Optical assembly and electronic apparatus

Abstract

Provided in the present application are an optical assembly and an electronic apparatus. The optical assembly comprises a camera module, a light source, a light receiver and a light guide member. The camera module comprises a substrate, a structural member, an image sensor, and a lens. The structural member, the image sensor, and the light source are all mounted on the substrate. The image sensor, the lens, and the light receiver are located within an enclosed space of the structural member. The light source and the light receiver are separated by means of the structural member. The light guide member is used for guiding light emitted from the light source to the periphery of a light inlet of the camera module. In the present application, by integrating the camera module and the light source on the substrate, a detection light sensor consisting of the light source and the light receiver can share an optical window with the camera module, thereby enhancing a visual effect of a display screen.

Description

Optical components and electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on August 18, 2023, with application number 202311050782.5, and priority to the Chinese patent application with the invention name “Optical components and electronic devices”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the design of a detection light sensor in an electronic device, and in particular to an optical component and an electronic device. Background Art

[0003] Proximity sensors are often used in consumer electronic devices such as mobile phones to sense the proximity or distance between the user and the electronic device. These sensors can then be used to control the electronic device based on the proximity detection results. For example, when a phone is answering a call, if the distance between the phone and the ear falls below a threshold, the display (to reduce power consumption and increase battery life) and the touch screen (to prevent accidental touches) can be turned off. Optical proximity detection is known as proximity light sensing.

[0004] Currently, light sensors (e.g., proximity sensors) in consumer electronics devices are typically placed below the screen. For the proximity sensors to function properly, a separate optical window must be defined in the display screen to transmit the light received and received by the proximity sensors. Consumer electronics devices also require an optical window in the display screen corresponding to the front-facing camera.

[0005] Multiple optical windows, each for the front camera and proximity sensor, are installed on the display. These multiple and independent openings result in poor visual quality. The industry is currently working on reducing the number of optical windows on the display and improving visual quality while maintaining the optical performance of the front camera and proximity sensor.

[0006] Summary of the Invention

[0007] The present application provides an optical component and an electronic device. The optical component integrates the functions of a camera module and a detection light sensor. It can reduce the optical window on the display screen and improve the visual effect while meeting the optical performance of the front camera and the detection light sensor.

[0008] In a first aspect, an embodiment of the present application provides an optical component, which includes a camera module, a light source, a light receiver and a light guide, wherein the camera module includes a substrate, a structural component, an image sensor and a lens, wherein the image sensor is arranged on the substrate, the structural component is cylindrical and one end of which is connected to the substrate, the structural component and the substrate are jointly arranged to form an enclosed space, the image sensor and the lens are located in the enclosed space, and the end of the structural component away from the substrate is a light entrance of the camera module; the light source is arranged on the substrate and is used to send a light signal; the light guide is used to transmit the light signal to the periphery of the light entrance, and the refractive index of the light guide material constituting the light guide is greater than or equal to 1.4; the light receiver is located in the enclosed space, the light source and the light receiver are separated by the structural component, and the light receiver is used to receive the light signal entering the enclosed space through the light entrance.

[0009] The present application integrates the camera module and the detection light sensor into one optical assembly by arranging the light receiver of the detection light sensor in the enclosed space of the structural member, and separating the light source and the light receiver by the structural member. Since the structural member has a light-shielding property, the structural member separates the light receiver and the light source, which can achieve light isolation between the light receiver and the light source, avoid the crosstalk of light emitted by the light source to the area where the control chip is located, and ensure the detection efficiency of the detection light sensor. Moreover, the detection light sensor in the optical assembly provided by the present application uses the peripheral area of ​​the light inlet of the camera module as the light outlet area of ​​the light source, that is, the detection light sensor and the camera module can share an optical window on the display screen. Since the transmittance of this optical window is high, it is beneficial to improve the detection efficiency of the detection light sensor. For electronic devices, there is no need to set multiple optical windows on the display screen, which makes the visual effect of the display screen better, improves the screen-to-body ratio, and has the advantage of saving internal space of the electronic device.

[0010] In one possible embodiment, the light guide comprises an inner body and an enclosing layer, the inner body comprising a light incident surface, a light emitting surface, and an outer peripheral surface, the outer peripheral surface being connected between the light incident surface and the light emitting surface, the enclosing layer being sleeved on the outer peripheral surface of the inner body, the inner body being made entirely of the light-guiding material, and the enclosing layer being used to conduct light from the light incident surface to the light emitting surface within the inner body. This solution provides a specific structure for a light guide, wherein the light guide is formed by combining an inner body and an enclosing layer. The provision of the enclosing layer facilitates the conduction of light entering the inner body from the light incident surface to the light emitting surface within the inner body, resulting in high light guiding efficiency and the avoidance of large amounts of light leakage from the light guide.

[0011] In one possible embodiment, the enveloping layer is a total reflection film for achieving total reflection of light in the inner body. This solution can improve the efficiency of light transmission in the inner body and improve the utilization rate of optical signals by setting the enveloping layer as a total reflection film.

[0012] In one possible embodiment, the total reflection film is made of a metal film or a dielectric total reflection film. This solution provides two specific total reflection film materials. According to specific usage requirements, a suitable total reflection film can be selected, thereby improving the application flexibility of the light guide.

[0013] In one possible embodiment, the outer surface of the light guide includes at least one fully reflective curved surface. This design establishes a light transmission path between the light-entry surface and the light-exit surface, allowing light signals within the light guide to be transmitted along a desired path within the light guide, adapting to the specific usage environment of the camera module.

[0014] In one possible embodiment, the light guide includes a first curved segment and a second curved segment, the first curved segment being located between the second curved segment and the light incident surface, the number of the total reflection curved surfaces being two, namely a first curved surface and a second curved surface, the first curved surface being the surface of the first curved segment, the second curved surface being the surface of the second curved segment, and the bending radius of the first curved segment being smaller than the bending radius of the second curved segment. This solution provides a specific structural form of a light guide, wherein the formation of the first curved segment and the second curved segment enables the light guide to transmit optical signals between the light source and the periphery of the light incident port of the camera module. The formation of the first curved surface and the second curved surface provides conditions for the total reflection transmission of optical signals within the light guide.

[0015] In one possible embodiment, the light guide is an optical fiber. This solution provides a specific light guide. Setting the light guide as an optical fiber can ensure light transmission efficiency and easily match the shape of the structural components of the camera module.

[0016] In a possible implementation, the light source, the light receiver, and the light guide member constitute a proximity light sensor, and the proximity light sensor is used to determine the distance of a target object.

[0017] In one possible implementation, the light source, the light receiver, and the light guide constitute a structured light sensor (eg, a TOF rangefinder) for determining the position of a target object, such as 3D scanning.

[0018] In a possible implementation manner, the light guide component and the structural component are an integrally formed structure.

[0019] In a possible implementation, the structural member has a light source accommodating area, the light source is located in the light source accommodating area, an isolation portion is formed between the light source accommodating area and the surrounding space, and the isolation portion is used to separate the light receiver and the light source.

[0020] This solution accommodates the light source by setting a light source accommodating area on the structural member, so that the light signal emitted by the light source can be concentrated in the light source accommodating area and transmitted to the light output area through the light guide. This design is conducive to improving the luminous utilization rate of the light source, improving the sensing efficiency of the detection light sensor, and reducing the light loss caused by the light emitted by the light source diffusing in other spaces of the electronic device.

[0021] In a possible implementation, the structural member includes a top end and a bottom end that are oppositely arranged, and a main body area connected between the top end and the bottom end, the light entrance is located at the top end, and the light source accommodating area is located at the bottom end.

[0022] This solution sets the position of the light source accommodating area formed on the structural member at the bottom end of the structural member. Since the light source needs to be electrically connected to the driving circuit on the substrate through a conductive wire, and since the bottom end of the structural member is closer to the substrate, this design facilitates the wiring of the light source.

[0023] In one possible embodiment, the light source accommodating area has an open end and a light exit hole. The light source is disposed on a substrate, the open end is configured to engage with the substrate, and the light exit hole is configured to transmit the light signal. This solution, by disposing the light source on the substrate and utilizing the combination of the open end of the light source accommodating area of ​​the structural member and the substrate, enables the light source to be installed in the light source accommodating area, facilitating assembly and further facilitating wiring of the light source.

[0024] In a possible implementation, the detection light sensor further includes a light guide, one end of which is located in the light exit hole or extends into the light source accommodating area through the light exit hole, and the other end of which is located in the light exit area of ​​the optical signal.

[0025] By providing a light guide, this solution can allow more light signals emitted by the light source to be transmitted to the light output area, thereby improving the utilization rate of the light signal and the detection efficiency of the detection light sensor.

[0026] In one possible embodiment, the light guide includes a light emitting portion, the light emitting portion being located in the light emitting area of ​​the optical signal, and the light emitting portion being arranged to surround at least a portion of the structural member. This solution transforms the point light source at the light entrance position of the light guide into a surface light source at the light exit position, which can more clearly illuminate the detection target. By arranging the light exit portion of the light guide to surround at least a portion of the structural member, the light exit area of ​​the light guide is expanded at the periphery of the light exit area of ​​the structural member, making the light exit of the light exit area more uniform.

[0027] In a specific embodiment, the light emitting portion can be in a closed ring shape, so that the periphery of the structural member has a 360-degree surrounding light-emitting band, which expands the light emitting area, improves the uniformity of the light emitting, and improves the detection efficiency of the detection light sensor.

[0028] In other embodiments, the light emitting portion may also be in the shape of a ring, a semi-ring, an arc, etc. with an opening.

[0029] In one possible embodiment, the light guide has an overall rod-shaped structure, comprising a light incident surface, a transmission section, and a light exit surface. The transmission section is connected between the light incident surface and the light exit surface, the light incident surface faces the light source, and the light exit surface is located in the light exit area of ​​the light signal of the detection light sensor. The transmission section has an elongated rod-shaped structure, and the end faces of the transmission section at both ends constitute the light incident surface and the light exit surface. The light exit surface of the light guide provided by this solution has the same shape as the light incident surface, and the light guide has the advantages of simple structure and flexible assembly.

[0030] In one possible embodiment, the structural member includes a top end and a bottom end that are relatively arranged, and a main body area connected between the top end and the bottom end. The light source accommodating area is located at the top end, and the top end is surrounded by a cylindrical structure. The interior space of the cylindrical structure is the light inlet. The light source accommodating area is formed on the end face or outer surface of the cylindrical structure. The light source accommodating area and the light inlet are separated by the structural member. By arranging the light source at the top end of the structural member, this solution allows the light source to be located in the optical window, eliminating the need for a light guide. The light from the light source can be directly emitted from the display screen. This not only improves the utilization rate of light and the detection efficiency of the detection light sensor, but also eliminates the need for a light guide, saving the cost of optical components.

[0031] In one specific embodiment, the end surface of the structural component located within the optical window is provided with a stepped surface. This stepped surface is formed by removing a portion of the structural component to form a mounting groove wall. The light source is fixed to this stepped surface. This solution, by forming a stepped surface at the end of the structural component located within the optical window and by removing material, helps maintain a small optical window size and improve the screen-to-body ratio of the display.

[0032] In one possible embodiment, the light receiver is integrated on the image sensor. The “integration” in “the light receiver is integrated on the image sensor” can be understood as a physical connection relationship, for example, the light receiver is glued to the image sensor, and can also be understood as a circuit integration relationship, for example, the light receiver is arranged inside the image sensor, and the light receiver serves as a circuit element in the image sensor. The present application integrates the light receiver on the image sensor in a design so that the light receiver does not occupy additional space in the camera module, and only utilizes the area at the edge of the imaging area on the image sensor that can capture light. For example, this area on the image sensor was originally idle and no other electronic devices would be set up. Therefore, the present application can utilize the idle space of the image sensor by integrating the light receiver on the image sensor, so that the combined design of the detection light sensor and the camera module will not affect the size and structural layout of the camera module itself.

[0033] In one possible implementation, the image sensor has a first area, a second area, and a third area. The second area is located within the first area, the third area is located within the first area and outside the second area, and the light receiver is located in the third area. The first area is the area on the image sensor where light entering the camera module through the light inlet is projected onto the image sensor, and the second area is the imaging area of ​​the camera module. This solution provides specific locations for light receivers on the image sensor, making the integration of light receivers on the image sensor feasible.

[0034] In one possible embodiment, the camera module further includes a filter positioned between the image sensor and the lens. The filter includes Region 1 and Region 2, wherein Region 1 corresponds to the second region and is configured to transmit visible light and block infrared light. Region 2 is located peripherally to Region 1 and corresponds to the third region and is configured to transmit or partially transmit infrared light. This solution, by configuring the properties of Region 1 and Region 2 of the filter to match the receiver integrated with the image sensor, allows the overall optical module to maintain the size of the camera module and integrate the detection light sensor functionality without changing the spatial layout of the camera module.

[0035] In a possible implementation, the optical filter includes an isolation region connected between the first region and the second region, and the isolation region is used to prevent infrared light from entering the second region.

[0036] In one possible implementation, the light receiver is connected to the inner wall of the structural member. This solution provides a solution for arranging the light receiver on the inner wall of the structural member, which does not require changing the design of the image sensor and the filter, and reduces the design cost.

[0037] In one possible embodiment, the camera module further includes a filter, which is located between the image sensor and the lens, and is used to transmit visible light and cut off infrared light. The light receiver is located in the space between the filter and the lens, and is used to reflect the light signal emitted by the light source entering the enclosed space to the light receiver.

[0038] In one possible embodiment, the camera module further includes a filter positioned between the image sensor and the lens, and the light receiver is disposed on the filter, on the side of the filter facing the lens. By integrating the light receiver on the filter, this solution allows the optical design of the image sensor and filter to remain unchanged. Instead, the light receiver needs only to be fixedly attached to the filter and then electrically connected to the substrate via wires. This solution offers the advantages of low design cost and ease of implementation.

[0039] In one possible embodiment, the optical filter and image sensor are stacked on a substrate, and the optical receiver is electrically connected to the substrate. This stacking of the optical filter and image sensor allows the stacked structure to jointly support the optical receiver, facilitating assembly and securing of the optical receiver while ensuring its structural stability.

[0040] In one possible embodiment, the optical assembly further includes a substrate, the image sensor is disposed on the substrate, and the structural member is connected to the substrate; the detection light sensor further includes a signal processor disposed on the substrate, the signal processor being configured to control the light source and receive and process signals from the light receiver. By integrating the signal processor on the substrate, this solution can improve the integration of the camera module and the detection light sensor. In other embodiments, the signal processor can also be disposed on other circuit boards within the electronic device.

[0041] In a possible implementation manner, the signal processor is located in the enclosed space and integrated on the image sensor.

[0042] In one possible implementation, the signal processor is located outside the structural member, the light source is located on the substrate, and the signal processor and light source are located on the same side of the structural member. This solution facilitates wiring layout on the substrate by placing the light source and signal processor adjacent to each other, shortening the electrical connection path between the light source and signal processor, thereby improving the efficiency of the detection light sensor.

[0043] In one possible implementation, the image sensor includes a timing circuit and an analog-to-digital converter, which are electrically connected. The substrate is provided with a controlled current source, which is electrically connected between the light source and a current output channel of the image sensor. The current output channel is electrically connected to the timing circuit and is configured to output a stroboscopic signal. The stroboscopic signal is a power control signal determined based on the exposure time of the image sensor. This solution provides a design for at least part of the circuitry within the image sensor. This design utilizes a timing circuit to regulate the signal of the controlled current source, outputs the stroboscopic signal through the current output channel, and combines the image sensor exposure time with the power supply on / off, thereby implementing a specific control scheme for optical components.

[0044] In one possible embodiment, the image sensor includes a timing circuit and an analog-to-digital converter, which are electrically connected to the timing circuit and the analog-to-digital converter. The substrate includes a power signal output port and a power signal input port, which are electrically connected to a controlled current source located outside the substrate. The light source is electrically connected to the power signal input port, which is electrically connected to a current output channel of the image sensor. The current output channel is electrically connected to the timing circuit and is configured to output a stroboscopic signal. The stroboscopic signal is a power control signal determined based on the exposure time of the image sensor. This solution provides a design scheme for at least part of the circuitry within an image sensor, in which the signal of the controlled current source is regulated by the timing circuit. This solution positions the controlled current source outside the substrate, and positions the power signal input port and the power output port on the substrate. This saves substrate space and facilitates the miniaturization of the camera module. This solution also outputs a stroboscopic signal via the current output channel and combines the image sensor exposure time with the power switch, thereby implementing a specific control scheme for optical components.

[0045] In a second aspect, the present application provides an electronic device comprising an optical component and a display screen provided by any possible embodiment of the first aspect, wherein the display screen has an optical window, the light inlet is located within the optical window, and the area between the light inlet and the inner wall of the optical window constitutes the light exit area of ​​the light signal emitted by the light source.

[0046] The electronic device provided by the present application adopts the optical component provided by the first aspect, so that the display screen of the electronic device has a specific and better screen-to-body ratio. Only one optical window needs to be set to meet the two different functions of the camera module and the detection light sensor, saving the opening area on the display screen. Moreover, the integrated design of the camera module and the detection light sensor is also conducive to saving space inside the electronic device without affecting the respective functions of the camera module and the detection light sensor. Since the light transmittance of the optical window of the camera module is relatively high, the present application can improve the detection efficiency of the detection light sensor.

[0047] In a possible embodiment, the light source is located on the inner wall of the optical window. The present application can set the light source on the inner wall of the optical window, saving space inside the electronic device and improving the efficiency of the light source.

[0048] In one possible embodiment, the light source is disposed on the back of the display screen. This application can utilize the back of the display screen as the installation location for the light source, saving space within the electronic device. The light source can be positioned closer to the optical window on the back of the display screen, which can also improve the light efficiency of the light source.

[0049] In one possible implementation, the light source is integrated into the display screen. The light source can be integrated into the display screen during its production process, or the display screen's driver can be used to drive the light source. This design significantly reduces internal space in the electronic device.

[0050] In a third aspect, the present application provides a control system comprising a driver, a first receiving circuit, a second receiving circuit and a control circuit, wherein the control circuit is electrically connected to the driver, the first receiving circuit and the second receiving circuit, the first receiving circuit being used to receive and process the optical signal of the detection light sensor, the second receiving circuit being used to receive and process the image signal of the camera module, and the driver being used to drive the power supply of the detection light sensor to emit light.

[0051] In a possible implementation, the first receiving circuit includes a signal amplifying circuit and a signal sampling circuit.

[0052] In one possible implementation, the driver, the first receiving circuit, the second receiving circuit, and the control circuit are all integrated into an image signal processor; or, the first receiving circuit, the second receiving circuit, and the control circuit are all integrated into an image signal processor, and the driver is independently provided outside the image signal processor.

[0053] The control system provided in the present application integrates a first receiving circuit for collecting detection signals from a detection light sensor and a second receiving circuit for collecting imaging signals from a camera module. One control system can control two optical modules with different functions, which can save the area of ​​the circuit board occupied by the control system and is conducive to the miniaturization design of electronic equipment.

[0054] In a fourth aspect, the present application provides a control method for controlling the optical component provided by any possible embodiment of the first aspect, the control method comprising periodically executing imaging control of the camera module and detection control of the detection light sensor; wherein, in the interval time period between two imaging controls of the camera module, the detection control of the detection light sensor is performed once or multiple times; or, in the interval time period between two detection controls of the detection light sensors, the imaging control of the camera module is performed once or multiple times.

[0055] This control method allows the camera module's imaging component (image sensor) to be inactive while the detection light sensor is active. Camera module imaging control and proximity light sensor detection control can be performed in separate time periods. The detection light sensor can be independently controlled without activating the camera module, reducing energy consumption in electronic devices.

[0056] In a possible implementation, the detection light sensor is a proximity light sensor, and detection control of the detection light sensor in each detection cycle includes:

[0057] Turning off the light source, exposing the light receiver for the first time to generate a first light signal, and receiving and processing the first light signal through a first receiving circuit;

[0058] Turning on the light source to expose the light receiver for a second time to generate a second light signal, and receiving and processing the second light signal through the first receiving circuit;

[0059] A proximity light detection signal is determined based on the first light signal and the second light signal.

[0060] The control method provided in this solution is used to realize a scenario in which the imaging part (image sensor) of the camera module also works when the proximity light sensor works, but the imaging of the proximity light sensor and the camera module are completely independent.

[0061] In a possible implementation, the detection light sensor is a proximity light sensor, and detection control of the detection light sensor in each detection cycle includes:

[0062] Turning off the light source, exposing the camera module to light, generating a first light signal, and receiving and processing the first light signal through a second receiving circuit;

[0063] Turning on the light source to expose the light receiver to generate a second light signal, and receiving and processing the second light signal through the first receiving circuit;

[0064] A proximity light detection signal is determined based on the first light signal and the second light signal.

[0065] The control method provided in this solution is used to realize a scenario in which the imaging part (image sensor) of the camera module also works when the proximity light sensor works, but the imaging of the proximity light sensor and the camera module is completed in coordination with each other.

[0066] In a possible implementation, determining the proximity light detection signal according to the first light signal and the second light signal is specifically:

[0067] The proximity light detection signal is obtained by subtracting the first light signal from the second light signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] FIG1 is a schematic diagram of an electronic device provided in one embodiment of the present application;

[0069] FIG2 is a schematic structural diagram of the electronic device shown in FIG1 from another angle;

[0070] FIG3 is a schematic diagram of an electronic device provided in one embodiment of the present application;

[0071] FIG4 is a partial cross-sectional view of the electronic device shown in FIG3;

[0072] FIG5 is a schematic diagram of a control chip of a detection light sensor in an optical assembly provided in one embodiment of the present application;

[0073] FIG6 is a schematic diagram of an optical assembly provided in one embodiment of the present application;

[0074] FIG7 is a schematic diagram of a control chip of a detection light sensor in an optical assembly provided in one embodiment of the present application;

[0075] FIG8A is a plan view of an image sensor of a camera module in an optical assembly provided in one embodiment of the present application;

[0076] FIG8B is a plan view of an image sensor of a camera module in an optical assembly provided in one embodiment of the present application;

[0077] FIG9A is a plan view of a filter of a camera module in an optical assembly provided in one embodiment of the present application;

[0078] FIG9B is a plan view of a filter of a camera module in an optical assembly provided in one embodiment of the present application;

[0079] FIG10 is a schematic diagram of the optical path of the embodiment shown in FIG4 ;

[0080] FIG11 is a schematic diagram of an optical assembly provided in one embodiment of the present application;

[0081] FIG12 is a schematic diagram of an optical assembly provided in one embodiment of the present application;

[0082] FIG13 is a schematic diagram of an optical assembly provided in one embodiment of the present application;

[0083] FIG14 is a schematic diagram of an optical assembly provided in one embodiment of the present application;

[0084] FIG15 is a perspective schematic diagram of an optical assembly provided in one embodiment of the present application;

[0085] FIG16 is a perspective exploded schematic diagram of the optical assembly provided in FIG15 in one direction;

[0086] FIG17 is a perspective exploded schematic diagram of the optical assembly provided in FIG15 from another direction;

[0087] FIG18 is a schematic diagram showing a substrate and an electronic device disposed on the substrate provided in one embodiment;

[0088] FIG19A is a schematic diagram of an optical assembly provided in one embodiment of the present application;

[0089] FIG19B is a cross-sectional view of the optical assembly shown in FIG19A;

[0090] 20A, 20B, and 20C are respectively a perspective view, a plan view, and a cross-sectional view of a light guide in an optical assembly provided in one embodiment of the present application;

[0091] FIG21 is a schematic diagram of a control system provided in one embodiment of the present application;

[0092] FIG22 is a schematic diagram of a control system provided in one embodiment of the present application;

[0093] FIG23 is a schematic diagram of a control method provided in a first embodiment of the present application;

[0094] FIG24 is a schematic diagram of a control method provided in a second embodiment of the present application;

[0095] FIG25 is a circuit arrangement architecture on a substrate of an optical component and a partial circuit architecture on a system-on-chip provided in one embodiment of the present application;

[0096] FIG26 is a circuit arrangement architecture on a substrate of an optical component and a partial circuit architecture of a system-on-chip and a power management module provided in one embodiment of the present application. DETAILED DESCRIPTION

[0097] The following describes possible implementations of the present application in conjunction with the accompanying drawings in possible implementations of the present application.

[0098] Please refer to Figure 1, which is a schematic diagram of an electronic device 1000 provided in a possible embodiment of the present application. The electronic device can be a mobile phone, tablet, laptop, television, vehicle-mounted device, wearable device, or other electronic product. The wearable device can be a smart bracelet, smart watch, wireless headset, augmented reality (AR) glasses, augmented reality helmet, virtual reality (VR) glasses, and VR helmet, etc.

[0099] The possible implementation methods of the present application are described by taking a mobile phone as an example of an electronic device.

[0100] Please refer to Figures 1 and 2 together. Figure 2 is a schematic structural diagram of the electronic device 1000 shown in Figure 1 at another angle. The electronic device 1000 includes a housing 100, a display screen 200, a front camera device 300, a rear camera device 400, a mainboard 500, a processor 600, a memory 700 and a battery 800. The display screen 200 is used to display images, and the display screen 200 may also have an integrated touch screen function. The display screen 200 is mounted on the housing 100. The housing 100 may include a frame 1001 and a back cover 1002. The display screen 200 and the back cover 1002 are respectively mounted on opposite sides of the frame 1001. In this possible embodiment, in the external space of the electronic device 1000, the space facing the display screen 200 is defined as the front of the electronic device 1000, and the space facing the back cover 1002 is defined as the back of the electronic device 1000.

[0101] In some possible implementations, the front camera device 300 is located inside the housing 100 and below the display screen 200. The display screen 200 is provided with a front camera hole 2001, and the front camera device 300 collects light in front of the electronic device 1000 through the front camera hole 2001 to achieve shooting.

[0102] In one embodiment, the optical assembly provided herein can be used in place of the front camera 300. Specifically, the optical assembly provided herein includes at least a portion of the front camera 300 and a detection light sensor. The detection light sensor collects environmental information through the front camera aperture 2001. For example, when a user approaches the front camera 300 while answering a call, the detection light sensor detects the user and turns off the display to reduce power consumption and increase battery life, and turns off the touch screen to prevent accidental touches.

[0103] The detection light sensor may be a proximity light sensor or a structured light sensor (such as a TOF rangefinder) for determining the position of a target object, such as 3D scanning.

[0104] In some possible implementations, the back cover 1002 is provided with at least one rear camera hole 1003. The rear camera device 400 is located inside the housing 100, and the rear camera device 400 collects light from the rear of the electronic device 1000 through the at least one rear camera hole 1003 to achieve shooting. In possible implementations of the present application, "at least one" includes two situations: one and more, more means more than two, and "more than" includes this number. The rear camera device 400 includes at least one camera module 4001, for example, it may include one or more of a standard camera module, a telephoto camera module, a wide-angle camera module, an ultra-telephoto camera module, and an ultra-wide-angle camera module. Exemplarily, the rear camera device 400 includes a standard camera, a wide-angle camera, and a periscope telephoto camera.

[0105] In one embodiment, the optical assembly provided by the present application can also be used in the position of the rear camera device 400. When the detection light sensor senses the environment through the back cover of the electronic device, the optical assembly provided by the present application can include at least part of the rear camera device 400 and the detection light sensor. The detection light sensor collects environmental information through the rear camera hole 1003. For example, when the mobile phone needs to lock the screen, you can place your hand at the position of the rear camera device 400, and the detection light sensor will detect and transmit the signal to the system-level image sensor (SOC), and the SOC will control the phone to lock the screen. Similarly, the detection light sensor can be a proximity light sensor or a structured light sensor.

[0106] In some possible implementations, the rear camera device 400 may further include a flash module 4002. The rear cover 1002 is provided with a flash hole 1004. The flash module 4002 is located inside the housing 100 and emits light through the flash hole 1004. The mainboard 500 is located inside the housing 100, and the processor 600 and memory 700 are fixed to the mainboard 500. The display screen 200, the front camera device 300, and the rear camera device 400 are electrically connected to the processor 600. The memory 700 is used to store computer program code. The computer program code includes computer instructions. The processor 600 is used to call computer instructions to cause the electronic device 1000 to perform corresponding operations, such as causing the display screen 200 to display a target image, causing the front camera device 300 and the rear camera device 400 to capture a target image, etc. The battery 800 is electrically connected to the mainboard 500 to power the electronic device 1000. In some possible implementations, the electronic device 1000 may also include one or more functional modules such as an antenna module, a mobile communication module, a sensor module, a motor, a microphone module, a speaker module, etc., and these functional modules can be electrically connected to the processor 600 to transmit signals.

[0107] Please refer to Figures 3 and 4 together. Figure 3 is a schematic diagram of an electronic device 1000 provided in one embodiment, and Figure 4 is a partial cross-sectional view of the electronic device 1000 shown in Figure 3, with the cross-section located at the position of the BB indicator line in Figure 3. As shown in Figure 3, the electronic device 1000 includes a display screen 200, and the display screen 200 has an optical window 200H. The optical window 200H can be a window for the front camera to collect image information. The optical window 200H is set on the display screen 200 and is located in an area near the top of the display screen 200. The optical window 200H can be located in the middle of the width direction of the display screen 200, or in a corner position at the top of the display screen 200.

[0108] Referring to FIG. 4 , in one embodiment, the display screen 200 is an OLED display screen. The display screen 200 includes a support layer 204, a TFT (Thin Film Transistor) layer 203, a display layer 202, and a protective layer 201, which are stacked in sequence. The support layer 204 is used to support the TFT layer 203 and the display layer 202. The TFT layer 203 is used to drive the display layer 202 to emit light. The protective layer 201 is used to protect the display layer 202. The protective layer 201 can be glass, i.e., CG (Cover Glass). At the location of the optical window 200H, the display screen 200 only retains the protective layer 201. That is, at the location of the optical window 200H, the support layer 204, the TFT layer 203, and the display layer 202 all form through holes. Therefore, at the location of the optical window 200H, only the protective layer 201 affects the transmittance. Because the protective layer 201 is transparent, the optical window 200H of the display screen 200 has high transmittance.

[0109] Referring to Figure 4, the electronic device provided by the present application is equipped with an optical component 10, which is arranged below the display screen 200 and assembled at the position of the optical window 200H. The optical component 10 interacts with the outside world through the optical window 200H on the display screen 200 to collect relevant information, for example, image information and proximity light information. The optical component 10 includes a camera module 30 and a detection light sensor 50. In this embodiment, the detection light sensor 50 is a proximity light sensor. The camera module 30 and the detection light sensor 50 in the optical component 10 provided in the embodiment of the present application share an optical window 200H, and there is no need to set up different optical windows on the display screen for the camera module 30 and the detection light sensor 50 to use. Therefore, the optical component 10 provided in the embodiment of the present application is used in an electronic device, so that the appearance integrity of the display screen 200 of the electronic device is better and the screen ratio of the display screen 200 is larger.

[0110] In one embodiment, the camera module 30 includes a substrate 31 , a structural member 32 , an image sensor 33 , a filter 34 , and a lens 35 .

[0111] Structural member 32 is cylindrical and encloses a space 321. Along the optical axis of camera module 30, both opposing ends of structural member 32 are open. One end is located at optical window 200H, and the other end is buckled onto substrate 31. Image sensor 33, filter 34, and lens 35 are located within enclosed space 321. Along the optical axis of camera module 30, filter 34 is located between image sensor 33 and lens 35.

[0112] In one embodiment, the image sensor 33 is fixed on the substrate 31. The filter 34 and the lens 35 are fixed to the structural member 32. The embodiment shown in Figure 4 only schematically shows the relative position relationship between the various structural elements in the camera module 30, and does not limit the specific connection method and specific position setting between the various structural elements, nor does it limit the structural form of the various structural elements. For example: in one embodiment, the structural member 32 can be an integrated structure. In other embodiments, the structural member 32 can also be formed by connecting two or more structures. For example, one of the cylindrical structures is used to fix the lens 35, and one of the frame-shaped base structures is used to install the filter 34 between the lens 35 and the image sensor 33 (the filter 34 can also be other types of optical elements). The different structures of the structural member 32 can be fixed by gluing.

[0113] Referring to FIG. 4 , in one embodiment, the detection light sensor 50 includes a light source 51, a control chip 52, and a light guide 53. The light source 51 is used to transmit a light signal. Specifically, the light source 51 is used to transmit a light signal for implementing a proximity light function or a proximity / distance judgment. For example, the light emitted by the light source 51 is an infrared light signal. In a specific embodiment, the light emitted by the light source 51 is an infrared light of 940 nm ± 20 nm. In a specific embodiment, the light source 51 is a vertical-cavity surface-emitting laser (VCSEL). The light guide 53 is used to transmit the infrared light signal emitted by the light source 51 to the optical window 200H, and emit it from the optical window 200H out of the display screen 200 to illuminate the sensing object outside the display screen 200. After the infrared light signal is reflected by the sensing object, it can enter the enclosed space 321 of the camera module from the optical window 200H. The control chip 52 is used to receive the light signal (e.g., infrared light) emitted by the light source 51 that enters the enclosed space 321.

[0114] The light guide 53 is used to transmit the light signal emitted by the light source 51. The light signal can enter the light guide 53 through the light incident surface of the light guide 53 and be transmitted to the light output surface in the light guide 53. The light signal is emitted through the light output surface. In one embodiment, the refractive index of the light guide material constituting the light guide 53 is greater than or equal to 1.4. For example, the refractive index of the light guide 53 is 1.5, 1.6, etc. The light guide material of the light guide 53 can be PC (polycarbonate material), glass, PMMA (polymethyl methacrylate material), etc. In one embodiment, the light guide can also be an optical fiber, such as a plastic optical fiber or a quartz optical fiber.

[0115] Referring to FIG4 , in one embodiment, the light source 51 and the control chip 52 are disposed in different spaces, respectively. The control chip 52 is disposed in the enclosed space 321 of the structural member 32. The light source 51 and the control chip 52 are separated by the structural member 32, so that the light emitted by the light source 51 cannot directly illuminate the position of the control chip 52. As shown in FIG4 , in one embodiment, the image sensor 33 and the light source 51 are both disposed on the substrate 31. The bottom end of the structural member 32 (the end of the structural member 32 away from the display screen 200) is connected to the substrate 31 to form two cavities C1 and C2, wherein one cavity C1 accommodates the image sensor 33 and the other cavity C2 accommodates the light source 51. That is, in this embodiment, the structural member 32 is provided with a light source accommodating area (cavity C2), and the light source accommodating area is located at the bottom end of the structural member 32. This solution sets the position of the light source accommodating area formed on the structural member 32 at the bottom end of the structural member 32. Since the light source 51 needs to be electrically connected to the driving circuit on the substrate 31 through a conductive wire, and since the bottom end of the structural member is connected to the substrate 31, this design facilitates the wiring of the light source 51.

[0116] In one embodiment shown in Figure 4 , the light receiver and signal processor of the detection light sensor are integrated onto a control chip 52. The control chip 52 is configured to receive and process infrared light signals. The control chip 52 is disposed on the image sensor 33. For example, the two can be stacked, with the control chip 52 disposed on the surface of the image sensor 33 facing away from the substrate 31. Alternatively, the control chip 52 is integrated into the image sensor 33. The "integrated" in "control chip 52 integrated into the image sensor 33" can be understood as a physical connection, such as affixing the control chip 52 to the image sensor via adhesive, or as a circuit integration, such as placing the control chip 52 within the image sensor and serving as a circuit component within the image sensor. The control chip 52 can be electrically connected to circuits within the substrate 31, for example, by gold wire bonding. In one embodiment, the control chip 52 is electrically connected to the light source 51, and the electrical connection between the two can be achieved through wiring within the substrate 31. The control chip 52 is configured to control the light source 51. In other implementations, the control chip 52 may not be electrically connected to the light source 51 , and the light source 51 may be controlled to emit light through other control circuits in the electronic device.

[0117] Referring to FIG. 5 , FIG. 5 is a schematic diagram of a control chip 52 for a detection light sensor in an optical assembly provided in one embodiment of the present application. The control chip 52 is electrically connected to a light source 51. The control chip 52 is also electrically connected to a microcontroller unit (MCU) or system-on-chip (SOC) of an electronic device, enabling control of the control chip 52 by the MCU or SOC or for information exchange with the control chip 52. The control chip 52 includes a light receiver 521 and a signal processor 522. The control chip 52 is the device and circuitry within the solid-line box between the light source 51 and the MCU or SOC. The signal processor 522 is the portion of the device and circuitry within the dashed-line box within the control chip 52. The control chip 52 provided in the embodiment shown in FIG. 5 integrates the light receiver 521 and the signal processor 522. The specific location of the light receiver 521 is not limited to that shown in FIG. The light receiver 521 may also be located within the dashed-line box. The specific locations of the components within the control chip 52 shown in FIG. 5 are merely schematic representations of the connection relationship between the components and do not limit the specific arrangement of the components.

[0118] Specifically, the signal processor 522 includes a digital-to-analog converter (e.g., an IDAC, i.e., a current-shaped digital-to-analog converter), an amplifier, an analog-to-digital converter (ADC), a control memory, and a light source driver (Tx_driver). The light source driver is used to drive the light source to emit light. The digital-to-analog converter is used to eliminate crosstalk from ambient light. The amplifier and the ADC are used to amplify the electrical signal converted and output by the optical receiver 521 and convert it into a digital signal. The amplifier can increase the gain. The control memory is used to coordinate transmission and reception and store the digital signal output by the ADC. The control memory is connected to the MCU or SOC through an interface (e.g., an I2C interface). In one embodiment, the MCU or SOC configures the signal processor 522 through the I2C interface and reads the test data stored in the signal processor 522. The signal processor 522 can report the status or test data of the signal processor 522 to the MCU or SOC through the interface.

[0119] Figure 6 is a schematic diagram of an optical assembly 10 provided in one embodiment of the present application. The embodiment shown in Figure 6 differs from the embodiment shown in Figure 4 in the configuration of the control chip 52 in the detection light sensor 50. Referring to Figure 6 , in this embodiment, the control chip 52 includes a light receiver 521 and a signal processor 522. These are independent components and can be positioned differently on the substrate 31, providing a more flexible configuration. To conserve space within the camera module 30, only the light receiver 521 can be positioned within the camera module 30. For example, the light receiver 521 can be positioned within the enclosed space 321. Specifically, in one embodiment, the light receiver 521 can be formed on the image sensor 33. In one embodiment, the light receiver 521 is integrated with the image sensor 33. The "integrated" in "light receiver 521 is integrated with the image sensor 33" can be understood as a physical connection, such as gluing the light receiver to the image sensor, or it can be understood as circuit integration, such as positioning the light receiver within the image sensor, where it serves as a circuit component within the image sensor.

[0120] The signal processor 522 is disposed on the substrate 31, and the signal processor 522 can be located outside the structural member 32. Figure 6 only schematically shows a specific solution in which the signal processor 522 is located on the periphery of the structural member 32. In other embodiments, the signal processor 522 can also be disposed side by side with the light source 51, or the signal processor 522 can be disposed inside the same chamber as the light source 51. The electrical connection between the signal processor 522 and the light source 51 can be achieved through internal wiring of the substrate 31, or can be directly connected on the surface of the substrate 31 through wires. The optical receiver 521 can be electrically connected to the circuits in the substrate 31, for example, by electrically connecting the circuits in the substrate 31 through gold wire. The electrical connection between the signal processor 522 and the optical receiver 521 can be electrically connected through wiring in the substrate 31.

[0121] Referring to FIG. 7 , FIG. 7 is a schematic diagram of a control chip 52 for a detection light sensor in an optical assembly according to one embodiment of the present application. In FIG. 7 , a solid-line frame represents a signal processor 522, and a light receiver 521 may be a PD. Light receiver 521 and light source 51 are located outside the solid-line frame, indicating that light receiver 521, light source 51, and signal processor 522 are independent components. The specific architecture of signal processor 522 shown in FIG. 7 is identical to that of signal processor 522 shown in FIG. 5 and will not be further described.

[0122] In the embodiment shown in FIG4 , the control chip 52 is integrated with the image sensor 33. In the embodiment shown in FIG6 , the light receiver 521 is integrated with the image sensor 33. Light emitted by the light source 51 exits the optical window 200H, is reflected by the target, enters the camera module 30 through the optical window 200H, passes through the lens 35 and the filter 34, and enters the control chip 52 or the light receiver 521.

[0123] Based on the embodiments shown in Figures 4 and 6, in one embodiment, refer to Figure 8A, which is a planar schematic diagram of the image sensor of the camera module in the optical assembly provided by one embodiment of the present application. For the image sensor 33, its effective area is the first area 331, and the first area 331 is the area within the larger solid line box in Figure 8A. The light entrance hole of the camera module is circular. When light enters the camera module, a circular light entrance projection area 334 is also formed. The area within the dotted circle in Figure 8A is the light entrance projection area 334 on the image sensor 33. The area where the light entrance projection area 334 and the first area 331 intersect is the image generation area on the image sensor 33. Since the captured image or video is rectangular, a rectangular imaging effective area needs to be formed within the image generation area on the image sensor 33. The present application defines the imaging effective area as the second area 332. As shown in Figure 8A, the second area 332 is the area surrounded by the rectangular box located within the first area 331. The area within the imaging effective area and outside the second area 332 is an additional area, that is, light can be projected into this area, but this area is not used for imaging by the camera module. This application defines this additional area as the third area 333.

[0124] In summary, the image sensor 33 has a first area 331, a second area 332, and a third area 333. The second area 332 is located inside the first area 331, and the third area 333 is located within the first area 331 and outside the second area 332. In the embodiment shown in FIG4 , the control chip is located in the third area 333, and in the embodiment shown in FIG6 , the light receiver is located in the third area 333.

[0125] Refer to Figure 8B, which is a planar schematic diagram of the image sensor of the camera module in the optical assembly provided in one embodiment of the present application. The difference between the embodiment shown in Figure 8B and the embodiment shown in Figure 8A is that: in the embodiment shown in Figure 8B, the image sensor 33 also has a transition zone 335, and the transition zone 335 is located between the second area 332 and the third area 333, that is, the setting of the transition zone 335 makes the second area 332 and the third area 333 not directly adjacent to each other. Due to the setting of the transition zone 335, this solution can prevent infrared light from entering the second area 332 (imaging area). For example, if the transition zone 335 is not provided, when the camera module is assembled, if there are assembly tolerances, etc., it may cause infrared light to enter the second area 332 (imaging area) and cause the image sensor to have a color cast problem.

[0126] Referring to FIG. 8B , in one embodiment, the image sensor further includes a logic area 336. The logic area 336 is located in a rectangular region outside the first region 331 and partially overlaps with the circular incident projection area 334. The logic area refers to a non-imaging area and is typically where the image signal processor (ISP) is located.

[0127] Based on the embodiments shown in Figures 4 and 6, in one embodiment, referring to Figure 9A, Figure 9A is a planar schematic diagram of the filter of the camera module in the optical assembly provided in one embodiment of the present application. The filter 34 is rectangular and has an outer edge 340. Similarly, the dotted circular area in Figure 9A is the incident light projection area 344 on the filter 34, and the area where the incident light projection area 344 and the outer edge 340 intersect is the effective light transmission area. Since the captured image or video is rectangular, a rectangular imaging light transmission area needs to be formed within the effective light transmission area on the filter 34. The present application defines this imaging light transmission area as area one 341. The area within the effective light transmission area and outside area one 341 is an additional area, that is, light can pass through this area, but this part of the light is not used for imaging. The present application defines the additional area on the filter 34 as area two 342. Area two 342 is located outside area one 341.

[0128] In one embodiment, referring to FIG9B , FIG9B is a planar schematic diagram of a filter of a camera module in an optical assembly provided in one embodiment of the present application. The difference between the embodiment shown in FIG9B and the embodiment shown in FIG9A is that: in the embodiment shown in FIG9B , the filter 34 also includes an isolation area 343 (the rectangular black frame between area 1 341 and area 2 342 in FIG9B represents the isolation area 343 ), and the isolation area 343 is connected between area 1 341 and area 2 342 . The isolation area 343 is used to prevent the problem of color cast of the image sensor caused by infrared light entering the second area (the imaging area on the image sensor). The isolation area 343 needs to be a low-transmittance material or an opaque material. The isolation area 343 can prevent infrared light from reaching the imaging area of ​​the image sensor and causing crosstalk.

[0129] FIG10 is a schematic diagram of the optical path of the embodiment shown in FIG4 , and the embodiment shown in FIG6 may also have a similar optical path. Referring to FIG10 , in the optical axis direction of the camera module, area 1 341 of the filter 34 is arranged corresponding to the second area 332 of the image sensor 33, and area 2 342 is arranged corresponding to the third area 333 of the image sensor 33. The “corresponding arrangement” mentioned here can be understood as that the two correspond to each other on the optical path, and their shapes can be the same, but it does not mean that the sizes of the two are the same. For example, the size of area 1 341 of the filter 34 may be smaller than the size of the second area 332 of the image sensor 33. In one embodiment, area 1 341 of the filter 34 is used to transmit visible light and cut off infrared light. Area 2 342 of the filter 34 is used to transmit infrared light or partially transmit infrared light.

[0130] As shown in Figure 10, the infrared light emitted by the light source 51 is transmitted through the light guide 53 to the optical window 200H, emitted from the display screen 200, and projected onto the detection target. After being reflected by the detection target, it enters the optical window 200H. After passing through the lens 35, the infrared light is projected onto the second region 342 of the filter 34. Because the second region 342 can transmit infrared light or partially transmit infrared light, the infrared light passes through the second region 342 of the filter and is projected onto the third region 333 of the image sensor 33. The control chip 52 is disposed in the third region 333. Therefore, the control chip 52 can receive the infrared light and process the infrared light signal to realize the detection function of the detection light sensor and determine the state of the detection target relative to the display screen (close or far).

[0131] This solution sets the properties of area 1 and area 2 of the filter to match the solution of integrating the receiver on the image sensor, so that the overall optical module can maintain the size of the camera module and integrate the function of the detection light sensor without changing the spatial layout of the camera module.

[0132] In the embodiment shown in FIG10 , the camera module 30 captures the target scene through the optical window 200H. The light of the target scene passes through the optical window 200H, sequentially through the lens 35 and the area 1 341 of the filter 34, and is projected onto the second area 332 of the image sensor 33, so that the image sensor 33 captures image information.

[0133] FIG11 is a schematic diagram of an optical component provided by an embodiment. In the embodiment shown in FIG11 , the control chip 52 is disposed on the filter 34. The control chip 52 is located on the surface of the filter 34 away from the image sensor 33. The control chip 52 can be electrically connected to the substrate 31 by gold wire. All areas on the filter 34 are used to transmit visible light and cut off infrared light. In this embodiment, the filter 34 and the image sensor 33 are stacked, that is, the filter 34 is directly attached to the surface of the image sensor 33. This method eliminates the connection between the filter 34 and the structural member 32. Moreover, the filter 34 and the image sensor 33 are used to jointly carry the control chip 52, so that the assembly of the control chip 52 in the camera module has structural stability, and can also ensure that the overall structure of the camera module is simple, which is conducive to a miniaturized design.

[0134] FIG12 is a schematic diagram of an optical component provided by one embodiment. In the embodiment shown in FIG12 , the optical filter 34 is fixedly connected to the structural member 32, and the optical receiver 521 is arranged on the optical filter 34. The optical receiver 521 is located on the surface of the optical filter 34 away from the image sensor 33. The entire area on the optical filter 34 is used to transmit visible light and cut off infrared light. The signal processor 522 of the optical proximity sensor is located on the substrate 31 and can be arranged on the periphery of the structural member 32. This solution continues the design scheme of separately arranging the optical filter 34 and the image sensor 33, and integrates the optical receiver 521 on the optical filter 34. Arranging the signal processor 522 on the periphery of the structural member 32 minimizes the number of optical devices inside the structural member 32, and also ensures that the optical device carried by the optical filter 34 is only the optical receiver 521. The structure is simple and light in weight. Moreover, the optical receiver 521 only needs two wires to be connected to the substrate 31, and the electrical connection circuit is simple.

[0135] Figure 13 is a schematic diagram of an optical component provided in one embodiment. In the embodiment shown in Figure 13, the light receiver 521 is connected to the inner wall of the structural member 32. This solution provides a solution for arranging the light receiver on the inner wall of the structural member, which can keep the design of the image sensor and the filter unchanged, and has a lower design cost. In one embodiment, the light receiver 521 is located on the side of the filter 34 away from the image sensor 33, that is, the light receiver 521 is located in the space between the lens 35 and the filter 34. The filter 34 is used to transmit visible light and cut off infrared light, and the filter 34 is used to reflect the light signal (infrared light) emitted by the light source 51 entering the enclosed space to the light receiver 521. In this embodiment, the filter 34 can be fixedly connected to the structural member 32 (as shown in Figure 13). In one embodiment, the transmittance of the filter 34 is greater than x%, where x can be any value in the range of greater than or equal to 1 and less than or equal to 80.

[0136] For example, the light receiver 521 can be provided on the filter 34. By integrating the light receiver on the filter, this solution can achieve the same optical design as the image sensor and the filter. It only needs to fix the light receiver on the filter and then electrically connect the light receiver and the substrate via wires. This solution has the advantages of low design cost and easy implementation.

[0137] In other embodiments, the optical filter 34 may also be stacked on the surface of the image sensor 33 (as shown in FIG11 ), and the optical receiver 521 may be fixed to the surface of the optical filter 34. The stacking of the optical filter 34 and the image sensor 33 allows the stacked structure formed by the optical filter 34 and the image sensor 33 to jointly support the optical receiver, facilitating assembly and fixation of the optical receiver and ensuring the structural stability of the optical receiver.

[0138] The optical receiver 521 can be connected to the structural member 32 using screws, adhesive, or other fixing methods. The optical receiver 521 and the substrate 31 can be electrically connected by a wire extending along the inner wall of the structural member to the substrate 31, with the ends of the wire electrically connecting the optical receiver 521 and the substrate 31, respectively. The signal processor 522 is disposed on the substrate 31 and located outside the structural member 32. The signal processor 522 and the optical receiver 521 are electrically connected via wiring within the substrate 31.

[0139] In the embodiments shown in Figures 4, 6, 11, and 12, the light source 51 is disposed on the substrate 31 and located within a cavity C2 of the structural member 32, also referred to as the light source accommodation area. By providing the light source accommodation area on the structural member 32 to accommodate the light source 51, the light signal emitted by the light source 51 is concentrated within the light source accommodation area and then conducted to the light output area via the light guide. This design improves the light utilization efficiency of the light source 51, enhances the detection efficiency of the light sensor, and reduces light loss caused by diffusion of light emitted by the light source 51 into other spaces within the electronic device. As shown in Figure 4, the light source accommodation area (cavity C2) has an open end C21 and a light output hole C22. The structural member 32 is made of a light-shielding material. Specifically, the bottom of the cavity C2 is the open end C21, and the open end C21 of the bottom of the cavity C2 is coupled to the substrate 31, so that the cavity C2 is snap-fitted to the substrate 31 and the light source 51 is housed within the cavity C2. This solution sets the light source 51 on the substrate 31, and utilizes the combination of the open end C21 of the light source accommodating area of ​​the structural member 32 and the substrate 31 to achieve the installation of the light source 51 in the light source accommodating area, which is convenient for assembly and more convenient for wiring of the light source 51. A light outlet hole C22 is provided at the top of the chamber C2, and the light emitted by the light source 51 is emitted from the chamber C2 through the light outlet hole C22. In one embodiment, the light guide 53 transmits the light emitted by the light source 51 to the position of the optical window 200H. One end of the light guide 53 can be located in the light outlet hole C22. One end of the light guide 53 can also pass through the light outlet hole C22 and extend into the interior of the chamber C2. By providing the light guide 53, this solution can enable the light signal emitted by the light source 51 to be transmitted to the light outlet area more, thereby improving the utilization rate of the light signal and improving the detection efficiency of the detection light sensor.

[0140] In the embodiment shown in FIG13 , the light source 51 is fixed to the outer surface of the structural member 32. Specifically, as shown in FIG13 , the outer surface of the structural member 32 includes a mounting surface, which faces the display screen 200. The mounting surface can be oriented in the same direction as the substrate 31, or parallel to the surface of the substrate 31. The mounting surface is located between the substrate 31 and the display screen 200. The light source 51 can be attached to the mounting surface using screws, adhesive, or other fixing methods. One end of a light guide 53 faces the light source 51, and the other end of the light guide 53 is located within the optical window 200H. The light guide 53 is used to guide light emitted by the light source 51 to the optical window 200H. In other embodiments, the detection light sensor 50 may not be provided with a light guide 53. The light emitted by the light source 51 can be reflected by the structural member 32, the display screen 200, or other structural members to the optical window 200H. In this embodiment, since the light source 51 is located on the mounting surface, the distance between the light source 51 and the optical window 200H is smaller than the distance between the substrate 31 and the optical window 200H. Compared with the embodiment shown in FIG. 12 , the light source 51 has a higher light utilization rate and a smaller light loss, which can improve the detection efficiency of the detection light sensor 50 .

[0141] In the embodiment shown in FIG13 , the light source 51 is electrically connected to the substrate 31. Specifically, the electrical connection can be achieved through an electrical connection line 511. The electrical connection line 511 can be arranged along the outer surface of the structural member 32, or can be arranged in the space outside the structural member 32, or can be embedded in the interior of the structural member 32. The signal processor 522 and the light source 51 can be electrically connected through the combination of the electrical connection line 511 and the wiring within the substrate 31.

[0142] Figure 14 is a schematic diagram of an optical component provided by an embodiment. In the embodiment shown in Figure 14, the detection light sensor 50 includes a light source 51 and a control chip 52, and the detection light sensor 50 does not include a light guide. The light source 51 is arranged on an end of the structural member 32 away from the substrate 31. The light source 51 is located in the optical window 200H. Specifically, the end face of the structural member 32 located in the optical window 200H is provided with a step surface 328, and this step surface 328 is a mounting groove wall formed by cutting off part of the structural member 32. The light source 51 is fixed on this step surface 328. This solution forms a step surface at the end of the structural member located in the optical window, and the step surface is formed by removing material, which is conducive to ensuring the small size of the optical window and improving the screen-to-body ratio of the display screen. The end of the structural member 32 located in the optical window 200H is the top of the structural member 32. This solution can be understood as setting a light source accommodating area at the top of the structural member 32. The mounting groove where the step surface 328 is located can be understood as the structure of the light source accommodating area. The light source 51 is set in the light source accommodating area. This solution sets the light source 51 at the top of the structural member 32 so that the light source 51 is located in the optical window. There is no need to set a light guide. The light from the light source 51 can be directly emitted from the display screen. This not only improves the utilization rate of light and the detection efficiency of the detection light sensor, but also eliminates the need for a light guide and saves the cost of the optical component. Specifically, the top of the structural member 32 is surrounded by a cylindrical structure, the internal space of the cylindrical structure is the light entrance, and the lens 35 is located in the internal space of the cylindrical structure. The light source accommodating area can be formed on the end face or outer surface of the cylindrical structure of the structural member 32. As shown in Figure 14, the light source accommodating area is open (or open-shaped) on one side of the end face and one side of the outer surface of the cylindrical structure. The open end face is set to allow the light from the light source 51 to be directly emitted from the display screen. The opening of the outer surface is used to lead out the electrical connection line 511 connected between the light source 51 and the substrate 31 .

[0143] The light emitted by the light source 51 is directly emitted from the optical window 200H and exits the display screen 200, without the need for a light guide. The light source 51 and the substrate 31 are electrically connected via an electrical connection line 511. The electrical connection line 511 extends along the outer surface of the structural member 32 to the substrate 31 and is electrically connected to the wiring inside the substrate 31. The wiring inside the substrate 31 can realize the electrical connection between the light source 51 and the control chip 52. The specific arrangement of the optical receiver and signal processor of the control chip 52 in the embodiment shown in Figure 14 can also be replaced by the design scheme of the optical receiver 521 and signal processor 522 in the embodiments shown in Figures 13, 12, 11, and 6.

[0144] FIG15 is a perspective schematic diagram of an optical assembly 10 provided in one embodiment. FIG16 is a perspective exploded schematic diagram of the optical assembly provided in FIG15 from one direction. FIG17 is a perspective exploded schematic diagram of the optical assembly provided in FIG15 from another direction. Referring to FIG15 , FIG16 and FIG17 , the optical assembly 10 includes a substrate 31, which is used to house electronic components. The electronic components of the optical assembly 10, such as the image sensor 33, the light source 51, and the signal processor 522, are disposed on the substrate 31. The optical receiver can be integrated with the image sensor 33. The structural member 32 includes a first structural body 32A and a second structural body 32B. The first structural body 32A surrounds a first enclosing space 321A, and the second structural body 32B surrounds a second enclosing space 321B. The first enclosing space 321A is used to accommodate a lens 35. In one embodiment, the second enclosing space 321B is used to accommodate the image sensor 33 and the filter 34. In one embodiment, the second enclosed space 321B may only accommodate the filter 34 , and the image sensor 33 may be sunken into the substrate 31 . For example, a groove may be provided on the surface of the substrate 31 to accommodate the image sensor.

[0145] Referring to Figures 16 and 17 , the first structure 32A and the second structure 32B are fixedly connected by adhesive layer B1, and the second structure 32B and the substrate 31 are fixedly connected by adhesive layer B2. This solution, by designing the structural member 32 as a split structure, facilitates the assembly of the filter 34 and lens 35, helping to ensure the positional accuracy and connection reliability of the various components in the camera module. In other embodiments, the first structure 32A and the second structure 32B can also be designed as a single-piece structure.

[0146] As shown in Figure 15, in this embodiment, the vertical projection of the structural member 32 on the substrate 31 covers a portion of the area of ​​the substrate 31. The structural member 32 is snapped onto the substrate 31, accommodating the image sensor inside the structural member 32, and the light source 51 is located on the periphery of the structural member 32. This design can give the structural member 32 the advantage of being small in size, making the optical component lightweight. Moreover, the light source 51 and the light receiver located inside the structural member 32 are separated by the structural member 32, eliminating the need to provide multiple chambers on the structural member 32, simplifying the structure of the structural member 32 and having the advantage of low manufacturing cost.

[0147] Referring to Figures 15, 16 and 17, the optical component 10 includes a shielding cover 40, which is buckled on the substrate 31. The shielding cover 40 is located on one side of the structural member 32 and is used to shield the electronic devices on the substrate 31 and outside the structural member 32. For example, in one embodiment, the light source 51 is located on the periphery of the structural member 32, and the shielding cover 40 surrounds the light source 51, and the light source 51 is located in the receiving space formed by the substrate 31 of the shielding cover. Such a design can prevent the light emitted by the light source 51 from leaking to the outside of the optical component 10, and can improve the utilization rate of the light signal emitted by the light source 51. A through hole 401 is provided on the shielding cover 40, and the through hole 401 is used to accommodate the light guide 53. Specifically, one end of the light guide 53 can extend from the through hole 401 into the receiving space between the shielding cover 40 and the substrate 31, so that one end of the light guide 53 can be adjacent to the light source 51. One end of the light guide 53 may also be located inside the through hole 401 (i.e., it does not extend into the light shield, but only stops within the space surrounded by the through hole 401). The light emitted by the light source 51 is mapped to one end of the light guide 53, so that the light can enter the light guide 53. The light guide 53 transmits the optical signal to the light exit area, that is, the periphery of the end of the structural member 32 facing away from the substrate 31.

[0148] Referring to Figure 15, the light guide 53 includes a light emitting portion 530, which is a portion of the light guide 53 located in the light emitting area of ​​the light signal emitted by the light source 51 of the detection light sensor. In one embodiment, the light emitting portion 530 is arranged around at least a portion of the structural member 32. In the embodiment shown in Figure 15, the light emitting portion 530 can be in the shape of a closed ring. Specifically, the light emitting portion 530 can be in the shape of a circular ring, a polygonal ring structure, and so on. In the present application, by designing the light emitting portion 530 as a closed ring, the point light source at the light entrance position of the light guide 53 is converted into a surface light source at the light exit position, which can more clearly illuminate the detection target. The light exit portion 530 is within the optical window and can completely surround the portion of the structural member 32 located within the optical window, so that the light from the light source 51 forms an annular light exit surface at the optical window position. The light can be emitted in all directions (360 degrees) from the periphery of the camera module's light inlet position, allowing more infrared light emitted by the light source 51 to enter the interior of the structural member 32, thereby improving the detection efficiency of the detection light sensor. In other embodiments, the light exit portion 530 can also be annular, semi-annular, arc-shaped, etc. with an opening.

[0149] Referring to Figures 16 and 17 , the structural member 32 includes a top end 323 and a bottom end 324, which are positioned opposite each other, and a main body region 325 connected between the top end 323 and the bottom end 324. The top end 323 is formed at the top of the first structural body 32A, and the bottom end 324 is formed at the bottom of the second structural body 32B. The bottom end 324 is connected to the substrate 31, and the top end 323 extends into the optical window. The top end 323 encloses a cylindrical structure, the interior of which serves as the light inlet for the camera module.

[0150] In one embodiment, the light source vacant area may be formed at the top end 323 , for example, at the end face or outer surface of the top end 323 , and the light source accommodating area and the light entrance are separated by a structural member 32 .

[0151] FIG18 is a schematic diagram of a substrate and electronic components disposed on the substrate, provided in one embodiment. Referring to FIG18 and FIG15 , an image sensor 33 is disposed on the substrate 31, and a light source 51 and a signal processor 522 are disposed on the substrate 31. The light source 51 and the signal processor 522 are located on the same side of the image sensor 33. As shown in FIG15 , the light source 51 and the signal processor 522 are located on the same side of the structural member 32. Furthermore, the light source 51 and the signal processor 522 are disposed adjacent to each other. Adjacent arrangement can be understood as meaning that no other electronic components are disposed between the light source 51 and the signal processor 522. This design facilitates wiring arrangement of the substrate 31, making the electrical connection path between the light source 51 and the signal processor 522 closer, which is beneficial for improving the operating efficiency of the detection light sensor. In one embodiment, the light source 51, the signal processor 522, and other electronic components on the substrate 31 located outside the structural member 32 are all located within the enclosed space formed by the shielding cover 40 and the substrate 31.

[0152] FIG19A is a schematic diagram of an optical assembly provided in one embodiment. FIG19B is a cross-sectional view of the optical assembly shown in FIG19A. In the embodiments shown in FIG19A and FIG19B, the bottom end of the structural member 32 is combined with the substrate 31, and the structural member 32 and the substrate 31 are connected to form two chambers C1 and C2, wherein one chamber C1 accommodates the image sensor 33 and the other chamber C2 accommodates the light source 51. The two chambers C1 and C2 are separated by a partition wall 326 formed by the structural member 32. A light exit hole C22 is formed on the side of the chamber C2 facing away from the substrate 31. The light guide 53 passes through the light exit hole C22, one end of the light guide 53 is in the chamber C2, and the other end of the light guide 53 is at the top end of the structural member 32 (i.e., the end of the structural member 32 away from the substrate 31 and the end of the structural member 32 located at the optical window position).

[0153] 20A , 20B , and 20C are respectively a stereoscopic view, a plan view, and a cross-sectional view of a light guide in an optical assembly provided in one embodiment of the present application.

[0154] 20A , 20B and 20C , the light guide 53 includes a light incident surface 531 , a transmission section 532 and a light emitting surface 533 . The transmission section 532 is an elongated rod-shaped structure with a bent shape. The cross-section of the transmission section 532 can be circular, square, triangular, polygonal, irregular, or the like. The light incident surface 531 is an end face of the transmission section 532 and is the end face of the transmission section 532 facing the light source 51 . The light emitting portion 530 is connected to the end of the transmission section 532 away from the light source. The light emitting surface 533 is the end face of the light emitting portion 530 and is the surface facing the external space of the display screen. In this embodiment, the light emitting portion 530 is annular and surrounds the periphery of the structural member.

[0155] In one embodiment, the refractive index of the light-guiding material of the light guide is greater than or equal to 1.4. The refractive index of the light-guiding material of the light guide is greater than the refractive index of the external environment of the light guide, which satisfies the requirement for light to propagate by total internal reflection within the light guide. For example, the refractive index of the light-guiding material of the light guide (taking PC as an example) is 1.5, and the external environment is air, which has a refractive index of 1. In this case, when light enters the light guide, because the refractive index of the light-guiding material is greater than the refractive index of the external environment of the light guide, the light can be totally reflected within the light guide.

[0156] As shown in FIG20A , in one embodiment, the outer surface of the light guide 53 includes at least one total reflection curved surface 5321. At the position of the total reflection curved surface 5321, the calculation formula for the total reflection critical angle of light is:

[0157] Wherein, n1 is the refractive index of the light-guiding material, and n2 is the refractive index of the material outside the light-guiding material and in contact with the light-guiding material.

[0158] Taking PC material and air as an example, the calculation formula for the total reflection critical angle of light is:

[0159] The conditions that need to be met in the design of the light guide provided in one embodiment of the present application at the position of the total reflection curved surface 5321 are:

[0160] θ1>θc>41.8°,

[0161] This design can improve the transmission efficiency of light.

[0162] As shown in Figure 20B, in one embodiment, the transmission section 532 of the light guide 53 includes a first curved section 532A and a second curved section 532B, the first curved section 532A is located between the second curved section 532B and the light incident surface 531, and the number of the total reflection curved surfaces is two, namely the first curved surface S1 and the second curved surface S2, the first curved surface S1 is the surface of the first curved section 532A, the second curved surface S2 is the surface of the second curved section 532B, and the bending radius of the first curved section 532A is smaller than the bending radius of the second curved section 532B.

[0163] As shown in Figure 20C, in one embodiment, the light guide 53 includes an inner body 5301 and an enclosing layer 5302, the inner body 5301 includes a light incident surface 531, a light emitting surface 533 and an outer peripheral surface 535, the outer peripheral surface 535 is connected between the light incident surface 531 and the light emitting surface 533, the enclosing layer 5302 is arranged on the outer peripheral surface 535 of the inner body 5301, the inner body 5301 is made of light-guiding material, and the enclosing layer 5302 is used to realize the transmission of light from the light incident surface 531 to the light emitting surface 533 in the inner body 5301.

[0164] In one embodiment, the enveloping layer 5302 is a total reflection film, which is used to achieve total reflection of light in the inner body 5301. The material of the enveloping layer 5302 is a metal film or a dielectric total reflection film. The metal film can be made of silver, aluminum, etc., and the dielectric total reflection film can be made of tantalum oxide, etc.

[0165] In one embodiment, the material of the inner body 5301 can be PC (polycarbonate material), glass, PMMA (polymethyl methacrylate material), etc.

[0166] Referring to FIG. 19A , in one embodiment, the light guide 53 can be integrally assembled with the structural member 32. Specifically, the structural member and the light guide can be formed into a single piece using a two-shot injection molding process. By designing the mold to achieve alternating flow of two different material solutions within the mold cavity, the light guide and the structural member can be integrated into one structure, thereby reducing the number of parts, increasing assembly efficiency, and improving the overall structural reliability of the camera module.

[0167] In other embodiments, the light guide has an overall rod-like structure, comprising a light incident surface, a transmission section, and a light exit surface. The transmission section is connected between the light incident surface and the light exit surface, the light incident surface faces the light source, and the light exit surface is located in the light exit area of ​​the light signal emitted by the light source 51. The transmission section has an elongated rod-like structure, and the end faces of the transmission section at both ends constitute the light incident surface and the light exit surface. This solution is equivalent to the light guide in FIG15 , except that the light exit portion does not form a ring-shaped structure, but instead directly forms the light exit surface with one end of the transmission section.

[0168] The present application integrates the camera module and the detection light sensor into one optical assembly by arranging the light receiver of the detection light sensor in the enclosed space of the structural member, and separating the light source and the light receiver by the structural member. Since the structural member has a light-shielding property, the structural member separates the light receiver and the light source, which can achieve light isolation between the light receiver and the light source, avoid the crosstalk of light emitted by the light source to the area where the control chip is located, and ensure the detection efficiency of the detection light sensor. Moreover, the detection light sensor in the optical assembly provided by the present application utilizes the peripheral area of ​​the light inlet of the camera module as the light outlet area of ​​the light source, that is, the detection light sensor and the camera module share an optical window on the same display screen. Since the transmittance of this optical window is high, it is beneficial to improve the detection efficiency of the detection light sensor. For electronic devices, there is no need to set multiple optical windows on the display screen, so that the visual effect of the display screen is better. The present application can improve the screen-to-body ratio and also has the advantage of saving internal space of electronic devices.

[0169] By integrating the light receiver onto the image sensor, the present application eliminates the need for additional space within the camera module. Instead, the application utilizes only the edge of the image sensor's imaging area that is capable of capturing light. For example, this area on the image sensor is otherwise unused and would not house other electronic components. Therefore, by integrating the light receiver onto the image sensor, the present application utilizes the unused space within the image sensor, ensuring that the combined design of the detection light sensor and camera module does not affect the size and structural layout of the camera module itself.

[0170] In a specific embodiment, it is assumed that the light source of the detection light sensor adopts a vertical cavity surface emitting laser (VCSEL), and the light guide is implemented using a 1mm plastic optical fiber. The transmittance of the lens in the camera module (including the optical window after the screen window is opened) is 80%. Since the optical path of the light guide is <10cm, the transmission loss of the light guide can be ignored. The coupling loss between the VCSEL and the light guide can be easily reduced to <2dB. That is, >62% of the light signal sent by the VCSEL will be coupled into the light guide. The equivalent transmittance of the transmission path is >49%.

[0171] Assuming that the transmittance of the filter is >10%, the equivalent transmittance of the receiving channel is >8%.

[0172] It can be seen that the optical components provided by the embodiments of the present application can increase the equivalent transmittance by 30 to 490 times. The effective signal strength during detection light detection can be increased by 30 to 490 times, making it easy to distinguish the signal strength differences of target objects at different set distances (for example, 3 cm and 5 cm).

[0173] Because the light source and light receiver are separated by a structural member, that is, they are placed in independent cavities, the light signal sent by the light source is unlikely to directly interfere with the detector and can only be transmitted outside the display screen through the light guide, reducing crosstalk from the light source to the detector. Using the method of the present invention, when detecting the difference in signal intensity of a target object at a distance of 3cm / 5cm, it is easier to obtain a higher signal-to-interference plus noise ratio (SNR). This makes it easier to distinguish between targets at a distance of 3cm / 5cm, and to make it easier to determine whether they are approaching or far away.

[0174] The electronic device provided by the present application adopts the optical component provided by the first aspect, so that the display screen of the electronic device has a specific and better screen-to-body ratio. Only one optical window needs to be set to meet the two different functions of the camera module and the detection light sensor, saving the opening area on the display screen. Moreover, the integrated design of the camera module and the detection light sensor is also conducive to saving space inside the electronic device without affecting the respective functions of the camera module and the detection light sensor. Since the light transmittance of the optical window of the camera module is relatively high, the present application can improve the detection efficiency of the detection light sensor.

[0175] In a possible embodiment, the light source is located on the inner wall of the optical window. The present application can set the light source on the inner wall of the optical window, saving space inside the electronic device and improving the efficiency of the light source.

[0176] In one possible embodiment, the light source is disposed on the back of the display screen. This application can utilize the back of the display screen as the installation location for the light source, thereby saving space within the electronic device. The light source can be positioned on the back of the display screen close to the optical window, thereby improving the efficiency of the light source.

[0177] In one possible implementation, the light source is integrated into the display screen. The light source can be integrated into the display screen during its production process, or the display screen's driver can be used to drive the light source. This design significantly reduces internal space in the electronic device.

[0178] Referring to Figure 21 , in one possible implementation, the present application provides a control system, which can be a control circuit for an integrated camera module and a detection light sensor. The control system includes a driver, a first receiving circuit Rx1, a second receiving circuit Rx2, and a control circuit. The first receiving circuit Rx1 is used to receive and process light signals from the detection light sensor, while the second receiving circuit Rx2 is used to receive and process image signals from the imaging portion of the camera module. Both the first receiving circuit Rx1 and the second receiving circuit Rx2 can be equipped with functional circuits such as signal amplification circuits and signal sampling circuits.

[0179] The driver is electrically connected to the control circuit, and the driver is also electrically connected to the light source 51 . The control circuit transmits a control signal to the driver, and the driver is used to control the light source 51 to emit light.

[0180] In Figure 21 , the arrowed line labeled "ctrl" between the control circuit and the driver represents a control signal line used by the control circuit to transmit control signals to the driver. Similarly, control signal lines ("ctrl" lines) are provided between the control circuit and the first receiving circuit RX1, and between the control circuit and the second receiving circuit RX2. The arrowed line labeled "data" between the first receiving circuit RX1 and the control circuit represents a data signal line used by the first receiving circuit RX1 to transmit data signals to the control circuit. Similarly, a data signal line ("data" line) is provided between the second receiving circuit RX2 and the control circuit.

[0181] The first receiving circuit Rx1 is electrically connected to the control circuit and is also electrically connected to the optical receiver 521 of the detection light sensor. The optical receiver 521 can be a detector structure arranged in an array. The control circuit transmits a control signal to the first receiving circuit Rx1, so that the first receiving circuit Rx1 receives the optical signal collected by the detection light sensor. The first receiving circuit Rx1 can also transmit the received optical signal to the control circuit.

[0182] The second receiving circuit Rx2 is electrically connected to the control circuit and is also electrically connected to the image sensor 33 of the camera module. The control circuit transmits a control signal to the second receiving circuit Rx2, which receives the image signal captured by the image sensor 33. The second receiving circuit Rx2 can also transmit the received image signal to the control circuit.

[0183] In one embodiment shown in FIG21 , the control system is integrated into an image signal processor (ISP), i.e., the control system is designed into the ISP chip. The driver, first receiving circuit Rx1, second receiving circuit Rx2, and control circuit are all integrated into the ISP chip.

[0184] In one embodiment shown in FIG22 , the first receiving circuit Rx1, the second receiving circuit Rx2 and the control circuit in the control system are integrated into an image signal processor (ISP), while the driver is provided outside the ISP, that is, the driver is separated to form a separate chip or control circuit.

[0185] The control system provided in the present application integrates a first receiving circuit for collecting detection signals from a detection light sensor and a second receiving circuit for collecting imaging signals from a camera module. One control system can control two optical modules with different functions, which can save the area of ​​the circuit board occupied by the control system and is conducive to the miniaturization design of electronic equipment.

[0186] The present application also provides a control method for an optical component, the control method comprising periodically executing the imaging control of the camera module and the detection control of the detection light sensor; wherein, the detection control of the detection light sensor is performed once or multiple times in the interval time period between two imaging controls of the camera module; or, the imaging control of the camera module is performed once or multiple times in the interval time period between two detection controls of the detection light sensors. The control method provided by this solution is used to realize a scenario in which the imaging part (image sensor) of the camera module does not work when the detection light sensor is working. The imaging control of the camera module and the detection control of the proximity light sensor can be performed in different time periods. The detection light sensor can be independently controlled without starting the camera module, which can reduce the energy consumption of the electronic device.

[0187] 21 and 23 , in one embodiment, the detection light sensor is a proximity light sensor, and the detection control of the detection light sensor in each detection cycle includes the following steps:

[0188] S101: Turn off the light source 51. The control circuit controls the first receiving circuit RX1 to perform a first exposure on the light receiver 521 of the proximity light sensor, generating a first light signal. Assume that the time for this first exposure is T1. During T1, the light source 51 of the proximity light sensor is in the off state. That is, the driver outputs no drive signal to the light source 51, and the light source 51 does not emit light. During T1, the first receiving circuit RX1 receives and processes the first light signal. The first light signal may be a background environment signal, which includes light intensity, background noise, or background light in the background environment.

[0189] S102, turning on the light source 51, making the light source 51 emit light for T2 time, and at the same time controlling the first receiving circuit RX1 to expose the light receiver 521 of the proximity light sensor for a second time to generate a second light signal, and processing the second light signal through the first receiving circuit.

[0190] S103: Determine a proximity light detection signal according to the first light signal and the second light signal.

[0191] S104: judging whether the target object is moving away or approaching according to the final proximity light detection signal, and outputting an approaching or moving away state indication.

[0192] The image signal of the camera module imaging exposure is collected through the second receiving circuit RX2.

[0193] In this embodiment, the second receiving circuit RX2 drives the imaging control part of the camera module (the driving period is indicated by the imaging exposure in Figure 23), and the first receiving circuit RX1 drives the control part of the proximity light sensor (the driving period is indicated by the collection of background light and the collection of received signals in Figure 23).

[0194] Based on the first embodiment, in other embodiments, the control method may not include step S103, and instead may be implemented by performing signal acquisition through integration. Specifically, when performing signal acquisition through integration, steps S101 and S102 may be subtracted using reverse integration. Assuming that step S101 is a forward integration, step S102 is a reverse integration. Assuming that step S101 is a reverse integration, step S102 is a forward integration. This solution can be implemented by switching the polarity of the integration circuit input.

[0195] In one embodiment, in combination with Figures 21 and 24, the present application provides a control method for realizing a scenario in which when the proximity light sensor is working, the imaging part (image sensor) of the camera module also works, but the imaging of the proximity light sensor and the camera module is completed in coordination with each other.

[0196] In this embodiment, the detection control of the detection light sensor in each detection cycle includes the following steps:

[0197] At step S301, light source 51 is turned off. The control circuit then controls second receiving circuit RX2 to expose image sensor 33, generating a first light signal. Assuming exposure time T10, during this time, light source 51, which is close to the light sensor, is off. That is, the driver outputs no drive signal to light source 51, and light source 51 does not emit light. During this time, the first light signal is received and processed by second receiving circuit RX2.

[0198] S302 , turning on the light source 51 to emit light for a time period of T20 , while the control circuit controls the first receiving circuit RX1 to expose the light receiver 521 of the proximity light sensor to generate a second light signal. The first receiving circuit receives and processes the second light signal.

[0199] S303: Determine a proximity light detection signal according to the first light signal and the second light signal.

[0200] Since the imaging part of the image sensor 33 and the light receiver 521 corresponding to the second receiving circuit RX2 and the first receiving circuit RX1 are at different positions on the image sensor in the camera module, the imaging part of the image sensor 33 and the light receiver 521 respond differently to the light signal. Therefore, when eliminating the influence of background noise or background light, it is necessary to normalize the signal measured in step S302 and the signal measured in step S301, or perform coefficient conversion.

[0201] S304: Determine whether the target object is moving away or approaching based on the final proximity light detection signal, and output an approaching or moving away state indication.

[0202] The image signal of the camera module imaging exposure is collected through the second receiving circuit.

[0203] The control method provided in this solution includes the second receiving circuit RX2 driving the camera module's imaging control portion (in Figure 24, the driving period is indicated by imaging exposure, ambient light detection exposure, or imaging exposure), and the first receiving circuit RX1 driving the proximity light sensor's control portion (in Figure 24, the signal is collected and received). Before the first receiving circuit RX1 drives the proximity light sensor's light receiver to collect the received signal, the second receiving circuit RX2 drives the image sensor for imaging exposure or ambient light detection exposure. This exposure task is equivalent to the background light collection task performed by the first receiving circuit RX1 driving the proximity light sensor in the first and second embodiments.

[0204] Figure 25 illustrates the circuit layout architecture on a substrate of an optical assembly and a partial circuit architecture on a system-on-chip, according to one embodiment of the present application. Referring to Figure 25 , in one embodiment, a light source 51 and an image sensor 33 are both disposed on the substrate 31, with a light receiver 522 integrated within the image sensor 33. The image sensor 33 includes a timing circuit and an analog-to-digital converter, which are electrically connected. The substrate 31 includes a controlled current source electrically connected between the light source 51 and a current output channel (STROBE channel) of the image sensor 33. The current output channel is electrically connected to the timing circuit and is configured to output a strobe signal, which is a power control signal determined based on the exposure time of the image sensor. In the circuit architecture provided by the embodiment shown in Figure 25 , the controlled current source for driving the light source 51 to emit light is disposed on the substrate 31, and the light source control signal for aligning the exposure time of the image sensor 33 is emitted from the current output channel (STROBE channel) of the image sensor's camera.

[0205] FIG26 illustrates the circuit layout architecture on the substrate of an optical assembly, as well as a partial circuit architecture of a system-on-chip (SoC) and a power management module, provided in one embodiment of the present application. Referring to FIG26 , in one embodiment, a light source 51 and an image sensor 33 are both disposed on the substrate 31, and a light receiver 522 is integrated within the image sensor 33. The image sensor includes a timing circuit and an analog-to-digital converter, which are electrically connected to the timing circuit and the analog-to-digital converter. The substrate includes a power signal output port K2 and a power signal input port K1, which are configured to electrically connect to a controlled current source located outside the substrate. The light source 51 is electrically connected to the power signal input port K1, which is electrically connected to the current output channel (STROBE channel) of the image sensor 33. The current output channel K2 is electrically connected to the timing circuit and configured to output a strobe signal, which is a power control signal determined based on the exposure time of the image sensor 33.

[0206] This solution provides a circuit design for at least part of an image sensor. This solution uses a timing circuit to regulate the signal of a controlled current source, outputs a stroboscopic signal through a current output channel, and combines the exposure time of the image sensor with the switching of the power supply to implement a specific control solution for optical components.

[0207] Referring to Figure 26 , in one embodiment, a controlled current source is disposed within a power management module (PMU). This solution can utilize the controlled current source within the PMU to drive light source 51. This design saves space on substrate 31 and facilitates the miniaturization of the camera module. This solution also outputs a strobe signal through a current output channel and combines the image sensor's exposure time with the power supply's on / off function, achieving a specific control scheme for optical components.

[0208] In addition to the embodiments shown in FIG. 25 and FIG. 26 , the controlled current source may also be located at other locations within the electronic device.

[0209] Referring to Figures 25 and 26 , the image signal processor is integrated into the image sensor and electrically connected to an analog-to-digital converter (ADC). The ADC receives and processes the signal captured by the optical receiver 522 and transmits it to the image signal processor for further processing. The image signal processor on substrate 31 is electrically connected to the digital signal processing module on the system-on-chip (SoC). The SoC includes a proximity light signal processing module and a visible light signal processing module, both of which are electrically connected to the digital signal processing module.

[0210] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0211] The above description is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. In the absence of conflict, the possible embodiments of the present application and the features of the possible embodiments can be combined with each other. Therefore, the scope of protection of the present application shall be based on the scope of protection of the claims.

Claims

1. An optical component, characterized in that: It includes a camera module, a light source, a light receiver and a light guide. The camera module comprises a substrate, a structural member, an image sensor and a lens, wherein the image sensor is arranged on the substrate, the structural member is cylindrical and one end of the structural member is connected to the substrate, the structural member and the substrate are jointly arranged to form an enclosed space, the image sensor and the lens are located in the enclosed space, and the end of the structural member away from the substrate is a light inlet of the camera module; The light source is disposed on the substrate and is used to send an optical signal; The light guide is used to transmit the optical signal to the periphery of the light entrance, and the refractive index of the light guide material constituting the light guide is greater than or equal to 1.4; the optical receiver is located in the enclosed space, the light source and the optical receiver are separated by the structural member, and the optical receiver is used to receive the optical signal entering the enclosed space through the light entrance.

2. The optical component according to claim 1, characterized in that The light guide component includes an inner body and an enclosing layer, the inner body includes a light incident surface, a light emitting surface and an outer peripheral surface, the outer peripheral surface is connected between the light incident surface and the light emitting surface, the enclosing layer is sleeved on the outer peripheral surface of the inner body, the inner body is all made of the light guiding material, and the enclosing layer is used to realize the transmission of light from the light incident surface to the light emitting surface in the inner body.

3. The optical component according to claim 2, characterized in that The surrounding layer is a total reflection film, which is used to achieve total reflection of light in the inner body.

4. The optical component according to claim 3, characterized in that The material of the total reflection film is a metal film or a dielectric total reflection film.

5. The optical component according to any one of claims 1 to 4, characterized in that: The outer surface of the light guide element includes at least one total reflection curved surface.

6. The optical component according to claim 5, characterized in that The light guide includes a first curved segment and a second curved segment, the first curved segment is located between the second curved segment and the light incident surface, the number of the total reflection curved surfaces is two, namely the first curved surface and the second curved surface, the first curved surface is the surface of the first curved segment, the second curved surface is the surface of the second curved segment, and the bending radius of the first curved segment is smaller than the bending radius of the second curved segment.

7. The optical component according to claim 2, characterized in that The light guide is an optical fiber.

8. The optical component according to any one of claims 1 to 7, characterized in that: The structural member has a light source accommodating area, the light source is located in the light source accommodating area, an isolation portion is formed between the light source accommodating area and the surrounding space, and the isolation portion is used to separate the light receiver from the light source.

9. The optical component according to claim 8, characterized in that The structural member comprises a top end and a bottom end which are arranged opposite to each other and a main body area connected between the top end and the bottom end. The light entrance is located at the top end, and the light source accommodating area is located at the bottom end.

10. The optical component according to claim 9, characterized in that The light source accommodating area has an open end and a light exit hole. The light source is arranged on a substrate. The open end is used to be combined with the substrate, and the light exit hole is used to transmit the light signal.

11. The optical component according to claim 10, characterized in that One end of the light guide member where the light incident surface is located is located in the light exit hole or extends into the light source accommodating area through the light exit hole.

12. The optical component according to any one of claims 1 to 11, characterized in that: The light guide member includes a light emitting portion, the light emitting portion is located at the periphery of the light incident port, and the light emitting portion is arranged around at least a portion of the structural member.

13. The optical component according to any one of claims 1 to 12, characterized in that: The light receiver is integrated on the image sensor.

14. The optical component according to claim 13, characterized in that The image sensor has a first area, a second area and a third area, the second area is located inside the first area, the third area is located within the first area and outside the second area, and the light receiver is located in the third area; The first area is an area formed by the light entering the camera module through the light entrance and projected onto the image sensor, and the second area is an imaging area of ​​the camera module.

15. The optical component according to claim 14, characterized in that The camera module also includes a filter, which is located between the image sensor and the lens. The filter includes area one and area two. The area one is arranged corresponding to the second area. The area one is used to transmit visible light and cut off infrared light. The area two is located outside the area one. The area two is arranged corresponding to the third area. The area two is used to transmit infrared light or partially transmit infrared light.

16. The optical component according to claim 15, characterized in that The filter includes an isolation region connected between the first region and the second region, and the isolation region is used to prevent infrared light from entering the second region.

17. The optical component according to any one of claims 1 to 12, characterized in that: The light receiver is connected to an inner wall of the structural member.

18. The optical component according to claim 17, characterized in that The camera module also includes a filter, which is located between the image sensor and the lens, and is used to transmit visible light and cut off infrared light. The light receiver is located in the space between the filter and the lens, and is used to reflect the light signal emitted by the light source entering the enclosed space to the light receiver.

19. The optical component according to any one of claims 1 to 12, characterized in that: The camera module also includes a filter, which is located between the image sensor and the lens. The light receiver is arranged on the filter and is located on a side of the filter facing the lens.

20. The optical component according to claim 19, characterized in that The filter and the image sensor are stacked on the substrate, and the light receiver is electrically connected to the substrate.

21. The optical component according to any one of claims 1 to 20, characterized in that: The optical receiver further comprises a signal processor, which is disposed on the substrate and is used for receiving and processing the signal of the optical receiver.

22. The optical component according to claim 21, characterized in that The signal processor is located in the surrounding space and integrated on the image sensor; or, The signal processor is located at the periphery of the structural component and is arranged on the substrate. The signal processor and the light source are located on the same side of the structural component.

23. The optical component according to any one of claims 1 to 22, characterized in that: The light source, the light receiver, and the light guide constitute a proximity light sensor.

24. The optical component according to any one of claims 1 to 23, characterized in that: The light guide member and the structural member are an integrally formed structure.

25. The optical component according to any one of claims 1 to 24, characterized in that: The image sensor is provided with a timing circuit and an analog-to-digital converter, the timing circuit and the analog-to-digital converter are electrically connected, the substrate is provided with a controlled current source, the controlled current source is electrically connected between the light source and the current output channel of the image sensor, the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor.

26. The optical component according to any one of claims 1 to 24, characterized in that: The image sensor is provided with a timing circuit and an analog-to-digital converter, the timing circuit and the analog-to-digital converter are electrically connected, the substrate includes a power signal output port and a power signal input port, the power signal output port and the power signal input port are used to be electrically connected to a controlled current source located outside the substrate, the light source is electrically connected to the power signal input port, the power signal output port is electrically connected to a current output channel of the image sensor, the current output channel is electrically connected to the timing circuit and is used to output a stroboscopic signal, and the stroboscopic signal is a power control signal determined according to the exposure time of the image sensor.

27. An electronic device, characterized in that: It comprises an optical component and a display screen as described in any one of claims 1 to 26, wherein the display screen has an optical window, the light inlet is located in the optical window, and the area between the light inlet and the inner wall of the optical window constitutes a light exit area of ​​the light signal emitted by the light source.

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