Light-emitting device and electronic apparatus

Abstract

Provided as an example is a light-emitting device capable of efficiently radiating heat.　The light-emitting device includes: a drive substrate which has a plurality of light-emitting elements on a first surface side and drives the light-emitting elements; a heat conduction part provided on a second surface on the opposite side of the drive substrate to the first surface; a wiring substrate connected to the drive substrate; and a reinforcement member connected to a second surface of the wiring substrate, wherein a first surface of the wiring substrate is wire-bonded to the drive substrate, the heat conduction part and the reinforcement member are connected, and the reinforcement member is composed of a material having a thermal conductivity equal to or greater than that of the drive substrate.

Description

Light-emitting device and electronic device

[0001] The present disclosure relates to a light-emitting device and an electronic device.

[0002] Light-emitting devices using light-emitting elements such as semiconductor light-emitting elements are becoming smaller and more precise, and are expected to be applied to various fields such as AR (Augmented Reality), VR (Virtual Reality), and MR (Mixed Reality). However, as light-emitting elements have become brighter and the currents flowing through them have increased in recent years, the amount of heat generated when the light-emitting elements emit light has increased. Therefore, a structure capable of efficiently dissipating heat generated by a light-emitting device is desired. For example, Patent Document 1 listed below describes a wearable display device that dissipates heat generated in a display panel using a heat dissipation sheet. Patent Document 2 listed below also describes a projection-type display device that dissipates heat using a heat sink.

[0003] JP 2016-39529 A JP 2010-175583 A

[0004] In this field, there is a demand for a structure that can efficiently dissipate heat generated in the light-emitting device. Also, in order to increase the brightness of the light-emitting element, it is desirable to be able to pass a large current through the light-emitting element, and to minimize the size of the light-emitting device.

[0005] An object of the present disclosure is to provide a light-emitting device and an electronic device that can pass a relatively large current through a light-emitting element, have an efficient heat dissipation structure without increasing the size as much as possible, and have a light-emitting device and an electronic device.

[0006] The present disclosure relates to a light-emitting device having, for example, a drive substrate having a first surface on which a plurality of light-emitting elements are provided and which drives the light-emitting elements, a heat-conducting portion provided on a second surface opposite to the first surface of the drive substrate, a wiring substrate connected to the drive substrate, and a reinforcing member connected to the second surface of the wiring substrate, wherein the first surface of the wiring substrate is connected to the drive substrate by wire bonding, the heat-conducting portion is connected to the reinforcing member, and the reinforcing member is made of a material having a thermal conductivity equal to or higher than that of the drive substrate. The present disclosure may also be an electronic device having the light-emitting device.

[0007] The present disclosure also relates to a light-emitting device having, for example, a drive substrate having a first surface on which a plurality of light-emitting elements are provided and which drives the light-emitting elements, a wiring substrate connected to the drive substrate, and a reinforcing member, wherein the first surface of the wiring substrate is connected to the drive substrate by wire bonding, a first region on the first surface of the reinforcing member is directly bonded to the second surface of the drive substrate, and a second region on the first surface of the reinforcing member is connected to the second surface of the wiring substrate, and the reinforcing member is made of a material having a thermal conductivity equal to or higher than that of the drive substrate. The present disclosure may also be an electronic device having the above light-emitting device.

[0008] 1A and 1B are cross-sectional schematic diagrams for explaining an example of a cross-sectional configuration of a light-emitting device according to a first embodiment. FIGS. 1A and 1B are cross-sectional schematic diagrams for explaining an example of a cross-sectional configuration of a light-emitting device according to a first embodiment. FIGS. 1A and 1B are cross-sectional schematic diagrams for explaining an example of a cross-sectional configuration of a light-emitting device according to a second ... 1A and 1B are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a second embodiment. 1A and 1B are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a second embodiment. 1A and 1B are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a third embodiment. 1A to 1C are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a third embodiment. 1A to 1C are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a third embodiment. 1A and 1B are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a third embodiment. 1A and 1B are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a third embodiment. 1A and 1B are diagrams to be referred to when describing an example of a manufacturing method for a light emitting device according to a third embodiment.1A and 1B are cross-sectional schematic diagrams for explaining an example of a cross-sectional configuration of a light-emitting device according to a fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. FIGS. 1A and 1B are diagrams referred to when explaining an example of a manufacturing method for a light-emitting device according to the fourth embodiment. 10A and 10B are diagrams referred to when describing an example of a manufacturing method for a light emitting device according to a fifth embodiment. 10A and 10B are diagrams referred to when describing an example of a manufacturing method for a light emitting device according to a fifth embodiment. 10B are diagrams referred to when describing an example of a manufacturing method for a light emitting device according to a sixth embodiment. 10C are diagrams referred to when describing a cross-sectional configuration example of a light emitting device according to a sixth embodiment. 10D are diagrams referred to when describing a modified example of a light emitting device according to a sixth embodiment. 10E are diagrams referred to when describing a modified example of a light emitting device according to a sixth embodiment. 10F are diagrams referred to when describing a modified example of a light emitting device according to a sixth embodiment. 10G are diagrams referred to when describing a modified example of a light emitting device according to a sixth embodiment. 10G are diagrams referred to when describing a modified example of a light emitting device according to a seventh embodiment. 10G are diagrams referred to when describing a specific example of an electronic device to which a light emitting device according to a seventh embodiment is applied ...1 is a perspective view showing an example of the appearance of a head-mounted display; FIG. 2 is a perspective view showing an example of the appearance of a television device; FIG. 3 is a perspective view showing an example of the appearance of a see-through head-mounted display; and FIG. 4 is a perspective view showing an example of the appearance of a smartphone. FIG. 5A is a diagram showing an example of the interior of a vehicle from the rear to the front of the vehicle; and FIG. 6B is a diagram showing an example of the interior of a vehicle from diagonally rear to diagonally front of the vehicle.

[0009] Embodiments of the present disclosure will be described below with reference to the drawings. The description will be made in the following order: <Problems to be Considered in the Present Disclosure> <First Embodiment> <Second Embodiment> <Third Embodiment> <Fourth Embodiment> <Fifth Embodiment> <Sixth Embodiment> <Seventh Embodiment> <Application Example> <Modification> The embodiments described below are preferred specific examples of the present disclosure, and the contents of the present disclosure are not limited to these embodiments. In the following description, components having substantially the same functional configurations are denoted by the same reference numerals, and redundant description will be omitted as appropriate. In addition, to avoid cluttering the illustrations, reference numerals may be assigned to only some components, or the illustrations may be simplified or enlarged / reduced. For convenience of description, directions such as left, right, up, and down are defined, but the contents of the present disclosure are not limited to these directions. In the following description, the X-axis, Y-axis, and Z-axis are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis perpendicular to the predetermined plane.

[0010] In the following description, a light-emitting device using a compound semiconductor light-emitting element (LED element) as a self-luminous light-emitting element will be described as an example. However, this does not prohibit the use of light-emitting elements other than LED elements in the light-emitting device according to the present disclosure. Organic light-emitting diodes (OLED) light-emitting elements and light-emitting elements equipped with quantum dots may also be used as the light-emitting element. Furthermore, the size of the light-emitting element in plan view is not particularly limited. For example, among OLED elements and LED elements, so-called micro-OLED elements and micro-LED elements, which are more miniaturized, may also be used as the light-emitting element.

[0011] <Issues to be Considered in the Present Disclosure> First, to facilitate understanding of the present disclosure, issues to be considered in the present disclosure will be described.

[0012] FIG. 1 is a schematic cross-sectional view showing an example of a cross-sectional configuration of a light-emitting device (light-emitting device 1) having a general configuration (e.g., a configuration corresponding to the wearable display device described in Patent Document 1). The light-emitting device 1 includes, for example, a light-emitting unit 2, a drive substrate 3, a cover glass 4, and a wiring substrate 5. The light-emitting unit 2 includes a plurality of LED elements. For example, red, green, and blue are defined as multiple color types, and the light-emitting unit 2 includes a red LED element 6R, a green LED element 6G, and a blue LED element 6B corresponding to these color types. Each of the LED elements 6R, 6G, and 6B constitutes a subpixel, and these three subpixels constitute one pixel. The light-emitting unit 2 is composed of a plurality of pixels. The dominant wavelengths of light corresponding to the red, green, and blue colors can be defined as wavelengths in the range of 610 nm to 650 nm (red wavelength band), 510 nm to 590 nm (green wavelength band), and 440 nm to 480 nm (blue wavelength band), respectively. When there is no need to particularly distinguish between the individual LED elements, they will be collectively referred to as LED elements 6 as appropriate.

[0013] The drive substrate 3 is a so-called backplane and has a first surface 3A and a second surface 3B opposite the first surface 3A. In the following description, for other components, the surface located on the +Z direction (upper side) may be referred to as the first surface, and the surface located on the opposite side of the first surface (lower side) may be referred to as the second surface. A light-emitting unit 2 is provided on the first surface 3A side of the drive substrate 3. The drive substrate 3 has a drive circuit unit that drives multiple LED elements 6, and each LED element 6 is driven by the operation of the drive circuit unit. When each LED element 6 is driven, the LED element 6 emits light. In the configuration of the light-emitting device 1, the +Z direction (from bottom to top in FIG. 1 ) is the light emission direction.

[0014] The cover glass 4 is provided to cover the light-emitting unit 2. A wiring board 5 is connected to an end of the first surface 3A of the drive substrate 3. The wiring board 5 has a first surface 5A and a second surface 5B, and an end of the second surface 5B is connected to an end of the first surface 3A of the drive substrate 3. The wiring board 5 is connected to the drive substrate 3, for example, by an ACF (Anisotropic Conductive Film) 7. Although not shown, the wiring board 5 is connected to an appropriate drive IC (Integrated Circuit). A control signal is supplied from the drive IC to a drive circuit unit of the drive substrate 3 via the wiring board 5. The drive circuit unit of the drive substrate 3 operates in response to the control signal.

[0015] In the configuration of the light emitting device 1, heat generated by the light emission of the LED elements 6 is transferred to the drive substrate 3 and dissipated from the second surface 3B side of the drive substrate 3.

[0016] However, the configuration of the light-emitting device 1 has a problem in that the area of ​​the second surface 3B of the drive substrate 3, i.e., the heat dissipation area, is small. In particular, as the light-emitting device 1 continues to be miniaturized in the future, the heat dissipation area will become even smaller. In addition, because the wiring substrate 5 is connected by the ACF 7, it becomes difficult to pass a large current, which makes it difficult to increase the brightness of the LED elements 6.

[0017] 2 is a schematic cross-sectional view showing an example of a cross-sectional configuration of a light-emitting device (light-emitting device 1A) having another general configuration (for example, a configuration corresponding to the projection display device described in the above-mentioned Patent Document 2). Note that in light-emitting device 1A, components similar to those in light-emitting device 1 are assigned the same reference numerals.

[0018] In the light emitting device 1A, the drive substrate 3 is mounted on a first surface 5A of the wiring substrate 5. The drive substrate 3 and the wiring substrate 5 are connected by wire bonding via a connection portion 8. An opening is formed in a part of the wiring substrate 5, exposing a second surface 3B of the drive substrate 3, and a heat sink 9 is attached so as to come into contact with this portion.

[0019] However, in the configuration of the light emitting device 1A, the contact area between the drive substrate 3 and the heat sink 9 is small, and the size of the heat sink 9 is also large. In addition, there is a problem that the number of parts increases, and the light emitting device 1A becomes large. Taking the above points into consideration, the details of the present disclosure will be described in detail with reference to embodiments.

[0020] First Embodiment [Overall Configuration Example] FIG. 3 is a cross-sectional schematic diagram illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100A) according to the first embodiment. The light-emitting device 100A generally includes a light-emitting unit 10, a drive substrate 20, a cover glass 30, a wiring substrate 40, a reinforcing member 50, a heat-conducting unit 60, and a connecting unit 70. In the configuration of the light-emitting device 100A shown in FIG. 3, light emitted by the light-emitting unit 10 is emitted upward (in the +Z direction) from the cover glass 30. Cross sections of the components of the light-emitting device 100A described below can be observed using a scanning electron microscope (SEM) or composition analysis using energy dispersive X-ray (EDX). The same applies to the light-emitting devices described in other embodiments.

[0021] (Light-Emitting Unit) The light-emitting unit 10 has a plurality of LED elements. For example, red, green, and blue are defined as a plurality of color types, and the light-emitting unit 10 has a red LED element 11R, a green LED element 11G, and a blue LED element 11B corresponding to these color types. Each of the LED elements 11R, 11G, and 11B constitutes a sub-pixel, and these three sub-pixels constitute one pixel. The light-emitting unit 10 is composed of a plurality of pixels. The dominant wavelength of light corresponding to each of the red, green, and blue colors can be, for example, the same wavelength as that of the LED elements 6 constituting the light-emitting unit 2 described above. Note that when there is no need to particularly distinguish between the individual LED elements, they will be collectively referred to as LED elements 11 as appropriate.

[0022] The layout of the individual LED elements 11 is not particularly limited, but may include a layout in which the individual rectangular LED elements 11 are arranged in a matrix. The layout of the LED elements 11 may also be a stripe layout, a delta layout, or the like. The number of LED elements 11 may be changed as appropriate depending on the type of electronic device to which the light emitting device 100A is applied, etc.

[0023] Although not shown in the drawings, the light-emitting unit 10 includes not only the LED elements 11 but also electrodes connected to the LED elements 11 and a protective layer for protecting the LED elements 11. The light-emitting unit 10 may have any known configuration.

[0024] (Drive Substrate) The drive substrate 20 is a so-called backplane, and drives the plurality of LED elements 11. The drive substrate 20 has a first surface 20A and a second surface 20B opposite to the first surface 20A. The light-emitting unit 10 including the above-described LED elements 11 is provided on the first surface 20A side of the drive substrate 20. The drive substrate 20 has, for example, a base material and an interlayer insulating layer (these structures are not shown). The interlayer insulating layer may be formed by being laminated on the base material, or a portion of it may be formed directly on the base material by a semiconductor process.

[0025] The base material is, for example, a semiconductor substrate such as a silicon substrate. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, or single crystal silicon. The interlayer insulating layer is made of, for example, an organic material or an inorganic material. The organic material includes, for example, at least one of polyimide and acrylic resin. The inorganic material includes, for example, at least one of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide.

[0026] The substrate may be an insulating substrate such as a glass substrate, quartz, or resin substrate with low moisture and oxygen permeability. Examples of glass substrates include high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, and quartz glass. Specific examples of resin substrates include at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene naphthalate. The substrate has, for example, a thin plate shape. The substrate may be flexible.

[0027] The interlayer insulating layer is provided with a drive circuit section that drives the plurality of LED elements 11. Examples of the drive circuit section include a drive circuit that controls the drive of the LED elements 11 and a power supply circuit that supplies power to the plurality of LED elements 11 (neither of which are shown). The interlayer insulating layer prevents the various circuits from being exposed to the outside. These drive circuit sections are connected to the wiring board 40 via a connection section 70 (specifically, a wire section 71 provided in the connection section 70).

[0028] (Cover Glass) A cover glass 30 is disposed on the first surface side of the light-emitting unit 10. This seals the first surface side of the light-emitting unit 10. A glass substrate can be used as the cover glass 30. The material of the glass substrate is not particularly limited, as long as it is made of a substance that transmits light emitted from the LED element 11. Examples of materials for the glass substrate include various glass substrates such as high strain point glass, soda glass, borosilicate glass, and lead glass, as well as quartz substrates. The cover glass 30 is not limited to a glass substrate, and may be made of plastic or film.

[0029] In the following description, the laminated structure including the drive substrate 20, the light-emitting unit 10, and the cover glass 30, which are laminated from the −Z direction to the +Z direction, may be referred to as a laminated structure 35.

[0030] (Wiring Board) The wiring board 40 is formed, for example, by an FPC (Flexible Printed Circuits). The wiring board 40 has a first surface 40A and a second surface 40B. A predetermined pattern made of copper foil or the like is formed in an appropriate location on the first surface 40A. Although not shown, this pattern is connected to a drive IC to which the wiring board 40 is attached.

[0031] A laminated structure 35 is mounted at a predetermined location on the first surface 40A of the wiring substrate 40. For example, the first surface 40A of the wiring substrate 40 and the vicinity of the outer edge of the second surface 20B of the drive substrate 20 are adhered with an adhesive 65. The adhesive 65 is not limited to a specific material, but one example is a silver paste resin. In addition, a connection portion 70 is formed at a location on the first surface 40A of the wiring substrate 40 adjacent to the laminated structure 35.

[0032] (Reinforcing Member) The reinforcing member 50 has a first surface 50A and a second surface 50B. The first surface 50A of the reinforcing member 50 is fixed to at least a portion of the second surface 40B of the wiring substrate 40 by adhesive or the like, thereby connecting the two. The strength of the wiring substrate 40 is reinforced by the reinforcing member 50.

[0033] The reinforcing member 50 also functions as a heat dissipation member that dissipates heat generated by the light-emitting unit 10, specifically, the LED elements 11, emitting light. The reinforcing member 50 is made of a thermally conductive material having a thermal conductivity equal to or greater than that of the drive substrate 20. Examples of such a thermally conductive material include metals such as copper (Cu), aluminum (Al), gold (Au), and silver (Ag), as well as compounds thereof. The reinforcing member 50 may also be made of a non-conductive material with high thermal conductivity. Examples of such a material include aluminum nitride (AlN). By making the reinforcing member 50 of a thermally conductive material having a thermal conductivity equal to or greater than that of the drive substrate 20, the reinforcing member 50 can be provided with heat dissipation properties.

[0034] (Heat Conduction Section) The heat conduction section 60 is made of, for example, a thermally conductive material (TIM (Thermal Interface Material)). In this embodiment, heat conduction grease is used as the heat conduction section 60. The heat conduction grease is a liquid containing added heat conduction particles. The heat conduction grease has the advantages of having low thermal resistance, being thin, and not requiring processing such as heating. The heat conduction section 60 is interposed, for example, between the second surface 20B of the drive substrate 20 and the first surface 50A of the reinforcing member 50. As a result, the heat conduction section 60 is thermally connected (to be able to transmit heat) to each of the drive substrate 20 and the reinforcing member 50.

[0035] (Connection Portion) The connection portion 70 includes, for example, a wire portion 71, a molded portion 72, and a dam 73. The wire portion 71 is made of a conductive metal. The material of the wire portion 71 is not particularly limited, but an example includes a material containing at least one metal (including alloys) selected from the group consisting of gold (Au), silver (Ag), palladium (Pd), platinum (Pt), nickel (Ni), aluminum (Al), titanium (Ti), tungsten (W), vanadium (V), chromium (Cr), copper (Cu), zinc (Zn), tin (Sn), and indium (In). The diameter of each wire can be changed as needed, but as an example, a wire of approximately 20 μm is used.

[0036] One end of the wire portion 71 is connected to the drive substrate 20 (e.g., the first surface 20A of the drive substrate 20) and further connected to a drive circuit unit included in the drive substrate 20. The other end of the wire portion 71 is connected to the wiring substrate 40 (e.g., a predetermined pattern formed on the first surface 40A of the wiring substrate 40). That is, the first surface 40A of the wiring substrate 40 is connected to the drive substrate 20 by wire bonding, and the drive substrate 20 and the wiring substrate 40 are electrically connected via the connection portion 70 (specifically, the wire portion 71). A control signal output from the drive IC is supplied from the wiring substrate 40 to the drive circuit unit via the wire portion 71. Then, when the drive circuit unit operates, a predetermined LED element 11 emits light at a predetermined luminous intensity. The number of wires included in the wire portion 71 can be changed as appropriate.

[0037] The molded portion 72 protects the wire portion 71. The molded portion 72 is made of a resin material or the like. The dam 73 serves to block the resin material (sealing material (EC (Encap material)) that constitutes the molded portion 72) from flowing out when the wire portion 71 is molded in the molded portion 72.

[0038] [Manufacturing Method of Light-Emitting Device] Next, an example of a manufacturing method of the light-emitting device 100A according to the first embodiment will be described with reference to Figures 4 to 8. In each figure, A shows an example of a cross-sectional configuration, and B shows a plan view (viewed from the +Z direction toward the -Z direction). This also applies to figures for explaining other manufacturing methods.

[0039] 4A and 4B, a wiring substrate 40 is prepared to which a reinforcing member 50 is attached. As shown in Fig. 4B, a pad portion 41 to which the other end of the wire portion 71 is connected is formed on a first surface 40A of the wiring substrate 40.

[0040] Next, the heat conductive portion 60 is formed at a predetermined location on the first surface 40A of the wiring substrate 40 by coating or the like. Then, an adhesive 65 is applied to a predetermined location around the heat conductive portion 60, and then the laminated structure 35 is attached to the adhesive 65. Specifically, as shown in FIGS. 5A and 5B , the adhesive 65 is attached near the outer edge of the second surface 20B of the drive substrate 20. The adhesive 65 is then hardened by heating in an oven or the like. The heating temperature and heating time are set appropriately depending on the material of the adhesive 65, but as an example, the heating temperature is set to 80° C. and the heating time is set to 1 hour.

[0041] 6A and 6B , the wire portion 71 is connected. Specifically, one end of the wire portion 71 is connected to a predetermined location on the first surface 20A of the drive substrate 20, and the other end of the wire portion 71 is connected to the pad portion 41.

[0042] 7A and 7B, a dam 73 is formed at a predetermined location on the first surface 40A of the wiring substrate 40. For example, as shown in Fig. 7B, a U-shaped dam 73 is formed so as to surround the wire portion 71.

[0043] 8A and 8B, a molded portion 72 is then formed around the wire portion 71. In this manner, the light emitting device 100A is completed.

[0044] [Operation] Heat is generated when the LED elements 11 in the light emitting device 100A emit light. The generated heat is transferred to the reinforcing member 50 via the drive substrate 20, the heat conduction portion 60, and the wiring substrate 40. The heat is then dissipated by the reinforcing member 50.

[0045] [Effects] The light-emitting device 100A according to this embodiment has the following advantages, for example: The drive substrate 20 is mounted on the first surface 40A of the wiring substrate 40. The heat-conducting portion 60 is disposed in the resulting gap between the second surface 20B of the drive substrate 20 and the first surface 40A of the wiring substrate 40. This reduces thermal resistance, allowing heat generated by the light emission of the LED elements 11 to be effectively transferred to the reinforcing member 50. The reinforcing member 50 can also function as a heat dissipation member, allowing for a larger heat dissipation area than the drive substrate 20. Even if the light-emitting device is further miniaturized, the required heat dissipation area can be secured. Furthermore, since there is no need to add a new heat dissipation member, the number of components is not increased and low costs can be achieved. The reinforcing member 50 can be made of a thermally conductive material with a thermal conductivity higher than that of the drive substrate 20, thereby improving heat dissipation efficiency. Connecting the drive substrate 20 and the wiring substrate 40 by wire bonding rather than ACF allows a relatively large current to flow through the light-emitting device 100A.

[0046] Second Embodiment Next, a second embodiment will be described. In the description of the second embodiment, the same or similar components as those in the above description will be denoted by the same reference numerals, and duplicate descriptions will be omitted as appropriate. Furthermore, unless otherwise specified, the matters and effects described in other embodiments can be applied to the second embodiment.

[0047] 9 is a schematic cross-sectional view illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100B) according to the second embodiment. The light-emitting device 100B differs from the light-emitting device 100A in that the wiring substrate 40 has a thermal via portion 42. The thermal via portion 42 is composed of a plurality of vias 42A that penetrate the wiring substrate 40 in the thickness direction (Z direction).

[0048] The thermal via portion 42 is disposed, for example, between the heat conduction portion 60 and the reinforcing member 50. That is, in this embodiment, the heat conduction portion 60 and the reinforcing member 50 are thermally connected via the thermal via portion 42. The thermal via portion 42 can reduce the thermal resistance between the drive board 20 and the reinforcing member 50. That is, the heat generated by the light emission of the LED element 11 can be more efficiently conducted to the reinforcing member 50, which functions as a heat dissipation member.

[0049] An example of a manufacturing method for the light emitting device 100B will now be described. As shown in Figures 10A and 10B, a wiring substrate 40 having a reinforcing member 50 attached thereto is prepared. As shown in Figures 10A and 10B, the wiring substrate 40 according to this embodiment has the thermal via portion 42 described above.

[0050] Next, the heat conductive portion 60 is formed by coating or the like in a location near the thermal via portion 42 on the first surface 40A of the wiring substrate 40. Then, an adhesive 65 is applied to a predetermined location around the heat conductive portion 60, and then the laminated structure 35 is attached to the adhesive 65. Specifically, as shown in FIGS. 11A and 11B , the adhesive 65 is attached near the outer edge of the second surface 20B of the drive substrate 20. The adhesive 65 is then hardened by being heated in an oven or the like. The heating temperature and heating time are set appropriately depending on the material of the adhesive 65, but as an example, the heating temperature is set to 80° C. and the heating time is set to 1 hour.

[0051] 12A and 12B , the wire portion 71 is connected. Specifically, one end of the wire portion 71 is connected to a predetermined location on the first surface 20A of the drive substrate 20, and the other end of the wire portion 71 is connected to the pad portion 41.

[0052] 13A and 13B, a dam 73 is formed at a predetermined location on the first surface 40A of the wiring substrate 40. For example, as shown in Fig. 13B, a U-shaped dam 73 is formed so as to surround the wire portion 71.

[0053] 14A and 14B, a molded portion 72 is then formed around the wire portion 71. In this manner, the light emitting device 100B is completed.

[0054] <Third Embodiment> Next, a third embodiment will be described. In the description of the third embodiment, the same or similar components as those in the above description will be denoted by the same reference numerals, and duplicated descriptions will be omitted as appropriate. Furthermore, unless otherwise specified, the matters and effects described in the other embodiments can be applied to the third embodiment.

[0055] 15 is a schematic cross-sectional view illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100C) according to the third embodiment. The light-emitting device 100C differs from the light-emitting devices 100A and 100B in that the wiring substrate 40 has an opening 43 formed therein.

[0056] As shown in FIG. 15 , the wiring substrate 40 has an opening 43. A heat conduction portion 60 is formed in the opposing gap formed by the opening 43 between the second surface 20B of the drive substrate 20 and the first surface 50A of the reinforcing member 50. In this embodiment, the first surface 60A of the heat conduction portion 60 is directly thermally connected to the second surface 20B of the drive substrate 20, and the second surface 60B of the heat conduction portion 60 is directly thermally connected to the first surface 50A of the reinforcing member 50. This embodiment also reduces the thermal resistance between the drive substrate 20 and the reinforcing member 50. That is, heat generated by the light emission of the LED elements 11 can be more efficiently conducted to the reinforcing member 50, which functions as a heat dissipation member.

[0057] Specific examples of the opening 43 will be described with reference to Figures 16A to 16C. Figures 16A to 16C are views (planar views) of the light-emitting device 100C as viewed from the light-emitting side. Note that in Figures 16A to 16C, the illustration of the light-emitting device 100C is appropriately simplified.

[0058] As shown in Fig. 16A, the shape of the opening 43 indicated by the dotted line is, for example, rectangular. Also, as shown in Fig. 16B, the shape of the opening 43 indicated by the dotted line may be, for example, circular. Also, the opening 43 may have multiple openings. For example, as shown in Fig. 16C, the opening 43 may have four rectangular openings 43A, 43B, 43C, and 43D. Thus, the shape of the opening 43 is not particularly limited, but it is preferable that the shape and size of the opening 43 increase the area of ​​the thermal connection.

[0059] An example of a manufacturing method for the light emitting device 100C will be described. As shown in Figures 17A and 17B, a wiring substrate 40 having a reinforcing member 50 attached thereto is prepared. As shown in Figures 17A and 17B, the wiring substrate 40 according to this embodiment has the opening 43 described above.

[0060] Next, the heat conductive portion 60 is formed at the location of the opening 43 of the wiring substrate 40 by coating or the like. Then, an adhesive 65 is applied to predetermined locations around the heat conductive portion 60, and then the laminated structure 35 is attached to the adhesive 65. Specifically, as shown in FIGS. 18A and 18B , the vicinity of the outer edge of the second surface 20B of the drive substrate 20 is attached to the adhesive 65. Then, the adhesive 65 is hardened by being heated in an oven or the like. The heating temperature and heating time are set appropriately depending on the material of the adhesive 65, but as an example, the heating temperature is set to 80° C. and the heating time is set to 1 hour.

[0061] 19A and 19B , the wire portion 71 is connected. Specifically, one end of the wire portion 71 is connected to a predetermined location on the first surface 20A of the drive substrate 20, and the other end of the wire portion 71 is connected to the pad portion 41.

[0062] 20A and 20B, a dam 73 is formed at a predetermined location on the first surface 40A of the wiring substrate 40. For example, as shown in Fig. 20B, a U-shaped dam 73 is formed so as to surround the wire portion 71.

[0063] 21A and 21B, a molded portion 72 is then formed around the wire portion 71. In this manner, the light emitting device 100C is completed.

[0064] <Fourth Embodiment> Next, a fourth embodiment will be described. In the description of the fourth embodiment, the same or similar components as those in the above description will be denoted by the same reference numerals, and duplicate descriptions will be omitted as appropriate. Furthermore, unless otherwise specified, the matters and effects described in the other embodiments can be applied to the fourth embodiment.

[0065] 22 is a schematic cross-sectional view illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100D) according to the fourth embodiment. The light-emitting device 100D has a wiring substrate 40 similar to the light-emitting device 100A, and the wiring substrate 40 has an opening 43 similar to the light-emitting device 100C described in the third embodiment.

[0066] The reinforcing member 50 included in the light emitting device 100D according to this embodiment has a flat portion 51 and a protrusion 52 that protrudes in the +Z direction (upward) and is formed integrally with the flat portion 51. The flat portion 51 and the protrusion 52 may be separate components that are integrated together.

[0067] The second surface of the flat portion 51 and the second surface of the protrusion 52 form a common second surface, i.e., the second surface 50B of the reinforcing member 50. The first surface 50A of the flat portion 51 is connected to the second surface 40B of the wiring board 40. In this way, the reinforcing member 50 reinforces the strength of the wiring board 40.

[0068] The protrusion 52 is formed at a position corresponding to the opening 43, for example, inside the opening 43. A heat conduction section 60 is formed between a first surface 52A which is an end surface of the protrusion 52 and a second surface 20B of the drive substrate 20. That is, in this embodiment, the first surface 52A which is an end surface of the protrusion 52 and the heat conduction section 60 are directly thermally connected to each other.

[0069] This configuration makes it possible to reduce the gap between the drive substrate 20 and the reinforcing member 50. In other words, it is possible to reduce the thermal resistance between the drive substrate 20 and the reinforcing member 50, and it is possible to efficiently transfer the heat generated by the light emission of the LED elements 11 to the reinforcing member 50.

[0070] It is preferable to form a heat conduction section 60 in order to seal the gap between the second surface 20B of the drive substrate 20 and the first surface 52A of the protrusion 52 without any gaps and form a heat propagation path, but if the gap can be made sufficiently small, the heat conduction section 60 may not be necessary.

[0071] An example of a manufacturing method for the light emitting device 100D will be described. As shown in Figures 23A and 23B, a wiring substrate 40 having a reinforcing member 50 attached thereto is prepared. As shown in Figures 23A and 23B, the wiring substrate 40 has an opening 43, and a protrusion 52 of the reinforcing member 50 is disposed inside the opening 43. Note that there may be a small gap between the outer edge of the opening 43 and the protrusion 52. As shown in Figure 23B, in plan view, a first surface 52A of the protrusion 52 is exposed inside the opening 43.

[0072] Next, the heat conductive portion 60 is formed on the first surface 52A of the protrusion 52 by coating or the like. Then, an adhesive 65 is applied to predetermined locations around the heat conductive portion 60, and then the laminated structure 35 is attached to the adhesive 65. Specifically, as shown in FIGS. 24A and 24B , the adhesive 65 is attached near the outer edge of the second surface 20B of the drive substrate 20. The adhesive 65 is then hardened by heating in an oven or the like. The heating temperature and heating time are set appropriately depending on the material of the adhesive 65, but as an example, the heating temperature is set to 80° C. and the heating time is set to 1 hour.

[0073] 25A and 25B , the wire portion 71 is connected. Specifically, one end of the wire portion 71 is connected to a predetermined location on the first surface 20A of the drive substrate 20, and the other end of the wire portion 71 is connected to the pad portion 41.

[0074] 26A and 26B, a dam 73 is formed at a predetermined location on the first surface 40A of the wiring substrate 40. For example, as shown in Fig. 26B, a U-shaped dam 73 is formed so as to surround the wire portion 71.

[0075] 27A and 27B, a molded portion 72 is then formed around the wire portion 71. In this manner, the light emitting device 100D is completed.

[0076] <Fifth Embodiment> Next, a fifth embodiment will be described. In the description of the fifth embodiment, the same or similar components as those in the above description will be denoted by the same reference numerals, and duplicated descriptions will be omitted as appropriate. Furthermore, unless otherwise specified, the matters and effects described in the other embodiments can be applied to the fifth embodiment.

[0077] 28 is a schematic cross-sectional view illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100E) according to the fifth embodiment. The light-emitting device 100E has a heat-conducting portion 68 instead of the heat-conducting portion 60. The heat-conducting portion 68 according to this embodiment differs from the heat-conducting portion 60 in that it is a heat-conducting adhesive material that has adhesive properties as well as thermal conductivity.

[0078] The heat conductive portion 68 may be made of, for example, a resin-based adhesive such as a urea resin-based adhesive, a melamine resin-based adhesive, a phenol resin-based adhesive, a resorcinol resin-based adhesive, an epoxy-based adhesive, a polyester-based adhesive, a polyurethane-based adhesive, a polyamide-based adhesive, a polyimide-based adhesive, a vinyl acetate resin-based adhesive, a vinyl chloride resin-based adhesive, a polyvinyl alcohol-based adhesive, an acrylic resin-based adhesive, a polyolefin-based adhesive, or a silicone resin-based adhesive; a rubber-based adhesive such as a chloroprene rubber-based adhesive, a nitrile rubber-based adhesive, an SBR-based adhesive, a natural rubber-based adhesive, a recycled rubber-based adhesive, a butyl rubber-based adhesive, a block rubber-based adhesive, a polysulfide-based adhesive, or a silicone-based adhesive; a polyisobutylene-based adhesive, a polyvinyl ether-based adhesive, a chlorinated rubber-based adhesive, or a cellulose-based adhesive to which a thermally conductive inorganic filler has been added.

[0079] 28 , the second surface 20B of the drive substrate 20 and the first surface 50A of the reinforcing member 50 are bonded together by a heat-conducting portion 68. The heat-conducting portion 68 can be made thin, which reduces the thermal resistance between the drive substrate 20 and the reinforcing member 50. This allows the heat generated by the light emission of the LED elements 11 to be efficiently conducted to the reinforcing member 50.

[0080] It is preferable that the difference between the coefficient of thermal expansion (CTE (Coefficient of Thermal Expansion)) of the reinforcing member 50 and the coefficient of thermal expansion of the drive substrate 20 is small (a predetermined value or less). A material for the reinforcing member 50 is selected so that the difference in the coefficient of thermal expansion is a predetermined value or less. In addition, when a TIM material is used as the heat conduction portion, it is preferable to select a soft TIM.

[0081] By selecting the materials etc. as described above, warping of the drive substrate 20 and the reinforcing member 50 can be suppressed, and therefore failures due to disconnection of wiring and degradation of the image quality obtained by the light emitting device 100E can be suppressed.

[0082] For example, when the drive substrate 20 contains silicon (Si), the reinforcing member 50 can be made of aluminum nitride (AlN), for example, to make the thermal expansion coefficients of both substrates approximately equal. In other words, the thermal expansion coefficients can be matched. This also achieves the same effect as above. Note that "the thermal expansion coefficients of both substrates are approximately equal" means that the thermal expansion coefficients are close enough to achieve this effect.

[0083] 29A to 29D, an example of the arrangement of the heat conductive portion 68 will be described. As shown in FIG. 29A, for example, a rectangular opening may be provided in the wiring substrate 40, and the heat conductive portion 68 may be formed inside the opening. The heat conductive portion 68 does not necessarily have to be disposed inside the opening provided in the wiring substrate 40. For example, as shown in FIGS. 29B to 29D, the wiring substrate 40 may be removed so as to reach the outer edge. The heat conductive portion 68 may be formed on the first surface 50A of the reinforcing member 50 that is exposed by removing the wiring substrate 40. The reinforcing member 50 may not originally have a wiring substrate 40 formed in the location where the heat conductive portion 68 is to be formed.

[0084] An example of a manufacturing method for the light emitting device 100E will be described. As shown in Figures 30A and 30B, a wiring substrate 40 having a reinforcing member 50 attached thereto is prepared. In this embodiment, a wiring substrate 40 having a reinforcing member 50 attached near an end portion is prepared. As shown in Figure 30B, in plan view, a first surface 50A of the reinforcing member 50 is exposed in areas other than the area where the wiring substrate 40 is attached.

[0085] 31A and 31B , a heat-conducting portion 68, which is a heat-conductive adhesive, is applied to a predetermined location on the first surface 50A of the reinforcing member 50. Then, the laminated structure 35, specifically the second surface 20B of the drive substrate 20 included in the laminated structure 35, is attached to the heat-conducting portion 68. The heat-conducting portion 68 is then hardened by an appropriate method, thereby fixing the laminated structure 35 to the first surface 50A of the reinforcing member 50.

[0086] 32A and 32B , the wire portion 71 is connected. Specifically, one end of the wire portion 71 is connected to a predetermined location on the first surface 20A of the drive substrate 20, and the other end of the wire portion 71 is connected to the pad portion 41.

[0087] 33A and 33B, a dam 73 is formed at a predetermined location on the first surface 40A of the wiring substrate 40. For example, as shown in Fig. 33B, a U-shaped dam 73 is formed so as to surround the wire portion 71.

[0088] 34A and 34B, a molded portion 72 is then formed around the wire portion 71. In this manner, the light emitting device 100E is completed.

[0089] <Sixth Embodiment> Next, a sixth embodiment will be described. In the description of the sixth embodiment, the same or similar components as those in the above description will be denoted by the same reference numerals, and duplicated descriptions will be omitted as appropriate. Furthermore, unless otherwise specified, the matters and effects described in the other embodiments can be applied to the sixth embodiment.

[0090] FIG. 35 is a cross-sectional schematic diagram illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100F) according to the sixth embodiment. In the light-emitting device 100F, a plurality of LED elements 11 are provided on the first surface 20A of a drive substrate 20. The drive substrate 20 drives the LED elements 11. A wiring substrate 40 is connected near an end of the drive substrate 20. The first surface 40A of the wiring substrate 40 is connected to the drive substrate 20 by wire bonding. A first region AR1 on the first surface 50A of the reinforcing member 50 is directly bonded to the second surface 20B of the drive substrate 20. A second region AR2 on the first surface 50A of the reinforcing member 50 is connected to an end of the second surface 40B of the wiring substrate 40. Here, the end of the second surface 40B of the wiring substrate 40 is a region including a portion connected by wire bonding at the connection portion 70. In this embodiment as well, the reinforcing member 50 is made of a material having a thermal conductivity equal to or higher than that of the drive substrate 20 .

[0091] As described above, the light-emitting device 100F according to this embodiment differs from the light-emitting device 100E according to the fifth embodiment in that the drive substrate 20 and the reinforcing member 50 are directly bonded to each other. Here, "directly bonded" refers to bonding without any intervening layer, as well as bonding without an adhesive such as resin. Specifically, the drive substrate 20 and the reinforcing member 50 may be bonded by anodic bonding, which uses electrostatic attraction while applying a high voltage between the substrates; fusion bonding (hydrophilic bonding), which bonds the substrates at high temperatures after hydrophilic treatment; diffusion bonding, which bonds metal surfaces at high temperatures and pressures below the melting point of the substrates; or surface activation bonding (also called room-temperature bonding), which bonds the surfaces at low temperatures by irradiating them with plasma or the like. Generally, the bonded surfaces are polished and cleaned to be flat and free of contamination or impurities, and then bonded using a surface treatment, temperature, and pressure appropriate for the bonding materials. When silicon or glass is mixed with metal, bonding may be performed via a bonding layer such as metal, but the bonding layer in this specification refers to a bonding layer that is not fused and bonded by heating above the melting point, such as solder bonding or silver paste, but is molecularly bonded below the melting point. Such a bonding layer may be interposed between the drive substrate 20 and the reinforcing member 50. However, from the viewpoint of heat dissipation, it is preferable that the drive substrate 20 and the reinforcing member 50 are directly bonded.

[0092] It is preferable that the difference between the thermal expansion coefficient of the reinforcing member 50 and the thermal expansion coefficient of the drive substrate 20 is small (a predetermined value or less). A material for the reinforcing member 50 is selected so that the difference in thermal expansion coefficient is a predetermined value or less. In addition, when a TIM material is used as the heat conductive portion, it is preferable to select a soft TIM.

[0093] By selecting the materials etc. as described above, warping of the drive substrate 20 and the reinforcing member 50 can be suppressed, and therefore failures due to disconnection of wiring and degradation of the image quality obtained by the light emitting device 100E can be suppressed.

[0094] For example, when the drive substrate 20 contains silicon (Si), the reinforcing member 50 can be made of aluminum nitride (AlN), for example, to make the thermal expansion coefficients of both substrates approximately equal. In other words, the thermal expansion coefficients can be matched. This also achieves the same effect as above. Note that "the thermal expansion coefficients of both substrates are approximately equal" means that the thermal expansion coefficients are close enough to achieve this effect.

[0095] As in the light emitting device 100F, by directly bonding the drive substrate 20 and the reinforcing member 50, it is possible to reduce the thermal resistance between them. This allows the heat generated by the light emission of the LED elements 11 to be efficiently transferred to the reinforcing member 50. Furthermore, it is possible to minimize warping of the drive substrate 20 and the reinforcing member 50 during bonding or when the LED elements 11 generate heat.

[0096] A modified example of the light-emitting device 100F will be described. For example, as shown in FIG. 36 , the reinforcing member 50 of the light-emitting device 100F may have a step portion 53. The step portion 53 is formed, for example, so as to protrude in the +Z direction near the outer edge of the reinforcing member 50. The inner surface 53A of the step portion 53 may be bonded to a side surface 20C of the drive substrate 20 that is substantially perpendicular to the first surface 20A and the second surface 20B. This increases the bonding area between the drive substrate 20 and the reinforcing member 50, thereby improving heat dissipation efficiency. Furthermore, the step when connecting the wire portion 71, specifically, the step between the first surface 20A of the drive substrate 20 and the first surface 40A of the wiring substrate 40, can be reduced, thereby improving the reliability of the wire bonding connection.

[0097] As shown in FIG. 37 , a thermally conductive sheet 45 having high thermal conductivity may be provided on the second surface 40B of the wiring board 40. The thermally conductive sheet 45 is, for example, laminated on the second surface 40B of the wiring board 40. An example of the thermally conductive sheet 45 is copper foil. In this manner, in the second region AR2, the first surface 50A of the reinforcing member 50 and the second surface 40B of the wiring board 40 may be connected via a thermally conductive sheet 45 or the like. This configuration promotes heat dissipation from the wiring board 40. In other words, the heat dissipation area can be increased, thereby improving the heat dissipation performance of the light emitting device 100F.

[0098] A heat dissipation member may be provided on the second surface 50B of the reinforcing member 50. For example, as shown in Fig. 38, heat dissipation fins 55 may be provided on the second surface 50B of the reinforcing member 50. By providing the heat dissipation fins 55, the heat dissipation area of ​​the reinforcing member 50 can be increased. This can improve the heat dissipation performance of the light emitting device 100F.

[0099] <Seventh Embodiment> Next, a seventh embodiment will be described. In the description of the seventh embodiment, the same or similar components as those in the above description will be denoted by the same reference numerals, and duplicate descriptions will be omitted as appropriate. Furthermore, unless otherwise specified, matters described in other embodiments can be applied to the seventh embodiment.

[0100] 39 is a schematic cross-sectional view illustrating an example of the cross-sectional configuration of a light-emitting device (light-emitting device 100G) according to the sixth embodiment. The reinforcing member 50 of the light-emitting device 100G has an attachment portion 80 for attaching the light-emitting device 100G to a housing 205 that is the housing of an electronic device to which the light-emitting device 100G is applied.

[0101] In the present embodiment, the mounting portion 80 includes, for example, a screw hole 81 formed in the reinforcing member 50 and a screw 82 that screws into the screw hole 81. As shown in Fig. 39 , a housing 205 of the electronic device is placed on the second surface 50B of the reinforcing member 50. The housing 205 has a screw hole 205A, and the housing 205 is placed so that the screw hole 205A is below the screw hole 81. The screw 82 is then threaded into the screw hole 81 and the screw hole 205A, thereby mounting the drive substrate 20 to the housing 205 of the electronic device. That is, the light-emitting device 100G having the drive substrate 20 is mounted to the housing 205 of the electronic device.

[0102] An application example of the light emitting device 100G will be specifically described. Fig. 40 is a diagram showing an example of the appearance of AR glasses (AR glasses 200) to which the light emitting device 100G can be applied. The AR glasses 200 according to this example have a glasses-type main body 201 and ear hooks 202 and 203 extending from ends of the main body 201. These frames (main body 201, ear hooks 202, and ear hooks 203) are formed of resin or the like. A user of the AR glasses 200 views people, scenery, and the like in the real world through a right-eye lens 201A and a left-eye lens 201B supported by the main body 201.

[0103] A rod-shaped housing 205 is attached to the outside of the ear hook 202. The housing 205 is bent inward (towards the right-eye lens 201A) near the boundary between the main body 201 and the ear hook 202, and a small display 206 is provided at the tip of the housing 205. The user views the content displayed on the display 206 through the right-eye lens 201A. The housing 205 is made of, for example, metal, but may also be made of resin.

[0104] The housing 205 has an internal space in which the light-emitting device 100G is housed. The light-emitting device 100G emits light based on display data. The display data is supplied to the light-emitting device 100G, for example, via wireless communication. When the light-emitting device 100G emits light, content corresponding to the display data is displayed on the display 206. This allows the user to view the display content of the display 206 superimposed on real space.

[0105] A light guide plate is housed in the internal space of the housing 205. As shown in FIG. 41 , for example, three light guide plates (light guide plates 207A, 207B, and 207C) are housed in the housing 205. The light guide plates 207A, 207B, and 207C are arranged in order of proximity to the light-emitting device 100G. Light emitted from the light-emitting device 100G (indicated by the arrows in FIG. 41 ) is guided by being reflected sequentially from the light guide plate 207A to the light guide plate 207B and the light guide plate 207C, and the light reflected by the light guide plate 207C is projected onto the display 206. As a result, predetermined information is displayed on the display 206, and the content of the display is perceived by the user's eye E.

[0106] As described above, the light emitting device 100G is attached to the housing 205. For example, as shown in Fig. 42 , the light emitting device 100G is attached to a predetermined surface (the inner surface of the housing 205) in the internal space of the housing 205 by means of the attachment portion 80. Specifically, the light emitting device 100G is fixed to the housing 205 by screws.

[0107] According to this embodiment, the heat generated by the LED element 11 can be further conducted from the reinforcing member 50 to the housing 205. This allows heat to be dissipated by the housing 205, which has a larger heat dissipation area. In this way, the light emitting device 100G having the mounting portion 80 can improve heat dissipation efficiency.

[0108] The attachment portion 80 is not limited to screws, but may be fastened with screws, glued, or joined to the housing 205, or the like.

[0109] The light emitting device according to the above embodiment may be provided in various electronic devices, and is particularly suitable for electronic viewfinders for video cameras or single-lens reflex cameras, or head-mounted displays that require high resolution and are used in close proximity to the eyes for magnification.

[0110] 43A and 43B show an example of the appearance of a digital still camera 310. This digital still camera 310 is a single-lens reflex type with interchangeable lenses, and has an interchangeable taking lens unit (interchangeable lens) 312 located approximately in the center of the front of a camera main body 311, and a grip part 313 on the left side of the front for the photographer to hold.

[0111] A monitor 314 is provided at a position shifted to the left from the center on the back of the camera body 311. An electronic viewfinder (eyepiece window) 315 is provided above the monitor 314. By looking through the electronic viewfinder 315, the photographer can visually confirm the optical image of the subject guided by the photographing lens unit 312 and determine the composition of the photograph. The electronic viewfinder 315 is equipped with the above-mentioned light-emitting device.

[0112] 44 shows an example of the appearance of a head-mounted display 320. The head-mounted display 320 has, for example, ear hooks 322 for wearing on the user's head on both sides of a glasses-shaped display unit 321. The display unit 321 is equipped with the above-mentioned light-emitting device.

[0113] 45 shows an example of the appearance of a television device 330. This television device 330 has, for example, an image display screen unit 331 including a front panel 332 and a filter glass 333, and this image display screen unit 331 is equipped with the above-mentioned light-emitting device.

[0114] 46 shows an example of the appearance of a see-through head mounted display 340. The see-through head mounted display 340 includes a main body 341, an arm 342, and a lens barrel 343.

[0115] The main body 341 is connected to the arm 342 and the glasses 350. Specifically, an end of the long side of the main body 341 is coupled to the arm 342, and one side of the main body 341 is connected to the glasses 350 via a connecting member. The main body 341 may also be directly worn on the head of a human body.

[0116] The main body 341 incorporates a control board for controlling the operation of the see-through head mounted display 340 and a display unit. The arm 342 connects the main body 341 to the lens barrel 343 and supports the lens barrel 343. Specifically, the arm 342 is coupled to an end of the main body 341 and an end of the lens barrel 343, respectively, and fixes the lens barrel 343. The arm 342 also incorporates a signal line for communicating data related to images provided from the main body 341 to the lens barrel 343.

[0117] The lens barrel 343 projects image light provided from the main body 341 via the arm 342 through the eyepiece 351 toward the eyes of the user wearing the see-through head mounted display 340. In this see-through head mounted display 340, the display unit of the main body 341 includes the above-described light emitting device.

[0118] 47 shows an example of the appearance of a smartphone 360. The smartphone 360 ​​includes a display unit 361 that displays various information, an operation unit 362 that includes buttons and the like that accept operation inputs from the user, etc. The display unit 361 includes the above-described light-emitting device.

[0119] (Example 6) The light emitting device described above may be provided in various displays provided on vehicles.

[0120] 48A and 48B are diagrams showing an example of the internal configuration of a vehicle 500 equipped with various displays. Specifically, Fig. 48A is a diagram showing an example of the internal appearance of the vehicle 500 from the rear to the front of the vehicle 500, and Fig. 48B is a diagram showing an example of the internal appearance of the vehicle 500 from diagonally rear to diagonally front of the vehicle 500.

[0121] The vehicle 500 includes a center display 501, a console display 502, a head-up display 503, a digital rearview mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes the above-described light-emitting device. For example, all of these displays may include the above-described light-emitting device.

[0122] The center display 501 is disposed in a portion of the dashboard facing the driver's seat 508 and the passenger seat 509. While FIGS. 48A and 48B show an example of a horizontally elongated center display 501 extending from the driver's seat 508 side to the passenger seat 509 side, the screen size and location of the center display 501 are arbitrary. The center display 501 can display information detected by various sensors. As a specific example, the center display 501 can display an image captured by an image sensor, a distance image to obstacles in front of or to the side of the vehicle 500 measured by a ToF sensor, and the body temperature of a passenger detected by an infrared sensor. The center display 501 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information.

[0123] The safety-related information includes information such as detection of drowsiness, distraction, child mischief, whether a seatbelt is fastened, and whether a passenger has been abandoned. This information is detected, for example, by a sensor placed on the back side of the center display 501. The operation-related information is obtained by detecting gestures related to passenger operations using a sensor. The detected gestures may include operations of various equipment within the vehicle 500. For example, operations of the air conditioning system, navigation system, AV system, lighting system, etc. are detected. The life log includes life logs of all passengers. For example, the life log includes a record of each passenger's actions while on board. By acquiring and saving the life log, the condition of the passenger at the time of the accident can be confirmed. The health-related information is obtained by detecting the passenger's body temperature using a sensor such as a temperature sensor, and inferring the passenger's health condition based on the detected body temperature. Alternatively, an image sensor may be used to capture an image of the passenger's face, and the passenger's health condition may be inferred from the facial expression in the image. Furthermore, the system may have an automated voice conversation with the occupant and estimate the occupant's health condition based on the occupant's responses. The authentication / identification-related information includes a keyless entry function that uses a sensor to perform facial recognition, a function that automatically adjusts seat height and position using facial recognition, etc. The entertainment-related information includes a function that uses a sensor to detect operation information of an AV device by the occupant, and a function that recognizes the occupant's face using a sensor and provides content suitable for the occupant via the AV device.

[0124] The console display 502 can be used to display, for example, life log information. The console display 502 is disposed near a shift lever 511 on a center console 510 between a driver's seat 508 and a passenger seat 509. Information detected by various sensors can also be displayed on the console display 502. Furthermore, the console display 502 may display an image of the vehicle's surroundings captured by an image sensor, or an image showing the distance to an obstacle around the vehicle.

[0125] The head-up display 503 is virtually displayed behind the windshield 512 in front of the driver's seat 508. The head-up display 503 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 503 is often virtually located in front of the driver's seat 508, it is suitable for displaying information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500 and the remaining fuel (battery) level.

[0126] The digital rearview mirror 504 can not only display the rear of the vehicle 500 but also the status of passengers in the rear seats. Therefore, by placing a sensor on the back side of the digital rearview mirror 504, it can be used to display life log information, for example.

[0127] The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 can be used to display at least one of, for example, safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 505 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, and for displaying information regarding the operation of AV equipment, air conditioning equipment, etc.

[0128] The rear entertainment display 506 is attached to the back side of the driver's seat 508 and the passenger seat 509 and is intended for viewing by rear seat passengers. The rear entertainment display 506 can be used to display, for example, at least one of safety-related information, operation-related information, a life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, since the rear entertainment display 506 is located directly in front of the rear seat passengers, information related to the rear seat passengers is displayed on the rear entertainment display 506. For example, the rear entertainment display 506 may display information related to the operation of an AV device or an air conditioning system, or may display the results of measuring the body temperature of the rear seat passengers using a temperature sensor.

[0129] A sensor may be placed on the back side of the light-emitting device to measure the distance to surrounding objects. Optical distance measurement methods are broadly divided into passive and active types. Passive methods measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive methods include lens focusing, stereo, and monocular vision. Active methods measure distance by projecting light onto an object and receiving the light reflected from the object with a sensor. Active methods include optical radar, active stereo, photometric stereo, moire topography, and interferometry. The light-emitting device described above can be applied to any of these distance measurement methods. Using a sensor placed on the back side of the light-emitting device described above, the passive or active distance measurement described above can be performed.

[0130] Although the embodiments of the present disclosure have been specifically described above, the contents of the present disclosure are not limited to the above-described embodiments, and various modifications based on the technical ideas of the present disclosure are possible. Modifications will be described below.

[0131] The configurations, methods, steps, shapes, materials, numerical values, etc. given in the embodiments and modifications are merely examples, and different configurations, methods, steps, shapes, materials, numerical values, etc. may be used as needed. Furthermore, the materials given as examples in the embodiments and modifications may be used alone or in combination of two or more, unless otherwise specified.

[0132] The present disclosure may also employ the following configurations. (1) A light-emitting device comprising: a drive substrate having a first surface on which a plurality of light-emitting elements are provided and which drives the light-emitting elements; a heat-conducting portion provided on a second surface of the drive substrate opposite the first surface; a wiring board connected to the drive substrate; and a reinforcing member connected to the second surface of the wiring board, wherein the first surface of the wiring board and the drive substrate are connected by wire bonding, the heat-conducting portion and the reinforcing member are connected, and the reinforcing member is made of a material having a thermal conductivity equal to or higher than that of the drive substrate. (2) The light-emitting device described in (1), wherein the heat-conducting portion and the reinforcing member are connected through a thermal via formed in the wiring board. (3) The light-emitting device described in (1), wherein an opening is formed in the wiring board. (4) The light-emitting device described in (3), wherein the heat-conducting portion and the reinforcing member are directly connected through the opening. (5) The light emitting device according to (3), wherein a protrusion is formed in a location of the reinforcing member corresponding to the opening, and an end face of the protrusion is directly connected to the heat conductive portion. (6) The light emitting device according to (1), wherein the heat conductive portion is made of a heat conductive adhesive, and the second surface of the drive substrate and the first surface of the reinforcing member are bonded by the heat conductive portion. (7) The light emitting device according to any of (1) to (6), wherein the thermal expansion coefficient of the reinforcing member is approximately equal to the thermal expansion coefficient of the drive substrate. (8) An electronic device having the light emitting device according to any of (1) to (7). (9) A light-emitting device comprising: a drive substrate having a plurality of light-emitting elements provided on a first surface side thereof and driving the light-emitting elements; a wiring substrate connected to the drive substrate; and a reinforcing member, wherein a first surface of the wiring substrate is connected to the drive substrate by wire bonding; a first region on the first surface of the reinforcing member is directly bonded to a second surface of the drive substrate; and a second region on the first surface of the reinforcing member is connected to the second surface of the wiring substrate; and the reinforcing member is made of a material having a thermal conductivity equal to or higher than that of the drive substrate.(10) The light-emitting device according to (9), wherein a step portion is formed in the reinforcing member, and an inner surface of the step portion is joined to a part of a side surface of the drive substrate that is approximately perpendicular to the second surface. (11) The light-emitting device according to (9), wherein copper foil is formed on the second surface of the wiring board, and the second surface of the wiring board and the second region of the reinforcing member are connected via the copper foil. (12) The light-emitting device according to (9), wherein a heat dissipation fin is formed on the second surface of the reinforcing member. (13) The light-emitting device according to (9), wherein the reinforcing member has an attachment portion for attaching the light-emitting device. (14) An electronic device having the light-emitting device according to any of (9) to (13).

[0133] DESCRIPTION OF SYMBOLS 10... Light emitting section 11... LED element 20... Drive substrate 20A... First surface of drive substrate 20B... Second surface of drive substrate 40... Wiring substrate 40A... First surface of wiring substrate 40B... Second surface of wiring substrate 45... Thermally conductive sheet 50... Reinforcing member 50A... First surface of reinforcing member 50B... Second surface of reinforcing member 53... Step portion 53A... Inner surface of step portion 55... Heat dissipation fin 60, 68... Thermally conductive section 70... Connection portion 71... Wire portion 80... Mounting portion 100A to 100G... Light emitting device

Claims

1. A light-emitting device comprising: a drive substrate having a first surface on which a plurality of light-emitting elements are provided, the drive substrate driving the light-emitting elements; a heat-conducting portion provided on a second surface of the drive substrate opposite the first surface; a wiring substrate connected to the drive substrate; and a reinforcing member connected to the second surface of the wiring substrate, the first surface of the wiring substrate being connected to the drive substrate by wire bonding, the heat-conducting portion being connected to the reinforcing member, and the reinforcing member being made of a material having a thermal conductivity equal to or greater than that of the drive substrate.

2. The light emitting device according to claim 1, wherein the heat conductive portion and the reinforcing member are connected through a thermal via formed in the wiring board.

3. The light emitting device according to claim 1, wherein an opening is formed in the wiring substrate.

4. The light emitting device according to claim 3, wherein the heat conductive portion and the reinforcing member are directly connected to each other through the opening.

5. The light emitting device according to claim 3, wherein a protrusion is formed at a location on said reinforcing member that corresponds to said opening, and an end face of said protrusion is directly connected to said heat conductive portion.

6. The light emitting device according to claim 1, wherein the heat conductive portion is made of a heat conductive adhesive material, and the second surface of the drive substrate and the first surface of the reinforcing member are bonded together by the heat conductive portion.

7. The light emitting device according to claim 1, wherein the thermal expansion coefficient of said reinforcing member is substantially equal to the thermal expansion coefficient of said driving substrate.

8. An electronic device comprising the light emitting device according to claim 1.

9. A light-emitting device comprising: a drive substrate having a first surface on which a plurality of light-emitting elements are provided, the drive substrate driving the light-emitting elements; a wiring substrate connected to the drive substrate; and a reinforcing member, wherein a first surface of the wiring substrate is connected to the drive substrate by wire bonding, a first region on the first surface of the reinforcing member is directly bonded to a second surface of the drive substrate, and a second region on the first surface of the reinforcing member is connected to the second surface of the wiring substrate, and the reinforcing member is made of a material having a thermal conductivity equal to or greater than that of the drive substrate.

10. The light emitting device according to claim 9, wherein a step portion is formed in the reinforcing member, and an inner surface of the step portion is joined to a part of a side surface of the drive substrate that is approximately perpendicular to the second surface.

11. The light emitting device according to claim 9, wherein a copper foil is formed on a second surface of the wiring board, and the second surface of the wiring board and the second region of the reinforcing member are connected via the copper foil.

12. The light emitting device according to claim 9, wherein a heat dissipation fin is formed on the second surface of the reinforcing member.

13. The light emitting device according to claim 9, wherein the reinforcing member has an attachment portion for attaching the light emitting device.

14. An electronic device comprising the light emitting device according to claim 9.

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