Microstrip composite antenna for receiving and / or transmitting keying modulation signal

Abstract

The present application provides a microstrip composite antenna and an integrated circuit board for receiving and / or sending a keying modulation signal. The antenna comprises a strip radiation antenna and a microstrip radiation line connected to each other, the microstrip radiation line comprises a first radiation line and a second radiation line, a first end of the first radiation line is connected to a signal input and / or output point of the keying modulation signal, and the second radiation line connected to a second end is further connected to a grounding plane of a PCB; first and second support sections of the strip radiation antenna are respectively bent towards a same side of a middle section, a first pin of the first support section is connected to the second radiation line, and a second pin of the second support section is connected to the grounding plane of the PCB by means of a capacitor; the strip radiation antenna is located above the microstrip radiation line, and at least one of the first and second radiation lines is parallel to the middle section. The microstrip composite antenna can meet both miniaturization and high gain requirements, has a relatively high structure and signal stability, and can be used in a receiver and / or a transmitter using a keying modulation signal.

Description

Microstrip composite antenna for receiving and / or transmitting keying modulated signals Technical Field

[0001] The present application relates to the field of radio technology, and in particular to a microstrip composite antenna for receiving and / or transmitting keying modulation signals. Background Art

[0002] A radio frequency (RF) antenna is used to transmit or receive radio frequency signals. RF antennas are categorized as either internal or external, depending on their installation location. Internal antennas can be soldered to a printed circuit board (PCB) and installed inside the device, making them suitable for a wide range of applications.

[0003] In the prior art, to achieve standing waves on the transmission line for optimal gain for a built-in RF antenna, the antenna length typically needs to be λ / 4 (where λ is the wavelength of the electromagnetic wave) or an integer multiple thereof. For example, for a bracket antenna with a resonant frequency of 434MHz, the antenna length required to meet the λ / 4 requirement is approximately 18cm. This size necessitates a larger PCB board and the electronic device on which the antenna is soldered, resulting in higher equipment costs.

[0004] In order to reduce the size of the antenna, the related art has proposed a helical antenna structure. Compared with the aforementioned bracket antenna, although the helical antenna has reduced the size of the antenna, the gain is significantly reduced (for example, the gain of a small-sized helical antenna with a resonant frequency of 434MHz is about -4 to -5dBi). Moreover, the vibration of the equipment will cause the spring-shaped antenna to deform, thereby changing the resonant frequency of the antenna, resulting in lower working stability. In addition, the related art has also proposed a radio frequency antenna using FPC (Flexible Printed Circuit) technology. This type of antenna usually needs to be glued and fixed inside the device, and the feeder end uses welding or IPEX snap-on type. However, the firmness of this fixing method is not good. The 3M glue used for pasting will age and fall off after long-term use. In addition, the feeder is thin, so the port has weak vibration resistance and there is a risk of falling off and breaking.

[0005] It can be seen that the RF antennas in related technologies are difficult to meet the requirements of miniaturization and high gain at the same time. Therefore, it is urgent to develop an RF antenna that can meet the requirements of miniaturization and high gain, so as to achieve working stability while improving and reducing the cost of the RF antenna and the equipment in which it is located, thereby meeting the needs of the industry.

[0006] Summary of the Invention

[0007] The present application provides a microstrip composite antenna for receiving and / or transmitting keying modulated signals, and an integrated circuit board incorporating the microstrip composite antenna, to at least solve the technical problems in the related art. The technical solution of the present application is as follows:

[0008] According to a first aspect of an embodiment of the present application, a microstrip composite antenna for receiving and / or transmitting a keying modulated signal is provided, wherein the microstrip composite antenna comprises a strip radiating antenna and a microstrip radiating line connected to each other, wherein:

[0009] The microstrip radiating line includes a first radiating line and a second radiating line printed on a PCB board, wherein a first end of the first radiating line is connected to a signal input and / or output point of a keying modulation signal, a second end of the first radiating line is connected to the second radiating line, and the second radiating line is further connected to a ground plane of the PCB board;

[0010] The strip radiating antenna includes a middle section and a first supporting section and a second supporting section respectively located at two ends of the middle section, wherein the first supporting section and the second supporting section are respectively bent toward the same side of the middle section, a first pin formed at an end of the first supporting section is connected to the second radiating line, and a second pin formed at an end of the second supporting section is connected to the ground plane of the PCB board through a capacitor;

[0011] The strip radiating antenna is located above the microstrip radiating line, and at least one of the first radiating line and the second radiating line is parallel to the middle section.

[0012] According to a second aspect of an embodiment of the present application, an integrated circuit board is provided, comprising: a control module, a signal processing module, an interface module, and the microstrip composite antenna according to the first aspect, wherein:

[0013] The first end of the microstrip radiating line in the microstrip composite antenna is connected to the signal processing module, and the signal processing module is used to modulate and output a key modulation signal to the microstrip composite antenna, and / or to receive and demodulate the key modulation signal received by the microstrip composite antenna.

[0014] According to a third aspect of an embodiment of the present application, a vehicle is provided. The vehicle is equipped with the microstrip composite antenna as described in the first aspect, or the integrated circuit board as described in the second aspect.

[0015] The technical solutions provided by the embodiments of this application bring at least the following beneficial effects:

[0016] The strip antenna in this solution connects to a microstrip radiating line printed on a PCB via pins at both ends, forming a composite microstrip antenna. Because the first end of the first radiating line is connected to the input and / or output point of a keying modulation signal, the composite microstrip antenna can be used to receive and / or transmit keying modulation signals (such as ASK and FSK).

[0017] On the one hand, compared to bracket antennas, the size of strip radiating antennas is not limited by the λ / 4 factor. Therefore, both the strip radiating antenna and the resulting microstrip composite antenna are significantly smaller than conventional bracket antennas. On the other hand, through the interaction between the microstrip radiator and the strip radiating antenna, the microstrip composite antenna can stably operate at the desired resonant frequency and achieve high antenna gain. For example, the measured gain near the resonant frequency of 434.4 MHz is approximately -1.9 dBi, significantly higher than that of a similarly sized helical antenna. This demonstrates that the microstrip composite antenna effectively meets the requirements of both miniaturization and high gain.

[0018] In addition, the strip radiating antenna can be made of a long strip of metal with strong rigidity, so it is not easy to deform, thereby ensuring that the microstrip composite antenna operates stably at or near the resonant frequency; and since the strip radiating antenna is firmly soldered to the PCB board through pins, it has good seismic resistance, high structural stability and signal stability.

[0019] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application.

[0021] FIG1 is a schematic structural diagram of a strip radiating antenna provided by an exemplary embodiment;

[0022] FIG2 is a schematic structural diagram of another strip radiating antenna provided by an exemplary embodiment;

[0023] FIG3 is a schematic structural diagram of another strip radiating antenna provided by an exemplary embodiment;

[0024] FIG4 is a schematic diagram of a production process of a strip radiating antenna provided by an exemplary embodiment;

[0025] FIG5 is a schematic structural diagram of a microstrip composite antenna provided by an exemplary embodiment;

[0026] FIG6 is a schematic diagram of a ground trace provided by an exemplary embodiment;

[0027] FIG7 is a schematic diagram of the distance between a strip radiating antenna and a ground plane provided by an exemplary embodiment;

[0028] FIG8 is a diagram showing measured S11 and Smith impedance of a microstrip composite antenna provided by an exemplary embodiment;

[0029] FIG9 is a diagram showing a measured RF signal radiation direction of a microstrip composite antenna provided by an exemplary embodiment;

[0030] FIG10 is a graph showing a measured gain of a microstrip composite antenna provided by an exemplary embodiment;

[0031] FIG11 is a comparison diagram of measured signal distances between a microstrip composite antenna and a helical antenna of similar size provided by an exemplary embodiment;

[0032] FIG12 is a schematic structural diagram of an integrated circuit board provided by an exemplary embodiment;

[0033] FIG. 13 is a diagram showing the measured dimensions of an integrated circuit board provided by an exemplary embodiment. DETAILED DESCRIPTION

[0034] In order to enable ordinary people in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0035] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0036] To address the technical issues in related technologies, the present invention proposes a microstrip composite antenna composed of a microstrip radiator and a strip radiating antenna for receiving and / or transmitting keyed modulated signals, thereby simultaneously meeting the requirements of miniaturization and high gain. The microstrip composite antenna described in this application is described in detail below with reference to the accompanying drawings.

[0037] The microstrip composite antenna described in the present application includes a microstrip radiating line and a strip radiating antenna connected to each other, wherein the microstrip radiating line includes a first radiating line and a second radiating line printed on a PCB board, a first end of the first radiating line is connected to a signal input and / or output point of a keying modulation signal, a second end of the first radiating line is connected to the second radiating line, and the second radiating line is further connected to a ground plane of the PCB board;

[0038] The strip radiating antenna includes a middle section and a first supporting section and a second supporting section respectively located at two ends of the middle section, wherein the first supporting section and the second supporting section are respectively bent toward the same side of the middle section, a first pin formed at an end of the first supporting section is connected to the second radiating line, and a second pin formed at an end of the second supporting section is connected to the ground plane of the PCB board through a capacitor;

[0039] The strip radiating antenna is located above the microstrip radiating line, and at least one of the first radiating line and the second radiating line is parallel to the middle section.

[0040] The strip radiating antenna used to form a microstrip composite antenna adopts a new antenna structure proposed in this application, which includes a middle section and a first supporting section and a second supporting section located at both ends of the middle section, and the first supporting section and the second supporting section are respectively bent toward the same side of the middle section. The middle section is in the shape of a long strip. In addition, a first pin is formed at the end of the first supporting section, and a second pin is formed at the end of the second supporting section, wherein the end of any supporting section is the end of the supporting section away from the middle section. The strip radiating antenna can be soldered to a PCB board through the first pin and the second pin. The number of the first pin and the second pin is at least one. The structure of the strip radiating antenna is described below.

[0041] Figures 1 to 3 are schematic structural diagrams of three exemplary strip radiating antennas provided by exemplary embodiments of the present application. As shown in any of Figures 1 to 3, the strip radiating antenna 100 includes a first support section 101, a second support section 102, and a middle section 103, wherein the first support section 101 and the second support section 102 are respectively located at the two ends of the middle section 103, and both are bent toward the same side of the middle section 103. When the strip radiating antenna 100 is placed in the direction shown in Figures 1 to 3, the first support section 101 and the second support section 102 are both bent toward the lower surface of the middle section 103, thereby forming a strip radiating antenna 100 similar to a long bench shape: at this time, the first support section 101 and the second support section 102 can be used to support the middle section 103, and a hollow structure is formed in the middle of the first support section 101, the second support section 102, and the middle section 103. Therefore, after the strip radiating antenna 100 is soldered to the PCB board, there is a certain space between the middle section 103 and the surface of the PCB board (that is, the middle section 103 does not contact the surface of the PCB board). In addition, the first supporting segment 101 and the second supporting segment 102 can be bent by 90° or close to 90° respectively, so as to form a strip radiating antenna 100 with a regular shape.

[0042] As can be seen from the strip radiating antennas 100 shown in Figures 1 to 3, the main difference between the three lies in the number of pins. In the strip radiating antenna 100 shown in Figure 1, the first support segment 101 has two first pins formed at the end, namely pin 1011 and pin 1012, with a first notch 1013 formed between the two pins. Symmetrically, the second support segment 102 has two second pins formed at the end, namely pin 1021 and pin 1022, with a second notch 1023 formed between the two pins. At this point, when viewed from the front, the strip radiating antenna 100 has an axisymmetric shape: the first support segment 101 and the second support segment 102 are symmetrical with each other about the line connecting the center points of the two long sides of the middle segment 103 (see the dotted line X0 in Figure 4).

[0043] In the strip radiating antenna 100 shown in Figure 2 , the first support segment 101 ends at a first pin, pin 1011; the second support segment 102 ends at two second pins, pin 1021 and pin 1022, with a second notch 1023 formed between the two pins. In the strip radiating antenna 100 shown in Figure 3 , the first support segment 101 ends at a first pin, pin 1011; the second support segment 102 ends at a second pin, pin 1021. Similar to Figure 1 , the first support segment 101 and the second support segment 102 of the strip radiating antenna 100 shown in Figure 3 are also symmetrical about the line connecting the center points of the two long sides of the middle segment 103.

[0044] It can be understood that Figures 1 to 3 are merely exemplary. In fact, one or more pins can be formed at the end of any supporting section of the strip radiating antenna 100. When multiple pins are formed, corresponding gaps can be formed between any two adjacent pins. This specification does not limit the number of pins and gaps.

[0045] The microstrip composite antenna described in this application is a radio frequency antenna that can be used to transmit or receive radio frequency signals within a specific frequency band (or frequency range). As a key component of a microstrip composite antenna, the size of the strip radiating antenna will affect the overall frequency band of the microstrip composite antenna, so its size must be appropriately designed.

[0046] As shown in Figures 1-3, the dimensions of the strip radiating antenna 100 primarily include length L, height H, and width W. In one embodiment, if the frequency band of the microstrip composite antenna is 310-490 MHz, the dimensions of the strip radiating antenna can range from 22-50 mm in length, 5-10 mm in height, and 3-8 mm in width. Of course, the specific dimensions of the strip radiating antenna 100 can be appropriately set based on the desired antenna parameters, production process accuracy, and other practical requirements. This application does not impose any restrictions on the specific values ​​of these dimensions.

[0047] Among them, in order to reduce the signal attenuation of the RF antenna so that it has a higher gain, it is usually necessary to ensure that the microstrip composite antenna operates in a resonant state. The RF signal frequency at this time is the resonant frequency of the RF antenna, also known as the resonance point. Taking the common resonant frequency of 434MHz as an example, the dimensions of the strip radiating antenna 100 can be set to length L = 26mm, height H = 7mm, and width W = 6mm. At this time, the microstrip composite antenna can operate within the frequency band of 431 to 437MHz (i.e., 434±3MHz), that is, the resonant frequency of the antenna is within this frequency band and as close to 434MHz as possible. At this time, the signal attenuation of the microstrip composite antenna is small, which can ensure that the antenna has a higher gain when the resonant frequency is within the frequency band of 431 to 437MHz (e.g., 434MHz).

[0048] In one embodiment, the thickness of the strip radiating antenna also needs to be reasonably set. In fact, since the current flowing through the strip radiating antenna has a skin effect, the thickness of the antenna has little effect on its working performance. Therefore, a thinner metal sheet can be appropriately selected to make the strip radiating antenna to minimize the weight of the antenna and reduce the metal material to reduce costs. However, considering that an overly thin strip radiating antenna may be deformed due to vibration during operation, or may be deformed due to touch during production or transportation, the above deformation will cause signal instability, and a thicker antenna can have higher rigidity and stronger structural stability, so the antenna should have a suitable thickness. Exemplarily, the thickness of the strip radiating antenna can range from 0.2 to 1.0 mm, preferably, it can be 0.4 mm, 0.5 mm, 0.6 mm, etc.

[0049] The pins formed at the end of the support section of the strip radiating antenna shown in Figures 1 to 3 are all surface mount (SMT, Surface Mounted Technology, or SMD). In fact, any of the above pins can also be a plug-in pin. In other words, any or all of the first and second pins can be surface mount or plug-in, that is, each first pin can be surface mount or plug-in. In the case of multiple first pins, some of the first pins can be surface mount and the rest can be plug-in (pin 1011 as shown in Figure 1 is surface mount and pin 1012 can be plug-in); similarly, each second pin can be surface mount or plug-in. In the case of multiple second pins, some of the second pins can be surface mount and the rest can be plug-in (pin 1022 as shown in Figure 1 can be surface mount and pin 1022 can be plug-in), etc. Of course, the specific form of the pins of the strip radiating antenna should be reasonably arranged according to the board space of the PCB board, and the embodiments of the present application are not limited to this.

[0050] In one embodiment, the strip radiating antenna can be formed from a long strip of metal sheet through a stamping and / or bending process to form the intermediate section, the first support section, and the second support section. Figure 4 is a schematic diagram of the production process of a strip radiating antenna provided by an exemplary embodiment. As shown in Figure 4, the length L0 of the long strip of metal sheet 401 is L + 2H + 2L1, and the width is W. Among them, the distance from the left edge of the metal sheet to the dotted line X1 and the distance from the right edge of the metal sheet to the dotted line X4 are both L1, which will become the pin length of the mounted pin of the strip radiating antenna 100 (L1 as shown in Figure 1); the distance between the dotted lines X1 and X2 and the dotted lines X3 and X4 are both H, which will become the height of the strip radiating antenna 100 (H as shown in Figures 1 to 3); the distance between the dotted lines X2 and X3 is L, which will become the length of the middle section 103 of the strip radiating antenna 100 (L as shown in Figures 1 to 3), and W will become the width of the strip radiating antenna 100 (W as shown in Figures 1 to 3), wherein the widths of the first support section 101, the second support section 102 and the middle section 103 are equal, all of which are said W.

[0051] For example, the metal sheet 401 can be first bent along dotted lines X1 and X4 from both ends of the metal sheet 401 toward the center of the metal sheet (i.e., toward X0) (e.g., by 90°), and then further bent along dotted lines X2 and X3 in that direction, thereby obtaining the strip radiating antenna 100 shown in FIG3 . For another example, the metal sheet 401 can be stamped at both ends (either separately or simultaneously) or cut to obtain the metal sheet 402, with notches formed at the original locations of the two portions that were stamped or cut away (these portions are rectangles located at both ends of the metal sheet 401, with a length of L1+H1 and a width of W1). Thereafter, the metal sheet 402 can be first bent along dotted lines X1 and X4 from both ends toward the center of the metal sheet (i.e., toward X0) (e.g., by 90°), and then further bent along dotted lines X2 and X3 in that direction, thereby obtaining the strip radiating antenna 100 shown in FIG1 . For another example, only the right end of metal sheet 401 can be stamped or cut to obtain metal sheet 403, with a notch formed at the original location of the stamped or cut portion. Subsequently, metal sheet 402 can be bent (e.g., 90°) along dotted lines X1 and X4 from both ends toward the center of the metal sheet (i.e., toward X0), and then further bent along dotted lines X2 and X3 in that direction, thereby obtaining the strip radiating antenna 100 shown in FIG2. It will be understood that in the above-mentioned bending process, the first bend is used to form the first and second pins, and the second bend is used to form the first support segment 101 and the second support segment 102. Through the above-mentioned processes, the strip radiating antennas shown in FIG1 to FIG3 can be obtained from the elongated metal sheet 401 shown in FIG4.

[0052] In addition, the material of the strip radiating antenna described in this specification is metal. For example, in order to achieve better radio frequency signal transmission and reception effects, a metal conductor with excellent conductive properties such as copper or copper alloy can be selected to process the aforementioned long strip metal sheet 401, and the strip radiating antenna can be formed based on the metal sheet. Alternatively, the inner core of the strip radiating antenna can be made of a non-conductive material (such as ceramics, plastics, etc.), and then a metal conductor of uniform thickness is formed on the surface of the inner core through electroplating or spraying processes to obtain a finished strip radiating antenna. When the strip radiating antenna is working, the metal material is used for conduction, and the core therein can play a supporting role. This method can use less metal to make a lighter strip radiating antenna, thereby further saving metal and helping to reduce the weight of the antenna.

[0053] Furthermore, the antenna surface can be coated with an anti-rust material through spraying, baking, or other methods to prevent rust, allowing the antenna to be used in harsh environments such as high humidity and high salinity. Of course, the anti-rust material should be selected from materials that do not absorb RF signals to minimize signal attenuation and increase antenna gain.

[0054] It should be noted that the shapes of the strip radiating antennas shown in Figures 1 to 3 are only exemplary. In practical implementation, the shape, number of pins, pin type and other specific conditions of the strip radiating antenna can be reasonably set or appropriately modified according to actual conditions. The embodiments of the present application do not limit this.

[0055] In an embodiment of the present application, the microstrip radiating line is printed on a PCB board. For example, the microstrip radiating line can be formed by printing conductive copper foil on the PCB board. Solder pads are printed at appropriate locations on the PCB board for soldering corresponding pins of the strip radiating antenna (the soldering pads and pins are soldered to form a secure solder joint), thereby forming an electrical connection between the microstrip radiating line and the strip radiating antenna to form a microstrip composite antenna.

[0056] The PCB substrate described in this application can be any type of substrate, including paper, fiberglass cloth, composite (CEM series), multilayer, and specialty material (ceramic, metal core, etc.). Given that the dielectric constant ε of different substrate materials generally varies, to prevent excessive absorption of the RF signal received and transmitted by the microstrip composite antenna, resulting in signal attenuation, it is recommended that the PCB substrate be constructed from a material with a dielectric constant ε no greater than 5.5.

[0057] Taking the strip radiating antenna 100 shown in Figure 1 as an example, if the antenna is soldered to the PCB board 513, the antenna can be connected to the microstrip radiating line 500 printed on the PCB board 513 to form a microstrip composite antenna. At this time, the relative position relationship between the two can be seen in Figures 5 to 6. The structure of the microstrip composite antenna is explained below using this as an example.

[0058] As previously described, the first support segment 101 of the strip radiating antenna 100 has a first pin at its end, and a second pin at its end. In one embodiment, the number of the first pins may be one or more, each of which may be soldered to the PCB via a first soldering pad at a corresponding location on the PCB. Similarly, the number of the second pins may be one or more, each of which may be soldered to the PCB via a second soldering pad at a corresponding location on the PCB. The second soldering pad may also be connected to the ground plane of the PCB via the capacitor.

[0059] For another example, if the strip radiating antenna 100 shown in FIG2 is soldered to a PCB board 513, the PCB board may be printed with solder pads 506 and 507 as shown in FIG5 . In this case, the first pin 1011 of the strip radiating antenna 100 shown in FIG2 may be soldered to at least one of the two solder pads. Alternatively, a larger solder pad may be printed at the location of solder pads 506 and 507 (i.e., covering the current location of solder pads 506 and 507, and the shape of the solder pad may match the bottom shape of the pin 1011 shown in FIG2 ), and the first pin 1011 may be soldered to the pad. The soldering method for the second pins (i.e., pins 1021 and 1022) of the strip radiating antenna 100 shown in FIG2 can be seen in FIG5 , and will not be described in detail.

[0060] For another example, if the strip radiating antenna 100 shown in FIG3 is soldered to a PCB board 513, a larger solder pad can be printed at the position corresponding to the solder pads 506 and 507 on the PCB board (i.e., covering the current position of the solder pads 506 and 507, and the shape of the solder pad can match the bottom shape of the first pin 1011 shown in FIG3 ), and the first pin 1011 can be soldered to the solder pad. Similarly, a larger solder pad can be printed at the position corresponding to the solder pads 504 and 505 on the PCB board 513 (i.e., covering the current position of the solder pads 504 and 505, and the shape of the solder pad can match the bottom shape of the second pin 1021 shown in FIG3 ), and the second pin 1021 can be soldered to the solder pad, and no further details will be given.

[0061] By soldering the pins to the pads, a secure connection between the strip radiating antenna and the PCB can be achieved. The number of the first pins or second pins and the number of their corresponding pads can be reasonably set based on actual conditions such as antenna performance and board space, and the embodiments of the present application are not limited thereto.

[0062] As shown in FIG5 , corresponding pads are printed on PCB board 513, corresponding to the four pins of strip radiating antenna 100: first pads (pads 506 and 507) and second pads (pads 504 and 505). Pins 1011 and 1012 are soldered to pads 506 and 507, respectively, and pins 1021 and 1022 are soldered to pads 504 and 505, respectively. Furthermore, the first pad is connected to second radiating line 502 printed on PCB board 513; the second pad is connected to the ground plane via capacitors. For example, pad 504 is connected to ground plane 510 via capacitor 508, and pad 505 is connected to ground plane 510 via capacitor 509.

[0063] As previously mentioned, any pin of the strip radiating antenna 100 can be a surface-mount type or a plug-in type. Since the first support segment 101 and the second support segment 102 are located at the two ends of the middle segment 103, in order to shorten the overall length of the strip radiating antenna 100 and to save as much board space as possible on the PCB board 513, any surface-mount pin can be bent toward another pin, that is, toward the center of the strip radiating antenna 100. For example, if the first pin is a surface-mount type, it can be bent toward the second pin; and / or, if the second pin is a surface-mount type, it can be bent toward the first pin. As shown in Figures 1 to 3, each pin is bent toward the center of the middle segment 103 (that is, each pin is bent inward), so that the overall length L of the strip radiating antenna 100 is shorter (that is, equal to the length of the middle segment 100).

[0064] Of course, if there is sufficient space on the PCB board 513, any of the above pins can also be bent in a direction away from the other pin, which can increase the distance between the first pin and the second pin to reduce the difficulty of soldering the strip radiating antenna 100.

[0065] As shown in Figures 5 and 6, the microstrip radiator 500 printed on the PCB board 513 includes two parts, namely a first radiator 501 and a second radiator 502. The first end 5011 of the first radiator 501 is connected to the signal input and / or output point 512 of the key modulation signal. It can be understood that if the microstrip composite antenna receives the key modulation signal modulated (or encoded) by the signal modulation module through the signal input and / or output point 512 (in this case, the signal input and / or output point 512 is used as the signal input end of the microstrip composite antenna), the microstrip composite antenna can act as a transmitting antenna (in the form of a radio frequency signal) to transmit the key modulation signal to the surrounding space, and this signal can be regarded as the output signal of the microstrip composite antenna. Alternatively, if the microstrip composite antenna receives a key-modulated signal (the received signal is essentially a radio frequency signal) modulated by a signal source (through other antennas) from the surrounding space, the signal can be output to a signal demodulation module through the signal input and / or output point 512 (at this time, the signal input and / or output point 512 is used as the signal output end of the microstrip composite antenna), so that the module can demodulate (or decode) the key-modulated signal. At this time, the received key-modulated signal can be regarded as the input signal of the microstrip composite antenna.

[0066] Among them, the signal input and / or output point 512 connected to the first end 5011 of the first radiating line 501 can serve only as the signal input end of the microstrip composite antenna, or only as the signal output end of the microstrip composite antenna, or as both the signal input end and the signal output end of the microstrip composite antenna. In the case of serving as both the signal input end and the signal output end of the microstrip composite antenna, the microstrip composite antenna is a transceiver antenna, which can operate in simplex (only receiving or only transmitting radio frequency signals at the same time) or duplex (simultaneously receiving and transmitting radio frequency signals) mode. The specific connection method and its operating mode can be set as needed, and the embodiments of the present application are not limited to this. In addition, the signal input and / or output point 512 can be connected to the aforementioned signal input end or signal output end through a 50 ohm coaxial cable signal line or an impedance line such as a PCB.

[0067] In one embodiment, the keying modulation signal may have different types depending on the modulation / demodulation algorithm corresponding to the signal. For example, the keying modulation signal may include at least one of the following: an FSK (Frequency Shift Keying) signal, an ASK (Amplitude Shift Keying) signal, or a PSK (Phase Shift Keying) signal. FSK, ASK, or PSK signals are significantly different from PPM (Pulse Position Modulation) signals used in related technologies.

[0068] Taking the ASK signal as an example, if the signal input and / or output point 512 is used as the signal input end of the microstrip composite antenna, the signal modulation module connected to the signal input end can use the ASK algorithm to encode the signal to be output, and output the encoded ASK signal to the first end 5011 of the first radiating line 501, so that the microstrip composite antenna can transmit the signal as a radio frequency signal to the surrounding space. In this case, the microstrip composite antenna can be integrated into an FSK transmitter. Alternatively, if the signal input and / or output point 512 is used as the signal output end of the microstrip composite antenna, then for the ASK signal received by the microstrip composite antenna, the signal demodulation module connected to the signal output end can use the ASK algorithm to decode the signal, and output the decoded signal to the back end for further processing. In this case, the microstrip composite antenna can be integrated into an ASK receiver.

[0069] In one embodiment, the PCB board 513 may include n layers of circuits, where 2≤n, i.e., the PCB board 513 is a multi-layer board. In this case, the first radiating line 501 and the second radiating line 502 may be located on the i-th and j-th layers of the n-layer circuits, respectively, where 1≤i≤n, 1≤j≤n, and i≠j. As i≠j indicates, the first radiating line 501 and the second radiating line 502 are located on different layers, so they can be connected across layers, i.e., the first radiating line 501 can be connected to the second radiating line 502 across layers. The embodiments of this specification do not restrict the relative sizes of i and j. In other words, the relative positions of the first radiating line 501 and the second radiating line 502 are not restricted. The first radiating line 501 can be located on top (closer to the strip antenna 100), or the second radiating line 502 can be located on top. This will not be further elaborated. In fact, precisely because the first radiating line 501 and the second radiating line 502 are located on different layers, a three-dimensional transmission line is required to achieve a cross-layer connection between them to effectively transmit RF signals. At this time, the microstrip radiating line 500 can form a coplanar waveguide with the strip radiating antenna 100 to achieve a better signal coupling effect.

[0070] In addition, depending on the specific values ​​of i and j, the cross-layer connection can be achieved by various methods such as vias, buried vias, blind vias and / or cross-wires, and the embodiments of the present application are not limited to this.

[0071] In another embodiment, the first radiating line 501 and the second radiating line 502 may also be located on the same layer, such as the first layer of a multi-layer board, or the same layer of a single-layer board (in which case there is only this layer). In this scenario, the first radiating line 501 and the second radiating line 502 can remain parallel, such as both being long strips and having their axes symmetrically distributed about the projection axis of the middle section 103 on the PCB board, that is, the first radiating line 501 and the second radiating line 502 are respectively located on either side of the projection axis. In this case, the microstrip radiating line 500 can also approximately form a coplanar waveguide with the strip radiating antenna 100, thereby achieving a certain degree of signal coupling.

[0072] In one embodiment, the first radiating line 501 may be located on the first layer below the middle section 103, and the second pin may be soldered to the PCB board 513 via a second solder pad located on the first layer. Furthermore, the signal input and / or output point 512 and the first end 5011 of the first radiating line 501 are respectively located on either side of the second support section 102 of the strip radiating antenna 100, and the first end 5011 located on one side of the second support section 102 is connected to the signal input and / or output point 512 located on the other side via an extension wire 511. Of course, the aforementioned "first layer below" does not distinguish between the front and back sides of the PCB board, but only indicates that the strip radiating antenna 100 is soldered to a certain surface of the PCB board, and the "first layer below" is the first layer counted downward from the surface. For example, the "first layer below" may be the top layer or the bottom layer of the PCB board. Since the first pin of the strip radiating antenna 100 is directly soldered to the surface of the PCB board 513, in order to connect the signal input and / or output points 512 and the first end 5011 located on both sides of the second support section 102, the extension wire 511 can be arranged in a variety of ways.

[0073] For example, the extension wire 511 can bypass the second pad within the first layer and connect to the first end 5011. If the strip radiating antenna 100 shown in FIG5 is replaced with the strip radiating antenna 100 shown in FIG3 (which has only one first pin 1021), the extension wire 511 can bypass the pad corresponding to the first pin 1021 within the first layer and connect to the first end 5044. Alternatively, as shown in FIG5 , if the ground plane 510 of the first layer does not surround the signal input and / or output point 512, the extension wire 511 can bypass pad 504 (i.e., bypass from the outside of pad 504) or 505 (i.e., bypass from the outside of pad 505) within the first layer and connect to the first end 5011.

[0074] For another example, given that the layout method of bypassing the solder pad in the first layer has relatively strict requirements on the device arrangement method of the first layer, in order to avoid bypassing the solder pad, a notch 1023 (that is, the aforementioned second notch 1023) can also be set at the end of the second support segment 102. At this time, the extension wire 511 can pass through under the notch 1023. The specific passing method can be seen in Figure 5.

[0075] At the same time, a first notch 1013 is formed at the end of the first supporting section of the strip radiating antenna 100 shown in Figure 5. These two notches can ensure that the radio frequency signal emitted by the strip radiating antenna 100 is distributed as symmetrically and evenly as possible in the surrounding space, which helps to improve the coverage range of the antenna signal.

[0076] Furthermore, when the extension wire 511 passes through the bottom of the notch 1023, the end of the second support section 102 can form two second pins symmetrical to each other with the notch 1023 as the center, such as pins 1021 and 1022. The two second pins can be connected to the ground plane 510 of the PCB board 513 through at least one capacitor. For example, pin 1021 is connected to the ground plane 510 through a capacitor 508; for another example, pin 1022 can also be connected to the ground plane 510 in series or in parallel through two capacitors 509 and 509' (not shown in Figure 5). Alternatively, one of the two second pins can be connected to the ground plane (510) of the PCB board (513) through at least one capacitor, while the other second pin is left hanging. In this way, the strip radiating antenna (including the two second pins) only needs to be produced according to a fixed size and method, without frequently changing the production process of the strip radiating antenna, which helps to improve the production efficiency of the strip radiating antenna and its structural compatibility with the PCB board.

[0077] It is understandable that the more capacitors are connected between the first support section 501 and the ground plane 510, the higher the adjustment accuracy when adjusting the resonant frequency of the microstrip composite antenna through the capacitor, and the easier it is to achieve precise adjustment of the resonant frequency. Of course, the number of capacitors cannot be increased indefinitely, and it is necessary to consider a variety of factors such as the size of the capacitor, the size of the board space, and the welding accuracy. In addition, since the capacitance value of the chip capacitor is usually a fixed value, it may be difficult to ensure that the microstrip composite antenna operates at or near the resonant frequency through capacitor selection in some scenarios. To this end, an adjustable capacitor can be connected between the second pad and the ground plane 510 so that the resonant frequency of the antenna can be more accurately adjusted by adjusting the capacitance value of the adjustable capacitor.

[0078] To achieve better signal transmission and reception, the width of the notch 1023 should be no less than 1.2 times the width of the extension wire 511. As shown in FIG5 , the width W1 of the gap between pins 1021 and 1022 (i.e., the second notch 1023) should be greater than or equal to 1.2 times the width of the extension wire 511. Furthermore, considering that the widths of the extension wire 511 can be the same or different at different locations, the width W1 of the notch 1023 should be at least greater than or equal to 1.2 times the width of the portion of the extension wire 511 located between pins 1021 and 1022.

[0079] In the embodiment of this specification, the second end 5012 of the first radiating line 501 is connected to the second radiating line 502, which is also connected to the ground plane of the PCB board 513. As an example, assuming that the PCB board 513 is a multilayer board, with the first radiating line 501 and the second radiating line 502 located on layer i and layer j, respectively, as shown in FIG5 , the second end 5012 located on layer i (e.g., layer 1) is connected to the second radiating line 502 located on layer j (e.g., layer 2) via a via (see FIG6 for layer j). The second end 5012 then returns to layer 1 through a via 503 covered by the second radiating line 502, extending laterally within layer 1 to connect to pins 506 and 507. In this case, a direct cross-layer connection is achieved between the circuits on layer i and layer j via the vias (i.e., the via at the second end 5012 and the via 503). In addition, the second radiating line 502 can be connected to the ground plane 602 of the j-th layer through the bridge connection line 601 ; of course, the bridge connection line 601 may not be provided, and the second radiating line 502 may be directly extended to connect to the ground plane 602 .

[0080] It should also be noted that ground plane 510 (located on layer i) shown in FIG5 and ground plane 602 (located on layer j) shown in FIG6 are both zero-potential planes for PCB 513. In practice, the ground planes on each layer can be interconnected to achieve a uniform zero potential across the entire PCB 513, thus avoiding the "virtual ground" phenomenon. Therefore, ground plane 510 and ground plane 503 can be considered the same ground plane, namely, the PCB's ground plane GND.

[0081] The strip radiating antenna 100 described in the embodiments of this specification is located above the microstrip radiating line 500, and at least one of the first radiating line 501 and the second radiating line 502 is parallel to the middle section 103 of the strip radiating antenna 100. As shown in Figure 5, the central axes of the first radiating line 501 and the second radiating line 502 are both parallel to the central axis of the middle section 103 (i.e., the central axes of the three are coplanar), while the second radiating line 502 is located below the first radiating line 501 and is further longitudinally from the strip radiating antenna 100.

[0082] In one embodiment, the length of the first radial line 501 is no less than ½ the length of the intermediate segment 103. In other words, the orthographic projection of the second end 5012 of the first radial line 501 on the intermediate segment 103 is located on the side of the intermediate segment 103 closest to the first support segment 101. As shown in FIG5 , the dashed line X0 represents the center of the intermediate segment 103 (in the length L direction), while the second end 5012 is located between the dashed line X0 and the first support segment 101 (i.e., to the right of the dashed line X0).

[0083] In one embodiment, the ratio of the width W2 of the second radiating line 502 to the width W of the strip radiating antenna 100 should be in the range of 0.8 to 1.2, that is, the difference between W2 and W should not exceed 20% of W. Preferably, W2 should be equal to W, in which case the signal coupling between the second radiating line 502 and the strip radiating antenna 100 is better.

[0084] In one embodiment, to prevent the ground plane from interfering with the RF signals received and transmitted by the strip radiating antenna (e.g., absorbing the signal), the strip radiating antenna should be placed as far away from the ground plane as possible. For example, if the long side of the orthographic projection of the strip radiating antenna 100 on the PCB board 513 is parallel to at least one edge of the ground plane, the distance between the long side and the edge should be no less than 6 mm. As shown in FIG7 , the long side 701 of the orthographic projection of the strip radiating antenna 100 on the PCB board 513 is parallel to the edge 702 of the ground plane 510. In this case, the distance S between the long side 701 and the edge 702 should be no less than 6 mm to minimize any interference that the ground plane 510 may cause on the operation of the strip radiating antenna 100.

[0085] In one embodiment, a signal processing module may be integrated into the PCB board 513 where the microstrip composite antenna is located, and the module may be connected to the signal input and / or output point 512. The module may be used to demodulate the key-modulated signal received by the microstrip composite antenna; and / or output the modulated key-modulated signal to the microstrip composite antenna so that the signal is transmitted to the surrounding space via the antenna. When modulating or demodulating the key-modulated signal, the signal processing module may use a corresponding keying algorithm, such as modulating an ASK signal or demodulating an ASK signal using an ASK algorithm, modulating an FSK signal or demodulating an FSK signal using an FSK algorithm, or modulating a PSK signal or demodulating a PSK signal using an FSK algorithm. Furthermore, it is understood that when the signal processing module demodulates the key-modulated signal, it is implemented as the aforementioned signal demodulation module; and when the signal processing module modulates the key-modulated signal, it is implemented as the aforementioned signal modulation module. In fact, the aforementioned signal demodulation module and signal debugging module can be functional units integrated in the signal processing module.

[0086] In addition, the PCB board 513 may also integrate a control module (such as an MCU, Microcontroller Unit) and an interface circuit (not shown). The interface circuit may integrate relevant interfaces such as power supply and communication to provide power to the PCB board 513 and establish communication with other devices (or functional modules of other devices) for data exchange. In this way, the microstrip composite antenna described in this application and related functional modules can be highly integrated on the PCB board 513, thereby further achieving miniaturization and integration of the functional modules.

[0087] The strip antenna in this solution connects to a microstrip radiating line printed on a PCB via pins at both ends, forming a composite microstrip antenna. Because the first end of the first radiating line is connected to the input and / or output point of a keying modulation signal, the composite microstrip antenna can be used to receive and / or transmit keying modulation signals (such as ASK and FSK).

[0088] On the one hand, compared with the bracket antenna, the size of the strip radiating antenna is not limited by λ / 4. Therefore, both the strip radiating antenna and the microstrip composite antenna composed of it are significantly smaller in size than the conventional bracket antenna; on the other hand, through the mutual cooperation of the microstrip radiating line and the strip radiating antenna, the microstrip composite antenna can operate stably at the expected resonant frequency and have a higher antenna gain. For example, the measured gain at the resonant frequency of 434.4MHz is approximately -1.9dBi, which is significantly higher than the gain of a spiral antenna of similar size.

[0089] This demonstrates that the microstrip composite antenna effectively meets both the requirements of miniaturization and high gain. Furthermore, the strip radiating antenna can be made of a rigid, long metal strip, making it less susceptible to deformation and ensuring stable operation at or near its resonant frequency. Furthermore, because the strip radiating antenna is securely soldered to the PCB via pins, it offers excellent shock resistance, high structural stability, and signal stability.

[0090] This concludes the introduction to the structure of the microstrip composite antenna. The following describes its actual performance in conjunction with experimental data.

[0091] For example, a strip radiating antenna with a length of 26 mm, a height of 7 mm, and a width of 6 mm was soldered to a PCB and connected to a microstrip radiating line printed on the PCB to form the microstrip composite antenna shown in Figure 4. A 50-ohm coaxial cable connected the first end 107 to the signal output port (i.e., the antenna was used as a receiving antenna). A Smith chart was plotted using a vector network analyzer, and the position of the mark at a set frequency (e.g., 434 MHz) was observed in conjunction with the S11 (return loss) plot. During testing, the resonant frequency of the microstrip composite antenna was varied by adjusting the capacitance values ​​of capacitors 408 and 409.

[0092] As shown in the S11 and Smith impedance measured diagrams in FIG8 , when the resonant frequency of the microstrip composite antenna is adjusted to 434.4 MHz (i.e., point P in the diagram), the real part of the antenna impedance is 383.95 mΩ and the imaginary part is 941.96 pF.

[0093] As shown in the measured RF signal radiation pattern in Figure 9, (b), (c), and (d) of Figure 9 show that when the microstrip composite antenna operates at 434.00MHz, its maximum gain on the H plane (i.e., the xy plane) is located near 210°, its maximum gain on the E1 plane (i.e., the xz plane) is located near 210°, and its maximum gain on the E2 plane (i.e., the yz plane) is located near 135°. As shown in Figure 9(a), the overall maximum gain of the microstrip composite antenna is -1.9dBi. The measured gain pattern in Figure 10 shows the variation curve of the antenna gain within the frequency band of 420.00 to 440.00MHz, and the gain value near 434.00MHz also confirms this point.

[0094] In addition, a comparative test was conducted on the signal range of the aforementioned microstrip composite antenna of this solution and a spiral antenna of similar size: each antenna was used to receive the RF signal (carrying tire pressure information collected by the sensor) emitted by the TPMS sensor. The test conditions were as follows: the RF communication rate was set to 19.2kbps, the FSK receiving sensitivity was set to -102dBm, the signal power of the TPMS sensor was 5dBm, and the sensor was placed at a fixed position (coordinate zero) as the signal source for testing. The test results can be seen in Figure 11. As shown in Figure 11, the maximum receiving range of the microstrip composite antenna of this solution is approximately 50m. The maximum receiving range in eight directions around the signal source is relatively uniform, generally ranging from 49 to 53 meters. Under the same test conditions, the maximum receiving range of a spiral antenna of similar size (length L = 38.5mm, diameter D = 5.5mm) is generally around 40m. Therefore, the maximum signal receiving range of the microstrip composite antenna described in this application is approximately 20% higher than that of a spiral antenna of the same size.

[0095] It can be seen from the above tests that the microstrip composite antenna described in the present application has excellent performance parameters such as gain and maximum signal reception distance, and has significantly improved performance compared to the helical antenna.

[0096] In addition to the aforementioned microstrip composite antenna, this application also proposes an integrated circuit board with highly integrated components and functions. The integrated circuit board includes a control module, a signal processing module, an interface module, and a microstrip composite antenna as described in any of the preceding embodiments, wherein the first end of the microstrip radiating line in the microstrip composite antenna is connected to the signal processing module.

[0097] As shown in Figure 12, the integrated circuit board 1200 includes a control module 1201, a signal processing module 1202, an interface module 1203, and a microstrip composite antenna 1204. The control module 1201 is used to control the normal operation of the integrated circuit board 1200 as a whole; the signal processing module 1202 is used to demodulate the keying modulation signal received by the microstrip composite antenna 1204 and / or to transmit the modulated keying modulation signal to the surrounding space through the microstrip composite antenna 1204; and the interface module 1203 can integrate multiple interfaces such as a power supply interface and a communication interface, and can realize power and communication connections between the integrated circuit board 1200 and other devices through this module.

[0098] Since the strip radiating antenna described in this solution is relatively small in size, the miniaturization of the microstrip composite antenna can be achieved. Furthermore, the integrated circuit board equipped with the microstrip composite antenna can also have a relatively small size. As shown in Figure 13, a microstrip composite antenna 1302 is mounted on an integrated circuit board 1301. The size of the integrated circuit board 1301 is measured using a vernier caliper 1303. From the readings 1304 in (a) and (b), it can be seen that the length of the circuit board is approximately 30 mm and the width is approximately 42 mm. It can be seen that the integrated circuit board equipped with a miniaturized, high-gain microstrip composite antenna is only 30 mm * 42 mm in size, which is significantly smaller than the size of a circuit board equipped with a conventional antenna (such as a bracket antenna, etc.), thereby achieving miniaturization of the circuit board (based on the small-sized microstrip composite antenna). In fact, if the functional modules assembled on the integrated circuit board 1301 are streamlined, its size can be further reduced to meet application scenarios with more stringent size requirements.

[0099] In one embodiment, the microstrip composite antenna described in this application can be installed in a vehicle as a standalone antenna, or the integrated circuit board described in this application can be integrated into a vehicle as a signal processing device with an integrated antenna module. This application also provides a vehicle equipped with the microstrip composite antenna described in any of the above embodiments, or the integrated circuit board described in any of the above embodiments.

[0100] Exemplarily, the microstrip composite antenna or integrated circuit board installed in the vehicle can be used to receive tire pressure, temperature, humidity and other signals emitted by tire pressure sensors (or TPMS sensors) installed in the vehicle tires, and submit them to the vehicle's on-board system after appropriate processing so that the on-board system can archive them and / or display them to users for viewing.

[0101] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0102] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

[0103] It should be noted that, in this application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. The terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0104] The above is a detailed introduction to the methods and devices provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the methods and core ideas of the present application. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of the present application should not be understood as a limitation on the present application.

Claims

1. A microstrip composite antenna for receiving and / or transmitting a keying modulated signal, characterized in that: The microstrip composite antenna comprises a strip radiating antenna (100) and a microstrip radiating line (500) connected to each other, wherein: The microstrip radiating line (500) comprises a first radiating line (501) and a second radiating line (502) printed in a PCB board (513); a first end (5011) of the first radiating line (501) is connected to a signal input and / or output point (512) of a keying modulation signal; a second end (5012) of the first radiating line (501) is connected to the second radiating line (502); and the second radiating line (502) is also connected to a ground plane of the PCB board (513); The strip radiating antenna (100) comprises a middle section (103) and a first supporting section (101) and a second supporting section (102) respectively located at two ends of the middle section (103); the first supporting section (101) and the second supporting section (102) are respectively bent toward the same side of the middle section (103); a first pin formed at the end of the first supporting section (101) is connected to the second radiating line (502); and a second pin formed at the end of the second supporting section (102) is connected to the ground plane of the PCB board (513) via a capacitor. The strip radiating antenna (100) is located above the microstrip radiating line (500), and at least one of the first radiating line (501) and the second radiating line (502) is parallel to the middle section (103).

2. The microstrip composite antenna according to claim 1, characterized in that: The keying modulation signal includes at least one of the following: a frequency shift keying FSK signal, an amplitude shift keying ASK signal, and a phase shift keying PSK signal.

3. The microstrip composite antenna according to claim 1, characterized in that: The number of the first pins is one or more, and each of the first pins is soldered to the PCB board (513) via a first soldering pad at a corresponding position on the PCB board (513); The number of the second pins is one or more, and each of the second pins is soldered to the PCB board (513) via a second soldering pad at a corresponding position on the PCB board (513), and the second soldering pad is connected to the ground plane via the capacitor.

4. The microstrip composite antenna according to claim 1, characterized in that: Any one or all of the first pin and the second pin are of surface mount type or direct insertion type.

5. The microstrip composite antenna according to claim 4, characterized in that: The first pin is of a surface mount type and is bent toward the second pin; and / or, The second pin is of a surface mount type and is bent toward the first pin.

6. The microstrip composite antenna according to claim 1, characterized in that: The PCB board (513) includes n layers of circuits, 2≤n, the first radiating line (501) and the second radiating line (502) are respectively located at the i-th layer and the j-th layer of the n layers of circuits, 1≤i≤n, 1≤j≤n, i≠j, and the first radiating line (501) is connected to the second radiating line (502) across layers.

7. The microstrip composite antenna according to claim 1, characterized in that: The first radiating line (501) is located in the first layer below the middle section (103) and the second pin is soldered to the PCB board (513) via a second solder pad located in the first layer, and the first end (5011) located on one side of the second supporting section (102) is connected to the signal input and / or output point (512) located on the other side via an extension wire (511), wherein: A notch (1023) is provided at the end of the second supporting section (102), and the extension wire (511) passes through under the notch (1023); or, The extension wire (511) is connected to the first end (5011) in the first layer by bypassing the second pad.

8. The microstrip composite antenna according to claim 7, characterized in that: When the extension wire (511) passes through the bottom of the notch (1023), the end of the second support section (102) forms two second pins symmetrical to each other with the notch (1023) as the center, wherein: The two second pins are respectively connected to the ground plane (510) of the PCB board (513) through at least one capacitor; or, One of the second pins is connected to the ground plane (510) of the PCB board (513) via at least one capacitor, and the other second pin is left floating.

9. The microstrip composite antenna according to claim 8, characterized in that: The width of the notch (1023) is not less than 1.2 times the width of the extension wire (511).

10. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The frequency band of the microstrip composite antenna is 310-490 MHz, the length L of the strip radiating antenna (100) is in the range of 22-50 mm, the height H is in the range of 5-10 mm, and the width W is in the range of 3-8 mm.

11. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The resonant frequency of the microstrip composite antenna is within the frequency band of 431-437 MHz, and the dimensions of the strip radiating antenna (100) are: length L=26 mm, height H=7 mm, and width W=6 mm.

12. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The thickness of the strip radiating antenna (100) is in the range of 0.2 to 1.0 mm.

13. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The length of the first radiation line (501) is not less than 1 / 2 of the length of the middle section (103).

14. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The ratio of the width (W2) of the second radiating line (502) to the width (W) of the strip radiating antenna (100) is in the range of 0.8 to 1.

2.

15. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The long side of the orthographic projection of the strip radiating antenna (100) on the PCB board (513) is parallel to at least one edge of the ground plane (510), and the distance between the long side and the edge is not less than 6 mm.

16. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The dielectric constant of the substrate of the PCB board (513) is not greater than 5.

5.

17. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The strip radiating antenna (100) is made of a long strip of metal sheet (401) through stamping and / or bending to obtain the middle section (103), the first supporting section (101) and the second supporting section (102).

18. The microstrip composite antenna according to any one of claims 1 to 8, characterized in that: The PCB board (513) is integrated with a signal processing module, the signal processing module is connected to the signal input and / or output point (512), and the signal processing module is used to: Demodulating a keying modulation signal received by the microstrip composite antenna; and / or, The modulated keying modulation signal is transmitted to the surrounding space through the microstrip composite antenna.

19. An integrated circuit board, characterized in that: The integrated circuit board (1200) comprises: a control module (1201), a signal processing module (1202), an interface module (1203) and a microstrip composite antenna (1204) according to any one of claims 1 to 17, wherein: The first end (5011) of the microstrip radiating line (500) in the microstrip composite antenna (1204) is connected to the signal processing module (1202), and the signal processing module (1202) is used to demodulate the key-controlled modulation signal received through the microstrip composite antenna (1204), and / or to transmit the modulated key-controlled modulation signal to the surrounding space through the microstrip composite antenna (1204).

20. A vehicle, characterized in that: The vehicle is equipped with the microstrip composite antenna according to any one of claims 1 to 18, or is equipped with the integrated circuit board (1200) according to claim 19.

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