Switching power supply module

Abstract

A switching power supply module (10) has a plurality of power conversion circuits configured on a circuit board. The plurality of power conversion circuits each include inductor elements (31, 32), power semiconductor package elements (21, 22), and a smoothing capacitor element. The inductor elements (31, 32) have a metal conductor mainly composed of metal and a magnetic core, the metal conductor penetrating the magnetic core. A firm-contact structure is established between the metal conductor and the magnetic core in the penetration portion. The plurality of inductor elements (31, 32) constituting the plurality of power conversion circuits are mounted on a circuit board (81). The plurality of power semiconductor package elements (21, 22) constituting the plurality of power conversion circuits are mounted on a circuit board (82). The width of the inductor elements (31, 32) is smaller than the width of the power semiconductor package elements (21, 22). The plurality of inductor elements (31, 32) are arrayed in parallel to the mounting surface of the circuit board (81) for the plurality of inductor elements (31, 32) and along the width direction of the plurality of inductor elements (31, 32). The circuit board (81) and the circuit board (82) are disposed in a state of being: parallel to the mounting surface of the circuit board (81) for the plurality of inductor elements (31, 32) and the mounting surface of the circuit board (82) for the plurality of power semiconductor package elements (21, 22); separated from each other in a direction orthogonal to the mounting surfaces; and overlapping in a plan view in the direction orthogonal to the mounting surfaces. The circuit board (81) and the circuit board (82) are electrically connected by a connection conductor (60) connecting the circuit boards in the direction orthogonal to the mounting surfaces.

Description

Switching Power Supply Module

[0001] The present invention relates to a switching power supply module including a plurality of power conversion circuits.

[0002] As described in Patent Document 1, a conventional switching power supply device has a structure in which a semiconductor IC including a switching element that constitutes a power conversion circuit, an inductor, and a capacitor are mounted on one side of a printed circuit board.

[0003] Currently, a large amount of power is required to operate advanced processors, which are advanced semiconductor ICs that perform high-speed calculations and are used in AI, data centers, etc. As semiconductor processes become more miniaturized, the operating voltage of advanced processors decreases, requiring them to be supplied with low-voltage, high-current power.

[0004] To achieve this large current, there is a demand for a multiphase switching power supply device in which a plurality of power conversion circuits are connected in parallel.

[0005] Japanese Patent Application Laid-Open No. 2018-117077

[0006] In the structure of the prior art, when trying to realize a multiphase switching power supply device as described above, a plurality of power conversion circuits corresponding to the number of phases is required, and accordingly, the number of semiconductor ICs, inductors, and capacitors that constitute each of the plurality of power conversion circuits increases according to the number of phases.

[0007] This results in a large planar shape of the switching power supply. This makes it difficult to place it close to the load, and increases power loss due to wiring resistance, resulting in large power loss. Since power loss is proportional to the square of the current, power loss becomes even more of a problem in switching power supplies that output large currents as described above.

[0008] Furthermore, since multiple semiconductor ICs, each of which is a heat-generating component, are arranged over a large area, the cooling function components such as heat sinks become larger, which reduces the heat dissipation efficiency per given spatial volume.

[0009] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a switching power supply module that reduces power loss and has high heat dissipation efficiency per given spatial volume.

[0010] The switching power supply module of the present invention comprises a plurality of power conversion circuits mounted on a circuit board. Each of the plurality of power conversion circuits comprises an inductor element, a power semiconductor package element, and a smoothing capacitor element. The inductor element comprises a metal conductor and a magnetic core, the metal conductor penetrating the magnetic core, and the metal conductor and the magnetic core are in close contact at the penetrating portion. The circuit board comprises a first circuit board and a second circuit board.

[0011] A plurality of inductor elements constituting the plurality of power conversion circuits are mounted on a first circuit board, and a plurality of power semiconductor package elements constituting the plurality of power conversion circuits are mounted on a second circuit board.

[0012] The width of the inductor element is smaller than the width of the power semiconductor package element. The plurality of inductor elements are arranged parallel to the mounting surface of the first circuit board on which the plurality of inductor elements are mounted and along the width direction of the plurality of inductor elements.

[0013] The first circuit board and the second circuit board are arranged so that the mounting surface of the first circuit board for the multiple inductor elements and the mounting surface of the second circuit board for the multiple power semiconductor package elements are parallel, separated from each other in a direction perpendicular to these mounting surfaces, and overlapping in a plan view seen in the direction perpendicular to these mounting surfaces. The first circuit board and the second circuit board are electrically connected by connecting conductors connected in a direction perpendicular to the mounting surfaces.

[0014] In this configuration, the power semiconductor package element and the inductor element that make up one power conversion circuit are arranged at different positions in the height direction of the switching power supply module and overlap in a planar view. This reduces the planar area of ​​the configuration region of the power conversion circuit, making it easier to place it close to the load. Furthermore, because the power semiconductor package element and the inductor element are arranged in a concentrated manner in a planar view, the heat-generating area in a planar view can be reduced, and a decrease in heat dissipation efficiency per given spatial volume is suppressed.

[0015] According to the present invention, it is possible to realize a switching power supply module that can reduce power loss, simplify the cooling structure per given spatial volume, and increase heat dissipation efficiency.

[0016] FIG. 1 is a circuit diagram of a switching power supply module according to a first embodiment. FIGS. 2A and 2B are external perspective views of the switching power supply module according to the first embodiment. FIG. 3 is an exploded perspective view of the switching power supply module according to the first embodiment. FIG. 4 is a front view and a side view of the switching power supply module according to the first embodiment. FIG. 5 is a front view, a side view, and a back view of a first circuit board of the switching power supply module according to the first embodiment. FIG. 6 is a front view, a side view, and a back view of a second circuit board of the switching power supply module according to the first embodiment. FIG. 7 is a perspective view, a front view, and a side view of an inductor element of the switching power supply module according to the first embodiment. FIG. 8 is a circuit diagram of a switching power supply module according to a second embodiment. FIG. 9 is an exploded perspective view of the switching power supply module according to the second embodiment. FIG. 10 is a front view and a side view of the switching power supply module according to the second embodiment. FIG. 11 is a circuit diagram of a switching power supply module according to a third embodiment. FIG. 12 is an exploded perspective view of the switching power supply module according to the third embodiment. FIG. 13 is a front view and a side view of the switching power supply module according to the third embodiment. Fig. 14 is an exploded perspective view of a switching power supply module according to a fourth embodiment. Fig. 15 is an exploded perspective view of a switching power supply module according to a fifth embodiment. Fig. 16 is a side view of a switching power supply module according to the fifth embodiment. Fig. 17 is an exploded perspective view of a switching power supply module according to a sixth embodiment. Fig. 18 is a side view of a switching power supply module according to the sixth embodiment. Fig. 19 is an exploded perspective view of a switching power supply module according to a seventh embodiment.

[0017] First Embodiment A switching power supply module according to a first embodiment of the present invention will be described with reference to the drawings.

[0018] (Circuit Configuration of Switching Power Supply Module 10) Fig. 1 is a circuit diagram of a switching power supply module according to a first embodiment. As shown in Fig. 1, the switching power supply module 10 includes a plurality of power semiconductor package elements (power semiconductor package elements 21 and 22), a plurality of inductors (inductor L31 and inductor L32), an input capacitor Ci, and an output capacitor Co. The output capacitor Co corresponds to the "smoothing capacitor" of the present invention.

[0019] The switching power supply module 10 includes a pair of input terminals PIH and PIL, a pair of output terminals POH and POL, an input side wiring LNi, an output side wiring LNo, and a reference potential wiring LNg.

[0020] A DC power supply is connected to the input terminals PIH and PIL, with the input terminal PIH connected to the positive terminal of the DC power supply and the input terminal PIL connected to the negative terminal of the DC power supply.

[0021] An input capacitor Ci is connected between the input terminal PIH and the input terminal PIL. The input terminal PIH is connected to an input side line LNi, and the input terminal PIL is connected to a reference potential line LNg.

[0022] The power semiconductor package element 21 and the power semiconductor package element 22 are connected to the input terminal PIH and the input terminal PIL, respectively.

[0023] The power semiconductor package element 21 includes a drive circuit 210, a power semiconductor element Q21H, and a power semiconductor element Q21L. The drive circuit 210 is configured by an analog circuit. The power semiconductor element Q21H and the power semiconductor element Q21L are configured by, for example, power FETs. The drive circuit 210, the power semiconductor element Q21H, and the power semiconductor element Q21L are integrally formed by a single analog IC.

[0024] The drain terminal of the power semiconductor element Q21H is connected to the input side wiring LNi. The source terminal of the power semiconductor element Q21H is connected to the drain terminal of the power semiconductor element Q21L. The source terminal of the power semiconductor element Q21L is connected to the reference potential wiring LNg.

[0025] The gate terminal of power semiconductor element Q21H and the gate terminal of power semiconductor element Q21L are connected to drive circuit 210. Although not shown, drive circuit 210 receives power from a DC power supply through input side wiring LNi. Drive circuit 210 controls the drive of power semiconductor element Q21H and power semiconductor element Q21L. As a result, switching of power semiconductor element Q21H and power semiconductor element Q21L is controlled at a predetermined switching frequency (switching period).

[0026] The power semiconductor package element 22 includes a drive circuit 220, a power semiconductor element Q22H, and a power semiconductor element Q22L. The drive circuit 220 is configured by an analog circuit. The power semiconductor element Q22H and the power semiconductor element Q22L are configured by, for example, power FETs. The drive circuit 220, the power semiconductor element Q22H, and the power semiconductor element Q22L are integrally formed by a single analog IC.

[0027] The drain terminal of the power semiconductor element Q22H is connected to the input side wiring LNi. The source terminal of the power semiconductor element Q22H is connected to the drain terminal of the power semiconductor element Q22L. The source terminal of the power semiconductor element Q22L is connected to the reference potential wiring LNg.

[0028] The gate terminal of power semiconductor element Q22H and the gate terminal of power semiconductor element Q22L are connected to drive circuit 220. Although not shown, drive circuit 220 receives power from a DC power supply through input side wiring LNi. Drive circuit 220 controls the drive of power semiconductor element Q22H and power semiconductor element Q22L. As a result, the switching of power semiconductor element Q22H and power semiconductor element Q22L is controlled at a predetermined switching frequency (switching period).

[0029] One terminal of the inductor L31 is connected to the output terminal of the power semiconductor package element 21 (the node of the source terminal of the power semiconductor element Q21H and the gate terminal of the power semiconductor element Q21L).

[0030] One terminal of the inductor L32 is connected to the output terminal of the power semiconductor package element 22 (the node of the source terminal of the power semiconductor element Q22H and the gate terminal of the power semiconductor element Q22L).

[0031] The other terminal of the inductor L31 and the other terminal of the inductor L32 are connected to the output side line LNo.

[0032] The output side wiring LNo is connected to the output terminal POH, and the output terminal POL is connected to the reference potential wiring LNg.

[0033] The output capacitor Co is connected between the output terminals POH and POL.

[0034] The load ZLD is connected between the output terminals POH and POL.

[0035] With this configuration, the switching power supply module 10 includes a first power conversion circuit including a power semiconductor package element 21, an inductor L31, and an output capacitor Co, and a second power conversion circuit including a power semiconductor package element 22, an inductor L32, and an output capacitor Co.

[0036] The drive circuit 210 of the power semiconductor package element 21 and the drive circuit 220 of the power semiconductor package element 22 are connected to an MPU (not shown).

[0037] The MPU performs multiphase control on the power semiconductor package elements 21 and 22. In this case, the MPU performs two-phase multiphase control, so that the first power conversion circuit and the second power conversion circuit of the switching power supply module 10 perform multiphase operation to supply power to the load ZLD.

[0038] 2A and 2B are external perspective views of the switching power supply module according to the first embodiment. FIG. 2A is a view without a heat sink, and FIG. 2B is a view with a heat sink attached. FIG. 3 is an exploded perspective view of the switching power supply module according to the first embodiment. FIG. 4 is a front view and a side view of the switching power supply module according to the first embodiment. FIG. 5 is a front view, a side view, and a back view of a first circuit board of the switching power supply module according to the first embodiment. FIG. 6 is a front view, a side view, and a back view of a second circuit board of the switching power supply module according to the first embodiment. FIG. 7 is a perspective view, a front view, and a side view of an inductor element of the switching power supply module according to the first embodiment. Note that in the drawings of each embodiment, including this embodiment, leads and symbols have been omitted as appropriate to prioritize readability, to the extent that they can be easily inferred from the descriptions of other parts.

[0039] The switching power supply module 10 includes a plurality of power semiconductor package elements 21, 22, a plurality of inductor elements 31, 32, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a plurality of connecting conductors 60, a circuit board 81, a circuit board 82, and a heat sink HS.

[0040] The power semiconductor package elements 21 and 22 are formed by mounted analog ICs and correspond to the power semiconductor package elements 21 and 22 in the circuit diagram of FIG. 1, respectively.

[0041] Inductor element 31 and inductor element 32 are formed as mounted elements. Inductor element 31 corresponds to inductor L31 in the circuit diagram of Fig. 1, and inductor element 32 corresponds to inductor L32 in the circuit diagram of Fig. 1. Fig. 7 shows inductor element 31, but inductor element 31 and inductor element 32 have the same structure.

[0042] 7 , the inductor element 31 includes a metal conductor 311 and a magnetic core 312. The metal conductor 311 is a rod having a bent portion (curved portion) along the middle. The metal conductor 311 includes a main body 3110, a first end 3111, and a second end 3112.

[0043] The first end 3111 is connected to one end of the main body portion 3110 in the extension direction (direction of conduction to the magnetic core 312). The second end 3112 is connected to the other end of the main body portion 3110 in the extension direction. The extension directions of the first end 3111 and the second end 3112 are perpendicular to the extension direction of the main body portion 3110. The extension directions of the first end 3111 and the second end 3112 are opposite to each other. The tip end of the first end 3111 (the end opposite to the end connected to the main body portion 3110) is the first terminal E3111 of the inductor element 31. The tip end of the second end 3112 (the end opposite to the end connected to the main body portion 3110) is the second terminal E3112 of the inductor element 31.

[0044] The magnetic core 312 has a substantially rectangular parallelepiped shape and contains the main body 3110 of the metal conductor 311. The magnetic core 312 is in close contact with the side surface of the main body 3110 (a surface parallel to the penetration direction at the penetration portion where the main body 3110 penetrates the magnetic core 312).

[0045] The first end portion 3111 protrudes from the first end face EF3121 of the magnetic core 312 to the outside of the magnetic core 312 and extends toward the back surface D312 of the magnetic core 312. A tip end (first terminal E3111) of the first end portion 3111 protrudes beyond the back surface D312 of the magnetic core 312.

[0046] The second end 3112 protrudes from the second end face EF3122 of the magnetic core 312 to the outside of the magnetic core 312 and extends toward the surface U312 of the magnetic core 312. The tip of the second end 3112 (second terminal E3112) protrudes beyond the surface U312 of the magnetic core 312.

[0047] The shapes of the inductor element 31 and the inductor element 32 are not limited to this, and may be any shape in which the first terminal E3111 protrudes toward the back surface D312 of the magnetic core 312 and the second terminal E3112 protrudes toward the front surface U312 of the magnetic core 312.

[0048] The plurality of capacitor elements 40 are formed as mount-type elements. The plurality of capacitor elements 40 correspond to the input capacitors Ci in Fig. 1. The plurality of capacitor elements 40 are, for example, chip-type capacitor elements having terminal electrodes on both ends.

[0049] The plurality of capacitor elements 50 are formed as mount-type elements. The plurality of capacitor elements 50 correspond to the output capacitors Co in Fig. 1. The plurality of capacitor elements 50 are, for example, chip-type capacitor elements having terminal electrodes on both ends.

[0050] (Mounting Structure of Circuit Board 81) The circuit board 81 is substantially rectangular in plan view and has a front surface 811 and a back surface 812. The circuit board 81 is mainly made of insulating resin and has a conductor pattern formed thereon to implement the switching power supply module 10. In this embodiment, the circuit board 81 corresponds to the first circuit board, the front surface 811 corresponds to the first front surface, and the back surface 812 corresponds to the first back surface.

[0051] 5 and other figures, the inductor element 31, the inductor element 32, the plurality of capacitor elements 50, and the plurality of connecting conductors 60 are mounted on the surface 811 of the circuit board 81. In other words, the surface 811 is the mounting surface for the inductor element 31, the inductor element 32, the plurality of capacitor elements 50, and the plurality of connecting conductors 60. More specifically, the mounting pattern is as follows.

[0052] The inductor element 31 and the inductor element 32 are mounted so that their respective length directions (extension directions of the main body portions 3110 of the metal conductor 311 and 321) are parallel to the first direction (L direction in each drawing) on ​​the circuit board 81. The inductor element 31 and the inductor element 32 are mounted adjacent to each other in the second direction (W direction in each drawing) on ​​the circuit board 81.

[0053] The inductor element 31 and the inductor element 32 are mounted so that the direction in which their main bodies extend is substantially parallel to the surface 811 of the circuit board 81. The inductor element 31 and the inductor element 32 are mounted so that the direction in which their main bodies extend is parallel to the first direction (L direction) of the circuit board 81.

[0054] The inductor element 31 is mounted so that the magnetic core 312 is positioned away from the surface 811. The inductor element 32 is mounted so that the magnetic core 322 is positioned away from the surface 811. The distance between the magnetic core 312 and the surface 811 and the distance between the magnetic core 322 and the surface 811 are approximately the same.

[0055] The first terminal E3111 of the metal conductor 311 of the inductor element 31 and the first terminal E3211 of the metal conductor 321 of the inductor element 32 are joined to land conductors on the surface 811 of the circuit board 81 by a conductive bonding material such as solder.

[0056] The second terminal E3112 of the inductor element 31 and the second terminal E3212 of the inductor element 32 are located near one end of the circuit board 81 in the first direction.

[0057] The plurality of capacitor elements 50 are mounted in the height direction (H direction in each drawing) between the magnetic core 312 of the inductor element 31 or the magnetic core 322 of the inductor element 32 and the surface 811. When the surface 811 is viewed from above, the plurality of capacitor elements 50 are mounted in an area that substantially overlaps the inductor element 31 or the inductor element 32. The plurality of capacitor elements 50 are arranged two-dimensionally on two orthogonal axes, that is, the first direction and the second direction.

[0058] The plurality of connecting conductors 60 are made of a metal plate having a flat surface or an insulating substrate (e.g., a glass epoxy substrate) having a flat surface and on which a conductor pattern is formed. The length of the plurality of connecting conductors 60 in the second direction (W direction) is approximately the same as the length of the circuit boards 81 and 82 in the second direction (W direction).

[0059] The plurality of connecting conductors 60 are mounted near the other end in the first direction (the L direction in each drawing) on ​​the surface 811 of the circuit board 81. The plurality of connecting conductors 60 are arranged so that their flat surfaces are parallel to a direction perpendicular to the surface 811 and a direction parallel to the second direction (the W direction in each drawing). The plurality of connecting conductors 60 are arranged at intervals in the first direction.

[0060] A plurality of external connecting conductors 819 are formed on the rear surface 812 of the circuit board 81. The plurality of external connecting conductors 819 are, for example, circular in plan view and are arranged two-dimensionally along two orthogonal axes, a first direction and a second direction. Some of the plurality of external connecting conductors 819 form the input terminal PIH, the input terminal PIL, the output terminal POH, and the output terminal POL shown in the circuit of FIG. 1 .

[0061] (Mounting Structure of Circuit Board 82) The circuit board 82 is substantially rectangular in plan view, and has a front surface 821 and a back surface 822. The circuit board 82 is mainly made of insulating resin and has a conductor pattern formed thereon to implement the switching power supply module 10. The planar shape of the circuit board 82 is substantially the same as the planar shape of the circuit board 81. In this embodiment, the circuit board 82 corresponds to the second circuit board, the front surface 821 corresponds to the second front surface, and the back surface 822 corresponds to the second back surface.

[0062] 6 and other figures, the power semiconductor package element 21 and the plurality of capacitor elements 40 are mounted on a surface 821 of the circuit board 82. In other words, the surface 821 is the mounting surface for the power semiconductor package element 21 and the plurality of capacitor elements 40.

[0063] The power semiconductor package element 21 and the group of the plurality of capacitor elements 40 are aligned in a first direction (direction L in each drawing) on ​​the surface 821. The power semiconductor package element 21 is arranged closer to one end of the surface 821 than the group of the plurality of capacitor elements 40.

[0064] The plurality of capacitor elements 40 are arranged two-dimensionally on the surface 821 along two orthogonal axes, a first direction and a second direction.

[0065] The power semiconductor package element 22 and the plurality of capacitor elements 40 are mounted on a rear surface 822 of the circuit board 82. In other words, the rear surface 822 is a mounting surface for the power semiconductor package element 22 and the plurality of capacitor elements 40.

[0066] The power semiconductor package element 22 and the group of the plurality of capacitor elements 40 are aligned in a first direction (direction L in each drawing) on ​​the rear surface 822. The power semiconductor package element 22 is arranged closer to one end of the rear surface 822 than the group of the plurality of capacitor elements 40.

[0067] In a plan view of the circuit board 82 , the power semiconductor package element 22 overlaps the power semiconductor package element 21 .

[0068] At one end in the first direction of the rear surface 822, a land conductor (see dotted lines in FIG. 6 ) on which the second terminal E3112 of the inductor element 31 and the second terminal E3212 of the inductor element 32 are mounted is formed. At the other end in the first direction of the rear surface 822, no multiple capacitor elements 40 are mounted, but a land conductor (see dotted lines in FIG. 6 ) on which a multiple number of connecting conductors 60 are mounted is formed. In other words, the rear surface 822 is also a mounting surface on which the multiple connecting conductors 60, the second terminal E3112 of the inductor element 31, and the second terminal E3212 of the inductor element 32 are mounted.

[0069] (Laminated structure of circuit board 81 and circuit board 82) The circuit board 82 is disposed on the front surface 811 side of the circuit board 81. The back surface 822 of the circuit board 82 faces the front surface 811 of the circuit board 81. In other words, the circuit boards 82 and 81 overlap when viewed in the height direction (direction H in each drawing) (in a plan view). The length direction of the circuit board 81 and the length direction of the circuit board 82 are parallel to each other.

[0070] The circuit board 81 and the circuit board 82 are separated from each other in the height direction (H direction in each drawing).

[0071] The second terminal E3112 of the inductor element 31, the second terminal E3212 of the inductor element 32, and a plurality of connecting conductors 60 are mounted on the back surface 822 of the circuit board 82. This electrically and physically connects the circuit board 81 and the circuit board 82. The plurality of connecting conductors 60 form the input side wiring LNi and the reference potential wiring LNg in the circuit of FIG.

[0072] In this configuration, in a plan view of the switching power supply module 10, the inductor element 31 and the inductor element 32 overlap with the power semiconductor package element 21 and the power semiconductor package element 22.

[0073] More specifically, the width W31 of the inductor element 31 and the width W32 of the inductor element 32 (see FIG. 5, etc.) are smaller than, and are approximately half of, the width W21 of the power semiconductor package element 21 and the width W22 of the power semiconductor package element 22 (see FIG. 6, etc.). As a result, in the width direction of the switching power supply module 10, the inductor element 31 and the inductor element 32 overlap with the power semiconductor package elements 21, 22 almost entirely.

[0074] Furthermore, the length L31 of the inductor element 31 and the length L32 of the inductor element 32 (see FIG. 5, etc.) are shorter than the length L21 of the power semiconductor package element 21 and the length L22 of the power semiconductor package element 22. As a result, in the length direction of the switching power supply module 10, the inductor element 31 and the inductor element 32 overlap substantially entirely with the power semiconductor package elements 21 and 22.

[0075] In this manner, in this embodiment, the inductor element 31 and the inductor element 32 overlap substantially entirely with the power semiconductor package elements 21 and 22 in both the length direction and the width direction.

[0076] (Example of the effect of the above configuration) With this configuration, the power semiconductor package elements and inductor elements that make up one power conversion circuit are not aligned on a plane but are aligned in the height direction, which reduces the planar area of ​​one power conversion circuit.

[0077] Furthermore, the planar area of ​​the switching power supply module 10 is reduced, making it easier to arrange the power semiconductor package elements 21 and 22 and the inductor elements 31 and 32 close to the load ZLD. This allows the switching power supply module 10 to reduce loss in power supply to the load ZLD.

[0078] Furthermore, the power semiconductor package elements 21, 22 and the inductor elements 31, 32 are arranged in a concentrated manner in a plane. This allows the switching power supply module 10 to have a small heat-generating area in a planar view. Furthermore, the switching power supply module 10 can confine heat generated by electronic components arranged in various locations within a predetermined spatial volume, thereby uniforming the temperature distribution within the predetermined spatial volume. Therefore, the switching power supply module 10 can simplify the cooling structure, suppress a decrease in heat dissipation efficiency per predetermined spatial volume, and improve heat dissipation efficiency.

[0079] 2B, the heat sink HS is positioned in the switching power supply module 10 so as to abut against the uppermost power semiconductor package element 21 of the switching power supply module 10 at a position overlapping the power semiconductor package elements 21 and 22 and the inductor elements 31 and 32. This allows the switching power supply module 10 to dissipate heat efficiently.

[0080] Furthermore, since the planar area of ​​the heat sink HS can be made approximately the same as the planar area of ​​the power semiconductor package element 21, the planar area of ​​the switching power supply module 10 with the heat sink HS attached can be prevented from becoming larger, and the switching power supply module 10 can be made compact.

[0081] Furthermore, inductor element 31 and inductor element 32 are connected to circuit board 81 and circuit board 82. In other words, inductor element 31 and inductor element 32 also function as an electrical connection between circuit board 81 and circuit board 82. As a result, even if circuit board 81 and circuit board 82 are separated in the height direction, it is not necessary to provide a separate conductor pattern connecting power semiconductor package element 21 and inductor element 31, and a separate conductor pattern connecting power semiconductor package element 22 and inductor element 32. This allows the number of components of switching power supply module 10 to be reduced, thereby achieving miniaturization.

[0082] Furthermore, in this configuration, the power semiconductor package element 21 and the inductor element 31 overlap in plan view, and the second terminal E3112 of the inductor element 31 is connected to the circuit board 82 near the power semiconductor package element 21 in plan view.

[0083] This allows the switching power supply module 10 to shorten the connection distance between the power semiconductor package element 21 and the inductor element 31. Similarly, the power semiconductor package element 22 and the inductor element 32 overlap in a planar view, and the second terminal E3212 of the inductor element 32 is connected to the circuit board 82 near the power semiconductor package element 22 in a planar view. This allows the switching power supply module 10 to shorten the connection distance between the power semiconductor package element 22 and the inductor element 32.

[0084] Furthermore, the metal conductor 311 of the inductor element 31 has a larger cross-sectional area than the conductor pattern of the circuit board 82. This reduces the electrical resistance between the power semiconductor package element 21 and the inductor element 31. Similarly, the metal conductor 321 of the inductor element 32 has a larger cross-sectional area than the conductor pattern of the circuit board 82. This reduces the electrical resistance between the power semiconductor package element 22 and the inductor element 32.

[0085] In inductor element 31, main body 3110 of metal conductor 311 is in close contact with magnetic core 312. In inductor element 32, main body 3110 of metal conductor 321 is in close contact with magnetic core 322. This increases the adhesion between the metal conductor and the magnetic core in inductor elements 31 and 32, thereby increasing the magnetic flux density of the generated magnetic flux.

[0086] Therefore, the outer shape of the inductor elements 31, 32 can be made small to achieve the desired inductance, which makes it easier to arrange the inductor elements 31, 32 so that they overlap the power semiconductor package elements 21, 22. Therefore, in the switching power supply module 10, heat generation points tend to be concentrated in a planar manner, and heat dissipation efficiency can be more reliably improved.

[0087] Furthermore, since the input side wiring LNi and the reference potential wiring LNg are formed by the connecting conductor 60 and the connecting conductor 60 is a flat plate, the switching power supply module 10 can reduce the electrical resistance of the input side wiring LNi and the electrical resistance of the reference potential wiring LNg.

[0088] By overlapping or placing the external connecting conductors 819i (see side view of Figure 4) that constitute the input terminals PIH and PIL with multiple connecting conductors 60 in a planar view, the wiring between the input terminals PIH and PIL and the multiple capacitor elements 40 and power semiconductor package elements 21, 22 can be shortened.

[0089] By placing the external connecting conductor 819o (see side view in Figure 4) that constitutes the output terminal POH and the output terminal POL close to or overlapping the multiple capacitor elements 50 in a planar view, the wiring between the multiple capacitor elements 50 and inductor elements 31, 32 and the output terminal POH and the output terminal POL can be shortened.

[0090] In the above configuration, current flows in a substantially counterclockwise direction through the input terminals PIH and PIL, the plurality of capacitor elements 40 (input capacitors Ci), the plurality of power semiconductor package elements 21 and 22, the plurality of inductor elements 31 and 32, the plurality of capacitor elements 50 (output capacitors Co), and the output terminals POH and POL, in that order, as can be seen by referring to the side view of Figure 4, for example. This allows the switching power supply module 10 to have short wiring.

[0091] Second Embodiment A switching power supply module according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 8 is a circuit diagram of the switching power supply module according to the second embodiment. Fig. 9 is an exploded perspective view of the switching power supply module according to the second embodiment. Fig. 10 is a surface view and a side view of the switching power supply module according to the second embodiment.

[0092] The switching power supply module 10A according to the second embodiment has a configuration that supports three-phase multiphase control, and in this respect it differs from the switching power supply module 10 according to the first embodiment. Descriptions of the same parts of the switching power supply module 10A as those of the switching power supply module 10 will be omitted where appropriate.

[0093] (Circuit Configuration of Switching Power Supply Module 10A) As shown in FIG. 8, the switching power supply module 10A includes a plurality of power semiconductor package elements (power semiconductor package element 21, power semiconductor package element 22, and power semiconductor package element 23), a plurality of inductors (inductor L31, inductor L32, and inductor L33), an input capacitor Ci, and an output capacitor Co.

[0094] The power semiconductor package element 23 includes a drive circuit 230, a power semiconductor element Q23H, and a power semiconductor element Q23L. The power semiconductor package element 23 has the same configuration as the power semiconductor package elements 21 and 22.

[0095] The power semiconductor package element 23 is connected in parallel to the power semiconductor package element 21 and the power semiconductor package element 22 .

[0096] One terminal of the inductor L33 is connected to the output terminal of the power semiconductor package element 23. The other terminal of the inductor L33 is connected to the output side wiring LNo.

[0097] With this configuration, the switching power supply module 10A achieves three-phase multiphase control.

[0098] 9 and 10 , the switching power supply module 10A differs from the switching power supply module 10 according to the first embodiment in that it generally uses three circuit boards. Descriptions of the same parts of the switching power supply module 10A as those of the switching power supply module 10 will be omitted where appropriate.

[0099] The switching power supply module 10A includes a plurality of power semiconductor package elements 21, 22, 23, a plurality of inductor elements 31A, 32A, 33A, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a plurality of connecting conductors 60, a plurality of connecting conductors 61A, a connecting conductor 62A, a circuit board 81, a circuit board 82, and a circuit board 83.

[0100] The power semiconductor package elements 21, 22, and 23 are formed by mounted analog ICs, and correspond to the power semiconductor package elements 21, 22, and 23 in the circuit diagram of FIG. 8, respectively.

[0101] Inductor element 31A, inductor element 32A, and inductor element 33A are formed as mounted elements. Inductor element 31A corresponds to inductor L31 in the circuit diagram of Fig. 8, inductor element 32A corresponds to inductor L32 in the circuit diagram of Fig. 8, and inductor element 33A corresponds to inductor L33 in the circuit diagram of Fig. 8.

[0102] Inductor element 31A includes a metal conductor 311A ​​and a magnetic core 312A. Inductor element 32A includes a metal conductor 321A and a magnetic core 322A. Inductor element 33A includes a metal conductor 331A and a magnetic core 332A. The schematic structures of inductor elements 31A, 32A, and 33A are similar to those of inductor elements 31 and 32.

[0103] The width of the inductor elements 31A, 32A, and 33A is about one-third of the width of the power semiconductor package elements 21, 22, and 23.

[0104] The plurality of connecting conductors 61A and the connecting conductor 62A have the same configuration as the connecting conductor 60 .

[0105] The circuit board 83 has a front surface 831 and a back surface 832, and similar to the circuit boards 81 and 82, a conductor pattern for realizing the switching power supply module 10A is formed thereon.

[0106] (Mounting Structure of Circuit Board 81) On a surface 811 of the circuit board 81, a plurality of inductor elements 31A, 32A, 33A, a plurality of capacitor elements 50, and a plurality of connecting conductors 60 are mounted.

[0107] The inductor element 31A, the inductor element 32A, and the inductor element 33A are mounted adjacent to each other in the second direction (W direction in each drawing) on ​​the circuit board 81.

[0108] The first terminal E3111 of the metal conductor 311A ​​of the inductor element 31A, the first terminal E3211 of the metal conductor 321A of the inductor element 32A, and the first terminal E3311 of the metal conductor 331A of the inductor element 33A are joined to the land conductor on the surface 811 of the circuit board 81 by a conductive bonding material such as solder.

[0109] The second terminal E3112 of the inductor element 31A, the second terminal E3212 of the inductor element 32A, and the second terminal E3312 of the inductor element 33A are located near one end of the circuit board 81 in the first direction.

[0110] (Mounting Structure of Circuit Board 82) On the circuit board 82, the power semiconductor package element 23, the plurality of capacitor elements 40, the plurality of connecting conductors 61A, and the connecting conductor 62A are mounted.

[0111] A plurality of connecting conductors 61A and a plurality of connecting conductors 62A are mounted on a surface 821 of the circuit board 82. The plurality of connecting conductors 61A are mounted at positions overlapping the plurality of connecting conductors 60 in a plan view. The connecting conductor 62A is mounted at a position overlapping the second terminals of the plurality of inductor elements 31A, 32A, and 33A in a plan view.

[0112] A power semiconductor package element 23 and a plurality of capacitor elements 40 are mounted on a rear surface 822 of the circuit board 82 .

[0113] (Mounting Structure of Circuit Board 83) On the circuit board 83, the power semiconductor package element 21, the power semiconductor package element 22, and a plurality of capacitor elements 40 are mounted.

[0114] A power semiconductor package element 21 and a plurality of capacitor elements 40 are mounted on a front surface 831 of the circuit board 83. A power semiconductor package element 22 and a plurality of capacitor elements 40 are mounted on a back surface 832 of the circuit board 83.

[0115] (Stacked structure of multiple circuit boards 81, 82, 83) The circuit board 82 is disposed on the front surface 811 side of the circuit board 81. The back surface 822 of the circuit board 82 faces the front surface 811 of the circuit board 81. In other words, the circuit boards 82 and 81 overlap (in a plan view) when viewed in the height direction (direction H in each drawing). The length direction of the circuit board 82 and the length direction of the circuit board 81 are parallel. The circuit boards 82 and 81 are separated from each other in the height direction (direction H in each drawing).

[0116] The circuit board 83 is disposed on the front surface 821 side of the circuit board 82. The back surface 832 of the circuit board 83 faces the front surface 821 of the circuit board 82. In other words, the circuit boards 83 and 82 overlap (in a plan view) when viewed in the height direction (direction H in each drawing). The length direction of the circuit board 83 and the length direction of the circuit board 82 are parallel. The circuit boards 83 and 82 are separated from each other in the height direction (direction H in each drawing).

[0117] The second terminal E3112 of the inductor element 31A, the second terminal E3212 of the inductor element 32A, the second terminal E3312 of the inductor element 33A, and a plurality of connecting conductors 60 are mounted on a rear surface 822 of the circuit board 82. As a result, the circuit board 81 and the circuit board 82 are electrically and physically connected to each other.

[0118] A plurality of connection conductors 61A and connection conductors 62A are mounted on a rear surface 832 of the circuit board 83. As a result, the circuit boards 82 and 83 are electrically and physically connected to each other.

[0119] In this configuration, in a plan view of the switching power supply module 10A, the power semiconductor package element 21, the power semiconductor package element 22, and the power semiconductor package element 23 overlap each other. Furthermore, in a plan view of the switching power supply module 10A, the inductor element 31A, the inductor element 32A, and the inductor element 33A overlap with the power semiconductor package element 21, the power semiconductor package element 22, and the power semiconductor package element 23.

[0120] With this configuration, the switching power supply module 10A can achieve three-phase multiphase control while having approximately the same planar area as the two-phase multiphase control switching power supply module 10. The switching power supply module 10A can achieve the same effects as the switching power supply module 10.

[0121] Furthermore, in the switching power supply module 10A, the plurality of connecting conductors 61A overlap the plurality of connecting conductors 60 in a plan view. This allows the switching power supply module 10A to shorten the connection distances between the input terminal PIH and the output terminal POH and the plurality of power semiconductor package elements 21, 22, and 23, thereby suppressing power loss.

[0122] Furthermore, in the switching power supply module 10A, the connecting conductor 62A overlaps with the second terminals of the multiple inductor elements 31A, 32A, and 33A. This allows the switching power supply module 10A to shorten the connection distance between the power semiconductor package element 21 and the inductor element 31A, the connection distance between the power semiconductor package element 22 and the inductor element 32A, and the connection distance between the power semiconductor package element 23 and the inductor element 33A, thereby suppressing power loss.

[0123] [Third Embodiment] A switching power supply module according to a third embodiment of the present invention will be described with reference to the drawings. Fig. 11 is a circuit diagram of the switching power supply module according to the third embodiment. Fig. 12 is an exploded perspective view of the switching power supply module according to the third embodiment. Fig. 13 is a surface view and a side view of the switching power supply module according to the third embodiment.

[0124] The switching power supply module 10B according to the third embodiment has a configuration that supports four-phase multiphase control, and in this respect it differs from the switching power supply module 10A according to the second embodiment. Descriptions of the same parts of the switching power supply module 10B as those of the switching power supply module 10A will be omitted where appropriate.

[0125] (Circuit Configuration of Switching Power Supply Module 10B) As shown in FIG. 11, the switching power supply module 10B includes a plurality of power semiconductor package elements (power semiconductor package element 21, power semiconductor package element 22, power semiconductor package element 23, and power semiconductor package element 24), a plurality of inductors (inductor L31, inductor L32, inductor L33, and inductor L34), an input capacitor Ci, and an output capacitor Co.

[0126] The power semiconductor package element 24 includes a drive circuit 240, a power semiconductor element Q24H, and a power semiconductor element Q24L. The power semiconductor package element 24 has the same configuration as the power semiconductor package elements 21, 22, and 23.

[0127] The power semiconductor package element 24 is connected in parallel to the power semiconductor package elements 21 , 22 , and 23 .

[0128] One terminal of the inductor L34 is connected to the output terminal of the power semiconductor package element 24. The other terminal of the inductor L34 is connected to the output side wiring LNo.

[0129] With this configuration, the switching power supply module 10B achieves four-phase multiphase control.

[0130] 12 and 13, the switching power supply module 10B differs from the switching power supply module 10A according to the second embodiment in that it includes four power semiconductor package elements and four inductor elements. Descriptions of the same parts of the switching power supply module 10B as those of the switching power supply module 10A will be omitted where appropriate.

[0131] The switching power supply module 10B includes a plurality of power semiconductor package elements 21, 22, 23, 24, a plurality of inductor elements 31B, 32B, 33B, 34B, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a plurality of connecting conductors 60, a plurality of connecting conductors 61B, a connecting conductor 62B, a circuit board 81, a circuit board 82, and a circuit board 83.

[0132] The power semiconductor package elements 21, 22, 23, and 24 are formed by mounted analog ICs, and correspond to the power semiconductor package elements 21, 22, 23, and 24 in the circuit diagram of FIG. 11, respectively.

[0133] Inductor element 31B, inductor element 32B, inductor element 33B, and inductor element 34B are formed as mounted elements. Inductor element 31B corresponds to inductor L31 in the circuit diagram of Fig. 11, inductor element 32B corresponds to inductor L32 in the circuit diagram of Fig. 11, inductor element 33B corresponds to inductor L33 in the circuit diagram of Fig. 11, and inductor element 34B corresponds to inductor L34 in the circuit diagram of Fig. 11.

[0134] Inductor element 31B includes a metal conductor 311B and a magnetic core 312B. Inductor element 32B includes a metal conductor 321B and a magnetic core 322B. Inductor element 33B includes a metal conductor 331B and a magnetic core 332B. Inductor element 34B includes a metal conductor 341B and a magnetic core 342B. The general structures of inductor elements 31B, 32B, 33B, and 34B are similar to those of inductor elements 31 and 32 according to the first embodiment.

[0135] The width of the inductor elements 31B, 32B, 33B, and 34B is about 1 / 4 of the width of the power semiconductor package elements 21, 22, 23, and 24.

[0136] The plurality of connecting conductors 61B have the same configuration as the plurality of connecting conductors 61A, and the connecting conductor 62B has the same configuration as the connecting conductor 62B.

[0137] Conductor patterns for realizing the switching power supply module 10B are formed on the plurality of circuit boards 81, 82, and 83.

[0138] (Mounting Structure of Circuit Board 81) On a surface 811 of the circuit board 81, a plurality of inductor elements 31B, 32B, 33B, 34B, a plurality of capacitor elements 50, and a plurality of connecting conductors 60 are mounted.

[0139] Inductor element 31B, inductor element 32B, inductor element 33B, and inductor element 34B are mounted adjacent to each other in the second direction (W direction in each drawing) on ​​circuit board 81.

[0140] The first terminal E3111 of the metal conductor 311B of the inductor element 31B, the first terminal E3211 of the metal conductor 321B of the inductor element 32B, the first terminal E3311 of the metal conductor 331B of the inductor element 33B, and the first terminal E3411 of the metal conductor 341B of the inductor element 34B are joined to the land conductor on the surface 811 of the circuit board 81 by a conductive bonding material such as solder.

[0141] The second terminal E3112 of the inductor element 31B, the second terminal E3212 of the inductor element 32B, the second terminal E3312 of the inductor element 33B, and the second terminal E3412 of the inductor element 34B are located near one end of the circuit board 81 in the first direction.

[0142] (Mounting Structure of Circuit Board 82) On the circuit board 82, the power semiconductor package element 23, the power semiconductor package element 24, the plurality of capacitor elements 40, the plurality of connecting conductors 61B, and the connecting conductor 62B are mounted.

[0143] The power semiconductor package element 23, a plurality of connecting conductors 61B, and a connecting conductor 62B are mounted on a surface 821 of the circuit board 82. The plurality of connecting conductors 61B are mounted in positions overlapping the plurality of connecting conductors 60 in a plan view. The connecting conductor 62B is mounted in positions overlapping the second terminals of the plurality of inductor elements 31B, 32B, 33B, and 34B in a plan view.

[0144] The power semiconductor package element 24 and a plurality of capacitor elements 40 are mounted on the rear surface 822 of the circuit board 82 .

[0145] (Mounting Structure of Circuit Board 83) On the circuit board 83, the power semiconductor package element 21, the power semiconductor package element 22, and a plurality of capacitor elements 40 are mounted.

[0146] A power semiconductor package element 21 and a plurality of capacitor elements 40 are mounted on a front surface 831 of the circuit board 83. A power semiconductor package element 22 and a plurality of capacitor elements 40 are mounted on a back surface 832 of the circuit board 83.

[0147] (Stacked structure of multiple circuit boards 81, 82, 83) The circuit board 82 is disposed on the front surface 811 side of the circuit board 81. The back surface 822 of the circuit board 82 faces the front surface 811 of the circuit board 81. In other words, the circuit boards 82 and 81 overlap (in a plan view) when viewed in the height direction (direction H in each drawing). The length direction of the circuit board 82 and the length direction of the circuit board 81 are parallel. The circuit boards 82 and 81 are separated from each other in the height direction (direction H in each drawing).

[0148] The circuit board 83 is disposed on the front surface 821 side of the circuit board 82. The back surface 832 of the circuit board 83 faces the front surface 821 of the circuit board 82. In other words, the circuit boards 83 and 82 overlap (in a plan view) when viewed in the height direction (direction H in each drawing). The length direction of the circuit board 83 and the length direction of the circuit board 82 are parallel. The circuit boards 83 and 82 are separated from each other in the height direction (direction H in each drawing).

[0149] The second terminal E3112 of the inductor element 31B, the second terminal E3212 of the inductor element 32B, the second terminal E3312 of the inductor element 33A, and a plurality of connecting conductors 60 are mounted on a rear surface 822 of the circuit board 82. As a result, the circuit board 81 and the circuit board 82 are electrically and physically connected to each other.

[0150] A plurality of connection conductors 61B and connection conductors 62B are mounted on a rear surface 832 of the circuit board 83. As a result, the circuit boards 82 and 83 are electrically and physically connected to each other.

[0151] In this configuration, in a plan view of the switching power supply module 10B, the power semiconductor package element 21, the power semiconductor package element 22, the power semiconductor package element 23, and the power semiconductor package element 24 overlap with each other. Furthermore, in a plan view of the switching power supply module 10B, the inductor element 31B, the inductor element 32B, the inductor element 33B, and the inductor element 34B overlap with the power semiconductor package element 21, the power semiconductor package element 22, the power semiconductor package element 23, and the power semiconductor package element 24.

[0152] With this configuration, the switching power supply module 10B can achieve four-phase multiphase control while having approximately the same planar area as the switching power supply module 10 with two-phase multiphase control and the switching power supply module 10A with three-phase multiphase control.The switching power supply module 10B can achieve the same effects as the switching power supply modules 10 and 10A.

[0153] Furthermore, in the switching power supply module 10B, in a plan view, the plurality of connecting conductors 61B overlap the plurality of connecting conductors 60. This allows the switching power supply module 10B to shorten the connection distance between the input terminals PIH and PIL and the plurality of power semiconductor package elements 21, 22, 23, and 24, thereby suppressing power loss.

[0154] Furthermore, in the switching power supply module 10B, the connecting conductor 62B overlaps with the second terminals of the multiple inductor elements 31B, 32B, 33B, and 34B. This allows the switching power supply module 10B to shorten the connection distance between the power semiconductor package element 21 and the inductor element 31B, the connection distance between the power semiconductor package element 22 and the inductor element 32B, the connection distance between the power semiconductor package element 23 and the inductor element 33B, and the connection distance between the power semiconductor package element 24 and the inductor element 34B, thereby suppressing power loss.

[0155] Although the above-described first, second, and third embodiments respectively show the cases of two-phase, three-phase, and four-phase, similar effects can also be achieved in switching power supply modules of multiphase control having five or more phases by appropriately applying the configurations of the above-described switching power supply modules 10, 10A, and 10B and increasing the number of stacked circuit boards.

[0156] [Fourth Embodiment] A switching power supply module according to a fourth embodiment of the present invention will be described with reference to the drawings. Fig. 14 is an exploded perspective view of the switching power supply module according to the fourth embodiment.

[0157] The switching power supply module 10C according to the fourth embodiment differs from the switching power supply module 10 according to the first embodiment in that it includes a multi-inductor element 30C. Descriptions of the same parts of the switching power supply module 10C as those of the switching power supply module 10 will be omitted where appropriate.

[0158] The switching power supply module 10C includes a multi-inductor element 30C. The multi-inductor element 30C includes a metal conductor 311, a metal conductor 321, and a magnetic core 302.

[0159] The metal conductors 311 and 321 run parallel to each other with a predetermined gap between them. The metal conductors 311 and 321 have the same configuration as the metal conductors 311 and 321 of the inductor element 31 according to the first embodiment.

[0160] The main body of each of the metal conductors 311 and 321 is enclosed within the magnetic core 302. The side surfaces of the main body of the metal conductor 311 and the side surfaces of the main body of the metal conductor 321 are in close contact with the magnetic core 302.

[0161] With this configuration, the multi-inductor element 30C has a configuration in which the inductor L31 and the inductor L32 in the circuit of FIG. 1 are integrally formed.

[0162] The length of the multi-inductor element 30C is the same as the lengths of the inductor elements 31 and 32 according to the first embodiment. The width of the multi-inductor element 30C is approximately the same as or smaller than the width of the power semiconductor package elements 21 and 22.

[0163] With this configuration, the switching power supply module 10C can achieve the same effects as the switching power supply module 10.

[0164] Fifth Embodiment A switching power supply module according to a fifth embodiment of the present invention will be described with reference to the drawings. Fig. 15 is an exploded perspective view of the switching power supply module according to the fifth embodiment. Fig. 16 is a side view of the switching power supply module according to the fifth embodiment.

[0165] The switching power supply module 10D according to the fifth embodiment differs from the switching power supply module 10 according to the first embodiment in that the positions in the height direction of the circuit board 81 and the circuit board 82 are swapped. Descriptions of the same parts of the switching power supply module 10D as those of the switching power supply module 10 will be omitted as appropriate.

[0166] The switching power supply module 10D includes a power semiconductor package element 21, a power semiconductor package element 22, an inductor element 31D, an inductor element 32D, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a plurality of connecting conductors 60, a connecting conductor 63D, a circuit board 81D, and a circuit board 82D.

[0167] The inductor element 31D includes a metal conductor 311D and a magnetic core 312. The inductor element 31D differs from the inductor element 31 in the shape of the metal conductor 311D. The metal conductor 311D includes a main body portion 3110, a first end portion 3111, and a second end portion 3112. The first end portion 3111 and the second end portion 3112 both extend toward the bottom surface side of the magnetic core 312. The inductor element 32D includes a metal conductor 321D and a magnetic core 322, and has a configuration similar to that of the inductor element 31D.

[0168] The circuit board 81D and the circuit board 82D are arranged separated in the height direction so that a rear surface 812 of the circuit board 81D and a front surface 821 of the circuit board 82D face each other.

[0169] An inductor element 31D, an inductor element 32D, and a plurality of capacitor elements 50 are mounted on a surface 811 of the circuit board 81D.

[0170] The first terminal E3111 and the second terminal E3112 of the inductor element 31D are both joined with a conductive bonding material to the surface 811. Similarly, the first terminal E3211 and the second terminal E3212 of the inductor element 32D are both joined with a conductive bonding material to the surface 811.

[0171] A plurality of capacitor elements 50 are mounted on the rear surface 812 of the circuit board 81D.

[0172] Mounted on a surface 821 of the circuit board 82D are a power semiconductor package element 21, a power semiconductor package element 22, and a plurality of capacitor elements 40. The power semiconductor package element 21 and the power semiconductor package element 22 are mounted on the surface 821 in a stacked state.

[0173] A plurality of external connection conductors 829 are formed on the rear surface 822 of the circuit board 82D.

[0174] One ends in the height direction of the plurality of connecting conductors 60 are mounted on the front surface 821 of the circuit board 82D. The other ends in the height direction of the plurality of connecting conductors 60 are mounted on the back surface 812 of the circuit board 81D. The plurality of connecting conductors 60 overlap at least a portion of the plurality of capacitor elements 50 in a plan view.

[0175] Like the connecting conductor 60, the connecting conductor 63D is configured from a metal or an insulating substrate on which a conductor pattern is formed. One end of the connecting conductor 63D in the height direction is mounted on the front surface 821 of the circuit board 82D. The other end of the connecting conductor 63D in the height direction is mounted on the back surface 812 of the circuit board 81D. In a plan view, the connecting conductor 63D overlaps with the second terminal E3112 of the inductor element 31D and the second terminal E3212 of the inductor element 32D.

[0176] With this configuration, the switching power supply module 10D, like the switching power supply module 10, can reduce power loss and increase heat dissipation efficiency per given spatial volume.

[0177] Sixth Embodiment A switching power supply module according to a sixth embodiment of the present invention will be described with reference to the drawings. Fig. 17 is an exploded perspective view of the switching power supply module according to the sixth embodiment. Fig. 18 is a side view of the switching power supply module according to the sixth embodiment.

[0178] The switching power supply module 10E according to the sixth embodiment differs from the switching power supply module 10 according to the first embodiment in that it uses inductor elements 31E and 32E and a connecting conductor 64. Descriptions of the same parts of the switching power supply module 10E as those of the switching power supply module 10 will be omitted where appropriate.

[0179] The switching power supply module 10E includes an inductor element 31E, an inductor element 32E, and a connecting conductor 64.

[0180] The inductor element 31E includes a metal conductor 311E and a magnetic core 312. The inductor element 31E differs from the inductor element 31 in the shape of the metal conductor 311E. A first end 3111 and a second end 3112 of the metal conductor 311E both extend toward the bottom surface of the magnetic core 312. The inductor element 32E includes a metal conductor 321E and a magnetic core 322, and has a configuration similar to that of the inductor element 31E.

[0181] The first terminal E3111 and the second terminal E3112 of the inductor element 31E are both joined to the surface 811 by a conductive bonding material. Similarly, the first terminal E3211 and the second terminal E3212 of the inductor element 32E are both joined to the surface 811 by a conductive bonding material.

[0182] Like the connection conductor 60, the connection conductor 63E is made of metal or an insulating substrate on which a conductor pattern is formed. One end of the connection conductor 63E in the height direction is mounted on the front surface 811 of the circuit board 81. The other end of the connection conductor 63E in the height direction is mounted on the back surface 822 of the circuit board 82. In plan view, the connection conductor 63E is arranged at an end of the circuit boards 81, 82 opposite to the end where the multiple connection conductors 60 are arranged. That is, the connection conductor 63E is arranged in a position close to the second terminal E3112 of the inductor element 31E and the second terminal E3212 of the inductor element 32E, and is mounted on the front surface 811 of the circuit board 81.

[0183] With this configuration, the switching power supply module 10E, like the switching power supply module 10, can reduce power loss and increase heat dissipation efficiency per given spatial volume.

[0184] Seventh Embodiment A switching power supply module according to a seventh embodiment of the present invention will be described with reference to the drawings. Fig. 19 is an exploded perspective view of the switching power supply module according to the seventh embodiment.

[0185] The switching power supply module 10F according to the seventh embodiment differs from the switching power supply module 10 according to the first embodiment in that power semiconductor package elements are also arranged in the width direction of the circuit board. Descriptions of the same parts of the switching power supply module 10F as those of the switching power supply module 10 will be omitted where appropriate.

[0186] The switching power supply module 10F includes a power semiconductor package element 21, a power semiconductor package element 22, a power semiconductor package element 23, a power semiconductor package element 24, an inductor element 31, an inductor element 32, an inductor element 33, an inductor element 34, a plurality of capacitor elements 40, a plurality of capacitor elements 50, a plurality of connecting conductors 60F, a circuit board 81F, and a circuit board 82F.

[0187] The circuit of the switching power supply module 10F is a circuit that can realize four-phase multiphase control, similar to the switching power supply module 10B according to the third embodiment.

[0188] The length of the circuit board 81F in the second direction (W direction) is approximately twice that of the circuit board 81.

[0189] Inductor element 31, inductor element 32, inductor element 33, and inductor element 34 are mounted on surface 811 of circuit board 81F. Inductor element 31, inductor element 32, inductor element 33, and inductor element 34 are mounted so that the direction in which their main bodies extend is parallel to the first direction (L direction) of circuit board 81F. Inductor element 31, inductor element 32, inductor element 33, and inductor element 34 are mounted side by side in the second direction (W direction) of circuit board 81F.

[0190] The power semiconductor package element 21 and the power semiconductor package element 22 are mounted on a surface 821 of the circuit board 82F. The power semiconductor package element 21 and the power semiconductor package element 22 are mounted side by side in the second direction (W direction) of the circuit board 82F.

[0191] The power semiconductor package elements 23 and 24 are mounted on the rear surface 822 of the circuit board 82F. The power semiconductor package elements 23 and 24 are mounted side by side in the second direction (W direction) of the circuit board 82F.

[0192] In a plan view, the mounting areas of the power semiconductor package elements 21 and 22, the mounting areas of the power semiconductor package elements 23 and 24, and the mounting areas of the inductor elements 31, 32, 33, and 34 overlap.

[0193] The length of the plurality of connecting conductors 60F in the second direction (W direction) is approximately the same as the length of the circuit boards 81F and 82F in the second direction (W direction). The plurality of connecting conductors 60F electrically and physically connect the circuit boards 81F and 82F.

[0194] With this configuration, the switching power supply module 10F, like the switching power supply module 10, can reduce power loss and increase heat dissipation efficiency per given spatial volume.

[0195] <1> A switching power supply module comprising a plurality of power conversion circuits on a circuit board, wherein each of the plurality of power conversion circuits comprises an inductor element, a power semiconductor package element, and a smoothing capacitor element, wherein the inductor element comprises a metal conductor mainly made of metal and a magnetic core, the metal conductor penetrates the magnetic core, and the metal conductor and the magnetic core have a tight contact structure at the penetration portion, the circuit board comprises a first circuit board and a second circuit board, wherein the plurality of inductor elements comprising the plurality of power conversion circuits are mounted on the first circuit board, and the plurality of power semiconductor package elements comprising the plurality of power conversion circuits are mounted on the second circuit board, a width of the inductor element is smaller than a width of the power semiconductor package elements, the plurality of inductor elements are parallel to a mounting surface of the plurality of inductor elements on the first circuit board and are arranged along a width direction of the plurality of inductor elements, and the first circuit board and the second circuit board are arranged such that the mounting surface of the plurality of inductor elements on the first circuit board and the mounting surface of the plurality of power semiconductor package elements on the second circuit board are parallel, a switching power supply module, wherein the first circuit board and the second circuit board are separated from each other in a direction perpendicular to their mounting surfaces and are arranged so as to overlap in a plan view seen in the direction perpendicular to their mounting surfaces, and the first circuit board and the second circuit board are electrically connected by a connecting conductor that connects in the direction perpendicular to the mounting surfaces.

[0196] <2> The switching power supply module of <1>, wherein the number of the inductor elements is the same as the number of the power semiconductor package elements.

[0197] <3> The switching power supply module of <1> or <2>, wherein the first circuit board has a first surface on which the plurality of inductor elements are mounted, and a first back surface on which input / output terminals of the switching power supply module are arranged, and the second circuit board is disposed on the first surface side of the first circuit board.

[0198] <4> The switching power supply module of <3>, wherein the second circuit board has a second front surface and a second back surface opposite to the first front surface, a first power semiconductor package element of the plurality of power semiconductor package elements is mounted on the second front surface, and a second power semiconductor package element of the plurality of power semiconductor package elements is mounted on the second back surface, and the first power semiconductor package element, the second power semiconductor package element, and the plurality of inductor elements overlap in the plan view.

[0199] <5> The switching power supply module of <3> or <4>, wherein the metal conductor comprises: a main body portion that penetrates the magnetic core; a first end portion that does not penetrate the magnetic core and forms a first terminal of the inductor element at one end of the main body portion; and a second end portion that does not penetrate the magnetic core and forms a second terminal of the inductor element at the other end of the main body portion, wherein the inductor element is disposed so that the main body portion is parallel to the mounting surface.

[0200] <6> The switching power supply module of <5>, wherein the first end and the second end are shaped to be formed in a direction substantially perpendicular to a direction of conduction of the main body portion, the direction in which the first end extends from the main body portion is opposite to the direction in which the second end extends from the main body portion, and the first end is mounted on the first circuit board, and the second end is mounted on the second circuit board.

[0201] <7> The switching power supply module according to any one of <1> to <6>, wherein the connecting conductor is made of a column or plate mainly made of metal.

[0202] <8> The switching power supply module according to any one of <1> to <7>, wherein the connecting conductor is made of a conductor pattern formed on a glass epoxy substrate.

[0203] <9> The switching power supply module according to any one of <1> to <8>, wherein the power semiconductor package element is an element in which a power semiconductor element that performs a switching operation and a drive circuit that drives the power semiconductor element are integrated.

[0204] <10> The switching power supply module according to any one of <3> to <6>, wherein the smoothing capacitor element includes a plurality of input capacitor elements and a plurality of output capacitor elements, the plurality of output capacitor elements being mounted on the first circuit board, and the plurality of input capacitor elements being mounted on the second circuit board.

[0205] <11> The switching power supply module according to any one of <1> to <10>, wherein the planar area of ​​the first circuit board and the planar area of ​​the second circuit board are substantially the same.

[0206] <12> The switching power supply module of any one of <1> to <11>, wherein the number of the plurality of power conversion circuits, the plurality of inductor elements, and the plurality of power semiconductor package elements is three or more, the circuit board further includes a third circuit board, the plurality of inductor elements are mounted on the first circuit board, the plurality of power semiconductor package elements are mounted on the second circuit board and the third circuit board, the third circuit board is arranged such that a mounting surface of the power semiconductor package elements on the third circuit board is parallel to a mounting surface of the power semiconductor package elements on the second circuit board, the third circuit board is separated in a direction perpendicular to these mounting surfaces, and overlaps in the planar view, and the second circuit board and the third circuit board are electrically connected by a connecting conductor connecting in a direction perpendicular to the mounting surfaces.

[0207] <13> The switching power supply module according to any one of <1> to <12>, further comprising a heat sink having approximately the same area as the power semiconductor package element, the heat sink overlapping the power semiconductor package element in the plan view and thermally connecting to the power semiconductor package element.

[0208] 10, 10A, 10B, 10C, 10D, 10E, 10F: switching power supply module 21, 22, 23, 24: power semiconductor package element 30C: multi-inductor element 31, 31A, 31B, 31D, 31E, 32, 32A, 32B, 32D, 32E, 33, 33A, 33B, 34, 34B: inductor element 40, 50: capacitor element 60, 60F, 61A, 61B, 62A, 62B, 63D, 63E, 64: connecting conductor 81, 81D, 81F, 82, 82D, 82F, 83: circuit board 210, 220, 230, 240: drive circuit 302, 312, 312A, 312B, 322, 322A, 322B, 332A, 332B, 342B: magnetic core 311, 311A, 311B, 311D, 311E, 321, 321A, 321B, 321D, 321E, 331A, 331B, 341B: metal conductor 811, 821, 831: front surface 812, 822, 832: back surface 819, 819i, 819o, 829: external connecting conductor 3110: main body 3111: first end 3112: second end Ci: input capacitor Co: output capacitor E3111, E3211, E3311, E3411: first terminal E3112, E3212, E3312, E3412: Second terminal EF3121: First end face EF3122: Second end face L31, L32, L33, L34: Inductor LNg: Reference potential wiring LNi: Input side wiring LNo: Output side wiring PIH, PIL: Input terminals POH, POL: Output terminals Q21H, Q21L, Q22H, Q22L, Q23H, Q23L, Q24H, Q24L: Power semiconductor element ZLD: Load

Claims

1. A switching power supply module comprising multiple power conversion circuits on a circuit board, Each of the aforementioned power conversion circuits comprises an inductor element, a power semiconductor package element, and a smoothing capacitor element. The inductor element comprises a metal conductor mainly composed of metal and a magnetic core, the metal conductor penetrates the magnetic core, and in the penetration portion, the metal conductor and the magnetic core are in close contact. The circuit board comprises a first circuit board and a second circuit board, The plurality of inductor elements constituting the plurality of power conversion circuits are mounted on the first circuit board, The plurality of power semiconductor package elements constituting the plurality of power conversion circuits are mounted on the second circuit board, The width of the inductor element is smaller than the width of the power semiconductor package element. The plurality of inductor elements are arranged parallel to the mounting surface of the plurality of inductor elements on the first circuit board and along the width direction of the plurality of inductor elements. The first circuit board and the second circuit board are, The mounting surface of the plurality of inductor elements on the first circuit board and the mounting surface of the plurality of power semiconductor package elements on the second circuit board are parallel, These mounting surfaces are separated from each other in directions perpendicular to each other, Furthermore, in a plan view taken in a direction perpendicular to these mounting surfaces, they overlap. They are arranged, The first circuit board and the second circuit board are electrically connected by connecting conductors connected in a direction perpendicular to the mounting surface. Switching power supply module.

2. The number of inductor elements and the number of power semiconductor package elements are the same. A switching power supply module according to claim 1.

3. The first circuit board is, The first surface on which the plurality of inductor elements are mounted, The first back surface of the switching power supply module, where the input / output terminals are located, It has, The second circuit board is positioned on the first surface side of the first circuit board. A switching power supply module according to claim 1 or claim 2.

4. The second circuit board has a second surface and a second back surface facing the first surface. The first power semiconductor package element in the plurality of power semiconductor package elements is mounted on the second surface, The second power semiconductor package element in the plurality of power semiconductor package elements is mounted on the second back surface, The first power semiconductor package element, the second power semiconductor package element, and the plurality of inductor elements overlap in the plan view. The switching power supply module according to claim 3.

5. The aforementioned metal conductor is The main body portion penetrates the aforementioned magnetic core, The magnetic core does not penetrate the first end portion, and at one end of the main body portion, the first end portion forms the first terminal of the inductor element. The magnetic core is not penetrated, and the other end of the main body forms a second terminal of the inductor element, Equipped with, The inductor element is arranged such that the main body is parallel to the mounting surface. The switching power supply module according to claim 3.

6. The first end and the second end are shaped in a direction substantially perpendicular to the conductive direction of the main body, The direction in which the first end extends from the main body and the direction in which the second end extends from the main body are opposite. The first end is mounted on the first circuit board, The second end is mounted on the second circuit board. The switching power supply module according to claim 5.

7. The aforementioned connecting conductor consists of a column or plate mainly made of metal. A switching power supply module according to claim 1 or claim 2.

8. The connecting conductor consists of a conductive pattern formed on a glass epoxy substrate. A switching power supply module according to claim 1 or claim 2.

9. The aforementioned power semiconductor package element is an element in which a power semiconductor element that performs switching operations and a drive circuit that drives the power semiconductor element are integrated into one component. A switching power supply module according to claim 1 or claim 2.

10. The smoothing capacitor element comprises a plurality of input capacitor elements and a plurality of output capacitor elements. The plurality of output capacitor elements are mounted on the first circuit board. The plurality of input capacitor elements are mounted on the second circuit board. The switching power supply module according to claim 3.

11. The planar area of ​​the first circuit board and the planar area of ​​the second circuit board are approximately the same. A switching power supply module according to claim 1 or claim 2.

12. The number of the multiple power conversion circuits, the multiple inductor elements, and the multiple power semiconductor package elements is three or more. The circuit board further comprises a third circuit board, The plurality of inductor elements are mounted on the first circuit board, The plurality of power semiconductor package elements are mounted on the second circuit board and the third circuit board. The third circuit board described above is The mounting surface of the power semiconductor package element on the third circuit board is parallel to the mounting surface of the power semiconductor package element on the second circuit board, These mounting surfaces are separated in a direction perpendicular to them, Furthermore, in the state in which they overlap in the plan view, They are arranged, The second circuit board and the third circuit board are electrically connected by connecting conductors connected in a direction perpendicular to the mounting surface. A switching power supply module according to claim 1 or claim 2.

13. The power semiconductor package element is equipped with a heat sink having approximately the same area as the aforementioned power semiconductor package element, The heat sink overlaps the power semiconductor package element in the plan view and is thermally connected to the power semiconductor package element. A switching power supply module according to claim 1 or claim 2.