Switching power source module

Abstract

Provided is a switching power source module (10) comprising: a circuit board (82) on which a switching element is mounted; a circuit board (81) on which at least one of an input capacitor element and an output capacitor element is mounted; and a power inductor element which electrically connects the switching element and an output capacitor. The power inductor element is disposed between the circuit board (81) and the circuit board (82). The power inductor element comprises a metal conductor and a magnetic body core. The magnetic body core encapsulates the metal conductor, and in the encapsulated portion, the metal conductor and the magnetic body core have a closely adhered structure. The metal conductor comprises: a main body that is encapsulated in the magnetic body core; a first end part that is not encapsulated in the magnetic body core, and that forms a first terminal of the power inductor element at one end of the main body; and a second end part that is not encapsulated in the magnetic body core, and that forms a second terminal of the power inductor element at the other end of the main body. The first end part extends from the main body to the circuit board (81) and is physically and electrically connected to the circuit board (81). The second end part extends from the main body to the circuit board (82) and is physically and electrically connected to the circuit board (82).

Description

Switching Power Supply Module

[0001] The present invention relates to a switching power supply module including a plurality of power conversion circuits.

[0002] A typical conventional switching power supply device has a structure in which switching elements, inductors, and capacitors that constitute a power conversion circuit are mounted on one side of a printed circuit board.

[0003] Additionally, a large current is required to drive advanced processors, which are semiconductor ICs that perform high-speed calculations and are currently used in AI, data centers, etc. As semiconductor processes become more miniaturized, the operating voltage of advanced processors decreases, requiring them to be supplied with low-voltage, high-current power.

[0004] To achieve this large current, there is a demand for a switching power supply device in which a plurality of power conversion circuits are connected in parallel.

[0005] As such a switching power supply device, Patent Document 1 describes a power supply module including a first circuit board, a second circuit board, and a magnetic core module.

[0006] The first circuit board includes at least one power circuit, the second circuit board includes at least an output capacitor, and the first and second circuit boards are spaced apart from each other.

[0007] A rod-shaped conductor is mounted on the surface of the first circuit board facing the second circuit board.

[0008] The magnetic core module is disposed between the first circuit board and the second circuit board, and has a through hole formed therein. A rod-shaped conductor is inserted into the through hole to form an output inductor of the power supply module.

[0009] U.S. Pat. No. 1,282,632

[0010] However, in the power supply module described in Patent Document 1, it is difficult to physically fix the magnetic core module, resulting in low rigidity of the module structure. Also, it is difficult to align the positions of the first circuit board, the second circuit board, and the magnetic core module, making manufacturing of the power supply module complicated.

[0011] Furthermore, because the conductor is inserted through the through-hole of the magnetic core module, a considerable gap exists between the magnetic core module and the conductor, which increases leakage flux during switching operation, reduces inductance, and reduces power conversion efficiency.Furthermore, electromagnetic noise is emitted, exposing the problem of electromagnetic interference.

[0012] An object of the present invention is to provide a switching power supply module that has a high rigidity module structure, is easy to manufacture, and achieves high power conversion efficiency and suppression of electromagnetic noise and electromagnetic interference.

[0013] A switching power supply module according to one embodiment of the present invention includes a first circuit board on which a switching element is mounted, a second circuit board on which at least one of an input capacitor and an output capacitor is mounted, and a power inductor that electrically connects the switching element and the output capacitor.

[0014] The power inductor is disposed between the first circuit board and the second circuit board, and includes a metal conductor and a magnetic core, the magnetic core enclosing the metal conductor, and the metal conductor and the magnetic core are in close contact with each other at the enclosing portion.

[0015] The metal conductor comprises a main body portion enclosed within the magnetic core, a first end portion not enclosed within the magnetic core and forming a first terminal of the power inductor at one end of the main body portion, and a second end portion not enclosed within the magnetic core and forming a second terminal of the power inductor at the other end of the main body portion.

[0016] The first end extends from the main body to the first circuit board and is physically and electrically connected to the first circuit board, and the second end extends from the main body to the second circuit board and is physically and electrically connected to the second circuit board.

[0017] The structure in which the first end of the power inductor is connected to the first circuit board and the second end is connected to the second circuit board form a three-dimensional structure that increases the volumetric space filling rate of the electronic components.

[0018] In this configuration, the closed current path through which the switching current flows is made approximately perpendicular to the first circuit board and the second circuit board, and the magnetic flux loop created by the switching current is made approximately parallel to the first circuit board and the second circuit board, thereby increasing the packaging density of electronic components in the volumetric space while controlling the direction of the magnetic flux generated by the switching current.

[0019] According to the present invention, the rigidity of the module structure is increased, the manufacturing is easy, high power conversion efficiency is achieved, and electromagnetic noise and electromagnetic interference can be suppressed.

[0020] FIG. 1 is a circuit diagram of a switching power supply module according to a first embodiment. FIG. 2 is an external perspective view of the switching power supply module according to the first embodiment. FIG. 3 is an exploded perspective view of the switching power supply module according to the first embodiment. FIG. 4 is a surface view and a side view of the switching power supply module according to the first embodiment. FIG. 5 is a perspective view, a surface view, and a side view of an inductor element of the switching power supply module according to the first embodiment. FIG. 6A is a perspective view that simply and schematically shows magnetic flux at a certain timing when a switching current flows through the inductor element, and FIG. 6B is a side view that simply and schematically shows magnetic flux in the switching power supply module 10 at that timing. FIG. 7 is an external perspective view of a switching power supply module according to a second embodiment. FIG. 8 is a surface view and a side view of the switching power supply module according to the second embodiment. FIG. 9 is a side view of a switching power supply module according to a third embodiment. FIG. 10 is a circuit diagram of a switching power supply module according to a fourth embodiment. FIG. 11 is an exploded perspective view of a switching power supply module according to the fourth embodiment. Figures 12(A) and 12(B) are plan views of a circuit board according to a fourth embodiment, and Figure 12(B) is a side view of a switching power supply module according to the fourth embodiment. Figure 13(A) is an external perspective view of an inductor element according to the fourth embodiment, and Figure 13(B) is a four-sided view thereof. Figure 14 is an exploded perspective view of a switching power supply module according to a fifth embodiment.

[0021] First Embodiment A switching power supply module according to a first embodiment of the present invention will be described with reference to the drawings.

[0022] (Circuit Configuration of Switching Power Supply Module 10) Fig. 1 is a circuit diagram of a switching power supply module according to Embodiment 1. As shown in Fig. 1, the switching power supply module 10 includes a plurality of power semiconductor package elements (power semiconductor package elements 21 and 22), a plurality of inductors (inductors L31 and L32: power inductors), an input capacitor Ci, and an output capacitor Co.

[0023] The switching power supply module 10 includes a pair of input terminals PIH and PIL, a pair of output terminals POH and POL, an input side wiring LNi, an output side wiring LNo, and a reference potential wiring LNg.

[0024] A DC power supply is connected to the input terminals PIH and PIL. The input terminal PIH is connected to the positive electrode of the DC power supply, and the input terminal PIL is connected to the negative electrode of the DC power supply. An input capacitor Ci is connected between the input terminals PIH and PIL. An input side wiring LNi is connected to the input terminal PIH, and a reference potential wiring LNg is connected to the input terminal PIL.

[0025] The power semiconductor package element 21 and the power semiconductor package element 22 are connected to the input terminal PIH and the input terminal PIL, respectively.

[0026] The power semiconductor package element 21 includes a drive circuit 210, a power semiconductor element Q21H, and a power semiconductor element Q21L. The drive circuit 210 is configured by an analog circuit. The power semiconductor element Q21H and the power semiconductor element Q21L are configured by, for example, power FETs. The drive circuit 210, the power semiconductor element Q21H, and the power semiconductor element Q21L are integrally formed by a single analog IC.

[0027] The drain terminal of the power semiconductor element Q21H is connected to the input side wiring LNi. The source terminal of the power semiconductor element Q21H is connected to the drain terminal of the power semiconductor element Q21L. The source terminal of the power semiconductor element Q21L is connected to the reference potential wiring LNg.

[0028] The gate terminal of power semiconductor element Q21H and the gate terminal of power semiconductor element Q21L are connected to drive circuit 210. Although not shown, drive circuit 210 receives power from a DC power supply through input side wiring LNi. Drive circuit 210 controls the drive of power semiconductor element Q21H and power semiconductor element Q21L. As a result, switching of power semiconductor element Q21H and power semiconductor element Q21L is controlled at a predetermined switching frequency (switching period).

[0029] The power semiconductor package element 22 includes a drive circuit 220, a power semiconductor element Q22H, and a power semiconductor element Q22L. The drive circuit 220 is configured by an analog circuit. The power semiconductor element Q22H and the power semiconductor element Q22L are configured by, for example, power FETs. The drive circuit 220, the power semiconductor element Q22H, and the power semiconductor element Q22L are integrally formed by a single analog IC.

[0030] The drain terminal of the power semiconductor element Q22H is connected to the input side wiring LNi. The source terminal of the power semiconductor element Q22H is connected to the drain terminal of the power semiconductor element Q22L. The source terminal of the power semiconductor element Q22L is connected to the reference potential wiring LNg.

[0031] The gate terminal of power semiconductor element Q22H and the gate terminal of power semiconductor element Q22L are connected to drive circuit 220. Although not shown, drive circuit 220 receives power from a DC power supply through input side wiring LNi. Drive circuit 220 controls the drive of power semiconductor element Q22H and power semiconductor element Q22L. As a result, the switching of power semiconductor element Q22H and power semiconductor element Q22L is controlled at a predetermined switching frequency (switching period).

[0032] One terminal of the inductor L31 is connected to the output terminal of the power semiconductor package element 21 (the node of the source terminal of the power semiconductor element Q21H and the gate terminal of the power semiconductor element Q21L).

[0033] One terminal of the inductor L32 is connected to the output terminal of the power semiconductor package element 22 (the node of the source terminal of the power semiconductor element Q22H and the gate terminal of the power semiconductor element Q22L).

[0034] The other terminal of the inductor L31 and the other terminal of the inductor L32 are connected to the output side line LNo.

[0035] The output side wiring LNo is connected to the output terminal POH. The output terminal POL is connected to the reference potential wiring LNg. The output capacitor Co is connected between the output terminals POH and POL. The load ZLD is connected between the output terminals POH and POL.

[0036] With this configuration, the switching power supply module 10 includes a first power conversion circuit including a power semiconductor package element 21, an inductor L31, and an output capacitor Co, and a second power conversion circuit including a power semiconductor package element 22, an inductor L32, and an output capacitor Co.

[0037] The drive circuit 210 of the power semiconductor package element 21 and the drive circuit 220 of the power semiconductor package element 22 are connected to an MPU (not shown).

[0038] The MPU performs multiphase control on the power semiconductor package elements 21 and 22. In this case, the MPU performs two-phase multiphase control, so that the first power conversion circuit and the second power conversion circuit of the switching power supply module 10 perform multiphase operation to supply power to the load ZLD.

[0039] (Structure of Switching Power Supply Module 10) Fig. 2 is an external perspective view of the switching power supply module according to the first embodiment. Fig. 2 is a diagram showing a switching power supply module with a heat sink attached. Fig. 3 is an exploded perspective view of the switching power supply module according to the first embodiment. Fig. 4 is a surface view and a side view of the switching power supply module according to the first embodiment.

[0040] Fig. 5 is a perspective view, a surface view, and a side view of the inductor element of the switching power supply module according to the first embodiment. Fig. 6(A) is a perspective view that simply and schematically shows the magnetic flux at a certain timing when a switching current flows through the inductor element, and Fig. 6(B) is a side view that simply and schematically shows the magnetic flux in the switching power supply module 10 at that timing.

[0041] In each drawing of each embodiment including this embodiment, leading lines and symbols are omitted as appropriate to prioritize readability, within the scope that can be easily inferred from the explanation of other parts.

[0042] The switching power supply module 10 includes a plurality of power semiconductor package elements 21, 22, a plurality of inductor elements 31, 32, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a plurality of connecting conductors 60, a circuit board 81, a circuit board 82, and a heat sink HS.

[0043] The power semiconductor package elements 21 and 22 are formed by mounted analog ICs and correspond to the power semiconductor package elements 21 and 22 in the circuit diagram of FIG. 1, respectively.

[0044] Inductor element 31 and inductor element 32 are formed as mounted elements. Inductor element 31 corresponds to inductor L31 in the circuit diagram of Fig. 1, and inductor element 32 corresponds to inductor L32 in the circuit diagram of Fig. 1. Fig. 5 shows inductor element 31, but inductor element 31 and inductor element 32 have the same structure.

[0045] 5 , the inductor element 31 includes a metal conductor 311 and a magnetic core 312. The metal conductor 311 is a rod having a bent portion (curved portion) along the middle. The metal conductor 311 includes a main body 3110, a first end 3111, and a second end 3112.

[0046] The first end 3111 is connected to one end of the main body portion 3110 in the extension direction (direction of conduction to the magnetic core 312). The second end 3112 is connected to the other end of the main body portion 3110 in the extension direction. The extension directions of the first end 3111 and the second end 3112 are perpendicular to the extension direction of the main body portion 3110. The extension directions of the first end 3111 and the second end 3112 are opposite to each other. The tip end of the first end 3111 (the end opposite to the end connected to the main body portion 3110) is the first terminal E3111 of the inductor element 31. The tip end of the second end 3112 (the end opposite to the end connected to the main body portion 3110) is the second terminal E3112 of the inductor element 31.

[0047] The magnetic core 312 has a substantially rectangular parallelepiped shape and contains the main body 3110 of the metal conductor 311. The magnetic core 312 is in close contact with the side surface of the main body 3110 (a surface parallel to the penetration direction at the penetration portion where the main body 3110 penetrates the magnetic core 312).

[0048] The first end portion 3111 protrudes from the first end face EF3121 of the magnetic core 312 to the outside of the magnetic core 312 and extends toward the back surface D312 of the magnetic core 312. A tip end (first terminal E3111) of the first end portion 3111 protrudes beyond the back surface D312 of the magnetic core 312.

[0049] The second end 3112 protrudes from the second end face EF3122 of the magnetic core 312 to the outside of the magnetic core 312 and extends toward the surface U312 of the magnetic core 312. The tip of the second end 3112 (second terminal E3112) is flush with the surface U312 of the magnetic core 312.

[0050] The shapes of the inductor element 31 and the inductor element 32 are not limited to this, and it is sufficient that the first terminal E3111 protrudes from the back surface D312 side of the magnetic core 312 and the second terminal E3112 is flush with the front surface U312 side of the magnetic core 312.

[0051] The magnetic core 312 includes a first magnetic core part and a second magnetic core part. The first magnetic core part covers the side surface of the main body part 3110 and is in close contact with the main body part 3110. The second magnetic core part covers the outer surface of the first magnetic core part (the surface of the first magnetic core part opposite the inner surface that is in close contact with the main body part). The second magnetic core part is spaced apart from the main body part 3110 and is in close contact with the first magnetic core part.

[0052] The first magnetic core portion and the second magnetic core portion have different material compositions. The first magnetic core portion has a composition that prioritizes adhesion to the main body portion 3110, while the second magnetic core portion has a composition that prioritizes characteristics. The first magnetic core portion and the second magnetic core portion are integrally molded.

[0053] The magnetic core 322 has a similar configuration to the magnetic core 312 .

[0054] The plurality of capacitor elements 40 are formed as mount-type elements. The plurality of capacitor elements 40 correspond to the input capacitors Ci in Fig. 1. The plurality of capacitor elements 40 are, for example, chip-type capacitor elements having terminal electrodes on both ends.

[0055] The plurality of capacitor elements 50 are formed as mount-type elements. The plurality of capacitor elements 50 correspond to the output capacitors Co in Fig. 1. The plurality of capacitor elements 50 are, for example, chip-type capacitor elements having terminal electrodes on both ends.

[0056] (Mounting Structure of Circuit Board 81) The circuit board 81 is substantially rectangular in plan view and has a front surface 811 and a back surface 812. The circuit board 81 is mainly made of insulating resin and has a conductor pattern formed thereon to realize the switching power supply module 10. In this embodiment, the circuit board 81 corresponds to the second circuit board.

[0057] 3 and 4, for example, the inductor element 31, the inductor element 32, the plurality of capacitor elements 50, and the plurality of connecting conductors 60 are mounted on the surface 811 of the circuit board 81. In other words, the surface 811 is the mounting surface for the inductor element 31, the inductor element 32, the plurality of capacitor elements 50, and the plurality of connecting conductors 60. More specifically, the mounting pattern is as follows.

[0058] The inductor element 31 and the inductor element 32 are mounted so that their respective length directions (extension directions of the main body portions 3110 of the metal conductor 311 and 321) are parallel to the first direction (L direction in each drawing) on ​​the circuit board 81. The inductor element 31 and the inductor element 32 are mounted adjacent to each other in the second direction (W direction in each drawing) on ​​the circuit board 81.

[0059] The inductor element 31 and the inductor element 32 are mounted so that the direction in which the main body extends is approximately parallel to the surface 811 of the circuit board 81 .

[0060] The inductor element 31 is mounted so that the magnetic core 312 is positioned away from the surface 811. The inductor element 32 is mounted so that the magnetic core 322 is positioned away from the surface 811. The distance between the magnetic core 312 and the surface 811 and the distance between the magnetic core 322 and the surface 811 are approximately the same.

[0061] The first terminal E3111 of the metal conductor 311 of the inductor element 31 and the first terminal E3211 of the metal conductor 321 of the inductor element 32 are joined to land conductors on the surface 811 of the circuit board 81 by a conductive bonding material such as solder.

[0062] The second terminal E3112 of the inductor element 31 and the second terminal E3212 of the inductor element 32 are located near one end of the circuit board 81 in the first direction.

[0063] The plurality of capacitor elements 50 are mounted in the height direction (H direction in each drawing) between the magnetic core 312 of the inductor element 31 or the magnetic core 322 of the inductor element 32 and the surface 811. When the surface 811 is viewed from above, the plurality of capacitor elements 50 are mounted in an area that substantially overlaps the inductor element 31 or the inductor element 32. The plurality of capacitor elements 50 are arranged two-dimensionally on two orthogonal axes, that is, the first direction and the second direction.

[0064] The plurality of connecting conductors 60 are made of a metal plate having a flat surface or an insulating substrate (e.g., a glass epoxy substrate) having a flat surface and on which a conductor pattern is formed. The length of the plurality of connecting conductors 60 in the second direction (W direction) is approximately the same as the length of the circuit boards 81 and 82 in the second direction (W direction).

[0065] The plurality of connecting conductors 60 are mounted near the other end in the first direction (the L direction in each drawing) on ​​the surface 811 of the circuit board 81. The plurality of connecting conductors 60 are arranged so that their flat surfaces are parallel to a direction perpendicular to the surface 811 and a direction parallel to the second direction (the W direction in each drawing). The plurality of connecting conductors 60 are arranged at intervals in the first direction.

[0066] A plurality of external connecting conductors 819 are formed on the rear surface 812 of the circuit board 81. The plurality of external connecting conductors 819 are, for example, circular in plan view and are arranged two-dimensionally along two orthogonal axes, a first direction and a second direction. Some of the plurality of external connecting conductors 819 form the input terminal PIH, the input terminal PIL, the output terminal POH, and the output terminal POL shown in the circuit of FIG. 1 .

[0067] (Mounting Structure of Circuit Board 82) The circuit board 82 is substantially rectangular in plan view, and has a front surface 821 and a back surface 822. The circuit board 82 is mainly made of insulating resin and has a conductor pattern formed thereon to implement the switching power supply module 10. The planar shape of the circuit board 82 is substantially the same as the planar shape of the circuit board 81. In this embodiment, the circuit board 82 corresponds to the first circuit board.

[0068] 3 and 4 , the power semiconductor package element 21, the power semiconductor package element 22, and the plurality of capacitor elements 40 are mounted on a surface 821 of the circuit board 82. In other words, the surface 821 is the mounting surface for the power semiconductor package element 21, the power semiconductor package element 22, and the plurality of capacitor elements 40.

[0069] The power semiconductor package element 21 and the power semiconductor package element 22 are arranged in the second direction (W direction in each drawing) on ​​the surface 821 .

[0070] The set of the power semiconductor package element 21 and the power semiconductor package element 22 and the group of the plurality of capacitor elements 40 are aligned in a first direction (direction L in each drawing) on ​​the surface 821. The set of the power semiconductor package element 21 and the power semiconductor package element 22 is arranged closer to one end of the surface 821 than the group of the plurality of capacitor elements 40.

[0071] The plurality of capacitor elements 40 are arranged two-dimensionally on the surface 821 along two orthogonal axes, a first direction and a second direction.

[0072] A plurality of capacitor elements 40 are mounted on a rear surface 822 of the circuit board 82. In other words, the rear surface 822 is a mounting surface for the plurality of capacitor elements 40. The plurality of capacitor elements 40 on the rear surface 822 are mounted in an area overlapping with the mounting area of ​​the plurality of capacitor elements 40 on the front surface 821.

[0073] At one end in the first direction of the rear surface 822, a land conductor is formed on which the second terminal E3112 of the inductor element 31 and the second terminal E3212 of the inductor element 32 are mounted. At the other end in the first direction of the rear surface 822, no capacitor elements 40 are mounted, but a land conductor (see dotted line in FIG. 4 ) on which a plurality of connecting conductors 60 are mounted is formed. In other words, the rear surface 822 is also a mounting surface on which the plurality of connecting conductors 60, the second terminal E3112 of the inductor element 31, and the second terminal E3212 of the inductor element 32 are mounted.

[0074] (Laminated structure of circuit board 81 and circuit board 82) The circuit board 82 is disposed on the front surface 811 side of the circuit board 81. The back surface 822 of the circuit board 82 faces the front surface 811 of the circuit board 81. In other words, the circuit boards 82 and 81 overlap when viewed in the height direction (direction H in each drawing) (in a plan view). The length direction of the circuit board 81 and the length direction of the circuit board 82 are parallel to each other.

[0075] The circuit board 81 and the circuit board 82 are separated from each other in the height direction (H direction in each drawing).

[0076] The second terminal E3112 of the inductor element 31, the second terminal E3212 of the inductor element 32, and a plurality of connecting conductors 60 are mounted on the back surface 822 of the circuit board 82. This electrically and physically connects the circuit board 81 and the circuit board 82. The plurality of connecting conductors 60 form the input side wiring LNi and the reference potential wiring LNg in the circuit of FIG.

[0077] Furthermore, the surface U312 of the inductor element 31 and the surface U322 of the inductor element 32 abut against the back surface 822 of the circuit board 82. This brings the inductor elements 31 and 32 into physical contact with the circuit board 82.

[0078] In this configuration, in a plan view of the switching power supply module 10, the inductor element 31 overlaps the power semiconductor package element 21. The inductor element 32 overlaps the power semiconductor package element 22.

[0079] More specifically, the width of the inductor elements 31, 32 is equal to or less than the width of the power semiconductor package elements 21, 22. As a result, the inductor elements 31, 32 overlap substantially entirely with the power semiconductor package elements 21, 22 in the width direction of the switching power supply module 10.

[0080] The length of the inductor elements 31, 32 is shorter than the length L22 of the power semiconductor package elements 21, 22. As a result, the inductor elements 31, 32 overlap substantially entirely with the power semiconductor package elements 21, 22 in the length direction of the switching power supply module 10.

[0081] In this manner, in this embodiment, the inductor element 31 and the inductor element 32 overlap substantially entirely with the power semiconductor package elements 21 and 22 in both the length direction and the width direction.

[0082] (Example of effect of the above configuration) With this configuration, the power semiconductor package elements and inductor elements that make up one power conversion circuit are not aligned in a plane, but are aligned in the height direction. This allows the planar area of ​​one power conversion circuit to be reduced. In other words, the switching power supply module 10 realizes a structure in which the circuit board 81, the multiple inductor elements 31 and 32, and the circuit board 82 are aligned in the height direction, thereby increasing the packaging density of electronic components in the volume space.

[0083] This reduces the planar area of ​​the switching power supply module 10, making it easier to arrange the power semiconductor package elements 21 and 22 and the inductor elements 31 and 32 close to the load ZLD. This allows the switching power supply module 10 to reduce loss in power supply to the load ZLD.

[0084] Furthermore, the power semiconductor package elements 21, 22 and the inductor elements 31, 32 are arranged in a concentrated manner in a plane. This allows the switching power supply module 10 to have a small heat-generating area in a planar view. Furthermore, the switching power supply module 10 can confine heat generated by electronic components arranged in various locations within a predetermined spatial volume, thereby uniforming the temperature distribution within the predetermined spatial volume. Therefore, the switching power supply module 10 can simplify the cooling structure, suppress a decrease in heat dissipation efficiency per predetermined spatial volume, and improve heat dissipation efficiency.

[0085] 2, the heat sink HS is positioned in the switching power supply module 10 so as to abut against the uppermost power semiconductor package element 21 of the switching power supply module 10 at a position overlapping the power semiconductor package elements 21 and 22 and the inductor elements 31 and 32. This allows the switching power supply module 10 to dissipate heat efficiently.

[0086] Furthermore, since the planar area of ​​the heat sink HS can be made approximately the same as the planar area of ​​the power semiconductor package element 21, the planar area of ​​the switching power supply module 10 with the heat sink HS attached can be prevented from becoming larger, and the switching power supply module 10 can be made compact.

[0087] Furthermore, in this configuration, the power semiconductor package element 21 and the inductor element 31 overlap in plan view, and the second terminal E3112 of the inductor element 31 is connected to the circuit board 82 near the power semiconductor package element 21 in plan view.

[0088] This allows the switching power supply module 10 to shorten the connection distance between the power semiconductor package element 21 and the inductor element 31. Similarly, the power semiconductor package element 22 and the inductor element 32 overlap in a planar view, and the second terminal E3212 of the inductor element 32 is connected to the circuit board 82 near the power semiconductor package element 22 in a planar view. This allows the switching power supply module 10 to shorten the connection distance between the power semiconductor package element 22 and the inductor element 32.

[0089] Furthermore, inductor element 31 and inductor element 32 are electrically and physically connected to circuit board 81 and circuit board 82. This allows for increased rigidity of the module structure of switching power supply module 10. In particular, switching power supply module 10 can achieve increased rigidity of the module structure even in a configuration in which circuit board 81, multiple inductor elements 31 and 32, and circuit board 82 are aligned in the height direction.

[0090] Furthermore, in the switching power supply module 10, the magnetic cores 312, 322 of the multiple inductor elements 31, 32 abut against the rear surface of the circuit board 82. This allows the switching power supply module 10 to have even greater rigidity in its module structure.

[0091] Furthermore, inductor element 31 and inductor element 32 are mounted on circuit board 81 and circuit board 82 as a single electronic component with main body 3110 and 3210 in close contact with magnetic core 312 and 322. Therefore, switching power supply module 10 can be easily manufactured even if it has a structure in which circuit board 81, multiple inductor elements 31 and 32, and circuit board 82 are aligned in the height direction.

[0092] In addition, in this configuration, the inductor elements 31 and 32 are connected to the circuit boards 81 and 82 by conductor portions that extend in a direction perpendicular to the front and back surfaces of the circuit boards 81 and 82 .

[0093] This allows the closed current path through which the switching current flows via the inductor elements 31 and 32 to be approximately perpendicular to the mounting surfaces of the electronic components on the circuit boards 81 and 82 .

[0094] In this case, as shown in Fig. 6A, the magnetic flux loop φ311E generated outside the magnetic core 312 with respect to the inductor element 31 is parallel to the front surface U312 and the back surface D312 of the magnetic core 312. Therefore, as shown in Fig. 6B, the magnetic flux loop φ311E generated by the switching current flowing through the inductor elements 31 and 32 is approximately parallel to the mounting surfaces of the circuit boards 81 and 82. In this case, the magnetic flux loop φ311E is parallel to the mounting surfaces of the circuit boards 81 and 82 and is generated within a predetermined height range on the circuit board 81 side of the back surface 822 of the circuit board 82. Therefore, it is possible to prevent the magnetic flux loop φ311E from undesirably coupling to and adversely affecting the electronic components (power semiconductor package elements 21 and 22, the plurality of capacitor elements 40, and the plurality of capacitor elements 50) mounted on the circuit boards 81 and 82.

[0095] Furthermore, because the magnetic core 312 tightly covers the main body 3110, the magnetic flux loop φ312C generated in the main body 3110 of the inductor element 31 hardly leaks outside the inductor element 31. Therefore, even if the magnetic flux loop φ312C generated in the main body 3110 is perpendicular to the mounting surfaces of the circuit boards 81 and 82, it hardly reaches the circuit boards 81 and 82. This makes it possible to prevent the magnetic flux loop φ312C from undesirably coupling to and adversely affecting the electronic components (power semiconductor package elements 21 and 22, the plurality of capacitor elements 40, and the plurality of capacitor elements 50) mounted on the circuit boards 81 and 82.

[0096] In this way, the switching power supply module 10 can control the direction of the magnetic flux generated by the switching current, and can suppress deterioration of characteristics while realizing high-density packaging.

[0097] The magnetic cores 312 and 322 of the inductor elements 31 and 32 each include a first magnetic core portion and a second magnetic core portion having different compositions. The first magnetic core portion prioritizes adhesion to the main body, while the second magnetic core portion prioritizes characteristics. This allows the inductor elements 31 and 32 to suppress magnetic flux leakage and achieve excellent characteristics in a compact size.

[0098] Furthermore, the metal conductor 311 of the inductor element 31 has a larger cross-sectional area than the conductor pattern of the circuit board 82. This reduces the electrical resistance between the power semiconductor package element 21 and the inductor element 31. Similarly, the metal conductor 321 of the inductor element 32 has a larger cross-sectional area than the conductor pattern of the circuit board 82. This reduces the electrical resistance between the power semiconductor package element 22 and the inductor element 32.

[0099] In inductor element 31, main body 3110 of metal conductor 311 is in close contact with magnetic core 312. In inductor element 32, main body 3110 of metal conductor 321 is in close contact with magnetic core 322. This increases the adhesion between the metal conductor and the magnetic core in inductor elements 31 and 32, thereby increasing the magnetic flux density of the generated magnetic flux.

[0100] Therefore, the outer shape of the inductor elements 31, 32 can be made small to achieve the desired inductance, which makes it easier to arrange the inductor elements 31, 32 so that they overlap the power semiconductor package elements 21, 22. Therefore, in the switching power supply module 10, heat generation points tend to be concentrated in a planar manner, and heat dissipation efficiency can be more reliably improved.

[0101] Furthermore, since the input side wiring LNi and the reference potential wiring LNg are formed by the connecting conductor 60 and the connecting conductor 60 is a flat plate, the switching power supply module 10 can reduce the electrical resistance of the input side wiring LNi and the electrical resistance of the reference potential wiring LNg.

[0102] As described above, the switching power supply module 10 has a highly rigid module structure and is easy to manufacture. Furthermore, the inductor element 31 (inductor L31) and the inductor element 32 (inductor L32) have a tightly integrated structure in which the magnetic core encloses a metal conductor, enabling the magnetic core to achieve a high inductance due to a high magnetic flux density distribution. This allows the switching power supply module 10 to achieve high power conversion efficiency by reducing conduction loss and switching loss in the switching elements due to the high inductance. At the same time, the switching power supply module 10 can suppress malfunctions of the control circuit and suppress electromagnetic interference with the electrical circuits formed on the circuit board due to electromagnetic noise generated by the switching current during switching operation.

[0103] Second Embodiment A switching power supply module according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 7 is an external perspective view of the switching power supply module according to the second embodiment. Fig. 8 is a front view and a side view of the switching power supply module according to the second embodiment.

[0104] The switching power supply module 10A according to the second embodiment differs from the switching power supply module 10 according to the first embodiment only in the mounting structure of the power semiconductor package elements 21 and 22 and the parts related to this structure. The other configuration of the switching power supply module 10A is the same as that of the switching power supply module 10, and a description of the similar parts will be omitted.

[0105] The power semiconductor package element 22 is mounted on the rear surface 822 of the circuit board 82. The power semiconductor package element 22 is arranged closer to one end of the rear surface 822 than the group of the plurality of capacitor elements 40.

[0106] In a plan view of the circuit board 82 , the power semiconductor package element 22 overlaps the power semiconductor package element 21 .

[0107] The width of the inductor elements 31, 32 is equal to or less than half the width of the power semiconductor package elements 21, 22. In a plan view of the circuit boards 81, 82 (plan view of the switching power supply module 10A), the inductor elements 31, 32 overlap the power semiconductor package elements 21, 22.

[0108] The surface U312 of the magnetic core 312 of the inductor element 31 and the surface U322 of the magnetic core 322 of the inductor element 32 abut against the surface F22 of the power semiconductor package element 22.

[0109] With this configuration, the width of the switching power supply module 10A can be reduced to approximately half that of the switching power supply module 10. This allows the switching power supply module 10A to have an even smaller planar area while achieving the same effects as the switching power supply module 10. Furthermore, the switching power supply module 10A can dissipate heat more efficiently because the electronic components that dissipate heat can be concentrated in a planar area.

[0110] Third Embodiment A switching power supply module according to a third embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a side view of the switching power supply module according to the third embodiment.

[0111] The switching power supply module 10B according to the third embodiment differs from the switching power supply module 10A according to the second embodiment in the connection structure of the inductor elements 31, 32 to the circuit board 81. The other configuration of the switching power supply module 10B is the same as that of the switching power supply module 10A, and a description of similar parts will be omitted.

[0112] The back surface D312 of the magnetic core 312 of the inductor element 31 and the back surface D322 of the magnetic core 322 of the inductor element 32 abut against the surface 811 of the circuit board 81.

[0113] With this configuration, the inductor elements 31 and 32 are physically connected to the circuit boards 81 and 82 over a larger area.

[0114] As a result, the switching power supply module 10B can achieve higher rigidity while achieving the same effects as the switching power supply module 10.

[0115] [Fourth Embodiment] A switching power supply module according to a fourth embodiment of the present invention will be described with reference to the drawings. Fig. 10 is a circuit diagram of the switching power supply module according to the fourth embodiment. Fig. 11 is an exploded perspective view of the switching power supply module according to the fourth embodiment. Figs. 12(A) and 12(B) are plan views of a circuit board according to the fourth embodiment, and Fig. 12(B) is a side view of the switching power supply module according to the fourth embodiment.

[0116] 10, 11, 12(A), 12(B), 13(A), and 13(B), a switching power supply module 10C according to the fourth embodiment differs from the switching power supply module 10 according to the first embodiment in the number and structure of power semiconductor package elements that perform multiphase control. The other basic configuration of the switching power supply module 10C is the same as that of the switching power supply module 10, and a description of similar parts will be omitted.

[0117] (Circuit Configuration of Switching Power Supply Module 10C) The switching power supply module 10C includes a plurality of power semiconductor package elements 21, 22, and 23, and a plurality of inductors L31, L32, and L33. The power semiconductor package element 23 has a configuration similar to that of the power semiconductor package elements 21 and 22, and includes a drive circuit 230, a power semiconductor element Q23H, and a power semiconductor element Q23L.

[0118] A plurality of power semiconductor package elements 21, 22, and 23 are connected in parallel to the input terminals PIH and PIL. The output terminal of the power semiconductor package element 21 is connected to the output terminal POH through an inductor L31. The output terminal of the power semiconductor package element 22 is connected to the output terminal POH through an inductor L32. The output terminal of the power semiconductor package element 23 is connected to the output terminal POH through an inductor L33.

[0119] With this configuration, the switching power supply module 10C performs three-phase multiphase control.

[0120] (Structure of Switching Power Supply Module 10C) The switching power supply module 10C includes a circuit board 81C and a circuit board 82C. The circuit board 81C and the circuit board 82C are elongated and have substantially the same shape.

[0121] The circuit board 81C has a first end 81E1 at one longitudinal end and a second end 81E2 at the other longitudinal end, a first side 81S1 at one lateral end and a second side 81S2 at the other lateral end.

[0122] The circuit board 82C has a first end 82E1 at one longitudinal end and a second end 82E2 at the other longitudinal end, and a first side 82S1 at one lateral end and a second side 82S2 at the other lateral end.

[0123] The plurality of power semiconductor package elements 21, 22, and 23 are mounted on a surface 821 of the circuit board 82C. The plurality of power semiconductor package elements 21, 22, and 23 are mounted in the order of the power semiconductor package element 21, the power semiconductor package element 22, and the power semiconductor package element 23 from the first end 82E1 toward the second end 82E2.

[0124] The multiple inductor elements 31C (L31), 32C (L32), and 33C (L33) have the same configuration. Fig. 13(A) is an external perspective view of the inductor element according to the fourth embodiment, and Fig. 13(B) is a four-sided view thereof. Note that Figs. 13(A) and 13(B) show the inductor element 31C as an example, but the inductor elements 32C and 33C also have the same configuration.

[0125] The inductor element 31C includes a metal conductor 311C and a magnetic core 312C. The metal conductor 311 has a wound shape, and at least a portion of this wound shape is embedded in the magnetic core 312. The magnetic core 312 is in close contact with the metal conductor 311.

[0126] A first terminal E3111, which is one end of the metal conductor 311, is exposed from the side surface of the magnetic core 312 and extends toward the back surface D312. A second terminal E3112, which is the other end of the metal conductor 311, is exposed from the side surface of the magnetic core 312 and extends toward the front surface U312.

[0127] The multiple inductor elements 31C, 32C, and 33C are mounted on a surface 811 of the circuit board 81C. More specifically, the first terminal E3111 of the inductor element 31C, the first terminal E3211 of the inductor element 32C, and the first terminal E3311 of the inductor element 33C are mounted on the respective land conductors on the surface 811 of the circuit board 81C.

[0128] At this time, it is preferable that the rear surface D312 of the magnetic core 312 of the inductor element 31C, the rear surface D322 of the magnetic core 322 of the inductor element 32C, and the rear surface D332 of the magnetic core 332 of the inductor element 33C abut against the surface 811 of the circuit board 81C.

[0129] The inductor elements 32C and 33C of the plurality of inductor elements 31C are mounted in the order of inductor element 31C, inductor element 32C, and inductor element 33C from the first end 81E1 toward the second end 81E2.

[0130] In a plan view of the switching power supply module 10C, the inductor element 31C overlaps the power semiconductor package element 21, the inductor element 32C overlaps the power semiconductor package element 22, and the inductor element 33C overlaps the power semiconductor package element 23.

[0131] The plurality of capacitor elements 40 are mounted on a rear surface 822 of the circuit board 82C. The plurality of capacitor elements 50 are mounted on a front surface 811 of the circuit board 81C.

[0132] The connection conductors 60P, 60G, and 60S are flat and have the same configuration as the connection conductor 60. The connection conductor 60P is a connection conductor for input from a DC power supply. The connection conductor 60G is a connection conductor for a reference potential. The connection conductor 60S is a connection conductor for a control signal from an external MCU (not shown).

[0133] The connecting conductor 60P is mounted near the first end 81E1 on the surface 811 of the circuit board 81C. The flat surface of the connecting conductor 60P is parallel to the first end 81E1 and is substantially perpendicular to the surface 811.

[0134] The connecting conductor 60G is mounted on the front surface 811 of the circuit board 81C near the second end 81E2 and near the second side 81S2. A part of the flat surface of the connecting conductor 60P is parallel to the second end 81E2, and another part of the flat surface of the connecting conductor 60P is parallel to the second side 81S2. The flat surface of the connecting conductor 60P is approximately perpendicular to the front surface 811.

[0135] The connecting conductor 60S is mounted near the second side portion 81S2 on the surface 811 of the circuit board 81C. The flat surface of the connecting conductor 60S is parallel to the second side portion 81S2 and is substantially perpendicular to the surface 811.

[0136] In this way, the connecting conductors 60P, 60G, and 60S are arranged to surround the multiple inductor elements 31C, 32C, and 33C, except for the first side 81S1 side of the circuit board 81C.

[0137] In such a configuration, the conductor portion on the surface 811 of the circuit board 81C and the back surface 822 of the circuit board 82C are electrically and physically connected by a plurality of inductor elements 31C, 32C, 33C, connecting conductor 60P, connecting conductor 60G, and connecting conductor 60S.

[0138] More specifically, the second terminal E3112 of the inductor element 31C, the second terminal E3212 of the inductor element 32C, and the second terminal E3312 of the inductor element 33C are mounted on their respective land conductors on the rear surface 822 of the circuit board 82C. At this time, it is preferable that the surface U312 of the magnetic core 312 of the inductor element 31C, the surface U322 of the magnetic core 322 of the inductor element 32C, and the surface U332 of the magnetic core 332 of the inductor element 33C abut against the rear surface 822 of the circuit board 82C.

[0139] With this configuration, the switching power supply module 10C can achieve the same effects as the switching power supply module 10.

[0140] Furthermore, by including inductor elements 31C, 32C, and 33C that use wound conductors, the switching power supply module 10C can make the planar shape of the inductor elements 31C, 32C, and 33C smaller in order to achieve the same inductance as the inductor elements 31, 32, and 33 of the first embodiment.

[0141] Furthermore, in the switching power supply module 10C, the connecting conductors 60P, 60G, and 60S are not all parallel to each other but are spaced apart from each other, thereby suppressing undesired coupling between the connecting conductors 60P, 60G, and 60S.

[0142] Fifth Embodiment A switching power supply module according to a fifth embodiment of the present invention will be described with reference to the drawings. Fig. 14 is an exploded perspective view of the switching power supply module according to the fifth embodiment.

[0143] 14, a switching power supply module 10D according to the fifth embodiment is a 12-phase multi-phase converter that is configured by appropriately adopting the configurations of the switching power supply modules shown in the above embodiments. Therefore, in the following, description of content that can be easily understood from the description of the above embodiments will be omitted.

[0144] The switching power supply module 10D includes a circuit board 81D and a circuit board 82D, a plurality of power semiconductor package elements 20, a plurality of inductor elements 30, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a connecting conductor 60P, a connecting conductor 60G, and a connecting conductor 60S.

[0145] The plurality of power semiconductor package elements 20 have the same configuration as the above-described power semiconductor package element 21, etc. The plurality of inductor elements 30 have the same configuration as the above-described inductor element 31.

[0146] The plurality of power semiconductor package elements 20 and the plurality of capacitor elements 40 are mounted on a front surface 821 of the circuit board 82D. Note that the plurality of power semiconductor package elements 20 and the plurality of capacitor elements 40 may be mounted not only on the front surface 821 of the circuit board 82D but also on a rear surface 822 thereof.

[0147] The multiple inductor elements 30, the multiple capacitor elements 50, the connecting conductor 60P, the connecting conductor 60G, and the connecting conductor 60S are mounted on the front surface 811 of the circuit board 81D.

[0148] The multiple inductor elements 30, the connecting conductors 60P, 60G, and 60S are electrically and physically connected to the front surface 811 of the circuit board 81D and the back surface 822 of the circuit board 82D.

[0149] With this configuration, the switching power supply module 10D can realize 12-phase multiphase control and can achieve the same effects as the switching power supply module 10C.

[0150] It should be noted that the above-described embodiments are merely examples, and the configurations of the embodiments can be combined as appropriate.

[0151] In this way, by appropriately adopting and combining the configurations of each embodiment of the present invention, including this embodiment, it is possible to easily configure a switching power supply module according to the number of multiple power conversion circuits to be multiphase controlled, in other words, a switching power supply module according to the output current value.

[0152] <1> A power inductor comprising: a first circuit board on which a switching element is mounted; a second circuit board on which at least one of an input capacitor and an output capacitor is mounted; and a power inductor electrically connecting the switching element and the output capacitor, wherein the power inductor is disposed between the first circuit board and the second circuit board; and the power inductor comprises a metal conductor and a magnetic core, the magnetic core enclosing the metal conductor, and the metal conductor and the magnetic core having a tightly integrated structure at the enclosing portion; and the metal conductor comprises: a main body portion enclosed in the magnetic core; a first end portion not enclosed in the magnetic core, which forms a first terminal of the power inductor at one end of the main body portion; and a second end portion not enclosed in the magnetic core, which forms a second terminal of the power inductor at the other end of the main body portion, wherein the first end portion extends from the main body portion to the first circuit board and is physically and electrically connected to the first circuit board, the second end extends from the main body to the second circuit board and is physically and electrically connected to the second circuit board, and a structure in which the first end of the power inductor is connected to the first circuit board and a structure in which the second end is connected to the second circuit board form a three-dimensional structure that increases the volumetric space filling rate of electronic components, and a closed current path through which a switching current flows is made substantially perpendicular to the first circuit board and the second circuit board, and a magnetic flux loop created by the switching current is made substantially parallel to the first circuit board and the second circuit board, thereby increasing the packaging density of electronic components in the volumetric space while controlling the direction of the magnetic flux generated by the switching current.

[0153] <2> The switching power supply module according to <1>, wherein the main body extends in a direction parallel to the first circuit board and the second circuit board.

[0154] <3> The switching power supply module of <1> or <2>, wherein the magnetic core includes a first magnetic core portion that is in close contact with the metal conductor, and a second magnetic core portion that is spaced apart from the metal conductor and in close contact with the first magnetic core portion.

[0155] <4> The switching power supply module according to <3>, wherein the first magnetic core portion and the second magnetic core portion have different material compositions and are integrally molded using magnetic materials of different compositions.

[0156] <5> The switching power supply module according to any one of <1> to <4>, wherein the number of the switching elements is plural, and the plural switching elements are mounted on both sides of the first circuit board in positions where they overlap each other.

[0157] <6> The switching power supply module according to <5>, wherein the number of the power inductors is the same as the number of the switching elements, and the plurality of power inductors are arranged in parallel with the first circuit board and the second circuit board.

[0158] <7> The switching power supply module of <6>, wherein, when viewed in a direction in which the first circuit board, the plurality of power inductors, and the second circuit board are arranged, a magnetic core of the plurality of power inductors is arranged to overlap one of the plurality of power inductors.

[0159] <8> The switching power supply module according to any one of <1> to <7>, wherein the switching element is configured by a power semiconductor IC in which a power semiconductor element and a drive circuit are integrally formed.

[0160] <9> The switching power supply module according to any one of <1> to <8>, wherein the input capacitor is mounted on the first circuit board.

[0161] <10> The switching power supply module according to any one of <1> to <9>, wherein the output capacitor is mounted on the second circuit board.

[0162] <11> The switching power supply module according to any one of <1> to <10>, wherein at least one of the input capacitor and the output capacitor and the power inductor are mounted on a front surface of the second circuit board, and two-dimensionally arranged land conductors are formed on a rear surface of the second circuit board.

[0163] <12> The switching power supply module according to any one of <1> to <11>, further comprising a connection member that electrically and physically connects the front surface of the second circuit board and the back surface of the first circuit board, the connection member being formed of a bus bar made mainly of metal, or a wired circuit board having a conductor pattern formed on substantially the entire surface of an insulating substrate.

[0164] <13> The switching power supply module according to <6> or <7>, comprising: a plurality of power conversion circuits each including the switching element and the power inductor; and a control unit that controls operation of the plurality of power conversion circuits, wherein the control unit performs a multi-phase converter operation by shifting the phases of operation of the plurality of power conversion circuits.

[0165] 10, 10A, 10B, 10C, 10D: switching power supply module 20, 21, 22, 23: power semiconductor package element 30, 31, 31C, 32, 32C, 33C: inductor element 40, 50: capacitor element 60, 60G, 60P, 60S: connecting conductor 81, 81C, 81D, 82, 82C, 82D: circuit board 81E1, 82E1: first end 81E2, 82E2: second end 81S1, 82S1: first side 81S2, 82S2: second side 210, 220, 230: drive circuit 311, 311C, 321: metal conductor 312, 312C, 322, 332: magnetic core 811, 821: front surface 812, 822: back surface 819: External connecting conductor 3110: Main body 3111: First end 3112: Second end Ci: Input capacitor Co: Output capacitor D312, D322, D332: Back surface E3111, E3211, E3311: First terminal E3112, E3212, E3312: Second terminal EF3121: First end surface EF3122: Second end surface F22: Front surface HS: Heat sink L31, L32, L33: Inductor LNg: Reference potential wiring LNi: Input side wiring LNo: Output side wiring PIH, PIL: Input terminals POH, POL: Output terminals Q21H, Q21L, Q22H, Q22L, Q23H, Q23L: Power semiconductor element U312, U322, U332: Surface ZLD: Load

Claims

1. A first circuit board on which switching elements are mounted, A second circuit board on which at least one of the input capacitor and the output capacitor is mounted, A power inductor electrically connects the switching element and the output capacitor, Equipped with, The power inductor is positioned between the first circuit board and the second circuit board. The power inductor comprises a metal conductor and a magnetic core, the magnetic core encloses the metal conductor, and in the enclosed portion, the metal conductor and the magnetic core are in a tightly integrated structure. The aforementioned metal conductor is The main body enclosed within the magnetic core, Not enclosed within the magnetic core, and having a first end at one end of the main body that forms the first terminal of the power inductor, The magnetic core is not enclosed within the aforementioned magnetic core, and the other end of the main body has a second end that forms the second terminal of the power inductor, Equipped with, The first end extends from the main body to the first circuit board and is physically and electrically connected to the first circuit board. The second end extends from the main body to the second circuit board and is physically and electrically connected to the second circuit board. The structure in which the first end of the power inductor is connected to the first circuit board and the structure in which the second end is connected to the second circuit board, By constructing a three-dimensional structure with an increased volumetric space-filling ratio using electronic components, The current closed circuit through which the switching current flows is positioned approximately perpendicular to the first and second circuit boards, and the magnetic flux loop created by the switching current is positioned approximately parallel to the first and second circuit boards, thereby increasing the mounting density of electronic components in the volume space while controlling the direction of the magnetic flux generated by the switching current. Switching power supply module.

2. The direction in which the main body extends is parallel to the first circuit board and the second circuit board. A switching power supply module according to claim 1.

3. The magnetic core comprises a first magnetic core portion that is in close contact with the metal conductor, and a second magnetic core portion that is spaced apart from the metal conductor and in close contact with the first magnetic core portion. A switching power supply module according to claim 1 or claim 2.

4. The first magnetic core and the second magnetic core have different material compositions and are integrally molded from magnetic materials of different compositions. The switching power supply module according to claim 3.

5. The number of the aforementioned switching elements is multiple. The plurality of switching elements are mounted on both sides of the first circuit board in positions that overlap each other. A switching power supply module according to claim 1 or claim 2.

6. The power inductors consist of multiple units, the same number as the switching elements. The plurality of power inductors are arranged in parallel with the first circuit board and the second circuit board. The switching power supply module according to claim 5.

7. Viewed in the direction in which the first circuit board, the plurality of power inductors, and the second circuit board are aligned, The magnetic cores of the plurality of power inductors are arranged to overlap any one of the plurality of power inductors. The switching power supply module according to claim 6.

8. The switching element is composed of a power semiconductor IC in which a power semiconductor element and a drive circuit are integrally formed. A switching power supply module according to claim 1 or claim 2.

9. The input capacitor is mounted on the first circuit board. A switching power supply module according to claim 1 or claim 2.

10. The output capacitor is mounted on the second circuit board. A switching power supply module according to claim 1 or claim 2.

11. At least one of the input capacitor and the output capacitor, and the power inductor are mounted on the surface of the second circuit board. On the back surface of the second circuit board, a two-dimensional arrangement of land conductors is formed. A switching power supply module according to claim 1 or claim 2.

12. The device includes a connecting member that electrically and physically connects the front surface of the second circuit board and the back surface of the first circuit board, The connecting member is formed from a busbar made primarily of metal, or from a wiring circuit board in which a conductor pattern is formed on substantially the entire surface of an insulating substrate. A switching power supply module according to claim 1 or claim 2.

13. A plurality of power conversion circuits each including the switching element and the power inductor, A control unit that controls the operation of the plurality of power conversion circuits, Equipped with, The control unit performs multiphase converter operation by shifting the phase of operation of the plurality of power conversion circuits. The switching power supply module according to claim 6.