Prepreg, laminate, printed wiring board, and semiconductor package

Abstract

The present invention provides: a prepreg which contains a resin composition that contains a siloxane-modified maleimide resin and a fiber base material that contains a glass fiber having a content of Al2O3 of 20% by mass or more; a laminate which uses the prepreg; a printed wiring board; and a semiconductor package.

Description

Prepregs, laminates, printed wiring boards and semiconductor packages

[0001] The present embodiment relates to a prepreg, a laminate, a printed wiring board, and a semiconductor package.

[0002] In recent years, the field of semiconductor packaging has seen advances in wiring density and integration, and as a result, printed wiring boards are required to have higher reliability than ever before. To improve the reliability of printed wiring boards, substrates for printed wiring boards are required to have improved heat resistance, low thermal expansion, conductor adhesion, etc.

[0003] Patent Document 1 discloses a thermosetting resin composition that exhibits excellent low cure shrinkage, low thermal expansion, good copper foil adhesion, and a high elastic modulus, and that contains an amino-modified siloxane compound (A) having at least one primary amino group per molecule and a maleimide compound (B) having at least two N-substituted maleimide groups per molecule.

[0004] JP 2016-030757 A

[0005] In multilayer printed wiring boards, through holes are sometimes formed in an insulating layer to connect inner and outer copper layers. For example, when forming a conductor circuit using a semi-additive process (SAP), after forming the through holes in the insulating layer, a desmearing process is performed to remove smears at the bottom of the through holes. Then, an electroless copper plating layer, called a seed layer, is formed on the insulating layer and within the through holes. A resist pattern is then formed on the seed layer, and a circuit pattern is formed by electrolytic copper plating in areas where the resist pattern is not present. The resist pattern and unnecessary portions of the seed layer are then removed to form the conductor circuit. As mentioned above, the wiring density of printed wiring boards has significantly increased in recent years, and this has led to the development of smaller through holes. Research by the present inventors has revealed that it is difficult to obtain good plating properties within the through holes because plating solutions have difficulty flowing into the smaller diameter through holes. To obtain good plating properties within the smaller diameter through holes, the insulating layer must have high water wettability to facilitate the flow of plating solutions. However, conventional materials have insufficient water wettability.

[0006] In view of the current situation, an object of the present embodiment is to provide a prepreg whose cured product has excellent water wettability, and a laminate, a printed wiring board, and a semiconductor package using the prepreg.

[0007] As a result of extensive research to solve the above problems, the present inventors have found that the above problems can be solved by the present embodiment described below, and have completed the present embodiment. That is, the present embodiment relates to the following [1] to [8]. [1] A resin composition containing a siloxane-modified maleimide resin, and Al ２ O ３ [2] A prepreg comprising: a fiber substrate containing glass fibers having a content of 20 mass % or more of [1]. [3] The prepreg according to [1] above, wherein the siloxane-modified maleimide resin has a structure derived from a maleimide resin having one or more N-substituted maleimide groups and a structure derived from a siloxane compound having two primary amino groups. [4] The glass fibers further contain SiO２ The glass fiber contains the above-mentioned Al ２ O ３ and the SiO ２ The prepreg according to [1] or [2] above, wherein the total content of the resin composition in the prepreg is 70% by mass or more. [4] The prepreg according to any one of [1] to [3] above, wherein the content of the resin composition in the prepreg is 30 to 90% by mass. [5] A laminate having a metal foil and a cured product of the prepreg according to any one of [1] to [4] above. [6] A printed wiring board having a cured product of the prepreg according to any one of [1] to [5] above. [7] A semiconductor package having a printed wiring board according to [6] above and a semiconductor element. [8] A method for producing a printed wiring board, comprising forming through-holes in the cured product of the prepreg according to any one of [1] to [5] above, and then forming a conductor layer in the through-hole by plating.

[0008] According to the present embodiment, it is possible to provide a prepreg having excellent water wettability when cured, and a laminate, a printed wiring board, and a semiconductor package using the prepreg.

[0009] In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. For example, a numerical range "X to Y" (X and Y are real numbers) means a numerical range that is equal to or greater than X and equal to or less than Y. In this specification, the term "X or greater" means X and a numerical value that exceeds X. In addition, the term "Y or less" in this specification means Y and a numerical value that is less than Y. The lower limit and upper limit of a numerical range described in this specification can be arbitrarily combined with the lower limit or upper limit of another numerical range. In the numerical ranges described in this specification, the lower limit or upper limit of that numerical range may be replaced with a value shown in the examples.

[0010] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more.

[0011] In this specification, the content of each component in a resin composition means the total amount of the multiple substances present in the resin composition, unless otherwise specified, when multiple substances corresponding to each component are present in the resin composition.

[0012] The expression "containing XX" as used herein means both containing XX in a reacted state if XX is capable of reacting, and simply containing XX.

[0013] In this specification, the term "solid content" refers to components other than the solvent, and components that are liquid at 25°C are also considered to be solid content.

[0014] The expression "containing XX" as used herein means both containing XX in a reacted state if XX is capable of reacting, and simply containing XX.

[0015] The weight average molecular weight (Mw) in this specification refers to a value measured in terms of polystyrene by gel permeation chromatography (GPC). Specifically, the weight average molecular weight (Mw) in this specification can be measured by the method described in the examples.

[0016] In this specification, the term "semi-cured product" is synonymous with a resin composition in a B-stage state according to JIS K 6800 (2006), and the term "cured product" is synonymous with a resin composition in a C-stage state according to JIS K 6800 (2006).

[0017] The mechanism of action described in this specification is speculation and does not limit the mechanism by which the effects of this embodiment are achieved.

[0018] Any combination of the features described in this specification is also included in this embodiment.

[0019] [Prepreg] The prepreg of the present embodiment comprises a resin composition containing a siloxane-modified maleimide resin and Al ２ O ３ and a prepreg containing:

[0020] <Resin Composition> The resin composition contained in the prepreg of this embodiment contains a siloxane-modified maleimide resin. Hereinafter, the siloxane-modified maleimide resin may be referred to as "(A) siloxane-modified maleimide resin" or "component (A)." Furthermore, in this specification, each component may be abbreviated as component (A), component (B), etc., and similar abbreviations may be used for other components. Below, each component contained in the resin composition will be described in order.

[0021] ((A) Siloxane-Modified Maleimide Resin) The component (A) is not particularly limited as long as it is a maleimide resin modified with a siloxane compound. The (A) siloxane-modified maleimide resin may be used alone or in combination of two or more types.

[0022] The (A) siloxane-modified maleimide resin is preferably one having a structure derived from a maleimide resin having one or more N-substituted maleimide groups [hereinafter, this may be referred to as a "maleimide resin (AX)" or "component (AX)"] and a structure derived from a siloxane compound having two primary amino groups [hereinafter, this may be referred to as a "siloxane diamine"].

[0023] <Structure derived from maleimide resin (AX)> Examples of the structure derived from the maleimide resin (AX) include a structure formed by a Michael addition reaction between at least one N-substituted maleimide group among the N-substituted maleimide groups contained in the maleimide resin (AX) and a primary amino group contained in the siloxane diamine. The structure derived from the maleimide resin (AX) contained in the (A) siloxane-modified maleimide resin may be one type alone or two or more types.

[0024] From the viewpoint of heat resistance, the content of the structure derived from the maleimide resin (AX) in the siloxane-modified maleimide resin (A) is preferably 5 to 95 mass %, more preferably 30 to 93 mass %, and even more preferably 60 to 90 mass %.

[0025] -Maleimide Resin (AX)- From the viewpoints of conductor adhesion and heat resistance, the maleimide resin (AX) is preferably an aromatic maleimide resin having two or more N-substituted maleimide groups, and more preferably an aromatic bismaleimide resin having two N-substituted maleimide groups.

[0026] In this specification, the term "aromatic maleimide resin" refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring. In addition, in this specification, the term "aromatic bismaleimide resin" refers to a compound having two N-substituted maleimide groups directly bonded to an aromatic ring. In addition, in this specification, the term "aromatic polymaleimide resin" refers to a compound having three or more N-substituted maleimide groups directly bonded to an aromatic ring. In addition, in this specification, the term "aliphatic maleimide resin" refers to a compound having an N-substituted maleimide group directly bonded to an aliphatic hydrocarbon.

[0027] The maleimide resin (AX) is preferably a maleimide resin represented by the following general formula (A-1).

[0028] (In the formula, X Ａ１ is a divalent organic group.

[0029] X in the above general formula (A-1) Ａ１ Examples of the divalent organic group represented by formula (A-2) below, a divalent organic group represented by formula (A-3) below, a divalent organic group represented by formula (A-4) below, a divalent organic group represented by formula (A-5) below, and a divalent organic group represented by formula (A-6) below.

[0030] (In the formula, R Ａ１ is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ａ１ is an integer from 0 to 4. * represents a binding site.)

[0031] R in the above general formula (A-2) Ａ１Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. n Ａ１ is an integer of 2 or more, a plurality of R Ａ１ They may be the same or different.

[0032] (In the formula, R Ａ２ and R Ａ３ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ａ２ n is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent organic group represented by the following general formula (A-3-1): Ａ２ and n Ａ３ are each independently an integer of 0 to 4. * represents a binding site.

[0033] R in the above general formula (A-3) Ａ２ and R Ａ３ The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R Ａ１ The same can be mentioned.

[0034] X in the above general formula (A-3) Ａ２ Examples of the alkylene group having 1 to 5 carbon atoms represented by X include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. Ａ２ Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group.

[0035] n Ａ２ or nＡ３ is an integer of 2 or more, a plurality of R Ａ２ R Ａ３ They may be the same or different from each other.

[0036] X in the above general formula (A-3) Ａ２ The divalent organic group represented by formula (A-3-1) is as follows:

[0037] (In the formula, R Ａ４ and R Ａ５ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Ａ３ is an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. Ａ４ and n Ａ５ are each independently an integer of 0 to 4. * represents a binding site.

[0038] R in the above general formula (A-3-1) Ａ４ and R Ａ５ The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R Ａ１ The same as X in the above general formula (A-3-1) can be mentioned. Ａ３ The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by the above X Ａ２ The same as those in the above general formula (A-3-1) Ａ４ and n Ａ５ are each independently an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. Ａ４ or n Ａ５ is an integer of 2 or more, a plurality of R Ａ４ R Ａ５ They may be the same or different from each other.

[0039] (In the formula, n Ａ６ is an integer from 0 to 10. * represents a binding site.)

[0040] (In the formula, n Ａ７ is a number from 0 to 5. * represents a binding site.)

[0041] (In the formula, R Ａ６ and R Ａ７ are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. Ａ８ is an integer from 1 to 8. * represents a binding site.)

[0042] R in the above general formula (A-6) Ａ６ and R Ａ７ The aliphatic hydrocarbon group having 1 to 5 carbon atoms and the halogen atom represented by R Ａ１ The same as those in the general formula (A-6) above are included. Ａ８ is an integer of 2 or more, a plurality of R Ａ６ R Ａ７ They may be the same or different from each other.

[0043] Examples of the maleimide resin (AX) include aromatic bismaleimide resins, aromatic polymaleimide resins, and aliphatic maleimide resins. Examples of the maleimide resin (AX) include bis(4-maleimidophenyl)methane, m-phenylene bismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 4-methyl-1,3-phenylene bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, polyphenylmethane maleimide, biphenyl aralkyl maleimide, and aromatic bismaleimide resins having an indane skeleton. Among these, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane is preferred.

[0044] <<Structure derived from siloxane diamine>> Examples of the structure derived from siloxane diamine include a structure formed by a Michael addition reaction between one or both of the two primary amino groups possessed by the siloxane diamine and an N-substituted maleimide group possessed by the maleimide resin (AX). The structure derived from siloxane diamine contained in the (A) siloxane-modified maleimide resin may be of one type alone or of two or more types.

[0045] From the viewpoint of low thermal expansion, the content of the siloxane diamine-derived structure in the siloxane-modified maleimide resin (A) is preferably 5 to 95 mass %, more preferably 7 to 70 mass %, and even more preferably 10 to 40 mass %.

[0046] -Siloxane diamine- The siloxane diamine is not particularly limited as long as it is a siloxane compound having two primary amino groups. The siloxane diamine is preferably one containing a divalent group having a structure represented by the following general formula (A-7):

[0047] (In the formula, R Ａ８ and R Ａ９ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. * represents a bonding site.

[0048] R in the above general formula (A-7) Ａ８ and R Ａ９ Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R include alkyl groups having 1 to 5 carbon atoms such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. As the aliphatic hydrocarbon group having 1 to 5 carbon atoms, an aliphatic hydrocarbon group having 1 to 3 carbon atoms is preferred, an alkyl group having 1 to 3 carbon atoms is more preferred, and a methyl group is even more preferred. R Ａ８ and R Ａ９ The substituent on the phenyl group in the substituted phenyl group represented by the formula (I) can be the above-mentioned aliphatic hydrocarbon groups having 1 to 5 carbon atoms.

[0049] The siloxane diamine is preferably a silicone compound having primary amino groups at both ends, and more preferably a compound represented by the following general formula (A-8).

[0050] (In the formula, R Ａ８ and R Ａ９ is the same as in the general formula (A-7), and R Ａ１０ and RＡ１１ are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms, a phenyl group, or a substituted phenyl group. Ａ４ and X Ａ５ are each independently a divalent organic group, and n Ａ９ is an integer from 2 to 100.

[0051] R in the above general formula (A-8) Ａ１０ and R Ａ１１ The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R Ａ８ and R Ａ９ The same can be mentioned.

[0052] X in the above general formula (A-8) Ａ４ and X Ａ５ Examples of the divalent organic group represented by include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -O-, or a divalent linking group formed by combining these. Examples of the alkylene group include alkylene groups having 1 to 10 carbon atoms, such as a methylene group, an ethylene group, or a propylene group. Examples of the alkenylene group include alkenylene groups having 2 to 10 carbon atoms. Examples of the alkynylene group include alkynylene groups having 2 to 10 carbon atoms. Examples of the arylene group include arylene groups having 6 to 20 carbon atoms, such as a phenylene group or a naphthylene group. Among these, X Ａ４ and X Ａ５ As the alkylene group, an alkylene group or an arylene group is preferable, and an alkylene group is more preferable.

[0053] n in the above general formula (A-8) Ａ９ is an integer of 2 to 100, preferably an integer of 2 to 50, more preferably an integer of 3 to 40, and even more preferably an integer of 5 to 30. Ａ９ is an integer of 2 or more, a plurality of R Ａ８ R Ａ９ They may be the same or different from each other.

[0054] The primary amino group equivalent weight of the siloxane diamine is preferably 300 to 2,000 g / mol, more preferably 400 to 1,500 g / mol, and even more preferably 500 to 1,000 g / mol.

[0055] <<Method for Producing (A) Siloxane-Modified Maleimide Resin>> The (A) siloxane-modified maleimide resin can be produced, for example, by subjecting a maleimide resin (AX) to a Michael addition reaction with a siloxane diamine in an organic solvent. The reaction temperature for the Michael addition reaction is preferably 50 to 160°C, more preferably 60 to 150°C, and even more preferably 70 to 140°C, from the viewpoints of workability such as reaction rate and suppressing gelation of the product during the reaction. The reaction time for the Michael addition reaction is preferably 0.5 to 10 hours, more preferably 1 to 6 hours, and even more preferably 1.5 to 4 hours, from the viewpoints of productivity and allowing the reaction to proceed sufficiently. When reacting the maleimide resin (AX) with the siloxane diamine, a reaction catalyst may be used as necessary. However, these reaction conditions can be adjusted appropriately depending on the types of raw materials used, and are not particularly limited.

[0056] The weight average molecular weight (Mw) of the siloxane-modified maleimide resin (A) is preferably 1,000 to 20,000, more preferably 3,000 to 15,000, and even more preferably 5,000 to 10,000, from the viewpoints of handleability and moldability.

[0057] The content of the siloxane-modified maleimide resin (A) in the resin composition is preferably 10 to 70 mass %, more preferably 20 to 60 mass %, and even more preferably 30 to 50 mass %, based on the total amount (100 mass %) of the resin components in the resin composition. When the content of the siloxane-modified maleimide resin (A) is within the above range, the heat resistance, low thermal expansion, moldability, and copper foil adhesion tend to be more improved.

[0058] In this specification, the term "resin component" refers to a resin and a compound that forms a resin through a curing reaction. Examples of the resin component include component (A), component (B), component (C), and component (D). On the other hand, components (E), (F), and the like are not included in the resin component.

[0059] The content of the resin component in the resin composition is preferably 5 to 70% by mass, more preferably 10 to 60% by mass, and even more preferably 20 to 40% by mass, based on the total solid content (100% by mass) of the resin composition. When the content of the resin component is equal to or greater than the lower limit, the heat resistance, moldability, processability, and copper foil adhesion tend to be improved. On the other hand, when the content of the resin component is equal to or less than the upper limit, the low thermal expansion property tends to be improved.

[0060] ((B) Maleimide Resin Other Than Component (A)) The resin composition preferably further contains, as component (B), a maleimide resin other than component (A) [hereinafter, may be referred to as "(B) maleimide resin"]. The prepreg of this embodiment tends to have better heat resistance due to the resin composition containing the (B) maleimide resin. One type of (B) maleimide resin may be used alone, or two or more types may be used in combination.

[0061] Examples of (B) maleimide resins include the maleimide resin (AX) described above. Among these, maleimide resins having three or more N-substituted maleimide groups are preferred, and maleimide resins having three or more N-substituted maleimide groups bonded to an aromatic ring are more preferred. From the viewpoint of handleability, the number of N-substituted maleimide groups in a maleimide resin having three or more N-substituted maleimide groups may be six or less, or may be five or less.

[0062] The maleimide resin (B) is preferably a compound represented by the following general formula (B-1).

[0063] (In the formula, X Ｂ１ are each independently a divalent hydrocarbon group having 1 to 20 carbon atoms, and n Ｂ１ is an integer from 2 to 5.

[0064] X in the above general formula (B-1) Ｂ１ Examples of the divalent hydrocarbon group having 1 to 20 carbon atoms represented by the formula (B-1) include divalent aliphatic hydrocarbon groups such as alkylene groups having 1 to 5 carbon atoms and alkylidene groups having 2 to 5 carbon atoms; and divalent hydrocarbon groups containing an aromatic hydrocarbon group represented by the following general formula (B-2).

[0065] Examples of alkylene groups having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. As the alkylene group having 1 to 5 carbon atoms, an alkylene group having 1 to 3 carbon atoms is preferred, an alkylene group having 1 or 2 carbon atoms is more preferred, and a methylene group is even more preferred. As the alkylidene group having 2 to 5 carbon atoms, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

[0066] (In the formula, Ar Ｂ１ is a divalent aromatic hydrocarbon group, and X Ｂ２ and X Ｂ３ are each independently a divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms. * represents a bonding site.

[0067] X in the above general formula (B-2) Ｂ２ and X Ｂ３ The divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by X in the above general formula (B-1) is Ｂ１ Examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms mentioned above are as follows. Among these, a methylene group is preferred. Ｂ１ Examples of the divalent aromatic hydrocarbon group represented by include a phenylene group, a naphthylene group, a biphenylene group, and an anthranylene group. Of these, a biphenylene group is preferred. Examples of the biphenylene group include a 4,2'-biphenylene group, a 4,3'-biphenylene group, a 4,4'-biphenylene group, and a 3,3'-biphenylene group, and of these, a 4,4'-biphenylene group is preferred.

[0068] Among the above options, X in the general formula (B-1) Ｂ１ is preferably an alkylene group having 1 to 5 carbon atoms or an alkylidene group having 2 to 5 carbon atoms, more preferably a methylene group or an isopropylidene group, and even more preferably a methylene group.

[0069] n in the above general formula (B-1) Ｂ１ is an integer of 2 to 5, preferably an integer of 2 to 4, and more preferably 2 or 3.

[0070] Examples of the compound represented by the general formula (B-1) include polyphenylmethane maleimide, biphenylaralkyl maleimide, etc. Among these, polyphenylmethane maleimide is preferred from the viewpoints of desmear resistance, heat resistance, low thermal expansion, and elastic modulus.

[0071] When the resin composition contains the (B) maleimide resin, the content of the (B) maleimide resin is preferably 10 to 70% by mass, more preferably 20 to 60% by mass, and even more preferably 30 to 50% by mass, relative to the total amount (100% by mass) of resin components in the resin composition. When the content of the (B) maleimide resin is equal to or greater than the above-mentioned lower limit, the desmear resistance, heat resistance, low thermal expansion, and elastic modulus tend to be more favorable. On the other hand, when the content of the (B) maleimide resin is equal to or less than the above-mentioned upper limit, the fluidity of the resin composition is improved, and the moldability of the prepreg tends to be more favorable.

[0072] (Epoxy Resin (C)) The resin composition preferably further contains an epoxy resin (C). The prepreg of this embodiment tends to have better heat resistance when the resin composition contains an epoxy resin (C). One type of epoxy resin (C) may be used alone, or two or more types may be used in combination.

[0073] The (C) epoxy resin is preferably an epoxy resin having two or more epoxy groups. (C) Epoxy resins are classified into, for example, glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, etc. Among these, glycidyl ether type epoxy resins are preferred.

[0074] (C) Epoxy resins are classified into various epoxy resins based on differences in their main skeletons, and each of the above types of epoxy resins can be further classified into bisphenol-type epoxy resins such as bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and bisphenol S-type epoxy resins; alicyclic epoxy resins such as dicyclopentadiene-type epoxy resins; aliphatic linear epoxy resins; novolac-type epoxy resins such as phenol novolac-type epoxy resins, cresol novolac-type epoxy resins, bisphenol A novolac-type epoxy resins, bisphenol F novolac-type epoxy resins, phenol aralkyl novolac-type epoxy resins, and biphenyl aralkyl novolac-type epoxy resins; stilbene-type epoxy resins; naphthalene-type epoxy resins such as naphthol novolac-type epoxy resins and naphthol aralkyl-type epoxy resins; biphenyl-type epoxy resins; xylylene-type epoxy resins; and dihydroanthracene-type epoxy resins. Among these, naphthalene-type epoxy resins are preferred from the viewpoints of heat resistance and low thermal expansion.

[0075] When the resin composition contains the epoxy resin (C), the content of the epoxy resin (C) is preferably 1 to 30 mass%, more preferably 2 to 20 mass%, and even more preferably 3 to 10 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition. When the content of the epoxy resin (C) is equal to or greater than the above-mentioned lower limit, the heat resistance tends to be better. On the other hand, when the content of the epoxy resin (C) is equal to or less than the above-mentioned upper limit, the low thermal expansion property tends to be better.

[0076] (D) Benzoxazine Resin) The resin composition preferably further contains a (D) benzoxazine resin. The prepreg of this embodiment tends to have excellent toughness in the cured product due to the resin composition containing a (D) benzoxazine resin. In this embodiment, "benzoxazine resin" refers to a resin having at least one benzoxazine ring in the molecule. In this embodiment, "benzoxazine ring" refers to a ring structure in which a six-membered oxazine ring containing one oxygen atom and one nitrogen atom contains two double bonds, one of which is dihydrogenated and the other double bond is condensed to a benzene ring. One type of (D) benzoxazine resin may be used alone, or two or more types may be used in combination.

[0077] The benzoxazine resin (D) may have one or more benzoxazine rings, preferably two or three benzoxazine rings, and more preferably two benzoxazine rings.

[0078] As the (D) benzoxazine resin, known benzoxazine resins can be used, and examples thereof include Pd-type benzoxazine, Fa-type benzoxazine, ALP-d-type benzoxazine, and T-ala-type benzoxazine.

[0079] Examples of the benzoxazine resin (D) include a compound represented by the following general formula (D-1) and a compound represented by the following general formula (D-2).

[0080] (In the formula, R Ｄ１ , R Ｄ２ , R Ｄ３ and R Ｄ４ are each independently a hydrocarbon group having 1 to 10 carbon atoms. Ｄ１ represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, —O—, a sulfonyl group, a carbonyloxy group, —C(═O)—, or a single bond. Ｄ１ , n Ｄ２ , n Ｄ３ and n Ｄ４ are each independently an integer of 0 to 4.

[0081] (In the formula, R Ｄ５ and R Ｄ６ are each independently a hydrocarbon group having 1 to 10 carbon atoms. Ｄ７ and R Ｄ８ are each independently a hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom. Ｄ２ represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, —O—, a sulfonyl group, a carbonyloxy group, —C(═O)—, or a single bond. Ｄ５ and n Ｄ６ is an integer from 0 to 3.

[0082] In the above general formula (D-1), R Ｄ１ , R Ｄ２ , R Ｄ３ and R Ｄ４ Examples of the hydrocarbon group having 1 to 10 carbon atoms represented by include aliphatic hydrocarbon groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, n-pentyl, n-octyl, and n-decyl groups; and aromatic hydrocarbon groups such as phenyl. Ｄ１ , n Ｄ２ , n Ｄ３ and n Ｄ４ are each independently an integer of 0 to 4, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 is more preferred. Ｄ１ Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, and a 1,5-pentamethylene group. The alkylene group is preferably an alkylene group having 1 to 3 carbon atoms, and more preferably a methylene group. In the above general formula (D-1), X Ｄ１ Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. Among these, an isopropylidene group is preferred.

[0083] In the above general formula (D-2), R Ｄ５ and R Ｄ６The hydrocarbon group having 1 to 10 carbon atoms represented by R Ｄ１ In the above general formula (D-2), n Ｄ５ and n Ｄ６ are each independently an integer of 0 to 3, and from the viewpoint of availability, an integer of 0 to 2 is preferred, and 0 is more preferred. Ｄ２ The alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by the above X Ｄ１ In the above general formula (D-2), R Ｄ７ and R Ｄ８ The hydrocarbon group having 1 to 10 carbon atoms represented by R Ｄ５ and R Ｄ６ Among these, R Ｄ７ and R Ｄ８ is preferably an aromatic hydrocarbon group, more preferably a phenyl group.

[0084] Among the compounds represented by either general formula (D-1) or (D-2), the compounds represented by general formula (D-1) are preferred from the viewpoint of low thermal expansion and heat resistance.

[0085] When the resin composition contains a (D) benzoxazine resin, the content of the (D) benzoxazine resin is preferably 1 to 30 mass%, more preferably 5 to 25 mass%, and even more preferably 10 to 20 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition. When the content of the (D) benzoxazine resin is equal to or greater than the above-mentioned lower limit, the toughness tends to be improved. On the other hand, when the content of the (D) benzoxazine resin is equal to or less than the above-mentioned upper limit, the heat resistance tends to be improved.

[0086] (E) Inorganic Filler It is preferable that the resin composition further contains an inorganic filler (E). When the resin composition contains an inorganic filler (E), the prepreg of this embodiment tends to easily obtain better low thermal expansion properties and heat resistance. One type of (E) inorganic filler may be used alone, or two or more types may be used in combination.

[0087] (E) inorganic filler can be enumerated as follows: silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide etc.Among these, from the viewpoint of low thermal expansion, heat resistance and flame retardancy, silica, alumina, mica, talc are preferred, silica, alumina are more preferred, and silica is even more preferred.As silica, from the viewpoint of dispersibility and moldability, fused silica is preferred.

[0088] (E) Average particle diameter of inorganic filler (D ５０ From the viewpoint of dispersibility and fine wiring, the average particle diameter (D ５０ The average particle size of the inorganic filler (E) can be measured, for example, by a particle size distribution analyzer using a laser diffraction scattering method.

[0089] The shape of the (E) inorganic filler may be, for example, spherical or crushed, with spherical being preferred. The (E) inorganic filler may be surface-treated with a surface treatment agent such as a silane coupling agent in order to improve dispersibility and adhesion to the organic component.

[0090] When the resin composition contains an (E) inorganic filler, the content of the (E) inorganic filler is preferably 30 to 90 mass%, more preferably 40 to 85 mass%, and even more preferably 60 to 80 mass%, based on the total solids content (100 mass%) of the resin composition. When the content of the (E) inorganic filler is equal to or greater than the above-mentioned lower limit, low thermal expansion and heat resistance tend to be more favorable. On the other hand, when the content of the (E) inorganic filler is equal to or less than the above-mentioned upper limit, moldability and copper foil adhesion tend to be more favorable.

[0091] (F) Curing Accelerator The resin composition preferably further contains a (F) curing accelerator. When the resin composition contains a (F) curing accelerator, the curability is improved, and better copper foil adhesion tends to be easily obtained. One type of (F) curing accelerator may be used alone, or two or more types may be used in combination.

[0092] (F) Examples of the curing accelerator include acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, tributylamine, pyridine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate; isocyanate-masked imidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; organic peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-bis(t-butylperoxy)diisopropylbenzene; and carboxylates of manganese, cobalt, zinc, and the like. Among these, isocyanate-masked imidazole compounds are preferred from the viewpoints of curing acceleration effect and storage stability.

[0093] When the resin composition contains a (F) curing accelerator, the content of the (F) curing accelerator is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and even more preferably 0.1 to 1 part by mass, per 100 parts by mass of the total amount of resin components in the resin composition. When the content of the (F) curing accelerator is equal to or greater than the above-mentioned lower limit, a sufficient curing acceleration effect tends to be easily obtained. Furthermore, when the content of the (F) curing accelerator is equal to or less than the above-mentioned upper limit, storage stability tends to be more easily improved.

[0094] (Other Optional Components) The resin composition may further contain, as necessary, one or more other optional components selected from the group consisting of resin materials other than the above components, antioxidants, heat stabilizers, antistatic agents, UV absorbers, pigments, colorants, lubricants, organic solvents, and other additives. Each of the above optional components may be used alone, or two or more may be used in combination. The content of the above optional components in the resin composition is not particularly limited, and they may be used as needed within a range that does not inhibit the effects of this embodiment. Furthermore, the resin composition may not contain the above optional components depending on the desired performance.

[0095] (Organic Solvent) From the viewpoint of handleability, the resin composition may be a varnish-like resin composition containing an organic solvent. Examples of the organic solvent include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic hydrocarbon-based solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone.

[0096] (Method for producing resin composition) The resin composition can be produced by mixing the respective components. At this time, the respective components may be dissolved or dispersed while stirring. The conditions such as the mixing order, temperature, and time are not particularly limited and may be set arbitrarily depending on the types of raw materials, etc.

[0097] <Fiber Base Material> The fiber base material contained in the prepreg of this embodiment is Al ２ O ３ The fiber substrate contains glass fibers having a content of Al of 20 mass % or more. ２ O ３ By containing glass fibers having a content of 20 mass % or more of Al in the glass fibers, the cured product of the prepreg of this embodiment has excellent wettability with water.２ O ３ From the viewpoint of wettability with water, the content of Al derived from glass fibers in the prepreg of this embodiment is 20% by mass or more, preferably 21 to 35% by mass, more preferably 22 to 30% by mass, and even more preferably 23 to 27% by mass. ２ O ３ From the viewpoint of wettability with water, the content of Al is preferably 9 to 50 mass%, more preferably 10 to 40 mass%, even more preferably 11 to 30 mass%, and still more preferably 12 to 20 mass%. ２ O ３ From the viewpoint of wettability with water, the content is preferably 10 to 55 mass %, more preferably 11 to 45 mass %, even more preferably 12 to 35 mass %, and still more preferably 13 to 25 mass %.

[0098] The glass fiber further contains SiO ２ The glass fiber preferably contains SiO ２ From the viewpoint of wettability with water, the content is preferably 50 to 80 mass %, more preferably 55 to 75 mass %, and even more preferably 60 to 70 mass %.

[0099] In addition, the glass fiber further contains SiO ２ When the glass fiber contains ２ O ３ and SiO ２ From the viewpoint of wettability with water, the total content of Al in the glass fiber is preferably 70% by mass or more, more preferably 80% by mass or more, and even more preferably 85% by mass or more. ２ O ３ and SiO ２ The total content of is preferably 96% by mass or less, more preferably 95% by mass or less, and even more preferably 94% by mass or less.

[0100] Glass fiber is SiO ２ and Al ２ O ３ Besides, Fe ２ O ３ , B ２ O３ , CaO, MgO, Na ２ O.K. ２ O, Li ２ O, TiO ２ , ZnO, ZrO ２ , F ２ The glass fiber may contain other components such as SiO. ２ and Al ２ O ３ The component other than the above is preferably one or more of the other components. Among these, it is preferable that the glass fiber further contains MgO. The content of MgO in the glass fiber is preferably 2 to 20 mass%, more preferably 5 to 15 mass%, and even more preferably 7 to 12 mass%. Preferred examples of the glass fiber include T-glass and S-glass.

[0101] The fiber substrate may have a shape such as a woven fabric, a nonwoven fabric, a roving, a chopped strand mat, a surfacing mat, etc., and is preferably a glass cloth. From the viewpoint of impregnation with the resin composition, the fiber substrate may be surface-treated with a coupling agent or may be mechanically opened.

[0102] The thickness of the fiber base material is preferably 5 to 200 μm, more preferably 20 to 150 μm, even more preferably 50 to 110 μm, and even more preferably 70 to 100 μm, from the viewpoint of the mechanical strength of the prepreg and high-density wiring.

[0103] The weight of the fiber base material is preferably 10 to 210 g / m from the viewpoint of the mechanical strength of the prepreg and high-density wiring. ２ , more preferably 50 to 180 g / m ２ , more preferably 100 to 130 g / m ２ is.

[0104] <Method for Producing Prepreg> The prepreg of this embodiment can be produced, for example, by impregnating or applying the resin composition to a fiber substrate and then heating and drying to B-stage it. The temperature and time for heating and drying can be, for example, 50 to 200°C and 1 to 30 minutes, from the viewpoints of productivity and appropriately B-staging the resin composition of this embodiment.

[0105] <Resin Composition Content> From the viewpoint of moldability, the resin composition content in the prepreg of the present embodiment is preferably 30 to 90 mass %, more preferably 35 to 70 mass %, and even more preferably 40 to 60 mass %.

[0106] <Content of Inorganic Component> The content of the inorganic component contained in the prepreg of the present embodiment is preferably 50 to 97 mass%, more preferably 60 to 95 mass%, even more preferably 70 to 93 mass%, and still more preferably 80 to 90 mass%, from the viewpoint of wettability with water.

[0107] <Prepreg Thickness> The thickness of the prepreg of this embodiment is preferably 5 to 200 μm, more preferably 20 to 150 μm, and even more preferably 50 to 110 μm, from the viewpoint of the mechanical strength of the prepreg and achieving high-density wiring.

[0108] [Laminate] The laminate of the present embodiment is a laminate having a cured product of the prepreg of the present embodiment and a metal foil.

[0109] Examples of metals for the metal foil include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements.

[0110] The laminate of this embodiment can be produced, for example, by placing metal foil on one or both sides of the prepreg of this embodiment and then hot-press molding. Typically, the B-staged prepreg is cured by this hot-press molding to obtain the laminate of this embodiment. When hot-press molding, only one prepreg may be used, or two or more prepregs may be stacked together. The number of prepregs may be, for example, 2 to 20, 4 to 18, or 6 to 16. For hot-press molding, for example, a multi-stage press, a multi-stage vacuum press, a continuous molding machine, an autoclave molding machine, or the like can be used. The hot-press molding conditions can be, for example, a temperature of 100 to 300°C, a time of 10 to 300 minutes, and a pressure of 1.5 to 5 MPa.

[0111] [Printed wiring board and manufacturing method thereof] The printed wiring board of the present embodiment is a printed wiring board having a cured product of the prepreg of the present embodiment. The printed wiring board of the present embodiment can be manufactured, for example, by forming a conductor circuit on the cured product of the prepreg of the present embodiment by a known method.

[0112] The method for producing a printed wiring board of this embodiment involves forming through-holes in a cured product of the prepreg of this embodiment and then forming a conductor layer in the through-holes by plating. The cured product of the prepreg in which the through-holes are formed may be the laminate of this embodiment described above, or may be a circuit board in which the prepreg of this embodiment is laminated on one or both sides and cured.

[0113] The through-holes may be formed by a known method, such as a method using a drill, a laser, or plasma, or a combination of these. Examples of lasers used to form the through-holes include a carbon dioxide laser, a YAG laser, a UV laser, and an excimer laser.

[0114] The shape of the through-holes in plan view is not particularly limited, but a circular shape is preferable. The diameter of the circular through-holes may be 300 μm or less, 200 μm or less, or 150 μm or less. The cured prepreg of this embodiment has excellent water wettability, so that even if the diameter of the through-holes is small, the plating solution easily flows in, and good plating properties can be obtained within the through-holes. Furthermore, the diameter of the circular through-holes may be 40 μm or more, 100 μm or more, or 150 μm or more, as desired. Note that the "circular shape" in this embodiment is a concept that includes not only a perfect circle but also an ellipse, and in the case of an ellipse, the major axis of the ellipse is taken as the diameter.

[0115] The surface of the cured prepreg may then be roughened with an oxidizing agent. In addition, so-called "smears" that occur during through-hole formation may be removed at the same time as the roughening treatment.

[0116] Next, a conductor layer is formed on the surface of the roughened cured prepreg and in the through-holes by plating. Examples of plating methods include electroless plating and electrolytic plating. Examples of metals for plating include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing at least one of these metal elements. Among these, copper and nickel are preferred, and copper is more preferred.

[0117] Thereafter, the conductor layer is patterned to form a circuit, and known methods such as a subtractive method, a full-additive method, a semi-additive method (SAP: Semi-Additive Process), a modified semi-additive method (m-SAP: Modified Semi-Additive Process), etc. Furthermore, a multilayer printed wiring board can be produced by appropriately repeating the necessary steps.

[0118] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package including the printed wiring board of this embodiment and a semiconductor element. The semiconductor package of this embodiment can be manufactured, for example, by mounting a semiconductor chip, a memory, etc. on the printed wiring board of this embodiment by a known method.

[0119] The present embodiment will be specifically described below with reference to examples, although the present embodiment is not limited to the following examples.

[0120] In each example, the weight average molecular weight (Mw) was measured by the following method. It was calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. Apparatus: Pump: L-6200 type [manufactured by Hitachi High-Technologies Corporation] Detector: L-3300 type RI [manufactured by Hitachi High-Technologies Corporation] Column oven: L-655A-52 [manufactured by Hitachi High-Technologies Corporation] Column: Guard column; TSK Guard column HHR-L + column; TSKgel G4000HHR + TSKgel G2000HHR (all manufactured by Tosoh Corporation, trade names) Column size: 6.0 x 40 mm (guard column), 7.8 x 300 mm (column) Eluent: tetrahydrofuran Sample concentration: 30 mg / 5 mL Injection volume: 20 μL Flow rate: 1.00 mL / min Measurement temperature: 40°C

[0121] Production Example 1: Production of Siloxane-Modified Maleimide Resin

[0049] 50 g of a silicone compound having primary amino groups at both ends (manufactured by Momentive Performance Materials Japan, LLC, product name: XF42-C5379, primary amino group functional group equivalent: 740 g / mol), 100 g of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, and 200 g of propylene glycol monomethyl ether were placed in a 2 L reactor equipped with a thermometer, a stirrer, and a reflux condenser and moisture meter, and the mixture was allowed to react at 120°C for 2 hours to produce a siloxane-modified maleimide resin. The weight-average molecular weight (Mw) of the resulting siloxane-modified maleimide resin was 8,000.

[0122] Example 1 and Comparative Example 1 (Production of Resin Composition) Each component shown in Table 1 was stirred and mixed with methyl isobutyl ketone to prepare a varnish-like resin composition having a solid content concentration of 55 to 65% by mass. In Table 1, the unit of the blending amount of each component is parts by mass, and in the case of a solution, it means parts by mass converted into solid content.

[0123] (Production of prepreg) The varnish-like resin composition obtained above was impregnated into a fiber substrate shown in Table 1, and the resulting material was dried by heating at 130° C. for 5 minutes to obtain a prepreg. The content of the resin composition in the prepreg was 50% by mass.

[0124] (Production of copper-clad laminate) Eight prepregs obtained above were stacked, and 12 μm thick copper foil (manufactured by Mitsui Kinzoku Co., Ltd., product name "3EC-M3-VLP-12", roughened surface Rz: 3.0 μm) was placed on top and bottom of them so that the roughened surface was in contact with the prepreg. This laminate was heated and press-molded at a temperature of 240° C. and a pressure of 3.0 MPa for 80 minutes to obtain a copper-clad laminate.

[0125] [Evaluation Method] Each evaluation was carried out according to the following methods. The results are shown in Table 1.

[0126] (Method for Measuring Water Contact Angle) The copper foil on both sides of the copper-clad laminate obtained in each example was removed by etching to obtain an etched laminate. The etched laminate was then immersed for 5 minutes in a swelling solution (manufactured by Atotech Japan, product name "Swelling Deep Securigant P") heated to 80°C. The laminate was then immersed for 10 minutes in a roughening solution (manufactured by Atotech Japan, product name "Concaterate Compact CP") heated to 80°C. The laminate was then neutralized by immersion for 5 minutes in a neutralizing solution (manufactured by Atotech Japan, product name "Reduction Solution Securigant P500") heated to 40°C to obtain a desmeared laminate. The etched laminate and the desmeared laminate were used as measurement subjects, and the static contact angle when purified water was dropped on each surface was measured under the following conditions. Measurement device: NIC Corporation, product name "LSE-B100TW" Measurement temperature: 25°C Amount of purified water droplet: 1 μl (syringe diameter 25G) Image analysis method: θ / 2 method Measurement time: 5 seconds after dropping

[0127]

[0128] The details of each component and fiber substrate shown in Table 1 are as follows: [Component (A)] Siloxane-modified maleimide resin: siloxane-modified maleimide resin prepared in Production Example 1

[0129] [Component (B)] Polyphenylmethane maleimide: manufactured by Daiwa Chemical Industry Co., Ltd., trade name "BMI-2300"

[0130] [Component (C)] Naphthalene-type epoxy resin: manufactured by DIC Corporation, product name "HP-9540"

[0131] [Component (D)] p-d type benzoxazine resin: a compound represented by the following formula:

[0132] [Component (E)] Fused silica: average particle diameter (D ５０ ) 0.5 μm spherical fused silica

[0133] [Component (F)] Curing accelerator: isocyanate masked imidazole, manufactured by Daiichi Kogyo Seiyaku Co., Ltd., product name "G-8009L"

[0134] [Fiber base material] Glass cloth 1: basis weight: 110 g / m ２ , thickness of glass cloth: 90 μm, composition of glass fiber (Al ２ O ３ Content 24-26% by mass, SiO ２ Content 64 to 66% by mass, MgO content 9 to 11% by mass) Glass cloth 2: basis weight: 100 g / m ２ , thickness of glass cloth: 90 μm, composition of glass fiber (Al ２ O ３ Content 12-16% by mass, SiO ２ Content 52-56% by mass, CaO and MgO content 20-25% by mass, Ba ２ O ３ content 5-10% by mass)

[0135] From Table 1, it can be seen that the cured product of the prepreg of Example 1 of this embodiment has a small water contact angle and is excellent in wettability with water.

Claims

1. A resin composition containing a siloxane-modified maleimide resin and Al ２ O ３ A fiber base material containing glass fibers having a content of 20 mass % or more, and a prepreg containing:

2. The prepreg according to claim 1, wherein the siloxane-modified maleimide resin has a structure derived from a maleimide resin having one or more N-substituted maleimide groups, and a structure derived from a siloxane compound having two primary amino groups.

3. The glass fiber further comprises SiO ２ The glass fiber contains the Al. ２ O ３ and the SiO ２ The prepreg according to claim 1 or 2, wherein the total content of said components is 70 mass% or more.

4. The prepreg according to claim 1 or 2, wherein the content of the resin composition in the prepreg is 30 to 90 mass %.

5. A laminate comprising the cured prepreg according to claim 1 or 2 and a metal foil.

6. A printed wiring board having a cured product of the prepreg according to claim 1 or 2.

7. A semiconductor package comprising the printed wiring board according to claim 6 and a semiconductor element.

8. A method for producing a printed wiring board, comprising forming through-holes in the cured product of the prepreg according to claim 1 or 2, and then forming a conductor layer in the through-hole by plating.

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