Wiring substrate and manufacturing method therefor, and display device

Abstract

A wiring substrate, comprising a base, a plurality of electrodes, and a plurality of leads. The base has a first surface and a second surface arranged opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, wherein at least one of the plurality of side surfaces is a selected side surface. The plurality of electrodes are arranged on the first surface of the base at intervals in a first direction, and / or are arranged on the second surface of the base at intervals in the first direction. The plurality of leads are arranged at intervals in the first direction. The plurality of leads comprise a plurality of first leads and a plurality of second leads, at least one electrode is connected to at least two first leads, and the plurality of second leads are insulated from the electrodes. Moreover, on the first surface or the second surface of the base, at least one second lead is arranged between two first leads which are connected to different electrodes and are adjacent to each other.

Description

Wiring substrate, manufacturing method thereof, and display device

[0001] This application claims priority to Chinese patent application No. 202311021470.1, filed on August 14, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a wiring substrate and a manufacturing method thereof, and a display device. Background Art

[0003] With the development of light-emitting diode (LED) technology, light-emitting substrates using submillimeter or even micron-scale light-emitting diodes (LEDs) have become widely used. This allows products such as liquid crystal displays (LCDs) to achieve contrast levels comparable to those of organic light-emitting diode (OLED) displays while retaining the technical advantages of LCDs. This improves display quality and provides users with a superior visual experience.

[0004] Summary of the Invention

[0005] In one aspect, a wiring substrate is provided. The wiring substrate includes a substrate, a plurality of electrodes, and a plurality of leads. The substrate has a first surface and a second surface disposed opposite each other, and a plurality of side surfaces connecting the first and second surfaces, at least one of the plurality of side surfaces being a selected side surface. The plurality of electrodes are arranged at intervals along a first direction on the first surface of the substrate, and / or are arranged at intervals along the first direction on the second surface of the substrate.

[0006] The multiple leads are spaced apart along the first direction. Each lead includes a first routing segment, a second routing segment, and a third routing segment connected in sequence. The first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface. The multiple leads include multiple first leads and multiple second leads. At least one electrode overlaps at least two of the first leads; the multiple second leads are insulated from the electrodes. Furthermore, on the first or second surface of the substrate, at least one second lead exists between two adjacent first leads connected to different electrodes.

[0007] In some embodiments, the plurality of electrodes include a plurality of first electrodes and a plurality of second electrodes. The plurality of first electrodes are spaced apart along the first direction on the first surface of the substrate. The plurality of second electrodes are spaced apart along the first direction on the second surface of the substrate and correspond one-to-one with the plurality of first electrodes. At least one first electrode and its corresponding second electrode are connected via at least two first leads.

[0008] In some embodiments, the orthographic projection of any first electrode on the substrate at least partially overlaps with the orthographic projection of the corresponding second electrode on the substrate. The substrate includes a first substrate and a second substrate, the first substrate and the second substrate being fixed relative to each other. The first electrode is disposed on a surface of the first substrate away from the second substrate, and the second electrode is disposed on a surface of the second substrate closer to or farther from the first substrate.

[0009] In some embodiments, the first electrode and the second electrode connected to the same first lead constitute an electrode pair, and any electrode pair is connected by a first lead group, and each first lead group includes at least two first leads.

[0010] In some embodiments, a ratio of a width of the first lead group along the first direction to a width of the electrode pair along the first direction is greater than or equal to 1 and less than or equal to 1.8.

[0011] In some embodiments, different first lead groups include the same number of first leads.

[0012] In some embodiments, the number of first leads included in any one of the first lead groups is positively correlated with the width of the electrode pairs connected thereto along the first direction.

[0013] In some embodiments, the first leads in all first lead groups have the same width along the first direction; and / or the intervals between two adjacent first leads in all first lead groups are the same.

[0014] In some embodiments, in each of the first lead groups, a distance between any two adjacent first lead lines along the first direction is less than or equal to a width of any first lead line along the first direction.

[0015] In some embodiments, the distance between any two adjacent leads along the first direction is the same; and / or the width of any two leads along the first direction is the same.

[0016] In some embodiments, a distance between any two adjacent leads along the first direction is less than or equal to a width of any lead along the first direction.

[0017] In another aspect, a display device is provided. The display device includes a wiring substrate according to any of the above embodiments, an electronic component, and a driver circuit board. The electronic component is disposed on a first surface of a substrate of the wiring substrate, and the driver circuit board is connected to the wiring substrate.

[0018] In another aspect, a method for preparing a wiring substrate is provided. The method for preparing a wiring substrate is used to prepare the wiring substrate of any of the above embodiments, and the method comprises:

[0019] A substrate is provided. The substrate has a first surface and a second surface disposed opposite each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one of the plurality of side surfaces being a selected side surface. The first surface of the substrate includes a plurality of electrodes spaced apart along a first direction, and / or the second surface of the substrate includes a plurality of electrodes spaced apart along the first direction.

[0020] A plurality of leads are formed. The plurality of leads are arranged at intervals along the first direction; each lead includes a first routing segment, a second routing segment, and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface; the plurality of leads include a plurality of first leads and a plurality of second leads, at least one of the electrodes overlaps with at least two of the first leads; the plurality of second leads are insulated from the electrodes; and, on the first surface or the second surface of the substrate, at least one second lead exists between two adjacent first leads connected to different electrodes.

[0021] In some embodiments, forming the plurality of leads includes: forming a conductive layer, wherein the conductive layer covers selected side surfaces of the substrate and extends to the first surface and the second surface; etching specific areas of the conductive layer multiple times; and forming the plurality of leads in the unetched portions of the conductive layer.

[0022] In some embodiments, etching the specific regions of the conductive layer multiple times includes: etching a first specific region of the conductive layer multiple times; the unetched portion of the conductive layer forms a plurality of initial leads; and etching a second specific region of each of the initial leads; the unetched portion of the initial lead forms a plurality of leads.

[0023] In some embodiments, the etching sequence of the multiple etchings includes at least one of sequentially etching from one side to the other side of the conductive layer, alternately etching from the middle to both sides of the conductive layer, and alternately etching from both sides to the middle of the conductive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and do not limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, etc. involved in the embodiments of the present disclosure.

[0025] FIG1 is a structural diagram of a display device according to some embodiments;

[0026] FIG2 is a structural diagram of another display device according to some embodiments;

[0027] FIG3 is a cross-sectional view along AA′ in FIG1 ;

[0028] FIG4 is a partial cross-sectional view of a display device according to some embodiments;

[0029] FIG5 is a top view of a light emitting substrate according to some embodiments;

[0030] FIG6 is a circuit diagram of a light emitting substrate according to some embodiments;

[0031] FIG7 is a partial cross-sectional view of a wiring substrate according to some embodiments;

[0032] FIG8 is a partial cross-sectional view of another wiring substrate according to some embodiments;

[0033] FIG9 is a partial cross-sectional view of yet another wiring substrate according to some embodiments;

[0034] FIG10 is a partial cross-sectional view of yet another wiring substrate according to some embodiments;

[0035] FIG11 is a diagram illustrating a connection structure between electrodes and leads of a wiring substrate according to some embodiments;

[0036] FIG12 is a diagram illustrating a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0037] 13 is a diagram illustrating a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0038] FIG14 is a diagram showing a connection structure between electrodes and leads of yet another wiring substrate according to some embodiments;

[0039] FIG15 is a diagram showing a connection structure between electrodes and leads of another wiring substrate according to some embodiments;

[0040] 16 to 18 are flow charts of a method for preparing a wiring substrate according to some embodiments;

[0041] FIG19 is a diagram showing the steps of a method for preparing a wiring substrate according to some embodiments;

[0042] FIG20 is a diagram showing the steps of another method for preparing a wiring substrate according to some embodiments;

[0043] FIG21 is a diagram showing the steps of another method for preparing a wiring substrate according to some embodiments;

[0044] FIG. 22 is a structural diagram of initial leads of a wiring substrate according to some embodiments. DETAILED DESCRIPTION

[0045] The following, in conjunction with the accompanying drawings, clearly and completely describes the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some of the embodiments of the present disclosure, and not all of them. Based on the embodiments provided by this disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this disclosure.

[0046] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0047] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0048] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0049] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0050] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0051] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0052] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0053] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0054] As used herein, "parallel," "perpendicular," and "equal" include the stated conditions and conditions that are similar to the stated conditions, within an acceptable range of deviations as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "equal" includes both absolute equality and approximate equality, where the acceptable range of deviations for approximate equality may include, for example, a difference between two conditions that is less than or equal to 5% of either condition.

[0055] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0056] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0057] As shown in FIG. 1 , some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays an image, whether in motion (eg, video) or stationary (eg, still image), and whether textual or graphic.

[0058] For example, referring to Figures 1 and 2, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, a virtual reality (VR) device, etc.

[0059] For example, as shown in FIG1 , the display device 1000 may be a portable display product; for example, the display device 1000 may be the mobile phone shown in FIG1 . For another example, referring to FIG2 , the display device 1000 may be a wearable device; for example, the display device 1000 may be the watch shown in FIG2 .

[0060] It should be noted that, depending on different application scenarios, the shape of the display surface of the display device 1000 is not unique. The shape of the display surface of the display device 1000 can be any one of circular, elliptical or polygonal, which is not specifically limited in the embodiments of the present disclosure.

[0061] In some embodiments, the display device 1000 may be a liquid crystal display (LCD) device, a mini / micro light emitting display (MLED) device, etc., which is not specifically limited in the embodiments of the present disclosure.

[0062] The following takes the display device 1000 as a liquid crystal display device as an example to schematically illustrate some embodiments of the present disclosure, but the implementation of the present disclosure is not limited to this, and any other display device 1000 can also be considered as long as the same technical concept is applied.

[0063] In some embodiments, referring to FIG3 , the display device 1000 includes a light-emitting substrate 210 and a driver circuit board 230 . The light-emitting substrate 210 has opposing light-emitting and non-light-emitting sides. The light-emitting side refers to the side of the light-emitting substrate 210 that can emit light (the upper side of the light-emitting substrate 210 in FIG3 ), and the non-light-emitting side refers to the side opposite the light-emitting side (the lower side of the light-emitting substrate 210 in FIG3 ). The driver circuit board 230 is disposed on the non-light-emitting side of the light-emitting substrate 210 and is connected to the light-emitting substrate 210 to provide a light-emitting signal to the light-emitting substrate 210. The light-emitting substrate 210 can emit light of only one color or multiple colors. In some examples, the light-emitting substrate 210 is provided with a light-emitting device capable of emitting red light, a light-emitting device capable of emitting green light, and a light-emitting device capable of emitting blue light, respectively. The light-emitting substrate 210 can directly achieve full-color display.

[0064] In some embodiments, referring to FIG. 4 , a display device 1000 includes a display panel 100 , a backlight module 200 , a housing 300 , and a cover plate 400 .

[0065] As shown in FIG4 , the display panel 100 includes a display side and a non-display side that are arranged opposite to each other. The display side refers to the side of the display panel 100 used to display the image (the upper side of the display panel 100 in FIG4 ), and the non-display side refers to the other side opposite to the display side (the lower side of the display panel 100 in FIG4 ). The cover plate 400 is arranged on the light-emitting side of the display panel 100, and the cover plate 400 is used to protect the display panel 100. For example, the material used for the cover plate 400 can be a rigid material such as glass, quartz, plastic, or a flexible material such as a polymer resin. The backlight module 200 is arranged on the non-light-emitting side of the display panel 100, and the backlight module 200 is used to provide a light source for the display panel 100. The housing 300 can be an open box-shaped structure, and the display panel 100 and the backlight module 200 are arranged in the housing 300. The cover plate 400 is arranged on the light-emitting side of the display panel 100 and is located at the opening of the housing 300. The backlight module 200 is arranged on the non-light-emitting side of the display panel 100. The backlight module 200 includes a light emitting substrate 210 and a driving circuit board 230.

[0066] In other examples, the backlight module 200 further includes a plurality of optical films 220, and the light-emitting substrate 210 can directly emit white light, which is then homogenized by the plurality of optical films 220 and then emitted toward the display panel 100. Alternatively, the light-emitting substrate 210 can also emit light of other colors (e.g., blue light), which is then color-converted and homogenized by the plurality of optical films 220 and then emitted toward the display panel 100.

[0067] For example, referring to FIG. 4 , along a direction perpendicular to the light emitting substrate 210 and away from the light emitting substrate 210 , the plurality of optical films 220 include a diffuser 221 , a quantum dot film 222 , a diffuser 223 and a composite film 224 that are sequentially arranged.

[0068] The diffuser 221 blurs the light emitted by the light-emitting substrate 210 and provides support for the quantum dot film 222, diffuser 223, and composite film 224. The quantum dot film 222, when stimulated by light of a certain color emitted by the light-emitting substrate 210, converts that light into white light, thereby improving the utilization of the light energy of the light-emitting substrate 210. The diffuser 223 evens out the light passing through it. The composite film 224 improves the light extraction efficiency of the backlight module 200, thereby increasing the display brightness of the display device 1000.

[0069] It should be noted that the composite film 224 may include a brightness enhancement film (BEF) and a reflective polarized brightness enhancement film (DBEF), which utilizes the principles of total reflection, refraction, and polarization to increase the light flux within a certain angle range to improve the brightness of the display device 1000.

[0070] For example, the light-emitting substrate 210 emits blue light in a direction away from the light-emitting substrate 210. The quantum dot film 222 may include a red quantum dot material, a green quantum dot material, and a transparent material. When the blue light emitted by the light-emitting substrate 210 passes through the red quantum dot material, it is converted into red light; when the blue light passes through the green quantum dot material, it is converted into green light; the blue light can directly pass through the transparent material; then, the blue light, red light, and green light are mixed and superimposed in a certain proportion to present white light. Finally, the diffuser 221 and the diffuser sheet 223 can mix the white light evenly to improve the light shadow produced by the light-emitting substrate 210 and improve the display quality of the display device 1000.

[0071] In some embodiments, referring to FIG. 4 , the light emitting substrate 210 includes a wiring substrate 10 and an electronic component 20 , and the electronic component 20 is disposed on the wiring substrate 10 .

[0072] As shown in FIG. 4 and FIG. 5 , the electronic component 20 may include a light emitting device 21 and / or a microchip 22 .

[0073] The light-emitting device 21 may include a Micro LED and / or a Mini LED. For example, the size (e.g., length) of a Micro LED is less than 50 microns, such as 10 to 50 microns. For another example, the size (e.g., length) of a Mini LED is 50 to 150 microns, such as 80 to 120 microns.

[0074] The microchip 22 may include a sensor chip and a driver chip. The sensor chip may be, for example, a light sensor chip or a heat sensor chip, etc. The driver chip is used to provide a driving signal to the light emitting device 21 .

[0075] Exemplarily, as shown in FIG5 and FIG6 , the light-emitting substrate 210 includes a plurality of driving units 211 arranged in an array, and each driving unit 211 includes a plurality of light-emitting devices 21 connected in series and / or in parallel.

[0076] For example, as shown in Figures 5 and 6, each driving unit 211 includes four light-emitting devices 21 connected in series. Of course, each driving unit 211 may also include three, five, six, or eight light-emitting devices 21, and the connection mode of the multiple light-emitting devices 21 in the driving unit 211 is not limited to series connection, but may also be parallel connection, or a combination of series and parallel connection, and the embodiments of the present disclosure are not limited thereto.

[0077] In addition, one microchip 22 can drive multiple light-emitting devices 21 in one driving unit 211 to emit light, or can drive multiple light-emitting devices 21 in multiple driving units 211 to emit light respectively.

[0078] For example, as shown in FIG5 and FIG6, every four driving units 211 are electrically connected to a microchip 22, and the microchip 22 is electrically connected to the multiple light-emitting devices 21 in the four driving units 211, respectively, to drive the multiple light-emitting devices 21 in the four driving units 211 to emit light.

[0079] 5 , the wiring substrate 10 has a light emitting area A1 and a bonding area A2 , and the bonding area A2 is located on one side of the light emitting area A1 along the second direction Y. The light emitting area A1 is configured to be provided with the electronic component 20 , and the bonding area A2 is configured to be provided with the electrode 40 .

[0080] In addition, the wiring substrate 10 may further include a test area A3 , which is located on a side of the light emitting area A1 away from the bonding area A2 along the first direction X. The test area A3 is configured to be provided with a test pad.

[0081] It should be noted that the electronic component 20 and the electrode 40 are respectively arranged on two opposite surfaces of the wiring substrate 10, and the test pad can be located on the same surface as the electronic component 20 or the electrode 40, which is not specifically limited in the embodiment of the present disclosure.

[0082] Some embodiments of the present disclosure provide a wiring substrate 10 . Referring to FIG. 7 , FIG. 8 , and FIG. 9 , the wiring substrate 10 includes a substrate 30 , a plurality of electrodes 40 , and a plurality of leads 50 .

[0083] In some examples, as shown in Figures 7 to 10 , substrate 30 has a first surface 30A and a second surface 30B disposed opposite each other, and a plurality of side surfaces 30C connecting first surface 30A and second surface 30B. At least one of the plurality of side surfaces 30C is a selected side surface 30CC. For example, selected side surface 30CC is a side surface of substrate 30 that is distal to or proximal to test area A3 (see Figure 5 ).

[0084] It should be noted that, of the first surface 30A and the second surface 30B, one is the surface of the substrate 30 for mounting the electronic components 20, and the other is the surface of the substrate 30 for mounting the driver circuit board 230. For example, the first surface 30A is the surface of the substrate 30 for mounting the electronic components 20, and the second surface 30B is the surface of the substrate 30 for mounting the driver circuit board 230.

[0085] In some examples, referring to Figures 5 and 7, the first surface 30A is the surface of the substrate 30 for mounting the electronic component 20, and the plurality of electrodes 40 are arranged at intervals along the first direction X in an area near the edge of the first surface 30A of the substrate 30; or, the second surface 30B is the surface of the substrate 30 for mounting the electronic component 20, and the plurality of electrodes 40 are arranged at intervals along the first direction X in an area near the edge of the second surface 30B of the substrate 30.

[0086] In other examples, referring to Figures 8 to 10 , among the plurality of electrodes 40, a portion of the electrodes 40 are arranged at intervals along the first direction X on the first surface 30A of the substrate 30, and another portion of the electrodes 40 are arranged at intervals along the first direction X on the second surface 30B of the substrate 30. The region where the electrodes 40 located on the first surface 30A are located is directly opposite the region where the electrodes 40 located on the second surface 30B are located, that is, the orthographic projections of the electrodes 40 on the first surface 30A or the second surface 30B at least partially overlap.

[0087] 8 to 10 , the plurality of electrodes 40 include a plurality of first electrodes 41 and a plurality of second electrodes 42. The plurality of first electrodes 41 are arranged at intervals along the first direction X on the first surface 30A of the substrate 30. The plurality of second electrodes 42 are arranged at intervals along the first direction X on the second surface 30B of the substrate 30.

[0088] In some examples, as shown in Figures 7 to 15, multiple leads 50 are arranged at intervals along the first direction X, and each lead 50 includes a first routing segment 501, a second routing segment 502, and a third routing segment 503 connected in sequence. The first routing segment 501 is located on the first surface 30A, the second routing segment 502 is located on the selected side surface 30CC, and the third routing segment 503 is located on the second surface 30B.

[0089] Below, some embodiments of the present disclosure are schematically described by taking the first surface 30A as the surface of the substrate 30 for mounting the electronic component 20 and the second surface 30B as the surface of the substrate 30 for mounting the driving circuit board 230 as an example, but the embodiments of the present disclosure are not limited thereto.

[0090] In this case, the driver circuit board 230 can, for example, be connected to the third trace segment 503 on the second surface 30B of the wiring substrate 10, thereby providing a light-emitting signal to the electronic component 20 disposed on the first surface 30A of the wiring substrate 10. In other words, no bending space is required between the housing 300 of the display device 1000 and the wiring substrate 10, thereby facilitating a reduction in the bezel of the display device 1000.

[0091] In some examples, as shown in Figures 7 and 11, the plurality of leads 50 may include a plurality of first leads 51 and a plurality of second leads 52. The electrode 40 overlaps the first leads 51 and is insulated from all second leads 52. On the first surface 30A or the second surface 30B of the substrate 30, there is at least one second lead 52 between two adjacent first leads 51 connected to different electrodes 40.

[0092] In this case, at least one lead 50 (i.e., second lead 52) is located between two adjacent first lead 51 connected to different electrodes 40, and the second lead 52 is spaced apart from the adjacent first lead 51. Since each of the plurality of lead 50 extends in the same direction, the plurality of lead 50 are spaced apart along the first direction X. An etching process can be used to achieve the spacing between multiple leads 50, and the value range of the spacing can be within 15μm; when laser etching is used to achieve the spacing between multiple leads 50, there is a probability that the metal melts and then diffuses due to laser etching, resulting in a short circuit between two adjacent leads 50. However, since a second lead 52 is provided between two adjacent first leads 51 connected to different electrodes 40, the probability of a short circuit between the two first leads 51 will be greatly reduced. It can be understood that the probability of a short circuit will decrease with the increase in the number of second leads 52 provided between the two first leads 51; at the same time, due to the existence of the second lead 52 and the spacing between adjacent leads, the spacing between the two first leads 51 will also become larger, further reducing the probability of a short circuit between the two, thereby improving the yield and reliability.

[0093] Among them, the above-mentioned electrode 40 is overlapped with the first lead 51, including any one of the following: the first lead 51 is located on the side of the first electrode 41 away from the substrate 30, the first electrode 41 is located on the side of the first lead 51 away from the substrate 30, or the first lead 51 is in direct contact with the end face of the first electrode 41 (that is, the orthographic projections of the two on the first surface 30A coincide only at the boundary).

[0094] In the following, some embodiments of the present disclosure are schematically described and illustrated by taking the case where the first lead 51 is located on the side of the first electrode 41 away from the substrate 30 as an example, but the embodiments of the present disclosure are not limited thereto.

[0095] On this basis, at least one electrode 40 is overlapped with at least two first leads 51. In this way, as long as there is one intact first lead 51, the electrode 40 overlapped with at least two first leads 51 can still transmit electrical signals, reducing the risk of circuit breakage and improving production yield.

[0096] Exemplarily, as shown in FIG. 12 to FIG. 15 , the plurality of second electrodes 42 correspond to the plurality of first electrodes 41 on a one-to-one basis, and at least one first electrode 41 and the corresponding second electrode 42 are connected via at least two first leads 51 .

[0097] At this time, as long as there is a complete lead 50 between the connected first electrode 41 and the second electrode 42, electrical signals can still be transmitted between the first electrode 41 and the second electrode 42, so that the driving circuit board 230 (see Figure 3) can provide a luminous signal to the wiring substrate 10, reducing the risk of a short circuit between the connected first electrode 41 and the second electrode 42, and improving the production yield.

[0098] In some embodiments, as shown in FIG. 9 , FIG. 10 and FIG. 12 , the orthographic projection of any first electrode 41 on the substrate 30 and the orthographic projection of the corresponding second electrode 42 on the substrate 30 at least partially overlap.

[0099] The substrate 30 includes a first substrate 31 and a second substrate 32. The first substrate 31 and the second substrate 32 are fixed relative to each other. The first electrode 41 is disposed on the surface of the first substrate 31 away from the second substrate 32, and the second electrode 42 is disposed on the surface of the second substrate 32 close to or away from the first substrate 31.

[0100] In some examples, as shown in FIG9 , the first electrode 41 is disposed on a surface of the first substrate 31 away from the second substrate 32, that is, the first surface 30A is the surface of the first substrate 31 away from the second substrate 32. The second electrode 42 is disposed on a surface of the second substrate 32 closer to the first substrate 31, that is, the second surface 30B is the surface of the second substrate 32 closer to the first substrate 31.

[0101] Furthermore, the third routing segment 503 of the first lead 51 is located between the first substrate 31 and the second substrate 32 . The second electrode 42 overlaps the third routing segment 503 of the first lead 51 , and is thus connected to the corresponding first electrode 41 through at least two first leads 51 .

[0102] For example, referring to Figure 9, the wiring substrate 10 also includes a first circuit layer 60, which is arranged on the first surface 30A of the substrate 30. The first electrode 41 can be located in the first circuit layer 60 and connected to the signal line 110 (power signal line, address signal line, data signal line and ground signal line, etc.) included in the first circuit layer 60.

[0103] It should be noted that the first circuit layer 60 can be a single-layer structure or a multi-layer structure, which is not specifically limited in the present embodiment. The end of the second electrode 42 away from the selected side surface 30CC can be directly connected to the driving circuit board 230 to provide a luminous signal to the wiring substrate 10. For example, the second substrate 32 can be made of materials such as polyethylene terephthalate (PET), polyethylene naphthalate two formal acid glycol ester (PEN), or polyimide (PI), and the second substrate 32 can be a flexible substrate.

[0104] In other examples, as shown in FIG10 , the first electrode 41 is disposed on a surface of the first substrate 31 away from the second substrate 32, that is, the first surface 30A is the surface of the first substrate 31 away from the second substrate 32. The second electrode 42 is disposed on a surface of the second substrate 32 away from the first substrate 31, that is, the second surface 30B is the surface of the second substrate 32 away from the first substrate 31.

[0105] Furthermore, the third segment 503 of the first lead 51 is located on a side of the second substrate 32 away from the first substrate 31. The second electrode 42 overlaps the third segment 503 of the first lead 51, and is thus connected to the corresponding first electrode 41 through at least two first leads 51.

[0106] For example, referring to FIG10 , the wiring substrate 10 further includes a first wiring layer 60 and a second wiring layer 70. The first wiring layer 60 is disposed on the first surface 30A of the substrate 30. The first electrode 41 may be located on the first wiring layer 60 and connected to the signal line 110 included in the first wiring layer 60. The second wiring layer 70 is disposed on the second surface 30B of the substrate 30. The second electrode 42 may be located on the second wiring layer 70 and connected to the signal line 110 included in the second wiring layer 70.

[0107] It should be noted that the second circuit layer 70 can be a single-layer structure or a multi-layer structure, and the embodiments of the present disclosure do not specifically limit this. Among them, the second substrate 32 plays a supporting role. In some embodiments, the second electrode 42 can be connected to the driving circuit board 230 through a flexible circuit board to provide a luminous signal to the wiring substrate 10; in other embodiments, the end of the second electrode 42 away from the selected side surface 30CC can be directly connected to the driving circuit board 230 to provide a luminous signal to the wiring substrate 10. Exemplarily, the second substrate 32 can be made of materials such as PET, PEN or PI. Exemplarily, the second substrate 32 can be made of rigid materials such as glass, quartz, plastic or polymethyl methacrylate (PMMA).

[0108] In some embodiments, referring to Figures 8 to 15, the first electrode 41 and the second electrode 42 connected to the same first lead 51 constitute an electrode pair 410, and any electrode pair 410 is connected by a first lead group 510, and each first lead group 510 includes at least two first leads 51.

[0109] In other words, any first electrode 41 and the corresponding second electrode 42 are connected by at least two first leads 51. Thus, as long as there is a complete lead 50 between any first electrode 41 and the second electrode 42, electrical signals can still be transmitted between the first electrode 41 and the second electrode 42, so that the driving circuit board 230 can provide a light-emitting signal to the wiring substrate 10, reducing the risk of a short circuit between the first electrode 41 and the second electrode 42 and improving production yield.

[0110] It can be understood that the width and the spacing between the first electrodes 41 and the second electrodes 42 along the first direction X can be set according to actual conditions.

[0111] In some embodiments, referring to FIG. 14 , the width L1 of the first electrode 41 along the first direction X is positively correlated with the width L2 of the signal line 110 to which it is connected along the first direction X. Furthermore, / or, the spacing S1 between two adjacent first electrodes 41 is positively correlated with the spacing S2 between the signal lines 110 to which they are connected.

[0112] At this point, the signal lines 110 correspond one-to-one with the first electrodes 41, creating a neat structure and helping to reduce contact resistance. Furthermore, the one-to-one correspondence between the signal lines 110 and the first electrodes 41 facilitates distinguishing the signal lines connected to the second electrodes 42, thereby facilitating alignment and connection between the second electrodes 42 transmitting different signals and the driver circuit board 230.

[0113] In some other embodiments, referring to FIG. 12 , the width L1 of each first electrode 41 along the first direction X is the same, and / or the interval S1 between two adjacent first electrodes 41 is the same.

[0114] In this case, the width L1 of the plurality of first electrodes 41 along the first direction X does not need to correspond to a specific signal line 110, resulting in a simple manufacturing process with low process difficulty. Furthermore, the signal lines 110 do not need to be aligned and connected to specific first electrodes 41; each signal line 110 can be connected to one or more first electrodes 41. This reduces the risk of a short circuit between the signal lines 110 and the first electrodes 41, and eliminates the need for alignment between the signal lines 110 and the first electrodes 41, simplifying the process and improving production yield.

[0115] In some embodiments, referring to FIG12 , the second electrode 42 is a block-shaped electrode, and each first electrode 41 is connected to a corresponding second electrode 42 via a plurality of first leads 51 of a first lead set 510. Here, along the first direction X, the width of the first electrode 41 and the width of the second electrode 42 can be substantially equal, for example.

[0116] At this time, a first electrode 41 corresponds to a second electrode 42 one by one, the structure is regular, and it is beneficial to reduce contact resistance; at the same time, each second electrode 42 is independently connected to a different signal line, which is convenient for alignment connection with the driving circuit board 230.

[0117] In other embodiments, referring to FIG. 13 , each second electrode 42 includes a plurality of sub-electrodes 421 . Along the first direction X, all sub-electrodes 421 have substantially equal widths, and all sub-electrodes 421 have substantially equal spacing. Furthermore, along the first direction X, the width of each sub-electrode 421 is smaller than the width of any first electrode 41 .

[0118] In this case, the widths of the plurality of sub-electrodes 421 along the first direction X do not need to correspond to the widths of the first electrode 41, and the plurality of sub-electrodes 421 included in each second electrode 42 are connected to one first electrode 41 via the plurality of first leads 51 of one first lead group 510. For example, one sub-electrode 421 is connected to one first electrode 41 via one first lead 51, thereby minimizing the risk of a short circuit between the first electrode 41 and the second electrode 42.

[0119] It should be noted that, among the plurality of sub-electrodes 421 , some of the sub-electrodes 421 may overlap with the second lead 52 , and this embodiment of the present disclosure does not specifically limit this.

[0120] In the following, some embodiments of the present disclosure are schematically described by taking the second electrode 42 as a block electrode as an example, but the embodiments of the present disclosure are not limited thereto.

[0121] It is understandable that the width and spacing of the first leads 51 in the first lead group 510 along the first direction X can be set according to actual conditions.

[0122] 14 and 15 , in each first lead group 510 , the width L2 of any first lead 51 along the first direction X is the same. On this basis, as shown in FIG15 , all leads 50 (including the second lead 52 ) have the same width L2 along the first direction X to simplify the manufacturing process.

[0123] 14 and 15 , in each first lead group 510 , any two adjacent first leads 51 have the same spacing along the first direction X. On this basis, as shown in FIG15 , all leads 50 have the same spacing along the first direction X to simplify the manufacturing process.

[0124] For example, referring to Figures 14 and 15 , in each first lead group 510, the width L2 of any first lead 51 along the first direction X is the same, and in each first lead group 510, the spacing S3 between any two adjacent first leads 51 along the first direction X is the same. On this basis, as shown in Figure 15 , all leads 50 have the same width L2 along the first direction X, and all leads 50 have the same spacing S3 along the first direction X, to simplify the manufacturing process.

[0125] In some embodiments, referring to Figures 14 and 15 , in each first lead group 510 , the spacing S3 between any two adjacent first leads 51 along the first direction X is less than or equal to the width L2 of any first lead 51 along the first direction X. On this basis, as shown in Figures 14 and 15 , the spacing S3 between all leads 50 along the first direction X is less than or equal to the width L2 of any lead 50 along the first direction X, to simplify the manufacturing process.

[0126] The distance between the two adjacent leads 50 is less than or equal to 15 μm. When laser etching is used to form the leads 50, the width of the etched path formed by a single etching is relatively small. To avoid problems such as excessive distance between the two adjacent leads 50, requiring multiple etchings, resulting in a long process time, and damaging the surface of the underlying film layer (e.g., substrate 30), the distance between the two adjacent leads 50 can be set to any one of 15 μm, 10 μm, 8 μm, 7 μm, 6 μm, 5 μm, 4 μm, 2 μm, and 1 μm.

[0127] The width of the lead 50 along the first direction is 5 μm to 20 μm. For example, the width of the lead 50 is any one of 5 μm, 8 μm, 10 μm, 13 μm, 14 μm, 15 μm, 18 μm, 19 μm and 20 μm.

[0128] In some embodiments, as shown in FIG. 14 and FIG. 15 , a ratio of a width L3 of the first lead set 510 along the first direction X to a width L4 of the electrode pair 410 along the first direction X is greater than or equal to 1 and less than or equal to 1.8.

[0129] The width L3 of the first lead group 510 along the first direction X refers to the distance between the two oppositely spaced boundaries of the two most distant first lead lines 51 among the plurality of first lead lines 51 included in the first lead group 510. The width L4 of the electrode pair 410 along the first direction X refers to the larger width of the first electrode 41 or the second electrode 42 in the electrode pair 410 along the first direction X.

[0130] For example, along the first direction X, the first electrodes 41 and the second electrodes 42 have the same width, and the ratio of the width L3 of the first lead group 510 along the first direction X to the width L1 of the first electrode 41 along the first direction X is greater than or equal to 1 and less than or equal to 1.8. In this case, in the second direction Y, the orthographic projections of the two opposing boundaries of the first electrode 41 and the second electrode 42 on the substrate 30 are both within the range of the orthographic projection of the first lead group 510 on the substrate 30. The cross-sectional area of ​​the plurality of first leads 51 connecting the first electrodes 41 and the second electrodes 42 is large, and the resistance is low. It should be noted that the cross-sectional area is perpendicular to the second direction Y. Moreover, when laser etching is used to form each lead 50, the boundary of any lead 50 along the second direction Y can be controlled so that it does not coincide with the boundary of any first electrode 41 along the second direction Y or the boundary of any second electrode 42 along the second direction Y. That is, during the laser etching process, the path of the laser can be prevented from coinciding with the boundary of the first electrode 41 along the second direction Y or the boundary of the second electrode 42 along the second direction Y, thereby preventing laser damage to the edges of the first electrode 41 and the second electrode 42.

[0131] In some embodiments, as shown in FIG. 12 and FIG. 14 , different first lead groups 510 include the same number of first leads 51 .

[0132] For example, as shown in FIG14 , at least two first electrodes 41 have different widths along the first direction X. For example, the width of the first electrode 41 along the first direction X is positively correlated with the width of the signal line to which it is connected along the first direction X. In this case, the width of the first lead 51 along the first direction X is positively correlated with the width of the first electrode 41 to which it is connected.

[0133] For example, referring to FIG. 14 , in the first direction X, the widths of the two first electrodes 41 are different, and the number of first lead wires 51 included in the two first lead wire groups 510 connected to the two first electrodes 41 is the same.

[0134] As shown in FIG. 14 , the width of the first lead 51 connected to the first electrode 41 having a larger width is greater than the width of the first lead 51 connected to the first electrode 41 having a smaller width.

[0135] For example, as shown in FIG12 , along the first direction X, all first electrodes 41 have the same width, and the two first lead groups 510 connected to the two first electrodes 41 have the same number of first leads 51. In this case, along the first direction X, the first leads 51 in all first lead groups 510 can have the same width L2; and the spacing S3 between two adjacent first lead lines 51 in all first lead groups 51 can be the same.

[0136] In other embodiments, referring to FIG. 15 , the number of first leads 51 included in any first lead set 510 is positively correlated with the width L4 of the electrode pair 410 connected thereto along the first direction X.

[0137] The width L4 of the electrode pair 410 along the first direction X refers to the larger width of the first electrode 41 and the second electrode 42 along the first direction X in the electrode pair 410 .

[0138] 15 , at least two first electrodes 41 have different widths along the first direction X. For example, the width of the first electrode 41 along the first direction X is positively correlated with the width of the signal line 110 connected thereto along the first direction X.

[0139] For example, referring to FIG. 15 , in the first direction X, the widths of the two first electrodes 41 are different, and the number of first leads 51 included in the two first lead groups 510 connected to the two first electrodes 41 is positively correlated with the width L4 of the electrode pair 410 connected thereto along the first direction X.

[0140] At this time, the number of the first lead lines 51 connected to the first electrodes 41 having a larger width is greater than the number of the first lead lines 51 connected to the first electrodes 41 having a smaller width.

[0141] 15 , one first electrode 41 is connected to six first leads 51 , and another first electrode 41 is connected to three first leads 51 . Furthermore, the width of the first electrode 41 connected to six first leads 51 is greater than the width of the first electrode 41 connected to three first leads 51 .

[0142] Some embodiments of the present disclosure further provide a method for preparing a wiring substrate 10 , which is used to prepare the wiring substrate 10 of any of the above embodiments. As shown in FIG. 16 , the method includes S100 to S200 .

[0143] S100: providing a substrate.

[0144] In the above steps, referring to FIG. 19 to FIG. 21 , the substrate 30 has a first surface 30A and a second surface 30B opposite to each other, and a plurality of side surfaces 30C connecting the first surface 30A and the second surface 30B, at least one of the plurality of side surfaces 30C being a selected side surface 30CC.

[0145] 19 to 21 , the first surface 30A of the substrate 30 includes a plurality of electrodes 40 arranged at intervals along the first direction X, and / or the second surface 30B of the substrate 30 includes a plurality of electrodes 40 arranged at intervals along the first direction X.

[0146] S200: forming a plurality of leads.

[0147] In the above steps, referring to Figures 11 to 15 , a plurality of leads 50 are arranged at intervals along the first direction X. Each lead 50 includes a first routing segment 501, a second routing segment 502, and a third routing segment 503 connected in sequence. The first routing segment 501 is located on the first surface 30A, the second routing segment 502 is located on the selected side surface 30CC, and the third routing segment 503 is located on the second surface 30B.

[0148] 11 to 15 , the plurality of leads 50 include a plurality of first leads 51 and a plurality of second leads 52. At least one electrode 40 is connected to at least two first leads 51. The plurality of second leads 52 are insulated from the electrodes 40. Furthermore, on the first surface 30A or the second surface 30B of the substrate 30, at least one second lead 52 exists between two adjacent first leads 51 connected to different electrodes 50.

[0149] It should be understood that the process method used in the above-mentioned S200 is not unique. S200 can adopt sputtering film formation and then be combined with a laser etching process; it can also adopt a mask and sputtering process; it can also adopt a printing process, a pad printing process; or after film formation, it can be combined with at least one of laser selective melting and electron beam selective melting to achieve it.

[0150] The following uses S200, which uses sputtering film formation combined with laser etching process, as an example to schematically illustrate some embodiments of the present disclosure. However, the implementation of the present disclosure is not limited to this, and any other process methods can also be considered as long as the same technical concept is applied.

[0151] Exemplarily, referring to FIG. 17 , the above-mentioned S200 includes S210 to S220 .

[0152] S210: forming a conductive layer.

[0153] In the above steps, referring to FIG. 19 to FIG. 21 , the conductive layer 50 ′ covers the selected side surface 30CC of the substrate 30 and extends to the first surface 30A and the second surface 30B.

[0154] For example, referring to Figures 12 and 19 , the first surface 30A of the substrate 30 includes a plurality of electrodes 40 spaced apart along a first direction X, and the second surface 30B of the substrate 30 includes a plurality of electrodes 40 spaced apart along the first direction X. In this case, on the first surface 30A, the conductive layer 50 ′ extends to at least one side of the electrode 40 and overlaps the electrode 40 . On the second surface 30B, the conductive layer 50 ′ extends to at least one side of the electrode 40 and overlaps the electrode 40 .

[0155] In some examples, referring to FIG. 19 , the above-mentioned S210 specifically includes: bombarding the first target M1 with an inert gas.

[0156] In the above steps, referring to FIG. 19 , the first target M1 oscillates between a first position and a second position. The angle between the first target M1 and the plane containing the second surface 30B in the first position is substantially equal to the angle between the first target M1 and the plane containing the second surface 30B in the second position. The angle between the first target M1 and the plane containing the second surface 30B in the first position is greater than or equal to 75°.

[0157] It should be noted that the inert gas includes any one of helium, neon, and argon, etc., and the embodiments of the present disclosure do not specifically limit this.

[0158] In other examples, referring to FIG. 20 , S210 specifically includes: bombarding the second target M2 and the third target M3 with an inert gas, and the substrate 30 moves between the second target M2 and the third target M3 at a non-uniform speed.

[0159] In the above steps, referring to FIG. 20 , the second target M2 and the third target M3 are located on opposite sides of the substrate 30 and are substantially parallel to the second surface 30B of the substrate 30 .

[0160] In some other examples, referring to FIG. 21 , S210 specifically includes: bombarding the fourth target M4 and the fifth target M5 with an inert gas.

[0161] 21 , in the above steps, the fourth target M4 and the fifth target M5 are located on opposite sides of the substrate 30 and are tilted relative to the substrate 30. For example, the angles between the fourth target M4 and the fifth target M5 and the plane of the second surface 30B are 10° to 30°.

[0162] Herein, the materials of the first target M1, the second target M2, the third target M3, the fourth target M4, and the fifth target M5 may be the same or different. The materials of the first target M1, the second target M2, the third target M3, the fourth target M4, and the fifth target M5 include conductive materials. In some embodiments, the conductive material includes a metal element or alloy, for example, at least one of copper, aluminum, nickel, chromium, gold, and silver. In other embodiments, the conductive material includes a non-metal, for example, carbon and / or silicon. In yet other embodiments, the conductive material includes a metal oxide, for example, aluminum oxide and / or indium tin oxide.

[0163] S220: etching and removing specific areas of the conductive layer to form a plurality of leads.

[0164] In the above steps, specific areas of the conductive layer 50' are etched multiple times, and the remaining portions of the conductive layer 50' form multiple leads 50. The etching sequence of the multiple etching steps includes at least one of etching sequentially from one side of the conductive layer 50' to the other, etching alternately from the center to both sides of the conductive layer 50', and etching alternately from both sides to the center of the conductive layer 50'. It should be noted that this etching process can utilize a laser etching process.

[0165] It should be noted that the specific area is a pre-set area, which is the area between the multiple lead wires 50 that are finally formed, and can be specifically set according to actual conditions.

[0166] In addition, along the first direction X, from the first side to the second side of the conductive layer 50 ′, the multiple etchings are sequentially 1st to Nth etchings. The first side and the second side are two opposite sides of the conductive layer 50 ′ in the first direction X.

[0167] For example, the etching sequence may also be: first etching, second etching, third etching, fourth etching...N-1th etching, Nth etching.

[0168] At this time, multiple etchings are performed sequentially from the first side to the second side, the process difficulty is low, and the production efficiency is high.

[0169] For another example, the etching sequence may be: 1st etching, Nth etching, 2nd etching, N-1th etching...N / 2+1th etching, N / 2th etching.

[0170] At this time, multiple etchings are performed alternately from both sides to the middle of the conductive layer 50 ′, and the risk of residual molten liquid droplets between two adjacent leads 50 is low, and the risk of short circuit between two adjacent leads 50 is low.

[0171] For another example, the etching sequence may be: 1st etching, 2nd etching...N / 2th etching, Nth etching, N-1th etching...N / 2+1th etching. Or the etching sequence may be: N / 2th etching, N / 2-1th etching...1st etching, N / 2+1th etching, N / 2+2th etching...Nth etching.

[0172] In this case, the multiple etchings are performed in two stages: one stage is performed sequentially from the first side to the second side, and the other stage is performed sequentially from the second side to the first side. This reduces the risk of residual molten droplets between two adjacent leads 50 and the risk of shorting two adjacent leads 50.

[0173] In some embodiments, referring to FIG. 18 , the above-mentioned S220 includes S221 - S222 .

[0174] S221: etching a first specific region of the conductive layer multiple times.

[0175] In the above steps, referring to FIG22 , the unetched portion of the conductive layer 50 ′ forms a plurality of initial leads 51 ′. The etching sequence of the multiple etching steps includes at least one of etching sequentially from one side of the conductive layer 50 ′ to the other side, etching alternately from the center of the conductive layer 50 ′ to both sides, and etching alternately from both sides to the center of the conductive layer 50 ′.

[0176] The initial leads 51 ′ include a lead region 511 and a spacer region 512 . The lead region 511 and the spacer region 512 extend along the second direction Y and are arranged in a staggered manner in the first direction X.

[0177] For example, referring to Figures 15 and 22 , the boundaries of a portion of initial leads 51' along the second direction Y are the boundaries of a first lead group 510 to be formed along the second direction Y. The boundaries of another portion of initial leads 51' along the second direction Y are the boundaries of a second lead group 520 formed by a plurality of second leads 52 between adjacent first lead groups 510 along the second direction Y. The first specific area is the area between the first lead group 510 and the second lead group 520.

[0178] It should be noted that the etching sequence of the multiple etchings here can be referred to above, and the embodiments of the present disclosure will not be described in detail here.

[0179] S222: Etching a second specific region of each initial lead.

[0180] In the above steps, referring to FIG. 22 , the unetched portion of the initial lead 51 ′ (lead region 511 ) is formed into a plurality of leads 50 (see FIG. 15 ).

[0181] The first specific area and the second specific area can be etched according to actual conditions. The first specific area and the second specific area are all areas that need to be etched.

[0182] Exemplarily, referring to FIG. 15 and FIG. 22 , the first specific area is the area between the first lead group 510 and the second lead group 520 , and the second specific area is the spacing area 512 between the first lead group 510 and the second lead group 520 .

[0183] Exemplarily, along the first direction X, from the first side to the second side of the conductive layer 50 ′, the multiple etchings are sequentially 1st to Nth etchings. The first side and the second side are two opposite sides of the conductive layer 50 ′ in the first direction X.

[0184] In this case, the first specific region may be, for example, a region etched an odd number of times, and the second specific region may be, for example, a region etched an even number of times. Alternatively, the first specific region may be, for example, a region etched an odd number of times, and the second specific region may be, for example, a region etched an even number of times. This is not specifically limited in the present embodiment.

[0185] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0186] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A wiring substrate, comprising: A substrate having a first surface and a second surface disposed opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one side surface of the plurality of side surfaces being a selected side surface; A plurality of electrodes are arranged on the first surface of the substrate at intervals along a first direction; and / or, arranged at intervals on the second surface of the substrate along the first direction; A plurality of leads are arranged at intervals along the first direction; each lead comprises a first routing segment, a second routing segment and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface; the plurality of leads comprise a plurality of first leads and a plurality of second leads, at least one of the electrodes is overlapped with at least two of the first leads; the plurality of second leads are insulated from the electrodes; and, on the first surface or the second surface of the substrate, between two adjacent first leads connected to different electrodes, there is at least one second lead.

2. The wiring substrate according to claim 1, wherein: The plurality of electrodes include: A plurality of first electrodes are arranged at intervals on the first surface of the substrate along the first direction; A plurality of second electrodes are arranged at intervals along the first direction on the second surface of the substrate and correspond one-to-one to the plurality of first electrodes; at least one of the first electrodes and the corresponding second electrode are connected through at least two of the first leads.

3. The wiring substrate according to claim 2, wherein: The orthographic projection of any one of the first electrodes on the substrate at least partially overlaps with the orthographic projection of the corresponding second electrode on the substrate; The substrate includes a first substrate and a second substrate, the first substrate and the second substrate are relatively fixedly arranged; the first electrode is arranged on a surface of the first substrate away from the second substrate, and the second electrode is arranged on a surface of the second substrate close to or away from the first substrate.

4. The wiring substrate according to claim 2 or 3, wherein: The first electrode and the second electrode connected to the same first lead wire form an electrode pair. Any electrode pair is connected by a first lead wire group. Each first lead wire group includes at least two first lead wires.

5. The wiring substrate according to claim 4, wherein: A ratio of a width of the first lead group along the first direction to a width of the electrode pair along the first direction is greater than or equal to 1 and less than or equal to 1.

8.

6. The wiring substrate according to claim 4 or 5, wherein: Different first lead groups include the same number of first lead lines.

7. The wiring substrate according to claim 4 or 5, wherein: The number of first leads included in any one of the first lead groups is positively correlated with the width of the electrode pair connected thereto along the first direction.

8. The wiring substrate according to any one of claims 4 to 7, wherein: The widths of the first leads in all the first lead groups along the first direction are the same; and / or the intervals between two adjacent first lead lines in all the first lead groups are the same.

9. The wiring substrate according to any one of claims 4 to 8, wherein: In each of the first lead groups, a distance between any two adjacent first lead lines along the first direction is less than or equal to a width of any first lead line along the first direction.

10. The wiring substrate according to any one of claims 1 to 9, wherein: The distance between any two adjacent lead lines along the first direction is the same; and / or the width of any two lead lines along the first direction is the same.

11. The wiring substrate according to any one of claims 1 to 10, wherein: The distance between any two adjacent lead lines along the first direction is less than or equal to the width of any one lead line along the first direction.

12. A display device, comprising: The wiring substrate according to any one of claims 1 to 11; An electronic component is disposed on a first surface of a substrate of the wiring substrate; A driving circuit board is connected to the wiring substrate.

13. A method for preparing a wiring substrate, for preparing the wiring substrate according to any one of claims 1 to 11, the method comprising: providing a substrate; The substrate comprises a first surface and a second surface which are arranged opposite to each other, and a plurality of side surfaces connecting the first surface and the second surface, at least one side surface of the plurality of side surfaces being a selected side surface; The first surface of the substrate includes a plurality of electrodes arranged at intervals along a first direction, and / or the second surface of the substrate includes a plurality of electrodes arranged at intervals along the first direction; A plurality of leads are formed; the plurality of leads are arranged at intervals along the first direction; each lead comprises a first routing segment, a second routing segment and a third routing segment connected in sequence, the first routing segment is located on the first surface, the second routing segment is located on the selected side surface, and the third routing segment is located on the second surface; the plurality of leads comprise a plurality of first leads and a plurality of second leads, at least one of the electrodes is overlapped with at least two of the first leads; the plurality of second leads are insulated from the electrodes; and, on the first surface or the second surface of the substrate, between two adjacent first leads connected to different electrodes, there is at least one second lead.

14. The preparation method according to claim 13, wherein: The forming of a plurality of leads comprises: forming a conductive layer; the conductive layer covers selected side surfaces of the substrate and extends to the first surface and the second surface; Specific areas of the conductive layer are etched multiple times; unetched portions of the conductive layer form the multiple leads.

15. The preparation method according to claim 14, wherein: The etching of the specific area of ​​the conductive layer multiple times includes: Etching the first specific area of ​​the conductive layer multiple times; the unetched portion of the conductive layer forms a plurality of initial leads; The second specific region of each of the initial leads is etched; and the unetched portion of the initial leads forms a plurality of leads.

16. The preparation method according to claim 14 or 15, wherein: The etching sequence of the multiple etchings includes at least one of sequentially etching from one side to the other side of the conductive layer, alternately etching from the middle to both sides of the conductive layer, and alternately etching from both sides to the middle of the conductive layer.

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