Antenna package module

Abstract

The present invention relates to an antenna package module, wherein the antenna package module comprises a base substrate including a first substrate layer and a second substrate layer stacked together, an antenna portion coupled to a first surface of the base substrate, a driving chip coupled to a second surface of the base substrate and exchanging signals with the antenna portion, a molding portion coupled to a second surface of the base substrate and encapsulating the driving chip, and a connector portion formed on a second surface of the base substrate and exchanging signals with the driving chip, wherein the first substrate layer and the second substrate layer have different dielectric constants, the first substrate layer includes a first metal layer having a first thickness, and the second substrate layer includes a second metal layer having a thickness different from that of the first metal layer.

Description

Technology Field

[0001] The present invention relates to an antenna package module, and more specifically, to an antenna package module using a heterogeneous substrate based on a material having a low dielectric constant and a low signal loss rate. Background Technology

[0002] In response to advancements in wireless communication technology and user demands, recently developed wireless communication technologies are characterized by the use of higher frequency signals.

[0003] Since signals in these high-frequency bands have relatively short wavelengths, significant transmission loss occurs during signal transmission; therefore, more sophisticated and complex antenna configurations are required to improve signal reception rates.

[0004] In addition, in some cases, it is required to mount multiple antennas in miniaturized electronic devices. However, it is very difficult to mount multiple antennas in small and thin electronic devices using conventional methods.

[0005] Therefore, there is an increasing demand for antennas that can smoothly cover high-frequency signals while being easily mounted on small and thin electronic devices.

[0006] In addition, there is an increasing demand for reducing transmission loss for high-frequency band signals received from antennas. Prior art literature

[0007] Republic of Korea Registered Patent No. 10-1505595 Republic of Korea Published Patent No. 10-2018-0105833 The problem to be solved

[0008] The problem that the present invention aims to solve is to reduce signal transmission loss in an antenna package module.

[0009] Another problem that the present invention aims to solve is to enable efficient dissipation of heat generated in the antenna package module. means of solving the problem

[0010] An antenna package module according to one feature of the present invention comprises a base substrate including a first substrate layer and a second substrate layer stacked together, an antenna portion coupled to a first surface of the base substrate, a driving chip coupled to a second surface of the base substrate and exchanging signals with the antenna portion, a molding portion coupled to a second surface of the base substrate and encapsulating the driving chip, and a connector portion formed on a second surface of the base substrate and exchanging signals with the driving chip, wherein the first substrate layer and the second substrate layer have different dielectric constants, the first substrate layer includes a first metal layer having a first thickness, and the second substrate layer includes a second metal layer having a thickness different from that of the first metal layer.

[0011] The first substrate layer may be coupled to the antenna portion, the second substrate layer may be coupled to the driving chip, and the dielectric constant of the first substrate layer may be lower than the dielectric constant of the second substrate layer.

[0012] The first substrate layer can be coupled to the antenna portion, the second substrate layer can be coupled to the driving chip, and the second metal layer can be thicker than the first metal layer.

[0013] The base substrate may further include a third substrate layer located between the first substrate layer and the second substrate layer, and the first substrate layer and the second substrate layer may have a lower signal loss rate and a lower dielectric constant than the third substrate layer, and the third substrate layer may be thicker than the first substrate layer and the second substrate layer to have a heat dissipation function.

[0014] The above antenna section may include a plurality of patch antennas arranged in one direction.

[0015] The first substrate layer may further include a first insulating layer in contact with the first metal layer, and the second substrate layer may further include a second insulating layer in contact with the second metal layer, and the first insulating layer and the second insulating layer contain different materials, and each of the first insulating layer and the second insulating layer may contain a material selected from polyimide, silicon, and glass. Effects of the invention

[0016] In this way, by using a heterogeneous substrate made of a heterogeneous material as the base substrate, the heat dissipation function is improved, and the signal transmission rate can also be improved. Brief explanation of the drawing

[0017] FIG. 1 is a perspective view of an antenna package module according to one embodiment of the present invention. FIG. 2 is a cross-sectional view of an antenna package module according to one embodiment of the present invention. Specific details for implementing the invention

[0018] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols are assigned the same reference number, and redundant descriptions thereof will be omitted. Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted.

[0019] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0020] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0021] In this application, each step described may be performed regardless of the order listed, except where it must be performed in the order listed by a particular causal relationship.

[0022] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0023] Hereinafter, an antenna package module according to one embodiment of the present invention will be described with reference to the attached drawings.

[0024] The antenna package module (100) of this example may be an antenna package module including, for example, a 6G chip package antenna.

[0025] The antenna package module (100) of this example may be provided with a base substrate (10), an antenna part (20) located on one side of the base substrate (10), a driving part (30) located on the opposite side of the base substrate (10) and facing the opposite side of the base substrate (10), and a connector part (40) located on the other side of the base substrate (10) and physically and electrically connected to the driving part (30).

[0026] The base substrate (10) of the present example may be a heterogeneous substrate based on a low dielectric constant and a low loss material with low signal loss, and may form the base of an antenna package module (100). Such a base substrate (10) may be made of a printed circuit board such as a rigid circuit board.

[0027] This base substrate (10) may be a multilayer printed circuit board.

[0028] For example, the base substrate (10) of the present example may have a first substrate layer (11), a second substrate layer (12) located below the first substrate layer (11), and a third substrate layer (13) located between the first substrate layer (11) and the second substrate layer (12), as shown in FIG. 2.

[0029] Accordingly, the base substrate (10) may have a structure in which a second substrate layer (12), a third substrate layer (13), and a first substrate layer (11) are stacked in sequence from the bottom to the top.

[0030] As a result, the upper surface of the first substrate layer (11) can form one side of the base substrate (10), and the lower surface of the second substrate layer (12) can form the other side of the base substrate (10).

[0031] Accordingly, an antenna part (20) may be located on the upper surface of the first substrate layer (11), and a driving part (30) may be located on the lower surface of the second substrate layer (12).

[0032] These first to third substrate layers (11-13) can be electrically connected to other adjacent layers and electrically connected to at least one of the antenna part (20), the driving part (30), and the connector part (40).

[0033] In this example, the first substrate layer (11) and the second substrate layer (12) are each connected to an antenna unit (20) or a driving unit (30), so that signal transmission and reception can be performed directly with each connected antenna unit (20) or driving unit (30).

[0034] At this time, the dielectric constant of the first substrate layer (11) directly connected to the antenna part (20) may be lower than the dielectric constant of the second substrate layer (12) directly connected to the driving part (30).

[0035] Therefore, by preventing dielectric loss due to high dielectric constant, the ability of the antenna part (20) to generate or receive radio waves due to high dielectric constant can be prevented.

[0036] On the other hand, the third substrate layer (13) located between the first substrate layer (11) and the second substrate layer (12) can only perform signal transmission and reception with the first substrate layer (11) or the second substrate layer (12) located above or below it.

[0037] Accordingly, the first substrate layer (11) and the second substrate layer (12) may have a lower signal transmission loss rate and a lower dielectric constant than the third substrate layer (13).

[0038] On the other hand, since the third substrate layer (13) is located in the middle part of the base substrate (10), it can be provided with a heat dissipation function that can effectively discharge heat generated inside the base substrate (10) to the outside more effectively than the first substrate layer (11) and the second substrate layer (12).

[0039] In this case, heat generated inside the base substrate (10) is quickly discharged to the outside, so the durability of the base substrate (10) can be improved.

[0040] For example, as illustrated in FIG. 2, the first substrate layer (11) may have a substrate portion (e.g., first substrate portion) (111) and a metal layer (e.g., first metal layer) (112) located on the first substrate portion (111) and in contact with the first substrate portion (111). At this time, the first metal layer (112) may be located on the upper surface of the first substrate portion (111) to perform electrical and physical connections with the antenna portion (20).

[0041] The second substrate layer (12) may also be provided with a substrate portion (e.g., second substrate portion) (121) and a metal layer (e.g., second metal layer) (122) located on the second substrate portion (121) and in contact with the second substrate portion (121). At this time, the second metal layer (122) may be located on the lower surface of the second substrate portion (121) to perform electrical and physical connections with the driving portion (30) and the connector portion (40).

[0042] Additionally, the third substrate layer (13) located between the first substrate layer (11) and the second substrate layer (12) may be provided with a plurality of metal layers (e.g., third metal layers) (132, 133) located on the upper and lower surfaces of the substrate portion (third substrate portion) (131) respectively and in contact with the corresponding surface of the third substrate portion (131).

[0043] At this time, the third metal layer (132) located on the upper surface of the third substrate part (131) is for electrical connection with the first substrate layer (11) located on the upper surface, and the third metal layer (133) located on the lower surface of the third substrate part (131) is for electrical connection with the second substrate layer (12) located on the lower surface.

[0044] As previously described, since the first substrate layer (11) is connected to the antenna part (20) and the second substrate layer (12) is connected to the driving part (30), the thickness of the first metal layer (112) of the first substrate layer (11) may be different from the thickness of the second metal layer (122) of the second substrate layer (12).

[0045] For example, to reduce wiring resistance during signal transmission and reception with a driving unit (30) that controls the operation of the antenna package module (100) and to effectively perform a heat dissipation function that dissipates heat generated from the driving unit (30), the second metal layer (122) may have a thicker thickness than the first metal layer (112) for signal transmission and reception with the antenna unit (20).

[0046] In this way, the base substrate (10) may be a multilayer printed circuit board in which a plurality of metal layers are located.

[0047] In this example, the first substrate portion (111), which is the first insulating layer, and the second substrate portion (121), which is the second insulating layer, may contain different materials and, for example, may be made of different materials.

[0048] The first substrate part (111) may be an antenna substrate for the antenna part (20), and the second substrate part (121) may be a substrate for the driving part (30).

[0049] At this time, each of the first substrate part (111) and the second substrate part (121) may contain one material selected from polyimide, silicon, and glass.

[0050] Additionally, the first substrate portion (111) to the third substrate portion (131) may all be insulating layers containing insulating material, the first substrate portion (111) and the second substrate portion (121) may contain prepreg, and the third substrate portion (131) may function as a core.

[0051] In this way, the base substrate (10) having first to third substrate layers (11-13) may have via holes (H10) for signal transmission between each substrate layer (11-13), and each via hole (H10) may be filled with a conductive material such as copper, so that each via hole (H10) can function as a signal transmission via hole for transmitting a signal.

[0052] Additionally, for the heat dissipation function of the third substrate layer (13), the base substrate (10) may be provided with a via hole (H20) that penetrates the corresponding part of the base substrate (10) between the third substrate layer (13) and the driving unit (30), and the interior of the via hole (H20) may be filled with a conductive material such as copper.

[0053] At this time, the width (e.g., diameter) of this via hole (H20) may be larger than the width of the signal transmission via hole (H10). Therefore, heat generated inside the base substrate (10) can be transferred to the driving unit (30) through this via hole (H20) and can be quickly discharged to the outside through the driving unit (30). Thus, this via hole (H20) can function as a heat transfer via hole for transferring heat and discharging it to the outside.

[0054] At this time, the heat transfer via hole (H20) can penetrate at least a portion of the first substrate layer (11), and if it completely penetrates the first substrate layer (11) along the thickness direction of the first substrate layer (11), it can come into contact with the lower surface of the antenna portion (20).

[0055] In this way, the base substrate (10) may have a total of four layers, and each layer may have a metal layer (112, 132, 133, 122) that performs various functions (e.g., antenna, signal line, terminal, pad, ground, or power supply line, etc.).

[0056] The antenna section (20) may include a substrate (not shown) and at least one antenna located on the substrate.

[0057] The substrate of the antenna part (20) may be a substrate or film made of a non-conductive material or a dielectric, or a non-conductive layer formed through the application, printing, or stacking operation of a non-conductive material.

[0058] The antenna can be made of a conductive material and can be fabricated by printing or laminating a conductive pattern on the substrate of the antenna part (20).

[0059] Such antennas may have a plate shape, be equipped with an internal hollow hole, or be in the form of a patch.

[0060] In the case of multiple antennas, they can be arranged side by side spaced apart from each other along the length direction of the antenna package module (100).

[0061] However, in an alternative example, the substrate of the antenna portion (20) may be a substrate portion (111), and a metal layer (112) located on the substrate portion (111) may form the antenna.

[0062] In this alternative example, since the metal layer (112) constitutes the antenna, the antenna (112) can be positioned on the corresponding surface of the substrate portion (111) of the first substrate layer (11) and coupled with the antenna (112). In this case, the antenna portion (20) can be omitted.

[0063] As illustrated in FIG. 2, the driving unit (30) may be provided with at least one driving chip (31) and a molding unit (32) that encapsulates the driving chip (31) inside. Additionally, although not illustrated, the driving unit (30) may be provided with a plurality of electrical and electronic components to perform functions necessary for the operation of the driving chip (31).

[0064] The driving chip (31) is an integrated circuit (IC) chip and can control the operation of the antenna package module (100).

[0065] Accordingly, the driving chip (31) can receive and process a wireless communication signal applied from the antenna unit (20) and transmit it to a signal processing module (not shown), or process a signal transmitted from the signal processing module and transmit it to the outside through the antenna unit (20) as a wireless communication signal having a desired frequency band size.

[0066] This driving chip (31) can convert the frequency magnitude of a signal received at the antenna unit (20) or transmitted through the antenna unit (20) to a desired magnitude.

[0067] As illustrated in FIG. 1, the driving chip (31) can be electrically and physically connected to the connector part (40) through a transmission line (124), such as a signal line.

[0068] The molding portion (32) is made of a molding material and may cover electronic components such as a driving chip (31) and an electrical / electronic component located on the corresponding surface (e.g., another surface) of the base substrate (10), and may additionally cover a portion of the transmission line (124) in some cases.

[0069] Therefore, the component embedded in the molding part (32) can be protected from external impact or foreign substances such as moisture.

[0070] A connector portion (40) that electrically connects an antenna package module (100) and an external device (e.g., a signal processing module) may be located on the corresponding surface (e.g., the bottom surface) of the second substrate layer (12) of the base substrate (10) that is exposed and not covered by the molding portion (32).

[0071] Accordingly, the connector part (40) can be physically and electrically coupled with a wiring cable (not shown) that is physically and electrically connected to the connector (not shown) of the signal processing module.

[0072] The technical features disclosed in each embodiment of the present invention are not limited to that embodiment only, and as long as they are not mutually incompatible, the technical features disclosed in each embodiment may be combined and applied to different embodiments.

[0073] Therefore, in each embodiment, the technical features are described primarily, but as long as the technical features are not mutually incompatible, they may be combined and applied together.

[0074] The present invention is not limited to the embodiments described above and the attached drawings, and various modifications and variations may be possible from the perspective of those skilled in the art to which the present invention belongs. Accordingly, the scope of the present invention should be defined not only by the claims of this specification but also by equivalents thereof. Explanation of the symbols

[0075] 100: Antenna package module 10: Base board 20: Antenna section 30: Driving section 40: Connector part 11: First substrate layer 12: Second substrate layer 13: Third substrate layer 111: First substrate part 112: First metal layer 121: Second substrate part 122: Second metal layer 131: Third substrate part 132, 133: Third metal layer 31: Driving chip 32: Molding part H10, H20: via holes

Claims

Claim 1 An antenna package module comprising: a base substrate including a first substrate layer and a second substrate layer stacked together and a third substrate layer located between the first substrate layer and the second substrate layer; an antenna portion coupled to a first surface of the base substrate; a driving chip coupled to a second surface of the base substrate and exchanging signals with the antenna portion; a molding portion coupled to a second surface of the base substrate and encapsulating the driving chip; a connector portion formed on a second surface of the base substrate and exchanging signals with the driving chip; and a heat transfer via hole located between the third substrate layer and the driving chip, which transfers heat generated inside the base substrate toward the driving chip and discharges it to the outside through the driving chip, wherein the dielectric constant of the first substrate layer is lower than the dielectric constant of the second substrate layer, the first substrate layer includes a first metal layer having a first thickness, and the second substrate layer includes a second metal layer having a second thickness thicker than the first metal layer to reduce wiring resistance and dissipate heat during signal transmission and reception with the driving chip. Claim 2 delete Claim 3 delete Claim 4 An antenna package module according to claim 1, wherein the first substrate layer and the second substrate layer have a lower signal loss rate and a lower dielectric constant than the third substrate layer, and the third substrate layer is thicker than the first substrate layer and the second substrate layer and has a heat dissipation function. Claim 5 The antenna portion of claim 1 is an antenna package module comprising a plurality of patch antennas arranged in one direction. Claim 6 An antenna package module according to claim 1, wherein the first substrate layer further comprises a first insulating layer in contact with the first metal layer, the second substrate layer further comprises a second insulating layer in contact with the second metal layer, the first insulating layer and the second insulating layer contain different materials, and each of the first insulating layer and the second insulating layer contains a material selected from polyimide, silicon, and glass.

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