Thermal spreader

The package design with a thermal diffuser and interface layer addresses SSD heat distribution issues, ensuring safe and stable operation by evenly distributing heat and preventing thermal throttling.

TW202514957APending Publication Date: 2025-04-01SK HYNIX NAND PRODUCT SOLUTIONS CORP
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SK HYNIX NAND PRODUCT SOLUTIONS CORP
Filing Date
2024-08-16
Publication Date
2025-04-01

AI Technical Summary

Technical Problem

Existing solid-state storage devices (SSDs) face challenges with non-uniform heat distribution leading to hot spots and thermal throttling, which affect performance and safety.

Method used

A package design incorporating a thermal diffuser layer and interface layer with insulating and conductive portions to distribute heat evenly across the outer surface, reducing the likelihood of hot spots and thermal throttling.

Benefits of technology

The solution ensures that the outer surface temperature remains below safety limits, improving thermal management and preventing performance drops in SSDs.

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Abstract

A package and related method for manufacturing thereof, the package including multiple layers. The layers include an external layer with an external layer outer surface and an external layer inner surface, and an interface layer with an interface layer outer surface and an interface layer inner surface, where the interface layer outer surface is in contact with the external layer inner surface. The layers also include a thermal spreader layer with a thermal spreader outer surface and a thermal spreader inner surface, where the thermal spreader outer surface is in contact with the interface layer inner surface. The layers include circuitry, which is arranged proximate to and facing the thermal spreader inner surface. In some embodiments, the thermal spreader layer includes at least one thermally conductive channel to transfer heat along the at least one channel, the heat to be thermally transferred to the external layer via the interface layer.
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