DIE-CUTTING DEVICE

MX431785BActive Publication Date: 2026-02-25CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
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Patent Information

Application Number
MX2023006240
Authority / Receiving Office
MX · MX
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-09-30
Filing Date
2023-05-26
Publication Date
2026-02-25
Estimated Expiration
2042-06-09

AI Technical Summary

Technical Problem

The fluctuation of electrode plates during the cutting process to form tabs results in unstable cutting, leading to incomplete cuts or inability to achieve the cut, which affects the forming quality of lithium-ion battery electrodes.

Method used

A die-cutting device with first and second limiting elements on either side of the electrode plate in the thickness direction, along with a transport mechanism, to stabilize the electrode plate and ensure precise cutting by limiting fluctuations, and a guiding mechanism to compensate for deformations.

Benefits of technology

Improves cutting stability and forming quality of electrode plates by reducing abrasion and deformation, ensuring complete cuts and enhancing the structural integrity of the tabs.

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Abstract

This application provides a die-cutting device related to the technical field of battery manufacturing. The die-cutting device comprises a transport mechanism, a first cutting mechanism, a first limiting element, and a second limiting element. The transport mechanism is configured to transport an electrode plate. The first cutting mechanism is located on one side of the electrode plate in the thickness direction and is configured to cut an uncoated region. The first limiting element is provided with a cutting hole that coincides with a laser cutting path. The second limiting element is located on the side of the electrode plate, oriented opposite the first limiting element in the thickness direction, and is configured to cooperate with the first limiting element to limit the electrode plate in the thickness direction.The first and second limiting elements are provided on the two sides of the electrode plate, respectively, to limit the electrode plate's thickness direction. This cooperatively limits the electrode plate's fluctuation range in the thickness direction, thereby improving cutting stability and enhancing the forming quality of the electrode plate. A cutting hole is provided to allow the laser light emitted by the first cutting mechanism to pass through, preventing it from cutting the first limiting element.
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Description

DIE-CUTTING DEVICE Cross-reference to related request This application claims priority from Chinese patent application no. 202122410066.6, filed on September 30, 2021, and entitled DIE-CUTTING DEVICE, which is incorporated herein by reference in its entirety. Field of Invention This application relates to the technical aspects of battery manufacturing and, in particular, to a die-cutting device. Background of the Invention Lithium batteries are currently widely used in electronics, vehicles, the aerospace sector, and other fields. Increasingly complex application environments and conditions place greater demands on batteries in terms of safety performance, energy density, production cost, and other factors. The quality of electrode plate formation in lithium-ion batteries has a significant impact on battery performance, including safety, energy density, and production cost. Therefore, improving electrode plate formation quality has become a critical problem in battery manufacturing. Summary of the Invention In accordance with the realizations of this application, a die-cutting device is provided to improve the forming quality of an electrode plate. In a first aspect, according to an embodiment of the present application, a die-cutting device is provided comprising a transport mechanism, a first cutting mechanism, a first limiting element, and a second limiting element. The transport mechanism is configured to transport an electrode plate comprising an uncoated region and a coated region, the uncoated region being connected to the coated region. The first cutting mechanism is located on one side of the electrode plate in a thickness direction and is configured to cut the uncoated region. The electrode plate is coated in such a way that the uncoated region forms a waste portion connected to the coated region and a tab connected to the coated region and separate from the waste portion. The first limiting element is located between the electrode plate and the first cutting mechanism in the thickness direction and is provided with a cutting hole that allows the laser light emitted by the first cutting mechanism to pass through, the cutting hole coinciding with a laser light cutting path. The second limiting element is located on the side of the electrode plate, oriented opposite the first limiting element in the thickness direction, and is configured to cooperate with the first limiting element to limit the electrode plate in the thickness direction.In the previous technical solution, during the process of cutting the electrode plate to form the tongue, both a transport force from the transport mechanism and a cutting force from the cutting mechanism can cause the electrode plate to fluctuate in the thickness direction, resulting in an unstable cut that affects the quality of the tongue cut. Excessive fluctuation amplitude of the electrode plate can also cause the electrode plate to be outside the cutting range of the cutting mechanism, resulting in an incomplete cut or an inability to achieve the cut.The first and second limiting elements are provided on the two sides of the electrode plate, respectively, and limit the electrode plate's thickness along its two sides. This cooperatively limits the electrode plate's fluctuation range in the thickness direction, thereby improving cutting stability and enhancing the electrode plate's forming quality. The first limiting element is located between the electrode plate and the first cutting mechanism, in the direction of the electrode plate's thickness. A cutting hole is provided to allow the laser light emitted by the first cutting mechanism to pass through, cutting the electrode plate while preventing the laser light from cutting the first limiting element. In some embodiments of the first aspect of this application, the first limiting element and the second limiting element overlap at least partially in the thickness direction to form an overlapping region, and the first cutting mechanism is configured to cut the uncoated region into the overlapping region. nfrzonn / eznz / B / Yi - 3In the above technical solution, the first cutting mechanism cuts the uncoated region in the overlapping region formed by the first limiting element and the second limiting element, and therefore the two sides of the electrode plate in the thickness direction corresponding to the cutting region of the first cutting mechanism are both limited, which can limit the fluctuation range of the electrode plate in the thickness direction and can limit the degree of fluctuation of the electrode plate in the thickness direction of the electrode plate within the cutting range of the first cutting mechanism, so that the cutting stability can be improved. In some embodiments of the first aspect of this application, the first limiting element comprises a first rolling body configured to abut against the uncoated region. In the above technical solution, the fluctuation of the electrode plate in the thickness direction can cause the uncoated region of the electrode plate to abut against the first limiting element, and the first rolling body of the first limiting element to abut against the uncoated region. Thus, the uncoated region is in rolling friction contact with the first limiting element, and the uncoated region has small frictional damping, thereby improving the transmission stability of the electrode plate and reducing abrasion of the electrode plate, in order to effectively prevent tearing of the tongue, even serious consequences such as strip breakage, due to the large damping between the tongue and the first limiting element after the tongue has separated from the waste portion. In some embodiments of the first aspect of the present application, the first rolling body is arranged downstream of the first cutting mechanism. In the previous technical solution, since the waste portion and the tab are not restrained by each other after the waste portion has separated from the tab, both the tab and the waste portion readily adhere to the first limiting element when in contact with it. Therefore, the first rolling element is arranged downstream of the first cutting mechanism so that the separated tab and waste portion can both be in rolling fit with the first limiting element, thus reducing the risk of tab tearing and strip breakage caused by the tab and waste portion adhering to the first limiting element. nfrzonn / eznz / B / Yi -4In some embodiments of the first aspect of the present application, the first limiting element further comprises a first limiting portion and a first connecting portion, the first rolling body being mounted on the first connecting portion and the surface of the first limiting element that is oriented towards the electrode plate being flush with the edge of the first rolling body that is configured to abut against the uncoated region. In the above technical solution, the surface of the first limiting portion that is oriented towards the electrode plate is flush with the edge of the first rolling body that is configured to abut against the uncoated region and then, the first limiting portion and the first rolling body are at the same distance from the electrode plate to allow the electrode plate to have the same range of fluctuation in the thickness direction, thus improving cutting stability and reducing the risk of large deformation of the electrode plate, in order to improve the forming quality of the electrode plate. In some embodiments of the first aspect of this application, the die-cutting device further comprises a second cutting mechanism and a guiding mechanism. The second cutting mechanism is arranged on one side of the electrode plate in the thickness direction, downstream of the first cutting mechanism, and is configured to cut the waste portion to separate it from the coated region. The guiding mechanism is arranged downstream of the first limiting element and is configured to guide the waste portion toward the second cutting mechanism. In the above technical solution, the electrode plate is formed in two stages by the first cutting mechanism and the second cutting mechanism. In the first stage, the tongue is separated from the scrap portion, so that during the cutting operation, fluctuations in the scrap portion have little influence on the tongue. This greatly reduces the risk of decreased product quality due to tongue deformation caused by scrap fluctuations and damage caused by the scrap portion pulling, and also improves the quality of the electrode plate formation. After separating the scrap portion from the tongue, the scrap portion is cut to separate it from the coated area, thus completing the cutting of the electrode plate. The guide mechanism propels the waste portion to move towards the second mechanism of nfrzonn / eznz / B / Yi - 5 cut to compensate for the deformation of the electrode plate during the cutting process of the first cutting mechanism, so that the waste portion is displaced to be within the cutting range of the second cutting mechanism to ensure that the second cutting mechanism can effectively cut the electrode plate. In some embodiments of the first aspect of this application, the guide mechanism is an adsorption mechanism and the guide mechanism is located on the same side as the second cutting mechanism in the thickness direction. In the above technical solution, the guiding mechanism is the adsorption mechanism and the uncoated region is driven by adsorption to move towards the second cutting mechanism, so that the amount of displacement of the waste portion can be controlled more precisely. In some embodiments of the first aspect of this application, the adsorption mechanism comprises an adsorption face provided with a plurality of adsorption holes. In the above technical solution, the provision of adsorption holes can improve adsorption stability, thereby effectively improving the shear stability of the waste portion. In some embodiments of the first aspect of this application, the guide mechanism is located on the same side as the first limiting element in the thickness direction; and the second limiting element comprises second rolling bodies configured to abut against the uncoated region. In the above technical solution, the guide mechanism and the first limiting element are located on the same side of the electrode plate in the thickness direction. The uncoated region can abut against the second limiting element due to the fluctuation of the electrode plate in the thickness direction, and the second rolling bodies of the second limiting element abut against the uncoated region. Thus, the uncoated region is in rolling friction contact with the second limiting element, and the uncoated region has small frictional damping, thereby improving the transmission stability of the electrode plate and reducing electrode plate abrasion, in order to effectively prevent tongue tearing, and even serious consequences such as strip breakage.due to the large cushioning between the tongue and the second limiting element after the tongue has separated from the waste portion. In some embodiments of the first aspect of this application, nfrzonn / eznz / B / Yi is provided -6a plurality of second rolling bodies and are located downstream of the first cutting mechanism, some of the plurality of second rolling bodies being located upstream of the second cutting mechanism and some of the plurality of second rolling bodies being located downstream of the second cutting mechanism. In the above technical solution, some of the second rolling bodies are arranged upstream of the second cutting mechanism and some are arranged downstream of the second cutting mechanism, so that the waste portion can be in rolling contact with the second limiting element before and after separating from the coated region, in order to reduce the resistance of the electrode plate during the transmission process, improve the transmission stability of the electrode plate and reduce the abrasion of the electrode plate. In some embodiments of the first aspect of the present application, the second limiting element further comprises a second limiting portion and a second connecting portion, the second rolling bodies being mounted on the second connecting portion and the surface of the second limiting portion that is oriented towards the electrode plate being flush with the edges of the second rolling bodies that are configured to abut against the waste portion. In the above technical solution, the surface of the second limiting portion that is oriented towards the electrode plate is flush with the edges of the second rolling bodies that are configured to abut against the uncoated region and then, the second limiting portion and the second rolling bodies are at the same distance from the electrode plate to allow the electrode plate to have the same range of fluctuation in the thickness direction, thus improving the cutting stability and reducing the risk of large deformation of the electrode plate, in order to improve the forming quality of the electrode plate. In some embodiments of the first aspect of this application, the die-cutting device further comprises a third limiting element arranged on one side of the coated region in the thickness direction and configured to limit the coated region in a direction of displacement of the waste portion. In the above technical solution, since the waste portion will cause the displacement of the coated region to cause deformation of the electrode plate during the process of the guide mechanism that drives the portion of nfrzonn / eznz / B / Yi - 7. Waste to move towards the second cutting mechanism, the covered region is limited by the third limiting element in the direction of displacement of the waste portion, so that the maximum deformation of the electrode plate can be limited, in order to improve the formation quality of the electrode plate. In some embodiments of the first aspect of this application, the third limiting element is provided with a plurality of through holes. In the above technical solution, the third limiting element is provided with a plurality of through holes, so that it is not easy for dust to accumulate in the third limiting element, and the provision of the through holes can also reduce the weight of the third limiting element. In some embodiments of the first aspect of the present application, the die-cutting device further comprises a dust removal mechanism configured to remove the dust generated on the electrode plate when the second cutting mechanism cuts the waste portion of the electrode plate. In the previous technical solution, a portion of the coating is generally cut away during the process of separating the waste portion from the coated area, generating a significant amount of dust. The dust removal mechanism is designed to eliminate the dust generated on the electrode plate when the second cutting mechanism removes the waste portion. This maintains a clean cutting environment and prevents dust from interfering with the cutting operation of the second mechanism, thus improving the quality of the electrode plate formation. In some embodiments of the first aspect of the present application, the transport mechanism comprises a first transmission roller and a second transmission roller that cooperate to transport the electrode plate, and the first limiting element and the second limiting element are both located between the first transmission roller and the second transmission roller in a transport direction of the electrode plate. In the above technical solution, the first transmission roller and the second transmission roller cooperate to transport the electrode plate, so that the transport stability can be improved, in order to improve the cutting stability and the forming quality of the electrode plate. nfrzonn / eznz / B / Yi - 8 Brief Description of the Figures of the Invention To more clearly describe the technical solutions of the embodiments of this application, the required accompanying drawings of the embodiments are briefly described below. It should be understood that the following accompanying drawings illustrate only some embodiments of this application and should therefore not be interpreted as limiting its scope. Those skilled in the art can also derive other relevant accompanying drawings from these accompanying drawings without any further creative effort. FIG. 1 is a schematic structural diagram of a die-cutting device according to some embodiments of the present application; FIG. 2 is a schematic structural diagram of a first limiting element from a first perspective according to some embodiments of the present application; FIG. 3 is a schematic structural diagram of a first limiting element from a second perspective according to some embodiments of the present application; FIG. 4 is a schematic structural diagram of a first limiting element from a third perspective according to some embodiments of the present application; Figure 5 is a schematic structural diagram of a die-cutting device according to some other embodiments of the present application; FIG. 6 is a schematic structural diagram of an adsorption mechanism provided with adsorption holes; FIG. 7 is a schematic structural diagram of a second limiting element according to an embodiment of the present application; and Figure 8 is a schematic structural diagram of a die-cutting device according to further embodiments of the present application. List of reference symbols: 100 - die-cutting device; 10 - transport mechanism; 11 - first transmission roller; 12 - second transmission roller; 20 - first cutting mechanism; 30 - first limiting element; 31 - first cutting hole; 32 - first rolling body; 33 - first limiting portion; 331 - first surface; 34 - first connecting portion; 40 - second limiting element; 41 - second cutting hole; 42 - second rolling body; 43 - second limiting portion; 44 - second connecting portion; 50 - guide mechanism; 51 - adsorption face; 52 - first adsorption hole; 53 - second adsorption hole; nfrzonn / eznz / B / Yi - 960 - second cutting mechanism; 70 - third limiting element; 71 - through hole; 80 - dust removal mechanism; 90 - waste collection mechanism; 200 - electrode plate; 210 - uncoated region; 220 - coated region; 300 - laser light; A - direction of electrode plate thickness; B - direction of electrode plate transport; C - direction of electrode plate width. nfrzonn / pznz / e / Yi Detailed Description of the Invention To further clarify the objectives, technical solutions, and advantages of the embodiments of this application, the technical solutions of the embodiments of this application will be clearly and completely described below, with reference to the accompanying drawings of the embodiments of this application. Obviously, the embodiments described are some, rather than all, of the embodiments of this application. In general, the assemblies of the embodiments of this application described and illustrated in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application as claimed, but is merely representative of selected embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without any creative effort shall fall within the scope of protection of this application. It should be noted that the realizations of this application and the characteristics of the realizations can be combined with each other without conflict. It should be noted that analogous numbers and letters refer to analogous elements in the following attached drawings, so once an element has been defined in an attached drawing, it does not require further definition and explanation in subsequent attached drawings. In describing the embodiments of this application, it should be noted that the orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings or are orientations or positional relationships in which a product of this application is conventionally placed when in use or the orientations or positional relationships - 10. These terms are commonly understood by those skilled in the art and are intended only to facilitate and simplify the description of this application, rather than to indicate or imply that the device or item referred to must have a particular orientation or be constructed and operated in a particular orientation, and should not be interpreted as limiting this application. Furthermore, the terms first, second, third, etc., are used merely for clarity and should not be interpreted as indicating or implying relative importance. Currently, from the perspective of evolving market trends, traction batteries are being used more and more widely. They are not only used in energy storage power systems such as hydroelectric, thermal, wind, and solar power plants, but also extensively in electric transportation such as electric bicycles, electric motorcycles, and electric vehicles, and in many fields such as aerospace and military equipment. With the continuous expansion of the application of traction batteries, market demand for them is also growing. A battery cell comprises an electrode assembly and an electrolyte. The electrode assembly consists of a positive electrode plate, a negative electrode plate, and a separator. The operation of the battery cell is based primarily on the movement of metal ions between the positive and negative electrode plates. Each positive electrode plate and negative electrode plate comprises a coated region and an uncoated region. The uncoated region is connected to the coated region and extends beyond it in one direction, spanning the width of the electrode plate. On the positive electrode plate, the coated region is covered with a layer of positive active material, which can be lithium cobaltate, lithium iron phosphate, ternary lithium, or lithium manganate, among others. On the negative electrode plate, the coated region is covered with a layer of negative active material, which can be carbon or silicon, among others. A tab of the electrode plate is formed in the uncoated region.In some other embodiments, to ensure the structural strength of the tongue, the portion of the tongue near the coated region can also be coated with a certain layer of active material. nfrzonn / eznz / B / Yi - 11 The inventor has discovered that, in the prior art, regardless of whether it is a positive electrode plate or a negative electrode plate, during the process of cutting an uncoated region to form a tongue, both a transport force from a transport mechanism and a cutting force from a cutting mechanism of the electrode plate cause the electrode plate to fluctuate greatly in one direction of the electrode plate thickness, resulting in poor cutting stability, and an excessive fluctuation amplitude of the electrode plate can also cause the electrode plate to be outside a cutting range of the cutting mechanism, resulting in incomplete cutting or failure to achieve cutting and severely affecting the forming quality of the electrode plate. Based on the above considerations, to solve the problem of poor electrode plate formation quality caused by electrode plate fluctuation during the cutting process to form a tab, the inventor has designed, through in-depth research, a die-cutting device in which a first limiting element is provided, having a cutting hole that allows laser light to pass through, and a second limiting element, on two sides of an electrode plate, which respectively limit the electrode plate on the two sides of the electrode plate in one thickness direction, in order to cooperatively limit the fluctuation range of the electrode plate in the thickness direction to improve cutting stability, thereby improving the formation quality of the electrode plate.The first limiting element is located between the electrode plate and the first cutting mechanism in the direction of the thickness of the electrode plate, and the cutting hole is provided to allow the laser light emitted by the first cutting mechanism to pass through, in order to cut the electrode plate and prevent the laser light from cutting the first limiting element. With reference to FIG. 1, FIG. 1 is a schematic structural diagram of a die-cutting device 100 according to certain embodiments of the present application. The die-cutting device 100 comprises a transport mechanism 10, a first cutting mechanism 20, a first limiting element 30, and a second limiting element 40. The transport mechanism 10 is configured to transport an electrode plate 200. The electrode plate 200 comprises an uncoated region 210 (shown in FIG. 8) and a coated region 220 (shown in FIG. 8), the uncoated region 210 being connected to nfrzonn / eznz / B / Yi - 12the coated region 220. The first cutting mechanism 20 is located on one side of the electrode plate in a direction of thickness A and the first cutting mechanism 20 is configured to cut the uncoated region 210 to allow the uncoated region 210 to form a waste portion (not shown in the figure) connected to the coated region 220 and a tab (not shown in the figure) connected to the coated region 220 and separated from the waste portion. The first limiting element 30 is located between the electrode plate 200 and the first cutting mechanism 20 in the thickness direction and the first limiting element 30 is provided with a cutting hole (shown in FIG. 2 and defined as a first cutting hole 31) that allows the laser light 300 emitted by the first cutting mechanism 20 to pass through, the cutting hole coinciding with a cutting path of the laser light 300.The second limiting element 40 is located on the side of the electrode plate 200 which is oriented in the opposite direction to the first limiting element 30 in the thickness direction and the second limiting element 40 is configured to cooperate with the first limiting element 30 to limit the electrode plate 200 in the thickness direction. In some embodiments, the transport mechanism 10 includes a first transmission roller 11 and a second transmission roller 12. The first transmission roller 11 and the second transmission roller 12 cooperate to transport the electrode plate 200, and the first limiting element 30 and the second limiting element 40 are located between the first transmission roller 11 and the second transmission roller 12 in a transport direction B of the electrode plate 200. The transport mechanism 10 transports the electrode plate 200 to the first cutting mechanism 20 at a predetermined speed, and the first cutting mechanism emits laser light 300 to the electrode plate 200 to cut the uncoated region 210. The first transmission roller 11 and the second transmission roller 12 cooperate to transport the electrode plate 200, so that the transport stability can be improved, in order to improve the cutting stability and the forming quality of the electrode plate 200. The first cutting mechanism 20 is located on one side of the electrode plate in the direction of thickness A, and the first limiting element 30 is located between the electrode plate 200 and the first cutting mechanism 20 in the direction of thickness A of the electrode plate. The laser light 300 activated by the first nfrzonn / eznz / B / Yi - The cutting mechanism 20 passes through the cutting hole in the first limiting element 30 and then acts on the electrode plate 200 to cut the uncoated region 210 of the electrode plate 200. The first cutting mechanism 20 is a laser light cutting mechanism 300, the transport mechanism 10 transports the electrode plate 200 to the first cutting mechanism 20 at a certain speed, and the first cutting mechanism emits the laser light 300 to the electrode plate 200 to cut the uncoated region 210. The cutting hole (the first cutting hole 31) coincides with the cutting path of the laser light 300 (the laser light emitted by the first cutting mechanism 20), so it can be understood that the shape of the cutting hole is the same as the moving path of the laser light 300 emitted by the first cutting mechanism 20 and it can also be understood that the laser light 300 emitted by the first cutting mechanism 20 can move in the cutting hole, in order to cut the electrode plate 200 without cutting the first limiting element 30. The cutting hole can have various shapes, for example, the cutting hole has a rectangular shape, an I-shape, a circular shape, etc., as long as the first limiting element 30 can prevent the laser light 300 emitted by the first cutting mechanism 20. In some embodiments, the second limiting element 40 may also be provided with a cutting hole. The cutting hole in the first limiting element 30 is arranged opposite the cutting hole in the second limiting element 40 in the direction of the thickness A of the electrode plate, and the cutting hole in the second limiting element 40 also allows the laser light 300 emitted by the first cutting mechanism 20 to pass through, in order to prevent the laser light 300 passing through the electrode plate 200 from cutting the second limiting element 40. The shape and size of the cutting hole provided in the second limiting element 40 may correspond to the shape and size of the cutting hole provided in the first limiting element 30.For convenience in illustrating the figures, the cutting hole in the first limiting element 30 is defined as a first cutting hole 31 and the cutting hole in the second limiting element 40 is defined as a second cutting hole 41 (shown in FIG. 7). During the process of cutting the electrode plate 200 to form the tab, both a transport force from the transport mechanism 10 and a cutting force from the cutting mechanism can cause the electrode plate nfrzonn / eznz / B / Yi - 14200 fluctuates in the thickness direction, resulting in unstable cutting that affects the cut quality of the tongue. Excessive fluctuation amplitude of electrode plate 200 can also cause it to fall outside the cutting range of the cutting mechanism, resulting in incomplete or no cut at all. The first limiting element 30 and the second limiting element 40 are provided on the two sides of electrode plate 200, respectively. These elements limit the electrode plate 200 on both sides in the thickness direction A, cooperatively limiting its fluctuation range and thus improving cutting stability and the forming quality of the electrode plate 200.The first limiting element 30 is located between the electrode plate 200 and the first cutting mechanism 20 in the direction of the thickness A of the electrode plate and the cutting hole is provided to allow the laser light 300 emitted by the first cutting mechanism 20 to pass through, in order to cut the electrode plate 200 and prevent the laser light 300 from cutting the first limiting element 30. Referring to FIG. 1, in some embodiments, the first limiting element 30 and the second limiting element 40 overlap at least partially in the thickness direction to form an overlapping region, and the first cutting mechanism 20 is configured to cut the uncoated region 210 into the overlapping region. The thickness direction in this document refers to the thickness direction A of the electrode plate. The fact that the first limiting element 30 and the second limiting element 40 overlap at least partially to form the overlapping region actually means that the projections of the first limiting element 30 and the second limiting element 40 onto the electrode plate 200 overlap at least partially in the thickness direction A of the electrode plate. It may be that two ends of the first limiting element 30 are flush with two ends of the second limiting element 40 in a transport direction B of the electrode plate. It may also be that one end of the first limiting element 30 is flush with one end of the second limiting element 40 in the transport direction B of the electrode plate, and the other end of the second limiting element 40 extends beyond the other end of the first limiting element. - 1530 in the transport direction B of the electrode plate (which is like the relative relationship between the first limiting element 30 and the second limiting element 40 as shown in FIG. 1); or in the transport direction B of the electrode plate, one end of the first limiting element 30 is beyond one end of the second limiting element 40 in the opposite direction of the transport direction B of the electrode plate, and the other end of the second limiting element 40 is beyond the other end of the second limiting element 40 in the transport direction B of the electrode plate. The first limiting element 30 and the second limiting element 40 both cover at least part of the uncoated region 210 in one direction of the width C of the electrode plate. The laser light 300 emitted by the first cutting mechanism 20 is projected onto the overlapping region. The first cutting mechanism 20 cuts the uncoated region 210 into the overlapping region formed by the first limiting element 30 and the second limiting element 40, so that both sides of the electrode plate 200 in the thickness direction corresponding to the cutting region of the first cutting mechanism 20 are both limited. This can limit the fluctuation range of the electrode plate 200 in the thickness direction A and limit the degree of fluctuation of the electrode plate 200 in the thickness direction A within the cutting range of the first cutting mechanism 20, thus improving cutting stability. In some embodiments, the first limiting element 30 comprises a first rolling body 32 configured to abut against the uncoated region 210. The first rolling element 32 can have many structural forms, for example, the first rolling element 32 can be a roller shaft, a ball, etc. The fluctuation of the electrode plate 200 in the thickness direction can cause the uncoated region 210 of the electrode plate 200 to abut against the first limiting element 30, and the first rolling body 32 of the first limiting element 30 to abut against the uncoated region 210. This results in the uncoated region 210 being in rolling friction contact with the first limiting element 30, and the uncoated region 210 experiencing minimal frictional damping. This improves the transmission stability of the electrode plate 200 and reduces abrasion of the electrode plate 200, effectively preventing tongue tearing and even serious consequences such as strip breakage. This is due to the high damping between the tongue and the first limiting element 30 after the tongue has separated from the portion of nfrzonn / eznz / B / Yi. - 16 waste. In some embodiments, the first rolling body 32 is arranged downstream of the first cutting mechanism 20. It should be noted that the expressions upstream and downstream mentioned in the context of the realizations of the present application refer to production sequences, with upstream referring to the production sequence that comes first and downstream referring to the production sequence that comes later, rather than defining spatial positions of the components. One or more (two or more) first rolling bodies 32 may be provided. In an embodiment in which a plurality of first rolling bodies 32 are provided, some of the first rolling bodies 32 in the plurality of first rolling bodies 32 may be located upstream of the first cutting mechanism 20 and the other first rolling bodies 32 may be located downstream of the first cutting mechanism 20. In the case in which a plurality of first rolling bodies 32 are provided, the plurality of first rolling bodies 32 may all be located downstream of the first cutting mechanism 20. As shown in FIG. 1, the first rolling bodies 32 are roller shafts and the plurality of roller shafts are arranged side by side in parallel and at intervals in a conveying direction of the electrode plate 200. Since the waste portion and the tab are not restrained by each other after the waste portion has separated from the tab, the tab and the waste portion readily adhere to the first limiting element 30 when in contact with it. Therefore, the first rolling body 32 is arranged downstream of the first cutting mechanism 20 so that the separated tab and waste portion can both be in rolling fit with the first limiting element 30, in order to reduce the risk of tab tearing and strip breakage caused by the tab and waste portion adhering to the first limiting element 30. Referring to FIG. 1, 2, 3 and 4, FIG. 2 is a schematic structural diagram of a first limiting element 30 from a first perspective according to some embodiments of the present application, FIG. 3 is a schematic structural diagram of a first limiting element 30 from a second perspective according to some embodiments of the present application, and FIG. 4 is a schematic structural diagram of a first limiting element 30 from a third perspective according to some embodiments of the present application. - 17. In some embodiments, the first limiting element 30 further comprises a first limiting portion 33 and a first connecting portion 34, the first rolling body 32 being mounted on the first connecting portion 34 and the surface of the first limiting portion 33 that is oriented towards the electrode plate 200 being flush with the edge of the first rolling body 32 that is configured to abut against the uncoated region 210. The first limiting portion 33 has a plate-shaped structure; the cutting hole for the first limiting element 30 is provided in the first limiting portion 33; the first connecting portion 34 is connected to one end of the first limiting portion 33 and is located downstream of the first limiting portion 33; and the first limiting portion 33 has a greater thickness than the first connecting portion 34. The first rolling body 32 is rotatably mounted on the first connecting portion 34. The first rolling body 32 can be driven by a magnetic wheel. The first limiting portion 33 has a first surface 331 that is oriented towards the electrode plate 200, and the surface of the first rolling body 32 that is configured to abut against the uncoated region 210 is a circumferential face of the first rolling body 32. The surface of the first limiting portion 33 that is oriented towards the electrode plate 200 and that is flush with the edge of the first rolling body 32 that is configured to abut against the uncoated region 210 can be interpreted as the extension surface of the first surface 331 being tangent to the circumferential face of the first rolling body 32. In some embodiments, the axis of rotation of the first rolling body 32 is located in a central plane of the thickness of the first limiting portion 33, and thus the first rolling body 32 has a diameter equal to the thickness of the first limiting portion 33.The central thickness plane of the first limiting portion 33 refers to a plane located at the center of the first limiting portion 33 in a direction of the thickness of the first limiting portion 33 and parallel to the first surface 331. The direction of the thickness of the first limiting portion 33 is the same as the direction of the thickness A of the electrode plate, the thickness of the first limiting portion 33 refers to the dimension of the first limiting portion 33 in the direction of the thickness thereof, and the thickness of the first connecting portion 34 refers to the dimension of the first connecting portion 34 in the direction of the thickness of the first limiting portion 33. nfrzonn / eznz / B / Yi - 18The surface of the first limiting portion 33 that is oriented towards the electrode plate 200 is flush with the edge of the first rolling body 32 that is configured to abut against the uncoated region 210 and so the first limiting portion 33 and the first rolling body 32 are at the same distance from the electrode plate 200 to allow the electrode plate 200 to have the same range of fluctuation in the thickness direction, thereby improving cutting stability and reducing the risk of large deformation of the electrode plate 200, in order to improve the forming quality of the electrode plate 200. With reference to FIG. 5, FIG. 5 is a schematic structural diagram of a die-cutting device 100 according to some other embodiments of the present application. In some embodiments, the die-cutting device 100 further comprises a second cutting mechanism 60 and a guiding mechanism 50. The second cutting mechanism 60 is arranged on one side of the electrode plate 200 in the thickness direction, downstream of the first cutting mechanism 20, and is configured to cut the waste portion to separate it from the coated region 220. The guiding mechanism 50 is arranged downstream of the first limiting element 30 and is configured to drive the waste portion toward the second cutting mechanism 60. The second cutting mechanism 60 is a laser light cutting mechanism 300. The laser light 300 emitted by the second cutting mechanism 60 is projected on one side of the adsorption mechanism in the direction of the width C of the electrode plate, in order to prevent the laser light 300 emitted by the second cutting mechanism 60 from cutting the adsorption mechanism. The electrode plate 200 is formed in two stages by the first cutting mechanism 20 and the second cutting mechanism 60. In the first stage, the tongue is separated from the waste portion, so that during the cutting operation, the fluctuation of the waste portion has little influence on the tongue, in order to greatly reduce the risk of decrease in the product qualification index due to tongue deformation caused by the fluctuation of the waste portion and damage to the tongue caused by the pulling of the waste portion and also improve the forming quality of the electrode plate 200. As shown in FIG. 5, the first cutting mechanism 20 and the second nfrzonn / eznz / B / Yi - The first cutting mechanism 20 and the second cutting mechanism 60 are located on the same side of the electrode plate in the direction of thickness A. In other embodiments, the first cutting mechanism 20 and the second cutting mechanism 60 may be located on opposite sides of the electrode plate in the direction of thickness A. After the waste portion separates from the tab, the waste portion is cut to separate it from the coated region 220, thus completing the cutting of the electrode plate 200. The guide mechanism 50 drives the waste portion to move towards the second cutting mechanism 60 to compensate for the deformation of the electrode plate 200 during the cutting process of the first cutting mechanism 20, so that the waste portion is moved to be within the cutting range of the second cutting mechanism 60 (for the laser light cutting mechanism 300, the cutting range is the range that the laser light 300 can reach), in order to ensure that the second cutting mechanism 60 can effectively cut the electrode plate 200. In some embodiments, the guide mechanism 50 is an adsorption mechanism and the guide mechanism 50 and the second cutting mechanism 60 are located on the same side in the thickness direction. The thickness direction in this document refers to the thickness direction A of the electrode plate, and the guide mechanism 50 and the second cutting mechanism 60 are located on the same side of the thickness direction. The adsorption mechanism may be a negative pressure mechanism. In other embodiments, the guide mechanism 50 and the second cutting mechanism 60 may be located on opposite sides of the electrode plate in the thickness direction A, and the guide mechanism 50 may be a blowing mechanism configured to blow the waste portion toward the second cutting mechanism 60, such that the waste portion is displaced toward the second cutting mechanism 60. The adsorption mechanism drives the uncoated region 210 by adsorption to move towards the second cutting mechanism 60, so that the amount of displacement of the waste portion can be more precisely controlled. With reference to FIG. 6, FIG. 6 is a schematic structural diagram of an adsorption mechanism provided with adsorption holes. In some embodiments, the adsorption mechanism comprises an adsorption face provided with a plurality of adsorption holes 51. The adsorption mechanism may comprise an adsorption tape and the face of nfrzonn / eznz / B / Yi Adsorption face 51 is a surface of the adsorption tape. Each adsorption hole can have a diameter of 3 mm. The adsorption face 51 is provided with multiple rows of first adsorption holes 52 and at least one row of second adsorption holes 53, each row of first adsorption holes 52 including at least two first adsorption holes 52 arranged at intervals in the width direction C of the electrode plate, the multiple rows of first adsorption holes 52 being arranged at intervals in the transport direction B of the electrode plate, and a row of second adsorption holes 53 being provided between two adjacent rows of first adsorption holes 52. The spacing of the two adjacent rows of first adsorption holes 52 can be 2 mm and the spacing between the two adjacent rows of second adsorption holes 53 can be 2 mm.In some embodiments, the adsorption face 51 is flush with the first surface 331 of the first limiting portion 33 which is configured to abut against the uncoated region 210. In the same row of first adsorption holes 52, the two adjacent first adsorption holes 52 are equidistant from the center of each first adsorption hole to the center of the nearest second adsorption hole 53, i.e., in FIG. 6, L1 = L2. In this way, the adsorption holes are staggered so that when the waste portion is not completely out of control of the front row of adsorption holes, the next row of adsorption holes is in operation, ensuring that the separation of the waste portion from the coated region 220 is always controlled, thus preventing the influence of the waste portion fluctuation on shear stability. Therefore, the provision of adsorption holes can improve adsorption stability, thereby effectively improving the shear stability of the waste portion. In some embodiments, the guide mechanism 50 and the first limiting element 30 are located on the same side in the thickness direction; and the second limiting element 40 comprises second rolling bodies 42 configured to abut against the uncoated region 210. The second rolling bodies 42 can have many structural forms, for example, the second rolling bodies 42 can be roller shafts, balls, etc. The guide mechanism 50 and the first limiting element 30 are located on the same side of the electrode plate in the direction of thickness A, the non-nfrzonn / eznz / B / Yi region -21 coated 210 can abut against the second limiting element 40 due to the fluctuation of the electrode plate 200 in the thickness direction and the second rolling bodies 42 of the second limiting element 40 abut against the uncoated region 210, so that the uncoated region 210 is in rolling friction contact with the second limiting element 40 and the uncoated region 210 has a small friction damping, thus improving the transmission stability of the electrode plate 200 and reducing the abrasion of the electrode plate 200, in order to effectively prevent the tearing of the tongue, even serious consequences such as the breakage of the strip, due to the large damping between the tongue and the second limiting element 40 after the tongue has separated from the waste portion. Referring to FIG. 7, FIG. 7 is a schematic structural diagram of a second limiting element according to some embodiments of the present application. In some embodiments, a plurality of second rolling bodies 42 is provided; the plurality of second rolling bodies 42 are located downstream of the first cutting mechanism 20, some of the plurality of second rolling bodies 42 are located upstream of the second cutting mechanism 60, and some of the plurality of second rolling bodies 42 are located downstream of the second cutting mechanism 60. In other embodiments, some of the plurality of second rolling bodies 42 may be located upstream of the first cutting mechanism 20. Some of the second rolling bodies 42 are arranged upstream of the second cutting mechanism 60 and some of the second rolling bodies 42 are arranged downstream of the second cutting mechanism 60, so that the waste portion can be in rolling contact with the second limiting element 40 before and after separating from the coated region 220, in order to reduce the resistance of the electrode plate 200 during the transmission process, improve the transmission stability of the electrode plate 200 and reduce the abrasion of the electrode plate 200. With further reference to FIG. 7, in some embodiments, the second limiting element 40 further comprises a second limiting portion 43 and a second connecting portion 44, the second rolling bodies 42 being mounted on the second connecting portion 44 and the surface of the second limiting portion 43 that is oriented towards the electrode plate 200 being flush with the edges of the second rolling bodies 42 that are configured to abut nfrzonn / eznz / B / Yi -22 against the waste portion. The second limiting portion 43 has a plate-like structure; the second limiting portion 43 is positioned opposite the first limiting portion 33; the cutting hole for the second limiting element 40 is provided in the second limiting portion 43; the second connecting portion 44 is connected to one end of the second limiting portion 43 and located downstream of the second limiting portion 43; and the second limiting portion 43 has a greater thickness than the second connecting portion 44. The second rolling bodies 42 are rotatably mounted on the second connecting portion 44. The second limiting portion 43 has a second surface that is oriented towards the electrode plate 200, and the surfaces of the second rolling bodies 42 that are configured to abut against the uncoated region 210 are circumferential faces of the second rolling bodies 42.The surface of the second limiting portion 43 that is oriented towards the electrode plate 200, which is flush with the edges of the second rolling bodies 42 configured to abut against the uncoated region 210, can be interpreted as the extension surface of the second surface being tangent to the circumferential faces of the second rolling bodies 42. In some embodiments, the axes of rotation of the second rolling bodies are located in a central plane of thickness of the second limiting portion 43, and thus each second rolling body 42 has a diameter equal to the thickness of the second limiting portion 43. The central plane of thickness of the second limiting portion 43 refers to a plane located at the center of the second limiting portion 43 in a direction of thickness of the second limiting portion 43 and parallel to the second surface.The direction of the thickness of the second limiting portion 43 is consistent with the direction of the thickness A of the electrode plate, the thickness of the second limiting portion 43 refers to the dimension of the second limiting portion 43 in the direction of the thickness of the same and the thickness of the second connection portion 44 refers to the dimension of the second connection portion 44 in the direction of the thickness of the second limiting portion 43. The surface of the second limiting portion 43 that is oriented towards the electrode plate 200 is flush with the edges of the second rolling bodies 42 that are configured to abut against the uncoated region 210, and thus the second limiting portion 43 and the second rolling bodies 42 are the same distance from the electrode plate 200 to allow the plate of nfrzonn / eznz / B / Yi -23 electrodes 200 have the same fluctuation range in the thickness direction, thus improving cutting stability and reducing the risk of large deformation of the electrode plate 200, in order to improve the forming quality of the electrode plate 200. With reference to FIG. 8, FIG. 8 is a schematic structural diagram of a die-cutting device 100 according to some embodiments of the present application. In some embodiments, the die-cutting device 100 further comprises a third limiting element 70, and in the thickness direction, the third limiting element 70 is arranged on one side of the coated region 220 and is configured to limit the coated region 220 in a direction of displacement of the waste portion. The third limiting element 70 has a plate-shaped structure and in the direction of the width C of the electrode plate, the third limiting element 70 and the guide mechanism 50 are arranged side by side in an interval and the laser light 300 emitted by the second cutting mechanism 60 passes between the third limiting element 70 and the guide mechanism 50 and is then projected towards the electrode plate 200. Since the waste portion will cause the displacement of the coated region 220 to deform the electrode plate 200 during the process of the guide mechanism 50 that drives the waste portion to move towards the second cutting mechanism 60, the coated region 220 is limited by the third limiting element 70 in the direction of displacement of the waste portion, so that the maximum deformation of the electrode plate 200 is limited, in order to improve the forming quality of the electrode plate 200. In some embodiments, the third limiting element 70 is provided with a plurality of through holes 71. The plurality of through holes 71 can be arranged in many ways, such as arranged in a rectangular series or arranged in a circular series. The through holes 71 are provided in such a way that dust does not easily accumulate in the third limiting element 70, and the provision of the through holes 71 can also reduce the weight of the third limiting element 70. In some embodiments, the die-cutting device 100 further comprises a dust removal mechanism 80 (shown in FIG. 5). The dust removal mechanism 80 is configured to remove the dust generated on the plate nfrzonn / eznz / B / Yi -24 of electrodes 200 when the second cutting mechanism 60 cuts the waste portion of the electrode plate 200. As shown in FIG. 5, two dust removal mechanisms 80 can be provided. The two dust removal mechanisms 80 are arranged on two sides of the electrode plate in the direction of thickness A, in order to remove dust from the electrode plate 200 from both sides of the electrode plate in the direction of thickness A, thereby improving the dust removal efficiency. In some embodiments, a dust removal mechanism 80 corresponding to a cutting position of the first cutting mechanism 20 can be provided to remove the dust generated on the electrode plate 200 when the first cutting mechanism 20 cuts the electrode plate 200 to form a tab.Since the first cutting mechanism 20 produces less dust when cutting, the dust removal mechanism 80 corresponding to the first cutting mechanism 20 can be arranged on one or both sides of the electrode plate 200 in the width direction and the dust can be adsorbed on one side of the electrode plate in the width direction C by means of a negative pressure dust removal mechanism 80. The dust removal mechanism 80 can be a negative pressure dust removal mechanism 80, and in the case of two negative pressure dust removal mechanisms 80 being distributed on two sides of the electrode plate in the direction of thickness A, according to an actual dust spray trajectory generated in front of and behind the electrode plate 200, the convection negative pressure dust removal mechanisms 80 are designed in front of and behind a cutting point of the electrode plate 200, thus improving the dust removal efficiency without affecting the cutting stability. For the structure of the negative pressure dust removal mechanism 80, refer to the related technical document, which will not be repeated herein. Of course, the dust removal mechanism 80 can be of other shapes. During the process of separating the waste portion from the coated region 220, a portion of the coating will generally be cut away, generating a significant amount of dust. The dust removal mechanism 80 is configured to remove the dust generated on the electrode plate 200 when the second cutting mechanism 60 cuts the nfrzonn / eznz / B / Yi -25 portion of waste from the electrode plate 200, in order to maintain a clean cutting environment and avoid the influence of dust on the cutting operation of the second cutting mechanism 60, which is conducive to improving the forming quality of the electrode plate 200. In some embodiments, the die-cutting device 100 further comprises a waste collection mechanism 90. The waste collection mechanism 90 is arranged downstream of the second cutting mechanism 60 and the waste collection mechanism 90 is configured to collect the waste portion separated from the coated region 220. Referring to FIG. 5, a die-cutting device 100 is provided according to an embodiment of the present application. The die-cutting device 100 comprises a transport mechanism 10, a first cutting mechanism 20, a first limiting element 30, a second limiting element 40, a guiding mechanism 50, a second cutting mechanism 60, a third limiting element 70, two dust removal mechanisms 80, and a waste collection mechanism 90. The first limiting element 30 and the second limiting element 40 are arranged opposite each other on two sides of an electrode plate in a thickness A direction. The first limiting element 30 is provided with a first V-shaped cutting hole 31. The first cutting mechanism 20 is arranged on the side of the first limiting element 30, which is oriented away from the electrode plate 200 in the thickness A direction of the electrode plate. The first cutting mechanism 20 is a laser light cutting mechanism 300, and the laser light 300 emitted by the first cutting mechanism 20 passes through the first cutting hole 31 and cuts an uncoated region 210 of the electrode plate 200, such that the uncoated region 210 forms a waste portion connected to the coated region 220 and a tab connected to the coated region 220 and separated from the waste portion.The first limiting element 30 comprises a first limiting portion 33, a first connecting portion 34 and a plurality of first rolling bodies 32, the first connecting portion 34 being connected to the first limiting portion 33 and located downstream of the first limiting portion 33 and the first rolling bodies 32 being rotatably connected to the first connecting portion 34. The second cutting mechanism 60 and the guide mechanism 50 are both located downstream of the first cutting mechanism 20 and the second cutting mechanism 60, the guide mechanism 50, the third limiting element 70 and the first cutting mechanism nfrzonn / eznz / B / Yi -2620 are located on the same side of the electrode plate in the direction of thickness A. The second cutting mechanism 60 is configured to cut the waste portion to separate the waste portion from the coated region 220. The second cutting mechanism 60 is a laser light cutting mechanism 300 and the guiding mechanism 50 is an adsorption mechanism. The second limiting element 40 comprises a second limiting portion 43, a second connecting portion 44 and a plurality of second rolling bodies 42.The second connection portion 44 is connected to the second limiting portion 43 and located downstream of the second limiting portion 43. The second rolling bodies 42 are rotatably connected to the second connection portion 44. Some of the second rolling bodies 42 are located downstream of the second cutting mechanism 60, and some of the second rolling bodies 42 are located upstream of the second cutting mechanism 60. A plurality of through holes 71 are provided in the third limiting element 70 and the third limiting element 70 is configured to limit the coated region 220 in a displacement direction of the waste portion. The two dust removal mechanisms 80 are arranged respectively on two sides of the electrode plate in the direction of thickness A to form the dust absorption by convection, in order to remove the dust generated on the electrode plate 200 when the second cutting mechanism 60 cuts the waste portion of the electrode plate 200. The waste collection mechanism 90 is arranged downstream of the second cutting mechanism 60 to collect the waste portion separated from the covered region 220. The foregoing descriptions are merely preferred embodiments of the present application and are not intended to limit its scope. For those skilled in the art, various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, and the like made within the spirit and principle of the present application shall fall within the scope of protection of the present application. It is hereby stated that, as of this date, the best method known to the applicant for carrying out the aforementioned invention is that which is clear from the present description of the invention.

Claims

1. A die-cutting device, comprising: a transport mechanism configured to transport an electrode plate comprising an uncoated region and a coated region, the uncoated region being connected to the coated region; a first cutting mechanism located on a side of the electrode plate in a thickness direction and configured to cut the uncoated region, such that the uncoated region forms a waste portion connected to the coated region and a tab connected to the coated region and separated from the waste region; a first limiting element located between the electrode plate and the first cutting mechanism in the thickness direction and provided with a cutting hole allowing laser light emitted by the first cutting mechanism to pass through, the cutting hole coinciding with a cutting path of the laser light;and a second limiting element located on the side of the electrode plate that is oriented in the opposite direction to the first limiting element in the thickness direction and configured to cooperate with the first limiting element to limit the electrode plate in the thickness direction.

2. The die-cutting device according to claim 1, wherein the first limiting element and the second limiting element overlap at least partially in the thickness direction to form an overlapping region and the first cutting mechanism is configured to cut the uncoated region into the overlapping region.

3. The die-cutting device according to claim 1 or 2, wherein the first limiting element comprises a first rolling body configured to abut against the uncoated region.

4. The die-cutting device according to claim 3, wherein the first rolling body is arranged downstream of the first cutting mechanism.

5. The die-cutting device according to claim 3 or 4, wherein the first limiting element further comprises a first limiting portion -28 and a first connecting portion, the first rolling body being mounted on the first connecting portion and the surface of the first limiting element that is oriented towards the electrode plate being flush with the edge of the first rolling body that is configured to abut against the uncoated region.

6. The die-cutting device according to any one of claims 1-5, further comprising: a second cutting mechanism disposed on a side of the electrode plate in the thickness direction, arranged downstream of the first cutting mechanism and configured to cut the waste portion to separate the waste portion from the coated region; and a guide mechanism disposed downstream of the first limiting element and configured to drive the waste portion to move towards the second cutting mechanism.

7. The die-cutting device according to claim 6, wherein the guide mechanism is an adsorption mechanism and the guide mechanism is located on the same side as the second cutting mechanism in the thickness direction.

8. The die-cutting device according to claim 7, wherein the adsorption mechanism comprises an adsorption face provided with a plurality of adsorption holes.

9. The die-cutting device according to any one of claims 6-8, wherein the guide mechanism is located on the same side as the first limiting element in the thickness direction; and the second limiting element comprises second rolling bodies configured to abut against the uncoated region.

10. The die-cutting device according to claim 9, wherein a plurality of second rolling bodies are provided and are located downstream of the first cutting mechanism, some of the plurality of second rolling bodies being located upstream of the second cutting mechanism and some of the plurality of second rolling bodies being located downstream of the second cutting mechanism.

11. The die-cutting device according to claim 9 or 10, wherein the second limiting element further comprises a second limiting portion and a second connecting portion, the second rolling bodies being mounted on the second connecting portion and the surface of the second limiting portion that is oriented towards the electrode plate being flush with the edges of the second rolling bodies that are configured to abut against the waste portion.

12. The die-cutting device according to any one of claims 6-11, further comprising a third limiting element disposed on one side of the coated region in the thickness direction and configured to limit the coated region in a direction of displacement of the waste portion.

13. The die-cutting device according to claim 12, wherein the third limiting element is provided with a plurality of through holes.

14. The die-cutting device according to any one of claims 6-13, further comprising: a dust removal mechanism configured to remove the dust generated on the electrode plate when the second cutting mechanism cuts the waste portion of the electrode plate.

15. The die-cutting device according to any one of claims 1-14, wherein the transport mechanism comprises a first transmission roller and a second transmission roller cooperating to transport the electrode plate, and the first limiting element and the second limiting element are both located between the first transmission roller and the second transmission roller in a transport direction of the electrode plate.