Electronic device comprising heat-dissipating member

Abstract

An electronic device according to various embodiments of the present invention may comprise: a display disposed to display video in a first direction of the electronic device; a substrate part disposed to face the display in a second direction, which is opposite to the first direction, the substrate part including a heat source disposed on the substrate part; a first heat-dissipating member disposed between the display and the substrate part; and a second heat-dissipating member disposed between the first heat-dissipating member and the substrate part. The first heat-dissipating member can include a first heat insulator disposed in a region including a region overlapping the heat source with respect to the first direction, and the second heat-dissipating member can include a second heat insulator disposed in a region at least partially overlapping the heat source with respect to the first direction.

Description

Electronic devices including heat dissipation elements

[0001] The various embodiments disclosed in this document relate to electronic devices, and more particularly, to electronic devices including a heat dissipation member.

[0002] Electronic devices are becoming increasingly slimmer, more rigid, and more aesthetically pleasing, while simultaneously being developed to differentiate their functional elements. Electronic devices are evolving beyond their standard rectangular form factor into increasingly diverse shapes. Electronic devices may have a flexible structure that allows for portability and the use of large-screen displays. For example, an electronic device may have a structure (e.g., a rollable or slideable structure) that allows the display area (e.g., display area) of a flexible display to be varied by supporting housings that slide relative to each other.

[0003] Electronic devices may include various active components, such as an application processor (AP), a radio-frequency integrated circuit (RFIC), a power management IC (PMIC), and a multimode multiband power amplifier (MMPA), to provide various functions to users. These various active components may consume power for operation. The power consumed by these various active components is converted into heat, and these various active components act as heat sources. The heat generated from the heat sources may increase the temperature of the electronic device. The electronic device may include a heat dissipation member to effectively dissipate the heat from the heat sources to the outside.

[0004] As electronic devices become smaller and more heat-generating sources are densely arranged on the circuit board, and the power consumption of the heat-generating sources increases, the heat generated by the heat-generating sources may become concentrated in certain areas of the electronic device, causing the temperature to increase in certain areas of the surface of the electronic device. To dissipate the heat generated by the heat-generating source, a heat-radiating member having a material with high thermal conductivity may be arranged. However, heat-radiating members arranged in conventional electronic devices transfer the heat generated by the heat-generating source toward the surface of the electronic device, making it difficult to alleviate the heat concentration in certain areas of the surface of the electronic device. Therefore, a heat-radiating member that can disperse the heat generated by the heat-generating source over a wide area of ​​the electronic device is required.

[0005] Various embodiments of the present invention can provide a heat dissipation member that disperses heat from a heat source and an electronic device with reduced heat concentration.

[0006] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by those skilled in the art to which the present invention pertains from the description below.

[0007] An electronic device according to various embodiments of the present invention may include a display arranged to display an image in a first direction of the electronic device, a substrate arranged to face the display in a second direction opposite to the first direction, the substrate including a heat source arranged on the substrate, a first heat dissipation member arranged between the display and the substrate, and a second heat dissipation member arranged between the first heat dissipation member and the substrate. The first heat dissipation member may include a first heat insulator arranged in an area including an area overlapping the heat source with respect to the first direction, and the second heat dissipation member may include a second heat insulator arranged in an area at least partially overlapping the heat source with respect to the first direction.

[0008] In various embodiments, the second insulator may have a shape corresponding to the planar shape of the heat source.

[0009] In various embodiments, the first insulator may have a larger area than the second insulator.

[0010] In various embodiments, the first insulation may include a first insulation layer and a second insulation layer positioned so as to overlap the first insulation layer below the first insulation layer with respect to the first direction.

[0011] In various embodiments, the first heat dissipation member may include a first heat conductive layer positioned between the first insulating layer and the second insulating layer.

[0012] In various embodiments, the first insulating layer may have a larger area than the second insulating layer.

[0013] In various embodiments, the second insulation may include a third insulation layer and a fourth insulation layer positioned so as to overlap the third insulation layer below the third insulation layer with respect to the first direction.

[0014] In various embodiments, the second heat dissipation member may include a second heat-conducting layer positioned between the third insulating layer and the fourth insulating layer.

[0015] In various embodiments, the third insulating layer may have a larger area than the fourth insulating layer.

[0016] In various embodiments, the first insulator and the second insulator include a plurality of insulating layers laminated in the first direction, the first heat dissipation member and the second heat dissipation member each include at least one heat conductive layer positioned between the plurality of insulating layers and laminated alternately with the plurality of insulating layers, and the plurality of insulating layers may be arranged such that their areas sequentially increase as they go in the first direction.

[0017] In various embodiments, the electronic device further includes a frame having a first side facing the display and a second side facing the substrate, wherein the first heat dissipation member is disposed on the first side of the frame, and the second heat dissipation member is disposed on the second side of the frame.

[0018] In various embodiments, the first insulator and the second insulator may be configured to transfer heat in a direction perpendicular to the first direction.

[0019] In various embodiments, the first insulator and the second insulator may comprise an anisotropic heat transfer material having a heat conduction direction at least partially oriented perpendicular to the first direction.

[0020] In various embodiments, the anisotropic heat transfer material may comprise graphite.

[0021] According to various embodiments of the present invention, a heat dissipation member is a heat dissipation member of an electronic device, wherein the electronic device may include a display arranged to display an image in a first direction of the electronic device, and a substrate arranged to face the display in a second direction opposite to the first direction, the substrate including a heat source arranged on the substrate. The heat dissipation member may include a first heat dissipation member arranged between the display and the substrate, and a second heat dissipation member arranged between the first heat dissipation member and the substrate. The first heat dissipation member may include a first insulator arranged in an area including an area overlapping the heat source with respect to the first direction, and the second heat dissipation member may include a second insulator arranged in an area overlapping at least partially with the heat source with respect to the first direction.

[0022] In various embodiments, the second insulator may have a shape corresponding to the planar shape of the heat source.

[0023] In various embodiments, the first insulator may have a larger area than the second insulator.

[0024] In various embodiments, the first insulator and the second insulator include a plurality of insulating layers laminated in the first direction, the first heat dissipation member and the second heat dissipation member each include at least one heat conductive layer positioned between the plurality of insulating layers and laminated alternately with the plurality of insulating layers, and the plurality of insulating layers may be arranged such that their areas sequentially increase as they go in the first direction.

[0025] In various embodiments, the electronic device further includes a frame having a first side facing the display and a second side facing the substrate, wherein the first heat dissipation member is disposed on the first side of the frame, and the second heat dissipation member is disposed on the second side of the frame.

[0026] In various embodiments, the first insulator and the second insulator may be configured to transfer heat in a direction perpendicular to the first direction.

[0027] In various embodiments, the first insulator and the second insulator may comprise an anisotropic heat transfer material having a heat conduction direction at least partially oriented perpendicular to the first direction.

[0028] In various embodiments, the anisotropic heat transfer material may comprise graphite.

[0029] According to various embodiments disclosed in this document, the first and second heat-dissipating members, which are arranged in an area overlapping the heat source, can prevent heat generated from the heat source from being intensively transferred in the first direction, and the first and second heat-dissipating members spread the heat from the heat source in the direction of the surface of the frame of the electronic device, so that heat concentration on the surface of the electronic device can be alleviated or prevented.

[0030] In addition, the effects that can be obtained or expected by various embodiments of this document may be disclosed directly or implicitly in the detailed description of the embodiments of this document.

[0031] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0032] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0033] FIGS. 2A to 2F illustrate a portable electronic device having an in-folding housing structure according to one embodiment.

[0034] FIG. 3A is a plan view of an electronic device according to various embodiments of the present invention.

[0035] FIG. 3b is a cross-sectional view of an electronic device according to various embodiments of the present invention.

[0036] FIG. 3c is a cross-sectional view showing a first heat dissipation member according to various embodiments of the present invention.

[0037] FIG. 3d is a cross-sectional view showing a first heat dissipation member according to various embodiments of the present invention.

[0038] Fig. 4a is a cross-sectional view of an electronic device according to a comparative example.

[0039] Fig. 4b is a plan view showing the heat distribution of an electronic device according to a comparative example.

[0040] FIG. 4c is a cross-sectional view of an electronic device according to various embodiments of the present invention.

[0041] FIG. 4d is a plan view showing the heat distribution of an electronic device according to various embodiments of the present invention.

[0042] FIG. 5a is a schematic diagram showing a heat dissipation member of an electronic device according to various embodiments.

[0043] FIG. 5b is a schematic diagram showing heat transfer of a heat dissipation member of an electronic device according to various embodiments.

[0044] FIG. 5c is an enlarged cross-sectional view of an electronic device according to various embodiments.

[0045] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0046] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0047] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0048] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0049] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0050] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0051] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0052] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0053] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0054] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0055] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0056] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0057] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0058] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0059] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0060] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0061] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0062] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0063] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0064] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0065] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0066] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0067] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0068] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0069] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0070] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0071] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0072] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0073] According to various embodiments, a portable electronic device (e.g., the electronic device (101) of FIG. 1) may have a foldable housing that is divided into two housings with a folding axis as the center. A first part of a display (e.g., a flexible display) may be disposed in a first housing, and a second part of the display may be disposed in a second housing. The foldable housing may be implemented in an in-folding manner in which the first and second parts face each other when the portable electronic device is folded. Alternatively, the foldable housing may be implemented in an out-folding manner in which the first and second parts face each other when the portable electronic device is folded. A surface on which the first and second parts of the display are disposed may be defined as a front surface of the portable electronic device, an opposite surface thereof may be defined as a rear surface of the portable electronic device, and a surface surrounding a space between the front and rear surfaces may be defined as a side surface of the portable electronic device.

[0074] According to the embodiments mentioned in this document, the case of in-folding, in which a first part of the display in a first housing is arranged to face a second part of the display in a second housing when the display of the portable electronic device is folded, is illustrated and described as an example. However, according to one embodiment, the same may be applied to the case of out-folding, in which a first part of the display in a first housing (210) is arranged to face the opposite direction from a second part of the display in a second housing when the display is folded. In addition, one embodiment may be applied to a multi-foldable electronic device in which in-folding and in-folding are combined, in-folding and out-folding are combined, or out-folding and out-folding are combined.

[0075] FIGS. 2A to 2F illustrate a portable electronic device (200) having an in-folding housing structure according to one embodiment. Specifically, FIGS. 2A and 2B illustrate a front view of a foldable portable electronic device (hereinafter, simply referred to as an electronic device) according to various embodiments in an unfolded (flat or open) state, FIG. 2C illustrates a rear view of the electronic device in a folded (or closed) state, FIG. 2D illustrates a rear view in an unfolded state, FIG. 2E illustrates a front view in a partially folded state (in other words, a partially unfolded state, or an intermediate state (freestop state) between a fully folded state and a fully unfolded state), and FIG. 2F is an exploded perspective view of the electronic device.

[0076] Referring to FIGS. 2A to 2F, a portable electronic device (200) (e.g., electronic device (101) of FIG. 1) may include a first housing (210), a second housing (220), a hinge assembly (240) connecting the first housing (210) and the second housing (220) such that the second housing (220) is rotatable relative to the first housing (210), a flexible or foldable display (299) disposed within a space formed by the foldable housings (210, 220), and a sensor module (e.g., sensor module (176) of FIG. 1).

[0077] The display (299) can be arranged from the first housing (210) across the hinge assembly (240) to the second housing (220). The display (299) can be divided into a first display area (211) arranged in the internal space of the first housing (210) and a second display area (221) arranged in the internal space of the second housing (220) based on the folding axis (A). A sensor module (e.g., an illumination sensor) can be arranged below the sensor area (or, light transmitting area) (242a) of the first display area (211) when viewed from the front. The position and / or size of the sensor area (242a) within the first display area (211) can be determined by the position and / or size of the illumination sensor arranged below it. For example, the size (e.g., diameter) of the sensor area (242a) may be determined based on the field of view (FOV) of the light sensor. In one embodiment, the sensor area (242a) may be configured to have a lower pixel density and / or lower wiring density than its surroundings to improve light transmittance. In some embodiments, the display (299) may include a protective layer (298) that includes a transparent material and protects the panel layer from external foreign substances and impacts.

[0078] The hinge assembly (240) may be implemented in an in-folding manner so that the two display areas (211, 221) face each other when the portable electronic device (200) is switched from an unfolded state (e.g., the state of FIG. 2a) to a folded state (e.g., the state of FIG. 2c). For example, when the electronic device (200) is in an unfolded state, the two display areas (211, 221) may face substantially the same direction. As the state is switched from an unfolded state to a folded state, the two display areas (211, 221) may rotate in a direction where they face each other. The hinge assembly (240) may be configured so that the foldable housing (210, 220) has a resistance to rotation. When an external force exceeding the resistance is applied to the foldable housing (210, 220), the foldable housing (210, 220) may rotate.

[0079] Based on the angle formed between the two display areas (211, 221), the state of the electronic device (200) can be defined. For example, the state of the electronic device (200) can be defined as an unfolded (flat or open) state when the angle between the two display areas (211, 221) is approximately 180 degrees. The state of the portable electronic device (200) can be defined as a folded (or closed) state when the angle between the two display areas (211, 221) is approximately 0 to 10 degrees. When the two display areas (211, 221) form an angle that is greater than the angle when folded and less than the angle when unfolded (e.g., between about 10 degrees and 179 degrees), the state of the portable electronic device (200) can be defined as an intermediate state (in other words, a partially folded or partially unfolded state) as illustrated in FIG. 2e.

[0080] Based on the state of the portable electronic device (200), an active area on which visual information (e.g., text, images, or icons) will be displayed on the display (299) may be determined. For example, when the electronic device (200) is in an intermediate state, the active area may be determined as the first display area (211) or the second display area (221). An area with relatively less movement among the first display area (211) and the second display area (221) may be determined as the active area. For example, when a user holds the housing of the electronic device (200) with one hand and opens another housing with a finger (e.g., thumb) of the same hand or with the other hand, the electronic device (200) may transition from a folded state to an intermediate state, and accordingly, the electronic device (200) may determine the display area of ​​the held housing (e.g., a housing with relatively less movement) as the active area. When the portable electronic device (200) is in an unfolded state, the entire area of ​​the display (299) (e.g., both the first display area (211) and the second display area (221)) can be determined as the active area.

[0081] According to various embodiments, the first housing (210) may, in an unfolded state, include a first surface (first display area) (211) facing a first direction (e.g., front direction) (z-axis direction) and a second surface (212) facing a second direction (e.g., rear direction) (-z-axis direction) opposite to the first surface (211). The second housing (220) may, in an unfolded state, include a third surface (second display area) (221) facing a first direction (e.g., z-axis direction) and a fourth surface (222) facing a second direction (e.g., -z-axis direction). The electronic device (200) can be operated in such a way that, in an unfolded state, the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) face the same first direction (e.g., z-axis direction), and in a folded state, the first surface (211) and the third surface (221) face each other. The electronic device (200) can be operated in such a way that, in an unfolded state, the second surface (212) of the first housing (210) and the fourth surface (222) of the second housing (220) face the same second direction (- z-axis direction), and in a folded state, the second surface (212) and the fourth surface (222) face each other in opposite directions.

[0082] According to various embodiments, the first housing (210) may include a first side frame (213) that at least partially forms an exterior of the electronic device (200) and a first rear cover (214) that is coupled with the first side frame (213) and forms at least a portion of a second side (212) of the electronic device (200). In one embodiment, the first side frame (213) may include a first side surface (213a), a second side surface (213b) that extends from one end of the first side surface (213a), and a third side surface (213c) that extends from the other end of the first side surface (213a). In one embodiment, the first side frame (213) may be formed into a rectangular (e.g., square or rectangular) shape through the first side surface (213a), the second side surface (213b), and the third side surface (213c).

[0083] A portion of the first side frame (213) may be formed of a conductor. For example, referring to FIG. 2b, a part of the first side (213a) (ⓕ), a part of the second side (213b) (ⓓ) and a part of the third side (213c) (ⓔ) may be formed of a metal material. The conductor may be electrically connected to a grip sensor (not shown) disposed adjacent to the conductor in the internal space of the first housing (210). The processor measures the capacitance formed between the conductor and the ground (e.g., the ground of the main printed circuit board) through the grip sensor, and based on the measured capacitance value, recognizes that a dielectric (e.g., a finger, a palm, a face) is close to (or in contact with) the first housing (210) and a place in the first housing (210) that is in contact with the dielectric (e.g., the first side (213a), the second side (213b), the third side (213c)).

[0084] According to various embodiments, the second housing (220) may include a second side frame (223) that at least partially forms an exterior of the electronic device (200) and a second rear cover (224) that is coupled to the second side frame (223) and forms at least a portion of a fourth side (222) of the electronic device (200). In one embodiment, the second side frame (223) may include a fourth side (223a), a fifth side (223b) that extends from one end of the fourth side (223a), and a sixth side (223c) that extends from the other end of the fourth side (223a). In one embodiment, the second side frame (223) may be formed into a rectangular shape through the fourth side (223a), the fifth side (223b), and the sixth side (223c).

[0085] A part of the second side frame (223) may be formed of a conductor. For example, referring to FIG. 2B, a part of the fourth side (223a) (ⓑ), a part of the fifth side (223b) (ⓐ) and a part of the sixth side (223c) (ⓒ) may be formed of a metal material. The conductor may be electrically connected to a grip sensor (not shown) disposed adjacent to the conductor in the internal space of the second housing (220). The processor may measure the capacitance formed between the conductor and the ground (e.g., the ground of the main printed circuit board) through the grip sensor, and based on the measured capacitance value, may recognize that the dielectric is close to (or in contact with) the second housing (220) and a place in the second housing (220) that is in contact with the dielectric (e.g., the fourth side (223a), the fifth side (223b), the sixth side (223c)).

[0086] According to various embodiments, the pair of housings (210, 220) are not limited to the illustrated shapes and combinations, and may be implemented by other shapes or combinations and / or combinations of parts. For example, the first side frame (213) may be formed integrally with the first rear cover (214), and the second side frame (223) may be formed integrally with the second rear cover (224).

[0087] According to various embodiments, the first rear cover (214) and the second rear cover (224) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0088] According to various embodiments, the electronic device (200) may include a first protective cover (215) (e.g., a first protective frame or a first decorative member) coupled along an edge of the first housing (210). The electronic device (200) may include a second protective cover (225) (e.g., a second protective frame or a second decorative member) coupled along an edge of the second housing (220). According to one embodiment, the first protective cover (215) and the second protective cover (225) may be formed of a metal or polymer material.

[0089] According to various embodiments, the electronic device (200) may include a sub-display (231) that is arranged separately from the display (299). According to one embodiment, the sub-display (231) is arranged to be at least partially exposed on the second side (212) of the first housing (210), so that when in a folded state, it can display status information of the electronic device (200). According to one embodiment, the sub-display (231) may be arranged to be visible from the outside through at least a portion of the first rear cover (214). In some embodiments, the sub-display (231) may be arranged on the fourth side (222) of the second housing (220). In this case, the sub-display (231) may be arranged to be visible from the outside through at least a portion of the second rear cover (224).

[0090] According to various embodiments, the electronic device (200) may include at least one of an input device (203), an audio output device (201, 202), a camera module (205, 208), a key input device (206), a connector port (207), and a sensor module (not shown). In one embodiment, the sensor module (e.g., the sensor module (176) of FIG. 1) and the camera (205) may be positioned below the display (299) when viewed from the front.

[0091] According to various embodiments, the electronic device (200) may be operated to maintain an intermediate state via the hinge assembly (240). In this case, the electronic device (200) may control the display (299) to display different contents on the display area corresponding to the first side (211) and the display area corresponding to the third side (221).

[0092] Referring to FIG. 2F, an electronic device (200) according to various embodiments may include a first side frame (213), a second side frame (223), and a hinge assembly (240) rotatably connecting the first side frame (213) and the second side frame (223). According to one embodiment, the electronic device (200) may include a first support plate (2131) extending at least partially from the first side frame (213), and a second support plate (2231) extending at least partially from the second side frame (223). According to one embodiment, the first support plate (2131) may be formed integrally with the first side frame (213) or structurally coupled with the first side frame (213). Similarly, the second support plate (2231) may be formed integrally with the second side frame (223) or structurally coupled with the second side frame (223). According to one embodiment, the electronic device (200) may include a display (299) arranged to be supported by a first support plate (2131) and a second support plate (2231). According to one embodiment, the electronic device (200) may include a first rear cover (214) coupled with a first side frame (213) and providing a first space between the first support plate (2131) and a second rear cover (224) coupled with a second side frame (223) and providing a second space between the second support plate (2231). In some embodiments, the first side frame (213) and the first rear cover (214) may be formed integrally. In some embodiments, the second side frame (223) and the second rear cover (224) may be formed integrally. According to one embodiment, the electronic device (200) may include a first housing (210) provided through a first side frame (213), a first support plate (2131), and a first rear cover (214).According to one embodiment, the electronic device (200) may include a second housing (220) provided through a second side frame (223), a second support plate (2231), and a second rear cover (224).

[0093] Although not shown, the hinge assembly (240) may include a first arm structure coupled to a first housing (210) (e.g., a first support plate (2131)), a second arm structure coupled to a second housing (220) (e.g., a second support plate (2231)), and a detent structure that physically contacts the first arm structure and the second arm structure such that the first housing (210) and the second housing (220) have a resistance to rotation. The foldable housing (210, 220) may have a resistance to rotation due to a contact force of the detent structure (e.g., a force pushing the first arm structure and the second arm structure).

[0094] According to various embodiments, the electronic device (200) may include a first substrate assembly (261) (e.g., a main printed circuit board), a camera assembly (263), a first battery (271), or a first bracket (251) disposed in a first space between a first side frame (213) and a first rear cover (214). In one embodiment, the camera assembly (263) may include a plurality of cameras (e.g., camera modules (205, 208) of FIGS. 2A and 2C) and may be electrically connected to the first substrate assembly (261). In one embodiment, the first bracket (251) may provide a support structure and enhanced rigidity for supporting the first substrate assembly (261) and / or the camera assembly (263). According to one embodiment, the electronic device (200) may include a second substrate assembly (262) (e.g., a sub-printed circuit board), an antenna (290) (e.g., a coil member), a second battery (272), or a second bracket (252) disposed in a second space between the second side frame (223) and the second rear cover (224). According to one embodiment, the electronic device (200) may include a wiring member (280) (e.g., a flexible printed circuit board (FPCB)) disposed to extend from the first substrate assembly (261) across the hinge assembly (240) to a plurality of electronic components (e.g., the second substrate assembly (262), the second battery (272), or the antenna (290)) disposed between the second side frame (223) and the second rear cover (224) and to provide an electrical connection.

[0095] According to various embodiments, the electronic device (200) may include a hinge cover (241) that supports the hinge assembly (240) and is positioned so as to be exposed to the outside when the electronic device (200) is in a folded state and is introduced into the first space and the second space when the electronic device (200) is in an unfolded state, thereby being invisible from the outside.

[0096] According to various embodiments, the electronic device (200) may include a first protective cover (215) coupled along an edge of the first side frame (213). According to one embodiment, the electronic device (200) may include a second protective cover (225) coupled along an edge of the second side frame (223). In the display (299), an edge of the first display area (211) may be protected by the first protective cover (215). An edge of the second display area (221) may be protected by the second protective cover (225). A protective cap (235) may be disposed in an area corresponding to the hinge assembly (240) to protect a portion of the edge of the display (299) that is bent.

[0097] FIG. 3A is a plan view of an electronic device (300) according to various embodiments of the present invention.

[0098] FIG. 3b is a cross-sectional view of an electronic device (300) according to various embodiments of the present invention.

[0099] FIG. 3c is a cross-sectional view showing a first heat dissipation member (320a) according to various embodiments of the present invention.

[0100] FIG. 3d is a cross-sectional view showing a first heat dissipation member (320a) according to various embodiments of the present invention.

[0101] The cross-section of Fig. 3b is a cross-section taken along the AA direction of Fig. 3a.

[0102] Referring to FIGS. 3A and 3B , the electronic device (300) may include at least one housing (302) (e.g., the first housing (210) and the second housing (220) of FIGS. 2A to 2F ), a substrate portion (310) (e.g., the first substrate assembly (261)), and a heat dissipation member (320). The housing may include a frame (303). The frame (303) may be a member that reinforces the structural rigidity of the housing, supports components inside the electronic device (300), and dissipates heat generated in the electronic device (300). The frame (303) may have a first surface facing a first direction (e.g., the z direction in the drawing) and a second surface facing a second direction (e.g., the -z direction in the drawing) opposite to the first surface. In various embodiments, the material of the frame (303) may be a metal material including, for example, aluminum or an alloy thereof. In various embodiments, a display (301) (e.g., a display module (160) of FIG. 1, a display (299) of FIGS. 2A to 2F) may be positioned in a first direction of the frame (303), and a substrate (310) and a rear plate (304) may be positioned in a second direction.

[0103] The substrate portion (310) may be a portion including a circuit board (310a) on which various electrical components of the electronic device (300) (e.g., a processor (120), a memory (130), an audio output module (155), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), or an antenna module (197) of FIG. 1) are disposed or electrically connected. In various embodiments, the substrate portion (310) may include at least one circuit board (310a) and an interposer (310b) that interconnects the circuit boards (310a). In various embodiments, the substrate portion (310) may be positioned to face the display (301).

[0104] In various embodiments, the substrate (310) may include a heat source (311). The heat source (311) may include various circuit elements that consume power and generate heat, such as a processor (e.g., an application processor (AP) (311a)), a communication modem, and a power management IC of the electronic device (300). In various embodiments, the substrate (310) may include a shield can (314) that at least partially surrounds the heat source (311), such as the AP (311a), and suppresses electromagnetic interference (EMI) from the heat source (311) and its surroundings.

[0105] The heat dissipation member (320) may be a member that suppresses the temperature rise of the electronic device (300) caused by the heat of the heat source (311) by diffusing the heat generated from the heat source (311) through heat transfer. In various embodiments, the heat dissipation member (320) may include a heat-conductive material having high thermal conductivity, such as metal, graphite, carbon fiber, carbon nanotube, ceramic, and / or diamond. In various embodiments, the heat dissipation member (320) may have a composite material in which the above-described heat-conductive material is mixed, dispersed, and / or oriented in a paste, polymer film, and / or elastomer matrix. In various embodiments, the heat dissipation member (320) may receive heat from the heat source (311) by directly contacting the heat source (311) or indirectly via a member such as a thermal interface material (315) therebetween. The thermal interface material (315) may include, for example, thermal paste (315a) and / or a conductive heat transfer film (315b) (e.g., nano TIM). The conductive heat transfer film (315b) may transfer heat from the heat source (311) and block EMI generated from or introduced into the heat source (311).

[0106] In various embodiments, the electronic device (300) may include a heat dissipation member (320) (e.g., a first heat dissipation member (320a) and a second heat dissipation member (320b)). The first heat dissipation member (320a) may be positioned between the display (301) and the substrate (310), and the second heat dissipation member (320b) may be positioned between the substrate (310) and the first heat dissipation member (320a). For example, the first heat dissipation member (320a) may be positioned on a first surface of the frame (303), and the second heat dissipation member (320b) may be positioned between the heat source (311) and the frame (303) (e.g., a second surface of the frame (303)). The first heat dissipation member (320a) may be a member for effectively dissipating heat transferred from the heat source (311) through the frame (303) to the outside of the electronic device (300). The second heat dissipation member (320b) may be a member for effectively dissipating heat of the electronic device (300) to the outside by dissipating heat transferred from the heat source (311) to a wider range of the frame (303). In various embodiments, the electronic device (300) may include a laminated heat dissipation member (320) laminated between the second heat dissipation member (320b) and the heat source (311).

[0107] Referring to FIGS. 3b to 3d, the first heat dissipation member (320a) may include a first insulator (321). The first insulator (321) may be disposed in an area including an area overlapping with a heat source (311) within the electronic device (300) with respect to a first direction (e.g., the z-axis direction in the drawing). For example, the first insulator (321) may be disposed in an area including an area overlapping with the first heat source (311) in the first heat dissipation member (320a) and a periphery of the area.

[0108] The second heat dissipation member (320b) may include a second insulator (322). The second insulator (322) may be disposed in an area that at least partially overlaps the heat source (311) within the electronic device (300) with respect to the first direction (e.g., the z-axis direction in the drawing). For example, the second insulator (322) may be disposed in an area that overlaps the first heat source (311) in the second heat dissipation member (320b). In various embodiments, the second insulator (322) may have a shape corresponding to a planar shape (e.g., an xy plane in the drawing) of the heat source (311). For example, when the heat source (311) (e.g., AP (311a)) is a square, the second insulator (322) may have a square shape that is substantially the same as the square.

[0109] In various embodiments, the first insulator (321) may have a shape corresponding to the plane (e.g., xy plane in the drawing) shape of the heat source (311). For example, when the heat source (311) (e.g., AP (311a)) is a square, the first insulator (321) may have a square shape that is substantially similar to the square.

[0110] In various embodiments, the second insulator (322) may have substantially the same area as the heat source (311). For example, the width (W2) of the second insulator (322) may be substantially the same as the width (W3) of the heat source (311). If the area of ​​the second insulator (322) is excessively large compared to the area of ​​the heat source (311), the heat flow from the heat source (311) to the surface of the electronic device (300) is excessively restricted, thereby reducing the heat dissipation performance of the electronic device (300), causing the temperature of the heat source (311) (e.g., AP (311a)) to excessively rise, and the performance of the electronic device (300) may be reduced due to throttling caused by this. If the area of ​​the second insulator (322) is too narrow compared to the heat source (311), the heat dissipation effect by the first insulator (321) and the second insulator (322) described later may be reduced.

[0111] In various embodiments, the first insulator (321) may have a larger area than the second insulator (322). For example, the width (W1) of the first insulator (321) may be larger than the width (W2) of the second insulator (322). The effect of this will be described later.

[0112] Fig. 4a is a cross-sectional view of an electronic device (3) according to a comparative example.

[0113] Fig. 4b is a plan view showing the heat distribution of an electronic device (3) according to a comparative example.

[0114] FIG. 4c is a cross-sectional view of an electronic device (300) according to various embodiments of the present invention.

[0115] FIG. 4d is a plan view showing the heat distribution of an electronic device (300) according to various embodiments of the present invention.

[0116] The electronic device (3) of the comparative example is an electronic device (300) that does not include a first insulator (321) and a second insulator (322).

[0117] Referring to FIGS. 4a and 4b, heat (H) generated from the heating element (31) of the electronic device (3) of the comparative example is transferred in the first direction (z-axis direction) through the heat dissipation member (32) and the frame (33), so that the heat can be concentrated on a relatively narrow area of ​​the surface of the electronic device (3) that overlaps with the heating element. Accordingly, a high-temperature area (4) can be formed on a specific area of ​​the surface of the electronic device (3).

[0118] Referring to FIGS. 4C and 4D , heat (H) generated from the heating element reaches the second insulator (322), and is suppressed from transferring heat in the first direction (e.g., the z direction) by the second insulator (322), and is promoted to spread in a direction substantially perpendicular to the first direction (e.g., a direction parallel to the xy plane), so that the heat can be transferred to a wider area of ​​the frame (303). The heat transferred to the frame (303) is suppressed from transferring heat in the first direction by the first insulator (321), and is further spread in a direction substantially perpendicular to the first direction, so that the heat can be transferred to a wider area. Therefore, it is possible to reduce or prevent heat from being concentrated in a specific area of ​​the electronic device (300). Accordingly, compared to the comparative example of FIG. 4b, it can be seen that the embodiment of the present invention of FIG. 4d has a relatively large area of ​​a region (400) with a relatively high temperature on the surface of the electronic device (300), and the maximum temperature on the surface of the electronic device (300) is lowered.

[0119] In various embodiments, the first heat dissipation member (320a) and the second heat dissipation member (320b) may include an anisotropic heat transfer material. The anisotropic heat transfer material may be a material whose thermal conductivity varies depending on the direction. The anisotropic heat transfer material may include, for example, a material such as graphite having a relatively high thermal conductivity in a direction parallel to the crystal plane and / or carbon fibers and / or carbon nanotubes having a relatively high thermal conductivity in the direction of the fiber axis. In various embodiments, the first heat dissipation member (320a) and the second heat dissipation member (320b) may include a graphite sheet including graphite that is at least partially oriented such that the primary heat transfer direction is substantially in the planar direction. In various embodiments, the first heat dissipation member (320a) and the second heat dissipation member (320b) may include, for example, a carbon fiber pad or carbon nanotube pad that is oriented and / or woven such that the direction of the fibers is in the planar direction. The anisotropic heat transfer material can improve thermal conductivity in a direction perpendicular to the first direction (the thickness direction of the electronic device (300), for example, the z direction in the drawing) of the first heat dissipation member (320a) and the second heat dissipation member (320b) (the surface direction of the electronic device (300), for example, the direction parallel to the xy plane in the drawing). Accordingly, the heat of the heat source (311) can be spread to a wider area of ​​the electronic device (300), thereby improving the heat dissipation performance of the electronic device (300) and lowering the surface temperature.

[0120] FIG. 5a is a schematic diagram showing a heat dissipation member (320) of an electronic device (300) according to various embodiments.

[0121] FIG. 5b is a schematic diagram showing heat transfer of a heat dissipation member (320) of an electronic device (300) according to various embodiments.

[0122] FIG. 5c is an enlarged cross-sectional view of an electronic device (300) according to various embodiments.

[0123] Figure 5c is an enlarged view of area B of Figure 3b.

[0124] In various embodiments, the insulation of the heat dissipation member (320) may include a plurality of insulation layers (3211, 3212, 3221, 3222). For example, referring to FIGS. 5A and 5B, the first insulation (321) of the first heat dissipation member (320a) may include a first insulation layer (3211) and a second insulation layer (3212). In various embodiments, the second insulation layer (3212) may be positioned to at least partially overlap the first insulation layer (3211) at a lower portion (e.g., in the -z direction) of the first insulation layer (3211). In various embodiments, the heat dissipation member (320) may include at least one thermally conductive layer (323a, 323b) positioned between the plurality of insulation layers (3211, 3212, 3221, 3222). For example, the first heat dissipation member (320a) may include a first heat-conducting layer (323a) positioned between the first insulation layer (3211) and the second insulation layer (3212). Referring to FIG. 5b, the heat-conducting layers (323a, 323b) may transfer heat from one edge of the plurality of insulation layers (3211, 3212, 3221, 3222) to the other edge in the plane direction of the heat dissipation member (320a, 320b) (e.g., a direction parallel to the xy plane).

[0125] In various embodiments, the plurality of insulating layers (3211, 3212, 3221, 3222) may sequentially increase in area in the first direction (e.g., the z-direction in the drawing). For example, the area (e.g., width (W11)) of the first insulating layer (3211) may be larger than the area (e.g., width (W12)) of the second insulating layer (3212).

[0126] Referring to FIG. 5b, the heat conducting layers (323a, 323b) enhance the transfer of heat from one side of the insulator to the other, thereby preventing uneven concentration of heat around the insulator. In addition, heat transferred from the heat source (311) is primarily distributed by the first insulation layer (3211) and then further distributed by the second insulation layer (3212), thereby allowing the heat of the heating element to be gradually distributed over a wider range.

[0127] In various embodiments, the second insulator (322) of the second heat dissipation member (320b) may also include a plurality of insulation layers (3211, 3212, 3221, 3222) (e.g., a third insulation layer (3221) and a fourth insulation layer (3222)), and the second heat dissipation member (320b) may include a second heat-conductive layer (323b), and reference may be made to the above description of the first heat dissipation member (320a) and the first insulator (321) unless otherwise contradictory.

[0128] Referring to FIG. 5c, the first insulator (321) and the second insulator (322) may include a plurality of insulating layers (3211, 3212, 3221, 3222) laminated in the first direction (z-axis direction). For example, the first insulator (321) may include a first insulating layer (3211) and a second insulating layer (3212), and the second insulator (322) may include a third insulating layer (3221) and a fourth insulating layer (3222). The first heat dissipation member (320a) and the second heat dissipation member (323b) may include a plurality of heat conductive layers (323a, 323b) alternately laminated between the plurality of insulating layers (3211, 3212, 3221, 3222). For example, the first heat dissipation member (320a) may include a first heat-conducting layer (323a) disposed between a first insulation layer (3211) and a second insulation layer (3212), and the second heat dissipation member (320b) may include a second heat-conducting layer (323b) disposed between a third insulation layer (3221) and a fourth insulation layer (3222). In various embodiments, the areas of the plurality of insulation layers (3211, 3212, 3221, 3222) may sequentially increase in the first direction. For example, the first insulation layer (3211) may have a larger area than the second insulation layer (3212), the second insulation layer (3212) may have a larger area than the third insulation layer (3221), and the third insulation layer (3221) may have a larger area than the fourth insulation layer (3222). In various embodiments, the fourth insulation layer (3222) may have substantially the same area as the heat source (311) (e.g., AP (311a)). The plurality of insulation layers (3211, 3212, 3221, 3222) with sequentially increasing areas can effectively distribute heat generated from the heat source (311) sequentially to a wider area of ​​the electronic device (300) in the first direction, thereby lowering the surface temperature of the electronic device (300) and effectively releasing heat from the heat source (311).In addition, the heat dissipation area can be increased without increasing the area of ​​the insulation layer (e.g., the fourth insulation layer (3222)) close to the heat source (311), so that the heat dissipation performance of the heat source (311) can be prevented or reduced from deteriorating as the area of ​​the insulation layer increases.

[0129] An electronic device (300) according to various embodiments of the present invention may include a display (301) arranged to display an image in a first direction of the electronic device (300), a substrate (301) arranged to face the display (301) in a second direction opposite to the first direction, the substrate (301) including a heat source (311) arranged on the substrate (301), a first heat dissipation member (320a) arranged between the display (301) and the substrate (301), and a second heat dissipation member (320b) arranged between the first heat dissipation member (320a) and the substrate (301). The first heat dissipation member (320a) may include a first insulator (321) arranged in an area including an area overlapping with the heat source (311) based on the first direction, and the second heat dissipation member (320b) may include a second insulator (322) arranged in an area overlapping at least partly with the heat source (311) based on the first direction.

[0130] In various embodiments, the second insulator (322) may have a shape corresponding to the planar shape of the heat source (311).

[0131] In various embodiments, the first insulator (321) may have a larger area than the second insulator (322).

[0132] In various embodiments, the first insulation (321) may include a first insulation layer (3211) and a second insulation layer (3212) arranged to overlap the first insulation layer (3211) at a lower portion of the first insulation layer (3211) with respect to the first direction.

[0133] In various embodiments, the first heat dissipation member (320a) may include a first heat conducting layer (323a) positioned between the first insulation layer (3211) and the second insulation layer (3212).

[0134] In various embodiments, the first insulating layer (3211) may have a larger area than the second insulating layer (3212).

[0135] In various embodiments, the second insulation (322) may include a third insulation layer (3221) and a fourth insulation layer (3222) arranged to overlap the third insulation layer (3221) at a lower portion of the third insulation layer (3221) with respect to the first direction.

[0136] In various embodiments, the second heat dissipation member (320b) may include a second heat conducting layer (323b) positioned between the third insulation layer (3221) and the fourth insulation layer (3222).

[0137] In various embodiments, the third insulating layer (3221) may have a larger area than the fourth insulating layer (3222).

[0138] In various embodiments, the first insulator (321) and the second insulator (322) include a plurality of insulating layers (3211, 3212, 3221, 3222) laminated in the first direction, and the first heat dissipation member (320a) and the second heat dissipation member (320b) include at least one heat conducting layer (323a, 323b) positioned between the plurality of insulating layers (3211, 3212, 3221, 3222) and alternately laminated with the plurality of insulating layers (3211, 3212, 3221, 3222), and the plurality of insulating layers (3211, 3212, 3221, 3222) may be arranged such that their areas sequentially increase as they go in the first direction.

[0139] In various embodiments, the electronic device (300) further includes a frame (303) having a first surface facing the display (301) and a second surface facing the substrate (310), and the first heat dissipation member (320a) may be disposed on the first surface of the frame (303), and the second heat dissipation member (320b) may be disposed on the second surface of the frame (303).

[0140] In various embodiments, the first insulator (321) and the second insulator (322) may be configured to transfer heat in a direction perpendicular to the first direction.

[0141] In various embodiments, the first insulator (321) and the second insulator (322) may include an anisotropic heat transfer material whose heat conduction direction is at least partially oriented perpendicular to the first direction.

[0142] In various embodiments, the anisotropic heat transfer material may comprise graphite.

[0143] A heat dissipation member (320) according to various embodiments of the present invention is a heat dissipation member (320) of an electronic device (300), wherein the electronic device (300) may include a display (301) arranged to display an image in a first direction of the electronic device (300), and a substrate (301) arranged to face the display (301) in a second direction opposite to the first direction, and a heat source (311) arranged on the substrate (301). The heat dissipation member may include a first heat dissipation member (320a) arranged between the display (301) and the substrate (301), and a second heat dissipation member (320b) arranged between the first heat dissipation member (320a) and the substrate (301). The first heat dissipation member (320a) may include a first insulator (321) arranged in an area including an area overlapping with the heat source (311) based on the first direction, and the second heat dissipation member (320b) may include a second insulator (322) arranged in an area overlapping at least partly with the heat source (311) based on the first direction.

[0144] In various embodiments, the second insulator (322) may have a shape corresponding to the planar shape of the heat source (311).

[0145] In various embodiments, the first insulator (321) may have a larger area than the second insulator (322).

[0146] In various embodiments, the first insulator (321) and the second insulator (322) include a plurality of insulating layers (3211, 3212, 3221, 3222) laminated in the first direction, and the first heat dissipation member (320a) and the second heat dissipation member (320b) include at least one heat conducting layer (323a, 323b) positioned between the plurality of insulating layers (3211, 3212, 3221, 3222) and alternately laminated with the plurality of insulating layers (3211, 3212, 3221, 3222), and the plurality of insulating layers (3211, 3212, 3221, 3222) may be arranged such that their areas sequentially increase as they go in the first direction.

[0147] In various embodiments, the electronic device (300) further includes a frame (303) having a first surface facing the display (301) and a second surface facing the substrate (310), and the first heat dissipation member (320a) may be disposed on the first surface of the frame (303), and the second heat dissipation member (320b) may be disposed on the second surface of the frame (303).

[0148] In various embodiments, the first insulator (321) and the second insulator (322) may be configured to transfer heat in a direction perpendicular to the first direction.

[0149] In various embodiments, the first insulator (321) and the second insulator (322) may include an anisotropic heat transfer material whose heat conduction direction is at least partially oriented perpendicular to the first direction.

[0150] In various embodiments, the anisotropic heat transfer material may comprise graphite.

[0151] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, A display arranged to display an image in a first direction of the electronic device; A substrate portion arranged to face the display in a second direction opposite to the first direction, the substrate portion including a heat source arranged on the substrate portion; A first heat dissipation member disposed between the display and the substrate; and Including a second heat dissipation member arranged between the first heat dissipation member and the substrate portion, The first heat dissipation member includes a first insulator arranged in an area including an area overlapping the heat source with respect to the first direction, An electronic device wherein the second heat dissipation member includes a second insulator arranged in an area that at least partially overlaps the heat source with respect to the first direction.

2. In paragraph 1, An electronic device wherein the second insulator has a shape corresponding to the planar shape of the heat source.

3. In paragraph 1, An electronic device wherein the first insulator has a larger area than the second insulator.

4. In paragraph 1, An electronic device wherein the first insulation layer comprises a first insulation layer and a second insulation layer arranged to overlap the first insulation layer at a lower portion of the first insulation layer with respect to the first direction.

5. In paragraph 4, An electronic device wherein the first heat dissipation member includes a first heat conducting layer positioned between the first insulating layer and the second insulating layer.

6. In paragraph 4, An electronic device wherein the first insulating layer has a larger area than the second insulating layer.

7. In paragraph 1, An electronic device wherein the second insulation layer comprises a third insulation layer and a fourth insulation layer arranged to overlap the third insulation layer at a lower portion of the third insulation layer with respect to the first direction.

8. In paragraph 7, An electronic device wherein the second heat dissipation member includes a second heat conducting layer positioned between the third insulating layer and the fourth insulating layer.

9. In paragraph 7, An electronic device wherein the third insulating layer has a larger area than the fourth insulating layer.

10. In paragraph 1, Further comprising a frame having a first side facing the display and a second side facing the substrate, The above first heat dissipation member is arranged on the first surface of the frame, An electronic device wherein the second heat dissipation member is disposed on the second surface of the frame.

11. In paragraph 1, The above first insulator and the above second insulator, An electronic device comprising an anisotropic heat transfer material having a heat conduction direction at least partially oriented perpendicular to the first direction, and configured to transfer heat in a direction perpendicular to the first direction.

12. As a heat dissipation member of an electronic device, said electronic device, a display arranged to display an image in a first direction of the electronic device; and A substrate portion arranged to face the display in a second direction opposite to the first direction, comprising a substrate portion including a heat source arranged on the substrate portion, The above heat dissipation member is, A first heat dissipation member disposed between the display and the substrate; and Including a second heat dissipation member arranged between the first heat dissipation member and the substrate portion, The first heat dissipation member includes a first insulator arranged in an area including an area overlapping the heat source with respect to the first direction, A heat dissipation member including a second insulator arranged in an area that at least partially overlaps the heat source with respect to the first direction.

13. In paragraph 12, The above second insulator is a heat-radiating member having a shape corresponding to the planar shape of the heat source.

14. In paragraph 12, The above first insulator is a heat-radiating member having a larger area than the above second insulator.

15. In paragraph 12, The above electronic device, Further comprising a frame having a first side facing the display and a second side facing the substrate, The above first heat dissipation member is arranged on the first surface of the frame, The second heat dissipation member is a heat dissipation member disposed on the second surface of the frame.

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