Display panel and display device

Abstract

The present application provides a display panel and a display device. In the display panel, grooves are formed in at least some connection electrodes, and first electrodes are arranged in the grooves. Thus, when micro light-emitting diode devices emit light, the light emitted by the micro light-emitting diode devices can diverge to the side walls and top surfaces of the connection electrodes corresponding to the grooves, so that the connection electrodes can reflect the light emitted by the micro light-emitting diode devices, thereby increasing the brightness of the display panel, and reducing the power consumption of the display panel.

Description

Display panel and display device Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Micro-LED (micro light-emitting diode) displays are widely used due to their high brightness, fast response time, and long lifespan. Existing Micro-LED displays include vertical Micro-LED displays and planar Micro-LED displays. Vertical Micro-LED displays, with electrodes located on both sides of the light-emitting material, offer a smaller chip area than flip-chip Micro-LED displays, eliminate the risk of P / N electrode short circuits, maximize electrode area, provide symmetrical light patterns, and are easier to control than flip-chip displays. However, during use, vertical Micro-LED displays have been found to partially diverge to the sides, resulting in light loss and higher power consumption.

[0003] Therefore, existing Micro-LED display devices have a technical problem in which light diverges to both sides, resulting in light loss. SUMMARY OF THE INVENTION

[0004] Embodiments of the present application provide a display panel and a display device to alleviate the technical problem of existing Micro-LED display devices in which light diverges to both sides and causes light loss.

[0005] To solve the above problems, the technical solutions provided by this application are as follows:

[0006] An embodiment of the present application provides a display panel, comprising:

[0007] A first substrate comprises a driving circuit layer and a connecting electrode layer, wherein the connecting electrode layer is arranged on one side of the driving circuit layer;

[0008] a second substrate disposed opposite to the first substrate, the second substrate comprising a transparent electrode layer;

[0009] a plurality of micro-light emitting diode devices disposed between the first substrate and the second substrate, each of the micro-light emitting diode devices comprising a first electrode, a second electrode, and a light emitting layer, wherein the light emitting layer is disposed between the first electrode and the second electrode;

[0010] The connecting electrode layer includes a plurality of connecting electrodes, at least some of which are provided with grooves, the first electrode is disposed in the grooves, and the first electrode is connected to the connecting electrode, and the second electrode is connected to the transparent electrode layer.

[0011] At the same time, an embodiment of the present application provides a display device, which includes the display panel as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0013] FIG1 is a first schematic diagram of a display panel provided in an embodiment of the present application.

[0014] FIG2 is a second schematic diagram of a display panel provided in an embodiment of the present application.

[0015] FIG3 is a third schematic diagram of a display panel provided in an embodiment of the present application. Modes for Carrying Out the Invention

[0016] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0017] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0018] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0019] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0020] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0021] The embodiments of the present application address the technical problem of existing Micro-LED display devices in which light diverges to both sides, resulting in light loss, and provide a display panel and a display device to alleviate the above technical problem.

[0022] As shown in FIG1 , an embodiment of the present application provides a display panel, wherein the display panel 1 includes:

[0023] The first substrate 11 includes a driving circuit layer 112 and a connecting electrode layer 113 , wherein the connecting electrode layer 113 is provided on one side of the driving circuit layer 112 ;

[0024] A second substrate 12 is disposed opposite to the first substrate 11 , and the second substrate 12 includes a transparent electrode layer 122 ;

[0025] A plurality of micro-LED devices 13 are disposed between the first substrate 11 and the second substrate 12. Each of the micro-LED devices 13 includes a first electrode 131, a second electrode 132, and a light-emitting layer 133. The light-emitting layer 133 is disposed between the first electrode 131 and the second electrode 132.

[0026] The connecting electrode layer 113 includes a plurality of connecting electrodes 113 a , at least some of the connecting electrodes 113 a are provided with grooves 14 , the first electrode 131 is disposed in the grooves 14 , and the first electrode 131 is connected to the connecting electrode 113 a , and the second electrode 132 is connected to the transparent electrode layer 122 .

[0027] An embodiment of the present application provides a display panel, which provides a groove on at least a portion of the connecting electrode so that the first electrode is provided in the groove. When the micro-LED device emits light, the light emitted by the micro-LED device will diverge to the side walls and top surface of the groove corresponding to the connecting electrode, so that the connecting electrode can reflect the light emitted by the micro-LED device, thereby improving the utilization rate of the light emitted by the micro-LED device, avoiding light loss, increasing the brightness of the display panel, and reducing the power consumption of the display panel.

[0028] In order to address the problem that there may be step differences between each micro-LED device, resulting in poor contact between the micro-LED device and the transparent electrode layer, in some embodiments, as shown in FIG1 , the second substrate 12 further includes a support pad 123, which is disposed on a side of the transparent electrode layer 122 away from the micro-LED device 13, and the support pad 123 is disposed correspondingly to the second electrode 132. By arranging the support pad on the second substrate, so that the support pad is disposed on a side of the transparent electrode layer away from the micro-LED device, and the support pad is disposed correspondingly to the second electrode, when the second substrate is aligned with the first substrate, even if there is a step difference between different micro-LED devices, resulting in a gap between the micro-LED device and the transparent electrode layer, the transparent electrode layer can be supported by the support pad, thereby reducing the step difference, allowing the transparent electrode layer to contact the second electrode of the micro-LED device, improving the contact impedance between the transparent electrode layer and the second electrode of the micro-LED device, and improving the yield of the display panel.

[0029] Specifically, considering that micro-LED devices of different luminous colors have different thicknesses, for example, different luminous efficiencies of micro-LED devices of different luminous colors, the thicknesses of the luminescent materials of micro-LED devices of different luminous colors will be different, which will result in step differences between different micro-LED devices, resulting in poor contact between the transparent electrode layer and the second electrode. In the embodiments of the present application, a support pad is provided at a position corresponding to the second electrode, so that the support pad supports the transparent electrode layer, allowing the transparent electrode layer to contact the second electrode, improving the contact between the transparent electrode layer and the second electrode. Furthermore, the support pad has a certain degree of elasticity, which prevents the micro-LED device from being squeezed and damaged.

[0030] Specifically, the width of the support pad is greater than the width of the second electrode. If the width of the support pad is greater than the width of the second electrode, the contact effect between the transparent electrode layer and the second electrode will be better, and it will be easier to align and connect the support pad and the second electrode, reducing the process difficulty and improving the yield of the display panel.

[0031] In some embodiments, the material of the support pad includes an organic photoresist material. By making the material of the support pad include an organic photoresist material, the support pad has better elasticity. When the support pad supports the transparent electrode layer, the part of the transparent electrode layer corresponding to the micro-light-emitting diode device with a smaller thickness can be in direct contact with the second electrode, and the part of the support pad corresponding to the micro-light-emitting diode device with a larger thickness can be compressed and contracted, thereby avoiding squeezing the micro-light-emitting diode device and causing damage to the micro-light-emitting diode device.

[0032] Specifically, the elastic modulus of the support pad is smaller than that of the transparent electrode layer, so that the elasticity of the support pad is better than that of the transparent electrode layer, and the support pad can support the transparent electrode layer and improve the contact effect between the transparent electrode layer and the second electrode.

[0033] Specifically, taking the micro-LED device including a red micro-LED device, a blue micro-LED device and a green micro-LED device as an example, for example, the thickness of the blue micro-LED device is greater than the thickness of the red micro-LED device. When the support pad supports the transparent electrode layer, the support pad presses the transparent electrode layer downward in the area corresponding to the red micro-LED device, so that the part of the transparent electrode layer corresponding to the red micro-LED device can normally contact the second electrode. In the area corresponding to the blue micro-LED device, the support pad can shrink under pressure to avoid squeezing the blue micro-LED device and causing damage to it, thereby improving the yield of the display panel.

[0034] Specifically, the support pad has different thicknesses corresponding to micro-light-emitting diode devices of different luminous colors, so that the support pad can not only solve the problem of poor contact with the transparent electrode layer caused by the step difference of different micro-light-emitting diode devices, but also prevent the micro-light-emitting diode devices from being damaged by pressure, thereby improving the yield of the display panel.

[0035] Specifically, the material of the support pad includes a transparent material. By making the material of the support pad a transparent material, it is avoided that the support pad blocks light and causes light loss.

[0036] In some embodiments, as shown in FIG2 , the support pad 123 includes a first color conversion portion 123a, a second color conversion portion 123b, and a third color conversion portion 123c. The first color conversion portion 123a, the second color conversion portion 123b, and the third color conversion portion 123c are respectively provided corresponding to the plurality of micro-LED devices 13. By including the first color conversion portion, the second color conversion portion, and the third color conversion portion, the support pad can improve the color purity of the micro-LED devices and enhance the display quality of the display panel.

[0037] Specifically, the support pad comprises quantum dots, including red, green, and blue quantum dots, which are arranged corresponding to the plurality of micro-LED devices. By making the support pad comprise quantum dots, including red, green, and blue quantum dots, and corresponding to the plurality of micro-LED devices, the color purity of the micro-LED devices can be improved, thereby enhancing the display quality of the display panel.

[0038] Correspondingly, the material of the first color conversion part is red light quantum dots, the material of the second color conversion part is green light quantum dots, and the material of the third color conversion part is blue light quantum dots.

[0039] Specifically, the shape of the quantum dots can be spherical, rectangular, prism, etc., and the quantum dot materials include hydrogel-loaded quantum dot structures, QD@MOFs, CdSeSiO2, II-VIA, III-VA QD nanorods, Dot-in-rod QD core-shell structure nanorods, dual-emission and triple-emission quantum dot materials, and perovskite quantum dots; the red light quantum dots, green light quantum dots and blue light quantum dots all include a luminescent core and an inorganic protective shell, the material of the green light quantum dot luminescent core includes ZnCdSe2, InP, Cd2SSe and other materials, the material of the red light quantum dot luminescent core includes CdSe, Cd2SeTe, InAs and other materials, the red light quantum dot inorganic protective shell and the green light quantum dot inorganic protective shell both include CdS, ZnSe, ZnCdS2, ZnS, ZnO and other materials, the blue light quantum dots are CdSe@ZnS blue light quantum dots with a core-shell structure or ZnCdS@ZnS blue light quantum dots with a core-shell structure, wherein "CdSe@ZnS" is ZnS coated with CdSe, and "ZnCdS@ZnS" is ZnS coated with ZnCdS.

[0040] In some embodiments, the support pad material includes color resist, including red, green, and blue color resists, and the red, green, and blue color resists are respectively provided corresponding to the plurality of micro-LED devices. By including red, green, and blue color resists in the support pad material, and respectively providing the red, green, and blue color resists corresponding to the plurality of micro-LED devices, the color purity of the micro-LED devices can be improved, thereby enhancing the display quality of the display panel.

[0041] Correspondingly, the material of the first color conversion part is red color resist, the material of the second color conversion part is green color resist, and the material of the third color conversion part is blue color resist.

[0042] In some embodiments, as shown in FIG2 , the second substrate 12 further includes a light shielding layer 124, which is disposed between adjacent support pads 123. By disposing the light shielding layer between adjacent support pads, the light shielding layer can reduce reflection from the metal wires on the first substrate, thereby preventing interference caused by light reflected from the metal wires. Furthermore, the light shielding layer can prevent external light from being reflected from the display panel, thereby improving the display effect of the display panel.

[0043] Specifically, the material of the light shielding layer includes black color resist and black oxide.

[0044] In some embodiments, as shown in FIG3 , the display panel 1 further includes a conductive electrode 15 and a driver chip 21. The connecting electrode layer 113 further includes a common electrode 113 b. The conductive electrode 15 connects the transparent electrode layer 122 and the common electrode 113 b, and the conductive electrode 15 is connected to the driver chip 21. By providing the conductive electrode, the connecting electrode layer includes a common electrode, and the conductive electrode connects the transparent electrode layer and the common electrode, a signal can be input to the transparent electrode layer through the common electrode, allowing the transparent electrode layer to operate normally.

[0045] Specifically, the conductive electrode includes one of a conductive gold ball and a conductive silver paste.

[0046] In some embodiments, the depth of the groove is greater than the thickness of the first electrode. By making the groove deeper than the thickness of the first electrode, at least a portion of the light-emitting layer of the micro-LED device is disposed within the groove. When the micro-LED device emits light, the light emitted by the micro-LED device can illuminate the sidewalls and top surface of the connecting electrode, thereby improving the reflection effect of the light from the micro-LED device, further reducing light loss, improving the light utilization efficiency of the display panel, and reducing the power consumption of the display panel.

[0047] Specifically, the depth of the groove may be one third to one half of the thickness of the micro light emitting diode device.

[0048] In some embodiments, the first electrode contacts the top surface of the connecting electrode and the side surface of the connecting electrode. By making the first electrode contact the top surface of the connecting electrode and the side surface of the connecting electrode, the first electrode and the connecting electrode have better contact effects, reduce the contact impedance between the first electrode and the connecting electrode, and reduce the power consumption of the display panel.

[0049] In some embodiments, the display panel further includes a filling glue, and the filling glue is disposed between adjacent micro light emitting diode devices.

[0050] In some embodiments, the micro-LED device includes a red micro-LED device, a green micro-LED device and a blue micro-LED device. As shown in FIG1 , the light-emitting layer 133 includes a red light-emitting layer 133a, a green light-emitting layer 133b and a blue light-emitting layer 133c.

[0051] In some embodiments, as shown in FIG. 1 , the first substrate 11 further includes a first underlay 111 , and the material of the first underlay includes glass and polyimide.

[0052] In some embodiments, as shown in FIG. 1 , the second substrate 12 further includes a second underlay 121 , and the material of the second underlay includes glass and polyimide.

[0053] In some embodiments, the light emitting layer includes a quantum well layer.

[0054] In some embodiments, the material of the connecting electrode layer includes silver.

[0055] At the same time, an embodiment of the present application provides a method for manufacturing a display panel, which includes a display panel as described in any of the above embodiments.

[0056] Specifically, the display panel preparation method includes:

[0057] Prepare a driving circuit layer and a connecting electrode layer on the first substrate through processes such as film formation, exposure, development, and etching;

[0058] etching the connection electrode layer to form a groove;

[0059] welding the first electrodes of the plurality of micro-light emitting diode devices to the connecting electrodes on the first substrate through a mass transfer and bonding process;

[0060] depositing a transparent conductive layer on the second substrate;

[0061] The first substrate bonded with the micro-LED device is vacuum-aligned with the second substrate so that the second electrode of the micro-LED device contacts the transparent conductive layer. Multiple micro-LED devices are respectively arranged corresponding to the red color resist, the green color resist and the blue color resist.

[0062] In some embodiments, before the step of depositing a transparent conductive layer on the second substrate, the method further includes:

[0063] A support pad is prepared on the second substrate through processes such as photoresist coating, exposure, development, and baking; the setting position of the support pad corresponds to the position of the second electrode of the micro light emitting diode device.

[0064] In some embodiments, before the step of depositing a transparent conductive layer on the second substrate, the method further includes:

[0065] A light shielding layer is prepared on the second substrate by processes such as photoresist coating, exposure, development, and baking;

[0066] The red color resist is prepared by processes such as photoresist coating, exposure, development, and baking;

[0067] Green color resist is prepared through processes such as photoresist coating, exposure, development, and baking;

[0068] The blue color resist is prepared through processes such as photoresist coating, exposure, development, and baking.

[0069] The above embodiments illustrate the structure of the display panel from the perspective of each film layer and the combination of film layers. When there is no conflict between the various embodiments, the various embodiments can be combined to achieve better technical effects, which will not be repeated here. For example, the support pad includes a red color resist, a green color resist, and a blue color resist. The red color resist, the green color resist, and the blue color resist are respectively provided for the plurality of micro-LED devices, and the depth of the groove is greater than the thickness of the first electrode.

[0070] At the same time, an embodiment of the present application provides a display device, which includes the display panel as described in any of the above embodiments.

[0071] Specifically, the display device further includes a flexible circuit board.

[0072] According to the above embodiments, it can be seen that:

[0073] Embodiments of the present application provide a display panel and a display device. The display panel includes a first substrate, a second substrate, and micro-LED devices. The first substrate includes a driving circuit layer and a connecting electrode layer, the connecting electrode layer being disposed on one side of the driving circuit layer. The second substrate is disposed opposite the first substrate and includes a transparent electrode layer. The micro-LED devices are disposed between the first and second substrates. Each micro-LED device includes a first electrode, a second electrode, and a light-emitting layer, the light-emitting layer being disposed between the first and second electrodes. The connecting electrode layer includes a plurality of connecting electrodes, at least some of which are provided with grooves. The first electrode is disposed within the grooves and connected to the connecting electrode, and the second electrode is connected to the transparent electrode layer. By providing grooves on at least some of the connecting electrodes, such that the first electrode is disposed within the grooves, when the micro-LED devices emit light, the light emitted by the micro-LED devices is dispersed onto the sidewalls and top surfaces of the grooves corresponding to the connecting electrodes. This allows the connecting electrodes to reflect the light emitted by the micro-LED devices, thereby improving the utilization rate of the light emitted by the micro-LED devices, avoiding light loss, increasing the brightness of the display panel, and reducing the power consumption of the display panel.

[0074] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0075] The above is a detailed introduction to a display panel and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, comprising: A first substrate, comprising a driving circuit layer and a connecting electrode layer, wherein the connecting electrode layer is arranged on one side of the driving circuit layer; a second substrate, disposed opposite to the first substrate, wherein the second substrate comprises a transparent electrode layer; A plurality of micro light emitting diode devices are disposed between the first substrate and the second substrate, each of the micro light emitting diode devices comprises a first electrode, a second electrode and a light emitting layer, and the light emitting layer is disposed between the first electrode and the second electrode; The connecting electrode layer includes a plurality of connecting electrodes, at least some of the connecting electrodes are provided with grooves, the first electrode is arranged in the groove, and the first electrode is connected to the connecting electrode, and the second electrode is connected to the transparent electrode layer.

2. The display panel according to claim 1, wherein: The second substrate further includes a support pad, which is disposed on a side of the transparent electrode layer away from the micro-LED device, and is disposed corresponding to the second electrode, and has a width greater than a width of the second electrode.

3. The display panel according to claim 2, wherein: The material of the support pad includes organic photoresist material.

4. The display panel according to claim 2, wherein: The support pad includes a first color conversion portion, a second color conversion portion and a third color conversion portion, and the first color conversion portion, the second color conversion portion and the third color conversion portion are respectively arranged corresponding to the plurality of micro light emitting diode devices.

5. The display panel according to claim 4, wherein: The material of the support pad includes one of color resist and quantum dots.

6. The display panel according to claim 5, wherein: The second substrate further includes a light shielding layer, and the light shielding layer is arranged between adjacent support pads.

7. The display panel according to claim 1, wherein: The display panel further includes a conduction electrode and a driving chip. The connection electrode layer further includes a common electrode. The conduction electrode connects the transparent electrode layer and the common electrode, and the conduction electrode is connected to the driving chip.

8. The display panel according to claim 1, wherein: The depth of the groove is greater than the thickness of the first electrode.

9. The display panel according to claim 8, wherein: The conducting electrode comprises one of a conductive gold ball and a conductive silver paste.

10. The display panel according to claim 1, wherein: The first electrode contacts a top surface of the connection electrode and a side surface of the connection electrode.

11. A display device, comprising a display panel, the display panel comprising: A first substrate, comprising a driving circuit layer and a connecting electrode layer, wherein the connecting electrode layer is arranged on one side of the driving circuit layer; a second substrate, disposed opposite to the first substrate, wherein the second substrate comprises a transparent electrode layer; A plurality of micro light emitting diode devices are disposed between the first substrate and the second substrate, each of the micro light emitting diode devices comprises a first electrode, a second electrode and a light emitting layer, and the light emitting layer is disposed between the first electrode and the second electrode; The connecting electrode layer includes a plurality of connecting electrodes, at least some of the connecting electrodes are provided with grooves, the first electrode is arranged in the groove, and the first electrode is connected to the connecting electrode, and the second electrode is connected to the transparent electrode layer.

12. The display device according to claim 11, wherein: The second substrate further includes a support pad, which is disposed on a side of the transparent electrode layer away from the micro-LED device, and is disposed corresponding to the second electrode, and has a width greater than a width of the second electrode.

13. The display device according to claim 12, wherein: The material of the support pad includes organic photoresist material.

14. The display device according to claim 12, wherein: The support pad includes a first color conversion portion, a second color conversion portion and a third color conversion portion, and the first color conversion portion, the second color conversion portion and the third color conversion portion are respectively arranged corresponding to the plurality of micro light emitting diode devices.

15. The display device according to claim 14, wherein: The material of the support pad includes one of color resist and quantum dots.

16. The display device according to claim 15, wherein: The second substrate further includes a light shielding layer, and the light shielding layer is arranged between adjacent support pads.

17. The display device according to claim 11, wherein: The display panel further includes a conduction electrode and a driving chip. The connection electrode layer further includes a common electrode. The conduction electrode connects the transparent electrode layer and the common electrode, and the conduction electrode is connected to the driving chip.

18. The display device according to claim 11, wherein: The depth of the groove is greater than the thickness of the first electrode.

19. The display device according to claim 18, wherein: The conducting electrode comprises one of a conductive gold ball and a conductive silver paste.

20. The display device according to claim 11, wherein: The first electrode contacts a top surface of the connection electrode and a side surface of the connection electrode.

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