Solid-state machining method and solid-state machining device

Abstract

A solid-state machining method, the solid-state machining method comprising steps of: connecting a solid-state machining tool to a transition main shaft (100) so as to drive same by means of a machine head; starting a solid-state machining apparatus, and performing machining by means of moving the solid-state machining tool along a preset machining route; during the solid-state machining process, measuring deformation of a deformation detection area (120) on the transition main shaft (100) by means of a strain gauge, so as to monitor the pressure and / or torque of the transition main shaft (100); by means of a first temperature monitoring assembly, monitoring the temperature of the solid-state machining tool (500); and by means of a second temperature monitoring assembly (510), monitoring the temperature of the deformation detection area (120).

Description

Solid-state processing method and solid-state processing device Technical Field

[0001] The present invention relates to the field of solid-state processing technology, and in particular to a solid-state processing method and a solid-state processing device. Background Art

[0002] Currently, the force and torque conditions of the stirring tool during solid-state machining are often monitored using pressure and torque sensors placed within the spindle. Once installed, these sensors have limited ranges, making repairs or replacements of sensors with different ranges complex and expensive. Furthermore, the temperature at the force and torque monitoring points on the stirring tool can affect the final monitoring results, and there is currently no effective means of monitoring this temperature. Furthermore, previous methods for measuring the temperature of the tool tip during solid-state machining typically employ the following three methods, which are either inaccurate or costly. One method is to use an infrared imager to detect the temperature of solid-state processing tools and processing positions. This method is not accurate enough in temperature measurement because the surface oxidation conditions and temperatures of objects of different materials affect the comparative emissivity. Another method is to use a sliding thermocouple to detect the temperature of the heat-affected zone near the processing position. The surface roughness, adaptation space and sliding speed of the workpiece under actual working conditions limit the temperature measurement accuracy of the sliding contact thermocouple, and the temperature measurement is not accurate enough. Another method is to place the thermocouple wire through a pre-processed hole or groove near the solid-state processing position. When the solid-state processing is completed, the tip of the thermocouple will form a metallurgical bond with the material near the solid-state processing position, and it cannot be used a second time, which is costly.

[0003] Summary of the Invention

[0004] The present invention provides a solid-state processing method and a solid-state processing device to solve the problems in the prior art.

[0005] The technical problem solved by the present invention is achieved by adopting the following technical solutions:

[0006] In a first aspect, the present invention provides a solid-state processing method, the solid-state processing method comprising the steps of:

[0007] Connecting a solid-state machining tool to a transition spindle for driving through the machine head;

[0008] Start the solid-state processing equipment and perform moving processing along a predetermined processing route by using the solid-state processing tool;

[0009] During solid-state machining, the deformation of the deformation detection area on the transition spindle is measured by a strain gauge to monitor the pressure and / or torque of the transition spindle;

[0010] monitoring the temperature of the solid-state processing tool via a first temperature monitoring assembly;

[0011] The temperature of the deformation detection area is monitored by a second temperature monitoring component.

[0012] In some embodiments, the solid-state processing method is a friction stir welding method or a solid-state additive manufacturing method.

[0013] Furthermore, during the solid-state machining process, the steps of measuring the deformation of the deformation detection area on the transition spindle by a strain gauge to monitor the pressure and / or torque of the transition spindle; monitoring the temperature of the solid-state machining tool by a first temperature monitoring component; and monitoring the temperature on the deformation detection area by a second temperature monitoring component include:

[0014] A control device is provided on the outer side of the transition spindle, and wireless signals of the strain gauge, the first temperature monitoring component and the second temperature monitoring component are sent and received through the control device during the solid-state machining process.

[0015] In some embodiments, a control device is provided on an outer side of the transition spindle, and the steps of transmitting and receiving wireless signals between the strain gauge, the first temperature monitoring component, and the second temperature monitoring component through the control device during the solid-state machining process include:

[0016] During the solid-state processing process, the integrated circuit board assembly in the control device sends and receives wireless signals from the strain gauge, the first temperature monitoring assembly and the second temperature monitoring assembly, and displays the corresponding signals on the terminal, and the power supply assembly in the control device supplies power to the integrated circuit board assembly.

[0017] In some embodiments, before the solid-state machining process begins, strain gauges are attached to the deformation detection area on the transition spindle to calibrate the pressure and / or torque measurements.

[0018] In some embodiments, before the solid-state machining process begins, the step of attaching strain gauges to the deformation detection area on the transition spindle to calibrate the pressure and / or torque measurement includes:

[0019] The pressure calibration method is to place the transition spindle on a designated mold with its bottom fixed, and apply a known force from the top, gradually increasing the applied force, receiving the pressure signal through the control device and calibrating the displayed pressure signal.

[0020] In some embodiments, before the solid-state machining process begins, the step of attaching strain gauges to the deformation detection area on the transition spindle to calibrate the pressure and / or torque measurement includes:

[0021] The torque calibration method is as follows: the transition spindle is placed on a designated mold with its bottom fixed, a torque of known magnitude is applied from its top, and the torque signal is received by a control device and the displayed torque signal is calibrated.

[0022] In some embodiments, before the solid-state processing process begins, a first temperature monitoring component extends into a cavity inside the solid-state processing tool close to one end of the processing end of the solid-state processing tool; thereby, during the solid-state processing process, the temperature of the processing end of the solid-state processing tool is monitored in real time through the monitoring end of the first temperature monitoring component.

[0023] In some embodiments, before the solid-state machining process begins, a first temperature monitoring component extends into a cavity within the solid-state machining tool, proximate to one end of the machining end of the solid-state machining tool; thereby, during the solid-state machining process, the step of monitoring the temperature of the machining end of the solid-state machining tool in real time via the monitoring end of the first temperature monitoring component includes:

[0024] A thermocouple is provided in one of the vertical section and the inclined section of the cavity to monitor the temperature of the processing end of the solid processing tool, and a positioning piece is provided in the other of the vertical section and the inclined section of the cavity to position the thermocouple.

[0025] In some embodiments, during solid-state machining, a cooling device is provided on the outside of the transition spindle, and the cooling device faces one side of the solid-state machining tool. The heat transferred from the solid-state machining tool to the transition spindle is cooled by the cooling device to avoid excessive temperature of the transition spindle.

[0026] In some embodiments, during the solid-state machining process, a cooling device is provided on the outer side of the transition spindle, and the cooling device faces one side of the solid-state machining tool. The step of cooling the heat transferred from the solid-state machining tool to the transition spindle by the cooling device to prevent the transition spindle from overheating includes:

[0027] The cooling device is a self-cooling component fixedly connected to the outside of the transition spindle. During the solid-state processing process, the self-cooling component rotates synchronously with the transition spindle; or it is a cooling sleeve rotatably connected to the outside of the transition spindle. The cooling sleeve has a cooling module to cool the transition spindle. During the solid-state processing process, the transition spindle rotates relative to the cooling sleeve, and the cooling sleeve does not rotate.

[0028] In some embodiments, the cooling device is a self-cooling component fixedly connected to the outer side of the transition spindle, and during the solid-state machining process, the self-cooling component rotates synchronously with the transition spindle, including:

[0029] The self-cooling component is a semiconductor refrigeration plate and / or a fan. During the solid-state processing process, the transition spindle is cooled by the semiconductor refrigeration plate and / or the fan; and the semiconductor refrigeration plate and / or the fan are evenly distributed on the outside of the transition spindle to maintain the weight balance of various parts of the transition spindle.

[0030] In some embodiments, the cooling device includes a cooling sleeve rotatably connected to the outside of the transition spindle, the cooling sleeve having a cooling module therein for cooling the transition spindle. During the solid-state machining process, the transition spindle rotates relative to the cooling sleeve, and the step of not rotating the cooling sleeve includes:

[0031] The cooling module is a cooling chamber opened in the cooling sleeve. During the solid-state processing, the purpose of controlling the cooling efficiency is achieved by controlling the temperature or flow of the fluid entering the cooling chamber.

[0032] In some embodiments, when the second temperature monitoring component detects that the temperature at the deformation detection area is lower than a minimum value of a preset temperature range, the heating module may heat the location.

[0033] In some embodiments, when the second temperature monitoring component detects that the temperature of the deformation detection area is higher than the maximum value of a preset temperature range, the cooling efficiency of the cooling device can be increased to reduce the heat conducted from the solid machining tool to the transition spindle.

[0034] In some embodiments, in order to achieve constant temperature control of the deformation detection area, different temperatures are calibrated before the solid-state processing process begins to obtain the offset value pattern of the strain gauge measurement data at each temperature, so as to form an error correction curve corresponding to these temperature values ​​and input it into the control device. The correct strain gauge measurement value can be obtained by referring to the curve.

[0035] In some embodiments, before the solid-state machining process begins, an annular heat insulation assembly is installed between the transition spindle and the solid-state machining tool to reduce the conduction of heat generated by the solid-state machining tool to the transition spindle during the machining process.

[0036] In a second aspect, the present invention provides a solid-state processing device, which is a solid-state processing device for implementing the above method.

[0037] The present invention has the following beneficial effects:

[0038] During the solid-state machining process, the deformation of the deformation detection area on the transition spindle is measured by a strain gauge to monitor the pressure and / or torque of the transition spindle; the strain gauge is small in size, light in weight, simple in structure, and fast in measurement. During measurement, it has basically no effect on the working state and stress distribution of the measured part, and is suitable for dynamic measurement; the temperature of the solid-state machining tool is monitored by a first temperature monitoring component, so that the real-time working temperature of the solid-state machining tool can be obtained, which is convenient for adjusting the working parameters of the solid-state machining tool according to the obtained temperature information; the temperature on the deformation detection area is monitored by a second temperature monitoring component, and the temperature of the deformation detection area is understood in real time, which is convenient for the user to make targeted adjustments according to the obtained temperature information, thereby preventing the temperature of the deformation detection area from being too high or too low, thereby affecting the measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0040] FIG1 is a schematic flow diagram of the solid-state processing method of the present invention;

[0041] FIG2 is a schematic diagram of the overall use of an embodiment of the present invention;

[0042] FIG3 is a schematic diagram of solid-state processing on a substrate according to the present invention;

[0043] FIG4 is a schematic structural diagram of an embodiment of a wireless shaft handle according to the present invention;

[0044] FIG5 is a schematic structural diagram of another embodiment of the wireless shaft handle of the present invention;

[0045] FIG6 is a schematic diagram of the main structure of the present invention;

[0046] FIG7 is a schematic diagram of the oblique structure of the present invention;

[0047] FIG8 is a schematic diagram of the top structure of FIG6;

[0048] FIG9 is a schematic cross-sectional view of the structure taken along line AA in FIG8 ;

[0049] FIG10 is an enlarged structural diagram of point D in FIG9 ;

[0050] FIG11 is a schematic cross-sectional view of the structure taken along line BB in FIG8 ;

[0051] FIG12 is an embodiment of a connection assembly according to the present invention;

[0052] FIG13 is an enlarged structural diagram of point E in FIG12;

[0053] FIG14 is another embodiment of the connection assembly of the present invention;

[0054] FIG15 is an enlarged structural diagram of point F in FIG14;

[0055] FIG16 is a schematic diagram of the main structure of the wireless smart shaft handle;

[0056] FIG17 is a schematic cross-sectional view of the structure taken along line CC in FIG16;

[0057] FIG18 is a schematic diagram of the oblique structure of the wireless smart shaft handle;

[0058] FIG19 is a schematic diagram of the connection structure between the transition spindle and the strain measurement assembly;

[0059] Figure 20 is a schematic diagram of the segmented structure of the transition spindle;

[0060] Figure 21 is a schematic structural diagram of the cooling section on the transition spindle.

[0061] Explanation of reference numerals: 100, transition spindle; 200, processing unit; 300, control device; 400, cooling device; 500, first temperature monitoring assembly; 510, second temperature monitoring assembly; 600, positioning member; 700, heating module; 800, connecting assembly; 900, strain measurement assembly; 1000, connecting frame; 110, supporting area; 120, deformation detection area; 130, mounting hole; 140, threaded through hole; 150, heat dissipation slot; 210, cavity; 211, inclined section; 212, vertical section; 212a, groove; 220, threaded structure; 310, protective sleeve; 320, integrated circuit board assembly; 321, wireless transceiver module; 322, temperature control panel; 330, power supply assembly; 410, cooling sleeve; 420, cooling chamber; 430, self-cooling assembly; 440, cold air gun; 810, magnetic element; 820, fixing buckle; 830, first threaded hole; a, base material; b, weld. DETAILED DESCRIPTION

[0062] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below with reference to specific illustrations.

[0063] In order to solve the above technical problems, please refer to the accompanying drawings for understanding. In a first aspect of the present application, a solid-state processing method is proposed, the steps of which include:

[0064] S100: Connecting a solid-state machining tool to the transition spindle 100 to be driven by the handpiece; installing the solid-state machining tool on one side of the transition spindle 100, and driving the transition spindle 100 by the handpiece to drive the solid-state machining tool to rotate;

[0065] S200: As shown in FIG3 , the solid-state processing device is started and the solid-state processing tool is used to perform mobile processing along a predetermined processing route; the solid-state processing device is started to drive the head, the transition spindle 100, and the solid-state processing tool to perform mobile solid-state processing along the solid-state processing route on the substrate a;

[0066] S300: During the solid-state machining process, the deformation of the deformation detection area 120 on the transition spindle 100 is measured using strain gauges to monitor the pressure and / or torque of the transition spindle 100; multiple sets of strain gauges are attached to the outer side of the transition spindle 100, at least one set of which is used to measure the downward pressure of the transition spindle 100, and at least one set of which is used to measure the torque of the transition spindle 100;

[0067] S400: During the solid-state processing, the temperature of the solid-state processing tool is monitored by the first temperature monitoring component 500; the temperature of the solid-state processing tool is monitored in real time by the first temperature monitoring component 500 to obtain real-time parameters, thereby facilitating feedback adjustment by the user;

[0068] S500: During the solid-state machining process, the temperature on the deformation detection area 120 is monitored by the second temperature monitoring component 510; the second temperature monitoring component 510 is set at the deformation detection area 120 of the transition spindle 100, and the temperature of the deformation detection area 120 is monitored in real time by the second temperature monitoring component 510, which can also be the temperature of the strain gauge, to prevent the strain gauge from being in a higher or lower temperature area and the user cannot know the information, thereby causing the user to be unaware of the inaccurate measurement results in time.

[0069] The solid-state processing method can be a stir friction welding method or a solid-state additive manufacturing method. When the solid-state processing method is a stir friction welding method, the solid-state processing tool is a stir friction welding tool; when the solid-state processing method is a solid-state additive manufacturing method, the solid-state processing tool is a hollow stirring tool.

[0070] A control device 300 is located outside the transition spindle 100. During solid-state machining, the control device 300 transmits and receives wireless signals from the strain gauge, the first temperature monitoring assembly 500, and the second temperature monitoring assembly 510. The control device 300 converts the wireless signals into numerical values ​​displayed on a terminal, allowing the user to intuitively understand various machining parameter information. During solid-state machining, the integrated circuit board assembly 320 within the control device 300 transmits and receives wireless signals from the strain gauge, the first temperature monitoring assembly 500, and the second temperature monitoring assembly 510, and displays the corresponding signals on the terminal. The power supply assembly 330 within the control device 300 provides power to the integrated circuit board assembly 320. The strain gauge, the first temperature monitoring assembly 500, and the second temperature monitoring assembly 510 can all be connected to the integrated circuit board assembly 320. Because the control device 300 moves with all three, signal transmission is more stable, resulting in more accurate data. The detected spindle torque, pressure, and stirring tool temperature are used to determine whether the solid-state machining process or machining parameters are suitable, and feedback is provided to the control device, which then responds and adjusts the parameters in real time.

[0071] S110: Before the solid-state machining process begins, a strain gauge is attached to the deformation detection area 120 on the transition spindle 100 , and the mechanical data to be measured by the strain gauge, such as pressure, torque, etc., are calibrated in advance.

[0072] S111: The specific method for calibrating the pressure is to place the transition spindle 100 on the designated mold with its bottom fixed, and apply a force of known magnitude from the top, gradually increasing the applied force, receiving the pressure signal through the control device 300 and calibrating the displayed pressure signal.

[0073] S112: The torque calibration method is specifically as follows: placing the transition spindle 100 on a designated mold with its bottom fixed, applying a torque of known magnitude from its top, and increasing it sequentially, receiving the torque signal through the control device 300 and calibrating the displayed torque signal.

[0074] S113: Before the solid-state processing process begins, the first temperature monitoring component 500 extends into the cavity 210 inside the solid-state processing tool close to one end of the processing end of the solid-state processing tool; thereby, during the solid-state processing process, the temperature of the processing end of the solid-state processing tool is monitored in real time through the monitoring end of the first temperature monitoring component 500 to prevent heat from being consumed during the conduction process, resulting in the inability to obtain accurate temperature information.

[0075] S1131: A thermocouple is set in one of the vertical section 212 and the inclined section 211 of the cavity 210 to monitor the temperature of the processing end of the solid-state processing tool, and a positioning member 600 is set in the other of the vertical section 212 and the inclined section 211 of the cavity 210 to position the thermocouple to prevent the thermocouple from displacement or collision during high-speed rotation.

[0076] S310: During the solid-state machining process, a cooling device 400 is provided on the outer side of the transition spindle 100, and the cooling device 400 faces one side of the solid-state machining tool. The heat transferred from the solid-state machining tool to the transition spindle 100 is cooled by the cooling device 400 to avoid excessive temperature of the transition spindle 100. Since the control device 300 and electrical components such as strain gauges are provided on the transition spindle 100, excessively high temperatures can easily cause these electrical components to become inaccurate or fail. Therefore, it is necessary to cool the heat transferred from the solid-state machining tool to the transition spindle 100. At the same time, heat insulation can also be achieved by providing a heat insulation component between the transition spindle 100 and the solid-state machining tool. Both cooling methods for the transition spindle 100 can be used. Preferably, the two cooling methods are used simultaneously. After field use, if one of the two cooling methods is canceled, a higher temperature will appear at the transition spindle 100, resulting in inaccurate measurement results.

[0077] S311: There are multiple embodiments of the cooling device, one of which is that the cooling device 400 includes a cooling sleeve 410 rotatably connected to the outside of the transition spindle 100, and the cooling sleeve 410 has a cooling module to cool the transition spindle 100. During the solid-state processing process, the transition spindle 100 rotates relative to the cooling sleeve 410, and the cooling sleeve 410 does not rotate. This method of setting up the cooling device is relatively stable and reliable, that is, the cooling sleeve must be fixedly connected to the frame and cannot rotate with the transition spindle 100. It can be called a "wired type".

[0078] S3111: The cooling module opens a cooling cavity 420 in the cooling sleeve 410. During the solid-state processing, the purpose of controlling the cooling efficiency is achieved by controlling the temperature or flow of the fluid entering the cooling cavity 420; for example, when a faster cooling rate is required, the fluid temperature can be lowered and the fluid flow rate can be faster; when a slower cooling rate is required, the opposite measures can be taken.

[0079] S312: Another type of cooling device is "wireless" cooling, that is, the cooling device 400 is a self-cooling component 430 fixedly connected to the outside of the transition spindle 100. During the solid-state processing, the self-cooling component 430 rotates synchronously with the transition spindle 100; this method makes the overall structure small in size, light in weight, and more convenient to use.

[0080] Of course, there are other cooling methods that can be used. Here we only give a few feasible methods to facilitate understanding.

[0081] S3121: The self-cooling component 430 is a semiconductor cooling fin and / or fan. During the solid-state processing process, the semiconductor cooling fin and / or fan are used to dissipate heat from the transition spindle 100. The semiconductor cooling fin is compact and lightweight, suitable for rotating along with the transition spindle 100. The fan is inherently low-cost and easy to install. When installing both the semiconductor and fan, the semiconductor cooling fins and / or fan are evenly distributed around the outside of the transition spindle 100 to maintain weight balance across the transition spindle 100 and prevent the transition spindle 100 from becoming unbalanced during high-speed rotation. To further enhance the cooling effect, as shown in FIG2 , a cold air gun 440 can be used to assist in achieving more efficient cooling.

[0082] S510: When the second temperature monitoring component 510 detects that the temperature at the deformation detection area 120 is lower than the minimum value of the preset temperature range, the heating module 700 can be controlled to heat the position; the preset temperature range can be selected according to actual needs, such as 10℃-20℃, 20℃-30℃, 30℃-40℃, etc.; of course, the range value of the preset temperature can also be selected. The previous description only shows the range of 10℃, and it can also be any value, such as the range of 5℃, 6℃: 10℃-15℃, 20℃-25℃, 10℃-16℃, 20℃-26℃, etc. Specifically, the preset temperature range can be changed accordingly according to changes in the situation; preferably, the preset temperature range fluctuates within the room temperature range.

[0083] S520: When the second temperature monitoring component 510 detects that the temperature of the deformation detection area 120 is higher than the maximum value of the preset temperature range, the cooling efficiency of the cooling device 400 can be increased to reduce the heat conducted from the solid processing tool to the transition spindle 100; the preset temperature range can be selected according to the actual needs, such as 10℃-20℃, 20℃-30℃, 30℃-40℃, etc.; of course, the range value of the preset temperature can also be selected. The previous description only shows the range of 10℃, and it can also be any value, such as the range of 5℃, 6℃: 10℃-15℃, 20℃-25℃, 10℃-16℃, 20℃-26℃, etc. Specifically, the preset temperature range can be changed accordingly according to changes in the situation; preferably, the preset temperature range fluctuates within the room temperature range.

[0084] By combining the two steps S510 and S520, since the two ends of the transition spindle 100 are a heating module 700 at one end and a cooling device 400 at the end close to the solid-state processing tool, and the middle is the deformation detection area 120, which is also the location where the strain gauge is bonded; in this way, the force measuring area can be heated and cooled above and below it, thereby achieving dynamic control, because the temperature of the force measuring area is read synchronously. In this way, regardless of whether it is winter or summer, or whether the tool handle is working and generating heat, a constant temperature control is formed based on the temperature value of the force measuring area and the upper and lower heating and heat dissipation to ensure the test accuracy; the temperature of the deformation detection area 120 can also be monitored by the second temperature monitoring component 510. This temperature should be kept near a fixed temperature (such as room temperature or the ambient temperature during calibration). If the actual measured temperature in the transition area is found to be lower than this temperature, the heating part will work; if the actual measured temperature in the transition area is found to be higher than this temperature, the cooling part will work to keep the temperature in the transition area from deviating significantly, thereby ensuring the measurement accuracy of the strain gauge.

[0085] Optionally, there are other temperature control methods, such as not using a heating module and only changing the temperature of the fluid entering the cooling chamber. For example, if the temperature of the fluid entering the cooling chamber is high, the cooling chamber will play a heating role at this time, replacing the heating module and achieving the temperature control purpose. This is just a description of possible implementation methods and should not be regarded as a limitation of this case.

[0086] The influence of the temperature at the deformation detection area 120 on the strain gauge measurement can also be eliminated by other means. For example, the deformation detection area 120 can be freely heated or cooled, but before that, it is calibrated at different temperatures. The temperature can be selected according to actual conditions. When the temperature is low, it can be calibrated at -30℃, -20℃, -10℃, etc., or it can be 0℃, 15℃, 20℃, 30℃, 40℃, 50℃, etc. At the same time, the temperature should be understood as a temperature range, such as -50℃-100℃, etc., to obtain the offset value pattern of the strain measurement data at various temperatures, and input the error correction curve corresponding to this temperature into the receiving end. In this way, the heating or cooling module can be omitted during the test. When the initial temperature is very low (in winter) and the temperature is too high due to the heat transfer from the stirring head, the correct strain gauge value (pressure and torque) can be obtained based on the temperature and the received signal and the reference calibration curve.

[0087] To achieve intelligent control, the present invention can also be used in conjunction with the UI interface to read the input analog signal, read the machine tool coordinates and XYZ running speed values ​​in the PLC, and realize PLC path control and motion control, such as automatic tool setting, planning the starting point and end point, setting the spindle speed and Z pressing speed, and XY moving speed; realize data recording, monitoring and closed-loop adjustment of temperature, torque and pressure during solid-state processing; record solid-state processing parameters (such as speed, tool speed, penetration amount), characteristic curves (temperature, torque, pressure) and videos during solid-state processing, and summarize them into the process database after entering the corresponding material type; combined with AI artificial intelligence, when the curve is abnormal during solid-state processing, the software controls the PLC, thereby adjusting the solid-state processing parameters and realizing closed-loop control. Distributed control is carried out for the solid-state processing process, that is, in the initial stage, identification and matching of temperature, force and torque are performed to know the material category, and then the process parameters are matched from the process library for solid-state processing.

[0088] On the other hand, the present application also proposes a solid-state processing device, which is a solid-state processing device for implementing the above method.

[0089] The invention comprises a smart shaft and a processing part 200 detachably connected to the smart shaft, wherein the processing part 200 is a solid processing tool; wherein the smart shaft comprises a transition spindle 100, wherein the first end of the transition spindle 100 is connected to the driving spindle, and the second end of the transition spindle 100 is used to connect to the processing part 200; a control device 300 and a cooling device 400 are installed on the outer side of the transition spindle 100, and the cooling device 400 is located between the control device 300 and the processing part 200; the transition spindle 100 plays a role in supporting and installing the control device 300, the cooling device 400 and the monitoring device; and the cooling device 400 is provided with Between the processing part 200 and the control device 300, the heat conducted from the processing part 200 to the control device 300 can be effectively reduced, thereby protecting the control device 300; the smart shaft handle also includes a monitoring device, which is connected to the control device 300. The monitoring device is used to monitor the real-time parameters of the smart shaft handle and transmit the parameters to the control device 300, so as to adjust the solid-state processing parameters through the obtained data, thereby optimizing the indicators at the processing position and extending the life of the solid-state processing tool; the parameters may include but are not limited to temperature, pressure, torque, spindle speed, solid-state processing speed, pressing depth and other data.

[0090] As shown in FIG9 , the monitoring device includes a first temperature monitoring component 500 and a strain measurement component 900 . The first temperature monitoring component 500 is used to monitor the temperature of the processing portion 200 ; the strain measurement component 900 is used to measure the downward force and / or torque of the spindle.

[0091] As shown in Figures 6-7 and 11, the cooling device 400 includes a cooling sleeve 410 rotatably connected to the outside of the transition spindle 100. Furthermore, the rotatable connection can be a bearing connection. The cooling sleeve 410 is fixedly connected to the frame via a connecting frame 1000, and a cooling module is arranged in the cooling sleeve 410. The cooling sleeve 410 can support, bear, and protect the cooling module therein. Optionally, the cooling module includes a cooling cavity 420 arranged inside the cooling sleeve 410. The cooling cavity 420 has an inlet end and an outlet end. A cooling fluid enters the cooling cavity 420 from the inlet end and flows out from the outlet end, thereby removing heat from the transition spindle 100. The cooling fluid includes liquid cooling and air cooling. Conventional water cooling can be used for liquid cooling; and compressed air, rare gas, carbon dioxide, and other gases can be used for forced convection. The above cooling sleeve 410 is fixedly connected to the frame through the connecting frame 1000. The connecting frame 1000 drives the cooling device 400 to follow the frame for multi-axis movement. The transition main shaft 100 can drive the control device 300 and the monitoring device to rotate together. For ease of understanding, a more detailed explanation is given as follows: In this embodiment, the cooling device 400 does not rotate with the transition main shaft 100.

[0092] Specifically, the following method can be used to achieve rotation of the transition spindle 100 relative to the cooling device 400. First, a gap is created between the inner wall of the cooling sleeve 410 and the outer wall of the transition spindle 100 to form a cavity. A skeleton oil seal is placed at the top of the cavity, with its outer side mating with the cavity and its inner side mating with the spindle extension sleeve, sealing the top of the cavity. After applying synthetic grease, this seal ensures rotation of the spindle sleeve. A support ring is located below the skeleton oil seal, whose outer diameter matches the inner diameter of the cavity. Another skeleton oil seal is placed below the support ring, sealing the lower portion of the cavity. Finally, a fixing sleeve (ring) is positioned at the bottom of the cooling sleeve 410. The upper protrusion of the fixing sleeve (ring) mates with the skeleton oil seal and is connected to the cooling sleeve 410 via four screws. This provides axial tightening of the skeleton oil seal and the retaining ring, preventing the skeleton oil seal and the support ring from rotating with the transition spindle 100. Two threaded holes are located in the center of the cooling sleeve 410, connecting to the cooling cavity 420 for connecting water pipes to supply and drain cooling water. The hollow position of the support ring should correspond to the cooling water inlet / outlet position. The above solution is only one of several solutions that can realize cooling of the transition spindle 100 by cooling fluid, and is intended to facilitate understanding of the technical solution and should not be understood as limiting.

[0093] The cooling device 400 also has a wireless usage, that is, the cooling device 400 includes a self-cooling component 430 fixedly arranged on the outside of the transition main shaft 100 and a fixed component. The self-cooling component 430 rotates with the transition main shaft 100. The self-cooling component 430 can be a semiconductor cooling plate and / or a fan, and the semiconductor cooling plate and / or the fan are connected to the control device 300; preferably, the semiconductor cooling plates or fans can be arranged in multiple groups and evenly distributed on the outside of the transition main shaft 100 to facilitate uniform weight distribution.

[0094] As shown in Figures 2 and / or 12 , a heating module 700 is also provided on the outside of the transition spindle 100 for heating the transition spindle 100. The heating module 700 is connected to the control device 300, which may include a control panel to facilitate temperature control. Optionally, as shown in Figure 2 , the heating module 700 may be a heat gun mounted on the connecting frame 1000 and independent of the tool handle. When the smart tool handle is used in cold weather, it can be used to spray hot air to heat the tool handle and adjust the temperature of the measurement area.

[0095] Optionally, the heating module 700 may also be a heating element with a smaller volume and weight, such as a resistance heating plate, and may be used regardless of whether the cooling device 400 is fixed or rotates with the transition spindle 100 .

[0096] As shown in Figure 17, the control device 300 includes an integrated circuit board assembly 320 and a power supply assembly 330. The integrated circuit board assembly 320 is connected to the power supply assembly 330. The integrated circuit board assembly 320 includes a wireless transceiver module 321 (the wireless transceiver module includes a wireless signal acquisition module and a wireless signal transmission module) and a temperature control panel 322. The wireless transceiver module 321 is connected to the monitoring device, the cooling device 400, and the heating module 700. The temperature control panel 322 is connected to the monitoring device, the cooling device 400, and the heating module 700.

[0097] Among them, the relevant connection relationship and the cooperative use process of the first temperature monitoring component 500 are described in detail as follows: a cavity 210 is opened inside the processing part 200, and the first end of the cavity 210 extends inside the processing part 200 to the processing end near the processing part 200, and a first temperature monitoring component 500 is provided in the first end of the cavity 210 to monitor the temperature of the processing part 200 near the processing end in real time; this design can avoid a large amount of heat loss during the conduction process, thereby collecting more accurate temperature information, which is convenient for users to monitor the temperature in real time; preferably, the first temperature monitoring component 500 can be a thermocouple, which has a wide measurement range, high measurement accuracy, and is deformable, and is suitable for use in this application; of course, other feasible temperature sensors that can enter the cavity 210, such as thermal resistors, can also be selected according to actual needs.

[0098] As shown in Figure 10, the cavity 210 includes an inclined section 211 opened inside the processing part 200 and a vertical section 212 connected to the inclined section 211. One of the inclined section 211 and the vertical section 212 is used to insert the first temperature monitoring component 500, and the other of the inclined section 211 and the vertical section 212 is used to install a positioning member 600 to position the first temperature monitoring component 500 to prevent the first temperature monitoring component 500 from shifting and / or colliding during the process of following the high-speed rotation of the shaft handle and the processing part 200.

[0099] As shown in Figures 9-10 and 12-15, the positioning member 600 is a positioning rod. The first end of the positioning rod is used to position the first temperature monitoring component 500, and the second end of the positioning rod is fixed by the connecting assembly 800. It can be understood that the positioning member 600 in the present application is not limited to the embodiment of the positioning rod. As long as it can play a positioning or fixing role for the first temperature monitoring component 500 similar to the positioning rod, it can be used, such as a snap clamping and fixing method. At the same time, there are many ways to fix the positioning rod through the connecting assembly 800, which are not particularly limited. The following are several examples to facilitate understanding of the technical solutions:

[0100] In an optional embodiment, as shown in Figures 9-10 and 12-13, the connecting assembly 800 includes a threaded structure provided on one end of the positioning rod and on the processing portion 200. The threaded structure on the positioning rod and the threaded structure on the processing portion 200 can be threadedly connected. The threaded connection method is low in cost and convenient for assembly and disassembly.

[0101] In another optional embodiment, as shown in Figures 14-15, the connecting component 800 is a magnetic fixing component, which is adsorbed on the side of the processing part 200 facing the transition spindle 100, and the positioning member 600 passes through the magnetic fixing component to fix the positioning member 600 through the magnetic fixing component; a groove 212a is provided at the inlet end of the vertical section 212, and a magnetic member 810 is adsorbed on the inner wall of the groove 212a, and a fixing buckle 8 is adsorbed on one side of the magnetic member 810. 20. Through holes are provided in the fixing buckle 820 and the magnetic component 810 along the axial direction of the transition main shaft 100, and the positioning rod (positioning component 600) is inserted into the vertical section 212 after passing through the through hole; there are multiple connection methods between the positioning rod and the magnetic fixing component, for example, the positioning rod is a magnetic metal, so that the positioning rod and the magnetic component 810 are adsorbed and connected; a first threaded hole 830 can also be provided in the radial direction of the fixing buckle 820, and a screw is passed through the first threaded hole 830 to fix the positioning rod and the magnetic fixing component.

[0102] Please refer to FIG12 . The first end of the thermocouple is connected to the control device 300 (as for the connection method between the thermocouple and the control device 300, the thermocouple can be directly connected to the control device 300; or the thermocouple can be electrically connected to the control device 300 via a wireless method). Specifically, the first end of the thermocouple is also connected to the integrated circuit board assembly 320 included in the control device 300, and the temperature of the processing unit 200 and the pressure, torque and other information of the spindle are simultaneously transmitted through the integrated circuit board assembly 320. The second end of the thermocouple abuts the first end of the cavity 210, and the measuring end of the thermocouple is as close as possible to the processing end of the processing unit 200. This makes it easier to accurately measure the real-time temperature of the processing end; optionally, the thermocouple includes the following two settings. First, as shown in the figure, the first end of the thermocouple is connected to the control device 300 (same as above), and the second end of the thermocouple passes through the interior of the transition spindle 100 and enters the vertical section 212 and approaches the processing end of the processing part 200; a channel is opened inside the transition spindle to communicate with the cavity 210, and then the thermocouple is passed through the channel inside the transition spindle 100 and the cavity 210 inside the processing part 200 in turn. This arrangement of the thermocouple is relatively stable and reliable, and is not easy to cause the thermocouple to shift, and can also minimize the interference of external factors on the thermocouple. Secondly, as shown in the figure, the first end of the thermocouple is still connected to the control device 300, and the second end of the thermocouple is arranged along the outer wall of the transition main shaft 100 and enters from the inclined section 211 to approach the processing end of the processing part 200; the thermocouple and the transition main shaft 100, and the thermocouple and the processing part 200 can be fixed by means of straps and / or snap connections; this method of designing the thermocouple on the outside of the transition main shaft 100 does not require opening a hole in the transition main shaft 100, and the cost of use is relatively low.

[0103] The connection relationship and the cooperative use process of the strain measurement assembly 900 are described in detail as follows: the strain measurement assembly 900 is used to measure the downward force and / or torque of the driving spindle; by detecting the deformation of the extended transition spindle 100, the pressure and torque during the solid-state machining process are detected in real time, so that the solid-state machining parameters can be adjusted based on the obtained data to achieve optimization of the indicators at the machining position and extension of the life of the solid-state machining tool.

[0104] Preferably, as shown in Figure 5, the strain measurement assembly 900 includes one or more groups of strain gauges connected to the outside of the transition spindle 100. Optionally, the strain gauges are fixed to the outside of the transition spindle 100 by bonding; when there is only one group of strain gauges, the strain gauges are used to measure the pressure under the drive spindle or the torque of the drive spindle; when there are multiple groups of strain gauges, at least one group is used to measure the pressure under the drive spindle, and at least one group is used to measure the torque of the drive spindle; the strain gauges are half-bridge strain gauges or full-bridge strain gauges; at the same time, in order to ensure that the weight on the transition spindle 100 is evenly distributed, the strain gauges are evenly distributed on the outside of the transition spindle 100; optionally, the strain measurement assembly 900 can also adopt a method of setting a pressure sensor and / or torque sensor on the outside of the transition spindle 100.

[0105] As shown in FIG9 , the transition spindle 100 can be divided into multiple sections along its axial direction, including a deformation detection area 120 and support areas 110 located on both sides of the deformation detection area 120, wherein the support area 110 is used to install the protective sleeve 310, and the deformation detection area 120 is used to install the strain measurement component 900; a cavity is formed between the protective sleeve 310 and the transition spindle 100, and the strain measurement component 900 (strain gauge) installed outside the deformation detection area 120 is located in the cavity; an installation groove is opened in the protective sleeve 310, and an integrated circuit board component 320 is installed in the installation groove. At the same time, a power supply component 330 is also installed in the cavity or the installation groove. The integrated circuit board assembly 320 and the strain measurement assembly 900 are both connected to the integrated circuit board assembly 320, and the integrated circuit board assembly 320 is powered by the power supply assembly 330. The integrated circuit board assembly 320 includes at least a wireless signal acquisition module and a wireless signal transmission module to transmit and receive measurement signals from the strain measurement assembly 900. The above-mentioned protective sleeve 310 structural design serves the following functions: first, the protective sleeve 310 can protect the strain measurement assembly 900; second, the cavity structure design of the protective sleeve 310 can reduce weight; and third, the cavity can also accommodate the integrated circuit board assembly 320 and the power supply assembly 330. Preferably, the protective sleeve 310 is made of a polymer material such as nylon that does not block wireless signal transmission. Furthermore, the protective sleeve 310 is additively manufactured. Optionally, the protective sleeve 310 is fixed to the outside of the transition spindle by multiple screws. Similarly, to ensure uniform weight distribution on the transition spindle 100, the multiple screws are preferably evenly distributed around the circumference of the transition spindle 100.

[0106] Optionally, in order to control the changes in the pressure and torque range of the solid-state machining spindle during solid-state machining of different materials, if a smaller range and higher precision mechanical measurement is required, that is, the deformation of the transition spindle 100 during solid-state machining needs to be larger, the diameter of the deformation detection position (the position for sticking strain gauges) can be reduced accordingly, and its structure, material, etc. can be adjusted accordingly; specifically, the diameter of the transition spindle 100 corresponding to the deformation detection area 120 can be made smaller than the diameter of the transition spindle 100 corresponding to the support area 110; preferably, the deformation detection area 120 and the support area 110 have a smooth transition, so that the downward pressure and torque of the driving spindle can be transmitted unimpeded to the strain measurement component 900 on the deformation detection area 120.

[0107] Preferably, a second temperature monitoring component 510 is provided at the deformation detection area 120. The second temperature monitoring component 510 is located in the cavity. The second temperature monitoring component 510 can be a temperature measuring element such as a thermocouple or a thermistor. Taking a thermocouple as an example, one end of the thermocouple is connected to the integrated circuit board assembly 320, and the other end of the thermocouple is used to measure the temperature of the deformation detection area 120 in real time.

[0108] Optionally, a rubber ring or similar accessory for increasing friction may be provided at the supporting position of the supporting area 110 to prevent the protective sleeve 310 from slipping axially along the transition main shaft 100 .

[0109] As shown in Figure 20, the transition spindle 100 may not only include the above-mentioned support area 110 and deformation detection area 120, but also include a cooling section; preferably, the cooling section is located on the side of the protective sleeve 310 facing the processing part 200 to prevent excessive heat from being conducted from the processing part 200 to the integrated circuit board assembly 320 and the power supply assembly 330; a cooling device 400 is provided on the outside of the cooling section to quickly cool the heat conducted to the cooling section, so as to effectively protect the integrated circuit board assembly 320 and the power supply assembly 330 from damage; preferably, a heat dissipation groove 150 is provided on the outside of the cooling section.

[0110] In actual use, it is found that the heat of the processing part 200 will still be conducted to the deformation detection area 120 on the transition spindle, causing inaccurate measurement data; therefore, preferably, an annular heat insulation component is provided between the deformation detection area 120 of the transition spindle 100 and the processing part 200; the position of the annular heat insulation component can be selectively installed according to the shaft handle structure; the setting of the annular heat insulation component must also meet the requirements of both conducting the downward pressure of the driving spindle and isolating or reducing the heat conducted from the processing part 200 to the deformation detection area 120; further, the material of the annular heat insulation component is mica, high-temperature resistant carbon fiber synthetic stone plate and other high-temperature resistant and pressure-resistant materials; as for the shape, size and quantity of the heat insulation component, they can be selected according to actual needs

[0111] Preferably, the first end of the transition spindle 100 is connected to the drive spindle, and the second end of the transition spindle 100 is provided with a mounting hole 130 coaxial with the solid processing tool. The solid processing tool is inserted into the mounting hole 130 and fixedly connected to the transition spindle 100. Optionally, as shown in FIG9 , one or more threaded through holes 140 are provided on the side wall of the mounting hole 130 to facilitate the passage of a threaded member through the threaded through hole 140 to fix the solid processing tool in the mounting hole 130. This design of inserting a section of the solid processing tool into the mounting hole 130 increases the contact surface between the solid processing tool head and the inner wall of the mounting hole 130, which is more conducive to the fixation of the solid processing tool. Of course, the transition spindle 100 can also be connected to the solid processing tool in other ways, such as by designing a threaded structure on both the transition spindle 100 and the solid processing tool. It is understandable that the above two methods are only for the purpose of facilitating the understanding of the content of this application and do not constitute a limitation thereto.

[0112] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of this application, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0113] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A solid state processing method, characterized in that: The solid state processing method comprises the following steps: connecting a solid machining tool to the transition spindle (100) to be driven through the machine head; Start the solid-state processing equipment and perform mobile processing along a predetermined processing route by using the solid-state processing tool; During solid-state machining, the deformation of the deformation detection area (120) on the transition spindle (100) is measured by a strain gauge to monitor the pressure and / or torque of the transition spindle (100); Monitoring the temperature of the solid-state processing tool by a first temperature monitoring component (500); The temperature of the deformation detection area (120) is monitored by a second temperature monitoring component (510).

2. The solid-state processing method according to claim 1, characterized in that The solid-state processing method is a friction stir welding method or a solid-state additive manufacturing method.

3. The solid-state processing method according to claim 1, characterized in that: During solid-state machining, the steps of measuring the deformation of a deformation detection area (120) on the transition spindle (100) by means of a strain gauge to monitor the pressure and / or torque of the transition spindle (100); monitoring the temperature of the solid-state machining tool by means of a first temperature monitoring component (500); and monitoring the temperature on the deformation detection area (120) by means of a second temperature monitoring component (510) include: The outer side of the transition spindle (100) is provided with a control device (300), and during the solid-state machining process, the control device (300) collects and transmits wireless signals of the strain gauge, the first temperature monitoring component (500) and the second temperature monitoring component (510).

4. The solid-state processing method according to claim 3, characterized in that: The outer side of the transition spindle (100) is provided with a control device (300), and the steps of sending and receiving wireless signals of the strain gauge, the first temperature monitoring component (500) and the second temperature monitoring component (510) through the control device (300) during the solid-state machining process include: During the solid-state processing, the integrated circuit board component (320) in the control device (300) receives and sends wireless signals from the strain gauge, the first temperature monitoring component (500) and the second temperature monitoring component (510), and displays the corresponding signals on the terminal, and the power supply component (330) in the control device (300) supplies power to the integrated circuit board component (320).

5. The solid-state processing method according to claim 1, characterized in that: Before the solid-state machining process begins, a strain gauge is adhered to the deformation detection area (120) on the transition spindle (100) to calibrate the pressure and / or torque measurement.

6. The solid-state processing method according to claim 5, characterized in that: Before the solid-state machining process begins, the step of adhering the strain gauge to the deformation detection area (120) on the transition spindle (100) to calibrate the pressure and / or torque measurement includes: The pressure calibration method includes placing the transition spindle (100) on a designated mold with its bottom fixed, applying a force of known magnitude from the top, and increasing the applied force in sequence. The pressure signal is received by a control device (300) and the displayed pressure signal is calibrated.

7. The solid-state processing method according to claim 5, characterized in that: Before the solid-state machining process begins, the step of adhering the strain gauge to the deformation detection area (120) on the transition spindle (100) to calibrate the pressure and / or torque measurement includes: The torque calibration method includes placing the transition spindle (100) on a designated mold with its bottom fixed, applying a torque of known magnitude from its top, and increasing it in sequence, receiving the torque signal through a control device (300) and calibrating the displayed torque signal.

8. The solid-state processing method according to claim 1, characterized in that: Before the solid-state machining process begins, a first temperature monitoring component (500) extends into a cavity (210) inside the solid-state machining tool close to one end of the machining end of the solid-state machining tool; thereby During the processing, the temperature of the processing end of the solid processing tool is monitored in real time through the monitoring end of the first temperature monitoring component (500).

9. The solid-state processing method according to claim 8, characterized in that: Before the solid-state machining process begins, a first temperature monitoring component (500) extends into a cavity (210) inside the solid-state machining tool close to one end of the machining end of the solid-state machining tool; so that during the solid-state machining process, the step of real-time monitoring the temperature of the machining end of the solid-state machining tool through the monitoring end of the first temperature monitoring component (500) comprises: A thermocouple is arranged in one of the vertical section (212) and the inclined section (211) of the cavity (210) to monitor the temperature of the processing end of the solid processing tool, and a positioning member (600) is arranged in the other of the vertical section (212) and the inclined section (211) of the cavity (210) to position the thermocouple.

10. The solid-state processing method according to any one of claims 2 to 9, characterized in that: During the solid-state machining process, a cooling device (400) is provided on the outer side of the transition spindle (100), and the heat transferred from the solid-state machining tool to the transition spindle (100) is cooled by the cooling device (400) to avoid excessive temperature of the transition spindle (100).

11. The solid-state processing method according to claim 10, characterized in that: During the solid-state machining process, a cooling device (400) is provided on the outer side of the transition spindle (100), and the cooling device (400) faces one side of the solid-state machining tool. The steps of cooling the heat transferred from the solid-state machining tool to the transition spindle (100) by the cooling device (400) to avoid the excessive temperature of the transition spindle (100) include: The cooling device (400) is a self-cooling component (430) fixedly connected to the outside of the transition spindle (100). During the solid-state processing, the self-cooling component (430) rotates synchronously with the transition spindle (100); or a cooling sleeve rotatably connected to the outside of the transition spindle (100). (410), the cooling sleeve (410) has a cooling module inside to cool the transition spindle (100), during the solid-state machining process, the transition spindle (100) rotates relative to the cooling sleeve (410), and the cooling sleeve (410) does not rotate.

12. The solid-state processing method according to claim 11, characterized in that The cooling device (400) is a self-cooling component (430) fixedly connected to the outside of the transition spindle (100). During the solid-state machining process, the self-cooling component (430) rotates synchronously with the transition spindle (100), comprising: The self-cooling component (430) is a semiconductor cooling fin and / or a fan. During the solid-state processing, the semiconductor cooling fin and / or the fan are used to dissipate heat from the transition spindle (100); and the semiconductor cooling fin and / or the fan are evenly distributed on the outside of the transition spindle (100) to maintain the weight balance of various parts of the transition spindle (100).

13. The solid-state processing method according to claim 11, characterized in that: The cooling device (400) comprises a cooling sleeve (410) rotatably connected to the outside of the transition spindle (100), wherein the cooling sleeve (410) has a cooling module inside to cool the transition spindle (100). During the solid-state machining process, the transition spindle (100) rotates relative to the cooling sleeve (410), and the cooling sleeve (410) does not rotate. The step comprises: A cooling cavity (420) is provided in the cooling sleeve (410). During the solid-state processing, the temperature or flow rate of the fluid entering the cooling cavity (420) is controlled to achieve the purpose of controlling the cooling efficiency.

14. The solid-state processing method according to any one of claims 1 to 9, characterized in that: When the second temperature monitoring component (510) detects that the temperature at the deformation detection area (120) is lower than the minimum value of the preset temperature range, the heating module (700) can be used to heat the location.

15. The solid-state processing method according to claim 10, characterized in that: When the second temperature monitoring component (510) detects that the temperature of the deformation detection area (120) is higher than the maximum value of the preset temperature range, the cooling efficiency of the cooling device (400) can be increased to reduce the heat conducted from the solid processing tool to the transition spindle (100).

16. The solid-state processing method according to any one of claims 2 to 9, characterized in that: In order to achieve constant temperature control of the deformation detection area (120), different temperatures are calibrated before the solid-state processing process begins, and the offset value rules of the strain gauge measurement data at each temperature are obtained to form an error correction curve corresponding to these temperature values ​​and input it into the control device (300). The correct strain gauge measurement value can be obtained by referring to the curve.

17. The solid-state processing method according to any one of claims 1 to 9, characterized in that: Before the solid-state machining process begins, an annular heat insulation component is installed between the transition spindle (100) and the solid-state machining tool to reduce the conduction of heat generated by the solid-state machining tool to the transition spindle (100) during the machining process.

18. A solid state processing device, characterized in that The solid-state processing device is a solid-state processing device for implementing the method according to any one of claims 1 to 17.

Images