Light source module, detection device, and terminal device

Abstract

The present application discloses a light source module, a detection device, and a terminal device for solving the problem of the center wavelength of a transmitted optical signal shifting due to temperature instability of the light source in a light source module of the prior art. The light source module and the device may be applied in fields such as autonomous driving, intelligent driving, or optical displays. The light source module includes a light source component configured to transmit an optical signal, a cooling component stacked with the light source component, and a storage structure, wherein the storage structure includes at least one first sidewall, and the at least one first sidewall accommodates at least a portion of the cooling component. The cooling component can be used to cool the heat of the light source component, and the storage component can be used to further weaken or block (i.e., stop) heat conduction to the light source component. Thus, the light source component can be maintained within a stable temperature range, and the light source component can further maintain a stable center wavelength and a stable light emission output.

Description

Technology Field

[0001] This application relates to the field of sensor technology, and in particular to light source modules, detection devices, and terminal devices. Background Technology

[0002] With the advancement of laser technology, devices utilizing laser technology, such as LiDAR systems and head-up devices (HUDs), are becoming increasingly widely used. Devices utilizing laser technology include laser light sources. The center wavelength of a laser light source shifts with changes in temperature. The center wavelength is the wavelength corresponding to the center position of the full width at half maxima (FWHM) of the spectrum obtained by measuring the laser light source at a specific temperature and rated output. FWHM can also be referred to as inverted width, half-width, half-peak width, or half-height width; it is the peak width at half the height of the spectral peak value—that is, the difference in wavelength obtained when the intensity on both sides of the spectral peak value decreases to half of the peak value. In this scenario, the temperature of the laser light source increases over time during operation. As the temperature of the laser light source rises, the center wavelength of the optical signal transmitted by the laser light source shifts toward longer wavelengths. Conversely, as the temperature of the laser light source decreases, the center wavelength of the optical signal transmitted by the laser light source shifts toward shorter wavelengths. Furthermore, the luminous output from the laser light source decreases as the temperature increases. Therefore, to obtain a stable center wavelength and emission output, it is important to improve the temperature stability of the laser light source during the packaging process. In particular, the requirements for temperature stability and reliability of the laser light source are higher when applying it to scenarios involving frequent temperature changes.

[0003] Therefore, improving the temperature stability of the laser light source is a technical challenge that needs to be urgently addressed.

[0004] The present application provides a light source module, a detection device, and a terminal device to improve the temperature stability of a light source component within a light source module.

[0005] According to a first aspect, the present application provides a light source module. The light source module includes a light source component, a cooling component, and a storage structure. The storage structure includes at least one first sidewall, and the at least one first sidewall accommodates at least a portion of the cooling component. The cooling component is laminated with the light source component.

[0006] It should be noted that the light source module may also be referred to as an optical module, a laser transmission module, etc.

[0007] Based on the light source module, a cooling component can be used to cool the heat of the light source component, and a storage component can be used to further weaken or block (i.e., stop) heat conduction to the light source component. Therefore, the light source component can be maintained within a stable temperature range, and the light source component can further maintain a stable center wavelength and stable luminous output.

[0008] Specifically, during the operation of the device in which the light source module is located, the light source component is configured to transmit a light signal, and the cooling component is configured to conduct heat from the light source component. The heat from the light source component may include, but is not limited to, heat generated by the operation of the light source component and / or heat from the environment in which the light source component is located and / or heat generated by structures surrounding the light source component. The first sidewall is configured to attenuate or block heat conducted to the light source component. The heat conducted to the light source component includes at least a portion of the return heat of the light source component.

[0009] In a possible implementation, the storage structure further includes a bottom plate, and the bottom plate contacts a first end of a first side wall. Additionally, optionally, the bottom plate and the first side wall may be in direct or indirect contact.

[0010] The first side wall may be supported by a bottom plate. The bottom plate and the first side wall together may form a structure that surrounds at least a portion of the cooling component.

[0011] In a possible implementation, the thermal conductivity of the bottom plate material is higher than the thermal conductivity of the first sidewall material.

[0012] A first sidewall formed of a material with low thermal conductivity can effectively weaken or block heat conduction to the light source component. Additionally, a bottom plate formed using a material with high thermal conductivity helps to further conduct heat from the light source component to the outside, that is, to improve the heat dissipation effect of the light source component.

[0013] Specifically, the thermal conductivity of the material of the first sidewall is less than a second threshold, where the second threshold is related to the cooling range of the cooling component and the heat returned by the first sidewall. Furthermore, it can be understood that the thermal conductivity of the material of the first sidewall can reduce the heat conducted to the light source component as much as possible. Even if a small amount of heat is conducted to the light source component, effective temperature control can be achieved by re-cooling the cooling component. Therefore, the light source component is within a stable temperature range.

[0014] Additionally, optionally, the material of the first side wall may be an insulating material and / or, or the material of the bottom plate may be a thermally conductive material.

[0015] The first side wall is formed using an insulating material, which can effectively block or attenuate heat conducted to the light source component. Heat from the light source component can be effectively dissipated through a bottom plate formed of a thermally conductive material.

[0016] For example, the material of the first side wall includes glass or acrylic, or a combination of both. The material of the bottom plate may include, but is not limited to, Kovar alloy, tungsten copper alloy, Invar, copper, etc.

[0017] In a possible implementation, the first sidewall is of a "strip" type, an "L" type (including a similar "L" type), or a similar type. If the first sidewall is of a "strip" type, the structure of the first sidewall is simple to manufacture, so it can be understood that the packaging of the light source module is simplified.

[0018] The following describes two exemplary methods for connecting the second end of the first side wall and the light source component.

[0019] Method 1: The second end of the first sidewall is connected to a light source component using structural adhesive, and the second end of the first sidewall is on the opposite side from the first end of the first sidewall.

[0020] The first sidewall and the light source component are connected using structural adhesive. This improves the strength of the light source module and can further increase the heat transferred from the light source component to the outside of the light source component.

[0021] Method 2: The second end of the first side wall is also connected to the light source component through welding.

[0022] The strength of the light source module is improved by welding the second end of the first side wall to the light source component.

[0023] In a possible implementation, the storage structure further includes at least one second sidewall, and at least one second sidewall accommodates at least a portion of the first sidewall. Additionally, optionally, at least one second sidewall may further accommodate at least a portion of a light source component.

[0024] The second sidewall helps to further reduce heat conduction to the light source component. Additionally, the second sidewall can be used to surround at least a portion of the first sidewall and can further surround at least a portion of the light source component.

[0025] Additionally, optionally, the second sidewall may be higher than the light source component or have the same height as the light source component. In this way, the second sidewall may also accommodate the light source component.

[0026] In a possible implementation, the bottom plate and the second side wall are formed integrally.

[0027] Based on this, the structure obtained by integrating the bottom plate and the second side wall can be referred to as a package housing. The first side wall, cooling components, and light source components can be packaged in the package housing.

[0028] In a possible implementation, the second sidewall is higher than the first sidewall.

[0029] If the second sidewall is set higher than the first sidewall, the second sidewall can accommodate as much of the first sidewall as possible. If the light source module additionally includes a shielding cover, the second sidewall helps prevent the shielding cover from coming into contact with the light source component.

[0030] Additionally, the shielding cover is optionally electrically connected to the bottom plate or the second side wall. In this way, electromagnetic radiation to the light source module can be shielded.

[0031] In a possible implementation, a thermally conductive adhesive is filled between the base plate and the support component, and the support component is configured to support the light source module; or a thermally conductive adhesive is filled between the base plate and the cooling component.

[0032] Thermally conductive adhesive is filled between the base plate and the support component and / or between the base plate and the cooling component. This helps to further enhance the heat dissipation effect of the light source component.

[0033] The support component may be a dedicated component that supports the light source module and dissipates heat from the light source module, for example, a thermally conductive support or a heat sink. Alternatively, the support component may be another structure located around the light source module that supports the light source module and dissipates heat from the light source module.

[0034] In another possible implementation, an opening is included in the base plate. The cooling component passes through the opening and comes into contact with the supporting component. Additionally, the cooling component may come into direct or indirect contact with the supporting component. For example, a thermally conductive adhesive is filled between the cooling component and the supporting component.

[0035] Since the cooling component is in contact with the support component, the cooling component can directly conduct heat from the light source component to the outside. This shortens the heat dissipation path and allows heat from the light source component to be effectively conducted from the light source component to the outside.

[0036] Additionally, structural adhesive is optionally filled between the non-open area of ​​the floor plate and the supporting component.

[0037] The strength of the light source module is enhanced by filling the space between the non-open area of ​​the base plate and the supporting component with structural adhesive.

[0038] In a possible implementation, the light source component includes a light source and a substrate, and the substrate drives the light source to transmit an optical signal.

[0039] In a possible implementation, the difference between any two of the coefficient of thermal expansion of the substrate, the coefficient of thermal expansion of the second sidewall, and the coefficient of thermal expansion of the first sidewall is smaller than a first threshold. Here, three coefficients of thermal expansion are applied by limiting the difference to be smaller than the first threshold. For example, the first threshold may be parts per million (ppm), where 1 ppm is one part per million.

[0040] In this way, the coefficients of thermal expansion of the first sidewall, the second sidewall, and the substrate can be adjusted. This helps prevent problems such as breakage or warping that occur at different temperatures and are caused by the difference in the coefficients of thermal expansion between the first sidewall, the substrate, and the second sidewall.

[0041] In possible implementations, the light source includes a laser diode. Laser diodes have advantages such as high efficiency, small size, and a long lifespan.

[0042] According to a second aspect, the present application provides a detection device. The detection device includes a light source module in either the first aspect or an implementation of the first aspect.

[0043] In a possible implementation, the detection device may further include a receiving module configured to receive an echo signal corresponding to a light signal, wherein the echo signal is used to obtain association information of a target detected by the detection device.

[0044] For example, the detection device may be a LiDAR device. Additionally, optionally, the associated information of the target may include, but is not limited to, the distance information of the target, the orientation of the target, the velocity of the target, and / or grayscale information of the target.

[0045] In another possible implementation, the detection device may further include an image acquisition module configured to acquire image information.

[0046] For example, the detection device can be a fusion sensor. A fusion sensor is a sensor that integrates the functions of a LiDAR device and a camera.

[0047] According to a third embodiment, the present application provides a terminal device. The terminal device includes a detection device in either the second embodiment or an implementation of the second embodiment.

[0048] Additionally, optionally, the terminal device may further include a processor configured to plan a driving path based on the association information and / or image information of the target.

[0049] In possible implementations, terminal devices may include, but are not limited to, vehicles (e.g., unmanned vehicles, intelligent vehicles, electric vehicles, or digital vehicles), robots, surveying and mapping devices, unmanned aerial vehicles, smart home devices (e.g., robot vacuums), smart manufacturing devices (e.g., industrial devices), smart transport devices (e.g., automated guided vehicles (AGVs), unmanned transport vehicles, or trucks).

[0050] According to a fourth aspect, the present application provides an optical display device. The optical display device includes a light source module in either the first aspect or an implementation of the first aspect.

[0051] For example, optical display devices may include, but are not limited to, in-vehicle displays, head-up devices (HUDs), near-eye display (NED) devices, projectors, and smart home devices (e.g., smart desk lamps, sound systems, smart lighting systems, electrical appliance control systems, home background music, home theater systems, intercom systems, or video monitors). Brief explanation of the drawing

[0052] FIG. 1a is a schematic diagram of a possible application scenario according to the present application; FIG. 1b is a schematic diagram of another possible application scenario according to the present application; FIG. 1c is a schematic diagram of another possible application scenario according to the present application; FIG. 1d is a schematic diagram of another possible application scenario according to the present application; FIG. 1e is a schematic diagram of another possible application scenario according to the present application; FIG. 1f is a schematic diagram of an additional possible application scenario according to the present application; FIG. 2 is a schematic diagram of the structure of a light source module according to the present application; FIG. 3 is a schematic diagram illustrating the cooling principle of a TEC according to the present application; FIG. 4a is a schematic diagram of the structure of a storage structure according to the present application; FIG. 4b is a schematic diagram of the structure of another storage structure according to the present application; FIG. 4c is a schematic diagram of the structure of another storage structure according to the present application; FIG. 4d is a schematic diagram of the structure of another storage structure according to the present application; FIG. 4e is a schematic diagram of the structure of another storage structure according to the present application; FIG. 4f is a schematic diagram of the structure of an additional storage structure according to the present application; FIG. 4g is a schematic diagram of the structure of another additional storage structure according to the present application; FIG. 5a is a schematic diagram showing the positional relationship between the first side wall and the bottom plate according to the present application; FIG. 5b is a schematic diagram showing the positional relationship between the first sidewall, the light source component, and the bottom plate according to the present application; FIG. 5c is a schematic diagram showing different positional relationships between a first sidewall, a light source component, and a bottom plate according to the present application; FIG. 6a is a schematic diagram showing the positional relationship between a bottom plate and a cooling component according to the present application; FIG. 6b is a schematic diagram showing a different positional relationship between a bottom plate and a cooling component according to the present application; FIG. 7a is a schematic diagram of the structure of another storage structure according to the present application; FIG. 7b is a schematic diagram of the structure of another additional storage structure according to the present application; FIG. 8 is a schematic diagram of the structure of a shielding cover and a storage structure according to the present application; FIG. 9 is a schematic diagram of the structure of another light source module according to the present application; FIG. 10 is a schematic diagram of the structure of another light source module according to the present application; FIG. 11 is a schematic diagram of the structure of a lidar device according to one embodiment of the present application. FIG. 12 is an exemplary functional block diagram of a vehicle according to the present application. Specific details for implementing the invention

[0053] The following describes embodiments of the present application in detail with reference to the attached drawings.

[0054] Some terms of this application are described below. It should be noted that while the description is intended to aid the understanding of those skilled in the art, it does not constitute a limitation on the scope of protection claimed in this application.

[0055] 1. Thermal conductivity

[0056] Thermal conductivity, also known as the thermal conductivity coefficient or thermal conductivity, is a physical quantity that represents a material's ability to conduct heat.

[0057] 2. Coefficient of thermal expansion (CTE)

[0058] The coefficient of thermal expansion is a physical quantity that indicates the degree of thermal expansion of a material, and generally refers to the relative change in length or size of an object of unit length or unit size when the temperature rises by 1°C.

[0059] 3. Insulation materials

[0060] Insulating materials are materials that can block or reduce heat transfer, and are also called thermal insulation materials.

[0061] Several terms used in this application have been explained above, and the following describes possible application scenarios of this application.

[0062] It should be noted that in this application, the light source module may also be referred to as an optical module, a laser transmission module, etc. All modules, including the functional components and structures of this application, fall within the scope of protection of this application. It should be understood that the term "light source module" is merely an exemplary term.

[0063] In possible application scenarios, the light source module of the present application may be integrated into a LiDAR device, and the LiDAR device may be installed in a vehicle. For example, the vehicle may be an unmanned vehicle, an intelligent vehicle, an electric vehicle, or a digital vehicle. The LiDAR device may be deployed at various locations on the vehicle. For example, the LiDAR device may be deployed in one or more of the four directions of the vehicle—front, rear, left, and right—to capture information about the surrounding environment of the vehicle. FIG. 1a illustrates an example where the LiDAR device is deployed in front of the vehicle. The LiDAR device can detect a fan-shaped area indicated by the dotted box in FIG. 1a, and this fan-shaped area may be referred to as the LiDAR detection area. The principle of target detection by the LiDAR device is as follows: The LiDAR device transmits an optical signal in a specific direction. If a target is present in the detection area of ​​the LiDAR device, the target reflects the received optical signal back to the LiDAR device (the reflected light may be referred to as an echo signal), and then the LiDAR device determines information about the target based on the echo signal. A LiDAR device can acquire information regarding the vehicle's latitude, longitude, speed, and direction, or targets within a specific range (e.g., other surrounding vehicles or obstacles) in real-time or periodically, based on optical signals transmitted by the device. Based on this information, the LiDAR device or the vehicle can determine the vehicle's location and perform path planning. For example, it can determine the vehicle's location based on longitude and latitude, determine the vehicle's driving direction and future destination based on speed and direction, or determine the quantity and density of obstacles around the vehicle based on the distances to surrounding objects. Additionally, driverless driving, autonomous driving, assisted driving, and intelligent driving can be implemented optionally depending on the functions of an Advanced Driving Assistant System (ADAS).

[0064] It should be noted that the LiDAR device mounted on a vehicle in the preceding description is merely an example. For instance, a LiDAR device can be deployed as an airborne radar on an unmanned aerial vehicle. As another example, a LiDAR device can be installed in a roadside unit (RSU) as a roadside traffic LiDAR device to implement intelligent vehicle-road collaborative communication. As yet another example, a LiDAR device can be installed on an automated guided vehicle (AGV). An AGV is a transport vehicle equipped with an automatic navigation system, such as an electronic navigation system or an optical navigation system, that moves along a predetermined navigation path and can implement security protection and various transport functions.

[0065] In other possible application scenarios, the light source module of the present application may be integrated into a head-up device (HUD). Refer to FIG. 1b. FIG. 1b illustrates an example in which a HUD is installed in a vehicle. The HUD can project a formed image (referred to as the HUD virtual image) into the driver's field of vision ahead. This image is fused with actual road surface information to enhance the driver's perception of the actual driving environment. For example, the HUD virtual image containing navigation information and / or instrument information (e.g., vehicle speed, rotational speed, temperature, fuel level) can be superimposed on the actual environment outside the vehicle to allow the driver to obtain an augmented reality visual effect. In particular, the HUD can be applied to scenarios such as augmented reality (AR) navigation, adaptive cruise, and lane departure warning. The HUD includes, but is not limited to, a windshield (W)-HUD and an augmented reality head-up display (AR-HUD).

[0066] There is also another possible implementation of integrating the light source module of the present application into an in-vehicle display. Refer to FIG. 1c. The in-vehicle display may be installed on the seat back of the vehicle or at the position of the passenger seat, etc. In the present application, the installation location of the in-vehicle display is not limited.

[0067] In another possible application scenario, the light source module of the present application may be integrated into a near-eye display (NED) device. For example, the NED device may be an AR device or a virtual reality (VR) device. An AR device may include, but is not limited to, AR glasses or an AR helmet, and a VR device may include, but is not limited to, VR glasses or a VR helmet. Refer to FIG. 1d. Let AR glasses be taken as an example. A user may wear an AR glasses device for gaming, watching videos, virtual meetings, video shopping, telemedicine, or remote education. Other scenarios are not listed herein.

[0068] In another possible application scenario, the light source module of the present application may be integrated into a projector. Refer to FIG. 1e. The projector can project an image onto a wall or a projection screen.

[0069] It should be understood that the application scenarios mentioned above are merely examples, and that the light source module is applicable to any scenario where there are high requirements for the stability of the light source temperature. For example, the light source module provided in this application can be additionally applied as a backlight source to a display. Refer to FIG. 1f. For example, the light source module can also be applied to beauty medical devices, etc.

[0070] As explained in the background, the center wavelength of the optical signal emitted by the light source in conventional light source modules shifts with temperature changes. Additionally, the luminous output of the light source decreases as the temperature increases.

[0071] With this in mind, the present application provides a light source module. The light source module can maintain the light source of the light source module within a stable temperature range. This helps to improve the stability of the light emission output of the light source module and the center wavelength of the transmitted light signal.

[0072] Based on the foregoing, the light source module provided in the present application will be described in detail below with reference to FIGS. 2 to 10.

[0073] FIG. 2 is a schematic diagram of the structure of a light source module according to one embodiment of the present application. The light source module may include a light source component (201), a cooling component (202), and a storage structure (203). The storage structure (203) includes at least one first side wall (2031). The first side wall (2031) accommodates at least a portion of the cooling component (202). It should be noted that in the present application, "accommodates" means that the first side wall (2031) is positioned on the outer periphery (or referred to as the outer side) of the cooling component (202).

[0074] In a possible implementation, the light source component (201) and the cooling component (202) are laminated. Additionally, it may be understood that the contact between the light source component (201) and the cooling component (202) may be direct contact or indirect contact. For example, indirect contact may mean that a sandwich structure is placed or that a thermally conductive adhesive (or referred to as thermal adhesive) is filled between the light source component (201) and the cooling component (202). In the following description, 'contact' may be understood as direct contact or indirect contact. The thermally conductive adhesive may also be referred to as thermal adhesive, thermally conductive silica gel, thermally conductive silicone rubber, thermally conductive silicone adhesive, or thermally conductive silicone. Organic silica gel is the main material of the thermally conductive adhesive. The thermally conductive adhesive is obtained by adding and mixing polymeric materials, such as fillers and thermally conductive materials, to organic silica gel. The thermally conductive adhesive has excellent thermal conductivity and electrical insulation performance.

[0075] In a possible implementation, the first side wall (2031) may be in contact with the cooling component (202), or there may be a specific gap between the first side wall (2031) and the cooling component (202). FIG. 2 illustrates an example in which there is a specific gap between the first side wall (2031) and the cooling component (202). It can be understood that the smaller the gap between the first side wall (2031) and the cooling component (202), the better the effect of blocking heat conduction to the light source component (201) by the first side wall (2031). That is, when the structure of the cooling component (202) is fixed, the larger the width (L) of the first side wall (2031), the better the effect of blocking heat conduction to the light source component (201) by the first side wall (2031).

[0076] In the example of FIG. 2, it should be noted that the storage structure (203) includes two first side walls (2031), and the two first side walls (2031) are located on both sides of the cooling component (202). The number of first side walls (2031) included in the storage structure (203) is not limited in this application.

[0077] Based on the aforementioned light source module, a cooling component can be used to cool the heat of the light source component, and a storage component can be used to further weaken or block (i.e., stop) heat conduction to the light source component. Thus, the light source component can be maintained within a stable temperature range, and the light source component can further maintain a stable center wavelength and stable light emission output.

[0078] The following provides an example of a specific implementation by separately describing each functional component and structure illustrated in FIG. 2. For convenience of explanation, the light source component, cooling component, and storage structure are not numbered below.

[0079] 1. Light source components

[0080] In a possible implementation, the light source component may include a light source and a substrate. Specifically, the light source is positioned on the substrate, which may also be understood as the light source and the substrate being stacked. The substrate drives the light source to emit an optical signal.

[0081] For example, the light source may be a semiconductor laser, and the semiconductor laser may include, but is not limited to, a laser diode (LD). Laser diodes have advantages such as high efficiency, small size, and a long lifespan. Specifically, for example, the light source may be a vertical cavity surface emitting laser (VCSEL), an edge emitting laser (EEL), or a diode-pumped solid-state laser (DPSS). The substrate may be a ceramic substrate or a printed circuit board (PCB).

[0082] It can be understood that a light source generates a large amount of heat during operation, which can cause temperature changes in the light source, or that temperature changes in the light source can be caused by temperature changes in the environment of the light source module. At different temperatures, the center wavelength of the light signal emitted from the light source differs. For example, temperature The center wavelength of the optical signal emitted by a light source at T1℃ is The center wavelength of the optical signal emitted by a light source at a temperature T2℃ is λ1, where λ1 and λ2 may differ. To stabilize the center wavelength of the optical signal output from the light source, effective heat dissipation must be performed from the light source.

[0083] 2. Cooling Components

[0084] In possible implementations, the cooling component may be, for example, a thermoelectric cooler (TEC). Thermoelectric coolers are based on the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon where, when a direct current flows through a dipole composed of two semiconductor materials, one end absorbs heat and the other end releases heat. The semiconductor materials of TECs primarily include highly doped N-type and P-type bismuth tellurides.

[0085] FIG. 3 is a schematic diagram illustrating the cooling principle of a TEC according to the present application. The TEC includes a pair (set) of P-type semiconductors and N-type semiconductors connected together by electrodes. The pair of P-type semiconductors and N-type semiconductors is sandwiched between two ceramic electrodes. When current flows through the TEC, heat generated by the current is transferred from one side of the TEC to the other. In this case, a "hot" end and a "cold" end are formed in the TEC.

[0086] In a possible implementation, the "cold" end of the TEC is configured to contact the light source module and conduct heat generated from the light source module to the "cold" end of the TEC to dissipate the heat from the light source module. Additionally, the light source module may be in direct or indirect contact with the "cold" end of the TEC. For example, a thermally conductive adhesive or other heat-conducting sandwich structure is filled between the light source module and the "cold" end of the TEC.

[0087] It should be noted that the aforementioned TEC is a possible example of a cooling component. In this application, the specific structure of the cooling component is not limited. Any structure capable of conducting heat from a light source component may be referred to as a cooling component.

[0088] 3. Storage structures

[0089] In a possible implementation, the storage structure may include at least one first sidewall. The first sidewall may accommodate a portion of the cooling component and may be configured to weaken or block heat conduction to the light source component.

[0090] Additionally, optionally, the first sidewall may be "strip" shaped and may also be "straight" shaped. Alternatively, the first sidewall may be "L-shaped," wherein the "L-shaped" shape may include, but is not limited to, a regular "L-shaped" shape or an irregular "L-shaped" shape (which may be referred to as a pseudo-"L-shaped"), for example, an "L-shaped" shape having an arc. Alternatively, the first sidewall may be "Γ" shaped, etc. In this application, the specific shape of the first sidewall is not limited. Since the structure of the "strip" shaped first sidewall is simple to manufacture, the packaging of the light source module is simplified.

[0091] For example, the storage structure comprises two first side walls. Specifically, the two first side walls of the "strip" type may be parallel (see FIG. 4a), or the two first side walls may be vertical (see FIG. 4b), and there may be a specific gap between the two vertical side walls, or the two side walls may be in contact. This is not limited in this application. Alternatively, there may be a specific indentation between the two side walls (see FIG. 4c or FIG. 4d). The two side walls with a specific indentation may be in contact or there may be a specific gap. This is not limited in this application. It should be noted that the positional relationship between the two first side walls provided above is merely illustrative and the positional relationship between the two first side walls is not limited in this application.

[0092] For example, the storage structure includes two first side walls. Specifically, two first side walls of an "L" shape or a pseudo-"L" shape may form a "square" shape with an opening (see FIG. 4e or FIG. 4f). The area of ​​the opening may be used for the passage of optical signals, etc. As another example, two first side walls of a "Λ" shape may form a "square" shape with an opening (see FIG. 4g).

[0093] It should be noted that in this application, the number of first sidewalls included in the storage structure is not limited. The foregoing description is merely a possible example in which the storage structure includes two first sidewalls.

[0094] For example, the first sidewall is of the “strip” type, and one first sidewall can accommodate one side of the cooling component. For example, the first sidewall is of the “strip” type. Two first sidewalls can accommodate both sides of the cooling component, and in particular, they may be opposing sides (see FIG. 4a or FIG. 4c) or connected sides (see FIG. 4b or FIG. 4d).

[0095] To easily explain the solution, an example is used below where the first sidewall is "strip" type and the storage structure includes two first sidewalls.

[0096] In a possible embodiment, the storage structure further includes a bottom plate. FIG. 5a is a schematic diagram illustrating the positional relationship between the first sidewall and the bottom plate according to the present application. The bottom plate contacts the first ends of the two first sidewalls individually. It can be understood that the first sidewalls may contact the bottom plate directly. Alternatively, the first sidewalls may contact the bottom plate indirectly. For example, a structural adhesive or other insulating sandwich structure is filled between the bottom plate and the first sidewalls. It should be noted that in actual product design, the bottom plate may or may not belong to the light source module. If the bottom plate does not belong to the light source module, a structure similar to the bottom plate and corresponding to the light source module described above may be present in the product. A structure similar to the bottom plate may have other functions in addition to corresponding to the light source module, and is referred to uniformly as the 'bottom plate' here. The light source module and the bottom plate may be collectively referred to as the optical module. It should be noted that structural adhesives are generally adhesives characterized by high strength (e.g., compressive strength of 65 megapascals (MPa) or more, steel-to-steel bonding strength of 30 MPa or more, shear strength of 18 MPa or more), high load capacity, resistance to aging, fatigue resistance, corrosion resistance, and stable performance within the expected life cycle.

[0097] Additionally, optionally, the second end of the first sidewall is connected to a light source component. Refer to FIG. 5b for details. In a possible manner, the second end of the first sidewall is connected to the light source component using structural adhesive, and the second end of the first sidewall faces the first end of the first sidewall. According to this connection method, the first sidewall and the light source component are connected using structural adhesive. This can improve the strength of the light source module and further increase the heat of the light source component transferred to the outside of the light source component. In another possible manner, the second end of the first sidewall is connected to the light source component through welding. By welding the second end of the first sidewall to the light source component, the strength of the light source module is improved.

[0098] In a possible implementation, the first sidewall may be a single-layer wall (as shown in FIG. 5b) or a multi-layer wall as shown in FIG. 5c. FIG. 5c illustrates an example where the first sidewall is a two-layer wall. It should be noted that in this application, the number of layers of the first sidewall included in the storage structure is not limited. It can be seen that the more layers of the first sidewall, the thicker the first sidewall becomes, and the better the effect of blocking heat conduction to the light source component by the first sidewall.

[0099] In a possible implementation, the thermal conductivity of the material of the base plate is higher than the thermal conductivity of the material of the first side wall. The first side wall formed of a material with low thermal conductivity can effectively weaken or block heat conduction to the light source component. Additionally, the base plate formed using a material with high thermal conductivity helps to further conduct heat from the light source component to the outside, thereby improving the heat dissipation effect for the light source component.

[0100] Additionally, optionally, the thermal conductivity of the material of the first sidewall is less than a second threshold, where the second threshold is related to the cooling range of the cooler and the heat returned by the first sidewall. Furthermore, the second threshold must satisfy the requirement that the temperature control effect of the TEC should not exceed the target range due to the heat returned to the light source component through the first sidewall. Additionally, it can be understood that the thermal conductivity of the material of the first sidewall can reduce the heat conducted to the light source component as much as possible. Even if a small amount of heat is conducted to the light source component, effective temperature control can be achieved through the re-cooling of the cooling component. Thus, the light source component remains within a stable temperature range.

[0101] Specifically, the material of the first sidewall may be an insulating material and / or, or the material of the bottom plate may be a thermal conductive material. For example, the material of the first sidewall may include glass or acrylic or a combination thereof, but is not limited thereto. The material of the bottom plate may include any one or any combination of Kovar alloy, tungsten copper alloy, Invar, copper, etc., but is not limited thereto.

[0102] It should be noted that the materials of the first sidewall and the bottom plate are merely examples. In this application, there are no limitations on the materials of the first sidewall and the bottom plate. The material used in the bottom plate to conduct heat from the light source component to the outside and / or the material used in the first sidewall to weaken or block heat conduction to the light source component falls within the scope of protection of this application.

[0103] Depending on whether the bottom plate includes an opening, the following shows two possible positional relationships between storage structures and cooling components in different cases.

[0104] Case 1: The floor plate includes an opening.

[0105] FIG. 6a is a schematic diagram showing the positional relationship between a base plate and a cooling component according to the present application. The base plate has an opening through which the cooling component can pass. Additionally, it can be understood that the cooling component can pass through the opening of the base plate and come into contact with a supporting component. Furthermore, a thermally conductive adhesive is filled between the cooling component and the supporting component. Since the cooling component passes through the opening, the heat dissipation path can be shortened. This helps to improve the temperature stability of the light source component.

[0106] Case 2: No opening in the floor plate.

[0107] FIG. 6b is a schematic diagram showing another positional relationship between a base plate and a cooling component according to the present application. The base plate may come into contact with the cooling component. To further enhance the heat dissipation effect of the light source component, a thermally conductive adhesive is filled between the base plate and the cooling component.

[0108] In a possible implementation, the storage structure further includes at least one second sidewall. At least one second sidewall accommodates at least a portion of the first sidewall. Refer to FIG. 7a. For example, the storage structure has two second sidewalls. The storage structure includes two second sidewalls (second sidewall A and second sidewall B) and two first sidewalls (first sidewall A and first sidewall B). Second sidewall A accommodates first sidewall A, and second sidewall B accommodates first sidewall B.

[0109] It should be noted that the first sidewall may be in contact with the second sidewall, or it may not be in contact with the second sidewall. When the first sidewall is not in contact with the second sidewall, the return heat passing through the second sidewall can be understood as being dissipated through the air. In this case, the effect of blocking heat conduction to the light source component by the first sidewall is further enhanced.

[0110] FIG. 7b is a schematic diagram of the structure of another storage structure according to one embodiment of the present application. The storage structure may include a first side wall, a second side wall, and a bottom plate. A first end of the first side wall contacts the bottom plate, and a first end of the second side wall also contacts the bottom plate. In a possible embodiment, the bottom plate and the second side wall may be formed integrally. The integrated structure formed by the second side wall and the bottom plate may be referred to as a package housing, and the first side wall and the cooling component may be packaged in the package housing.

[0111] In a possible implementation, the second sidewall is higher than the first sidewall. Additionally, since the second sidewall may be higher than the light source component or have the same height as the light source component, the second sidewall may further include the light source component. Additionally, it may be understood that the light source component may be packaged in a package housing. Refer to FIG. 8.

[0112] In a possible implementation, the material of the second sidewall may include, but is not limited to, any one or any combination of, Kovar alloy, tungsten-copper alloy, Invar, copper, etc.

[0113] In a possible implementation, there is a gap between the second sidewall and the substrate of the light source component, and the width of the gap is, for example, 0.5 millimeters (mm) or more. In this way, heat conduction to the light source component can be further blocked or weakened. Additionally, space is provided for the thermal expansion of the substrate and the second sidewall.

[0114] In a possible implementation, the difference between any two of the coefficient of thermal expansion of the substrate of the light source component, the coefficient of thermal expansion of the second sidewall, and the coefficient of thermal expansion of the first sidewall is smaller than a first threshold value. For example, the first threshold value may be 10 ppm. For details, please refer to the displacement tolerance of the substrate. In this way, the coefficients of thermal expansion of the first sidewall, the second sidewall, and the substrate can be adjusted. This helps prevent problems such as breakage or warping that occur at different temperatures and are caused by the difference between the coefficients of thermal expansion of the first sidewall, the substrate, and the second sidewall. It should be noted that it is desirable for the coefficients of thermal expansion of the first sidewall, the substrate, and the second sidewall to be close.

[0115] Additionally, optionally, the light source module may further include a shielding cover (see FIG. 8), and the shielding cover is electrically connected to the bottom plate or the second end of the second side wall. In this way, electromagnetic radiation to the light source module can be shielded.

[0116] In a possible implementation, a component that supports a light source module and dissipates heat from the light source component may be referred to as a support component. The support component may be a dedicated component that supports the light source module and dissipates heat from the light source module, for example, a thermally conductive support. Alternatively, the support component may be another structure surrounding the light source module capable of supporting the light source module and dissipating heat from the light source module. Additionally, it is understood that the support component is used to dissipate heat from the light source module so that the light source maintains a stable temperature.

[0117] Based on Example 1 described above, a thermally conductive adhesive is filled between the cooling component and the support component, and a structural adhesive is filled between the non-open area of ​​the base plate and the support component. Refer to Fig. 6a for details. Since the thermally conductive adhesive is filled between the cooling component and the support component, the cooling component can effectively conduct heat from the light source component to the outside. The structural adhesive is filled between the non-open area of ​​the base plate and the support component. This helps improve the strength of the light source module.

[0118] Based on the aforementioned Example 2, a thermally conductive adhesive may be filled between the base plate and the support component (see Fig. 6b) to further enhance the heat dissipation effect of the light source component.

[0119] In other possible implementations, the component used to dissipate heat conducted by the light source component (i.e., conduct heat from the light source module to the outside of the light source module) may be a heat sink. A heat sink is any object capable of dissipating heat from the light source component, and the temperature of the heat sink does not change depending on the amount of heat transferred to the heat sink. The heat sink may include, but is not limited to, objects such as the atmosphere and the ground, and may include copper pillars with high thermal conductivity.

[0120] Based on the foregoing, two specific implementations of the aforementioned light source module are provided below to further understand the structure of the light source module and the process of heat dissipation implementation. Unless otherwise noted or logical conflicts arise, the functional components and structure described above can be combined according to their internal logical relationships to form other possible ion trap systems. The specific implementations of the two light source modules provided below are merely examples.

[0121] FIG. 9 is a schematic diagram of the structure of another light source module according to one embodiment of the present application. The light source module may include a light source (901), a substrate (902), a cooling component (903), and a storage structure (904) (identifiers are not shown in the drawing). For example, the storage structure (904) includes two first side walls (9041). Additionally, the light source (901), the substrate (902), and the cooling component (903) are stacked. Additionally, optionally, the storage structure (904) may further include a bottom plate (9042). The two first side walls (9041) and the bottom plate (9042) accommodate the cooling component (903). Specifically, the first end of the first side wall (9041) contacts the bottom plate (9042) (the contact may be direct or indirect contact). The second end of the first side wall (9041) is connected to the substrate (902) using structural adhesive. Thermally conductive adhesive is filled between the cooling component (903) and the bottom plate (9042), and thermally conductive adhesive is also filled between the bottom plate (9042) and the support component.

[0122] Additionally, optionally, the storage structure (904) may further include a second side wall (9043), and the first end of the second side wall (9043) contacts the bottom plate. For example, two second side walls (9043) and the bottom plate (9042) are formed integrally, and the structure obtained through integration can be referred to as a package housing.

[0123] Additionally, optionally, the light source module may further include a shielding cover (905), and the shielding cover (905) is electrically connected to the second end of the second side wall (9043).

[0124] For a detailed description of the functional components and structure of Fig. 9, please refer to the relevant descriptions given earlier. Further details are not described here.

[0125] According to FIG. 9 described above, the direction of heat conduction of the light source (901) can be indicated by an arrow. Heat conduction mainly includes heat conduction in the heat dissipation path and heat conduction in the return path. In the heat dissipation path, heat from the light source (901) passes through the substrate (902), the cooling component (903), and the thermally conductive adhesive, and is then transferred to the support component. The support component dissipates heat from the light source module in all directions, and the direction of heat conduction for a portion of the heat is the direction of the light source (902). In the return path, heat conduction to the light source can be effectively blocked by the first sidewall (9041). This helps maintain the temperature stability of the light source. It can be understood that the lower the heat in the return path, the lower the heat conduction to the light source and the higher the reliability of the light source module.

[0126] It should be noted that in the heat dissipation path, thermally conductive adhesives are used for connecting or joining structures to ensure excellent heat dissipation. In the return path, structural adhesives are used for connecting or joining structures to ensure bond strength.

[0127] FIG. 10 is a schematic diagram of the structure of another light source module according to one embodiment of the present application. The light source module may include a light source (1001), a substrate (1002), a cooling component (1003), and a storage structure (1004) (identifiers are not shown in the drawing). For example, the storage structure (1004) includes two first side walls (10041). Additionally, the light source (1001), the substrate (1002), and the cooling component (1003) are stacked. Additionally, optionally, the storage structure (1004) further includes a bottom plate (10042), wherein the bottom plate (10042) includes an opening. The cooling component (1003) passes through the opening of the bottom plate (10042) and contacts a support component. Additionally, optionally, a thermally conductive adhesive is filled between the support component and the cooling component (1003) passing through the opening of the bottom plate (10042). Additionally, optionally, structural adhesive is filled between the non-open area of ​​the base plate and the supporting component. The first end of the first side wall (10041) contacts the base plate (10042), and the second end of the first side wall (10041) is connected to the substrate (1002) using structural adhesive.

[0128] Additionally, optionally, the storage structure (1004) may further include a second side wall (10043), and the first end of the second side wall (10043) contacts the bottom plate. For example, two second side walls (10043) and the bottom plate (10042) are formed integrally, and the structure obtained through integration can be referred to as a package housing.

[0129] Additionally, optionally, the light source module may further include a shielding cover (1005), and the shielding cover (1005) is electrically connected to a second end of the second side wall (10043).

[0130] For a detailed description of the functional components and structure of Fig. 10, please refer to the related descriptions given earlier. Further details are not described here.

[0131] Based on the light source module shown in Fig. 10, the cooling component can directly conduct heat from the light source to the support component using a thermally conductive adhesive. Because the heat dissipation path is short, the effect of conducting heat from the light source to the support component can be further enhanced.

[0132] It should be understood that the shapes of the structural adhesive and thermally conductive adhesive shown in the attached drawings in the aforementioned embodiments are merely examples and are not limited to the present application.

[0133] Based on the structural and functional principles of the light source module described above, the present application may further provide a detection device. The detection device may include a light source module in any of the embodiments described above. That is, the light source module provided in the embodiments of the present application may be used in any detection device necessary for controlling the temperature stability of the light source in the light source module.

[0134] In a possible implementation, the detection device may further include another module, for example, a receiving module, configured to receive an echo signal corresponding to a light signal, wherein the echo signal is used to obtain association information of a target detected by the detection device.

[0135] Example 1: The detection device may be a LiDAR device. FIG. 11 is a schematic diagram of the structure of a LiDAR device according to one embodiment of the present application. The LiDAR device may include a light source module (1101) and a receiving module (1102) in any one of the aforementioned embodiments. Additionally, optionally, the LiDAR device may further include a processing module (1103). The light source module (1101) is configured to transmit a light signal to a detection area, and the light signal is transmitted by a target in the detection area to obtain an echo signal. The receiving module (1102) is configured to receive the echo signal. Additionally, optionally, the receiving module (1102) is configured to perform an optical-to-electrical conversion on the echo signal to obtain an electrical signal used to determine association information of the target. Additionally, the receiving module (1102) transmits the electrical signal to the processing module (1103). The processing module (1103) can determine association information of the target based on the received electrical signal. The associated information of the target may include, but is not limited to, the target's distance information, the target's direction, the target's speed, and / or the target's grayscale information.

[0136] In a possible implementation, the receiving module may include an optical receiving lens and may further include a detector. The optical receiving lens is used to collect as much echo signal as possible and transmit the collected echo signal to the detector. The optical receiving lens includes at least one lens. The lens of the optical receiving lens may be a single spherical lens, a combination of multiple spherical lenses (e.g., a combination of concave lenses, a combination of convex lenses, or a combination of convex and concave lenses), a single aspherical lens, or a combination of multiple aspherical lenses. A combination of multiple spherical lenses and / or aspherical lenses helps improve the image quality of the lidar device and reduce aberrations of the lidar device. It can be understood that convex and concave lenses may be of various types. For example, convex lenses include biconvex lenses, planoconvex lenses, and meniscus lenses, and concave lenses include biconvex concave lenses, planoconcave lenses, and meniscus lenses.

[0137] Additionally, optionally, the lens material of the optical receiving lens may be an optical material such as glass, resin, or crystal. If the lens material is resin, the weight of the lidar device can be reduced. If the lens material is glass, the image quality of the lidar device can be further improved. Furthermore, to effectively suppress thermal drift, the optical lens includes at least one lens made of glass material.

[0138] In possible implementations, the detector may include, but is not limited to, a single-photon avalanche diode (SPAD) array, a digital silicon photomultiplier (SiPM) array, an avalanche photodiode (APD), etc.

[0139] In a possible implementation, the processing module may include one or more processing units. The processing units may be, for example, a central processing unit (CPU) or other general-purpose processor, a field programmable gate array (FPGA), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a controller, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. The general-purpose processor may be a microprocessor or any conventional processor. Different processing units may be independent components or may be integrated into one or more processors.

[0140] It should be noted that the structure of the lidar device described above is merely an example. As another possible example, the lidar device may include a greater or lesser number of modules, and each module may include a greater or lesser number of components.

[0141] Example 2: The detection device may be a fusion sensor. The fusion sensor may have the functions of the LiDAR device and camera described earlier. In a possible implementation, the fusion sensor may further include an image acquisition module for obtaining image information.

[0142] It should be noted that the two examples of detection devices described above are used merely to facilitate the explanation of the solution. The specific form and name of the detection device are not limited in this application.

[0143] Based on the structural and functional principles of the detection device described above, the present application may further provide a terminal device. The terminal device may include a detection device in any of the embodiments described above. Additionally, optionally, the terminal device may further include a processor configured to plan a driving path based on association information and / or image information of a target.

[0144] For example, terminal devices may include, but are not limited to, vehicles (e.g., unmanned vehicles, intelligent vehicles, electric vehicles, or digital vehicles), robots, surveying and mapping devices, unmanned aerial vehicles, smart home devices (e.g., robot vacuums), smart manufacturing devices (e.g., industrial devices), smart transport devices (e.g., automated guided vehicles (AGVs), unmanned transport vehicles, or trucks), ships, etc.

[0145] The following describes a functional block diagram of a vehicle equipped with (i.e., integrated with) a detection device, using a vehicle as an example. In the vehicle's structure, the detection device can be referred to as a sensor system.

[0146] FIG. 12 is an exemplary functional block diagram of a vehicle according to the present application. Components coupled to or included in the vehicle (1200) may include a propulsion system (110), a sensor system (120), a control system (130), a peripheral device (140), a power supply (150), a computer system (160), and a user interface (170). Components of the vehicle (1200) may be configured to be interconnected with other components coupled to various systems for operation. For example, the power supply (150) may supply power to all components of the vehicle (1200). The computer system (160) may be configured to receive data from the propulsion system (110), the sensor system (120), the control system (130), and the peripheral device (140) and to control them. The computer system (160) may be further configured to display images generated in the user interface (170) and to receive input from the user interface (170).

[0147] The propulsion system (110) drives the movement of the vehicle (1200). The propulsion system (110) may include an engine / motor (114), an energy source (113), a transmission device (112), and wheels / tires (111). Additionally, the propulsion system (110) may include additional or alternative components other than those shown in FIG. 11. This is not specifically limited in the present application.

[0148] The sensor system (120) may include multiple sensors for detecting information about the environment of the vehicle (1200). For example, the sensors of the sensor system (120) may include, but are not limited to, a Global Positioning System (GPS) (126), an Inertial Measurement Unit (IMU) (125), a millimeter-wave radar (124), a lidar device (123), a camera (122), and a brake (121) used to correct the position and / or orientation of the sensors. The millimeter-wave radar (124) may use radio signals to detect targets in the surrounding environment of the vehicle (1200). In some embodiments, the millimeter-wave radar (124) may be used to detect the speed and / or direction of movement of targets in addition to detecting targets. The lidar device (123) may use lasers to detect targets in the environment of the vehicle (1200). In some embodiments, the lidar device (123) may include one or more laser sources, a scanner, one or more detectors and other system components. The camera (122) may be configured to capture multiple images of the surrounding environment of the vehicle (1200). The camera (122) may be a static camera or a video camera.

[0149] The sensor system (120) may also include sensors of the internal systems of the vehicle (1200) being monitored (e.g., an air quality monitor inside the vehicle, a fuel gauge, an oil temperature gauge). Sensor data from one or more of these sensors may be used to detect objects and their corresponding characteristics (location, shape, orientation, speed, etc.). Such detection and identification are key functions for the safe operation of the vehicle (1200). The sensor system (120) may also include other sensors. This is not specifically limited in the present application.

[0150] The GPS (126) may be any sensor used to estimate the geographical location of the vehicle (1200). In this case, the GPS (126) may include a transceiver that estimates the location of the vehicle (1200) relative to the Earth based on satellite position data. For example, a computer system (160) may be configured to use the GPS (126) to estimate the road on which the vehicle (1200) is traveling by referring to map data. The IMU (125) may be configured to detect changes in the position and orientation of the vehicle (1200) and any combination thereof based on inertial acceleration. In some examples, the sensor combination of the IMU (125) may include, for example, an accelerometer and a gyroscope. Additionally, there are other possible combinations of sensors in the IMU (125).

[0151] The control system (130) controls the operation of the vehicle (1200) and the components of the vehicle (1200). The control system (130) may include various components including a steering unit (136), a throttle (135), a braking unit (134), a sensor fusion algorithm (133), a computer vision system (132), a path control system (131), and an obstacle avoidance system (137). The steering system (136) is operable to adjust the direction of movement of the vehicle (1200). For example, in one embodiment, the steering system (136) may be a steering wheel system. The throttle (135) is configured to control the operating speed of the engine (114) to further control the speed of the vehicle (1200). The control system (130) may additionally or alternatively include components other than those shown in FIG. 11. This is not particularly limited in the present application.

[0152] The braking unit (134) is used to control the deceleration of the vehicle (1200). The braking unit (134) may decelerate the wheel (111) using friction. In another embodiment, the braking unit (134) may convert the kinetic energy of the wheel (111) into an electric current. The braking unit (134) may also reduce the rotational speed of the wheel (111) in a different way to control the speed of the vehicle (1200). The computer vision system (132) may be operated to process and analyze images captured by the camera (122) and to recognize targets and / or features of the surrounding environment of the vehicle (1200). Targets and / or features may include traffic signals, road boundaries, obstacles, etc. The computer vision system (132) may use target recognition algorithms, Structure from Motion (SFM) algorithms, video tracking, and other computer vision technologies. In some embodiments, the computer vision system (132) may be configured to perform tasks such as mapping the environment, tracking a target, or estimating the speed of a target. The path control system (131) is configured to determine the movement path of the vehicle (1200). In some embodiments, the path control system (142) may determine the movement path of the vehicle (1200) based on data from the sensor system (120), GPS (126), and one or more predetermined maps. The obstacle avoidance system (137) is configured to recognize, evaluate, and avoid potential obstacles in the environment of the vehicle (1200) or to traverse potential obstacles in other ways. For example, the control system (130) may additionally or alternatively include components other than those described and described, or some of the aforementioned components may not be included.

[0153] Peripheral device (140) may be configured to allow the vehicle (1200) to interact with external sensors, other vehicles, and / or users. Peripheral device (140) may include a wireless communication system (144), a touchscreen (143), a microphone (142), and / or a speaker (141). Peripheral device (140) may additionally or alternatively include components other than those shown in FIG. 11. This is not particularly limited in the present application.

[0154] In some embodiments, the peripheral device (140) provides means for a user of the vehicle (1200) to interact with the user interface (170). For example, a touchscreen (143) may provide information for the user of the vehicle (1200). The user interface (170) may further operate the touchscreen (143) to receive input from the user. In other cases, the peripheral device (140) may provide means for the vehicle (1200) to communicate with other devices within the vehicle. For example, a microphone (142) may receive audio (e.g., voice commands or other audio input) from the user of the vehicle (1200). Likewise, a speaker (141) may output audio to the user of the vehicle (1200).

[0155] A wireless communication system (144) can communicate wirelessly with one or more devices directly or through a communication network. For example, the wireless communication system (144) can use 3G cellular communication such as Code Division Multiple Access (CDMA), EVD0, Global System for Mobile Communications (GSM) / General Packet Radio Service (GPRS), or 4G cellular communication such as Long Term Evolution (LTE), or 5G cellular communication. The wireless communication system (144) can communicate with a wireless local area network (WLAN) via Wi-Fi. In some embodiments, the wireless communication system (144) can communicate directly with a device via an infrared link, Bluetooth, or Zigbee. Various vehicle communication systems, such as other wireless protocols, for example, a wireless communication system (144), may include one or more dedicated short range communications (DSRC) devices, and such devices may include public and / or private data communication between a vehicle and / or a roadside station.

[0156] The power source (150) may be configured to supply power to some or all components of the vehicle (1200). Accordingly, the power source (150) may include, for example, a rechargeable lithium-ion or lead-acid battery. In some examples, one or more battery packs may be configured to supply power. Other power materials and configurations may exist. In some examples, the power source (150) and the energy source (113) may be implemented together, as in some all-electric vehicles. Components of the vehicle (1200) may be configured to be interconnected with other components inside and / or outside each system of the component. Accordingly, the components and systems of the vehicle (1200) may be communicably connected to each other via a system bus, network and / or other connection mechanism.

[0157] Some or all functions of the vehicle (1200) are controlled by a computer system (160). The computer system (160) may include at least one processor (161). The processor (161) executes instructions (1631) stored in a non-transient computer-readable medium, for example, memory (163). The computer system (160) may be a plurality of computing devices that control individual components or subsystems of the vehicle (1200) in a distributed manner.

[0158] The processor (161) may be any conventional processor, such as a central processing unit (CPU). Optionally, the processor may be a dedicated device, such as an application-specific integrated circuit (ASIC) or another hardware-based processor. Although FIG. 12 functionally illustrates the processor, memory, and other components of the computer system (160) in the same block, those skilled in the art should understand that the processor, computer, or memory may actually comprise multiple processors, computers, or memories that may or may not be stored in the same physical housing. For example, memory may be a hard disk drive, or other storage media located in a housing different from that of the computer system (160). Thus, references to a processor or computer are understood to include references to a set of processors, computers, or memories that may or may not operate in parallel. Instead of using a single processor to perform the steps described herein, some components, such as steering components and deceleration components, may each have their own processor. The processor performs only operations related to the function of the component.

[0159] In various embodiments described herein, the processor may be located away from the vehicle and communicate wirelessly with the vehicle. In other embodiments, some processes described herein are performed by a processor located inside the vehicle, while other processes are performed by a remote processor, including performing steps required for a single operation.

[0160] In some embodiments, the memory (163) may include instructions (1631), e.g., program logic, and the instructions (1631) may be executed by the processor (161) to perform various functions of the vehicle (1200), including the functions described above. The memory (163) may also include additional instructions, including instructions to transmit data to, receive data from, interact with, and / or control one or more of the propulsion system (110), sensor system (120), control system (130), and peripheral device (140).

[0161] In addition to commands (1631), memory (163) can store data such as road maps, route information, data detected by sensors, vehicle location, vehicle direction, vehicle speed, other vehicle data, and other information. This information can be used by the vehicle (1200) and the computer system (160) while driving the vehicle (1200) in autonomous, semi-autonomous, and / or manual modes.

[0162] The user interface (170) is configured to provide information to the user of the vehicle (1200) or to receive information from the user. Optionally, the user interface (170) may be included in one or more input / output devices in a set of peripheral devices (140), such as a wireless communication system (144), a touchscreen (143), a microphone (142), and a speaker (141).

[0163] The computer system (160) can control the functions of the vehicle (1200) based on inputs received from various subsystems (e.g., propulsion system (110), sensor system (120), and control system (130)) and inputs received from the user interface (170). For example, the computer system (160) can control the steering unit (136) by utilizing inputs from the control system (130) to avoid obstacles detected by the sensor system (120) and the obstacle avoidance system (137). In some embodiments, the computer system (160) can operate to provide control over various aspects of the vehicle (1200) and the subsystems of the vehicle (1200).

[0164] Optionally, one or more of the aforementioned components may be separated from the vehicle (1200) or associated with the vehicle (1200). For example, the memory (163) may be partially or wholly separated from the vehicle (1200). The above-described components may be communicatedly coupled via wired and / or wireless means.

[0165] It should be noted that the vehicle functional framework illustrated in FIG. 12 is merely an example. In other examples, the vehicle (1200) may include more or fewer or different systems, and each system may include more or fewer or different components. Additionally, the illustrated systems and components may be combined or divided in any way. This is not specifically limited in this application.

[0166] Based on the aforementioned structural and functional principles of the light source module, the present application may further provide an optical display device. The optical display device may include a light source module in any of the embodiments described above. That is, the light source module provided in the embodiments of the present application may be used in any optical display device necessary for controlling the temperature stability of the light source in the light source module.

[0167] For example, optical display devices may include, but are not limited to, in-vehicle displays, HUDs, NED devices, projectors, and smart home devices (e.g., smart desk lamps, sound systems, smart lighting systems, electrical appliance control systems, home background music, home theater systems, intercom systems, or video surveillance).

[0168] In the embodiments of this application, unless otherwise specified or logically conflicting, terms and / or descriptions between different embodiments may be consistent and cross-referenced, and technical features of different embodiments may be combined to form new embodiments based on the internal logical relationships of different embodiments.

[0169] In this application, "equivalent" does not mean absolutely equivalent, and engineering error may be permitted. "Vertical" does not mean absolutely vertical, and engineering error may be permitted. "Higher" does not mean absolutely higher, and engineering error may be permitted. "At least one" means one or more, and "plural" means two or more. The term "and / or" describes an association between associated entities and indicates that three relationships may exist. For example, A and / or B may represent the following cases: A existing alone, A and B both existing, and B existing alone, where A and B may be singular or plural. "One or more of the following items (pieces)" or a similar expression indicates any combination of these items, including any combination of a single item (piece) or multiple items (pieces). For example, at least one of a, b, and c may represent a, b, c, "a and b," "a and c," "b and c," or "a, b, and c," wherein a, b, and c may be singular or plural. In the description of this application, the letter ' / ' typically indicates an 'or' relationship between connected objects. In the formulas of this application, the letter ' / ' typically indicates a 'dividing' relationship between connected objects. Additionally, in this application, the word 'e.g.' is used to provide examples, illustrations, or descriptions. An embodiment or design method described as 'e.g.' in this application should not be described as being more desirable or having more advantages than other embodiments or design methods. Alternatively, the word 'e.g.' may be understood as presenting a concept in a particular manner and does not constitute a limitation to this application.

[0170] It should be understood that the various numbers in this application are used merely for distinction for ease of explanation and are not intended to limit the scope of the embodiments of this application. It should be understood that the sequence numbers of the processes described above do not imply an order of execution. The order of execution of the processes must be determined according to the function and internal logic of the processes. Terms such as "first," "second," etc., are intended to distinguish similar objects and do not indicate a specific order or sequence. Furthermore, terms such as "include," "have," and variations thereof are intended to encompass non-exclusive inclusions, such as including a series of steps or units. A method, system, product, or device comprising a list of steps or units is not necessarily limited to the explicitly listed steps and units and may include other steps or units that are not explicitly listed or are inherent in such process, method, product, or device.

[0171] Although this application has been described with reference to specific features and embodiments, it is evident that various modifications and combinations may be made without departing from the spirit and scope of this application. Accordingly, the specification and the accompanying drawings are merely illustrative of the solutions defined in the appended claims and are to be considered as some or all modifications, variations, combinations, or equivalents that encompass the scope of this application.

[0172] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit and scope of the invention. This application is intended to encompass such modifications and variations where they fall within the scope defined by the following claims and their equivalents in the embodiments of this application.

Claims

Claim 1 A light source module comprising: a light source component configured to transmit a light signal; a cooling component stacked with the light source component; and a storage structure comprising at least one first sidewall, wherein the storage structure comprises, said, at least one first sidewall accommodating at least a portion of the cooling component; said, the storage structure further comprising a bottom plate, said bottom plate in contact with a first end of the first sidewall; said bottom plate comprising an opening; and said cooling component passing through the opening in contact with a support component. Claim 2 delete Claim 3 A light source module according to claim 1, wherein the thermal conductivity of the material of the bottom plate is higher than the thermal conductivity of the material of the first side wall. Claim 4 A light source module according to claim 1, wherein the material of the first side wall is an insulating material and / or the material of the bottom plate is a heat-conducting material. Claim 5 In claim 1, the second end of the first sidewall is connected to the light source component using a structural adhesive, and the second end of the first sidewall is a light source module opposite to the first end of the first sidewall. Claim 6 In claim 1, the storage structure further comprises at least one second sidewall, and the at least one second sidewall accommodates at least a portion of the first sidewall, a light source module. Claim 7 In paragraph 6, at least one second sidewall is a light source module that further accommodates at least a portion of the light source component. Claim 8 In claim 6, the light source module in which the bottom plate and the second side wall are integrally formed. Claim 9 In claim 6, a light source module in which the second side wall is higher than the first side wall. Claim 10 A light source module according to claim 1, wherein the first side wall is "strip" type or "L" type. Claim 11 In claim 1, the light source module further comprises a shielding cover, and the shielding cover is electrically connected to a bottom plate or a second side wall. Claim 12 In claim 1, a thermally conductive adhesive is filled between the base plate and the support component, and the support component is configured to support the light source module and / or; a light source module in which a thermally conductive adhesive is filled between the base plate and the cooling component. Claim 13 delete Claim 14 A light source module according to claim 1, wherein a structural adhesive is filled between the non-open area of ​​the base plate and the supporting component, or a thermally conductive adhesive is filled between the cooling component and the supporting component. Claim 15 In claim 1, the light source component comprises a light source and a substrate; the substrate is configured to drive the light source to transmit a light signal, forming a light source module. Claim 16 A light source module according to claim 15, wherein the difference between any two of the thermal expansion coefficient of the substrate, the thermal expansion coefficient of the second sidewall, and the thermal expansion coefficient of the first sidewall is smaller than a first threshold value. Claim 17 In paragraph 15, the light source is a light source module including a laser diode. Claim 18 A light source module according to claim 1, wherein the material of the first side wall comprises glass or acrylic or a combination of both. Claim 19 A detection device comprising a light source module as described in any one of claims 1, 3 through 12 and 14 through 18. Claim 20 In claim 19, the detection device further comprises a receiving module; the receiving module is configured to receive an echo signal corresponding to an optical signal, and the echo signal is used to obtain association information of a target detected by the detection device. Claim 21 In paragraph 19, the detection device is a detection device that is a lidar device. Claim 22 In paragraph 19, the detection device further comprises an image acquisition module; the image acquisition module is configured to acquire image information. Claim 23 In paragraph 22, the detection device is a detection device that is a fusion sensor. Claim 24 A terminal device comprising a detection device and a processor as described in claim 19, wherein the processor is configured to plan a driving path based on association information and / or image information of a target.

Images