the transfer unit 70 and the gate valve 80 that has become unable to move within the vacuum transfer chamber 40a due to a malfunction in the maintenance mode.

[0077] The recovery unit 200 has a pick 201 and a base 202. The pick 201 supports at least one of the transport unit 70 and the gate valve 80. The pick 201 is connected to the base 202. Similar to the base 72c described above, a plurality of permanent magnets (not shown) are arranged on the base 202. The base 202 moves over the planar motors 43 and 104 due to the magnetic fields generated by the coils 43a of the planar motor 43 and the coils of the planar motor 104.

[0078] With this configuration, the control device 4 can move or rotate the collection unit 200 by, for example, controlling the energization of each coil 43a of the planar motor 43 so that the position of the base 202 is at a desired position. In other words, the control device 4 can support and move at least one of the transport unit 70 and the gate valve 80 with the pick 201 by, for example, controlling the energization of each coil 43a of the planar motor 43.

[0079] For example, the recovery unit 200 is accommodated in the accommodation space K1, and the magnetically levitated moving body (gate valve 80 in the illustrated example) recovered by the recovery unit 200 is accommodated in the accommodation space K2. The recovery unit 200 may be provided with a sensor that detects a malfunctioning transport unit 70 and gate valve 80. The recovery unit 200 may be common to the transport unit 70 and the gate valve 80, or may be provided separately for the transport unit 70 and the gate valve 80.

[0080] In a maintenance mode of the substrate processing system 1 including the plurality of maintenance apparatuses 5, when the transfer unit 70 is to be recovered as part of maintenance of the vacuum transfer chamber 40a, for example, the control device 4 first connects the substrate processing apparatus 2 to be maintained to the maintenance apparatus 5. Specifically, the control device 4 performs control similar to that of step S1 described above.

[0081] Next, the control device 4 controls the planar motors 43, 104 to move the recovery unit 200, which was waiting in the waiting chamber 100 of the maintenance device 5 in the substrate processing mode, to the vacuum transport chamber 40a, and causes the recovery unit 200 to recover the transport unit 70.

[0082] Specifically, the control device 4 controls the planar motor 104 to move the recovery unit 200 housed in the storage space K1 to the vicinity of the opening 102. Next, the control device 4 controls the planar motors 43 and 104 to move the recovery unit 200 in the standby chamber 100 through the opening 102 and the second opening 42 in that order, and into the vacuum transfer chamber 40a. Thereafter, the control device 4 controls the planar motor 43 to support the faulty transfer unit 70 with the pick 201 of the recovery unit 200. Next, the control device 4 controls the planar motor 43 to move the recovery unit 200, which supports the faulty transfer unit 70, to the vicinity of the opening 102 within the vacuum transfer chamber 40a. Next, the control device 4 controls the planar motors 43 and 104 to move the recovery unit 200 supporting the failed transport unit 70 through the second opening 42 and the opening 102 in that order, from inside the vacuum transport chamber 40a to inside the standby chamber 100. Thereafter, the control device 4 controls the planar motor 104 to move the failed transport unit 70 using the recovery unit 200 and store it in the storage space K2. Subsequently, the control device 4 controls the planar motor 104 to return the recovery unit 200 to the storage space K1.

[0083] Thereafter, the control device 4 disconnects the substrate processing apparatus 2 from the maintenance device 5. Specifically, the control device 4 performs control similar to that of step S4 described above.

[0084] The collection of the gate valve 80 as part of the maintenance of the vacuum transfer chamber 40a is carried out in the same manner as the collection of the transfer unit 70 as part of the maintenance of the vacuum transfer chamber 40a.

[0085] As described above, in the embodiment using the substrate processing system 1 including the maintenance device 5, the transfer unit 70 and the gate valve 80 can be recovered as maintenance of the vacuum transfer chamber 40a without opening the vacuum transfer chamber 40a to the atmosphere. Note that, in this embodiment as well, by using the maintenance device 3, the transfer unit 70 and the gate valve 80 provided in the vacuum transfer chamber 40a can be replaced without opening the vacuum transfer chamber 40a to the atmosphere.

[0086] In the maintenance apparatus 5 of the above embodiment, the magnetic levitation type maintenance unit that waits in the waiting chamber 100 in the substrate processing mode is the recovery unit 200, but it may also be a magnetic levitation type cleaning unit 210 as shown in FIG. 11.

[0087] Like the recovery unit 200, the magnetic levitation cleaning unit 210 (hereinafter sometimes referred to as the "cleaning unit 210") is a magnetic levitation mobile body that moves when current is applied to the coils of the planar motors 43 and 104. The cleaning unit 210 cleans the vacuum transfer chamber 40a in maintenance mode. Specifically, the cleaning unit 210 cleans the inner wall surface of the vacuum transfer chamber 40a.

[0088] For example, the cleaning unit 210 is accommodated in each of the accommodation spaces K1 and K2.

[0089] 12, the cleaning unit 210 has, for example, plate brushes 211a to 211c, links 212a to 212c, and a base 213. In the following, when describing common points between the plate brushes 211a to 211c, the plate brushes 211a to 211c will be referred to as plate brushes 211. Similarly, when describing common points between the links 212a to 212c, the links 212a to 212c will be referred to as links 212.

[0090] The plate brush 211a is used to clean the ceiling surface of the vacuum transfer chamber 40a, the plate brush 211b is used to clean the floor surface of the vacuum transfer chamber 40a, and the plate brush 211c is used to clean the vertical inner wall surface of the vacuum transfer chamber 40a.

[0091] One end of the link 212 is connected to the base 213. The other end of the link 212a is connected to the plate brush 211a. The other end of the link 212b is connected to the plate brush 211b. The other end of the link 212c is connected to the plate brush 211c.

[0092] The link 212 can move the corresponding plate brush 211 between a processing position facing the surface to be cleaned and a standby position closer to the base 213 than the processing position.

[0093] Similar to base 72c, multiple permanent magnets (not shown) are arranged on base 213. Base 213 moves on planar motors 43 and 104 due to the magnetic fields generated by coils 43a of planar motor 43 and coils of planar motor 104.

[0094] The base 213 may be provided with a driving unit (not shown) such as a motor or a cylinder that drives the movement of the plate brush 211 by the link 212. The base 213 may also be provided with a communication unit (not shown) for communication between the driving unit and the control device 4.

[0095] With this configuration, the control device 4 can, for example, control the energization of each coil 43a of the planar motor 43, oscillate the cleaning unit 210 parallel to the brush surface of the plate brush 211 while keeping the plate brush 211 in contact with the surface to be cleaned, thereby cleaning the vacuum transfer chamber 40a (specifically, its inner wall surface).

[0096] In an embodiment using the substrate processing system 1 including the maintenance apparatus 5 accommodating the cleaning unit 210, the vacuum transfer chamber 40a can be cleaned as part of maintenance of the vacuum transfer chamber 40a without opening the vacuum transfer chamber 40a to the atmosphere. Note that in this embodiment as well, by using the maintenance apparatus 3, the transfer unit 70 and the gate valve 80 provided in the vacuum transfer chamber 40a can be replaced without opening the vacuum transfer chamber 40a to the atmosphere.

[0097] Furthermore, this method of replacing the transfer unit 70 and the gate valve 80 does not require a worker to perform the replacement work, and therefore the worker does not need to access the inside of the vacuum transfer chamber 40a. Therefore, there is no need to provide an opening in the vacuum transfer chamber 40a for this access, and the inner wall surface of the vacuum transfer chamber 40a can be made as flat as possible.

[0098] Furthermore, in the substrate processing system 1, the transport unit 70 that transports the substrate W and the gate valve 80 that opens and closes the first opening 41 are of the magnetic levitation type. This also allows the inner wall surface of the vacuum transport chamber 40a to be made as flat as possible. If the inner wall surface of the vacuum transport chamber 40a is flat, it is easy to clean it with the cleaning unit 210.

[0099] As shown in FIG. 13, the magnetic levitation type maintenance unit accommodated in the standby chamber 100 by the maintenance apparatus 5 and waiting in the standby chamber 100 in the substrate processing mode may be a magnetic levitation type monitoring unit 220.

[0100] Like the recovery unit 200, the magnetically levitated monitoring unit 220 (hereinafter sometimes referred to as the "monitoring unit 220") is a magnetically levitated mobile body that moves when current is applied to the coils of the planar motors 43 and 104. The monitoring unit 220 is configured to monitor the internal conditions of the vacuum transfer chamber 40a and the substrate processing module 60 (specifically, the substrate processing chamber 60a) in the maintenance mode.

[0101] For example, the monitoring unit 220 is accommodated in each of the accommodation spaces K1 and K2.

[0102] The monitoring unit 220 is configured in the same manner as the transport unit 70, for example, but has an imaging unit 221 instead of the end effector 72a.

[0103] 14, the imaging section 221 has a plate-shaped support member 222. An upper imaging section 223 is provided on the upper surface of the tip of the support member 222, and a lower imaging section 224 is provided on the lower surface of the tip.

[0104] Although not shown, the upper imaging unit 223 and the lower imaging unit 224 each have a transparent cover, an imaging element, and an illumination module. The transparent cover is made of a transparent material and defines an accommodation space with an atmospheric atmosphere. The imaging element and illumination module are accommodated in this accommodation space with an atmospheric atmosphere. The imaging element of the upper imaging unit 223 is arranged to capture an image above it, and the imaging element of the lower imaging unit 224 is arranged to capture an image below it. The illumination module illuminates at least the imaging range of the imaging element.

[0105] The support member 222 may be provided with a storage unit that stores the imaging results obtained by the upper imaging unit 223 and the lower imaging unit 224. The support member 222 may also be provided with a communication unit (not shown) that wirelessly communicates the imaging results obtained by the upper imaging unit 223 and the lower imaging unit 224 to the control device 4.

[0106] The control device 4 can position the upper imaging section 223 and the lower imaging section 224 of the monitoring unit 220 inside the vacuum transfer chamber 40a or the substrate processing chamber 60a by controlling the energization of each coil 43a of the planar motor 43. This allows the upper imaging section 223 and the lower imaging section 224 of the monitoring unit 220 to monitor the internal conditions of the vacuum transfer chamber 40a and the substrate processing chamber 60a, and more specifically, to capture images of the interiors of the vacuum transfer chamber 40a and the substrate processing chamber 60a.

[0107] In a configuration using the substrate processing system 1 equipped with the maintenance device 5 accommodating the monitoring unit 220, the internal states of the vacuum transfer chamber 40a and the substrate processing chamber 60a can be monitored as part of maintenance of the vacuum transfer chamber 40a without opening the vacuum transfer chamber 40a to the atmosphere. For example, monitoring of the internal state of the substrate processing chamber 60a is performed when an abnormal discharge occurs within the substrate processing chamber 60a. In this case, the location of the abnormal discharge within the substrate processing chamber 60a can be identified based on the monitoring results obtained by the monitoring unit 220.

[0108] In this embodiment, too, by using the maintenance device 3, the transfer unit 70 and the gate valve 80 provided in the vacuum transfer chamber 40a can be replaced without opening the vacuum transfer chamber 40a to the atmosphere.

[0109] <Modifications> In the above embodiment, the maintenance device 3 is detachably connected to the substrate processing apparatus 2 and is connected to the substrate processing apparatus 2 only when the transport unit 70 and the gate valve 80 are replaced, but the maintenance device 3 may also be connected to the substrate processing apparatus 2 at times other than the replacement. That is, the maintenance device 3 may be permanently installed in the substrate processing apparatus 2 as described above. The same applies to the maintenance device 5.

[0110] When the maintenance device 3 is permanently installed relative to the substrate processing apparatus 2, as shown in FIG. 15 , an opening 106 that connects the waiting chamber 100 to the outside of the maintenance device 3 and a gate valve 107 that opens and closes the opening 106 may be provided on the side opposite (hereinafter referred to as the back side) to the opening 102 side (hereinafter referred to as the front side).

[0111] This allows an operator to replace the transfer units 70 and gate valves 80 in the standby chamber 100 while the maintenance apparatus 3 is connected to the substrate processing apparatus 2. Specifically, an operator can remove used transfer units 70 and gate valves 80 from the standby chamber 100 through the opening 106, and can also replenish the standby chamber 100 with unused transfer units 70 and gate valves 80 through the opening 106.

[0112] Even when the maintenance device 3 is not permanently installed in the substrate processing apparatus 2 , the opening 106 and the gate valve 107 may be provided on the rear side of the maintenance device 3 .

[0113] When an opening 106 and a gate valve 107 are provided on the rear side of the maintenance apparatus 3, the transfer unit 70 and the gate valve 80 in the standby chamber 100 may be interchanged as follows. That is, first, with one maintenance apparatus 3 (hereinafter referred to as the first apparatus 3) connected to the substrate processing apparatus 2, the control device 4 connects another maintenance apparatus 3 (hereinafter referred to as the other apparatus 3) to the rear side of the first apparatus 3. This allows the standby chambers 100 of the first apparatus 3 and the other apparatus 3 to communicate with each other via the opening 106 on the rear side of the first apparatus 3 and the opening 102 on the front side of the other apparatus 3. Then, the control device 4 controls the energization of the coils of the planar motors 104 of the first apparatus 3 and the other apparatus 3 to move, i.e., remove, the used transfer unit 70 and gate valve 80 from the standby chamber 100 of the first apparatus 3 to the standby chamber 100 of the other apparatus 3 via the openings 102 and 106. Furthermore, the control device 4 controls the energization of the coils of the planar motors 104 of the first device 3 and the second device 3, and moves the transport unit 70 and the gate valve 80 from the standby chamber 100 of the second device 3 to the standby chamber 100 of the first device 3 via the openings 102 and 106. In this manner, the transport unit 70 and the gate valve 80 in the standby chamber 100 may be interchanged.

[0114] Similar to the maintenance apparatus 3 described above, an opening 106 and a gate valve 107 may be provided on the rear side of the maintenance apparatus 5. This allows the transfer unit 70 and gate valve 80 recovered by the recovery unit 200, the recovery unit 200 itself, the cleaning unit 210, and the monitoring unit 220 to be removed from the standby chamber 100 of the maintenance apparatus 5 connected to the substrate processing apparatus 2 through the opening 106. This removal is performed, for example, in the same manner as the removal of the transfer unit 70 and gate valve 80 from the standby chamber 100 in the maintenance apparatus 3 described above.

[0115] In the above embodiment, the standby chamber 100 of the maintenance device 3 and the vacuum transfer chamber 40a are connected to each other by the second opening 42, which is an opening different from the first opening 41 that passes through the substrate processing chamber 60a and the vacuum transfer chamber 40a. Alternatively, the standby chamber 100 of the maintenance device 3 and the vacuum transfer chamber 40a may be connected to each other via the first opening 41. In other words, the maintenance device 3 may be connected to the portion of the vacuum transfer chamber 40a to which the substrate processing chamber 60a is connected. The same applies to the maintenance device 5.

[0116] The maintenance device 3 and the maintenance device 5 may be integrated, and both the replacement magnetically levitated mobile body and the magnetically levitated maintenance unit may be housed in one device. Also, one magnetically levitated maintenance unit housed in the maintenance device 5 may have two or more functions of the recovery unit 200, the cleaning unit 210, and the monitoring unit 220. Furthermore, the transport unit 70 housed in the maintenance device 3 may be provided with imaging units corresponding to the upper imaging unit 223 and the lower imaging unit 224 of the monitoring unit 220, and these imaging units may be used to monitor the internal conditions of the vacuum transport chamber 40a and the substrate processing chamber 60a.

[0117] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0118] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0119] REFERENCE SIGNS LIST 1 substrate processing system 2 substrate processing apparatus 3 maintenance apparatus 4 control apparatus 40 vacuum transfer module 40a vacuum transfer chamber 41 first opening 42 second opening 43 planar motor 60 substrate processing module 70 magnetically levitated substrate transfer unit 71 planar motor 80 magnetically levitated gate valve 100 standby chamber 104 planar motor 200 magnetically levitated recovery unit 210 magnetically levitated cleaning unit 220 magnetically levitated monitoring unit W substrate

Claims

1. A substrate processing system comprising: a substrate processing apparatus; a maintenance apparatus; and a control device, wherein the substrate processing apparatus comprises: a substrate processing module; and a vacuum transfer module, wherein the vacuum transfer module is a vacuum transfer chamber having a first opening and a second opening, the vacuum transfer chamber being connected to the substrate processing module via the first opening; and a first planar motor configured to move at least one magnetically levitated mobile body along a first plane in the vacuum transfer chamber, wherein the maintenance apparatus comprises: a waiting chamber connected to the vacuum transfer chamber via the second opening; and a second planar motor configured to move the at least one magnetically levitated mobile body along a second plane extending from the first plane into the waiting chamber, wherein the control device is configured to control the first planar motor and the second planar motor to replace a working magnetically levitated mobile body of the at least one magnetically levitated mobile body located in the vacuum transfer chamber with a replacement magnetically levitated mobile body of the at least one magnetically levitated mobile body located in the waiting chamber.

2. The substrate processing system of claim 1, wherein the at least one magnetically levitated mobile body comprises a magnetically levitated substrate transport unit configured to transport a substrate within the vacuum transport chamber.

3. The substrate processing system of claim 1, wherein the at least one magnetically levitated mobile body includes a magnetically levitated gate valve configured to open and close the first opening.

4. The substrate processing system according to claim 1, wherein the at least one magnetically levitated mobile body includes at least one magnetically levitated maintenance unit waiting in the waiting chamber in a substrate processing mode.

5. The substrate processing system of claim 4, wherein the at least one magnetic levitation maintenance unit comprises a magnetic levitation cleaning unit configured to clean the vacuum transfer chamber.

6. The substrate processing system of claim 4, wherein the at least one magnetic levitation type maintenance unit includes a magnetic levitation type recovery unit configured to recover a moving body in the vacuum transfer chamber to the waiting chamber.

7. The substrate processing system of claim 4, wherein the at least one magnetically levitated maintenance unit comprises a magnetically levitated monitoring unit configured to monitor an internal condition of the vacuum transfer chamber and the substrate processing module.

8. The substrate processing system according to any one of claims 1 to 7, wherein the maintenance device is movable, and the waiting chamber is detachably connected to the vacuum transfer chamber.

9. A substrate processing system comprising: a substrate processing apparatus; a maintenance apparatus; and a control device, wherein the substrate processing apparatus comprises: a substrate processing module; and a vacuum transfer module, wherein the vacuum transfer module is a vacuum transfer chamber having a first opening and a second opening, the vacuum transfer chamber connected to the substrate processing module via the first opening; and a first planar motor configured to move at least one magnetically levitated mobile body along a first plane within the vacuum transfer chamber, wherein the maintenance apparatus comprises: a waiting chamber connected to the vacuum transfer chamber via the second opening; and a second planar motor configured to move the at least one magnetically levitated mobile body along a second plane extending from the first plane into the waiting chamber, wherein the at least one magnetically levitated mobile body comprises at least one magnetically levitated maintenance unit waiting in the waiting chamber in a substrate processing mode, and wherein the control device is configured to control the first planar motor and the second planar motor in the maintenance mode to move the at least one magnetically levitated maintenance unit from the waiting chamber to the vacuum transfer chamber.

10. The substrate processing system of claim 9, wherein the at least one magnetic levitation maintenance unit comprises a magnetic levitation cleaning unit configured to clean the vacuum transfer chamber.

11. The substrate processing system of claim 9, wherein the at least one magnetic levitation type maintenance unit includes a magnetic levitation type recovery unit configured to recover a moving body in the vacuum transfer chamber to the waiting chamber.

12. The substrate processing system of claim 9, wherein the at least one magnetically levitated maintenance unit comprises a magnetically levitated monitoring unit configured to monitor an internal condition of the vacuum transfer chamber and the substrate processing module.

13. The substrate processing system according to any one of claims 9 to 12, wherein the maintenance device is movable, and the waiting chamber is detachably connected to the vacuum transfer chamber.

14. A mobile maintenance device comprising: a waiting chamber detachably connected to a vacuum transport chamber; and a planar motor configured to move at least one magnetically levitated mobile body along a first plane within the waiting chamber, the first plane extending from a second plane within the vacuum transport chamber when the waiting chamber is connected to the vacuum transport chamber.

15. The mobile maintenance apparatus according to claim 14, wherein said at least one magnetically levitated mobile body includes at least one magnetically levitated maintenance unit waiting in said waiting chamber in a substrate processing mode.

16. The mobile maintenance device of claim 15, wherein said at least one magnetic levitation maintenance unit includes a magnetic levitation cleaning unit configured to clean said vacuum transport chamber in a maintenance mode.

17. The mobile maintenance device according to claim 15, wherein the at least one magnetic levitation type maintenance unit includes a magnetic levitation type recovery unit configured to recover a moving body in the vacuum transport chamber to the waiting chamber in a maintenance mode.

18. The mobile maintenance apparatus of claim 15, wherein the at least one magnetically levitated maintenance unit includes a magnetically levitated monitoring unit configured to monitor internal conditions of the vacuum transfer chamber and substrate processing module in a maintenance mode.