SOLDER PASTE AND SOLDER JOINT

Abstract

The present invention relates to a soldering paste comprising a first metal powder, a second metal powder, and a flux. The first metal powder contains Sn. A second metal powder 20A has a core portion 201 formed from an alloy containing Ni and Fe, and a surface layer 202 covering the core portion 201 and formed from a metal containing Ni. The Ni content in the metal forming the surface layer 202 of the second metal powder 20A is 50% by mass or more with respect to the total mass of the metal forming the surface layer 202 of the second metal powder 20A. The surface layer 202 of the second metal powder 20A has a thickness of 0.05 µm or more and 0.30 µm or less.

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