Portable skin cooling apparatus

Abstract

A portable skin cooling apparatus, comprising: a housing (100), a cavity being provided in the housing (100); an electric heating element (200), fixed in the cavity of the housing (100), the electric heating element (200) being provided with a refrigeration surface; a cooling head (300), embedded in a surface of the housing (100), the cooling head (300) being connected to the refrigeration surface of the electric heating element (200); a power supply (400), located in the housing (100), the power supply (400) being used for supplying power to the electric heating element (200); and a PCB (500), located in the housing (100), the PCB (500) being connected to the electric heating element (200) and the power supply (400). The electric heating element (200) is used for refrigeration, the PCB (500) is provided with a central control module, the central control module is used for controlling a refrigeration temperature of the electric heating element (200), and the cooling head (300) is used for being in contact with the skin to apply a cold compress.

Description

A portable skin cooling device Technical Field

[0001] The invention belongs to the technical field of cold compress instruments and relates to a portable skin cooling device. Background Art

[0002] Traditional methods of treating skin conditions and relieving itching involve medications, steroids, hand creams, and lotions. These methods are slow, cumbersome, and can cause various side effects. Cold therapy is a natural, non-drug technique for relieving itching. When the skin is subjected to a harmless cold stimulus, the cold activates temperature-sensitive cells, thereby reducing itching. Studies have shown that heat increases itching, while cold can relieve itching. The cold stimulus needs to be intense to effectively reduce irritation, inflammation, pain, and itch. The cold temperature numbs nerves and reduces blood flow to the area, thereby reducing itching and pain. Ice can also reduce swelling and discomfort associated with various rashes or allergy symptoms.

[0003] However, current cold compresses typically use ice or ice packs. These must be prepared and stored in a container, making them difficult to use immediately. Ice is too cold to be applied directly to the skin, posing a risk of frostbite. Furthermore, ice / ice packs are prone to condensation and melting when exposed to the atmosphere, making them extremely inconvenient to use. Summary of the Invention

[0004] The purpose of the present invention is to address the deficiencies of the existing technology and provide a portable skin cooling device that uses electric heating elements to cool and apply ice to relieve itching, reduce pain and inflammation, reduce the risk of frostbite, and is easy to use and carry.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A portable skin cooling device comprising:

[0007] a housing, wherein a cavity is provided in the housing;

[0008] An electric heating element is fixed in the cavity of the housing, and the electric heating element is provided with a cooling surface;

[0009] A cooling head is embedded in the surface of the shell, and the cooling head is connected to the cooling surface of the electric heating element;

[0010] A power supply is located in the housing and is used to supply power to the electric heating element;

[0011] A PCB board is located in the housing and is connected to the electric heating element and the power supply respectively;

[0012] The electric heating element is used for cooling, the PCB board is provided with a central control module, the central control module is used to control the cooling temperature of the electric heating element, and the cooling head is used to contact the skin for ice compress.

[0013] Furthermore, the electric heating element includes a TEC semiconductor cooler.

[0014] Furthermore, the electric heating element is composed of a plurality of TEC semiconductor coolers with hot and cold surfaces alternately stacked or arranged in a planar array.

[0015] Furthermore, it also includes a refrigeration temperature sensor, which is located in the shell and connected to the PCB board. The refrigeration temperature sensor is used to monitor the temperature data of the cooling head and feed it back to the central control module.

[0016] Furthermore, a heat dissipation module is provided in the shell, the electric heating element includes a cooling surface and a heating surface, and the heat dissipation module is connected to the heating surface.

[0017] Furthermore, the heat dissipation module includes a heat absorption tube, and a phase change material is sealed in the heat absorption tube.

[0018] Furthermore, it also includes a heat dissipation temperature sensor, which is fixed in the shell and connected to the central control module. The heat dissipation temperature sensor is used to monitor the temperature of the heat dissipation module and feed back to the central control module.

[0019] Furthermore, it also includes a vibration motor, which is fixed in the shell and connected to the central control module.

[0020] Furthermore, it also includes LED and radio frequency electrodes.

[0021] Furthermore, it also includes an electrotherapy electrode, which is fixed to the surface of the shell and connected to the central control module, and the electrotherapy electrode is used for electrotherapy.

[0022] The technical solution of the present invention has the following advantages over the prior art:

[0023] 1. Good skin cooling effect. Through the cooling surface and cooling head of the electric heating element, it can quickly reduce skin temperature, relieve discomfort and pain, and help reduce swelling and soothe the skin.

[0024] 2. Precise temperature control. The cooperation between the central control module and the refrigeration temperature sensor can accurately control the refrigeration temperature, avoid overcooling or insufficient cooling, and provide safe and effective cooling effects.

[0025] 3. The heat dissipation treatment is effective. Through the heat dissipation module and phase change material, it can effectively absorb and release heat, maintain a stable operating temperature of the device and heating elements, and improve service life and safety. It has a fanless design, no operating noise, and good waterproof and dustproof performance.

[0026] 4. Multifunctional application, the device provides the choice of light therapy and electrotherapy functions, which can meet the needs of different skin problems and provide more comprehensive treatment effects.

[0027] 5. The vibration motor increases comfort. The vibration motor in the device can provide massage and soothing effects, increasing the comfort during use and making the entire treatment process more pleasant.

[0028] Other features and advantages of the invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the invention. The purpose and other advantages of the invention can be realized and obtained through the structures particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be described in detail below with reference to the accompanying drawings to make the above advantages of the present invention more clear.

[0030] FIG1 is an exploded view of a portable skin cooling device according to the present invention;

[0031] FIG2 is a connection block diagram of a portable skin cooling device according to the present invention;

[0032] FIG3 is a schematic diagram of temperature control of a portable skin cooling device according to the present invention. DETAILED DESCRIPTION

[0033] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0036] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0037] Referring to Figures 1-3, a portable skin cooling device comprises:

[0038] A housing 100, wherein a cavity is provided in the housing 100;

[0039] The electric heating element 200 is fixed in the cavity of the housing 100 and is provided with a cooling surface;

[0040] A cooling head 300 is embedded in the surface of the housing 100 and is connected to the cooling surface of the electric heating element 200;

[0041] A power supply 400 is located in the housing 100 and is used to supply power to the electric heating element 200;

[0042] The PCB board 500 is located in the housing 100 and is connected to the electric heating element 200 and the power supply 400 respectively;

[0043] The electric heating element 200 is used for cooling, the PCB board 500 is provided with a central control module, the central control module is used to control the cooling temperature of the electric heating element 200, and the cooling head 300 is used to contact the skin for ice compress.

[0044] The power supply 400 is a DC power supply. When a cold compress is required, the power supply 400 is powered by the electric heating element 200. A power protection circuit on the PCB protects the power supply during charging. The electric heating element 200 cools the skin. By placing the cooling head 300 close to the skin, the electric heating element 200 continuously maintains a low temperature, compensating for rebound skin surface temperature and body temperature. This cooling effect stimulates the skin and constricts blood vessels and pores, thereby reducing blood flow and providing immediate and temporary relief and comfort to alleviate irritation, pain, or itching.

[0045] The cooling head 300 is made of a non-allergenic and highly thermally conductive material, such as stainless steel or titanium alloy. Because the cooling head 300 directly contacts the skin for cooling, a non-allergenic material is used to avoid allergic reactions in individuals with specific skin conditions. Furthermore, to optimize the user experience and ensure a more uniform cooling effect, a highly thermally conductive material is used to avoid issues such as uneven cooling or inefficient temperature transfer.

[0046] When applying a cold compress, you also need to consider the issue of avoiding frostbite. There are two ways to prevent frostbite. One is a constant power method. The electric heating element 200 is DC driven. The central control module controls the working current to be constant to achieve the purpose of constant power, so that the cooling capacity is slightly greater than the body's heat rebound, avoiding the cold compress temperature being too low to cause low-temperature frostbite. The other is a timing method. The timing unit on the PCB sets a time threshold for continuous cold compress. When the continuous working time reaches the threshold, the electric heating element 200 automatically cuts off the power to prevent the user from falling asleep during use, causing continuous cold compress to affect health.

[0047] The PCB's storage unit can be used to pre-program various control modes based on specific needs. This allows users to set the optimal ice application time and cooling power of the heating element 200° for relieving itching, pain, and swelling, making it easy for users to set and switch between different modes with just one click.

[0048] In this embodiment, the housing 100 is cylindrical, and the cooling head 300 is embedded at the end of the housing 100 for ease of grip. The cooling head 300 can also be of different shapes, including geometric shapes, circular, concave, convex, or roller forms. The cooling head 300 can be of different sizes and is suitable for various inflammations, relieving pain and itching, and promoting collagen production.

[0049] In this embodiment, the electric heating element 200 comprises a TEC (Technical Transistor Cooler). A TEC (Technical Transistor Cooler) is a device that cools or heats an object by transferring heat from one side of the device to the other. It utilizes a bismuth-antimony compound semiconductor element. When two dissimilar metals are connected, a voltage is generated. This current is then used to transfer heat from one side of the device to the other. This process, known as the Peltier effect, enables precise temperature control and reduces energy consumption compared to traditional methods. Compared to other cooling devices, TECs offer the following advantages:

[0050] 1. No need for refrigerant. TEC refrigeration unit does not require the use of traditional refrigerants. It is an environmentally friendly and sustainable refrigeration technology.

[0051] 2. High reliability. TEC cooling devices are made of semiconductor materials and have no moving parts, so they have high reliability. TEC is not easily damaged or malfunctions.

[0052] 3.TEC cooling units are relatively small and compact, making them suitable for small or portable equipment.

[0053] 4. Good control flexibility, TEC cooling device has fast response and precise temperature control characteristics. By adjusting the voltage or current, the cooling effect can be precisely controlled to meet different needs and treatment requirements.

[0054] 5. Low energy consumption. Compared with traditional refrigeration equipment, TEC refrigeration unit has lower energy consumption. It consumes energy only when cooling is needed, and does not require additional energy for circulating refrigerant, saving energy.

[0055] 6. Low noise. The TEC cooling device has no moving parts, so the noise level is low when working, which can provide a quieter and more comfortable cooling experience.

[0056] In this embodiment, the electric heating element 200 is composed of a plurality of TEC semiconductor coolers whose hot and cold surfaces are alternately stacked or arranged in a planar array.

[0057] TEC stacking increases the effectiveness and capacity of thermoelectric conversion by stacking multiple TECs together. The principle of TEC stacking is to connect multiple TEC modules together in a certain manner so that heat can be transferred between the TECs. Each TEC module has two contact surfaces: a cold surface and a hot surface. By stacking multiple TECs together, a structure with alternating cold and hot surfaces can be formed. In a TEC stack, when current passes through each TEC module, a heat difference is generated at each contact surface. This allows for a larger temperature difference and higher cooling or heating capacity. TEC stacking also provides greater thermoelectric conversion efficiency and a more precise temperature control range.

[0058] Planar Array: Planar array placement involves arranging multiple TEC modules on a plane, forming a two-dimensional array structure. Each TEC module typically has only one contact surface: either the cold or hot side. Planar array placement is suitable for applications requiring a larger cooling surface.

[0059] This embodiment also includes a refrigeration temperature sensor, which is located in the housing 100 and connected to the PCB board 500. The refrigeration temperature sensor is used to monitor the temperature data of the cooling head 300 and feed it back to the central control module. Because the cooling head 300 is a component that is in direct contact with the skin, there is heat conduction between the cooling head 300 and the electric heating element 200. For temperature control, there is a certain delay, so the accuracy and response speed of temperature control. In order to improve the safety of ice compresses and the accuracy of temperature control, the temperature of the cooling head 300 is directly monitored by the refrigeration temperature sensor. The central control module can control the power of the electric heating element 200 in real time according to the data feedback from the refrigeration temperature sensor to achieve the purpose of constant temperature control, avoid the situation of sudden changes in temperature, and ensure the user experience.

[0060] Based on the feedback from the cold temperature sensor, the central control module can control the working mode of the cooling temperature sensor through pulse control. When the device is first started, in order to make the cooling head 300 reach the preset ice compress temperature more quickly, the proportion of the pulse on time in the pulse control is increased. The control pulse is adjusted in real time based on the feedback from the cold temperature sensor. Pulse period t o The initial cooling time is t on , the adjustment time is Δt. If the real-time temperature is higher than the threshold temperature, Δt is a positive number; if the real-time temperature is lower than the threshold temperature, Δt is a negative number.

[0061] In this embodiment, a digital display device is provided on the surface of the housing 100, which is connected to the central control module and can be used to display the real-time temperature of the cooling head 300 and the remaining power of the power supply 400, so that the user can easily understand the cooling status of the cooling head 300.

[0062] In this embodiment, a heat dissipation module is provided in the housing 100, and the electric heating element 200 includes a cooling surface and a heating surface, and the heat dissipation module is connected to the heating surface. The TEC semiconductor refrigerator is a device that transfers heat from one side of the device to the other side to cool or heat an object. Therefore, during the instruction process, the other side of the cooling surface of the TEC is the heating surface. The cooling principle is to pass an electric current through the P-type and N-type semiconductor materials connected on both sides, so that one side absorbs heat and the other side dissipates heat, thereby achieving a cooling effect. During the TEC cooling process, the heat dissipation on the other side will affect the cooling effect. This is because the cooling effect of the TEC is achieved by transferring heat from one side to the other side. If the other side cannot effectively dissipate heat, heat will accumulate inside the TEC, resulting in a decrease in the temperature difference and a weakening of the cooling effect.

[0063] Therefore, in order to ensure the cooling effect of TEC, it is necessary to ensure that the other side can effectively dissipate heat.

[0064] This can be achieved by using a heat sink, fan or other cooling device to increase the heat dissipation surface area and improve the heat dissipation efficiency. In addition, you can also consider optimizing the selection of heat dissipation materials and the treatment of the contact surface to improve the heat dissipation effect.

[0065] In this embodiment, the heat dissipation module includes a heat absorbing tube 600, and a phase change material is sealed inside the heat absorbing tube 600. There are many conventional heat dissipation solutions, such as using a radiator, fan or other cooling device to increase the heat dissipation surface area and improve the heat dissipation efficiency.

[0066] This embodiment also includes a heat pipe, which is a heat dissipation element that uses the phenomenon of absorbing heat energy when liquid turns into gas and releasing heat energy when gas turns into gas to transfer heat from one location to another more quickly.

[0067] Compared with general metal sheets, heat pipes have the following advantages:

[0068] The heat transfer speed is fast and the heat energy can be effectively dissipated.

[0069] The heat transfer distance is long and the heat energy can be dispersed effectively.

[0070] The absence of any moving parts to transfer heat makes the heat pipe quiet, noiseless, maintenance-free and highly reliable.

[0071] The advantage of a TEC cooling device is its low noise level. Conventional heat dissipation methods are noisy and require more openings in the housing 100, compromising the housing's dust and water resistance. The phase-change material is encapsulated in a brass cylinder to increase the surface area exposed to the surrounding environment. This improves heat transfer efficiency. The heat sink's temperature rises as the TEC's operating temperature increases, until it reaches a certain temperature, at which point the phase-change material begins to melt and absorb additional heat from the system, allowing it to dissipate heat more efficiently. Once all the phase-change material has melted and reached the required temperature, it needs to rest to prevent overheating. It then begins to resolidify, returning to its original state and continuing its heat absorption and dissipation function.

[0072] The heat dissipation is achieved by using phase change materials in the heat absorbing tube. Compared with traditional air cooling, it has the following advantages:

[0073] 1. No fans or other mechanical devices are required, so no noise is generated.

[0074] 2. Phase change materials have high heat capacity and thermal conductivity, allowing them to quickly absorb and release heat. Compared to fan cooling, phase change materials can more effectively reduce device temperature and improve heat dissipation.

[0075] 3. Phase change material heat dissipation does not require additional power supply and does not generate additional energy consumption. Compared with fan heat dissipation, phase change material heat dissipation is more energy-saving and environmentally friendly, and improves the cruising ability of portable devices.

[0076] 4. Phase change material heat dissipation has no mechanical parts, so the maintenance cost is low. Compared with fan heat dissipation, there is no need to clean and replace the fan regularly, which reduces the maintenance work and cost of the equipment.

[0077] The phase change material can be a hydrated salt or a mixture of hydrated salts, a paraffin compound, an organic compound such as capric acid, lauric acid, stearic acid and other fatty acids. The set melting point of the phase change material will be determined by the use, operating temperature and ambient temperature.

[0078] This embodiment also includes a heat dissipation temperature sensor, which is fixed within the housing 100 and connected to the central control module. This heat dissipation temperature sensor is used to monitor the temperature of the heat dissipation module and provide feedback to the central control module. In TEC cooling applications, monitoring the radiator temperature is crucial, as the radiator temperature directly affects the TEC's heat dissipation efficiency. When the radiator temperature is too high, the TEC's heat dissipation capacity decreases, resulting in reduced cooling performance. Therefore, by monitoring the radiator temperature, the heat dissipation system can be adjusted and optimized in a timely manner to ensure efficient TEC cooling. At the same time, excessively high radiator temperatures may cause the radiator and surrounding components to overheat, even leading to malfunction or damage. By monitoring the radiator temperature, temperature anomalies can be detected promptly, allowing appropriate measures to be taken to ensure safe system operation. The lifespan and stability of the TEC are also closely related to the radiator temperature. Excessively high radiator temperatures will increase the TEC's operating temperature, accelerating its aging process and shortening its lifespan. Temperature fluctuations can also affect the TEC's stability and performance. By monitoring the radiator temperature, the TEC's operating temperature can be controlled within an appropriate range, extending its lifespan and improving its stability.

[0079] In another embodiment, a vibration motor is further included, which is fixed in the housing 100 and connected to the central control module. The vibration motor is fixed to the housing 100 and achieves a vibration massage effect on the skin by causing resonance between the housing 100 and the cooling head 300.

[0080] Ice compresses can effectively reduce pain and inflammation, while the vibration motor can stimulate the skin and muscles, distract attention, and reduce pain perception. The combined use can provide better pain relief.

[0081] The vibration of the vibration motor can promote local blood circulation and increase blood flow. Meanwhile, ice compresses can constrict blood vessels and reduce the amount of blood flowing into the area. By using them together, you can achieve a better blood circulation effect while applying ice.

[0082] The combination of ice and a vibration motor can accelerate the healing process of injured areas. Ice reduces inflammation and swelling, alleviating tissue damage. The vibration motor, on the other hand, stimulates local blood circulation, enhancing nutrient supply to muscles and tissues, and promoting healing and repair.

[0083] The vibrations from the vibration motor can help relax tense muscles and relieve muscle fatigue and tension. Ice compresses can reduce local temperature and relieve muscle pain and discomfort. Combining the two can provide even greater muscle relaxation.

[0084] In another embodiment, the device further comprises an LED, wherein the LED is used for light therapy and is a red light LED and / or a blue light LED.

[0085] Ice can reduce inflammation and swelling, while red light therapy has also been shown to have anti-inflammatory effects. Combining ice with red light therapy can even more effectively alleviate inflammation, reducing pain and discomfort. Red light therapy is widely used in tissue repair and trauma rehabilitation. It can stimulate cellular metabolism, increase ATP production, and accelerate wound healing and tissue repair. Ice, on the other hand, can reduce blood flow to the area, reducing inflammation and creating a better environment for tissue repair.

[0086] Blue light therapy has been shown to have antibacterial properties, effectively killing bacteria and reducing the risk of infection. Combining ice with blue light therapy can provide additional antibacterial effects while applying ice, which can help wounds heal after trauma or surgery.

[0087] Another embodiment further includes radiofrequency electrodes, which are fixed to the surface of the housing 100 and connected to the central control module. The radiofrequency electrodes stimulate the deeper layers of the skin by generating heat, promoting collagen regeneration and tissue firming. However, radiofrequency treatment may cause a certain degree of heat and discomfort on the skin's surface.

[0088] In this case, applying an ice compress can help cool the skin, reduce discomfort, and provide additional soothing relief. Ice compresses can relieve the sensation of heat by lowering the temperature of the skin, reducing redness, swelling, and localized inflammation.

[0089] When using radiofrequency electrodes with ice, the general steps are as follows:

[0090] Perform radiofrequency treatment first: Place the radiofrequency electrodes correctly on the skin and select appropriate energy and time for treatment as needed.

[0091] Ice compress: After radiofrequency treatment, the cooled surface of the heating element is gently pressed or slid over the treated area to cool the skin.

[0092] Using RF electrodes with ice can help alleviate the heat and discomfort of RF treatments while providing soothing relief.

[0093] In another embodiment, it further includes an electrotherapy electrode, which is fixed to the surface of the shell 100 and connected to the central control module, and is used for electrotherapy.

[0094] Electrotherapy is a method of relieving pain by stimulating nerve conduction with an electric current. While ice compresses can reduce inflammation and swelling by reducing local temperature, electrotherapy can stimulate nerves and interfere with the conduction of pain signals, thereby reducing pain.

[0095] Electrotherapy can stimulate muscle fibers, reducing muscle tension and spasms. Ice compresses can reduce local temperature, alleviating muscle pain and discomfort. Combining the two can provide even greater muscle relaxation.

[0096] Electrotherapy can stimulate local blood circulation and increase blood flow through electrical stimulation. Ice compresses can constrict blood vessels and reduce blood flow to the area. Combining these two methods can provide a better circulation-boosting effect while applying ice.

[0097] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A portable skin cooling device, characterized in that: include: A housing (100), wherein a cavity is provided in the housing (100); An electric heating element (200) is fixed in the cavity of the housing (100), wherein the electric heating element (200) is provided with a cooling surface; A cooling head (300) is embedded in the surface of the shell (100), and the cooling head (300) is connected to the cooling surface of the electric heating element (200); A power source (400) is located in the housing (100), and the power source (400) is used to supply power to the electric heating element (200); A PCB board (500) is located in the housing (100), and the PCB board (500) is connected to the electric heating element (200) and the power source (400) respectively; The electric heating element (200) is used for cooling, the PCB board (500) is provided with a central control module, the central control module is used to control the cooling temperature of the electric heating element (200), and the cooling head (300) is used to contact the skin for ice compress.

2. The portable skin cooling device according to claim 1, characterized in that: The electric heating element (200) comprises a TEC semiconductor cooler.

3. The portable skin cooling device according to claim 2, characterized in that: The electric heating element (200) is composed of a plurality of TEC semiconductor refrigerators whose hot and cold surfaces are alternately stacked or arranged in a planar array.

4. The portable skin cooling device according to claim 1, characterized in that: It also includes a refrigeration temperature sensor, which is located in the housing (100) and connected to the PCB board (500), and is used to monitor temperature data of the cooling head (300) and feed back to the central control module.

5. The portable skin cooling device according to claim 1, characterized in that: A heat dissipation module is provided in the housing (100); the electric heating element (200) comprises a cooling surface and a heating surface; the heat dissipation module is connected to the heating surface.

6. The portable skin cooling device according to claim 5, characterized in that: The heat dissipation module comprises a heat absorption pipe (600), wherein a phase change material is sealed inside the heat absorption pipe (600).

7. The portable skin cooling device according to claim 5, characterized in that: It also includes a heat dissipation temperature sensor, which is fixed in the housing (100) and connected to the central control module. The heat dissipation temperature sensor is used to monitor the temperature of the heat dissipation module and feed back to the central control module.

8. The portable skin cooling device according to claim 1, characterized in that: It also includes a vibration motor, which is fixed in the housing (100) and connected to the central control module.

9. The portable skin cooling device according to claim 1, characterized in that: Also included are LEDs and radio frequency electrodes.

10. The portable skin cooling device according to claim 1, characterized in that: It also includes an electrotherapy electrode, which is fixed to the surface of the shell (100) and connected to the central control module, and is used for electrotherapy.

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