Electronic device comprising antenna

Abstract

This electronic device comprises: a housing including a first housing part and a second housing part; a first substrate disposed on the second housing part; a second substrate disposed on the first housing part; a third substrate for electrically connecting the first substrate and the second substrate; at least one processor disposed on the first substrate; an RF transceiver disposed on the first substrate; a first coupler which is disposed on the first substrate and which provides a first coupling signal on the basis of a first signal; and a second coupler which is disposed on the second substrate and which provides a second coupling signal on the basis of a second signal.

Description

Electronic device including an antenna

[0001] The descriptions below relate to electronic devices that include antennas.

[0002] Electronic devices including large-screen displays can enhance user usability. As demand for highly portable electronic devices increases, electronic devices may include deformable displays. The deformable displays may be slidably deformable. The electronic devices may include housing parts that are movably coupled to each other for the deformable displays. Each of the housing parts may include substrates (e.g., printed circuit boards) electrically connected to electronic components. The substrates may be spaced apart from each other.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include a housing, memory, a first substrate, a second substrate, a third substrate, at least one processor, an RF transceiver, a first coupler, and a second coupler. The housing may include a first housing part and a second housing part that are movably coupled to each other. The first substrate may be disposed on the second housing part. The second substrate may be disposed on the first housing part. The third substrate may be deformable based on movement of the first housing part or the second housing part. The third substrate may electrically connect the first substrate and the second substrate. The at least one processor may be disposed on the first substrate. The RF transceiver may be disposed on the first substrate. The first coupler may be disposed on the first substrate. The first coupler may be configured to provide a first coupling signal based on a first signal from the RF transceiver. The second coupler may be disposed on the second substrate. The second coupler may be configured to provide a second coupling signal based on a second signal from the third substrate.

[0005] An electronic device is provided. The electronic device may include a memory, a first substrate, a second substrate, a third substrate, at least one processor, an RF transceiver, a first coupler, a second coupler, and an antenna. The memory may store instructions. The second substrate may be spaced apart from the first substrate. The third substrate may electrically connect the first substrate and the second substrate. The third substrate may include a first connector connected to the first substrate and a second connector connected to the second substrate. The at least one processor may be disposed on the first substrate. The RF transceiver may be disposed on the first substrate. The first coupler may be disposed on the first substrate. The first coupler may be configured to provide a first coupling signal based on a first signal from the RF transceiver. The second coupler may be disposed on the second substrate. The second coupler may be configured to provide a second coupling signal based on a second signal from the third substrate. The antenna may be electrically connected to the second coupler via the second substrate. The at least one processor may be configured to identify a difference between an electrical characteristic of the first coupling signal provided from the first coupler and an electrical characteristic of the second coupling signal provided from the second coupler. The at least one processor may be configured to change a transmission power output through the RF transceiver based on identifying that a difference between the electrical characteristic of the first coupling signal and the electrical characteristic of the second coupling signal exceeds a reference value.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] FIG. 2A is a top plan view of an exemplary electronic device in a first state.

[0008] FIG. 2b is a bottom view of an exemplary electronic device in a first state.

[0009] Figure 2c is a plan view of an exemplary electronic device within a second state.

[0010] FIG. 2d is a bottom view of an exemplary electronic device within a second state.

[0011] Figures 3a and 3b are exploded perspective views of an exemplary electronic device.

[0012] FIG. 4A is a cross-sectional view of an exemplary electronic device in a first state.

[0013] FIG. 4b is a cross-sectional view of an exemplary electronic device in a second state.

[0014] Figure 5a illustrates the interior of an exemplary electronic device in a first state.

[0015] Figure 5b illustrates the interior of an exemplary electronic device in the second state.

[0016] Figure 5c is an exploded perspective view of an exemplary electronic device.

[0017] Figure 6a illustrates a first substrate, a second substrate, and a third substrate within a first state.

[0018] Figure 6b illustrates the first substrate, the second substrate, and the third substrate within the second state.

[0019] Figure 7a is a graph showing the reflection coefficient of an RF signal according to the angle of a part of the third substrate.

[0020] Figure 7b is a graph showing the transmission coefficient of an RF signal according to the angle of a part of the third substrate.

[0021] Figure 8a is a schematic block diagram of an exemplary electronic device.

[0022] Figure 8b illustrates an exemplary unidirectional coupler.

[0023] Figure 8c illustrates an exemplary first substrate.

[0024] Figure 8d illustrates an exemplary second substrate.

[0025] Figure 9 is a flow chart showing the operation of an exemplary electronic device.

[0026] Figure 10 is a flow chart showing an example of an operation for changing transmission power based on power.

[0027] Fig. 11 is a flowchart showing an example of an operation for changing the operating frequency of an antenna based on SNR.

[0028] Figure 12 is a flowchart illustrating an example of an operation for changing an antenna based on SNR.

[0029] Figure 13a is a schematic block diagram of an exemplary electronic device.

[0030] Figure 13b illustrates an exemplary bidirectional coupler.

[0031] Figure 13c illustrates an exemplary third substrate.

[0032] Fig. 13d is a cross-sectional view of an exemplary third substrate taken along line C-C' of Fig. 13c.

[0033] Figure 14a is a flow chart showing an example of an operation for changing the impedance of a transmission signal based on VSWR.

[0034] Figure 14b illustrates an exemplary antenna switching circuit.

[0035] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] For example, the display of the display module (160) may be flexible. For example, the display may include a display area that is exposed outside a housing of the electronic device (101) that provides at least a portion of the outer surface of the electronic device (101) (e.g., the housing (201) of FIG. 5A). For example, since the display has flexibility, at least a portion of the display may be rollable into the housing or slidable into the housing. For example, the size of the display area may change depending on the size of the at least a portion of the display that is rolled into the housing or slid into the housing. For example, the electronic device (101) including the display may be in a plurality of states, including a first state that provides the display area having a first size and a second state that provides the display area having a second size different from the first size. For example, the first state may be exemplified through the description of FIGS. 2A and 2B.

[0059] FIG. 2A is a top plan view of an exemplary electronic device in a first state.

[0060] Referring to FIG. 2A, the electronic device (101) may include a housing (201) and a display (230) (e.g., the display). For example, the housing (201) may include a first housing part (210), a second housing part (220) movable relative to the first housing part (210) in a first direction (261) parallel to the y-axis or a second direction (262) parallel to the y-axis and opposite to the first direction (261). Alternatively, the first housing part (210) and the second housing part (220) may be movable relative to each other in the first direction (261) or the second direction (262). Although the second housing part (220) is described as being movable relative to the first housing part (210) within the present disclosure, this is not limited thereto. For example, the housing (201) may have a structure in which the overall size of the housing (201) can be changed according to a change in the relative positional relationship between the first housing part (210) and the second housing part (220). For example, the relative positional relationship between the first housing part (210) and the second housing part (220) can be changed by the operation of a motor (e.g., motor (361) of FIG. 3A) to be described later. For example, the first housing part (210) or the second housing part (220) may be movable by the motor (361), or both the first housing part (210) and the second housing part (220) may be movable.

[0061] For example, the electronic device (101) may be in the first state. For example, within the first state, the second housing part (220) may be movable relative to the first housing part (210) in a first direction (261) among the first direction (261) and the second direction (262). For example, within the first state, the second housing part (220) may not be movable relative to the first housing part (210) in the second direction (262).

[0062] For example, within the first state, the display (230) may provide the display area having the smallest size. For example, within the first state, the display area may correspond to the area (230a). For example, although not shown in FIG. 2A, within the first state, an area of ​​the display (230) other than the area (230a) which is the display area (e.g., area (230b) of FIG. 2C) may be included within the first housing part (210). For example, within the first state, the area (e.g., area (230b) of FIG. 2C) may be covered by the first housing part (210). For example, within the first state, the area may be rolled into the first housing part (210). For example, within the first state, the area (230a) may include a planar portion. However, the present invention is not limited thereto. For example, the region (230a) may include a curved portion extending from the planar portion and positioned within the edge portion, within the first state.

[0063] For example, the first state may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is positioned within the first housing part (210). For example, the first state may be referred to as a reduced state in that it provides the display area having the smallest size, but is not limited thereto.

[0064] For example, the second housing part (220) may include a first image sensor (250-1) within the camera module (180) that is exposed through a portion of the area (230a) and faces a third direction (263) parallel to the z-axis. For example, although not illustrated in FIG. 2A, the second housing part (220) may include one or more second image sensors within the camera module (180) that are exposed through a portion of the second housing part (220) and faces a fourth direction (264) parallel to the z-axis and opposite to the third direction (263). For example, the one or more second image sensors may be exemplified through the description of FIG. 2B.

[0065] FIG. 2b is a bottom view of an exemplary electronic device in a first state.

[0066] Referring to FIG. 2B, within the first state, one or more second image sensors (250-2) disposed within the second housing part (220) may be positioned within a structure disposed within the first housing part (210) for the one or more second image sensors (250-2). For example, light from outside the electronic device (101) may be received by the one or more second image sensors (250-2) through the structure within the first state. For example, since the one or more second image sensors (250-2) are positioned within the structure within the first state, the one or more second image sensors (250-2) may be exposed through the structure within the first state. For example, the structure may be implemented in various ways. For example, the structure may be an opening or a notch. For example, the structure may be an opening (212a) in the first plate (212) of the first housing part (210) that surrounds at least a portion of the second housing part (220). However, the present invention is not limited thereto. For example, in the first state, one or more second image sensors (250-2) included in the second housing part (220) may be covered by the first plate (212) of the first housing part (210).

[0067] For example, the first state can be changed to the second state.

[0068] For example, the first state (or the second state) can be changed to the second state (or the first state) through intermediate states between the first state and the second state.

[0069] For example, the first state (or the second state) may be changed to the second state (or the first state) based on a user input. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a user input to a physical button exposed through a part of the first housing part (210) or a part of the second housing part (220). For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a touch input to an executable object displayed within the display area. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a touch input having a contact point on the display area and having a pressing strength greater than or equal to a reference strength. For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a voice input received through a microphone of the electronic device (101). For example, the first state (or the second state) may be changed to the second state (or the first state) in response to an external force applied to the first housing part (210) and / or the second housing part (220) to move the second housing part (220) with respect to the first housing part (210). For example, the first state (or the second state) may be changed to the second state (or the first state) in response to a user input identified from an external electronic device (e.g., earbuds or a smart watch) connected to the electronic device (101). However, the present invention is not limited thereto.

[0070] The second state can be illustrated through the description of FIGS. 2c and 2d.

[0071] Figure 2c is a plan view of an exemplary electronic device within a second state.

[0072] Referring to FIG. 2C, the electronic device (101) may be in the second state. For example, in the second state, the second housing part (220) may be movable in the second direction (262) among the first direction (261) and the second direction (262) with respect to the first housing part (210). For example, in the second state, the second housing part (220) may not be movable in the first direction (261) with respect to the first housing part (210).

[0073] For example, within the second state, the display (230) may provide the display area having the largest size. For example, within the second state, the display area may correspond to an area (230c) including an area (230a) and an area (230b). For example, an area (230b) that was included within the first housing part (210) within the first state may be exposed within the second state. For example, within the second state, the area (230a) may include a planar portion. However, the present invention is not limited thereto. For example, the area (230a) may also include a curved portion that extends from the planar portion and is positioned within the edge portion. For example, within the second state, the area (230b), unlike the area (230a) within the first state, may include a planar portion among the planar portion and the curved portion. However, the present invention is not limited thereto. For example, the region (230b) may include a curved portion extending from the planar portion of the region (230b) and positioned within the edge portion.

[0074] For example, the second state may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) disposed outside the first housing part (210) extends relative to the first state. For example, the second state may be referred to as an expanded state in that it provides the display area having the largest size. However, the present invention is not limited thereto.

[0075] For example, the first image sensor (250-1) facing the third direction (263) may move together with the area (230a) according to the movement of the second housing part (220) in the first direction (261) when the state of the electronic device (101) changes from the first state to the second state. For example, although not shown in FIG. 2c, one or more second image sensors (250-2) facing the fourth direction (264) may move according to the movement of the second housing part (220) in the first direction (261) when the state of the electronic device (101) changes from the first state to the second state. For example, the relative positional relationship between one or more second image sensors (250-2) and the structure illustrated through the description of FIG. 4b may change according to the movement of one or more second image sensors (250-2). For example, the change in the above relative position relationship can be illustrated through Fig. 2d.

[0076] FIG. 2d is a bottom view of an exemplary electronic device within a second state.

[0077] Referring to FIG. 2d, within the second state, one or more second image sensors (250-2) may be positioned outside the structure. For example, the structure may include an opening (212a). For example, within the second state, one or more second image sensors (250-2) may be positioned outside the opening (212a) in the first plate (212). For example, one or more second image sensors (250-2) may be exposed through the opening (212a) within the first state. For example, because one or more second image sensors (250-2) are positioned outside the first housing part (210) within the second state, one or more second image sensors (250-2) may be exposed within the second state. For example, since one or more second image sensors (250-2) are positioned outside the structure within the second state, the relative positional relationship within the second state may be different from the relative positional relationship within the first state.

[0078] For example, if the electronic device (101) does not include the above structure such as the opening (212a), one or more second image sensors (250-2) may be exposed within the second state among the first state and the second state.

[0079] Although not shown in FIGS. 2A, 2B, 2C, and 2D, the electronic device (101) may be in an intermediate state between the first state and the second state. For example, the size of the display area in the intermediate state may be larger than the size of the display area in the first state and smaller than the size of the display area in the second state. For example, the display area in the intermediate state may correspond to an area including a portion of the area (230a) and the area (230b). For example, in the intermediate state, a portion of the area (230b) may be exposed, and another portion (or a remaining portion) of the area (230b) may be covered by the first housing part (210) or rolled into the first housing part (210). However, the present invention is not limited thereto.

[0080] Referring again to FIG. 1, the electronic device (101) may include structures for moving a second housing (e.g., a second housing part (220) of FIG. 2A) of the electronic device (101) relative to a first housing (e.g., a first housing part (210) of FIG. 2A) of the electronic device (101). For example, the structures may be exemplified through the description of FIGS. 3A and 3B.

[0081] Figures 3a and 3b are exploded perspective views of an exemplary electronic device.

[0082] Referring to FIGS. 3A and 3B, the electronic device (101) may include a first housing part (210), a second housing part (220), a display (230), and a driving unit (360).

[0083] For example, the first housing part (210) may include a first cover (311), a first plate (212), and a frame (313).

[0084] For example, the first cover (311) may at least partially form a side portion of an outer surface of the electronic device (101). For example, the first cover (311) may include an opening (311a) for one or more second image sensors (250-2). For example, the first cover (311) may include a surface that supports the first plate (212). For example, the first cover (311) may be coupled with the first plate (212). For example, the first cover (311) may include a frame (313). For example, the first cover (311) may be coupled with the frame (313).

[0085] For example, the first plate (212) may at least partially form a rear portion of the outer surface. For example, the first plate (212) may include an opening (212a) for one or more second image sensors (250-2). For example, the first plate (212) may be disposed on the surface of the first cover (311). For example, the opening (212a) may be aligned with the opening (311a).

[0086] For example, the frame (313) may be at least partially surrounded by the first cover (311).

[0087] For example, the frame (313) can be at least partially wrapped by the display (230). For example, although the frame (313) is at least partially wrapped by the display (230), the position of the frame (313) can be maintained independently of movement of the display (230). For example, the frame (313) can be arranged with respect to at least some of the components of the display (230). For example, the frame (313) can include rails (313a) that provide (or guide) a path for movement of at least one component of the display (230).

[0088] For example, the frame (313) may be coupled with at least one component of the electronic device (101). For example, the frame (313) may support the battery (189). For example, the battery (189) may be supported through a recess or hole in a surface (313b) of the frame (313). For example, the frame (313) may be coupled with one end of a flexible printed circuit board (FPCB) (325) on a surface of the frame (313). For example, although not explicitly shown in FIGS. 3A and 3B , the other end of the FPCB (325) may be connected to a PCB (324) through at least one connector. For example, the PCB (324) may be electrically connected to another PCB that supplies power to the motor (361) through the FPCB (325).

[0089] For example, the frame (313) can be combined with at least one structure of the electronic device (101) for a plurality of states including the first state and the second state. For example, the frame (313) can fasten the motor (361) of the driving unit (360).

[0090] For example, the second housing part (220) may include a second cover (321) and a second plate (322).

[0091] For example, the second cover (321) may be at least partially wrapped by the display (230). For example, the second cover (321) may be coupled to at least a portion of an area (230a) of the display (230) that wraps the second cover (321), unlike the frame (313), such that the display (230) moves relative to the second housing part (220) as the second housing part (220) moves relative to the first housing part (210).

[0092] For example, the second cover (321) may be coupled with at least one component of the electronic device (101). For example, the second cover (321) may be coupled with a printed circuit board (PCB) (324) including components of the electronic device (101). For example, the PCB (324) may include a processor (120) (not shown in FIGS. 3A and 3B). For example, the second cover (321) may support one or more second image sensors (250-2).

[0093] For example, the second cover (321) can be combined with at least one structure of the electronic device (101) for a plurality of states including the first state and the second state. For example, the second cover (321) can fix the rack gear (363) of the driving unit (360).

[0094] For example, the second cover (321) can be combined with the second plate (322).

[0095] For example, the second plate (322) may be coupled with the second cover (321) to protect at least one component of the electronic device (101) coupled within the second cover (321) and / or at least one structure of the electronic device (101) coupled within the second cover (321). For example, the second plate (322) may include a structure for the at least one component. For example, the second plate (322) may include one or more openings (326) for one or more second image sensors (250-2). For example, the one or more openings (326) may be aligned with one or more second image sensors (250-2) disposed on the second cover (321). For example, the size of each of the one or more openings (326) may correspond to the size of each of the one or more second image sensors (250-2).

[0096] For example, the electronic device (101) may include a support member (331) for supporting at least a portion of the display (230). For example, the support member (331) may include a plurality of bars. For example, the plurality of bars may be coupled to each other. The support member (331) may support an area (230b) of the display (230).

[0097] For example, the driving unit (360) may include a motor (361), a pinion gear (362), and a rack gear (363).

[0098] For example, the motor (361) may operate based on power from the battery (189). For example, the power may be provided to the motor (361) in response to the user input.

[0099] For example, the pinion gear (362) may be coupled to the motor (361) via a shaft. For example, the pinion gear (362) may be rotated based on the motion of the motor (361) transmitted via the shaft.

[0100] For example, the rack gear (363) can be arranged in relation to the pinion gear (362). For example, teeth of the rack gear (363) can mesh with teeth of the pinion gear (362). For example, the rack gear (363) can be moved in the first direction (261) or the second direction (262) according to the rotation of the pinion gear (362). For example, the second housing part (220) can be moved in the first direction (261) and the second direction (262) by the rack gear (363) that is moved according to the rotation of the pinion gear (362) due to the operation of the motor (361). For example, the first state of the electronic device (101) can be changed to a state different from the first state (e.g., one or more intermediate states or the second state) through the movement of the second housing part (220) in the first direction (261). For example, the second state of the electronic device (101) can be changed to a state different from the second state (e.g., one or more intermediate states or the first state) through the movement of the second housing part (220) in the second direction (262). For example, the first state being changed to the second state by the driving unit (360) and the second state being changed to the first state by the driving unit (360) can be exemplified through FIGS. 4A and 4B.

[0101] For example, the first cover (311) may include a conductive portion (e.g., the first conductive portion (314)) that can operate as an antenna radiator used for communication with an external electronic device. For example, the conductive portion may include a conductive material (e.g., metal). For example, the conductive portion may operate as an antenna radiator that can transmit and / or receive a wireless signal on a designated frequency band by being powered from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1).

[0102] Referring to FIG. 3B, the first cover (311) may include a first conductive portion (314), a second conductive portion (315), and / or a third conductive portion (316) that cooperatively form a first surface (S1) facing the +z direction and a second surface (S2) facing the -y direction. For example, the first cover (311) may include a first non-conductive portion (317) and a second non-conductive portion (318) that contact each of two ends of the first conductive portion (314). The first conductive portion (314) may be electrically isolated from the second conductive portion (315) and / or the third conductive portion (316) by the first non-conductive portion (317) and the second non-conductive portion (318). For example, the first conductive portion (314) may function as an antenna radiator for transmitting and / or receiving a wireless signal on a designated frequency band. For example, the first conductive portion (314) may be electrically connected to another PCB. The first conductive portion (314) capable of functioning as an antenna radiator may be referred to as at least a portion of an antenna (e.g., antenna (561) of FIG. 8A) to be described later.

[0103] Fig. 4a is a cross-sectional view of an exemplary electronic device in a first state. Fig. 4b is a cross-sectional view of an exemplary electronic device in a second state.

[0104] For example, FIG. 4A is a cross-sectional view of an exemplary electronic device (101) taken along line A-A' of FIG. 2A. For example, FIG. 4B is a cross-sectional view of an exemplary electronic device (101) taken along line B-B' of FIG. 2C.

[0105] Referring to FIGS. 4A and 4B, the motor (361) can be operated based at least in part on the defined user input received within the first state (490). For example, the pinion gear (362) can be rotated in the first rotational direction (411) based at least in part on the operation of the motor (361). For example, the rack gear (363) can be moved in the first direction (261) based at least in part on the rotation of the pinion gear (362) in the first rotational direction (411). For example, since the second cover (321) within the second housing part (220) fixes the rack gear (363), the second housing part (220) can be moved in the first direction (261) based at least in part on the movement of the rack gear (363) in the first direction (261). For example, since the second cover (321) within the second housing part (220) is coupled with at least a portion of the area (230a) of the display (230) and fixes the rack gear (363), the display (230) can be moved at least in part based on the movement of the rack gear (363) in the first direction (261). For example, the display (230) can be moved along the rails (313a). For example, the shape of at least a portion of the plurality of bars of the support member (331) of the display (230) can be changed when the state (490) is changed to the state (495) which is the second state.

[0106] For example, the area (230b) of the display (230) may be moved according to the movement of the display (230). For example, the area (230b) may be moved through the space between the first cover (311) and the frame (313) when the state (490) is changed to the state (495) according to the user input defined above. For example, the area (230b) in the state (495) may be exposed, unlike the area (230b) rolled into the space in the state (490).

[0107] For example, since the second cover (321) within the second housing part (220) is coupled with the PCB (324) connected to the other end of the FPCB (325) and fixes the rack gear (363), the shape of the FPCB (325) can be changed when the state (490) is changed to the state (495).

[0108] The motor (361) can be operated based at least in part on the defined user input received within the state (495). For example, the pinion gear (362) can be rotated in the second rotational direction (412) based at least in part on the operation of the motor (361). For example, the rack gear (363) can be moved in the second direction (262) based at least in part on the rotation of the pinion gear (362) in the second rotational direction (412). For example, since the second cover (321) within the second housing part (220) secures the rack gear (363), the second housing part (220) can be moved in the second direction (262) based at least in part on the movement of the rack gear (363) in the second direction (262). For example, since the second cover (321) of the second housing part (220) is coupled with at least a portion of the area (230a) of the display (230) and fixes the rack gear (363), the display (230) can be moved at least in part based on the movement of the rack gear (363) in the second direction (262). For example, the display (230) can be moved along the rails (313a). For example, the shape of at least a portion of the plurality of bars of the support member (331) of the display (230) can be changed when the state (495) is changed to the state (490). The support member (331) can be moved relative to the first housing part (210). The support member (331) housed inside the first housing part (210) within the state (490) can be positioned between the first cover (311) and the frame (313). As the support member (331) moves, the display (230) can move with respect to the first housing part (210).

[0109] For example, the area (230b) of the display (230) may be moved according to the movement of the display (230). For example, the area (230b) may be moved through the space between the first cover (311) and the frame (313) when the state (495) is changed to the state (490) according to the user input defined above. For example, the area (230b) in the state (490) may be rolled into the space, unlike the area (230b) exposed in the state (495).

[0110] For example, since the second cover (321) of the second housing part (220) is coupled with the PCB (324) connected to the other end of the FPCB (325) and fixes the rack gear (363), the shape of the FPCB (325) can be changed when the state (495) is changed to the state (490).

[0111] Figure 5a illustrates the interior of an exemplary electronic device in a first state. Figure 5b illustrates the interior of an exemplary electronic device in a second state. Figure 5c is an exploded perspective view of the exemplary electronic device.

[0112] Referring to FIGS. 5A, 5B, and 5C, an exemplary electronic device (101) may include a housing (201), a first substrate (511), a second substrate (512), and a third substrate (513).

[0113] For example, the housing (201) may include a first housing part (210) and a second housing part (220) that are movably coupled to each other. For example, the first housing part (210) may be movably coupled to the second housing part (220) in a first direction (261) and a second direction (262). However, the present invention is not limited thereto. For example, “the first housing part (210) is movably coupled to the second housing part (220)” may refer to a change in the relative positions of the first housing part (210) and the second housing part (220) with respect to each other. The first housing part (210) and the second housing part (220) may be referred to as the first housing part (210) and the second housing part (220) described with reference to FIGS. 2A to 4B. The state in which the second housing part (220) is movable in the first direction (261) (e.g., slide-in state) may be referred to as the first state illustrated in FIGS. 2A and 5A. The state in which the second housing part (220) is movable in the second direction (262) (e.g., slide-out state) may be referred to as the second state illustrated in FIGS. 2B and 5B. The first state may be referred to as a reduced state in that it provides the smallest size of the housing (201). The second state may be referred to as an expanded state in that it provides the largest size of the housing (201). However, the present invention is not limited thereto. For example, the electronic device (101) may be in any one of a plurality of intermediate states between the first state and the second state. The plurality of intermediate states may refer to a state between a first state in which the size of the housing (201) is minimum and a second state in which the size of the housing (201) is maximum.For example, within a plurality of intermediate states, the size of the housing (201) may be larger than the size of the housing (201) within the first state and smaller than the size of the housing (201) within the second state.

[0114] For example, the first substrate (511), the second substrate (512), and the third substrate (513) may be configured to provide electrical connections between components of the electronic device (101). For example, the first substrate (511) and the second substrate (512) may include printed circuit boards. For example, the first substrate (511) and the second substrate (512) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. The first substrate (511) and the second substrate (512) may provide electrical connections between various electronic components by using wires and conductive vias formed in the conductive layers.

[0115] The electronic device (101) may include a plurality of electronic components for various functions. The plurality of electronic components may be arranged in the first housing part (210) and the second housing part (220). As the first housing part (210) and the second housing part (220) are movably coupled to each other, an electrical connection may be required between at least one electronic component (e.g., the processor (120) of FIG. 1) arranged in the first housing part (210) and at least one electronic component (e.g., the antenna (561) of FIG. 8A) arranged in the second housing part (220). The arrangement of the component in the first housing part (210) or the second housing part (220) may refer to a structure in which the component is arranged inside the first housing part (210) or the second housing part (220) or a structure in which the component is supported by the first housing part (210) or the second housing part (220). However, the present invention is not limited thereto.

[0116] For example, the first substrate (511) may be disposed on the second housing part (220). For example, the second housing part (220) may include a second cover (321). For example, the first substrate (511) may be disposed on the second cover (321). The first substrate (511) may be electrically connected to at least one electronic component of the second housing part (220). For example, at least one processor (520) (e.g., the processor (120) of FIG. 1) and / or a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be disposed on the first substrate (511).

[0117] For example, the second substrate (512) may be disposed on the first housing part (210). For example, the first housing part (210) may include a first cover (311) and a frame (313). For example, the second substrate (512) may be disposed on one side (210a) of the first cover (311) of the first housing part (210). To provide a space in which at least a portion of the second housing part (220) and / or at least a portion of a display (e.g., a display (230) of FIG. 5C) may be positioned inside the first housing part (210), the third substrate (513) may be disposed on one side (210a) of the first housing part (210) rather than inside the first housing part (210). The second substrate (512) may be electrically connected to at least one electronic component of the first housing part (210). For example, the second substrate (512) may be electrically connected to an antenna (e.g., antenna (561) of FIG. 8A). For example, the antenna (561) may include the first conductive portion (314) illustrated in FIGS. 3A and 3B. However, the present invention is not limited thereto. For example, the antenna (561) may include a separate antenna module distinct from the first conductive portion (314).

[0118] For example, the third substrate (513) can electrically connect the first substrate (511) and the second substrate (512). For example, the third substrate (513) can include a flexible printed circuit board and / or a flexible printed circuit board radio frequency cable (FRC). The third substrate (513) can electrically connect the first substrate (511) and the second substrate (512), thereby providing a path for an electrical signal (e.g., an RF signal) between the first substrate (511) and the second substrate (512). For example, an electrical signal provided from at least one electronic component disposed on the first substrate (511) can be transmitted to at least one electronic component disposed on the second substrate (512) via the third substrate (513).

[0119] For example, the third substrate (513) may be connected to the second substrate (512). However, this is not limited thereto. The third substrate (513) may be directly connected to the second substrate (512), or may be indirectly connected via a fourth substrate (514) that is electrically connected to the second substrate (512). For example, the fourth substrate (514) may be positioned between the first substrate (511) and the second substrate (512). For example, an electrical signal provided from the first substrate (511) may be provided to the second substrate (512) via the third substrate (513) and the fourth substrate (514).

[0120] For example, the electronic device (101) may include a driving unit (360). The driving unit (360) may be configured to provide a driving force that changes the shape of the housing (201). For example, the driving unit (360) may include a motor (361), a rack gear (363), and / or a pinion gear (362). For example, the motor (361) may operate based on power provided from a battery. The pinion gear (362) may be coupled to the motor (361) via a shaft. For example, the pinion gear (362) may rotate based on the rotational motion of the motor (361) transmitted through the shaft. For example, the rack gear (363) may move based on the rotation of the pinion gear (362) by meshing with the pinion gear (362). For example, the teeth of the rack gear (363) may mesh with the teeth of the pinion gear (362). As the pinion gear (362) rotates, the pinion gear (362) may move the rack gear (363) in a first direction (261) or a second direction (262). For example, the rack gear (363) may be configured to move in the first direction (261) or the second direction (262) based on the rotational direction of the pinion gear (362).

[0121] Referring to FIG. 5C, the display (230) may include a first display area (230a) and a second display area (230b). The first display area (230a) may be a portion of the display (230) that can always be viewed from the outside, independent of the state of the electronic device (101). For example, regardless of whether the electronic device (101) is in the first state or the second state, the first display area (230a) may be a flat planar portion. The second display area (230b) may be a bendable portion that can be at least partially deformed according to the movement of the second housing part (220). For example, the display (230) may be coupled to the second housing part (220). The display (230) may be configured to move based on the movement of the second housing part (220).

[0122] Within the first state, at least a portion of the second display area (230b) can be rolled into the first housing part (210). Within the second state, at least a portion of the second display area (230b) can be unfolded. As the display (230) moves, the position of the second display area (230b) can change. For example, within the first state, the second display area (230b) can be positioned on the inside of the first housing part (210). For example, within the second state, at least a portion of the second display area (230b) can be positioned on the outside of the first housing part (210). When the second display area (230b) is positioned on the outside of the first housing part (210), the second display area (230b) can be unfolded, thereby expanding the display area of ​​the display (230). For example, the first display area (230a) may be referred to as the aforementioned area (e.g., area (230a) of FIG. 2a), and the second display area (230b) may be referred to as the aforementioned area (e.g., area (230b) of FIG. 2c).

[0123] Referring to FIGS. 5A and 5B, as the structure of the housing (201) is changed by the driving unit (360), the distance between the first substrate (511) and the second substrate (512) may be changed. The change in the distance between the first substrate (511) and the second substrate (512) may cause a deformation of the shape of the third substrate (513). The electrical signal transmitted through the third substrate (513) may be affected by the deformation of the shape of the third substrate (513).

[0124] Figure 6a illustrates a first substrate, a second substrate, and a third substrate within a first state. Figure 6b illustrates a first substrate, a second substrate, and a third substrate within a second state.

[0125] Referring to FIGS. 6A and 6B, the third substrate (513) can be deformed based on the movement of the first housing part (e.g., the first housing part (210) of FIG. 5A) or the second housing part (e.g., the second housing part (220) of FIG. 5A). For example, the third substrate (513) can be flexible. For example, a portion (513c) of the third substrate (513) between the first connector (513a) coupled to the first substrate (511) and the second connector (513b) coupled to the second substrate (512) can be bent or unfolded based on the movement of the first housing part (210) or the second housing part (220).

[0126] For example, the third substrate (513) may include a first connector (513a) and a second connector (513b). The first connector (513a) may be fixed by being connected to the first substrate (511). The second connector (513b) may be fixed by being connected to the second substrate (512). Since the first connector (513a) is fixed to the first substrate (511) and the second connector (513b) is fixed to the second substrate (512), when the first housing part (210) or the second housing part (220) moves, the relative positional relationship between the first connector (513a) and the second connector (513b) may change. As the relative positions between the fixed first connector (513a) and the second connector (513b) change, the shape of a portion (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b) may change. However, this is not limited thereto. For example, the second connector (513b) may be fixed by being connected to a fourth substrate (514) that is electrically connected to the second substrate (512).

[0127] Referring to Fig. 6a, within the first state, the portion (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b) can be bent. Referring to Fig. 6b, within the second state, the portion (513c) of the third substrate (513) can be unfolded. Within the second state, the portion (513c) of the third substrate (513) can be flat.

[0128] As the state of the electronic device (e.g., the electronic device (101) of FIG. 5A) repeatedly changes, the shape of the third substrate (513) may repeatedly change. For example, when the electronic device (101) changes from a first state to a second state, the portion (513c) of the third substrate (513) may change from a bent state to a flat state. For example, when the electronic device (101) changes from a second state to a first state, the portion (513c) of the third substrate (513) may change from a bent state to a flat state. For example, when the electronic device (101) is in an intermediate state, the portion (513c) of the third substrate (513) may be bent, slightly curved, or slightly straight. Within the intermediate state, the angle at which the part (513c) of the third substrate (513) is bent may be smaller than the angle at which the part (513c) of the third substrate (513) is bent within the first state. The angle at which the part (513c) of the third substrate (513) is bent may be maximum within the first state. The angle at which the part (513c) of the third substrate (513) is bent may be minimum within the second state. Within the plurality of intermediate states, the angle at which the part (513c) of the third substrate (513) is bent may be smaller than the angle within the first state and larger than the angle within the second state.

[0129] For example, referring to FIG. 6a, within the first state, the portion (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b) may be at least partially bent. As the first substrate (511) and the second substrate (512) come closer, the gap between the first substrate (511) and the second substrate (512) may be reduced. Within the first state, the portion (513c) of the third substrate (513) may be bent, so that the third substrate (513) may be positioned between the first substrate (511) and the second substrate (512). For example, referring to FIG. 6b, within the second state, the portion (513c) of the third substrate (513) may be at least partially flattened. For example, within the second state, the portion (513c) of the third substrate (513) may include a flat portion (513d) and a curved portion (513e). For example, the third substrate (513c) may include a rigid-flexible PCB (RF-PCB) that includes both a rigid portion and a flexible portion. For example, the portion of the third substrate (513) that bends based on the state of the electronic device (101) may be flexible, and the portion of the third substrate (513) that is always flat regardless of the state of the electronic device (101) may be rigid. However, the present invention is not limited thereto.

[0130] The third substrate (513) may include a signal line for an electrical signal. The signal line may include an RF signal line for an RF (radio frequency) signal. The shape of the portion (513c) of the third substrate (513) may affect the electrical signal transmitted through the signal line of the third substrate (513). For example, the signal line for the transmission path of the electrical signal of the third substrate (513) disposed between the first substrate (511) and the second substrate (512) may have different electrical characteristics based on the shape of the third substrate (513). For example, the impedance of the RF signal line formed within the third substrate (513) may vary based on the angle at which the portion (513c) of the third substrate (513) is bent.

[0131] For example, when an RF signal is transmitted and / or received through an antenna electrically connected to the second substrate (512), the electrical characteristics (e.g., impedance) of the RF signal may change as the RF signal passes through the third substrate (513). For example, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on the first substrate (511) and may radiate an RF signal through an antenna (e.g., the first conductive portion (314) of FIG. 3B and / or the antenna (561) of FIG. 8A) electrically connected to the second substrate (512). The RF signal may be provided to the antenna through the first substrate (511), the third substrate (513), the fourth substrate (514), and the second substrate (512). For example, an RF signal received through the antenna electrically connected to the second substrate (512) may be provided to the wireless communication circuit (192) through the second substrate (512), the fourth substrate (514), the third substrate (513), and the first substrate (511). Since the electrical path through which the RF signal is transmitted includes the third substrate (513), which may be at least partially bent depending on the state of the electronic device (101), the RF signal transmitted and / or received through the electronic device (101) may be affected by the impedance of the RF signal line formed within the third substrate (513).

[0132] Fig. 7a is a graph showing the reflection coefficient of an RF signal according to the angle of a portion of the third substrate. Fig. 7b is a graph showing the transmission coefficient of an RF signal according to the angle of a portion of the third substrate.

[0133] The x-axis of the graphs (700a, 700b) is frequency (unit: GHz (giga hertz)), and the y-axis is S-parameter (unit: dB (decibel)).

[0134] Referring to the graph (700a) in FIG. 7a, depending on the angle at which a portion (e.g., a portion (513c) of FIG. 6a) of a third substrate (e.g., the third substrate (513) of FIG. 6a) between a first connector (e.g., the first connector (513a) of FIG. 6a) and a second connector (e.g., the second connector (513b) of FIG. 6a) is bent, a reflection coefficient of an RF signal flowing along an RF signal line of the third substrate (513) may vary. The reflection coefficient may be referred to as a parameter indicating the degree to which power provided to a load (e.g., the antenna (561) of FIG. 8a) through the RF signal line is reflected rather than radiated. For example, the above angle may be referred to as a bending angle (θ) of the part (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b), which changes according to a change in the relative positional relationship between the first substrate (511) and the second substrate (512).

[0135] For example, the first graph (701) represents the reflection coefficient of the RF signal flowing along the RF signal line when the part (513c) of the third substrate (513) is in a flat state (e.g., the second state). For example, the second graph (702) represents the reflection coefficient of the RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 0.4 degrees. For example, the third graph (703) represents the reflection coefficient of the RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 1 degree. For example, the fourth graph (704) represents the reflection coefficient of the RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 6 degrees. For example, the fifth graph (705) represents the reflection coefficient of an RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 30 degrees.

[0136] Referring to FIG. 7A, as the angle of the portion (513c) of the third substrate (513) increases, the reflection coefficient may increase. For example, the reflection coefficient of the RF signal indicated by the first graph (701) may be the lowest. For example, the reflection coefficient of the RF signal indicated by the fifth graph (705) may be the highest. When the electronic device (101) changes from the second state to the intermediate state or the first state, the portion (513c) of the third substrate (513) may be bent, thereby increasing the angle of the portion (513c) of the third substrate (513). As the reflection coefficient increases depending on the angle of the portion (513c) of the third substrate (513), the radiation performance of the antenna (561) may deteriorate.

[0137] Referring to the graph (700b) in FIG. 7b, depending on the angle at which a portion (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b) is bent, a transmission coefficient of an RF signal flowing along the RF signal line of the third substrate (513) may vary. The transmission coefficient may be referred to as a parameter indicating the extent to which power provided to a load (e.g., an antenna (561)) through the RF signal line passes through the RF signal line. For example, the angle may be referred to as a bending angle (θ) of the portion (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b), which changes depending on a change in the relative positional relationship between the first substrate (511) and the second substrate (512).

[0138] For example, the first graph (706) represents the transmission coefficient of the RF signal flowing along the RF signal line when the part (513c) of the third substrate (513) is in a flat state (e.g., the second state). For example, the second graph (707) represents the transmission coefficient of the RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 0.4 degrees. For example, the third graph (708) represents the transmission coefficient of the RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 1 degree. For example, the fourth graph (709) represents the transmission coefficient of the RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 6 degrees. For example, the fifth graph (710) represents the transmission coefficient of an RF signal flowing along the RF signal line when the angle of the part (513c) of the third substrate (513) is about 30 degrees.

[0139] Referring to FIG. 7B, as the angle of the portion (513c) of the third substrate (513) increases, the transmission coefficient may decrease. For example, the transmission coefficient of the RF signal indicated by the first graph (706) may be the highest. For example, the transmission coefficient of the RF signal indicated by the fifth graph (710) may be the lowest. When the electronic device (101) changes from the second state to the intermediate state or the first state, the portion (513c) of the third substrate (513) may be bent, thereby increasing the angle of the portion (513c) of the third substrate (513). As the transmission coefficient decreases depending on the angle of the portion (513c) of the third substrate (513), the radiation performance of the antenna (561) may deteriorate.

[0140] An RF signal (e.g., a transmission signal) to be transmitted to an external electronic device may be provided from a first substrate (511) to a second substrate (512) through a third substrate (513). The RF signal may be transmitted to the external electronic device by being provided to an antenna (561) electrically connected to the second substrate (512). When the RF signal passes through the third substrate (513), the electrical characteristics of the RF signal may change depending on the angle at which the portion (513c) of the third substrate (513) is bent. The electronic device (101) may identify the difference in electrical characteristics between a signal before passing through the third substrate (513) (e.g., the first signal (811) of FIG. 8A) and a signal after passing through the third substrate (513) (e.g., the second signal (812) of FIG. 8A), and compensate for the difference, thereby reducing deterioration of communication performance.

[0141] Figure 8a is a schematic block diagram of an exemplary electronic device. Figure 8b illustrates an exemplary unidirectional coupler. Figure 8c illustrates an exemplary first substrate. Figure 8d illustrates an exemplary second substrate.

[0142] As described above, as the angle increases, the reflection coefficient of the RF signal may increase, and the transmission coefficient may decrease. For example, as the angle at which a portion (e.g., a portion (513c) of FIG. 6A) of the third substrate (e.g., the third substrate (513) of FIG. 6A) is bent increases, signal loss due to impedance change may increase. When the RF signal passes through the third substrate (513), the loss of the RF signal may occur, which may cause a deterioration in the performance of the electronic device (101). For example, the electrical characteristics of the RF signal for communication with an external electronic device may change as it passes through the third substrate (513), which may deteriorate the communication performance of the electronic device (101).

[0143] An exemplary electronic device (101) may include components for improving communication performance of the electronic device (101) by identifying electrical characteristic deviations caused by an RF signal passing through a third substrate (513) and compensating for the deviations. Hereinafter, with reference to the drawings, an exemplary electronic device (101) capable of compensating for characteristic deviations of an RF signal due to a third substrate (513) is described.

[0144] Referring to FIG. 8A, an exemplary electronic device (101) may include at least one processor (520), an RF transceiver (530), a first coupler (540), a second coupler (550), and / or an antenna (561).

[0145] For example, at least one processor (520), an RF transceiver (530), and a first coupler (540) may be disposed on a first substrate (511). As described above, the first substrate (511) may be disposed on a first housing part (210). For example, the second coupler (550) may be disposed on a second substrate (512). As described above, the second substrate (512) may be disposed on one surface (210a) of the second housing part (220). A third substrate (513) may be disposed between the first substrate (511) and the second substrate (512). The antenna (561) may be electrically connected to the second substrate (512). For example, an antenna radiator for transmitting and / or receiving a signal may be electrically connected to the second substrate (512). For example, the antenna (561) may be referred to as the first conductive portion illustrated in FIG. 3b (e.g., the first conductive portion (314) in FIG. 3b), but is not limited thereto.

[0146] For example, at least one processor (520) may include at least one of an application processor (AP) (e.g., the main processor (121) of FIG. 1) or a communication processor (CP) (e.g., the auxiliary processor (123) of FIG. 1). For example, the processor may include an AP and a CP. For example, at least one processor (520) may include an AP. For example, at least one processor (520) may include a CP.

[0147] At least one processor (520) can generate a baseband signal. At least one processor (520) can control an RF transceiver (530) to process the generated baseband signal. At least one processor (520) can output a transmission signal with a specified transmission power. For example, the transmission signal may refer to a communication signal to be transmitted to an external electronic device (e.g., a base station, another terminal). At least one processor (520) can control the RF transceiver (530) to transmit the transmission signal through the antenna (561). At least one processor (520) can control the RF transceiver (530) to transmit the transmission signal in a frequency band capable of communicating with the external electronic device.

[0148] For example, the RF transceiver (530) may be implemented as a single chip (e.g., a radio frequency integrated circuit (RFIC) chip) or as part of a single package. The RF transceiver (530) may include a digital to analog converter (DAC) for converting a digital signal to an analog signal. The RF transceiver (530) may include a mixer and an oscillator (e.g., a local oscillator (LO)) for up-conversion. The RF transceiver (530) may convert a baseband signal generated by at least one processor (520) into an RF signal. The RF transceiver (530) may include an analog to digital converter (ADC) for converting an analog signal to a digital signal. The RF transceiver (530) may include a mixer and an oscillator for down-conversion. The RF transceiver (530) can convert an RF signal received from the antenna (561) into a baseband signal so that it can be processed by at least one processor (520). The RF transceiver (530) can transmit and / or receive the RF signal via the RF signal line (805).

[0149] For example, the electronic device (101) may include a power amplifier module (PAM) (590). For example, the PAM (590) may include, but is not limited to, a power amplifier (PA) (591) and / or a duplexer (592) for a transmission path.

[0150] For example, the RF transceiver (530) can receive coupling signals fed back from the first coupler (540) and the second coupler (550). For example, the RF transceiver (530) can include a feedback receive port (FBRX). For example, the RF transceiver (530) can receive a first coupling signal (811c) provided from the first coupler (540) and a second coupling signal (812c) provided from the second coupler (550) at different times. The electronic device (101) can include components for receiving the first coupling signal (811c) and the second coupling signal (812c). For example, the components can include a low noise amplifier (LNA), an ADC, a mixer, and an oscillator.

[0151] For example, the first coupler (540) and the second coupler (550) may be unidirectional couplers. However, this is not limited thereto. The first coupler (540) and the second coupler (550) may be dual directional couplers. An example in which the first coupler (540) and the second coupler (550) are implemented as dual directional couplers will be described later with reference to FIG. 13A.

[0152] For example, the first coupler (540) and the second coupler (550) may refer to RF passive components for distributing or combining signal power. Referring to FIG. 8B, the unidirectional coupler (800) may include three ports. The three ports may include a first port (801) for inputting a transmission signal, a second port (802) for outputting a transmission signal, or a third port (803) for coupling. For example, the unidirectional coupler (800) may be a three-port coupler. The unidirectional coupler (800) may include a portion of an RF signal line (805) for power transfer between the first port (801) and the second port (802). The first port (801) may be referred to as an input port. The second port (802) may be referred to as an output port. The unidirectional coupler (800) may include a coupling signal line (804) connected to the third port (803) and adjacent to the RF signal line (805). Through the coupling signal line (804), the unidirectional coupler (800) may transmit power to the third port (803) or obtain power from the third port (803). The third port (803) may be referred to as a coupling port. In one embodiment, the unidirectional coupler (800) may output a signal applied through the third port (803) and a signal applied through the first port (801) together through the second port (802).

[0153] Referring back to FIG. 8A, the coupling signal line (804) may include a first coupling signal line (804a) and a second coupling signal line (804b). For example, the first coupler (540) may be disposed on the first substrate (511). For example, the first coupler (540) may be configured to provide a first coupling signal (811c) based on a first signal (811) from the RF transceiver (530). The first coupling signal (811c) may be a coupling signal for the first signal (811), which is a transmission signal before passing through the third substrate (513). The first coupler (540) may provide the first coupling signal (811c) to the RF transceiver (530) via the first coupling signal line (804a).

[0154] For example, the second coupler (550) may be disposed on a second substrate (512) spaced apart from the first substrate (511). For example, the second coupler (550) may be configured to provide a second coupling signal (812c) based on a second signal (812) transmitted from a third substrate (513). The second coupling signal (812c) may be a coupling signal for the second signal (812), which is a transmission signal after passing through the third substrate (513). The second coupler (550) may provide the second coupling signal (812c) to the RF transceiver (530) via a second coupling signal line (804b). However, the present invention is not limited thereto.

[0155] When a transmission signal is provided from at least one processor (520) to the antenna (561), the transmission signal may pass through the third substrate (513). Depending on the shape of the third substrate (513), a signal disadvantage (e.g., loss) may occur due to the impedance of the RF signal line (805) within the third substrate (513). For example, a difference may occur between the electrical characteristics of the first signal (811) and the electrical characteristics of the second signal (812). Due to the difference, the electronic device (101) may not have the intended communication performance. For example, as the power of the transmission signal decreases, the quality of the transmission signal may deteriorate. The electronic device (101) may include a first coupler (540) disposed on a first substrate (511) and a second coupler (550) disposed on a second substrate (512) to obtain parameters representing electrical characteristics of a first signal (811) and parameters representing electrical characteristics of a second signal (812). In FIG. 8A, the first coupler (540) is illustrated as a separate component from a power amplifier module (PAM) (590), but is not limited thereto. For example, the first coupler (540) may be included within the PAM (590).

[0156] Fig. 8c shows an example of a first substrate (511) on which the components illustrated in Fig. 8a are arranged. The first substrate (511) illustrated in Fig. 8c is merely exemplary and is not limited thereto.

[0157] Referring to FIGS. 8A and 8C, the first coupler (540) may be disposed within a PAM (590) that includes a plurality of components (e.g., a power amplifier (591), at least one low noise amplifier (LNA) (593), at least one filter (594), a switching circuit (595), a receive interface (596), and / or a transmit interface (597)). For example, the first coupler (540) may be disposed between an output terminal of the power amplifier (591) and a first connector (513a) to provide a first coupling signal (e.g., a first coupling signal (811c) of FIG. 8A), which is a coupling signal of a first signal (e.g., a first signal (811) of FIG. 8A) from an RF transceiver (e.g., an RF transceiver (530) of FIG. 8A), to the RF transceiver (530). For example, the first coupler (540) can reduce the loss of the first signal (811) provided to the first coupler (540) by being arranged between the output terminal of the power amplifier (591) and the first connector (513a). For example, the first coupler (540) can be connected to the output terminal of the filter (594) in consideration of the insertion loss caused by the filter (e.g., band pass filter (BPF)) (594). By arranging the first coupler (540) within the PAM (590), the mounting space (or mounting area) occupied by the first coupler (540) can be reduced.

[0158] FIG. 8d illustrates an example of a second substrate (512) on which the components illustrated in FIG. 8a are arranged. The second substrate (512) illustrated in FIG. 8d is merely exemplary and is not limited thereto.

[0159] Referring to FIGS. 8A and 8D, a second coupler (550) may be disposed between a second connector (513b) and an antenna (e.g., an antenna (561) of FIG. 8A) on a second substrate (512). The second coupler (550) may be disposed between a first portion (512a) of the second substrate (512) connected to the second connector (513b) and at least one fourth portion (512d) of the second substrate (512) connected to the antenna (561) in order to provide a second coupling signal (e.g., a second coupling signal (812c) of FIG. 8A), which is a coupling signal of a second signal (e.g., a second signal (812) of FIG. 8A) from a third substrate (513), to an RF transceiver (e.g., an RF transceiver (530) of FIG. 8A). For example, the second coupler (550) may be disposed between the second connector (513b) and the antenna (561) to obtain the second signal (812) before the second signal (812) is transmitted to the antenna (561) electrically connected to the second substrate (512). For example, in order to provide information about the impedance of an RF signal line (e.g., the RF signal line (805) of FIG. 8A) of the third substrate (513) through the second coupling signal (812c), the second coupler (550) may be disposed close to the second connector (513b). For example, in order to provide information about the impedance of an antenna switching circuit (e.g., the antenna switching circuit (580) of FIG. 8A) through the second coupling signal (812c), the second coupler (550) may be disposed close to the antenna switching circuit (580).

[0160] For example, since the second substrate (512) can be placed on one side (e.g., one side (210a) of FIG. 5c) of the first housing part (e.g., the first housing part (210) of FIG. 5c), the thickness of the second coupler (550) can be limited. To reduce the thickness of the second coupler (550), the second coupler (550) can include a conductive pattern embedded in the second substrate (512). Since the second coupler (550) is implemented as a conductive pattern embedded in the second substrate (512) rather than being placed on the second substrate (512) as a separate component, the thickness of the second coupler (550) can be reduced.

[0161] For example, as illustrated in FIG. 8D, the second coupler (550) may be formed as at least one conductive pattern disposed on a plurality of layers (5131, 5132, 5133) of the second substrate (512). For example, the second substrate (512) may include a plurality of layers (5131, 5132, 5133) that are stacked on each other. For example, the third substrate (513) may include a first layer (5131), a second layer (5132), and / or a third layer (5133). However, the present invention is not limited thereto. The second coupler (550) may not be directly mounted in the form of a circuit on the second substrate (512), but may be formed as at least one conductive pattern built on the first layer (5131), the second layer (5132), and / or the third layer (5133) that are stacked on each other. For example, the second coupler (550) may be formed of at least one or a combination of a first conductive pattern (551) disposed on a first layer (5131), a second conductive pattern (552) disposed on a second layer (5132), and / or a third conductive pattern (553) disposed on a third layer (5133). The first conductive pattern (551), the second conductive pattern (552), and / or the third conductive pattern (553) may be stacked on each other.

[0162] In another example, the second coupler (550) may include multiple first conductive patterns (551) disposed on multiple portions of a first layer (5131), multiple second conductive patterns (552) disposed on multiple portions of a second layer (5132), and / or multiple third conductive patterns (553) disposed on multiple portions of a third layer (5133), or a combination thereof. The multiple first conductive patterns (551), the multiple second conductive patterns (552), and / or the multiple third conductive patterns (553) may be laminated to one another.

[0163] Referring to FIG. 8d, the second substrate (512) may include a first portion (512a), a second portion (512b), a third portion (512c), and / or at least one fourth portion (512d). The first portion (512a) may be a portion of the second substrate (512) that is connected to the second connector (513b). The second portion (512b) may be a portion of the second substrate (512) from which a plurality of signal lines extend. The third portion (512c) may be a portion of the second substrate (512) on which at least one electronic component (e.g., the second coupler (550) and / or the antenna switching circuit (580)) is disposed. The at least one fourth portion (512d) may be a portion of the second substrate (512) that includes at least one contact portion that is connected to an antenna (e.g., the antenna (561) of FIG. 8a).

[0164] For example, the electronic device (101) may further include a switching circuit (570). The switching circuit (570) may be disposed on the first substrate (511). The switching circuit (570) may electrically connect the RF transceiver (530) and the first coupler (540). The switching circuit (570) (shown in FIG. 8A) may electrically connect the RF transceiver (530) and the second coupler (550). For example, the switching circuit (570) may be connected to the first coupling signal line (804a), the second coupling signal line (804b), and the third coupling signal line (804c) between the RF transceiver (530) and the switching circuit (570). For example, the switching circuit (570) may include a first terminal (571) connected to a first coupling signal line (804a), a second terminal (572) connected to a second coupling signal line (804b), and a third terminal (573) connected to a third coupling signal line (804c).

[0165] For example, the RF transceiver (530) may be configured to receive the first coupling signal (811c) by being electrically connected to the first coupler (540) via the switching circuit (570). For example, the electrical connection between the RF transceiver (530) and the first coupler (540) may be formed through a state (570a) of the switching circuit (570) that electrically connects the first terminal (571) of the first switching circuit (570) and the third terminal (573) of the first switching circuit (570). In a state (570a) of a switching circuit (570) in which a first terminal (571) and a third terminal (573) are electrically connected, a first coupling signal (811c) provided from a first coupler (540) can be provided to an RF transceiver (530) through a first coupling signal line (804a) and a third coupling signal line (804c).

[0166] For example, the RF transceiver (530) may be configured to receive the second coupling signal (812c) by being electrically connected to the second coupler (550) via the switching circuit (570). For example, the electrical connection between the RF transceiver (530) and the second coupler (550) may be formed through a state (570b) of the switching circuit (570) that electrically connects the second terminal (572) of the first switching circuit (570) and the third terminal (573) of the first switching circuit (570). In a state (570b) of a switching circuit (570) in which a second terminal (572) and a third terminal (573) are electrically connected, a second coupling signal (812c) provided from a second coupler (550) can be provided to an RF transceiver (530) through a second coupling signal line (804b) and a third coupling signal line (804c).

[0167] For example, at least one processor (520) may be configured to control a switching circuit (570). The at least one processor (520) may control the switching circuit (570) such that the first coupling signal (811c) and the second coupling signal (812c) are provided at different times. For example, the at least one processor (520) may control the switching circuit (570) such that the first terminal (571) and the third terminal (573) are electrically connected (e.g., state (570a)). Within the state (570a), the at least one processor (520) may receive the first coupling signal (811c). After receiving the first coupling signal (811c), at least one processor (520) can control the switching circuit (570) so that the second terminal (572) and the third terminal (573) are electrically connected (e.g., state (570b)). Within the state (570b), at least one processor (520) can receive the second coupling signal (812c). However, the present invention is not limited thereto.

[0168] The RF transceiver (530) may include an analog to digital converter (ADC) for converting the first coupling signal (811c) and the second coupling signal (812c) into digital signals. The RF transceiver (530) may include a mixer and an oscillator for down-converting the first coupling signal (811c) and the second coupling signal (812c). The RF transceiver (530) may down-convert the received first coupling signal (811c) and the second coupling signal (812c) and convert them into digital signals. The RF transceiver (530) may provide the converted first coupling signal (811c) and the second coupling signal (812c) to at least one processor (520).

[0169] For example, the electronic device (101) may further include an antenna switching circuit (580) for changing the inductance of an inductor or the capacitance of a capacitor electrically connected to the antenna (561). The operation of controlling the antenna switching circuit (580) by at least one processor (520) will be described later with reference to FIG. 14A.

[0170] As described above, depending on the angle at which the portion of the third substrate (513) (e.g., the portion (513c) of FIG. 6A) is bent, a difference may occur between the electrical characteristics of the first signal (811) and the electrical characteristics of the second signal (812). For example, since the first coupling signal (811c) is a coupling signal for the first signal (811) from the RF transceiver (530), it may represent the electrical characteristics of the transmission signal before passing through the third substrate (513). For example, since the second coupling signal (812c) is a coupling signal for the second signal (812) from the third substrate (513), it may represent the electrical characteristics of the transmission signal after passing through the third substrate (513). At least one processor (520) may perform a deviation compensation control or another similar process to compensate for a difference in electrical characteristics of the first signal (811) exceeding a reference value and the second signal (812) based on the first coupling signal (811c) and the second coupling signal (812c). Through the deviation compensation control or another similar process, the difference in electrical characteristics of the first signal (811) and the second signal (812) may be reduced. Through the reduction of the difference, the at least one processor (520) may reduce deterioration of communication performance of the electronic device (101).

[0171] Below, the operation of at least one processor (520) is described.

[0172] Figure 9 is a flow chart showing the operation of an exemplary electronic device.

[0173] Referring to FIG. 9, in operation 901, at least one processor (e.g., at least one processor (520) of FIG. 8A) may obtain a first coupling signal (e.g., the first coupling signal (811c) of FIG. 8A) and a second coupling signal (e.g., the second coupling signal (812c) of FIG. 8A).

[0174] For example, at least one processor (520) can obtain a first coupling signal (811c) from a first coupler (e.g., the first coupler (540) of FIG. 8A) disposed on a first substrate (e.g., the first substrate (511) of FIG. 8A). For example, at least one processor (520) can obtain a first coupling signal (811c) from a second coupler (e.g., the second coupler (550) of FIG. 8A) disposed on a second substrate (e.g., the second substrate (512) of FIG. 8A). The second coupling signal (812c) can be provided to the first substrate (511) via a third substrate (e.g., the third substrate (513) of FIG. 8A). For example, at least one processor (520) can receive a first coupling signal (811c) and a second coupling signal (812c) from an RF transceiver (e.g., the RF transceiver (530) of FIG. 8A). For example, at least one processor (520) can control a switching circuit (e.g., the switching circuit (570) of FIG. 8A) so that the RF transceiver (530) is electrically connected to the first coupler (540). For example, at least one processor (520) can control a switching circuit (570) so that the RF transceiver (530) is electrically connected to the second coupler (550). The RF transceiver (530) can receive the first coupling signal (811c) and the second coupling signal (812c) at different times. The RF transceiver (530) can down-convert the first coupling signal (811c) and the second coupling signal (812c) and convert them into digital signals. At least one processor (520) can receive the converted first coupling signal (811c) and second coupling signal (812c) from the RF transceiver (530).

[0175] In operation 903, at least one processor (520) can identify a difference between a first parameter representing an electrical characteristic of a first coupling signal (811c) and a second parameter representing an electrical characteristic of a second coupling signal (812c).

[0176] For example, at least one processor (520) can obtain a first parameter of the first coupling signal (811c). For example, at least one processor (520) can obtain a second parameter of the second coupling signal (812c). At least one processor (520) can calculate a difference between the first parameter and the second parameter. For example, the parameter representing the electrical characteristic may include at least one of power, signal to noise ratio (SNR), or voltage standing wave ratio (VSWR) of the first coupling signal (811c) and the second coupling signal (812c). However, the parameters described above are merely exemplified as parameters for identifying disadvantages (e.g., loss) caused by the third substrate (513), and this exemplary description is not to be construed as limiting the use of other parameters.

[0177] In operation 905, at least one processor (520) may identify whether a difference between a first parameter and a second parameter exceeds a reference value. For example, the reference value may be set based on the degree to which the difference between the first parameter and the second parameter affects the communication performance of an electronic device (e.g., the electronic device (101) of FIG. 8A). For example, when a transmission signal is provided to an antenna (e.g., the antenna (561) of FIG. 8A) through the first substrate (511), the third substrate (513), and the second substrate (512), a loss may occur due to the impedance of an RF signal line (e.g., the RF signal line (805) of FIG. 8A) of the third substrate (513). If the quality of a signal radiated through the antenna (561) is degraded due to the loss, the communication performance of the electronic device (101) may deteriorate. The reference value may be set based on the extent to which the degradation of the signal quality affects the communication performance of the electronic device (101). For example, a difference between the first parameter and the second parameter that is below the reference value may be an acceptable difference because the impact on the communication performance of the electronic device (101) is minor. For example, a difference between the first parameter and the second parameter that exceeds the reference value may be an unacceptable difference because it causes a deterioration in the communication performance of the electronic device (101).

[0178] If the difference exceeds the reference value, at least one processor (520) may perform operation 907. If the difference does not exceed the reference value, at least one processor (520) may perform operation 901 again.

[0179] In operation 907, at least one processor (520) may perform control for deviation compensation. For example, at least one processor (520) may change the transmission power output through the RF transceiver (530) based on the first coupling signal (811c) provided from the first coupler (540) and the second coupling signal (812c) provided from the second coupler (550).

[0180] For example, at least one processor (520) may perform control to compensate for a difference (deviation) between the first parameter and the second parameter that is greater than or equal to a reference value, based on the first coupling signal (811c) and the second coupling signal (812c). As described above, depending on the angle at which the portion (e.g., the portion (513c) of FIG. 6A) of the third substrate (513) is bent, a difference may occur between the electrical characteristics of the first signal (e.g., the first signal (811) of FIG. 8A) and the electrical characteristics of the second signal (e.g., the second signal (812) of FIG. 8A). For example, at least one processor (520) may perform control to compensate for the deviation so that the difference between the first parameter and the second parameter becomes less than or equal to a reference value. When the difference between the first parameter and the second parameter becomes less than or equal to a reference value, the difference between the electrical characteristics of the first signal (811) and the electrical characteristics of the second signal (812) is reduced, thereby reducing the deterioration of the communication performance of the electronic device (101). According to one embodiment, the electronic device (101) can maintain the target communication performance regardless of the state of the electronic device (101) (e.g., the first state, the second state, and a plurality of intermediate states).

[0181] For example, the control for the deviation compensation may include at least one of an operation for changing the transmission power output through the RF transceiver (530), an operation for changing the operating frequency of a signal to be transmitted through the antenna (561), an operation for changing the impedance of a signal line by changing the inductance of an inductor or the capacitance of a capacitor electrically connected to the antenna (561), and an operation for changing the antenna to be used for communication with an external electronic device from the antenna (561) to the other antenna (562).

[0182] Figure 10 is a flow chart showing an example of an operation for changing transmission power based on power.

[0183] For example, the first parameter may be the power of a first coupling signal (e.g., the first coupling signal (811c) of FIG. 8A), and the second parameter may be the power of a second coupling signal (e.g., the second coupling signal (812c) of FIG. 8A). The power of the coupling signal may be proportional to the transmission power output through the RF transceiver (e.g., the RF transceiver (530) of FIG. 8A). For example, when the transmission power output through the RF transceiver (530) increases, the power of the coupling signal may increase. For example, when the transmission power output through the RF transceiver (530) decreases, the power of the coupling signal may decrease.

[0184] Referring to FIG. 10, in operation 1001, at least one processor (e.g., at least one processor (520) of FIG. 8A) may obtain a first coupling signal (811c) and a second coupling signal (812c). Operation 1001 in FIG. 10 may be substantially the same as operation 901 in FIG. 9.

[0185] In operation 1003, at least one processor (520) can identify a difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c).

[0186] For example, as illustrated in FIG. 6B, when the electronic device (e.g., the electronic device (101) of FIG. 8A) is in the second state, a portion (e.g., a portion (513c) of FIG. 6A) of the third substrate (e.g., the third substrate (513) of FIG. 8A) may be flat. Since the portion (513c) of the third substrate (513) including the RF signal line (e.g., the RF signal line (805) of FIG. 8A) is flat, the loss of the RF signal passing through the RF signal line (805) of the third substrate (513) may be relatively small. For example, as illustrated in FIG. 6A, when the electronic device (101) is in the first state, a portion (513c) of the third substrate (513) may be bent. Since a portion (513c) of the third substrate (513) including the RF signal line (805) is bent, the loss of the transmission signal passing through the RF signal line of the third substrate (513) may be relatively large. As the loss of the transmission signal changes, the loss of the first signal (e.g., the first signal (811) of FIG. 8A), which is the signal before passing through the third substrate (513), may be less than the loss of the second signal (e.g., the second signal (812) of FIG. 8A), which is the signal after passing through the third substrate (513). Due to the difference in the loss, a difference may occur between the power of the first coupling signal (811c) and the power of the second coupling signal (812c). For example, when the loss of the transmission signal is large when passing through the third substrate (513), the power of the transmission signal may be reduced. As the power of the transmitted signal decreases, the quality of the radiated signal transmitted through the antenna (561) may deteriorate.

[0187] For example, at least one processor (520) can obtain the power of the first coupling signal (811c). For example, at least one processor (520) can obtain the power of the second coupling signal (812c). For example, at least one processor (520) can calculate the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c).

[0188] In operation 1005, at least one processor (520) can identify whether the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) exceeds a reference value. For example, the reference value can be set to a value at which it can be determined that the communication performance of the electronic device (101) has deteriorated due to loss of the transmission signal. For example, the reference value can be about 2 dB to about 3 dB, but is not limited thereto.

[0189] If the difference does not exceed the reference value, at least one processor (520) may perform operation 1007. If the difference exceeds the reference value, at least one processor (520) may perform operation 1009.

[0190] In operation 1007, at least one processor (520) can maintain the transmission power output through the RF transceiver (530). When the RF signal passes through the third substrate (513), since the loss of the transmission signal is small, the difference between the power of the first signal (811) and the power of the second signal (812) may be small. When the difference between the power of the first signal (811) and the power of the second signal (812) is small, the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) may be less than or equal to a reference value. Since the loss of the RF signal is small, the electronic device (101) can have the target communication performance. Since the electronic device (101) has the target communication performance, the at least one processor (520) can maintain the transmission power output through the RF transceiver (530) without changing it.

[0191] In operation 1009, at least one processor (520) may change the transmit power output through the RF transceiver (530).

[0192] For example, when an RF signal passes through the third substrate (513), if the loss of the transmission signal is large, the difference between the power of the first signal (811) and the power of the second signal (812) may be large. For example, in the first state, since the angle at which the part (513c) of the third substrate (513) is bent is relatively large, the loss of the RF signal may be large. When the second signal (812) from the third substrate (513) is radiated through the antenna (561), the communication performance of the electronic device (101) may deteriorate. At least one processor (520) may increase the transmission power output through the RF transceiver (530) in order to increase the power of the second signal (812). For example, at least one processor (520) may control the RF transceiver (530) to output a signal with a first transmission power higher than a second transmission power to be described later, based on identifying a difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) that exceeds a reference value. The first transmission power may be referred to as a power that can compensate for the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c). For example, the first transmission power, which is the compensation power, may be determined through a least square error estimation process for the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c). As the above transmission power increases, the loss that occurs while passing through the third substrate (513) is compensated, so that the difference between the power of the first signal (811) and the power of the second signal (812) can be reduced.

[0193] For example, when the electronic device (101) is in the second state, the portion (513c) of the third substrate (513) may have less loss due to impedance because it is flat. Within the second state, the difference between the power of the first signal (811) and the power of the second signal (812) may be small. When the difference between the power of the first signal (811) and the power of the second signal (812) is small, the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) may also be small. At least one processor (520) may maintain the transmission power in response to identifying a difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) that is less than or equal to a reference value.

[0194] For example, as the electronic device (101) changes from the second state to the first state (or intermediate state), the portion (513c) of the third substrate (513) may be bent. As the portion (513c) is bent, loss due to impedance may increase. Within the first state (or intermediate state), the difference between the power of the first signal (811) and the power of the second signal (812) may be large. When the difference between the power of the first signal (811) and the power of the second signal (812) is large, the difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) may also be large. At least one processor (520) may increase the transmission power in response to identifying a difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c) exceeding a reference value. As the transmission power increases, the above loss can be compensated. The power of the second signal (812) after increasing the transmission power may be greater than the power of the second signal (812) before increasing the transmission power.

[0195] For example, while the RF transceiver (530) outputs a signal with the first transmission power, at least one processor (520) may perform operations 1001, 1003, and 1005 again. For example, when the electronic device (101) is in the first state, after the transmission power is increased, the state of the electronic device (101) may change from the first state to the second state. In the second state, the portion (513c) of the third substrate (513) may be flattened, so that the loss of the transmission signal may be reduced. As the loss of the RF signal is reduced, the difference between the power of the first signal (811) and the power of the second signal (812) may be reduced. At least one processor (520) can identify a difference between the power of the first coupling signal (811c) and the power of the second coupling signal (812c), and based on identifying that the difference does not exceed a reference value, change the transmission power to a second transmission power lower than the first transmission power. As the loss of the transmission signal is reduced, if the RF transceiver (530) outputs a signal at a high power when the difference between the power of the first signal (811) and the power of the second signal (812) is less than the reference value, unnecessary power consumption may occur. At least one processor (520) can reduce the unnecessary power consumption by again reducing the power output through the RF transceiver (530).

[0196] Fig. 11 is a flowchart showing an example of an operation for changing the operating frequency of an antenna based on SNR.

[0197] For example, the first parameter may be the SNR of the first coupling signal (e.g., the first coupling signal (811c) of FIG. 8A), and the second parameter may be the SNR of the second coupling signal (e.g., the second coupling signal (812c) of FIG. 8A). The SNR quantitatively represents the influence of noise on the RF signal. For example, the SNR may be calculated based on the following [Mathematical Formula 1].

[0198]

[0199] P sig represents the power of the transmitted signal. P noise , represents the noise power.

[0200] Referring to FIG. 11, in operation 1101, at least one processor (e.g., at least one processor (520) of FIG. 8A) may obtain a first coupling signal (811c) and a second coupling signal (812c). Operation 1101 in FIG. 11 may be substantially the same as operation 901 in FIG. 9.

[0201] In operation 1103, at least one processor (520) can identify a difference between an SNR of a first coupling signal (811c) and an SNR of a second coupling signal (812c).

[0202] The SNR of the first coupling signal (811c) may represent the SNR of the first coupling signal (811c), which is an output signal of the first coupler (540), compared to the transmission signal output through the RF transceiver (e.g., the RF transceiver (530) of FIG. 8A). The SNR of the second coupling signal (812c) may represent the SNR of the second coupling signal (812c), which is an output signal of the second coupler (550), compared to the transmission signal output through the RF transceiver (530). For example, since the positions of the first signal (811) and the second signal (812) are different within the housing (e.g., the housing (201) of FIG. 5A), a difference may occur between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c). For example, depending on the state of the electronic device (e.g., the electronic device (101) of FIG. 8A), a difference may occur between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c).

[0203] For example, the difference between the SNR of the first coupling signal (811c) and / or the SNR of the second coupling signal (812c) may increase due to noise that may be induced from the first substrate (e.g., the first substrate (511) of FIG. 8A), the second substrate (e.g., the second substrate (512) of FIG. 8A), and / or the third substrate (e.g., the third substrate (513) of FIG. 8A) and / or noise that may be induced from the motor (e.g., the motor (361) of FIG. 5A) for driving the operation of the housing (201). Within the first state, the second state, or a plurality of intermediate states, the SNR of the second coupling signal (812c) may decrease relative to the SNR of the first coupling signal (811c). For example, at least one processor (520) may obtain the SNR of the first coupling signal (811c). For example, at least one processor (520) can obtain the SNR of the second coupling signal (812c). For example, at least one processor (520) can calculate the difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c).

[0204] In operation 1105, at least one processor (520) can identify whether a difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) exceeds a reference value. For example, the reference value can be set to a value at which it can be determined that the communication performance of the electronic device (101) has deteriorated due to the difference.

[0205] If the difference exceeds the reference value, at least one processor (520) may perform operation 1107. If the difference does not exceed the reference value, at least one processor (520) may perform operation 1101 again.

[0206] In operation 1107, at least one processor (520) may change an operating frequency of a signal to be transmitted via an antenna (e.g., antenna (561) of FIG. 8A).

[0207] For example, the difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) may increase due to the influence of noise within a specific frequency. At least one processor (520) may change the operating frequency of a signal to be transmitted through the antenna (561) to compensate for the difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c). The change in the operating frequency may be referred to as a change in the transmission channel. As the operating frequency is changed, noise according to a specific frequency may be reduced. By reducing the noise, the difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) may be reduced.

[0208] Operation 1107 may be replaced with operation 1009 in FIG. 10. For example, at least one processor (520) may change the transmission power output through the RF transceiver (530) based on identifying a difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) that exceeds a reference value. For example, when the SNR of the second coupling signal (812c) decreases compared to the SNR of the first coupling signal (811c), at least one processor (520) may increase the transmission power output through the RF transceiver (530). Referring to [Mathematical Formula 1] above, as the transmission power increases, the influence of noise on the signal is reduced, thereby decreasing the SNR. The difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) may be reduced. As the difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) is reduced, the deterioration of the communication performance of the electronic device (101) can be reduced.

[0209] Figure 12 is a flowchart illustrating an example of an operation for changing an antenna based on SNR.

[0210] Referring to FIG. 12, in operation 1201, at least one processor (e.g., at least one processor (520) of FIG. 8A) may obtain a first coupling signal (e.g., the first coupling signal (811c) of FIG. 8A) and a second coupling signal (e.g., the second coupling signal (812c) of FIG. 8A). Operation 1201 in FIG. 12 may be substantially the same as operation 901 in FIG. 9.

[0211] In operation 1203, at least one processor (520) may identify a difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c). Operation 1203 in FIG. 12 may be substantially identical to operation 1103 in FIG. 11.

[0212] In operation 1205, at least one processor (520) may identify whether a difference between the SNR of the first coupling signal (811c) and the SNR of the second coupling signal (812c) exceeds a reference value. Operation 1205 in FIG. 12 may be substantially the same as operation 1105 in FIG. 11.

[0213] If the difference exceeds the reference value, at least one processor (520) may perform operation 1207. If the difference does not exceed the reference value, at least one processor (520) may perform operation 1201 again.

[0214] In operation 1207, at least one processor (520) may change the antenna to be used for communication with an external electronic device to another antenna (e.g., another antenna (562) of FIG. 8A).

[0215] Referring back to FIG. 8A, the electronic device (101) may further include another antenna (562). The other antenna (562) may be electrically connected to the first substrate (511). In FIG. 8A, the other antenna (562) is illustrated as being electrically connected to the first coupler (540), but is not limited thereto. For example, the other antenna (562) may not be electrically connected to the first coupler (540). For example, when the other antenna (562) is electrically connected to the first coupler (540), the frequency band of the signal transmitted and / or received through the other antenna (562) may be the same as the frequency band of the signal transmitted and / or received through the antenna (561). However, the present invention is not limited thereto. For example, if another antenna (562) is electrically connected to the first coupler (540), the frequency band of the signal transmitted and / or received through the other antenna (562) may be different from the frequency band of the signal transmitted and / or received through the antenna (561).

[0216] For example, another antenna (562) may be disposed on the first housing part (210), but is not limited thereto. For example, when transmitting a transmission signal through an antenna (561) electrically connected to the second substrate (512), the SNR may be reduced due to the influence of noise while the transmission signal passes through the third substrate (513). At least one processor (520) may change the antenna to be used for communication with the external electronic device to the other antenna (562) so that the signal to be transmitted to the external electronic device does not pass through the third substrate (513). Since the other antenna (562) is electrically connected to the first substrate (511), the signal may not pass through the third substrate (513). For example, since the processor and RF transceiver (530) are disposed on the first substrate (511), they can be electrically connected to the other antenna (562) that is electrically connected to the first substrate (511) through the first substrate (511). When the electronic device (101) transmits a signal to an external electronic device, the transmission signal can be radiated through the other antenna (562) that is electrically connected to the first substrate (511) without passing through the third substrate (513). Since the signal does not pass through the third substrate (513), the influence of noise can be reduced. As the influence of noise on the signal to be transmitted is reduced, the communication performance of the electronic device (101) can be improved.

[0217] Fig. 13a is a schematic block diagram of an exemplary electronic device. Fig. 13b illustrates an exemplary bidirectional coupler. Fig. 13c illustrates an exemplary third substrate. Fig. 13d is a cross-sectional view of the exemplary third substrate taken along line C-C' of Fig. 13c.

[0218] The electronic device (101) illustrated in FIG. 13a may be substantially identical to the electronic device (101) illustrated in FIG. 8a, except for the descriptions given with reference to FIGS. 13a, 13b, 13c, and 13d. Hereinafter, the same reference numerals may be assigned to the same components. Duplicate descriptions may be omitted.

[0219] Referring to FIGS. 13A and 13B, the first coupler (540) and the second coupler (550) may be dual directional couplers. The dual directional coupler is a directional coupler and may be inserted into a line between an RF source and a load. The dual directional coupler may provide RF power corresponding to the forward direction and power reflected from the load to the source. The dual directional coupler refers to an RF element for extracting a coupling signal of a signal corresponding to the propagation direction of a transmission signal (hereinafter, a forward coupling signal) and a coupling signal of a reflected signal opposite to the propagation direction of the transmission signal (hereinafter, a reverse coupling signal). The dual directional coupler may be referred to as a dual coupler or a dual directional coupler.

[0220] Referring to FIG. 13B, the bidirectional coupler (1300) may include four ports. The four ports may include a first port (1301) for inputting a signal, a second port (1302) for outputting a signal, a third port (1303) for a forward coupling signal, and a fourth port (1304) for a reverse coupling signal. The bidirectional coupler (1300) may include an RF line (805) for power transfer between the first port (1301) and the second port (1302). The first port (1301) may be referred to as an input port. The second port (1302) may be referred to as an output port. The bidirectional coupler (1300) may include a first coupling signal line (1305) connected to the third port (1303) and adjacent to the RF line (805). Through the first coupling signal line (1305), the bidirectional coupler (1300) can output a forward coupling signal to the third port (1303). The bidirectional coupler (1300) can include a second coupling signal line (1306) connected to the fourth port (1304) and adjacent to the RF line (805). Through the second coupling signal line (1306), the bidirectional coupler (1300) can output a reverse coupling signal to the fourth port (1304). The third port (1303) can be referred to as a forward coupling port. The fourth port (1304) can be referred to as a reverse coupling port. The direction of the third port (1303) from the terminal impedance of the first coupling signal line (1305) and the direction of the fourth port (1304) from the terminal impedance of the second coupling signal line (1306) may be opposite.

[0221] Referring to FIG. 13A, the first coupling signal line (1305) may include a first forward coupling signal line (1305a) and a second forward coupling signal line (1305b). The second coupling signal line (1306) may include a first reverse coupling signal line (1306a) and a second reverse coupling signal line (1306b). The first coupler (540) may provide a first forward coupling signal (811f), which is a signal component corresponding to the propagation direction of the transmission signal, and a first reverse coupling signal (811r), which is a signal component reflected from the RF signal line. For example, the first coupler (540) may output the first forward coupling signal (811f) through the first forward coupling signal line (1305a). For example, the first coupler (540) can output the first reverse coupling signal (811r) through the first reverse coupling signal line (1306a).

[0222] The second coupler (550) can provide a second forward coupling signal (812f), which is a signal component corresponding to the propagation direction of the RF signal, and a second reverse coupling signal (812r), which is a signal component reflected from the RF signal line. For example, the second coupler (550) can output the second forward coupling signal (812f) through the second forward coupling signal line (1305b). For example, the second coupler (550) can output the second reverse coupling signal (812r) through the second reverse coupling signal line (1306b).

[0223] For example, the switching circuit (570) can electrically connect the RF transceiver (530) and the first coupler (540). The switching circuit (570) can electrically connect the RF transceiver (530) and the second coupler (550). For example, the switching circuit (570) can be connected to a first forward coupling signal line (1305a), a first reverse coupling signal line (1306a), a second forward coupling signal line (1305b), a second reverse coupling signal line (1306b), and a third coupling signal line (804c) between the RF transceiver (530) and the switching circuit (570).

[0224] For example, at least one processor (520) can receive a first forward coupling signal (811f) by controlling a switching circuit (570) to electrically connect a first forward coupling signal line (1305a) and a third coupling signal line (804c). For example, at least one processor (520) can receive a first reverse coupling signal (811r) by controlling a switching circuit (570) to electrically connect a second reverse coupling signal line (1306a) and a third coupling signal line (804c). For example, at least one processor (520) can receive a second forward coupling signal (812f) by controlling a switching circuit (570) to electrically connect a second forward coupling signal line (1305b) and a third coupling signal line (804c). For example, at least one processor (520) can receive the second reverse coupling signal (812r) by controlling the switching circuit (570) to electrically connect the second reverse coupling signal line (1306b) and the third coupling signal line (804c).

[0225] The first forward coupling signal (811f) and the first reverse coupling signal (811r) provided through the first coupler (540), which is a bidirectional coupler, can be used to calculate the voltage standing wave ratio (VSWR) of the first signal (811). The second forward coupling signal (812f) and the second reverse coupling signal (812r) provided through the second coupler (550), which is a bidirectional coupler, can be used to calculate the voltage VSWR of the second signal (812). The VSWR can be calculated based on the following [Mathematical Formula 2].

[0226]

[0227] Γ represents the reflection coefficient. The reflection coefficient can be calculated based on the following [Mathematical Formula 3].

[0228]

[0229] Reflection coefficient represents the reflection coefficient. S fwd represents the forward coupling signal. S rev represents the reverse coupling signal.

[0230] Referring to the above [Mathematical Formula 2] and [Mathematical Formula 3], the first VSWR of the first signal (811) and the second VSWR of the second signal (812) can be calculated. For example, the reflection coefficient of the first signal (811) can be calculated based on the first forward coupling signal (811f), the first reverse coupling signal (811r) and the above [Mathematical Formula 3], and the first VSWR of the first signal (811) can be calculated based on the reflection coefficient and the above [Mathematical Formula 2]. For example, the reflection coefficient of the second signal (812) can be calculated based on the second forward coupling signal (812f), the second reverse coupling signal (812r) and the above [Mathematical Formula 3], and the second VSWR of the second signal (812) can be calculated based on the reflection coefficient and the above [Mathematical Formula 2].

[0231] For example, since the second coupler (550) is disposed on the second substrate (512), the second forward coupling signal line (1305b) and the second reverse coupling signal line (1306b) can pass from the second substrate (512) to the third substrate (513) and be connected to the switching circuit (570) line disposed on the first substrate (511). The third substrate (513) can include the second forward coupling signal line (1305b) and the second reverse coupling signal line (1306b).

[0232] Referring to FIG. 13c, the third substrate (513) may include a plurality of layers (5131, 5132, 5133) that are stacked on each other. The third substrate (513) may transmit signals through signal lines formed in each of the plurality of layers (5131, 5132, 5133). For example, the third substrate (513) may include a first layer (5131), a second layer (5132), and / or a third layer (5133). However, the present invention is not limited thereto.

[0233] Referring to FIG. 13d, the third substrate (513) may include an RF signal line (805) formed on the second layer (5132). The RF signal line (805) may be a signal line for transmitting a transmission signal and a reception signal.

[0234] For example, there may be a plurality of antennas (e.g., the antenna (561) of FIG. 8A) electrically connected to the second substrate (e.g., the second substrate (512) of FIG. 8A). For example, the antenna (561) may include a first antenna for transmitting and / or receiving a signal on a first frequency band (e.g., a low band band), a second antenna for transmitting and / or receiving a signal on a second frequency band (e.g., a high band band), and a third antenna for transmitting and / or receiving a signal on a third frequency band (e.g., an ultra high band band). However, the present invention is not limited thereto. The RF signal line (805) formed on the second layer (5132) may include a first signal line (M1) electrically connected to the first antenna, a second signal line (M2) connected to the second antenna, and / or a third signal line (M3) connected to the third antenna.

[0235] For example, the second layer (5132) may include a second forward coupling signal line (1305b) and a second reverse coupling signal line (1306b) that are electrically connected to a second coupler (550) disposed on a second substrate (512) and a switching circuit (570) disposed on a first substrate (511). The second forward coupling signal line (1305b) and the second reverse coupling signal line (1306b) formed in the second layer (5132) may be spaced apart from each other to reduce the influence of mutual coupling. For example, at least one signal line may be disposed between the second forward coupling signal line (1305b) and the second reverse coupling signal line (1306b). For example, the at least one signal line may include at least one of the first signal line (M1), the second signal line (M2), and / or the third signal line (M3). However, it is not limited thereto. For example, the electronic device (101) may include a MIMO LNA Front-End Module (LFEM) for a multiple input multiple output (MIMO) antenna (561). The LEFM may include four output signal lines (L1, L2, L3, L4) of the LEFM for transmission and / or reception of a base station and a reference signal (e.g., a sounding reference signal (SRS)). The second layer (5132) may include the output signal lines (L1, L2, L3, L4) of the LEFM. For example, the electronic device (101) may perform an antenna switching operation according to 1T4R (1-transmit 4-receive) in a frequency band defined in the standard of 3GPP (e.g., n41 band). The second layer (5132) may include signal lines capable of outputting SRS for an antenna (561) that transmits and / or receives signals in the frequency band.For example, at least one signal line disposed between the second forward coupling signal line (1305b) and the second reverse coupling signal line (1306b) may further include at least one of the signal lines (L1, L2, L3, L4, SRS) described above.

[0236] Figure 14a is a flow chart illustrating an example of an operation for changing the impedance of a transmission signal based on VSWR. Figure 14b illustrates an exemplary antenna switching circuit.

[0237] Referring to FIG. 14A, in operation 1401, at least one processor (e.g., at least one processor (520) of FIG. 13A) may obtain a first coupling signal (e.g., the first coupling signal (811c) of FIG. 13A) and a second coupling signal (e.g., the second coupling signal (812c) of FIG. 13A). Operation 1401 in FIG. 14A may be substantially the same as operation 901 in FIG. 9.

[0238] In operation 1403, at least one processor (520) can identify a difference between a VSWR of a first coupling signal (811c) and a VSWR of a second coupling signal (812c).

[0239] For example, the first parameter may be a first VSWR of the first coupling signal (811c), and the second parameter may be a second VSWR of the second coupling signal (812c). The first VSWR may be calculated based on a first forward coupling signal (811f) of the first signal (e.g., the first signal (811) of FIG. 13a) and a first reverse coupling signal (811r) of the first signal. The second VSWR may be calculated based on a second forward coupling signal (812f) of the second signal (e.g., the second signal (812) of FIG. 13a) and a second reverse coupling signal (812r) of the second signal (812).

[0240] For example, when the electronic device (101) is in the first state, as the bending angle of the part (e.g., the part (513c) of FIG. 6A) of the third substrate (e.g., the third substrate (513) of FIG. 13A) increases, the impedance of the RF signal line (805) of the third substrate (513) may increase. For example, while the second signal (812) passes through the RF signal line (805) of the third substrate (513), the VSWR may increase due to the impedance of the RF signal line (805) of the third substrate (513). For example, as the reflected signal increases due to the impedance of the RF signal line of the third substrate (513), the VSWR may increase. To lower the VSWR, impedance matching may be required.

[0241] In operation 1405, at least one processor (520) can identify whether a difference between the VSWR of the first coupling signal (811c) and the VSWR of the second coupling signal (812c) exceeds a reference value. For example, the reference value can be set to a value at which it can be determined that the communication performance of the electronic device (101) has deteriorated due to the difference.

[0242] If the difference exceeds the reference value, at least one processor (520) may perform operation 1407. If the difference does not exceed the reference value, at least one processor (520) may perform operation 1101 again.

[0243] In operation 1407, at least one processor (520) may change the impedance of a signal output through an RF transceiver (e.g., the RF transceiver (530) of FIG. 13A).

[0244] For example, at least one processor (520) can change the impedance of the signal by changing a parameter value (e.g., inductance or capacitance) of at least one passive element (581) electrically connected to an antenna (e.g., antenna (561) of FIG. 13A) through an antenna switching circuit (e.g., antenna switching circuit (580) of FIG. 13A). For example, the electronic device (101) may further include an antenna switching circuit (580).

[0245] Referring to FIG. 14B, the antenna switching circuit (580) may be configured to electrically connect at least one passive element (581) and the antenna (561). For example, the at least one passive element (581) may include, but is not limited to, an inductor (582) and / or a capacitor (583) having a specified parameter value (e.g., inductance or capacitance). For example, the at least one passive element (581) may also include a variable inductor (582) and / or a variable capacitor (583) having variable parameter values. For example, the antenna switching circuit (580) may include a switching circuit (584) that electrically connects the antenna (561) and the at least one passive element (581).

[0246] For example, at least one processor (520) may control the antenna switching circuit (580) to reduce reflection due to impedance difference. For example, at least one processor (520) may control the antenna switching circuit (580) to change the impedance of a signal output through the RF transceiver (530). For example, at least one processor (520) may be configured to change the inductance of an inductor (582) or the capacitance of a capacitor (583) electrically connected to the antenna (561). For example, at least one processor (520) may be configured to change the inductance of an inductor (582) or the capacitance of a capacitor (583) electrically connected to the antenna (561) by changing the inductor (582) or the capacitor (583) electrically connected to the antenna (561). For example, at least one processor (520) may be configured to change the inductance of a variable inductor (582) or the capacitance of a variable capacitor (583) electrically connected to the antenna (561). As the impedance of the signal line of the transmission signal is matched, the difference between the first VSWR and the second VSWR may be reduced. However, the present invention is not limited thereto. For example, at least one processor (520) may change the impedance of the transmission signal output through the RF transceiver (530) based on identifying a difference between the first VSWR and the second VSWR that is greater than a reference value. For example, at least one processor (520) may change the impedance of the transmission signal by changing the inductance of the inductor of the output terminal of the power amplifier (e.g., the power amplifier (591) of FIG. 8A) and / or the capacitance value of the capacitor of the output terminal of the power amplifier (591).

[0247] An electronic device (101) is provided. The electronic device may include a housing (201), a memory (130), a first substrate (511), a second substrate (512), a third substrate (513), at least one processor (520), an RF transceiver (530), a first coupler (540), and a second coupler (550). For example, the housing (201) may include a first housing part (210) and a second housing part (220) that are movably coupled to each other. The memory (130) may store instructions. The first substrate (511) may be disposed on the second housing part (220). The second substrate (512) may be disposed on the first housing part (210). The third substrate (513) may be deformable based on the movement of the first housing part (210) or the second housing part (220). The third substrate (513) may electrically connect the first substrate (511) and the second substrate (512). The at least one processor (520) may be disposed on the first substrate (511). The RF transceiver (530) may be disposed on the first substrate (511). The first coupler (540) may be disposed on the first substrate (511). The first coupler (540) may be configured to provide a first coupling signal (811c) based on a first signal (811) from the RF transceiver (530). The second coupler (550) may be disposed on the second substrate (512). The second coupler (550) may be configured to provide a second coupling signal (812c) based on a second signal (812) from the third substrate (513). For example, the shape of a portion of the third substrate between the first connector and the second connector may be deformed depending on movement of the first housing part or the second housing part. Based on the angle at which the portion of the third substrate is bent, the impedance of the RF signal line formed within the third substrate may change.The loss of an RF signal may change due to a change in the impedance of an RF signal line. The electronic device may change the transmission power to compensate for the difference in characteristics between a first signal, which is a signal before passing through a third substrate, and a second signal, which is a signal after passing through the third substrate. For example, the electronic device may identify the difference in characteristics using a coupling signal of the first signal (e.g., a first coupling signal) and a coupling signal of the second signal (e.g., a second coupling signal). As the difference in characteristics is compensated for, the electronic device may maintain the desired communication performance regardless of the state.

[0248] For example, the electronic device (101) may further include an antenna (561) electrically connected to the second coupler (550) through the second substrate (512). For example, the third substrate (513) may include a first connector (513a) connected to the first substrate (511) and a second connector (513b) connected to the second substrate (512). The third substrate (513) may be at least partially bent or unfolded based on movement of the first housing part (210) or the second housing part (220).

[0249] For example, a portion (513c) of the third substrate (513) between the first connector (513a) and the second connector (513b) may be bent in a first state in which the size of the housing (201) is minimum. The portion (513c) of the third substrate (513) may be flat in a second state in which the size of the housing (201) is maximum. For example, as the first housing part or the second housing part moves, the relative positional relationship between the first substrate and the second substrate may change. The third substrate, which electrically connects the first substrate and the second substrate, may be deformed as the positional relationship changes. Through the deformable third substrate, an electrical connection may be possible between at least one electronic component (e.g., a processor) electrically connected to the first substrate and at least one electronic component (e.g., an antenna) electrically connected to the second substrate.

[0250] For example, the at least one processor (520) may be configured to set the transmission power output through the RF transceiver (530) based on the first coupling signal (811c) provided from the first coupler (540) and the second coupling signal (812c) provided from the second coupler (550).

[0251] For example, the first coupler (540) may be disposed between the RF transceiver (530) and the first connector (513a). The second coupler (550) may be disposed between the second connector (513b) and the antenna (561). For example, the first coupler may be disposed between the RF transceiver and the first connector in order to provide a first coupling signal, which is a coupling signal of a first signal from the RF transceiver, to the RF transceiver. The second coupler may be disposed between the second connector and the antenna in order to provide a second coupling signal, which is a coupling signal of a second signal from a third substrate, to the RF transceiver.

[0252] For example, the at least one processor (520) may be configured to change the transmission power output through the RF transceiver (530) based on identifying that the difference between the electrical characteristics of the first coupling signal (811c) and the electrical characteristics of the second coupling signal (812c) exceeds a reference value. For example, when the loss of the RF signal is large when the RF signal passes through the third substrate, the difference between the power of the first signal and the power of the second signal may be large. The at least one processor may change the transmission power to compensate for the difference between the power of the first signal and the power of the second signal. For example, the at least one processor may increase the power of the second signal provided to the antenna by increasing the transmission power. By this operation, the difference between the power of the first signal and the power of the second signal is reduced, so that the electronic device can maintain the target communication performance regardless of the state of the electronic device.

[0253] For example, the at least one processor (520) may be configured to control the RF transceiver (530) to output the signal at a first transmission power based on identifying that a difference between an electrical characteristic of the first coupling signal (811c) and an electrical characteristic of the second coupling signal (812c) exceeds the reference value. The at least one processor (520) may be configured to control the RF transceiver (530) to output the signal at a second transmission power lower than the first transmission power based on identifying a difference between an electrical characteristic of the first coupling signal (811c) and an electrical characteristic of the second coupling signal (812c) that is less than a reference value while the RF transceiver (530) outputs the signal at the first transmission power. For example, the electronic device may increase the transmission power to compensate for the difference between the power of the first signal and the power of the second signal. After increasing the transmission power, if the difference between the power of the first signal and the power of the second signal decreases as the state of the electronic device changes, the electronic device can reduce unnecessary power consumption by lowering the transmission power.

[0254] For example, the electrical characteristics may include at least one of the power, signal-to-noise ratio (SNR), and / or voltage standing wave ratio (VSWR) of the first coupling signal (811c) and the second coupling signal (812c). For example, a disadvantage (e.g., loss) of a transmission signal by the third substrate can be identified from the difference in electrical characteristics representing the electrical characteristics of the first signal and the electrical characteristics of the second signal.

[0255] For example, the at least one processor (520) may be configured to change an operating frequency of a signal to be transmitted through the antenna (561) based on identifying that a difference between an electrical characteristic of the first coupling signal (811c) and an electrical characteristic of the second coupling signal (812c) exceeds a reference value. For example, a difference between an SNR of the first signal and an SNR of the second signal may increase due to an influence of noise within a specific frequency. The at least one processor may compensate for the difference between the SNR of the first signal and the SNR of the second signal by changing the operating frequency of the signal to be transmitted through the antenna.

[0256] For example, the electronic device (101) may further include an antenna switching circuit (580) including at least one of an inductor (582) or a capacitor (583) electrically connected to the antenna (561). The at least one processor (520) may be configured to change the inductance of the inductor (582) or the capacitance of the capacitor (583) electrically connected to the antenna (561) based on identifying that a difference between an electrical characteristic of the first coupling signal (811c) and an electrical characteristic of the second coupling signal (812c) exceeds a reference value. For example, the at least one processor may change the impedance of a transmission signal by changing an electrical characteristic value (e.g., inductance or capacitance) of at least one passive element electrically connected to the antenna through the antenna switching circuit. For example, at least one processor can tune the operating frequency of the antenna by changing an electrical characteristic value (e.g., inductance or capacitance) of at least one passive element electrically connected to the antenna via an antenna switching circuit. Changing the impedance of the transmission signal and / or changing the operating frequency of the antenna can reduce a difference between the electrical characteristics of the first signal and the second signal. As the difference is reduced, the communication performance of the electronic device can be improved.

[0257] For example, the electronic device (101) may further include another antenna (562) electrically connected to the first substrate (511). The at least one processor (520) may be configured to change the antenna to be used for communication with the external electronic device from the antenna (561) to the other antenna (562) based on identifying that a difference between the electrical characteristics of the first coupling signal (811c) and the electrical characteristics of the second coupling signal (812c) exceeds a reference value. For example, when transmitting a signal through an antenna electrically connected to the second substrate, the SNR may be reduced due to the influence of noise while the signal passes through the third substrate. The at least one processor may change the antenna to be used for communication with the external electronic device to the other antenna so that the signal to be transmitted to the external electronic device does not pass through the third substrate. By not passing the signal through the third substrate, the influence of noise may be reduced. As the influence of noise on the signal to be transmitted is reduced, the communication performance of electronic devices can be improved.

[0258] For example, the at least one processor (520) may be configured to receive the forward coupling signal of the first signal (811) and the reverse coupling signal of the first signal (811) provided from the first coupler (540) and the forward coupling signal of the second signal (812) and the reverse coupling signal of the second signal (812) provided from the second coupler (550). The at least one processor (520) may be configured to change the impedance of the signal output through the RF transceiver (530) based on identifying that a difference between a first VSWR based on the forward coupling signal of the first signal (811) and the reverse coupling signal of the first signal (811) and a second VSWR based on the forward coupling signal of the second signal (812) and the reverse coupling signal of the second signal (812) exceeds a reference value. For example, an electronic device can identify a signal disadvantage (e.g., loss) due to a third substrate through VSWR. For the identification, the electronic device can include a first coupler and a second coupler, which are bidirectional couplers. At least one processor can identify a signal disadvantage (e.g., loss) due to the third substrate by identifying a difference between the first VSWR and the second VSWR. At least one processor can reduce the difference between the first VSWR and the second VSWR by changing the impedance of the transmission signal. As the difference between the first VSWR and the second VSWR is reduced, the communication performance of the electronic device can be improved.

[0259] For example, the third substrate (513) may include a forward coupling signal line (1306a), a reverse coupling signal line (1306b), and at least one signal line. The forward coupling signal line (1306a) may be configured to transmit a forward coupling signal of the second signal (812). The reverse coupling signal line (1306b) may be configured to transmit a reverse coupling signal of the second signal (812). The at least one signal line may be disposed between the forward coupling signal line and the reverse coupling signal line. For example, the third substrate may include a signal line for the forward coupling signal of the second signal and a signal line for the reverse coupling signal of the second signal. In order to reduce coupling between the signal lines, the third substrate may include at least one signal line disposed between the signal line for the forward coupling signal of the second signal and the signal line for the reverse coupling signal of the second signal. By the above structure, the interference between the forward coupling signal of the second signal and the reverse coupling signal of the second signal can be reduced. As the interference is reduced, at least one processor can accurately calculate the second VSWR.

[0260] For example, the second substrate (512) may be disposed on one surface (210a) of the first housing part (210). The second coupler (550) may include a conductive pattern embedded in the second substrate (512). For example, since the second substrate may be disposed on one surface of the first housing part, the thickness of the second coupler may be limited. In order to reduce the thickness of the second coupler, the second coupler may include a conductive pattern embedded in the second substrate. Since the second coupler is implemented as a conductive pattern embedded in the second substrate rather than being disposed on the second substrate as a separate component, the thickness of the second coupler may be reduced.

[0261] For example, the electronic device (101) may further include a switching circuit (570). The switching circuit (570) may be disposed on the first substrate (511) and configured to electrically connect the first coupler (540) or the second coupler (550) with the RF transceiver (530). The at least one processor (520) may be configured to obtain the first coupling signal (811c) based on electrically connecting the at least one processor (520) and the first coupler (540) through the switching circuit (570). The at least one processor (520) may be configured to obtain the second coupling signal (812c) based on electrically connecting the at least one processor (520) and the second coupler (550) through the switching circuit (570). For example, the first coupling signal and the second coupling signal may be provided to at least one processor at different times. The at least one processor may control a switching circuit so that the first coupling signal and the second coupling signal are provided at different times.

[0262] For example, the electronic device (101) may include a display (230). The display (230) may include a first display area (230a) and a second display area (230b). The second display area (230b) may be at least partially bent into the first housing part (210) based on movement of the first housing part (210) or the second housing part (220). At least a portion of the second display area (230b) may be rolled into the first housing part (210) in a first state. At least a portion of the second display area (230b) may be pulled out from the inside of the first housing part (210) to the outside of the first housing part (210) in a second state. For example, the size of the display area of ​​the display may be changed. To change the size of the display area of ​​the display, at least a portion of the second display area can be retracted within the first housing part within the first state. Since the size of the housing and the size of the display area of ​​the display can be changed, the electronic device can provide a variety of user experiences.

[0263] An electronic device (101) is provided. The electronic device (101) may include a first substrate (511), a second substrate (512), a third substrate (513), at least one processor (520), an RF transceiver (530), a first coupler (540), a second coupler (550), and an antenna (561). The second substrate (512) may be spaced apart from the first substrate (511). The third substrate (513) may electrically connect the first substrate (511) and the second substrate (512). The third substrate (513) may include a first connector (513a) connected to the first substrate (511) and a second connector (513b) connected to the second substrate (512). The at least one processor (520) may be disposed on the first substrate (511). The RF transceiver (530) may be disposed on the first substrate (511). The first coupler (540) may be disposed on the first substrate (511). The first coupler (540) may be configured to provide a first coupling signal (811c) based on a first signal (811) from the RF transceiver (530). The second coupler (550) may be disposed on the second substrate (512). The second coupler (550) may be configured to provide a second coupling signal (812c) based on a second signal (812) from the third substrate (513). The antenna (561) may be electrically connected to the second coupler (550) through the second substrate (512). The at least one processor (520) may be configured to identify a difference between an electrical characteristic of the first coupling signal (811c) provided from the first coupler (540) and an electrical characteristic of the second coupling signal (812c) provided from the second coupler (550).The at least one processor (520) may be configured to change the transmission power output through the RF transceiver (530) based on identifying that a difference between the electrical characteristics of the first coupling signal (811c) and the electrical characteristics of the second coupling signal (812c) exceeds a reference value.

[0264] For example, the first coupler (540) may be placed between the RF transceiver (530) and the first connector (513a). The second coupler (550) may be placed between the second connector (513b) and the antenna (561).

[0265] For example, the electrical characteristics may include at least one of power, signal to noise ratio (SNR), and / or voltage standing wave ratio (VSWR) of the first coupling signal (811c) and the second coupling signal (812c).

[0266] For example, the at least one processor (520) may be configured to change the operating frequency of a signal to be transmitted through the antenna (561) based on identifying that a difference between an electrical characteristic of the first coupling signal (811c) and an electrical characteristic of the second coupling signal (812c) exceeds a reference value.

[0267] For example, the electronic device (101) may further include another antenna (562) electrically connected to the first substrate (511). The at least one processor (520) may be configured to change the antenna to be used for communication with an external electronic device from the antenna (561) to the other antenna (562) based on identifying that a difference between an electrical characteristic of the first coupling signal (811c) and an electrical characteristic of the second coupling signal (812c) exceeds a reference value.

[0268] An electronic device includes: first and second housing parts movably coupled to each other; first and second substrates disposed on the first and second housing parts, respectively; a third substrate deformable based on movement of the first housing part or the second housing part and electrically connected to the first and second substrates; an RF transceiver; a first coupler disposed on the first substrate and configured to provide a first coupling signal based on a first signal from the RF transceiver; and a second coupler disposed on the second substrate and configured to provide a second coupling signal based on a second signal from the third substrate.

[0269] A method performed by an electronic device including first and second housing parts movably coupled to each other, first and second substrates disposed on the first and second housing parts, respectively, a third substrate deformable based on movement of the first housing part or the second housing part and electrically connected to the first and second substrates, and a transceiver, the method comprising: obtaining a first coupling signal from a first coupler disposed on the first substrate based on a transmit / receive signal; obtaining a second coupling signal from a second coupler disposed on the second substrate based on a signal on the third substrate; identifying a first difference between respective parameters of the first coupling signal and the second coupling signal; determining whether the first difference exceeds a reference value; and controlling deviation compensation when the first difference exceeds the reference value.

[0270] The method further comprises: identifying a second difference in power between first and second coupling signals; determining whether the second difference exceeds a reference value; maintaining a transmission power output through the transceiver if the second difference does not exceed the reference value; and changing a transmission power output through the transceiver if the second difference exceeds the reference value.

[0271] The method further comprises: identifying a third difference in SNR of the first and second coupling signals; determining whether the third difference exceeds a reference value; and changing an operating frequency of a signal transmitted through an antenna if the third difference exceeds the reference value.

[0272] The method further includes: identifying a fourth difference in SNR of the first and second coupling signals; determining whether the fourth difference exceeds a reference value; and changing an antenna for signal transmission when the fourth difference exceeds the reference value.

[0273] The method further includes: identifying a fifth difference in VSWR of the first and second coupling signals; determining whether the fifth difference exceeds a reference value; and changing an impedance of a transmission signal if the fifth difference exceeds the reference value.

[0274] The method comprises: identifying a second difference in power of first and second coupling signals, a third difference in SNR of the first and second coupling signals, a fourth difference in SNR of the first and second coupling signals, and a fifth difference in VSWR of the first and second coupling signals; determining whether one of the second, the third, the fourth, or the fifth difference exceeds a corresponding reference value; and performing one of the following operations: maintaining a transmission power output through a transceiver if the second difference does not exceed the reference value, and changing the transmission power output through the transceiver if the second difference exceeds the reference value; changing an operating frequency of a signal transmitted through an antenna if the third difference exceeds the reference value; changing an antenna for signal transmission if the fourth difference exceeds the reference value; and changing an impedance of a transmission signal if the fifth difference exceeds the reference value.

[0275] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0276] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0277] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0278] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0279] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0280] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A housing comprising a first housing part and a second housing part which are movably coupled to each other; Memory that stores instructions; A first substrate disposed on the second housing part; A second substrate disposed on the first housing part; A third substrate that is deformable based on movement of the first housing part or the second housing part and electrically connects the first substrate and the second substrate; At least one processor disposed on the first substrate; An RF (radio frequency) transceiver disposed on the first substrate; A first coupler disposed on the first substrate and configured to provide a first coupling signal based on a first signal from the RF transceiver; A second coupler is disposed on the second substrate and configured to provide a second coupling signal based on a second signal from the third substrate. Electronic devices.

2. In paragraph 1, Further comprising an antenna electrically connected to the second coupler through the second substrate, The third substrate above is, A first connector connected to the first substrate and a second connector connected to the second substrate, wherein the first housing part or the second housing part is at least partially bent based on movement of the first housing part or the second housing part. Electronic devices.

3. In paragraph 2, The above first coupler, positioned between the RF transceiver and the first connector, The above second coupler, located between the second connector and the antenna, Electronic devices.

4. In any one of paragraphs 1 to 3, The above instructions, when executed by the at least one processor, cause the electronic device to: Causing to set the transmission power output through the RF transceiver based on the first coupling signal provided from the first coupler and the second coupling signal provided from the second coupler. Electronic devices.

5. In any one of paragraphs 1 to 4, The above instructions, when executed by the at least one processor, cause the electronic device to: Based on identifying that a difference between the electrical characteristics of the first coupling signal and the electrical characteristics of the second coupling signal exceeds a reference value, causing the transmission power output through the RF transceiver to be changed, Electronic devices.

6. In paragraph 5, At least one processor of the above, Controlling the RF transceiver to output a signal at a first transmission power based on identifying that a difference between the electrical characteristics of the first coupling signal and the electrical characteristics of the second coupling signal exceeds the reference value; The RF transceiver is configured to control the RF transceiver to output the signal at a second transmission power lower than the first transmission power based on identifying that a difference between the electrical characteristics of the first coupling signal and the electrical characteristics of the second coupling signal is less than or equal to the reference value while the RF transceiver outputs the signal at the first transmission power. Electronic devices.

7. In paragraph 5 or 6, The above electrical characteristics are, At least one of the power, signal to noise ratio (SNR), or voltage standing wave ratio (VSWR) of the first coupling signal and the second coupling signal, Electronic devices.

8. In any one of paragraphs 1 to 7, Further comprising an antenna electrically connected to the second coupler through the second substrate, The instructions, when executed by the at least one processor, cause the electronic device to change an operating frequency of a signal to be transmitted through the antenna based on identifying that a difference between an electrical characteristic of the first coupling signal and an electrical characteristic of the second coupling signal exceeds a reference value. Electronic devices.

9. In any one of paragraphs 1 to 8, An antenna electrically connected to the second coupler through the second substrate; and Further comprising an antenna switching circuit including at least one of an inductor or a capacitor electrically connected to the antenna, The instructions, when executed by the at least one processor, cause the electronic device to change the inductance of the inductor or the capacitance of the capacitor electrically connected to the antenna based on identifying that a difference between an electrical characteristic of the first coupling signal and an electrical characteristic of the second coupling signal exceeds a reference value. Electronic devices.

10. In any one of paragraphs 1 to 9, An antenna electrically connected to the second coupler through the second substrate; and Further comprising another antenna electrically connected to the first substrate; The instructions, when executed by the at least one processor, cause the electronic device to change the antenna to be used for communication with the external electronic device from the antenna to the other antenna based on identifying that a difference between an electrical characteristic of the first coupling signal and an electrical characteristic of the second coupling signal exceeds a reference value. Electronic devices.

11. In any one of paragraphs 1 to 10, The above instructions, when executed by the at least one processor, cause the electronic device to: Receive a forward coupling signal of the first signal and a reverse coupling signal of the first signal provided from the first coupler, and a forward coupling signal of the second signal and a reverse coupling signal of the second signal provided from the second coupler, causing an impedance of a signal output through the RF transceiver to be changed based on identifying that a difference between a first VSWR based on the forward coupling signal of the first signal and the reverse coupling signal of the first signal and a second VSWR based on the forward coupling signal of the second signal and the reverse coupling signal of the second signal exceeds a reference value; Electronic devices.

12. In any one of paragraphs 1 to 11, The third substrate above is, A forward coupling signal line configured to transmit a forward coupling signal of the second signal; A reverse coupling signal line configured to transmit a reverse coupling signal of the second signal; and Comprising at least one signal line arranged between the forward coupling signal line and the reverse coupling signal line, Electronic devices.

13. In any one of paragraphs 1 to 12, The above second substrate, is placed on one side of the first housing part, The above second coupler, Including a conductive pattern fitted onto the second substrate, Electronic devices.

14. In any one of paragraphs 1 to 13, Further comprising a switching circuit arranged on the first substrate and configured to electrically connect the first coupler or the second coupler with the RF transceiver, The above instructions, when executed by the at least one processor, cause the electronic device to: By means of the above switching circuit, based on electrically connecting the at least one processor and the first coupler, the first coupling signal is obtained, By means of said switching circuit, based on electrically connecting said at least one processor and said second coupler, causing said second coupling signal to be obtained, Electronic devices.

15. In any one of paragraphs 1 to 14, Further comprising a display including a first display area and a second display area that can be bent at least partially into the first housing part based on movement of the first housing part or the second housing part, At least a portion of the second display area, In the first state, it is rolled into the first housing part, In the second state, the first housing part is drawn out from inside the first housing part to outside the first housing part. Electronic devices.

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