Brain wave measurement device and brain wave measurement method

Abstract

Provided is a brain wave measurement device (10) comprising: an electrode unit (30) that acquires brain waves by contacting a measurement site of a subject; and a support member (20) that supports the electrode unit (30). The support member (20) includes: a film member (120) (substrate, circuit pattern (22), protective layer, and shield layer); and a mounting part (25) that is provided to the film member (120) and that is for mounting the electrode unit (30). The electrode unit (30) and the mounting part (25) are fixed by a detachable engagement structure.

Description

Electroencephalogram measuring device and electroencephalogram measuring method

[0001] The present invention relates to an electroencephalogram measuring device and an electroencephalogram measuring method.

[0002] Various developments have been made with regard to electroencephalogram (EEG) measuring devices for measuring electroencephalograms (also referred to as "EEG signals"). For example, a known example of this type of technology is a biosignal measuring device that includes a support made of a shape-memory material, which is a headband worn on the user's head, and a vital sensor attached to the support for acquiring the user's biosignals (see, for example, Patent Document 1). According to the technology disclosed in Patent Document 1, when measuring biosignals, the support can be easily restored to a shape that matches the user's body shape, which has been previously shape-memorized.

[0003] Patent No. 5900167

[0004] However, there is a concern that the measurement of EEG requires contacting multiple electrodes with the body (i.e., the scalp), which results in a large number of signal lines connected to the electrodes, making the entire device complicated. On the other hand, it is necessary to properly contact the electrodes with the body. In other words, there is a need for a technology that allows for quick and proper preparation of an EEG measurement device.

[0005] The present invention has been made in view of the above circumstances, and has as its object to provide a technique for quickly and appropriately preparing an electroencephalogram device for measuring electroencephalograms.

[0006] The present invention provides the following technologies. (1) An electroencephalogram (EEG) measuring device having an electrode unit that contacts a measurement site on a subject's head to acquire electroencephalograms, and a support member that supports the electrode unit, wherein the support member has: a film member; and a mounting portion provided on the film member for mounting the electrode unit, and the electrode unit and the mounting portion are fixed by a detachable engagement structure. (2) The electroencephalogram measuring device according to (1), wherein the engagement structure includes a female button portion provided with an opening in the mounting portion, and a male button portion provided on the electrode unit. (3) The electroencephalogram measuring device according to (1), wherein the engagement structure includes a male button portion provided with an opening in the mounting portion, and a female button portion provided on the electrode unit. (4) The electroencephalogram measuring device according to (1), wherein the engagement structure includes an opening in the mounting portion, and a bolt and nut structure that fastens the electrode unit to the opening. (5) The electroencephalogram measuring device according to any one of (2) to (4), wherein a plurality of the openings are provided corresponding to one electrode position, and the electrode unit is fixed to one opening selected from the plurality of openings. (6) The electroencephalogram measuring device according to (4), wherein the opening is an elongated hole, and the position at which the electrode unit is fixed is adjustable. (7) The electroencephalogram measuring device according to any one of (1) to (6), wherein the film member is formed in an elongated shape, and a plurality of the mounting portions are arranged side by side at predetermined intervals in the longitudinal direction of the film member. (8) An electroencephalogram measuring method comprising measuring electroencephalograms by wearing the electroencephalogram measuring device according to any one of (1) to (7) on a subject.

[0007] According to the present invention, a technique can be provided for quickly and appropriately preparing an electroencephalogram (EEG) measurement device for measuring electroencephalograms.

[0008] 10A and 10B are schematic diagrams showing a state in which an electroencephalogram measuring device is attached to a head according to a first embodiment; a schematic diagram showing a support member and an attachment section according to the first embodiment; a cross-sectional view of an electrode unit attached to a support member according to the first embodiment; a plan view schematically showing a substrate and a circuit pattern in a support member according to the first embodiment; a cross-sectional view of a support member according to the first embodiment; a diagram schematically showing an adjustment section according to the first embodiment; a schematic diagram showing a support member and an attachment section according to a modified example of the first embodiment; a plan view schematically showing a substrate and a circuit pattern in a support member according to a modified example of the first embodiment; a cross-sectional view of an electrode unit attached to a support member according to a second embodiment; a view from above of an electrode unit mounted on a mounting section in a region near an end of an electroencephalogram measuring device according to a third embodiment; a cross-sectional view of an electrode unit attached to a support member according to a third embodiment; a plan view schematically showing the circuit pattern in the region shown in FIG. 10 according to the third embodiment; a cross-sectional view of an electrode unit attached to a support member according to a fourth embodiment.

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In this embodiment, an electroencephalogram (EEG) measuring device having an electrode unit and worn on the head of a subject to acquire electroencephalograms, and an electroencephalogram measuring method using the electroencephalogram measuring device will be described.

[0010] <First embodiment> <Schematic structure of electroencephalogram measuring device 10> Fig. 1 is a schematic diagram showing a state in which an electroencephalogram measuring device 10 is attached to a person's head 99, as viewed from the front. Fig. 2 is a diagram showing a support member 20 and an attachment portion 70 that support an electrode unit 30.

[0011] The EEG measuring device 10 is attached to a person's head 99, detects EEGs as potential fluctuations from the living body, and outputs the detected EEGs to an EEG display device. The EEG display device acquires the EEGs detected by the EEG measuring device 10, displays them on a monitor, stores the data, and performs well-known EEG analysis processing (measurement processing).

[0012] The electroencephalogram (EEG) measuring device 10 has a plurality of electrode units 30 that contact the measurement site of the subject (i.e., the head 99) to acquire electroencephalograms, which are brain waves, a support member 20 to which the electrode units 30 are attached and supported, and an attachment portion 70 to which the support member 20 is fixed to the head 99.

[0013] <Support Member 20> The support member 20 includes a film member 120 and a mounting portion 25 for mounting the electrode unit 30 provided on the film member 120. In this embodiment, the electrode unit 30 and the mounting portion 25 are attached using a snap button fitting structure. The film member 120 includes a base material 21, a circuit pattern 22, a protective layer 23, and a shielding layer 24. In this embodiment, the EEG measurement device 10 is fixed to the head 99 by attaching the mounting portion 70 to the subject's ear. As will be described in detail later, the electrode unit 30 and the mounting portion 25 are fixed using a detachable engagement structure. Furthermore, a circuit pattern 22 is provided on the support member 20, serving as a signal line connecting the electrode unit 30 to an external EEG display device or the like, providing a neat wiring structure. To achieve such a structure, a flexible circuit (also called a flexible substrate) is used as the support member 20.

[0014] <Mounting portion 25 (female button terminal 25a)> The support member 20 is provided with a mounting portion 25 that fixes the electrode unit 30. The mounting portion 25 has a female button terminal 25a, which is one component of a snap button, and a base portion 25b that has a predetermined thickness and fixes the female button terminal 25a to the support member 20 (i.e., the film member 120) with a certain strength. The female button terminal 25a is formed of a conductive material and is connected to the circuit pattern 22. Alternatively, the female button terminal 25a and the base portion 25b may be integrally formed of a conductive material, and the base portion 25b may be connected to the circuit pattern 22. The following describes an example of a configuration in which the female button terminal 25a and the base portion 25b are integrally formed.

[0015] The opening of the female button terminal 25a is exposed toward the head 99 side (the lower side in the figure), and is capable of fitting with the male button terminal 35 of the electrode unit 30 described later.

[0016] <Attachment Part 70> The attachment part 70 has the ear attachment part 40, the adjustment part 50, and the tension display part 60, which are connected by an inextensible member (here, a string 65).

[0017] When the electroencephalogram measuring device 10 is attached to the head 99, the positions of the electrode units 30 are roughly at the vertices of a polygon, and the electrode units 30 are spanned by the support member 20. That is, in the left-right direction in the figure, the support member 20 is bent exactly at the portion where the electrode units 30 are attached (the position where the mounting portion 25 (female button terminal 25a) is provided).

[0018] <Electrode unit 30> The electrode unit 30 is detachably provided only at the site required for EEG measurement. The attachment positions of the electrode unit 30 (i.e., the positions of the female button terminals 25a) correspond to, for example, the positions T3, C3, Cz, C4, and T4 in the International 10-20 electrode placement method, and are arranged symmetrically in front view as shown in Figure 1.

[0019] 3 shows a cross-sectional view of the electrode unit 30 attached to the mounting portion 25 (female button terminal 25a) of the support member 20. The electrode unit 30 has a male button terminal 35 provided as a connection terminal. The male button terminal 35 is detachably attached to the female button terminal 25a provided at a predetermined position on the support member 20 by a fitting structure (here, a fitting structure using snap buttons). By using a structure in which the electrode unit 30 is attached by a fitting structure using snap buttons, it is possible to improve the workability when attaching the electrode unit 30.

[0020] The electrode unit 30 may be made entirely of conductive metal, or may have a rubber-like elastic material as a base with a conductive material provided on the surface. The following describes an example of a configuration based on a rubber-like elastic material.

[0021] The electrode unit 30 has a cylindrical base 31, a protrusion 32 integrally provided on one end of the base 31 (here, the base bottom surface 36), a conductive contact portion 33, a signal line portion 34, and a male button terminal 35 provided in a convex shape on the other end of the base 31 (here, the base top surface 37). Note that, hereinafter, the base 31 and the protrusion 32 will be referred to as an electrode main body 39 for convenience.

[0022] The electrode body 39 is integrally formed from a rubber-like elastic member. Specific materials for the elastic member will be described later. The electrode body 39 (i.e., the base 31 and the protrusions 32) are not limited to being integrally formed, but may be formed as separate parts that are attached together with adhesive or a fitting structure.

[0023] <Shapes of base 31 and protrusions 32> The base 31 is generally cylindrical. A circular base undersurface 36 at one end (the lower side in the figure) of the base 31 is provided with a plurality of generally conical protrusions 32 that protrude downward in the figure. Note that the base 31 may be cylindrical, and the cross section may be a circle or other shape such as a polygon. Furthermore, the shape of the protrusions 32 is not limited to a conical shape, and various shapes such as a pyramid such as a triangular pyramid or a cylindrical shape may be used.

[0024] The conductive contact portion 33 is provided on at least the surface of the tip end of the protrusion 32. The conductive contact portion 33 may be provided on the entire surface of the protrusion 32.

[0025] The outer diameter of the base 31 is, for example, 10 mm to 50 mm. The height (thickness) of the base 31 is, for example, 0.5 mm to 5 mm. The height of the protrusion 32 is, for example, 2 mm to 10 mm. The width of the protrusion 32 (outer diameter of the base portion) is, for example, 1 mm to 10 mm.

[0026] <Material of the electrode body 39 (base 31 and protrusions 32)> The material of the electrode body 39 will be described. As described above, the electrode body 39 can be made of a rubber-like elastic material. Specific examples of the rubber-like elastic material include rubber and thermoplastic elastomers (also simply referred to as "elastomers (TPE)"). Examples of rubber include silicone rubber. Examples of thermoplastic elastomers include styrene-based TPE (TPS), olefin-based TPE (TPO), vinyl chloride-based TPE (TPVC), urethane-based TPE (TPU), ester-based TPE (TPEE), and amide-based TPE (TPAE).

[0027] When the material of the electrode body 39 is silicone rubber, the rubber hardness A is, for example, 15 or more and 55 or less, when the Type A durometer hardness on the surface of the electrode body 39 measured at 37°C in accordance with JIS K 6253 (1997) is defined as rubber hardness A.

[0028] Here, the silicone rubber-based curable composition will be described. The silicone rubber can be composed of a cured product of the silicone rubber-based curable composition. The curing process of the silicone rubber-based curable resin composition is carried out, for example, by heating at 100 to 250°C for 1 to 30 minutes (primary curing) and then post-baking at 100 to 200°C for 1 to 4 hours (secondary curing).

[0029] The insulating silicone rubber is a silicone rubber that does not contain a conductive filler, and the conductive silicone rubber is a silicone rubber that contains a conductive filler.

[0030] The silicone rubber-based curable composition according to this embodiment can contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer that serves as the main component of the silicone rubber-based curable composition according to this embodiment.

[0031] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of vinyl group-containing linear organopolysiloxane. The same type of vinyl group-containing linear organopolysiloxanes may be different in the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount of vinyl groups added, as long as they contain the same vinyl groups as functional groups and have a linear shape. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different vinyl group-containing organopolysiloxanes.

[0032] The vinyl group-containing organopolysiloxane (A) can include a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

[0033] The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, and these vinyl groups become crosslinking points during curing.

[0034] The vinyl group content of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but preferably contains two or more vinyl groups in the molecule and is 15 mol% or less, and more preferably 0.01 to 12 mol%. This optimizes the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1), ensuring the formation of networks with the components described below. In this embodiment, the symbol "to" means that both ends of the symbol are included.

[0035] In this specification, the vinyl group content refers to the mol % of vinyl group-containing siloxane units when all units constituting the vinyl group-containing linear organopolysiloxane (A1) are taken as 100 mol %, where it is considered that there is one vinyl group per vinyl group-containing siloxane unit.

[0036] The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably within a range of, for example, about 1,000 to 10,000, and more preferably about 2,000 to 5,000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number average degree of polymerization (or number average molecular weight) measured by GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0037] Furthermore, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

[0038] By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above ranges, the heat resistance, flame retardancy, chemical stability, and other properties of the resulting silicone rubber can be improved.

[0039] As the vinyl group-containing linear organopolysiloxane (A1), those having a structure represented by the following formula (1) are particularly preferred.

[0040]

[0041] In formula (1), R １ is a hydrocarbon group that is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a combination thereof having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups, with vinyl groups being preferred. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0042] Also, R ２is a hydrocarbon group that is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a combination thereof having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0043] Also, R ３ is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group combining these. Examples of alkyl groups having 1 to 8 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl groups.

[0044] Furthermore, R in formula (1) １ and R ２ Examples of the substituent of R include a methyl group and a vinyl group. ３ Examples of the substituent include a methyl group.

[0045] In addition, in formula (1), a plurality of R １ are independent of each other and may be different from each other or may be the same. ２ , and R ３ The same is true for .

[0046] Furthermore, m and n are the numbers of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1), where m is an integer of 0 to 2000 and n is an integer of 1000 to 10000. m is preferably 0 to 1000, and n is preferably 2000 to 5000.

[0047] Specific examples of the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1) include those represented by the following formula (1-1):

[0048]

[0049] In formula (1-1), R１ and R ２ are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0050] Furthermore, the vinyl group-containing linear organopolysiloxane (A1) preferably contains a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more vinyl groups in the molecule and a vinyl group content of 0.4 mol% or less, and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol%. Combining a first vinyl group-containing linear organopolysiloxane (A1-1) with a vinyl group content typical of crude rubber, which is the raw material for silicone rubber, with a second vinyl group-containing linear organopolysiloxane (A1-2) with a high vinyl group content allows for uneven distribution of vinyl groups and more effectively creates a variation in crosslink density within the crosslinked network of the silicone rubber. As a result, the tear strength of the silicone rubber can be more effectively increased.

[0051] Specifically, the vinyl group-containing linear organopolysiloxane (A1) may be, for example, a vinyl group-containing linear organopolysiloxane represented by the above formula (1-1), １ is a vinyl group and / or R ２ a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more units in the molecule in which R is a vinyl group and containing 0.4 mol% or less of the unit; １ is a vinyl group and / or R ２ It is preferable to use a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol % of units in which each of the units is a vinyl group.

[0052] The first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol %, and the second vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol %.

[0053] Furthermore, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are combined and blended, the ratio of (A1-1) to (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1):(A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0054] The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may each be used alone or in combination of two or more.

[0055] The vinyl group-containing organopolysiloxane (A) may also contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

[0056] <<Organohydrogenpolysiloxane (B)>> The silicone rubber-based curable composition of this embodiment may contain a crosslinking agent. The crosslinking agent may contain an organohydrogenpolysiloxane (B). The organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure, and may contain either one or both of these.

[0057] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of crosslinking agent. The same type of crosslinking agent only needs to have a common structure, such as a linear or branched structure, and may have different molecular weight distributions or different functional groups in the molecule, or the amounts added may differ. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different crosslinking agents.

[0058] The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure in which hydrogen is directly bonded to Si (≡Si—H), and is a polymer that undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with vinyl groups of components blended into the silicone rubber-based curable composition, thereby crosslinking these components.

[0059] The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0060] The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by gel permeation chromatography (GPC) using chloroform as a developing solvent, in terms of polystyrene.

[0061] Furthermore, it is generally preferred that the linear organohydrogenpolysiloxane (B1) does not contain a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the linear organohydrogenpolysiloxane (B1).

[0062] As the linear organohydrogenpolysiloxane (B1) described above, for example, one having a structure represented by the following formula (2) is preferably used.

[0063]

[0064] In formula (2), R ４ is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these, or a hydride group having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0065] Also, R ５is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these, or a hydride group having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of alkenyl groups having 1 to 10 carbon atoms include vinyl groups, allyl groups, and butenyl groups. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0066] In addition, in formula (2), a plurality of R ４ are independent of each other and may be different from each other or may be the same. ５ The same applies to multiple R ４ and R ５ At least two of these are hydride groups.

[0067] Also, R ６ is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group combining these. Examples of alkyl groups having 1 to 8 carbon atoms include methyl groups, ethyl groups, and propyl groups, and among these, methyl groups are preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl groups. ６ are independent of each other and may be different from each other or may be the same.

[0068] In addition, R in formula (2) ４ , R ５ , R ６ Examples of the substituent include a methyl group and a vinyl group, and a methyl group is preferred from the viewpoint of preventing intramolecular crosslinking reactions.

[0069] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by formula (2), where m is an integer of 2 to 150 and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

[0070] The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more.

[0071] Because the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms regions with high crosslink density and is a component that significantly contributes to the formation of a sparsely crosslinked structure in the silicone rubber system. Similarly to the linear organohydrogenpolysiloxane (B1), it has a structure in which hydrogen is directly bonded to Si (≡Si—H), and undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with the vinyl groups of other components incorporated into the silicone rubber-based curable composition, forming a polymer that crosslinks these components.

[0072] The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

[0073] Furthermore, it is generally preferred that the branched organohydrogenpolysiloxane (B2) does not contain a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the branched organohydrogenpolysiloxane (B2).

[0074] The branched organohydrogenpolysiloxane (B2) is preferably one represented by the following average composition formula (c):

[0075] Average compositional formula (c) (H ａ (R ７ ) ３－ａ SiO １／２ ) ｍ (SiO ４／２ ) ｎ (In formula (c), R ７ is a monovalent organic group, a is an integer ranging from 1 to 3, and m is H ａ (R ７ ) ３－ａ SiO １／２ The number of units, n, is SiO ４／２ (number of units)

[0076] In formula (c), R ７is a monovalent organic group, preferably a substituted or unsubstituted alkyl group or aryl group having 1 to 10 carbon atoms, or a hydrocarbon group consisting of a combination thereof. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, and propyl groups, with methyl being preferred. Examples of aryl groups having 1 to 10 carbon atoms include phenyl groups.

[0077] In formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer ranging from 1 to 3, preferably 1.

[0078] In addition, in formula (c), m is H ａ (R ７ ) ３－ａ SiO １／２ The number of units, n, is SiO ４／２ The number of units.

[0079] The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in their structures, that is, whether they are linear or branched, and the number of alkyl groups R bonded to Si (R / Si), where the number of Si is 1, is in the range of 1.8 to 2.1 for the linear organohydrogenpolysiloxane (B1) and 0.8 to 1.7 for the branched organohydrogenpolysiloxane (B2).

[0080] Because the branched organohydrogenpolysiloxane (B2) has a branched structure, it leaves a residue amount of 5% or more when heated, for example, in a nitrogen atmosphere to 1,000° C. at a heating rate of 10° C. / min. In contrast, because the linear organohydrogenpolysiloxane (B1) is linear, it leaves a residue amount of almost zero after heating under the above conditions.

[0081] Specific examples of the branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3).

[0082]

[0083] In formula (3), R ７is a substituted or unsubstituted alkyl group or aryl group having 1 to 8 carbon atoms, or a hydrocarbon group combining these, or a hydrogen atom. Examples of alkyl groups having 1 to 8 carbon atoms include methyl groups, ethyl groups, and propyl groups, with methyl groups being preferred. Examples of aryl groups having 1 to 8 carbon atoms include phenyl groups. R ７ Examples of the substituent include a methyl group.

[0084] In addition, in formula (3), a plurality of R ７ are independent of each other and may be different from each other or may be the same.

[0085] In addition, in formula (3), "-O-Si≡" indicates that Si has a branched structure that spreads three-dimensionally.

[0086] The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more.

[0087] Furthermore, the amount of hydrogen atoms (hydride groups) directly bonded to Si in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is not particularly limited. However, in the silicone rubber-based curable composition, the total amount of hydride groups in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, per mole of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1). This ensures the reliable formation of a crosslinked network between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1).

[0088] <<Silica Particles (C)>> The silicone rubber-based curable composition according to this embodiment contains a non-conductive filler. The non-conductive filler may contain silica particles (C) as needed. This can improve the hardness and mechanical strength of the elastomer.

[0089] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of non-conductive filler. Non-conductive fillers of the same type may have at least common constituent materials, but may differ in particle size, specific surface area, surface treatment agent, or the amount of surface treatment agent added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0090] The silica particles (C) are not particularly limited, but examples thereof include fumed silica, calcined silica, precipitated silica, etc. These may be used alone or in combination of two or more.

[0091] The silica particles (C) have a specific surface area of, for example, 50 to 400 m2 as measured by the BET method. ２ / g, and 100 to 400m ２ The average primary particle size of the silica particles (C) is preferably, for example, 1 to 100 nm, and more preferably about 5 to 20 nm.

[0092] By using silica particles (C) having a specific surface area and average particle size within the above ranges, it is possible to improve the hardness and mechanical strength, particularly the tensile strength, of the silicone rubber formed.

[0093] <<Silane Coupling Agent (D)>> The silicone rubber-based curable composition of this embodiment can contain a silane coupling agent (D). The silane coupling agent (D) can have a hydrolyzable group. The hydrolyzable group is hydrolyzed by water to form a hydroxyl group, and this hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl groups on the surface of the silica particles (C), thereby modifying the surface of the silica particles (C).

[0094] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of silane coupling agent. Silane coupling agents of the same type may have at least a common functional group, but may differ in other functional groups in the molecule or in the amount added. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different silane coupling agents.

[0095] Furthermore, this silane coupling agent (D) can contain a silane coupling agent having a hydrophobic group. This provides the hydrophobic group to the surface of the silica particles (C), thereby reducing the cohesive force of the silica particles (C) in the silicone rubber-based curable composition, and ultimately in the silicone rubber (reducing aggregation due to hydrogen bonding through silanol groups). This is presumably improving the dispersibility of the silica particles (C) in the silicone rubber-based curable composition. This increases the interface between the silica particles (C) and the rubber matrix, enhancing the reinforcing effect of the silica particles (C). Furthermore, it is presumed that the slipperiness of the silica particles (C) within the matrix improves during deformation of the rubber matrix. The improved dispersibility and slipperiness of the silica particles (C) improve the mechanical strength (e.g., tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C).

[0096] Furthermore, the silane coupling agent (D) can contain a silane coupling agent having a vinyl group. This allows the vinyl group to be introduced onto the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, when the vinyl group of the vinyl group-containing organopolysiloxane (A) and the hydride group of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction to form a network (crosslinked structure), the vinyl group of the silica particles (C) also participates in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B), and the silica particles (C) are also incorporated into the network. This allows the formed silicone rubber to have a low hardness and a high modulus.

[0097] As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

[0098] Examples of the silane coupling agent (D) include those represented by the following formula (4).

[0099] Y ｎ -Si-(X) ４－ｎ ...(4) In the above formula (4), n represents an integer of 1 to 3. Y represents a functional group having a hydrophobic group, a hydrophilic group, or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of the groups is a hydrophobic group. X represents a hydrolyzable group.

[0100] The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group formed by combining these groups, such as a methyl group, an ethyl group, a propyl group, or a phenyl group, with a methyl group being particularly preferred.

[0101] Examples of the hydrophilic group include a hydroxyl group, a sulfonic acid group, a carboxyl group, and a carbonyl group, and among these, a hydroxyl group is particularly preferred. Although a hydrophilic group may be contained as a functional group, it is preferable that the hydrophilic group is not contained from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

[0102] Further, examples of the hydrolyzable group include an alkoxy group such as a methoxy group or an ethoxy group, a chloro group, or a silazane group. Among these, a silazane group is preferred because of its high reactivity with the silica particles (C). Note that, in the case of a compound having a silazane group as a hydrolyzable group, the (Y ｎ The resulting structure has two —Si— structures.

[0103] Specific examples of the silane coupling agent (D) represented by the above formula (4) are as follows. Examples of the silane coupling agent (D) having a hydrophobic group as the functional group include alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; and hexamethyldisilazane. Among these, silane coupling agents having a trimethylsilyl group containing one or more selected from the group consisting of hexamethyldisilazane, trimethylchlorosilane, trimethylmethoxysilane, and trimethylethoxysilane are preferred.

[0104] As the one having vinyl group as the functional group, for example, can be mentioned alkoxysilane such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane; chlorosilane such as vinyltrichlorosilane, vinylmethyldichlorosilane; divinyltetramethyldisilazane.Among these, preferred is the silane coupling agent having vinyl group-containing organosilyl group, comprising one or more selected from the group consisting of methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, divinyltetramethyldisilazane, vinyltriethoxysilane, vinyltrimethoxysilane and vinylmethyldimethoxysilane.

[0105] Furthermore, when the silane coupling agent (D) contains two types of silane coupling agents, one having a trimethylsilyl group and the other having a vinyl group-containing organosilyl group, it is preferable that the silane coupling agent containing the hydrophobic group is hexamethyldisilazane, and the silane coupling agent containing the vinyl group is divinyltetramethyldisilazane.

[0106] When a silane coupling agent (D1) having a trimethylsilyl group and a silane coupling agent (D2) having a vinyl group-containing organosilyl group are used in combination, the ratio of (D1) to (D2) is not particularly limited, but for example, the weight ratio of (D1):(D2) is 1:0.001 to 1:0.35, preferably 1:0.01 to 1:0.20, and more preferably 1:0.03 to 1:0.15. By adjusting the weight ratio within this range, the desired physical properties of the silicone rubber can be obtained. Specifically, a balance can be achieved between the dispersibility of silica in the rubber and the crosslinkability of the rubber.

[0107] In this embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, relative to 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 40% by mass or less, relative to 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). By setting the content of the silane coupling agent (D) to the above lower limit or more, the adhesion between the columnar portion containing the elastomer and the conductive resin layer can be improved. This can also contribute to improving the mechanical strength of the silicone rubber. Setting the content of the silane coupling agent (D) to the above upper limit or less allows the silicone rubber to have appropriate mechanical properties.

[0108] <<Platinum or Platinum Compound (E)>> The silicone rubber-based curable composition according to this embodiment may contain a catalyst. The catalyst may contain platinum or a platinum compound (E). The platinum or platinum compound (E) is a catalytic component that acts as a catalyst during curing. The amount of platinum or platinum compound (E) added is a catalytic amount.

[0109] The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may contain the same type of catalyst. The same type of catalyst is sufficient as long as they have at least common constituent materials, and the catalyst may contain different compositions, and the amounts added may be different. The insulating silicone rubber-based curable composition and the conductive silicone rubber-based curable composition may further contain different catalysts.

[0110] As the platinum or platinum compound (E), known compounds can be used, such as platinum black, platinum supported on silica or carbon black, chloroplatinic acid or an alcohol solution of chloroplatinic acid, a complex salt of chloroplatinic acid and an olefin, and a complex salt of chloroplatinic acid and a vinylsiloxane.

[0111] The platinum or platinum compound (E) may be used alone or in combination of two or more.

[0112] In this embodiment, the content of platinum or platinum compound (E) in the silicone rubber-based curable composition refers to a catalytic amount and can be set as appropriate. Specifically, the amount is an amount such that the platinum group metal is 0.01 to 1000 ppm by weight, preferably 0.1 to 500 ppm, per 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), silica particles (C), and silane coupling agent (D). By setting the content of platinum or platinum compound (E) to be equal to or greater than the above-mentioned lower limit, the silicone rubber-based curable composition can be cured at an appropriate rate. Furthermore, setting the content of platinum or platinum compound (E) to be equal to or less than the above-mentioned upper limit can contribute to reducing production costs.

[0113] <<Water (F)>> Furthermore, the silicone rubber-based hardening composition according to this embodiment may contain water (F) in addition to the above components (A) to (E).

[0114] Water (F) functions as a dispersion medium for dispersing the components contained in the silicone rubber-based curable composition, and is also a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). Therefore, the silica particles (C) and the silane coupling agent (D) can be more reliably bonded to each other in the silicone rubber, and uniform properties can be exhibited overall.

[0115] (Other Components) Furthermore, the silicone rubber-based curable composition of this embodiment may further contain other components in addition to the above components (A) to (F). Examples of these other components include inorganic fillers other than the silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.

[0116] The conductive solution (conductive silicone rubber composition) according to this embodiment contains the above-mentioned conductive filler and solvent in addition to the above-mentioned silicone rubber-based curable composition that does not contain a conductive filler.

[0117] As the solvent, various known solvents can be used, including, for example, high-boiling point solvents, which may be used alone or in combination of two or more.

[0118] Examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, trifluoromethylbenzene, and benzotrifluoride; ethers such as diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, and 1,1,2-trichloroethane; carboxylic acid amides such as N,N-dimethylformamide and N,N-dimethylacetamide; and sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide. These may be used alone or in combination of two or more.

[0119] The conductive solution can have a viscosity suitable for various application methods such as spray application and dip application by adjusting the amount of solids in the solution.

[0120] Furthermore, when the conductive solution contains the conductive filler and the silica particles (C), the lower limit of the content of the silica particles (C) contained in the electrode part main body 39 can be, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more, relative to 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the electrode part main body 39. On the other hand, the upper limit of the content of the silica particles (C) contained in the electrode part main body 39 can be, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less, relative to 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can achieve a balance between the conductivity of the electrode part main body 39 and the mechanical strength and flexibility.

[0121] The conductive solution can be heated and dried as needed to obtain conductive silicone rubber. The conductive silicone rubber may be configured to not contain silicone oil. This prevents the silicone oil from bleeding out onto the surface of the electrode body 39, thereby preventing a decrease in conductivity.

[0122] <Material of Conductive Contact Portion 33> The conductive member of the conductive contact portion 33 is, for example, a paste containing a highly conductive metal (so-called conductive paste). The highly conductive metal includes one or more metals selected from the group consisting of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, and alloys thereof. In particular, silver, silver chloride, and copper are suitable from the viewpoints of availability and conductivity.

[0123] When the conductive contact portion 33 is formed from a paste containing a highly conductive metal, the top of the protrusion portion 32 made of a rubber-like elastic body is dipped (dipped and coated) into a paste-like conductive solution containing a highly conductive metal, thereby forming the conductive contact portion 33 on the surface of the protrusion portion 32.

[0124] The conductive contact portion 33 may be formed as a conductive resin layer by applying a conductive solution containing a conductive filler and a solvent to the protrusion portion 32. In this case, by using the same material (silicone rubber) as the solvent for the protrusion portion 32, the adhesion of the conductive contact portion 33 (conductive resin layer) can be improved.

[0125] The conductive solution is heated and dried as needed to obtain a conductive silicone rubber. The conductive silicone rubber may be configured not to contain silicone oil. This prevents the silicone oil from bleeding out onto the surface of the conductive contact 33, thereby preventing a decrease in conductivity.

[0126] This improves the ability to push aside hair when the electroencephalogram measuring device 10 is attached to the head 99. Furthermore, it is possible to ensure a sufficient contact area of ​​the conductive contact portion 33 when the electroencephalogram measuring device 10 is attached.

[0127] <Structure of Signal Wire Portion 34> The electrode unit 30 is provided with a signal wire portion 34 as a signal path connecting to the conductive contact portion 33. The signal wire portion 34 may have any of various wiring structures as long as it provides electrical continuity via the base 31 and the protrusion 32. Here, the signal wire portion 34 is provided so as to extend from the conductive contact portion 33 at the tip of the protrusion 32, pass through the interior of the protrusion 32 and the base 31, and be exposed on the base upper surface 37. The portion of the signal wire portion 34 that protrudes from the base upper surface 37 (here, the end portion 34a) is sandwiched between the male button terminal 35 (more specifically, the disk portion 35a) and the base upper surface 37, ensuring electrical continuity with the male button terminal 35.

[0128] The lower tip of the signal line portion 34 may have any of a protruding structure, a structure that is substantially flush with the tip of the protrusion 32 or its vicinity, i.e., a structure that is buried in the region where the conductive contact portion 33 is formed. A protruding structure may be used from the viewpoint of connection stability with the conductive contact portion 33. The protruding portion of the tip of the signal line portion 34 is partially or entirely covered with the conductive contact portion 33. The protruding structure of the tip of the signal line portion 34 may be unfolded, folded, or wrapped around the surface of the tip of the protrusion 32.

[0129] As another wiring structure for the signal line portion 34, it may be a structure in which it is provided on the surfaces of the protrusion portion 32 and the base portion 31, or a wiring structure in which it is provided partly inside and partly on the surface. In other words, it is sufficient if the signal detected by the conductive contact portion 33 is ultimately transmitted to the male button terminal 35.

[0130] <Material of the Signal Wire Portion 34> The signal wire portion 34 may be made of a known material, for example, conductive fiber. The conductive fiber may be one or more types selected from the group consisting of metal fiber, metal-coated fiber, carbon fiber, conductive polymer fiber, conductive polymer-coated fiber, and conductive paste-coated fiber. These may be used alone or in combination of two or more types.

[0131] The metal material of the metal fibers and metal-coated fibers is not limited as long as it is conductive, but examples include copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, stainless steel, aluminum, silver / silver chloride, and alloys thereof. These may be used alone or in combination of two or more. Among these, silver can be used from the viewpoint of conductivity. Furthermore, it is preferable that the metal material does not contain metals that put a burden on the environment, such as chromium.

[0132] The fiber materials for the metal-coated fibers, conductive polymer-coated fibers, and conductive paste-coated fibers are not particularly limited, but may be synthetic fibers, semi-synthetic fibers, or natural fibers. Among these, polyester, nylon, polyurethane, silk, cotton, etc. are preferred. These may be used alone or in combination of two or more.

[0133] Examples of the carbon fiber include PAN-based carbon fiber and pitch-based carbon fiber.

[0134] The conductive polymer material for the conductive polymer fibers and conductive polymer-coated fibers may be, for example, a mixture of a conductive polymer such as polythiophene, polypyrrole, polyaniline, polyacetylene, polyphenylene vinylene, polynaphthalene, or a derivative thereof and a binder resin, or an aqueous solution of a conductive polymer such as PEDOT-PSS ((3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid)).

[0135] The resin material contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, but preferably has elasticity, and may contain, for example, one or more selected from the group consisting of silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, and ethylene propylene rubber. These may be used alone or in combination of two or more.

[0136] The conductive filler contained in the conductive paste of the conductive paste-coated fiber is not particularly limited, and may be any known conductive material, but may include one or more selected from the group consisting of metal particles, metal fibers, metal-coated fibers, carbon black, acetylene black, graphite, carbon fibers, carbon nanotubes, conductive polymers, conductive polymer-coated fibers, and metal nanowires.

[0137] The metal constituting the conductive filler is not particularly limited, but may include, for example, at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, silver / silver chloride, or alloys thereof, or two or more of these. Among these, silver or copper is preferred because of its high conductivity and easy availability.

[0138] The signal line portion 34 may be made of a twisted yarn made by twisting together a plurality of linear conductive fibers, which can prevent the signal line portion 34 from breaking when the device is deformed.

[0139] In this embodiment, the coating of conductive fibers does not simply mean covering the outer surface of the fiber material, but also includes, in the case of a twisted yarn made by twisting together single fibers, impregnating the gaps between the fibers in the twisted yarn with metal, conductive polymer, or conductive paste to coat each of the single fibers that make up the twisted yarn.

[0140] The tensile elongation at break of the signal line portion 34 is, for example, 1% to 50%, and preferably 1.5% to 45%. By setting the elongation at break within this range, excessive deformation of the protrusion 32 can be suppressed while suppressing breakage during deformation.

[0141] <Male Button Terminal 35 and Female Button Terminal 25a> The male button terminal 35 is made of, for example, a highly conductive metal and has a disk-shaped disk portion 35a and a protrusion 35b extending from the center of the upper surface of the disk portion 35a. Examples of the highly conductive metal that can be used include stainless steel, copper alloy, aluminum alloy, and brass.

[0142] The disk portion 35a is attached to the base upper surface 37 of the base 31 with a conductive adhesive or the like. At this time, as described above, the end 34a of the signal line portion 34 is sandwiched between the disk portion 35a and the base upper surface 37, ensuring electrical continuity with the male button terminal 35. The protrusion 35b is formed in a cylindrical shape, with its tip slightly bulging out in the horizontal direction. With this structure, when the male button terminal 35 is fitted into the female button terminal 25a, the male button terminal 35 is properly and detachably fixed.

[0143] The female button terminal 25a, like the male button terminal 35, is made of a metal with good conductivity, has a female button shape that can fit the protrusion 35b constituting the male button terminal 35, and is provided so that it can be fitted from the bottom (head 99 side). The female button terminal 25a is connected to the circuit pattern 22 (more specifically, the first pattern 27 described below) directly or via the base portion 25b.

[0144] The female button terminal 25a and the male button terminal 35 (protrusion 35b) are fitted together, thereby allowing the electrode unit 30 to be detachably attached to the support member 20. The electroencephalogram acquired by the electrode unit 30 is output to an electroencephalogram display device or the like via the wiring structure of the circuit pattern 22.

[0145] <Support Member 20> The support member 20 will be specifically described mainly with reference to Fig. 4 and Fig. 5. Fig. 4 is a plan view schematically showing the substrate 21 and circuit pattern 22 of the support member 20. In other words, the shielding layer 24 is omitted from the illustration. Fig. 5 is a cross-sectional view of the support member 20, showing the X1-X1 cross-section of Fig. 2.

[0146] The support member 20 is a so-called flexible substrate and is composed of a base material 21, a circuit pattern 22, a protective layer 23, a shielding layer 24, and a string guide portion 26. The base material 21 has openings 29 for attaching mounting portions 25 (i.e., female button terminals 25a) at five positions corresponding to the positions T3, C3, Cz, C4, and T4 in the International 10-20 electrode placement method. The string guide portion 26 is provided in a convex shape on both ends of the base material 21 in the longitudinal direction. The string guide portion 26 has openings that communicate in the left-right direction, through which the string 65 is inserted. This ensures that the string 65 always passes through both ends of the base material 21, ensuring the EEG measurement device 10 is worn properly.

[0147] The support member 20 is flexible at least in the longitudinal direction, and is configured to have sufficient strength for attaching the electrode units 30. That is, it has sufficient strength to prevent breakage when the electrode units 30 are attached by providing the mounting portions 25 (i.e., the female button terminals 25a). Furthermore, the support member 20 has physical properties that do not stretch, so that the multiple electrode units 30 can be pressed against the head 99 with an appropriate pressure, i.e., so that a constant tension acts on the electrode units 30.

[0148] The vertical width (depth length) of the support member 20 depends on the size of the electrode unit 30 to be attached, but can be, for example, 10 mm to 50 mm. The horizontal width (left-right length) of the support member 20 depends on the size of the head 99 and the electrode positions, but can be, for example, 200 mm to 400 mm. Furthermore, the distance between the electrodes can be, for example, 65 mm to 75 mm, assuming an adult. The thickness of the support member 20 depends on the material, but can be, for example, 0.02 mm to 1 mm. By setting the thickness of the support member 20 within the above range, the electrode unit 30 can be pressed with a constant tension. The support member 20 may be curved to a degree that does not substantially change the tension, depending on the shape of the head 99 and the condition of the hair.

[0149] Each component of the support member 20 will now be described in detail. <Substrate 21> The substrate 21 can be a resin film substrate, a metal film member, or a glass film. Examples of resin film substrates include polyimide resin films, polyetherimide resin films, polyamideimide resin films, and other polyimide resin-based films; polyamide resin films, such as polyamide resin films; polyester resin films, such as polyester resin films; PET (polyethylene terephthalate) resin films; and PS (polystyrene) resin films. Of these, polyimide resin films are particularly preferred from the viewpoint of improving flexibility, elastic modulus, and heat resistance. Furthermore, examples of metal members that can be used include aluminum foil and copper foil.

[0150] The thickness of the base material 21 is not particularly limited, but can be set to 0.01 mm to 0.9 mm. When the thickness is within this range, the base material 21 can be made to conform appropriately to the shape of the head 99, and the base material 21 can have an appropriate strength for attaching the electrode unit 30.

[0151] <Circuit Pattern 22> The circuit pattern 22 can be obtained, for example, by patterning into a desired shape by etching a flexible copper-clad laminate having copper foil provided over the entire upper surface of the substrate 21. Alternatively, the circuit pattern 22 can be provided by printing a desired pattern using a conductive paste such as silver ink or copper ink.

[0152] The circuit pattern 22 has first to fifth circuit patterns 22a to 22e (simply referred to as circuit patterns 22 when not distinguished) provided so as to extend leftward from each of the five openings 29. The first to fifth circuit patterns 22a to 22e are independent of each other and electrically insulated from each other.

[0153] Each circuit pattern 22 includes a first pattern 27 arranged in a ring shape around the periphery of the opening 29 and a second pattern 28 extending linearly from the first pattern 27 to the left in the figure. A mounting portion 25 is attached to the first pattern 27, providing electrical continuity between the circuit pattern 22 and the mounting portion 25 (i.e., the female button terminal 25a). A portion of the second pattern 28 is angled diagonally to separate it from the other second patterns 28 and the first pattern 27. Furthermore, because adjustment portions 50 are sewn between electrode positions C3 and T3 and between electrode positions C4 and T4, the circuit pattern 22 (first pattern 27) is formed avoiding the areas required for sewing. A connector (not shown) for connecting to external wiring is provided at the extending end (left end in the figure) of the second pattern 28. Note that the circuit pattern 22 may be a dummy pattern rather than an actual wiring structure in order to provide a predetermined strength to the support member 20. For example, since the string guide portion 26 is subjected to force from the string 65 passing through the inside, a desired strength can be ensured by providing a dummy pattern at the fixed portion of the string guide portion 26.

[0154] <Protective layer 23> The protective layer 23 is formed by covering the upper surface of the circuit pattern 22 with an insulating material, and may be, for example, a coverlay film made of an insulating resin film and an adhesive, or may be formed by forming a liquid resin composition containing a thermosetting resin by a screen printing method or the like and then heating and curing it.

[0155] <Shield layer 24> The shield layer 24 is provided to counter noise when transmitting brain waves, and includes a first shield layer 24a provided on the upper surface of the protective layer 23 and a second shield layer 24b provided on the lower surface of the base material 21. The first shield layer 24a and the second shield layer 24b may be formed of the same material or different materials.

[0156] The shielding layer 24 (first shielding layer 24a, second shielding layer 24b) is obtained by forming a layer that acts as an electromagnetic wave shield on the protective layer 23 using a method such as screen printing with a conductive paste containing a metal filler. This metal filler can be made of metals such as gold, silver, copper, or aluminum, or alloys, either alone or in combination. There are no particular restrictions on the size of the filler, but fillers ranging from several nanometers to several micrometers are used. The paste is made by mixing this metal filler with a thermosetting epoxy resin or the like.

[0157] The thickness of the shield layer 24 (first shield layer 24a, second shield layer 24b) can be, for example, 5 μm to 50 μm. By setting the thickness within this range, a stable thickness can be achieved when forming the shield layer 24, and desired shielding performance can be achieved.

[0158] The shielding layer 24 may be a laminate in which a conductive metal layer is formed on a resin film by vapor deposition or the like. In this case, the laminate is attached to the upper surface of the protective layer 23 or the lower surface of the substrate 21 using an adhesive or the like. While the shielding layer may be formed by printing, vapor deposition is preferred because it allows the shielding layer to be made thinner and more resistant to bending. The conductive metal layer is connected to the ground (a portion stable at the reference potential) of the circuit pattern 22. Either or both of the first shielding layer 24a and the second shielding layer 24b may be omitted. In this case, noise resistance performance is reduced, but the device can be simplified. Furthermore, noise resistance performance can be addressed to a certain extent by signal processing.

[0159] <Mounting portion 70> The mounting portion 70 is attached to each of the longitudinal ends of the support member 20, and is placed between the support member 20 and a part of the subject that is different from the measurement part (here, the ear), and presses the electrode unit 30 against the head 99 with a predetermined electrode pressing force.

[0160] Specifically, the attachment unit 70 includes an adjustment unit 50 , an ear attachment unit 40 , and a tension display unit 60 , which are connected by a non-stretchable string 65 .

[0161] The ear attachment unit 40 is attached to the ear of the subject. In this embodiment, the ear attachment unit 40 is attached by wrapping around the ear from below.

[0162] The adjustment unit 50 is shown in Figure 6. Figure 6(a) is a side view, and Figure 6(b) is a plan view. As shown in Figure 1, the adjustment unit 50 is sewn to the support member 20 between electrode positions C3 and T3 and between electrode positions C4 and T4. The adjustment unit 50 has a plate-shaped member 52 attached to the support member 20, and a locking unit 51 that slides the plate-shaped member 52 and fixes it at a desired position. The locking unit 51 is provided with a string attachment portion 54 to which a string 65 is attached.

[0163] The plate-shaped member 52 is a long, rail-like strip with multiple protrusions 52a arranged in a row. The locking portion 51 is slidably fitted into the rail formed by the protrusions 52a. The locking portion 51 has a locking mechanism 56 that prevents it from sliding. The locking mechanism 56 is released from the non-slidable state by performing a predetermined operation (e.g., pushing it sideways). The locking portion 51 slides on the plate-shaped member 52, allowing adjustment of the distance between the ear attachment portion 40 attached to the string 65 and the support member 20. The material of the adjustment portion 50 is not particularly limited, but various plastics can be used. Nylon 66 is preferably used from the standpoints of physical properties, processability, cost, etc.

[0164] The tension display unit 60 has a spring member and a display scale that displays the extension state of the spring member, and the tension acting on the tension display unit 60 from the extension state of the spring member, i.e., the tension acting on both ends of the support member 20, can be visually confirmed.

[0165] As described above, according to this embodiment, in the electroencephalogram measuring device 10, the member to which the electrode unit 30 is attached (i.e., the support member 20) is made of a flexible circuit board, which serves as a signal line connecting the electrode unit 30 to an external electroencephalogram display device or the like, thereby achieving a neat wiring structure. Furthermore, because a flexible circuit board does not stretch but can be bent, the support member 20 can be made to conform well to the shape of the head 99. As a result, the posture in which the electrode unit 30 is pressed against the head 99 can be adjusted appropriately, and the force with which the electrode unit 30 is pressed against the head 99 can be easily optimized.

[0166] In the above description, one mounting portion 25 (i.e., female button terminal 25a) for mounting the electrode unit 30 is provided at each electrode position. However, this is not limiting, and a configuration may be adopted in which multiple female button terminals 25a are provided at a given electrode position, and any one of the female button terminals 25a can be selected. Fig. 7 is a plan view showing the support member 20 and mounting portion 25 according to such a modification. Fig. 8 is a plan view showing the circuit pattern 22 on the support member 20.

[0167] Here, the mounting sections 25 for the electrode positions T3 and T4 near both longitudinal ends have three female button terminals 25a arranged at predetermined intervals in the horizontal direction (longitudinal direction) and a base section 25b provided in common with the terminals. The circuit pattern 22 connected to the base section 25b also has a first pattern 27 formed by connecting three generally annular patterns and a second pattern 28 extending from the first pattern 27. By employing such a configuration, the position of the electrode unit 30 can be adjusted according to the size and shape of the subject's head 99.

[0168] Second Embodiment A second embodiment will be described with reference to Fig. 9. Fig. 9 is a cross-sectional view of the electrode unit 30 of this embodiment attached to the support member 20. This embodiment differs from the first embodiment in the mounting structure of the electrode unit 30. The following description will mainly focus on the differences, and descriptions of similar configurations will be omitted as appropriate.

[0169] Specifically, the support member 20 has a base portion 125b and a male button terminal 125a, which is one component of a snap button, as the mounting portion 125. The male button terminal 125a is formed so as to protrude in a cylindrical shape from the disk-shaped base portion 125b toward the lower side of the support member 20. The tip portion of the male button terminal 125a bulges slightly laterally and is formed so as to be able to fit into the female button terminal 135b of the electrode unit 30.

[0170] The electrode unit 30 has a female button terminal 135b, which is the other component of the snap button, on the upper surface of a disk portion 135a provided on the base upper surface 37. The female button terminal 135b of the electrode unit 30 is formed so that the male button terminal 125a can be fitted into it with its opening facing upward.

[0171] In this way, by using a fitting structure using snap buttons to attach the electrode unit 30, workability when attaching the electrode unit 30 can be improved, similar to the first embodiment.

[0172] Third Embodiment A third embodiment will be described with reference to FIGS. 10 to 12. FIG. 10 is a top view of the electrode unit 30 mounted on the mounting section 225 in the region near the end of the electroencephalogram (EEG) measurement device 10 (the region corresponding to electrode position T4). FIG. 11 is a cross-sectional view of the electrode unit 30 mounted on the support member 20 of this embodiment, taken along the X2-X2 line in FIG. 10. FIG. 12 is a plan view schematically illustrating the circuit pattern 22 in the region shown in FIG. 10. In the following, this embodiment differs from the first and second embodiments in the mounting structure of the electrode unit 30. The following description will focus mainly on the differences, and descriptions of similar configurations will be omitted where appropriate.

[0173] Specifically, the electrode unit 30 and the support member 20 are detachably fixed to each other by screw engagement. Here, a bolt-shaped male screw terminal 235b provided on the disk portion 235a of the electrode unit 30 is inserted into an opening 229 of the mounting portion 225 and fastened with a conductive nut 236. The opening 229 is provided as a substantially rectangular elongated hole extending in the longitudinal direction (the left-right direction in the drawing). The first pattern 27 provided so as to surround the opening 229 is formed in a rectangular frame shape corresponding to the shape of the opening 229.

[0174] The position of the electrode unit 30 can be adjusted by adjusting the insertion position of the male screw terminal 235b into the opening 229 in the left-right direction (indicated by the arrow in the figure). In addition, the electrode unit 30 is fixed to the support member 20 using a so-called bolt and nut fixing method, so the fixed state is stable. As a result, noise generation during EEG measurement can be suppressed.

[0175] <Fourth embodiment> A fourth embodiment will be described with reference to Fig. 13. Fig. 13 is a cross-sectional view of the electrode unit 30 of this embodiment attached to the support member 20. This embodiment differs from the first to third embodiments in the mounting structure of the electrode unit 30. The following description will mainly focus on the differences, and descriptions of similar configurations will be omitted as appropriate.

[0176] In this embodiment, the electrode unit 30 has a recessed screw hole 335b at the center of the upper surface of a disk portion 335a provided on the base upper surface 37. The support member 20 is provided with an annular mounting portion 325. The central opening 29 of the mounting portion 325 and the screw hole 335b have approximately the same outer diameter. The electrode unit 30 is placed from below the support member 20 so that the screw hole 335b and the central opening 29 of the mounting portion 325 overlap, and a bolt 326 is inserted from above the opening 29 to fasten the electrode unit 30 to the support member 20. This structure stabilizes the fixed state between the electrode unit 30 and the support member 20. As a result, noise generation during electroencephalogram measurement can be suppressed.

[0177] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted.

[0178] The above embodiments can be briefly summarized as follows: (1) An electroencephalogram (EEG) measuring device 10 having an electrode unit 30 that contacts a measurement site on a head 99 of a subject to acquire electroencephalograms, and a support member 20 that supports the electrode unit 30, wherein the support member 20 has: a film member 120 (a base material 21, a circuit pattern 22, a protective layer 23, and a shielding layer 24); and a mounting portion 25 that is provided on the film member 120 and that mounts the electrode unit 30, wherein the electrode unit 30 and the mounting portion 25 are fixed by a detachable engagement structure. (2) The electroencephalogram measuring device 10 according to (1), wherein the engagement structure has a female button terminal 25a provided in the mounting portion 25 with an opening 80, and a male button terminal 35 provided on the electrode unit 30. (3) The electroencephalogram measuring device 10 according to (1), wherein the engagement structure includes a male button terminal 125a provided in the mounting portion 25 and a female button terminal 135b provided with an opening in the electrode unit 30. (4) The electroencephalogram measuring device 10 according to (1), wherein the engagement structure includes an opening 29 provided in the mounting portion 25 and a bolt-nut structure (male screw terminal 235b, nut 236) for fastening the electrode unit 30 to the opening 29. (5) The electroencephalogram measuring device 10 according to any one of (2) to (4), wherein a plurality of openings 29 are provided corresponding to one electrode position, and the electrode unit 30 is fixed to one opening 29 selected from the plurality of openings 29. (6) The electroencephalogram measuring device 10 according to (4), wherein the opening 229 is an elongated hole, and the position at which the electrode unit 30 is fixed is adjustable. (7) The electroencephalogram measuring device 10 according to any one of (1) to (6), wherein the film member 120 is formed in an elongated shape, and the mounting portions 25 are arranged in a plurality of positions at predetermined intervals in the longitudinal direction of the film member 120. (8) An electroencephalogram measuring method for measuring electroencephalograms by attaching the electroencephalogram measuring device 10 according to any one of (1) to (7) to the head 99 of a subject.

[0179] This application claims priority based on Japanese Patent Application No. 2024-035555, filed March 8, 2024, the disclosure of which is incorporated herein in its entirety by reference.

[0180] REFERENCE SIGNS LIST 10 Electroencephalogram measuring device 20 Support member 21 Base material 22 Circuit pattern 23 Protective layer 24 Shield layer 25 Mounting portion 25a, 135b Female button terminal 25b, 125b Base portion 27 First pattern 28 Second pattern 29, 229 Opening 30 Electrode unit 31 Base portion 32 Protrusion portion 33 Conductive contact portion 34 Signal line portion 35, 125a Male button terminal 40 Ear attachment portion 50 Adjustment portion 60 Tension display portion 70 Mounting portion 235b Male screw terminal 326 Bolt

Claims

1. An electroencephalogram (EEG) measuring device comprising: an electrode unit that contacts a measurement site on a head of a subject to acquire an electroencephalogram; and a support member that supports the electrode unit, The support member is A film member; a mounting portion provided on the film member for mounting the electrode unit; and the electrode unit and the mounting portion are fixed by a detachable engagement structure, The electroencephalogram measuring device, wherein the film member is a single elongated member.

2. The electroencephalogram measuring device according to claim 1 , wherein the engagement structure comprises a female button portion provided with an opening in the mounting portion, and a male button portion provided on the electrode unit.

3. The electroencephalogram measuring device according to claim 1 , wherein the engagement structure has a male button portion provided on the mounting portion and a female button portion provided with an opening on the electrode unit.

4. The electroencephalogram measuring device according to claim 1 , wherein the engagement structure has an opening provided in the mounting portion and a bolt and nut structure for fastening the electrode unit to the opening.

5. 5. The electroencephalogram measuring device according to claim 2, wherein a plurality of the openings are provided corresponding to one electrode position, and the electrode unit is fixed to one opening selected from the plurality of openings.

6. The electroencephalogram measuring device according to claim 4 , wherein the opening is an elongated hole, and the position at which the electrode unit is fixed is adjustable.

7. An electroencephalogram measuring device as described in any one of claims 1 to 4, wherein the mounting portions are arranged in a row at a predetermined interval in the longitudinal direction of the film member.

8. An electroencephalogram measuring device described in any one of claims 1 to 4, wherein the film member is a flexible circuit board having a circuit pattern.

9. An electroencephalogram measuring method for measuring electroencephalograms by attaching the electroencephalogram measuring device according to any one of claims 1 to 4 to a subject.