Loudspeaker comprising a micro-electromechanical unit
The loudspeaker with a micro-electromechanical unit using Al(1-x)Ga(x)N and GaN layers addresses the size and power consumption challenges of audio devices by enhancing SNR and reducing on-resistance through piezoelectric diaphragm technology, enabling efficient and compact audio performance.
Patent Information
- Application Number
- US18/705833
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- Priority Date
- 2021-10-29
- Filing Date
- 2022-10-26
- Publication Date
- 2026-05-21
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing audio devices, such as wireless earbuds, face a compromise between high fidelity audio quality, minimal size, and low power consumption, particularly due to the need for built-in batteries and wireless communication, which affects on-resistance and signal-to-noise ratio (SNR).
A loudspeaker comprising a micro-electromechanical unit with a diaphragm made of Al(1-x)Ga(x)N and GaN layers, a support structure, and an electrode, utilizing piezoelectric properties to generate sound waves without a solenoid, and incorporating a superlattice for enhanced piezoelectric effect and a backplate with through-holes for pressure amplification, along with a transistor structure for improved conductivity.
The solution reduces power demand, increases SNR, and allows for a compact size while maintaining high audio quality by integrating the diaphragm as both a loudspeaker and microphone, utilizing GaN HEMT transistors for efficient power management.