Optical module test board and optical module test method

Abstract

The present disclosure provides an optical module test board, comprising: a test board body; a test light source, fixed on the test board body, the data transmission rate of an optical signal emitted by the test light source being configured to be adjustable, and the maximum data transmission rate being greater than or equal to 800 Gbps; a first radio frequency connector, fixed on the test board body and used for being connected to an adapted optical module to be tested, the first radio frequency connector being a QSFP-DD radio frequency connector or an OSFP radio frequency connector; a first optical fiber line, used for transmitting a bit error test optical signal emitted by the test light source to said optical module, so that on the basis of the received bit error test optical signal, said optical module generates and outputs a corresponding bit error test electric signal; and a signal processing module, fixed on the test board body, connected to said optical module by means of a first conductive line on the test board body, and used for receiving, by means of the first conductive line, the bit error test electric signal outputted by said optical module and determining the bit error rate of said optical module on the basis of the bit error test electric signal.

Description

Optical module test board and optical module test method Technical Field

[0001] The present disclosure relates to the technical field of optical module testing, and in particular to an optical module testing board and an optical module testing method. Background Art

[0002] The application of technologies such as cloud computing, VR / AR, AI, and 5G creates a massive demand for data traffic, and this explosive growth requires higher bandwidth. With the rapid development of the communications industry, optical modules are also evolving towards smaller size, higher speeds, and more versatile features. Higher speeds and more complex encoding methods require test systems with stronger anti-interference capabilities and more expensive test equipment. Traditional bit error testing requires equipment such as a test board, a bit error tester, and high-frequency cables connecting the test board and the bit error tester. Bit error testing systems built around these equipment are not only expensive but also suffer from poor stability.

[0003] Summary of the Invention

[0004] In a first aspect, an embodiment of the present disclosure provides an optical module test board, comprising:

[0005] Test board body;

[0006] A test light source is fixed to the test board body, wherein the data transmission rate of the optical signal emitted by the test light source is configured to be adjustable and the maximum data transmission rate is greater than or equal to 800 Gbps, and the test light source is used to generate and emit an error test optical signal;

[0007] A first RF connector is fixed to the test board body and is used for connecting the adapted optical module to be tested so that the optical module to be tested is electrically connected to the corresponding conductive circuit on the test board body, wherein the first RF connector is a QSFP-DD RF connector or an OSFP RF connector;

[0008] a first optical fiber line, configured to transmit the error test optical signal emitted by the test light source to the optical module to be tested, so that the optical module to be tested generates and outputs a corresponding error test electrical signal according to the received error test optical signal;

[0009] A signal processing module is fixed on the test board body and connected to the optical module to be tested through a first conductive circuit on the test board body, and is used to receive the error test electrical signal output by the optical module to be tested through the first conductive circuit, and determine the bit error rate of the optical module to be tested based on the error test electrical signal.

[0010] In some embodiments, the first RF connector is a QSFP-DD RF connector, and the optical module to be tested includes: an 800G QSFP-DD packaged optical module, a 400G QSFP-DD packaged optical module, a 200G QSFP56 packaged optical module, or a 100G QSFP28 packaged optical module;

[0011] Alternatively, the first RF connector is an OSFP RF connector, and the optical module to be tested includes an 800G OSFP packaged optical module.

[0012] In some embodiments, the signal processing module is also connected to the optical module to be tested through a second conductive circuit on the test board body, and the signal processing module is also used to send the output test electrical signal to the optical module to be tested through the second conductive circuit, so that the optical module to be tested can perform output performance testing based on the output test electrical signal.

[0013] In some embodiments, further comprising: a second optical fiber line, a first optical switch, and a second optical switch;

[0014] The TX terminal on the Line side of the optical module to be tested corresponds to M optical channels, the second optical fiber line includes M optical channels, the input end of the first optical switch has M optical channels corresponding to the second optical fiber line in a one-to-one manner, the output end of the first optical switch has 1 optical channel, the input end of the second optical switch has 1 optical channel, and the output end of the second optical switch has N optical channels;

[0015] One end of the second optical fiber line is connected to the optical module to be tested, the other end of the second optical fiber line is connected to the input end of the first optical switch, the output end of the first optical switch is connected to the input end of the second optical switch, and the output end of the second optical switch is connected to at least one optical testing device;

[0016] The second optical fiber line is used to transmit optical signals in the M optical channels corresponding to the TX terminals on the Line side of the optical module to be tested to the first optical switch respectively;

[0017] The first optical switch is configured to transmit an optical signal transmitted by a first target optical channel among the M optical channels at the input end to the output end in response to external control;

[0018] The second optical switch is used to transmit the optical signal at the input end to one second target optical channel among the N optical channels at the output end in response to external control, so that an external test device connected to the second target optical channel can perform a test based on the optical signal in the second target optical channel.

[0019] In some embodiments, the optical module test board further includes:

[0020] a microcontrol unit connected to the signal processing module via a third communication link, configured to send a test signal pattern and a test signal rate corresponding to a current bit error test to the signal processing module via the third communication link signal processing module, and further configured to receive bit error rate information of the optical module to be tested fed back by the signal processing module via the third communication link;

[0021] The micro control unit is configured with at least one communication interface, so that the micro control unit can perform data communication with a host computer through the communication interface.

[0022] In some embodiments, the optical module test board further includes: at least one of a first monitoring module and a second monitoring module;

[0023] The first monitoring module is connected to the test light source via a first communication link, and is configured to monitor the working state of the test light source via the first communication link and generate corresponding first working state information, and send the first working state information to the host computer;

[0024] The second monitoring module is connected to the optical module to be tested via a second communication link, and is used to monitor the working status of the optical module to be tested via the second communication link and generate corresponding second working status information, and send the second working status information to the host computer.

[0025] In some embodiments, the optical module test board further includes: at least one of a dip switch module and a display module;

[0026] The DIP switch module is connected to the first RF connector and is used to control the voltage levels of at least some pins of the first RF connector;

[0027] The display module is connected to the first RF connector and is used to display the working status of at least part of the pins of the first RF connector.

[0028] In some embodiments, the optical module test board further includes: a power module, a step-down chip, and a slow-start chip;

[0029] The power supply module is used to provide the test board with a working voltage;

[0030] The voltage drop chip is electrically connected to the power module and the slow-start chip, and is used to step down the working voltage of the test board provided by the power module to obtain the working voltage of the optical module, and pass the working voltage of the optical module through the slow-start chip to the first RF connector to power the optical module to be tested connected to the first RF connector.

[0031] In a second aspect, an embodiment of the present disclosure further provides an optical module testing method. Based on the optical module testing board provided in the first aspect, the optical module testing method includes the steps of performing a bit error rate test on the optical module to be tested, specifically including:

[0032] The test light source generates and transmits an error test optical signal;

[0033] The first optical fiber line transmits the error test optical signal emitted by the test light source to the optical module to be tested connected to the first RF connector;

[0034] The optical module to be tested generates and outputs a corresponding error test electrical signal according to the received error test optical signal;

[0035] The signal processing module receives the bit error test electrical signal output by the optical module to be tested through the first conductive circuit, and determines the bit error rate of the optical module to be tested according to the bit error test electrical signal.

[0036] In some embodiments, the optical module testing method further includes: performing an optical output test on the optical module to be tested, specifically including:

[0037] The signal processing module sends an output test electrical signal to the optical module to be tested through the second conductive line;

[0038] The optical module to be tested outputs a corresponding output test optical signal based on the output test electrical signal, so that an external test device can implement an output performance test of the optical module to be tested according to the output test optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG1 is a structural block diagram of an optical module test board provided in an embodiment of the present disclosure;

[0040] FIG2 is a schematic diagram of a pin portion of a QSFP-DD RF connector according to an embodiment of the present disclosure;

[0041] FIG3 is a schematic diagram of a pin portion of an OSFP radio frequency connector according to an embodiment of the present disclosure;

[0042] FIG4 is another structural block diagram of an optical module test board provided in an embodiment of the present disclosure;

[0043] FIG5 is a schematic diagram of a circuit structure of a DIP switch module in an embodiment of the present disclosure;

[0044] 6A to 6C are three more structural block diagrams of the optical module test board provided by the embodiments of the present disclosure.

[0045] FIG7 is a flow chart of a method for testing an optical module according to an embodiment of the present disclosure;

[0046] FIG8 is another flowchart of the optical module testing method provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0047] In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the present disclosure is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0048] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described target changes, the relative positional relationship may also change accordingly.

[0049] In each accompanying drawing, identical element adopts similar reference numeral to represent.For the sake of clarity, each part in the accompanying drawings is not all drawn to scale.In addition, some well-known parts may not be shown in the drawings.

[0050] In the embodiments of the present disclosure, 100G / 200G / 400G / 800G optical modules refer to optical modules with data communication transmission rates capable of reaching 100Gbps / 200Gbps / 400Gbps / 800Gbps (gigabits per second), respectively.

[0051] The TX terminal refers to a signal transmission terminal of the corresponding structure, and the RX terminal refers to a signal reception terminal of the corresponding structure.

[0052] Figure 1 is a block diagram of the structure of an optical module test board provided in an embodiment of the present disclosure. Figure 2 is a schematic diagram of the pin portion of a QSFP-DD RF connector in an embodiment of the present disclosure. Figure 3 is a schematic diagram of the pin portion of an OSFP RF connector in an embodiment of the present disclosure. As shown in Figures 1 to 3, the optical module test board can be used to perform bit error testing on optical modules. The optical module test board includes: a test board body, a test light source, a first RF connector, a first optical fiber line, and a signal processing module.

[0053] The test board body is also called a module compliance test board (MCB), which generally includes an insulating board and some conductive circuits pre-set on the insulating board as needed.

[0054] The test light source is fixed to the test board body, and the data transmission rate of the optical signal emitted by the test light source is configured to be adjustable and the maximum data transmission rate is greater than or equal to 800Gbps. In some embodiments, the test light source can be specifically used to generate and emit an error test optical signal.

[0055] In some embodiments, the signal pattern corresponding to the error test optical signal is PRBS31 or PRBS31Q.

[0056] The first RF connector is fixed on the test board body. The first RF connector is used for connecting the adapted optical module to be tested so that the optical module to be tested is electrically connected to the corresponding conductive circuit on the test board body. The first RF connector is a QSFP-DD RF connector or an OSFP RF connector.

[0057] The first optical fiber line is used to transmit the error test optical signal emitted by the test light source to the optical module to be tested, so that the optical module to be tested generates and outputs a corresponding error test electrical signal according to the received error test optical signal.

[0058] The signal processing module is fixed on the test board body and is connected to the optical module to be tested through the first conductive circuit on the test board body. It is used to receive the error test electrical signal output by the optical module to be tested through the first conductive circuit and determine the bit error rate of the optical module to be tested based on the error test electrical signal.

[0059] Specifically, the signal processing module compares the error-detection test signal sent by the optical module under test with a pre-stored standard error-detection test signal to identify bit errors in the received error-detection test signal and calculate the corresponding bit error rate. The specific process of performing error detection and bit error rate calculation based on the error-detection test signal is conventional in the art and will not be described in detail here.

[0060] The optical module test board provided by the disclosed embodiments integrates code transmission, code reception, and testing functions. This board can be used to perform bit error testing on the optical module under test. Compared with existing technologies, this eliminates the need for expensive equipment such as bit error testers and radio frequency cables, significantly reducing testing costs. Furthermore, the optical module test board provided by the disclosed embodiments offers enhanced stability and maintainability.

[0061] In this disclosure, the first optical fiber line includes multiple optical channels, specifically the number of optical channels corresponding to the RX terminals on the Line side of the optical module to be tested. As an example, two 800G 2*DR4 optical fiber lines each include two MPO-12 optical fibers; the left four channels are Tx and the right four channels are Rx. The 2*4 Tx channels of the test light source are connected to the 2*4 Rx channels of the optical module to be tested via an optical attenuator, and the 2*4 Tx channels of the module to be tested are connected to an optical switch.

[0062] In some embodiments, a variable optical attenuator (VOA) is provided on the first optical fiber line. The VOA can adjust the intensity of the error test optical signal input to the optical module to be tested, so as to test the sensitivity of the optical module to be tested during the error test.

[0063] In the disclosed embodiment, the data transmission rate of the optical signal emitted by the test light source is configured to be adjustable, so the optical module test board is compatible with the test requirements of optical modules based on OSFP packaging or QSFP series packaging, such as 800G OSFP packaged optical modules, 800G QSFP-DD packaged optical modules, 400G QSFP-DD packaged optical modules, 200G QSFP56 packaged optical modules, and 100G QSFP28 packaged optical modules.

[0064] As shown in FIG2 , in some embodiments, the first RF connector is a QSFP-DD RF connector. The QSFP-DD RF connector includes two parts (such as U1A and U1B in FIG2 ). In actual use, the QSFP-DD RF connector is an integral chip structure.

[0065] When the first RF connector is a QSFP-DD RF connector, the optical module to be tested may include: an 800G QSFP-DD packaged optical module, a 400G QSFP-DD packaged optical module, a 200G QSFP56 packaged optical module, or a 100G QSFP28 packaged optical module.

[0066] As shown in FIG3 , in some other embodiments, the first RF connector is an OSFP RF connector, and the optical module to be tested includes an 800G OSFP packaged optical module.

[0067] It should be noted that the QSFP-DD RF connector and OSFP RF connector shown in Figures 2 and 3 both include some signal transmission pins TX, some signal receiving pins RX, a ground pin GND, and some functional pins (such as the ModPrsL pin, the InitMode pin, etc.); the QSFP-DD RF connector and OSFP RF connector in this proposal are both standard RF connectors, and the specific structure and function of each pin are not described in detail here.

[0068] The optical module test board provided by the embodiment of the present disclosure can not only support bit error testing of the optical module to be tested, but also support output performance testing of the optical module to be tested.

[0069] Continuing with FIG. 1 , in some embodiments, the signal processing module is further connected to the optical module to be tested via a second conductive circuit on the test board body. The signal processing module is further configured to transmit an output test electrical signal to the optical module to be tested via the second conductive circuit, so that the optical module to be tested can perform an output performance test based on the output test electrical signal. Specifically, the optical module to be tested can output a corresponding optical signal based on the output test electrical signal, and an external test device (e.g., a digital communication analyzer, a spectrometer, an optical power meter, etc.) can test the output performance of the optical module to be tested based on the optical signal output by the optical module to be tested.

[0070] In some embodiments, the signal pattern corresponding to the output test electrical signal may be PRBS15 or PRBS15Q. For example, when the optical module to be tested is a 100G DR1, the signal pattern corresponding to the output test electrical signal is PRBS15; when the optical module to be tested is of another series, the signal pattern corresponding to the output test electrical signal is PRBS15Q.

[0071] Figure 4 is another structural block diagram of the optical module test board provided in an embodiment of the present disclosure. As shown in Figure 4, in some embodiments, the board further includes: a second optical fiber line, a first optical switch, and a second optical switch.

[0072] The TX terminal on the Line side of the optical module to be tested corresponds to M optical channels, the second optical fiber line includes M optical channels, the input end of the first optical switch has M optical channels corresponding one-to-one to the second optical fiber line, the output end of the first optical switch has one optical channel, the input end of the second optical switch has one optical channel, and the output end of the second optical switch has N optical channels. Where N ≥ 2 and N is an integer.

[0073] In practical applications, the number of external test devices required can be selected based on testing requirements, and the value of N in the second optical switch is determined based on the number of external test devices. In principle, each external test device connects to a corresponding optical channel in the second optical switch, so N is greater than or equal to the total number of configured external test devices. Figure 4 illustrates only the case where N is 4, which is for illustrative purposes only and does not limit the technical solutions of this disclosure.

[0074] One end of the second optical fiber line is connected to the optical module to be tested, the other end of the second optical fiber line is connected to the input end of the first optical switch, the output end of the first optical switch is connected to the input end of the second optical switch, and the output end of the second optical switch is connected to at least one optical testing device.

[0075] The second optical fiber line is used to transmit the optical signals in the M optical channels corresponding to the TX terminals on the Line side of the optical module to be tested to the first optical switch respectively.

[0076] The first optical switch is configured to transmit an optical signal transmitted by a first target optical channel among the M optical channels at the input end to the output end in response to external control.

[0077] The second optical switch is used to transmit the optical signal at the input end to one second target optical channel among the N optical channels at the output end in response to external control, so that an external test device connected to the second target optical channel can perform a test based on the optical signal in the second target optical channel.

[0078] That is, the first optical switch can selectively transmit the optical signal in a certain channel (hereinafter referred to as the optical channel to be tested) in the TX terminal on the Line side of the optical module to be tested to the second optical switch, and the second optical switch can selectively transmit the optical signal in the optical channel to be tested to an external test device to perform corresponding testing on the output performance of the optical channel to be tested.

[0079] Continuing to refer to FIG1 and FIG4 , in some embodiments, the optical module test board further includes: a micro-controller unit (MCU). The MCU is connected to the signal processing module via a third communication link, and the MCU is used to send a test signal pattern (generally PRBS31 or PRBS31Q; for example, PRBS31 is used when the electrical port signal is an NRZ signal, and PRBS31Q is used when the electrical port signal is a PAM4 signal) and a test signal rate (determined according to the maximum data transmission rate of the optical module to be tested) corresponding to the current bit error test to the signal processing module via the third communication link signal processing module, and is also used to receive the bit error rate information of the optical module to be tested fed back by the signal processing module via the third communication link.

[0080] In some embodiments, the MCU is configured with at least one communication interface for the MCU to communicate data with the host computer via the communication interface. As an optional embodiment, the MCU is configured with a half-duplex interface (e.g., an I2C interface) and a full-duplex interface (RS232 interface).

[0081] In some embodiments, the MCU is configured with an electrically erasable programmable read-only memory (EEPROM), which pre-stores programs required for the MCU to operate normally. The EEPROM and the MCU can communicate via an SPI interface. Furthermore, the EEPROM can also pre-store programs required for the signal processing module to operate normally, and the EEPROM and the signal processing module can communicate via the SPI interface.

[0082] In some embodiments, the optical module testing board further includes: at least one of a first monitoring module and a second monitoring module.

[0083] The first monitoring module is connected to the test light source via a first communication link, and is used to monitor the working state of the test light source via the first communication link and generate corresponding first working state information, and send the first working state information to the host computer.

[0084] The second monitoring module is connected to the optical module to be tested via a second communication link, and is used to monitor the working status of the optical module to be tested via the second communication link and generate corresponding second working status information, and send the second working status information to the host computer.

[0085] In some embodiments, the first communication link and the second communication link are both I2C serial communication buses.

[0086] In the embodiment of the present disclosure, by setting the above-mentioned first monitoring module and second monitoring module, the working status information of the test light source and the optical module to be tested (for example, including working temperature, working voltage, bias current, transmitted optical power and received optical power, etc.) can be respectively obtained based on digital diagnostic monitoring technology (Digital Diagnostic Monitoring) for monitoring, and the problem can be quickly located and solved when the test light source and the optical module to be tested fail. In addition, based on the first monitoring module and the second monitoring module, the compatibility of the test light source and the optical module to be tested can also be verified (compatibility verification is to analyze whether the working environment of the module complies with the data manual or is compatible with relevant standards; for example, the working voltage exceeds the specified range, the received optical power is too high or too low, the temperature exceeds the working temperature range, etc.).

[0087] In some embodiments, the optical module test board further includes a dip switch module, wherein the dip switch module is connected to the first RF connector and is configured to control the voltage levels of at least some pins of the first RF connector. Exemplarily, the first RF connector is a QSFP-DD RF connector, and the pins controllable by the dip switch module include the InitMode pin, ModSelL pin, ResetL pin, and ModPrsL pin of the QSFP-DD RF connector.

[0088] FIG5 is a schematic diagram of a circuit structure of a DIP switch module in an embodiment of the present disclosure. As shown in FIG5, in one embodiment, referring to FIG4 and FIG5, the DIP switch module includes a first switch SW1, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, and a ninth resistor R9.

[0089] Among them, one end of the sixth resistor R6 is connected to the power supply VCC, and the other end of the sixth resistor R6 is respectively connected to the first end of the first switch SW1 and the QSFP-DD RF connector; one end of the seventh resistor R7 is connected to the power supply VCC, and the other end of the seventh resistor R7 is respectively connected to the second end of the first switch SW1 and the QSFP-DD RF connector; one end of the eighth resistor R8 is connected to the power supply VCC, and the other end of the eighth resistor R8 is respectively connected to the third end of the first switch SW1 and the QSFP-DD RF connector; one end of the ninth resistor R9 is connected to the power supply VCC, and the other end of the ninth resistor R9 is respectively connected to the fourth end of the first switch SW1 and the QSFP-DD RF connector; the fifth end to the eighth end of the first switch SW1 are grounded;

[0090] It is understandable that the dip switch includes but is not limited to a 2-position dip switch, a 3-position dip switch, or a 4-position dip switch. This embodiment is described by taking the first switch SW1 as a 4-position dip switch as an example.

[0091] As shown in Figure 5, the first end to the fourth end of the first switch SW1 are respectively connected to the InitMode pin, ModSelL pin, ResetL pin and ModPrsL pin of the QSFP-DD RF connector. The first switch SW1 is used to control the high and low levels of the InitMode pin, ModSelL pin, ResetL pin and ModPrsL pin.

[0092] In actual use, the first switch SW1 can be closed or opened to control the corresponding pin to be at a high level or a low level.

[0093] It should be noted that, in practical applications, the specific composition of the DIP switch module can be adjusted according to actual needs, and the present disclosure does not impose any restrictions on this.

[0094] In some embodiments, the optical module test board further includes a display module, wherein the display module is connected to the first RF connector and is configured to display the operating status of at least some of the pins of the first RF connector. This allows a tester to visually observe the status of at least one pin of the QSFP RF connector, such as the voltage and current at the corresponding pin, through the display module.

[0095] It should be noted that the display mode of the display module includes but is not limited to LED light display. In some embodiments, the working status of pins including VCC, IntL and ModPrsL can be displayed by LED lights.

[0096] In some embodiments, the optical module test board also includes: a power module, a voltage drop chip and a slow-start chip; wherein, the power module is used to provide the test board working voltage (for example, 12V); the voltage drop chip is electrically connected to the power module and the slow-start chip, and the voltage drop chip is used to step down the test board working voltage provided by the power module to obtain the optical module working voltage (for example, 3.3V), and pass the optical module working voltage through the slow-start chip to the first RF connector to power the optical module to be tested connected to the first RF connector.

[0097] In the embodiment of the present disclosure, a slow-start chip is provided between the optical module operating voltage and the voltage drop chip. This slow-start chip can effectively prevent the optical module to be tested from overcharging, and can also enable the test board to support hot-swapping of the optical module to be tested.

[0098] In addition, the voltage drop chip in the present disclosure can also provide power for the signal processing module and the light source module.

[0099] In some embodiments, a cooling fan is further provided on the optical module test board, and the power module can provide power for the cooling fan.

[0100] In some embodiments, the test light source may specifically be an optical module or a transmitter optical subassembly (TOSA).

[0101] In some embodiments, the signal processing module may be an optical module or a digital signal processing (DSP) chip.

[0102] Figures 6A to 6C are three more structural block diagrams of the optical module test board provided in an embodiment of the present disclosure. As shown in Figure 6A, as one of the specific examples, a second RF connector and a light source optical module are provided on the optical module test board, the second RF connector is fixed on the test board body, the light source optical module is adapted to and connected to the second RF connector, and the data transmission rate of the optical signal emitted by the light source optical module is configured to be adjustable and the maximum data transmission rate is greater than or equal to 800Gbps. The light source optical module is simultaneously used as a test light source and a signal processing module in the present disclosure. Specifically, the light emission submodule included in the light source optical module is used as the above-mentioned test light source, and the digital signal processing chip included in the light source optical module is used as the above-mentioned signal processing module.

[0103] The above technical solution of using the same light source optical module as the test light source and the signal processing module can greatly simplify the structural complexity of the optical module test board.

[0104] As shown in FIG6B , as a second specific example, the optical module test board is not provided with the above-mentioned second RF connector and light source optical module, but is directly provided with an independent optical transmission sub-module and an independent digital signal processing chip. The independent optical transmission sub-module is used as the above-mentioned test light source, and the independent digital signal processing chip is used as the above-mentioned signal processing module.

[0105] The use of the optical transmission sub-module as the test light source and the digital signal processing chip as the signal processing module can greatly reduce the cost of the optical module test board.

[0106] As shown in Figure 6C, as a third specific example, the optical module test board is provided with the above-mentioned second RF connector and light source optical module, and is also provided with an independent digital signal processing chip; wherein, the light source optical module is used as the test light source in the present disclosure, and the independent digital signal processing chip is used as the signal processing module in the present disclosure.

[0107] The above three specific examples are merely three specific optional implementations of the optical module test board in the present disclosure, and do not limit the technical solution of the present disclosure.

[0108] The optical module test board provided by the disclosed embodiment integrates functions such as code transmission and reception, power supply, and monitoring. It is compatible with the testing requirements of optical modules based on OSFP or QSFP series packages, such as 800G OSFP-packaged optical modules, 800G QSFP-DD-packaged optical modules, 400G QSFP-DD-packaged optical modules, 200G QSFP56-packaged optical modules, and 100G QSFP28-packaged optical modules. Compared with existing technologies, it saves expensive equipment such as bit error testers and radio frequency cables, greatly reducing testing costs. In addition, the optical module test board provided by the disclosed embodiment has stronger stability and maintainability.

[0109] FIG7 is a flow chart of an optical module testing method provided by an embodiment of the present disclosure. As shown in FIG7 , the optical module testing method is based on the optical module testing board provided by the previous embodiment, and the optical module testing method includes: step S1 of performing a bit error rate test on the optical module to be tested, specifically including:

[0110] Step S101: A test light source generates and transmits a bit error test optical signal.

[0111] The signal pattern corresponding to the error test optical signal emitted by the test light source is PRBS31Q; the data transmission rate of the error test optical signal emitted by the test light source is determined by the maximum data transmission rate of the optical module to be tested.

[0112] Step S102: The first optical fiber line transmits the error test optical signal emitted by the test light source to the optical module to be tested connected to the first RF connector.

[0113] In some embodiments, an adjustable optical attenuator is provided on the first optical fiber line, and the intensity of the error test optical signal input to the optical module to be tested can be adjusted based on the adjustable optical attenuator, so as to test the sensitivity of the optical module to be tested during the error test (i.e., determine the minimum light intensity that the optical module to be tested can recognize).

[0114] Step S103: The optical module to be tested generates and outputs a corresponding error test electrical signal according to the received error test optical signal.

[0115] Step S104: The signal processing module receives the bit error test electrical signal output by the optical module to be tested through the first conductive circuit, and determines the bit error rate of the optical module to be tested according to the bit error test electrical signal.

[0116] For the detailed description of the above steps S101 to S104 , please refer to the contents of the previous embodiment, which will not be repeated here.

[0117] FIG8 is another flow diagram of the optical module testing method provided by an embodiment of the present disclosure. As shown in FIG8 , when the signal processing module is further connected to the optical module to be tested via the second conductive circuit on the test board body, the optical module testing method includes not only step S1 of the previous embodiment but also step S2 of performing an optical output test on the optical module to be tested, specifically including:

[0118] Step S201: The signal processing module sends an output test electrical signal to the optical module to be tested through the second conductive line.

[0119] In some embodiments, the signal pattern corresponding to the output test electrical signal sent by the signal processing module is PRBS15Q, and the data transmission rate of the output test electrical signal is determined by the maximum data transmission rate of the optical module to be tested.

[0120] Step S202: The optical module to be tested outputs a corresponding output test optical signal based on the output test electrical signal, so that an external test device can perform an output performance test on the optical module to be tested according to the output test optical signal.

[0121] For the detailed description of the above steps S201 to S202, please refer to the contents of the previous embodiment, which will not be repeated here.

[0122] The technical solution of the present disclosure does not limit the order of executing the above steps S1 and S2. The above step S1 may be executed first and then the above step S2, or the above step S2 may be executed first and then the above step S1. Both situations fall within the protection scope of the present disclosure.

[0123] The technical solution of the embodiment of the present disclosure can not only implement a bit error test on the optical module to be tested, but also implement a sensitivity test and an output performance test on the optical module to be tested.

[0124] It should be noted that the flowcharts and block diagrams in the accompanying drawings involved in the above-mentioned embodiments illustrate the possible implementation architectures, functions and operations of the systems, methods and computer program products according to the various embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or part of the code, and the aforementioned module, program segment, or part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the boxes can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified functions or operations, or can be implemented using a combination of dedicated hardware and computer instructions.

[0125] The circuits or sub-circuits described in the embodiments of the present disclosure may be implemented in software or hardware. The described circuits or sub-circuits may also be provided in a processor. For example, they may be described as: a processor comprising: a receiving circuit and a processing circuit, wherein the processing module comprises a writing sub-circuit and a reading sub-circuit. The names of these circuits or sub-circuits do not, in certain circumstances, constitute limitations on the circuits or sub-circuits themselves.

[0126] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. An optical module test board, characterized in that: include: Test board body; A test light source is fixed on the test board body, the data transmission rate of the optical signal emitted by the test light source is configured to be adjustable and the maximum data transmission rate is greater than or equal to 800 Gbps, and the test light source is used to generate and emit an error test optical signal; A first RF connector is fixed on the test board body and is used for connecting the adapted optical module to be tested so that the optical module to be tested is electrically connected to the corresponding conductive circuit on the test board body, wherein the first RF connector is a QSFP-DD RF connector or an OSFP RF connector; A first optical fiber line, used for transmitting the error test optical signal emitted by the test light source to the optical module to be tested, so that the optical module to be tested generates and outputs a corresponding error test electrical signal according to the received error test optical signal; A signal processing module is fixed on the test board body and connected to the optical module to be tested through a first conductive circuit on the test board body, and is used to receive the error test electrical signal output by the optical module to be tested through the first conductive circuit, and determine the bit error rate of the optical module to be tested according to the error test electrical signal.

2. The optical module test board according to claim 1, characterized in that: The first RF connector is a QSFP-DD RF connector, and the optical module to be tested includes: an 800G QSFP-DD packaged optical module, a 400G QSFP-DD packaged optical module, a 200G QSFP56 packaged optical module or a 100G QSFP28 packaged optical module; Alternatively, the first RF connector is an OSFP RF connector, and the optical module to be tested includes an 800G OSFP packaged optical module.

3. The optical module test board according to claim 1, characterized in that: The signal processing module is also connected to the optical module to be tested through a second conductive circuit on the test board body, and the signal processing module is also used to send an output test electrical signal to the optical module to be tested through the second conductive circuit, so that the optical module to be tested can perform an output performance test based on the output test electrical signal.

4. The optical module test board according to claim 3, characterized in that: Also includes: a second optical fiber line, a first optical switch, and a second optical switch; The TX terminal on the Line side of the optical module to be tested corresponds to M optical channels, the second optical fiber line includes M optical channels, the input end of the first optical switch has M optical channels corresponding to the second optical fiber line one by one, the output end of the first optical switch has 1 optical channel, the input end of the second optical switch has 1 optical channel, and the output end of the second optical switch has N optical channels; One end of the second optical fiber line is connected to the optical module to be tested, the other end of the second optical fiber line is connected to the input end of the first optical switch, the output end of the first optical switch is connected to the input end of the second optical switch, and the output end of the second optical switch is connected to at least one optical test device; The second optical fiber line is used to transmit optical signals in M ​​optical channels corresponding to the TX terminals on the Line side of the optical module to be tested to the first optical switch respectively; The first optical switch is used to transmit the optical signal transmitted by one first target optical channel among the M optical channels at the input end to the output end in response to external control; The second optical switch is used to transmit the optical signal at the input end to one second target optical channel among the N optical channels at the output end in response to external control, so that an external test device connected to the second target optical channel can perform a test based on the optical signal in the second target optical channel.

5. The optical module test board according to claim 1, characterized in that: Also includes: A micro control unit, connected to the signal processing module via a third communication link, configured to send a test signal pattern and a test signal rate corresponding to a current bit error test to the signal processing module via the third communication link signal processing module, and also configured to receive bit error rate information of the optical module to be tested fed back by the signal processing module via the third communication link; The micro control unit is configured with at least one communication interface, so that the micro control unit can perform data communication with a host computer through the communication interface.

6. The optical module test board according to claim 1, characterized in that: Also includes: at least one of a first monitoring module and a second monitoring module; The first monitoring module is connected to the test light source through a first communication link, and is used to monitor the working state of the test light source through the first communication link and generate corresponding first working state information, and send the first working state information to the host computer; The second monitoring module is connected to the optical module to be tested via a second communication link, and is used to monitor the working state of the optical module to be tested via the second communication link and generate corresponding second working state information, and send the second working state information to the host computer.

7. The optical module test board according to claim 1, characterized in that: Also includes: At least one of a DIP switch module and a display module; The DIP switch module is connected to the first RF connector and is used to control the level of at least some pins in the first RF connector; The display module is connected to the first RF connector and is used to display the working status of at least part of the pins of the first RF connector.

8. The optical module test board according to any one of claims 1 to 7, characterized in that: Also includes: Power module, step-down chip and slow-start chip; The power supply module is used to provide the test board with working voltage; The voltage drop chip is electrically connected to the power module and the slow-start chip, and is used to step down the working voltage of the test board provided by the power module to obtain the working voltage of the optical module, and pass the working voltage of the optical module through the slow-start chip to the first RF connector to power the optical module to be tested connected to the first RF connector.

9. A method for testing an optical module, characterized in that: Based on the optical module test board described in any one of claims 1 to 8, the optical module testing method includes the step of performing a bit error rate test on the optical module to be tested, specifically including: The test light source generates and transmits a bit error test optical signal; The first optical fiber line transmits the error test optical signal emitted by the test light source to the optical module to be tested connected to the first RF connector; The optical module to be tested generates and outputs a corresponding bit error test electrical signal according to the received bit error test optical signal; The signal processing module receives the bit error test electrical signal output by the optical module to be tested through the first conductive line, and determines the bit error rate of the optical module to be tested according to the bit error test electrical signal.

10. The optical module testing method according to claim 9, characterized in that: The optical module test board is the optical module test board described in claim 3 or 4, and the optical module test method further comprises: a step of performing an optical output test on the optical module to be tested, specifically comprising: The signal processing module sends an output test electrical signal to the optical module to be tested through the second conductive line; The optical module to be tested outputs a corresponding output test optical signal based on the output test electrical signal, so that an external test device can implement an output performance test of the optical module to be tested according to the output test optical signal.

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