Foldable electronic device including magnetic sensor and method for preventing open / closed recognition malfunction thereof

Abstract

An electronic device according to one embodiment may include instructions that cause a magnetic force sensor to output a first interrupt signal indicating the second state to a first processor and a second processor through an interrupt line when a change in the magnetic force measured by the magnetic force sensor in a state in which the electronic device is recognized as being in a first state satisfies a first recognition condition for changing from the first state to the second state. The memory according to one embodiment may include instructions that cause the second processor to calculate the folding angle between the first housing and the second housing by activating the at least one folding angle sensor and an angle calculation processing unit in response to receiving the first interrupt signal. The memory according to one embodiment may include instructions that cause the first processor or the second processor to maintain the first state recognition when the folding angle is included in a first state condition, and recognize that the electronic device has changed from the first state to the second state when the folding angle deviates from the first state condition.

Description

Foldable electronic device including magnetic sensor and method for preventing malfunction of opening / closing recognition thereof

[0001] The present invention relates to a foldable electronic device including a magnetic sensor and a method for preventing malfunction in opening and closing recognition thereof.

[0002] Electronic devices are evolving to expand their displays or improve their usability to meet the needs of users who desire newer and more diverse functions. For example, electronic devices (e.g., foldable electronic devices) can be implemented in a manner that allows the first and second housings to rotate relative to each other, thereby operating in an in-folding, out-folding, or in / out folding manner.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] Electronic devices (e.g., foldable electronic devices) that are formed to be folded relative to each other based on a folding axis can recognize the open / closed state (e.g., open state, closed state, and intermediate state) of the electronic devices using a magnetic sensor (e.g., a hall sensor). The magnetic sensor can measure a magnetic value (or magnetic force intensity, magnetic force data) according to a distance from a magnetic substance. The electronic device can recognize whether the electronic device is in an open or closed state by comparing the magnetic value detected by the magnetic sensor with an open / closed recognition condition.

[0005] However, the magnetic sensor's magnetic value may change even when an external magnetic body (other than the magnetic body mounted on the electronic device or the internal magnetic body) approaches the magnetic sensor to interact with the magnetic sensor. Since the magnetic value of the external magnetic body varies depending on the size or type, it may be difficult for the electronic device to distinguish each approach of the external magnetic body.

[0006] Changes in the magnetic sensor caused by external magnetic materials may be included in the open / closed recognition conditions, which may result in open / closed recognition errors (e.g., currently recognized as open or closed) during the operation of the electronic device. Furthermore, even when the electronic device is open, the approach of an external magnetic material may cause the device to be mistakenly recognized as closed, which may result in malfunctions in functions that depend on the electronic device's state (e.g., the function that ends a call when switching to the closed state during a call).

[0007] Various embodiments provide a method and device for preventing malfunctions due to recognition of opening and closing of an electronic device by determining whether a magnetic change is an intended magnetic change or an unintended magnetic change using folding angle sensors utilized for switching a display screen.

[0008] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0009] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0010] An electronic device according to one embodiment may include a first housing and a second housing foldably coupled to the first housing. The electronic device according to one embodiment may include a first magnetic body disposed in the first housing and a second magnetic body disposed in the second housing. The electronic device according to one embodiment may include a magnetic sensor that detects a change in magnetic force according to a distance between the first magnetic body and the second magnetic body. The electronic device according to one embodiment may include at least one folding angle sensor that detects a folding angle between the first housing and the first housing. The electronic device according to one embodiment may include a first processor connected to the magnetic sensor via a first data line that transmits data of the magnetic sensor and an interrupt line that transmits an interrupt signal when a magnetic condition according to a magnetic change is satisfied. The electronic device according to one embodiment may include a second processor and a memory that are connected to the magnetic sensor via a second data line that branches from a node of the interrupt line and transmits data of the at least one folding angle sensor. In one embodiment, the memory may include instructions that, when executed, cause the magnetic sensor to output a first interrupt signal indicating the second state to the first processor and the second processor through the interrupt line when a change in magnetic force measured by the magnetic sensor in a state in which the electronic device is recognized as a first state satisfies a first recognition condition for changing from the first state to the second state. In one embodiment, the memory may include instructions that cause the second processor to activate the at least one folding angle sensor and an angle calculation processing unit in response to receiving the first interrupt signal to calculate a folding angle between the first housing and the second housing.According to one embodiment, the memory may include instructions that cause the first processor or the second processor to maintain recognition of the first state when the folding angle is included in the first state condition, and to cause the electronic device to recognize that the first state has been changed to the second state when the folding angle is outside the first state condition.

[0011] A method for preventing an open / close recognition malfunction of an electronic device according to one embodiment may include an operation in which, when a change in magnetic force measured by a magnetic sensor in a state in which the electronic device is recognized as a first state satisfies a first recognition condition for changing from the first state to the second state, the magnetic sensor outputs a first interrupt signal indicating the second state to a first processor and a second processor through the interrupt line. A method according to one embodiment may include an operation in which, in response to the second processor receiving the first interrupt signal, the second processor activates the at least one folding angle sensor and the angle calculation processing unit to calculate a folding angle between the first housing and the second housing. A method according to one embodiment may include an operation in which, when the folding angle is included in the first state condition, the first processor or the second processor maintains the first state recognition. A method according to one embodiment may include an operation in which, when the folding angle deviates from the first state condition, the electronic device recognizes that it has changed from the first state to the second state.

[0012] The electronic device of the present invention may include a computer-readable recording medium having recorded thereon a program for implementing a method for preventing opening / closing recognition malfunction.

[0013] According to various embodiments, by transmitting an interrupt signal of a magnetic sensor that determines the open / closed state (e.g., open state, closed state, or intermediate state) of an electronic device to a processing unit (e.g., auxiliary processor, sensor hub) that controls folding angle calculation, the open / closed state can be monitored (or re-determined) through folding angle calculation without delay and the open / closed state can be stably determined without error.

[0014] According to various embodiments, the folding angle sensor can be activated without the involvement of the main processor or application processor, and the folding angle sensor can be used to recognize the opening and closing of an electronic device to determine whether a change in magnetic force is an intended change or an unintended change.

[0015] According to various embodiments, by reliably recognizing the opening / closing information of an electronic device, malfunction due to misrecognition of the electronic device status can be prevented.

[0016] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0017] In addition, the effects that can be obtained or expected from various embodiments of this document may be disclosed directly or implicitly in the detailed description of the embodiments of this document.

[0018] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0019] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0020] FIG. 2A is a front perspective view of an electronic device illustrating a folded state (or unfolded state) according to one embodiment.

[0021] FIG. 2b is a plan view showing the front of the electronic device in an unfolded state according to one embodiment.

[0022] FIG. 2c is a plan view illustrating the rear surface of an electronic device in an unfolded state according to one embodiment.

[0023] FIG. 3A is a perspective view of an electronic device illustrating a folding state according to one embodiment.

[0024] FIG. 3b is a perspective view of an electronic device illustrating an intermediate state according to one embodiment.

[0025] Figure 4 is an exploded perspective view of an electronic device according to one embodiment.

[0026] FIG. 5 is a diagram showing the arrangement of a magnetic sensor, magnetic materials, and folding angle sensor included in an electronic device according to one embodiment.

[0027] FIG. 6 illustrates configurations of an open / close recognition structure of an electronic device according to one embodiment.

[0028] FIG. 7 illustrates a graph showing a change in magnetic force according to a folder angle when an electronic device according to one embodiment transitions from an open state to a closed state.

[0029] FIG. 8A and FIG. 8B are flowcharts of a method for preventing malfunction of an electronic device recognition including a magnetic sensor according to one embodiment.

[0030] FIG. 9 illustrates configurations of an opening / closing recognition structure of an electronic device according to one embodiment.

[0031] FIG. 10 is a flowchart of a method for preventing malfunction of an electronic device recognition including a magnetic sensor according to one embodiment.

[0032] FIG. 11 is a flowchart of a method for preventing malfunction of an electronic device recognition including a magnetic sensor according to one embodiment.

[0033] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0034] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0035] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment.

[0036] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0037] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0038] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0039] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0044] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0045] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0049] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0051] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0054] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0055] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0056] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] FIG. 2A is a front perspective view of an electronic device in a folded state according to various embodiments of the present disclosure. FIG. 2B is a plan view illustrating a front side of the electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 2C is a plan view illustrating a rear side of the electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 3A is a perspective view of an electronic device in a folded state according to various embodiments of the present disclosure. FIG. 3B is a perspective view of an electronic device in an intermediate state according to various embodiments of the present disclosure.

[0059] Referring to FIGS. 2A to 3B , an electronic device (101) (e.g., a foldable electronic device) may include a first housing (210) (e.g., a first housing portion or a first housing structure) and a second housing (220) (e.g., a second housing portion or a second housing structure) that are foldably coupled to each other based on a hinge device (e.g., a hinge assembly (HA) of FIG. 2B ) (e.g., a hinge module or a hinge structure) (e.g., a hinge assembly (HA) of FIG. 5 ). In one embodiment, the first housing (210), the second housing (220), and the hinge device (e.g., the hinge assembly (HA) of FIG. 2B ) may include a foldable housing (e.g., a housing, a foldable housing structure, or a housing structure). In one embodiment, the hinge device (e.g., the hinge assembly (HA) of FIG. 2B ) may be arranged in the x-axis direction or the y-axis direction. In one embodiment, the electronic device (101) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) disposed in a region (e.g., a recess) formed by the first and second housings (210, 220). In one embodiment, the first housing (210) and the second housing (220) may be disposed on opposite sides of a folding axis (F) and may have a shape that is substantially symmetrical with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (210) and the second housing (220) may vary depending on a state of the electronic device (101). For example, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device is in an unfolded state (flat state), a folded state (folding state), or an intermediate state.

[0060] According to various embodiments, the first housing (210) may include a first surface (211) facing a first direction (e.g., front direction) (z-axis direction) and a second surface (212) facing a second direction (e.g., rear direction) (-z-axis direction) opposite to the first surface (211) in an unfolded state of the electronic device (101). In one embodiment, the second housing (220) may include a third surface (221) facing the first direction (z-axis direction) and a fourth surface (222) facing the second direction (-z-axis direction) in an unfolded state of the electronic device (101). In one embodiment, in an unfolded state of the electronic device (101), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may face substantially the same first direction (z-axis direction). In one embodiment, in a folded state of the electronic device (101), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may face each other. In one embodiment, in an unfolded state of the electronic device (101), the second side (212) of the first housing (210) and the fourth side (222) of the second housing (220) may face substantially the same second direction (- z-axis direction). In one embodiment, in a folded state of the electronic device (101), the second side (212) of the first housing and the fourth side (222) of the second housing (220) may face opposite directions. For example, in a folded state of the electronic device (101), the second side (212) may face the first direction (z-axis direction) and the fourth side (222) may face the second direction (- z-axis direction). In this case, the first display (230) may not be visible from the outside (in folding mode). In one embodiment, the electronic device (101) may be folded so that the second side (212) of the first housing (210) and the fourth side (222) of the second housing (220) face each other. In this case, the first display (230) may be arranged to be visible from the outside (out folding mode).

[0061] According to various embodiments, the first housing (210) (e.g., the first housing structure) may include a first side member (213) that at least partially forms an exterior of the electronic device (101), and a first rear cover (214) that is coupled with the first side member (213) and forms at least a portion of a second side (212) of the electronic device (101). In one embodiment, the first side member (213) may include a first side surface (213a), a second side surface (213b) that extends from one end of the first side surface (213a), and a third side surface (213c) that extends from the other end of the first side surface (213a). In one embodiment, the first side member (213) may be formed into a rectangular (e.g., square or rectangular) shape through the first side surface (213a), the second side surface (213b), and the third side surface (213c).

[0062] According to various embodiments, the second housing (220) (e.g., the second housing structure) may include a second side member (223) that at least partially forms an exterior of the electronic device (101), and a second rear cover (224) that is coupled with the second side member (223) and forms at least a portion of a fourth side (222) of the electronic device (101). In one embodiment, the second side member (223) may include a fourth side (223a), a fifth side (223b) that extends from one end of the fourth side (223a), and a sixth side (223c) that extends from the other end of the fourth side (223a). In one embodiment, the second side member (223) may be formed into a rectangular shape through the fourth side (223a), the fifth side (223b), and the sixth side (223c).

[0063] According to various embodiments, the first and second housings (210, 220) are not limited to the shapes and combinations shown, and may be implemented by combinations and / or combinations of other shapes or parts. In one embodiment, the first side member (213) may be formed integrally with the first rear cover (214), and the second side member (223) may be formed integrally with the second rear cover (124).

[0064] According to various embodiments, in the unfolded state of the electronic device (101), the second side (213b) of the first side member (213) and the fifth side (223b) of the second side member (223) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (101), the third side (213c) of the first side member (213) and the sixth side (223c) of the second side member (223) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (101), the sum of the lengths of the second side (213b) and the fifth side (223b) may be configured to be longer than the lengths of the first side (213a) and / or the fourth side (223a). In one embodiment, in the unfolded state of the electronic device (101), the sum of the lengths of the third side (213c) and the sixth side (223c) may be configured to be longer than the lengths of the first side (213a) and / or the fourth side (223a).

[0065] Referring to FIGS. 3A and 3B , the first side member (213) and / or the second side member (223) may be formed of metal or may further include a polymer that is injected into the metal. In one embodiment, the first side member (213) and / or the second side member (223) may also include at least one conductive portion (216 and / or 226) that is electrically segmented through at least one segment (2161, 2162 and / or 2261, 2262) formed of polymer. In such a case, the at least one conductive portion (216 and / or 226) may be used as at least a portion of an antenna that operates in at least one designated band (e.g., a legacy band or a new radio (NR) band) by being electrically connected to a wireless communication circuit included in the electronic device (101).

[0066] According to various embodiments, the first rear cover (214) and / or the second rear cover (224) may be formed of, for example, at least one or a combination of at least two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0067] According to various embodiments, the first display (230) may be arranged to extend from a first surface (211) of the first housing (210) across a hinge device (e.g., a hinge assembly (HA) of FIG. 2B) to at least a portion of a third surface (221) of the second housing (220). In one embodiment, the first display (230) may include a first region (230a) substantially corresponding to the first surface (211), a second region (230b) substantially corresponding to the second surface (212), and a third region (230c) (e.g., a folding region or a bendable region) connecting the first region (230a) and the second region (230b). In one embodiment, the third region (230c) may be disposed at a position corresponding to a hinge device (e.g., the hinge assembly (HA) of FIG. 2B) as a part of the first region (230a) and / or the second region (230b). In one embodiment, the electronic device (101) may include a hinge housing (241) (e.g., a hinge cover) that supports the hinge device (e.g., the hinge assembly (HA) of FIG. 2B). In one embodiment, the hinge housing (241) may be disposed so that at least a portion thereof is visually exposed to the outside when the electronic device (101) is in a folded state, and is inserted into the internal space of the first housing (210) and the internal space of the second housing (220) when the electronic device (101) is in an unfolded state, thereby being invisible from the outside.

[0068] According to various embodiments, the electronic device (101) may include a second display (231) (e.g., a sub-display) disposed separately from the first display (230). In one embodiment, the second display (231) may be disposed so as to be at least partially visually exposed on the second surface (212) of the first housing (210). In one embodiment, when the electronic device (101) is in a folded state, the second display (231) may replace at least a portion of the display function of the first display (230) to display at least a portion of the status information of the electronic device (101). In one embodiment, the second display (231) may be disposed so as to be visible from the outside through at least a portion of the first rear cover (214). In one embodiment, the second display (231) may also be disposed on the fourth surface (222) of the second housing (220). In this case, the second display (231) may be arranged so as to be visible from the outside through at least a portion of the second rear cover (224).

[0069] According to various embodiments, the electronic device (101) may include at least one of an input device (203) (e.g., a microphone), an audio output device (201, 202), a sensor module (204), a camera device (205, 208), a key input device (206), or a connector port (207). In the illustrated embodiment, the input device (203) (e.g., a microphone), an audio output device (201, 202), a sensor module (204), a camera device (205, 208), a key input device (206), or a connector port (207) is illustrated as a hole or a circular element formed in the first housing (210) or the second housing (220), but this is an exemplary illustration for description and is not limited thereto. According to various embodiments, the input device (203) may include at least one microphone (203) disposed in the second housing (220). In one embodiment, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. In one embodiment, the plurality of microphones (203) may be arranged at appropriate locations in the first housing (210) and / or the second housing (220). In one embodiment, the audio output device (201, 202) may include at least one speaker (201, 202). In one embodiment, the at least one speaker (201, 202) may include a call receiver (201) arranged in the first housing (210) and a speaker (202) arranged in the second housing (220). In one embodiment, the input device (203), the audio output device (201, 202), and the connector port (207) are arranged in a space provided in the first housing (210) and / or the second housing (220) of the electronic device (101), and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, at least one connector port (207) can be used to transmit and receive power and / or data with an external electronic device.In one embodiment, at least one connector port (e.g., an ear jack hole) may accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with an external electronic device. In one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be used in common for the input device (203) and the audio output devices (201, 202). In one embodiment, the audio output devices (201, 202) may include a speaker (e.g., a piezo speaker) that is not exposed through the holes formed in the first housing (210) and / or the second housing (220).

[0070] According to various embodiments, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. In one embodiment, the sensor module (204) may detect an external environment through a first surface (211) of the first housing (210). In one embodiment, the electronic device (101) may further include at least one sensor module arranged to detect an external environment through a second surface (212) of the first housing (210). In one embodiment, the sensor module (204) (e.g., an illuminance sensor) may be arranged under the first display (230) to detect an external environment through the first display (230). In one embodiment, the sensor module (204) may include at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an ambient light sensor (204).

[0071] According to various embodiments, the camera devices (205, 208) may include a first camera device (205) (e.g., a front camera device) disposed on a first side (211) of a first housing (210) and a second camera device (208) disposed on a second side (212) of the first housing (210). In one embodiment, the electronic device (101) may further include a flash (209) disposed near the second camera device (208). In one embodiment, the camera devices (205, 208) may include at least one lens, an image sensor, and / or an image signal processor. In one embodiment, the camera device (205, 208) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and two or more image sensors are positioned on one side of the electronic device (101) (e.g., a first side (211), a second side (212), a third side (121), or a fourth side (122)). In one embodiment, the camera device (205, 208) may also include lenses and / or image sensors for time of flight (TOF).

[0072] According to various embodiments, the key input device (206) (e.g., a key button) may be disposed on a third side (213c) of the first side member (213) of the first housing (210). In one embodiment, the key input device (206) may also be disposed on at least one of the other side surfaces (213a, 213b) of the first housing (210) and / or the side surfaces (223a, 223b, 223c) of the second housing (220). In one embodiment, the electronic device (101) may not include some or all of the key input devices (206), and the key input devices (206) that are not included may be implemented in another form, such as a soft key, on the first display (230). In one embodiment, the key input device (206) may also be implemented using a pressure sensor included in the first display (230).

[0073] According to various embodiments, some of the camera devices (205, 208) (e.g., the first camera device (205)) or the sensor module (204) may be arranged to be visually exposed through the first display (230). In one embodiment, the first camera device (205) or the sensor module (204) may be optically exposed to the outside through an opening (e.g., a through hole) at least partially formed in the first display (230) in the internal space of the electronic device (101). In one embodiment, at least a portion of the sensor module (204) may be arranged to not be visually exposed through the first display (230) in the internal space of the electronic device (101). Referring to FIG. 3B, the electronic device (101) may be operable to maintain at least one designated folding angle in an intermediate state through a hinge device (e.g., the hinge assembly (HA) of FIG. 2B). For example, the electronic device (101) can control the first display (230) to display different contents in the display area corresponding to the first side (211) and the display area corresponding to the third side (221). In one embodiment, the electronic device (101) can operate in a substantially unfolded state (e.g., the unfolded state of FIG. 2A) and / or a substantially folded state (e.g., the folded state of FIG. 3A) based on a predetermined folding angle (e.g., the angle between the first housing (210) and the second housing (220) when the electronic device (101) is in an intermediate state) through a hinge device (e.g., the hinge assembly (HA) of FIG. 2B). In one embodiment, the electronic device (101) can be operated to transition from an unfolded state (e.g., the unfolded state of FIG. 2a) to an unfolded state (e.g., the unfolded state of FIG. 2a) when a pressure is applied in the unfolding direction (direction A) from an unfolded state at a constant folding angle through a hinge device (e.g., the hinge assembly (HA) of FIG. 2b).In one embodiment, the electronic device (101) can be operated to transition to a folded state (e.g., the folded state of FIG. 3a) when a pressure is applied in a folding direction (direction B) from an unfolded state at a predetermined folding angle through a hinge device (e.g., the hinge assembly (HA) of FIG. 2b). In one embodiment, the electronic device (101) can be operated to maintain an unfolded state (not shown) at various folding angles through a hinge device (e.g., the hinge assembly (HA) of FIG. 2b) (free stop function).

[0074] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0075] Referring to FIG. 4, the electronic device (101) may include a first side member (213) (e.g., a first side frame), a second side member (223) (e.g., a second side frame), and a hinge assembly (HA) (e.g., the hinge assembly (HA) of FIG. 2B) (e.g., a hinge device, a hinge module, or a hinge structure) that rotatably connects the first side member (213) and the second side member (223). In one embodiment, the electronic device (101) may include a first support member (2131) (e.g., a first support plate) that extends at least partially from the first side member (213), and a second support member (2231) (e.g., a second support plate) that extends at least partially from the second side member (223). In one embodiment, the first support member (2131) may be formed integrally with the first side member (213) or structurally coupled with the first side member (213). In one embodiment, the second support member (2231) may be formed integrally with the second side member (223) or structurally coupled with the second side member (223). In one embodiment, the first display (230) may be arranged to be supported by the first support member (2131) and the second support member (2231). In one embodiment, the electronic device (101) may include a first rear cover (214) coupled with the first side member (213) and providing a first space between the first support member (2131) and the second side member (223), and a second rear cover (224) coupled with the second side member (223) and providing a second space between the second support member (2231). In one embodiment, the first side member (213) and the first rear cover (214) may be formed integrally. In one embodiment, the second side member (223) and the second rear cover (124) may be formed integrally. In one embodiment, the first housing (210) may include the first side member (213), the first support member (2131), and the first rear cover (214). In one embodiment, the second housing (220) may include the second side member (223), the second support member (2231), and the second rear cover (224).In one embodiment, the electronic device (101) may include a second display (231) that is arranged to be visible from the outside through at least a portion of the first rear cover (214).

[0076] According to various embodiments, the electronic device (101) may include a first substrate (261) (e.g., a first substrate assembly or a main printed circuit board), a camera assembly (263), a first battery (271), or a first bracket (251) disposed in a first space between a first side member (213) and a first rear cover (214). In one embodiment, the camera assembly (263) may include a plurality of camera devices (e.g., the camera devices (205, 208) of FIGS. 2A and 3A) and may be electrically connected to the first substrate (261). In one embodiment, the first bracket (251) may provide a support structure and improved rigidity for supporting the first substrate (261) and / or the camera assembly (263). In one embodiment, the electronic device (101) may include a second substrate (262) (e.g., a second substrate assembly or a sub-printed circuit board), an antenna (290) (e.g., a coil member), a second battery (272), or a second bracket (252) disposed in a second space between the second side member (223) and the second rear cover (224). In one embodiment, the electronic device (101) may include a wiring member (280) (e.g., a flexible printed circuit board (FPCB)) that extends from the first substrate (261) across the hinge assembly (HA) to a plurality of electronic components (e.g., a second substrate (262), a second battery (272), or an antenna (290)) disposed between the second side member (223) and the second rear cover (224) and provides an electrical connection. In one embodiment, the antenna (290) may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna.

[0077] According to various embodiments, the electronic device (101) may include a first protective cover (215) (e.g., a first protective frame or a first decorative member) coupled along an edge of a first housing (210) and a second protective cover (225) (e.g., a second protective frame or a second decorative member) coupled along an edge of a second housing (220). In one embodiment, the first protective cover (215) and / or the second protective cover (225) may be formed of a metal or polymer material. In one embodiment, the first protective cover (215) and / or the second protective cover (225) may be used as a decoration member. In this case, the first display (230) may be arranged so that the edge of the first region (e.g., the first region (230a) of FIG. 2B) is not visually visible from the outside between the first housing (210) and the first protective cover (215). In one embodiment, the first display (230) may be positioned so that the edge of the second region (e.g., the second region (230b) of FIG. 2B) is not visually visible from the outside between the second housing (220) and the second protective cover (225). In some embodiments, the first protective cover (215) and / or the second protective cover (225) may be omitted.

[0078] According to various embodiments, the electronic device (101) may include a protective structure (135) positioned to protect the edge of the third area (e.g., the third area (230c) of FIG. 2B) of the first display (230). In this case, the edge of the first display (230) may be protected by the protective structure (235) positioned at a position corresponding to the folding area (e.g., the folding area (230c) of FIG. 2B). In some embodiments, the protective structure (235) may be omitted.

[0079] According to various embodiments, the first support member (2131) may include a first support surface (2131a) facing a first direction (z-axis direction) and a second support surface (2131b) facing a second direction (-z-axis direction) opposite to the first direction. In one embodiment, the second support member (2231) may include a third support surface (2231a) facing the first direction (z-axis direction) and a fourth support surface (2231b) facing the second direction (-z-axis direction) when the electronic device (101) is in an unfolded state. In one embodiment, the first display (230) may be arranged to be supported by the first support surface (2131a) of the first support member (2131) and the third support surface (2231a) of the second support member (2231).

[0080] FIG. 5 is a diagram showing the arrangement of a magnetic sensor, magnetic materials, and folding angle sensor included in an electronic device according to one embodiment.

[0081] An electronic device (101) according to one embodiment may be a foldable electronic device including a first housing (210) and a second housing (220) that is openable or closable and connected to the first housing (210), as illustrated in FIGS. 2A to 4 . For example, the electronic device (101) may include all or at least a portion of the components of the electronic device (101) as described in the description with reference to FIGS. 2A to 4 .

[0082] According to one embodiment, the electronic device (101) may include a magnetic sensor (520) (e.g., a hall sensor) for detecting whether the electronic device is in a folded state, magnetic bodies (M1 (512), M2 (512), M3 (513), M4 (514)) for fixing the first housing (210) and the second housing (220), a first folding angle sensor (530) (e.g., a 6-axis sensor) for calculating a folding angle, and a second folding angle sensor (535) (e.g., a 6-axis sensor).

[0083] The first housing (210) and the second housing (220) can maintain the folded state through the attractive force acting between the magnetic bodies in the folded state. For example, the first magnet (M1) and the second magnet (M2) can be arranged in the first housing (210), and the third magnet (M2) and the fourth magnet (M4) can be arranged in the second housing (220). When the electronic device (101) is in the closed state, the attractive force can be applied while at least a part of the first magnet (M1) (511) and the second magnet (M2) (512) are arranged to face each other, and at least a part of the third magnet (M3) (513) and the fourth magnet (M4) (514) are arranged to face each other.

[0084] In one embodiment, the magnetic sensor (520) may be positioned adjacent to the second magnet (512), but is not limited thereto. In the example of FIG. 5, the second magnet (512) or the first magnet (511) continuously or fixedly supplies magnetic force to the magnetic sensor (520), and the fourth magnet (514) or the third magnet (513) may change the distance from the magnetic sensor (250) depending on the open / closed state of the electronic device (101) to supply additional magnetic force and magnetic flux values ​​to the magnetic sensor.

[0085] According to one embodiment, the electronic device (101) can determine the open / closed state (e.g., open state / closed state) of the electronic device (101) based on the change in magnetic force measured by the magnetic sensor (520). For example, the electronic device (101) can set a first recognition condition (e.g., about 0 uT) for determining the open state of the electronic device (101) and a second recognition condition (e.g., when the magnetic force is about 3000 uT in the closed state, if it exceeds about 2100 uT, it is recognized as a closed state) in relation to the magnetic force value.

[0086] The magnetic sensor (520) can output an interrupt signal indicating a closed state when the magnetic change measured by the magnetic sensor (520) satisfies a first recognition condition, and can output an interrupt signal indicating an open state when the magnetic change measured by the magnetic sensor (520) satisfies a second recognition condition.

[0087] The electronic device (101) can recognize the open / closed state of the electronic device (101) according to an interrupt signal transmitted from the magnetic sensor (520).

[0088] However, in the case of the electronic device exemplified by Fig. 5, even if an external magnetic body other than the fourth magnet (514) approaches the electronic device (101) around the second magnet (512) located near the magnetic sensor (520), the magnetic value of the magnetic sensor (520) may change to satisfy the magnetic condition when in the closed state. As a result, the electronic device (101) may misrecognize the open state of the electronic device (101) as a closed state due to the external magnetic body, which may cause malfunction of the electronic device.

[0089] Hereinafter, various embodiments will describe a method and device for preventing malfunctions due to recognition of the opening and closing of an electronic device by monitoring (or determining) whether a magnetic change is an intended or unintended magnetic change using folding angle sensors that calculate a folding angle in addition to a magnetic sensor, and will focus on illustrating a structure for recognizing the opening and closing state of an electronic device.

[0090] FIG. 6 illustrates configurations of an open / close recognition structure of an electronic device according to one embodiment.

[0091] Referring to FIG. 6, an electronic device (101) according to one embodiment may be a foldable electronic device including a first housing (210) and a second housing (220) that is openably or closably connected to the first housing (210), as illustrated in FIGS. 2A to 4.

[0092] The electronic device (101) may include a magnetic sensor (610) (e.g., a magnetic sensor (520) of FIG. 5), a first folding angle sensor (620) (e.g., a first folding angle sensor (530) of FIG. 5), a second folding angle sensor (630) (e.g., a second folding angle sensor (535) of FIG. 5), and a processor (640) (e.g., a processor (120) of FIG. 1). The illustrated configurations of FIG. 6 are merely examples, and in addition to the illustrated configurations, the electronic device (101) may further include at least some of the configurations and functions of FIGS. 1, 2A to 4.

[0093] According to one embodiment, the magnetic sensor (610) may be designed to determine whether the electronic device (101) is in a folded state. The first folding angle sensor (620) and the second folding angle sensor (630) may be designed to determine the folding angle for switching a user interface (UI) corresponding to the display form.

[0094] In the present disclosure, the first folding angle sensor (620) and the second folding angle sensor (630) may be additionally designed for the purpose of monitoring (or determining) the folding state to determine whether the magnetic change is an intended magnetic change or an unintended magnetic change.

[0095] According to one embodiment, the magnetic sensor (610) is connected to the processor (640) or the first MCU (650) through a first data line (660) that transmits a magnetic value (e.g., magnetic data) of the magnetic sensor and an interrupt line (or signal line) (680) that transmits an interrupt signal when a magnetic condition is satisfied according to the state of the electronic device (101), and may be connected to the second MCU (655) through a line branched from one node of the interrupt line (680).

[0096] The magnetic sensor (610) can recognize changes in magnetic force / magnetic field that occur between magnetic bodies (e.g., objects having magnetic force) (e.g., the second magnet and / or the fourth magnet of FIG. 5). For example, the magnetic sensor (610) can measure (or sense, detect) magnetic values ​​(e.g., magnetic data, magnetic field strength) based on the proximity or distance between magnetic bodies, and transmit the measured magnetic values ​​to the first MCU (650) via the first data line (660).

[0097] The magnetic sensor (610) can output an interrupt signal to the first MCU (650) and the second MCU (655) through an interrupt line depending on whether the magnetic change in the magnetic value satisfies (or corresponds to) the open / closed state recognition condition. For example, if the magnetic change in the magnetic value corresponds to (or satisfies) the first recognition condition in which the magnetic change changes from the first state to the second state, the magnetic sensor (610) can output (or transmit) a first interrupt signal to the first MCU (650) and the second MCU (655) through the interrupt line (680), and if the magnetic change in the magnetic value corresponds to (or satisfies) the second recognition condition in which the magnetic change changes from the second state to the first state, the magnetic sensor (610) can output (or transmit) a second interrupt signal to the first MCU (650) and the second MCU (655).

[0098] According to one embodiment, the magnetic sensor (610) (e.g., hall IC) may be implemented as a digital hall sensor. When the magnetic sensor (610) is implemented as a digital hall sensor, the configuration of the magnetic sensor may include at least one of a converter (e.g., buck-boost converter) (611) that converts an external voltage into an internal voltage, a hall element (or hall material) (613) that generates a hall effect (e.g., a phenomenon in which a potential difference is generated in a direction perpendicular to the current within a conductor through which current flows when a magnetic field is formed perpendicular to the direction of the current in a state in which current flows in the conductor), a CPU (612) that transmits the axis-specific voltage value transmitted from the hall element (613) or performs data calculations, an analog-digital converter (ADC) (614) that converts an analog signal into a digital signal, and / or an interface block (615).

[0099] According to one embodiment, when the magnetic sensor (610) is a digital Hall sensor, recognition conditions (e.g., first recognition conditions and second recognition conditions) of the open / closed state can be set based on the magnetic values ​​of one axis among the magnetic values ​​of the x-axis, y-axis, and z-axis in which a large difference in magnetic force occurs depending on the open / closed state of the electronic device (101). The recognition conditions may also be referred to as reference conditions, reference values, or threshold values.

[0100] The magnetic sensor (610) can output an interrupt signal to the first MCU (650) and the second MCU (655) through the interrupt line (680) when the recognition condition is satisfied according to the change in the magnetic force of one set axis.

[0101] The example of Fig. 7 shows a graph showing the change in magnetic force according to the folder angle when the electronic device (11) is switched from an open state to a closed state. Looking at the graph of Fig. 7, it can be confirmed that the difference in magnetic force change corresponding to the x-axis (720), y-axis (710), and z-axis (730) is the largest in the x-axis (720). If the difference (delta) in magnetic force change for this is displayed in a diagram, it can be as shown in Table 1. For example, the x-axis may be an axis along which the housings of the electronic device are folded, such as the electronic device illustrated in Figs. 2a and 2c, the y-axis may be an axis orthogonal to the x-axis in a plane, and the z-axis may be an axis orthogonal in space. The magnetic force value may be in uT units, but is not limited thereto.

[0102] Magnetic force change when opening and closing uTXYZopen-65401395-6054close-274041-4839delta3800-13541215

[0103] As illustrated in FIG. 7 and Table 1, it can be confirmed that one axis in which a large difference in magnetic force occurs when the state of the electronic device (101) changes (from the open state to the closed state) is the X-axis. The electronic device (101) can set a first recognition condition (or a first reference value) for determining the closed state of the electronic device and a second recognition condition (or a second reference value) for determining the open state based on the magnetic range and pattern of the X-axis. In one embodiment, since the first recognition condition and the second recognition condition can be set for each axis, they can be set based on the axis in which a large difference in magnetic force occurs depending on the folding direction of the electronic device (101). Hereinafter, an example in which the recognition condition for the open / closed state is set to a magnetic value corresponding to the X-axis will be described, but the recognition condition for the open / closed state may also be set to a magnetic value corresponding to the X-axis or the Z-axis.

[0104] According to one embodiment, the electronic device (101) may be configured so that, in addition to the first axis set as the recognition condition of the open / closed state (e.g., the first reference value and the second reference value), the change patterns (or ranges and aspects) of the other second and third axes are used for monitoring the open / closed state. For example, the electronic device (101) may determine whether the approach of a magnetic body is an external magnetic body through the change patterns of the magnetic force values ​​in the x-axis, y-axis, and z-axis.

[0105] According to one embodiment, the magnetic sensor (610) can transmit the measured magnetic values, i.e., the magnetic values ​​on the x-axis, y-axis, and z-axis, to the first MCU (650) through the first data line (660). Based on the reception of an interrupt signal through the interrupt line, the first MCU (650) can compare the change patterns (or ranges and aspects) of the other second and third axes, in addition to the first axis set as the recognition conditions of the open / closed state (e.g., the first reference value and the second reference value), with the magnetic changes stored in the memory (e.g., the change data of the y-axis and z-axis of FIG. 7 and Table 1), to determine whether the magnetic forces of the two axes (e.g., in addition to the set first axis, the other second and third axes) are similar to the current magnetic change. The first MCU (650) may recognize an unintended change in magnetic force due to the approach of an external magnetic body of the two axes when the magnetic force changes of the two axes are not similar in pattern or when the magnetic force values ​​of the second and third axes do not satisfy the recognition condition of the second state, and may request folding angle calculation to the second MCU (650). The second MCU (655) may activate (or turn on) at least one of the first folding angle sensor (620), the second folding angle sensor (630), and the angle calculation processing unit (not shown) (or angle calculation module, angle calculation core) in response to receiving an interrupt signal. For example, the angle calculation processing unit may be at least some cores, blocks, or elements included in the second MCU (655), but is not limited thereto. The first folding angle sensor (620) or the second folding angle sensor (630) can measure angular velocity changes and acceleration changes related to the movement of the electronic device (101) under the control of the second MCU (655), or measure folding angle changes and transmit the measured data (e.g., acceleration / angular velocity data) to the processor (640) or the second MCU (655) via the second data line (670).For example, the electronic device (101) may include a first folding angle sensor (620) in the first housing (210) and a second folding angle sensor (630) in the second housing (220). The first folding angle sensor (620) may detect angular velocity changes and acceleration changes related to the movement of the first housing (210), and the second folding angle sensor (630) may measure (or detect, sense, sense) angular velocity changes and acceleration changes related to the movement of the second housing (220).

[0106] The first folding angle sensor (620) or the second folding angle sensor (630) (e.g., a 6-axis sensor) may be configured with a combination of at least two of an acceleration sensor, an angular velocity sensor (e.g., a gyroscope sensor), or a geomagnetic sensor. The acceleration sensor is a sensor that detects the speed of an object, and the gyroscope sensor can detect the angular velocity, which is the rotational speed of the object. The geomagnetic sensor can detect the geomagnetic direction of the object.

[0107] For example, the first folding angle sensor (620) includes a converter (e.g., a buck-boost converter) (621) that converts an external voltage into an internal voltage, a gyro / acceleration structure (623), a block (e.g., a flier, a multiplexer, an ADC converter) (622) that processes data from the gyro / acceleration structure (623), a computation block (e.g., a core) (624) and / or an interface block (625), and the second folding angle sensor (630) includes a converter (e.g., a buck-boost converter) (631) that converts an external voltage into an internal voltage, a gyro / acceleration structure (633), a block (e.g., a flier, a multiplexer, an ADC converter) (632) that processes data from the gyro / acceleration structure, a computation block (e.g., a core) (634) and / or an interface block (635), but this is only an example.

[0108] According to one embodiment, the processor (640) controls the operation of the magnetic sensor (610), the first folding angle sensor (620), and the second folding angle sensor (630), and can recognize the opening / closing information (e.g., the opening / closing state and / or the folding angle) of the electronic device (101) based on data acquired from at least one of the magnetic sensor (610), the first folding angle sensor (620), and / or the second folding angle sensor (630). The processor (640) may be the same as the main processor (121) or the application processor (AP) of FIG. 1, or may be included in the main processor of FIG. 1.

[0109] According to one embodiment, the processor (640) can recognize the open or closed state of the electronic device (101) through the first MCU (650) and the second MCU (655), and control the operation of the electronic device (101) based on the open or closed state of the electronic device (101).

[0110] According to one embodiment, the processor (640) may include one or more processing units (or processing cores, processing blocks) to process each component of the electronic device (101).

[0111] In one embodiment, the processor (640) may include a first microcontroller unit (MCU) (650) that operates in an active state (e.g., a state in which the electronic device is powered on and the display is on) or a post-booting operation state of the electronic device (101), and a second MCU (655) that operates in a power-off state in which a charger is electrically connected, a sleep state of the electronic device, or a low-power state before booting. In the case of a foldable electronic device, since an active area of ​​a display to display visual information or a screen is determined based on a recognized open / close state or folding angle, the first MCU (650) and second MCU (655) configurations may be implemented as essential elements.

[0112] In the example of FIG. 6, the first MCU (650) and the second MCU (655) are implemented as included in the processor (640), but at least one of the first MCU (650) and the second MCU (655) may be implemented as a separate configuration from the processor (640).

[0113] The first MCU (650) can obtain a magnetic value (e.g., magnetic data) measured from the magnetic sensor (610) through the first data line (660). The first MCU (650) can determine the open / close state of the electronic device based on an interrupt signal output from the magnetic sensor (610) through an interrupt line (or signal line) (680).

[0114] The second MCU (655) can activate the first folding angle sensor (620) and the second folding angle sensor (630) (e.g., an angle operation processing unit and / or a gyro sensor) in response to receiving an interrupt signal output from the magnetic sensor (610) through an interrupt line (or signal line) (680), and can obtain data (e.g., acceleration / angular velocity data) measured from the first folding angle sensor (620) and the second folding angle sensor (630) through a second data line (670). In this embodiment, the second MCU (655) can control the operation of the first folding angle sensor (620) and the second folding angle sensor (630) instead of a high-performance processing core such as an AP or a CPU.

[0115] Additionally, the processor (640) may further include, but is not limited to, a converter (e.g., a buck-boost converter) (641) that converts an external voltage into internal voltages of components within each processor, a central processing unit (CPU) (642), a graphics processing unit (GPU) (644), a digital signal processor (DSP) (645), an image signal processor (ISP) (646), a modem processor (647), and a memory (643). According to one embodiment, the processing units within the processor (640) may be implemented as independent devices or may be integrated to be included in one processor.

[0116] In the comparative example (or the conventional case), when the first MCU (650) receives an interrupt signal from the magnetic sensor in relation to open / close recognition, the sequence proceeds in which the status message of the electronic device (101) is transmitted to a high-performance core such as an AP or CPU, and the high-performance core controls the second MCU (655) to perform folding angle calculation. However, in the present disclosure, by adopting a structure in which an interrupt signal is output from the magnetic sensor to the second MCU (655), monitoring for errors in the open / close recognition operation can be performed without delay through folding angle calculation.

[0117] FIGS. 8A and 8B are flowcharts of a method for preventing malfunction in open / closed state recognition of an electronic device including a magnetic sensor according to one embodiment. FIG. 8A may refer to an open / closed state recognition process when the electronic device is in an open state, and FIG. 8B may refer to an open / closed state recognition process when the electronic device is in a closed state.

[0118] In the following examples, the operations may be performed sequentially, but are not necessarily sequential. For example, the order of the operations may be changed, and at least two operations may be performed in parallel.

[0119] Referring to FIG. 8A, an electronic device (101) according to one embodiment includes the configurations of FIG. 6, and in operation 810, can detect the approach of a magnetic body in an open state of the electronic device (or an unfolded state of the first housing (210) and the second housing (220). For example, a magnetic sensor (e.g., 520 of FIG. 5, 610 of FIG. 6) can detect a change in a magnetic value due to the approach of a magnetic body.

[0120] When the electronic device is in an open state, the magnetic sensor (610) can output an interrupt high signal indicating a first state to the first MCU (650) and the second MCU (655) through an interrupt line. The processor (120 of FIG. 1, 640 of FIG. 6) or the first MCU (650) can recognize the electronic device as being in an open state by the interrupt high signal. In one example, the interrupt signal indicating the open state is a high signal, and the interrupt signal indicating the closed state is a low signal, but the present invention is not limited thereto.

[0121] In operation 811, the magnetic sensor (610) of the electronic device (101) can determine whether the measured magnetic change satisfies the magnetic condition of the first axis (e.g., first recognition condition, first reference value) set to recognize the closed state.

[0122] For example, the magnetic sensor (610) can measure magnetic values ​​corresponding to the x-axis, y-axis, and z-axis and transmit magnetic data (e.g., magnetic values ​​of the x-axis, y-axis, and z-axis) to the first MCU (650).

[0123] The electronic device (101) may be designed to set the output of an interrupt signal based on a change in magnetic force for one axis, and output the interrupt signal according to the magnetic force recognition condition of the reference axis. For example, when the magnetic force sensor (610) satisfies the magnetic force condition set for the open / closed state recognition for which the change in magnetic force for one axis is set, the magnetic force sensor (610) may output an interrupt signal through the interrupt line (680), and the magnetic force data (e.g., x-axis, y-axis, and z-axis magnetic force values) may be transmitted to the processor (640) or the first MCU (650) through the first data line (660).

[0124] In operation 812, the magnetic sensor (610) of the electronic device (101) can output an interrupt signal as a low signal indicating a closed state when the magnetic condition (e.g., the first recognition condition) set for closed state recognition is satisfied (yes in operation 811).

[0125] In operation 813, if the magnetic sensor (610) of the electronic device (101) does not satisfy the magnetic condition (e.g., the first recognition condition) set for recognition of the closed state (no in operation 811), the magnetic sensor (610) of the electronic device (101) may output an interrupt signal as a high signal indicating an open state. In operation 814, the processor (640) or the first MCU (650) of the electronic device (101) may maintain the recognition of the open / closed state of the electronic device (101) as an open state by the high signal.

[0126] In operation 815, the processor (640) or the first MCU (650) of the electronic device (101) can determine whether the magnetic change of the other second axis and / or third axis that is not linked to the interrupt satisfies the magnetic condition of the closed state.

[0127] For example, the electronic device (101) can store magnetic change data on the y-axis and z-axis according to the change in the state of the electronic device in advance, and compare the currently measured magnetic change with the magnetic change data stored in the memory to determine whether the magnetic change based on one axis is an intended magnetic change or an unintended magnetic change.

[0128] In operation 816, the processor (640) or the first MCU (650) of the electronic device (101) may determine whether the electronic device (101) is in a sleep state if the magnetic condition of the second axis and / or the third axis does not satisfy the magnetic condition set to recognize a closed state (no in operation 815).

[0129] In operation 817, the processor (640) or the first MCU (650) of the electronic device (101) can recognize the open / closed state of the electronic device (101) as the closed state if the change in magnetic force of the second axis and / or the third axis satisfies the magnetic force condition set for recognition of the closed state (yes in operation 815).

[0130] In this case, the electronic device (101) is recognized as being in a closed state based on the first axis, but since the magnetic change pattern (or range and aspect) of the second and third axes is similar to the magnetic change pattern when in the stored closed state, it can be recognized as an intended magnetic change (i.e., a magnetic change due to the attraction of magnetic materials mounted in the electronic device housing) and as a normal operation (i.e., recognized as being in a normally closed state).

[0131] In operation 818, the processor (640) or the first MCU (650) of the electronic device (101) may turn on (or activate) the folding angle sensor (and the angle operation processing unit) if the electronic device (101) is in a sleep state (yes in operation 816), and may skip operation 818 and proceed to operation 819 if the electronic device (101) is not in a sleep state (no in operation 816).

[0132] In operation 819, the processor (640) or the second MCU (655) of the electronic device (101) can calculate the folding angle based on data transmitted from the folding angle sensor through the second data line (670).

[0133] In operation 820, the processor (640) or the second MCU (655) of the electronic device (101) can determine whether the angle between the folding angles is about 10 degrees or more.

[0134] In operation 821, the processor (640) or the second MCU (655) of the electronic device (101) can maintain the open / closed state of the electronic device (101) recognized as the open state when the angle between the folding angles is about 10 degrees or more (yes in operation 820).

[0135] In this case, the electronic device (101) receives a low signal indicating a closed state, but since the folding angle satisfies the open state condition, not the closed state, the electronic device (101) regards the magnetic change generated by the magnetic sensor (610) as an unintended magnetic change and maintains the electronic device state as recognized as an open state, thereby preventing malfunction.

[0136] The processor (640) or the first MCU (650) can control the magnetic sensor (610) to output an interrupt signal as a high signal based on what is recognized as maintaining the electronic device open state.

[0137] In operation 822, the processor (640) or the second MCU (655) of the electronic device (101) can recognize the open / closed state of the electronic device (101) as the closed state when the angle between the folding angles is less than about 10 degrees (no in operation 820). Since the electronic device is recognized as being in the closed state by the magnetic sensor and the folding angle also satisfies the condition of the closed state, the electronic device can ultimately recognize the open / closed state of the electronic device (101) as the closed state.

[0138] Referring to FIG. 8B, an electronic device (101) according to one embodiment can detect the approach of a magnetic body in a closed state of the electronic device (or a closed state of the first housing (210) and the second housing (220)) at operation 830. For example, a magnetic sensor (610) can detect a change in a magnetic value due to the approach of a magnetic body.

[0139] When the electronic device is in a closed state, the magnetic sensor (e.g., hall sensor) can output an interrupt low signal to the first MCU (650) and the second MCU (655) through the interrupt line. The processor (640) or the first MCU (650) can recognize the electronic device as being in a closed state by the low signal.

[0140] In operation 831, the magnetic sensor (610) of the electronic device (101) can determine whether the measured magnetic change satisfies the recognition condition (e.g., second recognition condition, second reference value) of the first axis set to open state recognition.

[0141] In operation 832, if the magnetic sensor (610) of the electronic device (101) satisfies the recognition condition set for open state recognition (yes in operation 831), the interrupt signal can be output as a high signal indicating the open state.

[0142] In operation 833, if the magnetic sensor (610) of the electronic device (101) does not satisfy the recognition condition set for open state recognition (no in operation 831), the interrupt signal may be output as a low signal indicating a closed state. In operation 834, the processor (640) or the first MCU (650) of the electronic device (101) may maintain that the open / closed state of the electronic device (101) is recognized as a closed state.

[0143] In operation 835, the processor (640) or the first MCU (650) of the electronic device (101) may determine whether the magnetic condition of the other second axis and / or third axis that is not linked to the interrupt satisfies the magnetic condition of the open state.

[0144] In operation 836, the processor (640) or the first MCU (650) of the electronic device (101) can recognize the open / closed state of the electronic device (101) as the open state if the magnetic condition of the second axis and / or the third axis satisfies the magnetic condition set to recognize the closed state (yes in operation 835).

[0145] In this case, the electronic device (101) is recognized as being in an open state based on the first axis, but since the magnetic change of the second and third axes is similar to the magnetic change pattern (or range and aspect) when in the stored open state, it can be recognized as an intended magnetic change (i.e., a magnetic change due to the attraction of magnetic materials mounted in the electronic device housing) and as a normal operation (i.e., recognized as being in a normally open state).

[0146] In operation 837, the processor (640) or the first MCU (650) of the electronic device (101) can determine whether the electronic device (101) is in a sleep state if the magnetic change of the second axis and / or the third axis does not satisfy the magnetic condition set for open state recognition (no in operation 835).

[0147] In operation 838, the processor (640) or the first MCU (650) of the electronic device (101) may turn on (or activate) the folding angle sensor (and the angle operation processing unit) if the electronic device (101) is in a sleep state (yes in operation 836), and may proceed to operation 839 if the electronic device (101) is not in a sleep state (no in operation 836).

[0148] In operation 839, the processor (640) or the second MCU (655) of the electronic device (101) can calculate the folding angle based on data measured from the folding angle sensor.

[0149] In operation 840, the processor (640) or the second MCU (655) of the electronic device (101) can determine whether the angle between the folding angles is less than or equal to about 10 degrees.

[0150] In operation 841, the processor (640) or the second MCU (655) of the electronic device (101) can maintain the open / closed state of the electronic device (101) recognized as a closed state when the angle between the folding angles is less than or equal to about 10 degrees (yes in operation 820).

[0151] In this case, the electronic device (101) receives a high signal indicating an open state, but since the folding angle satisfies the closed state condition, not the open state, the electronic device (101) regards the magnetic change generated by the magnetic sensor (610) as an unintended magnetic change and maintains the electronic device state as a closed state, thereby preventing malfunction.

[0152] In operation 842, the processor (640) or the second MCU (655) of the electronic device (101) can recognize the open / closed state of the electronic device (101) as an open state when the angle between the folding angles exceeds about 10 degrees (no in operation 840).

[0153] FIG. 9 illustrates configurations representing an open / close recognition structure of an electronic device according to one embodiment.

[0154] Referring to FIG. 9, according to one embodiment, the magnetic sensor (910) may be implemented as an analog Hall sensor.

[0155] The embodiment of FIG. 6 shows an example in which the magnetic sensor (610) is implemented as a digital Hall sensor, and the ninth embodiment is an example in which the magnetic sensor (910) is implemented as an analog Hall sensor, and since the other components of FIG. 6 are substantially the same as those of FIG. 9, specific details on the functions and components will be omitted. For example, the processor (940), the first folding angle sensor (920), and the second folding angle sensor (930) illustrated in FIG. 9 may be substantially the same as the processor (640), the first folding angle sensor (620), and the second folding angle sensor (630) illustrated in FIG. 6. In addition, the processing blocks (e.g., converter (941), CPU (942), memory (943), GPU (944), DSP (945), ISP (946), modem processor (947), first MCU (950) and second MCU (955) in the processor (940) may be substantially the same as the configuration of FIG. 6. In addition, the converter (e.g., buck-boost converter) (921), gyro / acceleration structure (923), data processing block (e.g., flier, multiplexer, ADC converter) (922), operation block (e.g., core) (924) and interface block (925) included in the first folding angle sensor (920), and the converter (e.g., buck-boost converter) (931), gyro / acceleration structure (933), data processing block (e.g., flier, multiplexer, ADC converter) (932), operation block (e.g., core) (924) and interface block (925) included in the second folding angle sensor (930) It may be substantially identical to the block (e.g., core) (934) and / or the interface block (935).

[0156] According to one embodiment, when the magnetic sensor (910) is implemented as an analog Hall sensor, the magnetic sensor (910) is connected to the first MCU (950) and the second MCU (955) through an interrupt line (980), respectively, and the first data line (660) illustrated in FIG. 6 may be omitted. The second MCU may be structured to be connected to the first folding angle sensor (920) and the second folding angle sensor (930) through a data line (970).

[0157] The magnetic sensor (910) illustrated in FIG. 9 can determine that the magnetic value is in a closed state when a magnetic value greater than or equal to the operating point magnetic flux density (BOP) is measured and output a low interrupt signal to the first MCU (950) and the second MCU (955), and can determine that the magnetic value is in an open state when a magnetic value less than the returning (or release) point magnetic flux density (BRP) is measured and output a high interrupt signal to the first MCU (950) and the second MCU (955).

[0158] FIG. 10 is a flowchart of a method for preventing malfunction in recognizing an open / closed state of an electronic device including a magnetic sensor according to one embodiment.

[0159] In the following examples, the operations may be performed sequentially, but are not necessarily sequential. For example, the order of the operations may be changed, and at least two operations may be performed in parallel.

[0160] Referring to FIG. 10, an electronic device (101) according to one embodiment includes the configurations of FIG. 9, and in operation 1010, can detect the approach of a magnetic body in an open state of the electronic device (or an unfolded state of the first housing (210) and the second housing (220). For example, a magnetic sensor (e.g., 520 of FIG. 5, 910 of FIG. 9) can detect a change in a magnetic value due to the approach of a magnetic body.

[0161] When the electronic device is in an open state, the magnetic sensor (910) can output an interrupt high signal indicating the first state to the first MCU (950) and the second MCU (955) through an interrupt line.

[0162] In operation 1011, the magnetic sensor (910) of the electronic device (101) can determine whether the measured magnetic change satisfies the recognition condition (e.g., first recognition condition, first reference value) of the first axis set to recognize the closed state.

[0163] In operation 1012, the magnetic sensor (910) of the electronic device (101) can output an interrupt signal as a low signal indicating a closed state when the magnetic condition (e.g., the first recognition condition) set for closed state recognition is satisfied (yes in operation 1011).

[0164] In operation 1013, if the magnetic sensor (910) of the electronic device (101) does not satisfy the magnetic condition (e.g., the first recognition condition) set for recognition of the closed state (no in operation 1011), the interrupt signal can be output as a high signal indicating the open state.

[0165] In operation 1014, the processor (940) or the first MCU (950) of the electronic device (101) can maintain the open / closed state of the electronic device (101) recognized as an open state by a high signal.

[0166] In operation 1015, the processor (940) or the first MCU (950) of the electronic device (101) may determine whether the electronic device (101) is in a sleep state.

[0167] In operation 1016, the processor (940) or the first MCU (950) of the electronic device (101) may turn on (or activate) the folding angle sensor (and the angle operation processing unit) if the electronic device (101) is in a sleep state (yes in operation 1015), and may skip operation 1016 and proceed to operation 1017 if the electronic device (101) is not in a sleep state (no in operation 1015).

[0168] In operation 1017, the processor (940) or the second MCU (655) of the electronic device (101) can calculate the folding angle based on data transmitted from the folding angle sensor through the data line (970).

[0169] In operation 1018, the processor (940) or the second MCU (955) of the electronic device (101) can determine whether the angle between the folding angles is about 10 degrees or more.

[0170] In operation 1019, the processor (940) or the second MCU (955) of the electronic device (101) can maintain the open / closed state of the electronic device (101) recognized as the open state when the angle between the folding angles is about 10 degrees or more (yes in operation 1018).

[0171] In operation 1020, the processor (640) or the second MCU (655) of the electronic device (101) can recognize the open / closed state of the electronic device (101) as a closed state when the angle between the folding angles is less than about 10 degrees (no in operation 1018).

[0172] Although not shown in the drawing, the electronic device (101) of FIG. 9 can perform the open / close recognition operation in the closed state after omitting operations 835 and 836 among the operations of FIG. 8b.

[0173] FIG. 11 is a flowchart of a method for preventing malfunction in recognizing an open / closed state of an electronic device including a magnetic sensor according to one embodiment.

[0174] In the following examples, the operations may be performed sequentially, but are not necessarily sequential. For example, the order of the operations may be changed, and at least two operations may be performed in parallel.

[0175] Referring to FIG. 11, an electronic device (101) according to one embodiment can recognize the open / closed state of the electronic device (101) as a first state (e.g., open state or closed state) in operation 1110.

[0176] In operation 1120, when the open / closed state of the electronic device (101) is the first state, the magnetic sensor (e.g., 520 of FIG. 5, 610 of FIG. 6, 910 of FIG. 9) can output a first state interrupt (or first interrupt signal) to the first MCU (e.g., 650 of FIG. 6, 950 of FIG. 9) and the second MCU (e.g., 655 of FIG. 6, 955 of FIG. 9).

[0177] In operation 1130, the electronic device (101) can determine whether the magnetic value of the first axis measured by the magnetic sensor satisfies the recognition condition that the electronic device recognizes from the first state to the second state.

[0178] In operation 1140, if the magnetic value of the first axis measured by the magnetic sensor satisfies the recognition condition that the electronic device recognizes from the first state to the second state (yes in operation 1130), the electronic device (101) can change it to a second state interrupt (or second interrupt signal) and output it to the first MCU and the second MCU.

[0179] In operation 1150, the electronic device (101) can maintain the first state recognition when the magnetic value of the first axis measured by the magnetic sensor does not satisfy the recognition condition for the electronic device to recognize the first state as the second state (no in operation 1130).

[0180] In operation 1160, the electronic device (101) can determine whether the magnetic values ​​of the second and third axes measured by the magnetic sensor after the second state interrupt output satisfies the second state condition.

[0181] In operation 1165, the electronic device (101) can maintain recognition of the first state even if a second state interrupt is output when the magnetic values ​​of the second and third axes measured by the magnetic sensor do not satisfy the second state condition (no in operation 1160).

[0182] In some cases, when the magnetic sensor is an analog Hall sensor, operations 1160 and 1165 may be omitted.

[0183] In operation 1170, if the magnetic values ​​of the second and third axes measured by the magnetic sensor satisfy the second state condition (yes in operation 1160), the electronic device (101) can calculate the folding angle through the folding angle sensor under the control of the second MCU to determine whether the folding angle satisfies the first state condition.

[0184] In operation 1180, the electronic device (101) can maintain the first state recognition and change it to output as a second state interrupt if the folding angle satisfies the first state condition (yes in operation 1170) under the control of the second MCU.

[0185] In this case, the electronic device indicates that the folding angle is the first state, not the second state, even though the second state interrupt is output, so the second state interrupt output is ignored and the first state recognition is maintained, thereby preventing an opening / closing recognition error due to an unintended change in magnetic force.

[0186] In operation 1190, the electronic device (101) can recognize the open / closed state of the electronic device as the second state if the folding angle does not satisfy the first state condition but satisfies the second state condition (no in operation 1170) under the control of the second MCU. In this case, since the electronic device indicates the second state based on the measurement results from both the magnetic sensor and the folding angle sensor, it can ultimately confirm that the second state recognition is a normal operation through the second state interrupt.

[0187] An electronic device (101) according to one embodiment comprises a first housing (210), a second housing (220) foldably coupled to the first housing, a first magnetic body disposed in the first housing, a second magnetic body disposed in the second housing, a magnetic sensor (610, 910) for detecting a change in magnetic force according to a distance between the first magnetic body and the second magnetic body, at least one folding angle sensor (620, 630, 920, 630) for detecting a folding angle between the first housing and the first housing, a first processor (650, 950) connected to the magnetic sensor through a first data line for transmitting data of the magnetic sensor and an interrupt line for transmitting an interrupt signal when a magnetic condition according to a change in magnetic force is satisfied, a second processor (650, 950) connected to the magnetic sensor through a second data line branched from one node of the interrupt line and connected to the magnetic sensor, and transmitting data of the at least one folding angle sensor. A processor (655, 955) and a memory (130) are included, and the memory (130) is configured, when the electronic device is recognized as a first state and the magnetic change measured by the magnetic sensor satisfies a first recognition condition that changes from the first state to the second state, the magnetic sensor outputs a first interrupt signal indicating the second state to the first processor and the second processor through the interrupt line, and the second processor, in response to receiving the first interrupt signal, activates the at least one folding angle sensor and an angle operation processing unit to calculate a folding angle between the first housing and the second housing, and the first processor or the second processor maintains the first state recognition when the folding angle is included in the first state condition.The electronic device may include instructions that cause the electronic device to recognize that the first state has changed to the second state when the folding angle deviates from the first state condition.

[0188] According to one embodiment, the first processor may include a first microcontroller unit (MCU) that operates when the electronic device is powered on and the display is on or in an operating state after booting is completed, and the second processor may include a second MCU that operates when an external power source is connected when the electronic device is powered off or in a sleep state or a low-power state before booting of the electronic device.

[0189] According to one embodiment, the memory may further include instructions causing the magnetic sensor to output a second interrupt signal indicating the first state through the interrupt line when the magnetic change measured by the magnetic sensor satisfies a second recognition condition that changes from the second state to the first state.

[0190] According to one embodiment, the magnetic sensor may be implemented as one of a digital Hall sensor that measures magnetic values ​​of the first axis, the second axis, and the third axis according to the distance between the first magnetic body and the second magnetic body, or an analog Hall sensor that measures one magnetic value.

[0191] In the case where the magnetic sensor according to one embodiment is implemented as the digital Hall sensor, the magnetic sensor may set the first recognition condition and the second recognition condition based on the magnetic value of the first axis having the largest magnetic difference according to the change in the state of the electronic device among the magnetic values ​​of the first axis, the second axis, and the third axis.

[0192] According to one embodiment, the memory may further include instructions for causing the first processor to determine, based on the reception of the first interrupt signal, whether the magnetic values ​​of the second and third axes among the data transmitted from the magnetic sensor satisfy the recognition condition of the second state, and to request the second processor to perform the folding angle calculation if the magnetic values ​​of the second and third axes do not satisfy the recognition condition of the second state.

[0193] According to one embodiment, the memory may further include instructions for causing the first processor to determine whether the electronic device is in a sleep mode when the magnetic values ​​of the second and third axes do not satisfy a recognition condition of the second state, and for causing the second processor to activate the at least one folding angle sensor when the electronic device is in the sleep mode.

[0194] According to one embodiment, the memory may further include instructions for causing the first processor to determine whether the electronic device is in a sleep state, and for causing the second processor to activate the at least one folding angle sensor when the magnetic value of the first axis or the one magnetic value satisfies a first recognition condition that changes from the first state to the second state, after the magnetic sensor outputs a first interrupt signal.

[0195] According to one embodiment, the at least one folding angle sensor may include a first folding angle sensor that measures angular velocity and acceleration changes associated with movement of the first housing and a second folding angle sensor that measures angular velocity and acceleration changes associated with movement of the second housing.

[0196] According to one embodiment, the second processor may be implemented within the main processor (120) or the application processor, or may be disposed outside the main processor or the application processor.

[0197] According to one embodiment, the memory may further include instructions causing the second processor to deactivate the at least one folding angle sensor and the angle operation processing unit after the electronic device state recognition is completed.

[0198] A method for preventing an opening / closing recognition malfunction of an electronic device according to one embodiment may include: when a change in magnetic force measured by the magnetic force sensor in a state in which the electronic device is recognized as a first state satisfies a first recognition condition for changing from the first state to the second state, an operation in which the magnetic force sensor outputs a first interrupt signal indicating the second state to the first processor and the second processor through the interrupt line; an operation in which the second processor, in response to receiving the first interrupt signal, activates the at least one folding angle sensor and an angle calculation processing unit to calculate a folding angle between the first housing and the second housing; an operation in which the first processor or the second processor maintains the first state recognition when the folding angle is included in the first state condition, and an operation in which the electronic device recognizes that the folding angle has changed from the first state to the second state when the folding angle deviates from the first state condition.

[0199] The operation of outputting the first interrupt signal to the first processor and the second processor according to one embodiment may further include an operation of the first processor determining, based on the reception of the first interrupt signal, whether the magnetic values ​​of the second and third axes among the data transmitted from the magnetic sensor satisfy the recognition condition of the second state, and an operation of requesting the folding angle calculation to the second processor when the magnetic values ​​of the second and third axes do not satisfy the recognition condition of the second state.

[0200] The operation of determining whether the magnetic values ​​of the second and third axes according to one embodiment satisfy the recognition condition of the second state may further include an operation of determining, by the first processor, whether the electronic device is in sleep mode if the magnetic values ​​of the second and third axes do not satisfy the recognition condition of the second state, and an operation of activating, by the second processor, the at least one folding angle sensor if the electronic device is in sleep mode.

[0201] The operation of outputting the first interrupt signal to the first processor and the second processor according to one embodiment may further include: when the magnetic value of the first axis or the one magnetic value satisfies a first recognition condition that changes from the first state to the second state, after the magnetic sensor outputs the first interrupt signal, the first processor determining whether the electronic device is in a sleep state; and when the electronic device is in a sleep mode, the second processor activating the at least one folding angle sensor.

[0202] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0203] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0204] One embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0205] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0206] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, 1st housing; A second housing foldably coupled to the first housing; A first magnetic body disposed in the first housing; A second magnetic body disposed in the second housing; A first sensor that detects a change in magnetic force according to the distance between the first magnetic body and the second magnetic body; At least one second sensor for detecting a folding angle between the first housing and the first housing; A first processor connected to the first sensor through a first data line transmitting first sensor data and an interrupt line transmitting an interrupt signal when a magnetic condition is satisfied according to a change in magnetic force; A second processor connected to the first sensor by branching from one node of the interrupt line and connected to the at least one second angle sensor through a second data line transmitting second sensor data; and Includes a memory (130) that stores executable instructions, When the above instructions are executed by the first processor or the second processor, When the electronic device satisfies a first recognition condition that changes from the first state to the second state by a change in magnetic force measured by the first sensor in a state recognized as the first state, the first sensor outputs a first interrupt signal indicating the second state to the first processor and the second processor through the interrupt line, In response to the second processor receiving the first interrupt signal, the second processor activates the at least one second sensor and angle calculation processing unit to calculate a folding angle between the first housing and the second housing, An electronic device that allows the first processor or the second processor to maintain awareness of the first state when the folding angle is included in the first state condition, and allows the electronic device to recognize that it has changed to the second state when the folding angle is outside the first state condition.

2. In paragraph 1, The first processor includes a first MCU (micro controller unit) that operates when the electronic device is powered on and the display is on or in an operating state after booting is completed. An electronic device including a second MCU, wherein the second processor operates when the electronic device is powered off and an external power source is connected, or when the electronic device is in a sleep state or a low-power state before booting.

3. In paragraph 1, The above commands are, An electronic device that causes the first sensor to output a second interrupt signal indicating the first state through the interrupt line when the magnetic force change measured by the first sensor satisfies a second recognition condition that changes from the second state to the first state.

4. In paragraph 1, An electronic device characterized in that the first sensor is implemented as either a digital Hall sensor measuring magnetic values ​​of the first axis, the second axis, and the third axis according to the distance between the first magnetic body and the second magnetic body, or an analog Hall sensor measuring one magnetic value.

5. In paragraph 4, An electronic device in which the first recognition condition and the second recognition condition are set based on the magnetic value of the first axis having the largest magnetic difference according to the change in the electronic device state among the magnetic values ​​of the first axis, the second axis, and the third axis, when the first sensor is implemented as the digital Hall sensor.

6. In paragraph 5, The above commands are, The first processor determines, based on receiving the first interrupt signal, whether the magnetic values ​​of the second and third axes among the data transmitted from the first sensor satisfy the recognition condition of the second state, An electronic device that requests the second processor to perform the folding angle calculation when the magnetic values ​​of the second and third axes do not meet the recognition conditions of the second state.

7. In paragraph 6, The above commands are, An electronic device wherein, if the magnetic values ​​of the second and third axes do not satisfy the recognition conditions of the second state, the first processor determines whether the electronic device is in sleep mode, and if the electronic device is in sleep mode, the second processor activates the at least one second sensor.

8. In paragraph 4, The above commands are, An electronic device further comprising instructions for causing the first processor to determine whether the electronic device is in a sleep state, and for causing the second processor to activate the at least one second sensor if the magnetic value of the first axis or the one magnetic value satisfies a first recognition condition that changes from the first state to the second state, after the first sensor outputs a first interrupt signal.

9. In paragraph 1, An electronic device wherein said at least one second sensor comprises a first folding angle sensor for measuring angular velocity and acceleration changes associated with movement of the first housing and a second folding angle sensor for measuring angular velocity and acceleration changes associated with movement of the second housing.

10. In paragraph 1, An electronic device, characterized in that the second processor is implemented within the main processor or the application processor, or is disposed outside the main processor or the application processor.

11. In paragraph 1, The above commands are, An electronic device further comprising instructions causing the second processor to deactivate the at least one second sensor and the angle operation processing unit after the electronic device state recognition is completed.

12. 1st housing; A second housing foldably coupled to the first housing; A first magnetic body disposed in the first housing; A second magnetic body disposed in the second housing; A first sensor that detects a change in magnetic force according to the distance between the first magnetic body and the second magnetic body; At least one second sensor for detecting a folding angle between the first housing and the first housing; A first processor connected to the magnetic sensor through a first data line transmitting data of the first sensor and an interrupt line transmitting an interrupt signal when a magnetic condition is satisfied according to a change in magnetic force; A second processor connected to the at least one folding angle sensor through a second data line branched from one node of the interrupt line and connected to the magnetic sensor, and transmitting data of the at least one folding angle sensor; and A method for preventing malfunction of an opening / closing recognition of an electronic device including a memory, An operation in which, when the magnetic change measured by the first sensor in a state in which the electronic device is recognized as a first state satisfies a first recognition condition for changing from the first state to the second state, the first sensor outputs a first interrupt signal indicating the second state to the first processor and the second processor through the interrupt line; An operation of activating the at least one second sensor and angle operation processing unit in response to the second processor receiving the first interrupt signal to calculate a folding angle between the first housing and the second housing; The first processor or the second processor maintains the first state recognition when the folding angle is included in the first state condition; and A method comprising an action whereby the electronic device recognizes that the first state has changed to the second state when the folding angle deviates from a first state condition.

13. In paragraph 12, The first processor includes a first MCU (micro controller unit) that operates when the electronic device is powered on and the display is on or in an operating state after booting is completed. A method characterized in that the second processor includes a second MCU that operates when an external power source is connected while the electronic device is powered off, or in a sleep state or a low-power state before booting of the electronic device.

14. In paragraph 12, A method characterized in that the magnetic sensor is implemented as either a digital Hall sensor measuring magnetic values ​​of the first axis, the second axis, and the third axis according to the distance between the first magnetic body and the second magnetic body, or an analog Hall sensor measuring one magnetic value.

15. In paragraph 12, The operation of outputting the first interrupt signal to the first processor and the second processor is: A method further comprising: when the magnetic value of the first axis or the one magnetic value satisfies a first recognition condition that changes from the first state to the second state, after the magnetic sensor outputs a first interrupt signal, the first processor determining whether the electronic device is in a sleep state; and when the electronic device is in the sleep mode, the second processor activating the at least one folding angle sensor.

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