Terminal device

Abstract

A terminal device, comprising: a housing and a heat dissipation assembly located in the housing. The internal inner space of the housing comprises a hot zone and a cold zone, the heat dissipation assembly comprises at least two heat exchangers, a pump and connecting pipes, one of the heat exchangers is located in the hot zone, and the other heat exchangers are located in the cold zone, the connecting pipes are connected between the two heat exchangers to form a heat exchange circulation pipeline, and the pump is arranged in the heat exchange circulation pipeline, so as to realize heat exchange between the hot zone and the cold zone. The terminal device provided in the present application can achieve active liquid cooling and heat dissipation in the terminal device, and improve the temperature uniformity of the terminal device.

Description

terminal equipment

[0001] This application claims priority to the Chinese patent application with application number 202310937630.0 filed with the State Intellectual Property Office of China on July 27, 2023, and priority to the Chinese patent application with the invention name “Terminal Device”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field related to heat dissipation, and in particular to a terminal device. Background Art

[0003] As terminal devices (e.g., mobile phones, tablets, and laptops) become increasingly versatile and powerful, their heat generation is increasing. Currently, the primary cooling methods used within these devices include passive cooling methods such as VC vapor chambers, graphite, and graphene. Their primary purpose is to enhance internal heat conduction and optimize temperature uniformity within the phone. These passive cooling methods, due to their respective mechanics, struggle to significantly improve a phone's heat dissipation capabilities. For example, insufficient capillary force in VC vapor chambers results in slow liquid return and reduced heat distribution. Graphite Z-axis conducts heat poorly, and its density limits determine the limits of its thermal conductivity.

[0004] Summary of the Invention

[0005] The present application provides a terminal device, wherein the internal space of the terminal device is provided with a heat dissipation component, which can realize active liquid cooling and improve the temperature uniformity of the terminal device.

[0006] In a first aspect, an embodiment of the present application provides a terminal device, comprising a shell and a heat dissipation assembly located inside the shell, wherein the internal space of the shell includes a hot zone and a cold zone, and the heat dissipation assembly includes at least two heat exchangers, a pump and a connecting pipe, one of the heat exchangers is located in the hot zone, and the other heat exchanger is located in the cold zone, the connecting pipe is connected between the at least two heat exchangers to form a heat exchange circulation pipeline, and the pump is arranged in the heat exchange circulation pipeline to realize heat exchange between the hot zone and the cold zone.

[0007] The embodiment of the present application drives the refrigerant to circulate in the heat exchange circulation pipeline through a pump, and transfers the refrigerant between at least two heat exchangers to achieve heat dissipation. For example, one of the heat exchangers is a cooler, and the other heat exchangers are radiators. The cooler is connected to the heating device in the hot zone of the terminal device, and the radiator is located in the cold zone. The embodiment of the present application utilizes the driving force of the pump to bring the refrigerant with a higher temperature in the cooler to the radiator, and dissipates heat at the position of the radiator to cool the refrigerant, thereby realizing an active liquid cooling heat dissipation system. Compared with the passive liquid cooling heat dissipation method, the embodiment of the present application uses a pump as a power source, and the heat dissipation component can transfer the refrigerant farther, and the distance between the cooler and the radiator can be designed to be longer as needed. Therefore, the heat dissipation component can bring the heat from the hot zone to the cold zone, which can improve the heat dissipation efficiency and make the terminal device have a better temperature uniformity effect.

[0008] In one possible implementation, the terminal device includes a mainboard, a heating device and a battery located inside the shell, the heating device is arranged on the mainboard, the terminal device includes a top end and a bottom end arranged opposite to each other, the battery includes a first end and a second end arranged opposite to each other, the first end is located at the edge of the battery facing the top end, and the second end is located at the edge of the battery facing the bottom end, the mainboard is located between the first end and the top end, and the heat exchanger and the heating device located in the hot zone are thermally connected.

[0009] This embodiment, constrained by the positional relationship between the motherboard and battery within the housing, is limited to a mobile phone terminal device. A heat exchanger located in the hot zone is thermally connected to the heat-generating components on the motherboard to dissipate heat. Mobile phones have limited internal space and demanding heat dissipation requirements. Therefore, placing the heat dissipation component inside the phone creates an active liquid cooling system, improving heat dissipation and temperature uniformity.

[0010] In one possible implementation, at least a portion of the heat exchanger located in the cold zone is located between the second end and the bottom end. In this solution, in the application scenario where the terminal device is a mobile phone, the heat exchanger defining the cold zone is located between the second end of the battery and the bottom end of the terminal device. The heat dissipation assembly provided by this solution can transfer heat between the first end of the battery and the top end of the terminal device to between the second end of the battery and the bottom end of the terminal device over a long distance, and this transfer distance is not achievable with a vapor chamber.

[0011] In one possible implementation, at least a portion of the heat exchanger and a portion of the battery located in the cold zone overlap and are adjacent to the second end. In the application scenario where the terminal device is a mobile phone, the heat exchanger defining the cold zone is located within the projected area of ​​the battery and adjacent to the second end of the battery. The heat dissipation assembly provided by this solution can transfer heat between the first end of the battery and the top of the terminal device to a location in the area where the battery is located and adjacent to the second end. This transfer distance is long, and such a transfer distance is not achievable by a vapor chamber.

[0012] In one possible implementation, the terminal device includes a display screen, and the housing includes a middle frame and a back shell. The display screen and the back shell are located on opposite sides of the middle frame, and the heat dissipation assembly is located between the middle frame and the display screen. This solution places at least two heat exchangers, a pump, and connecting pipes on the same side of the middle frame, facilitating assembly of the terminal device. The connecting pipes do not need to pass through the middle frame, allowing the heat dissipation assembly to be assembled into a complete structure and then installed between the middle frame and the display screen. Therefore, this solution offers the advantage of easy assembly.

[0013] In one possible implementation, the terminal device includes a display screen, the shell includes a middle frame and a back shell, the display screen and the back shell are distributed on opposite sides of the middle frame, and at least one of the at least two heat exchangers is located between the middle frame and the back shell. This solution provides a specific positioning arrangement of the heat dissipation components, in which at least one of the at least two heat exchangers is arranged between the middle frame and the back shell. It is understandable that the remaining heat exchangers can be arranged between the middle frame and the display screen. In this way, the heat dissipation components are dispersed on both sides of the middle frame, and the space on both sides of the middle frame can be flexibly used. For example, if there is idle space in the area between the middle frame and the back shell near the small board, a heat exchanger and a pump can be set up. The idle space can be used to set up some heat dissipation components, which is conducive to the design of a thinner overall size of the terminal device.

[0014] In one possible implementation, the terminal device includes a first body and a second body, the first body and the second body being capable of folding or unfolding relative to each other, with the heat dissipation assembly located within the first body. In this embodiment, the heat dissipation assembly is disposed within the first body, eliminating the need for the connecting pipe to pass through the hinge assembly. Furthermore, the primary heat source in the hot zone within the first body is concentrated. This embodiment achieves both uniform heat dissipation and simplified placement of the heat dissipation assembly within the terminal device.

[0015] In one possible implementation, the terminal device includes a first body and a second body, the first body and the second body being capable of folding or unfolding relative to each other, one of the at least two heat exchangers being located within the first body, and at least one of the at least two heat exchangers being located within the second body. This embodiment transfers heat from the first body to the second body, where it is dissipated through the heat exchanger within the second body, thereby ensuring greater temperature uniformity between the first and second bodies.

[0016] In one possible implementation, the terminal device includes a hinge assembly connected between a first body and a second body. In one embodiment, a connecting tube is located between the hinge assembly and the flexible screen, with the connecting tube extending through the space between the hinge assembly and the flexible screen. In this embodiment, the connecting tube extends through the hinge assembly from the space between the middle door panel and the display screen at the hinge assembly location. This allows the connecting tube to bend at a large angle, which not only ensures unobstructed internal transmission space within the bent tube but also helps to ensure the service life and structural safety and stability of the connecting tube.

[0017] In one possible implementation, the connecting tube is located within the shaft assembly, meaning it passes through the interior of the shaft assembly. In this embodiment, the connecting tube passes through the interior of the shaft assembly, allowing for a larger diameter. This is because the space inside the shaft assembly is larger than the space between the shaft assembly and the display screen. A larger diameter connecting tube improves transmission efficiency and ensures structural strength and stability.

[0018] In one possible implementation, one of the at least two heat exchangers is a cooler, and the remaining heat exchangers are radiators. The radiators include a first radiator and a second radiator, the pumps include a first pump and a second pump, and the connecting pipes include a first connecting pipe and a second connecting pipe. The first pump is connected to the heat exchange circulation pipeline between the first radiator and the cooler via the first connecting pipe, and the second pump is connected to the heat exchange circulation pipeline between the second radiator and the cooler via the second connecting pipe. This solution forms two parallel heat exchange circulation pipelines using one cooler, two radiators, and two pumps, which is beneficial for improving heat dissipation efficiency and also allows for flexible arrangement of radiators and pumps.

[0019] In one possible implementation, the heat exchanger includes a plurality of fluid channels, channel inlets, and channel outlets. The channel inlets and the channel outlets are used to connect the connecting pipes. The equivalent diameter of the fluid channel is in the range of 0.05 mm to 0.3 mm (this range includes the endpoints), which can be understood as the equivalent diameter of the fluid channel being greater than or equal to 0.05 mm and less than or equal to 0.3 mm. On the one hand, this solution is conducive to increasing the heat exchange efficiency per unit volume of the heat exchanger. On the other hand, it is conducive to controlling the overall size of the heat exchanger to be thinner. When the heat exchanger is used inside a terminal device, the thickness of the terminal device can be controlled within a reasonable range. This heat exchanger can be a cooler arranged in a hot zone or a radiator arranged in a cold zone.

[0020] In one possible implementation, within the heat exchanger, fluid flows from the channel inlet through the multiple fluid channels to the channel outlet, forming multiple flow paths. The fluid flow paths of the multiple flow paths are of equal size. This solution helps ensure uniform flow distribution of the fluid within each channel of the cooler.

[0021] In one possible implementation, the multiple fluid channels extend along a second direction and are arranged in a row along the first direction. In the second direction, the channel inlet and the fluid channel at the head of the row are positioned opposite each other, and the channel outlet and the fluid channel at the tail of the row are positioned opposite each other. The second direction is perpendicular to the first direction. In this solution, by arranging the channel inlet and the channel outlet opposite each other to the liquid channel at the head and tail of the row, respectively, the flow from the channel inlet to the channel outlet can be close to or equal, which helps ensure uniform heating of the fluid within the heat exchanger.

[0022] In one possible implementation, a flow guide structure extending along the first direction is provided between the channel inlet and the multiple fluid channels. The flow guide structure divides the space within the cooler into a first space and a second space. The multiple fluid channels are located in the second space, and the channel inlet communicates with the first space. The flow guide structure is provided with multiple through holes along the first direction that connect the first and second spaces. This solution utilizes the multiple through holes in the flow guide structure to achieve more uniform flow distribution through each fluid channel of the heat exchanger.

[0023] In one possible implementation, along the first direction, the density of the through holes at both ends of the flow-guiding structure is less than the density of the through holes in the middle area of ​​the flow-guiding structure. This solution can improve the flow balancing effect by designing the distribution density of the through holes on the flow-guiding structure. For the edge area close to the channel entrance, since the channel entrance and the fluid channel are arranged along the first direction, the fluid can easily pass through the through holes due to the entrance effect. As for the other edge area far away from the channel entrance, the shell of the first plate can be used to force the fluid to change its flow direction, forming a fluid disturbance, which is beneficial for the fluid to pass through the through holes. However, for the middle area, there is no fluid disturbance factor in this area, and the fluid is not easy to change its flow direction, resulting in a small amount of fluid passing through the through holes. Therefore, through holes with a higher density are set in the middle area, and through holes with a lower density are set in the edge area, which is beneficial to the overall flow balancing effect of the flow-guiding structure.

[0024] In one possible implementation, the guide structure includes a plurality of diverter plates and a plurality of spoiler structures, the plurality of diverter plates are arranged at intervals along the first direction, and the through-holes are formed between adjacent diverter plates, the spoiler structure is protrudingly provided at one end of the corresponding diverter plate, and the spoiler structure protrudes toward the first space or the second space. The embodiment of the present application can solve the flow equalization effect in the case of a large flow rate in the heat exchanger by providing a spoiler structure. In the case of a large flow rate, it is difficult to achieve the purpose of changing the flow direction of the refrigerant medium by only forming pressure fluctuations through the through-holes on the guide structure. Therefore, it is necessary to provide a spoiler structure at the edge of the through-hole to increase the disturbance, strengthen the pressure fluctuations at the through-hole, and force the refrigerant medium to change the flow direction.

[0025] In one possible implementation, the heat exchanger includes a plurality of spaced-apart baffles extending along the second direction. Adjacent baffles form the fluid channel. Some of the fluid channels are first channels, and the baffles forming the first channels are first and second baffles. The end of the first channel facing the flow-guiding structure serves as the inlet of the first channel. The inlet of the first channel and the middle region of the flow-guiding structure are positioned opposite each other. At the inlet of the first channel, the distance between the first baffle and the flow-guiding structure in the second direction is smaller than the distance between the first baffle and the flow-guiding structure in the second direction. This solution advantageously improves fluid flow in the heat exchanger. For example, if the heat exchanger is made of metal, the metal surface is hydrophilic and has high surface energy, making it easy to form a liquid film in small channels and at low flow rates. The flow-guiding structure provided by this solution can achieve a stepped arrangement of the fluid channels in the middle region of the heat exchanger near the inlet, even when the channel equivalent diameter is small. This stepped arrangement of the flow channel structure effectively reduces the effects of channel clogging caused by water film adhesion on the microchannel surface by creating turbulent flow.

[0026] In one possible implementation, the first direction is the width of the fluid channel, the second direction is the length of the fluid channel, and the third direction is the height of the fluid channel. The first, second, and third directions are mutually perpendicular, and the ratio of the height to width dimensions of each fluid channel is 0.3-2. By constraining the height-to-width ratio of the fluid channel, this solution enables the cooler to be used in space-constrained environments such as mobile phones, improving the heat dissipation performance of small-sized terminal devices. Small-sized terminal devices have high heat dissipation requirements and can better highlight the heat dissipation effect of the heat dissipation component.

[0027] In a possible implementation, the thermal conductivity of the connecting pipe is K1, and the thermal conductivity of the metal is K2, wherein K1<K2 / 5.

[0028] In a possible implementation, the connecting pipe is made of non-metallic material.

[0029] In a possible implementation, the connecting pipe includes a metal pipe body and a heat insulation layer, and the heat insulation layer is coated on the periphery of the metal pipe body.

[0030] The connecting tube provided in this application has low thermal conductivity, which can ensure that less heat will be conducted to the terminal device in the area where the connecting tube extends, and can ensure that more heat is conducted to the radiator. Such a design can improve the temperature uniformity effect of the terminal device.

[0031] In one possible implementation, the cross-section of the connecting tube includes a height direction and a width direction, the connecting tube having a larger dimension in the width direction than in the height direction. In the cross-section of the connecting tube, the connecting tube includes a first tube body and a second tube body arranged opposite each other, the first tube body semi-enclosing a first channel, the second tube body semi-enclosing a second channel, the first and second tube bodies being fixedly connected by brazing, and the first and second channels being connected to form an internal channel of the connecting tube. This solution provides a specific method for manufacturing a connecting tube.

[0032] In a possible implementation, the height of the connecting tube does not exceed 0.25 mm. This solution helps ensure a thin design of the space inside the terminal device by limiting the height of the connecting tube.

[0033] In one possible implementation, the at least two heat exchangers and the connecting pipe are integrally formed into a heat sink structure. The heat sink structure includes a first interface and a second interface, the first interface and the second interface communicating with the connecting pipe, and the pump is connected between the first and second interfaces. By integrating all heat exchangers and connecting pipes into a single heat sink structure, this solution eliminates assembly, resulting in a cohesive heat sink assembly that is less prone to leakage and easier to assemble.

[0034] In one possible implementation, the heat sink structure includes a first plate and a second plate. The flow channels within the at least two heat exchangers and the flow channel within the connecting pipe are integrally formed on the surface of the first plate. The first and second plates are relatively connected as a single body, such that the flow channels within the at least two heat exchangers and the flow channel within the connecting pipe are formed between the first and second plates. In this solution, the flow channels within the heat exchanger and the flow channel within the connecting pipe are formed on the first plate, while the second plate is a smooth flat plate, which facilitates controlling production costs and difficulty.

[0035] In one possible implementation, the first and second interfaces are located at the junction of the first and second plates. This design ensures that the pump occupies as little space as possible between the first and second interfaces in the thickness direction of the heat sink structure, thereby facilitating a thinner design for the terminal device.

[0036] In one possible implementation, the heat sink structure encloses a housing space for accommodating the pump. The heat dissipation assembly provided in this solution places the pump within the housing space enclosed by the heat sink structure. The pump does not occupy space outside the heat sink structure, thus conserving space within the terminal device.

[0037] In one possible implementation, the heat sink structure includes a top edge and a bottom edge that are oppositely disposed, and a first side edge and a second side edge that are oppositely disposed and connected between the top edge and the bottom edge. One of the at least two heat exchangers is a cooler, and the cooler is formed in an area of ​​the heat sink structure adjacent to the top edge. At least one of the at least two heat exchangers is a radiator, and the radiator is formed in an area of ​​the heat sink structure adjacent to the bottom edge. Some of the connecting tubes are first tubes, and the first tubes are adjacent to the first side edge and connected between the cooler and the radiator. Some of the connecting tubes are second tubes, and the second tubes are adjacent to the second side edge and connected between the cooler and the radiator. This solution provides a specific structure of a heat sink structure, which specifically limits the positions of the cooler, radiator, and connecting tubes therein, which is conducive to miniaturizing the size of the heat sink structure and making it easy to match the internal environment of terminal devices such as mobile phones.

[0038] In one possible implementation, the heat sink structure is provided with an isolation zone, with a portion of the isolation zone located on a side of the first tube away from the first side edge and adjacent to the first tube, and a portion of the isolation zone located on a side of the second tube away from the second side edge and adjacent to the second tube. By providing the isolation zone on the heat sink structure, the present application separates the connecting tubes in the heat sink assembly used to transport the coolant at a lower temperature from the connecting tubes used to transport the coolant at a higher temperature, thereby reducing direct heat conduction between the two and enhancing heat exchange between the cooler and the radiator.

[0039] In a possible implementation, the pump is disposed in part of the isolation zone. Placing the pump in the isolation zone can save space by utilizing the isolation zone to install the pump, and can also ensure thermal isolation of the hot and cold water pipes.

[0040] In one possible implementation, part of the heat sink structure forms a vapor chamber, and the heat exchange circulation pipeline formed by the at least two heat exchangers and the connecting pipe is arranged around the periphery of the vapor chamber. One of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators. The evaporation zone of the vapor chamber is adjacent to the cooler, and the condensation zone of the vapor chamber is located between the cooler and the radiator. In this embodiment, the evaporation zone of the vapor chamber and the cooler are arranged adjacent to each other. Heat at the cooler position can be transferred to the evaporation zone of the vapor chamber through the main material of the heat sink structure, resulting in high thermal conductivity. The vapor chamber can supplement heat dissipation, which is beneficial to improving heat dissipation efficiency. By arranging the vapor chamber and the heat exchange circulation pipeline on a heat sink structure, this solution allows the heat sink structure to have two heat dissipation systems: an active liquid cooling system for the heat exchange circulation pipeline and a heat dissipation system for the vapor chamber. The two heat dissipation systems can work together, or when the terminal device has low power consumption, the active liquid cooling system can be disabled and only the heat dissipation system of the vapor chamber can be used. Therefore, this solution has greater application flexibility and can achieve better heat dissipation performance.

[0041] In the second aspect, the present application provides a temperature equalizing plate, including a shell, which surrounds a sealed space, in which a refrigerant medium is arranged. The sealed space includes an evaporation zone, in which a plurality of spaced-apart nucleation structures are arranged. The periphery of each nucleation structure is a hydrophilic structure, and the nucleation structure is used to promote nucleation boiling of the refrigerant medium.

[0042] The embodiment of the present application is to set up a structure in which nucleation structures and hydrophilic structures are alternately distributed in the evaporation zone of the temperature equalizing plate, that is, multiple nucleation structures are distributed at intervals, and the periphery of each nucleation structure is a hydrophilic structure. The surface of the nucleation structure has a hydrophobic function, that is, the contact angle between the surface of the nucleation structure and the liquid is large, so that the contact area between the liquid and the nucleation structure is smaller, and it is easier to nucleate and boil under the influence of the heat source. The contact angle between the hydrophilic structure and the liquid is small, and the fluid can expand and infiltrate on the surface of the hydrophilic structure, and the hydrophilic structure can continuously transport the liquid to the nucleation structure. The temperature equalizing plate provided by the present application can realize the easy nucleation and boiling of the liquid in the evaporation zone, thereby improving the temperature equalization effect of the temperature equalizing plate.

[0043] For example, the housing includes a first cover plate and a second cover plate. The first cover plate is thermally connected to the heat source, and the nucleation structure is disposed on the inner surface of the first cover plate, closer to the heat source. This allows the liquid in the evaporation zone to be more easily nucleated and boiled due to the nucleation structure. Therefore, the heat spreader provided in this application can achieve nucleation boiling of the liquid in the evaporation zone at a lower temperature, thereby improving the temperature balancing effect of the heat spreader.

[0044] In one possible implementation, the nucleation structure includes a groove structure formed on the inner side of the shell, a hydrophobic surface formed on the inner side of the shell, or a metal oxide coating formed on the inner side of the shell. This solution provides three specific nucleation structure forms. Specifically, the first form is to form a hydrophobic surface through surface treatment, which constitutes the nucleation structure; the second form is to make the surface of the nucleation structure hydrophobic by providing a groove structure; and the third form is to make the surface of the nucleation structure hydrophobic by providing a metal oxide coating. All three solutions are easy to implement and have low production costs.

[0045] In one possible implementation, in the evaporation zone, a plurality of micropillars are provided on the inner wall of the shell, the plurality of micropillars are spaced apart, the micropillars include an end face and a side face connected between the end face and the inner wall of the shell, the end face forms the groove structure, or the hydrophobic surface, or the metal oxide coating, and the side face of the micropillar and the surface of the inner wall between the plurality of micropillars are both provided with the hydrophilic structure. In this embodiment, by providing micropillars on the inner surface of the shell, the end face of the micropillar forms a hydrophobic surface, and the side face of the micropillar and the surface of the inner wall between the plurality of micropillars can both be a hydrophilic structure, so that the contact angle of the liquid on the end face with the end face is large, making it easier for the liquid to nucleate and boil. The method of providing micropillars on the inner surface of the first cover plate is easy to manufacture. For example, the micropillars can be integrally formed directly on the shell by stamping, etc., and the manufacturing cost is low.

[0046] In one possible implementation, support columns are provided within the sealed space, with one end of at least some of the support columns arranged in the evaporation zone connected to the shell, and the other end contacting the end face of at least one of the micropillars. This solution utilizes the abutment between the support columns and the micropillars, allowing them to jointly construct a support structure within the evaporation zone, thereby preventing collapse of the internal space within the evaporation zone and ensuring space for liquid vaporization. Furthermore, the support columns can be integrally formed with the shell, with the support columns abutting the micropillars. This reduces the need for the support columns to be excessively long, and allows them to be directly formed on the inner surface of the shell through a stamping process. This results in a simple manufacturing process, low cost, and high yield.

[0047] In one possible implementation, within the sealed space, the evaporation zone is provided with a plurality of support pillars, distributed between adjacent micropillars, and supporting the inner wall of the housing in the thickness direction of the vapor chamber. This solution, by placing support pillars within the evaporation zone against the inner surface of the housing, allows the micropillars to be distributed away from the support pillars. During the manufacturing process, there is no need to consider the positional relationship and alignment between the micropillars and support pillars, resulting in a simpler manufacturing process and lower production costs.

[0048] In one possible implementation, the housing includes a first cover plate and a second cover plate positioned opposite each other. A plurality of capillary walls are provided within the sealed space. These capillary walls are spaced apart and supported between the first and second cover plates. In the evaporation zone, the capillary walls are located between the micropillars. This solution utilizes the capillary walls as structures supporting the first and second cover plates within the evaporation zone. These capillary walls also function as liquid transport, improving liquid circulation within the heat spreader.

[0049] In one possible implementation, the sealed space includes a condensation zone and a first channel and a second channel connecting the condensation zone and the evaporation zone. The evaporation zone, the first channel, the condensation zone, and the second channel are sequentially connected to form a ring-shaped circulation channel. This solution provides a loop structure within the vapor chamber, ensuring smooth refrigerant transport within the vapor chamber and promoting temperature uniformity.

[0050] In one possible implementation, the vapor chamber is provided with a strip-shaped hole extending through the housing in the thickness direction of the vapor chamber. Along the plane extending from the vapor chamber, one end of the strip-shaped hole is located at or adjacent to the edge of the evaporation zone, and the other end of the strip-shaped hole is located at or adjacent to the edge of the condensation zone. The inner wall of the strip-shaped hole forms a partition wall between the first and second channels. This solution uses the provision of the strip-shaped hole to separate the first and second channels, thereby constructing a loop architecture.

[0051] In one possible implementation, the first channel is a gas channel, and the second channel is a liquid channel. The first channel includes an inlet and an outlet, wherein the inlet communicates with the evaporation zone, and the outlet communicates with the condensation zone. The gas channel includes an expansion zone, wherein the expansion zone has a larger cross-section than the inlet, and the expansion zone is located between the inlet and outlet. Because the expansion zone is wider than the inlet, the vapor pressure at the expansion zone is lower, and the phase transition temperature is lower, which allows the gas to expand and the condensation temperature to decrease, thereby providing favorable conditions for the vapor to flow along the gas channel to the condensation zone.

[0052] In one possible implementation, the housing includes a first cover plate and a second cover plate arranged opposite each other, the first channel being a gas channel, the second channel being a liquid channel, a first capillary layer and a second capillary layer being provided within the second channel, the first capillary layer covering the inner surface of the first cover plate, the second capillary layer covering the inner surface of the second cover plate, a support column being provided within the liquid channel, one end of the support column being fixedly connected to the inner surface of the second cover plate, the other end abutting the first capillary layer, and at least a portion of the side surfaces of the support column being hydrophobic. This solution, by providing the side surfaces of the support column with hydrophobic properties within the liquid channel, is intended to facilitate liquid separation from the side surfaces of the support column and entry into the first and second capillary layers, thereby smoothly completing liquid return and improving the fluidity of the refrigerant medium transport of the temperature equalizer, thereby promoting a uniform temperature effect.

[0053] In one possible implementation, the combined thickness of the first and second capillary layers accounts for at least 80% of the height of the second channel. Because the liquid channel is filled with liquid refrigerant, the liquid refrigerant is transferred through both the first and second capillary layers. Therefore, this solution limits the combined thickness of the first and second capillary layers to at least 80% of the liquid channel height, facilitating a slimmer vapor chamber design.

[0054] In one possible implementation, the first channel is a gas channel, and the second channel is a liquid channel. The second channel includes a tail end and a wide region. The tail end is located where the liquid channel and the evaporation zone connect, and the wide region and the tail end are adjacent. The cross-sectional area of ​​the tail end is smaller than the cross-sectional area of ​​the wide region. This solution prevents gas in the evaporation zone from flowing back into the liquid channel by configuring the tail end to be smaller than the wide region.

[0055] In one possible implementation, the condensation zone includes a plurality of biomimetic protrusion structures, which are spaced apart and include a bottom and a top. The bottom is connected to the inner surface of the shell, and the projection of the top on the bottom is located at the asymmetric center of the bottom. The top is the highest position of the biomimetic protrusion structure relative to the surface of the shell. Because the projection of the top on the bottom is located at the asymmetric center of the bottom, the surface connecting the top and bottom forms an inclined plane, and the inclined planes on both sides of the top have different angles. By forming inclined planes with different angles, gas condensed into water droplets on the biomimetic protrusion structures can flow quickly and enter the capillary structure. Therefore, this solution can increase the condensation rate through the biomimetic protrusion structure, so that the vapor in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0056] In one possible implementation, the shell includes a first cover plate and a second cover plate that are arranged opposite each other. The condensation area includes a plurality of support columns, which are spaced apart on the inner surface of the second cover plate. A capillary structure is provided on the inner surface of the first cover plate, and the plurality of support columns support the capillary structure. The plurality of bionic protrusion structures are distributed one-to-one between adjacent support columns, and the tops of the plurality of bionic protrusion structures are spaced apart from the capillary structure on the surface of the first cover plate. This solution achieves support between the first and second cover plates by providing support columns. The tops of the bionic protrusion structures are spaced apart from the inner surface of the first cover plate. This increases the contact area between the top surface of the bionic protrusion structure and the refrigerant medium, highlighting the effect of the bionic protrusion structure in increasing the condensation rate.

[0057] In one possible implementation, the housing includes a first cover plate and a second cover plate positioned opposite each other. The multiple bionic protrusions are spaced apart on the inner surface of the second cover plate. The inner surface of the first cover plate is provided with a capillary structure, and the tops of the multiple bionic protrusions abut the capillary structure on the surface of the first cover plate. This solution utilizes the bionic protrusions as support structures between the first and second cover plates, allowing the bionic protrusions to both provide support and increase the condensation rate. This means that by designing the support structures within the condensation zone as bionic protrusions, this solution can significantly increase the condensation rate.

[0058] In one possible implementation, the bionic raised structure includes a first inclined surface and a second inclined surface connected between the top and the bottom, the direction of the perpendicular line between the first cover plate and the second cover plate is a first direction, and on a first cross-section of the bionic raised structure, the angle between the extension direction of the second inclined surface and the first direction is a first angle, the angle between the extension direction of the second inclined surface and the first direction is a second angle, the first angle is greater than the second angle, and the first cross-section is parallel to the first direction and passes through the top. This solution achieves the effect of increasing the condensation rate of the bionic raised structure by constraining the angular relationship between the first and second inclined surfaces formed between the top and the bottom, that is, the first angle is greater than the second angle. This solution is easy to manufacture and has low production costs.

[0059] In one possible implementation, the first angle is in the range of 60°-80°, and the second angle is in the range of 10°-30°. This solution provides a specific angle range for the first angle and the second angle, which is conducive to ensuring the effect of the bionic protrusion structure in increasing the condensation rate.

[0060] In a third aspect, an embodiment of the present application provides a temperature equalizing plate, comprising a first cover plate and a second cover plate arranged opposite to each other, which are sealed and connected to form a sealed space, wherein the sealed space comprises an evaporation zone, a condensation zone, a gas channel connected between the condensation zone and the evaporation zone, and a liquid channel connected between the condensation zone and the evaporation zone, wherein the condensation zone comprises a plurality of bionic protrusion structures, and the plurality of bionic protrusion structures are distributed at intervals on the surface of the second cover plate, each of the bionic protrusion structures comprises a bottom, a top, and a first inclined surface and a second inclined surface connected between the top and the bottom, the direction of the vertical line between the first cover plate and the second cover plate is a first direction, the angle between the second inclined surface and the first direction is a first angle, the angle between the second inclined surface and the first direction is a second angle, and the first angle is greater than the second angle.

[0061] This solution can increase the condensation rate through the bionic convex structure, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0062] In a possible implementation, the first angle ranges from 60° to 80°; and the second angle ranges from 10° to 30°.

[0063] In one possible implementation, the top of each of the bionic protrusion structures faces the capillary structure of the first cover plate and is spaced apart from the capillary structure on the surface of the first cover plate. The condensation area also includes a plurality of support columns, which are spaced apart on the surface of the second cover plate and rest against the capillary structure on the surface of the first cover plate. The plurality of bionic protrusion structures are distributed in the area between adjacent support columns.

[0064] In a possible implementation, the top of each of the bionic protruding structures abuts against the capillary structure of the first cover plate.

[0065] In a fourth aspect, an embodiment of the present application provides a cooler, which includes a shell, which surrounds a plurality of fluid channels, and the cooler includes a channel inlet and a channel outlet connecting the fluid channels and the outside world, and the channel inlet and the channel outlet are respectively located on both sides of the fluid channel, and the shell is used to be connected to the heat source through a thermal interface material, and a plurality of hydrophobic surfaces are provided in the liquid channel at intervals, and the outer periphery of each of the hydrophobic surfaces is a hydrophilic surface, and the hydrophobic surface is used to promote nucleate boiling of the liquid, and the hydrophilic surface is used to supply the liquid to the hydrophobic surface.

[0066] The embodiment of the present application is to set up a structure in which a hydrophobic surface and a hydrophilic surface are distributed alternately in the cooler, that is, multiple hydrophobic surfaces are distributed at intervals, and the periphery of each hydrophobic surface is a hydrophilic surface. Since the contact angle between the hydrophobic surface and the liquid is large, the contact area between the liquid and the hydrophobic surface is smaller, and it is easier to nucleate boiling under the influence of the heat source. The hydrophilic surface can continuously transport liquid to the hydrophobic surface. Therefore, the temperature equalization plate provided by the present application can achieve nucleation boiling of the liquid in the cooler at a lower temperature, thereby improving the heat dissipation performance of the cooler.

[0067] In one possible implementation, the present application arranges a hydrophobic surface on the inner surface of the shell close to the heat source, so that the hydrophobic surface is closer to the heat source, making it easier for the liquid in the cooler to nucleate boiling under the influence of the hydrophobic surface.

[0068] In a fifth aspect, an embodiment of the present application provides a heat sink structure, part of which forms the heat sink described in any one of the embodiments of the second and third aspects, the heat sink structure comprising a first plate and a second plate, the second plate forming a cooler flow channel, a radiator flow channel and a connecting pipe flow channel, the second plate and the first plate being arranged relative to each other and connected as a whole, so that the cooler flow channel, the radiator flow channel and the connecting pipe flow channel form a sealed space between the first plate and the second plate; the heat exchange circulation pipeline formed by the cooler flow channel, the radiator flow channel and the connecting pipe flow channel is arranged around the periphery of the heat sink; the evaporation zone is adjacent to the cooler flow channel. By arranging the heat sink and the heat exchange circulation pipeline on a heat sink structure, this solution allows the heat sink structure to have two heat dissipation systems, namely, an active liquid cooling heat dissipation system of the heat exchange circulation pipeline and a heat dissipation system of the heat sink. The two heat dissipation systems can work together, or when the terminal device has low power consumption, the active liquid cooling heat dissipation system can be disabled and only the heat dissipation system of the heat sink can be used. Therefore, this solution has better application flexibility and can achieve better heat dissipation performance.

[0069] In the sixth aspect, an embodiment of the present application provides a terminal device, including a pump and a heat sink structure as described in the fourth aspect, the heat sink structure including a first interface and a second interface, the first interface and the second interface are connected to the connecting pipe, and the pump is connected between the first interface and the second interface.

[0070] In one possible implementation, the heat sink structure is enclosed to form a receiving space, which is used to accommodate the pump. The receiving space is located between the temperature equalizing plate and part of the connecting pipe flow channel, and is used to isolate the temperature equalizing plate and part of the connecting pipe flow channel.

[0071] In one possible implementation, the heat dissipation plate structure includes a top end and a bottom end that are relatively arranged, and a first side and a second side that are connected between the top end and the bottom end and are relatively arranged, the cooler flow channel is formed in a first area adjacent to the top end, and the radiator flow channel is formed in a second area adjacent to the bottom end, part of the connecting tubes are first tubes, the first tubes are adjacent to the first side and are connected between the cooler flow channel and the radiator flow channel, part of the connecting tubes are second tubes, the second tubes are adjacent to the second side and are connected between the cooler flow channel and the radiator flow channel, the temperature homogenizing plate is located between the first tube and the second tube, and an isolation zone is provided on the heat dissipation plate structure, part of the isolation zone is located between the first tube and the temperature homogenizing plate, and part of the isolation zone is located between the second tube and the temperature homogenizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0073] FIG1 is a schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application;

[0074] FIG2 is a schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application;

[0075] FIG3 is a schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application;

[0076] FIG4 is a schematic side exploded view of a terminal device provided in one embodiment of the present application;

[0077] FIG5 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0078] FIG6 is a side view of the internal structure layout of the terminal device shown in FIG5;

[0079] FIG7 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0080] FIG8 is a side view of the internal structure layout of the terminal device shown in FIG7;

[0081] FIG9 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0082] FIG10 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0083] FIG11 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0084] FIG12 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0085] FIG13 is a schematic diagram of the internal structure layout of a terminal device provided in one embodiment of the present application;

[0086] FIG14 is a schematic diagram of a configuration scheme of a connecting pipe at a rotating shaft assembly in a terminal device provided in one embodiment of the present application;

[0087] FIG15 is a schematic diagram of a configuration scheme of a connecting pipe at a rotating shaft assembly in a terminal device provided in one embodiment of the present application;

[0088] FIG16 , FIG17 and FIG18 are partial schematic diagrams of the connecting pipe provided in a specific embodiment of the present application;

[0089] FIG19 is a perspective schematic diagram and a partially enlarged schematic diagram of a cooler in a heat dissipation assembly provided in one embodiment of the present application;

[0090] FIG20 is a perspective exploded schematic diagram of the heat exchanger shown in FIG19 ;

[0091] FIG21 is a perspective schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0092] FIG22 is a schematic plan view of the first plate in the heat exchanger shown in FIG21 ;

[0093] FIG23 is a perspective schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0094] FIG24 is a schematic plan view of the first plate in the heat exchanger shown in FIG23 ;

[0095] FIG25 is a partial perspective schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0096] FIG26 is a partial perspective schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0097] FIG27 is a partial perspective schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0098] FIG28 is a partial perspective schematic diagram and a partially enlarged schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application;

[0099] FIG29 , FIG30 and FIG31 are respectively schematic plan views of a first plate in a heat exchanger provided in one embodiment of the present application;

[0100] FIG32 is a schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application;

[0101] FIG33 is a schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application;

[0102] FIG34 is an enlarged schematic diagram of a liquid channel in a heat exchanger provided in one embodiment of the present application;

[0103] FIG35 is a schematic diagram of a pump provided in one embodiment of the present application;

[0104] FIG36 is a perspective exploded schematic diagram of a heat dissipation assembly provided in one embodiment of the present application;

[0105] FIG37 is a plan view of the first plate member of the heat dissipation plate structure in the heat dissipation assembly shown in FIG36 ;

[0106] FIG38 is a schematic plan view of the second plate member of the heat dissipation plate structure in the heat dissipation assembly shown in FIG36 ;

[0107] FIG39 is a planar exploded schematic diagram of a heat dissipation plate structure provided in one embodiment of the present application;

[0108] FIG40 is a schematic diagram of the heat dissipation plate structure shown in FIG39 being applied in a terminal device;

[0109] FIG41 is a planar exploded schematic diagram of a heat dissipation plate structure provided in one embodiment of the present application;

[0110] FIG42 is a planar exploded schematic diagram of a heat dissipation plate structure provided in one embodiment of the present application;

[0111] FIG43 is a planar exploded schematic diagram of a temperature vapor chamber provided in one embodiment of the present application;

[0112] FIG44 is a cross-sectional schematic diagram of a vapor chamber provided in one embodiment of the present application, wherein the support structure inside the vapor chamber is omitted;

[0113] FIG45 is a specific structural design of the evaporation zone in the temperature vaporizer provided in one embodiment of the present application;

[0114] FIG46 is a schematic cross-sectional view of a portion of micropillars in the structure shown in FIG45 ;

[0115] FIG47 is a schematic cross-sectional view of some micropillars in a vapor chamber provided in one embodiment;

[0116] FIG48 is a specific structural design of the evaporation zone in a vapor chamber provided in one embodiment of the present application;

[0117] FIG49 is a schematic cross-sectional view of a portion of micropillars in the structure shown in FIG48 ;

[0118] FIG50 is a cross-sectional schematic diagram of the evaporation zone of a temperature vapor chamber provided in one embodiment of the present application;

[0119] FIG51 is a cross-sectional schematic diagram of the evaporation zone of a temperature vapor chamber provided in one embodiment of the present application;

[0120] FIG52 is a schematic cross-sectional view of the evaporation zone of a temperature vapor chamber provided in one embodiment of the present application;

[0121] FIG53 is a schematic diagram of a temperature vapor chamber provided in one embodiment of the present application;

[0122] FIG54 is an enlarged schematic cross-sectional view of position AA in FIG53;

[0123] FIG55 is a schematic diagram of an internal channel of a temperature vapor chamber provided in one embodiment of the present application;

[0124] FIG56 is a cross-sectional schematic diagram of a liquid channel of a temperature vapor chamber provided in one embodiment of the present application;

[0125] FIG57 is a perspective view, a top view, a front view, and a left side view of one of the biomimetic protrusion structures in the condensation area of ​​a vapor chamber provided by one embodiment of the present application;

[0126] FIG58 is a schematic diagram of the distribution of bionic protrusion structures in the condensation zone of a vapor chamber provided in one embodiment of the present application;

[0127] FIG59 is a partially enlarged cross-sectional schematic diagram of the bionic protrusion structure distribution solution shown in FIG58;

[0128] FIG60 is a schematic diagram of the distribution of bionic protrusion structures in the condensation zone of a vapor chamber provided in one embodiment of the present application;

[0129] FIG61 is a partially enlarged cross-sectional schematic diagram of the bionic protrusion structure distribution solution shown in FIG60;

[0130] FIG62 is a schematic diagram showing a comparison of the condensation phenomenon (the portion on the left of the dotted line) produced by the bionic protrusion structure 921 provided in one embodiment and the condensation phenomenon (the portion on the right of the dotted line) produced by an ordinary surface. DETAILED DESCRIPTION

[0131] In the following description of the embodiments of this application, unless otherwise specified, "and / or" is used to describe an association relationship between objects, indicating that three relationships can exist between objects. For example, A and / or B is used to represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0132] In the following description of the embodiments of the present application, “plurality” means two or more than two.

[0133] In the following description of the embodiments of the present application, terms such as "first" and "second" are only used to distinguish technical features for clear description, and should not be understood as implying relative importance or implicitly indicating the number of the indicated technical features.

[0134] The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "front," "back," "left," "right," "inner," "outer," "side," "top," and "bottom," etc., are merely references to directions in the accompanying drawings. Therefore, these directional terms are intended to better and more clearly illustrate and facilitate understanding of the embodiments of this application, and are not intended to explicitly or implicitly indicate that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the embodiments of this application.

[0135] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection, and can be a direct connection or an indirect connection through an intermediate medium.

[0136] Terminal devices can include mobile phones, tablets, smartwatches, laptops, wearable devices, and more. As terminal devices gain more functionality and performance, their heat generation increases dramatically. For example, more powerful computing chips, 5G technology, which consumes more power than 4G, and fast charging technologies with higher currents all lead to significant increases in heat generation, placing higher demands on the device's heat dissipation performance. Without an effective heat dissipation design, the accumulation of heat or cold can cause the temperature of mobile terminal devices to overheat or underheat, leading to the following adverse effects: decreased and limited device performance, poor user thermal experience, reduced device reliability, and battery safety issues.

[0137] Therefore, the heat dissipation design of terminal devices has become not only a major bottleneck in improving the performance and reliability of terminal devices, but also one of the most important indicators for consumers. In view of this, the embodiments of the present application provide an active liquid cooling solution that can overcome the shortcomings of conventional heat dissipation solutions, which cannot fully dissipate heat and thus have poor temperature uniformity across the entire device.

[0138] The terminal device provided in this application includes a housing and a heat dissipation assembly located within the housing. For example, the terminal device can be a mobile phone, and the housing can include a middle frame and a back shell, with the display screen and the back shell of the terminal device respectively disposed on opposite sides of the middle frame. The heat dissipation assembly includes at least two heat exchangers, a pump, and connecting pipes. The interior space of the housing includes a hot zone and a cold zone. It can be understood that the hot zone is the area where the terminal device generates heat when in operation, for example, the area where heat-generating devices (power devices) are located; the cold zone is the area where the terminal device does not generate heat or generates very low heat when in operation. The cold zone and the hot zone are typically spaced apart within the interior space of the housing, that is, other devices or apparatuses may be located in the space between the cold zone and the hot zone. For example, if the terminal device is a mobile phone, the hot zone and the cold zone are located at opposite ends of the battery. The area between the battery and the top of the phone can be defined as the hot zone because the motherboard is located there. The portion of the battery near the bottom of the phone and at least the portion between the battery and the bottom of the phone can be defined as the cold zone because there are no major heat-generating devices.

[0139] One of the at least two heat exchangers of the heat dissipation assembly is located in a hot zone within the terminal device, while the remaining heat exchangers are located in a cold zone within the terminal device. A connecting pipe connects the at least two heat exchangers to form a heat exchange circulation pipeline, and a pump is provided in the heat exchange circulation pipeline to achieve heat exchange between the hot zone and the cold zone. In this embodiment of the present application, an active liquid cooling circulation system, i.e., a heat dissipation assembly, is provided in the internal space of the terminal device. This system can transfer heat from the hot zone to the cold zone for dissipation, thereby improving the temperature uniformity of the terminal device.

[0140] Figure 1 is a schematic diagram of a heat dissipation component provided in a terminal device according to an embodiment of the present application. The terminal device 100 shown in Figure 1 is a mobile phone, and the internal space of the terminal device 100 includes a hot zone H and a cold zone C. For example, the terminal device 100 includes a top 1001 and a bottom 1002 arranged opposite to each other. Specifically, the top 1001 is the end where the front camera of the terminal device is located, and the bottom 1002 is the end where the charging port of the terminal device is located. The hot zone H is close to the top 1001 of the terminal device 100, and the cold zone C is close to the bottom 1002 of the terminal device 100. The hot zone H may contain major heat-generating components, such as a motherboard (or SOC). The cold zone C may contain non-heat-generating components (or components with lower heat generation), such as certain areas on a small board, or a portion of the battery near the small board. If there is no small board in the terminal device 100, the cold zone C includes at least a portion of the area between the battery and the bottom 1002 of the terminal device 100, and an area near the bottom 1002 of the terminal device 100 where part of the battery is located.

[0141] Referring to Figure 1 , the heat dissipation assembly 20 is disposed within the internal space of the terminal device 100, which also houses circuit boards and electronic components. The heat dissipation assembly 20 includes a heat exchanger 20A, a pump 23, and a connecting pipe 24. There are at least two heat exchangers 20A, each comprising a cooler 21 and a radiator 22. Specifically, one heat exchanger 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is located in the hot zone H, and the radiator 22 is located in the cold zone C. A connecting pipe 24 connects the cooler 21 and the radiator 22 to form a heat exchange circulation pipeline. A refrigerant, which may be water, is contained within the heat exchanger 20A and the connecting pipe 24. A pump 23 is disposed within the heat exchange circulation pipeline to drive the refrigerant to flow within the heat exchange circulation pipeline to achieve heat exchange between the hot zone H and the cold zone C.

[0142] In one embodiment, pump 23 is a liquid micropump. Heat dissipation assembly 20 may include a pump assembly, which includes pump 23 and a control unit configured to control the operating state of pump 23 and collect relevant data. In other embodiments, the control unit may be a circuit unit disposed within the terminal device, or the control unit may be integrated into other circuits of the terminal device, such as a system-on-chip (SoC).

[0143] For mobile phones, their internal space is limited and the heat dissipation requirements are severe. Compared with the use of a temperature equalizer for heat dissipation, the embodiment of the present application applies the heat dissipation component 20 to the internal space of the terminal device 100. Since the pump 23 can realize the liquid cooling cycle between the cooler 21 and the radiator 22, the heat dissipation component 20 constitutes an active liquid cooling cycle architecture, which can improve the temperature uniformity of the terminal device 100. In one embodiment, the present application can use the power of the pump to bring the heat from the hot zone near the top of the mobile phone to the cold zone near the bottom of the mobile phone for heat dissipation. Compared with the heat dissipation circulation path of the temperature equalizer, the heat dissipation circulation path of the heat dissipation component provided in the embodiment of the present application is longer, and the heat dissipation effect and temperature equalization effect are more significant.

[0144] Figure 2 is a schematic diagram of a heat dissipation assembly provided within a terminal device according to one embodiment of the present application. The terminal device 100 shown in Figure 2 is a laptop computer. This embodiment of the present application schematically illustrates a hot zone H and a cold zone C within the terminal device 100. For example, the display screen area of ​​the laptop computer can be cold zone C, the area below the laptop computer keyboard where the handwriting pad is located can be hot zone H, and the laptop computer's motherboard can be located within hot zone H. In one embodiment, the heat dissipation assembly 20 includes a heat exchanger 20A, a pump 23, and a connecting pipe 24. There are at least two heat exchangers 20A, each of which includes a cooler 21 and a radiator 22. Specifically, one of the heat exchangers 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is located within the hot zone H, in the lower right corner of the laptop computer; the radiator 22 is located within the cold zone C, in the lower left corner of the display screen. The pump 23 is located within the hot zone H, near the cooler 21. Part of the connecting tube 24 extends below the keyboard, part of the connecting tube 24 passes through the keyboard area and the hinge area, part of the connecting tube extends to the right edge area of ​​the keyboard, and part of the connecting tube 24 extends to the area where the display screen is located.

[0145] The manner in which the heat dissipation assembly 20 is provided within the terminal device 100 shown in FIG2 is similar to the embodiment shown in FIG1 , in that both embodiments form an active liquid cooling circulation architecture within the internal space of the terminal device 100 to achieve heat exchange between the hot zone H and the cold zone C, thereby improving the heat dissipation capability of the laptop computer. For example, the embodiment of the present application can transfer the heat generated by the motherboard of the laptop computer to the display area. When the display screen is in use, there is no obstruction around it, and the display screen does not generate heat. Transferring the heat from the motherboard to the display area can improve the heat dissipation and temperature equalization of the laptop computer, thereby preventing heat from being concentrated in the motherboard area and affecting performance and user experience.

[0146] FIG3 is a schematic diagram of a terminal device provided in accordance with an embodiment of the present application, wherein a heat dissipation component is provided in the terminal device. The terminal device 100 shown in FIG3 is a tablet computer. The internal space of the tablet computer also has a heat outlet zone H and a cold zone C. FIG3 schematically shows the positions of the hot zone H and the cold zone C in the tablet computer. In a specific terminal device 100, the positions, shapes, sizes, etc. of the hot zone H and the cold zone C can be adjusted as required. The manner in which the heat dissipation component 20 is provided in the terminal device 100 shown in FIG3 is similar to the embodiment shown in FIG1 , both of which constitute an active liquid cooling circulation architecture in the internal space of the terminal device 100 to achieve heat exchange between the hot zone H and the cold zone C, thereby improving the heat dissipation capacity of the tablet computer. In one embodiment, the heat dissipation component 20 includes a heat exchanger 20A, a pump 23, and a connecting pipe 24. The number of heat exchangers 20A is at least two, and the heat exchanger 20A includes a cooler 21 and a radiator 22, i.e., one of the heat exchangers 20A is a cooler 21, and the remaining heat exchangers 20A are radiators. The cooler 21 is located in the hot zone H, in the lower right corner of the tablet. The radiator 22 is located in the cold zone C, in the upper left corner of the tablet. The pump 23 is located near one side of the tablet. A connecting pipe 24 extends into the interior of the tablet.

[0147] FIG4 is a schematic diagram of a side exploded view of a terminal device provided in one embodiment of the present application. The terminal device 100 shown in FIG4 can be a mobile phone. The terminal device 100 includes a display screen 10, a middle frame 30, a back shell 50, a heat dissipation component 20, a mainboard 40, a battery 60, and a small board 70. The middle frame 30 and the back shell 50 are connected to form a shell 100A of the terminal device. The display screen 10 and the shell 100A are connected and together enclose an internal space of the terminal device 100, and the heat dissipation component 20, the mainboard 40, the battery 60, and the small board 70 are located in this internal space. In one embodiment, there may be no small board in the terminal device 100.

[0148] FIG5 is a schematic diagram of the internal structural layout of a terminal device provided in one embodiment of the present application. In one embodiment shown in FIG5 , the terminal device 100 is a mobile phone, and is provided with a mainboard 40, a battery 60, and a small board 70. In this embodiment, the terminal device 100 includes a top end 1001 and a bottom end 1002 arranged in opposite directions. Specifically, the top end 1001 is the end where the front camera of the terminal device is located, and the bottom end 1002 is the end where the charging port of the terminal device is located. The battery 60 includes a first end 601 and a second end 602 arranged in opposite directions. The first end 601 is located at the edge of the battery 60 facing the top end 1001, and the second end 602 is located at the edge of the battery 60 facing the bottom end 1002. The mainboard 40 and the small board 70 are distributed on opposite sides of the battery 60, with the mainboard 40 located between the first end 601 and the top end 1001. The small board 70 is located between the second end 602 and the bottom end 1002. The hot zone H includes the area where the main board 40 is located, and the cold zone C includes at least a portion of the area where the small board 70 is located, as well as a portion of the battery 60 located near the small board 70. As shown in Figure 5, in the area between the battery 60 and the bottom 1002 of the terminal device 100, the portion within the dashed box belongs to the cold zone C, while the portion outside the dashed box does not belong to the cold zone C. For example, a speaker is a heat-generating device and is therefore not within the cold zone C.

[0149] Referring to FIG. 5 , in some embodiments, a heat generating device 41, such as a System-on-a-Chip (SOC), is provided on the motherboard 40. The heat dissipation assembly 20 includes a heat exchanger 20A, a pump 23, and a connecting pipe 24. There are at least two heat exchangers 20A, each comprising a cooler 21 and a radiator 22. Specifically, one heat exchanger 20A is a cooler 21, while the remaining heat exchangers 20A are radiators. The cooler 21 is provided on the heat generating device 41. The area of ​​the cooler 21 is larger than that of the heat generating device 41, ensuring that the cooler 21 fully covers the heat generating device 41. The cooler 21 and the heat generating device 41 are thermally connected via a refrigerant medium to improve the efficiency of heat transfer from the heat generating device 41 to the cooler 21. In this embodiment, the heat exchanger 20A located in the cold zone H overlaps with a portion of the battery 60 and is adjacent to the second end 602. In other words, the radiator 22 overlaps with the portion of the battery 60 near the small plate 70. The pump 23 is disposed in the area where the small plate 70 is located. In other embodiments, the heat exchanger 20A located in the cold zone H may also be disposed in the area between the second end 602 of the battery 60 and the bottom end 1002 of the terminal device 100 .

[0150] In the embodiment shown in Figure 5, the pump 23 is arranged in the cold zone C between the second end 602 of the battery 60 and the bottom end 1002 of the terminal device 100, that is, the area where the small board 70 is located. In other embodiments, the pump 23 can also be arranged in the hot zone H, or a position between the hot zone H and the cold zone C. In one embodiment, the portion of the connecting pipe 24 connected between the pump 23 and the cooler 21 and the portion of the connecting pipe 24 connected between the pump 23 and the radiator 22 are used to transmit a refrigerant with a lower temperature, and the portion of the connecting pipe 24 connected between the radiator 22 and the cooler 21 is used to transmit a refrigerant with a higher temperature. In one embodiment, the portion of the connecting pipe 24 connected between the pump 23 and the cooler 21 and the portion of the connecting pipe 24 connected between the pump 23 and the radiator 22 are used to transmit a refrigerant with a higher temperature, and the portion of the connecting pipe 24 connected between the radiator 22 and the cooler 21 is used to transmit a refrigerant with a lower temperature.

[0151] FIG6 is a side view of the internal structural layout of the terminal device shown in FIG5 . The display screen 10 and the back shell 50 are distributed on opposite sides of the middle frame 30, that is, along the thickness direction of the terminal device 100, the display screen 10, the middle frame 30 and the back shell 50 are stacked. In an embodiment of the present application, the heat dissipation assembly 20 can be distributed between the middle frame 30 and the display screen 10, that is, the cooler 21, the radiator 22, the pump 23 and the connecting pipe 24 are all arranged between the middle frame 30 and the display screen 10. This solution arranges the cooler 21, the radiator 22, the pump and the connecting pipe 24 on the same side of the middle frame 30, which provides convenience for the assembly process of the terminal device 100. The connecting pipe 24 does not need to pass through the middle frame. In one embodiment, the heat dissipation assembly 20 can be assembled into a complete structure, and then the complete structure can be installed at a position between the middle frame 30 and the display screen 10.

[0152] Figure 7 is a schematic diagram of the internal structure layout of the terminal device provided in one embodiment of the present application. Figure 8 is a side view of the internal structure layout of the terminal device shown in Figure 7. Referring to Figures 7 and 8, the cooler 21 and the heating device 41 are connected by a refrigerant medium. In this embodiment, the position arrangement of the radiator 22 and the pump 23 is the same as that of the embodiment shown in Figure 5 and will not be repeated here. In this embodiment, the cooler 21 is located between the middle frame 30 and the display screen 10, and the radiator 22 is located between the middle frame 30 and the back shell 50. The pump 23 is located between the middle frame 30 and the back shell 50. In the thickness direction of the terminal device 100, the connecting pipe 24 needs to pass through the middle frame 30, and part of the connecting pipe 24 (the part of the connecting pipe 24 represented by the solid line in Figure 7) is located between the middle frame 30 and the display screen 10, and part of the connecting pipe 24 (the part of the connecting pipe 24 represented by the dotted line in Figure 7) is located between the middle frame 30 and the back shell 50. This solution disperses the heat dissipation components 20 on both sides of the middle frame 30, and can flexibly use the space on both sides of the middle frame 30. For example, if there is idle space in the area between the middle frame 30 and the back shell 50 near the small board 70, the radiator 22 and the pump 23 can be set in this idle space, and part of the heat dissipation components 20 can be set in the idle space, which is conducive to the overall thin size design of the terminal device 100.

[0153] Figure 9 is a schematic diagram of the internal structural layout of the terminal device provided by an embodiment of the present application. As shown in Figure 9, in this embodiment, the cooler 21 is located in the hot zone H, and is thermally connected to the heating device 41 through a refrigerant medium. The radiator 22 is located in the cold zone C, and is located in the area where the small plate 70 is located. The pump 23 is located in the hot zone H, and the pump 23 is arranged adjacent to the cooler 21. This solution sets the pump 23 in the area where the mainboard 40 is located, which is convenient for setting up a control unit. This control unit is used to control the working state of the pump 23 and collect relevant data. For example, the control unit can be set on the mainboard 40, or the control unit can be integrated into other circuit units on the mainboard 40. In the embodiment of the present application, the control unit for controlling the pump 23 can also be a separate chip, or can be arranged on a separate circuit board independent of the mainboard 40.

[0154] In one embodiment, the number of coolers in the heat dissipation assembly is one, the number of radiators is two or more, and the number of pumps is one, two, or more. The cooler, radiator, pump and connecting pipe constitute two or more parallel liquid cooling circulation systems, so that the heat dissipation assembly can be flexibly arranged in the terminal device to improve temperature uniformity and heat dissipation performance.

[0155] Figure 10 is a schematic diagram of the internal structural layout of the terminal device provided by an embodiment of the present application. As shown in Figure 10, in this embodiment, the number of heat exchangers 20A is three, of which the number of coolers 21 is one and the number of radiators 22 is two. The number of pumps 23 is one. The cooler 21 is located in the hot zone H and is connected to the heating device 41 through a refrigerant medium. The pump 23 is located in the hot zone H, and the pump 23 is arranged adjacent to the cooler 21. One of the radiators 22 (the first radiator) is located in the cold zone C and is located in the area where the small plate 70 is located. The other radiator 22 (the second radiator) is arranged to overlap with a partial area of ​​the battery 60 near the small plate 70. It can be understood that the two radiators 22 are distributed on two parallel liquid cooling pipelines. In this embodiment, by arranging the two radiators 22 in parallel in the cold zone C, the sizes of the two radiators 22 can be different or the same, and their positions can be flexibly arranged in the cold zone C. This solution can set the size of each radiator 22 according to the specific environmental size within the terminal device 100. The two radiators 22 are independent of each other and jointly achieve heat dissipation, which is conducive to rationally utilizing the space within the terminal device 100 while ensuring heat dissipation efficiency. It can avoid the situation where a larger radiator occupies a larger space, resulting in the overall size of the terminal device 100 being affected and a lightweight design being unable to be achieved.

[0156] In other embodiments, based on the embodiment shown in FIG10 , the number of heat sinks 22 can be set to three or more, and can be set according to the internal space requirements of the specific terminal device 100. For example, when the terminal device is a laptop computer, the power of the heating components on the motherboard is relatively high, requiring a stronger heat dissipation capability. Since the cold zone of the laptop computer is relatively large, more heat sinks can be installed, and three or more heat sinks can be set in parallel to improve heat dissipation efficiency.

[0157] Figure 11 is a schematic diagram of the internal structure of a terminal device provided in one embodiment of the present application. As shown in Figure 11, in this embodiment, the terminal device 100 is a foldable device, i.e., a mobile phone with a folding function. The terminal device 100 includes a first body 101 and a second body 102, connected by a hinge assembly 103. The first body 101 and the second body 102 can be folded or unfolded relative to each other. The first body 101 houses a main frame circuit board and a main frame battery. The main frame circuit board is equivalent to the terminal device's motherboard and is provided with a heating device 41, such as a SOC. The second body 102 houses a sub-frame circuit board and a sub-frame battery. Other electronic components, such as a speaker, are located on the side of the sub-frame battery away from the sub-frame circuit board. The first body 101 is provided with a rear-facing camera, and the second body 102 is provided with a front-facing camera. Electrical and data signals are transmitted between the first and second bodies 101, 102 via an FPC, which passes through the hinge assembly 103.

[0158] In the embodiment shown in FIG11 , the first body 101 includes a top end 1011 and a bottom end 1012. The main frame-side circuit board is located near the top end 1011 of the first body 101, and the main frame-side batteries are located between the main frame-side circuit board and the bottom end 1012 of the first body 101. The cooler 21 of the heat dissipation assembly is disposed in a hot zone H within the first body 101. Specifically, the cooler 21 is located in the area where the main frame-side circuit board is located and is thermally connected to the heat generating device 41. The radiator 22 of the heat dissipation assembly 20 is disposed in a cold zone C within the first body 101. In one embodiment, the radiator 22 overlaps with a portion of the main frame-side batteries and is located near the edge of the main frame-side batteries away from the main frame-side circuit board. The pump 23 of the heat dissipation assembly is located on the side of the main frame-side batteries away from the main frame-side circuit board, that is, near the bottom end 1012 of the first body 101. A connecting pipe 24 connects the cooler 21, pump 23, and radiator 22 to form a heat exchange circulation pipeline. In this embodiment, the heat dissipation component 20 is arranged in the first main body 101, and the connecting pipe 24 does not need to pass through the shaft assembly 103. Moreover, the hot zone H in the first main body 101 is the area where the main heat source is concentrated. This embodiment can take into account the solution of heat dissipation and temperature uniformity, and can ensure that the arrangement of the heat dissipation component in the terminal device is simple and easy.

[0159] Figure 12 is a schematic diagram of the internal structural layout of a terminal device provided in one embodiment of the present application. The embodiment shown in Figure 12 differs from the embodiment shown in Figure 11 in that the pump 23 and radiator 22 in the heat dissipation assembly 20 are arranged differently within the internal space of the terminal device 100. As shown in Figure 12, in this embodiment, the cooler 21 of the heat dissipation assembly 20 is located in the hot zone H within the first body 101. Specifically, the cooler 21 is located in the area where the main frame circuit board is located and is thermally connected to the heat generating device 41. The pump 23 and radiator 22 in the heat dissipation assembly 20 are located within the second body 102. The radiator 22 is located in the cold zone C, and the pump 23 is located in the area where the sub-frame circuit board is located. A connecting tube 24 extends from the first body 101 through the hinge assembly 103 and into the interior of the second body 102. The embodiment shown in Figure 12 conducts heat from the first body 101 to the second body 102, where it is dissipated by the radiator 22 located within the second body 102, ensuring better temperature uniformity between the first and second bodies 101, 102.

[0160] Figure 13 is a schematic diagram of the internal structure layout of the terminal device provided in one embodiment of the present application. The embodiment shown in Figure 13 combines the embodiment shown in Figure 11 and the embodiment shown in Figure 12. The cooler 21 of the heat dissipation assembly 20 is arranged in the hot zone H in the first body 101. Specifically, the cooler 21 is located in the area where the main frame side circuit board is located and is thermally connected to the heating device 41. In the embodiment shown in Figure 13, two independent liquid cooling circulation pipelines are connected by a cooler 21. The cooler 21 includes four interfaces, which are used to connect to the connecting pipe 24, two of which are liquid inlets and the other two are liquid outlets. The number of radiators 22 in the heat dissipation assembly 20 is two (respectively, the first radiator and the second radiator). One of the radiators 22 (the first radiator) is located in the cold zone C in the first body 101. Specifically, this radiator 22 is close to the bottom edge of the main frame side battery, and the bottom edge of the main frame side battery is located at the edge of the main frame side battery away from the main frame side circuit board. The other radiator 22 (the second radiator) is located in the cold zone C in the second body 102. In this embodiment, there are two pumps 23 (a first pump and a second pump). One pump 23 (the first pump) is located within the first body 101, on the side of the main frame battery away from the main frame circuit board, that is, near the bottom edge of the first body 101. The other pump 23 (the second pump) is located within the second body 102, in the area where the sub-frame circuit board is located. This solution helps improve the heat dissipation efficiency of the terminal device and also allows for flexible placement of the radiator and pumps.

[0161] FIG14 is a schematic diagram of a configuration scheme for a connecting tube in a terminal device provided in one embodiment of the present application at the location of a rotating shaft assembly. The relationship between the connecting tube 24 and the rotating shaft assembly 103 provided in this embodiment is a cross-axis connection relationship. Referring to FIG14 , the first body 101 and the second body 102 are connected via the rotating shaft assembly 103. The first body 101 includes a main frame door panel 1015 and a first middle frame 1016, and the second body 102 includes a sub-frame door panel 1025 and a second middle frame 1026. The rotating shaft assembly 103 includes an intermediate door panel 1031, a rotating shaft seat 1036, and a rotating shaft cover 1035. The rotating shaft seat 1036 is located between the intermediate door panel 1031 and the rotating shaft cover 1035. The first middle frame 1016 and the main frame door panel 1015 are arranged opposite each other, and the second middle frame 1026 and the sub-frame door panel 1025 are arranged opposite each other. When the first and second bodies 101, 102 are relatively unfolded, the main frame door panels 1015 and the sub-frame door panels 1025 are located on either side of the hinge seat 1036, the intermediate door panel 1031 is located between the hinge seat 1036 and the display screen 10, and the first and second intermediate frames 1016, 1026 are located on either side of the hinge cover 1035. The main frame door panels 1015, the sub-frame door panels 1025, and the intermediate door panels 1031 form a flattened support structure for supporting the display screen 10. In the flattened state, gaps exist between the main frame door panels 1015 and the display screen 10, between the intermediate door panels 1031 and the display screen, and between the sub-frame door panels 1025 and the display screen 10. The connecting tube 24 extends across the hinge assembly 103 from the gap between the intermediate door panel 1031 and the display screen 10. Since the deformation of the display screen 10 during the bending process is smaller than the deformation of the hinge assembly 103 during the bending process, in this embodiment, the connecting tube 24 is passed through the hinge assembly 103 from the gap between the middle door panel 1031 and the display screen 10, which can ensure that the connecting tube is bent at a larger angle. This not only ensures that the internal transmission space of the bending tube remains unobstructed, but also helps to ensure the service life and structural safety and stability of the connecting tube.

[0162] FIG15 is a schematic diagram of a configuration scheme for the connecting tube at the location of the hinge assembly in a terminal device provided in one embodiment of the present application. The relationship between the connecting tube 24 and the hinge assembly 103 provided in this embodiment is a through-shaft connection. The specific structure of the terminal device shown in FIG15 may be the same as the specific structure of the terminal device shown in FIG14 and will not be repeated here. In this embodiment, at the location of the hinge assembly 103, the connecting tube 24 is located on the side of the middle door panel 1031 facing away from the display screen 10, that is, the connecting tube 24 passes through the hinge assembly 103 from the gap between the hinge seat 1036 and the hinge cover 1035. In this embodiment, the connecting tube 24 passes through the interior of the hinge assembly 103 because the space inside the hinge assembly 103 is larger than the gap between the hinge assembly 103 and the display screen 10. Therefore, the diameter of the connecting tube 24 can be set larger. A larger connecting tube 24 is beneficial for improving heat transfer efficiency and ensuring the structural strength and stability of the connecting tube.

[0163] Figures 16, 17 and 18 are partial schematic diagrams of the connecting tube provided in a specific embodiment of the present application. Referring to Figures 16, 17 and 18, in one embodiment, the connecting tube 24 has low thermal conductivity, and the thermal conductivity of the connecting tube 24 is much lower than the thermal conductivity of the metal, so that the liquid inside the heat dissipation component is difficult to dissipate heat inside the connecting tube 24, so that the liquid inside the heat dissipation component can be concentrated in the radiator to dissipate heat. In one embodiment, the thermal conductivity of the connecting tube is K1, and the thermal conductivity of the metal is K2, where K1 < K2 / 5. The connecting tube provided in the present application has low thermal conductivity, which can ensure that less heat will be conducted to the terminal device in the area where the connecting tube extends, and can ensure that more heat is conducted to the radiator. Such a design can improve the temperature uniformity effect of the terminal device.

[0164] In one embodiment, the connecting pipe is made of a non-metallic material, and the thermal conductivity of the non-metallic material is much smaller than that of metal.

[0165] Referring to Figures 17 and 18, in one embodiment, the connecting tube 24 includes a metal tube body 241 and a thermal insulation layer 242, with the thermal insulation layer 242 covering the outer periphery of the metal tube body 241. This solution combines the thermal insulation layer 242 and the metal tube body 241 to form the connecting tube 24, ensuring that the connecting tube 24 can maintain good structural strength and stability despite being sufficiently small. The cross-section of the connecting tube 24 includes a height direction and a width direction, with the width direction of the connecting tube 24 being greater than the height direction, i.e., the connecting tube 24 is in the shape of a flat tube (as shown in Figure 17). In the cross section of the connecting tube 24, the metal tube body 241 comprises a first half-tube body 243 and a second half-tube body 244 arranged opposite each other. The first half-tube body 243 partially encloses a first half-channel 245, while the second half-tube body 244 partially encloses a second half-channel 246. The first half-tube body 243 and the second half-tube body 244 are fixedly connected by brazing. The first half-channel 245 and the second half-channel 246 communicate to form the internal channel of the connecting tube 24. This solution provides a specific method for manufacturing the connecting tube.

[0166] In one embodiment, the height 24H of the connecting tube 24 does not exceed 0.25 mm. The thickness of the thermal insulation layer 242 is not less than 0.05 mm. The thermal insulation layer 242 may be a PI film. This solution, by limiting the height of the connecting tube, helps ensure a thin design within the terminal device.

[0167] In one embodiment, the metal tube 241 in the connecting tube 24 may be a copper tube. Copper tubes are easily bendable. If the connecting tube 24 is relatively wide, support columns may be positioned within the first and second half tubes 243, 244 to prevent internal tubing collapse due to the wide width of the connecting tube 24. Laser welding or ultrasonic welding may be used to weld the connecting tube 24 to the cooler 21, radiator 22, and pump 23.

[0168] FIG19 is a perspective schematic diagram and a partially enlarged schematic diagram of a heat exchanger in a heat dissipation assembly provided in one embodiment of the present application, and FIG20 is a perspective exploded schematic diagram of the heat exchanger shown in FIG19 . Referring to FIG19 , in this embodiment, the heat exchanger is described in detail by taking the cooler 21 as an example. In other embodiments, the cooler 21 of the same structure can also become the radiator of the heat exchanger. The cooler 21 is a flat plate structure, and the cooler 21 includes a first plate 211 and a second plate 212 arranged in a stacked manner. The first plate 211 and the second plate 212 are connected to form a shell 210 of the cooler 21. The shell 210 surrounds and forms a plurality of fluid channels, and the shell 210 is provided with a channel inlet 213 and a channel outlet connecting the fluid channels. As shown in the partially enlarged view of FIG19 , in one embodiment, the second plate 212 and the first plate 211 are relatively buckled, and the groove position of the first plate 211 is the channel inlet 213.

[0169] In one embodiment, the first plate 211 is made of one or more of copper, aluminum, stainless steel, and a high thermal conductivity polymer material. The second plate 212 may also be made of one or more of copper, aluminum, stainless steel, and a high thermal conductivity polymer material.

[0170] Referring to FIG. 20 , in one embodiment, a channel inlet 213, a channel outlet 215, and a fluid channel 214 communicating between the channel inlet 213 and the channel outlet 215 are formed on the surface of the first plate 211. Specifically, the channel inlet 213, the channel outlet 215, and the fluid channel 214 communicating between the channel inlet 213 and the channel outlet 215 can be formed on the surface of the first plate 211 through etching or casting processes. The second plate 212 is a flat plate structure, i.e., no channel structure is provided on the second plate. The first plate 211 and the second plate 212 can be sealed by welding.

[0171] In one embodiment, the channel inlet 213 and the channel outlet 215 are respectively located on opposite sides of the fluid channel 214. As shown in Figure 20, the cooler 21 can be rectangular as a whole, and the channel inlet 213 and the channel outlet 215 are respectively located at a pair of oppositely arranged diagonal positions of the rectangle. There are multiple fluid channels 214, which are arranged between the channel inlet 213 and the channel outlet 215. The journey from the channel inlet 213 through each fluid channel 214 to the channel outlet 215 is called the flow of the refrigerant in the cooler 21. The refrigerant passes through the multiple fluid channels 214 in the cooler 21, generating multiple flows. The number of flows is the same as the number of fluid channels 214 and corresponds one to one. In one embodiment, the flow of the multiple fluid channels 214 is equal in size, which is conducive to ensuring the uniformity of the flow distribution of the refrigerant in the multiple fluid channels 214 of the cooler 21.

[0172] As shown in Figure 20, in one embodiment, the equivalent diameter D of the fluid channel 214 is within the range of 0.05 to 0.3 mm (this range is inclusive), which can be understood as the equivalent diameter D of the fluid channel 214 being greater than or equal to 0.05 mm and less than or equal to 0.3 mm. This solution limits the equivalent diameter D of the fluid channel 214 to the range of 0.05 to 0.3 mm. On the one hand, this helps increase the heat exchange efficiency per unit volume of the cooler 21. On the other hand, it helps to control the overall size of the cooler 21 to be thinner. When the cooler 21 is used inside a terminal device, the thickness of the terminal device can be controlled within a reasonable range.

[0173] Figure 21 is a perspective schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. Figure 22 is a plan schematic diagram of the first plate in the heat exchanger shown in Figure 21.

[0174] Referring to Figures 21 and 22 , the periphery of the first plate 211 forms an edge wall 2110, and the channel inlet 213 and channel outlet 215 are notches formed in the edge wall 2110. Within the space enclosed by the edge wall 2110 are located a flow guide structure 217 and barrier strips 216 for forming fluid channels 214. The barrier strips 216 are spaced apart along a first direction A1. In a specific embodiment, each barrier strip 216 is linear and extends in a second direction A2. A space is defined between each end of each barrier strip 216 and the edge wall 2110. This space connects each fluid channel 214 to the channel inlet 213 and channel outlet 215. Multiple fluid channels 214 are arranged in a row along a first direction A1. In a second direction A2, the channel inlet 213 and the fluid channel 214 at the head of the row are arranged opposite each other, and the channel outlet 215 and the fluid channel 214 at the tail of the row are arranged opposite each other. This solution can achieve close or equal flow from the channel inlet 213 to the channel outlet 215, which helps ensure uniform heating of the refrigerant medium within the cooler. The second direction A2 is perpendicular to the first direction A1. In a specific embodiment, the first plate 211 is rectangular, the first direction A1 is the long side of the rectangle, and the second direction A2 is the short side of the rectangle.

[0175] In one embodiment shown in Figures 21 and 22, the flow guide structure 217 includes a plurality of diverter plates 2171, and through holes 2172 are formed between adjacent diverter plates 2171. The plurality of diverter plates 2171 are arranged in a row along the first direction A1. The diverter plates 2171 can be integrally formed in the first plate 211 by etching or casting. The plurality of diverter plates 2171 separates the space in the first plate 211 (the space formed by the edge wall 2110) into a first space R1 and a second space R2. The plurality of fluid channels 214 formed by the plurality of barrier strips 216 are located in the second space R2, and the channel inlet 213 is connected to the first space R1. The plurality of through holes 2172 connect the first space R1 and the second space R2. This solution makes the flow distribution in the cooler more uniform by designing a flow guide structure.

[0176] In an embodiment shown in FIG. 21 and FIG. 22 , the diverter plates 2171 have the same dimensions extending along the first direction A1 , and the through holes 2172 in the flow-guiding structure 217 are evenly distributed along the first direction A1 .

[0177] FIG23 is a perspective schematic diagram of a first plate in a heat exchanger provided in one embodiment of the present application. FIG24 is a plan schematic diagram of the first plate in the heat exchanger shown in FIG23 . The difference between the embodiments shown in FIG23 and FIG24 and the embodiments shown in FIG21 and FIG22 lies in the different designs of the flow-guiding structure 217. Referring to FIG23 and FIG24 , in one embodiment, along the first direction A1, the density of through-holes 2172 located at both ends of the flow-guiding structure 217 is less than the density of through-holes 2172 located in the middle region of the flow-guiding structure 217. The flow-guiding structure 217 includes an edge region 2175 and a middle region 2174, with the edge region 2175 located on both sides of the middle region 2174. The size of each of the multiple diverter plates 2171 in the edge area 2175 is larger than the size of each of the multiple diverter plates 2171 in the middle area 2174, and the distribution density of the through holes 2172 in the edge area 2175 is smaller than the distribution density of the through holes 2172 in the middle area.

[0178] This solution can improve the flow balancing effect by designing the distribution density of the through holes 2172 on the flow-guiding structure 217. For the edge area 2175 close to the channel inlet 213, since the channel inlet 213 and the fluid channel 214 are both arranged along the first direction A1, the refrigerant can easily pass through the through holes 2172 due to the inlet effect. The inlet effect can be understood as follows: when the refrigerant enters the channel inlet 213, because the inner diameter of the connecting pipe is different from the size of the channel inlet 213, the potential energy of the fluid accumulates at the channel inlet 213, making the flow speed of the refrigerant faster. As for the other edge area 2175 away from the channel inlet 213, the corresponding part of the first plate 211 and the corresponding part of the second plate can be used to force the refrigerant to change its flow direction, forming a fluid disturbance, which is conducive to the refrigerant passing through the through holes 2172. However, for the middle area 2174, there is no fluid disturbance factor in this area, and the refrigerant medium is not easy to change the flow direction, resulting in a small amount of refrigerant medium passing through the through holes 2172. Therefore, a higher density of through holes 2172 is set in the middle area 2174, and a lower density of through holes 2172 is set in the edge area 2175, which is beneficial to the overall flow uniformity effect of the guide structure 217.

[0179] Figure 25 is a partial stereoscopic schematic diagram and a partially enlarged schematic diagram of the first plate in the heat exchanger provided in one embodiment of the present application. Referring to Figure 25, in one embodiment, the flow-guiding structure 217 includes a plurality of spoiler structures 2177, and the plurality of spoiler structures 2177 are protrudingly arranged at one end of the corresponding diverter plate 2171, and the spoiler structure 2177 protrudes toward the first space R1 or the second space R2. The spoiler structure 2177 is located at the outer edge of the through hole 2172. In this embodiment, each diverter plate 2171 has a spoiler structure 2177 at both ends, and each through hole 2172 has a spoiler structure 2177 on both sides of the outer edge. The spoiler structure 2177 extends from the surface of the diverter plate 2171 toward the second space R2. In this embodiment, the spoiler structure 2177 is a flat plate or a straight strip structure, and the spoiler structure 2177 is perpendicular to the diverter plate 2171.

[0180] By providing a flow-disrupting structure 2177, the embodiment of the present application can achieve a uniform flow effect in cooler 21 at high flow rates. In such high flow rates, simply providing pressure fluctuations caused by through-holes 2172 alone would not be sufficient to change the flow direction of the refrigerant. Therefore, it is necessary to provide a flow-disrupting structure 2177 in addition to providing through-holes 2172 to increase the disturbance, intensify the pressure fluctuations at through-holes 2172, and force the refrigerant to change its flow direction.

[0181] Figure 26 is a partial stereoscopic schematic diagram and a partially enlarged schematic diagram of the first plate in the heat exchanger provided in one embodiment of the present application. The difference between the embodiment shown in Figure 26 and the embodiment shown in Figure 25 is that the position setting of the spoiler structure 2177 is different. Referring to Figure 26, in this embodiment, the spoiler structure 2177 extends from the surface of the diverter plate 2171 in the direction of the first space R1. The arrangement directions of the spoiler structures 2177 in Figures 25 and 26 are different, and the selection of the two is mainly determined by the flow rate and flow resistance loss. The arrangement scheme of the spoiler structure 2177 shown in Figure 26 is characterized in that: at high flow rates, the diversion effect is more obvious, but the flow resistance loss is also greater. The specific structure and quantity distribution of the spoiler structure 2177 provided in this embodiment are the same as those in the embodiment shown in Figure 25, and will not be repeated here.

[0182] Figure 27 is a partial stereoscopic schematic diagram and a partially enlarged schematic diagram of the first plate in the heat exchanger provided by an embodiment of the present application. The difference between the embodiment shown in Figure 27 and the embodiment shown in Figure 26 is that the number of spoiler structures 2177 is different. Referring to Figure 27, a spoiler structure 2177 is provided at one end of each diverter plate 2171, that is, the outer edge of one side of each through hole 2172 has a spoiler structure 2177. The difference between the embodiment shown in Figure 27 and the implementation effect shown in Figure 26 is that the embodiment shown in Figure 27 provides a spoiler structure 2177 on each diverter plate 2171, and the uniform diversion effect is slightly inferior to the embodiment shown in Figure 26. However, in the embodiment shown in Figure 27, the resistance loss of the refrigerant medium during the flow process in the cooler is greatly reduced. The specific structure and positional relationship of the spoiler structure 2177 provided in this embodiment relative to the diverter plate 2171 are the same as those in the embodiment shown in Figure 26 and will not be repeated.

[0183] Figure 28 is a partial stereoscopic schematic diagram and a partially enlarged schematic diagram of the first plate in the heat exchanger provided in one embodiment of the present application. The difference between the embodiment shown in Figure 28 and the embodiment shown in Figure 27 is that the structural form of the spoiler structure 2177 is different. The spoiler structure 2177 in the embodiment provided in Figure 27 is a flat plate structure, and the spoiler structure 2177 in the embodiment provided in Figure 28 is an arc-shaped plate, which is used to achieve a reduction in resistance loss. Specifically, in this embodiment, the spoiler structure 2177 includes a connecting end 21771 and a free end 21772, the connecting end 21771 is connected to the diverter plate 2171, and the tip 21772 is located at the end of the spoiler structure 2177 away from the diverter plate 2171. The spoiler structure 2177 extends in an arc shape from the connecting end 21771 to the free end 21772. The connecting end 21771 is connected to the edge of the diverter plate 2171, and the tip 21772 extends in the first direction to a position corresponding to the interior of the through-hole 2172. The tip 21772 is projected onto the interior of the through-hole 2172 in the second direction. The concave surface of the curved plate-shaped spoiler structure 2177 faces the through-hole 2172, while the convex surface of the curved plate-shaped spoiler structure 2177 faces the edge wall 2110. The number and distribution of the spoiler structures 2177 provided in this embodiment, as well as their positional relationship relative to the diverter plate 2171, are the same as those in the embodiment shown in FIG. 27 and will not be further described.

[0184] Figures 29, 30, and 31 are schematic plan views of the first plate in a heat exchanger provided in accordance with an embodiment of the present application. In the embodiment shown in Figure 29, part of the flow-disturbing structure 2177 is the flow-disturbing structure 2177 provided in accordance with the embodiment shown in Figure 25, and part of the flow-disturbing structure 2177 is the flow-disturbing structure 2177 provided in accordance with the embodiment shown in Figure 26. In the embodiment shown in Figure 30, part of the flow-disturbing structure 2177 is the flow-disturbing structure 2177 provided in accordance with the embodiment shown in Figure 27, and part of the flow-disturbing structure 2177 is the flow-disturbing structure 2177 provided in accordance with the embodiment shown in Figure 28. In the embodiment shown in Figure 31, four different designs of flow-disturbing structures 2177 are formed in the first plate, as provided in the embodiments shown in Figures 25, 26, 27, and 28. In summary, the flow-disturbing structure 2177 in the flow-guiding structure in the cooler provided in accordance with an embodiment of the present application can be the flow-disturbing structure 2177 provided in any one of the embodiments shown in Figures 25 to 31, and can also be combined and varied based on these embodiments.

[0185] Figure 32 is a plan view of the first plate in the heat exchanger provided in one embodiment of the present application. Referring to Figure 32, in one embodiment, the guide structure 217 includes a double-layer diverter plate 2171 structure, and the guide structure 217 has a double-layer through hole 2172. The multi-layer diverter plate 2171 structure provided in this solution is used in the case where the flow rate in the cooler 21 is relatively low, and a strong pressure disturbance is formed through the two layers of through holes 2172, causing the refrigerant medium to change its flow direction. The secondary diversion formed by the double-layer diverter plate 2171 structure is more obvious than the primary diversion effect and is easier to control. A plurality of diverter plates 2171 are arranged in two rows along the second direction A2, and each row of diverter plates 2171 is arranged along the first direction A1. The guide structure 217 divides the internal space of the first plate into a first space R1 and a second space R2, and the interval area between the two rows of diverter plates 2171 forms a third space R3. In one embodiment. The two rows of diverter plates 2171 are staggered in the first direction A1, and the through holes 2172 formed in one row of diverter plates 2171 are arranged opposite the other row of diverter plates 2171 in the second direction A2. The through holes 2172 in one row of diverter plates 2171 are staggered with the through holes 2172 in the other row of diverter plates 2171.

[0186] FIG33 is a schematic plan view of a first plate in a heat exchanger provided in one embodiment of the present application. Referring to FIG33 , in one embodiment, a portion of the fluid channel 214 is a first channel 2140, and the fluid channels within the dashed box in FIG33 are all first channels 2140. The barrier bars 216 forming the first channel 2140 are a first barrier bar 2161 and a second barrier bar 2162. The flow-guiding structure 217 includes a middle region 2174 and an edge region 2175. The inlet of the first channel 2140 and the middle region 2174 of the flow-guiding structure 217 are arranged opposite each other. At the inlet of the first channel 2140, the first barrier bar 2161 and the second barrier bar 2162 are arranged in a stepped configuration. The distance between the first barrier bar 2161 and the flow-guiding structure 217 in the second direction A2 is less than the distance between the second barrier bar 2162 and the flow-guiding structure 217 in the second direction A2.

[0187] In one embodiment, the length of the first baffle 2161 is greater than the length of the second baffle 2162, and on the side adjacent to the guide structure 217, the vertical distance between the first baffle 2161 and the guide structure 217 is less than the vertical distance between the second baffle 2162 and the guide structure 217. The cooler is made of metal and can be made in one piece. Since the metal surface is hydrophilic and has a large surface energy, it is easy to form a liquid film in small-sized channels and low flow rates. The guide structure provided by this solution can achieve a step-by-step arrangement of the channel length of the fluid channel in the middle area of ​​the cooler near the inlet side when the equivalent diameter of the channel is small. The stepped flow channel structure can effectively reduce the impact of channel blockage caused by the adhesion of water film on the surface of the microchannel by forming a turbulent flow.

[0188] FIG34 is an enlarged schematic diagram of the liquid channel in the heat exchanger provided in one embodiment of the present application. Referring to FIG34 , for the fluid channel 214 in the cooler, the first direction A1 is the width direction of the fluid channel 214, the second direction A2 is the length direction of the fluid channel 214, and the third direction A3 is the height direction of the fluid channel 214. The first direction A1, the second direction A2, and the third direction A3 are perpendicular to each other. The dimension ratio of the height direction to the width direction of each fluid channel 214 is 0.3-2, that is, H / W=0.3-2. By constraining the dimension ratio of the height and width of the fluid channel, this solution allows the cooler to be used in space-constrained environments such as mobile phones, which is beneficial to improving the heat dissipation performance of small-sized terminal devices. Small-sized terminal devices have large heat dissipation requirements and can better highlight the heat dissipation effect of the heat dissipation component.

[0189] The specific structure of the radiator provided in this application can be the same as that of the cooler, and the specific structure of the radiator will not be described in detail. The size of the radiator can be different from that of the cooler, and radiators of different sizes can be set according to different usage environments and requirements.

[0190] Figure 35 is a schematic diagram of a pump provided in one embodiment of the present application. Referring to Figure 35, in one embodiment, the pump 23 provided in the present application is a piezoelectric micropump, and the pump 23 includes an inlet 231, an outlet 232, a pump chamber 233, a piezoelectric vibrator 234, an inlet valve 235, and an outlet valve 236. The piezoelectric vibrator 234 is arranged in the pump chamber 233, the inlet valve 235 is arranged between the inlet 231 and the pump chamber 233, and the outlet valve 236 is arranged between the outlet 232 and the pump chamber 233. The pump 23 also includes a terminal 237, which is electrically connected to the piezoelectric vibrator 234 and is used to connect an external drive circuit or drive component. The drive of the pump 23 can be a control unit, which can be a circuit board architecture independently arranged in the terminal device, or it can be a partial control circuit integrated on other circuit boards of the terminal device.

[0191] Figure 36 is a schematic diagram of a three-dimensional exploded view of a heat dissipation assembly provided in one embodiment of the present application. Referring to Figure 36, in one embodiment, the heat dissipation assembly 20 includes a heat dissipation plate structure 201 and a pump 23. The heat dissipation plate structure 201 is arranged to form a receiving space 2011, and the receiving space 2011 is used to accommodate the pump 23. In one embodiment, the heat dissipation plate structure 201 includes a first interface P1 and a second interface P2, and the first interface P1 and the second interface P2 are located on the inner wall of the receiving space 2011. The pump 23 is connected between the first interface P1 and the second interface P2 so that the pump 23 is connected to the heat dissipation channel inside the heat dissipation plate structure 201. The heat dissipation plate structure 201 is provided with an isolation zone 2014, which extends through the heat dissipation plate structure 201 in the thickness direction of the heat dissipation plate structure 201. The receiving space 2011 can also be called an isolation zone. Therefore, the pump 23 provided in the embodiment of the present application can be located in part of the isolation zone.

[0192] Referring to Figure 36 , the heat sink structure 201 includes a first plate 2012 and a second plate 2013, which are stacked relative to each other and interconnected as a single unit. The first port P1 and the second port P2 can be located at the junction of the first and second plates 2012, 2013. This design ensures that the pump minimizes the space occupied by the pump at the first and second ports P1, P2 in the thickness direction of the heat sink structure, facilitating a thinner design for the terminal device.

[0193] Figure 37 is a schematic plan view of the first plate member of the heat sink structure in the heat sink assembly shown in Figure 36. Figure 38 is a schematic plan view of the second plate member of the heat sink structure in the heat sink assembly shown in Figure 36. The embodiments of the present application provide at least two heat exchangers and connecting pipes integrally formed within a single heat sink structure, eliminating the need for assembly and ensuring a cohesive heat sink assembly that is less prone to leakage and easier to assemble.

[0194] Referring to Figures 37 and 38 , the first plate 2012 includes an integrally formed cooler channel 21P, a radiator channel 22P, and a connecting pipe channel 24P. In this embodiment, the cooler channel 21P, the radiator channel 22P, and the connecting pipe channel 24P are formed on the first plate 2012, while the second plate 2013 is a smooth flat plate, making it easier to control production costs and difficulty. It is understood that the cooler channel 21P and the corresponding first and second plates 2012 and 2013 together form the cooler, the radiator channel 22P and the corresponding first and second plates 2012 and 2013 together form the radiator, and the connecting pipe channel 24P and the corresponding first and second plates 2012 and 2013 together form the connecting pipe.

[0195] The portions within the dashed box in Figure 37 represent the cooler flow channel 21P and the radiator flow channel 22P. In one embodiment, the first plate 2012 includes a top end E1, a bottom end E2, and a first side E3 and a second side E4 connecting the top end E1 and the bottom end E2 and disposed opposite each other. The cooler flow channel 21P is adjacent to the top end E1, and the radiator flow channel 22P is adjacent to the bottom end E2. A portion of the connecting pipe flow channel 24P comprises a first section 24P1 adjacent to the first side E3 and connected between the cooler flow channel 21P and the radiator flow channel 22P. A portion of the connecting pipe flow channel 24P comprises a second section 24P2 adjacent to the second side E4 and connected between the cooler flow channel 21P and the radiator flow channel 22P. The first plate 2012 is provided with a first sub-isolating strip 20141. A portion of the first sub-isolating strip 20141 is located on a side of the first section 24P1 away from the first side edge E3 and adjacent to the first section 24P1. A portion of the first sub-isolating strip 20141 is located on a side of the second section 24P2 away from the second side edge E4 and adjacent to the second section 24P2. The first plate 2012 encloses a first sub-containment space 20111, which is used to accommodate the pump 23 and communicates with the second section 24P2 of the connecting pipe channel 24P.

[0196] 37 and 38 , the second plate 2013 has the same configuration as the first plate 2012. A second sub-isolating strip 20142 and a second sub-receiving space 20112 are provided on the second plate 2013. When the first plate 2012 and the second plate 2013 are interconnected, the second sub-isolating strip 20142 and the first sub-isolating strip 20141 communicate with each other to form an isolating strip of the heat dissipation plate structure, while the second sub-receiving space 20112 and the first sub-receiving space 20111 communicate with each other to form a receiving space of the heat dissipation plate structure.

[0197] A portion of the isolation zone on the heat sink structure is located on a side of the first tube away from the first side and adjacent to the first tube, and a portion of the isolation zone on the heat sink structure is located on a side of the second tube away from the second side and adjacent to the second tube. The heat sink structure includes a top and a bottom end disposed opposite each other, and a first side and a second side connected between the top and the bottom end and disposed opposite each other. One of the at least two heat exchangers is a cooler, and the remaining heat exchanger is a radiator. The cooler is formed in an area adjacent to the top end, and the radiator is formed in an area adjacent to the bottom end. A portion of the connecting tube is a first tube, adjacent to the first side and connected between the cooler and the radiator, and a portion of the connecting tube is a second tube, adjacent to the second side and connected between the cooler and the radiator.

[0198] In one embodiment, the heat exchanger formed in the heat dissipation plate structure may be the specific structure of the cooler provided in any one of Figures 21 to 34. The connecting pipe formed in the heat dissipation plate structure may have the specific structural dimensional parameters of the connecting pipe provided in any one of Figures 16 to 18.

[0199] In one embodiment of the present application, part of the heat sink structure forms a temperature equalizing plate, and a heat exchange circulation pipeline consisting of at least two heat exchangers and connecting pipes is arranged around the periphery of the temperature equalizing plate. At least one of the two heat exchangers is a cooler, and the other heat exchangers are radiators. The evaporation area of ​​the temperature equalizing plate is adjacent to the cooler, and the condensation area of ​​the temperature equalizing plate is located between the cooler and the radiator. In this embodiment, the evaporation area and the cooler of the temperature equalizing plate are arranged adjacent to each other, and the heat at the cooler position can be conducted to the evaporation area of ​​the temperature equalizing plate through the heat sink structure. The heat conduction efficiency is high, and the temperature equalizing plate can be used to supplement the heat dissipation, which is conducive to providing a heat dissipation effect. For a specific embodiment, please refer to the embodiment shown in Figure 39.

[0200] Figure 39 is a schematic planar exploded view of a heat sink structure provided in one embodiment of the present application. Referring to Figure 39 , the first plate 2012 of the heat sink structure 201 integrally includes a cooler channel 21P, a radiator channel 22P, a connecting pipe channel 24P, and a temperature-equalizing plate cavity 25C. The cooler channel 21P, the radiator channel 22P, and the connecting pipe channel 24P constitute a heat exchange circulation pipeline, which is arranged around the periphery of the temperature-equalizing plate cavity 25C. The temperature-equalizing plate cavity 25C includes an evaporation zone 251 and a condensation zone 252. The evaporation zone 251 is adjacent to the cooler channel 21P, and the condensation zone 252 is located between the cooler channel 21P and the radiator channel 22P. The first sub-isolation zone 20141 on the first plate 2012 is distributed on both sides of the temperature-equalizing plate cavity 25C and is located between the temperature-equalizing plate cavity 25C and the connecting pipe channel 24P. A temperature averaging plate isolation zone 253 is provided within the temperature averaging plate cavity 25C. Flanking the temperature averaging plate isolation zone 253 are a gas channel 254 and a liquid return channel 255. Both the gas channel 254 and the liquid return channel 255 connect between the evaporation zone 251 and the condensation zone 252. The evaporation zone 251, the gas channel 254, the condensation zone 252, and the liquid return channel 255 are sequentially connected to form an annular circulation channel.

[0201] As shown in Figure 39, the first plate 2012 has a length and a width. The evaporation zone 251 of the vapor chamber 25C and the cooler flow channel 21P are arranged side by side in the width direction. The cooler flow channel 21P and the radiator flow channel 22P are arranged opposite each other in the length direction and are located at the top and bottom ends of the first plate 2012, respectively. The condensation zone 252 of the vapor chamber 25C is located in the middle of the length of the first plate 2012.

[0202] Referring to Figure 39 , a capillary structure 256 is provided on the surface of the second plate 2013 of the heat sink structure 201. To clearly illustrate the various components of the heat sink structure 201, Figure 39 shows the capillary structure 256 separated from the second plate 2013. It is understood that the capillary structure 256 can be integrally formed on the surface of the second plate 2013, for example, by sintering a copper mesh. The second plate 2013 and the first plate 2012 are relatively joined and secured by sealing welding. The capillary structure 256 is positioned correspondingly to the gas channel 254, condensation zone 252, and liquid return channel 255 within the internal cavity 25C of the temperature equalizer. It can be understood that the area of ​​the capillary structure 256 on the second plate 2013 directly faces the areas of the gas channel 254, condensation zone 252, and liquid return channel 255 on the first plate 2012. In this embodiment, the area of ​​the evaporation region 251 is relatively small, and the liquid can be transferred by utilizing the capillary action of the inner surfaces of the first plate and the second plate corresponding to the evaporation region 251 . Therefore, the capillary structure 256 may not be provided in the evaporation region 251 .

[0203] The second plate 2013 is provided with an elongated channel 257. The elongated channel 257 has the same structure and dimensions as the temperature-equalizing plate isolation strip 253, which is a strip-shaped through-hole structure provided on the first plate 2012. The first and second plates are fastened relative to each other, and the elongated channel 257 and the temperature-equalizing plate isolation strip 253 are connected to form an integrated strip-shaped through-hole structure.

[0204] In this embodiment, the evaporation area 251 of the temperature equalizing plate in the heat dissipation plate structure 201 is adjacent to the area where the cooler is located, and the area where the cooler is located is thermally connected to the heating device in the terminal device. For example, the area where the cooler is located can be attached to the heating device through a refrigerant medium. For example, the heating device can be the SOC on the motherboard.

[0205] Refer to Figure 40, which is a schematic diagram of the heat sink structure shown in Figure 39 being applied to a terminal device. In one embodiment, the terminal device is a mobile phone. In the thickness direction of the terminal device, the heat sink structure 201 can be positioned between the display screen and the midframe. In the length direction of the terminal device, portions of the heat sink structure 201 correspond to the motherboard 40, portions correspond to the battery 60, and portions correspond to the small board 70. The cooler 21 of the heat sink structure 201 is located in the hot zone H and is thermally connected to the heat generating device 41 on the motherboard 40 of the terminal device. The heat sink 22 of the heat sink structure 201 is located in the cold zone C. For example, at least a portion of the heat sink 22 can overlap with the battery 60, or at least a portion of the heat sink 22 can overlap with a portion of the small board 70. The evaporation zone 251 of the heat sink 25 is located in the hot zone H and adjacent to the cooler 21. The condensation zone 252 of the heat sink 25 is located in the middle of the battery 60, between the cold zone C and the hot zone H.

[0206] The pump is not shown in FIG40 . It is understood that the pump may be located in the receiving space 2011 enclosed by the heat dissipation plate structure 201 .

[0207] As shown in Figure 40, the heat exchange circulation pipeline formed between the cooler 21 and the radiator 22 in the heat dissipation plate structure 201 is an active heat dissipation system. The circulation flow of the refrigerant medium is driven by a pump as a power source. The refrigerant medium in the cooler 21 located at the top of the terminal device can be transported to the radiator 22 located at the bottom of the terminal device for heat dissipation. The refrigerant medium transmission process is much greater than the refrigerant medium transmission process of the temperature equalizing plate, which is conducive to the flexible arrangement of the radiator 22 and can improve the heat dissipation efficiency and temperature equalization effect.

[0208] This embodiment integrates a heat exchange circulation pipeline and a heat spreader 25, and the two can work together. When the power consumption of the heating device is high, the control system can start the pump to start the liquid cooling circulation architecture. At the same time, the evaporation area of ​​the heat spreader will also be affected by the heat of the heating device, causing the liquid inside to turn into steam and be transferred to the condensation area along the gas channel. In the condensation area, the gas is liquefied and, under the driving force of the capillary structure, is transferred to the evaporation area through the liquid return channel. When the power consumption of the heating device is low, the pump is not started, and the heat is transferred to the evaporation area of ​​the heat spreader by heat conduction, causing the liquid in the evaporation area of ​​the heat spreader to change phase, thereby completing the transfer of heat to the condensation area.

[0209] The embodiments of the present application can also be applied when the heat generation of the heating device is relatively low. In this case, in order to save energy, there is no need to start the pump, but heat can be dissipated through the temperature equalizer.

[0210] Figure 41 is a schematic plan view of a heat sink structure 201 provided in accordance with one embodiment of the present application. Referring to Figure 41 , the first plate 2012 of the heat sink structure 201 is integrally formed with a cooler flow channel 21P, a radiator flow channel 22P, and a connecting pipe flow channel 24P. The embodiment shown in Figure 41 differs from the embodiment shown in Figure 39 in that the heat sink structure 201 in the embodiment shown in Figure 41 has only a liquid cooling circulation structure and does not include a temperature equalizing plate structure. The heat sink structure 201 only integrates the liquid cooling circulation structure consisting of the cooler flow channel 21P, the radiator flow channel 22P, and the connecting pipe flow channel 24P. Specifically, in this embodiment, the heat sink structure 201 includes a first plate 2012 and a second plate 2013. The cooler flow channel 21P, the radiator flow channel 22P, and the connecting pipe flow channel 24P are integrally formed within the first plate 2012. The second plate 2013 is a smooth, flat plate structure, meaning that no associated flow channel structures are provided on the second plate 2013. The first plate 2012 and the second plate 2013 are relatively connected, for example, they can be sealed together by welding, so that a liquid cooling circulation structure can be formed inside the heat dissipation plate structure 201 .

[0211] In the embodiment shown in Figure 41, the centers of the first plate 2012 and the second plate 2013 are both hollowed out, that is, the first plate 2012 and the second plate 2013 are both ring-shaped, so that the heat sink structure 201 has a hollowed-out ring structure. This embodiment can not only reduce the weight of the heat sink structure 201, but also ensure a more flexible extension path for the connecting pipe flow channel 24P. By changing the shape of the connecting pipe flow channel 24P, the heat sink structure 201 can be adapted to a variety of different application environments.

[0212] In the embodiment shown in FIG41 , the hollow space 2015 surrounded by the heat sink structure 201 is a single, integrated space. A pump can be placed within the hollow space 2015. Electronic device components, such as batteries, can also be placed within the hollow space 2015. Of course, a temperature vapor chamber can also be placed within the hollow space 2015.

[0213] Figure 42 is a schematic plan view of an exploded view of a heat sink structure provided in one embodiment of the present application. The embodiment shown in Figure 42 differs from the embodiment shown in Figure 41 in that the hollow space formed by the heat sink structure 201 in the embodiment shown in Figure 42 includes a larger main space 20151 and a smaller subspace 20152. Subspace 20152 is separated from the main space 20151 by a spacer 20153. Subspace 20152 is used to accommodate a pump, while main space 20151 can be used to accommodate electronic device components, such as batteries. Of course, a temperature equalizer can also be placed in main space 20151.

[0214] Figure 43 is a planar exploded view of a heat spreader provided in one embodiment of the present application. Figure 44 is a cross-sectional view of a heat spreader provided in one embodiment of the present application, wherein the support structure inside the heat spreader is omitted.

[0215] Referring to Figures 43 and 44 , in one embodiment, the temperature homogenizer 90 includes a housing 900, which forms a sealed space filled with a refrigerant. Specifically, in one embodiment, the housing 900 includes a first cover plate 901 and a second cover plate 902. The first and second cover plates 901 and 902 are sealed together to form a sealed space 903. The first and second cover plates 901 and 902 can be sealed together by welding. A capillary layer 904 is provided on the inner surface of the second cover plate 902.

[0216] An evaporation zone 91, a condensation zone 92, a first channel 93 and a second channel 94 connected between the condensation zone 92 and the evaporation zone 91 are formed in the sealed space 903. The evaporation zone 91, the first channel 93, the condensation zone 92 and the second channel 94 are connected in sequence to form an annular circulation channel. Figure 43 schematically indicates the positions of the evaporation zone 91, the first channel 93, the condensation zone 92 and the second channel 94 on the surface of the first cover plate 901. In the cross-sectional view shown in Figure 44, a portion of the left end of the sealed space 903 is the evaporation zone 91, a portion of the right end of the sealed space 903 is the condensation zone 92, and the portion in the middle can be either the first channel or the second channel. Specifically, in one embodiment, the first channel 93 is a gas channel and the second channel 94 is a liquid channel.

[0217] The portion of first cover plate 901 corresponding to evaporation zone 91 within sealed space 903 is connected to a heat source within the electronic device (e.g., the SOC on the motherboard) via a thermal interface material (e.g., thermal adhesive or other coolant). This allows the liquid in evaporation zone 91 to undergo a phase change due to the heat, forming vapor. The vapor enters first channel 93 and diffuses toward condensation zone 92. In condensation zone 92, the lower temperature forces the vapor to liquefy and form liquid. This liquid then passes through capillary layer 904, allowing it to be transported through second channel 94 to evaporation zone 91.

[0218] 43 and 44 , in the embodiment of the present application, a portion of the first cover plate 901 corresponding to the evaporation region 91 is provided with a plurality of spaced-apart nucleation structures 910. Each nucleation structure 910 is surrounded by a hydrophilic structure 920. The nucleation structures 910 are used to promote nucleation boiling of the refrigerant, and the hydrophilic structures 920 are used to supply the refrigerant to the nucleation structures 910. Specifically, because the surfaces of the nucleation structures 910 are hydrophobic, the contact angle between the refrigerant and the surfaces of the nucleation structures 910 is large, making nucleation boiling of the refrigerant more likely. Furthermore, the embodiment of the present application utilizes the hydrophilic structures 920 to continuously supply the refrigerant to the nucleation structures 910, thereby making boiling of the refrigerant in the evaporation region 91 more likely.

[0219] FIG45 is a specific structural design scheme of the evaporation zone in the temperature uniformity plate provided in one embodiment of the present application, which includes the overall structure of the portion of the first cover plate 901 in the evaporation zone 91 and a partially enlarged schematic diagram. FIG46 is a cross-sectional schematic diagram of some micropillars in the structure shown in FIG45 . Referring to FIG45 and FIG46 , in one embodiment, the nucleation structure 910 includes a hydrophobic surface formed in the shell, and the hydrophilic structure 920 includes a hydrophilic surface located outside the hydrophobic surface. A plurality of spaced micropillars 912 are provided in the evaporation zone 91, and the micropillars 912 are connected to the first cover plate 901. The micropillars 912 include an end face 9121 and a side face 9122 connected between the end face 9121 and the first cover plate 901. The end face 9121 forms a hydrophobic surface, and the side faces 9122 of adjacent micropillars 912 are surrounded to form a groove 913. The side faces 9122 and the bottom of the groove 913 are both the hydrophilic surfaces. In this embodiment, micropillars 912 are provided on the inner surface of the first cover plate 901. The end surfaces 9121 of the micropillars 912 are hydrophobic, while the side surfaces 9122 of the micropillars 912 and the bottom surfaces of the grooves 913 can both be hydrophilic surfaces. This allows the refrigerant to have greater contact with the end surfaces 9121. For example, if the contact angle is greater than 100 degrees or greater than 150 degrees, the refrigerant forms a droplet shape on the end surface 9121, making nucleate boiling more likely when the refrigerant is heated. Providing micropillars 912 on the inner surface of the first cover plate 901 is easy to manufacture. For example, the micropillars can be integrally formed directly on the surface of the first cover plate 901 by stamping, resulting in low manufacturing costs.

[0220] In the embodiment shown in Figure 45 , the bottom of the groove 913 forms the inner surface of the first cover plate 901, and the side surfaces 9122 of the micropillars 912 are directly connected to the inner surface of the first cover plate 901. The inner surface of the first cover plate 901 has a hydrophilic structure. Specifically, the first cover plate 901 is made of metal. Since the evaporation zone of the heat spreader is relatively small, it only needs to be aligned with the heating element. The inner surface of the first cover plate 901 has a hydrophilic structure. This solution utilizes the hydrophilic surface properties of the first cover plate 901 to transport liquid to the end surface 9121, eliminating the need for an additional capillary structure and facilitating a small, thin design of the heat spreader.

[0221] In one embodiment, the end surface 9121 is subjected to a hydrophobic treatment process to form a nucleation structure 910 having a hydrophobic function. For example, the nucleation structure 910 can be formed by a hydrophobic treatment process such as oxidation, electroplating, or fine etching.

[0222] Referring to Figures 45 and 46, for each microcolumn 912, the end face 9121 of the microcolumn 912 includes a first width W1 and a second width W2. The first width is the side length of the end face 9121 in the first direction, and the second width is the side of the end face 9121 in the second direction. The first direction and the second direction can be perpendicular to each other. In one embodiment, the first width W1 and the second width W2 can be equal. For example, the range of the first width W1 can be: 30-50um. The height H of the microcolumn 912 is the dimension of the microcolumn 912 protruding from the inner surface of the first cover plate 901, which can also be understood as the dimension in the thickness direction of the temperature equalizing plate. The thickness direction of the temperature equalizing plate can be the stacking direction between the first cover plate and the second cover plate. In one embodiment, the size range of the height H of the microcolumn 912 can be: 40-80um, and all microcolumns 912 can be designed with the same height. The distance L between adjacent micropillars 912 can be between 50-100um. Specifically, the distance L between adjacent micropillars 912 arranged in the first direction and the distance L between adjacent micropillars 912 arranged in the second direction can be the same; in fact, in an embodiment, the distance between adjacent micropillars 912 arranged in the first direction and the distance between adjacent micropillars 912 arranged in the second direction can also be different.

[0223] FIG47 is a schematic cross-sectional view of a portion of micropillars in a temperature homogenizing plate provided in one embodiment. Referring to FIG47 , the end face 9121 of the micropillar 912 includes a metal oxide coating 91211. In a specific embodiment, the metal oxide coating 91211 can be coated on the end face 9121 of the micropillar 912 by a process such as a Czochralski method, spraying, or oxidation. In this embodiment, the nucleation structure 910 includes the metal oxide coating 91211, which can be a micron-sized pit structure. The metal oxide coating 91211 has a hydrophobic structure. The coolant forms a large contact angle on the surface of the metal oxide coating 91211 with micron-sized pits, and the coolant easily aggregates into a water droplet shape, which is conducive to nucleated boiling.

[0224] Figure 48 illustrates a specific structural design scheme for the evaporation zone in a heat spreader according to one embodiment of the present application, including the overall structure and a partially enlarged schematic diagram of the portion of the first cover plate 901 in the evaporation zone 91. Figure 49 illustrates a cross-sectional schematic diagram of a portion of the micropillars in the structure shown in Figure 48. Referring to Figures 48 and 49, in one embodiment, a portion of the end surface 9121 of the micropillar 912 is provided with one or more inwardly concave groove structures 9124. In this embodiment, the nucleation structure 910 includes groove structures 9124, which can be visible pit structures. Groove structures 9124 can also have hydrophobic properties. The refrigerant forms a large contact angle on the surface of the groove structures 9124, allowing the refrigerant to easily converge into droplets, which is conducive to nucleated boiling. The area occupied by the groove structures 9124 accounts for 30% to 80% of the area of ​​the entire end surface 9121, meaning that the opening ratio of the groove structures 9124 on the entire end surface 9121 is 30% to 80%. This solution makes the end face 9121 a hydrophobic surface by setting a groove structure 9124 on the end face 9121. It can be understood that the setting of the groove structure 9124 makes the end face 9121 no longer a smooth surface (such as a smooth plane or a smooth curved surface), that is, the surface roughness of the end face 9121 is changed, so that when the liquid is on the end face 9121, a larger contact angle can be formed between the liquid and the end face 9121, forming a hydrophobic effect, which is conducive to nucleation boiling.

[0225] In a specific embodiment, a groove structure 9124 is provided on one end surface 9121, located in the center of the end surface 9121. The groove structure 9124 may be a columnar blind hole structure, and the cross-section of the groove structure 9124 may be circular, square, triangular, polygonal, or irregular. The depth of the groove structure 9124 is the dimension in the thickness direction of the temperature vapor chamber; alternatively, when the end surface 9121 is planar, the depth of the groove structure 9124 may be the dimension in a direction perpendicular to the end surface 9121. In one embodiment, the depth of the groove structure 9124 is 10% to 90% of the height of the micropillar 912.

[0226] The parameters such as the shape and size of the micropillars 912 in the embodiments shown in Figures 47, 48 and 49, as well as the arrangement and positional relationship of the multiple micropillars 912, can be referred to the embodiments shown in Figures 45 and 46 and will not be repeated here.

[0227] This application provides three specific hydrophobic surface forms, namely, surface treatment, groove structure, and metal oxide coating. These three solutions are easy to implement and have low production costs.

[0228] Figure 50 is a cross-sectional schematic diagram of the evaporation zone of the temperature equalizing plate provided in one embodiment of the present application. Referring to Figure 50, a support column 905 is provided in the sealed space 903 between the first cover plate 901 and the second cover plate 902. The support column 905 is fixedly connected to the second cover plate 902. The surface of the support column 905 facing the first cover plate 901 contacts the end face 9121 of at least one of the micro-pillars 912. In this solution, the support column 905 and the micro-pillar 912 abut against each other, so that the support column 905 and the micro-pillar 912 can jointly construct a support structure in the evaporation zone, thereby ensuring that the internal space of the evaporation zone does not collapse and ensuring space for liquid vaporization. In addition, the support column 905 can be integrally formed with the second cover plate, and the support column 905 abuts the micro-pillar 912, so that the size of the support column 905 does not need to be too long, and can be directly formed on the inner surface of the second cover plate through a stamping process. The manufacturing process is simple, the manufacturing cost is low, and the yield rate is also high.

[0229] FIG51 is a cross-sectional schematic diagram of the evaporation zone of a temperature-maintaining plate provided in one embodiment of the present application. Referring to FIG51 , a support column 905 is provided within the sealed space 903 between the first cover plate 901 and the second cover plate 902. In the evaporation zone, the support column 905 is positioned between the first cover plate 901 and the second cover plate 902, and a plurality of micro-pillars 912 are distributed in the area surrounding the support column 905. This solution arranges the support column 905 in the evaporation zone to abut between the first cover plate 901 and the second cover plate 902, so that the distribution of the micro-pillars 912 needs to avoid the position of the support column 905. During the manufacturing process, there is no need to consider the positional relationship and alignment between the micro-pillars 912 and the support column 905, resulting in a simpler manufacturing process and lower manufacturing costs.

[0230] In the embodiment shown in Figures 50 and 51, the support pillars 905 can be integrally formed with the second cover plate 902. For example, the support pillars 905 can be formed on the second cover plate 902 through a stamping process. The plurality of micropillars 912 can be integrally formed with the first cover plate 901. Figures 50 and 51 merely schematically illustrate the positional relationships between the support pillars 905 and micropillars 912, and between the support pillars 905 and the first and second cover plates 901 and 902, and do not represent their actual structural configurations.

[0231] Figure 52 is a cross-sectional schematic diagram of the evaporation zone of the heat spreader provided in one embodiment of the present application. Referring to Figure 52, a plurality of capillary walls 906 are provided in the sealed space 903 between the first cover plate 901 and the second cover plate 902. The plurality of capillary walls 906 are spaced apart in the sealed space 903. The plurality of capillary walls 906 are supported between the first cover plate 901 and the second cover plate 902. In the evaporation zone, the plurality of micropillars 912 are distributed in the area surrounding the capillary walls 906. The capillary walls 906 can be a copper mesh structure. The capillary walls 906 have a capillary force and are used to transport the refrigerant. In this solution, the capillary walls 906 serve as a structure supporting the first cover plate 901 and the second cover plate 902 in the evaporation zone. The capillary walls 906 also have the function of transporting the refrigerant. This solution improves the refrigerant circulation performance in the heat spreader.

[0232] Figure 53 is a schematic diagram of a heat spreader provided in one embodiment of the present application. Referring to Figure 53, the numbers 91, 92, 93, and 94 in Figure 53 represent the evaporation zone 91, the first channel 93, the condensation zone 92, and the second channel 94 inside the heat spreader, respectively. The evaporation zone 91, the first channel 93 (which can be a gas channel), the condensation zone 92, and the second channel 94 (which can be a liquid channel) in the sealed space between the first cover plate 901 and the second cover plate 902 are connected in sequence to form an annular circulation channel. This solution provides a loop structure within the heat spreader that can ensure the smoothness of the working medium transport within the heat spreader and promote the temperature equalization effect.

[0233] The heat spreader 90 is provided with a strip-shaped hole 95, which extends through the first cover plate 901 and the second cover plate 902 along its thickness. Along the plane extending from the heat spreader, one end of the strip-shaped hole 95 is located at the edge of the evaporation zone 91, and the other end is located at the edge of the condensation zone 92. This solution uses the provision of strip-shaped hole 95 to separate the first and second channels, creating a loop architecture.

[0234] FIG54 is an enlarged schematic cross-sectional view of the AA position in FIG53 . Referring to FIG53 and FIG54 , the inner walls 951 and 952 of the strip-shaped hole 95 constitute a partition wall between the first channel 93 and the second channel 94 .

[0235] FIG55 is a schematic diagram of the internal channels of a heat spreader provided in one embodiment of the present application. Referring to FIG55 , the heat spreader 90 includes a lengthwise direction and a widthwise direction. The evaporation zone 91 and the condensation zone 92 are respectively located at the top and bottom ends of the heat spreader 90 along the lengthwise direction. A first channel 93 and a second channel 94 are arranged along the widthwise direction. The first channel 93 includes an inlet end 931 and an outlet end 932. The inlet end 931 communicates with the evaporation zone 91, and the outlet end 932 communicates with the condensation zone 92. The first channel 93 includes an extension zone 933. For example, the portion of the first channel 93 within the dotted elliptical area in FIG55 may be the extension zone 933. The cross-section of the extension zone 933 is larger than the cross-section of the inlet end 931. The extension zone 933 is located between the inlet end 931 and the outlet end 932. The diameter of the outlet end 932 is larger than that of the inlet end 931. First channel 93 is wider at the location of expansion zone 933, and its width is greater than that of inlet end 931. Because expansion zone 933 is wider than inlet end 931, the steam pressure at expansion zone 933 is lower, and the phase transition temperature is lower. This allows the gas to expand and the condensation temperature to decrease, creating favorable conditions for steam to flow along first channel 93 to condensation zone 92.

[0236] In a possible implementation, the expansion zone 933 has a gradually expanding trend in which the cross section gradually expands in the direction extending from the inlet end 931 to the outlet end 932 .

[0237] Referring to Figure 55, in one embodiment, the second channel 94 includes a tail end 941 and a wide area 942, the tail end 941 is located at the position where the second channel 94 and the evaporation area 91 are connected, the wide area 942 and the tail end 941 are adjacent, and the cross-sectional area of ​​the tail end 941 is smaller than the cross-sectional area of ​​the wide area 942, so that a liquid seal is formed at the position where the tail end 941 is located to prevent the gas in the evaporation area 91 from flowing back to the second channel 94.

[0238] Figure 56 is a cross-sectional schematic diagram of the liquid channel of a heat spreader provided in one embodiment of the present application. Referring to Figure 56, a first capillary layer 945 and a second capillary layer 946 are provided within the second channel 94. The first capillary layer 945 covers the inner surface of the first cover plate 901, and the second capillary layer 946 covers the inner surface of the second cover plate 902. A support column 947 is provided within the second channel 94. One end of the support column 947 is fixedly connected to the inner surface of the second cover plate 902, and the other end abuts the first capillary layer 945. At least a portion of the side surface 9471 of the support column 947 has hydrophobic properties. By providing the side surface 9471 of the support column 947 with hydrophobic properties within the second channel 94, the liquid is more easily separated from the side surface 9471 of the support column 947 and more easily enters the first capillary layer 945 and the second capillary layer 946, thus completing the liquid return smoothly, thereby improving the fluidity of the working medium transport of the heat spreader and promoting the temperature equalization effect.

[0239] In one embodiment, the combined thickness of the first capillary layer 945 and the second capillary layer 946 accounts for at least 80% of the thickness of the second channel 94. Since the liquid channel is filled with liquid working fluid, the liquid working fluid is transferred through both the first and second capillary layers. Therefore, this solution constrains the combined thickness of the first and second capillary layers to be at least 80% of the thickness of the liquid channel, facilitating a thinner design for the vapor chamber.

[0240] In one embodiment, a bionic convex structure is provided in the condensation area of ​​the temperature homogenizing plate. The bionic convex structure can increase the condensation rate, so that the steam in the condensation area condenses into liquid more quickly and enters the capillary layer.

[0241] This application provides a design concept for a biomimetic raised structure. This biomimetic design concept is inspired by the raised structures on the surfaces of desert beetles and the needles of cacti. Specifically, the raised structures on the surfaces of desert beetles promote condensation, while the needles of cacti guide the flow of droplets. Based on this, the present application proposes a biomimetic raised structure in the condensation zone of a vapor chamber. This structure facilitates the condensation and shedding of steam, thereby enhancing the performance of the vapor chamber.

[0242] Figure 57 shows a perspective view, top view, front view, and left side view of one of the biomimetic raised structures in the condensation zone of a vapor chamber, provided in one embodiment of the present application. Referring to Figure 57 , the biomimetic raised structure 921 includes a bottom 9211, a top 9212, and a first inclined surface 9213 and a second inclined surface 9214 connected between the top 9212 and the bottom 9211. The bottom 9211 is connected to the inner surface of the vapor chamber housing, and the projection of the top 9212 onto the bottom 9211 is located at the asymmetric center of the bottom 9211. The top 9212 represents the highest point of the biomimetic raised structure 921 relative to the inner surface of the housing. In this solution, the projection of the top 9212 on the bottom 9211 is located at the asymmetric center of the bottom 9211. The surface connecting the top 9212 and the bottom 9211 constitutes an inclined surface, and the inclined surfaces on both sides of the top 9212 have different inclination angles. By forming inclined surfaces with different inclination angles, the gas can condense into water droplets on the bionic protrusion structure 921 and then flow quickly and enter the capillary structure. Therefore, this solution can increase the condensation rate through the bionic protrusion structure 921, so that the steam in the condensation zone condenses into liquid more quickly and enters the capillary layer.

[0243] The first inclined surface 9213 and the second inclined surface 9214 are both inclined relative to the thickness direction of the temperature homogenizing plate, and the thickness direction of the temperature homogenizing plate is the first direction. On the first cross section of the bionic raised structure 921, the angle between the extension direction of the first inclined surface 9213 and the first direction is the first angle B1, and the angle between the extension direction of the second inclined surface 9214 and the first direction is the second angle B2. The first angle B1 is greater than the second angle B2, and the first cross section is parallel to the first direction and passes through the top 9212. It can be understood that the angle at which the first inclined surface 9213 is inclined relative to the first direction (the first angle B1) is greater than the angle at which the second inclined surface is inclined relative to the first direction (the first angle B2). In one embodiment, the range of the first angle B1 is: 60°-80°, and the range of the second angle is: 10°-30°.

[0244] FIG58 is a schematic diagram of the distribution of biomimetic protrusion structures in the condensation zone of a heat spreader provided in one embodiment of the present application. FIG59 is a partially enlarged cross-sectional schematic diagram of the biomimetic protrusion structure distribution scheme shown in FIG58. Referring to FIG58 and FIG59, the condensation zone 92 includes a plurality of support columns 922 and a plurality of biomimetic protrusion structures 921. The plurality of support columns 922 are spaced apart on the surface of the second cover plate 902. The plurality of support columns 922 abut against the capillary structures 923 on the surface of the first cover plate 901. The plurality of biomimetic protrusion structures 921 are distributed in the area between adjacent support columns 922 and are spaced apart from the capillary structures 923 on the surface of the first cover plate 901. The bottom 9211 of each biomimetic protrusion structure 921 is connected to the second cover plate 902, and the top 9212 of each biomimetic protrusion structure 921 faces the capillary structure 923 on the first cover plate 901. The direction of the vertical line between the first cover plate 901 and the second cover plate 902 is the first direction.

[0245] Both the first inclined surface 9213 and the second inclined surface 9214 are inclined relative to the thickness direction of the vapor chamber, with the thickness direction of the vapor chamber being the first direction. In a first cross-section of the biomimetic protrusion structure 921, the angle between the extension direction of the first inclined surface 9213 and the first direction is a first angle B1, and the angle between the extension direction of the second inclined surface 9214 and the first direction is a second angle B2. The first angle B1 is greater than the second angle B2. The first cross-section is parallel to the first direction and passes through the top 9212.

[0246] Figure 60 is a schematic diagram of the distribution of biomimetic protrusion structures in the condensation zone of a heat spreader provided in one embodiment of the present application. Figure 61 is a partially enlarged cross-sectional schematic diagram of the biomimetic protrusion structure distribution scheme shown in Figure 60. Referring to Figures 60 and 61, the condensation zone 92 includes a plurality of biomimetic protrusion structures 921, which are spaced apart on the surface of the second cover plate 902. The plurality of biomimetic protrusion structures 921 abut against the capillary structure 923 on the inner surface of the first cover plate 901. Each biomimetic protrusion structure 921 and a bottom portion 9211 are connected to the second cover plate 902, and a top portion 9212 abuts against the capillary structure 923 on the inner surface of the first cover plate 901.

[0247] The working principle of the bionic protrusion structure 921 to increase the condensation rate is described as follows.

[0248] The surface of the bionic raised structure 921 (through the arrangement of the first inclined surface 9213 and the second inclined surface 9214) increases the contact area between the condensation wall and the steam, which is conducive to the formation of condensed water. Referring to Figure 57, on the first cross-section of the bionic raised structure 921, the angle between the extension direction of the second inclined surface 9214 and the first direction is the second angle B2. The second angle B2 is small, making the second inclined surface 9214 a steeper inclined surface. When the droplets are on the second inclined surface 9214, under the action of gravity, small and medium-sized droplets are easy to fall off directly. The second inclined surface 9214 can be an arc-shaped surface. The arc-shaped arrangement of the second inclined surface 9214 is conducive to increasing the surface area of ​​the bionic raised structure 921, obtaining a larger surface area in contact with the steam.

[0249] As shown in Figure 57, on the first cross-section of the bionic protrusion structure 921, the angle between the extension direction of the first inclined surface 9213 and the first direction is the first angle B1, the first angle B1 is greater than the second angle B2, the first inclined surface 9213 can be a gentler slope surface (the second inclined surface 9214 is a steeper slope), and the liquid can form liquid droplets with a smaller rolling angle on the first inclined surface 9213. The first inclined surface 9213 is easy for large liquids to fall off.

[0250] At the intersection of first slope 9213 and second slope 9214, surface forces exerted on droplets tend to form small droplets at top 9212. These droplets then merge with other droplets as they move toward first slope 9213. Because the droplets on first slope 9213 roll off at a shallow angle, these merged droplets easily fall off, carrying away the numerous small droplets previously formed on first slope 9213 and accelerating the condensation process. Simultaneously, the falling droplets at the top of first slope 9213 exert surface forces on the droplets on second slope 9214, continuously causing droplet formation and detachment.

[0251] In a specific embodiment, the top surface of the bionic protrusion structure 921 is a hydrophobic surface, which can further enhance the water condensation rate.

[0252] Figure 62 is a comparative schematic diagram of the condensation phenomenon (the part on the left of the dotted line) produced by the bionic protrusion structure 921 provided in one embodiment and the condensation phenomenon (the part on the right of the dotted line) produced by the ordinary surface. It can be clearly seen that the surface with the bionic protrusion structure 921 has a better condensation effect. The experimental results show that when coated with a hydrophobic layer, the condensation speed of the liquid on the surface of the bionic protrusion structure 921 shown in Figure 57 is more than 10 times the condensation speed of the liquid on the surface of the ordinary support column. In the case where the hydrophobic coating is not provided, the condensation speed of the liquid on the surface of the bionic protrusion structure 921 shown in Figure 57 is 3-5 times the condensation speed of the liquid on the surface of the ordinary support column.

[0253] The design of the temperature equalizer provided in Figures 43 to 61 of the embodiments of this application can be applied to the heat sink structure shown in Figures 39 and 40. By arranging the temperature equalizer and the liquid cooling circulation channel on a heat sink structure, this solution allows the heat sink structure to have two heat dissipation systems, namely the active liquid cooling heat dissipation system of the liquid cooling circulation channel and the heat dissipation system of the temperature equalizer. The two heat dissipation systems can work together, or when the terminal device has low power consumption, the active liquid cooling heat dissipation system can be disabled and only the heat dissipation system of the temperature equalizer can be used. Therefore, this solution has better application flexibility and can achieve better heat dissipation performance.

[0254] The working principle of the heat dissipation module, which sets the temperature spreader and liquid cooling circulation channel on a heat dissipation plate structure, is as follows: under low power consumption, the heat in the hot zone is mainly transferred by the evaporation and condensation of the liquid phase of the temperature spreader; under high power consumption, the pump is started under the control of the control chip, and the pump drives the liquid circulation in the active liquid cooling architecture to transfer liquid between the cooler pipe and the radiator pipe to achieve heat exchange. The efficient heat exchange capacity of the microchannel is used to move the heat in the hot zone to a cold zone farther away from the heat source for heat dissipation. The liquid cooling circulation system driven by the pump can transfer liquid to a farther cold zone, which can ensure the high efficiency of the system's heat dissipation.

[0255] In other application scenarios, the vapor chambers shown in Figures 43 through 61 of the present application can also be used independently in a terminal device, with the vapor chamber's evaporation zone directly attached to the device's heat source. Due to the hydrophobic surface design of the vapor chamber's evaporation zone, nucleated boiling can be easily achieved even with a low heat source, ensuring better temperature uniformity in the terminal device.

[0256] In one embodiment of the present application, the condensation rate is increased simply by providing multiple biomimetic protrusions in the condensation zone of the vapor chamber, allowing the vapor in the condensation zone to condense into liquid more quickly and enter the capillary layer. This advantage is not limited to whether the evaporation zone has an alternating arrangement of hydrophobic and hydrophilic surfaces. In other words, one embodiment of the present application can provide an architecture in which the condensation zone is provided with multiple biomimetic protrusions, while the evaporation zone can adopt any design architecture. The specific design method can be referred to the embodiments shown in Figures 57-61 and will not be further described.

[0257] In one embodiment of the present application, a cooler is provided, which includes a shell, which surrounds a plurality of fluid channels. The cooler includes a channel inlet and a channel outlet connected to the fluid channels, and the channel inlet and the channel outlet can be located on both sides of the fluid channel respectively. The shell is used to connect to the heat source through a thermal interface material. A plurality of spaced nucleation structures are provided in the fluid channel, and the periphery of each nucleation structure is a hydrophilic structure. The nucleation structure is used to promote nucleation boiling of the refrigerant medium, and the hydrophilic structure is used to transport the refrigerant medium to the position of the nucleation structure.

[0258] The embodiment of the present application is to set up a structure in which a nucleation structure and a hydrophilic structure are alternately distributed in the cooler. The nucleation structure has a hydrophobic function, and the contact angle between the surface of the nucleation structure and the liquid is large, so that the contact area between the liquid and the hydrophobic surface is smaller, and it is easier to nucleate and boil under the influence of the heat source. The hydrophilic structure can continuously transport liquid to the nucleation structure. Therefore, the cooler provided by the present application can achieve nucleation boiling of the liquid in the cooler at a lower temperature, thereby improving the heat dissipation performance of the cooler.

[0259] In one possible implementation, the present application arranges the nucleation structure on the inner surface of the shell close to the heat source, so that the nucleation structure is closer to the heat source, making it easier for the liquid in the cooler to nucleate and boil under the influence of the nucleation structure.

[0260] It can be understood that in this embodiment, the structure in which the nucleation structure and the hydrophilic structure are alternately distributed in the evaporation zone of the temperature equalizing plate provided in the aforementioned embodiment is applied in a cooler, and this cooler can be the cooler provided by any one of the embodiments of Figures 20-34.

[0261] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A terminal device, characterized in that: The invention comprises a shell and a heat dissipation component located inside the shell, wherein the internal space of the shell comprises a hot zone and a cold zone, the heat dissipation component comprises at least two heat exchangers, a pump and a connecting pipe, one of the at least two heat exchangers is located in the hot zone, and the other of the at least two heat exchangers is located in the cold zone, the connecting pipe is connected between the at least two heat exchangers to form a heat exchange circulation pipeline, and the pump is arranged in the heat exchange circulation pipeline to realize heat exchange between the hot zone and the cold zone.

2. The terminal device according to claim 1, characterized in that: The terminal device includes a mainboard, a heating device and a battery located inside the shell, the heating device is arranged on the mainboard, the terminal device includes a top end and a bottom end arranged oppositely, the battery includes a first end and a second end arranged oppositely, the first end is located at the edge of the battery facing the top end, and the second end is located at the edge of the battery facing the bottom end, the mainboard is located between the first end and the top end, and the heat exchanger located in the hot zone is thermally connected to the heating device.

3. The terminal device according to claim 2, characterized in that: At least part of the heat exchanger located in the cold zone is located between the second end and the bottom end; or, at least part of the heat exchanger located in the cold zone overlaps with part of the battery and is adjacent to the second end.

4. The terminal device according to claim 2 or 3, characterized in that: The terminal device includes a display screen, the housing includes a middle frame and a back shell, and the display screen and the back shell are distributed on opposite sides of the middle frame; The heat dissipation component is distributed between the middle frame and the display screen; or at least one of the at least two heat exchangers is located between the middle frame and the back shell.

5. The terminal device according to claim 1, characterized in that: The terminal device comprises a first body and a second body, and the first body and the second body can be folded or unfolded relative to each other; The heat dissipation component is located inside the first body; or, one of the at least two heat exchangers is located inside the first body, and at least one of the at least two heat exchangers is located inside the second body.

6. The terminal device according to any one of claims 1 to 5, characterized in that: One of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators. The radiators include a first radiator and a second radiator. The pumps include a first pump and a second pump. The connecting pipes include a first connecting pipe and a second connecting pipe. The first pump is connected to the heat exchange circulation pipeline between the first radiator and the cooler through the first connecting pipe, and the second pump is connected to the heat exchange circulation pipeline between the second radiator and the cooler through the second connecting pipe.

7. The terminal device according to any one of claims 1 to 6, characterized in that: The heat exchanger comprises a plurality of fluid channels, channel inlets and channel outlets. The channel inlets and the channel outlets are used to connect the connecting pipes. The equivalent diameter of the fluid channels is in the range of 0.05 mm to 0.3 mm.

8. The terminal device according to claim 7, characterized in that: The multiple fluid channels extend along a second direction and are arranged in a row in sequence along the first direction. In the second direction, the channel inlet and the fluid channel at the head of the row are arranged opposite to each other, and the channel outlet and the fluid channel at the end of the row are arranged opposite to each other. The second direction is perpendicular to the first direction.

9. The terminal device according to claim 7 or 8, characterized in that: A guide structure extending along the first direction is provided between the channel inlet and the multiple fluid channels, the guide structure divides the space in the cooler into a first space and a second space, the multiple fluid channels are located in the second space, the channel inlet is connected to the first space, and along the first direction, the guide structure is provided with multiple through holes connecting the first space and the second space.

10. The terminal device according to claim 9, characterized in that: Along the first direction, the density of the through holes located at both ends of the flow guiding structure is less than the density of the through holes located in the middle area of ​​the flow guiding structure.

11. The terminal device according to claim 9 or 10, characterized in that: The guide structure includes a plurality of diverter plates and a plurality of spoiler structures, the plurality of diverter plates are arranged at intervals along the first direction, and the through holes are formed between adjacent diverter plates, the spoiler structure is protrudingly arranged at one end of the corresponding diverter plate, and the spoiler structure protrudes toward the first space or the second space.

12. The terminal device according to claim 9 or 10, characterized in that: The heat exchanger includes a plurality of barrier strips which are spaced apart from each other and extend along the second direction, wherein the fluid channel is formed between adjacent barrier strips, a portion of the fluid channel is a first channel, the barrier strips forming the first channel are a first barrier strip and a second barrier strip, one end of the first channel facing the flow guide structure is an inlet of the first channel, the inlet of the first channel and a middle area of ​​the flow guide structure are arranged relative to each other, and at the inlet position of the first channel, a distance between the first barrier strip and the flow guide structure in the second direction is smaller than a distance between the first barrier strip and the flow guide structure in the second direction.

13. The terminal device according to any one of claims 7 to 12, characterized in that: The first direction is the width direction of the fluid channel, the second direction is the length direction of the fluid channel, and the third direction is the height direction of the fluid channel. The first direction, the second direction and the third direction are perpendicular to each other, and the ratio of the height direction dimension to the width direction dimension of each fluid channel is 0.3-2.

14. The terminal device according to any one of claims 1 to 13, characterized in that: The connecting pipe is made of non-metallic material; or, the connecting pipe includes a metal pipe body and a heat insulation layer, and the heat insulation layer is coated on the periphery of the metal pipe body.

15. The terminal device according to any one of claims 1 to 14, characterized in that: The at least two heat exchangers and the connecting pipe are integrally formed in a heat sink structure, the heat sink structure includes a first interface and a second interface, the first interface and the second interface are connected to the connecting pipe, and the pump is connected between the first interface and the second interface.

16. The terminal device according to claim 15, characterized in that: The heat dissipation plate structure includes a first plate and a second plate. The flow channels in the at least two heat exchangers and the flow channels in the connecting pipe are integrally formed on the surface of the first plate. The first plate and the second plate are relatively connected as a whole, so that the flow channels in the at least two heat exchangers and the flow channels in the connecting pipe are formed between the first plate and the second plate.

17. The terminal device according to claim 15 or 16, characterized in that: The heat dissipation plate structure is surrounded to form a receiving space, and the receiving space is used to accommodate the pump.

18. The terminal device according to any one of claims 15 to 17, characterized in that: The heat dissipation plate structure includes a top edge and a bottom edge that are arranged opposite to each other, and a first side edge and a second side edge that are connected between the top edge and the bottom edge and are arranged opposite to each other. One of the at least two heat exchangers is a cooler, and the cooler is formed in a region of the heat dissipation plate structure adjacent to the top edge. At least one of the at least two heat exchangers is a radiator, and the radiator is formed in a region of the heat dissipation plate structure adjacent to the bottom edge. Some of the connecting pipes are first pipes, and the first pipes are adjacent to the first side edge and connected between the cooler and the radiator. Some of the connecting pipes are second pipes, and the second pipes are adjacent to the second side edge and connected between the cooler and the radiator.

19. The terminal device according to claim 18, characterized in that: The heat sink structure is provided with an isolation zone, part of which is located on a side of the first tube away from the first side edge, and part of which is located on a side of the second tube away from the second side edge.

20. The terminal device according to any one of claims 15 to 19, characterized in that: Part of the heat dissipation plate structure forms a temperature equalizing plate, and the heat exchange circulation pipeline composed of the at least two heat exchangers and the connecting pipes is arranged around the periphery of the temperature equalizing plate, one of the at least two heat exchangers is a cooler, and the other heat exchangers are radiators, the evaporation zone of the temperature equalizing plate is adjacent to the cooler, and the condensation zone of the temperature equalizing plate is located between the cooler and the radiator.

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