Electronic device

Abstract

An electronic device according to one embodiment disclosed herein may comprise: a display; a conductive plate facing the display; a first circuit board (for example: a first printed circuit board) in which a first opening is formed and which has an electronic component disposed thereon; a second circuit board (for example: a second printed circuit board) having an integrated circuit (for example: a processor) disposed thereon, wherein the integrated circuit is disposed in the first opening; a shield can having a second opening and disposed on the first circuit board so as to surround the periphery of the electronic component; a shielding member covering the second opening; a vapor chamber disposed between the conductive plate and the shielding member when the display is viewed from a first direction; a first conductive member electrically connecting the conductive plate and the vapor chamber; and a second conductive member electrically connecting the vapor chamber and the shield can. The second conductive member may be disposed so as not to overlap the shielding member when viewed from the first direction. Various other embodiments may be possible.

Description

electronic devices

[0001] Embodiments of the present disclosure relate to an electronic device including a conductive member (e.g., a conductive gasket) electrically connecting a printed circuit board (PCB) and a vapor chamber.

[0002] An electronic device may refer to a device that performs a designated function according to a program installed therein, such as an electronic product, an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an audio / video device, a desktop / laptop computer, or a vehicle navigation system. The electronic device may include a twelfth printed circuit board (e.g., a main PCB) on which electronic components and peripheral circuits are arranged, and a second printed circuit board (e.g., a core PCB) on which a processor (e.g., an application processor (AP), a central processing unit (CPU)) is arranged. The electronic device may include shielding components (e.g., shielding members) for shielding noise (e.g., electromagnetic waves) generated from the processor and electronic components. The electronic device may include heat dissipation components (e.g., a thermal interface material (TIM), a heat diffusion plate) for dissipating (e.g., heat dissipating) heat generated from the processor and electronic components.

[0003] Electronic devices incorporate processors and electronic components with high power density (i.e., high power consumption per unit area). These processors and electronic components, placed on limited-area printed circuit boards (PCBs), can generate heat within the electronic devices. This increased heat generation can degrade the performance of the electronic devices or shorten the lifespan of the processors and electronic components. This increased heat generation can also cause the external surface of the electronic devices to heat up, potentially causing discomfort to the user. Furthermore, high-power processors and electronic components can generate noise (i.e., electromagnetic waves) in addition to heat generation. This noise (i.e., electromagnetic waves) generated from electronic components can degrade the performance and lifespan of peripheral components and circuits, and can cause malfunctions in the electronic devices. Furthermore, noise (i.e., electromagnetic waves) generated from electronic devices can have harmful effects on the human body.

[0004] The above-described material is provided solely as background information to aid in understanding the embodiments of the present disclosure. No determination has been made, and no claims are made, as to whether any of the above material constitutes prior art in connection with the present disclosure.

[0005] In order to dissipate heat generated from components of electronic devices, heat dissipating components (e.g., TIM, heat spreading plate) can be applied. In order to shield noise (e.g., electromagnetic waves) generated from components of electronic devices, a metal frame (e.g., metal plate) and a shield can that surrounds the processor and electronic components can be applied. The shielding (or removal) effect of the ground path contact using a conductive clip (e.g., C-clip) increases as it gets closer to the location of the component that generates noise (e.g., electromagnetic waves), and the shielding (or removal) effect may decrease as it gets farther away. In order to increase the shielding (or removal) effect of noise (e.g., electromagnetic waves) generated from the processor, the conductive clip (e.g., C-clip) should be placed in a location close to the processor. However, since the area of ​​the second printed circuit board (e.g., processor PCB, core circuit board) is small compared to the area of ​​the first printed circuit board (e.g., main PCB, main circuit board), there is a limitation in forming a ground path using a conductive clip (e.g., C-clip) on the second printed circuit board (e.g., processor PCB, core circuit board).

[0006] Embodiments of the present disclosure can provide an electronic device capable of shielding (e.g., removing) noise (e.g., electromagnetic waves) generated from a processor and a second printed circuit board (e.g., a processor PCB, a core circuit board) by forming a contact of a ground path at a portion adjacent to the processor and the second printed circuit board (e.g., a processor PCB, a core circuit board).

[0007] The technical challenges addressed in this document are not limited to the technical challenges mentioned above, and may be expanded upon without departing from the spirit and scope of the present disclosure. Additional technical challenges not mentioned herein will be readily apparent to those skilled in the art, as described below.

[0008] An electronic device according to one embodiment of the present disclosure may include a display, a conductive plate facing the display, a first circuit board (e.g., a first printed circuit board) having a first opening formed therein and electronic components arranged thereon, a second circuit board (e.g., a second printed circuit board) having an integrated circuit (e.g., a processor) arranged thereon and positioned such that the integrated circuit is positioned within the first opening, a shield can formed thereon and arranged on the first circuit board to surround a periphery of the electronic components, a shielding member covering the second opening, a vapor chamber arranged between the conductive plate and the shielding member when the display is viewed in a first direction, a first conductive member electrically connecting the conductive plate and the vapor chamber, and a second conductive member electrically connecting the vapor chamber and the shielding member. When viewed in the first direction, the second conductive member may be arranged so as not to overlap the shielding member.

[0009] An electronic device (101, 200, 300, 400, 500, 800, 1000, 1100, 1400, 1600) according to one embodiment of the present disclosure comprises: a display (410), a conductive plate (890) facing the display (410), a first circuit board (first printed circuit board (820)) in which an opening (822) is formed and an electronic component (821) is arranged; a second circuit board (second printed circuit board (810)) in which an integrated circuit (processor (120)) is arranged and the integrated circuit (processor (120)) is positioned within the first opening (822); a second opening (865) is formed and arranged on the first circuit board (first printed circuit board (820)) to surround a periphery of the electronic component (821). It may include a shield can (860), a shielding member (850) covering the second opening (865), a vapor chamber (870) disposed between the conductive plate (890) and the shielding member (850) when the display (410) is viewed in a first direction, and a conductive member electrically connecting the conductive plate (890) and the vapor chamber (870). The shield can (860) and the vapor chamber (870) may be electrically connected to form a ground path between the first circuit board (first printed circuit board (820)) and the conductive plate (890).

[0010] An electronic device according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor and a second printed circuit board (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (e.g., electromagnetic waves) generated from the processor and the second printed circuit board (e.g., a processor PCB, a core circuit board).

[0011] An electronic device according to an embodiment of the present disclosure forms a ground path contact at a portion adjacent to a processor and a second printed circuit board (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (e.g., electromagnetic waves) generated from the processor and the second printed circuit board (e.g., the processor PCB, the core circuit board). When a second conductive member (e.g., a gasket) is applied to the electronic device to form a ground path between a first printed circuit board (e.g., a main PCB, a main circuit board) and a conductive plate (e.g., a metal rear), total isotropic sensitivity (TIS) can be improved for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0012] An electronic device according to one embodiment of the present disclosure can form a ground path contact using a shield can and a conductive clip to shield (e.g., remove) noise (e.g., electromagnetic waves) generated from a processor and a second printed circuit board (e.g., a processor PCB, a core circuit board). By applying a shield can and a conductive clip to the electronic device to form a ground path between a first printed circuit board (e.g., a main PCB, a main circuit board) and a conductive plate (e.g., a metal rear), TIS can be improved for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0013] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0014] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0015] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0016] FIGS. 2A and 2B are front and rear views of a first state (e.g., unfolded stage) of an electronic device according to an embodiment of the present disclosure.

[0017] FIGS. 2C and 2D are front and rear views of a second state (e.g., folded state) of an electronic device according to an embodiment of the present disclosure.

[0018] FIG. 3A is a perspective view of a first side (e.g., front) of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 3b is a perspective view of a second side (e.g., a rear side) of an electronic device according to an embodiment of the present disclosure.

[0020] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment.

[0021] FIG. 5 is a drawing showing an electronic device in which a ground path is formed between a main printed circuit board (PCB) and a vapor chamber using a C-clip.

[0022] Figure 6 is a drawing showing that the C-clip is electrically connected to the main printed circuit board (PCB).

[0023] Figure 7 is a drawing showing noise and heat generated from a core printed circuit board (PCB) on which a processor is placed.

[0024] FIGS. 8 and 9 are drawings showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) that electrically connects a main printed circuit board (PCB) and a vapor chamber.

[0025] FIG. 10A is a drawing showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) electrically connecting a main printed circuit board (PCB) and a vapor chamber.

[0026] FIG. 10b is a drawing showing a second conductive member (gasket) being placed within an opening of a shielding member (e.g., metal TIM).

[0027] FIG. 11 is a drawing showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) that electrically connects a main printed circuit board (PCB) and a vapor chamber.

[0028] Figure 12 is a drawing showing a conductive member (e.g., a conductive gasket) being placed within a shielding member (e.g., a metal TIM (thermal interface material)).

[0029] Figure 13 is a drawing showing the structure of a shielding member (e.g., metal TIM).

[0030] FIG. 14A is a drawing showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) that electrically connects a main printed circuit board (PCB) and a vapor chamber.

[0031] Fig. 14b is a drawing showing the shape of the shield can illustrated in Fig. 14a.

[0032] FIG. 15A is a drawing showing an electronic device including a shieldcan electrically connecting a main printed circuit board (PCB) and a vapor chamber.

[0033] Figure 15b is a drawing showing a groove formed on the upper surface of the vapor chamber illustrated in Figure 15a.

[0034] FIG. 16 is a drawing showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) that electrically connects a main printed circuit board (PCB) and a vapor chamber.

[0035] FIG. 17 is a drawing showing an electronic device including a shieldcan electrically connecting a main printed circuit board (PCB) and a vapor chamber.

[0036] Fig. 18 is a drawing showing the shield can illustrated in Fig. 17.

[0037] FIG. 19 is a drawing showing an electronic device including a shieldcan electrically connecting a main printed circuit board (PCB) and a vapor chamber.

[0038] Figure 20 is a drawing showing the shield can pin being electrically connected to the conductive clip.

[0039] It should be noted that throughout the drawings, the same reference numbers are used to describe identical or similar elements, features and structures.

[0040] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While it includes numerous specific details to aid understanding, these are to be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0041] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to facilitate a clear and consistent understanding of this document. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only, and is not intended to limit this document as defined by the appended claims and their equivalents.

[0042] Singular forms should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, a reference to "component surfaces" may include reference to one or more of those surfaces.

[0043] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0044] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0045] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0046] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0047] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0048] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0049] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0050] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0051] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0052] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0053] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0054] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0055] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0056] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0057] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0058] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0059] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0060] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0061] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0062] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0063] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0064] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0065] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0066] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0067] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0068] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0069] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0070] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0071] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0072] According to one embodiment, the display module (160) may include a flexible display configured to be foldable or unfoldable.

[0073] According to one embodiment, the display module (160) may include a flexible display that is arranged to be slidable in a first direction (e.g., slidable in the x-axis direction) or slidable in a second direction (e.g., slidable in the y-axis direction) to provide a screen (e.g., a display screen).

[0074] According to one embodiment, the display module (160) may be referred to as a stretchable display, an expandable display, or a slide-in / out display.

[0075] According to one embodiment, the display module (160) may include a bar type or plate type display.

[0076] FIGS. 2A and 2B are front and rear views of a first state (e.g., unfolded state) of an electronic device according to an embodiment of the present disclosure. FIGS. 2C and 2D are front and rear views of a second state (e.g., folded state) of an electronic device according to an embodiment of the present disclosure.

[0077] Referring to FIGS. 2A to 2D , an electronic device (200) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 , the electronic device (400) of FIG. 4 ) may include a pair of housings (210, 220) (e.g., a foldable housing structure) that are rotatably coupled about a folding axis (F) through at least one hinge device (e.g., a hinge module or a hinge structure) so as to be foldable with respect to each other, a first display (230) (e.g., a flexible display, a foldable display, or a main display) disposed through the pair of housings (210, 220), and / or a second display (235) (e.g., a sub-display) disposed through the second housing (220).

[0078] According to one embodiment, at least a portion of at least one hinge device may be arranged so as not to be visible from the outside through the first housing (210) and the second housing (220), and may be arranged so as not to be visible from the outside through the hinge housing (290) (e.g., hinge cover) that covers the foldable portion in a first state (e.g., unfolded state). In this document, the surface on which the first display (230) is arranged may be defined as the front surface of the electronic device (200). In this document, the surface opposite to the front surface may be defined as the back surface of the electronic device (200). In addition, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (200).

[0079] According to one embodiment, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via at least one hinge device.

[0080] According to one embodiment, the pair of housings (210, 220) are not limited to the shapes and combinations shown in FIGS. 2a to 2d, and may be implemented by other shapes or combinations and / or combinations of parts.

[0081] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides of the folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other.

[0082] According to one embodiment, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F).

[0083] According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in a first state (e.g., unfolded stage), a second state (e.g., folded state), or a third state (e.g., intermediate state). For example, the electronic device (200) may sense whether it is in the first state (e.g., unfolded stage), the second state (e.g., folded state), or the third state (e.g., intermediate state) using a sensor module (e.g., sensor module (176) of FIG. 1). The electronic device (200) may sense the angle between the first housing (210) and the second housing (220) using a sensor module (e.g., sensor module (176) of FIG. 1).

[0084] According to one embodiment, the first housing (210) may be connected to at least one hinge device in a first state (e.g., an unfolded state) of the electronic device (200). The first housing (210) may include a first side member (213) arranged to face the front of the electronic device (200), a second side member (212) facing in an opposite direction of the first side member (211), and / or a first side member (213) surrounding at least a portion of a first space (5101) between the first side member (211) and the second side member (212).

[0085] According to one embodiment, the second housing (220) may be connected to at least one hinge device in a first state (e.g., an unfolded state) of the electronic device (200). The second housing (220) may include a third face (221) arranged to face the front of the electronic device (200), a fourth face (222) facing in an opposite direction of the third face (221), and / or a second side member (223) surrounding at least a portion of a second space (5201) between the third face (221) and the fourth face (222).

[0086] According to one embodiment, the first side (211) may be at least partially oriented in substantially the same direction as the third side (221) in a first state (e.g., an unfolded state) and may face the third side (221) in a second state (e.g., a folded state).

[0087] According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through a structural combination of a first housing (210) and a second housing (220).

[0088] According to one embodiment, the recess (201) may have substantially the same size as the first display (230).

[0089] According to one embodiment, the first housing (210) may be coupled to a first side member (213) when the first display (230) is viewed from above. The first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) that overlaps an edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside.

[0090] According to one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).

[0091] According to one embodiment, the second housing (220) may be coupled to the second side member (223) when the first display (230) is viewed from above. The second housing (220) may include a second protective frame (223a) that overlaps the edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside.

[0092] According to one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In one embodiment, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0093] According to one embodiment, a hinge housing (290) (e.g., a hinge cover) may be positioned between the first housing (210) and the second housing (220). The hinge housing (290) may be positioned to cover at least a portion of one hinge device (e.g., at least one hinge module).

[0094] According to one embodiment, the hinge housing (290) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the first state (e.g., unfolded state), the second state (e.g., folded state), or the third state (e.g., intermediate state) of the electronic device (200). For example, when the electronic device (200) is in the first state (e.g., unfolded state), at least a portion of the hinge housing (290) may be covered by the first housing (210) and the second housing (220) and may be arranged so as to be substantially invisible from the outside.

[0095] According to one embodiment, when the electronic device (200) is in the second state (folded state), at least a portion of the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be visible from the outside.

[0096] According to one embodiment, when the first housing (210) and the second housing (220) are in a third state (intermediate state) where they are folded at a certain angle, the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be at least partially visible from the outside of the electronic device (200). For example, the area where the hinge housing (290) is exposed to the outside may be less than that in the completely folded state. According to one embodiment, the hinge housing (290) may include a curved surface.

[0097] According to one embodiment, when the electronic device (200) is in a first state (e.g., an unfolded state), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may form substantially the same plane. The first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may be arranged to face substantially the same direction (e.g., the z-axis direction). As an example, when the electronic device (200) is in a first state (e.g., unfolded state), the first housing (210) may be rotated about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) face each other and may be folded in the opposite direction (e.g., out folding).

[0098] According to one embodiment, when the electronic device (200) is in the second state (folded state), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may be arranged to face each other. In this case, the first area (230a) and the second area (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with each other through the folding area (230c). According to one embodiment, at least a portion of the folding area (230c) may be deformed into a curved shape having a predetermined curvature.

[0099] According to one embodiment, when the electronic device (200) is in the third state (intermediate state), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the second state (e.g., folded state) and smaller than the first state (e.g., unfolded state), and the curvature of the folding region (230c) may be smaller than the second state (folded state) and larger than the first state (e.g., unfolded state). In one embodiment, the first housing (210) and the second housing (220) may form an angle that can stop at a specified folding angle between the second state (e.g., folded state) and the third state (e.g., intermediate state) through at least one hinge device (e.g., free stop function). In one embodiment, the first housing (210) and the second housing (220) may be continuously operated while being pressed in an unfolding or folding direction based on a specified inflection angle through at least one hinge device.

[0100] According to one embodiment, the electronic device (200) may include at least one of a display (230, 235), an input device (215), audio output devices (227, 228), sensor modules (217a, 217b, 226), camera modules (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In one embodiment, the electronic device (200) may omit at least one of the components or may additionally include at least one other component.

[0101] According to one embodiment, at least one display (230, 235) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third side (221) of a second housing (220) via at least one hinge device from a first side (211) of a first housing (210), and a second display (235) that is arranged to be at least partially visible from the outside through a fourth side (222) in an interior space of the second housing (220).

[0102] In one embodiment, the second display (235) may be positioned so as to be visible from the outside through the second surface (212) in the interior space of the first housing (210).

[0103] According to one embodiment, the first display (230) may be primarily used in a first state (e.g., unfolded state) of the electronic device (200). The second display (235) may also be used in the first state (e.g., unfolded state) of the electronic device (200).

[0104] According to one embodiment, the second display (235) may be primarily used in a second state (e.g., folded state) of the electronic device (200). The first display (230) may also be used in the second state (e.g., folded state) of the electronic device (200).

[0105] According to one embodiment, the electronic device (200) can control the first display (230) and / or the second display (235) to be usable based on the folding angles of the first housing (210) and the second housing (220) in the third state (e.g., intermediate state).

[0106] According to one embodiment, the first display (230) may be disposed in a receiving space formed by a pair of housings (210, 220). For example, the first display (200) may be disposed in a recess (201) formed by the pair of housings (210, 220), and may be disposed to occupy substantially most of the front surface of the electronic device (200) in a first state (e.g., unfolded state). According to one embodiment, the first display (230) may include a flexible display in which at least a portion of the first display (230) may be transformed into a flat or curved surface.

[0107] According to one embodiment, the first display (230) may include a first area (230a) facing the first housing (210) and a second area (230b) facing the second housing (220). According to one embodiment, the first display (230) may include a folding area (230c) including a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (F).

[0108] According to one embodiment, at least a portion of the folding area (230c) may include an area corresponding to at least one hinge device.

[0109] According to one embodiment, the area division of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and at least one hinge device, and substantially, the first display (230) can be displayed as a seamless, full screen through the pair of housings (210, 220) and at least one hinge device.

[0110] According to one embodiment, the first region (230a) and the second region (230b) may have an overall symmetrical shape with respect to the folding region (230c) or may have a partially asymmetrical shape.

[0111] According to one embodiment, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of a first housing (210) and a second rear cover (250) disposed on a fourth side (222) of a second housing (220). In one embodiment, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In one embodiment, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223).

[0112] In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed of an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0113] According to one embodiment, the second rear cover (250) may be formed of a substantially transparent plate, such as glass or polymer. Accordingly, the second display (235) may be positioned so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0114] In one embodiment, the input device (215) may include a microphone. In one embodiment, the input device (215) may include a plurality of microphones arranged to detect the direction of sound.

[0115] In one embodiment, the audio output devices (227, 228) may include speakers. In one embodiment, the audio output devices (227, 228) may include a call receiver (227) disposed through the fourth side (222) of the second housing (220) and an external speaker (228) disposed through at least a portion of the second side member (223) of the second housing (220).

[0116] In one embodiment, the input device (215), the audio output devices (227, 228), and the connector port (229) may be arranged in spaces of the first housing (210) and / or the second housing (220). The input device (215), the audio output devices (227, 228), and the connector port (229) may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be used in common for the input device (215) and the audio output devices (227, 228). In one embodiment, the audio output devices (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220).

[0117] According to one embodiment, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first side (211) of the first housing (210), a second camera module (216b) disposed on a second side (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth side (222) of the second housing (220).

[0118] According to one embodiment, the electronic device (200) may include a flash (218) positioned near the second camera module (216b). According to one embodiment, the flash (218) may include, for example, a light emitting diode or a xenon lamp.

[0119] According to one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, image sensors, and / or image signal processors. In one embodiment, at least one of the camera modules (216a, 216b, 225) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on one side of the first housing (210) and / or the second housing (220).

[0120] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., the sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state.

[0121] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., the sensor module (176) of FIG. 1) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220).

[0122] In one embodiment, the sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor.

[0123] According to one embodiment, a processor of an electronic device (200) (e.g., processor (120) of FIG. 1) may operate sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) to sense the illumination and / or IR intensity of the surroundings of the electronic device (200). The processor (120) may obtain information about the illumination and IR intensity of the surroundings of the electronic device (200).

[0124] According to one embodiment, the electronic device (200) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor, which are not shown.

[0125] In one embodiment, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0126] According to one embodiment, the key input device (219) may be arranged to be exposed to the outside through the first side member (213) of the first housing (210). In one embodiment, the key input device (219) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). In one embodiment, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 235). As one embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 235).

[0127] According to one embodiment, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. In one embodiment, the connector port (229) may also perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0128] According to one embodiment, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be visually exposed through at least one display (230, 235). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or the indicator may be arranged in an internal space of at least one housing (210, 220), below an active area (display area) of at least one display (230, 235). At least one camera module (216a, 225), at least one sensor module (217a, 226) and / or an indicator may be positioned so as to be in contact with the external environment through a perforated opening or transparent area through a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)).

[0129] According to one embodiment, an area where at least one display (230, 235) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content.

[0130] In one embodiment, the transparent region may be formed to have a transmittance in the range of about 5% to about 20%. The transparent region may include an area overlapping an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by the image sensor to create an image. For example, the transparent region of the display (230, 235) may include an area with a lower pixel density than the surrounding area. For example, the transparent region may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC). In one embodiment, some camera modules or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display. For example, the area facing the camera module (216a, 225) and / or sensor module (217a, 226) positioned under the display (230, 235) (e.g., display panel) may have an under display camera (UDC) structure, so that a perforated opening may not be necessary.

[0131] FIG. 3A is a perspective view of a first side (e.g., a front side) of an electronic device according to an embodiment of the present disclosure. FIG. 3B is a perspective view of a second side (e.g., a rear side) of an electronic device according to an embodiment of the present disclosure.

[0132] Referring to FIGS. 3A and 3B, an electronic device (300) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (400) of FIG. 4) may include a first side (or front side) (310A), a second side (or back side) (310B), and a housing (310). An electronic device (300) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (400) of FIG. 4) may include a display (301) (e.g., the display (410) of FIG. 4).

[0133] In one embodiment, the display (301) may be supported by a housing (310). For example, the display (310) may include a liquid crystal display (LCD) display, an organic light emitting diodes (OLED) display, or a micro LED display.

[0134] According to one embodiment, the housing (310) may include a side surface (310C) that surrounds a space between the first surface (310A) and the second surface (310B). According to one embodiment, the housing (310) may also refer to a structure that forms a portion of the first surface (310A), the second surface (310B), and the side surface (310C).

[0135] According to one embodiment, the first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers).

[0136] According to one embodiment, the second side (310B) may be formed by a substantially opaque back plate (311). The back plate (311) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. However, the present invention is not limited thereto, and the back plate (311) may also be formed by transparent glass.

[0137] In one embodiment, the side (310C) may be formed by a side bezel structure (318) (or “side member”) that is coupled to the front plate (302) and the back plate (311) and comprises a metal and / or polymer. In one embodiment, the back plate (311) and the side bezel structure (318) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0138] According to one embodiment, the front plate (302) may include two first regions (310D) that extend seamlessly from the first side (310A) toward the rear plate (311). The two first regions (310D) may be arranged at both ends of a long edge of the front plate (302).

[0139] According to one embodiment, the back plate (311) may include two second regions (310E) that extend seamlessly from the second side (310B) toward the front plate (302).

[0140] In one embodiment, the front plate (302) (or the rear plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). In one embodiment, some of the first regions (310D) or the second regions (310E) may not be included.

[0141] In embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a first thickness (or width) on a side that does not include the first regions (310D) or the second regions (310E) as described above. In embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a second thickness (or width) that is thinner than the first thickness on a side that includes the first regions (310D) or the second regions (310E).

[0142] According to one embodiment, the electronic device (300) may include at least one of a display (301), an audio input device (303) (e.g., the input module (150) of FIG. 1, a microphone), an audio output device (307, 314) (e.g., the audio output module (155) of FIG. 1, a speaker) (e.g., an audio module), sensor modules (304, 319) (e.g., the sensor module (176) of FIG. 1), a camera module (305, 312) (e.g., the camera module (180) of FIG. 1), a flash (313), a key input device (317), an indicator (not shown), and connectors (308, 309). According to one embodiment, the electronic device (300) may omit at least one of the components (e.g., the key input device (317)) or may additionally include other components.

[0143] In one embodiment, the display (301) is visually visible through the upper portion of the front plate (302).

[0144] According to one embodiment, at least a portion of the display (301) may be visible through the front plate (302) forming the first surface (310A) and the first region (310D) of the side surface (310C).

[0145] For example, a display module (e.g., a display module (160) of FIG. 1 in FIG. 4, a display module (160) of FIG. 4) may include a touch circuit (e.g., a touch circuit (450) of FIG. 4) including a touch sensor (e.g., a touch sensor (451) of FIG. 4) and a touch sensor IC (e.g., a touch sensor IC (453) of FIG. 4). The display module (e.g., a display module (160) of FIG. 1 in FIG. 4, a display module (160) of FIG. 4) may include a pressure sensor capable of measuring the intensity (pressure) of a touch. For example, the display (301) may be coupled to or disposed adjacent to the touch circuit (e.g., a touch circuit (450) of FIG. 4) and / or the pressure sensor. For example, the display (301) may be coupled to or placed adjacent to a digitizer (e.g., digitizer (460) of FIG. 4) that detects a magnetic field-type electronic pen (e.g., stylus pen).

[0146] According to one embodiment, at least a portion of the sensor modules (304, 319) and / or at least a portion of the key input device (317) may be disposed in the first area (310D) and / or the second area (310E).

[0147] According to one embodiment, the back surface of the screen display area of ​​the display (301) may include at least one of a first sensor module (304), camera modules (305, 312) (e.g., an image sensor), an audio output device (314) (e.g., an audio module), and a fingerprint sensor.

[0148] According to one embodiment, at least some of the sensor modules (304, 319) and / or at least some of the key input device (317) may be disposed in the first areas (310D) and / or the second areas (310E).

[0149] According to one embodiment, the audio input device (303) may include a microphone. According to one embodiment, the input device (303) may include a plurality of microphones arranged to detect the direction of sound.

[0150] According to one embodiment, the audio output device (307, 314) may include an audio output device (307) that operates as an external speaker and an audio output device (314) that operates as a call receiver.

[0151] In some embodiments, the acoustic input device (303) (e.g., microphone), the acoustic output device (307, 314), and the connectors (308, 309) may be arranged in the internal space of the electronic device (300). The acoustic input device (303) (e.g., microphone), the acoustic output device (307, 314), and the connectors (308, 309) may be exposed to the external environment through at least one hole formed in the housing (310). In some embodiments, the hole formed in the housing (310) may be used in common for the acoustic input device (303) (e.g., microphone) and the acoustic output device (307, 314). In some embodiments, the acoustic output device (307, 314) may include a speaker (e.g., piezo speaker) that operates without the hole formed in the housing (310).

[0152] According to one embodiment, the sensor modules (304, 319) (e.g., the sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor modules (304, 319) may include a first sensor module (304) (e.g., a proximity sensor) disposed on a first surface (310A) of the housing (310) and / or a second sensor module (319) (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface (310B) of the housing (310) and / or a third sensor module (not shown) (e.g., a fingerprint sensor). For example, the fingerprint sensor may be disposed on the first surface (310A) (e.g., the display (301)) and / or the second surface (310B) of the housing (310).

[0153] The electronic device (300) may further include at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor (e.g., a geomagnetic sensor (700) of FIG. 7), an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor, which are not shown.

[0154] According to one embodiment, the camera modules (305, 312) may include a first camera module (305) disposed on a first side (310A) of the electronic device (300), and a second camera module (312) disposed on a second side (310B). A flash (313) may be disposed around the camera modules (305, 312). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light-emitting diode or a xenon lamp.

[0155] According to one embodiment, the first camera module (305) may be arranged on the lower part of the display panel of the display (301) in an under-display camera (UDC) manner. According to one embodiment, two or more lenses (wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (300). According to one embodiment, a plurality of first camera modules (305) may be arranged on a first side (e.g., a side on which a screen is displayed) of the electronic device (300) in an under-display camera (UDC) manner.

[0156] According to one embodiment, the key input device (317) may be arranged on a side surface (310C) of the housing (310). According to one embodiment, the electronic device (300) may not include some or all of the above-mentioned key input devices (317), and the key input devices (317) that are not included may be implemented in another form, such as a soft key, on the display (301). According to one embodiment, the key input device (317) may be implemented using a pressure sensor included in the display (301).

[0157] According to one embodiment, the connectors (308, 309) may include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (309, or an earphone jack) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device. The first connector hole (308) may include a port of a universal serial bus (USB) type A, USB type B, or USB type C. When the first connector hole (308) supports a USB type C, the electronic device (300, e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, or the electronic device (400) of FIG. 4)) may support USB power delivery (PD) charging.

[0158] According to one embodiment, some of the first camera modules (305, 312) and / or the first sensor module (304, 319) of the sensor modules (304, 319) may be arranged to be visually visible through the display (301).

[0159] According to one embodiment, when the first camera module (305) is arranged in an under display camera (UDC) manner, the first camera module (305) may not be visually visible to the outside.

[0160] According to one embodiment, the first camera module (305) may be arranged to overlap with the display area, and may also display a screen in the display area corresponding to the first camera module (305). The first sensor module (304) may also be arranged to perform its function without being visually exposed through the front plate (302) in the internal space of the electronic device (300).

[0161] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment.

[0162] Referring to FIG. 4, an electronic device (400) according to an embodiment of the present disclosure may include a processor (120) (e.g., the processor (120) of FIG. 1), a memory (130) (e.g., the memory (130) of FIG. 1), a sensor module (176), and a display module (160) (e.g., the display module (160) of FIG. 1).

[0163] In one embodiment, the memory (130) (e.g., the memory (130) of FIG. 1, the memory (130) of FIG. 4) may include one or more of a High Bandwidth Memory (HBM), a dynamic random access memory (DRAM), a static random access memory (SRAM), a phase-change random access memory (PRAM), a magnetic random access memory (MRAM), a resistive random access memory (RRAM), a flash memory, and / or an electrically erasable programmable read-only memory (EEPROM).

[0164] According to one embodiment, a display module (160) (e.g., the display module (160) of FIG. 1) may include a display (410), a display driver IC (DDIC) (430) (e.g., a display driver) for driving the display (410), a touch circuit (450), a digitizer (460), and a digitizer driver (470). For example, all or part of a sensor module (176) may be included in the display module (160).

[0165] According to one embodiment, the DDIC (430) may include an interface module (431) (e.g., an interface circuit), a memory (433) (e.g., a buffer memory), an image processing module (435) (e.g., an image processing circuit), or a mapping module (437) (e.g., a mapping circuit).

[0166] According to one embodiment, the DDIC (430) can receive image information including image data or an image control signal corresponding to a command for controlling the image data from another component of an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2 and 3) through an interface module (431).

[0167] According to one embodiment, image information may be received from a processor (e.g., processor (120) of FIG. 1) (e.g., main processor (121) of FIG. 1) (e.g., application processor) or an auxiliary processor (e.g., auxiliary processor (123) of FIG. 1) (e.g., graphics processing unit) that operates independently of the functions of the main processor (121).

[0168] According to one embodiment, the DDIC (430) can communicate with the touch circuit (450) or the sensor module (176) through the interface module (431). In addition, the DDIC (430) can store at least some of the received image information in the memory (433). As an example, the DDIC (430) can store at least some of the received image information in the memory (433) on a frame-by-frame basis.

[0169] According to one embodiment, the image processing module (435) may perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a portion of the image data based at least on characteristics of the image data or characteristics of the display (410).

[0170] According to one embodiment, the mapping module (437) may generate a voltage value or a current value corresponding to the image data pre-processed or post-processed through the image processing module (435). According to one embodiment, the generation of the voltage value or the current value may be performed at least in part based on, for example, the properties of the pixels of the display (410) (e.g., the arrangement of the pixels (RGB stripe or pentile structure), or the size of each sub-pixel).

[0171] According to one embodiment, at least some pixels of the display (410) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data may be displayed through the display (410).

[0172] According to one embodiment, the touch circuit (450) may include a touch sensor (451) and a touch sensor IC (453) for controlling the touch sensor (451).

[0173] According to one embodiment, the touch sensor IC (453) may control the touch sensor (451) to detect a touch input or hovering input for a specific location of the display (410). For example, the touch sensor IC (453) may detect the touch input or hovering input by measuring a change in a signal (e.g., voltage, light quantity, resistance, or charge quantity) for a specific location of the display (410). The touch sensor IC (453) may provide information (e.g., location, area, pressure, or time) regarding the detected touch input or hovering input to the processor (120).

[0174] According to one embodiment, at least a portion of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of the DDIC (430) or the display (410).

[0175] According to one embodiment, at least a portion of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of another component (e.g., auxiliary processor (123)) disposed external to the display module (160).

[0176] According to one embodiment, the display module (160) may further include at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module (176), or a control circuit therefor. In this case, the at least one sensor or the control circuit therefor may be embedded in a part of the display module (160) (e.g., the display (410) or the DDIC (430)) or a part of the touch circuit (450).

[0177] For example, if the sensor module (176) embedded in the display module (160) includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor can obtain biometric information (e.g., a fingerprint image) associated with a touch input through a portion of the display (410).

[0178] For example, if the sensor module (176) embedded in the display module (160) includes a pressure sensor, the pressure sensor can obtain pressure information associated with a touch input through a part or the entire area of ​​the display (410).

[0179] According to one embodiment, the touch sensor (451) or sensor module (176) may be positioned between pixels of a pixel layer of the display (410), or above or below the pixel layer.

[0180] According to one embodiment, the display module (160) may include a digitizer (460) for detecting an input (e.g., a touch input or a hovering input) of an electronic pen (e.g., a stylus pen). For example, the digitizer (460) may convert analog coordinates (e.g., a position) of the electronic pen (e.g., a stylus pen) into digital coordinate data. The digitizer (460) may transmit the digital coordinate data to the processor (120) and / or the DDIC (430).

[0181] According to one embodiment, the processor (120) may obtain digital coordinate data input from the digitizer (460). The processor (120) may detect an input (e.g., a touch input or a hovering input) through an electronic pen (e.g., a stylus pen) based on the digital coordinate data. For example, the digitizer (460) may include a plurality of x-axis channels and a plurality of y-axis channels. The processor (120) may sense the position of the electronic pen (e.g., a stylus pen) using sensing signals (e.g., EMR signals) received from the x-axis channels and the y-axis channels arranged in the digitizer (460). For example, a digitizer (460) may have a plurality of x-axis channels and a plurality of y-axis channels sequentially arranged, and a processor (120) may sense the position of an electronic pen (e.g., a stylus pen) using sensing signals (e.g., EMR signals) received from three consecutive channels (e.g., three adjacent channels).

[0182] In one embodiment, the digitizer (460) may be hidden from the outside by the display (410), electronic components, and mechanisms.

[0183] For example, the digitizer (460) may be disposed integrally with the flat display (410) or disposed adjacent to the flat display (410). For example, when the digitizer (460) is applied to the flat display (410), the digitizer (460) may include one EMR (electro magnetic resonance) sheet (or EMR film). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of an electronic pen (e.g., a stylus pen) may be disposed on one EMR sheet.

[0184] For example, the digitizer (460) may be disposed integrally with a flexible display or a foldable display, or may be disposed adjacent to the flexible display or the foldable display. For example, the digitizer (460) may be disposed at the bottom (e.g., below) of the display (410) (e.g., the display (201) of FIGS. 2 and 3) in the z-axis direction (e.g., the z-axis direction of FIGS. 2A and 2B).

[0185] For example, when a digitizer (460) is applied to a flexible display or a foldable display, the digitizer (460) may include a plurality of electro magnetic resonance (EMR) sheets (or EMR films). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of an electronic pen (e.g., a stylus pen) may be arranged on the plurality of EMR sheets.

[0186] Fig. 5 is a drawing showing an electronic device in which a ground path is formed between a main printed circuit board (PCB) and a vapor chamber using a C-clip. Fig. 6 is a drawing showing that a C-clip is electrically connected to a main printed circuit board (PCB).

[0187] Referring to FIGS. 5 and 6, the electronic device (500) includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (520) (e.g., a main PCB, a main circuit board), a second printed circuit board (510) (e.g., a processor PCB, a core circuit board), a processor (530) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (521), a heat dissipation member (540) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (550) (e.g., a shielding member, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (560), a vapor chamber (570), a conductive member (580) (e.g., a conductive double-sided tape, a conductive adhesive layer), It may include a conductive plate (590) (e.g., metal rear, metal plate), and a conductive clip (501) (e.g., C-clip, conductive contact member).

[0188] According to one embodiment, a display module (e.g., display module (160) of FIG. 4) may be placed on a first printed circuit board (520) (e.g., main PCB, main circuit board). The display module (160) may include a display (e.g., display (410) of FIG. 4), a touch circuit (450), and a digitizer (460)).

[0189] According to one embodiment, when the electronic device (500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (590) (e.g., metal rear) may be arranged to face the display (410). Between the conductive plate (590) (e.g., metal rear, metal plate) and the display (410), components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0190] According to one embodiment, a shielding member (550), a shield can (560), and a vapor chamber (570) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (530) and electronic components (521) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0191] According to one embodiment, a vapor chamber (570) may be disposed on a conductive plate (590) (e.g., metal rear). For example, when the electronic device (500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a conductive member (580) (e.g., conductive double-sided tape, conductive adhesive layer) may be disposed between the conductive plate (590) (e.g., metal rear, metal plate) and the vapor chamber (570). For example, the conductive plate (590) (e.g., metal rear, metal plate) and the vapor chamber (570) may be electrically connected (e.g., electrically attached) by the conductive member (580) (e.g., conductive double-sided tape, conductive adhesive layer).

[0192] According to one embodiment, a shielding member (550) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (570).

[0193] For example, the shielding member (550) may include a material (e.g., a metal) or an alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (550) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (550) may include a composite material including a thermally conductive filler or a polymer.

[0194] For example, the shielding member (550) may be positioned to face (e.g., overlap) the heat-generating processor (530) and electronic components (521).

[0195] According to one embodiment, a heat dissipation member (540) (e.g., a heat dissipation component, a solid thermal interface material (TIM), a heat spreading (thermal conductive) member, thermal grease, heat spreading paste, or heat spreading (thermal conductive) paste) may be placed on the shielding member (550) so as to overlap at least a portion of the shielding member (550).

[0196] According to one embodiment, at least a portion of a first printed circuit board (520) (e.g., a main PCB, a main circuit board) and at least a portion of a second printed circuit board (510) (e.g., a processor PCB, a core circuit board) may be arranged to overlap each other. The first printed circuit board (520) (e.g., a main PCB, a main circuit board) may include a first opening (525). A processor (530) may be arranged on the second printed circuit board (510) (e.g., a processor PCB, a core circuit board) through the first opening (525). For example, electronic components (521) and peripheral circuits may be arranged on the first printed circuit board (520) (e.g., a main PCB, a main circuit board). For example, the electronic components (521) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0197] According to one embodiment, a processor (530) and core circuits may be arranged on a second printed circuit board (510) (e.g., a processor PCB, a core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., a power management module (188) of FIG. 1).

[0198] According to one embodiment, the processor (530) (e.g., the processor (120) of FIG. 1, the processor (120) of FIG. 4) may include one or more of an application processor (AP), a central processing unit (CPU), a graphics processing unit (e.g., a mobile graphics processing unit (GPU), a central processor (CP), an image signal processor, a communication processor, and a sensor hub processor).

[0199] In one embodiment, the memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may include one or more of High Bandwidth Memory (HBM), dynamic random access memory (DRAM), static random access memory (SRAM), phase-change random access memory (PRAM), magnetic random access memory (MRAM), resistive random access memory (RRAM), flash memory, and / or electrically erasable programmable read-only memory (EEPROM).

[0200] For example, the processor (530) may be disposed on the second printed circuit board (510) (e.g., processor PCB, core circuit board) so as to be positioned within the first opening (525). For example, the first printed circuit board (520) (e.g., main PCB, main circuit board) and the second printed circuit board (510) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected).

[0201] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (520) and / or a second printed circuit board (510) (e.g., processor PCB, core circuit board).

[0202] According to one embodiment, the shield can (560) may include a second opening (565). The shield can (560) may be placed on a first printed circuit board (520) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (521).

[0203] For example, the shield can (560) may be arranged to cover at least a portion of the first printed circuit board (520) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (510) (e.g., processor PCB, core circuit board). For example, the shield can (560) may be arranged to cover electronic components (521) arranged on the first printed circuit board (520) (e.g., main PCB, main circuit board) and the processor (530) arranged on the second printed circuit board (510) (e.g., processor PCB, core circuit board). For example, the shield can (560) may have an electromagnetic interference shielding (EMI shielding) function in addition to a heat dissipation function.

[0204] According to one embodiment, a heat dissipation member (540) (e.g., a heat dissipation component, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat spreading paste, or heat spreading (thermal conductive) paste) may be disposed between the processor (530) and the shielding member (550).

[0205] For example, the heat dissipation member (540) may be positioned to face (e.g., overlap) the processor (530) so as to discharge (e.g., cool, diffuse) heat generated from the processor (530). For example, the shielding member (550) may be positioned to face (e.g., overlap) the electronic components (521) and the processor (530) so as to discharge (e.g., cool, diffuse) heat generated from the electronic components (521) and the processor (530). For example, the shielding member (550) may be positioned to cover (e.g., seal) the second opening (565) of the shield can (560). For example, the shielding member (550) may have an electromagnetic interference shielding (EMI shielding) function in addition to a heat dissipation function.

[0206] According to one embodiment, when the electronic device (500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (570) may be placed between a conductive plate (590) (e.g., metal rear, metal plate) and a shielding member (550).

[0207] According to one embodiment, a conductive clip (501) (e.g., a C-clip, a conductive contact member) may be positioned between a first printed circuit board (520) (e.g., a main PCB, a main circuit board) and a vapor chamber (570). For example, the conductive clip (501) (e.g., a C-clip, a conductive contact member) may electrically connect the first printed circuit board (520) (e.g., a main PCB, a main circuit board) and the vapor chamber (570).

[0208] FIG. 7 is a drawing (700) showing noise and heat generated from a core printed circuit board (PCB) on which a processor is placed.

[0209] Referring to FIG. 7, noise (710) (e.g., electromagnetic waves) may be generated from the processor (530) and electronic components (521). Since a lot of noise (710) (e.g., electromagnetic waves) is generated from the second printed circuit board (510) (e.g., processor PCB, core circuit board) on which the processor (530) is placed, a ground pass must be formed to shield (e.g., remove) the noise (710) (e.g., electromagnetic waves). For example, a ground pass may be formed between the first printed circuit board (520) (e.g., main PCB, main circuit board) and the vapor chamber (570) using a conductive clip (501) (e.g., C-clip, conductive contact member). For example, a ground path can be formed around the processor (530) using a plurality of conductive clips (501) (e.g., C-clips, conductive contact members) (e.g., ten conductive clips).

[0210] For example, the closer the contact of the ground path using the conductive clip (501) (e.g., C-clip, conductive contact member) is to the location of the component that generates noise (e.g., electromagnetic wave), the more the shielding (or removal) effect may increase. The further the contact of the ground path using the conductive clip (501) (e.g., C-clip, conductive contact member) is to the location of the component that generates noise (e.g., electromagnetic wave), the more the shielding (or removal) effect may decrease. In order to increase the shielding (or removal) effect of noise (e.g., electromagnetic wave) generated from the processor (530), the conductive clip (501) (e.g., C-clip, conductive contact member) must be placed at a location adjacent to the processor (530). However, the area of ​​the second printed circuit board (510) (e.g., processor PCB, core circuit board) may be smaller than the area of ​​the first printed circuit board (520) (e.g., main PCB, main circuit board) (e.g., the second printed circuit board may have an area of ​​approximately 10% of the area of ​​the first printed circuit board). There is a limitation in forming a ground path using a conductive clip (501) (e.g., C-clip, conductive contact member) in the second printed circuit board (510) (e.g., processor PCB, core circuit board). Due to this, the position where the conductive clip (501) (e.g., C-clip, conductive contact member) is arranged may be moved (502) to an area of ​​the first printed circuit board (520) (e.g., main PCB, main circuit board).

[0211] For example, a part of the vapor chamber (570) may be removed, and the second printed circuit board (510) (e.g., processor PCB, core circuit board) and the conductive plate (590) (e.g., metal rear) may be electrically connected by a conductive clip (501) (e.g., C-clip, conductive contact member). In this case, the area of ​​the vapor chamber (570) may be reduced, resulting in a decrease in heat generation performance. Accordingly, the position where the conductive clip (501) (e.g., C-clip, conductive contact member) is disposed may be moved (502) to an area of ​​the first printed circuit board (520) (e.g., main PCB, main circuit board), thereby forming a ground path contact with the conductive clip (501) (e.g., C-clip, conductive contact member).

[0212]

[0213] When a shield can (560), a shielding member (550), and a conductive clip (501) (e.g., a C-clip, a conductive contact member) are applied to an electronic device (500) for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66), the noise (e.g., electromagnetic wave) shielding (or removal) performance can be improved as shown in Table 1. TIS is a measure of the Rx stage performance of a wireless device in free space, and TIS can be improved by applying a shield can (560), a shielding member (550), and a conductive clip (501) (e.g., a C-clip, a conductive contact member).

[0214] FIGS. 8 and 9 are drawings showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) that electrically connects a main printed circuit board (PCB) and a vapor chamber.

[0215] Referring to FIGS. 8 and 9, an electronic device (800) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (820) (e.g., a main PCB, a main circuit board), a second printed circuit board (810) (e.g., a processor PCB, a core circuit board), a processor (830) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (821), a heat dissipation member (840) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (850, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (860, shieldcan), a vapor chamber (870, vapor chamber), and a first conductive member. It may include a conductive member (880) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (890) (e.g., metal rear, metal plate), and a second conductive member (801) (e.g., gasket).

[0216] According to one embodiment, a display module (e.g., a display module (160) of FIG. 4) may be placed on a first printed circuit board (820) (e.g., a main PCB, a main circuit board). The display module (160) may include a display (e.g., a display (410) of FIG. 4) and a digitizer (460).

[0217] According to one embodiment, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (890) (e.g., metal rear) may be arranged to face the display (410). Between the conductive plate (890) (e.g., metal rear, metal plate) and the display (410), components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0218] According to one embodiment, a shielding member (850, metal TIM), a shield can (860), a vapor chamber (870), a first conductive member (880) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (890) (e.g., metal rear, metal plate), and a second conductive member (801) (e.g., gasket) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (830) and electronic components (821) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0219] According to one embodiment, a vapor chamber (870) may be disposed on a conductive plate (890) (e.g., metal rear). For example, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first conductive member (880) (e.g., conductive double-sided tape, conductive adhesive layer) may be disposed between the conductive plate (890) (e.g., metal rear, metal plate) and the vapor chamber (870). For example, the conductive plate (890) (e.g., metal rear, metal plate) and the vapor chamber (870) may be electrically connected (e.g., electrically attached) by the first conductive member (880) (e.g., conductive double-sided tape, conductive adhesive layer).

[0220] According to one embodiment, a shielding member (850, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (870).

[0221] For example, the shielding member (850, metal TIM) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (850, metal TIM) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (850, metal TIM) may include a composite material including a thermally conductive filler or a polymer.

[0222] For example, the shielding member (850, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (830) and electronic components (821).

[0223] According to one embodiment, a heat dissipation member (840) (e.g., heat dissipation component, solid TIM (thermal interface material), heat diffusion (thermal conductive) member, thermal grease, heat dissipation paste, heat diffusion (thermal conductive) paste) may be placed on the shielding member (850, metal TIM) so as to overlap at least a portion of the shielding member (850, metal TIM).

[0224] According to one embodiment, a first printed circuit board (820) (e.g., a main PCB, a main circuit board) may include a first opening (825). A processor (830) may be placed on a second printed circuit board (810) (e.g., a processor PCB, a core circuit board) through the first opening (825). For example, electronic components (821) and peripheral circuits may be placed on the first printed circuit board (820) (e.g., a main PCB, a main circuit board). For example, the electronic components (821) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0225] According to one embodiment, a processor (830) and core circuits may be arranged on a second printed circuit board (810) (e.g., a processor PCB, a core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., a power management module (188) of FIG. 1).

[0226] According to one embodiment, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (820) (e.g., main PCB, main circuit board) may be disposed between the display (410) and the conductive plate (890) (e.g., metal rear). For example, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (820) (e.g., main PCB, main circuit board) may be disposed between the second printed circuit board (810) (e.g., processor PCB, core circuit board) and the vapor chamber (870). For example, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (820) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (810) (e.g., processor PCB, core circuit board) and a shielding member (850, metal TIM).

[0227] According to one embodiment, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (810) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the conductive plate (890) (e.g., metal rear). For example, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (810) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the vapor chamber (870).

[0228] For example, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (810) (e.g., processor PCB, core circuit board) may be placed between the display (410) and the shielding member (850, metal TIM).

[0229] According to one embodiment, the processor (830) (e.g., the processor (120) of FIG. 1, the processor (120) of FIG. 4) may include one or more of an application processor (AP), a central processing unit (CPU), a graphics processing unit (e.g., a mobile graphics processing unit (GPU), a central processor (CP), an image signal processor, a communication processor, and a sensor hub processor).

[0230] In one embodiment, the memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may include one or more of High Bandwidth Memory (HBM), dynamic random access memory (DRAM), static random access memory (SRAM), phase-change random access memory (PRAM), magnetic random access memory (MRAM), resistive random access memory (RRAM), flash memory, and / or electrically erasable programmable read-only memory (EEPROM).

[0231] For example, the processor (830) may be positioned within the first opening (825). For example, the first printed circuit board (820) (e.g., main PCB, main circuit board) and the second printed circuit board (810) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected). For example, the first printed circuit board (820) (e.g., main PCB, main circuit board) and the second printed circuit board (810) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected) via an interposer.

[0232] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (820) and / or a second printed circuit board (810) (e.g., processor PCB, core circuit board).

[0233] According to one embodiment, the shield can (860) may include a second opening (865). The shield can (860) may be placed on a first printed circuit board (820) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (821).

[0234] For example, the shield can (860) may be arranged to cover at least a portion of the first printed circuit board (820) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (810) (e.g., processor PCB, core circuit board). For example, the shield can (860) may be arranged to cover electronic components (821) arranged on the first printed circuit board (820) (e.g., main PCB, main circuit board) and the processor (830) arranged on the second printed circuit board (810) (e.g., processor PCB, core circuit board). For example, the shield can (860) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0235] For example, the first shield can portion (861) of the shield can (860) may be electrically connected (e.g., directly connected or indirectly connected) to the first printed circuit board (820) (e.g., main PCB, main circuit board). The second shield can portion (862) of the shield can (860) may be electrically connected (e.g., directly connected or indirectly connected) to the shielding member (850, metal TIM). The third shield can portion (863) of the shield can (860) may be electrically connected (e.g., directly connected or indirectly connected) to the second conductive member (801) (e.g., gasket). For example, the third shield can portion (863) of the shield can (860) may be located between the first shield can portion (861) and the second shield can portion (862).

[0236] According to one embodiment, a heat dissipation member (840) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (830) and the shielding member (850, metal TIM).

[0237] For example, the heat dissipation member (840) may be positioned to face (e.g., overlap) the processor (830) so as to discharge (e.g., cool, diffuse) heat generated from the processor (830). For example, the shielding member (850, metal TIM) may be positioned to face (e.g., overlap) the electronic components (821) and the processor (830) so as to discharge (e.g., cool, diffuse) heat generated from the electronic components (821) and the processor (830). For example, the shielding member (850, metal TIM) may be positioned to cover (e.g., seal) the second opening (865) of the shield can (860). For example, the shielding member (850, metal TIM) may have not only a heat dissipation function but also an electromagnetic interference (EMI) shielding function.

[0238] According to one embodiment, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (870) may be placed between a conductive plate (890) (e.g., metal rear, metal plate) and a shielding member (850, metal TIM).

[0239] According to one embodiment, when the electronic device (800) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second conductive member (801) (e.g., gasket) may be placed between the shield can (860) and the vapor chamber (870).

[0240] According to one embodiment, the second conductive member (801) (e.g., a gasket) may be disposed on the periphery (e.g., periphery) of the shielding member (850, metal TIM). For example, the second conductive member (801) (e.g., a gasket) may be formed to have substantially the same thickness as the shielding member (850, metal TIM).

[0241] According to one embodiment, the second conductive member (801) (e.g., a gasket) may be electrically connected (e.g., directly or indirectly connected) to the shield can (860) and the vapor chamber (870).

[0242] For example, a first surface (e.g., an upper surface) of a second conductive member (801) (e.g., a gasket) may be electrically connected (e.g., a direct connection or an indirect connection) to a shield can (860) (e.g., a third shield can portion (863)). For example, a second surface (e.g., a lower surface) of a second conductive member (801) (e.g., a gasket) may be electrically connected (e.g., a direct connection or an indirect connection) to a vapor chamber (870).

[0243] According to one embodiment, the first printed circuit board (820) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (860), and the vapor chamber (870) may be electrically connected (e.g., directly connected or indirectly connected) to the conductive plate (890) (e.g., metal rear, metal plate). For example, the shield can (860) and the vapor chamber (870) may be electrically connected (e.g., directly connected or indirectly connected) by a second conductive member (801) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (820) (e.g., main PCB, main circuit board) and the vapor chamber (870). For example, the shield can (860) and the vapor chamber (870) may be electrically connected (e.g., directly or indirectly connected) by a second conductive member (801) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (820) (e.g., main PCB, main circuit board) and the conductive plate (890) (e.g., metal rear). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (830) and electronic components (821), and the noise (710) (e.g., electromagnetic waves) may be shielded (e.g., removed) through a ground path using the second conductive member (801) (e.g., gasket).

[0244] According to one embodiment, the second conductive member (801) (e.g., gasket) may include at least one of a conductive gasket, a conductive cushion pad, a conductive silicone gasket, a surface mounter technology (SMT) gasket, a wire mesh gasket, a ground foam gasket, or a fabric over foam gasket.

[0245] An electronic device (800) according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor (830) and a second printed circuit board (810) (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from the processor (830) and the second printed circuit board (810) (e.g., a processor PCB, a core circuit board).

[0246]

[0247] By applying a second conductive member (801) (e.g., a gasket) to an electronic device (800) to form a ground path between a first printed circuit board (820) (e.g., main PCB, main circuit board) and a conductive plate (890) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0248] For example, compared to the structure of the comparative example, when the processor (530, AP) is on, TIS can be improved in each of the frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66). In the structure of the comparative example, when the processor is on in LTE band 28, a signal attenuation of -5.4 [db] can occur. On the other hand, when the structure of the electronic device (800) of the present disclosure is applied, when the processor is on in LTE band 28, a signal attenuation of -1.1 [db] can occur, thereby improving TIS.

[0249] FIG. 10A is a diagram illustrating an electronic device according to an embodiment of the present disclosure, including a conductive member (e.g., a conductive gasket) electrically connecting a main printed circuit board (PCB) and a vapor chamber. FIG. 10B is a diagram illustrating a second conductive member (gasket) positioned within an opening of a shielding member (e.g., a metal TIM).

[0250] Referring to FIGS. 10A and 10B, an electronic device (1000) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1020) (e.g., a main PCB, a main circuit board), a second printed circuit board (1010) (e.g., a processor PCB, a core circuit board), a processor (1030) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1021), a heat dissipation member (1040) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1050, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1060, shieldcan), a vapor It may include a chamber (1070, vapor chamber), a first conductive member (1080) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1090) (e.g., metal rear, metal plate), and a second conductive member (1001) (e.g., gasket).

[0251] According to one embodiment, a display module (e.g., a display module (160) of FIG. 4) may be placed on a first printed circuit board (1020) (e.g., a main PCB, a main circuit board). The display module (160) may include a display (e.g., a display (410) of FIG. 4) and a digitizer (460).

[0252] According to one embodiment, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (1090) (e.g., metal rear) may be arranged to face the display (410). Between the conductive plate (1090) (e.g., metal rear, metal plate) and the display (410), components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0253] According to one embodiment, a shielding member (1050, metal TIM), a shield can (1060), a vapor chamber (1070), a first conductive member (1080) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1090) (e.g., metal rear, metal plate), and a second conductive member (1001) (e.g., gasket) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1030) and electronic components (1021) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0254] According to one embodiment, a vapor chamber (1070) may be disposed on a conductive plate (1090) (e.g., metal rear). For example, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first conductive member (1080) (e.g., conductive double-sided tape, conductive adhesive layer) may be disposed between the conductive plate (1090) (e.g., metal rear, metal plate) and the vapor chamber (1070). For example, the conductive plate (1090) (e.g., metal rear, metal plate) and the vapor chamber (1070) may be electrically connected (e.g., electrically attached) by the first conductive member (1080) (e.g., conductive double-sided tape, conductive adhesive layer).

[0255] According to one embodiment, a shielding member (1050, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1070).

[0256] For example, the shielding member (1050, metal TIM) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (1050, metal TIM) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (1050, metal TIM) may include a composite material including a thermally conductive filler or a polymer.

[0257] For example, the shielding member (1050, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1030) and electronic components (1021).

[0258] According to one embodiment, a heat dissipation member (1040) (e.g., heat dissipation component, solid TIM (thermal interface material), heat diffusion (thermal conductive) member, thermal grease, heat dissipation paste, heat diffusion (thermal conductive) paste) may be placed on the shielding member (1050, metal TIM) so as to overlap at least a portion of the shielding member (1050, metal TIM).

[0259] According to one embodiment, a first printed circuit board (1020) (e.g., a main PCB, a main circuit board) may include a first opening (1025). A processor (1030) may be placed on a second printed circuit board (1010) (e.g., a processor PCB, a core circuit board) through the first opening (1025). For example, electronic components (1021) and peripheral circuits may be placed on the first printed circuit board (1020) (e.g., a main PCB, a main circuit board). For example, the electronic components (1021) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0260] According to one embodiment, a processor (1030) and core circuits may be arranged on a second printed circuit board (1010) (e.g., a processor PCB, a core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., a power management module (188) of FIG. 1).

[0261] According to one embodiment, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1020) (e.g., main PCB, main circuit board) may be disposed between the display (410) and the conductive plate (1090) (e.g., metal rear). For example, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1020) (e.g., main PCB, main circuit board) may be disposed between the second printed circuit board (1010) (e.g., processor PCB, core circuit board) and the vapor chamber (1070). For example, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1020) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (1010) (e.g., processor PCB, core circuit board) and a shielding member (1050, metal TIM).

[0262] According to one embodiment, when the electronic device (1000) (or the display (410)) is viewed in a first direction (e.g., in the z-axis direction, in a vertical direction), the second printed circuit board (1010) (e.g., a processor PCB, a core circuit board) may be disposed between the display (410) and a conductive plate (1090) (e.g., a metal rear). For example, when the electronic device (1000) (or the display (410)) is viewed in a first direction (e.g., in the z-axis direction, in a vertical direction), the second printed circuit board (1010) (e.g., a processor PCB, a core circuit board) may be disposed between the display (410) and a vapor chamber (1070).

[0263] For example, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1010) (e.g., processor PCB, core circuit board) may be placed between the display (410) and the shielding member (1050, metal TIM).

[0264] For example, the processor (1030) may be positioned within the first opening (1025). For example, the first printed circuit board (1020) (e.g., main PCB, main circuit board) and the second printed circuit board (1010) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected). For example, the first printed circuit board (1020) (e.g., main PCB, main circuit board) and the second printed circuit board (1010) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected) via an interposer.

[0265] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (1020) and / or a second printed circuit board (1010) (e.g., processor PCB, core circuit board).

[0266] According to one embodiment, the shield can (1060) may include a second opening (1065). The shield can (1060) may be placed on a first printed circuit board (1020) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (1021).

[0267] For example, the shield can (1060) may be arranged to cover at least a portion of the first printed circuit board (1020) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (1010) (e.g., processor PCB, core circuit board). For example, the shield can (1060) may be arranged to cover electronic components (1021) arranged on the first printed circuit board (1020) (e.g., main PCB, main circuit board) and the processor (1030) arranged on the second printed circuit board (1010) (e.g., processor PCB, core circuit board). For example, the shield can (1060) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0268] For example, the first shield can portion of the shield can (1060) may be electrically connected (e.g., directly connected or indirectly connected) to the first printed circuit board (1020) (e.g., main PCB, main circuit board). The second shield can portion of the shield can (1060) may be electrically connected (e.g., directly connected or indirectly connected) to the shielding member (1050, metal TIM) and the second conductive member (1001) (e.g., gasket).

[0269] According to one embodiment, a heat dissipation member (1040) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (1030) and the shielding member (1050, metal TIM).

[0270] For example, the heat dissipation member (1040) may be positioned to face (e.g., overlap) the processor (1030) so as to dissipate (e.g., cool, diffuse) heat generated from the processor (1030). For example, the shielding member (1050, metal TIM) may be positioned to face (e.g., overlap) the electronic components (1021) and the processor (1030) so as to dissipate (e.g., cool, diffuse) heat generated from the electronic components (1021) and the processor (1030). For example, the shielding member (1050, metal TIM) may be positioned to cover (e.g., seal) the second opening (1065) of the shield can (1060). For example, the shielding member (1050, metal TIM) may have not only a heat dissipation function but also an electromagnetic interference (EMI) shielding function.

[0271] According to one embodiment, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (1070) may be placed between a conductive plate (1090) (e.g., metal rear, metal plate) and a shielding member (1050, metal TIM).

[0272] According to one embodiment, when the electronic device (1000) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second conductive member (1001) (e.g., gasket) may be placed between the shield can (1060) and the vapor chamber (1070).

[0273] For example, the second conductive member (1001) (e.g., gasket) may be formed to have substantially the same thickness as the shielding member (1050, metal TIM).

[0274] According to one embodiment, the shielding member (1050, metal TIM) may include a third opening (1055). For example, a second conductive member (801) (e.g., a gasket) may be positioned within the third opening (1055) of the shielding member (1050, metal TIM). For example, since the second conductive member (801) (e.g., a gasket) is positioned within the third opening (1055) of the shielding member (1050, metal TIM), the second conductive member (1001) (e.g., a gasket) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (1060) and the vapor chamber (1070). For example, a first surface (e.g., an upper surface) of a second conductive member (1001) (e.g., a gasket) may be electrically connected (e.g., a direct connection or an indirect connection) to a shield can (1060) (e.g., a third shield can portion (863)). For example, a second surface (e.g., a lower surface) of a second conductive member (1001) (e.g., a gasket) may be electrically connected (e.g., a direct connection or an indirect connection) to a vapor chamber (1070).

[0275] According to one embodiment, the first printed circuit board (1020) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (1060), and the vapor chamber (1070) may be electrically connected (e.g., directly connected or indirectly connected) to the conductive plate (1090) (e.g., metal rear, metal plate). For example, the shield can (1060) and the vapor chamber (1070) may be electrically connected (e.g., directly connected or indirectly connected) by a second conductive member (1001) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1020) (e.g., main PCB, main circuit board) and the vapor chamber (1070). For example, the shield can (1060) and the vapor chamber (1070) may be electrically connected (e.g., directly or indirectly connected) by a second conductive member (1001) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1020) (e.g., main PCB, main circuit board) and the conductive plate (1090) (e.g., metal rear). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1030) and electronic components (1021), and the noise (710) (e.g., electromagnetic waves) may be shielded (e.g., removed) through a ground path using the second conductive member (1001) (e.g., gasket).

[0276] According to one embodiment, the second conductive member (1001) (e.g., gasket) may include at least one of a conductive gasket, a conductive cushion pad, a conductive silicone gasket, a surface mounter technology (SMT) gasket, a wire mesh gasket, a ground foam gasket, or a fabric over foam gasket.

[0277] An electronic device (1000) according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor (1030) and a second printed circuit board (1010) (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from the processor (1030) and the second printed circuit board (1010) (e.g., a processor PCB, a core circuit board).

[0278] By applying a second conductive member (1001) (e.g., a gasket) to an electronic device (1000) to form a ground path between a first printed circuit board (1020) (e.g., main PCB, main circuit board) and a conductive plate (1090) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0279] FIG. 11 is a diagram showing an electronic device according to an embodiment of the present disclosure, including a conductive member (e.g., a conductive gasket) electrically connecting a main printed circuit board (PCB) and a vapor chamber. FIG. 12 is a diagram showing that a conductive member (e.g., a conductive gasket) is arranged within a shielding member (e.g., a metal TIM (thermal interface material)). FIG. 13 is a diagram showing the structure of the shielding member (e.g., a metal TIM). FIG. 12 shows a contact area (1102) where a second conductive member (1101) (e.g., a gasket) and a vapor chamber (1170, vapor chamber) are electrically connected.

[0280] Referring to FIGS. 11 to 13, an electronic device (1100) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1120) (e.g., a main PCB, a main circuit board), a second printed circuit board (1110) (e.g., a processor PCB, a core circuit board), a processor (1130) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1121), a heat dissipation member (1140) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1150, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1160, shieldcan), a vapor chamber (1170, The vapor chamber may include a first conductive member (1180) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1190) (e.g., metal rear, metal plate), and a second conductive member (1101) (e.g., gasket).

[0281] According to one embodiment, a display module (e.g., a display module (160) of FIG. 4) may be placed on a first printed circuit board (1120) (e.g., a main PCB, a main circuit board). The display module (160) may include a display (e.g., a display (410) of FIG. 4) and a digitizer (460).

[0282] According to one embodiment, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (1190) (e.g., metal rear) may be arranged to face the display (410). Between the conductive plate (1190) (e.g., metal rear, metal plate) and the display (410), components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0283] According to one embodiment, a shielding member (1150, metal TIM), a shield can (1160), a vapor chamber (1170), a first conductive member (1180) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1190) (e.g., metal rear, metal plate), and a second conductive member (1101) (e.g., gasket) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1130) and electronic components (1121) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0284] According to one embodiment, a vapor chamber (1170) may be disposed on a conductive plate (1190) (e.g., metal rear). For example, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first conductive member (1180) (e.g., conductive double-sided tape, conductive adhesive layer) may be disposed between the conductive plate (1190) (e.g., metal rear, metal plate) and the vapor chamber (1170). For example, the conductive plate (1190) (e.g., metal rear, metal plate) and the vapor chamber (1170) may be electrically connected (e.g., electrically attached) by the first conductive member (1180) (e.g., conductive double-sided tape, conductive adhesive layer).

[0285] According to one embodiment, a shielding member (1150, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1170).

[0286] For example, the shielding member (1150, metal TIM) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (1150, metal TIM) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (1150, metal TIM) may include a composite material including a thermally conductive filler or a polymer.

[0287] For example, the shielding member (1150, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1130) and electronic components (1121).

[0288] According to one embodiment, a heat dissipation member (1140) (e.g., heat dissipation component, solid TIM (thermal interface material), heat diffusion (thermal conductive) member, thermal grease, heat dissipation paste, heat diffusion (thermal conductive) paste) may be placed on the shielding member (1150, metal TIM) so as to overlap at least a portion of the shielding member (1150, metal TIM).

[0289] According to one embodiment, a first printed circuit board (1120) (e.g., a main PCB, a main circuit board) may include a first opening (1125). A processor (1130) may be placed on a second printed circuit board (1110) (e.g., a processor PCB, a core circuit board) through the first opening (1125). For example, electronic components (1121) and peripheral circuits may be placed on the first printed circuit board (1120) (e.g., a main PCB, a main circuit board). For example, the electronic components (1121) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0290] According to one embodiment, a processor (1130) and core circuits may be arranged on a second printed circuit board (1110) (e.g., processor PCB, core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., power management module (188) of FIG. 1).

[0291] According to one embodiment, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1120) (e.g., main PCB, main circuit board) may be disposed between the display (410) and the conductive plate (1190) (e.g., metal rear). For example, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1120) (e.g., main PCB, main circuit board) may be disposed between the second printed circuit board (1110) (e.g., processor PCB, core circuit board) and the vapor chamber (1170). For example, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1120) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (1110) (e.g., processor PCB, core circuit board) and a shielding member (1150, metal TIM).

[0292] According to one embodiment, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1110) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the conductive plate (1190) (e.g., metal rear). For example, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1110) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the vapor chamber (1170).

[0293] For example, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1110) (e.g., processor PCB, core circuit board) may be placed between the display (410) and the shielding member (1150, metal TIM).

[0294] For example, the processor (1130) may be positioned within the first opening (1125). For example, the first printed circuit board (1120) (e.g., main PCB, main circuit board) and the second printed circuit board (1110) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected). For example, the first printed circuit board (1120) (e.g., main PCB, main circuit board) and the second printed circuit board (1110) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected) via an interposer.

[0295] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (1120) and / or a second printed circuit board (1110) (e.g., processor PCB, core circuit board).

[0296] According to one embodiment, the shield can (1160) may include a second opening (1165). The shield can (1160) may be placed on a first printed circuit board (1120) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (1121).

[0297] For example, the shield can (1160) may be arranged to cover at least a portion of the first printed circuit board (1120) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (1110) (e.g., processor PCB, core circuit board). For example, the shield can (1160) may be arranged to cover electronic components (1121) arranged on the first printed circuit board (1120) (e.g., main PCB, main circuit board) and the processor (1130) arranged on the second printed circuit board (1110) (e.g., processor PCB, core circuit board). For example, the shield can (1160) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0298] For example, a first shield can portion of a shield can (1160) may be electrically connected (e.g., directly connected or indirectly connected) to a first printed circuit board (1120) (e.g., main PCB, main circuit board). A second shield can portion of a shield can (1160) may be electrically connected (e.g., directly connected or indirectly connected) to a shielding member (1150, metal TIM). For example, a second conductive member (1101) (e.g., gasket) may be electrically connected (e.g., indirectly connected) to the shield can (1160) via the shielding member (1150, metal TIM).

[0299] According to one embodiment, a heat dissipation member (1140) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (1130) and the shielding member (1150, metal TIM).

[0300] For example, the heat dissipation member (1140) may be positioned to face (e.g., overlap) the processor (1130) so as to discharge (e.g., cool, diffuse) heat generated from the processor (1130). For example, the shielding member (1150, metal TIM) may be positioned to face (e.g., overlap) the electronic components (1121) and the processor (1130) so as to discharge (e.g., cool, diffuse) heat generated from the electronic components (1121) and the processor (1130). For example, the shielding member (1150, metal TIM) may be positioned to cover (e.g., seal) the second opening (1165) of the shield can (1160). For example, the shielding member (1150, metal TIM) may have not only a heat dissipation function but also an electromagnetic interference (EMI) shielding function.

[0301] According to one embodiment, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (1170) may be placed between a conductive plate (1190) (e.g., metal rear, metal plate) and a shielding member (1150, metal TIM).

[0302] According to one embodiment, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second conductive member (1101) (e.g., gasket) may be placed between the shield can (1160) and the vapor chamber (1170).

[0303] According to one embodiment, when the electronic device (1100) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second conductive member (1101) (e.g., gasket) may be placed between a shielding member (1150, metal TIM) and a vapor chamber (1170).

[0304] For example, the second conductive member (1101) (e.g., gasket) may be formed with a thickness thinner than the thickness of the shielding member (1150, metal TIM).

[0305] According to one embodiment, the shielding member (1150, metal TIM) may include a shielding insulating layer (1151) (e.g., a non-conductive layer), a conductive layer (1152) (e.g., a metal conductive layer), and a conductive adhesive layer (1153) (e.g., a conductive double-sided tape). The conductive layer (1152) (e.g., a metal conductive layer) may be disposed on the shielding insulating layer (1151) (e.g., a non-conductive layer). The conductive adhesive layer (1153) (e.g., a conductive double-sided tape) may be disposed on the conductive layer (1152) (e.g., a metal conductive layer). The shielding insulating layer (1151) (e.g., a non-conductive layer) may be disposed to face the vapor chamber (1170). The conductive adhesive layer (1153) (e.g., a conductive double-sided tape) may be disposed to face the shield can (1160). The conductive adhesive layer (1153) (e.g., conductive double-sided tape) can be electrically connected (e.g., directly or indirectly connected) to the shield can (1160).

[0306] For example, the shielding member (1150, metal TIM) may include a groove (1151a). At least a portion of the shielding insulating layer (1151) (e.g., a non-conductive layer) may be removed to form the groove (1151a). A second conductive member (1101) (e.g., a gasket) may be disposed within the groove (1151a) of the shielding member (1150, metal TIM). Since the second conductive member (1101) (e.g., a gasket) is disposed within the groove (1151a) of the shielding member (1150, metal TIM), the second conductive member (1101) (e.g., a gasket) may be electrically connected (e.g., directly connected or indirectly connected) to the shielding member (1150, metal TIM) and the vapor chamber (1170). The second conductive member (1101) (e.g., a gasket) may be electrically connected (e.g., indirectly connected) to the shield can (1160) via the shielding member (1150, metal TIM). The second conductive member (1101) (e.g., a gasket) may be electrically connected (e.g., directly connected) to the vapor chamber (1170).

[0307] According to one embodiment, the first printed circuit board (1120) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (1160), and the vapor chamber (1170) may be electrically connected (e.g., directly connected or indirectly connected) to the conductive plate (1190) (e.g., metal rear, metal plate). For example, the shield can (1160) and the vapor chamber (1170) may be electrically connected (e.g., directly connected or indirectly connected) by a second conductive member (1101) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1120) (e.g., main PCB, main circuit board) and the vapor chamber (1170). For example, the shield can (1160) and the vapor chamber (1170) may be electrically connected (e.g., directly or indirectly connected) by a second conductive member (1101) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1120) (e.g., main PCB, main circuit board) and the conductive plate (1190) (e.g., metal rear). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1130) and electronic components (1121), and the noise (710) (e.g., electromagnetic waves) may be shielded (e.g., removed) through a ground path using the second conductive member (1101) (e.g., a gasket).

[0308] According to one embodiment, the second conductive member (1101) (e.g., gasket) may include at least one of a conductive gasket, a conductive cushion pad, a conductive silicone gasket, a surface mounter technology (SMT) gasket, a wire mesh gasket, a ground foam gasket, or a fabric over foam gasket.

[0309] An electronic device (1100) according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor (1130) and a second printed circuit board (1110) (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from the processor (1130) and the second printed circuit board (1110) (e.g., a processor PCB, a core circuit board).

[0310] By applying a second conductive member (1101) (e.g., a gasket) to an electronic device (1100) to form a ground path between a first printed circuit board (1120) (e.g., main PCB, main circuit board) and a conductive plate (1190) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0311] FIG. 14a is a drawing showing an electronic device according to one embodiment of the present disclosure, including a conductive member (e.g., a conductive gasket) electrically connecting a main printed circuit board (PCB) and a vapor chamber. FIG. 14b is a drawing showing the shape of the shield can illustrated in FIG. 14a.

[0312] Referring to FIGS. 14A and 14B, an electronic device (1400) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1420) (e.g., a main PCB, a main circuit board), a second printed circuit board (1410) (e.g., a processor PCB, a core circuit board), a processor (1430) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1421), a heat dissipation member (1440) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1450, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1460, shieldcan), a vapor It may include a chamber (1470, vapor chamber), a first conductive member (1480) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1490) (e.g., metal rear, metal plate), and a second conductive member (1401) (e.g., gasket).

[0313] According to one embodiment, a display module (e.g., a display module (160) of FIG. 4) may be placed on a first printed circuit board (1420) (e.g., a main PCB, a main circuit board). The display module (160) may include a display (e.g., a display (410) of FIG. 4) and a digitizer (460).

[0314] According to one embodiment, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (1490) (e.g., metal rear) may be arranged to face the display (410). Between the conductive plate (1490) (e.g., metal rear, metal plate) and the display (410), components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0315] According to one embodiment, a shielding member (1450, metal TIM), a shield can (1460), a vapor chamber (1470), a first conductive member (1480) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1490) (e.g., metal rear, metal plate), and a second conductive member (1401) (e.g., gasket) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1430) and electronic components (1421) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0316] According to one embodiment, a vapor chamber (1470) may be disposed on a conductive plate (1490) (e.g., a metal rear). For example, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., a z-axis direction, a vertical direction), a first conductive member (1480) (e.g., a conductive double-sided tape, a conductive adhesive layer) may be disposed between the conductive plate (1490) (e.g., a metal rear, a metal plate) and the vapor chamber (1470). For example, the conductive plate (1490) (e.g., a metal rear, a metal plate) and the vapor chamber (1470) may be electrically connected (e.g., electrically attached) by the first conductive member (1480) (e.g., a conductive double-sided tape, a conductive adhesive layer).

[0317] According to one embodiment, a shielding member (1450, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1470).

[0318] For example, the shielding member (1450, metal TIM) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (1450, metal TIM) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (1450, metal TIM) may include a composite material including a thermally conductive filler or a polymer.

[0319] For example, the shielding member (1450, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1430) and electronic components (1421).

[0320] According to one embodiment, a heat dissipation member (1440) (e.g., heat dissipation component, solid TIM (thermal interface material), heat diffusion (thermal conductive) member, thermal grease, heat dissipation paste, heat diffusion (thermal conductive) paste) may be placed on the shielding member (1450, metal TIM) so as to overlap at least a portion of the shielding member (1450, metal TIM).

[0321] According to one embodiment, a first printed circuit board (1420) (e.g., a main PCB, a main circuit board) may include a first opening (1425). A processor (1430) may be placed on a second printed circuit board (1410) (e.g., a processor PCB, a core circuit board) through the first opening (1425). For example, electronic components (1421) and peripheral circuits may be placed on the first printed circuit board (1420) (e.g., a main PCB, a main circuit board). For example, the electronic components (1421) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0322] According to one embodiment, a processor (1430) and core circuits may be arranged on a second printed circuit board (1410) (e.g., a processor PCB, a core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., a power management module (188) of FIG. 1).

[0323] According to one embodiment, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1420) (e.g., main PCB, main circuit board) may be disposed between the display (410) and the conductive plate (1490) (e.g., metal rear). For example, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1420) (e.g., main PCB, main circuit board) may be disposed between the second printed circuit board (1410) (e.g., processor PCB, core circuit board) and the vapor chamber (1470). For example, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1420) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (1410) (e.g., processor PCB, core circuit board) and a shielding member (1450, metal TIM).

[0324] According to one embodiment, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1410) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the conductive plate (1490) (e.g., metal rear). For example, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1410) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the vapor chamber (1470).

[0325] For example, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1410) (e.g., processor PCB, core circuit board) may be placed between the display (410) and a shielding member (1450, metal TIM).

[0326] For example, the processor (1430) may be positioned within the first opening (1425). For example, the first printed circuit board (1420) (e.g., main PCB, main circuit board) and the second printed circuit board (1410) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected). For example, the first printed circuit board (1420) (e.g., main PCB, main circuit board) and the second printed circuit board (1410) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected) via an interposer.

[0327] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (1420) and / or a second printed circuit board (1410) (e.g., processor PCB, core circuit board).

[0328] According to one embodiment, the shield can (1460) may include a second opening (1465). The shield can (1460) may be placed on a first printed circuit board (1420) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (1421).

[0329] For example, the shield can (1460) may be arranged to cover at least a portion of the first printed circuit board (1420) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (1410) (e.g., processor PCB, core circuit board). For example, the shield can (1460) may be arranged to cover electronic components (1421) arranged on the first printed circuit board (1420) (e.g., main PCB, main circuit board) and the processor (1430) arranged on the second printed circuit board (1410) (e.g., processor PCB, core circuit board). For example, the shield can (1460) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0330] For example, the first shield can portion (1461) of the shield can (1460) may be electrically connected (e.g., directly connected or indirectly connected) to the first printed circuit board (1420) (e.g., main PCB, main circuit board). The second shield can portion (1462) of the shield can (1460) may be electrically connected (e.g., directly connected or indirectly connected) to the shielding member (1450, metal TIM). The third shield can portion (1463) of the shield can (1460) may be electrically connected (e.g., directly connected or indirectly connected) to the second conductive member (1401) (e.g., gasket). For example, the third shield can portion (1463) of the shield can (1460) may be located between the first shield can portion (1461) and the second shield can portion (1462). For example, the first shield can portion (1461) and the second shield can portion (1462) of the shield can (1460) may be formed to be inclined (or curved) so that the second shield can portion (1462) of the shield can (1460) and the second conductive member (1401) (e.g., a gasket) may be electrically connected (e.g., directly connected or indirectly connected). The second shield can portion (1462) and the third shield can portion (1463) of the shield can (1460) may be formed to be inclined (or curved).

[0331] According to one embodiment, a heat dissipation member (1440) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (1430) and the shielding member (1450, metal TIM).

[0332] For example, the heat dissipation member (1440) may be positioned to face (e.g., overlap) the processor (1430) so as to discharge (e.g., cool, diffuse) heat generated from the processor (1430). For example, the shielding member (1450, metal TIM) may be positioned to face (e.g., overlap) the electronic components (1421) and the processor (1430) so as to discharge (e.g., cool, diffuse) heat generated from the electronic components (1421) and the processor (1430). For example, the shielding member (1450, metal TIM) may be positioned to cover (e.g., seal) the second opening (1465) of the shield can (1460). For example, the shielding member (1450, metal TIM) may have not only a heat dissipation function but also an electromagnetic interference (EMI) shielding function.

[0333] According to one embodiment, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (1470) may be placed between a conductive plate (1490) (e.g., metal rear, metal plate) and a shielding member (1450, metal TIM).

[0334] According to one embodiment, when the electronic device (1400) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second conductive member (1401) (e.g., gasket) may be placed between the shield can (1460) and the vapor chamber (1470).

[0335] According to one embodiment, the second conductive member (1401) (e.g., gasket) may be disposed on the periphery (e.g., periphery) of the shielding member (1450, metal TIM). For example, the second conductive member (1401) (e.g., gasket) may be formed thicker than the shielding member (1450, metal TIM). For example, the second conductive member (1401) (e.g., gasket) may be formed thicker than the heat dissipation member (1440). For example, the second conductive member (1401) (e.g., gasket) may be formed to have a thickness substantially equal to the sum of the thickness of the shielding member (1450, metal TIM) and the thickness of the heat dissipation member (1440). For example, the second conductive member (1401) (e.g., gasket) may be formed thicker than the sum of the thickness of the shielding member (1450, metal TIM) and the thickness of the heat dissipation member (1440).

[0336] According to one embodiment, the second conductive member (1401) (e.g., a gasket) may be electrically connected (e.g., directly or indirectly connected) to the shield can (1460) and the vapor chamber (1470).

[0337] For example, a first surface (e.g., an upper surface) of a second conductive member (1401) (e.g., a gasket) may be electrically connected (e.g., a direct connection or an indirect connection) to a shield can (1460) (e.g., a third shield can portion (1463)). For example, a second surface (e.g., a lower surface) of a second conductive member (1401) (e.g., a gasket) may be electrically connected (e.g., a direct connection or an indirect connection) to a vapor chamber (1470).

[0338] According to one embodiment, the first printed circuit board (1420) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (1460), and the vapor chamber (1470) may be electrically connected (e.g., directly connected or indirectly connected) to the conductive plate (1490) (e.g., metal rear, metal plate). For example, the shield can (1460) and the vapor chamber (1470) may be electrically connected (e.g., directly connected or indirectly connected) by a second conductive member (1401) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1420) (e.g., main PCB, main circuit board) and the vapor chamber (1470). For example, the shield can (1460) and the vapor chamber (1470) may be electrically connected (e.g., directly or indirectly connected) by a second conductive member (1401) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1420) (e.g., main PCB, main circuit board) and the conductive plate (1490) (e.g., metal rear). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1430) and electronic components (1421), and the noise (710) (e.g., electromagnetic waves) may be shielded (e.g., removed) through a ground path using the second conductive member (1401) (e.g., gasket).

[0339] According to one embodiment, the second conductive member (1401) (e.g., a gasket) may include at least one of a conductive gasket, a conductive cushion pad, a conductive silicone gasket, a surface mounter technology (SMT) gasket, a wire mesh gasket, a ground foam gasket, or a fabric over foam gasket.

[0340] An electronic device (1400) according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor (1430) and a second printed circuit board (1410) (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from the processor (1430) and the second printed circuit board (1410) (e.g., a processor PCB, a core circuit board). By applying a second conductive member (1401) (e.g., a gasket) to an electronic device (1400) to form a ground path between a first printed circuit board (1420) (e.g., main PCB, main circuit board) and a conductive plate (1490) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0341] Fig. 15a is a drawing showing an electronic device including a shield can electrically connecting a main printed circuit board (PCB) and a vapor chamber. Fig. 15b is a drawing showing a groove formed on the upper surface of the vapor chamber shown in Fig. 15a.

[0342] Referring to FIGS. 15A and 15B, an electronic device (1500) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1520) (e.g., a main PCB, a main circuit board), a second printed circuit board (1510) (e.g., a processor PCB, a core circuit board), a processor (1530) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1521), a heat dissipation member (1540) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1550, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1501, shieldcan), a vapor It may include a chamber (1570, vapor chamber), a first conductive member (1580) (e.g., conductive double-sided tape, conductive adhesive layer), and a conductive plate (1590) (e.g., metal rear).

[0343] According to one embodiment, a display module (e.g., a display module (160) of FIG. 4) may be placed on a first printed circuit board (1520) (e.g., a main PCB, a main circuit board). The display module (160) may include a display (e.g., a display (410) of FIG. 4) and a digitizer (460).

[0344] According to one embodiment, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (1590) (e.g., metal rear) may be arranged to face the display (410). Components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged between the conductive plate (1590) (e.g., metal rear, metal plate) and the display (410).

[0345] According to one embodiment, a shielding member (1550, metal TIM), a shield can (1501), a vapor chamber (1570), a first conductive member (1580) (e.g., conductive double-sided tape, conductive adhesive layer), and a conductive plate (1590) (e.g., metal rear, metal plate) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1530) and electronic components (1521) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0346] According to one embodiment, a vapor chamber (1570) may be disposed on a conductive plate (1590) (e.g., a metal rear). For example, when the electronic device (1500) (or the display (410)) is viewed in a first direction (e.g., a z-axis direction, a vertical direction), a first conductive member (1580) (e.g., a conductive double-sided tape, a conductive adhesive layer) may be disposed between the conductive plate (1590) (e.g., a metal rear, a metal plate) and the vapor chamber (1570). For example, the conductive plate (1590) (e.g., a metal rear, a metal plate) and the vapor chamber (1570) may be electrically connected (e.g., electrically attached) by the first conductive member (1580) (e.g., a conductive double-sided tape, a conductive adhesive layer).

[0347] According to one embodiment, a shielding member (1550, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1570).

[0348] For example, the shielding member (1550, metal TIM) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (1550, metal TIM) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (1550, metal TIM) may include a composite material including a thermally conductive filler or a polymer.

[0349] For example, a shielding member (1550, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1530) and electronic components (1521).

[0350] According to one embodiment, a heat dissipation member (1540) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat spreading paste, heat spreading (thermal conductive) paste)) may be placed on the shielding member (1550, metal TIM) so as to overlap at least a portion of the shielding member (1550, metal TIM).

[0351] According to one embodiment, a first printed circuit board (1520) (e.g., a main PCB, a main circuit board) may include a first opening (1525). A processor (1530) may be placed on a second printed circuit board (1510) (e.g., a processor PCB, a core circuit board) through the first opening (1525). For example, electronic components (1521) and peripheral circuits may be placed on the first printed circuit board (1520) (e.g., a main PCB, a main circuit board). For example, the electronic components (1521) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0352] According to one embodiment, a processor (1530) and core circuits may be arranged on a second printed circuit board (1510) (e.g., a processor PCB, a core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., a power management module (188) of FIG. 1).

[0353] According to one embodiment, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1520) (e.g., main PCB, main circuit board) may be disposed between the display (410) and the conductive plate (1590) (e.g., metal rear). For example, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1520) (e.g., main PCB, main circuit board) may be disposed between the second printed circuit board (1510) (e.g., processor PCB, core circuit board) and the vapor chamber (1570). For example, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1520) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (1510) (e.g., processor PCB, core circuit board) and a shielding member (1550, metal TIM).

[0354] According to one embodiment, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1510) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the conductive plate (1590) (e.g., metal rear). For example, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1510) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the vapor chamber (1570).

[0355] For example, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1510) (e.g., processor PCB, core circuit board) may be placed between the display (410) and a shielding member (1550, metal TIM).

[0356] For example, the processor (1530) may be positioned within the first opening (1525). For example, the first printed circuit board (1520) (e.g., main PCB, main circuit board) and the second printed circuit board (1510) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected). For example, the first printed circuit board (1520) (e.g., main PCB, main circuit board) and the second printed circuit board (1510) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected) via an interposer.

[0357] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (1520) and / or a second printed circuit board (1510) (e.g., processor PCB, core circuit board).

[0358] According to one embodiment, the shield can (1501) may include a second opening (1505). The shield can (1501) may be placed on a first printed circuit board (1520) (e.g., main PCB, main circuit board) to surround the periphery of electronic components (1521).

[0359] For example, the shield can (1501) may be arranged to cover at least a portion of a first printed circuit board (1520) (e.g., a main PCB, a main circuit board) and at least a portion of a second printed circuit board (1510) (e.g., a processor PCB, a core circuit board). For example, the shield can (1501) may be arranged to cover electronic components (1521) arranged on the first printed circuit board (1520) (e.g., a main PCB, a main circuit board) and a processor (1530) arranged on the second printed circuit board (1510) (e.g., a processor PCB, a core circuit board). For example, the shield can (1501) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0360] For example, the first shield can portion of the shield can (1501) may be electrically connected (e.g., directly connected or indirectly connected) to the first printed circuit board (1520) (e.g., main PCB, main circuit board). The second shield can portion of the shield can (1501) may be electrically connected (e.g., directly connected or indirectly connected) to the vapor chamber (1570).

[0361] According to one embodiment, the second shield can portion of the shield can (1501) may include a protrusion (1501a) so that the shield can (1501) can be electrically connected to and fixed to the vapor chamber (1570).

[0362] According to one embodiment, a groove (1571) may be formed in at least a portion of the vapor chamber (1570). For example, the groove (1571) of the vapor chamber (1570) may be formed at a position facing the protrusion (1501a) formed in the second shield can portion of the shield can (1501). The protrusion (1501a) of the second shield can portion may be brought into contact with the groove (1571) of the vapor chamber (1570), so that the shield can (1501) and the vapor chamber (1570) may be electrically connected and fixed.

[0363] According to one embodiment, a heat dissipation member (1540) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (1530) and the shielding member (1550, metal TIM).

[0364] For example, the heat dissipation member (1540) may be positioned to face (e.g., overlap) the processor (1530) so as to dissipate (e.g., cool, diffuse) heat generated from the processor (1530). For example, the shielding member (1550, metal TIM) may be positioned to face (e.g., overlap) the electronic components (1521) and the processor (1530) so as to dissipate (e.g., cool, diffuse) heat generated from the electronic components (1521) and the processor (1530). For example, the shielding member (1550, metal TIM) may be positioned to cover (e.g., seal) the second opening (1505) of the shield can (1501). For example, the shielding member (1550, metal TIM) may have not only a heat dissipation function but also an electromagnetic interference (EMI) shielding function.

[0365] According to one embodiment, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (1570) may be placed between a conductive plate (1590) (e.g., metal rear, metal plate) and a shielding member (1550, metal TIM).

[0366] According to one embodiment, when the electronic device (1500) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the shield can (1501) may be placed between the first printed circuit board (1520) (e.g., main PCB, main circuit board) and the vapor chamber (1570).

[0367] According to one embodiment, the first printed circuit board (1520) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (1501), and the vapor chamber (1570) may be electrically connected (e.g., directly connected or indirectly connected) to the conductive plate (1590) (e.g., metal rear, metal plate). For example, a ground path may be formed between the first printed circuit board (1520) (e.g., main PCB, main circuit board) and the vapor chamber (1570) by the shield can (1501). For example, a ground path may be formed between the first printed circuit board (1520) (e.g., main PCB, main circuit board) and the conductive plate (1590) (e.g., metal rear) by the shield can (1501). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1530) and electronic components (1521), and the noise (710) (e.g., electromagnetic waves) can be shielded (e.g., removed) through a ground pass using a shield can (1501).

[0368] An electronic device (1500) according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor (1530) and a second printed circuit board (1510) (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from the processor (1530) and the second printed circuit board (1510) (e.g., a processor PCB, a core circuit board). By applying a shield can (1501) to an electronic device (1500) to form a ground path between a first printed circuit board (1520) (e.g., main PCB, main circuit board) and a conductive plate (1590) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0369] FIG. 16 is a drawing showing an electronic device according to one embodiment of the present disclosure, which includes a conductive member (e.g., a conductive gasket) that electrically connects a main printed circuit board (PCB) and a vapor chamber.

[0370] Referring to FIG. 16, an electronic device (1600) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1620) (e.g., a main PCB, a main circuit board), a second printed circuit board (1610) (e.g., a processor PCB, a core circuit board), a processor (1630) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1621), a heat dissipation member (1640) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1650, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1660, shieldcan), a vapor chamber (1670, vapor chamber), a first It may include a conductive member (1680) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1690) (e.g., metal rear, metal plate), and a second conductive member (1601) (e.g., gasket).

[0371] According to one embodiment, a display module (e.g., display module (160) of FIG. 4) may be placed on a first printed circuit board (1620) (e.g., main PCB, main circuit board). The display module (160) may include a display (e.g., display (410) of FIG. 4) and a digitizer (460).

[0372] According to one embodiment, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the conductive plate (1690) (e.g., metal rear) may be arranged to face the display (410). Between the conductive plate (1690) (e.g., metal rear, metal plate) and the display (410), components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0373] According to one embodiment, a shielding member (1650, metal TIM), a shield can (1660), a vapor chamber (1670), a first conductive member (1680) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1690) (e.g., metal rear, metal plate), and a second conductive member (1601) (e.g., gasket) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1630) and electronic components (1621) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0374] According to one embodiment, a vapor chamber (1670) may be disposed on a conductive plate (1690) (e.g., a metal rear). For example, when the electronic device (1600) (or the display (410)) is viewed in a first direction (e.g., a z-axis direction, a vertical direction), a first conductive member (1680) (e.g., a conductive double-sided tape, a conductive adhesive layer) may be disposed between the conductive plate (1690) (e.g., a metal rear, a metal plate) and the vapor chamber (1670). For example, the conductive plate (1690) (e.g., a metal rear, a metal plate) and the vapor chamber (1670) may be electrically connected (e.g., electrically attached) by the first conductive member (1680) (e.g., a conductive double-sided tape, a conductive adhesive layer).

[0375] According to one embodiment, a shielding member (1650, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1670).

[0376] For example, the shielding member (1650, metal TIM) may include a material (e.g., metal) or alloy (e.g., CuSi) having high electrical and thermal conductivity. For example, the shielding member (1650, metal TIM) may include a material having high thermal conductivity, such as stainless steel, copper (Cu), nickel (Ni), silver (Ag), gold (Au), silicon (Si), or aluminum (Al). For example, the shielding member (1650, metal TIM) may include a composite material including a thermally conductive filler or a polymer.

[0377] For example, the shielding member (1650, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1630) and electronic components (1621).

[0378] According to one embodiment, a heat dissipation member (1640) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat spreading paste, heat spreading (thermal conductive) paste)) may be placed on the shielding member (1650, metal TIM) so as to overlap at least a portion of the shielding member (1650, metal TIM).

[0379] According to one embodiment, a first printed circuit board (1620) (e.g., a main PCB, a main circuit board) may include a first opening (1625). A processor (1630) may be placed on a second printed circuit board (1610) (e.g., a processor PCB, a core circuit board) through the first opening (1625). For example, electronic components (1621) and peripheral circuits may be placed on the first printed circuit board (1620) (e.g., a main PCB, a main circuit board). For example, the electronic components (1621) may include a communication module (e.g., a communication module (190) of FIG. 1) and / or a controller.

[0380] According to one embodiment, a processor (1630) and core circuits may be arranged on a second printed circuit board (1610) (e.g., a processor PCB, a core circuit board). For example, the core circuits may include a power management integrated circuit (PMIC) (e.g., a power management module (188) of FIG. 1).

[0381] According to one embodiment, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1620) (e.g., main PCB, main circuit board) may be disposed between the display (410) and the conductive plate (1690) (e.g., metal rear). For example, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the first printed circuit board (1620) (e.g., main PCB, main circuit board) may be disposed between the second printed circuit board (1610) (e.g., processor PCB, core circuit board) and the vapor chamber (1670). For example, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1620) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (1610) (e.g., processor PCB, core circuit board) and a shielding member (1650, metal TIM).

[0382] According to one embodiment, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1610) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the conductive plate (1690) (e.g., metal rear). For example, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), the second printed circuit board (1610) (e.g., processor PCB, core circuit board) may be disposed between the display (410) and the vapor chamber (1670).

[0383] For example, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1610) (e.g., processor PCB, core circuit board) may be placed between the display (410) and a shielding member (1650, metal TIM).

[0384] For example, the processor (1630) may be positioned within the first opening (1625). For example, the first printed circuit board (1620) (e.g., main PCB, main circuit board) and the second printed circuit board (1610) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected). For example, the first printed circuit board (1620) (e.g., main PCB, main circuit board) and the second printed circuit board (1610) (e.g., processor PCB, core circuit board) may be electrically connected (e.g., directly connected or indirectly connected) via an interposer.

[0385] According to one embodiment, memory (e.g., memory (130) of FIG. 1, memory (130) of FIG. 4) may be disposed on a first printed circuit board (1620) and / or a second printed circuit board (1610) (e.g., processor PCB, core circuit board).

[0386] According to one embodiment, the shield can (1660) may include a second opening (1665). The shield can (1660) may be placed on a first printed circuit board (1620) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (1621).

[0387] For example, the shield can (1660) may be arranged to cover at least a portion of the first printed circuit board (1620) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (1610) (e.g., processor PCB, core circuit board). For example, the shield can (1660) may be arranged to cover electronic components (1621) arranged on the first printed circuit board (1620) (e.g., main PCB, main circuit board) and a processor (1630) arranged on the second printed circuit board (1610) (e.g., processor PCB, core circuit board). For example, the shield can (1660) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0388] For example, a first shield-can portion of a shield-can (1660) may be electrically connected (e.g., directly connected or indirectly connected) to a first printed circuit board (1620) (e.g., main PCB, main circuit board). A second shield-can portion of a shield-can (1660) may be electrically connected (e.g., directly connected or indirectly connected) to a shielding member (1650, metal TIM). A third shield-can portion of a shield-can (1660) may be electrically connected (e.g., directly connected or indirectly connected) to a second conductive member (1601) (e.g., a gasket). For example, the third shield-can portion of a shield-can (1660) may be located between the first shield-can portion and the second shield-can portion.

[0389] According to one embodiment, a heat dissipation member (1640) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (1630) and the shielding member (1650, metal TIM).

[0390] For example, the heat dissipation member (1640) may be positioned to face (e.g., overlap) the processor (1630) so as to dissipate (e.g., cool, diffuse) heat generated from the processor (1630). For example, the shielding member (1650, metal TIM) may be positioned to face (e.g., overlap) the electronic components (1621) and the processor (1630) so as to dissipate (e.g., cool, diffuse) heat generated from the electronic components (1621) and the processor (1630). For example, the shielding member (1650, metal TIM) may be positioned to cover (e.g., seal) the second opening (1665) of the shield can (1660). For example, the shielding member (1650, metal TIM) may have not only a heat dissipation function but also an electromagnetic interference (EMI) shielding function.

[0391] According to one embodiment, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (1670) may be placed between a conductive plate (1690) (e.g., metal rear, metal plate) and a shielding member (1650, metal TIM).

[0392] According to one embodiment, when the electronic device (1600) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second conductive member (1601) (e.g., gasket) may be placed between the shield can (1660) and the vapor chamber (1670).

[0393] According to one embodiment, the second conductive member (1601) (e.g., a gasket) may be disposed on the periphery (e.g., around) of the shielding member (1650, metal TIM). For example, the second conductive member (1601) (e.g., a gasket) may be formed to have substantially the same thickness as the shielding member (1650, metal TIM).

[0394] According to one embodiment, the second conductive member (1601) (e.g., a gasket) may be electrically connected (e.g., directly or indirectly connected) to the shield can (1660) and the vapor chamber (1670).

[0395] For example, a first surface (e.g., an upper surface) of a second conductive member (1601) (e.g., a gasket) may be electrically connected (e.g., directly or indirectly connected) to a shield can (1660) (e.g., a third shield can portion). For example, a second surface (e.g., a lower surface) of a second conductive member (1601) (e.g., a gasket) may be electrically connected (e.g., directly or indirectly connected) to a vapor chamber (1670).

[0396] For example, the vapor chamber (1670) may include a support structure (1671) (e.g., a spacer) for supporting a pressure applied in a first direction (e.g., a z-axis direction, a vertical direction). When viewed in the first direction (e.g., a z-axis direction, a vertical direction), the second conductive member (1601) (e.g., a gasket) may be arranged to overlap the support structure (1671) (e.g., a spacer) of the vapor chamber (1670). The second conductive member (1601) (e.g., a gasket) may be arranged at a corresponding position of the support structure (1671) (e.g., a spacer) of the vapor chamber (1670).

[0397] According to one embodiment, a first printed circuit board (1620) (e.g., a main PCB, a main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to a shield can (1660), and a vapor chamber (1670) may be electrically connected (e.g., directly connected or indirectly connected) to a conductive plate (1690) (e.g., a metal rear, a metal plate). For example, the shield can (1660) and the vapor chamber (1670) may be electrically connected (e.g., directly connected or indirectly connected) by a second conductive member (1601) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1620) (e.g., a main PCB, a main circuit board) and the vapor chamber (1670). For example, the shield can (1660) and the vapor chamber (1670) may be electrically connected (e.g., directly or indirectly connected) by a second conductive member (1601) (e.g., a gasket), so that a ground path may be formed between the first printed circuit board (1620) (e.g., main PCB, main circuit board) and the conductive plate (1690) (e.g., metal rear). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1630) and electronic components (1621), and the noise (710) (e.g., electromagnetic waves) may be shielded (e.g., removed) through a ground path using the second conductive member (1601) (e.g., gasket).

[0398] According to one embodiment, the second conductive member (1601) (e.g., a gasket) may include at least one of a conductive gasket, a conductive cushion pad, a conductive silicone gasket, a surface mounter technology (SMT) gasket, a wire mesh gasket, a ground foam gasket, or a fabric over foam gasket.

[0399] An electronic device (1600) according to one embodiment of the present disclosure forms a contact of a ground path at a portion adjacent to a processor (1630) and a second printed circuit board (1610) (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from the processor (1630) and the second printed circuit board (1610) (e.g., a processor PCB, a core circuit board). By applying a second conductive member (1601) (e.g., a gasket) to an electronic device (1600) to form a ground path between a first printed circuit board (1620) (e.g., main PCB, main circuit board) and a conductive plate (1690) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0400] Fig. 17 is a drawing showing an electronic device including a shield can electrically connecting a main printed circuit board (PCB) and a vapor chamber. Fig. 18 is a drawing showing the shield can illustrated in Fig. 17.

[0401] In describing the electronic device (1700) of FIGS. 17 and 18, detailed descriptions of configurations identical (or similar) to the electronic device (800) of FIG. 9, the electronic device (1000) of FIG. 10A, the electronic device (1100) of FIG. 11, the electronic device (1400) of FIG. 14A, the electronic device (1500) of FIG. 15A, and the electronic device (1600) of FIG. 16 may be omitted.

[0402] Referring to FIGS. 17 and 18, an electronic device (1700) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1720) (e.g., a main PCB, a main circuit board), a second printed circuit board (1710) (e.g., a processor PCB, a core circuit board), a processor (1730) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1721), a heat dissipation member (1740) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1750, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1760, shieldcan), a vapor chamber (1770, The vapor chamber may include a conductive member (1780) (e.g., a conductive double-sided tape, a conductive adhesive layer), and a conductive plate (1790) (e.g., a metal rear).

[0403] According to one embodiment, when the electronic device (1700) (or display) is viewed in a first direction (e.g., in the z-axis direction, a vertical direction), a conductive plate (1790) (e.g., a metal rear) may be arranged to face the display. Between the conductive plate (1790) (e.g., a metal rear, a metal plate) and the display, components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0404] According to one embodiment, a shielding member (1750, metal TIM), a shield can (1760), a vapor chamber (1770), a conductive member (1780) (e.g., conductive double-sided tape, conductive adhesive layer), and a conductive plate (1790) (e.g., metal rear, metal plate) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1730) and electronic components (1721) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0405] According to one embodiment, the conductive plate (1790) (e.g., metal rear, metal plate) and the vapor chamber (1770) can be electrically connected (e.g., electrically attached) by a conductive member (1780) (e.g., conductive double-sided tape, conductive adhesive layer).

[0406] According to one embodiment, a shielding member (1750, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1770).

[0407] For example, a shielding member (1750, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1730) and electronic components (1721).

[0408] According to one embodiment, a heat dissipation member (1740) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat spreading paste, heat spreading (thermal conductive) paste)) may be placed on the shielding member (1750, metal TIM) so as to overlap at least a portion of the shielding member (1750, metal TIM).

[0409] According to one embodiment, for example, when the electronic device (1700) (or display) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1720) (e.g., main PCB, main circuit board) may be placed between a second printed circuit board (1710) (e.g., processor PCB, core circuit board) and a shielding member (1750, metal TIM).

[0410] According to one embodiment, when the electronic device (1700) (or display) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1710) (e.g., processor PCB, core circuit board) may be disposed between the display and the vapor chamber (1770).

[0411] According to one embodiment, when the electronic device (1700) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1710) (e.g., processor PCB, core circuit board) may be placed between the display and a shielding member (1750, metal TIM).

[0412] According to one embodiment, when the electronic device (1700) (or display) is viewed in a first direction (e.g., z-axis direction, vertical direction), the shield can (1760) may be placed between the first printed circuit board (1720) (e.g., main PCB, main circuit board) and the vapor chamber (1770).

[0413] According to one embodiment, the shield can (1760) may include a second opening (1765). The shield can (1760) may be placed on a first printed circuit board (1720) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (1721).

[0414] For example, the shield can (1760) may be arranged to cover at least a portion of the first printed circuit board (1720) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (1710) (e.g., processor PCB, core circuit board). For example, the shield can (1760) may be arranged to cover electronic components (1721) arranged on the first printed circuit board (1720) (e.g., main PCB, main circuit board) and the processor (1730) arranged on the second printed circuit board (1710) (e.g., processor PCB, core circuit board). For example, the shield can (1760) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0415] For example, the first shield can portion (1761) of the shield can (1760) may be electrically connected (e.g., directly connected or indirectly connected) to the first printed circuit board (1520) (e.g., main PCB, main circuit board). The second shield can portion (1762) of the shield can (1501) may be arranged to be in contact with the shielding member (1750, metal TIM).

[0416] The third shield can portion (1763) of the shield can (1760) can be electrically connected (e.g., directly connected or indirectly connected) to the vapor chamber (1770). To this end, a conductive protrusion (1764) (e.g., a conductive conductive ball) can be formed on the third shield can portion (1763) of the shield can (1760). The conductive protrusion (1764) (e.g., a conductive conductive ball) formed on the third shield can portion (1763) of the shield can (1760) can be electrically connected (e.g., directly connected or indirectly connected) to the first surface (e.g., the upper surface) of the vapor chamber (1770).

[0417] According to one embodiment, a heat dissipation member (1740) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, heat spreading (thermal conductive) paste)) may be placed between the processor (1730) and the shielding member (1750, metal TIM).

[0418] According to one embodiment, when the electronic device (1700) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a vapor chamber (1770) may be placed between a conductive plate (1790) (e.g., metal rear, metal plate) and a shielding member (1750, metal TIM).

[0419] According to one embodiment, the first printed circuit board (1720) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly or indirectly connected) to the shield can (1760), and the vapor chamber (1770) may be electrically connected (e.g., directly or indirectly connected) to the conductive plate (1790) (e.g., metal rear, metal plate). For example, a ground path may be formed between the first printed circuit board (1720) (e.g., main PCB, main circuit board) and the vapor chamber (1770) by the shield can (1760). For example, a ground path may be formed between the first printed circuit board (1720) (e.g., main PCB, main circuit board) and the conductive plate (1790) (e.g., metal rear) by the shield can (1760). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1730) and electronic components (1721), and the noise (710) (e.g., electromagnetic waves) can be shielded (e.g., removed) through a ground pass using a shield can (1760).

[0420] An electronic device (1700) according to an embodiment of the present disclosure forms a ground path contact using a shield can (1760) to shield (e.g., remove) noise (710) (e.g., electromagnetic waves) generated from a processor (1730) and a second printed circuit board (1710) (e.g., processor PCB, core circuit board). By applying a shield can (1760) to the electronic device (1700) to form a ground path between the first printed circuit board (1720) (e.g., main PCB, main circuit board) and a conductive plate (1790) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0421] Figure 19 is a drawing showing an electronic device including a shield can electrically connecting a main printed circuit board (PCB) and a vapor chamber. Figure 20 is a drawing showing a shield can pin electrically connected to a conductive clip.

[0422] In describing the electronic device (1900) of FIGS. 19 and 20, detailed descriptions of the same (or similar) configurations as the electronic device (800) of FIG. 9, the electronic device (1000) of FIG. 10A, the electronic device (1100) of FIG. 11, the electronic device (1400) of FIG. 14A, the electronic device (1500) of FIG. 15A, the electronic device (1600) of FIG. 16, and the electronic device (1700) of FIG. 17 may be omitted.

[0423] Referring to FIGS. 19 and 20, an electronic device (1900) according to an embodiment of the present disclosure includes a display module (e.g., a display module (160) of FIG. 4), a first printed circuit board (1920) (e.g., a main PCB, a main circuit board), a second printed circuit board (1910) (e.g., a processor PCB, a core circuit board), a processor (1930) (e.g., an AP: application processor, a CPU (central processing unit)), electronic components (1921), a heat dissipation member (1940) (e.g., a heat dissipation member, a solid TIM (thermal interface material), a heat spreading (thermal conductive) member, thermal grease, heat dissipation paste, a heat spreading (thermal conductive) paste)), a shielding member (1950, metal TIM) (e.g., a shielding component, a metal TIM, a shielding plate, a metal heat dissipation member, a metal heat dissipation plate), a shield can (1960, shieldcan), a vapor chamber (1970, The vapor chamber may include a conductive member (1980) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1990) (e.g., metal rear), and a conductive clip (2000).

[0424] According to one embodiment, when the electronic device (1900) (or display) is viewed in a first direction (e.g., in the z-axis direction, a vertical direction), a conductive plate (1990) (e.g., a metal rear) may be arranged to face the display. Between the conductive plate (1990) (e.g., a metal rear, a metal plate) and the display, components (e.g., components) for shielding noise (e.g., electromagnetic waves) and dissipating heat (e.g., heat cooling, heat exhaust) may be arranged.

[0425] According to one embodiment, a shielding member (1950, metal TIM), a shield can (1960), a vapor chamber (1970), a conductive member (1980) (e.g., conductive double-sided tape, conductive adhesive layer), a conductive plate (1990) (e.g., metal rear, metal plate), and a conductive clip (2000) may be arranged to shield noise (e.g., electromagnetic waves) generated from a processor (1930) and electronic components (1921) and to dissipate heat (e.g., heat cooling, heat exhaust).

[0426] According to one embodiment, the conductive plate (1990) (e.g., metal rear, metal plate) and the vapor chamber (1970) can be electrically connected (e.g., electrically attached) by a first conductive member (1980) (e.g., conductive double-sided tape, conductive adhesive layer).

[0427] According to one embodiment, a shielding member (1950, metal TIM) (e.g., shielding component, metal TIM, shielding plate, metal heat dissipation member, metal heat dissipation plate) may be placed over the vapor chamber (1970).

[0428] For example, a shielding member (1950, metal TIM) may be positioned to face (e.g., overlap) the heat-generating processor (1930) and electronic components (1921).

[0429] According to one embodiment, a heat dissipation member (1940) (e.g., heat dissipation component, solid TIM (thermal interface material), heat spreading (thermal conductive) member, thermal grease, heat spreading paste, heat spreading (thermal conductive) paste)) may be placed on the shielding member (1950, metal TIM) so as to overlap at least a portion of the shielding member (1950, metal TIM).

[0430] According to one embodiment, for example, when the electronic device (1900) (or display) is viewed in a first direction (e.g., z-axis direction, vertical direction), a first printed circuit board (1920) (e.g., main PCB, main circuit board) may be disposed between a second printed circuit board (1910) (e.g., processor PCB, core circuit board) and a shielding member (1950, metal TIM).

[0431] According to one embodiment, when the electronic device (1900) (or display) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1910) (e.g., processor PCB, core circuit board) may be positioned between the display and the vapor chamber (1970).

[0432] According to one embodiment, when the electronic device (1900) (or display (410)) is viewed in a first direction (e.g., z-axis direction, vertical direction), a second printed circuit board (1910) (e.g., processor PCB, core circuit board) may be placed between the display and a shielding member (1950, metal TIM).

[0433] According to one embodiment, when the electronic device (1900) (or display) is viewed in a first direction (e.g., z-axis direction, vertical direction), the shield can (1960) may be placed between the first printed circuit board (1920) (e.g., main PCB, main circuit board) and the vapor chamber (1970).

[0434] According to one embodiment, the shield can (1960) may include a second opening. The shield can (1960) may be placed on a first printed circuit board (1920) (e.g., main PCB, main circuit board) to surround the periphery of the electronic components (1921).

[0435] For example, the shield can (1960) may be arranged to cover at least a portion of the first printed circuit board (1920) (e.g., main PCB, main circuit board) and at least a portion of the second printed circuit board (1910) (e.g., processor PCB, core circuit board). For example, the shield can (1960) may be arranged to cover electronic components (1921) arranged on the first printed circuit board (1920) (e.g., main PCB, main circuit board) and a processor (1930) arranged on the second printed circuit board (1910) (e.g., processor PCB, core circuit board). For example, the shield can (1960) may have an electromagnetic interference (EMI) shielding function in addition to a heat dissipation function.

[0436] In one embodiment, a shield can pin (1965) may extend from a portion of the shield can (1960). The shield can (1960) and the shield can pin (1965) may be electrically connected.

[0437] According to one embodiment, the conductive clip (2000) may be positioned on a first surface (e.g., an upper surface) of the conductive clip (2000). The conductive clip (2000) and the shield can (1960) may be electrically connected.

[0438] For example, at least a portion of a shield can pin (1965) may be coupled (e.g., electrically connected) to a conductive clip (2000). The conductive clip (2000) may include a first clip finger (2010) and a second clip finger (2020) such that a space (2030) is formed therein. The first clip finger (2010) and the second clip finger (2020) may be arranged to face each other so that a reaction force is applied toward the space (2030) therein. When the shield can pin (1965) is coupled (e.g., fitted) into the space (2030) within the conductive clip (2000), the conductive clip (2000) and the shield can (1960) may be electrically connected.

[0439] For example, the first printed circuit board (1920) (e.g., main PCB, main circuit board) may be electrically connected (e.g., directly connected or indirectly connected) to the shield can (1960), and the vapor chamber (1970) may be electrically connected (e.g., directly connected or indirectly connected) to the conductive plate (1990) (e.g., metal rear, metal plate). For example, a ground path may be formed between the first printed circuit board (1920) (e.g., main PCB, main circuit board) and the vapor chamber (1970) by the shield can (1960) and the conductive clip (2000). For example, a ground path may be formed between the first printed circuit board (1920) (e.g., main PCB, main circuit board) and the conductive plate (1990) (e.g., metal rear) by the shield can (1960) and the conductive clip (2000). Noise (e.g., electromagnetic waves) (e.g., noise (710) of FIG. 7) may be generated in the processor (1930) and electronic components (1921), and the noise (710) (e.g., electromagnetic waves) can be shielded (e.g., removed) through a ground pass using a shield can (1960) and a conductive clip (2000).

[0440] An electronic device (1900) according to an embodiment of the present disclosure forms a ground path contact using a shield can (1960) and a conductive clip (2000), thereby shielding (e.g., removing) noise (710) (e.g., electromagnetic waves) generated from a processor (1930) and a second printed circuit board (1910) (e.g., processor PCB, core circuit board). By applying the shield can (1960) and the conductive clip (2000) to the electronic device (1900) to form a ground path between the first printed circuit board (1920) (e.g., main PCB, main circuit board) and the conductive plate (1990) (e.g., metal rear), TIS can be improved as described in Table 2 for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0441] An electronic device according to an embodiment of the present disclosure (e.g., an electronic device (101) of FIG. 1, an electronic device (200) of FIG. 2a, an electronic device (300) of FIG. 3a, an electronic device (400) of FIG. 4, an electronic device (500) of FIG. 5, an electronic device (800) of FIG. 9, an electronic device (1000) of FIG. 10a, an electronic device (1100) of FIG. 11, an electronic device (1400) of FIG. 14a, an electronic device (1600) of FIG. 16) comprises: a display (e.g., a display (410) of FIG. 4), a conductive plate (890) facing the display (410), a first circuit board (e.g., a first printed circuit board (820) of FIG. 9) in which a first opening (822) is formed and an electronic component (e.g., an electronic component (821) of FIG. 9) is arranged), an integrated circuit (e.g., a first printed circuit board (820) of FIG. 9) A second circuit board (e.g., a second printed circuit board (810) of FIG. 9) on which a processor (120)) is arranged and the integrated circuit (processor (120)) is positioned within the first opening (e.g., the first number (822) of FIG. 9), a shield can (e.g., a shield can (860) of FIG. 9) formed in a second opening (e.g., a second opening (865) of FIG. 9) and arranged on the first circuit board (first printed circuit board (820)) to surround the periphery of the electronic component (821), a shielding member (e.g., a shielding member (850) of FIG. 9) covering the second opening (865), a vapor chamber (e.g., a vapor chamber (870) of FIG. 9) arranged between the conductive plate (890) and the shielding member (850) when the display (410) is viewed in the first direction, the conductive It may include a first conductive member (e.g., the first conductive member (880) of FIG. 9) electrically connecting the plate (890) and the vapor chamber (870), and a second conductive member (e.g., the second conductive member (801) of FIG. 9) electrically connecting the vapor chamber (870) and the shield can (860). When viewed in the first direction, the second conductive member (801) may be positioned so as not to overlap the shield member (850).

[0442] According to one embodiment, when viewed from the first direction, the first circuit board (first printed circuit board (820)) may be positioned between the display (410) and the conductive plate (890).

[0443] According to one embodiment, when viewed from the first direction, the second circuit board (the second printed circuit board (810)) may be positioned between the first circuit board (the first printed circuit board (820)) and the conductive plate (890).

[0444] According to one embodiment, when viewed from the first direction, the first conductive member (880) may be disposed between the conductive plate (890) and the vapor chamber (870).

[0445] According to one embodiment, the second conductive member (801) may be placed on the periphery of the shielding member (850).

[0446] According to one embodiment, the shielding member (850) may include a third opening. The second conductive member (801) may be positioned within the third opening.

[0447] According to one embodiment, when viewed in a second direction perpendicular to the first direction, the second conductive member (801) and the shielding member (850) may be positioned substantially on the same line.

[0448] According to one embodiment, the shielding member (850) may include a conductive layer and a non-conductive layer. A groove may be formed in the non-conductive layer of the shielding member (850). The second conductive member (801) may be positioned in the groove of the non-conductive layer.

[0449] According to one embodiment, the vapor chamber (870) may include a support structure that supports the pressure applied in the first direction. When viewed in the first direction, the second conductive member (801) may be arranged to overlap the support structure of the vapor chamber (870).

[0450] According to one embodiment, the shield can (860) may include a first shield can portion (861) electrically connected to the first circuit board (first printed circuit board (820)). The shield can (860) may include a second shield can portion (862) connected to the shielding member (850). The shield can (860) may include a third shield can portion (863) electrically connected to the second conductive member (801).

[0451] According to one embodiment, the second conductive member (801) may include a conductive gasket.

[0452] According to one embodiment, the first conductive member (880) may include a conductive double-sided tape.

[0453] An electronic device (101, 200, 300, 400, 500, 800, 1000, 1100, 1400, 1600) according to one embodiment of the present disclosure comprises: a display (410), a conductive plate (890, 1590) facing the display (410), a first circuit board (first printed circuit board (820, 1520) in which an opening (822, 1525) is formed and an electronic component (821, 1521) is arranged; a second circuit board (second printed circuit board (810, 1510) in which an integrated circuit (processor (120)) is arranged and the integrated circuit (processor (120)) is positioned within the first opening (822, 1522); and a second opening (865, 1505) may be formed and may include a shield can (860, 1501) disposed on the first circuit board (first printed circuit board (820, 1520)) to surround the periphery of the electronic component (821), a shielding member (850, 1550) covering the second opening (865, 1505), a vapor chamber (870, 1570) disposed between the conductive plate (890, 1590) and the shielding member (850, 1550) when the display (410) is viewed in the first direction, and a conductive member (e.g., conductive double-sided tape) electrically connecting the conductive plate (890, 1590) and the vapor chamber (870, 1570). The shield can (860, 1501) and the vapor chamber (870, 1570) are electrically connected, A ground pass can be formed between the first circuit board (first printed circuit board (820, 1520)) and the conductive plate (890, 1590).

[0454] According to one embodiment, the shield can (860, 1501) may be electrically connected to the vapor chamber (870, 1570) at the outer edge of the shielding member (850, 1550).

[0455] According to one embodiment, the shield can (860, 1501) may include a first shield can portion (861) electrically connected to the first circuit board (first printed circuit board (820, 1520)). The shield can (860, 1501) may include a second shield can portion (862) connected to the shielding member (850, 1550). The shield can (860, 1501) may include a third shield can portion (863) electrically connected to the vapor chamber (870, 1570).

[0456] An electronic device according to one embodiment of the present disclosure forms a ground path contact at a portion adjacent to a processor and a second printed circuit board (e.g., a processor PCB, a core circuit board), thereby shielding (e.g., removing) noise (e.g., electromagnetic waves) generated from the processor and the second printed circuit board (e.g., the processor PCB, the core circuit board). When a second conductive member (e.g., a gasket) is applied to the electronic device to form a ground path between a first printed circuit board (e.g., a main PCB, a main circuit board) and a conductive plate (e.g., a metal rear), TIS can be improved for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

[0457] An electronic device according to one embodiment of the present disclosure can form a ground path contact using a shield can and a conductive clip to shield (e.g., remove) noise (e.g., electromagnetic waves) generated from a processor and a second printed circuit board (e.g., a processor PCB, a core circuit board). By applying a shield can and a conductive clip to the electronic device to form a ground path between a first printed circuit board (e.g., a main PCB, a main circuit board) and a conductive plate (e.g., a metal rear), TIS can be improved for frequency bands (e.g., LTE bands 28, 20, 5, 8, 3, 1 7, 2, 4, 66).

Claims

1. In an electronic device (800), display (410); A conductive plate (890) facing the above display (410); A first circuit board (820) having a first opening formed and electronic components arranged therein; A second circuit board (810) having an integrated circuit arranged thereon and positioned so that the integrated circuit is positioned within the first opening; A shield can (860) is placed on the first circuit board (820) so as to form a second opening and surround the periphery of the electronic component; A shielding member (850) covering the second opening; A vapor chamber (870) positioned between the conductive plate (890) and the shielding member (850) when viewing the display (410) in the first direction; A first conductive member (880) electrically connecting the conductive plate (890) and the vapor chamber (870); and It includes a second conductive member (801) that electrically connects the vapor chamber (870) and the shield can (860); When viewed from the first direction, the second conductive member (801) is positioned so as not to overlap with the shielding member (850). Electronic devices.

2. In paragraph 1, When viewed from the first direction, the first circuit board (820) is positioned between the display (410) and the conductive plate (890). Electronic devices.

3. In paragraph 1, When viewed from the first direction, the second circuit board (810) is positioned between the first circuit board (820) and the conductive plate (890). Electronic devices.

4. In paragraph 1, When viewed from the first direction, the first conductive member (880) is positioned between the conductive plate (890) and the vapor chamber (870). Electronic devices.

5. In paragraph 1, The second challenge member (801) is arranged on the outer side of the shield member (850). Electronic devices.

6. In paragraph 1, The above shielding member (850) includes a third opening, The second challenge member (801) is located within the third opening. Electronic devices.

7. In clause 5 or 6, When viewed from a second direction perpendicular to the first direction, the second conductive member (801) and the shielding member (850) are positioned substantially on the same line. Electronic devices.

8. In paragraph 1, The above shielding member (850) includes a conductive layer and a non-conductive layer, A groove is formed in the non-conductive layer of the above shielding member (850), The above second challenge member (801) is located in the groove of the non-conductive layer. Electronic devices.

9. In paragraph 1, The above vapor chamber (870) includes a support structure that supports the pressure applied in the first direction, When viewed from the first direction, the second conductive member (801) is positioned to overlap with the support structure of the vapor chamber (870). Electronic devices.

10. In paragraph 1, The above shield can (860) is A first shield can part (861) electrically connected to the first circuit board (820) above, A second shield can part (862) connected to the above shielding member (850), and Including a third shield can part (863) electrically connected to the second challenge member (801). Electronic devices.

11. In paragraph 1, The second challenge member (801) includes a challenge gasket. Electronic devices.

12. In paragraph 1, The above first challenge member (880) comprises a conductive double-sided tape. Electronic devices.

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