Earphone

Abstract

The present application provides an earphone. The earphone comprises a main circuit board, a radiator, and an extending ground board. The radiator is arranged on a first surface of the main circuit board; and the extending ground board is arranged on a second surface of the main circuit board and is co-ground with the main circuit board, wherein the first surface is a surface distant from a wearer, and the second surface is a surface facing the wearer.

Description

earphone

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application 202310946950.2, filed on July 28, 2023, entitled “Headphones,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of electronic products, and in particular to a headset. Background Art

[0004] True Wireless Stereo (TWS) earphones have been popular with consumers since their inception. TWS earphones require no wired connection; the two earbuds form a stereo system via Bluetooth. They offer excellent convenience and audio performance, making them the most popular earphone on the market alongside traditional earphones. However, due to the absorption and shielding of signals by the human head, the radiation efficiency of the earphone antenna is low.

[0005] Summary of the Invention

[0006] The present application provides an earphone that can improve the radiation efficiency of the antenna in the earphone.

[0007] An embodiment of the present application provides a headset, comprising: a main circuit board, a radiator, and an extended floor;

[0008] The radiator is arranged on the first surface of the main circuit board;

[0009] The extended floor is provided on the second surface of the main circuit board and shares a common ground with the main circuit board;

[0010] The first surface is a surface facing away from the wearer, and the second surface is a surface facing the wearer.

[0011] In an embodiment of the present application, by aligning the extended floorboard with the main circuit board, the current flowing from the radiator to the ground layer of the main circuit board can further flow to the extended floorboard, thereby facilitating the extension of the current in the antenna within the headset, thereby improving the antenna's radiation efficiency. Furthermore, by arranging the radiator on the first surface of the main circuit board and the extended floorboard on the second surface of the main circuit board, with the first surface being the surface away from the wearer and the second surface being the surface facing the wearer, when the headset is worn, the main circuit board and the extended floorboard are closer to the wearer than the radiator, thereby facilitating the further increase in the distance between the radiator and the wearer, thereby reducing head mode loss and further improving the antenna's radiation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG1 is a schematic diagram of the structure of an earphone provided in an embodiment of the present application;

[0013] FIG2 is a second structural diagram of an earphone provided in an embodiment of the present application;

[0014] FIG3 is a third structural diagram of an earphone provided in an embodiment of the present application;

[0015] FIG4 is a fourth structural diagram of an earphone provided in an embodiment of the present application;

[0016] FIG5 is a fifth structural diagram of an earphone provided in an embodiment of the present application;

[0017] FIG6 is a schematic structural diagram of a main circuit board in an embodiment of the present application;

[0018] FIG7 is a comparison diagram of the radiation efficiency of the loop antenna in the embodiment of the present application and the traditional planar inverted-F antenna;

[0019] FIG8 is a schematic diagram of the flow state of the current generated in the loop antenna when the loop antenna is in a working state according to an embodiment of the present disclosure;

[0020] FIG9 is a schematic diagram of the electric field distribution near the earphones when the extended floor is not provided in the earphones;

[0021] FIG10 is a schematic diagram of the electric field distribution near the earphone after the above-mentioned extended floor is installed in the earphone;

[0022] FIG11 is a comparison of the loss caused by the human body with and without the antenna extending the floor;

[0023] Figure 12 is a comparison of antenna radiation efficiency with and without extended floor panels;

[0024] FIG13 is a schematic cross-sectional view of the main circuit board in an embodiment of the present application;

[0025] FIG14 is a schematic cross-sectional view of a flexible circuit board in an embodiment of the present application. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0027] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0028] The earphones provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0029] Please refer to Figures 1-5, which are structural schematic diagrams of an earphone provided in an embodiment of the present application. The earphone includes a main circuit board 100, a radiator 300 and an extended floor 400; the radiator 300 is arranged on the first surface 107 of the main circuit board 100; the extended floor 400 is arranged on the second surface 108 of the main circuit board 100 and shares a common ground with the main circuit board 100; the first surface 107 is a surface away from the wearer, and the second surface 108 is a surface facing the wearer.

[0030] It is understood that the radiator 300 is the radiator of the antenna in the headset. The radiator 300 can be electrically connected to the main circuit board. In this way, a feed signal can be fed to the radiator 300 through the main circuit board 100. At the same time, the radiator 300 can also be grounded through the ground layer of the main circuit board 100, thereby forming an antenna structure. In this way, when the main circuit board 100 feeds the feed signal to the radiator 300, a current is generated in the radiator 300, and the current in the radiator 300 can flow to the ground layer of the main circuit board 100.

[0031] The extended floor panel 400 and the main circuit board 100 share a common ground, that is, the ground layer in the main circuit board 100 is electrically connected to the extended floor panel 400 .

[0032] The aforementioned first surface 107 being the surface facing away from the wearer specifically means that when the earphones are in the wearing state, the first surface 107 is the surface of the main circuit board 100 facing away from the wearer. In other words, when the earphones are in the wearing state, the first surface 107 is the surface of the main circuit board 100 facing away from the wearer. Specifically, referring to Figures 3 to 5 , the earphones may include an earmuff 500, and the earmuff 500 may include an in-ear earplug. When the earphones are in the wearing state, the user inserts the earplug into the ear. At this time, the first surface 107 of the main circuit board 100 faces away from the wearer's face, and the second surface 108 of the main circuit board 100 faces the wearer's face.

[0033] The above-mentioned earphone can be one of the Bluetooth earphones, for example, it can be one of the earphones with an antenna in a TWS earphone.

[0034] Please refer to Figures 9-10. Figure 10 is a schematic diagram of the electric field distribution near the earphones after the above-mentioned extended floor 400 is installed in the earphones. The area indicated by the rectangular box in Figure 10 is the electric field entering the human body. Figure 9 is a schematic diagram of the electric field distribution near the earphones when the above-mentioned extended floor 400 is not installed in the earphones. The area indicated by the rectangular box in Figure 9 is the electric field entering the human body. As can be seen from Figures 9-10, without the extended floor 400, a large portion of the electric field will enter the human body. However, after adding the extended floor 400, the distribution of the electric field is changed, which can significantly reduce the electric field entering the human body, thereby further reducing the loss of radiation performance caused by the human body. Please refer to Figure 11, which is a comparison of the loss caused by the human body for antennas with and without the extended floor 400. As can be seen from Figure 11, the human body loss can be reduced by 3dB by adding the extended floor 400. FIG12 is a comparison diagram of the antenna radiation efficiency with and without the extended floor 400. As can be seen from FIG12 , the radiation efficiency of the antenna with the extended floor 400 is 3 dB higher, thereby greatly improving the head model efficiency of the headset and improving the user experience.

[0035] In this embodiment, by aligning the extended floorboard 400 with the main circuit board 100, the current flowing from the radiator 300 to the ground layer of the main circuit board 100 can further flow to the extended floorboard 400, thereby extending the length of the current in the antenna within the headset and thereby improving the antenna's radiation efficiency. Furthermore, by arranging the radiator 300 on the first surface 107 of the main circuit board 100 and the extended floorboard 400 on the second surface 108 of the main circuit board 100, with the first surface 107 facing away from the wearer and the second surface 108 facing the wearer, when the headset is worn, the main circuit board 100 and the extended floorboard 400 are closer to the wearer than the radiator 300. This further increases the distance between the radiator 300 and the human body, thereby reducing head mode loss and further improving the antenna's radiation efficiency.

[0036] Optionally, FIG13 is a schematic cross-sectional view of a main circuit board in an embodiment of the present application; FIG14 is a schematic cross-sectional view of a flexible circuit board in an embodiment of the present application. As shown in FIG13 and FIG14 , the headset further includes a flexible circuit board 200. The main circuit board 100 includes a first signal layer 103 and a first ground layer 104. The flexible circuit board 200 includes a second ground layer 202, and the first ground layer 104 is electrically connected to the second ground layer 202. The extended floor panel 400 is electrically connected to the second ground layer 202.

[0037] The first end 301 of the radiator 300 is electrically connected to the RF transceiver circuit 102 in the first signal layer 103 , and the second end 302 of the radiator 300 is electrically connected to the first ground layer 104 , so as to form a loop antenna.

[0038] The above-mentioned RF transceiver circuit 102 can form the feed source (i.e., the RF signal source) of the loop antenna, the first end 301 of the radiator 300 forms a feeding point, and the first signal layer 103 is electrically connected to the feeding point through the RF transceiver circuit 102 to feed the feeding signal into the radiator 300.

[0039] The first signal layer 103 and the first ground layer 104 may be stacked or located on the same plane. For example, a hollowed-out area may be provided in the first ground layer 104, and the first signal layer 103 may be located in the hollowed-out area.

[0040] The flexible circuit board 200 can be used to mount the relevant electronic components of the headset. The first ground layer 104 forms the floor of the main circuit board 100, the second ground layer 202 forms the floor of the flexible circuit board 200, and the extended floor 400 is an additional floor added to extend the current of the headset antenna.

[0041] It is understandable that the radiator 300 can be bent to form a radiator of a loop antenna.

[0042] Specifically, because loop antennas are self-balancing, compared to traditional antennas, the current in loop antennas is primarily concentrated in the antenna branches, and the current on the floor is weaker. Traditional antennas, on the other hand, also have a strong current distribution on the floor. See Figure 7 for a comparison of the radiation efficiency of loop antennas and traditional planar inverted F antennas. As shown in Figure 7, the loop antenna has a 1dB higher radiation efficiency than the traditional PIFA (Planar Inverted F-Shaped Antenna).

[0043] In this embodiment, by electrically connecting the first ground layer 104 to the second ground layer 202 and the extended floor panel 400 to the second ground layer 202, the current transmitted from the radiator 300 to the first ground layer 104 can flow through the first ground layer 104 to the second ground layer 202, and then from the second ground layer 202 to the extended floor panel 400, thereby extending the length of the current in the antenna and thereby improving the antenna's radiation efficiency. Furthermore, by forming a loop antenna within the earphone, compared to traditional antennas (such as inverted-F antennas (IFAs) or monopoles), the current in the loop antenna is primarily concentrated in the antenna branches, and the current on the floor panel of the loop antenna is weaker. Furthermore, the floor panel in the earphone is generally closer to the human body than the radiator. Therefore, compared to traditional antennas in the earphone, forming a loop antenna within the earphone has lower head mode loss, thereby further improving the radiation efficiency of the antenna in the earphone.

[0044] Optionally, the first grounding layer 104 further includes a grounding terminal 101, and the first grounding layer 104 is electrically connected to the second grounding layer 202 through the grounding terminal 101, the grounding terminal 101, the first end 301 of the radiator 300 and the second end 302 of the radiator 300 are arranged at intervals along the length direction of the circuit board; and the first end 301 of the radiator 300 is located between the grounding terminal 101 and the second end 302 of the radiator 300.

[0045] The above-mentioned ground terminal 101 can be a first ground pin (first GND pin). The circuit board in a traditional headset usually includes four pins for connecting the speaker and the battery. The four pins are: Spk+, Spk-, Bat+, Bat-, wherein Spk+ is labeled 104 in Figure 6, Spk- is labeled 103 in Figure 6, Bat+ is labeled 105 in Figure 6, and Bat- is labeled 106 in Figure 6. Please refer to Figure 6. In the embodiment of the present disclosure, a first GND pin can be added on the basis of the four pins, and the first GND pin can be set between the two Spk and two Bat pins. Of course, the first GND pin can also be set on both sides of the above-mentioned four pins. The first GND pin is added to facilitate the connection between the first ground layer 104 and the second ground layer 202. The second ground layer 202 can be provided with a second GND pin, and the second ground layer 202 can be electrically connected to the extended floor 400 through the second GND pin.

[0046] It is understood that the flexible circuit board 200 may further include a second signal layer 201. The second signal layer 201 may be stacked with the second ground layer 202, or the second signal layer 201 may be arranged on the same plane as the second ground layer 202. The second signal layer 201 may be electrically connected to the Spk+, Spk-, Bat+, Bat-, and first GND pins. It is understood that the first GND pin is electrically connected to the second ground layer 202 via the second signal layer 201.

[0047] In addition, the earphones further include a speaker and a battery, at least one of which is electrically connected to the second signal layer 201. For example, the speaker and the battery are each electrically connected to the second signal layer 201, i.e., the flexible circuit board 200 is the flexible circuit board 200 used to mount the speaker and battery in the earphones. In this way, by reusing the flexible circuit board 200 in the earphones and changing the connection position between the flexible circuit board 200 and the main circuit board 100 (i.e., changing the position of the ground terminal 101, i.e., changing the position of the wire outlet of the flexible circuit board 200), the current length of the antenna can be extended.

[0048] Please refer to Figure 1. A portion of the current generated in the radiator 300 can enter the first ground layer 104 from the second end 302 of the radiator 300. Since the first end 301 of the radiator 300 is located between the ground terminal 101 and the second end 302 of the radiator 300, in order to enter the first ground layer 104, it needs to be transmitted from one end of the first ground layer 104 to the other end before reaching the ground terminal 101, and then enter the second ground layer 202 through the ground terminal 101, thereby further increasing the current length of the antenna in the headset.

[0049] Optionally, the ground terminal 101 is located at an end portion in the length direction of the first ground layer 104 .

[0050] The flexible circuit board 200 may include a conductive spring corresponding to the ground terminal 101, and the flexible circuit board 200 may be electrically connected to the ground terminal 101 via the conductive spring. Alternatively, the electrical connection between the flexible circuit board 200 and the ground terminal 101 may be established by direct soldering (hotbar). Referring to FIG1 , the ground terminal 101 is located at one end of the main circuit board 100 near the ear cup 500.

[0051] In this embodiment, by positioning the ground terminal 101 at the longitudinal end of the first ground layer 104, the propagation length of current entering the first ground layer 104 can be further delayed within the first ground layer 104, thereby further increasing the current flow length of the antenna in the headset. Referring to FIG8 , a schematic diagram illustrating the flow of current generated within the loop antenna when the loop antenna is in operation, in one embodiment of the present disclosure, is shown. Specifically, the current entering the first ground layer 104 from the second end 302 of the radiator 300 follows the path indicated by the arrows in FIG8 , i.e., it first propagates from one longitudinal end of the first ground layer 104 to the other, then from the top of the first ground layer 104 to the flexible printed circuit board 200, then from the flexible printed circuit board 200 to the extended floor panel 400, and finally from one end of the extended floor panel 400 to the other end.

[0052] Optionally, the extended floor 400 is in the shape of a strip plate, and the length of the extended floor 400 matches the length of the first ground layer 104 .

[0053] Specifically, the length of the extended floor panel 400 matching the length of the first grounding layer 104 may mean that the length of the extended floor panel 400 is equal to the length of the first grounding layer 104. Alternatively, the length of the extended floor panel 400 matching the length of the first grounding layer 104 may mean that the length of the extended floor panel 400 is slightly less than the length of the first grounding layer 104.

[0054] Furthermore, the ratio of the width of the extended floor panel 400 to the width of the first ground layer 104 ranges from 0.5 to 1. Specifically, since the effectiveness of the extended floor panel 400 is reduced when the ratio is less than 0.5, the reduction in effectiveness of the extended floor panel 400 is avoided by setting the ratio between 0.5 and 1. Furthermore, by setting the length of the first ground layer 104 to be slightly less than or equal to the length of the first ground layer 104 and setting the ratio between 0.5 and 1, the dimensions of the extended floor panel 400 are prevented from exceeding the dimensions of the main circuit board 100. This allows the orthographic projection of the extended floor panel 400 on the main circuit board 100 to lie within the main circuit board 100, allowing the extension floor panel 400 to be added without increasing the size of the headphones.

[0055] Optionally, the earphone further includes a housing, the housing including an ear bag 500 and an ear stem, wherein the ear bag 500 is connected to the ear stem, the main circuit board 100 is disposed in the housing, the radiator 300 is disposed in the ear stem, and the flexible circuit board 200 is disposed in the ear bag 500;

[0056] The extended floor 400 is disposed in the ear stem, and the extended floor 400 is attached to the inner wall of the ear stem; or, the extended floor 400 is disposed in the ear bag 500, and the extended floor 400 is attached to the inner wall of the ear bag 500.

[0057] It is understandable that a portion of the main circuit board 100 may be located in the ear bag 500 , and at the same time, another portion of the main circuit board 100 may be located in the ear stem.

[0058] Among them, the above-mentioned ear bag 500 is an ellipsoidal shell in the earphone for installing the earplug, and accordingly, the ear rod is a rod-shaped shell connected to the ear bag 500, and the relevant control buttons in the earphone can be set on the ear rod.

[0059] In this embodiment, the extended floor 400 is attached to the inner wall of the ear stem, or the extended floor 400 is attached to the inner wall of the ear bag 500 , thereby achieving installation and fixation of the extended floor 400 .

[0060] Optionally, the radiator 300 is located on a side of the first ground layer 104 facing away from the ear bag 500 .

[0061] In this embodiment, since the side of the first grounding layer 104 facing the ear bag 500 is closer to the human body, by positioning the radiator 300 on the side of the first grounding layer 104 facing away from the ear bag 500, the distance between the radiator 300 and the human body can be further increased, thereby reducing the head mode loss.

[0062] Optionally, the extended floor 400 is a serpentine plate.

[0063] Please refer to Figure 3. When the extended floor 400 is bonded to the inner wall of the ear bag 500, by setting the extended floor 400 to a serpentine plate shape, it is helpful to further reduce the size of the extended floor 400, and further reduce the installation space inside the earphone required for the extended floor 400.

[0064] Optionally, referring to FIG3-4 , the radiator 300 includes at least three strip segments 303 , which are arranged at intervals along the width direction of the main circuit board 100 , and the at least three strip segments 303 are sequentially connected end to end to form a serpentine radiator;

[0065] Alternatively, referring to FIG1-2 , the radiator 300 includes at least three strip segments 303 , which are spaced apart along the length direction of the main circuit board 100 , and are connected end to end in sequence to form a serpentine radiator.

[0066] Please refer to FIG. 2 . The direction indicated by the double-headed arrow a in FIG. 2 is the width direction of the main circuit board 100 , and the direction indicated by the double-headed arrow b in FIG. 2 is the length direction of the main circuit board 100 .

[0067] In this embodiment, the radiator 300 is wound to form a serpentine winding structure, so that the length of the radiator 300 can be further increased, thereby improving the signal radiation or signal reception effect of the radiator 300.

[0068] Optionally, the earphones further include a shell, a speaker and a battery, the shell includes an ear bag 500 and an ear rod, and the ear bag 500 is connected to the ear rod, the main circuit board 100 is arranged in the shell, the radiator 300 is arranged in the ear rod, and the flexible circuit board 200 is arranged in the ear bag 500; the extended floor 400 is arranged in the ear bag 500, and the extended floor 400 is attached to the inner wall of the ear bag 500, the flexible circuit board 200 further includes a second signal layer 201, and at least one of the speaker and the battery is electrically connected to the second signal layer 201.

[0069] In this embodiment, the current length of the antenna is extended by reusing the flexible circuit board 200 in the earphone and changing the connection position between the flexible circuit board 200 and the main circuit board 100.

[0070] Another embodiment of the present disclosure provides a true wireless stereo headset, including a first headset and a second headset, at least one of the first headset and the second headset is the headset described in the above embodiment.

[0071] In this embodiment, since at least one of the first earphone and the second earphone in the true wireless stereo earphone is the earphone described in the above embodiment, the true wireless stereo earphone can implement the various processes of the earphone in the above embodiment and has the same beneficial effects. To avoid repetition, they will not be described here.

[0072] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A headset, comprising: Main circuit board, radiators and extended floorboards; The radiator is disposed on the first surface of the main circuit board; The extended floor is disposed on the second surface of the main circuit board and shares a common ground with the main circuit board; The first surface is a surface facing away from the wearer, and the second surface is a surface facing the wearer.

2. The headset according to claim 1, wherein: The headset further comprises a flexible circuit board, the main circuit board comprises a first signal layer and a first ground layer, the flexible circuit board comprises a second ground layer, the first ground layer is electrically connected to the second ground layer, and the extended floor is electrically connected to the second ground layer; The first end of the radiator is electrically connected to the radio frequency transceiver circuit in the first signal layer, and the second end of the radiator is electrically connected to the first ground layer to form a loop antenna.

3. The headset according to claim 2, wherein: The first grounding layer also includes a grounding terminal, and the first grounding layer is electrically connected to the second grounding layer through the grounding terminal, the grounding terminal, the first end of the radiator and the second end of the radiator are arranged at intervals along the length direction of the circuit board; and the first end of the radiator is located between the grounding terminal and the second end of the radiator.

4. The headset according to claim 3, wherein: The ground terminal is located at an end portion in the length direction of the first ground layer.

5. The headset according to claim 2, wherein: The extended floor is in the shape of a strip plate, and the length of the extended floor matches the length of the first grounding layer.

6. The headset according to claim 5, wherein: The ratio of the width of the extended floor to the width of the first ground layer ranges from 0.5 to 1.

7. The headset according to claim 1, wherein: The earphone further comprises a shell, the shell comprises an ear bag and an ear rod, and the ear bag is connected to the ear rod, the main circuit board is arranged in the shell, and the radiator is arranged in the ear rod; The extended floor is arranged in the ear rod, and the extended floor is attached to the inner wall of the ear rod.

8. The headset according to claim 7, wherein: The extended floor is a serpentine plate body.

9. The headset according to claim 1, wherein: The radiator comprises at least three strip segments, the at least three strip segments are arranged at intervals along the width direction of the main circuit board, and the at least three strip segments are sequentially connected end to end to form a serpentine radiator; Alternatively, the radiator comprises at least three strip segments, the at least three strip segments are arranged at intervals along the length direction of the main circuit board, and the at least three strip segments are sequentially connected end to end to form a serpentine radiator.

10. The headset according to claim 2, wherein: The earphone also includes a shell, a speaker and a battery. The shell includes an ear bag and an ear rod, and the ear bag is connected to the ear rod. The main circuit board is arranged in the shell, and the radiator is arranged in the ear rod; the extended floor is arranged in the ear bag, and the extended floor is attached to the inner wall of the ear bag. The flexible circuit board also includes a second signal layer, and at least one of the speaker and the battery is electrically connected to the second signal layer.

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