X-ray imaging detection unit, module and device

Abstract

Disclosed in the present invention are an X-ray imaging detection unit, module and device. The X-ray imaging detection unit comprises: a circuit substrate having a rigid-flex structure, a photodiode array, a scintillator, and a processing unit; the circuit substrate having the rigid-flex structure comprises a flexible part, and a first rigid part and a second rigid part which are electrically connected by means of the flexible part; the photodiode array and the scintillator are sequentially arranged on the first rigid part as a sensing part which is used for converting an X-ray into a current signal; and the processing unit is arranged on the second rigid part and is used for receiving and processing the current signal from the sensing part, and the flexible part of the circuit substrate enables the processing unit to be foldable relative to the sensing part. According to the present invention, imaging detection modules can be spliced and expanded in a two-dimensional direction, achieving high-efficiency absorption of X-rays in a large-area imaging region.

Description

X-ray imaging detection unit, module and device Technical Field

[0001] The present invention relates to the field of X-ray imaging, and more particularly to an X-ray imaging detection unit, module, and device. Background Art

[0002] Figures 1A-1B show the structure of a common imaging detection module used in security and industrial CT inspection systems. Figure 2 shows the basic structure of an existing dual-energy imaging detection module. Because the imaging detection module contains processing circuitry, it occupies a portion of the substrate area, making it impossible to splice in the Z direction to create a larger Z-direction radiation sensing area. Furthermore, placing too many photodiode arrays on a substrate, or placing an array that is too large, can dramatically reduce production yield and reliability, and increase costs.

[0003] With the continuous development of technology, security inspection and industrial CT inspection systems require that detection devices continue to improve in the following aspects: 1. Image recognition accuracy; 2. Improved production efficiency and faster detection speed; 3. Continuous reduction in equipment costs; 4. Equipment reliability.

[0004] In response to the above demands, how to design an imaging detection module with better performance, more compactness, simplicity, feasibility and relatively low cost has become a problem that technicians in this field want to solve.

[0005] Summary of the Invention

[0006] In one aspect of the present invention, an X-ray imaging detection unit is provided, comprising:

[0007] A circuit substrate with a rigid-flex structure, a photodiode array, a scintillator and a processing unit,

[0008] The circuit substrate with a rigid-flex structure includes a flexible portion and a first rigid portion and a second rigid portion electrically connected via the flexible portion;

[0009] The photodiode array and the scintillator are sequentially arranged on the first rigid part as a sensing part for converting X-rays into current signals;

[0010] The processing unit is provided on the second rigid part, and is used to receive and process the current signal from the sensing part.

[0011] The flexible portion of the circuit substrate enables the processing unit to be foldable relative to the sensing portion.

[0012] Preferably, the X-ray imaging detection unit further comprises a connector or a gold finger provided at an end of the flexible portion of the circuit substrate away from the second rigid portion.

[0013] Preferably, a portion of the flexible part of the circuit substrate is stacked in the first rigid part and a portion of the flexible part of the circuit substrate is stacked in the second rigid part, and the flexible part is exposed from a recess at one side edge of the first rigid part, and the recess provides an accommodation space for the flexible part to bend about the first rigid part.

[0014] A second aspect of the present invention provides an X-ray imaging detection module, comprising a first imaging detection unit and a second imaging detection unit, wherein the first imaging detection unit and the second imaging detection unit are respectively the X-ray imaging detection units described above;

[0015] The sensing portion of the first imaging detection unit and the sensing portion of the second imaging detection unit are stacked as the sensing portion of the imaging detection module.

[0016] The flexible part of the circuit substrate of the first imaging detection unit and the flexible part of the circuit substrate of the second imaging detection unit are arranged relative to the sensing part of the imaging detection module, so that the processing unit of the first imaging detection unit and the processing unit of the second imaging detection unit are foldable relative to the sensing part of the imaging detection module.

[0017] Preferably, the scintillator of the first imaging detection unit is a low-energy scintillator, and the scintillator of the second imaging detection unit is a high-energy scintillator, and the thickness of the low-energy scintillator is smaller than the thickness of the high-energy scintillator.

[0018] Preferably, the sensing portion of the first imaging detection unit and the sensing portion of the second imaging detection unit are fixed by bonding.

[0019] Preferably, the imaging detection module further comprises a filter adhesively fixed between the sensing portion of the first imaging detection unit and the sensing portion of the second imaging detection unit.

[0020] Preferably, the imaging detection module further comprises a base for supporting the sensing part of the imaging detection module.

[0021] A third aspect of the present invention provides an X-ray imaging detection device comprising a bracket, a circuit board, and a plurality of X-ray imaging detection modules as described above;

[0022] The sensing portion of each X-ray imaging detection module is arranged on the first surface of the bracket, and the processing unit of the first imaging detection unit and the processing unit of the second imaging detection unit are arranged on the second surface of the bracket opposite to the first surface;

[0023] The circuit board is fixed to the second surface of the bracket and is electrically connected to the processing unit of the first imaging detection unit and the processing unit of the second imaging detection unit through a connector or a gold finger.

[0024] The X-ray imaging detection device sends the data from the X-ray imaging detection module to the host computer.

[0025] Preferably, the sensing parts of the X-ray imaging detection modules are arranged on the first surface of the bracket to achieve splicing and expansion of multiple X-ray imaging detection modules.

[0026] The beneficial effects of the present invention are as follows:

[0027] The present invention provides a circuit substrate with a rigid-flexible structure, comprising a first rigid portion and a second rigid portion. The X-ray sensing portion of an X-ray imaging detection unit, disposed on the first rigid portion, and a processing circuit for processing current signals, disposed on the second rigid portion, are electrically connected and folded via the flexible portion of the circuit substrate. This allows for a dual-energy X-ray imaging detection module with stacked sensing portions. The present invention provides a simple dual-energy X-ray imaging detection module in which the scintillator, photodiode array, and first rigid portion of the circuit substrate are secured by bonding, simplifying the product manufacturing process and improving production efficiency, yield, and reliability.

[0028] The X-ray imaging detection device of the present invention positions the sensing portion of the dual-energy imaging detection module on one side of a support and connects the processing unit to the other side of the support via an opposing flexible portion. This allows the sensing portion of the imaging detection module to be spliced ​​in all directions, enabling unlimited two-dimensional expansion of the imaging detection module. The large-area dual-energy imaging area of ​​the present invention maximizes X-ray absorption, improving detection speed, efficiency, and image quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0030] FIG1A shows a schematic diagram of the structure of a conventional imaging detection module used in security inspection and industrial CT inspection systems.

[0031] FIG1B is a top view schematic diagram showing the structure of a conventional imaging detection module used in security inspection and industrial CT inspection systems.

[0032] FIG2 shows a schematic diagram of the basic structure of a traditional dual-energy imaging detection module.

[0033] FIG3 is a schematic diagram of a circuit substrate according to an embodiment of the present invention.

[0034] FIG4 is a schematic diagram showing an X-ray imaging detection unit according to an embodiment of the present invention.

[0035] FIG5 is a schematic top view of an X-ray imaging detection unit according to an embodiment.

[0036] FIG6 is a schematic diagram showing an X-ray imaging detection module according to an embodiment of the present invention.

[0037] FIG7A shows a cross-sectional schematic diagram of the X-ray imaging detection device according to the present invention.

[0038] FIG7B shows a schematic diagram of the back structure of the X-ray imaging detection device according to the present invention.

[0039] FIG7C shows a schematic diagram of the front structure of the X-ray imaging detection device according to the present invention. DETAILED DESCRIPTION

[0040] To more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. For the sake of clarity, the dimensions of the various components in the accompanying drawings are not shown to scale. Those skilled in the art should understand that the detailed description below is illustrative rather than restrictive and should not be used to limit the scope of protection of the present invention.

[0041] For ease of description, the XZ plane is assumed to be a horizontal plane, and the Y direction is perpendicular to the horizontal plane. It should be noted that the figures of the present invention are exemplary. As shown in Figures 1A-1B, a conventional imaging detection system used in security inspections and industrial CT inspection systems includes an imaging detection module 101 and a radiation source 102. The imaging detection module includes a collimator 201, a scintillator 202, a photodiode array 203, and a circuit board 204. In the imaging detection system, the radiation source and imaging detection module are mounted on a frame. X-rays emitted by the radiation source penetrate the target and are received by the imaging detection module. The collimator absorbs most of the scattered radiation. The X-rays carrying information about the target are absorbed by the scintillator on the imaging detection module. The scintillator converts the X-rays into light signals, which are absorbed by the photodiode array below and converted into charge signals. The charge signals are then converted into voltage signals or digital signals by a charge processing chip on the circuit board and sent to the data acquisition and processing system, which reconstructs the image of the target and ultimately completes the inspection task. The scintillator and photodiode array pixels 2031 are arranged in the XZ plane. The number of pixels in the Z direction is typically referred to as the number of rows and is greater than or equal to 2. The number of pixels in the X direction is typically referred to as the number of channels and is greater than or equal to 2. Figure 2 shows a conventional dual-energy imaging detection module 111. A first photodiode array and a second photodiode array 213, each comprising photodiode pixels, are disposed on the first and second surfaces of a circuit substrate 214, respectively. A low-energy scintillator 212 is disposed on the surface of the first photodiode array facing away from the circuit substrate, while a high-energy scintillator 222 is disposed on the surface of the second photodiode array facing away from the circuit substrate. Low-energy scintillators are typically used to absorb low-energy X-rays, while high-energy scintillators are typically arranged in high-energy scintillator pixels corresponding to the photodiode pixels of the photodiode array to absorb high-energy X-rays. The processing chip 217 of the imaging detection module is disposed separately from the sensing portion comprising the photodiode array and scintillators on the circuit substrate 214. A filter 216 is used to absorb low-energy stray radiation remaining after X-rays pass through the low-energy scintillator.

[0042] In this structure, the lead pads or electrode balls of the photodiode array are connected to the lead pads or electrode pads on the circuit substrate. The charge current converted from X-rays is introduced through the substrate leads to the charge current processing chip, where it is quantized into a digital signal. The imaging detection system uses an image processing algorithm to reconstruct the digital signal containing information about the target being inspected into a color-coded image capable of roughly classifying material information. Because the processing chip in this imaging detection module structure requires a portion of the circuit substrate area, the imaging detection module can only be spliced ​​in the X direction and not in the Z direction. The photodiode array and its scintillator can only be arranged and extended in the X direction, making it difficult to form a larger area for sensing radiation in the Z direction. Furthermore, when too many photodiode arrays or an overly large photodiode array are installed on a single circuit substrate, production yield and reliability drop sharply, and costs rise.

[0043] The present invention provides a circuit substrate with a rigid-flex structure and an X-ray imaging detection unit including the circuit substrate. This allows for an X-ray detection device with a large X-ray sensing area without increasing the number of photodiodes provided on a single circuit substrate. Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0044] Figure 3 shows a circuit substrate with a rigid-flex structure according to the present invention. The circuit substrate includes a first rigid portion 301 and a flexible portion 303. The first rigid portion 301 comprises a stacked first substrate 3011, a first portion of a flexible circuit board, and a second substrate 3012. The second substrate is recessed inwardly relative to the first substrate by a distance D on one side of the first rigid portion. The flexible circuit board is separated from the first and second substrates at this recess 307 and extends to form the flexible portion 303. The flexible circuit board is made of a flexible material, such as a flexible copper-clad laminate (CCL), which is formed by bonding copper foil to one or both sides of a flexible insulating material such as polyester film or polyimide film through a specific process. The combination of the flexible circuit board and the recess in the first rigid portion enables signal fan-out in a direction perpendicular to the first rigid portion of the circuit substrate. The recess distance D is slightly greater than the thickness of the flexible circuit board, providing space for the flexible portion to bend at this location, enabling the rigid-flex circuit substrate to be arranged in various directions within the dimensions of the first rigid portion. The circuit substrate also includes a second rigid portion 302, which comprises a stacked third substrate 3021, the second portion of the flexible circuit board, and a fourth substrate 3022. The first rigid portion 301 and the second rigid portion 302 are separate and electrically connected via a flexible portion 303. The flexible portion bends to allow the electrically connected first and second rigid portions to overlap.

[0045] As a preferred embodiment, the flexible circuit board extends from the side of the second rigid part away from the first rigid part to form a flexible part 303, and is provided with a connector or gold finger 304 at one end away from the second rigid part. The connector or gold finger is electrically connected to the circuit substrate by, for example, soldering.

[0046] By utilizing the circuit substrate with a rigid-flexible structure as described above, an X-ray imaging detection unit of the present invention can be provided, wherein the sensing part of the X-ray imaging detection unit can be separated from the processing unit at an ideal distance, so as to further provide a dual-energy X-ray imaging detection module with a simple structure and easy preparation, as well as an X-ray imaging detection device including the X-ray imaging detection module.

[0047] Figures 4 and 5 illustrate an X-ray imaging detection unit 300 according to the present invention, comprising a rigid-flex circuit substrate, a photodiode array, a scintillator, and a processing unit. The rigid-flex circuit substrate comprises a first rigid portion 301, a second rigid portion 302, and a flexible portion 303 electrically connected to the first and second rigid portions. A scintillator 308 is disposed on the photodiode array 305 to absorb X-rays and convert them into visible light signals. The photodiode array 305 is disposed on and electrically connected to the first rigid portion 301 of the circuit substrate, and is configured to convert the visible light signals into current signals. The stacked scintillator 308, photodiode array 305, and first rigid portion 301 of the circuit substrate constitute a sensing portion 310 for converting X-rays into current signals. As shown in the figure, this comprises, for example, pixel units 309 formed by corresponding positions of pixels in the photodiode array 305 and the scintillator 308 in the Y direction. A processing unit 306 is disposed on and electrically connected to the second rigid portion 302 to receive and process the current signals from the sensing portion. The flexible portion electrically connecting the first rigid portion and the second rigid portion can fold the processing unit 306 relative to the sensing portion 310, providing the ability to fan out the current signal generated by the sensing portion to the processing unit perpendicular to the direction of the first rigid portion.

[0048] Specifically, the processing unit includes a processing circuit or a processing chip, and the photodiode array is a photodiode array based on a semiconductor material (Si, Ge, etc.) process. One end of the second substrate in the first rigid part of the circuit substrate is recessed relative to the first substrate by a distance, and the recessed distance D is determined as needed, for example, according to the thickness and deflection of the flexible circuit, to provide an accommodation space for the separation and bending of the flexible circuit and the rigid part. As a specific example, the recessed distance D is, for example, greater than 200 microns. Through the application of the rigid-flexible structure, the flexible part of the circuit substrate can be bent relative to the rigid part, so that the signal generated by the photodiode array arranged on the first rigid part can be transmitted to the processing circuit arranged on the second rigid part through the flexible part, thereby realizing the extension and folding of the electrical signal in the Y direction, so that the sensing part of the imaging detection unit can be spliced ​​in both the X and Z directions, achieving the maximum efficiency of X-ray absorption in the required detection area and improving the detection efficiency and image quality of the final target.

[0049] As an optional embodiment, the X-ray imaging detection unit 300 further includes a connector or gold finger 304 electrically connected to the second rigid portion via the flexible portion 303 of the circuit substrate. Through the connector or gold finger, the signal processed by the processing unit 306 can be output to the data acquisition and processing system for reconstructing the image of the inspected object and completing the inspection task.

[0050] As an optional embodiment, the scintillator 308 is bonded to the surface of the photodiode array 305, which is also bonded to the surface of the first rigid portion 301 of the circuit substrate. The X-ray imaging detection unit 300 with this structure can be tested after assembly. Once a qualified imaging detection unit is obtained, the X-ray imaging detection module and X-ray imaging detection device, described in detail below, can be fabricated through subsequent steps with low process technology risk. This reduces the testing costs of the detection unit, module, and device, thereby improving the overall product yield.

[0051] FIG6 illustrates an X-ray imaging detection module 600 according to an embodiment of the present invention, comprising a first X-ray imaging detection unit (also referred to as the first imaging detection unit) and a second X-ray imaging detection unit (also referred to as the second imaging detection unit) having the aforementioned structures. The first imaging detection unit comprises a first circuit substrate with a rigid-flexible structure, a first photodiode array 615, a first scintillator 618, and a first processing unit 616; the second imaging detection unit comprises a second circuit substrate with a rigid-flexible structure, a second photodiode array 625, a second scintillator 628, and a second processing unit 626. The first rigid portion 611 of the first circuit substrate, the first photodiode array 615, and the first scintillator 618, stacked sequentially in the first imaging detection unit, constitute the first sensing portion 610. The first rigid portion 621 of the second circuit substrate, the second photodiode array 625, and the second scintillator 628, stacked sequentially in the second imaging detection unit, constitute the second sensing portion 620. The first sensing portion 610 is located above the second sensing portion 620. The stacked first and second sensing portions constitute the sensing portion 660 of the imaging detection module 600.

[0052] The flexible portion 613 of the first circuit substrate of the first imaging detection unit is positioned on one side of the imaging detection module, while the flexible portion 623 of the second circuit substrate of the second imaging detection unit is positioned on the other side of the imaging detection module. These portions are positioned relative to each other with respect to the sensing portion of the imaging detection module, fanning out the current signals of the first imaging detection unit and the second imaging detection unit from different locations within the imaging detection module. The lengths of the flexible portion 613 of the first circuit substrate and the flexible portion 623 of the second circuit substrate respectively enable the first processing unit 616 on the second rigid portion 612 of the first circuit substrate and the second processing unit 626 on the second rigid portion 622 of the second circuit substrate to be foldable relative to the sensing portion of the imaging detection module. In a preferred embodiment, the first rigid portion 611 of the first circuit substrate and the second rigid portion 621 of the second circuit substrate have the same shape and dimensions. Thus, the imaging detection module constructed in this manner has a sensing portion that has the shape and dimensions of the first rigid portion. Therefore, the imaging detection module according to the present invention can be spliced ​​around the edges in the shape and dimensions of the first rigid portion of the first circuit substrate and the second rigid portion of the second circuit substrate, improving X-ray absorption efficiency and ultimately enhancing object detection efficiency and image quality.

[0053] As an optional embodiment, the first sensing portion 610 of the first imaging detection unit is fixed to the second sensing portion 620 of the second imaging detection unit by bonding, forming the sensing portion 660 of the dual-energy imaging detection module. The first processing unit 616 and the second processing unit 626 in the imaging detection module of the present invention are arranged away from the sensing portion 660 of the imaging detection module via the flexible portion of the circuit substrate, thereby saving the area of ​​the first rigid portion of the sensing portion, enabling a stacked arrangement of the first sensing portion including the first scintillator and the second sensing portion including the second scintillator, further enabling the first sensing portion and the second sensing portion to be fixed by bonding, and simultaneously enabling the dual-energy imaging detection module to be formed and spliced ​​in both the X and Z directions, thereby providing an X-ray imaging detection module with a simple structure and a simple manufacturing method.

[0054] As an optional embodiment, the first scintillator is a low-energy scintillator, the second scintillator is a high-energy scintillator, and the thickness of the first scintillator is smaller than that of the second scintillator.

[0055] Specifically, the first scintillator material includes GOS (Gd2O2S) or GGAG (Gd3Ga3Al2O 12 ) or CsI and other materials, and the second scintillator material includes GOS or GGAG or CWO (CdWO4) material.

[0056] As an optional embodiment, the imaging detection module further includes a filter 640 bonded and fixed between the first sensing portion of the first imaging detection unit and the second sensing portion of the second imaging detection unit, for absorbing low-energy stray X-rays remaining after the X-rays pass through the first imaging detection unit. The filter is typically made of copper, tin, gold, or the like.

[0057] Specifically, the first scintillator 618 of the first sensing portion 610 of the imaging detection module 600 is bonded to the surface of the first photodiode array 615, which is bonded to the surface of the first rigid portion 611 of the first circuit substrate. The first rigid portion is bonded to the filter 640, which is bonded to the second scintillator 628, which is bonded to the surface of the second photodiode array 625, which is bonded to the surface of the first rigid portion 621 of the second circuit substrate. The filter is bonded between the first sensing portion 610 and the second sensing portion 620, simplifying the filter installation method and effectively improving the filter's absorption efficiency. The X-ray imaging detection module 600 with this structure can be tested after assembly. Once a qualified imaging detection module is obtained, the X-ray imaging detection device, described in detail below, can be manufactured through subsequent steps with low process technology risk. This reduces the testing costs of the detection unit, module, and device, thereby improving the overall product yield.

[0058] As a preferred embodiment, the first imaging detection unit of the X-ray imaging detection module 600 also includes a first connector or a first gold finger 614 connected through a flexible portion of the first circuit substrate extending on a side of its second rigid portion away from its first rigid portion, and the second imaging detection unit of the X-ray imaging detection module 600 also includes a second connector or a second gold finger 624 connected through a flexible portion of the second circuit substrate extending on a side of its second rigid portion away from its first rigid portion.

[0059] As a preferred embodiment, the imaging detection module 600 further includes a base 650 for supporting the imaging detection module. Located below the first rigid portion 621 of the second circuit substrate of the second imaging unit, the base 650, as part of the sensing portion 660, provides support for the sensing portion of the imaging detection module and provides mounting holes for installation. Specifically, the base 650 is a metal base made of steel, aluminum, copper, or alloys thereof.

[0060] As a preferred embodiment, the present invention further provides a method for assembling an X-ray imaging detection module, the steps comprising:

[0061] Assembling a first imaging detection unit and a second imaging detection unit respectively, including bonding a photodiode array to a first surface of a first rigid portion of each circuit substrate, bonding a scintillator to a surface of the photodiode array, and disposing a processing unit on the second rigid portion, to obtain a first imaging detection unit assembled with the first scintillator and a second imaging detection unit assembled with the second scintillator;

[0062] Adhere a filter to a surface of the first rigid portion of the first circuit substrate of the first imaging detection unit that is away from the photodiode array;

[0063] The filter on the first imaging detection unit and the second scintillator of the second imaging detection unit are bonded and fixed together, and the flexible portion 613 of the first circuit substrate is positioned on a first side of the imaging detection module, and the flexible portion 623 of the second circuit substrate is positioned on a second side of the imaging detection module opposite to the first side;

[0064] The surface of the first rigid portion 621 of the second circuit substrate of the second imaging detection unit, which is away from the photodiode array, is connected and fixed to the base 650 .

[0065] Specifically, the processing unit is installed, and the first rigid portion of the imaging detection unit's circuit substrate, photodiode array, and scintillator are bonded together to form the sensing portion of the single-energy imaging detection unit. Testing is then performed, and if qualified, the X-ray imaging detection module is assembled using a low-risk process technology to form the dual-energy X-ray imaging detection module, improving product yield and reducing the cost of the imaging detection module.

[0066] Figures 7A-7C illustrate an X-ray imaging detection device 800 according to an embodiment of the present invention, comprising an imaging detection module bracket 810, a circuit board 820, and a plurality of imaging detection modules 600. The circuit board is used to provide a signal path between the imaging detection modules. The sensing portion 660 of each imaging detection module is fixed to the first surface of the imaging detection module bracket, as shown in Figure 7C , which shows the front side of the X-ray imaging detection device 800. The circuit board is fixed to the second surface of the imaging detection module bracket. The first processing unit of the first imaging detection unit and the second processing unit of the second imaging detection unit of each imaging detection module are disposed on the second surface of the imaging detection module bracket and are electrically connected to the circuit board via flexible portions and gold fingers or connectors, as shown in Figure 7B , which shows the back side of the X-ray imaging detection device 800. Specifically, the flexible portion 613 of the first circuit substrate of the first imaging detection unit and the flexible portion 623 of the second circuit substrate of the second imaging detection unit in the imaging detection module 600 are arranged relative to each other, and the length of the flexible portion 613 of the first circuit substrate is set to fold the first processing unit of the first imaging detection unit from one side of the bracket to the second side of the bracket and electrically connect it to the circuit board; the length of the flexible portion 623 of the second circuit substrate is set to fold the second processing unit of the second imaging detection unit from the other side of the bracket to the second side of the bracket and electrically connect it to the circuit board.

[0067] In an optional embodiment, the first imaging detection unit of the X-ray imaging detection module includes a first connector or first gold finger 614 mounted on a flexible portion 613 of the first circuit substrate at an end remote from the first rigid portion of the first circuit substrate. The second imaging detection unit includes a second connector or second gold finger 624 mounted on a flexible portion 623 of the second circuit substrate at an end remote from the first rigid portion of the second circuit substrate. The X-ray imaging detection module is connected to connector 830 of circuit board 820 via the connector or gold finger. The circuit board is used to collect data from each imaging detection module, transmit it to a host computer, and perform image reconstruction using an algorithm.

[0068] As an optional embodiment, the sensing portion of the imaging detection module 600 is fixedly connected to the imaging detection module bracket via, for example, a metal base.

[0069] Specifically, the sensing portions 660 of the imaging detection modules 600 are arranged and spliced ​​along the Z direction on the first surface of the imaging detection module bracket 810, thereby achieving expansion of the imaging detection module in the Z direction. Furthermore, multiple detection devices as shown in Figures 7A-7C can be arranged and spliced ​​in the X direction, and the resulting X-ray detection device achieves splicing and expansion of the pixel units of the detection unit in the entire X-ray detector system in all directions.

[0070] An embodiment of the present invention further provides a method for assembling an X-ray imaging detection device, the steps comprising:

[0071] Mechanically connecting the imaging detection module to the imaging detection module bracket using, for example, a metal base and screws on the imaging detection module, and fixing the sensing portion of the imaging detection module to the first surface of the imaging detection module bracket;

[0072] Bend and fold the flexible portion 613 of the first circuit substrate and the flexible portion 623 of the second circuit substrate, which are positioned opposite each other on the imaging detection module. The first processing unit on the second rigid portion of the first circuit substrate and the second processing unit on the second rigid portion of the second circuit substrate are bent and folded, respectively, to the second side of the imaging detection module bracket using the flexible portion of the first circuit substrate and the flexible portion of the second circuit substrate. The first processing unit and the second processing unit are electrically connected to the circuit board on the second side of the imaging detection module bracket using the first connector or first gold finger and the second connector or second gold finger, respectively. The second rigid portion of the first circuit substrate secures the first processing unit between its second rigid portion and the bracket, while the second rigid portion of the second circuit substrate secures the second processing unit between its second rigid portion and the bracket, protecting the processing units from damage in subsequent steps.

[0073] Repeat the above steps to splice multiple imaging detection modules 600 along the Z direction on the imaging detection module bracket 810. The gaps between the sensing portions 660 of each imaging detection module 600 can be controlled to be very small, so that the sensing portions of each imaging detection module are closely arranged, thereby obtaining an X-ray imaging detection device 800. Furthermore, by splicing the X-ray imaging detection device 800 in the X direction, the detector pixel units can be spliced ​​in all directions, ultimately obtaining an X-ray detector system (not shown).

[0074] Specifically, as shown in FIG. 7A-7C , the X-ray imaging detection module 600 can be applied to a large-area X-ray imaging detection device by closely arranging the sensing portion 660 on the first surface of the bracket 810 .

[0075] In the present invention, the recessed distance D at the ends of the first rigid portion of the first circuit substrate and the first rigid portion of the second circuit substrate of the imaging detection unit of imaging detection module 600 provides space for the flexible portion to bend substantially perpendicularly about the first rigid portion. The first rigid portion of the first circuit substrate of the first imaging detection unit and the first rigid portion of the second circuit substrate of the second imaging detection unit of imaging detection module 600 have the same shape and size. The imaging detection module thus constructed has a sensing portion having the shape and size of the first rigid portion. Therefore, the imaging detection module according to the present invention can be spliced ​​around the perimeter to approximately the size of the first rigid portion, thereby improving the absorption efficiency of large-area X-ray detection devices.

[0076] As an optional embodiment, a first imaging detection unit comprising a low-energy scintillator and a second imaging detection unit comprising a high-energy scintillator, which have passed testing, are assembled with a filter 640 by bonding to form a dual-energy imaging detection module. The dual-energy imaging detection module mechanically secures a sensing portion 660 to the first surface of an imaging detection module bracket 810 via a metal base and screws. The first and second processing units are bent and folded from opposite sides of the bracket to the second surface of the imaging detection module bracket by the flexible portions 613 and 623 of the first and second circuit substrates, which are arranged oppositely. The first and second imaging detection units are electrically connected to a circuit board fixed to the second surface of the imaging detection module bracket for providing a signal path via a first connector or first gold finger 614 and a second connector or second gold finger 624, thereby achieving data control and acquisition. The rigid-flexible circuit substrate of the present invention, the dual-energy X-ray detection module obtained by bonding and stacking, and the relative arrangement of the flexible portions of the first and second circuit substrates relative to the sensing portion enable the sensing portion of the dual-energy imaging detection module to be closely arranged around one surface of the bracket of the imaging detection device.

[0077] The aforementioned assembly structure and method of the compact X-ray imaging detection module enable the design of a large imaging area, improving production efficiency, product yield, and reliability of the X-ray imaging detection device. Furthermore, the dual-energy imaging detection module and device provided by the present invention, with its simple structure and preparation method, enhances the image recognition accuracy of X-ray imaging detection.

[0078] It should be noted that, in the description of the present application, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0079] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. An X-ray imaging detection unit, characterized in that: include: A circuit substrate, a photodiode array, a scintillator and a processing unit with a rigid-flex structure, The circuit substrate with a rigid-flex structure includes a flexible portion and a first rigid portion and a second rigid portion electrically connected through the flexible portion; The photodiode array and the scintillator are sequentially arranged on the first rigid part as a sensing part for converting X-rays into current signals; The processing unit is disposed on the second rigid part, and is used to receive and process the current signal from the sensing part. The flexible portion of the circuit substrate enables the processing unit to be foldable relative to the sensing portion.

2. The X-ray imaging detection unit according to claim 1, characterized in that: The X-ray imaging detection unit further includes a connector or a gold finger arranged at an end of the flexible part of the circuit substrate away from the second rigid part.

3. The X-ray imaging detection unit according to claim 1, characterized in that: The flexible portion is exposed from a recess at one side edge of the first rigid portion, and the recess provides an accommodation space for the flexible portion to bend with respect to the first rigid portion.

4. An X-ray imaging detection module, characterized in that: comprising a first imaging detection unit and a second imaging detection unit, wherein the first imaging detection unit and the second imaging detection unit are respectively the X-ray imaging detection units according to claim 1; The sensing part of the first imaging detection unit and the sensing part of the second imaging detection unit are stacked as the sensing part of the imaging detection module. The flexible part of the circuit substrate of the first imaging detection unit and the flexible part of the circuit substrate of the second imaging detection unit are arranged relative to the sensing part of the imaging detection module, so that the processing unit of the first imaging detection unit and the processing unit of the second imaging detection unit are foldable relative to the sensing part of the imaging detection module.

5. The X-ray imaging detection module according to claim 4, characterized in that: The scintillator of the first imaging detection unit is a low-energy scintillator, and the scintillator of the second imaging detection unit is a high-energy scintillator. The thickness of the low-energy scintillator is smaller than that of the high-energy scintillator.

6. The X-ray imaging detection module according to claim 4, characterized in that: The sensing portion of the first imaging detection unit and the sensing portion of the second imaging detection unit are fixed by bonding.

7. The X-ray imaging detection module according to claim 6, characterized in that: The imaging detection module further includes a filter bonded and fixed between the sensing part of the first imaging detection unit and the sensing part of the second imaging detection unit.

8. The X-ray imaging detection module according to claim 4, characterized in that: The imaging detection module also includes a base for supporting a sensing portion of the imaging detection module.

9. An X-ray imaging detection device, characterized in that: It comprises a bracket, a circuit board and a plurality of X-ray imaging detection modules according to any one of claims 4 to 8; The sensing part of each X-ray imaging detection module is arranged on the first surface of the bracket, and the processing unit of the first imaging detection unit and the processing unit of the second imaging detection unit are arranged on the second surface of the bracket opposite to the first surface; The circuit board is fixed to the second surface of the bracket and is electrically connected to the processing unit of the first imaging detection unit and the processing unit of the second imaging detection unit through a connector or a gold finger. The X-ray imaging detection device sends the data from the X-ray imaging detection module to the host computer.

10. The X-ray imaging detection device according to claim 9, characterized in that: The sensing parts of each X-ray imaging detection module are arranged on the first surface of the bracket, so as to realize the splicing and expansion of multiple X-ray imaging detection modules.

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