Method for manufacturing measurement device, and robot arm

Abstract

This method for manufacturing a measurement device, in which sensors contributing to force measurement are provided integrally, includes: forming a body part 11 of the measurement device on the basis of a first resin; and forming circuitry CB on a surface of the first resin integrally as a plating layer, the circuitry serving to output electric signals that change according to strains in the body part 11.

Description

Method for manufacturing a measuring device and a robot arm

[0001] This application claims priority to Japanese Patent Application No. 2023-189468, filed on November 6, 2023, the entire disclosure of which is incorporated herein by reference.

[0002] Conventionally, robot arms are known for various applications, such as industrial robots used in manufacturing sites, medical robots, and nursing care robots. Additionally, technologies related to end effectors, including robot hands and robot grippers, that are attached to the ends of robot arms are also known. For example, Patent Document 1 discloses a method for manufacturing a force sensor that can be attached to an end effector and has higher sensitivity than conventional force sensors.

[0003] JP 2023-19682 A

[0004] Due to the weight capacity limitations of robot arms, end effectors that can also be used as measuring devices for measuring force are required to have fewer parts, be smaller, and be lighter. In addition, waterproofing and water resistance are required for end effectors so that they can be washed to prevent the spread of infectious diseases and for other hygienic purposes. Generally, end effectors are made of metal, which makes them heavy and prone to rust when washed.

[0005] End effectors generally require sensor components to perform their functions. For example, in order for a robot arm to determine whether the end effector has grasped an object, a sensor component such as a force sensor, as in the prior art disclosed in Patent Document 1, is additionally mounted on the end effector. This makes it difficult to reduce the size and weight of the end effector.

[0006] An object of the present disclosure is to provide a method for manufacturing a measurement device and a robot arm that can contribute to force measurement with a simpler configuration.

[0007] A manufacturing method of a measuring device according to a first aspect for solving the above problem is a manufacturing method of a measuring device having an integrated sensor that contributes to measuring force, and includes a first step of forming a main body portion of the measuring device based on a first resin, and a second step of integrally forming a circuit that outputs an electrical signal that changes in response to distortion of the main body portion as a plating layer on the surface of the first resin.

[0008] A robot arm according to a second aspect includes, as an end effector, the measuring device manufactured by the above-described method for manufacturing a measuring device.

[0009] According to the present disclosure, it is possible to provide a method for manufacturing a measurement device and a robot arm that can contribute to force measurement with a simpler configuration.

[0010] 1 is an external perspective view showing an example of a robot arm according to an embodiment of the present disclosure; FIG. 2 is a block diagram showing an example of the configuration of the robot arm of FIG. 1; FIG. 3 is a first external perspective view showing an example of an end effector of the robot arm of FIG. 1; FIG. 4 is a second external perspective view showing an example of the end effector of the robot arm of FIG. 1; FIG. 5 is an enlarged cross-sectional view schematically showing an enlarged portion of a cross section taken along the arrows VI-VI of FIG. 5; and FIG. 6 is a flowchart illustrating an example of a manufacturing method for manufacturing the end effector of FIG. 1 as a measuring device.

[0011] Hereinafter, one embodiment of the present disclosure will be mainly described with reference to the accompanying drawings.

[0012] FIG. 1 is an external perspective view showing an example of a robot arm 1 according to an embodiment of the present disclosure. FIG. 2 is a block diagram showing an example of the configuration of the robot arm 1 of FIG. 1. FIG. 3 is a first external perspective view showing an example of an end effector 10 of the robot arm 1 of FIG. 1. FIG. 4 is a second external perspective view showing an example of the end effector 10 of the robot arm 1 of FIG. 1. FIG. 5 is a side view showing a portion of the configuration of the end effector 10 of FIG. 3. An example of the configuration of a robot arm 1 including an end effector 10 according to an embodiment as a measurement device will be mainly described with reference to FIGS. 1 to 5 .

[0013] As shown in Figures 1, 3, and 4, the robot arm 1 has a housing 1a that forms the main body, and an end effector 10 attached to the housing 1a at the tip of the robot arm 1. The end effector 10 corresponds to a measuring device described in the claims. The end of the end effector 10 opposite the portion for gripping an object is attached to the housing 1a, so that the end effector 10 is supported by the housing 1a. The end effector 10 is driven while supported by the housing 1a and grips the object. The end effector 10 contributes to measuring the force received as a reaction when gripping the object.

[0014] In the present disclosure, the term "object" includes a solid object that can be grasped by the end effector 10. Without being limited thereto, the object may include any other object that can be grasped by the end effector 10.

[0015] The end effector 10 is used in a robot. For example, the end effector 10 functions as a part of a robot having a robot arm 1. In this disclosure, the term "robot" includes, for example, industrial robots, nursing robots, marine robots, medical robots, and mobile objects such as vehicles and drones that move by making autonomous decisions. The term "industrial robot" includes, for example, collaborative robots that can work together with workers in the same space and other robots that work in isolation from workers. The end effector 10 is configured as a robot hand or robot gripper in such a robot.

[0016] 2 to 4, the end effector 10 has a main body 11. The main body 11 constitutes the entire outer shape of the end effector 10. The main body 11 has an attachment portion 11a that is attached to the housing 1a of the robot arm 1. The main body 11 has a pair of claws 11b that protrude from an end of the attachment portion 11a that is located on the opposite side from the housing 1a. The pair of claws 11b grip an object by, for example, shortening the distance between them to be approximately the same as the width of the object.

[0017] The claw portion 11b has a gripping portion 11b1 and a detecting portion 11b2. The gripping portion 11b1 is located at the tip of the main body portion 11 opposite the mounting portion 11a. The gripping portion 11b1 grips an object. The detecting portion 11b2 is formed on the main body portion 11 so that one end of the detecting portion 11b2 is attached to the mounting portion 11a and the other end is continuous with the gripping portion 11b1. The detecting portion 11b2 deforms in response to a force applied to the gripping portion 11b1. For example, the detecting portion 11b2 is thinner than the gripping portion 11b1 in the separation direction D1 in which the pair of claw portions 11b are separated from each other.

[0018] The end effector 10 is driven while supported by the housing 1a, and grasps an object with the pair of gripping portions 11b1 by reducing the separation distance between the pair of gripping portions 11b1 located at the tip of the end effector 10 along the separation direction D1 to be approximately the same as the width of the object. The end effector 10 contributes to measuring the force received as a reaction when grasping the object, based on the distortion of the detection portion 11b2 caused by the gripping of the object by the gripping portions 11b1.

[0019] The main body 11 contains resin. For example, the entire main body 11, including the attachment portion 11a and the claw portion 11b, is formed of resin. The detection portion 11b2, which contributes to measuring the reaction force when gripping an object, also contains resin.

[0020] As described below, in the present disclosure, the resin contained in the main body 11 includes, for example, a thermoplastic resin. The "thermoplastic resin" includes, for example, at least one selected from the group consisting of general-purpose plastics, engineering plastics, and super-engineering plastics. The thermoplastic resin is, for example, a polyarylene sulfide resin. More specifically, the thermoplastic resin includes a polyarylene sulfide resin such as a polyphenylene sulfide resin.

[0021] 2, the robot arm 1 includes an end effector 10 having a main body 11, a storage unit 20, a drive unit 30, and a control unit 40. The storage unit 20, the drive unit 30, and the control unit 40 are housed in a housing 1a of the robot arm 1.

[0022] The storage unit 20 includes, for example, a semiconductor memory, a magnetic memory, an optical memory, or any combination thereof. The storage unit 20 functions, for example, as a main storage device, an auxiliary storage device, or a cache memory. The storage unit 20 stores information used in the operation of the robot arm 1 and information obtained by the operation of the robot arm 1. For example, the storage unit 20 stores system programs, application programs, and various data acquired by any means such as communication.

[0023] The drive unit 30 includes, for example, any drive mechanism for driving the end effector 10. The drive mechanism includes, for example, a plurality of gears and a motor for rotating the gears. The drive unit 30 drives the end effector 10 in accordance with a control signal from the control unit 40. The drive unit 30 drives the claw portion 11b of the main body 11 of the end effector 10 in accordance with the control signal from the control unit 40, for example, so that the claw portion 11b grips an object.

[0024] The control unit 40 includes a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. The processor is a general-purpose processor such as a CPU or a GPU, or a dedicated processor specialized for specific processing. "CPU" is an abbreviation for Central Processing Unit. "GPU" is an abbreviation for Graphics Processing Unit. An example of the programmable circuit is an FPGA. "FPGA" is an abbreviation for Field-Programmable Gate Array. An example of the dedicated circuit is an ASIC. "ASIC" is an abbreviation for Application Specific Integrated Circuit. The control unit 40 is communicatively connected to each component of the robot arm 1, and executes various processes related to the operation of the robot arm 1 while controlling each component.

[0025] As shown in FIG. 5 , the detection unit 11b2 is formed integrally with resin and includes a circuit CB that outputs an electrical signal that changes in response to the distortion of the detection unit 11b2. The circuit CB is formed, for example, on each of the inner surfaces of the pair of claws 11b in the separation direction D1 in which the pair of claws 11b are separated from each other. The inner surface of the claw 11b is a surface located on the same side as the ventral side of the claw 11b, which is the side on which the claw 11b grips an object. The circuit CB is formed on the inner surface of the claw 11b over the entire detection unit 11b2, excluding the gripping portion 11b1. The circuit CB functions as a sensor that contributes to force measurement. The measurement device has such a sensor integrated therewith.

[0026] The circuit CB is formed, for example, by being directly drawn on the surface of the resin that forms the detection unit 11b2 of the main body 11. In the circuit CB, wiring and electrodes are formed in each region of the surface of the resin that forms the detection unit 11b2. The circuit CB is formed, for example, as a molded circuit using LDS, a type of MID. "MID" is an abbreviation for Molded Interconnect Device. "LDS" is an abbreviation for Laser Direct Structuring. The circuit CB is formed by plating by directly irradiating a laser onto the surface of the detection unit 11b2, which is a molded product.

[0027] The circuit CB has wiring W formed on the resin surface of the detection portion 11b2. The circuit CB has an input electrode E1 and an output electrode E2 formed on the resin surface of the detection portion 11b2. The input electrode E1 and the output electrode E2 are formed in parallel with each other. The wiring W of the circuit CB includes a plurality of straight lines connecting the input electrode E1 and the output electrode E2, which are formed integrally with the resin.

[0028] For example, the wiring W has a connection line W1 that extends linearly from each of the input electrode E1 and the output electrode E2 and bends at 90°. The wiring W has a gauge line W2 that connects two ends of the two connection lines W1 that are located on the opposite sides of the input electrode E1 and the output electrode E2. The gauge line W2 functions as a strain gauge. For example, the gauge line W2 is formed by repeatedly bending a straight line 180° at one end and then bending the bent line again 180° at the other end.

[0029] The width d1 of the wiring W, for example, the gauge wire W2, is not particularly limited, but is preferably 1 mm or less, more preferably 500 μm or less, more preferably 250 μm or less, more preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The lower limit of the width d1 is not particularly limited, but is, for example, preferably 10 μm or more, more preferably 20 μm or more, more preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more.

[0030] In the wiring W, the line spacing d2 between a pair of adjacent gauge lines W2 is not particularly limited, but is, for example, preferably 1 mm or less, more preferably 500 μm or less, more preferably 250 μm or less, more preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The lower limit of the spacing d2 is not particularly limited, but is, for example, preferably 10 μm or more, more preferably 20 μm or more, more preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more.

[0031] As an example, each of the width d1 and the distance d2 may be narrowed to about 50 μm.

[0032] The circuit CB formed on the surface of the detecting unit 11b2 outputs an electrical signal to the control unit 40 that changes depending on the electrical resistance of the wiring W itself. As a result, the detecting unit 11b2 contributes to the force measurement by the control unit 40 based on the wiring W itself. For example, the circuit CB includes a strain gauge. More specifically, the circuit CB functions as a strain gauge based on the configuration of the wiring W described above.

[0033] For example, when the detection unit 11b2 is distorted as the gripping unit 11b1 grips an object, the wiring W, which is formed as multiple straight lines connecting the input electrode E1 and the output electrode E2, also distorts, and the electrical resistance of the wiring W changes depending on the degree of distortion. The amount of distortion in the detection unit 11b2 and the electrical resistance value of the wiring W are correlated with each other. As a result, the voltage between the input electrode E1 and the output electrode E2 changes depending on the distortion of the detection unit 11b2. The circuit CB outputs a voltage signal corresponding to the electrical resistance of the wiring W itself, which changes depending on the distortion of the detection unit 11b2, to the control unit 40 as an example of the above-mentioned electrical signal.

[0034] For example, the control unit 40 of the robot arm 1 determines whether the pair of claws 11b have grasped an object based on an electrical signal output from the circuit CB of the main body 11. At this time, the control unit 40 measures the force applied to the claws 11b based on the electrical signal output from the circuit CB of the detection unit 11b2. For example, the control unit 40 calculates the magnitude of the force applied to the claws 11b based on the electrical signal. More specifically, the control unit 40 measures the voltage change between the input electrode E1 and the output electrode E2 based on the electrical signal, thereby measuring the magnitude of the force applied to the claws 11b of the end effector 10. The force magnitude measurement process executed by the control unit 40 of the robot arm 1 will be described.

[0035] First, the control unit 40 acquires actual measurement data, for example, during a preliminary calibration operation before actually gripping an object using the end effector 10 of the robot arm 1, and stores the data in the storage unit 20. In the present disclosure, "actual measurement data" includes, for example, data in which the voltage value of the electrical signal output from the detection unit 11b2 and the magnitude of the force applied to the gripping unit 11b1 of the claw 11b are correlated with each other. Based on such actual measurement data, the control unit 40 calculates an approximation formula or the like that indicates the relationship between the voltage value and the magnitude of the force applied to the gripping unit 11b1, and stores the calculated data in the storage unit 20.

[0036] When the control unit 40 measures the magnitude of the force received by the claws 11b and determines whether the pair of claws 11b has gripped an object, the control unit 40 calculates the magnitude of the force corresponding to the voltage value of the electrical signal output from the detection unit 11b2 by referring to the above-mentioned approximate formula based on past actual measurement data previously stored in the memory unit 20. The control unit 40 calculates the magnitude of the force received by the gripping unit 11b1 based on past actual measurement data previously acquired through calibration. When the pair of claws 11b grip an object, a force is applied to the gripping unit 11b1 as a reaction to that force. Therefore, the control unit 40 determines that the pair of claws 11b has gripped an object when, for example, the calculated magnitude of the force exceeds a predetermined threshold.

[0037] FIG. 6 is an enlarged cross-sectional view schematically showing a part of the cross section taken along the arrow line VI-VI in FIG.

[0038] The elastic modulus of the resin contained in the detecting portion 11b2 located on the claw portion 11b of the end effector 10 is not particularly limited, but is preferably, for example, 1 GPa or more and 50 GPa or less.

[0039] In the detection unit 11b2 located in the claw portion 11b of the end effector 10, the circuit CB is integrally formed as a plating layer on the surface of the resin contained in the detection unit 11b2. In Fig. 6, the gauge wire W2 of the wiring W is shown as part of the circuit CB. The configuration of the gauge wire W2 described below using Fig. 6 also applies to other components of the circuit CB, such as the input electrode E1, the output electrode E2, and the connection wire W1.

[0040] The plating layer includes a first layer W21, a second layer W22, and a third layer W23, in that order from the resin contained in the detecting portion 11b2. The first layer W21 is integrally formed with the resin contained in the detecting portion 11b2. The first layer W21 includes a first metal. For example, if the resin contained in the detecting portion 11b2 is configured by blending a metal oxide as a filler, the first metal includes a metal corresponding to the metal oxide. The first metal includes, for example, copper.

[0041] The second layer W22 is formed directly on the first layer W21. The second layer W22 contains a second metal that reduces rust of the first metal contained in the first layer W21. The second metal includes, for example, nickel. The third layer W23 is formed directly on the second layer W22. The third layer W23 contains a third metal that has the lowest electrical resistance of the plating layers. The third metal includes, for example, gold.

[0042] The total thickness of the plating layer is not particularly limited, but is preferably, for example, 1 μm to 30 μm. Of these, the thickness of the first layer W21 is not particularly limited, but is preferably, for example, 2 μm. The thickness of the second layer W22 is not particularly limited, but is preferably, for example, 2 μm. The thickness of the third layer W23 is not particularly limited, but is preferably, for example, 0.03 μm.

[0043] In the detection unit 11b2 located on the claw portion 11b of the end effector 10, a protective layer P is further formed directly on the circuit CB. The protective layer P covers the circuit CB. For example, the protective layer P is formed directly on the circuit CB in areas where the circuit CB is formed, and is formed directly on the resin contained in the detection unit 11b2 in areas where the circuit CB is not formed, filling in gaps in the circuit CB.

[0044] The protective layer P contains a resin. In the present disclosure, the resin contained in the protective layer P includes, for example, a thermosetting resin. Examples of the "thermosetting resin" include an acrylic resin and an epoxy resin. The overall thickness of the protective layer P, i.e., the height from the surface of the detection portion 11b2, is not particularly limited, but is preferably, for example, 15 μm.

[0045] Fig. 7 is a flowchart illustrating an example of a manufacturing method for manufacturing the end effector 10 of Fig. 1 as a measuring device. The flowchart shown in Fig. 7 focuses mainly on steps that are characteristic of the present disclosure among all steps in the manufacturing method of the measuring device, and shows an overview of the manufacturing method of the measuring device.

[0046] In step S101, the method for manufacturing the measuring device includes a first process of forming the main body 11 of the measuring device based on a resin (first resin).

[0047] In step S102, the manufacturing method for the measuring device includes a second step of integrally forming a circuit CB, which outputs an electrical signal that changes in response to distortion of the main body portion 11, as a plating layer on the surface of the first resin. In the second step, the circuit CB is formed as a plating layer on the surface of the detection portion 11b2 as a molded product by laser irradiation based on LDS. The second step further includes a step of forming a first layer W21 containing a first metal, a step of forming a second layer W22 containing a second metal, and a step of forming a third layer W23 containing a third metal.

[0048] In step S103, the method for manufacturing the measuring device includes a third step of forming a protective layer P that covers the plating layer based on a resin (second resin).

[0049] In one embodiment, a thermoplastic resin is preferably used for the main body 11 of the end effector 10. The thermoplastic resin is not particularly limited, but examples thereof include polyolefin-based resins such as polypropylene, polyethylene, and polybutene; polyester-based resins such as polyethylene terephthalate and polybutylene terephthalate; polyamide-based resins such as nylon-6 and nylon 6,6, or aromatic polyamide resins; thermoplastic polyimide resins; polyamideimide-based resins; polystyrene-based resins such as polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer resin, and acrylonitrile-butadiene-styrene copolymer resin; polyarylene sulfide-based resins such as polyphenylene sulfide; polyphenylene ether-based resins; polyurethane-based resins; polylactic acid; polyether ether ketone-based resins; polyetherimide-based resins; polyketone-based resins; polyarylate-based resins such as amorphous polyarylate and liquid crystalline polyarylate; and liquid crystalline polyester-based resins.

[0050] Among these, the thermoplastic resin used in one embodiment is preferably a thermoplastic polyimide resin, a polyamideimide resin, a polyarylene sulfide resin, a polyphenylene ether resin, a polyether ether ketone resin, a polyetherimide resin, a polyketone resin, a polyarylate resin, or a liquid crystalline polyester resin, which are so-called engineering plastics or super engineering plastics that are excellent in heat resistance, mechanical properties, etc., and from the viewpoints of chemical resistance, heat resistance, and mechanical properties, a polyarylene sulfide resin is more preferable, and further, among polyarylene sulfide resins (hereinafter also referred to as "PAS resin"), a polyphenylene sulfide resin (hereinafter also referred to as "PPS resin") is particularly preferable.

[0051] In one embodiment, the resin may be used alone, or a plurality of the resins may be mixed and used in the form of a polymer alloy. The resin according to one embodiment may contain a filler. The filler-containing resin may contain the filler described below and the resin described above, and may be in the form of a composition containing any of the optional additive components described below (colorant, antistatic agent, antioxidant, heat stabilizer, UV stabilizer, UV absorber, foaming agent, flame retardant, flame retardant aid, rust inhibitor, coupling agent, silane coupling agent, thermoplastic elastomer, or synthetic resin) as needed.

[0052] The polyarylene sulfide resin has a resin structure having a repeating unit in which an aromatic ring and a sulfur atom are bonded, and specifically, the polyarylene sulfide resin is a resin having a repeating unit of a structural moiety represented by the following general formula (1) and, if necessary, a trifunctional structural moiety represented by the following general formula (2):

[0053] In formula (1), R １ and R ２ each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a nitro group, an amino group, a phenyl group, a methoxy group, or an ethoxy group.

[0054] The trifunctional structural moiety represented by formula (2) is preferably in the range of 0.001 to 3 mol %, particularly preferably 0.01 to 1 mol %, based on the total number of moles including other structural moieties.

[0055] Here, the structural moiety represented by the general formula (1) is particularly R １ and R ２ is preferably a hydrogen atom from the viewpoint of the mechanical strength of the PAS resin, and in that case, examples include those bonded at the para position represented by the following formula (3) and those bonded at the meta position represented by the following formula (4).

[0056] Among these, a structure in which the bond between the sulfur atom and the aromatic ring in the repeating unit is bonded at the para position represented by the general formula (3) is particularly preferred in terms of heat resistance and crystallinity of the PAS resin.

[0057] The PAS resin may contain not only the structural moieties represented by the general formula (1) or (2) but also the structural moieties represented by the following structural formulae (5) to (8) in an amount of 30 mol % or less of the total of the structural moieties represented by the general formula (1) and the general formula (2).

[0058] In particular, in one embodiment, the structural moieties represented by the general formulae (5) to (8) are preferably 10 mol % or less in terms of the heat resistance and mechanical strength of the PAS resin. When the structural moieties represented by the general formulae (5) to (8) are contained in the PAS resin, the bonding mode thereof may be either a random copolymer or a block copolymer.

[0059] The PAS resin may have naphthyl sulfide bonds or the like in its molecular structure, but the amount is preferably 3 mol % or less, and particularly preferably 1 mol % or less, based on the total number of moles including other structural moieties.

[0060] The physical properties of the PAS resin are not particularly limited as long as they do not impair the effects of one embodiment, but are as follows.

[0061] (Melt Viscosity) The melt viscosity of the PAS resin is not particularly limited, but in order to obtain a good balance between fluidity and mechanical strength, the melt viscosity (V6) measured at 300°C is preferably in the range of 2 Pa s or more, preferably in the range of 1000 Pa s or less, more preferably in the range of 500 Pa s or less, and even more preferably in the range of 200 Pa s or less. The melt viscosity (V6) is measured using a flow tester, CFT-500D, manufactured by Shimadzu Corporation, at 300°C under a load of 1.96 × 10 ６ The melt viscosity is measured after holding the sample at a temperature of 10 Pa and L / D=10 (mm) / 1 (mm) for 6 minutes.

[0062] (Non-Newtonian Index) The non-Newtonian index of the PAS resin is not particularly limited, but is preferably in the range of 0.90 or more and 2.00 or less. When a linear polyarylene sulfide resin is used, the non-Newtonian index is preferably in the range of 0.90 or more, more preferably 0.95 or more, and preferably 1.50 or less, more preferably 1.20 or less. Such polyarylene sulfide resins have excellent mechanical properties, fluidity, and abrasion resistance. However, in one embodiment, the non-Newtonian index (N value) is a value calculated using the following formula after measuring the shear rate (SR) and shear stress (SS) using a capillograph under conditions of a melting point of +20°C and an orifice length (L) to orifice diameter (D) ratio of L / D = 40. The closer the non-Newtonian index (N value) is to 1, the more linear the structure, and the higher the non-Newtonian index (N value), the more branched the structure.

[0063] where SR is the shear rate (sec －１ ) SS is shear stress (dyne / cm ２ ) where K represents a constant.

[0064] In one embodiment, the resin used for the main body 11 of the end effector 10 contains a metal oxide containing at least one of copper and chromium for the purpose of forming a molded circuit using LDS. The metal oxide generates heat when irradiated with a laser, melting the resin and roughening the surface of the molded product, and is activated by laser irradiation to selectively form a plating layer. By using at least one of copper and chromium as the first metal contained in the first layer W21, as with the metal oxide, the adhesion at the interface between the first layer W21 and the resin is improved.

[0065] The metal oxide contains at least one of copper and chromium, and may further contain other metals such as iron, aluminum, gallium, boron, molybdenum, tungsten, and selenium.

[0066] Specific examples of the metal oxide include, but are not limited to, CuFe ０．５ B ０．５ O ２．５ , CuAl ０．５ B ０．５ O ２．５ , CuGa ０．５ B ０．５ O ２．５ , CuB ２ O ４ , CuB ０．７ O ２ , CuMo ０．７ O ３ , CuMo ０．５ O ２．５ , CuMoO ４ , CuWO ４ , CuSeO ４ , CuCr ２ O ４ Among these, the metal oxide is CuCr ２ O ４ , CuFe ０．５ B ０．５ O ２．５ , CuAl ０．５ B ０．５ O ２．５ Preferably, CuCr ２ O ４ , CuFe ０．５ B０．５ O ２．５ These metal oxides may be used alone or in combination of two or more.

[0067] The average particle size of the metal oxide is preferably 0.01 μm or more, more preferably 0.05 μm or more, and preferably 50 μm or less, more preferably 30 μm or less. An average particle size of 0.01 μm or more is preferable because efficient and stable production is possible. On the other hand, an average particle size of 50 μm or less is preferable because material strength can be maintained. In the present disclosure, the "average particle size of the metal oxide" refers to the number average particle size, and a value measured by electron microscopy is adopted. Specifically, the particle sizes of 100 arbitrarily selected metal oxide particles in one field of view of an electron microscope are measured, and the average value is calculated.

[0068] The Mohs hardness of the metal oxide preferably ranges from 4.0 or more to preferably 6.5 or less, more preferably 6.0 or less.

[0069] The amount of the metal oxide is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and even more preferably 25 parts by mass or more, and preferably 90 parts by mass or less, per 100 parts by mass of the PAS resin. When the amount of the metal oxide is 15 parts by mass or more, per 100 parts by mass of the PAS resin, it is preferable from the viewpoints that the surface roughening and activation of the metal oxide by laser irradiation of the obtained molded article can be highly occurred, and that plating properties are excellent. On the other hand, when the amount of the metal oxide is 90 parts by mass or less, it is preferable because the material strength can be maintained.

[0070] As other fillers, known and commonly used materials can be used as long as they do not impair the effects of one embodiment, and examples include fillers of various shapes, such as fibrous ones and non-fibrous ones such as granular and plate-shaped ones. Specifically, fibrous fillers such as glass fiber, carbon fiber, silane glass fiber, ceramic fiber, aramid fiber, metal fiber, potassium titanate, silicon carbide, calcium silicate, wollastonite, and natural fibers can be used, and non-fibrous fillers such as glass beads, glass flakes, barium sulfate, clay, pyrophyllite, bentonite, sericite, mica, talc, kerolite, pimelite, pyrophyllite, hydrotalcite, kaolinite, attapulgite, ferrite, calcium silicate, calcium carbonate, glass beads, zeolite, milled fiber, and calcium sulfate can also be used.

[0071] In one embodiment, the content of the filler is not particularly limited as long as it does not impair the effects of the embodiment. The amount of filler to be blended is, for example, preferably 1 part by mass or more, more preferably 10 parts by mass or more, and preferably 600 parts by mass or less, more preferably 200 parts by mass or less, per 100 parts by mass of the resin. Within this range, the resin exhibits good mechanical strength and moldability, which is preferable.

[0072] In one embodiment, a silane coupling agent may be blended as an optional component into the resin used in the main body 11 of the end effector 10. The silane coupling agent is not particularly limited as long as it does not impair the effects of the embodiment, but preferred examples include silane coupling agents having a functional group that reacts with a carboxy group, such as an epoxy group, an isocyanato group, an amino group, or a hydroxyl group. Examples of such silane coupling agents include epoxy group-containing alkoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; isocyanato group-containing alkoxysilane compounds such as γ-isocyanatopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, and γ-isocyanatopropyltrichlorosilane; amino group-containing alkoxysilane compounds such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane; and hydroxyl group-containing alkoxysilane compounds such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. In one embodiment, a silane coupling agent is not an essential component, but when used, its amount is not particularly limited as long as it does not impair the effects of the embodiment, and is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, to preferably 10 parts by mass or less, more preferably 5 parts by mass or less, relative to 100 parts by mass of the resin. In this range, the resin has good corona resistance and moldability, particularly releasability, and the molded article exhibits excellent adhesion to the epoxy resin while also improving mechanical strength, which is preferable.

[0073] In one embodiment, the resin used for the main body 11 of the end effector 10 may optionally contain a thermoplastic elastomer. Examples of thermoplastic elastomers include polyolefin elastomers, fluorine elastomers, and silicone elastomers, with polyolefin elastomers being preferred. When these elastomers are added, their amount is not particularly limited as long as it does not impair the effects of the embodiment. However, it is preferably in the range of 0.01 parts by mass or more, more preferably 0.1 parts by mass or more, to 10 parts by mass or less, more preferably 5 parts by mass or less, per 100 parts by mass of resin (A). This range is preferred because it improves the impact resistance of the resulting resin.

[0074] Examples of the polyolefin elastomer include a homopolymer of an α-olefin, a copolymer of two or more α-olefins, and a copolymer of one or more α-olefins with a vinyl polymerizable compound having a functional group. Examples of the α-olefin include α-olefins having 2 or more to 8 carbon atoms, such as ethylene, propylene, and 1-butene. Examples of the functional group include a carboxy group, an acid anhydride group (—C(═O)OC(═O)—), an epoxy group, an amino group, a hydroxyl group, a mercapto group, an isocyanate group, and an oxazoline group. Examples of the vinyl polymerizable compound having the functional group include one or more of vinyl acetate; α,β-unsaturated carboxylic acids such as (meth)acrylic acid; alkyl esters of α,β-unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, and butyl acrylate; metal salts of α,β-unsaturated carboxylic acids such as ionomers (metals include alkali metals such as sodium, alkaline earth metals such as calcium, and zinc); glycidyl esters of α,β-unsaturated carboxylic acids such as glycidyl methacrylate; α,β-unsaturated dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; and derivatives of the above α,β-unsaturated dicarboxylic acids (monoesters, diesters, and acid anhydrides). The above thermoplastic elastomers may be used alone or in combination of two or more.

[0075] Furthermore, in one embodiment, the resin used for the main body 11 of the end effector 10 may further contain, in addition to the above components, synthetic resins such as polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyarylene resin, polyethylene resin, polypropylene resin, polyethylene tetrafluoroethylene resin, polyethylene difluoroethylene resin, polystyrene resin, ABS resin, phenolic resin, urethane resin, and liquid crystal polymer (hereinafter simply referred to as synthetic resin) as optional components depending on the application. Although the above synthetic resins are not essential components in one embodiment, when they are included, the proportion of the synthetic resin is not particularly limited as long as it does not impair the effects of the embodiment. Furthermore, since the proportion varies depending on the respective purposes and cannot be generally defined, the proportion of the synthetic resin included in the resin according to one embodiment can be, for example, in the range of 5 parts by mass or more and 15 parts by mass or less per 100 parts by mass of the resin. In other words, the ratio of resin (A) to the total of resin (A) and synthetic resin is preferably in the range of (100 / 115) or more, more preferably (100 / 105) or more, on a mass basis.

[0076] In one embodiment, the resin used for the main body 11 of the end effector 10 may optionally contain known and commonly used additives, such as colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant assistants, rust inhibitors, and coupling agents, as needed. These additives are not essential components, and may be used in an amount, for example, preferably 0.01 parts by mass or more and preferably 1,000 parts by mass or less per 100 parts by mass of the resin, adjusted appropriately depending on the purpose and application so as not to impair the effects of the embodiment.

[0077] A method for manufacturing the resin used for the main body 11 of the end effector 10 in one embodiment will be described in detail below.

[0078] In one embodiment, the resin used in the main body 11 of the end effector 10 is a blend of the essential components and, as necessary, other optional components. The method for producing the resin used in the main body 11 of the end effector 10 in one embodiment is not particularly limited, but examples include a method of blending the essential components and, as necessary, optional components, and melt-kneading them, more specifically, a method of uniformly dry-mixing them in a tumbler or Henschel mixer as necessary, and then feeding the mixture into a twin-screw extruder and melt-kneading them.

[0079] The melt kneading can be carried out by heating the resin to a temperature range in which the resin temperature is equal to or higher than the melting point of the resin, preferably equal to or higher than the melting point + 10°C, more preferably equal to or higher than the melting point + 10°C, even more preferably equal to or higher than the melting point + 20°C, to a temperature range in which the resin temperature is equal to or higher than the melting point + 100°C, more preferably equal to or lower than the melting point + 50°C.

[0080] From the viewpoints of dispersibility and productivity, the melt kneader is preferably a twin-screw kneading extruder. For example, it is preferable to melt knead while appropriately adjusting the resin component discharge rate in the range of 5 to 500 (kg / hr) and the screw rotation speed in the range of 50 to 500 (rpm). It is even more preferable to melt knead under conditions where the ratio (discharge rate / screw rotation speed) is in the range of 0.02 to 5 (kg / hr / rpm). The components may be added and mixed simultaneously or in portions into the melt kneader. For example, when adding additives among the components, it is preferable from the viewpoint of dispersibility to feed them into the twin-screw kneading extruder through a side feeder. The position of the side feeder is preferably such that the ratio of the distance from the extruder's resin input section (top feeder) to the side feeder to the total screw length of the twin-screw kneading extruder is 0.1 or more, more preferably 0.3 or more. This ratio is preferably 0.9 or less, more preferably 0.7 or less.

[0081] The resin according to one embodiment obtained by melt-kneading in this manner is a molten mixture containing the above-mentioned essential components, optional components added as needed, and components derived therefrom. After the melt-kneading, it is preferable to extrude the molten resin into a strand shape using a known method, for example, and then process it into a form such as pellets, chips, granules, or powder, followed by pre-drying at a temperature in the range of 100 to 150°C as needed.

[0082] The molded article of one embodiment is formed by molding a resin. A method for producing the molded article of one embodiment includes a step of melt-molding the resin. The method is described in detail below.

[0083] In one embodiment, the resin used for the main body 11 of the end effector 10 is injection molded. The molding conditions are not particularly limited, and molding can be performed using a typical method. For example, the resin is melted in an injection molding machine at a temperature range above the melting point of the resin, preferably above the melting point +10°C, more preferably above the melting point +10°C to above the melting point +100°C, and even more preferably above the melting point +20°C to above the melting point +50°C. The resin is then injected into a mold through a resin outlet and molded. The mold temperature can also be set within a known temperature range, for example, from room temperature (23°C) to 300°C, preferably 120°C to 180°C.

[0084] The end effector 10 as a measuring device obtained by the manufacturing method according to the embodiment described above can contribute to force measurement with a simpler configuration. The end effector 10 is manufactured by a second process in which a circuit CB, which outputs an electrical signal that changes in response to strain in the main body 11, is integrally formed as a plating layer on the surface of the resin. This eliminates the need for additional sensor components, such as strain gauges, to measure force, as in conventional techniques. For example, in the case of a strain gauge-type force sensor as described in Patent Document 1, the force sensor exists as a separate component and must be separately attached to the target device. Therefore, additional space must be provided in the target device to accommodate the force sensor as a separate component, or the weight of the target device increases.

[0085] On the other hand, the end effector 10 according to one embodiment can omit the arrangement of lead wires corresponding to strain gauges. The end effector 10 does not require the arrangement of a separate sheet or film for sensor components, a substrate for forming an electrical circuit, or the like. The end effector 10 does not require the provision of separate joints or bonding portions for sheets, films, substrates, or the like. The end effector 10 can contribute to force measurement with the above-described simpler configuration.

[0086] The end effector 10 can be made smaller and lighter, and can satisfy the weight capacity limit of the robot arm 1. The end effector 10 also allows for greater freedom in its shape design. In addition, the end effector 10 has improved waterproofing and water resistance because the main body 11 contains resin, making it possible to wash the end effector 10 to prevent the spread of infectious diseases and for other hygienic purposes. Unlike conventional metal end effectors, the end effector 10 is lighter and less prone to rust when washed.

[0087] 7 , the manufacturing process for the end effector 10 can be shortened. Therefore, the end effector 10 can be delivered as a product in a short delivery time, and the costs from manufacturing to delivery can be reduced. Meanwhile, in the case of a strain gauge-type force sensor such as that described in Patent Document 1, the manufacturing process for the circuit pattern is extensive, including coating → resist application → pre-baking → exposure → development and rinsing → post-baking → etching → resist removal.

[0088] The end effector 10 is manufactured based on the third process of forming the protective layer P, which covers the plating layer, based on the second resin, thereby protecting the circuit CB as the plating layer. For example, the protective layer P in the end effector 10 can reduce defects such as dirt, scratches, and breakage of the circuit CB.

[0089] The circuit CB has wiring W formed on the surface of the resin and outputs an electrical signal that changes depending on the electrical resistance of the wiring W itself. As a result, the end effector 10 is an integrated molded product in which the circuit CB is directly drawn on the end effector 10 and contributes to force measurement. Because the drawn circuit CB itself serves as a means for transmitting electrical signals, the end effector 10 does not require additional wiring such as a harness or a circuit board. The end effector 10 does not require a shape or space to accommodate a wired harness or a circuit board, thereby avoiding a complex shape and simplifying its configuration.

[0090] The end effector 10 tends to become electrically charged due to the resin contained in the main body 11, but even in such cases, static electricity can be easily removed by the plated wiring W in the metal circuit CB formed on the surface. The end effector 10 can effectively remove static electricity due to the path shape of the wiring W drawn directly on its surface.

[0091] By setting the line width d1 of the wiring W to 10 μm or more and 1 mm or less, the end effector 10 can form an optimal circuit pattern depending on the bendability of the detection portion 11b2, which varies depending on the thickness and material of the claw portion 11b. For example, if the resin of the detection portion 11b2 has a high elastic modulus and the claw portion 11b is formed as a hard claw portion 11b, it is desirable to narrow the width d1 so that the electrical resistance of the wiring W itself can more easily change even in response to a small strain in the detection portion 11b2. Conversely, if the resin of the detection portion 11b2 has a low elastic modulus and the claw portion 11b is formed as a soft claw portion 11b, a larger width d1 is acceptable so that the electrical resistance of the wiring W itself can appropriately change in response to a large strain in the detection portion 11b2. As described above, by variably setting the value of the line width d1 of the wiring W, the end effector 10 can cause the detection portion 11b2 to function as a strain gauge with appropriate sensitivity depending on the elastic modulus of the resin of the claw portion 11b.

[0092] By setting the spacing d2 between the lines of the wiring W to 10 μm or more and 1 mm or less, the end effector 10 can form an optimal circuit pattern depending on the bendability of the detection portion 11b2, which varies depending on the thickness and material of the claw portion 11b. For example, if the resin of the detection portion 11b2 has a high elastic modulus and the claw portion 11b is formed as a hard claw portion 11b, it is desirable to narrow the spacing d2 so that even a small strain in the detection portion 11b2 can more easily cause a change in the electrical resistance of the wiring W itself. Conversely, if the resin of the detection portion 11b2 has a low elastic modulus and the claw portion 11b is formed as a soft claw portion 11b, a larger spacing d2 is acceptable so that a large strain in the detection portion 11b2 can appropriately cause a change in the electrical resistance of the wiring W itself. As described above, by variably setting the spacing d2 between the lines of the wiring W, the end effector 10 can cause the detection portion 11b2 to function as a strain gauge with appropriate sensitivity depending on the elastic modulus of the resin of the claw portion 11b.

[0093] By narrowing the width d1 and the spacing d2 of the end effector 10 to approximately 50 μm, the electrical resistance of the wiring W itself can be more easily changed even in response to a small strain in the detection portion 11b2. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is small or the elastic modulus of the resin of the detection portion 11b2 is high. The end effector 10 can cause the detection portion 11b2 to function as a more sensitive strain gauge.

[0094] The plating layer is formed integrally with the first resin and includes the first layer W21 containing the first metal, improving the adhesion at the interface between the first resin, which may be formed, for example, by blending a metal oxide containing the same metal as the first metal, and the first layer W21. Therefore, the end effector 10 can stably form a plating layer on the resin surface of the detection unit 11b2. The end effector 10 has a second layer W22 containing the second metal formed directly on the first layer W21, thereby reducing rust on the first metal. The end effector 10 has a third layer W23 containing the third metal, which has the lowest electrical resistance, formed directly on the second layer W22, thereby reducing the electrical resistance experienced by electrical signals transmitted through the circuit CB.

[0095] By setting the thickness of the plating layer to 1 μm or more and 30 μm or less, it is possible to more easily cause a change in the electrical resistance of the wiring W itself in response to even a small strain in the detection portion 11b2. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is small or the elastic modulus of the resin of the detection portion 11b2 is high. The end effector 10 can cause the detection portion 11b2 to function as a more sensitive strain gauge.

[0096] Since the circuit CB includes a strain gauge, the end effector 10 can output a voltage signal corresponding to the force applied to the gripping portion 11b1 to the control unit 40. This allows the end effector 10 to contribute to the force magnitude measurement process performed by the control unit 40. The control unit 40 can accurately calculate the magnitude of the force applied to the gripping portion 11b1 based on the voltage signal obtained from the end effector 10.

[0097] The resin includes a thermoplastic resin, and the thermoplastic resin is a polyarylene sulfide resin, which allows the end effector 10 to have improved waterproof and water resistance. In addition, the excellent chemical resistance and heat resistance of the polyarylene sulfide resin allows the end effector 10 to have improved chemical resistance and heat resistance. This allows the end effector 10 to be used in chemicals and high-temperature materials. For example, the end effector 10 can also grip objects that require chemical resistance.

[0098] The resin is formed by blending a metal oxide containing at least one of copper and chromium, which facilitates the formation of molded circuits using LDS in the end effector 10. The metal oxide containing at least one of copper and chromium generates heat when irradiated with a laser, melting the resin and roughening its surface, and is activated by laser irradiation to selectively form a plating layer.

[0099] In the end effector 10, the elastic modulus of the first resin is 1 GPa or more and 50 GPa or less, so that the bendability of the claw portion 11b including the detection portion 11b2 can be variably set within this numerical range. Therefore, the end effector 10 can realize an optimal bendability for the claw portion 11b according to the circuit pattern of the strain gauge in the detection portion 11b2. In the end effector 10, the elastic modulus of the first resin of the claw portion 11b can be optimized so that the detection portion 11b2 contributes to force measurement.

[0100] The control unit 40 of the robot arm 1 determines whether or not an object has been grasped based on the electrical signal output from the circuit CB of the main body 11, thereby enabling the robot arm 1 to perform operations such as moving the object. Once the robot arm 1 recognizes that it has grasped the object, it can also move the grasped object from one location to another.

[0101] As shown in FIG. 3, the detecting portion 11b2 is thinner than the gripping portion 11b1 in the claw portion 11b. This allows the end effector 10 to make the gripping portion 11b1, which contacts the object, relatively thick to form a sturdy gripping portion 11b1, while narrowing the width of the detecting portion 11b2, including the strain gauge portion in the circuit CB, to make it more susceptible to deformation. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is small or the elastic modulus of the resin of the detecting portion 11b2 is high. The end effector 10 allows the detecting portion 11b2 to function as a more sensitive strain gauge.

[0102] 5, the end effector 10 can more easily cause the electrical resistance of the wiring W itself to change in response to strain on the detection unit 11b2. Therefore, the end effector 10 can contribute to force measurement even when the magnitude of the force is small or when the resin of the detection unit 11b2 has a high elastic modulus. The end effector 10 can cause the detection unit 11b2 to function as a more sensitive strain gauge.

[0103] It will be apparent to those skilled in the art that the present disclosure may be embodied in other specific forms other than the above-described embodiments without departing from the spirit or essential characteristics thereof. Therefore, the foregoing description is illustrative and not limiting. The scope of the disclosure is defined not by the foregoing description but by the appended claims. All modifications within the range of equivalents of any modifications are intended to be embraced therein.

[0104] For example, the shape, pattern, size, arrangement, orientation, type, and number of each of the above-described components are not limited to those shown in the above description and drawings. The shape, pattern, size, arrangement, orientation, type, and number of each component may be configured arbitrarily as long as the function can be realized. The components of the end effector 10 and robot arm 1 shown in the drawings are functional concepts, and the specific form of each component is not limited to those shown in the drawings.

[0105] For example, the functions included in each step in the manufacturing method can be rearranged so as not to cause logical contradictions, and multiple steps can be combined into one or divided.

[0106] In the above embodiment, the measurement device is described as including the end effector 10, but is not limited to this. The measurement device may also include any other device. For example, the measurement device may include other devices used in the joint portion of the robot arm 1 and any other part of a robot having the robot arm 1, or may include devices such as actuators. The measurement device is not limited to devices for robots such as the end effector 10 used in the robot arm 1, but may also include devices used in precision machinery and devices attached to the tip of a viscometer in a stirring device. The measurement device may also include all devices that require a sensor, such as a strain gauge, to be integrally formed.

[0107] In the above embodiment, the method for manufacturing a measuring device is described as including a third step of forming a protective layer P that covers the plating layer based on the second resin, but this is not limited to this. The method for manufacturing a measuring device does not have to include such a third step. In this case, the protective layer P does not have to be formed directly on the circuit CB in the end effector 10. The circuit CB may be exposed without being covered by the protective layer P.

[0108] In the above embodiment, the circuit CB has wiring W formed on the surface of the resin, and outputs an electrical signal that changes depending on the electrical resistance of the wiring W itself. However, the present invention is not limited to this. The circuit CB may have a substrate that is integrally molded with the resin of the main body 11 and wiring formed on the substrate, and output an electrical signal that changes depending on the electrical resistance of the wiring itself.

[0109] The circuit CB may be configured based on a substrate that is integrally molded with resin by, for example, insert molding. In the circuit CB, wiring and electrodes may be formed on the substrate. The circuit CB may be configured as a molded circuit using, for example, an IME, a type of MID. "IME" is an abbreviation for In-Mold Electronics. The circuit CB may be formed by inserting a flexible substrate or the like during injection molding. In this way, the end effector 10 becomes an integrated molded product that contributes to force measurement by integrally molding the substrate with resin.

[0110] In the above embodiment, the circuit CB contributes to the force measurement based on the wiring W itself, but this is not limiting. The circuit CB may include a sensor component that contributes to the force measurement and is mounted on the circuit CB by soldering or the like, instead of or in addition to the wiring W that contributes to the force measurement.

[0111] In addition, the circuit CB may have a control element mounted on the circuit CB by soldering or the like to perform processing necessary to realize force measurement. In the present disclosure, the "control element" may include, for example, a microcontroller, a processor, a programmable circuit, a dedicated circuit, or any combination thereof. This allows the end effector 10 to perform the various processes described above that are performed by the control unit 40 of the robot arm 1. The end effector 10 can also perform determination processing, learning processing, and any other processing by itself.

[0112] In the above embodiment, the line width d1 of the wiring W is described as being 10 μm or more and 1 mm or less, but is not limited thereto. The line width d1 of the wiring W does not have to be included in such a numerical range.

[0113] In the above embodiment, the spacing d2 between the lines of the wiring W is described as being 10 μm or more and 1 mm or less, but is not limited thereto. The spacing d2 between the lines of the wiring W does not have to be within this numerical range.

[0114] In the above embodiment, the plating layer is described as including a first layer W21, a second layer W22, and a third layer W23, in that order, but is not limited to this. The plating layer is not limited to a three-layer structure, and may include at least one layer. The plating layer is described as containing copper, nickel, and gold as the first metal, the second metal, and the third metal, respectively, but is not limited to this. The plating layer may also contain a nickel alloy. In the present disclosure, "nickel alloy" includes nickel-copper alloy, nickel-gold alloy, nickel-chromium alloy, etc. This improves the properties of the plating layer, such as corrosion resistance, thermal conductivity, and oxidation resistance.

[0115] In the above embodiment, the thickness of the plating layer is described as being 1 μm or more and 30 μm or less, but is not limited thereto. The thickness of the plating layer does not have to be within this numerical range.

[0116] In the above embodiment, the circuit CB is described as including a strain gauge, but is not limited to this. The circuit CB may include any other components that can contribute to the force measurement of the end effector 10.

[0117] In the above embodiment, the elastic modulus of the first resin is described as being equal to or greater than 1 GPa and equal to or less than 50 GPa, but is not limited thereto. The elastic modulus of the first resin does not have to be within such a numerical range.

[0118] In the above embodiment, the first resin is described as being composed of a metal oxide containing at least one of copper and chromium, but this is not limited thereto. The first resin does not have to be composed of such a metal oxide. Even if the first resin does not contain a metal oxide, the formation of a plating layer by LDS is possible due to the anchor effect. The plating catalyst flows into holes formed by melting the resin with laser irradiation and roughening the surface of the molded product, physically integrating the plating with the first resin.

[0119] In the above embodiment, the control unit 40 of the robot arm 1 determines whether or not an object has been grasped based on the electrical signal output from the circuit CB of the main body 11. However, the present invention is not limited to this. The control unit 40 does not have to perform such a determination process.

[0120] In the above embodiment, the end effector 10 contributes to force measurement, and the control unit 40 of the robot arm 1 calculates the magnitude of the force applied to the claw 11b based on the electrical signal. However, this is not limited to this. For example, the end effector 10 may contribute to measuring not only the magnitude of the force but also the direction of the force by appropriately arranging multiple strain gauges. For example, the end effector 10 may contribute to measuring six axial directions, i.e., three axial directions of the X-axis, Y-axis, and Z-axis, as well as the rotational directions around each axis. The end effector 10 may have a force sensor integrated into the detection unit 11b2.

[0121] In the above embodiment, the detecting portion 11b2 is thinner than the gripping portion 11b1, but this is not limiting. The detecting portion 11b2 may have the same width as the gripping portion 11b1 or may be thicker than the gripping portion 11b1, as long as the detecting portion 11b2 can contribute to force measurement by the end effector 10.

[0122] In the above embodiment, the entire main body 11 is described as being made of resin, but this is not limiting. At least the portion of the main body 11 where the circuit CB is formed needs to be made of resin, and other parts of the main body 11 may be made of any material other than resin.

[0123] In the above embodiment, the end effector 10 has been described as having only one pair of claws 11b on the main body 11. However, the end effector 10 is not limited to this. The end effector 10 may have three or more claws 11b, or may have only one claw.

[0124] In the above embodiment, the control unit 40 of the robot arm 1 measures the magnitude of the force based on past actual measurement data acquired in advance through a calibration operation. However, this is not limited to this. The control unit 40 may calculate the magnitude of the force without using such past actual measurement data. For example, if the control unit 40 can refer to information such as a theoretical formula for calculating the magnitude of the force, which includes parameters such as the voltage value of the electrical signal output from the circuit CB of the detection unit 11b2, the control unit 40 may calculate the magnitude of the force based on the theoretical formula.

[0125] Some embodiments of the present disclosure are exemplified below. However, it should be noted that the embodiments of the present disclosure are not limited to these. [Appendix 1] A method for manufacturing a measuring device having an integrated sensor that contributes to force measurement, comprising: a first step of forming a main body of the measuring device from a first resin; and a second step of integrally forming a circuit that outputs an electrical signal that changes in response to distortion of the main body on the surface of the first resin as a plating layer. [Appendix 2] A method for manufacturing a measuring device as described in Appendix 1, further comprising a third step of forming a protective layer that covers the plating layer from a second resin. [Appendix 3] A method for manufacturing a measuring device as described in Appendix 1 or 2, wherein the circuit has wiring formed on the surface of the first resin and outputs the electrical signal that changes in response to the electrical resistance of the wiring itself. [Appendix 4] A method for manufacturing a measuring device as described in Appendix 3, wherein the line width of the wiring is 10 μm or more and 1 mm or less. [Appendix 5] The method for manufacturing a measuring device according to Appendices 3 or 4, wherein the spacing between the wiring lines is 10 μm or more and 1 mm or less. [Appendix 6] The method for manufacturing a measuring device according to any one of Appendices 1 to 5, wherein the plating layer is formed integrally with the first resin and includes, in that order: a first layer containing a first metal; a second layer containing a second metal that reduces rust of the first metal; and a third layer containing a third metal that has the lowest electrical resistance. [Appendix 7] The method for manufacturing a measuring device according to any one of Appendices 1 to 6, wherein the plating layer contains a nickel alloy. [Appendix 8] The method for manufacturing a measuring device according to any one of Appendices 1 to 7, wherein the plating layer has a thickness of 1 μm or more and 30 μm or less. [Appendix 9] The method for manufacturing a measuring device according to any one of Appendices 1 to 8, wherein the circuit includes a strain gauge. [Supplementary Note 10] The method for manufacturing a measuring device according to any one of Supplementary Notes 1 to 9, wherein the first resin includes a thermoplastic resin.[Appendix 11] A method for manufacturing a measuring device according to Appendix 10, wherein the thermoplastic resin includes at least one selected from the group consisting of general-purpose plastics, engineering plastics, and super engineering plastics. [Appendix 12] A method for manufacturing a measuring device according to Appendix 11, wherein the thermoplastic resin is a polyarylene sulfide resin. [Appendix 13] A method for manufacturing a measuring device according to any one of Appendixes 1 to 12, wherein the modulus of elasticity of the first resin is 1 GPa or more and 50 GPa or less. [Appendix 14] A method for manufacturing a measuring device according to any one of Appendixes 1 to 13, wherein the first resin is formed by blending a metal oxide containing at least one of copper and chromium. [Appendix 15] A robot arm comprising, as an end effector, the measuring device manufactured by the method for manufacturing a measuring device according to any one of Appendixes 1 to 14. [Supplementary Note 16] The robot arm according to Supplementary Note 15, comprising a control unit that determines whether an object has been gripped based on the electrical signal output from the circuit of the main body unit. [Supplementary Note 17] The robot arm according to Supplementary Note 15 or 16, wherein the main body unit of the measuring device comprises: a gripping unit that grips an object; and a detection unit that deforms in response to a force applied to the gripping unit and has the circuit, and the detection unit is thinner than the gripping unit.

[0126] REFERENCE SIGNS LIST 1 robot arm 1a housing 10 end effector (measuring device) 11 main body 11a attachment portion 11b claw portion 11b1 gripping portion 11b2 detection portion 20 memory portion 30 driving portion 40 control portion CB circuit D1 separation direction E1 input electrode E2 output electrode P protective layer W wiring W1 connection line W2 gauge line d1 width d2 spacing

Claims

1. 1. A method for manufacturing a measuring device having an integral sensor that contributes to force measurement, comprising: a first step of forming a main body of the measuring device based on a first resin; a second step of integrally forming a circuit for outputting an electrical signal that changes in response to distortion of the main body portion as a plating layer on the surface of the first resin; Including, The first resin includes a thermoplastic resin. A method for manufacturing a measuring device.

2. A method for manufacturing the measuring device according to claim 1, comprising: The method further includes a third step of forming a protective layer covering the plating layer based on a second resin. A method for manufacturing a measuring device.

3. A method for manufacturing the measuring device according to claim 1 or 2, comprising: the circuit has wiring formed on the surface of the first resin, and outputs the electrical signal that changes depending on the electrical resistance of the wiring itself. A method for manufacturing a measuring device.

4. A method for manufacturing the measuring device according to claim 3, comprising: The width of the wiring line is 10 μm or more and 1 mm or less. A method for manufacturing a measuring device.

5. A method for manufacturing the measuring device according to claim 3, comprising: The spacing between the wiring lines is 10 μm or more and 1 mm or less. A method for manufacturing a measuring device.

6. A method for manufacturing the measuring device according to claim 1 or 2, comprising: the plating layer is formed integrally with the first resin and includes, in that order, a first layer containing a first metal, a second layer containing a second metal that reduces rust of the first metal, and a third layer containing a third metal that has the smallest electrical resistance; A method for manufacturing a measuring device.

7. A method for manufacturing the measuring device according to claim 1 or 2, comprising: The plating layer contains a nickel alloy. A method for manufacturing a measuring device.

8. A method for manufacturing the measuring device according to claim 1 or 2, comprising: The thickness of the plating layer is 1 μm or more and 30 μm or less. A method for manufacturing a measuring device.

9. A method for manufacturing the measuring device according to claim 1 or 2, comprising: the circuit includes a strain gauge; A method for manufacturing a measuring device.

10. A method for manufacturing the measuring device according to claim 1 or 2, comprising: The thermoplastic resin includes at least one selected from the group consisting of general-purpose plastics, engineering plastics, and super engineering plastics. A method for manufacturing a measuring device.

11. A method for manufacturing a measuring device according to claim 10, comprising: The thermoplastic resin is a polyarylene sulfide resin. A method for manufacturing a measuring device.

12. A method for manufacturing the measuring device according to claim 1 or 2, comprising: The elastic modulus of the first resin is 1 GPa or more and 50 GPa or less. A method for manufacturing a measuring device.

13. A method for manufacturing the measuring device according to claim 1 or 2, comprising: the first resin is formed by blending a metal oxide containing at least one of copper and chromium; A method for manufacturing a measuring device.

14. A robot arm comprising, as an end effector, the measuring device manufactured by the method for manufacturing a measuring device according to claim 1 or 2.

15. 15. A robotic arm according to claim 14, a control unit that determines whether or not an object has been gripped based on the electrical signal output from the circuit of the main body unit, Robotic arm.

16. 15. A robotic arm according to claim 14, The main body of the measuring device includes: a gripping unit that grips an object; a detection unit that is distorted in response to a force applied to the gripping unit and has the circuit; Equipped with The detection portion is thinner than the grip portion. Robotic arm.