Inductor component, method for producing inductor component, and substrate for use in production of inductor component

Abstract

An inductor component (10) comprises an element body (11), a first insulating layer (31), and an inductor wiring (51). The inductor wiring (51) comprises a wiring body (52) and a protruding part (53) that protrudes from the outer surface of the wiring body (52) on the third-negative direction (Z2) side. The outer surface of the wiring body (52) on the third-negative direction (Z2) side is in contact with the outer surface of the first insulating layer (31) on the third-positive direction (Z1) side. When perspectively viewed along the third positive direction (Z1), the protruding part (53) is located within a range surrounded by the outer edge of the wiring body (52), and extends along the wiring body (52). When cross-sectionally viewed in a cross-section orthogonal to a first main surface (11A), the dimension (53W) of the protruding part (53) in a direction parallel to the first main surface (11A) is smaller than the dimension (52W) of the wiring body (52) in a direction parallel to the first main surface (11A) at a location where the protruding part (53) is connected.

Description

Inductor component, inductor component manufacturing method, and substrate for manufacturing inductor component

[0001] The present disclosure relates to an inductor component, a method for manufacturing an inductor component, and a substrate for manufacturing an inductor component.

[0002] The inductor component disclosed in Patent Document 1 includes an element body and inductor wiring. The element body has a first main surface. The inductor wiring extends within the element body parallel to the first main surface. The inductor wiring is spirally shaped. In other words, the inductor wiring has parallel portions.

[0003] Patent No. 6447368

[0004] In an inductor component such as that disclosed in Patent Document 1, the cross-sectional area of ​​the inductor wiring may be increased to reduce the DC resistance of the inductor wiring. However, for example, if the width dimension of the inductor wiring is increased, the spacing between the parallel portions of the inductor wiring becomes narrower. Therefore, if a manufacturing error or the like occurs, there is a higher risk of a short circuit occurring between the parallel portions of the inductor wiring.

[0005] In order to solve the above-described problems, one aspect of the present disclosure includes an element body including a magnetic material and having a planar main surface; an insulating layer located within the element body and extending on a plane parallel to the main surface; and an inductor wiring extending within the element body parallel to the main surface, wherein when one direction perpendicular to the main surface is defined as a positive direction and a direction opposite to the positive direction is defined as a negative direction, the inductor wiring has a wiring main body extending on an outer surface of the insulating layer on the positive direction side and a wiring main body protruding from the outer surface of the wiring main body on the negative direction side. and a protrusion extending along the wiring body, wherein the outer surface of the wiring body on the negative side and the outer surface of the insulating layer on the positive side are in contact with each other, and when viewed in the positive direction, the protrusion is located within an area surrounded by the outer edge of the wiring body and extends along the wiring body, and when viewed in a cross section perpendicular to the main surface, the dimension of the protrusion in a direction parallel to the main surface is smaller than the dimension of the wiring body at the point where the protrusion is connected in a direction parallel to the main surface.

[0006] Moreover, one aspect of the present disclosure is a method for manufacturing an inductor component, comprising: a seed layer formation process for forming a conductive seed layer on a main surface of a base substrate; an insulating layer formation process for forming an insulating layer having an opening of a predetermined wiring pattern on the seed layer; a resin wall formation process for forming a resin wall on the insulating layer along the outer edge of the opening; an inductor wiring formation process for forming a wiring body within a space surrounded by the resin wall by electrolytic plating by supplying power to the seed layer, and integrally forming a protruding portion that protrudes from the wiring body into the opening and extends along the wiring body; an element body formation process for forming a magnetic layer containing a magnetic material around the inductor wiring after the inductor wiring formation process; and a seed layer removal process for removing the seed layer after the first element body formation process.

[0007] Moreover, one aspect of the present disclosure is a substrate for manufacturing inductor components, comprising: a base substrate; a conductive seed layer located on a main surface of the base substrate; an insulating layer located on the seed layer and parallel to the main surface of the base substrate; and an inductor wiring located on the insulating layer and extending parallel to the main surface of the base substrate, wherein when one direction perpendicular to the main surface of the base substrate is defined as a positive direction and the direction opposite to the positive direction is defined as a negative direction, the inductor wiring comprises a wiring body extending on the outer surface of the insulating layer on the positive direction side, and a protrusion protruding from the outer surface of the wiring body on the negative direction side to the negative direction, and when viewed facing the positive direction, the protrusion extends along the wiring body, and the negative direction side surface of the protrusion is in contact with the seed layer.

[0008] This makes it possible to reduce the DC resistance of the inductor wiring while preventing short circuits between different parts of the inductor wiring.

[0009] FIG. 1 is a perspective view of an inductor component according to a first embodiment. FIG. 2 is a side perspective view of the inductor component according to the first embodiment. FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. 2. FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. 3. FIG. 5 is a flowchart of a manufacturing process for the inductor component according to the first embodiment. FIG. 6 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 7 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 8 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 9 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 10 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 11 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 12 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 13 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 14 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 15 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 16 is an explanatory diagram of a manufacturing method for the inductor component according to the first embodiment. FIG. 17 is an explanatory diagram of a method for manufacturing an inductor component according to the first embodiment. FIG. 18 is an explanatory diagram of a method for manufacturing an inductor component according to the first embodiment. FIG. 19 is an explanatory diagram of a method for manufacturing an inductor component according to the first embodiment. FIG. 20 is an explanatory diagram of a method for manufacturing an inductor component according to the first embodiment. FIG. 21 is a perspective view of an inductor component according to a second embodiment. FIG. 22 is a see-through view from above of an inductor component according to the second embodiment. FIG. 23 is a cross-sectional view taken along line 23-23 in FIG. 22. FIG. 24 is a flowchart of a manufacturing process for an inductor component according to the second embodiment. FIG. 25 is an explanatory diagram of a method for manufacturing an inductor component according to the second embodiment. FIG. 26 is an explanatory diagram of a method for manufacturing an inductor component according to the second embodiment. FIG. 27 is an explanatory diagram of a method for manufacturing an inductor component according to the second embodiment. FIG. 28 is an explanatory diagram of a method for manufacturing an inductor component according to the second embodiment. FIG. 29 is an explanatory diagram of a method for manufacturing an inductor component according to the second embodiment. FIG. 30 is an explanatory diagram of a method for manufacturing an inductor component according to the second embodiment. FIG. 31 is a perspective view of an inductor component according to a modified example. FIG. 32 is a perspective view of an inductor component according to a modified example.Fig. 33 is a cross-sectional view of an inductor component according to a modified example, Fig. 34 is a cross-sectional view of an inductor component according to a modified example, and Fig. 35 is an explanatory diagram of a method for manufacturing an inductor component according to a modified example.

[0010] Hereinafter, embodiments of the inductor component will be described with reference to the drawings. Note that the drawings may show components enlarged to facilitate understanding. The dimensional ratios of the components may differ from those in the actual components or from those in other drawings.

[0011] <Inductor Component of First Embodiment> Hereinafter, a first embodiment of an inductor component and a method for manufacturing an inductor component will be described.

[0012] 1, the inductor component 10 has a generally rectangular parallelepiped shape. The inductor component 10 includes an element body 11.

[0013] The element body 11 is substantially rectangular. That is, the element body 11 has six planar outer surfaces. Of these six outer surfaces, a specific one is designated as the first main surface 11A. Furthermore, a surface located opposite the first main surface 11A and parallel to the first main surface 11A is designated as the second main surface 11B. Furthermore, four surfaces perpendicular to the first main surface 11A, in other words, the outer surfaces excluding the first main surface 11A and the second main surface 11B, are designated as the side surfaces 11C of the element body 11. The outer shapes of the first main surface 11A, the second main surface 11B, and the side surfaces 11C of the element body 11 are all rectangular.

[0014] Here, the axis parallel to the long side of the first main surface 11A is defined as the first axis X. The axis parallel to the short side of the first main surface 11A is defined as the second axis Y. The axis perpendicular to the first main surface 11A is defined as the third axis Z. In this embodiment, the first axis X, the second axis Y, and the third axis Z are perpendicular to one another. Furthermore, a specific direction along the first axis X is defined as the first positive direction X1, and the direction opposite to the first positive direction X1 is defined as the first negative direction X2. Furthermore, a specific direction along the second axis Y is defined as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is defined as the second negative direction Y2. Furthermore, the direction along the third axis Z toward which the first main surface 11A faces is defined as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is defined as the third negative direction Z2.

[0015] As shown in FIG. 2 , the base body 11 has, as magnetic layers 20, a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25, in that order from the third negative direction Z2 side. That is, of the outer surfaces of the third magnetic layer 25, the outer surface facing the third positive direction Z1 is the first major surface 11A. Of the outer surfaces of the first magnetic layer 21, the outer surface facing the third negative direction Z2 is the second major surface 11B. Note that in FIG. 2 , the boundaries between the magnetic layers 20 are shown imaginarily with two-dot chain lines. In reality, clear boundaries between these magnetic layers 20 may not be observable.

[0016] The material of the magnetic layer 20, i.e., the material of the base body 11, contains a magnetic material. Specifically, the material of the base body 11 is an organic resin containing metal magnetic powder. In this embodiment, the metal magnetic powder is metal magnetic powder made of an Fe-based alloy or an amorphous alloy. More specifically, the metal magnetic powder is FeSiCr-based metal powder containing iron.

[0017] The inductor component 10 includes two insulating layers. The two insulating layers are a first insulating layer 31 and a second insulating layer 32. The first insulating layer 31 extends within the element body 11 on a plane parallel to the first main surface 11A. The first insulating layer 31 is in contact with the surface of the first magnetic layer 21 on the third positive direction Z1 side. In the third axis Z direction, the position of the first insulating layer 31 is the same as that of the first interlayer magnetic layer 22.

[0018] The second insulating layer 32 extends within the element body 11 on a plane parallel to the first main surface 11A. The second insulating layer 32 is in contact with the surface of the third magnetic layer 25 on the third negative direction Z2 side. In the third axis Z direction, the position of the second insulating layer 32 is the same as the position of the second interlayer magnetic layer 24. Note that "parallel" means that the first insulating layer 31 and the first main surface 11A are essentially parallel, allowing for manufacturing errors. For example, if the acute angle between the first insulating layer 31 and the first main surface 11A is less than 5 degrees, they are considered to be parallel.

[0019] 2, the inductor element 10 includes an inductor wiring 51. The inductor wiring 51 is made of a conductive material. In this embodiment, the composition of the inductor wiring 51 is such that the copper ratio is 99 wt % or more and the sulfur ratio is 0.1 wt % or more and 1.0 wt % or less.

[0020] The inductor wiring 51 is located inside the element body 11. The inductor wiring 51 extends parallel to the first main surface 11A. The inductor wiring 51 is located in the same layer as the first insulating layer 31 and the second magnetic layer 23 in the third axis Z direction. That is, the outer surface of the inductor wiring 51 on the third negative direction Z2 side is in contact with the outer surface of the first magnetic layer 21 on the third positive direction Z1 side. The second insulating layer 32 is located on the outer surface of the inductor wiring 51 on the third positive direction Z1 side.

[0021] The inductor wiring 51 includes a wiring body 52. ​​The wiring body 52 is a portion of the inductor wiring 51 that is located in the same layer as the second magnetic layer 23 in the third axis Z direction. Therefore, the wiring body 52 extends on the outer surface of the first insulating layer 31 on the third positive direction Z1 side. In other words, the outer surface of the wiring body 52 on the third negative direction Z2 side and the outer surface of the first insulating layer 31 on the third positive direction Z1 side are in contact with each other.

[0022] 3 , when the inductor component 10 is seen through in the third negative direction Z2, the inductor wiring 51 extends in a spiral shape. Furthermore, there is a distance between the outer edge of the inductor wiring 51 and the side surface 11C of the element body 11. Therefore, the inductor wiring 51 is not exposed at the side surface 11C of the element body 11. Furthermore, in this embodiment, no other conductive object is connected to the inductor wiring 51 and extends to the side surface 11C of the element body 11. Therefore, no conductive object electrically connected to the inductor wiring 51 is exposed at the side surface 11C of the element body 11.

[0023] The wiring body 52 has a pair of pad portions P and a wiring portion L. The pad portions P are located at both ends of the wiring body 52. ​​Of the pair of pad portions P, the pad portion P located on the first positive direction X1 side is referred to as the inner pad portion P1. The pad portion P located on the first negative direction X2 side is referred to as the outer pad portion P2. In other words, when viewed in the third negative direction Z2, the inner pad portion P1 is located on the first positive direction X1 side with respect to the geometric center of the element body 11. The outer pad portion P2 is located on the first negative direction X2 side with respect to the inner pad portion P1.

[0024] The wiring portion L connects the pair of pad portions P. Specifically, when the inductor component 10 is seen through in the third negative direction Z2, the wiring portion L extends counterclockwise from the inner pad portion P1 to the outer pad portion P2 such that the diameter increases as the number of turns increases. The number of turns of the wiring portion L is approximately 2.0 turns.

[0025] The number of turns of the wiring portion L is determined based on a virtual vector as follows: First, a vector is imagined with its start and end points at a first end of the center line CL of the wiring portion L. In this state, this vector is a zero vector. Then, while looking in the third negative direction Z2, the start point of this vector is kept fixed, and the end point of the vector is moved along the center line CL of the wiring portion L to the second end of the center line CL. At this time, the number of turns is calculated by assuming that a 360-degree rotation of the vector direction is 1.0 turn. For example, if the virtual vector rotates by 180 degrees, the number of turns is 0.5 turns.

[0026] In the wiring portion L, the width dimension in a direction perpendicular to the center line CL and parallel to the first main surface 11A is approximately constant throughout the entire wiring portion L. The center line CL of the wiring portion L is determined as follows: When viewed in a perspective manner in the third negative direction Z2, of the line segments connecting any point on the outer edge of the wiring portion L to a point on the outer edge on the opposite side, the line segment with the shortest distance between the two points is identified. When the line segments are identified in this way throughout the entire outer edge of the wiring portion L, the line connecting the midpoints of the identified line segments is defined as the center line CL of the wiring portion L when viewed in a perspective manner in the third negative direction Z2.

[0027] As shown in FIG. 4 , the inductor component 10 includes a resin wall 41. The resin wall 41 is made of an insulating resin. The resin wall 41 is laminated on a portion of the surface of the first insulating layer 31 on the third positive direction Z1 side. The resin wall 41 is located in the same layer as the wiring main body 52 and the second magnetic layer 23 in the third axis Z direction. The resin wall 41 covers the side surface 52S of the wiring main body 52 on the outer surface of the inductor wiring 51. The resin wall 41 also extends to the same layer as the second interlayer magnetic layer 24 and the second insulating layer 32 in the third axis Z direction. In other words, the resin wall 41 is also in contact with the second interlayer magnetic layer 24 and the second insulating layer 32. The side surface 52S of the wiring main body 52 refers to the outer surface of the wiring main body 52 excluding the outer surface on the third positive direction Z1 side and the outer surface on the third negative direction Z2 side.

[0028] 4, the outer surface of the resin wall 41 on the third positive direction Z1 side is illustrated as being in contact with the outer surface of the third magnetic layer 25 on the third negative direction Z2 side. In reality, the outer surface of the resin wall 41 on the third positive direction Z1 side may be buried in the second insulating layer 32 without being in contact with the outer surface of the third magnetic layer 25 on the third negative direction Z2 side.

[0029] The inductor component 10 includes a first pillar-shaped wiring 61A and a second pillar-shaped wiring 61B. The material of each pillar-shaped wiring is the same as the material of the inductor wiring 51. Each pillar-shaped wiring extends in a direction intersecting the first main surface 11A. Each pillar-shaped wiring is located in the same layer as the second interlayer magnetic layer 24 and the third magnetic layer 25 in the third axis Z direction. Each pillar-shaped wiring extends in a direction perpendicular to the first main surface 11A, i.e., in the third axis Z direction.

[0030] Each pillar-shaped wiring is in contact with the outer surface of the wiring main body 52 on the third positive direction Z1 side. Therefore, each pillar-shaped wiring is electrically connected to the inductor wiring 51. Specifically, the outer surface of the first pillar-shaped wiring 61A on the third negative direction Z2 side is in contact with a surface parallel to the first main surface 11A of the inner pad portion P1. The outer surface of the second pillar-shaped wiring 61B on the third negative direction Z2 side is in contact with a surface parallel to the first main surface 11A of the outer pad portion P2.

[0031] The inductor component 10 includes a first external electrode 81A and a second external electrode 81B. Each external electrode is located on the first main surface 11A of the element body 11. That is, each external electrode covers a portion of the outer surface of the element body 11.

[0032] The first external electrode 81A is located on the first main surface 11A on the first positive direction X1 side with respect to the geometric center of the first main surface 11A. The second external electrode 81B is located on the first main surface 11A on the first negative direction X2 side with respect to the geometric center of the first main surface 11A. The first external electrode 81A is in contact with a surface of the first columnar wiring 61A facing in the third positive direction Z1. The second external electrode 81B is in contact with a surface of the second columnar wiring 61B facing in the third positive direction Z1.

[0033] The inductor component 10 includes a solder resist 70. The solder resist 70 has higher insulating properties than the element body 11. The solder resist 70 covers the surface of the element body 11 facing the third positive direction Z1, excluding at least two external electrodes. In other words, the first main surface 11A of the element body 11 is not exposed because it is covered by the external electrodes and the solder resist 70. Note that the outer surface of the solder resist 70 on the third positive direction Z1 side does not need to be entirely exposed. For example, a portion of each external electrode may cover a portion of the outer surface of the solder resist 70 on the third positive direction Z1 side.

[0034] (Regarding the Protrusion) Next, a detailed configuration of the inductor wiring 51 will be described. As shown in Fig. 4, the inductor wiring 51 includes a wiring main body 52 and a protrusion 53. The inductor wiring 51 is formed in a single step by electrolytic plating in a manufacturing method described below. That is, the wiring main body 52 and the protrusion 53 are integrally molded.

[0035] The protruding portion 53 is a portion of the inductor wiring 51 that is located in the same layer as the first interlayer magnetic layer 22 in the third axis Z direction. The protruding portion 53 protrudes in the third negative direction Z2 from the outer surface of the wiring main body 52 on the third negative direction Z2 side. Specifically, the protruding portion 53 protrudes from both the wiring portion L and the pad portion P. The protruding portion 53 penetrates the first insulating layer 31. In this embodiment, the dimension of the protruding portion 53 in the third axis Z direction is the same as the dimension of the first insulating layer 31. Therefore, the position of the protruding portion 53, the position of the first insulating layer 31, and the position of the first interlayer magnetic layer 22 are the same in the third axis Z direction.

[0036] The outer surface of the protrusion 53 on the third negative direction Z2 side is in contact with the element body 11. The side surface 53S of the protrusion 53 is in contact with the first insulating layer 31. The side surface 53S of the protrusion 53 refers to the outer surface of the protrusion 53 excluding the outer surface on the third negative direction Z2 side. However, since the protrusion 53 protrudes from the wiring main body 52, it does not have an outer surface on the third positive direction Z1 side.

[0037] When viewed in the third positive direction Z1, the protrusion 53 extends along the wiring main body 52. ​​Specifically, the protrusion 53 extends from the inner pad portion P1, through the wiring portion L, to the outer pad portion P2. That is, the protrusion 53 extends over substantially the entire wiring main body 52. ​​As shown in FIG. 3 , when viewed in the third positive direction Z1, the protrusion 53 is located within an area surrounded by the outer edge of the wiring main body 52. ​​More specifically, as shown in FIG. 4 , when viewed in a cross section perpendicular to the first main surface 11A, the dimension of each portion of the inductor wiring 51 in a direction parallel to the first main surface 11A is defined as the width dimension. The width dimension 53W of the protrusion 53 is smaller than the width dimension 52W of the wiring main body 52 at the point where the protrusion 53 is connected on the same cross section.

[0038] (Regarding the Lead Portion) Next, the detailed configuration of each pillar-shaped wiring will be described. As shown in FIG. 4 , the first pillar-shaped wiring 61A includes a first pillar-shaped portion 62A and a first lead-out portion 63A. The first pillar-shaped wiring 61A is formed in a single step by electrolytic plating in a manufacturing method described below. Therefore, the first pillar-shaped portion 62A and the first lead-out portion 63A are integrally molded. The shapes of the first pillar-shaped portion 62A and the first lead-out portion 63A are both approximately semicircular pillars corresponding to the shape of the inner pad portion P1.

[0039] The first columnar section 62A is a portion of the first columnar wiring 61A that is located in the same layer as the third magnetic layer 25 in the third axis Z direction. The first columnar section 62A extends in the third positive direction Z1 from the outer surface of the second insulating layer 32 on the third positive direction Z1 side. That is, the outer surface of the first columnar section 62A on the third negative direction Z2 side and the outer surface of the second insulating layer 32 on the third positive direction Z1 side are in contact with each other.

[0040] The first lead portion 63A is located in the same layer as the second interlayer magnetic layer 24 in the third axis Z direction. The first lead portion 63A protrudes in the third negative direction Z2 from the outer surface of the first columnar portion 62A on the third negative direction Z2 side. The first lead portion 63A penetrates the second insulating layer 32. In addition, the dimension of the first lead portion 63A in the third axis Z direction is the same as the dimension of the second insulating layer 32. Therefore, in the third axis Z direction, the position of the first lead portion 63A, the position of the second insulating layer 32, and the position of the second interlayer magnetic layer 24 are the same.

[0041] An outer surface on the third negative direction Z2 side, which is one end of the first lead portion 63A, is in contact with a surface parallel to the first main surface 11A of the inner pad portion P1. The outer edge of the first lead portion 63A is parallel to the outer edge of the inner pad portion P1. When viewed in the third positive direction Z1, the outer edge of the first lead portion 63A is parallel to the outer edge of the first columnar portion 62A. When viewed in the third positive direction Z1, the area enclosed by the outer edge of the first columnar portion 62A is 1.3 times or less the area enclosed by the outer edge of the first lead portion 63A.

[0042] A side surface 63AS of the first lead portion 63A is in contact with the second insulating layer 32. The side surface 63AS of the first lead portion 63A refers to the outer surface of the first lead portion 63A excluding the outer surface on the third negative direction Z2 side. However, because the first lead portion 63A protrudes from the first columnar portion 62A, it does not have an outer surface on the third positive direction Z1 side.

[0043] When viewed in a cross section perpendicular to the first main surface 11A, the dimension of each portion of the first columnar wiring 61A in a direction parallel to the first main surface 11A is defined as the width dimension of the first columnar wiring 61A. The width dimension 63AW of the first lead-out portion 63A is smaller than the width dimension 62AW of the first columnar portion 62A at a point where the first lead-out portion 63A is connected on the same cross section.

[0044] The second columnar wiring 61B has a second columnar portion 62B and a second lead portion 63B. The second columnar wiring 61B is formed in a single step by electrolytic plating in a manufacturing method described below. Therefore, the second columnar portion 62B and the second lead portion 63B are integrally molded. The shapes of the second columnar portion 62B and the second lead portion 63B are both approximately quadrangular prisms corresponding to the shapes of the outer pad portion P2.

[0045] The second columnar section 62B is located in the same layer as the third magnetic layer 25 in the third axis Z direction. The second columnar section 62B extends in the third positive direction Z1 from the outer surface of the second insulating layer 32 on the third positive direction Z1 side. That is, the outer surface of the second columnar section 62B on the third negative direction Z2 side and the outer surface of the second insulating layer 32 on the third positive direction Z1 side are in contact with each other.

[0046] The second lead-out portion 63B is a portion of the second columnar wiring 61B that is located in the same layer as the second interlayer magnetic layer 24 in the third axis Z direction. The second lead-out portion 63B protrudes in the third negative direction Z2 from the outer surface of the second columnar section 62B on the third negative direction Z2 side. The second lead-out portion 63B penetrates the second insulating layer 32. In addition, the dimension of the second lead-out portion 63B in the third axis Z direction is the same as the dimension of the second insulating layer 32. Therefore, in the third axis Z direction, the position of the second lead-out portion 63B, the position of the second insulating layer 32, the position of the second interlayer magnetic layer 24, and the position of the first lead-out portion 63A are the same.

[0047] An outer surface on the third negative direction Z2 side, which is one end of the second lead portion 63B, is in contact with a surface parallel to the first main surface 11A of the outer pad portion P2. The outer edge of the second lead portion 63B is parallel to the outer edge of the outer pad portion P2. When viewed in the third positive direction Z1, the outer edge of the second lead portion 63B is parallel to the outer edge of the second columnar portion 62B. When viewed in the third positive direction Z1, the area enclosed by the outer edge of the second columnar portion 62B is 1.3 times or less the area enclosed by the outer edge of the second lead portion 63B.

[0048] A side surface 63BS of the second lead portion 63B is in contact with the second insulating layer 32. The side surface 63BS of the second lead portion 63B refers to the outer surface of the second lead portion 63B excluding the outer surface on the third negative direction Z2 side. However, because the second lead portion 63B protrudes from the second columnar portion 62B, it does not have an outer surface on the third positive direction Z1 side.

[0049] When viewed in a cross section perpendicular to first main surface 11A, the dimension of each portion of second columnar wiring 61B in a direction parallel to first main surface 11A is defined as the width dimension of second columnar wiring 61B. Width dimension 63BW of second lead-out portion 63B is smaller than width dimension 62BW of second columnar portion 62B at a point where second lead-out portion 63B is connected on the same cross section.

[0050] (Manufacturing Method) Next, a description will be given of a manufacturing method for the inductor component 10 according to the first embodiment. The manufacturing method for the inductor component 10 uses a so-called semi-additive process (SAP).

[0051] 5 , the method for manufacturing the inductor component 10 includes a base preparation step S11, an adhesive layer formation step S12, and a seed layer formation step S13. Furthermore, the method for manufacturing the inductor component 10 includes a first insulating layer formation step S14, a resin wall formation step S15, an inductor wiring formation step S16, a second insulating layer formation step S17, and a columnar wiring formation step S18. Furthermore, the method for manufacturing the inductor component 10 includes an insulating layer cutting step S19, a first element body formation step S20, a solder resist formation step S21, a seed layer removal step S22, a second element body formation step S23, an external electrode formation step S24, and a singulation step S25.

[0052] 6, first, a base preparation step S11 is performed. Specifically, a plate-shaped base substrate 91 is prepared. The base substrate 91 is made of ceramic. The dimensions of a main surface 91A of the base substrate 91 are such that a plurality of inductor components 10 can be formed thereon.

[0053] Here, the axis perpendicular to the main surface 91A of the base substrate 91 is defined as the third axis Z. Furthermore, the direction along the third axis Z in which the first main surface 11A faces is defined as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is defined as the third negative direction Z2. In other words, the third positive direction Z1 is the "upward direction," and the third negative direction Z2 is the "downward direction." That is, the "upper surface" is the surface facing the third positive direction Z1. The "lower surface" is the surface facing the third negative direction Z2. Note that the third positive direction Z1 during the manufacture of the inductor component 10 corresponds to the third positive direction Z1 in the inductor component 10 after manufacture. The same applies to the third negative direction Z2.

[0054] 7, an adhesive layer forming step S12 is performed. In the adhesive layer forming step S12, an adhesive layer 92 having adhesive properties is applied onto the main surface 91A of the base substrate 91. Specifically, the material of the adhesive layer 92 is a resin such as polyimide.

[0055] Next, as shown in FIG. 8 , a seed layer formation step S13 is performed. In the seed layer formation step S13, a conductive seed layer 93 is formed on the main surface 91A of the base substrate 91. Specifically, the seed layer 93 is formed on the upper surface of the adhesive layer 92 by sputtering. The material of the seed layer 93 is copper. Note that the seed layer 93 formed in the seed layer formation step S13 in this embodiment is not so-called patterned. For example, the seed layer 93 is formed over the entire main surface 91A of the base substrate 91.

[0056] Next, as shown in FIG. 9 , a first insulating layer forming step S14 is performed. In the first insulating layer forming step S14, a first insulating layer 31 having first openings 94 of a predetermined wiring pattern is formed on the upper surface of the seed layer 93 by photolithography. The position and shape of the first openings 94 correspond to the position and shape of the protrusions 53 of the inductor wiring 51 to be formed in a later step. Furthermore, because the protrusions 53 extend along the wiring main body 52, the shape of the first openings 94 also corresponds to the shape of the wiring main body 52 of the inductor wiring 51. Meanwhile, the range of the first openings 94 is slightly narrower than the range in which the wiring main body 52 is formed. Thus, the "predetermined wiring pattern" refers to the position and shape along the inductor wiring 51 formed in the inductor wiring forming step S16.

[0057] 10 , a resin wall formation step S15 is performed. In the resin wall formation step S15, a resin wall 41 is formed on the upper surface of the first insulating layer 31 along the outer edge of the first opening 94 by photolithography. At this time, the resin wall 41 is formed at a position slightly spaced apart from the edge of the first opening 94.

[0058] 11 , an inductor wiring formation step S16 is performed. In the inductor wiring formation step S16, power is supplied to the seed layer 93 to form the inductor wiring 51 by electrolytic plating. More specifically, the wiring main body 52 is formed in the space surrounded by the resin wall 41, and a protruding portion 53 that protrudes from the wiring main body 52 and extends along the wiring main body 52 is integrally formed in the first opening 94. In the inductor wiring formation step S16, the inductor wiring 51 is formed by a single electrolytic plating process, so that the wiring main body 52 and the protruding portion 53 are integrally formed.

[0059] 12 , a second insulating layer forming step S17 is performed. In the second insulating layer forming step S17, a second insulating layer 32 having a predetermined pattern of second openings 95 is formed on the upper surface of the wiring body 52 by photolithography. The position and shape of the second openings 95 correspond to the positions and shapes of the first lead portion 63A and the second lead portion 63B to be formed later. Meanwhile, the range of the second openings 95 is slightly narrower than the range in which each columnar portion is formed.

[0060] Next, as shown in FIG. 13 , a pillar wiring forming process S18 is performed. In the pillar wiring forming process S18, power is supplied to the seed layer 93, and electrolytic plating is performed via the inductor wiring 51 to form each lead portion within the second opening 95. Also, pillar portions are integrally formed on the third positive direction Z1 side of the lead portion and the second insulating layer 32. Specifically, although not shown, an auxiliary wall made of resin is formed on the upper surface of the second insulating layer 32 along the outer edge of the second opening 95 by photolithography. At this time, the auxiliary wall is formed at a position slightly spaced apart from the edge of the second opening 95. Next, each pillar portion is formed within the space surrounded by the auxiliary wall by electrolytic plating. At the same time, a first lead portion 63A protruding from the first columnar portion 62A is integrally formed within the second opening 95, and a second lead portion 63B protruding from the second columnar portion 62B is integrally formed. Next, the auxiliary wall is removed to form each pillar wiring.

[0061] 14 , an insulating layer cutting step S19 is performed. In the insulating layer cutting step S19, an excess portion of the first insulating layer 31 is removed by a laser. Specifically, a portion of the first insulating layer 31 that does not overlap with the region where the inductor wiring 51 and the resin wall 41 are present when viewed from a direction perpendicular to the main surface 91A of the base substrate 91 is cut so that the seed layer 93 is exposed.

[0062] 15 , a first element body forming step S20 is performed. In the first element body forming step S20, a magnetic layer 20 containing a magnetic material is formed around the inductor wiring 51, each lead-out portion, and each columnar portion. Specifically, magnetic layers 20 other than the first magnetic layer 21 are formed around the first insulating layer 31 covering the protrusion 53, around the resin wall 41 covering the wiring main body 52, around the second insulating layer 32 covering the two lead-out portions, and around the two columnar portions.

[0063] More specifically, in the first element body forming step S20, first, a resin containing magnetic powder is applied to the upper surface of the seed layer 93. At this time, the resin containing magnetic powder is applied so as to cover the upper surfaces of each columnar wiring. Next, the resin containing magnetic powder is hardened by pressing. After that, the upper surface side of the resin is removed until the upper surfaces of each columnar wiring are exposed. As a result, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are formed on the upper surface side of the seed layer 93. Note that in FIGS. 15 to 20, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are illustrated indistinguishably as the magnetic layer 20.

[0064] 16, a solder resist forming step S21 is performed. In the solder resist forming step S21, a solder resist 70 is formed on the upper surface of the third magnetic layer 25 and on the upper surfaces of each columnar wiring in areas where the first external electrode 81A and the second external electrode 81B are not to be formed. Specifically, an insulating resin is patterned in these areas by photolithography. Note that the product in the state from the inductor wiring forming step S16 to the seed layer removing step S22, in which the base substrate 91 is removed, can be treated as a substrate 99 for manufacturing an inductor component.

[0065] 17, a seed layer removal step S22 is performed. In the seed layer removal step S22, first, the base substrate 91 is cut and removed. Next, the adhesive layer 92 is removed by a method such as desmearing or ashing. After that, the seed layer 93 is removed by etching.

[0066] Next, as shown in FIG. 18 , a second element body forming step S23 is performed. In the second element body forming step S23, a first magnetic layer 21 containing a magnetic material is formed on the lower surfaces of the first insulating layer 31 and the first interlayer magnetic layer 22. Specifically, in the second element body forming step S23, a resin containing magnetic powder is first applied to the lower surfaces of the first insulating layer 31 and the first interlayer magnetic layer 22. Next, the resin containing magnetic powder is hardened by pressing. Thereafter, the lower surface side of the resin is ground so that the dimensions of the inductor component 10 become the desired values. As a result, the first magnetic layer 21 is formed on the surfaces of the first insulating layer 31 and the first interlayer magnetic layer 22 facing the third negative direction Z2. Note that in FIGS. 18 to 20 , the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are all illustrated indistinguishably as the magnetic layer 20.

[0067] Next, as shown in FIG. 19 , the external electrode formation step S24 is performed. In the external electrode formation step S24, a first external electrode 81A and a second external electrode 81B are formed. The areas in which each external electrode is formed are the areas of the upper surface of the third magnetic layer 25 and the upper surfaces of each columnar wiring that are not covered by the solder resist 70. Copper plating, nickel plating, and gold plating are performed in this order on these areas using an electroless plating method. As a result, the first external electrode 81A and the second external electrode 81B are formed in the above areas. Note that in FIGS. 19 and 20 , the copper, nickel, and gold plating layers are shown without distinction.

[0068] Next, as shown in Fig. 20, a singulation step S25 is performed. In the singulation step S25, the inductor components 10 are singulated by dicing. Specifically, the integrally molded multiple inductor components 10 are separated into individual inductor components 10. In Fig. 20, the cut surface SL of the inductor components 10 formed by dicing is indicated by a dashed dotted line. Through the above steps, the inductor components 10 are manufactured.

[0069] (Effects of the First Embodiment) (1-1) In the above embodiment, the inductor wiring 51 includes a wiring main body 52 and a protruding portion 53. Since the protruding portion 53 protrudes from the wiring main body 52, the protruding portion 53 extends to the position where the first insulating layer 31 is located in the third axis Z direction. This increases the cross-sectional area of ​​the inductor wiring 51 by the amount of the protruding portion 53. As a result, the DC resistance of the inductor wiring 51 can be reduced. Furthermore, the protruding portion 53 protrudes from the outer surface of the wiring main body 52 on the third negative direction Z2 side and extends along the wiring main body 52. ​​In other words, the protruding portion 53 is present within the range of the outer surface of the wiring main body 52 on the third negative direction Z2 side. These factors reduce the risk of short-circuiting between different portions of the protruding portion 53.

[0070] (1-2) In the above embodiment, the wiring body 52 and the protruding portion 53 are integrally molded. This prevents the electric field from being disturbed at the boundary between the wiring body 52 and the protruding portion 53. In other words, the DC resistance can be reduced compared to when there is a clear boundary between the wiring body 52 and the protruding portion 53.

[0071] (1-3) In the above embodiment, the inductor wiring 51 and conductive objects are not exposed on the side surface 11C of the element body 11. Specifically, for example, the current-carrying wiring for forming the inductor wiring 51 by electrolytic plating is not exposed. As a result, there is no risk that corrosion of the conductive objects exposed on the side surface 11C of the element body 11 will invade the inductor wiring 51 inside the element body 11.

[0072] (1-4) In the above embodiment, the outer surface of the protrusion 53 on the third negative direction Z2 side is in contact with the element body 11. Therefore, it is not in contact with other conductive objects. This reduces the risk of short-circuiting between different parts of the protrusion 53.

[0073] (1-5) In the above embodiment, the side surface 53S of the protrusion 53 is covered with the first insulating layer 31. This further improves the insulation between different portions of the protrusion 53.

[0074] (1-6) In the above embodiment, the inductor component 10 has pillar-shaped wirings, which allow the inductor wirings 51 to be electrically connected to an external electronic board or the like on the first main surface 11A.

[0075] (1-7) In the above embodiment, the inductor wiring 51 and each pillar wiring are in contact with each other. Compared to when another metal layer is interposed between the inductor wiring 51 and the pillar wiring, the boundary surface from the inductor wiring 51 to the pillar wiring is reduced. Therefore, it is possible to prevent the electrical resistance between the inductor wiring 51 and the pillar wiring from becoming high.

[0076] (1-8) In the above embodiment, when forming the inductor wiring 51, a wiring pattern is formed in the first insulating layer 31. This reduces the risk of short-circuiting between different locations of the inductor wiring 51, even if the distance between these locations is narrow. Therefore, the narrow space within the element body 11 can be used more effectively than when a wiring pattern is formed using a seed shaped in the shape of a wiring pattern.

[0077] (1-9) In the above embodiment, the substrate 99 for manufacturing the inductor component includes a base substrate 91. This allows the base substrate 91 to be gripped and handled during the manufacturing process of the inductor component 10. For example, this reduces the possibility of damaging the inductor component 10 compared to when the element body 11 is directly gripped and handled.

[0078] (1-10) In the above embodiment, in the manufacturing process of the inductor component 10, the adhesive layer 92 is interposed between the base substrate 91 and the seed layer 93. This makes it easier to separate the seed layer 93 from the base substrate 91 when removing the base substrate 91 compared to cutting the base substrate 91, etc. This reduces the effort required to manufacture the inductor component 10.

[0079] (1-11) In the above embodiment, the inductor wiring 51 is spiral-shaped, and the number of turns of the inductor wiring 51 is greater than one. In other words, the inductor wiring 51 has portions where different portions are parallel to each other. Even in such a case, the inductor wiring 51 has the protruding portion 53, so the cross-sectional area of ​​the inductor wiring 51 can be ensured without increasing the width of the inductor wiring 51. In other words, it is easy to prevent a short circuit between the parallel portions of the inductor wiring 51 while ensuring the cross-sectional area of ​​the inductor wiring 51.

[0080] (1-12) In the above embodiment, each pillar-shaped wiring includes a pillar portion and a lead-out portion. Each pillar-shaped portion is connected to the inductor wiring 51 via the lead-out portion, which is an integrally molded part with the pillar-shaped portion. In other words, no other conductive portion, such as the seed layer 93, is interposed between each pillar-shaped wiring and the inductor wiring 51. Therefore, the manufacturing process for the inductor component 10 can be simplified compared to when other conductive portions are present between each pillar-shaped wiring and the inductor wiring 51.

[0081] (1-13) In the above embodiment, when viewed in the third positive direction Z1, the outer edge of the first lead portion 63A is parallel to the outer edge of the first columnar portion 62A. The outer edge of the first lead portion 63A is also parallel to the outer edge of the inner pad portion P1. This simplifies the structure compared to when the outer edges are not parallel. The same applies to the outer edges of the second columnar wiring 61B and the outer pad portion P2.

[0082] (1-14) In the above embodiment, when viewed in the third positive direction Z1, the area enclosed by the outer edge of the first columnar section 62A is 1.3 times or less the area enclosed by the outer edge of the first lead section 63A. With this level of area difference, it is highly likely that the columnar section can be formed as designed by supplying power via the inductor wiring 51, without using a conductive section such as the seed layer 93. The same is true for the second columnar section 62B and the second lead section 63B.

[0083] (1-15) In the above embodiment, each lead portion is covered with the second insulating layer 32. This improves the insulation between each lead portion and the element body 11. (1-16) In the above embodiment, in the columnar wiring formation step S18, each columnar portion and lead portion are integrally molded. That is, in the manufacturing process of the inductor component 10, no other conductive portion, such as the seed layer 93, is interposed between each columnar wiring and the inductor wiring 51. Therefore, the manufacturing process of the inductor component 10 can be simplified compared to when other conductive portions are present between each columnar wiring and the inductor wiring 51.

[0084] <Inductor Component of Second Embodiment> Hereinafter, a second embodiment of an inductor component and a method for manufacturing an inductor component will be described.

[0085] (Overall Configuration of Inductor Component) As shown in Figures 21 and 22, the inductor component 110 of the second embodiment differs from the first embodiment mainly in that the inductor component 110 includes a first inductor wiring 151A and a second inductor wiring 151B, a first external electrode 81A to a fourth external electrode 81D, and the element body 11 does not include a second interlayer magnetic layer 24. Furthermore, since the element body 11 does not include the second interlayer magnetic layer 24, the inductor component 110 does not include a second insulating layer 32. Furthermore, each columnar wiring does not have a lead-out portion. Note that in the following description, components similar to those of the first embodiment will be denoted by the same reference numerals, and description thereof will be omitted or simplified.

[0086] As shown in Fig. 21 , among the outer surfaces of the element body 11, the outer shape of the first main surface 11A and the outer shape of the second main surface 11B are approximately square. As shown in Fig. 22 , the inductor component 110 has a first insulating layer 131. When the inductor component 110 is seen through from the third positive direction Z1 side, the first insulating layer 131 extends within the element body 11 on a plane parallel to the first main surface 11A. The first insulating layer 131 is in contact with the surface of the first magnetic layer 21 on the third positive direction Z1 side. In the third axis Z direction, the position of the first insulating layer 131 is the same as that of the first interlayer magnetic layer 22. In this embodiment, the inductor component 110 includes a first inductor wiring 151A and a second inductor wiring 151B, and accordingly, the first insulating layer 131 is present in two separate locations.

[0087] The inductor element 110 includes two inductor wirings. Specifically, the inductor element 110 includes a first inductor wiring 151A and a second inductor wiring 151B. The first inductor wiring 151A and the second inductor wiring 151B are located on the same layer in the third axis Z direction. When the inductor element 110 is seen through from the third positive direction Z1 side, the first inductor wiring 151A and the second inductor wiring 151B extend in an S-shape.

[0088] Hereinafter, the wiring portion of the first inductor wiring 151A will be referred to as the first wiring portion LA, the two pad portions as the first pad portions PA, the wiring body as the first wiring body 152A, and the protruding portion as the first protruding portion 153A. The first pad portion PA located on the first positive direction X1 side will be referred to as the first end pad portion P101A, and the first pad portion PA located on the first negative direction X2 side will be referred to as the second end pad portion P102A.

[0089] The wiring portion of the second inductor wiring 151B is referred to as the second wiring portion LB, the two pad portions are referred to as the second pad portion PB, the wiring body is referred to as the second wiring body 152B, and the protrusion is referred to as the second protrusion portion 153B. The second pad portion PB located on the first positive direction X1 side is referred to as the first end pad portion P101B, and the second pad portion PB located on the first negative direction X2 side is referred to as the second end pad portion P102B.

[0090] The first protrusion 153A of the first inductor wiring 151A has the same configuration as the protrusion 53 of the inductor component 10 in the first embodiment. That is, as shown in FIG. 23 , the outer surface of the first protrusion 153A on the third negative direction Z2 side is in contact with the element body 11. The side surface 153AS of the first protrusion 153A is in contact with the first insulating layer 131. When viewed in the third positive direction Z1, the first protrusion 153A extends along the first wiring main body 152A. Specifically, the first protrusion 153A extends from the first end pad portion P101A, via the first wiring portion LA, to the second end pad portion P102A. That is, the first protrusion 153A extends over substantially the entire area of ​​the first wiring main body 152A. 22 , when viewed in the third positive direction Z1, the first protrusion 153A is located within a range surrounded by the outer edge of the first wiring main body 152A. More specifically, as shown in FIG. 23 , when viewed in a cross section perpendicular to the first main surface 11A, the width of each portion of the first inductor wiring 151A is defined as the dimension parallel to the first main surface 11A. The width 153AW of the first protrusion 153A is smaller than the width 152AW of the first wiring main body 152A at the point where the first protrusion 153A is connected. Although not shown, the configuration of the second protrusion 153B of the second inductor wiring 151B is the same as the configuration of the first protrusion 153A.

[0091] 23 , the outer surface of the first inductor wiring 151A on the third positive direction Z1 side is in contact with the outer surface of the third magnetic layer 25 on the third negative direction Z2 side. Although not shown, the outer surface of the second inductor wiring 151B on the third positive direction Z1 side is in contact with the outer surface of the third magnetic layer 25 on the third positive direction Z1 side, similar to the first inductor wiring 151A.

[0092] 22 , the inductor element 110 includes four pillar wirings. Specifically, the inductor element 110 includes a first pillar wiring 161A, a second pillar wiring 161B, a third pillar wiring 161C, and a fourth pillar wiring 161D. Each pillar wiring has a substantially rectangular pillar shape corresponding to the shape of the pad to which the pillar wiring is connected.

[0093] In this embodiment, when the inductor element 110 is viewed in the third negative direction Z2, the outer edge of each columnar wiring substantially coincides with the outer edge of the corresponding pad. Therefore, the area of ​​the region surrounded by the outer edge of each columnar wiring is the same as the area of ​​the region surrounded by the outer edge of the pad to which the columnar wiring is connected. However, the areas being the same allows for a manufacturing error of, for example, 5%.

[0094] 23 , each pillar-shaped wiring is located in the same layer as the third magnetic layer 25 in the third axis Z direction. One end of the first pillar-shaped wiring 161A is in contact with a surface of the first pad portion PA that is parallel to the first main surface 11A of the first end pad portion P101A. In this embodiment, the difference between the dimension P101AW of the first end pad portion P101A in the direction parallel to the first main surface 11A and the dimension 161AW of the first pillar-shaped wiring 161A in the direction parallel to the first main surface 11A is substantially zero.

[0095] One end of the second columnar wiring 161B is in contact with a surface of the first pad portion PA that is parallel to the first main surface 11A of the second end pad portion P102A. In this embodiment, the difference between the dimension P102AW of the second end pad portion P102A in the direction parallel to the first main surface 11A and the dimension 161BW of the second columnar wiring 161B in the direction parallel to the first main surface 11A is substantially zero.

[0096] Although not shown in the drawings, the same applies to the third columnar wiring 161C and the fourth columnar wiring 161D. In this embodiment, when viewed in a cross section perpendicular to the first main surface 11A, the dimensions of each pad and the dimensions of the columnar wiring to which the pad is connected are the same in a direction parallel to the first main surface 11A. However, the "same" dimensions allow for a manufacturing error of, for example, 5%.

[0097] 21, the inductor component 110 has four external electrodes: a first external electrode 81A, a second external electrode 81B, a third external electrode 81C, and a fourth external electrode 81D.

[0098] The first external electrode 81A is located on the first main surface 11A on the first positive direction X1 side and the second positive direction Y1 side with respect to the geometric center of the first main surface 11A. The second external electrode 81B is located on the first negative direction X2 side and the second positive direction Y1 side with respect to the geometric center on the first main surface 11A. The third external electrode 81C is located on the first main surface 11A on the first positive direction X1 side and the second negative direction Y2 side with respect to the geometric center on the first main surface 11A. The fourth external electrode 81D is located on the first negative direction X2 side and the second negative direction Y2 side with respect to the geometric center on the first main surface 11A.

[0099] The first external electrode 81A is in contact with a surface of the first columnar wiring 161A facing the third positive direction Z1. The second external electrode 81B is in contact with a surface of the second columnar wiring 161B facing the third positive direction Z1. The third external electrode 81C is in contact with a surface of the third columnar wiring 161C facing the third positive direction Z1. The fourth external electrode 81D is in contact with a surface of the fourth columnar wiring 161D facing the third positive direction Z1.

[0100] (Regarding the Manufacturing Method) As shown in Fig. 24 , the manufacturing method of the inductor element 110 according to the second embodiment differs from the manufacturing method of the first embodiment mainly in that it does not include the resin wall forming step S15, the second insulating layer forming step S17, and the insulating layer cutting step S19. Furthermore, the manufacturing method of the inductor element 110 according to the second embodiment differs from the manufacturing method of the first embodiment in that it includes the first DFR forming step S115, the second DFR forming step S117, and the DFR removing step S119. Note that Figs. 25 to 30 only show views corresponding to the cross-sectional view of the inductor element 110 shown in Fig. 23 . That is, although Figs. 25 to 30 only show a cross section passing through the first inductor wiring 151A, the first columnar wiring 161A, and the second columnar wiring 161B, the cross section passing through the second inductor wiring 151B, the third columnar wiring 161C, and the fourth columnar wiring 161D also has a similar configuration.

[0101] First, in the manufacturing method of the second embodiment, the base preparation step S111 to the first insulating layer formation step S114 are performed in the same manner as in the first embodiment. That is, as shown in FIG. 25 , in the second embodiment, after the first insulating layer formation step S114, an adhesive layer 92 is formed on the upper surface of the base substrate 91. A seed layer 93 is formed on the upper surface of the adhesive layer 92. At this time, the seed layer 93 is formed over the entire main surface 91A of the base substrate 91. A first insulating layer 131 is formed in two separate locations on the upper surface of the seed layer 93. The position and shape of the first opening 194 in the first insulating layer 131 correspond to the position and shape of the first protrusion 153A of the first inductor wiring 151A and the position and shape of the second protrusion 153B of the second inductor wiring 151B, which will be formed in a later step.

[0102] Next, as shown in FIG. 26 , a first DFR formation process S115 is performed. In the first DFR formation process S115, a first dry film resist DFR1 having two second openings 195 is formed on the upper surfaces of the seed layer 93 and the first insulating layer 131 by photolithography. The two second openings 195 have a predetermined pattern. Specifically, the position and shape of one second opening 195 correspond to the position and shape of the first wiring main body 152A to be formed later. The position and shape of the other second opening 195 correspond to the position and shape of the second wiring main body 152B to be formed later.

[0103] Next, as shown in FIG. 27 , an inductor wiring forming step S116 is performed. In the inductor wiring forming step S116, power is supplied to the seed layer 93 to form each inductor wiring by electrolytic plating. Specifically, a first wiring main body 152A is formed in one of the second openings 195 of the first dry film resist DFR1, and a first protruding portion 153A protruding from the first wiring main body 152A and extending along the first wiring main body 152A is integrally formed in one of the first openings 194. Furthermore, a second wiring main body 152B is formed in the other second opening 195, and a second protruding portion 153B protruding from the second wiring main body 152B and extending along the second wiring main body 152B is integrally formed in the other first opening 194.

[0104] 28, a second DFR formation step S117 is performed. In the second DFR formation step S117, a second dry film resist DFR2 having four third openings 196 is formed on the upper surface of the first dry film resist DFR1 by photolithography.

[0105] 29 , a pillar-shaped wiring formation step S118 is performed. In the pillar-shaped wiring formation step S118, first pillar-shaped wirings 161A to fourth pillar-shaped wirings 161D are formed in the four third openings 196. The positions and shapes of the first pillar-shaped wirings 161A to fourth pillar-shaped wirings 161D correspond to the positions and shapes of the four third openings 196. In this way, the first inductor wiring 151A, the second inductor wiring 151B, and the first pillar-shaped wirings 161A to fourth pillar-shaped wirings 161D are formed.

[0106] Next, a DFR removal step S119 is performed as shown in Fig. 30. In the DFR removal step S119, the first dry film resist DFR1 and the second dry film resist DFR2 are completely removed by etching.

[0107] 24, after the DFR removal step S119 is performed, the steps from the first element body formation step S120 to the singulation step S125 are performed in the same manner as in the first embodiment. This results in the manufacture of the inductor component 110 of the second embodiment. Note that the state from the inductor wiring formation step S116 to the removal of the base substrate 91 in the seed layer removal step S122 can be treated as a substrate 199 for inductor component manufacture.

[0108] (Effects of the Second Embodiment) According to the second embodiment, in addition to the effects (1-1) to (1-11) described above, the following effects are further achieved.

[0109] (2-1) In the above embodiment, the inductor element 110 includes a second inductor wiring 151B in addition to a first inductor wiring 151A. This allows the mounting area to be reduced compared to mounting two inductor elements each including one inductor wiring.

[0110] (2-2) In the above embodiment, when viewed in a cross section perpendicular to the first main surface 11A, there is no significant difference between the dimensions of each pad portion and the dimensions of each columnar wiring in a direction parallel to the first main surface 11A. Therefore, the DC resistance caused by this difference can be reduced compared to when the differences in the dimensions are large.

[0111] <Modifications> The above-described embodiments and the following modifications can be combined with each other to the extent that no technical contradiction occurs. For example, a modification of the first embodiment can be combined with the second embodiment to the extent that no technical contradiction occurs.

[0112] (Regarding Modifications of the First Embodiment) The shape of the element body 11 is not limited to that of the above embodiment. Furthermore, the element body 11 may not have a portion of the magnetic layer 20 as long as it functions as the inductor component 10.

[0113] The metal magnetic powder that is the material of the element body 11 is not limited to FeSiCr-based magnetic powder. For example, it may be FeCo-based, FeSiAr-based, iron oxide-based, or a combination of these. The organic resin that is the material of the element body 11 may be epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, or a combination of these, or may contain inorganic fillers in addition to these materials. The material of the element body 11 may also be a non-magnetic material.

[0114] The shape, number, position, and other configurations of the inductor wiring 51 are not limited to those of the above embodiment. They may be changed as appropriate depending on the shape of the element body 11 and the application of the inductor component 10. The inductor wiring 51 may be exposed on the side surface 11C of the element body 11.

[0115] The material of the inductor wiring 51 is not limited to a conductor primarily composed of copper, but may be a conductor primarily composed of Ag, Al, or Au. The protrusion 53 does not have to extend continuously from the inner pad portion P1 to the outer pad portion P2. For example, it may be a chain line extending intermittently along the inductor wiring 51. In other words, the protrusion 53 may be partially interrupted.

[0116] The protrusion 53 and the wiring main body 52 do not have to be integrally molded. For example, after forming the protrusion 53 by electrolytic plating, the electrolytic plating is stopped and then restarted to form the wiring main body 52. ​​Strictly speaking, this may result in an interface between the protrusion 53 and the wiring main body 52. ​​Even in this case, the wiring main body 52 can be considered to substantially protrude from the protrusion 53. Furthermore, when the protrusion 53 and the wiring main body 52 are formed as separate molded bodies, the materials of the two do not necessarily have to be the same.

[0117] The side surface 53S of the protrusion 53 does not have to be in contact with the first insulating layer 31. For example, another metal layer may be interposed between the protrusion 53 and the first insulating layer 31. The dimension of the protrusion 53 in a direction perpendicular to the first main surface 11A may be less than the dimension of the first insulating layer 31. In this case, the tip of the protrusion 53 does not protrude beyond the first insulating layer 31 in the third negative direction Z2. Therefore, even if a manufacturing error or the like occurs, the tip of the protrusion 53 is unlikely to spread in a direction parallel to the first main surface 11A. As a result, the tip of the protrusion 53 is prevented from unintentionally shorting to another conductive part.

[0118] The inductor component 10 does not need to include a columnar wiring. For example, the inductor wiring 51 may be exposed from the side surface 11C of the element body 11 and connected to the external electrode. The first lead portion 63A and the first columnar portion 62A do not need to be integrally molded. For example, after the first lead portion 63A is formed by electrolytic plating, the electrolytic plating is terminated and then electrolytic plating is restarted to form the first columnar portion 62A. Strictly speaking, this may result in an interface between the first lead portion 63A and the first columnar portion 62A. Even in this case, the first columnar portion 62A can be considered to substantially protrude from the first lead portion 63A. Furthermore, when the first lead portion 63A and the first columnar portion 62A are formed as separate molded components, the materials of the two need not necessarily be the same. The same applies to the second lead portion 63B and the second columnar portion 62B.

[0119] The configuration of each lead portion is not limited to the example of the above embodiment. For example, the outer edge of the first lead portion 63A does not have to be parallel to the outer edge of the first columnar portion 62A. The first lead portion 63A does not have to be in contact with the outer surface of the inner pad portion P1 that is parallel to the first main surface 11A. Furthermore, the outer edge of the first lead portion 63A does not have to be parallel to the outer edge of the inner pad portion P1. This also applies to the second lead portion 63B and the outer pad portion P2.

[0120] When viewed in the third positive direction Z1, the area enclosed by the outer edge of the first columnar section 62A may be more than 1.3 times larger than the area enclosed by the outer edge of the first lead section 63A. Even in this case, since the first columnar wiring 61A has the first lead section 63A, at least the effect described in (1-1) can be obtained. The same applies to the second lead section 63B.

[0121] The side surface 63AS of the first lead portion 63A does not have to be in contact with the second insulating layer 32. For example, another member may be interposed between the first lead portion 63A and the second insulating layer 32. The same applies to the second lead portion 63B.

[0122] The inductor component 10 does not need to include the external electrodes and the solder resist 70. For example, the columnar wirings may be exposed from the first main surface 11A. This allows the size of the inductor component 10 to be reduced.

[0123] In the method for manufacturing the inductor component 10, the order of the steps may be changed as long as the inductor component 10 can be manufactured. For example, the solder resist formation step S21 may be performed after the second element body formation step S23.

[0124] The material of the seed layer 93 is not limited to the examples in the above embodiment. For example, the seed layer 93 may be a single layer of copper or a single layer of silver, or may have multiple layers of titanium and copper, etc. The material of the seed layer 93 and the material of the protrusion 53 may be different. For example, the material of the seed layer 93 may be silver, and the material of the inductor wiring 51 including the protrusion 53 may be copper. This allows for a high etch rate when the inductor wiring 51 is peeled off from the seed layer 93 by etching. This also applies to the substrate 99 used to manufacture inductor components.

[0125] In the adhesive layer forming step S12 to the solder resist forming step S21, the inductor wiring 51 and the like may be formed on both surfaces of the base substrate 91. In this case, when the inductor wiring 51 and the like is formed on the third negative direction Z2 side of the base substrate 91, each step may be performed with the third negative direction Z2 as the upward direction.

[0126] The adhesive layer forming step S12 may be omitted. The seed layer 93 may be formed directly on the upper surface of the base substrate 91. In other words, the substrate 99 for manufacturing inductor elements does not need to include the adhesive layer 92.

[0127] In the first insulating layer forming step S14, a negative photosensitive resin may be used as the material for the first insulating layer 31. In this case, the degree of photocuring of the portion of the first insulating layer 31 to be removed in the insulating layer cutting step S19 may be reduced to make that portion easier to peel off in the insulating layer cutting step S19.

[0128] Depending on the configuration of the inductor component 10 to be manufactured, one or more steps selected from the second insulating layer forming step S17, the columnar wiring forming step S18, the solder resist forming step S21, the second element body forming step S23, and the external electrode forming step S24 may be omitted.

[0129] The second insulating layer forming step S17 may be omitted, and the pillar-shaped wiring forming step S18 may be performed. In this case, in the pillar-shaped wiring forming step S18, an auxiliary wall may be formed on the outer surface of the inductor wiring 51 on the third positive direction Z1 side, and each pillar-shaped wiring may be formed.

[0130] In the insulating layer cutting step S19, the method for removing a portion of the first insulating layer 31 is not limited to a method using a laser. For example, a portion of the first insulating layer 31 may be removed by sandblasting. In this case, it is preferable that the second insulating layer 32 is thicker than the first insulating layer 31. Alternatively, it is preferable that the sandblasting resistance of the second insulating layer 32 is higher than that of the first insulating layer 31.

[0131] In the seed layer removal step S22, the seed layer 93 may be removed by etching. If the second element body formation step S23 is omitted, for example, an insulating layer may be formed on the lower surfaces of the protrusion 53, the first insulating layer 31, and the magnetic layer 20 formed in the first element body formation step S20.

[0132] In the external electrode formation step S24, the method for forming each external electrode is not limited to the example in the above embodiment. For example, copper plating may not be performed. As shown in the examples illustrated in FIGS. 31 and 32 , a specific external electrode may be connected to multiple inductor wirings. The inductor component 210 illustrated in FIG. 31 has five external electrodes. Specifically, the inductor component 210 has a first external electrode 81A on the first negative direction X2 side and the second positive direction Y1 side of the first main surface 11A of the element body 11. The inductor component 210 has a second external electrode 81B on the first positive direction X1 side and the second positive direction Y1 side of the first main surface 11A. The inductor component 210 has a third external electrode 81C on the first negative direction X2 side and the second negative direction Y2 side of the first main surface 11A. The inductor component 210 has a fourth external electrode 81D on the first positive direction X1 side and the second negative direction Y2 side of the first main surface 11A. The inductor element 210 has a fifth external electrode 81E at a position including approximately the geometric center of the first main surface 11A.

[0133] 32 , an inductor element 210 in one example of the modified example has four inductor wirings 51. Specifically, the inductor element 210 has a first inductor wiring 51A on the first negative direction X2 side and the second positive direction Y1 side inside the element body 11. The inductor element 210 has a second inductor wiring 51B on the first positive direction X1 side and the second positive direction Y1 side inside the element body 11. The inductor element 210 has a third inductor wiring 51C on the first negative direction X2 side and the second negative direction Y2 side inside the element body 11. The inductor element 210 has a fourth inductor wiring 51D on the first positive direction X1 side and the second negative direction Y2 side inside the element body 11.

[0134] In this example of the modification, specifically, the outer pad portion P2A of the first inductor wiring 51A is connected to the first external electrode 81A. The outer pad portion P2B of the second inductor wiring 51B is connected to the second external electrode 81B. The outer pad portion P2C of the third inductor wiring 51C is connected to the third external electrode 81C. The outer pad portion P2D of the fourth inductor wiring 51D is connected to the fourth external electrode 81D. The inner pad portion P1A of the first inductor wiring 51A, the inner pad portion P1B of the second inductor wiring 51B, the inner pad portion P1C of the third inductor wiring 51C, and the inner pad portion P1D of the fourth inductor wiring 51D are connected to the fifth external electrode 81E. Therefore, the fifth external electrode 81E, which is one of the multiple external electrodes, is connected to both the first end of the first inductor wiring 51A and the first end of the second inductor wiring 51B. This prevents a potential difference from occurring between the external electrodes connected to the inductor wirings. An electronic component having such a configuration is suitable as an inductor used in, for example, a multi-phase DC / DC converter.

[0135] (Regarding a Modification of the Second Embodiment) As shown in FIG. 33 , in a direction perpendicular to the first main surface 11A, the dimension 153AH of the first protrusion 153A may be less than the dimension 131H of the first insulating layer 131. In this case, the tip of the first protrusion 153A does not protrude from the first insulating layer 131 in the third negative direction Z2. Therefore, even if a manufacturing error or the like occurs, the tip of each protrusion is unlikely to spread in a direction parallel to the first main surface 11A. As a result, the tip of the first protrusion 153A is prevented from unintentionally shorting to another conductive part. The same applies to the second protrusion 153B.

[0136] 33 , the inductor element 110 may have an insulating coating CF that covers the side surface of the first inductor wiring 151A, the side surface of the first insulating layer 131 that is not in contact with the first protrusion 153A, the side surface of the first columnar wiring 161A, and the side surface of the second columnar wiring 161B. This improves the insulation between the inductor wirings and between the columnar wirings. The same applies to the second inductor wiring 151B.

[0137] The size of the end face of each columnar wire on the third negative direction Z2 side may be smaller than the size of the face of the pad portion to which the columnar wire is connected on the third positive direction Z1 side. In this case, when viewed in a cross section perpendicular to the first main surface 11A, the difference between the dimension P101AW of the first end pad portion P101A of the first pad portion PA and the dimension 161AW of the first columnar wire 161A in the direction parallel to the first main surface 11A is preferably 20 μm or less. Similarly, when viewed in a cross section perpendicular to the first main surface 11A, the difference between the dimension P102AW of the second end pad portion P102A of the first pad portion PA and the dimension 161BW of the second columnar wire 161B in the direction parallel to the first main surface 11A is preferably 20 μm or less.

[0138] This means that even if some manufacturing error occurs in the position of the first dry film resist DFR1 and the position of the second dry film resist DFR2 during the manufacturing process of the inductor component 110, the columnar wiring can be kept within the range of the corresponding pad portion.

[0139] However, even if the difference is greater than 20 μm, at least the effect described in (1-1) can be obtained by having each wiring body have a protrusion. This also applies to the second pad portion PB.

[0140] 33, the inductor component 110 does not need to include external electrodes and a solder resist 70. In this case, for example, it is sufficient that each columnar wiring is exposed from the first main surface 11A. This allows the size of the inductor component 110 to be reduced. In this example, the surface of the columnar wiring on the third positive direction Z1 side functions as an external electrode.

[0141] The inductor wirings and the pillar wirings may be formed by performing other steps, omitting one or more steps selected from the first DFR formation step S115 and the second DFR formation step S117. For example, instead of performing the second DFR formation step S117, auxiliary walls may be formed on the upper surfaces of the inductor wirings, and then electrolytic plating may be performed to form the pillar wirings.

[0142] The electrical conductivity of the outer surface of the first protrusion 153A facing the third negative direction Z2 may be lower than the electrical conductivity of the first wiring body 152A. For example, the tip of the first protrusion 153A may be oxidized by heat treatment to reduce the electrical conductivity. This improves the insulation between the first inductor wiring 151A and the element body 11. The same applies to the second protrusion 153B.

[0143] The outer surface of the first protrusion 153A on the third negative direction Z2 side may not be in contact with the element body 11. For example, as shown in FIG. 34 , the inductor component 110 may include a metal layer ML covering the outer surface of the first protrusion 153A on the third negative direction Z2 side. In this case, when viewed in the third positive direction Z1, the metal layer ML preferably extends along the first protrusion 153A. For example, selecting nickel as the material for the metal layer ML can suppress oxidation of the outer surface of the first protrusion 153A on the third negative direction Z2 side and deterioration of the outer surface of the first insulating layer 131 on the third negative direction Z2 side. Note that the metal layer ML may be formed by removing the base substrate 91 and etching the seed layer 93 so that it covers the first protrusion 153A, instead of performing the seed layer removal step S122. Furthermore, the electrical conductivity of the metal layer ML is preferably lower than that of the first wiring main body 152A. This improves the insulation between the first inductor wiring 151A and the element body 11. The same applies to the second protruding portion 153B.

[0144] 35, after the DFR removal step S119 and before the first element body formation step S120, a step of covering the side surfaces of each inductor wiring and each columnar wiring with an insulating coating CF may be performed. The insulating coating CF may be formed by, for example, chemical vapor deposition (CVD). This improves the insulation between the inductor wirings and between the columnar wirings.

[0145] <Supplementary Notes> The technical concepts that can be derived from the above-described embodiment and modifications are described below. [1] An inductor component comprising: an element body containing a magnetic material and having a planar main surface; an insulating layer located within the element body and extending on a plane parallel to the main surface; and an inductor wiring extending within the element body parallel to the main surface, wherein when one direction orthogonal to the main surface is defined as a positive direction and the direction opposite to the positive direction is defined as a negative direction, the inductor wiring comprises: a wiring body extending on an outer surface of the insulating layer on the positive direction side; and a protrusion protruding from the outer surface of the wiring body on the negative direction side to the negative direction side, the outer surface of the wiring body on the negative direction side and the outer surface of the insulating layer on the positive direction side are in contact with each other, when viewed in the positive direction, the protrusion is located within a range surrounded by the outer edge of the wiring body and extends along the wiring body, and when viewed in a cross section orthogonal to the main surface, a dimension of the protrusion in a direction parallel to the main surface is smaller than a dimension of the wiring body in a direction parallel to the main surface at a point where the protrusion is connected.

[0146] [2] The inductor component according to [1], wherein the wiring main body and the protrusion are integrally molded. [3] The inductor component according to [1] or [2], wherein, when the outer surfaces of the element body excluding the main surface and the surface opposite to the main surface are defined as side surfaces of the element body, the inductor wiring and the conductive object electrically connected to the inductor wiring are not exposed on the side surfaces of the element body.

[0147] [4] The inductor component according to any one of [1] to [3], wherein the outer surface of the protrusion on the negative side is in contact with the element body.

[0148] [5] The inductor component according to any one of [1] to [4], wherein the electrical conductivity of the outer surface of the protrusion on the negative side is lower than the electrical conductivity of the wiring body.

[0149] [6] The inductor component according to any one of [1] to [3], further comprising a metal layer covering an outer surface of the protrusion on the negative side, wherein when viewed in the positive direction, the metal layer extends along the protrusion.

[0150] [7] The inductor component according to [6], wherein the electrical conductivity of the metal layer is lower than the electrical conductivity of the wiring body.

[0151] [8] An inductor component according to any one of [1] to [7], wherein when the outer surfaces of the protrusion, excluding the outer surface on the negative side, are considered as side surfaces, the side surfaces of the protrusion are in contact with the insulating layer.

[0152] [9] The inductor component according to [8], wherein the dimension of the protrusion in a direction perpendicular to the main surface is less than the dimension of the insulating layer.

[0153]

[10] The inductor component according to any one of [1] to [9], further comprising a columnar wiring connected to the outer surface of the wiring body on the positive side and extending within the element body in a direction intersecting the main surface.

[0154]

[11] The inductor component according to

[10] , wherein the pillar-shaped wiring is in contact with the outer surface of the wiring body on the positive side.

[0155]

[12] The inductor component according to

[11] , wherein the wiring body includes a wiring portion extending parallel to the main surface and a pair of pad portions connected to each end of the wiring portion, one end of the pillar-shaped wiring is in contact with a surface of the pad portion parallel to the main surface, and when viewed in cross section in a direction perpendicular to the main surface, the difference in dimension between the pad portion and the pillar-shaped wiring in a direction parallel to the main surface is 20 μm or less.

[0156]

[13] An inductor component according to any one of

[10] to

[12] , further comprising an insulating coating covering the side surfaces of the wiring body, the side surfaces of the pillar-shaped wiring, and the side surfaces of the insulating layer, when the outer surfaces of the wiring body excluding the outer surface on the positive side and the outer surface on the negative side are defined as side surfaces of the wiring body, the outer surfaces of the pillar-shaped wiring excluding the outer surface on the positive side and the outer surface on the negative side are defined as side surfaces of the pillar-shaped wiring, and the outer surfaces of the insulating layer excluding the outer surface on the positive side and the outer surface on the negative side are defined as side surfaces of the insulating layer.

[0157]

[14] The inductor component according to any one of [1] to

[13] , further comprising: a second inductor wiring that is located in the same layer as the first inductor wiring in a direction perpendicular to the main surface and extends parallel to the main surface, when the inductor wiring is a first inductor wiring.

[0158]

[15] An inductor component according to

[14] , further comprising a plurality of external electrodes covering a portion of the outer surface of the element body, one of the plurality of external electrodes being connected to both a first end of the first inductor wiring and a first end of the second inductor wiring.

[0159]

[16] A method for manufacturing an inductor component, comprising: a seed layer forming step of forming a conductive seed layer on a main surface of a base substrate; an insulating layer forming step of forming an insulating layer having an opening of a predetermined wiring pattern on the seed layer; a resin wall forming step of forming a resin wall on the insulating layer along an outer edge of the opening; an inductor wiring forming step of forming a wiring body in a space surrounded by the resin wall by electrolytic plating by supplying power to the seed layer, and integrally forming a protruding portion that protrudes from the wiring body and extends along the wiring body into the opening; an element body forming step of forming a magnetic layer containing a magnetic material around the wiring body and the protruding portion after the inductor wiring forming step; and a seed layer removing step of removing the seed layer after the element body forming step.

[0160]

[17] A substrate for manufacturing an inductor component, comprising: a base substrate; a conductive seed layer located on a main surface of the base substrate; an insulating layer located on the seed layer and parallel to the main surface of the base substrate; and an inductor wiring located on the insulating layer and extending parallel to the main surface of the base substrate, wherein when one direction orthogonal to the main surface of the base substrate is defined as a positive direction and the direction opposite to the positive direction is defined as a negative direction, the inductor wiring comprises: a wiring main body extending on an outer surface of the insulating layer on the positive direction side; and a protrusion protruding from the outer surface of the wiring main body on the negative direction side to the negative direction, when viewed facing the positive direction, the protrusion extends along the wiring main body, and the negative direction side surface of the protrusion is in contact with the seed layer.

[0161]

[18] The substrate for manufacturing an inductor element according to

[17] , wherein the material of the seed layer is different from the material of the protrusion.

[0162]

[19] The substrate for manufacturing an inductor component according to

[17] or

[18] , further comprising an adhesive layer interposed between the base substrate and the seed layer, wherein the material of the adhesive layer is a resin having adhesive properties.

[0163] DESCRIPTION OF SYMBOLS 10...Inductor component 11...Element body 11A...First main surface 20...Magnetic layer 31...First insulating layer 41...Resin wall 51...Inductor wiring 52...Wiring body L...Wiring portion P...Pad portion 53...Protrusion 99...Substrate for manufacturing inductor component 91A...Main surface 92...Adhesive layer 93...Seed layer 94...First opening 95...Second opening 81A...First external electrode 81B...Second external electrode 81C...Third external electrode 81D...Fourth external electrode 82E...Fifth external electrode 110...Inductor component 131...First insulating layer 151A...First inductor wiring 153A...First protrusion 151B...Second inductor wiring 152B...Second wiring body 153B...Second protrusion 161A...First columnar wiring 162A...First columnar portion 163A...first lead-out portion 161B...second columnar wiring 162B...second columnar portion 163B...second lead-out portion 199...substrate for manufacturing inductor component

Claims

1. A body containing a magnetic material and having a planar main surface, An insulating layer located within the substrate and extending on a plane parallel to the main surface, Within the aforementioned body, an inductor wiring extending parallel to the main surface, Equipped with, When one of the directions perpendicular to the main surface is defined as the positive direction, and the direction opposite to the positive direction is defined as the negative direction, The aforementioned inductor wiring is A wiring body extending on the outer surface on the positive side of the insulating layer, A protruding portion that extends from the outer surface on the negative side of the wiring body toward the negative side, Equipped with, The outer surface on the negative side of the wiring body and the outer surface on the positive side of the insulating layer are in contact. When viewed through to the forward direction, the protruding portion is located within the range enclosed by the outer edge of the wiring body and extends along the wiring body. When viewed in cross-section perpendicular to the main surface, the dimension of the protrusion in the direction parallel to the main surface is smaller than the dimension of the wiring body in the direction parallel to the main surface at the point where the protrusion is connected. The electrical conductivity of the outer surface of the protrusion on the negative side is smaller than the electrical conductivity of the wiring body. Inductor components.

2. A body containing a magnetic material and having a planar main surface, An insulating layer located within the substrate and extending on a plane parallel to the main surface, Within the aforementioned body, an inductor wiring extending parallel to the main surface, Equipped with, When one of the directions perpendicular to the main surface is defined as the positive direction, and the direction opposite to the positive direction is defined as the negative direction, The aforementioned inductor wiring is A wiring body extending on the outer surface on the positive side of the insulating layer, A protruding portion that extends from the outer surface on the negative side of the wiring body toward the negative side, Equipped with, The outer surface on the negative side of the wiring body and the outer surface on the positive side of the insulating layer are in contact. When viewed through to the forward direction, the protruding portion is located within the range enclosed by the outer edge of the wiring body and extends along the wiring body. When viewed in cross-section perpendicular to the main surface, the dimension of the protrusion in the direction parallel to the main surface is smaller than the dimension of the wiring body in the direction parallel to the main surface at the point where the protrusion is connected. The protrusion further comprises a metal layer covering the outer surface on the negative side, When viewed through the lens in the forward direction, the metal layer extends along the protruding portion. Inductor components.

3. A body containing a magnetic material and having a planar main surface, An insulating layer located within the substrate and extending on a plane parallel to the main surface, Within the aforementioned body, an inductor wiring extending parallel to the main surface, Equipped with, When one of the directions perpendicular to the main surface is defined as the positive direction, and the direction opposite to the positive direction is defined as the negative direction, The aforementioned inductor wiring is A wiring body extending on the outer surface on the positive side of the insulating layer, A protruding portion that extends from the outer surface on the negative side of the wiring body toward the negative side, Equipped with, The outer surface on the negative side of the wiring body and the outer surface on the positive side of the insulating layer are in contact. When viewed through to the forward direction, the protruding portion is located within the range enclosed by the outer edge of the wiring body and extends along the wiring body. When viewed in cross-section perpendicular to the main surface, the dimension of the protrusion in the direction parallel to the main surface is smaller than the dimension of the wiring body in the direction parallel to the main surface at the point where the protrusion is connected. When the outer surfaces of the protruding portion, excluding the outer surface on the negative direction side, are considered as side surfaces, The side surface of the protruding portion is in contact with the insulating layer. In a direction perpendicular to the main surface, the dimensions of the protrusion are less than the dimensions of the insulating layer. Inductor components.

4. The wiring body and the protruding portion are integrally molded. An inductor component according to any one of claims 1 to 3.

5. When the outer surfaces of the aforementioned body, excluding the main surface and the surface opposite to the main surface, are defined as the side surfaces of the body, On the aforementioned side surface of the base body, the inductor wiring and any conductive objects electrically connected to the inductor wiring are not exposed. An inductor component according to any one of claims 1 to 3.

6. The outer surface on the negative side of the protruding portion is in contact with the base body. An inductor component according to claim 1 or claim 3.

7. The electrical conductivity of the metal layer is smaller than that of the wiring body. The inductor component according to claim 2.

8. The wiring body further comprises a columnar wiring that is connected to the outer surface on the positive side and extends within the element in a direction intersecting the main surface. An inductor component according to any one of claims 1 to 3.

9. The columnar wiring is in contact with the outer surface on the forward side of the wiring body. The inductor component according to claim 8.

10. The wiring body comprises a wiring section extending parallel to the main surface and a pair of pad sections connected to each end of the wiring section. One end of the columnar wiring is in contact with a surface parallel to the main surface of the pad portion. When viewed in cross-section in a direction perpendicular to the main surface, the difference between the dimensions of the pad portion and the dimensions of the columnar wiring in a direction parallel to the main surface is 20 μm or less. The inductor component according to claim 9.

11. Of the outer surfaces of the wiring body, the outer surfaces excluding the outer surface on the positive direction side and the outer surface on the negative direction side shall be defined as the side surfaces of the wiring body. Of the outer surfaces of the columnar wiring, the outer surfaces excluding the outer surface on the positive direction side and the outer surface on the negative direction side shall be defined as the side surfaces of the columnar wiring. When the outer surfaces of the insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, are defined as the side surfaces of the insulating layer, The invention further comprises an insulating coating that covers the side surface of the wiring body, the side surface of the columnar wiring, and the side surface of the insulating layer. The inductor component according to claim 8.

12. When the aforementioned inductor wiring is designated as the first inductor wiring, The system further comprises a second inductor wiring located on the same layer as the first inductor wiring in a direction perpendicular to the main surface, and extending parallel to the main surface. An inductor component according to any one of claims 1 to 3.

13. The aforementioned body further comprises a plurality of external electrodes covering a portion of the outer surface of the body, One of the plurality of external electrodes is connected to both the first end of the first inductor wiring and the first end of the second inductor wiring. The inductor component according to claim 12.

14. A seed layer formation step in which a conductive seed layer is formed on the main surface of a base substrate, An insulating layer forming step of forming an insulating layer having openings for a predetermined wiring pattern on the seed layer, A resin wall forming step is performed on the insulating layer, forming a resin wall along the outer edge of the opening, An inductor wiring formation step is performed by electroplating by supplying power to the seed layer, thereby forming a wiring body within the space surrounded by the resin wall, and integrally molding a protruding portion that protrudes from the wiring body into the opening and extends along the wiring body. Following the inductor wiring formation step, a base body formation step is performed in which a magnetic layer containing a magnetic material is formed around the wiring body and the protruding portion. After the above-mentioned body formation step, a seed layer removal step is performed to remove the seed layer, has Manufacturing method for inductor components.

15. A seed layer formation step of forming a conductive seed layer on the main surface of a base substrate, An insulating layer forming step is to form an insulating layer having a first opening of a predetermined wiring pattern on the seed layer, A DFR forming step in which a dry film resist having a predetermined pattern of second openings is formed on the seed layer and the insulating layer, An inductor wiring formation step is performed by electroplating by supplying power to the seed layer, thereby forming a wiring body in the second opening and integrally forming a protruding portion that protrudes from the wiring body and extends along the wiring body in the first opening, Following the inductor wiring formation step, a base body formation step is performed in which a magnetic layer containing a magnetic material is formed around the wiring body and the protruding portion. After the above-mentioned body formation step, a seed layer removal step is performed to remove the seed layer, has Manufacturing method for inductor components.

16. Base board and A conductive seed layer located on the main surface of the base substrate, An insulating layer located on the seed layer and parallel to the main surface of the base substrate, An inductor wiring located on the insulating layer and extending parallel to the main surface of the base substrate, An adhesive layer interposed between the base substrate and the seed layer, Equipped with, When one of the directions perpendicular to the main surface of the base substrate is defined as the positive direction, and the direction opposite to the positive direction is defined as the negative direction, The aforementioned inductor wiring is A wiring body extending on the outer surface on the positive side of the insulating layer, A protruding portion that extends from the outer surface on the negative side of the wiring body toward the negative side, Equipped with, When viewed in the forward direction, the protruding portion extends along the wiring body. The negative-direction side of the protrusion is in contact with the seed layer. The material of the seed layer and the material of the protruding part are different. The material of the adhesive layer is an adhesive resin. A circuit board for manufacturing inductor components.