Systems and methods for installing multi-surface contact pads for wireless communication systems.

TH2301006398APending Publication Date: 2026-10-19NATIONAL SCIENCE TECHNOLOGY DEVELOPMENT AGENCY
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Patent Information

Application Number
TH2301006398
Authority / Receiving Office
TH · TH
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-29
Publication Date
2026-10-19

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