Display device and electronic apparatus
The display device addresses light leakage issues by using an ordered tapered partition wall within its layered structure to reflect light back into the display area, improving brightness and color accuracy in high-definition applications.
Patent Information
- Application Number
- PCT/JP2024/026314
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-07-26
- Filing Date
- 2024-07-23
- Publication Date
- 2025-01-30
AI Technical Summary
Current display devices suffer from significant light leakage between adjacent pixels, which affects the brightness and color accuracy, particularly in high-definition and high-luminance applications like AR and VR headsets, where existing solutions do not adequately suppress light leakage and improve light integration efficiency.
The implementation of a display device with a two-dimensional arrangement of light emitting elements, featuring multiple stacked layers including a partition wall with an ordered tapered shape between adjacent elements, which reflects light back into the display area, reducing light leakage and enhancing light integration by matching the refractive index of the partition wall with the surrounding layers.
This configuration effectively suppresses light leakage and improves light integration, enhancing the brightness and color accuracy of the display device, particularly in high-definition and high-luminance applications, by ensuring that light is directed towards the intended viewing angle and reducing mixing between adjacent pixels.
Smart Images

Figure JP2024026314_30012025_PF_FP_ABST
Abstract
Description
Display devices and electronic devices
[0001] The present disclosure relates to a display device and an electronic device including the same.
[0002] Display devices with a two-dimensional arrangement of multiple light-emitting elements have become widespread in recent years. In this type of display device, light leakage occurs between adjacent pixels, which can lead to color mixing between the pixels. For this reason, technologies for suppressing light leakage between adjacent pixels have been studied. For example, Patent Document 1 proposes a technology for suppressing light leakage between adjacent pixels by providing a separator in a protective layer in a display device including a substrate, multiple light-emitting elements, a protective layer, and a color filter.
[0003] JP 2018-92873 A
[0004] However, the technology described in Patent Document 1 does not sufficiently suppress light leakage, and there is room for improvement.
[0005] An object of the present disclosure is to provide a display device that can suppress light leakage between adjacent pixels and an electronic device including the same.
[0006] In order to solve the above-mentioned problems, the display device according to the present disclosure includes: a plurality of light-emitting elements arranged two-dimensionally; a plurality of layers stacked on the plurality of light-emitting elements; and a partition wall disposed between adjacent light-emitting elements in a planar view and formed across two or more layers included in the plurality of layers, wherein the cross-sectional shape of the partition wall includes a forward tapered shape.
[0007] FIG. 1 is a cross-sectional view of a display device in which a color filter is formed on a glass substrate. FIG. 2 is a cross-sectional view of a display device in which a color filter is formed on a drive substrate. FIG. 3 is a cross-sectional view of a display device in which a color filter and a lens array are formed on a drive substrate. FIG. 4 is a cross-sectional view of a display device in which a gap exists between adjacent lenses. FIG. 5 is a plan view of a display device according to an embodiment. FIG. 6 is an enlarged cross-sectional view of a display region of a display device according to an embodiment. FIG. 7A is a cross-sectional view of an OLED layer including a single layer of light-emitting units. FIG. 7B is a cross-sectional view of an OLED layer including two layers of light-emitting units. FIG. 8 is a process diagram illustrating a first example of a method for manufacturing a display device according to an embodiment. FIG. 9 is a process diagram illustrating a first example of a method for manufacturing a display device according to an embodiment. FIG. 10 is a process diagram illustrating a first example of a method for manufacturing a display device according to an embodiment. FIG. 11 is a process diagram illustrating a second example of a method for manufacturing a display device according to an embodiment. FIG. 12 is a process diagram illustrating a second example of a method for manufacturing a display device according to an embodiment. FIG. 13 is a process diagram illustrating a second example of a method for manufacturing a display device according to an embodiment. FIG. 14 is an enlarged cross-sectional view of a display region of a display device according to a modified example. FIG. 15 is a cross-sectional view of a first example of a leakage suppression structure. FIG. 16 is a cross-sectional view of a second example of a leak suppression structure. FIG. 17 is a cross-sectional view of a third example of a leak suppression structure. FIG. 18 is a cross-sectional view of a fourth example of a leak suppression structure. FIG. 19 is a cross-sectional view of a fifth example of a leak suppression structure. FIG. 20 is a cross-sectional view of a sixth example of a leak suppression structure. FIG. 21 is a cross-sectional view of a seventh example of a leak suppression structure. FIG. 22 is an enlarged cross-sectional view of the groove shown in FIG. 21. FIG. 23 is a cross-sectional view of an eighth example of a leak suppression structure. FIG. 24 is a cross-sectional view of a ninth example of a leak suppression structure. FIG. 25 is a plan view for illustrating the arrangement of a first electrode and a third electrode. FIG. 26A is a schematic cross-sectional view for illustrating a first example of a resonator structure. FIG. 26B is a schematic cross-sectional view for illustrating a second example of a resonator structure. FIG. 27A is a schematic cross-sectional view for illustrating a third example of a resonator structure. FIG. 27B is a schematic cross-sectional view for illustrating a fourth example of a resonator structure. FIG. 28A is a schematic cross-sectional view for explaining a fifth example of the resonator structure.Fig. 28B is a schematic cross-sectional view for explaining a sixth example of the resonator structure. Fig. 29 is a schematic cross-sectional view for explaining a seventh example of the resonator structure. Fig. 30A is a front view of a digital still camera. Fig. 30B is a rear view of the digital still camera. Fig. 31 is a perspective view of a head-mounted display. Fig. 32 is a perspective view of a television device. Fig. 33 is a perspective view of a see-through head-mounted display. Fig. 34 is a perspective view of a smartphone. Fig. 35A is a view showing the interior of a vehicle from the rear to the front of the vehicle. Fig. 35B is a view showing the interior of a vehicle from diagonally rear to diagonally front of the vehicle.
[0008] Embodiments of the present disclosure will be described in the following order: 1. General Description of the Display Device According to the Present Disclosure 2. Background to the Creation of the Embodiments of the Present Disclosure 3. One Embodiment (Example of a Display Device) 4. Modifications 5. Example of a Leakage Suppression Structure 6. Example of a Resonator Structure 7. Application Example (Example of an Electronic Device) The embodiments described below are preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments. In the following description, components having substantially the same functional configuration are given the same reference numerals, and duplicate explanations will be omitted as appropriate. Furthermore, to prevent the illustrations from becoming too complicated, reference numerals may be given to only some of the components, or the illustrations may be simplified, enlarged, or reduced in size.
[0009] <1 General Description of the Display Device According to the Present Disclosure> The display device according to the present disclosure includes a plurality of light-emitting elements arranged two-dimensionally, a plurality of layers stacked on the plurality of light-emitting elements, and a partition wall that is disposed between adjacent light-emitting elements in a planar view and that is formed across two or more layers included in the plurality of layers, and the cross-sectional shape of the partition wall includes a forward tapered shape.
[0010] As described above, since the cross-sectional shape of the partition wall includes a forward tapered shape, the angle of incidence of light incident on the side surface of the partition wall from the light-emitting element becomes large, making it easier for the light to be totally reflected by the side surface of the partition wall. Furthermore, since the partition wall is formed across two or more layers, the amount of light leaking from above and / or below the partition wall to adjacent pixels can be reduced. Therefore, light leakage between adjacent pixels can be suppressed. In this specification, "and / or" means at least one of the following. For example, "X and / or Y" means three possibilities: X only, Y only, or X and Y.
[0011] In the display device according to the present disclosure, the refractive index of the partition wall is preferably lower than the refractive index of two or more layers included in the plurality of layers, thereby allowing light emitted from the light-emitting element to the wide-angle side to be totally reflected at the interface between the partition wall and the two or more layers.
[0012] In the display device according to the present disclosure, the plurality of layers may include a protective layer, a color filter, and an encapsulating resin layer, in that order, on the plurality of light-emitting elements. In this case, it is preferable that two or more layers included in the plurality of layers include the protective layer and the color filter. This allows light emitted from the light-emitting elements to the wide-angle side to be totally reflected at the interfaces between the protective layer and the color filter and the partition wall.
[0013] In the display device according to the present disclosure, the plurality of layers may include a protective layer, a first resin layer, a color filter, and an encapsulating resin layer, in that order, on the plurality of light-emitting elements. In this case, two or more layers included in the plurality of layers preferably include the protective layer, the first resin layer, and the color filter. This allows light emitted from the light-emitting elements to the wide-angle side to be totally reflected at the interfaces between the protective layer, the first resin layer, and the color filter and the partition wall. The first resin layer may be a first planarization layer.
[0014] In the display device according to the present disclosure, the plurality of layers may include a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and an encapsulating resin layer, in that order, on the plurality of light-emitting elements. In this case, two or more layers included in the plurality of layers preferably include the protective layer, the first resin layer, the color filter, and the second resin layer. This allows total reflection at the interfaces between the protective layer, the first resin layer, the color filter, and the second resin layer and the partition wall. The first resin layer and the second resin layer may be a first planarization layer and a second planarization layer, respectively.
[0015] In the display device according to the present disclosure, the refractive index of the partition wall is preferably the same as the refractive index of the sealing resin layer, which allows the partition wall and the sealing resin layer to be formed from the same material, thereby suppressing an increase in the number of materials required for manufacturing the display device.
[0016] In the display device according to the present disclosure, the sealing resin layer is in contact with the tops of the partition walls, and the refractive index of the partition walls is preferably lower than the refractive index of the sealing resin layer. This allows light emitted from the light-emitting elements to be refracted and bent in the front direction at the interface between the tops of the partition walls and the sealing resin layer. This improves the light extraction efficiency in the front direction.
[0017] In the display device according to the present disclosure, the top of the partition is preferably located higher than the color filter relative to the light emitting element, from the viewpoint of suppressing light leakage from above the partition into adjacent pixels.
[0018] In the display device according to the present disclosure, the plurality of light-emitting elements may include an organic-matter-containing layer including an organic light-emitting layer, and the organic-matter-containing layer may be connected between adjacent light-emitting elements. In this case, from the viewpoint of suppressing light leakage from below the partition wall to adjacent pixels, it is preferable that the bottom of the partition wall be buried in a protective layer.
[0019] In the display device according to the present disclosure, when a plurality of light-emitting elements include an organic-material-containing layer including an organic light-emitting layer, and the organic-material-containing layer is connected between adjacent light-emitting elements, it is preferable that the protective layer has a surface facing the light-emitting elements, and the bottom of the partition wall is spaced from the surface. This prevents the organic-material-containing layer from being exposed without being covered by the protective layer between adjacent light-emitting elements. Therefore, it is possible to prevent a decrease in the protective function of the protective layer against the organic-material-containing layer.
[0020] In the display device according to the present disclosure, the height of the top of the partition wall is preferably the same as the height of the bottom of the lens included in the lens array. This prevents the layer covering the light-collecting surface of the lens from changing from the partition wall to a sealing resin layer midway, thereby suppressing deterioration of the lens function. Furthermore, light leakage from above the partition wall to adjacent pixels can be suppressed.
[0021] In the display device according to the present disclosure, the bottom of the partition is preferably provided at a position that does not overlap with the light-emitting region of the light-emitting element in a plan view, thereby preventing light emitted from the light-emitting element to the wide-angle side from being reflected by the bottom of the partition and becoming stray light.
[0022] The display device according to the present disclosure may be included in an electronic device. For example, the display device according to the present disclosure may be included in an eyewear device such as a virtual reality (VR) device, a mixed reality (MR) device, or an augmented reality (AR) device, or may be included in an electronic viewfinder (EVF), a small projector, or the like.
[0023] In the present disclosure, a forward tapered shape refers to a shape in which the width of the partition narrows from the lowest layer (the layer on the light-emitting element side) to the highest layer (the layer on the opposite side from the light-emitting element side) among multiple layers stacked on multiple light-emitting elements.
[0024] In the present disclosure, the cross-sectional shape of the partition wall may include a forward tapered shape, and the cross-sectional shape of a portion of the partition wall in the thickness direction of the display device may be a forward tapered shape, or the cross-sectional shape of the entire partition wall may be a forward tapered shape.
[0025] In the present disclosure, the forward tapered shape includes a linear tapered shape in which the width of the partition wall changes linearly with respect to the height of the partition wall and the inclination angle of the side surface of the partition wall is constant, and a nonlinear tapered shape in which the width of the partition wall changes nonlinearly with respect to the height of the partition wall and the inclination angle of the side surface of the partition wall changes. The nonlinear tapered shape is, for example, an exponential tapered shape or a parabolic tapered shape.
[0026] In the present disclosure, expressions such as "the plurality of layers include a protective layer, a color filter, and a sealing resin layer, in that order, on the plurality of light-emitting elements," "the plurality of layers include a protective layer, a first resin layer, a color filter, and a sealing resin layer, in that order, on the plurality of light-emitting elements," and "the plurality of layers include a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and a sealing resin layer, in that order, on the plurality of light-emitting elements" indicate the relative positional relationship of each layer, and include not only a state in which each layer is in direct contact with each other without any other layer sandwiched between the layers, but also a state in which each layer is not in direct contact with each other but with another layer sandwiched between the layers.
[0027] In the present disclosure, "on object A" in expressions such as "object B is provided on object A" indicates the relative positional relationship between object A and object B, and includes not only a state in which object B is located directly on object A without any other objects in between, but also a state in which object B is located on object A with at least one other object in between.
[0028] In the present disclosure, the refractive index of various members such as partition walls, filled resin layers, and lenses represents the refractive index for light with a wavelength of 589.3 nm (the D line of sodium).
[0029] 2. Background to the Creation of the Embodiments of the Present Disclosure OLED (Organic Light Emitting Diode) display devices are being increasingly deployed in AR headsets, VR headsets, and the like, and there is a demand for higher definition and higher brightness.
[0030] 1, a conventional OLED display device 601 includes a drive substrate 611, a plurality of light-emitting elements 612, an insulating layer 613, a protective layer 614, a filling resin layer 615, a color filter 616F, and a glass substrate 617. The light-emitting elements 612 include a first electrode 621, an OLED layer 622, and a second electrode 623. The color filter 616F includes a red colored layer 616R, a green colored layer 616G, and a blue colored layer 616B.
[0031] The sub-pixel 610R is composed of a light-emitting element 612 and a colored layer 616R provided above the light-emitting element 612. The sub-pixel 610G is composed of a light-emitting element 612 and a colored layer 616G provided above the light-emitting element 612. The sub-pixel 610B is composed of a light-emitting element 612 and a colored layer 616B provided above the light-emitting element 612. In the following description, when the sub-pixels 610R, 610G, and 610B are referred to collectively without any particular distinction, they may be referred to as sub-pixels 610. Furthermore, when the colored layers 616R, 616G, and 616B are referred to collectively without any particular distinction, they may be simply referred to as colored layers 616.
[0032] In the display device 601 described above, the glass substrate 617 on which the color filter 616F is formed is bonded to the drive substrate 611 via the filled resin layer 615, so the distance D between the OLED layer 622 and the color filter 616F is large. For this reason, if this type of display device 601 is made higher-definition and the sub-pixels 610 are arranged at a narrower pitch, there is a problem in that light L emitted from the OLED layer 122 of a specific sub-pixel (local pixel) 610 is more likely to leak to an adjacent sub-pixel 610.
[0033] In consideration of the above problems, a display device 602 has been proposed in which a color filter 616F is provided on the drive substrate 611 side, as shown in Figure 2. In this display device 602, the distance D between the OLED layer 122 and the color filter 16 can be reduced, thereby suppressing light leakage into adjacent sub-pixels 610. This makes it possible to suppress color mixing and improve viewing angle characteristics. Note that in Figures 1 and 2, θ represents the viewing angle.
[0034] (Technology for Increasing the Brightness of Display Devices) Increasing the brightness of display devices is an important requirement, as it contributes to extending the lifespan and reducing power consumption of the display device. For this reason, a display device 603 has been proposed, in which a color filter 616F is provided on the drive substrate 611 side and a lens 618 is provided for each sub-pixel 610, as shown in Figure 3. In this display device 603, the lens 618 collects the light L emitted from the OLED layer 122 of each sub-pixel 610, increasing the efficiency of extracting the light L in the front direction and achieving high brightness.
[0035] (Problems with the display device 603) However, even when the color filter 616F is provided on the drive substrate 611 side, as shown in Fig. 4, there is a considerable amount of light L1 that leaks from a specific sub-pixel (local pixel) 610 to an adjacent sub-pixel 610. Not only is this light L1 not extracted in the front direction, but it may also cause color mixing.
[0036] 3 does not show a gap GP between adjacent lenses 618, but when lenses 618 are actually formed, a gap GP is usually formed between adjacent lenses 618 as shown in Fig. 4. Since light L2 incident on the gap GP is not condensed in the front direction, it is difficult to sufficiently increase the efficiency of extracting light L in the front direction in a display device 603 in which a gap GP is formed.
[0037] As described above, even in the display device 603, there is a considerable amount of light L1 and L2 that does not enter the colored layer 616 and lens 618 of the pixel (sub-pixel) itself, and there is room for improvement in light leakage between sub-pixels and light collection characteristics.
[0038] Therefore, the present inventors have conducted extensive research to improve the light leakage between sub-pixels and the light collection characteristics, and as a result have come up with a display device 101 according to an embodiment described below.
[0039] 5 is a plan view of a display device 101 according to an embodiment. The display device 101 has a display region RE1 and a peripheral region RE2 provided around the display region RE1.
[0040] In this specification, a first direction and a second direction that are orthogonal to each other within the display surface of the display device 101 are referred to as the X-axis direction and the Y-axis direction, respectively, and a third direction that is perpendicular to the display surface of the display device 101 is referred to as the Z-axis direction. In one embodiment, an example will be described in which the X-axis direction is the horizontal direction of the display surface and the Y-axis direction is the vertical direction of the display surface.
[0041] In one embodiment, an example will be described in which the display device 101 is a top-emission display device, but the type of the display device 101 is not limited to this example. The display device 101 may be a microdisplay. From the viewpoint of achieving high definition in the display device 101, the pixel pitch of the subpixels 10 is preferably 10 μm or less.
[0042] 6 is an enlarged cross-sectional view of the display region RE1 of the display device 101. A plurality of sub-pixels 10R, 10G, and 10B are two-dimensionally arranged in a specified arrangement pattern within the display region RE1. The specified arrangement pattern may be a stripe arrangement, a mosaic arrangement, a square arrangement, a delta arrangement, or any other arrangement. A pad section 113 and a driver (not shown) for displaying video are provided in the peripheral region RE2. A flexible printed circuit (FPC) (not shown) may be connected to the pad section 113.
[0043] The sub-pixel 10R can emit red light (first light). The sub-pixel 10G can emit green light (second light). The sub-pixel 10B can emit blue light (third light). In the following description, when the sub-pixels 10R, 10G, and 10B are referred to collectively without any particular distinction, the sub-pixels 10R, 10G, and 10B may be simply referred to as sub-pixels 10. One pixel (one pixel) is composed of, for example, a plurality of adjacent sub-pixels 10R, 10G, and 10B. However, the configuration of one pixel is not limited to this example, and one pixel may be composed of, for example, a plurality of adjacent sub-pixels 10R, 10G, 10B, and 10B.
[0044] 6 , the display device 101 includes a drive substrate 11, a plurality of light-emitting elements 12, an insulating layer 13, a protective layer 14, a planarization layer 15, a color filter 16, a planarization layer 17, a lens array 18, partition walls 19, and a sealing resin layer 20. The protective layer 14, the planarization layer 15, the color filter 16, the planarization layer 17, the lens array 18, and the sealing resin layer 20 are examples of a plurality of layers stacked on the plurality of light-emitting elements 12.
[0045] In this specification, of the two surfaces of each layer constituting display device 101, the surface facing the display surface (top side) of display device 101 may be referred to as the first surface (upper surface), and the surface facing the opposite side (bottom side) of display device 101 from the display surface may be referred to as the second surface (lower surface). In this specification, the peripheral portion of the first surface refers to an area having a predetermined width extending inward from the peripheral edge of the first surface. In this specification, the planar view refers to the planar view when an object is viewed from a direction perpendicular to the first surface or the second surface.
[0046] (Drive Substrate 11) The drive substrate 11 is a so-called backplane, and is capable of driving a plurality of light-emitting elements 12. The drive substrate 11 includes, for example, a substrate 111 and an insulating layer 112 in this order.
[0047] A plurality of drive circuits (not shown) and the like are provided on the first surface side of the substrate 111. The substrate 111 may be, for example, a semiconductor substrate on which transistors and the like can be easily formed, or a glass substrate or resin substrate with low moisture and oxygen permeability. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single crystal silicon. The glass substrate includes, for example, high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, or quartz glass. The resin substrate includes, for example, at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate.
[0048] The insulating layer 112 is provided on the first surface of the substrate 111 and covers a plurality of drive circuits and the like. The insulating layer 112 includes a plurality of contact plugs 112b, 112g and a plurality of wirings 112a therein. The plurality of contact plugs 112b, 112g and the wirings 112a electrically connect the light-emitting element 12 to the drive circuits. The contact plugs 112b, 112g include at least one metal selected from the group consisting of, for example, copper (Cu) and titanium (Ti).
[0049] The insulating layer 112 is, for example, an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains, for example, at least one selected from the group consisting of polyimide-based resin, acrylic-based resin, and novolac-based resin. The inorganic insulating layer is, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) and the like.
[0050] (Light-emitting element 12) The light-emitting element 12 can emit white light under the control of a drive circuit, etc. In one embodiment, the light-emitting element 12 is an organic light-emitting diode element (OLED element). The light-emitting element 12 is included in each of the sub-pixels 10R, 10G, and 10B of each color.
[0051] The plurality of light-emitting elements 12 are two-dimensionally arranged in a specified arrangement pattern on the first surface of the drive substrate 11. The specified arrangement pattern is as described above as the specified arrangement pattern of the plurality of sub-pixels 10. The light-emitting element 12 includes a first electrode 121, an OLED layer 122, and a second electrode 123, which are arranged in this order on the first surface of the drive substrate 11.
[0052] (First electrode 121) The first electrode 121 is provided on the second surface side of the OLED layer 122. The first electrode 121 is an individual electrode provided individually for each of the plurality of light-emitting elements 12. That is, the first electrode 121 is divided between adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11. The first electrode 121 is an anode. When a voltage is applied between the first electrode 121 and the second electrode 123, holes are injected from the first electrode 121 into the OLED layer 122.
[0053] The first electrode 121 may be composed of, for example, a metal layer, or may be composed of a metal layer and a transparent conductive oxide layer. When the first electrode 121 is composed of a metal layer and a transparent conductive oxide layer, it is preferable that the transparent conductive oxide layer be provided on the OLED layer 122 side, from the viewpoint of having a layer having a high work function adjacent to the OLED layer 122.
[0054] The metal layer may function as a reflective layer that reflects light L emitted by the OLED layer 122. The metal layer may contain at least one metal element selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). The metal layer may contain at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an aluminum alloy and a silver alloy. Specific examples of the aluminum alloy include AlNd and AlCu.
[0055] An underlayer (not shown) may be provided adjacent to the second surface side of the metal layer. The underlayer may be capable of improving the crystal orientation of the metal layer during deposition. The underlayer may contain, for example, at least one metal element selected from the group consisting of titanium (Ti) and tantalum (Ta). The underlayer may contain the at least one metal element as a constituent element of an alloy.
[0056] The transparent conductive oxide layer contains a transparent conductive oxide, for example, at least one selected from the group consisting of transparent conductive oxides containing indium (hereinafter referred to as "indium-based transparent conductive oxides"), transparent conductive oxides containing tin (hereinafter referred to as "tin-based transparent conductive oxides"), and transparent conductive oxides containing zinc (hereinafter referred to as "zinc-based transparent conductive oxides").
[0057] Examples of indium-based transparent conductive oxides include indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), and fluorine-doped indium oxide (IFO). Among these transparent conductive oxides, indium tin oxide (ITO) is particularly preferred. Indium tin oxide (ITO) has a particularly low work function barrier for hole injection into the OLED layer 122, allowing the driving voltage of the display device 101 to be particularly low. Examples of tin-based transparent conductive oxides include tin oxide, antimony-doped tin oxide (ATO), and fluorine-doped tin oxide (FTO). Examples of zinc-based transparent conductive oxides include zinc oxide, aluminum-doped zinc oxide (AZO), boron-doped zinc oxide, and gallium-doped zinc oxide (GZO).
[0058] (OLED Layer 122) The OLED layer 122 can emit white light. The OLED layer 122 is an example of an organic-material-containing layer that includes an organic light-emitting layer. The OLED layer 122 is provided between a plurality of first electrodes 121 and one second electrode 123. The OLED layer 122 connects adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11, and is a layer common to the plurality of light-emitting elements 12.
[0059] The OLED layer 122 may be configured as a laminate including an organic light-emitting layer, in which case some layers of the laminate (e.g., an electron injection layer) may be inorganic. The OLED layer 122 may be an OLED layer having a single light-emitting unit U as shown in FIG. 7A , an OLED layer having two light-emitting units U1 and U2 (tandem structure) as shown in FIG. 7B , or an OLED layer having a structure other than these. The OLED layer 122 having a single light-emitting unit U has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a red light-emitting layer 1220R, an emission separation layer 1223, a blue light-emitting layer 1220B, a green light-emitting layer 1220G, an electron transport layer 1224, and an electron injection layer 1225 are stacked in this order from the first electrode 121 to the second electrode 123. The OLED layer having two light-emitting units U1 and U2 has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a blue light-emitting layer 1220B, an electron transport layer 1226, a charge generation layer 1227, a hole transport layer 1228, a yellow light-emitting layer 1220Y, an electron transport layer 1224, and an electron injection layer 1225 are laminated in this order from the first electrode 121 to the second electrode 123.
[0060] The hole injection layer 1221 can increase the efficiency of hole injection into the light-emitting layers 1220R, 1220G, and 1220B and suppress leakage. The hole transport layers 1222 and 1228 can increase the efficiency of hole transport into the light-emitting layers 1220R, 1220B, and 1220Y. The electron injection layer 1225 can increase the efficiency of electron injection into the light-emitting layers 1220G and 1220Y. The electron transport layers 1224 and 1226 can increase the efficiency of electron transport into the light-emitting layers 1220G, 1220B, and 1220Y. The emission separation layer 1223 is a layer for adjusting the injection of carriers into the light-emitting layers 1220R, 1220G, and 1220B. The balance of light emission of each color is adjusted by injecting electrons and holes into the light-emitting layers 1220R, 1220G, and 1220B via the emission separation layer 1223. The charge generating layer 1227 can supply electrons and holes to the blue light emitting layer 1220B and the yellow light emitting layer 1220Y, which are disposed so as to sandwich the charge generating layer 1227, respectively.
[0061] When an electric field is applied to the red light-emitting layer 1220R, the green light-emitting layer 1220G, the blue light-emitting layer 1220B, and the yellow light-emitting layer 1220Y, recombination occurs between holes injected from the first electrode 121 or the charge generation layer 1227 and electrons injected from the second electrode 123 or the charge generation layer 1227, and the red light, green light, blue light, and yellow light can be emitted.
[0062] (Second electrode 123) The second electrode 123 is provided on the first surface side of the OLED layer 122. The second electrode 123 is connected between adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11, and is an electrode common to the plurality of light-emitting elements 12.
[0063] The second electrode 123 is a cathode. When a voltage is applied between the first electrode 121 and the second electrode 123, electrons are injected from the second electrode 123 into the OLED layer 122. The second electrode 123 is translucent to the white light emitted from the OLED layer 122. The second electrode 123 is preferably a transparent electrode that is transparent to visible light. In this specification, visible light refers to light in a wavelength range of 360 nm or more and 780 nm or less.
[0064] In order to improve luminous efficiency, it is preferable that the second electrode 123 be made of a material that is as transparent as possible and has a small work function. The second electrode 123 is made of, for example, at least one layer of a metal layer and a transparent conductive oxide layer. More specifically, the second electrode 123 is made of a single layer film of a metal layer or a transparent conductive oxide layer, or a laminate film of a metal layer and a transparent conductive oxide layer. When the second electrode 123 is made of a laminate film, the metal layer may be provided on the OLED layer 122 side, or the transparent conductive oxide layer may be provided on the OLED layer 122 side. However, from the viewpoint of having a layer with a low work function adjacent to the OLED layer 122, it is preferable that the metal layer be provided on the OLED layer 122 side.
[0065] The metal layer contains, for example, at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may contain the at least one metal element as a constituent element of an alloy. Specific examples of the alloy include an MgAg alloy, an MgAl alloy, and an AlLi alloy. The transparent conductive oxide layer contains a transparent conductive oxide. Examples of the transparent conductive oxide include the same materials as the transparent conductive oxide of the first electrode 121 described above.
[0066] (Insulating Layer 13) The insulating layer 13 is provided on the first surface of the drive substrate 11 in a portion between the separated first electrodes 121. The insulating layer 13 is an insulating layer for element isolation and can insulate the first electrodes 121 adjacent in the in-plane direction of the first surface of the drive substrate 11. The insulating layer 13 has a plurality of openings 13a. The plurality of openings 13a are provided corresponding to the respective light-emitting elements 12. The plurality of openings 13a may be provided on the first surface (the surface facing the OLED layer 122) of each first electrode 121. In other words, the peripheral portion of the first surface of each first electrode 121 may be covered by the insulating layer 13. The first electrode 121 and the OLED layer 122 come into contact with each other through the openings 13a. The shape of the openings 120 in a plan view is not particularly limited, and may be, for example, a substantially rectangular, a substantially circular, or a substantially elliptical shape.
[0067] The insulating layer 13 is, for example, an organic insulating layer, an inorganic insulating layer, or a laminate thereof. The organic insulating layer contains, for example, at least one selected from the group consisting of polyimide-based resins, acrylic-based resins, and novolac-based resins. The inorganic insulating layer is, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) and the like.
[0068] (Protective Layer 14) The protective layer 14 is provided on the first surface of the second electrode 123 and covers the plurality of light-emitting elements 12. The protective layer 14 is translucent to white light emitted from the light-emitting elements 12. The protective layer 14 can protect the plurality of light-emitting elements 12 and the like. For example, the protective layer 14 can prevent moisture from entering the plurality of light-emitting elements 12 and the like from the external environment. Furthermore, when the second electrode 123 is formed of a metal layer, the protective layer 14 may have a function of preventing oxidation of this metal layer.
[0069] The protective layer 14 contains, for example, at least one of an inorganic material and an organic material having low moisture absorption. The protective layer 14 may have a single layer structure or a multilayer structure. When the thickness of the protective layer 14 is increased, a multilayer structure is preferable. This is because the internal stress in the protective layer 14 can be alleviated. The inorganic material can be, for example, silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), titanium oxide (TiO x ) and aluminum oxide (AlO x The organic material includes at least one selected from the group consisting of thermosetting resin compositions, photosensitive resin compositions, and the like. The photosensitive resin composition includes, for example, an ultraviolet-curable resin composition. Specific examples of the organic material include at least one selected from the group consisting of acrylic resins, polyimide resins, novolac resins, epoxy resins, norbornene resins, parylene resins, and the like.
[0070] The protective layer 14 preferably includes a deposition layer in which atomic layers are deposited. The deposition layer may be an ALD (Atomic Layer Deposition) layer. When the protective layer 14 includes a deposition layer, the effect of the protective layer 14 in suppressing moisture penetration can be improved. The protective layer 14 includes, for example, a metal oxide or a metal nitride. The metal oxide is, for example, aluminum oxide (AlO x ) or titanium oxide (TiO x Metal nitrides include, for example, titanium nitride (TiNx ) is included.
[0071] (Planarization Layer 15) The planarization layer 15 is provided on the first surface of the protective layer 14. The planarization layer 15 is an example of a first resin layer. The planarization layer 15 fills in the irregularities on the first surface of the protective layer 14, and can form a flat first surface on the upper side of the protective layer 14. The planarization layer 15 is translucent to the white light emitted from the light-emitting element 12. The planarization layer 15 includes, for example, at least one of an organic material and an inorganic material.
[0072] The organic material includes, for example, a cured product of a photosensitive resin composition. The photosensitive resin composition may include either a positive-type photosensitive resin composition or a negative-type photosensitive resin composition. Specific examples of the photosensitive resin composition include at least one selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, acrylic resin, phenolic resin, and siloxane resin. Examples of the inorganic material include the same materials as those of the protective layer 14.
[0073] (Color Filter 16) The color filter 16 is a so-called on-chip color filter (OCCF). The color filter 16 is provided above the plurality of light-emitting elements 12. More specifically, the color filter 16 is provided on the first surface of the planarization layer 15. The color filter 16 includes, for example, a plurality of colored layers 160R, a plurality of colored layers 160G, and a plurality of colored layers 160B. In the following description, when the colored layers 160R, 160G, and 160B are referred to collectively without any particular distinction, the colored layers 160R, 160G, and 160B may be simply referred to as colored layers 160.
[0074] The multiple colored layers 160 are two-dimensionally arranged on the first surface of the planarization layer 15 in a specified arrangement pattern. The specified arrangement pattern is as described above for the multiple sub-pixels 10. Each colored layer 160 is provided above a light-emitting element 12. The sub-pixel 10R is composed of the light-emitting element 12 and a colored layer 160R provided above the light-emitting element 12. The sub-pixel 10G is composed of the light-emitting element 12 and a colored layer 160G provided above the light-emitting element 12. The sub-pixel 10B is composed of the light-emitting element 12 and a colored layer 160B provided above the light-emitting element 12.
[0075] The coloring layer 160R has a red color. The coloring layer 160R transmits the red light component of the white light emitted from the light-emitting element 12, but can absorb visible light components other than red light. The coloring layer 160G has a green color. The coloring layer 160G transmits the green light component of the white light emitted from the light-emitting element 12, but can absorb visible light components other than green light. The coloring layer 160B has a blue color. The coloring layer 160B transmits the blue light component of the white light emitted from the light-emitting element 12, but can absorb visible light components other than blue light.
[0076] The colored layer 160R includes, for example, a red color resist, the colored layer 160G includes, for example, a green color resist, and the colored layer 160B includes, for example, a blue color resist.
[0077] (Planarization Layer 17) The planarization layer 15 is provided on the first surface of the color filter 16. The planarization layer 15 is an example of a second resin layer. The planarization layer 17 fills in the irregularities on the first surface of the color filter 16, and can form a flat first surface on the upper side of the color filter 16. The planarization layer 17 is translucent to the red light, green light, and blue light emitted from the color filter 16. Examples of materials for the planarization layer 17 include the same materials as those for the planarization layer 15.
[0078] (Lens Array 18) The lens array 18 is provided on the first surface of the planarization layer 17. The lens array 18 includes a plurality of lenses 181. The lenses 181 can focus, in a front direction, light L emitted upward from the light-emitting elements 12 and incident via the colored layer 160. The lenses 181 can also focus, in a front direction, light L that is emitted obliquely from the light-emitting elements 12, reflected by the side surfaces of the partition walls 19, and then incident thereon. The lenses 181 are convex lenses having a convex focusing surface on the side opposite to the light-emitting elements 12. The plurality of lenses 181 are so-called on-chip microlenses (OCLs) and are two-dimensionally arranged on the first surface of the planarization layer 17 in a specified arrangement pattern. The specified arrangement pattern is as described above for the specified arrangement pattern of the plurality of subpixels 10. The centers of the lenses 181 substantially coincide with the centers of the light-emitting regions of the light-emitting elements 12 in a planar view. A gap is provided between adjacent lenses 181. In the embodiment, an example will be described in which a gap is provided between adjacent lenses 181, but a gap does not necessarily have to be provided between adjacent lenses 181.
[0079] The light-collecting surface of the lens 181 preferably has a convex curved surface shape. Examples of convex curved surfaces include, but are not limited to, a substantially parabolic or substantially hemispherical shape. Here, the term "substantially parabolic or substantially hemispherical" does not necessarily mean a parabolic or hemispherical shape in the strict sense, but includes shapes that are visually perceived as being close to a parabolic or hemispherical shape. For example, this includes a parabolic or hemispherical shape that is distorted or deformed within the range of tolerance, error, etc.
[0080] The refractive index n of the lens 181 1 is the refractive index n of the sealing resin layer 20 2 The refractive index n of the lens 181 is higher than 1 is the refractive index n of the sealing resin layer 20 2 , the light L can be refracted and condensed at the interface between the lens 181 and the sealing resin layer 20. Therefore, the light extraction function can be improved.
[0081] The lens 181 includes, for example, an organic material or an inorganic material that is transparent to visible light. The organic material includes, for example, a cured product of a photosensitive resin composition such as an ultraviolet curable resin composition. The inorganic material includes, for example, silicon nitride (SiN x ) and silicon oxynitride (SiO x N y The lens 181 may contain a filler. By adjusting the content of the filler contained in the lens 181, the refractive index n 1 The filler may be a hollow filler. The filler may be an inorganic filler. The inorganic filler may be, for example, aluminum oxide (AlO x ), titanium oxide (TiO x ) and zirconium oxide (ZrO x ) and the like.
[0082] (Partition 19) The partition 19 is configured to be able to reflect light emitted from the light-emitting element 12 at its side surface. The partition 19 is approximately parallel to an axis (Z-axis) extending in the thickness direction of the display device 101. The cross-sectional shape of the partition 19 is a forward tapered shape. When the cross-sectional shape of the partition 19 is a forward tapered shape, the angle of incidence of light L incident on the side surface of the partition 19 from the light-emitting element 12 increases, making it easier for the light L to be totally reflected by the side surface of the partition 19. Therefore, the light L incident on the side surface of the partition 19 from the light-emitting element 12 is less likely to leak to adjacent sub-pixels 10, making it possible to suppress color mixing. Furthermore, since the amount of light taken in by the lens 181 can be increased, the efficiency of extracting light L in the front direction can be improved.
[0083] The partitions 19 are disposed between adjacent light-emitting elements 12 in a plan view. More specifically, for example, the partitions 19 are provided at least one of between the light-emitting elements 12 adjacent to each other in the X-axis direction and between the light-emitting elements 12 adjacent to each other in the Y-axis direction in a plan view. The partitions 19 may be provided so as to surround the light-emitting elements 12.
[0084] The partition wall 19 is preferably formed across the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17. By forming the partition wall 19 across a plurality of layers in this manner, the amount of light reflected by the side surface of the partition wall 19 can be increased.
[0085] The bottom of the partition wall 19 is preferably buried in the protective layer 14, which is the lowest of the stacked films on the plurality of light-emitting elements 12. This allows the bottom of the partition wall 19 to be located close to the light-emitting elements 12, making it difficult for light L emitted from the light-emitting elements 12 to leak from below the partition wall 19 to the adjacent sub-pixels 10.
[0086] The bottom of the partition wall 19 is preferably spaced apart from the second surface (the surface on the light-emitting element 12 side) of the protective layer 14. This makes it possible to prevent the OLED layer 122 from being exposed without being covered by the protective layer 14 between adjacent light-emitting elements 12. This makes it possible to prevent a decrease in the protective function of the protective layer 14 for the OLED layer 122. From the viewpoint of preventing a decrease in the protective function of the protective layer 14 for the OLED layer 122, the distance from the second surface of the protective layer 14 to the bottom of the partition wall 19 (the thickness of the protective layer 14 at the bottom of the partition wall 19) is preferably 0.5 μm or more.
[0087] The bottom of the partition wall 19 is preferably provided at a position that does not overlap with the light-emitting region of the light-emitting element 12 in a plan view. This makes it possible to prevent light L emitted from the light-emitting element 12 to the wide-angle side from being reflected by the bottom of the partition wall 19 and becoming stray light.
[0088] The top of the partition 19 is preferably located higher than the color filter 16 with respect to the light emitting element 12 , and more preferably coincides with the height of the bottom surface of the lens 181 included in the lens array 18 .
[0089] By positioning the top of the partition 19 at a position higher than the color filter 16 with respect to the light emitting element 12, light L emitted from the light emitting element 12 to the wide-angle side is less likely to leak from above the partition 19 to the adjacent sub-pixel 10, thereby suppressing color mixing. In addition, the amount of light taken into the lens 181 can be increased, thereby improving the efficiency of extracting light L in the front direction.
[0090] By making the top of the partition 19 coincident with the height of the bottom surface of the lens 181, light L emitted from the light-emitting element 12 to the wide-angle side is less likely to leak from above the partition 19 to the adjacent sub-pixel 10, and the following effect is also obtained: That is, the layer covering the light-collecting surface of the lens 181 is prevented from changing from the partition 19 to the sealing resin layer 20 midway, and deterioration of the function of the lens 181 can be suppressed.
[0091] The top of the partition 19 may be located between adjacent lenses 181 in a plan view. In this case, it is preferable that the top of the partition 19 be in contact with the sealing resin layer 20. This allows the top of the partition 19 to be set at a higher position relative to the light-emitting element 12, making it difficult for light L emitted from the light-emitting element 12 to the wide-angle side to leak from above the partition 19 to the adjacent sub-pixel 10, thereby suppressing color mixing.
[0092] Refractive index n of the partition 19 3 is preferably lower than the refractive index of any of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17 that are in contact with the side surface of the partition wall 19. In this case, light emitted from the light-emitting element 12 can be totally reflected at the interfaces between the partition wall 19 and each of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17.
[0093] Refractive index n of the partition 19 3 is the refractive index n of the sealing resin layer 20 2 The refractive index n of the partition wall 19 is preferably the same as 3 is the refractive index n of the sealing resin layer 20 2 If the thickness is the same as that of the insulating layer 101, the partition wall 19 and the sealing resin layer 20 can be formed from the same material, and therefore an increase in the number of types of materials required for manufacturing the display device 101 can be suppressed.
[0094] In order to suppress a decrease in brightness due to light absorption by the partition walls 19, the partition walls 19 preferably have a light-transmitting property with respect to the white light emitted from the light-emitting elements 12. However, the optical properties of the partition walls 19 are not limited thereto, and the partition walls 19 may have a light-non-transmitting property with respect to the white light emitted from the light-emitting elements 12.
[0095] The partition wall 19 includes an organic material or an inorganic material. The organic material includes, for example, a cured product of a photosensitive resin composition such as an ultraviolet curable resin composition. The inorganic material includes, for example, silicon nitride (SiN x ) and silicon oxynitride (SiO x N y The partition walls 19 may contain a filler. By adjusting the content of the filler contained in the partition walls 19, the refractive index n 3 The filler may be a hollow filler. The filler may be an inorganic filler. The inorganic filler may be, for example, aluminum oxide (AlO x ), titanium oxide (TiO x ) and zirconium oxide (ZrO x ) and the like.
[0096] (Encapsulating resin layer 20) The encapsulating resin layer 20 covers the lens array 18. The encapsulating resin layer 20 can protect each component, such as the plurality of light-emitting elements 12, from moisture, impact, and the like. The encapsulating resin layer 20 includes a cured product of an encapsulating resin composition. The encapsulating resin composition includes, for example, at least one selected from the group consisting of a thermosetting resin composition and a photosensitive resin composition. The photosensitive resin composition includes, for example, an ultraviolet-curable resin composition. The encapsulating resin layer 20 may be configured with a hard coat layer. In this case, the scratch resistance, weather resistance, and other properties of the display device 101 can be improved.
[0097] [Method of Manufacturing Display Device 101] (First Example of Method of Manufacturing Display Device 101) Hereinafter, a first example of a method of manufacturing the display device 101 according to an embodiment will be described with reference to FIGS. 8 to 10 .
[0098] (Step of Forming Planarization Layer 15) First, a photosensitive resin composition is applied to the first surface of the color filter 16 by, for example, spin coating, and the photosensitive resin composition is cured, thereby forming a planarization layer 17 on the first surface of the color filter 16, as shown in step (S1) of FIG.
[0099] (Step of Forming the Partition Wall 19) Next, as shown in step (S2) of FIG. 8, silicon nitride (SiN x ) layer 31a is formed.
[0100] 8, openings 31b are formed in the silicon nitride layer 31a in portions located above the portions between adjacent light emitting elements 12 by, for example, dry etching, thereby forming the hard mask 31.
[0101] Next, as shown in step (S4) of FIG. 9 , grooves 19a are formed above the portions between adjacent light-emitting elements 12 by sequentially processing the planarization layer 17, color filters 16, and planarization layer 15 through the hard mask 31. Dry etching, for example, is used as a method for processing the planarization layer 17, color filters 16, and planarization layer 15. The cross-sectional shape of the grooves 19a is a forward tapered shape. Here, the forward tapered shape refers to a shape in which the width of the grooves 19a narrows from the second surface (the surface on the light-emitting element 12 side) of the planarization layer 15 toward the first surface (the surface opposite the light-emitting element 12 side) of the planarization layer 17.
[0102] 9 , the bottom of the groove 19a is dug down by, for example, etch-back, so that the bottom of the groove 19a is positioned within the protective layer 14, and the hard mask 31 is removed. At this time, it is preferable that the processing of the groove 19a be stopped just before the second surface (the surface on the light-emitting element 12 side) of the protective layer 14. This makes it possible to prevent a decrease in the protective function of the protective layer 14 for the OLED layer 122.
[0103] Next, a photosensitive resin composition is applied to the first surface of the planarization layer 17, and the photosensitive resin composition is filled into the grooves 19a. The photosensitive resin composition is then cured by light irradiation. As a result, a low-refractive-index resin layer 19b is formed, filling the grooves 19a, as shown in step (S6) of FIG. 9 . It is preferable that the low-refractive-index resin layer 19b has a lower refractive index than any of the layers constituting the side surfaces of the grooves 19a: the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17. Next, as shown in step (S7) of FIG. 10 , the entire first surface of the low-refractive-index resin layer 19b is processed, for example, by etch-back, to expose the first surface of the planarization layer 17.
[0104] (Lens Array 18 Formation Process) Next, a photosensitive resin composition serving as a lens material is applied to the first surface of the planarization layer 17 and cured by light irradiation to form a photosensitive resin layer serving as a lens material layer. Next, the photosensitive resin layer is patterned, for example, by photolithography technology, to form a plurality of columns on the first surface of the planarization layer 17. Next, the plurality of columns are processed into a convex curved surface by, for example, reflow treatment (heat treatment) or etch-back. As a result, a plurality of lenses 181 are formed on the first surface of the planarization layer 17, as shown in step (S8) of FIG. 10 .
[0105] (Step of forming sealing resin layer 20) Next, an sealing resin composition is applied so as to cover the plurality of lenses 181, and then cured to form the sealing resin layer 20, as shown in step (S9) of Fig. 10. Through the above steps, the display device 101 according to one embodiment is obtained.
[0106] (Second Example of Method for Manufacturing Display Device 101) Hereinafter, a second example of the method for manufacturing the display device 101 according to an embodiment will be described with reference to FIGS.
[0107] (Step of Forming Protective Layer 14) First, as shown in step (S1) of FIG. 11, the protective layer 14 is formed on the first surface of the second electrode 123 by, for example, CVD.
[0108] (Step of Forming Partition Wall 19) Next, a resist layer is formed on the first surface of protective layer 14, and then the resist layer is pattern-exposed and developed. As a result, as shown in step (S2) of FIG. 11 , resist pattern 32 having openings 32 a above the portions between adjacent light-emitting elements 12 is formed on the first surface of protective layer 14.
[0109] Next, as shown in step (S3) of FIG. 11 , the protective layer 14 is processed through the resist pattern 32 to form grooves 14a above the portions between adjacent light-emitting elements 12. For example, dry etching is used as a method for processing the protective layer 14. The cross-sectional shape of the grooves 14a is a forward tapered shape. Here, the forward tapered shape refers to a shape in which the width of the grooves 19a narrows from the first surface (the surface on the light-emitting element 12 side) of the protective layer 14 toward the second surface (the surface opposite the light-emitting element 12 side). Next, the resist pattern 32 is removed from the first surface of the protective layer 14.
[0110] Next, a photosensitive resin composition is applied to the first surface of protective layer 14, and grooves 14a are filled with the photosensitive resin composition. The photosensitive resin composition is then cured by light irradiation, thereby forming low-refractive-index resin layer 19c, as shown in step (S4) of Fig. 11. The low-refractive-index resin layer 19c preferably has a refractive index lower than that of protective layer 14 that forms the side surfaces of grooves 14a.
[0111] Next, a resist layer is formed on the first surface of the low-refractive-index resin layer 19c, and the resist layer is pattern-exposed and then developed, thereby forming a resist pattern 33 having openings 33a above the portions between adjacent light-emitting elements 12 on the first surface of the low-refractive-index resin layer 19c, as shown in step (S5) of FIG.
[0112] Next, as shown in step (S6) of FIG. 12 , the low-refractive-index resin layer 19c is processed through the resist pattern 33 to expose the protective layer 14, thereby forming grooves 19d above each light-emitting element 12. Processing conditions are controlled so that the side surfaces of the grooves 14a and 19d are substantially aligned. This results in the formation of partition walls 19 above the portions between adjacent light-emitting elements 12. Dry etching, for example, is used as a method for processing the low-refractive-index resin layer 19c. The grooves 19d have an inverse tapered shape. Here, the inverse tapered shape refers to a shape in which the width of the grooves 19d increases from the first surface (the surface facing the light-emitting element 12) of the low-refractive-index resin layer 19c toward the second surface (the surface opposite the light-emitting element 12). Next, the resist pattern 33 is removed from the tops of the partition walls 19.
[0113] (Step of Forming Planarization Layer 15) Next, a photosensitive resin composition is applied, for example, by an inkjet method, to the bottom of groove 19 d where sub-pixel 10R is to be formed, the bottom of groove 19 d where sub-pixel 10G is to be formed, and the bottom of groove 19 d where sub-pixel 10B is to be formed. Next, the photosensitive resin composition is irradiated with ultraviolet light and cured, thereby forming planarization layer 15.
[0114] (Process for Forming Color Filter 16) Next, red, green, and blue color resists are applied, for example, by inkjet printing, to the bottoms of the grooves 19d where the sub-pixels 10R, 10G, and 10B are to be formed, respectively. Next, the resists of each color are irradiated with ultraviolet light and cured. As a result, as shown in step (S7) of FIG. 12 , a red colored layer 160R, a green colored layer 160G, and a blue colored layer 160B are formed in the grooves 19d where the sub-pixels 10R, 10G, and 10B are to be formed, respectively. That is, the color filter 16 is formed on the first surface of the planarization layer 15.
[0115] (Step of Forming Planarization Layer 17) Next, a photosensitive resin composition is applied to the first surface of the color filter 16 by, for example, spin coating, and the photosensitive resin composition is filled into each groove 19d. Next, the photosensitive resin composition is irradiated with ultraviolet light and cured, thereby forming the planarization layer 17, as shown in step (S8) of Fig. 13. Next, the entire first surface of the planarization layer 17 is processed by, for example, etch-back, to expose the tops of the partition walls 19, as shown in step (S9) of Fig. 13.
[0116] (Step of forming lens array 18 and step of forming sealing resin layer 20) The step of forming lens array 18 and step of forming sealing resin layer 20 are the same as those in the first example of the manufacturing method of display device 101, and therefore descriptions thereof will be omitted. Through the above steps, the display device 101 according to one embodiment is obtained.
[0117] [Effects] In the display device 101 according to an embodiment, the partition 19 is disposed between adjacent light-emitting elements 12 in a planar view and extends over the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17. As a result, as shown in FIG. 6 , the wide-angle component of light L emitted from the OLED layer 122 is totally reflected at the interfaces between the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17 and the partition 19. The totally reflected wide-angle component of light L enters the lens 181 of the sub-pixel 10, which is the pixel of interest, and is collected by the lens 181 in the forward direction. Furthermore, in the display device 101 according to an embodiment, the cross-sectional shape of the partition 19 is forward tapered. Therefore, the angle of incidence of light L incident on the side surface of the partition 19 from the light-emitting element 12 increases, making the light L more likely to be totally reflected by the side surface of the partition 19. This improves light leakage between the sub-pixels 10 and light-collection characteristics. Therefore, it is possible to suppress color mixing (color crosstalk) and improve the efficiency of extracting light L in the front direction. Furthermore, by improving the efficiency of extracting light L in the front direction, it is also possible to improve the luminous efficiency.
[0118] In the display device disclosed in Patent Document 1, the separator is formed only in the protective layer, and the cross-sectional shape of the separator is rectangular. Therefore, it is difficult to sufficiently suppress light leakage between adjacent light-emitting elements 12, and there is room for improvement. On the other hand, in the display device according to one embodiment, the partition 19 is formed across the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17, and the cross-sectional shape of the partition 19 is forward tapered. This can reduce light leakage between adjacent light-emitting elements 12.
[0119] <4. Modifications> [Modification 1] In one embodiment, the refractive index n 3 is the refractive index n of the sealing resin layer 20 2 However, the refractive index n 3 and the refractive index n of the sealing resin layer 20 2 The relationship is not limited to this example, and may be, for example, 3 is the refractive index n of the sealing resin layer 20 2 In this case, as shown in FIG. 14, the light L emitted from the light emitting element 12 can be refracted at the interface between the top of the partition wall 19 and the sealing resin layer 20, and the light beam can be bent in the front direction. Therefore, the front brightness of the display device 101 can be further improved. In FIG. 14, the light L0 is refracted at the refractive index n 3 is the refractive index n of the sealing resin layer 20 2 This represents the light when it is the same as
[0120] [Modification 2] In the embodiment, an example has been described in which the display device 101 includes the lens array 18. However, the lens array 18 is not an essential component, and the display device 101 does not need to include the lens array 18. In this case, the display device 101 does not need to include the second planarization layer.
[0121] [Modification 3] In the embodiment, an example has been described in which the display device 101 includes the planarization layer 15 and the planarization layer 17. However, the planarization layer 15 and the planarization layer 17 are not essential components, and the display device 101 does not necessarily have to include at least one of the planarization layer 15 and the planarization layer 17.
[0122] [Variation 4] The partitions 19 may be arranged only between adjacent light-emitting elements 12 included in a predetermined region of the display region RE1. For example, the partitions 19 may be arranged between adjacent light-emitting elements 12 included in a central region (first region) of the display region RE1, but may not be arranged between adjacent light-emitting elements 12 included in a peripheral region (second region) of the display region RE1.
[0123] In the central region of the display region RE1, the center of the lens 181 may be approximately aligned with the center of the light-emitting region of the light-emitting element 12 in a plan view. On the other hand, in the peripheral region of the display region RE1, the center of the lens 181 may be shifted toward the outer periphery of the display region RE1 in a plan view with respect to the center of the light-emitting region of the light-emitting element 12. In this case, the CRA (Chief Ray Angle) of the central region of the display region RE1 is set to 0°, whereas the CRA of the peripheral region of the display region RE1 is set to a predetermined angle θ.
[0124] In the central region of the display region RE1, the center of the colored layer 160 may be approximately aligned with the center of the light-emitting region of the light-emitting element 12 in a planar view. On the other hand, in the peripheral region of the display region RE1, the center of the colored layer 160 may be shifted toward the outer periphery of the display region RE1 in a planar view with respect to the center of the light-emitting region of the light-emitting element 12. In this case, the CRA in the central region of the display region RE1 is set to 0°, whereas the CRA in the peripheral region of the display region RE1 is set to a predetermined angle θ.
[0125] [Modification 5] In one embodiment, the refractive index n 3 is lower than the refractive index of any of the layers in contact with the side surfaces of the partition wall 19, namely, the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17. However, the refractive index n 3 and the refractive indexes of the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17 that are in contact with the side surfaces of the partition wall 19 are not limited to this example. 3may be lower than the refractive index of at least one of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17 that are in contact with the side surface of the partition wall 19. In this case, the light L emitted from the light emitting element 12 to the wide-angle side can be totally reflected at the interface between the partition wall 19 and at least one of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17.
[0126] [Variation 6] In the embodiment, an example has been described in which the partition wall 19 is formed across the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17. However, the configuration of the partition wall 19 is not limited to this example. For example, the partition wall 19 may be formed across at least two layers selected from the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17.
[0127] [Variation 7] The display device 101 may further include a substrate. The substrate may be provided on the first surface of the sealing resin layer 20. In this case, the sealing resin layer 20 may function as an adhesive layer that bonds the lens array 18 to the substrate. The substrate seals the first surface of the drive substrate 11 on which the plurality of light emitting elements 12 and the like are provided. The substrate is translucent to the light L of each color emitted from the color filter 16. The substrate is, for example, a glass substrate.
[0128] [Modification 8] From the viewpoint of improving light extraction efficiency and / or improving color purity, the light emitting element 12 may have a resonator structure.
[0129] When the first electrode 121 is a reflective electrode that functions as a reflective layer, a resonator structure may be formed by the first electrode 121 and the second electrode 123. In this case, the optical distance between the first electrode 121 and the second electrode 123 may be set by the thickness of the OLED layer 122, by selecting the material of the first electrode 121, or by a combination of these.
[0130] When the first electrode 121 is a transparent electrode, a reflective layer may be provided below the transparent electrode, and a resonator structure may be formed by the reflective layer and the second electrode 123. In this case, the optical distance between the reflective layer and the second electrode 123 may be set by the thickness of the OLED layer 122, by selecting the material of the reflective layer, by the thickness of an insulating layer provided between the first electrode 121 (transparent electrode) and the reflective layer, or by a combination of two or more of these.
[0131] [Variation 9] In the embodiment, an example has been described in which the display device 101 includes a plurality of light-emitting elements 12 capable of emitting white light and a color filter 16, and a combination of these elements is capable of displaying a color image. However, the colorization method of the display device 101 is not limited to this. For example, instead of the plurality of light-emitting elements 12 capable of emitting white light, the display device 101 may include a plurality of light-emitting elements capable of emitting red light, a plurality of light-emitting elements capable of emitting green light, and a plurality of light-emitting elements capable of emitting blue light. In this case, the color filter is not an essential component and may or may not be included.
[0132] The light-emitting element capable of emitting light of a predetermined color (red light, green light, or blue light) is, for example, (1) a light-emitting element including a light-emitting layer capable of emitting light of a predetermined color (red light, green light, or blue light); (2) a light-emitting element including a light-emitting layer capable of emitting white light and capable of resonating and emphasizing light of a predetermined wavelength (red light, green light, or blue light) contained in the white light emitted by the light-emitting layer using a resonator structure; or (3) a light-emitting element including a light-emitting layer capable of emitting light of a predetermined color (red light, green light, or blue light) and capable of resonating and emphasizing light of a predetermined wavelength contained in the light of a predetermined color emitted by the light-emitting layer using a resonator structure.
[0133] [Modification 10] In the embodiment, an example in which the color filter 16 is provided has been described, but a quantum dot layer may be provided instead of the color filter 16, or a quantum dot layer may be provided together with the color filter 16. The quantum dot layer is a color conversion layer that contains quantum dots (semiconductor particles) and can convert the color of the light L emitted from the plurality of light-emitting elements 12. In this case, the plurality of light-emitting elements 12 may be configured to emit blue light.
[0134] [Modification 11] In the embodiment, an example in which the light-emitting element 12 is an OLED element has been described, but the light-emitting element is not limited to this example and may be, for example, a self-luminous light-emitting element such as an LED (Light Emitting Diode) element, an inorganic electroluminescence (IEL) element, a quantum dot light-emitting diode (QLED) element, or a semiconductor laser element. Two or more types of light-emitting elements may be provided in the display device 101.
[0135] [Other Modifications] Above, one embodiment of the present disclosure and its modification examples (hereinafter referred to as "one embodiment, etc.") have been specifically described, but the present disclosure is not limited to one embodiment, etc., and various modifications based on the technical ideas of the present disclosure are possible.
[0136] For example, the configurations, methods, steps, shapes, materials, and numerical values given in one embodiment are merely examples, and different configurations, methods, steps, shapes, materials, and numerical values may be used as necessary.
[0137] The configurations, methods, steps, shapes, materials, numerical values, etc. of the embodiments may be combined with one another without departing from the spirit of the present disclosure.
[0138] Unless otherwise specified, the materials exemplified in the embodiments and the like can be used singly or in combination of two or more.
[0139] Two or more of the configurations of Modifications 1 to 10 can be combined.
[0140] The present disclosure may also employ the following configurations. (1) A display device comprising: a plurality of light-emitting elements arranged two-dimensionally; a plurality of layers stacked on the plurality of light-emitting elements; and a partition wall disposed between adjacent light-emitting elements in a planar view and extending across two or more layers included in the plurality of layers, wherein the cross-sectional shape of the partition wall includes a forward tapered shape. (2) The display device according to (1), wherein the refractive index of the partition wall is lower than the refractive index of the two or more layers. (3) The display device according to (1) or (2), wherein the plurality of layers include a protective layer, a color filter, and a sealing resin layer, in that order, on the plurality of light-emitting elements. (4) The display device according to (3), wherein the two or more layers include the protective layer and the color filter. (5) The display device according to (1) or (2), wherein the plurality of layers include a protective layer, a first resin layer, a color filter, and a sealing resin layer, in that order, on the plurality of light-emitting elements. (6) The display device according to (5), wherein the two or more layers include the protective layer, the first resin layer, and the color filter. (7) The display device according to (1) or (2), wherein the plurality of layers include a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and a sealing resin layer, in that order, on the plurality of light-emitting elements. (8) The display device according to (7), wherein the two or more layers include the protective layer, the first resin layer, the color filter, and the second resin layer. (9) The display device according to any one of (3) to (8), wherein the refractive index of the partition is the same as the refractive index of the sealing resin layer. (10) The display device according to any one of (3) to (8), wherein the sealing resin layer is in contact with a top of the partition, and the refractive index of the partition is lower than the refractive index of the sealing resin layer. (11) The display device according to any one of (3) to (10), wherein the top of the partition is located at a higher position than the color filter relative to the light-emitting elements. (12) The display device according to any one of (3) to (11), wherein the plurality of light-emitting elements include an organic-matter-containing layer including an organic light-emitting layer, the organic-matter-containing layer is connected between adjacent light-emitting elements, and a bottom of the partition is buried in the protective layer.(13) The display device according to (12), wherein the protective layer has a surface on the light-emitting element side, and wherein a bottom of the partition is spaced from the surface. (14) The display device according to (7) or (8), wherein a height of a top of the partition matches a height of a bottom of a lens included in the lens array. (15) The display device according to any one of (1) to (14), wherein a bottom of the partition is provided at a position that does not overlap with a light-emitting region of the light-emitting element in the plan view. (16) An electronic device including the display device according to any one of (1) to (15).
[0141] <5. Examples of Leakage Suppression Structure> The OLED layer 122 of the display device 101 according to an embodiment and the like is connected between adjacent light-emitting elements 12 in the in-plane direction of the first surface of the drive substrate 11, and is a layer common to the plurality of light-emitting elements 12. For this reason, in the display device 101 according to an embodiment and the like, there is a risk of current leakage occurring between adjacent light-emitting elements 12. Below, examples of leakage suppression structures for suppressing such current leakage between the light-emitting elements 12 will be described. Note that in the following first to seventh examples, examples will be described in which the OLED layer 122 has two light-emitting units U1 and U2.
[0142] (Leakage Suppression Structure: First Example) Fig. 15 is a cross-sectional view of a first example of the leakage suppression structure. Note that in Fig. 15, layers above the second electrode 123 are not shown. Similarly, in the cross-sectional views for explaining the leakage suppression structures of the second to ninth examples, layers above the second electrode 123 are not shown.
[0143] The insulating layer 13 has openings 13a above each first electrode 121, and covers the periphery of the first surface of the first electrode 121 and the side surfaces (end surfaces) of the first electrodes 121. Specifically, the insulating layer 13 has side wall portions 13b and extension portions 13c. The side wall portions 13b are erected perpendicular to the first surface of the drive substrate 11 and cover the side surfaces of the first electrodes 121. The extension portions 13c extend from the upper ends of the inner circumferential surfaces of the side wall portions 13b toward the center of the first surface of the first electrodes 121 and cover the periphery of the first surfaces of the first electrodes 121.
[0144] The inner periphery of the opening 13a in the insulating layer 13 has a canopy-like protruding portion 132b that protrudes toward the center of the opening 13a. The protruding portion 132b is spaced apart from the first surface of the first electrode 121. The protruding portion 132b is preferably provided around the entire periphery of the opening 13a, but may be provided on a portion of the entire periphery of the opening 13a.
[0145] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are disconnected or made highly resistant by the overhanging portion 132b (region A shown in FIG. 15 ). This makes it possible to suppress current leakage between adjacent light-emitting elements 12. Here, "high resistance" refers to the light-emitting unit U1 and the charge generation layer 1227 becoming extremely thin at the overhanging portion 132b, resulting in high resistance. The disconnection or high resistance of the light-emitting unit U1 and the charge generation layer 1227 caused by the overhanging portion 132b can occur due to the shadowing effect of the overhanging portion 132b during film formation of the OLED layer 122. A gap 132c may be formed between the overhanging portion 132b and the first electrode 121.
[0146] The insulating layer 13 has a first insulating layer 131 and a second insulating layer 132, which are arranged in this order on the first surface of the drive substrate 11 and the first surface of the first electrode 121. The first insulating layer 131 has a plurality of first openings 131a. The second insulating layer 132 has a plurality of second openings 132a. The opening 13a is composed of overlapping first openings 131a and second openings 132a. The inner periphery of the second opening 132a in the second insulating layer 132 protrudes further inward from the opening 13a than the inner periphery of the first opening 131a in the first insulating layer 131, forming a protruding portion 132b.
[0147] 16 is a cross-sectional view of a second example of the leakage suppression structure. The second example differs from the first example in that the insulating layer 13 includes a third insulating layer 133 in addition to the first insulating layer 131 and the second insulating layer 132.
[0148] The third insulating layer 133 is provided between the drive substrate 11 and the first insulating layer 131, and between the first electrode 121 and the first insulating layer 131. The third insulating layer 133 has a third opening 133a on the first surface of the first electrode 121. In the second example, the opening 13a is composed of a first opening 131a, a second opening 132a, and a third opening 133a that are overlapped with each other. The inner periphery of the third opening 133a protrudes further inward than the inner periphery of the first opening 131a. A gap 132c may be formed between the protruding portion 132b and the third insulating layer 133.
[0149] (Leakage Suppression Structure: Third and Fourth Examples) In the first and second examples, examples have been described in which the inner periphery of the opening 13a in the insulating layer 13 has one protruding portion 132b. However, the number of protruding portions that the inner periphery of the opening 13a in the insulating layer 13 has is not limited to these examples, and the inner periphery of the opening 13a in the insulating layer 13 may have two or more protruding portions. Below, an example (third example) in which the inner periphery of the opening 13a in the insulating layer 13 has two protruding portions and an example (fourth example) in which the inner periphery of the opening 13a in the insulating layer 13 has three protruding portions will be described.
[0150] 17 is a cross-sectional view of a third example of the leakage suppression structure. The third example differs from the second example in that insulating layer 13 has fourth insulating layer 134 and fifth insulating layer 135, in that order, on the first surface of second insulating layer 132, and that the inner periphery of opening 13a in insulating layer 13 has two eave-like protrusions 132b and 135b.
[0151] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portion 132b and the overhanging portion 135b. The overhanging portion 135b is provided at a higher position than the overhanging portion 132b with respect to the first surface of the first electrode 121, and is spaced apart from the first surface of the second insulating layer 132. The overhanging portion 135b is set back more away from the center of the opening 13a than the overhanging portion 132b.
[0152] The fourth insulating layer 134 has a fourth opening 134a. The fifth insulating layer 135 has a fifth opening 135a. In the third example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, and a fifth opening 135a that are overlapping each other. The inner periphery of the fourth opening 134a is recessed in a direction away from the center of the opening 13a relative to the inner peripheries of the second opening 132a and the fifth opening 135a. The inner periphery of the fifth opening 135a protrudes more inward from the opening 13a than the fourth opening 134a, forming a protruding portion 135b.
[0153] 18 is a cross-sectional view of a fourth example of the leakage suppression structure. The fourth example differs from the third example in that insulating layer 13 has sixth insulating layer 136 and seventh insulating layer 137 in this order on the first surface of fifth insulating layer 135, and the inner periphery of opening 13a in insulating layer 13 has three eave-like protrusions 132b, 135b, and 137b.
[0154] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portion 132b, the overhanging portion 135b, and the overhanging portion 137b. The overhanging portion 137b is provided at a higher position than the overhanging portion 135b with respect to the first surface of the first electrode 121, and is spaced apart from the first surface of the fifth insulating layer 135. The overhanging portion 137b is set back more away from the center of the opening 13a than the overhanging portion 135b.
[0155] The sixth insulating layer 136 has a sixth opening 136a. The seventh insulating layer 137 has a seventh opening 137a. In the fourth example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, a fifth opening 135a, a sixth opening 136a, and a seventh opening 137a, which are all overlapping each other. The inner periphery of the sixth opening 136a is recessed in a direction away from the center of the opening 13a from the inner peripheries of the fifth opening 135a and the seventh opening 137a. The inner periphery of the seventh opening 137a protrudes inward from the sixth opening 136a, forming a protruding portion 137b.
[0156] 19 is a cross-sectional view of a fifth example of a leakage suppression structure. The fifth example differs from the second example in that insulating layer 13 includes first insulating layer 131, second insulating layer 132, and third insulating layer 133, as well as eighth insulating layer 138, and that the inner periphery of opening 13a in insulating layer 13 includes two eave-shaped protrusions 132b and 133b.
[0157] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portion 132b and the overhanging portion 133b. The overhanging portion 133b overhangs more inwardly of the opening 13a than the overhanging portion 132b. The overhanging portion 133b is located at a lower position than the overhanging portion 132b with respect to the first surface of the first electrode 121. The overhanging portion 133b is spaced apart from the first surface of the first electrode 121.
[0158] The eighth insulating layer 138 is provided between the drive substrate 11 and the third insulating layer 133, and between the first electrode 121 and the third insulating layer 133. The eighth insulating layer 138 has an eighth opening 138a. In the fifth example, the opening 13a is composed of a first opening 131a, a second opening 132a, a third opening 133a, and an eighth opening 138a, which are overlapped with each other. The inner periphery of the third opening 133a in the third insulating layer 133 protrudes further inward from the opening 13a than the inner periphery of the eighth opening 138a in the eighth insulating layer 138, thereby forming a protruding portion 133b.
[0159] (Leakage Suppression Structure: Sixth Example) Figure 20 is a cross-sectional view of a sixth example of a leakage suppression structure. The sixth example differs from the first example in that the insulating layer 13 has a protruding portion 13b1 on the outer periphery of the side wall portion 13b instead of having a protruding portion 132b on the inner periphery of the opening 13a. Although Figure 20 shows an example in which the insulating layer 13 has a single-layer structure, it may also have a laminated structure of two or more layers.
[0160] The protruding portion 13b1 protrudes outward from the outer periphery of the side wall portion 13b. A recess 13b2 is provided at a position a predetermined distance below the upper end of the outer periphery of the side wall portion 13b. By providing the recess 13b2 on the outer periphery of the side wall portion 13b in this manner, the protruding portion 13b1 is configured at the upper end of the outer periphery of the side wall portion 13b. The protruding portion 13b1 and the recess 13b2 are preferably provided around the entire periphery of the side wall portion 13b, but may be provided on a portion of the entire periphery of the side wall portion 13b.
[0161] The light-emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or made highly resistant by the protruding portion 132b (area A shown in FIG. 20 ), which makes it possible to suppress current leakage between adjacent light-emitting elements 12.
[0162] In the sixth example, the outer periphery of the side wall portion 13b has one protrusion 13b1 and one recess 13b2. However, the number of protrusions 13b1 and recesses 13b2 on the outer periphery of the side wall portion 13b is not limited to this example, and the outer periphery of the side wall portion 13b may have two or more protrusions 13b1 and two or more recesses 13b2. In this case, the two or more recesses 13b2 may be arranged sequentially at a predetermined distance from the upper end to the lower end of the outer periphery of the side wall portion 13b.
[0163] (Leakage Suppression Structure: Seventh Example) Fig. 21 is a cross-sectional view of a seventh example of the leakage suppression structure. A groove 13Gv is provided between adjacent light-emitting elements 12. The groove 13Gv may be provided between light-emitting elements 12 adjacent in a predetermined direction (e.g., the Y-axis direction), or may be provided so as to surround the light-emitting element 12. The groove 13Gv is formed across the insulating layer 13 and the insulating layer 112.
[0164] The light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the groove 13Gv. This makes it possible to suppress current leakage between adjacent light-emitting elements 12. Here, "high resistance" means that the light-emitting unit U1 and the charge generation layer 1227 have extremely thin film thicknesses within the groove 13Gv, thereby making them highly resistant, as shown in FIG. 22 . Of the layers included in the OLED layer 122, the light-emitting unit U2 located above the charge generation layer 1227 straddles the groove 13Gv.
[0165] (Leakage Suppression Structure: Eighth Example) FIG. 23 is a cross-sectional view of an eighth example of the leakage suppression structure. A plurality of wirings 112a, a plurality of contact plugs 112b, and a plurality of contact electrodes 112c are provided in the insulating layer 112. Each contact plug 112b electrically connects the first electrode 121 and the wiring 112a. A groove 13Gv is provided between adjacent light-emitting elements 12. The bottom surface of the groove 13Gv is formed by the first surface of the contact electrode 112c. An auxiliary electrode 112d is provided on the side surface of each groove 13Gv. The auxiliary electrode 112d is in contact with the first surface of the contact electrode 112c.
[0166] The OLED layer 122 is cut by the grooves 13Gv. While FIG. 23 shows an example in which the second electrode 123 is also cut by the grooves 13Gv, the second electrode 123 may not be cut by the grooves 13Gv and may be connected between adjacent light-emitting elements 12. The second electrode 123 is in contact with the auxiliary electrode 112d on the side surface of the groove 13Gv. The second electrode 123 is in contact with the contact electrode 112c on the bottom surface of the groove 13Gv. A protective layer 14 may be provided on the first surface of the second electrode 123 so as to follow the shape of the second electrode 123.
[0167] In the eighth example, the leakage current between adjacent light emitting elements 12 can be drawn into the auxiliary electrode 112d and the contact electrode 112c. Therefore, the current leakage between adjacent light emitting elements 12 can be suppressed.
[0168] (Leakage Suppression Structure: Ninth Example) Fig. 24 is a cross-sectional view of a ninth example of the leakage suppression structure. In the ninth example, the display device 101 includes a plurality of third electrodes 124. The plurality of third electrodes 124 are provided on the second surface side of the OLED layer 122, similar to the plurality of first electrodes 121. Each third electrode 124 is disposed between adjacent first electrodes 121.
[0169] 25 is a plan view illustrating the arrangement of the first electrodes 121 and the third electrodes 124. The multiple third electrodes 124 are a group of island-shaped electrodes having a smaller area than the first electrodes 121. The multiple third electrodes 124 are regularly arranged so as to be equally spaced from adjacent first electrodes 121 in a plan view. From another perspective, the multiple third electrodes 124 are arranged at a predetermined distance from each first electrode 121 and so as to surround it in a plan view.
[0170] A plurality of wirings 112a, a plurality of wirings 112e, a plurality of contact plugs 112b, and a plurality of contact plugs 112f are provided in the insulating layer 112. Each contact plug 112b electrically connects the first electrode 121 to the wiring 112a. Each contact plug 112f electrically connects the third electrode 124 to the wiring 112e.
[0171] The plurality of third electrodes 124 are connected to the internal circuitry of the display device 101 via contact plugs 112 f, wiring 112 e, etc., and are set to a common constant potential. Specifically, when a voltage is applied to the OLED layer 122, the potential of the third electrodes 124 is set to be smaller than the sum of the potential of the second electrodes 123 and the threshold voltage for the OLED layer 122. As a result, even if a voltage is applied to the OLED layer 122 by the first electrodes 121 and the second electrodes 123, causing a leakage current from the first electrodes 121, the leakage current flows preferentially to the third electrodes 124. This prevents a leakage current from flowing from a first electrode 121 to an adjacent first electrode 121.
[0172] (Leakage Suppression Structure: Other Examples) In the first to seventh examples, the OLED layer 122 has two light-emitting units U1 and U2. However, the configuration of the OLED layer 122 is not limited to these examples, and the OLED layer 122 may have a single light-emitting unit U, or may have three or more light-emitting units U.
[0173] In the first to seventh examples, the light-emitting unit U1 and the charge generation layer 1227 included in the OLED layer 122 are cut or made highly resistant by the overhanging portions 132b, 133b, 135b, 137b, and 13b1 and the grooves 13Gv (hereinafter referred to as "overhanging portions 132b and grooves 13Gv, etc."). However, the layers that are cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc. are not limited to these examples. For example, the hole injection layer 1221 or the hole transport layer 1222 included in the OLED layer 122 may be cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc., or both the hole injection layer 1221 and the hole transport layer 1222 included in the OLED layer 122 may be cut or made highly resistant by the overhanging portions 132b and grooves 13Gv, etc. When the OLED layer 122 has three or more light-emitting units U, two or more light-emitting units U and two or more charge generating layers 1227 included in the OLED layer 122 may be cut or made highly resistant by the protrusion 132b and the groove 13Gv, etc.
[0174] 6. Example of Resonator Structure The subpixel 10 included in the display device 101 according to an embodiment or the like may be configured to have a resonator structure that resonates light generated by the light-emitting element 12. The resonator structure will be described below with reference to the drawings. In the following description, the first surface of each layer may be referred to as the upper surface.
[0175] (Resonator Structure: First Example) Fig. 26A is a schematic cross-sectional view illustrating a first example of a resonator structure. In the following description, when the light-emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to collectively without any particular distinction, these light-emitting elements may be referred to as light-emitting elements 12. When the light-emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to separately, these light-emitting elements may be referred to as light-emitting elements 12. R , 12 G , 12 B The portions of the OLED layer 122 corresponding to the sub-pixels 10R, 10G, and 10B are called the OLED layer 122 R , OLED layer 122 G , OLED layer 122 B This is what happens.
[0176] In the first example, the first electrode 121 is formed to have a common film thickness in each light emitting element 12. The same is true for the second electrode 123.
[0177] A reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. In the following description, the optical adjustment layers 72 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as the optical adjustment layers 72. R , 72 G , 72 B This is what happens.
[0178] The reflector 71 is formed to have a common film thickness for each light-emitting element 12. The film thickness of the optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. R , 72 G , 72 B By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.
[0179] In the example shown in FIG. 26A, the light emitting element 12 R , 12 G , 12 BAs described above, the film thickness of the optical adjustment layer 72 differs depending on the color to be displayed by the sub-pixel, so the position of the upper surface of the second electrode 123 is aligned with the light emitting element 12. R , 12 G , 12 B It varies depending on the type of
[0180] The reflector 71 can be made of a metal such as aluminum (Al), silver (Ag), or copper (Cu), or an alloy containing any of these as its main component.
[0181] The optical adjustment layer 72 is made of silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y The optical adjustment layer 72 may be formed using an inorganic insulating material such as acrylic resin or polyimide resin, or an organic resin material such as acrylic resin or polyimide resin. The optical adjustment layer 72 may be a single layer or a laminated film made of a plurality of these materials. The number of laminated layers may vary depending on the type of light-emitting element 12.
[0182] The first electrode 121 can be formed using a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO).
[0183] The second electrode 123 needs to function as a semi-transmissive reflective film. The second electrode 123 can be formed using magnesium (Mg) or silver (Ag), a magnesium-silver alloy (MgAg) containing these as main components, or an alloy containing an alkali metal or an alkaline earth metal.
[0184] (Resonator Structure: Second Example) FIG. 26B is a schematic cross-sectional view for explaining a second example of the resonator structure.
[0185] In the second example, the first electrode 121 and the second electrode 123 are also formed to have the same film thickness in each light emitting element 12 .
[0186] Also in the second example, a reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. As in the first example, the reflector 71 is formed to have the same film thickness for each light-emitting element 12, and the film thickness of the optical adjustment layer 72 differs depending on the color to be displayed by the sub-pixel.
[0187] In the first example shown in FIG. 26A, the light emitting element 12 R , 12 G , 12 B The upper surfaces of the reflectors 71 are aligned, and the upper surface of the second electrode 123 is positioned so that the light emitting element 12 R , 12 G , 12 B It differed depending on the type of
[0188] In contrast, in the second example shown in FIG. 26B, the upper surface of the second electrode 123 is R , 12 G , 12 B In order to align the upper surfaces of the second electrodes 123, the light emitting elements 12 R , 12 G , 12 B The upper surface of the reflector 71 is R , 12 G , 12 B Therefore, the lower surface of the reflector 71 (in other words, the upper surface of the base layer (insulating layer) 73) has a stepped shape according to the type of the light emitting element 12.
[0189] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.
[0190] 27A is a schematic cross-sectional view illustrating a third example of the resonator structure. In the following description, the reflectors 71 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as the reflectors 71. R , 71 G , 71 B This is what happens.
[0191] In the third example, the first electrode 121 and the second electrode 123 are also formed to have the same film thickness in each light emitting element 12 .
[0192] Also in the third example, a reflector 71 is disposed below the first electrode 121 of the light-emitting element 12, with an optical adjustment layer 72 sandwiched therebetween. A resonator structure that resonates the light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. As in the first and second examples, the film thickness of the optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. As in the second example, the position of the upper surface of the second electrode 123 is located above the first electrode 121 of the light-emitting element 12. R , 12 G , 12 B are arranged to align.
[0193] In the second example shown in FIG. 27B, the lower surface of the reflector 71 has a stepped shape according to the type of light emitting element 12 in order to align the upper surface of the second electrode 123 .
[0194] In contrast, in the third example shown in FIG. 27A, the film thickness of the reflector 71 is R , 12 G , 12 B More specifically, the reflector 71 is set to have a different reflecting surface depending on the type of the reflector 71. R , 71 G , 71 B The film thickness is set so that the bottom surfaces of the
[0195] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.
[0196] 27B is a schematic cross-sectional view illustrating a fourth example of the resonator structure. In the following description, the first electrodes 121 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as the first electrodes 121. R , 121 G , 121 B This is what happens.
[0197] 27A , the first electrodes 121 and second electrodes 123 of each light-emitting element 12 are formed to have the same film thickness. A reflector 71 is disposed below the first electrodes 121 of the light-emitting elements 12 with an optical adjustment layer 72 sandwiched therebetween.
[0198] In contrast, in the fourth example shown in FIG. 27B, the optical adjustment layer 72 is omitted, and the film thickness of the first electrode 121 is set to the same as that of the light emitting element 12 R , 12 G , 12 B The settings were different depending on the type of
[0199] The reflector 71 is formed to have a common thickness for each light-emitting element 12. The thickness of the first electrode 121 varies depending on the color to be displayed by the sub-pixel. R , 121 G , 121 B By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.
[0200] The materials constituting the reflector 71, the optical adjustment layer 72, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore description thereof will be omitted.
[0201] (Resonator Structure: Fifth Example) FIG. 28A is a schematic cross-sectional view for explaining a fifth example of the resonator structure.
[0202] 26A , the first electrode 121 and the second electrode 123 are formed to have the same film thickness in each light-emitting element 12. A reflector 71 is disposed below the first electrode 121 of the light-emitting element 12 with an optical adjustment layer 72 sandwiched therebetween.
[0203] 28A, the optical adjustment layer 72 is omitted, and instead, an oxide film 74 is formed on the surface of the reflector 71. The thickness of the oxide film 74 is R , 12 G , 12 B In the following description, the oxide films 74 provided corresponding to the sub-pixels 10R, 10G, and 10B are referred to as oxide films 74 R , 74G , 74 B This is what happens.
[0204] The thickness of the oxide film 74 varies depending on the color to be displayed by the sub-pixel. R , 74 G , 74 B By having different film thicknesses, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light corresponding to the color to be displayed.
[0205] The oxide film 74 is a film obtained by oxidizing the surface of the reflector 71, and is made of, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, zirconium oxide, etc. The oxide film 74 functions as an insulating film for adjusting the optical path length (optical distance) between the reflector 71 and the second electrode 123.
[0206] Light-emitting element 12 R , 12 G , 12 B The oxide film 74, which has a different thickness depending on the type of material, can be formed, for example, as follows.
[0207] First, a container is filled with an electrolyte, and the substrate on which the reflector 71 is formed is immersed in the electrolyte. An electrode is disposed so as to face the reflector 71.
[0208] Then, a positive voltage is applied to the reflector 71 with the electrode as a reference, and the reflector 71 is anodized. The thickness of the oxide film formed by anodization is proportional to the voltage value applied to the electrode. R , 71 G , 71 B Anodic oxidation is performed while applying a voltage to each of the layers according to the type of light emitting element 12. This allows oxide films 74 with different thicknesses to be formed all at once.
[0209] The materials constituting the reflector 71, the first electrode 121 and the second electrode 123 are the same as those described in the first example, and therefore will not be described again.
[0210] (Resonator Structure: Sixth Example) FIG. 28B is a schematic cross-sectional view for explaining a sixth example of the resonator structure.
[0211] In the sixth example, the light emitting element 12 is configured by laminating a first electrode 121, an OLED layer 122, and a second electrode 123. However, in the sixth example, the first electrode 121 is formed so as to function both as an electrode and a reflector. The first electrode (also serving as a reflector) 121 is formed so as to function as a light emitting element 12. R , 12 G , 12 B The first electrode (also serving as a reflector) 121 is formed of a material having an optical constant selected according to the type of color to be displayed. By varying the phase shift due to the first electrode (also serving as a reflector) 121, it is possible to set the optical distance that produces the optimum resonance for the wavelength of light according to the color to be displayed.
[0212] The first electrode (also serving as a reflector) 121 can be made of a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or an alloy containing these as a main component. R First electrode (also serving as a reflector) 121 R is formed of copper (Cu), and the light emitting element 12 G First electrode (also serving as a reflector) 121 G and light-emitting element 12 B First electrode (also serving as a reflector) 121 B The insulating film 11 may be made of aluminum.
[0213] The material constituting the second electrode 123 is the same as that described in the first example, and therefore a description thereof will be omitted.
[0214] (Resonator Structure: Seventh Example) FIG. 29 is a schematic cross-sectional view for explaining a seventh example of the resonator structure.
[0215] The seventh example is basically the same as the light emitting element 12 R , 12 G The sixth example is applied to the light emitting element 12 B In this configuration, the optical distance that generates the optimum resonance for the wavelength of light corresponding to the color to be displayed can also be set.
[0216] Light-emitting element 12 R , 12 G First electrode (also serving as a reflector) 121 used in R , 121G The electrode can be made of a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu), or an alloy containing any of these as a main component.
[0217] Light-emitting element 12 B Reflector 71 used in B , optical adjustment layer 72 B and the first electrode 121 B The materials constituting the second embodiment are the same as those described in the first embodiment, and therefore will not be described here.
[0218] 7. Application Examples (Electronic Devices) The display device 101 according to an embodiment etc. may be provided in various electronic devices. The display device 101 according to an embodiment etc. is particularly suitable for eyewear devices such as head-mounted displays, or electronic viewfinders for video cameras or single-lens reflex cameras that require high resolution and are used in close proximity to the eyes with magnification.
[0219] 30A and 30B show an example of the appearance of a digital still camera 310. This digital still camera 310 is an interchangeable lens single-lens reflex type, and has an interchangeable taking lens unit (interchangeable lens) 312 located approximately in the center of the front of a camera main body 311, and a grip part 313 for the photographer to hold on the left side of the front.
[0220] A monitor 314 is provided at a position shifted to the left from the center of the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition. The electronic viewfinder 315 includes any one of the display devices 101 according to an embodiment.
[0221] 31 shows an example of the appearance of a head-mounted display 320. The head-mounted display 320 is an example of an eyewear device. The head-mounted display 320 has, for example, ear hooks 322 on both sides of a glasses-shaped display unit 321 for wearing on the user's head. The display unit 321 includes any one of the display devices 101 according to an embodiment, etc.
[0222] 32 shows an example of the appearance of a television device 330. This television device 330 has, for example, a video display screen unit 331 including a front panel 332 and a filter glass 333, and this video display screen unit 331 includes any one of the display devices 101 according to the embodiment.
[0223] 33 shows an example of the appearance of a see-through head mounted display 340. The see-through head mounted display 340 is an example of an eyewear device. The see-through head mounted display 340 includes a main body 341, an arm 342, and a lens barrel 343.
[0224] The main body 341 is connected to the arm 342 and the glasses 350. Specifically, an end of the long side of the main body 341 is coupled to the arm 342, and one side of the main body 341 is connected to the glasses 350 via a connecting member. The main body 341 may also be worn directly on the head of a human body.
[0225] The main body 341 incorporates a control board for controlling the operation of the see-through head mounted display 340 and a display unit. The arm 342 connects the main body 341 to the lens barrel 343 and supports the lens barrel 343. Specifically, the arm 342 is coupled to an end of the main body 341 and an end of the lens barrel 343, respectively, and fixes the lens barrel 343. The arm 342 also incorporates a signal line for communicating data related to images provided from the main body 341 to the lens barrel 343.
[0226] The lens barrel 343 projects image light provided from the main body 341 via the arm 342, through the eyepiece 351, toward the eyes of the user wearing the see-through head mounted display 340. In this see-through head mounted display 340, the display unit of the main body 341 includes any one of the display devices 101 according to an embodiment or the like.
[0227] 34 shows an example of the appearance of a smartphone 360. The smartphone 360 includes a display unit 361 that displays various information, an operation unit 362 that includes buttons and the like that accept operation inputs from a user, and the like. The display unit 361 includes any one of the display devices 101 according to an embodiment and the like.
[0228] (Specific Example 6) The display device 101 according to an embodiment may be provided in various displays provided in vehicles.
[0229] 35A and 35B are diagrams showing an example of the internal configuration of a vehicle 500 equipped with various displays. Specifically, Fig. 35A is a diagram showing an example of the internal appearance of the vehicle 500 from the rear to the front of the vehicle 500, and Fig. 35B is a diagram showing an example of the internal appearance of the vehicle 500 from diagonally rear to diagonally front of the vehicle 500.
[0230] The vehicle 500 includes a center display 501, a console display 502, a head-up display 503, a digital rearview mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes any one of the display devices 101 according to an embodiment, etc. For example, all of these displays may include any one of the display devices 101 according to an embodiment, etc.
[0231] The center display 501 is disposed in a portion of the dashboard facing the driver's seat 508 and the passenger seat 509. While FIGS. 35A and 35B show an example of a horizontally elongated center display 501 extending from the driver's seat 508 side to the passenger seat 509 side, the screen size and location of the center display 501 are arbitrary. The center display 501 can display information detected by various sensors. As a specific example, the center display 501 can display an image captured by an image sensor, a distance image to obstacles in front of or to the side of the vehicle 500 measured by a ToF sensor, the body temperature of a passenger detected by an infrared sensor, etc. The center display 501 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information.
[0232] The safety-related information includes information such as detection of drowsiness, distraction, child mischief, whether a seatbelt is fastened, and whether a passenger has been abandoned. This information is detected, for example, by a sensor placed on the rear side of the center display 501. The operation-related information is obtained by detecting gestures related to passenger operations using a sensor. The detected gestures may include operations of various equipment within the vehicle 500. For example, operations of the air conditioning system, navigation system, AV system, lighting system, etc. are detected. The life log includes life logs of all passengers. For example, the life log includes a record of each passenger's actions while on board. By acquiring and saving the life log, the condition of the passenger at the time of the accident can be confirmed. The health-related information is obtained by detecting the passenger's body temperature using a sensor such as a temperature sensor, and inferring the passenger's health condition based on the detected body temperature. Alternatively, an image sensor may be used to capture an image of the passenger's face, and the passenger's health condition may be inferred from the facial expression in the image. Furthermore, the system may have an automated voice conversation with the occupant and estimate the occupant's health condition based on the occupant's responses. The authentication / identification-related information includes a keyless entry function that uses a sensor to perform facial authentication, a function that automatically adjusts seat height and position using facial recognition, etc. The entertainment-related information includes a function that uses a sensor to detect operation information of an AV device by the occupant, a function that recognizes the occupant's face using a sensor and provides content suitable for the occupant via the AV device, etc.
[0233] The console display 502 can be used to display, for example, life log information. The console display 502 is disposed near a shift lever 511 on a center console 510 between a driver's seat 508 and a passenger seat 509. Information detected by various sensors can also be displayed on the console display 502. Furthermore, the console display 502 may display an image of the vehicle's surroundings captured by an image sensor, or an image showing the distance to an obstacle around the vehicle.
[0234] The head-up display 503 is virtually displayed behind the windshield 512 in front of the driver's seat 508. The head-up display 503 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 503 is often virtually located in front of the driver's seat 508, it is suitable for displaying information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500 and the remaining fuel (battery) level.
[0235] The digital rearview mirror 504 can not only display the rear of the vehicle 500 but also the status of passengers in the rear seats. Therefore, by placing a sensor on the back side of the digital rearview mirror 504, it can be used to display life log information, for example.
[0236] The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 505 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information related to the operation of AV equipment, air conditioning equipment, etc.
[0237] The rear entertainment display 506 is attached to the back side of the driver's seat 508 and the passenger seat 509 and is intended for viewing by rear seat passengers. The rear entertainment display 506 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, since the rear entertainment display 506 is located directly in front of the rear seat passengers, information related to the rear seat passengers is displayed on the rear entertainment display 506. For example, the rear entertainment display 506 may display information related to the operation of an AV device or an air conditioning system, or may display the results of measuring the body temperature of the rear seat passengers using a temperature sensor.
[0238] A sensor may be arranged on the rear surface of the display device 101 or the like, enabling distances to surrounding objects to be measured. Optical distance measurement methods are broadly divided into passive and active types. Passive methods measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive methods include the lens focusing method, the stereo method, and the monocular vision method. Active methods measure distance by projecting light onto an object and receiving reflected light from the object with a sensor. Active methods include the optical radar method, the active stereo method, the photometric stereo method, the moire topography method, and the interferometry method. The display device 101 according to one embodiment or the like can be applied to any of these distance measurement methods. The above-described passive or active distance measurement can be performed by using a sensor arranged on the rear surface of the display device 101.
[0239] DESCRIPTION OF SYMBOLS 10R, 10G, 10B Subpixel 11 Drive substrate 111 Substrate 112 Insulating layer 112b, 112g Contact plug 112a Wiring 113 Pad portion 12 Light-emitting element 121 First electrode 122 OLED layer 123 Second electrode 13 Insulating layer 13a Opening 14 Protective layer 15 Planarization layer (first resin layer) 16 Color filter 160R, 160G, 160B Colored layer 17 Planarization layer (second resin layer) 18 Lens array 181 Lens 19 Partition 20 Sealing resin layer 101 Display device 310 Digital still camera 320 Head-mounted display 330 Television device 340 See-through head-mounted display 360 Smartphone 500 Vehicle U1, U2 Light-emitting unit RE1 Display area RE2 Surrounding area
Claims
1. A display device comprising: a plurality of light-emitting elements arranged two-dimensionally; a plurality of layers stacked on the plurality of light-emitting elements; and a partition wall disposed between adjacent light-emitting elements in a planar view and formed across two or more layers included in the plurality of layers, wherein the cross-sectional shape of the partition wall includes a forward tapered shape.
2. The display device according to claim 1, wherein the refractive index of the partition is lower than the refractive index of the two or more layers.
3. The display device according to claim 1, wherein the plurality of layers include a protective layer, a color filter, and a sealing resin layer, which are disposed on the plurality of light-emitting elements in that order.
4. The display device according to claim 3, wherein the two or more layers include the protective layer and the color filter.
5. The display device according to claim 1, wherein the plurality of layers include a protective layer, a first resin layer, a color filter, and a sealing resin layer arranged in that order on the plurality of light-emitting elements.
6. The display device according to claim 5, wherein the two or more layers include the protective layer, the first resin layer, and the color filter.
7. The display device according to claim 1, wherein the plurality of layers include a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and a sealing resin layer, arranged in that order on the plurality of light-emitting elements.
8. The display device according to claim 7, wherein the two or more layers include the protective layer, the first resin layer, the color filter, and the second resin layer.
9. The display device according to claim 3, wherein the refractive index of the partition is the same as the refractive index of the sealing resin layer.
10. The display device according to claim 3, wherein the sealing resin layer is in contact with tops of the partition walls, and the refractive index of the partition walls is lower than the refractive index of the sealing resin layer.
11. The display device according to claim 3, wherein a top of the partition is located at a position higher than the color filter with respect to the light emitting element.
12. The display device according to claim 3, wherein the plurality of light-emitting elements include an organic-containing layer including an organic light-emitting layer, the organic-containing layer is connected between adjacent light-emitting elements, and a bottom of the partition is embedded in the protective layer.
13. The display device according to claim 12, wherein the protective layer has a surface on the side of the light emitting element, and a bottom of the partition is spaced apart from the surface.
14. The display device according to claim 7, wherein the height of the top of the partition coincides with the height of the bottom of the lens included in the lens array.
15. The display device according to claim 1, wherein a bottom of the partition is provided at a position that does not overlap with a light emitting region of the light emitting element in the plan view.
16. An electronic device comprising the display device according to claim 1.
Citation Information
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