POLYAMIDE MOLDING COMPOUND AND ITS USE AND MOLDINGS MANUFACTURED FROM THE MOLDING COMPOUND.

Abstract

The present invention relates to polyamide molding compounds comprising a semicrystalline copolyamide, at least one filler, and optionally additives. The invention also relates to moldings manufactured from these molding compounds and to the use of the molding compounds for manufacturing moldings.

Description

POLYAMIDE MOLDING COMPOUND AND ITS USE AND MOLDINGS MANUFACTURED FROM THE MOLDING COMPOUND The present invention relates to polyamide molding compounds comprising a semicrystalline copolyamide, at least one filler, and optionally additives. The invention also relates to molds manufactured from these compounds and to the use of the molding compounds for manufacturing molds. A number of polyamide molding compounds are known from the prior art, in which the composition of the molding compound is tailored to the desired property profile. In particular, with reinforced polyamide molding compounds, a glossy and smooth surface finish should be achievable in the molds produced from them, in addition to advantageous mechanical properties. The technical processing properties of the molding compounds should not be hindered by the present process. However, with fiberglass-reinforced injection-molded products, the surface of the molded parts is frequently dull and rough due to irregularities or the fiberglass effect. With visible molded parts, which are often relevant to the design of a body, this effect is generally undesirable. The surface quality of an injection-molded part is affected, among other things, by the crystallization behavior of the copolyamide. The high temperatures of the injection molding tools can certainly improve surface quality, but they can also extend the cooling time before reaching the demolding temperature. Transparent polyamides are known from document GB 1 433 144, from which molds can be manufactured at relatively high temperatures without losing good mechanical properties. Amorphous polyamides are formed from a mixture of 1,3-bis(aminomethyl)cyclohexane and an aliphatic diamine, and a mixture of an aromatic and aliphatic dicarboxylic acid. The surface properties of molds manufactured from these molding compounds are not addressed in this document. Fibers composed of a mixture of homopolyamide (PA 6 or PA 66) and a copolyamide consisting of more than 80% by weight of homopolyamide monomers and less than 20% of 1,3-bis(aminomethyl)cyclohexane and 1,6-hexanediamine are known from document GB 2 351 898. Both aliphatic and aromatic dicarboxylic acids are used as carboxylic acids. These fibers are particularly suitable for the production of textile materials. Polyamide resin compositions are known from EP 1 182 228 A1, which has a good production cycle due to a shortened crystallization time. Molds manufactured from these resins demonstrate good mechanical properties at temperatures of 1002°C or higher. Copolyamide resin is used for this purpose, employing a 1,4-bis(aminomethyl)cyclohexane diamine component and an additional diamine component of either xylenediamine or hexamethylenediamine, with adipic acid as the dicarboxylic acid component. The molding compound also contains nucleating agents. Based on this, one objective of the present invention was to provide polyamide molding compounds that allow the production of molds that have very good visual properties in addition to high toughness. The present objective is achieved by means of the polyamide molding compound having the characteristics of claim 1 and by means of the molds having the characteristics of claim 12. The uses according to the invention are provided in claim 14. According to the invention, polyamide molding compounds are provided comprising or consisting of the following components (A) to (C): (A) 22 to 70% by weight of a semicrystalline copolyamide formed from the monomers (a1) to (a5): (a1) from 20 to 37.5 mol% of 1,6-hexanediamine; (a2) 12.5 to 25% 1,34-bis(aminomethyl)cyclohexane; (a3) 0 to 5 mol% of at least one diamine having 2 to 35 carbon atoms, differing from monomers (a1) and (a2); (a4) 45 to 50 mol% of 1,6-hexanedioic acid (a5) 0 to 5 mol% of at least one dicarboxylic acid having 2 to 44 carbon atoms, differing from the monomer (a4); where the proportions of the monomers (a1), (a2) and (a3) ​​are with respect to the sum of the diamines used and represent up to 50% by moles; and QLCQnn / nznz / e / YiAi where the proportions of monomers (a4) and (a5) are with respect to the sum of the dicarboxylic acids used and represent up to 50% by moles; and where the proportions of monomers (a1) to (a5) represent 100% by moles. (B) 30 to 70% by weight of at least one filler; and (C) 0 to 8% by weight of at least one additive, wherein component (C) differs from component (B) and wherein the ratio of components (A) to (C) represents up to 100% by weight. Definition of terms • Notation and abbreviations for polyamides and their monomers For the purposes of the present invention, the term polyamide (abbreviated PA) is understood as an umbrella term; it includes homopolyamides and copolyamides. The notation and abbreviations selected for polyamides and their monomers correspond to those explained in ISO 16396-1 (2015, (D)). The abbreviations used herein are employed herein as synonyms with the IUPAC names of the monomers. In particular, the following abbreviations are used for the monomers of the present application: 1,3-BAC for 1,3-bis(aminomethyl)cyclohexane (also known as 1,3-cyclohexane dimethanamine, CAS No. 2579-20-6); 1,4-BAC for 1,4-bis(aminomethyl)cyclohexane (also called 1,4-cyclohexane dimethanamine, CAS No. 2549-93-1); IDP for isophoronediamine (also called 3-(aminomethyl)-3,5,5-trimethylcyclohexaneamine, 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane, or cyclohexane methanamine, 5-amino-1,3,5,5-trimethyl, CAS No.CAS 2855-13-2); MACM for bis(4-amino-3-methylcyclohexyl)methane (also called 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane), CAS No. 6864-37-5); PACM for bis(4-aminocyclohexyl)methane (also called 4,4'-diamino-cyclohexyl)methane, CAS No. 1761-71-3); 6 for 1,6-hexanediamine (CAS No. 124-09-4); T for terephthalic acid (CAS No. 100-21-0); I for isophthalic acid (CAS No. 121-95-5); 6 for 1,6-hexanedioic acid (CAS No. 124-04-9). • General observations on the compounds The terms "contain" and "comprising" in these claims and in the description mean that additional components are not excluded. Within the context of the present invention, the expression "consist of" is understood to mean QLCQnn / nznz / e / YiAi as the preferred realization of the terms contain or comprise. A group is defined as containing or comprising at least a specific number of components; this is also understood to mean that the group is disclosed as preferably consisting of these components. • General observations on quantity indications The polyamide molding compounds according to the present invention contain or consist of components (A), (B), and optionally (C); the provision herein being that components (A), (B), and (C) sum to 100% by weight. It is understood that the fixed ranges of quantity indications for the individual components (A), (B), and (C) are such that an arbitrary quantity of each of the individual components may be selected within the specified ranges, provided that the strict condition that the sum of all components (A) to (C) is 100% by weight is met. • Semi-crystalline polyamides In the sense of the present invention, semicrystalline copolyamides are those copolyamides that have a melting point and / or those copolyamides that preferably have a heat of fusion of more than 4 J / ga and a heating rate of 20 K / min in differential scanning calorimetry (DSC) according to ISO 11357-3 (2013). Polyamide molding compound The polyamide molding compound according to the invention contains components (A) and (B), and optionally (C) or consists of them. The proportion of component (A) in the polyamide molding compound is preferably within the range of 29 to 64.9% by weight, particularly preferably within the range of 36 to 59.8% by weight, with respect to the total weight of the polyamide molding compound. The proportion of component (B) in the polyamide molding compound is preferably within the range of 35 to 65% by weight, and particularly preferably within the range of 40 to 60% by weight, with respect to the total weight of the polyamide molding compound. The proportion of component (C) in the polyamide molding compound is preferably within the range of 0.1 to 6% by weight, and particularly preferably within the range of 0.2 to 4% by weight, with respect to the total weight of the polyamide molding compound. QLCQnn / nznz / e / YiAi The behavior of polyamide molding compounds in thermoplastic processing to produce molded parts by injection molding or extrusion is influenced by a number of thermal properties of the molding compound. Cycle time has a substantial influence on the economics of the injection molding process. The cooling time of the molding compound in the tool until the parts are stable enough to be removed from the mold without deformation or ejection marks is limiting. Ideally, the molding compound should also crystallize completely during the cooling time in the tool. Delayed crystallization after demolding results in shrinkage and deformation. Fast-setting molding compounds are characterized by a high crystallization rate and a short cycle time. A low melting point saves energy because the mass temperature can be lower. At the same time, it can prevent the thermal degradation and discoloration of the molding compound associated with it. At the same time, the crystallization temperature and rate may not be as high; however, the molding compound solidifies immediately upon contact with the cold surface of the tool. Effective holding pressure without premature solidification of the molding compound is required for accurate surface demolding. Molding compounds according to the invention achieve a very good surface with good crystallinity in the minimum cooling time specified by the thermal conductivity of the polyamide molding compound with typical wall thicknesses. At least a high toughness of the models is desirable, which is expressed by a high modulus of elasticity. For a high surface gloss, the tool temperature generally needs to be higher than the glass transition temperature. However, excessively high tool temperatures unnecessarily extend the cooling time and can result in adhesion and surface markings on the workpieces. It should also be noted that at tool temperatures of 190 to 200°C, water must be replaced with a heat transfer oil as the heating medium. Additionally, construction measures are required. QLPQnn / nznz / e / YiAi are costly. Both the extended cycle times and the additional costs for tool temperature control are disadvantageous for the molding compound as they increase the cost of the parts produced from it. The polyamide molding compounds according to the invention preferably have a glass transition temperature within the range of 50 to 200°C, particularly preferably within the range of 60 to 190°C, and preferably within the range of 65 to 90°C. The polyamide molding compounds according to the invention preferably have a melting temperature within the range of 100 to 260°C, particularly preferably within the range of 205 to 245°C, and most particularly preferably within the range of 210 to 235°C. The polyamide molding compounds according to the invention preferably have a crystallization temperature within the range of 130 to 200 °C, preferably within the range of 140 to 200 °C. The polyamide molding compounds according to the invention preferably have a crystallization rate within the range of 12 to 50 J / g min, particularly preferably within the range of 15 to 47 J / g min, and most particularly preferably within the range of 23 to 45 J / g min. A molding made from the polyamide molding compound preferably has a determined modulus of elasticity according to ISO 527 of at least 5000 MPa, preferably at least 8000 MPa, preferably at least 12000 MPa. A molding made from the preferably polyamide molding compound has a gloss value of 70 to 100 GU determined according to DIN EN 2813 (2015) in the dry state at 60s. A molding made from the preferably polyamide molding compound has a gloss value of 60 to 100 GU determined according to DIN EN 2813 (2015) in the conditioned a60s state. The polyamide compounds according to the invention or the molds manufactured from them, preferably, may have one or more, particularly preferably all, of the properties mentioned above (glass transition temperature, melting temperature values, crystallization temperature, crystallization rate, modulus of elasticity and gloss). QLCQnn / nznz / e / YiAi Component (A) The proportion of monomer (a1) in the semicrystalline copolyamide (component (A)) is preferably within the range of 20 to 35 mol%, particularly preferably within the range of 22.5 to 32.5 mol%, and even more preferably within the range of 25 to 32.5 mol%. The proportion of monomer (a2) in the semicrystalline copolyamide is preferably within the range of 15 to 25 mol%, particularly preferably within the range of 17.5 to 22.5 mol%. The proportion of monomer (a3) ​​in the semicrystalline copolyamide is preferably within the range of 0 to 2.5 mol%. The proportions of monomers (a1), (a2), and (a3) ​​are with respect to the sum of the diamines used and represent up to 50 mol%. The proportion of monomer (a4) in the semicrystalline copolyamide is preferably within the range of 47.5 to 50 mol%. The proportion of monomer (a5) in the semicrystalline copolyamide is preferably within the range of 0 to 2.5 mol. The proportions of monomers (a1), (a4), and (a5) are with respect to the sum of dicarboxylic acids used and represent up to 50 mol. The at least one monomer (a3) ​​is preferably selected from the group consisting of ethylenediamine, butanediamine, pentanediamine, methylpentanediamine, 1,8-octanediamine, methyloctanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, trimethylhexamethylenediamine, 1,4-cyclohexanediamine, bis-(4-amino-3-methylcyclohexyl)methane, bis-(4-aminocyclohexyl)methane, isophoronediamine, 1,4-bis(aminomethyl)cyclohexane, m-xylylenediamine, p-xylylenediamine, bis(aminocyclohexyl)propane and their alkyl derivatives, norbornanediamine and bis(aminomethyl)norbornane. A preferred group from which at least one monomer (a3) ​​is selected consists of pentanediamine, methylpentanediamine, methyloctanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, trimethylhexamethylenediamine, bis-(4-amino-3-methylcyclohexyl)methane, bis-(4-amino-cyclohexyl)methane, isophoronediamine, 1,4-bis(aminomethyl)cyclohexane, m-xylylenediamine, and p-xylylenediamine. The at least one monomer (a3) ​​is particularly selected QLCQnn / nznz / e / YiAi preferred from the group consisting of pentanediamine, methylpentanediamine, methyloctanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, trimethylhexamethylenediamine, bis-(4-amino-3-methylcyclohexyl)methane, bis-(4-aminocyclohexyl)methane and isophoronediamine. Bis-(4-amino-3-methylcyclohexyl)methane, bis-(4-amino-cyclohexyl)methane and / or isophoronediamine are used as monomers (a3) ​​in a very particularly preferred manner. The at least one monomer (a5) is preferably selected from the group consisting of isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, 1,9-nonanedioic acid, 1,10-decanedioic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid, 1,14-tetradecanedioic acid and 1,15-pentadecane acid, 1,16-hexadecanedioic acid, 1,17-heptadecanedioic acid, 1,18-octadecanedioic acid, arachidic acid, Japan acid, behenic acid, cyclohexanedioic acid, phenylindanodicarboxylic acid, phenylenedioxyacetic acid and fatty acid dimer with 35 to 44 carbon atoms. A preferred group from which at least one monomer (a5) is selected consists of isophthalic acid, terephthalic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid. The at least one monomer (a5) is particularly preferred from the group consisting of isophthalic acid, terephthalic acid, 1,10-decanedioic acid, and 1,12-dodecanedioic acid. Isophthalic acid and / or terephthalic acid are used as a monomer (a5) in a very particularly preferred way. The semicrystalline copolyamide (component (A)) preferably contains neither lactams nor amino acids. Component (B) The term fillers (components B) comprises fibrous or acicular fillers, particle-shaped fillers and mixtures thereof. Preferably, the fillers may be coated or have a treated surface; that is, they may be equipped with a suitable finish or bonding agent system, or, conversely, they may have an activated surface. Systems based on urethane, silanes, epoxies, polyamides, polyhydroxy ethers, QLCQnn / nznz / e / YiAi acrylates, their respective combinations, or mixtures thereof may be used for this purpose, for example. Bonding or softening agent systems may also contain other auxiliary agents such as static inhibitors or mold lubricants. Preferably, the fibrous or acicular fillers are selected from the group consisting of glass fibers, carbon fibers, basalt fibers, slag fibers, metal fibers, filaments, mineral fibers, volastonite, shredded glass fibers, shredded carbon fibers, shredded mineral fibers, and mixtures thereof. Particularly preferred, the fibrous or acicular fillers are selected from the group consisting of glass fibers, carbon fibers, basalt fibers, and mixtures thereof. Glass fibers alone are very preferably used as fibrous or acicular fillers. Stable or continuous fibers (balls) can be used for glass fibers or carbon fibers. Fiberglass or carbon fibers have a round, oval, elliptical, angular, or rectangular cross-section. Fibers with a non-circular cross-section (flat fibers), particularly oval, elliptical, angular, or rectangular, can also be used. The appearance of the glass fibers can be stretched or spiraled. All types of glass fibers can be used, such as -A, -C, -D, -E, -E-CR-, -L, -LD, -M, -NE, -S, -R, -Ar, or any desired mixtures thereof. -E-glass fibers or glass fibers derived from mixtures with -E-glass or mixtures of -E-glass fibers are preferred. Preferably, short glass fibers have a fiber length of 1 to 25 mm, preferably 1.5 to 20 mm, particularly preferably 2 to 12 mm, and very particularly preferred 2 to 8 mm. Preferably, the glass fibers have a diameter of 5 to 20 pm, preferably 5 to 15 pm, and particularly preferably 6 to 12 pm. If glass fibers are used as continuous fibers (spools) in a pultrusion process, they preferably have a maximum diameter of 20 µm, preferably no more than 18 µm, particularly preferably from 10 to 17 µm. Preferably, the carbon fibers have a diameter of 3 to 12 pm, preferably 4 to 10 pm, particularly preferably 4 to 9 pm. QLCQnn / nznz / e / YiAi With flat fibers, the aspect ratio, i.e., the ratio of the main cross-section axis to the secondary cross-section axis, is 1.5 to 8, preferably 2 to 6, and particularly preferably 3 to 5. Flat glass fibers are particularly preferred from flat fibers. The cross-sectional axes of the flat glass fibers have a length of 3 to 40 pm. The length of the secondary cross-sectional axis preferably ranges from 3 to 20 pm, particularly preferably from 4 to 10 pm, and the length of the main cross-sectional axis ranges from 6 to 40 pm, particularly preferably from 12 to 30 pm. Preferably, the particle-shaped charges are selected from the group consisting of dolomite, silicates, quartz, talc, mica, kaolin, perlite, silica, precipitated or pyrogenic silicon dioxide, diatomite, titanium dioxide, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, crushed or precipitated calcium carbonate, chalk, calcium, limestone powder, slate flour, feldspar, barium carbonate, barium sulfate, synthetic sheet silicates, natural sheet silicates, magnetizable or permanently magnetic alloys or metals, glass flakes, glass spheres, hollow glass spheres, spherical and hollow silicate charges, and mixtures thereof.Particularly preferred, particle-shaped fillers are selected from the group consisting of silicates, quartz, talc, mica, kaolin, perlite, silica, precipitated or pyrogenic silicon dioxides, diatomite, titanium dioxide, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, crushed or precipitated calcium carbonate, chalk, calcium, limestone powder, slate flour, feldspar, barium carbonate, barium sulfate, synthetic sheet silicates, natural sheet silicates, glass flakes, glass spheres, hollow glass spheres, spherical and hollow silicate fillers, and mixtures thereof.Most preferably, particle-shaped fillers are selected from the group consisting of silicates, talc, mica, kaolin, titanium dioxide, crushed or precipitated calcium carbonate, chalk, limestone powder, slate flour, synthetic sheet silicates, natural sheet silicates, glass flakes, glass spheres, hollow glass fibers, and mixtures thereof. Preferably, a fibrous or acicular filler or a mixture of both is used QLCQnn / nznz / e / YiAi less a fibrous or acicular filler with at least one particle-shaped filler, as filler (component (B)) in the polyamide molding compound according to the invention. If a mixture of at least one fibrous or acicular filler is used with at least one particle-shaped filler, the proportion of the particle-shaped filler constitutes a maximum of half, preferably a maximum of one third, and particularly preferably a maximum of one quarter, of the total amount of filler. Particularly preferred, exclusively fibrous or acicular fillers are used as filler in the polyamide molding compound according to the invention. Component (C) According to a preferred embodiment of the present invention, the at least one additive (component (C)) is selected from the group consisting of organic and inorganic stabilizers, in particular antioxidants, antiozonants, photostabilizers, in particular UV stabilizers, UV absorbers or UV blocking agents, mold lubricants, dyes, tipping agents, pigments, carbon black, graphite, graphene, polyamide oligomers, carbon nanotubes, photochromic agents, static inhibitors, release agents, antiblocking agents, chain lengthening additives, chain shortening additives, optical brighteners, IR absorbers, NIR absorbers, non-halogen flame retardants, metallic pigments, metallic flakes, metal-coated particles and mixtures thereof. Preferably, the polyamide oligomers have a number-average molecular weight of 1000 to 6000 g / mol, particularly preferably 2500 to 4500 g / mol, determined by means of gel permeability chromatography (GPC) with a triple detector. At least one additive may also be added in masterbatch form. Preferably, a polyamide is used as the base polymer of the masterbatch. Preferably, this polyamide is selected from the group consisting of PA 6, PA 66, PA 12, PA 1012, PA 1212, PA 6 / 12, PA 6 / 66, PA 6 / 69 and their blends, or consists of the copolyamide itself (A). Molds QLPQnn / nznz / e / YiAi According to the invention, the molds are provided in such a way that they can be manufactured from the previously described molding compounds. The molds according to the invention can be manufactured from the polyamide molding compound according to the invention by means of common processing techniques such as injection molding methods. A preferred embodiment provides that the molding is selected from the group consisting of visible parts that do not contain lacquer, with or without function, in a trunk or passenger compartment of a vehicle, in the home, mechanical engineering, electrical devices, electronic devices, household appliances, furniture, in particular fan blades, gearshift levers, switches, buttons, rotary controls, belts, operating elements for seat adjustment, operating elements of the steering column, operating levers, operating elements, drawers, accessory receptacles, drink receptacles, luggage hooks, coatings, light switches, knives, parts for scissors, threaded shanks, in particular for insulin pumps, housings and decorative elements. Uses The present invention further relates to the use of the polyamide molding compounds defined above according to the invention for the manufacture of visible, unlacquered parts, with or without function, in a trunk or passenger compartment of a vehicle, in the home, mechanical engineering, electrical devices, electronic devices, household appliances, furniture, in particular in fan blades, gear levers, switches, buttons, rotary controls, belts, operating elements for seat adjustment, operating elements of the steering column, operating levers, operating elements, drawers, accessory receptacles, drink receptacles, luggage hooks, coverings, light switches, knives, parts for scissors, threaded stems, in particular for insulin pumps, housings and decorative elements. The subject matter of the invention is explained in more detail by reference to the following examples without intending any restriction on the specific embodiments shown in this document. Examples and comparison examples Measurement methods QLCQnn / nznz / e / YiAi Relative viscosity The relative viscosity was determined according to ISO 307 (2007) at 20SC. 0.5 g of polymeric microgranules were weighed into a 100 ml m-cresol for this purpose; the calculation of the relative viscosity (RV) after RV = t / tO was carried out on the basis of section 11 of the standard. Glass transition temperature (Tg), heat of crystallization, heat of fusion and melting point The determination was made on microgranules in accordance with ISO 11357-3 (2013). Differential scanning calorimetry (DSC) was performed in each of the three stages at a heating rate of 20 K / min. Cooling took place at 20 K / min after the first heating. The sample was inactivated in dry ice after the second heating. The glass transition temperature (Tg) was determined during the third heating, and the melting point during the second. The crystallization temperature and crystallization rate were determined after cooling following the first heating. The temperature at the peak is specified as the melting point. The center of the glass transition range, specified in this case as the glass transition temperature (Tg), is determined using the half-height procedure. Brightness value at 60s The gloss was determined at a measurement angle of 60s according to DIN EN ISO 2813 (2015) on a Gloss Tector (ATP Messtechnik GmbH, Germany) at 23°C on plates with dimensions of 60 x 60 x 2 mm. The indication is given in gloss units (GU). Modulus of elasticity The determination of the modulus of elasticity was carried out according to ISO 527 (2012) at 23SC at a tensile speed of 1 mm / minute on an ISO tensile rod (type A1, mass of 170 x 20 / 10 x 4) manufactured according to the standard: ISO / CD 3167 (2003). Determination of molar mass The determination of molar mass is done by means of gel permeability chromatography (GPC) with a triple detector: refractive index, viscosity and light scattering (7Sy 90e). QLCQnn / nznz / e / YiAi The samples are dissolved in hexafluoroisopropanol (HFIP) (approximately 5 mg of polymer in 1 ml) for measurement and filtered into vials using disposable syringe filters before filling. QLCQnn / nznz / e / YiAi Unit: Malvern OMNISEC GPC System Software: Malvern OMNISEC Version 10.41 Column: Malvern HFIP3000 + HFIP6000M 300 x 7.8 mm, particle size 10 pm Flow: HFIP with 0.1 M potassium trifluoroacetate Column temperature: 40SC Detector temperature: 40°C Flow rate 1.0 ml / min Molecular masses (average Mn expressed as a number and average Mw expressed as a weight) are determined using the triple detection procedure. The GPC system is calibrated using a monodisperse PMMA standard. Three respective determinations are performed. The arithmetic mean of the molecular mass is reported. The HFIP solvent was purchased with HPLC quality from Fluorochem, Germany, and the potassium trifluoroacetate from Sigma-Aldrich, Switzerland. Disposable filters can be obtained from Chemie Brunschwig, Switzerland, under the name SFPTFE0250022NBC (PTFE membrane, pore size 0.45 pm, filter diameter 25 mm). Disposable filters can be obtained from VWR International GmbH, Germany. Fabrication of test samples Microgranules with a water content of less than 0.1% by weight were used to fabricate the test samples. The test samples were manufactured on an Ardurg injection molding machine, model Allrounder 420 C 1000-250. Increasing and decreasing cylinder temperatures from the feed stream to the nozzle were used in the present procedure. ISO traction rods Cylinder temperatures: 260 / 265 / 270 / 275 / 280 / 275 °C Tool temperature: 110 °C Plates 60 x 60 x 2 mm Cylinder temperatures: 270 / 275 / 280 / 285 / 290 / 285 °C Tool temperature: 110 °C A polished tool was used to manufacture the plates. The test samples were used in a dry state unless otherwise specified; for this purpose they were stored for at least 48 h after injection molding at room temperature in a dry environment, i.e., on silica gel. The 60 x 60 x 2 mm plates for surface gloss measurement in conditioned state were stored according to ISO 1110 for 7 days at 70°C and 10 to 62% relative humidity. Starting materials The materials used in the examples and comparative examples are listed in Tables 1 to 3. Table 1 Polyamides (A) used in the examples (continued on the following page 15) QLCQnn / nznz / e / YiAi Component Description Manufacturer Polyamide (A1) Semicrystalline copolyamide 6 / 1,3-BAC6 from 1,6 hexanediamine (25.0 mol%), 1,3-bis(aminomethyl)cyclohexane (25.0 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.80 (measured with 0.5 g in a 100 ml m-cresol at 20 eC) Glass transition temperature 80 SC Melting point 202 eC EMS-CHEMIE AG, Switzerland Component Description Manufacturer Polyamide (A2) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6 hexanediamine (27.5 mol%), 1,3-bis(aminomethyl)cyclohexane (22.5 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.75 (measured with 0.5 g in 100 ml m-cresol at 20°C) Glass transition temperature 76 °C Melting point 207 °C EMS-CHEMIE AG, Switzerland Polyamide (A3) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6 hexanediamine (30.0 mol%), 1,3-bis(aminomethyl)cyclohexane (20.0 mol%) and 1,6-hexanedioic acid (50.0% by moles), RV 1.74 (measured with 0.5 g in an m-cresol from EMS-CHEMIE AG, Switzerland Component Description Manufacturer 100 ml at 20 °C) Glass transition temperature 73 °C Melting point 215 °C Component Description Manufacturer Polyamide (A4) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6 hexanediamine (32.50 mol%), 1,3-bis(aminomethyl)cyclohexane (27.5 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.79 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition temperature 70 °C Melting point 222 °C EMS-CHEMIE AG, Switzerland Polyamide (A5) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6 hexanediamine (30.0 mol%), 1,3-bis(aminomethyl)cyclohexane (15.0 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.81 (measured with 0.5 g in 100 ml m-cresol at 20 °C) Glass transition temperature 68 °C Melting point 230 °C EMS-CHEMIE AG, Switzerland Polyamide (A6) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6-hexanediamine (37.5 mol%), 1,3-bis(aminomethyl)cyclohexane (12.5 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.85 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition temperature 67 °C Melting point 236 °C EMS-CHEMIE AG, Switzerland Polyamide (A7) Semicrystalline copolyamide 66 / 1,3-BAC6 / MACM6 from 1,6-hexanediamine (35.0 mol%), 1,3-bis(aminomethyl)cyclohexane (10.0 mol%), bis-(4-amino-3-methylcyclohexyl)methane (5.0 mol%), and 1,6-hexanedioic acid (50.0 mol%), RV 1.79 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition 73 BC Melting point 228 BC EMS-CHEMIE AG, Switzerland Component Description Manufacturer, QLPQnn / nznz / e / γΐΛΐ Component Description Manufacturer Polyamide (A8) Semicrystalline copolyamide 66 / 1,3-BAC6 / MACM6 from 1,6 hexanediamine (32.5 mol%), 1,3-bis(aminomethyl)cyclohexane (15.0 mol%), bis-(4-amino-3-methylcyclohexyl)methane (2.5 mol%), and 1,6-hexanedioic acid (50.0 mol%), RV 1.79 (measured with 0.5 g in 100 ml m-cresol at 20 °C) Glass transition temperature 72 °C Melting point 224 °C EMS-CHEMIE AG, Switzerland Polyamide (A9) Semicrystalline copolyamide 66 / 1,3BAC6 / PACM6 from 1,6 hexanediamine (35.0 mol%), 1,3-bis(aminomethyl)cyclohexane (10.0 mol%), bis-(4-amino-cyclohexyl)methane (5.0 mol%), and 1,6-hexanedioic acid (50.0 mol%), RV 1.84 (measured with 0.5 g in 100 ml m-cresol at 20 °C) Glass transition temperature 71 °C Melting point 231 °C EMS-CHEMIE AG, Switzerland Polyamide (A10) Semicrystalline copolyamide 66 / 1,3-BAC6 / PACM6 from 1,6-hexanediamine (32.5 mol%), 1,3-bis(aminomethyl)cyclohexane (15,0 mol%), bis-(4-amino-cyclohexyl)methane (2.5 mol%), and 1,6-hexanedioic acid (50.0 mol%), RV 1.83 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition temperature 72 °C Melting point 224 °C EMS-CHEMIE AG, Switzerland Polyamide (A11) Semicrystalline copolyamide 66 / 1,3-BAC6 / IPD6 from 1,6-hexanediamine (35.0 mol%), 1,3-bis(aminomethyl)cyclohexane (10.0 mol%), isophoronediamine (5.0 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.61 (measured with 0.5 g in a m-cresol of 100 ml at 20 °C) Glass transition temperature 75 °C Melting point 221 °C EMS-CHEMIE AG, Switzerland Polyamide (A12) Semicrystalline copolyamide 66 / 61 / 1,3-BAC6 / 1,3BACI from 1,6 hexanediamine (35.0 mol %), 1,3-bis(aminomethyl)cyclohexane (15.0 mol %), isophthalic acid (5.0 mol %) and 1,6-hexanedioic acid (45.0 mol %) RV 1.80 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) EMS-CHEMIE AG, Switzerland, QLPQnn / nznz / e / γΐΛΐ Component Description Manufacturer Glass transition temperature 78 °C Melting point 223 °C Component Description Manufacturer Polyamide (A13) Semicrystalline copolyamide 66 / 6T / (1,3BAC6 / 1,3-BACT) from 1,6-hexanediamine (35.0 mol%), 1,3-bis(aminomethyl)cyclohexane (15.0 mol%), terephthalic acid (5.0 mol%), and 1,6-hexanedioic acid (45.0 mol%), RV 1.83 (measured with 0.5 g in 100 ml m-cresol at 20 °C) Glass transition temperature 78 °C Melting point 225 °C EMS-CHEMIE AG, Switzerland Table 2 Polyamides (V) used in the comparison examples QLPQnn / nznz / e / YiAi Component Description Manufacturer Polyamide (V1) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6 hexanediamine (45.0 mol%), 1,3-bis(aminomethyl)cyclohexane (5.0 mol%) and 1,6-hexanedioic acid (50.0 mol%), RV 1.84 (measured with 0.5 g in 100 ml m-cresol at 20 °C) Glass transition temperature 59 °C Melting point 250 °C SC EMS-CHEMIE AG, Switzerland Polyamide (V2) Semicrystalline copolyamide 66 / 1,3-BAC6 from 1,6 hexanediamine (40.0 mol%), 1,3-bis(aminomethyl)cyclohexane (10.0 mol%) and 1,6-hexanedioic acid (50.0 mol %), RV 1.90 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition temperature 61 °C Melting point 240 °C EMS-CHEMIE AG, Switzerland Polyamide (V3) Semicrystalline polyamide 1,3-BAC6 from 1,3-bis(aminomethyl)cyclohexane and 1,6-hexanedioic acid RV 1.60 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition temperature 110 °C Melting point 229 °C EMS-CHEMIE AG,Swiss Polyamide (V4) Semicrystalline polyamide 66 derived from 1,6-hexanediamine and 1,6-hexanedioic acid RV 1.79 (measured with 0.5 g in a 100 ml m-cresol at 20 °C) Glass transition temperature 55 °C Melting point 261 °C Trade name: Radipol A45 RadiciChimica SpA, Italy, Table 3 Glass fibers (B) and additives (C) used in the examples and comparative examples Component Description Trade Name Manufacturer Glass Fiber (B1) Round glass fibers, 4.5 mm length Diameter 10 pm OCV 995 EC1 0-4.5 Owens Corning Vetrotex, France Glass Fiber (B2) Flat glass fibers, 3 mm length, main cross-section axis 28 pm, secondary cross-section axis 7 pm Nittobo CSG3PA820 Nitto Boseki Co., Ltd., Japan Kaolin (B3) CAS No. 1332-58-7 Translink 445 BASF SE, Germany Mica (B4) Ns. CAS 12001-26-2 Mica HLM 100 Antioxidant (C1) Ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-mtolyl)propionate] Ne CAS: 36443-68-2 Irganox 245 BASF SE, Germany Master Batch Black (C2) 25 wt% carbon black in Radipol A45 (PA66) from RadiciChimica SpA, Italy EMS-CHEMIE AG, Switzerland Additive Blend (CM) Weight Ratio (C1):(C2) = 1:5 General manufacturing rule for copolyamides (A) QLCQnn / nznz / e / YiAi The manufacture of the ccpolyamides according to the invention takes place in a manner known to itself, in known pressure and agitable autoclaves that have a presentation container and a reaction container: Deionized water is placed in the presentation vessel, and the monomers and any additives are added. The mixture is then inerted multiple times with nitrogen gas. Heating takes place at 180–230°C while stirring at the desired pressure to obtain a homogeneous solution. This solution is pumped through a sieve into the reaction vessel and heated to the desired reaction temperature of 250–300°C at a maximum pressure of 30 bar. The mixture is held at the reaction temperature for 2–4 hours during the pressure phase. In the subsequent expansion phase, the pressure is reduced to atmospheric pressure over 1–2 hours, with the temperature also decreasing. In the following degassing phase, the mixture is held at 250–300°C at atmospheric pressure for 0.5–6 hours. The polymer melt is discharged in strand form, cooled to 10–80°C in a water bath, and subjected to microgranule formation. The microgranules are dried at a temperature of 60 to 120°C under nitrogen or vacuum to a water content of less than 0.1% by weight. Suitable catalysts for accelerating the polycondensation reaction are phosphorus-containing acids such as H3PO2, H3PO3, H3PO4, their salts, and organic derivatives. Preferably, the catalysts are mixed within the range of 0.01 to 0.5% by weight, more preferably 0.03 to 0.1% by weight, with respect to the polyamide. The appropriate antifoaming agents to prevent foaming during degassing are 10% aqueous emulsions containing silicones or silicone derivatives and are preferably used in quantities of 0.01 to 1.0% by weight, particularly preferably 0.01 to 0.10% by weight, with respect to polyamide. The adjustment of relative viscosity, and consequently molar mass, can be achieved in a known manner, for example, by using monofunctional amines or carboxylic acids, and / or difunctional diamines or dicarboxylic acids as chain regulators. The typical amount of monofunctional chain regulators used is 10 to 200 mmol per kg of copolyamide. General manufacturing rule for polyamide molding compounds according to the invention To manufacture the polyamide molding compound according to the invention, components (A), (B), and optionally (C) are mixed in conventional compounding machines such as a single- or twin-shaft extruder or screw-type kneading devices. The components are individually metered by means of gravimetric or volumetric metering trays into the feed stream or, respectively, into a side-feed device, or are supplied in the form of a dry mix. If additives (component (C)) are used, they can be introduced directly or in the form of a masterbatch. The carrier material of the masterbatch is preferably a polyamide or a polyolefin. Among the polyamides, copolyamide (A) is particularly suitable for this purpose. The dry microgranules of components (A) and optional additives (C), QLPQnn / nznz / e / YiAi are mixed in a closed container to prepare the dry mix. This mix is ​​homogenized using an oscillating mixer, a drum mixer, or a drum dryer for 10 to 40 minutes. Homogenization may be carried out with a dry shielding gas to prevent moisture absorption. Compounding takes place at cylinder temperatures of 250 to 310°C, with the first cylinder temperature adjustable below 90°C. Degassing can occur upstream of the nozzle, either under vacuum or atmospherically. The melt is discharged as a strand, cooled to 10 to 80°C in a water bath, and then subjected to microgranulation. Alternatively, the melt can be pressurized in a water bath through a perforated plate with a cutting device, and the cut microgranules can be separated in a post-treatment path (submerged microgranulation). The microgranules are dried at 60 to 120°C under nitrogen or vacuum to a moisture content of less than 0.1% by weight. Manufacturing the polyamide molding compound according to Example 3 The dry microgranules of copolyamide PA 66 / 1.3-BAC 6 (A) and the additives (CM1) were mixed to form a dry mixture and, in fact, in the ratio indicated in Table 4, Example 3. This mixture was homogenized by means of a drum mixer for approximately 20 minutes. The polyamide molding compound was manufactured on a Werner & Pfleiderer ZSK 25 twin-shaft extruder. In this case, the dry mix was metered into the feed using a dosing scale. The glass fibers (B1) were conveyed into the melt using a dosing scale and housing zones 6 of the feed unit upstream of the nozzle. The temperature of the first housing was set at 50°C; those of the remaining housings at 260–280°C. A speed of 250 rpm and a throughput of 15 kg / h were used. No outgassing occurred. The molten strand was cooled in a water bath, cut, and the resulting microgranules were dried at 100°C under vacuum (30 mbar) for 24 hours to a moisture content of less than 0.1% by weight. Experimental Results QLCQnn / nznz / e / YiAi The molding compounds according to the invention were examined with respect to surface gloss and modulus of elasticity. The results of these examinations are shown in Tables 4 and 5. The molding compounds not according to the invention were also examined 5 with respect to surface gloss and modulus of elasticity under the same measurement conditions. The results of the comparison examples are summarized in Table 6. QLPQnn / nznz / e / YiAi Table 4 Examples 1 through 10 in accordance with the invention QLCQnn / nznz / e / YiAi Examples 10 VZ 1 CM 183 οϊ T- CO: <3> 90 o> hear l --------------------1-------------------d yes ! CM 185 co CM¡ OO co 1 o' 73 218 175 r^: O CM; O o co r- 2.4 f me ® CJ 5 175 CO: O CO¡ Ch 84 to 2.4 1 67 235 197 XT: 00 79 2.4 1 ή § 188 co 78 t CM > 3 S 180 oi co CQ: CO 75 co CN V — Yz í YZ t / Z 1 t < — . 78 74 | 72 207 | 214 í 220 154 161 í 175 16 22 | 35 80 83 | 88 74 76 | 78 Unit weight % in weight % in weight o] O s « oo· J / g min GU GU Component Mixture of additives (CM) (ΙΌ) «Wpixoijuv Measured values ​​Glass tran sition tem perature* Melting point** Crystallization temperature*** Crystallization rate*** Gloss value, 60°, drying Value of brightness, 60°, QLPQnn / nznz / e / γΐΛΐ O φ E QLCQnn / nznz / e / YiAi Table 5 Examples 11 to 1 / in accordance with the invention o E e> uT 17 (A13) 47.6 16 (A12) 47.6 15 (A11) 70 / 20 / 10 47.6 14 (A10) 65 / 30 / 5 47.6 13 (A9) 70 / 20 / 10 47.6 12 (A8) 65 / 30 / 5 47.6 Unit A [ 11 % en í (A7) motes i 70 / 20 / 10 % en i motes í % en i motes i % en ¡ motes i % en i motes í % en í 47.6 Component Polyamide (A) PA 66 / 1.3- 8AC6 / MACM6 Polyamide (A) PA 66 / 1.3- 8AC6 / PACM6 Polyamide (A11) PA 66 / 1.3- BAC6 / IPD6 Polyamide (A12) PA 66 / 61 / / 1,3- BAC6 / 1.3-BACI 63 / 7 / 27 / 3 Polyamide (A13) PA66 / 6T / 1,3BAC6 / 1,3-BACT 63 / 7 / 27 / 3 Polyamide (A) QLPQnn / nznz / e / YiAi Examples 16 1 17 — 50.0 | 50.0 2.4 2.4 — 78 | 78 223 | 225 158 I 163 16 21 77 i 74 74 72 y 50.0 2.4 LO 221 171 00 co co co r- 50.0 CM 224 181 CO o 00 O 00 «O 50.0 2.4 γΣ 231 98 f 00 T* O o' 2.4 £4 224 179 PO CO o 00 o 00 T— V 50.0 2.4 ro 228 182 co O) ατ Unit weight % by weight osad ue% oopp J / g min GU GU Component Glass fibers (B) Mixture of additives (CM) Measured values ​​Glass transition temperature* Melting point* Crystallization temperature* Crystallization rate*** Gloss value, 60°, Drying Gloss Value, 60°, Conditioning QLPQnn / nznz / e / γΐΛΐ Table 8 Examples 18 to 22 according to the invention —............. ........ ..... .......... —.... .......... ......... ......... ......... CM < δ < 60 / 40 97.6 1 1 vz co 215 .... — — — .... — --------- — — — 0 Λ (V4) 100 / 0 J C0 ír 50.0 2.4 LO 261 229 V OS píos compar 20 ooo > 4 476 _____500_____ 2.4 110 229 o Ejemi OT“ o 04 O co J 47.6 50.0____ 2.4 s 240 205 5 00 r~ o δ σ> i 47.6 50.0______ 2.4 59 250 216 5 I Unidad ί % en i moles i % en ί moles i % en peso i % en peso i % en peso oop Φ c Φ co cl £ o O Polyamide (V) PA 66 / 1,3-BAC6 £O o < Qp δ δ <d < cl <0 cg t5 £ 03 o o. poliamida (v) o (a3) fibras de vidrio (b) mezcla aditivos (cm) valores medidos temperatura transición vitrea* punto fusión* cristalización*QLPQnn / nznz / e / YiAi EITHER E ou ω o AND ÍH ?? so Q E o CL E oo £ í£ QLCQnn / nznz / e / YiAi Discussion of the results Plates of polyamide molding compounds according to the invention of Examples 1 to 8 and 11 to 17 filled with glass fibers consistently show a better brightness value than plates of the comparison materials of polyamide molding compounds of Comparison Examples 18 to 21, and indeed both dry and conditioned. The polyamide molding compound plates of Examples 9 and 10, which are filled only with minerals or with a mixture of glass fibers and minerals, show the best results. The PA 66 plates from the Comparison 21 example filled with glass fibers show their lack of suitability for visible parts since the surface quality is not sufficient. Crystallization is no longer observed in the DSC measurement of PA 1,3-BAC6 in Comparison Example 20, filled with glass fibers, after the first heating. The 1,3-bis(aminomethyl)cyclohexane content at 50 mol% is therefore too high. This also affects the brightness value, which decreases drastically due to the conditioning that occurs after post-crystallization in the current procedure. In order to achieve a modulus of elasticity of at least 5000 MPa, the polyamide molding compound according to the invention must contain a filler such as can be seen from the polyamide molding compound of Comparison Example 22.< / d>

Claims

1. A polyamide molding compound comprising or consisting of the following components (A) to (C): (A) 22 to 70% by weight of a semicrystalline copolyamide formed from monomers (a1) to (a5): (a1) 20 to 37.5 mol% of 1,6-hexanediamine; (a2) 12.5 to 35 mol% of 1,34-bis(aminomethyl)cyclohexane; (a3) ​​0 to 5 mol% of at least one diamine having 2 to 35 carbon atoms, differing from monomers (a1) and (a2); (a4) 45 to 50 mol% of 1,6-hexanedioic acid; and (a5) from 0 to 5 mole percent of at least one dicarboxylic acid having 2 to 44 carbon atoms, which differs from the monomer (a4); wherein the proportions of monomers (a1), (a2) and (a3) ​​are with respect to the sum of the diamines used and represent up to 50 mole percent; and wherein the proportions of monomers (a4) and (a5) are with respect to the sum of the dicarboxylic acids used and represent up to 50 mole percent;and where the proportions of monomers (a1) to (a5) represent 100% by mole; (B) from 30 to 70% by weight of at least one filler; and (C) from 0 to 8% by weight of at least one additive, where component (C) differs from component (B) and where the proportion of components (A) to (C) represents up to 100% by weight.

2. A polyamide molding material according to claim 1, characterized in that the proportion of component (A) in the polyamide molding compound is preferably within the range of 29 to 64.9% by weight, and preferably within the range of 36 to 59.8% by weight, with respect to the total weight of the polyamide molding; and / or the proportion of component (B) in the polyamide molding compound is preferably within the range of 35 to 65% by weight, and preferably within the range of 40 to 60% by weight, with respect to the total weight of the polyamide molding compound; and / or the proportion of component (C) in the polyamide molding compound is preferably within the range of 0.1 to 6% by weight, and preferably within the range of 0.2 to 4% by weight, with respect to the total weight of the polyamide molding compound.

3. A polyamide molding compound according to any one of the preceding claims, characterized in that: • the proportion of the monomer (a1) in the semicrystalline copolyamide is within the range of 20 to 35 mol%, preferably within the range of 22 to 32.5 mol%, particularly preferably within the range of 25 to 32.5 mol%; and / or • the proportion of the monomer (a2) in the copolyamide is within the range of 15 to 25 mol%, preferably within the range of 17.5 to 22.5 mol%; • The proportion of monomer (a3) ​​in the copolyamide is within the range of 0 to 2.5 mol%, where the proportions of monomers (a1), (a2) and (a3) ​​are with respect to the sum of the diamines used and represent up to 50 mol%.

4. A polyamide molding compound according to any one of the preceding claims, characterized in that • the proportion of monomer (a4) in the copolyamide is within the range of 47.5 to 2.5 mol%; and / or • the proportion of monomer (a5) in the copolyamide is within the range of 0 to 2.5 mol%, wherein the proportions of monomers (a4) and (a5) are with respect to the sum of the dicarboxylic acids used and represent up to 50 mol%.

5. A polyamide molding material according to any one of the preceding claims, QLCQnn / nznz / e / YiAi, characterized in that at least one monomer (a3) ​​is selected from the group consisting of ethylenediamine, butanediamine, pentanediamine, methylpentanediamine, 1,8-octanediamine, methyloctanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, trimethylhexamethylenediamine, 1,4-cyclohexanediamine, 1,3-cyclohexanediamine, bis-(4-amino-3-methylcyclohexyl)methane, bis-(4-amino-cyclohexyl)methane, isophoronediamine, 1,4-bis(aminomethyl)cyclohexane, m-xylylenediamine, p-xylylenediamine bis(aminocyclohexyl)propane and its alkyl derivatives, norbornanediamine and bis(aminomethyl)norbornane;and / or at least one monomer (a5) is selected from the group consisting of isophthalic acid, terephthalic acid, naphthalenedicarboxylic acid, 1,9-nonanedioic acid, 1,10-decanedioic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid, 1,14-tetradecanedioic acid, 1,15-pentadecanoic acid, 1,16-hexadecanedioic acid, 1,17-heptadecanedioic acid, 1,18-octadecanedioic acid, arachidic acid, Japan acid, behenic acid, cyclohexanedioic acid, phenylindanodicarboxylic acid, phenylenedioxyacetic acid, and fatty acid dimer having 35 to 44 carbon atoms.

6. A polyamide molding material according to any of the preceding claims, characterized in that the at least one filler (B) is selected from the group consisting of fibrous or acicular fillers, particle-shaped fillers, and mixtures thereof that are optionally coated or have a surface treatment.

7. A polyamide molding compound according to the preceding claim, characterized in that the fibrous or acicular fillers are selected from the group consisting of glass fibers, carbon fibers, basalt fibers, slag fibers, metal fibers, filaments, mineral fibers, volastonite, crushed glass fibers, crushed carbon fibers, crushed mineral fibers, and mixtures thereof, preferably selected from the group consisting of glass fibers, carbon fibers, basalt fibers, and mixtures thereof. QLCQnn / nznz / e / YiAi 8. A polyamide molding compound according to claim 6, characterized in that the particle-shaped fillers are preferably selected from the group consisting of dolomite, silicates, quartz, talc, mica, kaolin, perlite, silica, precipitated or pyrogenic silicon dioxide, diatomite, titanium dioxide, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, crushed or precipitated calcium carbonate, chalk, calcium, limestone powder, slate flour, feldspar, barium carbonate, barium sulfate, synthetic sheet silicates, natural sheet silicates, magnetizable or permanently magnetic alloys or metals, glass flakes, glass spheres, hollow glass spheres, spherical and hollow silicate fillers, and mixtures thereof, preferably selected from the group consisting of silicates, quartz, talc, mica, kaolin, perlite, silica, precipitated silicon dioxides or pyrogens, diatomite,titanium dioxide, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, crushed or precipitated calcium carbonate, chalk, calcium, limestone powder, slate flour, feldspar, barium carbonate, barium sulfate, synthetic silicates in sheet form, natural silicates in sheet form, glass flakes, glass spheres, hollow glass spheres, spherical and hollow silicate charges and mixtures thereof.

9. A polyamide molding material according to any one of the preceding claims, characterized in that at least one additive is selected from the group consisting of organic and inorganic stabilizers, in particular antioxidants, antiozonants, photostabilizers, in particular UV stabilizers, UV absorbers or UV blocking agents, mold lubricants, dyes, tipping agents, pigments, carbon black, graphite, graphene, polyamide oligomers, carbon nanotubes, photochromic agents, static inhibitors, release agents, antiblocking agents, chain-lengthening additives, chain-shortening additives, optical brighteners, IR absorbers, NIR absorbers, non-halogen flame retardants, metallic pigments, metal flakes, metal-coated particles, and mixtures thereof. QLCQnn / nznz / e / YiAi 10. A polyamide molding material according to any one of the preceding claims, characterized in that the polyamide compound has at least one of the following properties: • a glass transition temperature within the range of 50 to 200 °C, preferably from 60 to 190 °C, particularly preferably within the range of 65 to 90 °C; and / or • a melting temperature within the range of 100 to 260 °C, preferably from 205 to 245 °C, particularly preferably within the range of 210 to 235 °C; and / or • a crystallization temperature within the range of 60 to 190 °C, preferably within the range of 140 to 200 °C; and / or • a crystallization rate within the range of 13 to 50 J / g min, particularly preferably within the range of 15 to 47 J / g min, most particularly preferred within the range of 23 to 45 J / g min.

11. A polyamide molding material according to any one of the preceding claims, characterized in that the molding manufactured from the polyamide molding compound has at least one of the following properties: • a molding manufactured from the polyamide molding compound has a modulus of elasticity determined according to ISO 527 of at least 5000 MPa, preferably at least 8000 MPa, particularly preferably at least 12000 MPa; and / or • a gloss value of 70 to 100 GU determined according to DIN EN 2813 (2015) in the dry state at 60°C; and / or • a gloss value of 60 to 100 GU determined according to DIN EN 2813 (2015) in the conditioned state at 60°C.

12. A molding manufactured from a polyamide molding compound according to any one of the preceding claims. QLCQnn / nznz / e / YiAi 13. A molding according to claim 11, characterized in that the molding is selected from the group consisting of visible, unlacquered parts with or without function, in a trunk or passenger compartment of a vehicle, in the home, mechanical engineering, electrical devices, electronic devices, household appliances, furniture, in particular fan blades, gearshift levers, switches, buttons, rotary controls, belts, operating elements for seat adjustment, operating elements of the steering column, operating levers, operating elements, drawers, accessory receptacles, drink receptacles, luggage hooks, coverings, light switches, knives, scissor parts, threaded stems, in particular for insulin pumps, housings and decorative elements.

14. Use of the polyamide molding compound according to any one of claims 1 to 10 for the manufacture of visible, unlacquered parts with or without function, in a trunk or passenger compartment of a vehicle, in the home, mechanical engineering, electrical devices, electronic devices, household appliances, furniture, in particular in fan blades, gear levers, switches, buttons, rotary controls, belts, operating elements for seat adjustment, operating elements of the steering column, operating levers, operating elements, drawers, accessory receptacles, drink receptacles, luggage hooks, coverings, light switches, knives, parts for scissors, threaded stems, in particular for insulin pumps, housings and decorative elements.