A method for manufacturing a semiconductor device, a semiconductor device, a lead frame structure and a moulding form

Abstract

A B S T R A C T According to the first aspect, a method for manufacturing a semiconductor device is provided. The method provides a lead frame structure comprising an outer frame, an at least one lead frame die pad, an at least one lead frame terminal, and a plurality of lead frame junctions; b) mounting an at least one semiconductor die on the at least one lead frame die pad; c) mounting an at least one connecting element for creating electrical connection between the at least one semiconductor die and the at least one lead frame terminal; d) placing the lead frame structure, the at least one semiconductor die and the at least one connecting element in a molding form wherein the molding form comprises a breaking means for pressing and interrupting through the plurality of lead frame junctions; e) encapsulating by a mold compound the lead frame structure with the at least one semiconductor die and the at least one connecting element, such that at least part of the at least one lead terminal is exposed and thereby forming an encapsulated semiconductor device; f) interrupting, simultaneously with the encapsulation step in the molding form, the plurality of lead frame junctions in the lead frame structure between the at least one lead frame die pad and the at least one lead frame terminal by a pressing movement of the breaking means of the molding form locally through the plurality of lead frame junctions. Figure 2