Optical module

Abstract

The present application discloses an optical module, comprising a circuit board and an optical transceiving component, wherein the optical transceiving component comprises a transceiving tube, a first notch is provided on the end of the transceiving tube facing the circuit board, and the circuit board is fitted in the first notch. A receiving recess is provided on the upper surface of the transceiving tube, and the receiving recess comprises a first receiving recess part and a second receiving recess part, the height of the first receiving recess part being smaller than the height of the second receiving recess part. A transmitting recess is provided on the lower surface of the transceiving tube, and the transmitting recess comprises a first transmitting recess part, a second transmitting recess part and a third transmitting recess part, the heights of the second transmitting recess part, the third transmitting recess part and the first transmitting recess part sequentially increasing. In the present application, a receiving recess is provided on the upper surface of the transceiving tube, and an optical receiver is provided in the receiving recess so as to realize the reception of an optical signal; a transmitting recess is provided on the lower surface of the transceiving tube, and an optical transmitter is provided in the transmitting recess so as to realize the transmission of an optical signal.

Description

optical modules

[0001] This disclosure claims the priority of application number 202311194032.5 filed on September 15, 2023 with the China Patent Office; the priority of application number 202311197854.9 filed on September 15, 2023 with the China Patent Office; and the priority of application number 202311197656.2 filed on September 15, 2023 with the China Patent Office; all of which are incorporated by reference into this disclosure. Technical Field

[0002] The present disclosure relates to the field of optical fiber communications, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rate of optical modules continues to increase as optical communication technology evolves.

[0004] Summary of the Invention

[0005] Some embodiments of the present disclosure provide an optical module, including:

[0006] A circuit board is provided with an electrical chip and a light receiving chip group; the electrical chip is connected to the light receiving chip group, and the distance between two adjacent first electrical connection points of the electrical chip is equal;

[0007] The optical transceiver component includes a transceiver tube body, wherein a first notch is provided at one end of the transceiver tube body facing the circuit board, and the circuit board is clamped at the first notch;

[0008] A receiving groove is provided on the upper surface of the transceiver tube body, and the receiving groove includes a first receiving groove portion and a second receiving groove portion. A receiving substrate and an optical receiver are provided in the first receiving groove portion, and the second receiving groove portion is configured to accommodate an optical fiber. The height of the first receiving groove portion is lower than that of the second receiving groove portion.

[0009] The optical receiver includes a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism, wherein the fiber collimator group is connected to the optical fiber, wherein the fiber collimator group, the wave splitter group and the optical path offset plate group are arranged on the receiving substrate, and the optical path offset plate group is located between the wave splitter group and the turning prism; the turning prism is located above the optical receiving chip group; the optical receiving chip group includes a plurality of optical receiving chips arranged in parallel, and the first solder pads of the plurality of optical receiving chips are arranged at equal intervals; the wave splitter group includes at least two wave splitters, the wave splitter has a plurality of light output ports, and any two adjacent light output ports of the plurality of light output ports have a first spacing, one of the light output ports of the wave splitter is adjacent to one of the light output ports of an adjacent wave splitter, and has a second spacing; the second spacing is greater than the first spacing; the optical path offset plate group is configured to shorten the second spacing between the light paths emitted from the two adjacent light output ports between the two adjacent wave splitters. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] FIG1 is a partial structural diagram of an optical communication system provided according to an embodiment of the present disclosure;

[0012] FIG2 is a partial structural diagram of a host computer according to an embodiment of the present disclosure;

[0013] FIG3 is a structural diagram of an optical module provided according to an embodiment of the present disclosure;

[0014] FIG4 is an exploded view of an optical module according to an embodiment of the present disclosure;

[0015] FIG5 is an assembly diagram of the optical transceiver component and the circuit board in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0016] FIG6 is an exploded view of the optical transceiver component and the circuit board in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0017] FIG7 is another exploded view of the optical transceiver component and the circuit board in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0018] FIG8 is another exploded view of the optical transceiver component and the circuit board in the optical module according to an embodiment of the present disclosure;

[0019] FIG9 is another exploded view of the optical transceiver component and the circuit board in the optical module according to an embodiment of the present disclosure;

[0020] FIG10 is an exploded view of the optical transceiver component in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0021] FIG11 is an exploded view of an optical transmitter and a transceiver tube body in an optical module according to an embodiment of the present disclosure;

[0022] FIG12 is a cross-sectional view of an optical transceiver component and a circuit board in an optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0023] FIG13 is a light path diagram of an optical transmitter in an optical module according to an embodiment of the present disclosure;

[0024] FIG14 is a structural diagram of a transceiver tube body in an optical module according to an embodiment of the present disclosure;

[0025] FIG15 is a structural diagram of a second emission cover plate in an optical module according to an embodiment of the present disclosure;

[0026] FIG16 is an assembly diagram of a transceiver tube body and a second transmitting cover plate in an optical module according to an embodiment of the present disclosure;

[0027] FIG17 is a structural diagram of the second emission cover plate in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0028] FIG18 is an assembly diagram of the transceiver tube body and the second transmitting cover plate in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0029] FIG19 is another structural diagram of the second emission cover plate in the optical module according to an embodiment of the present disclosure;

[0030] FIG20 is another structural diagram of the second emission cover plate in the optical module according to an embodiment of the present disclosure;

[0031] FIG21 is another structural diagram of a transceiver tube body in an optical module according to an embodiment of the present disclosure;

[0032] FIG22 is another assembly diagram of the transceiver tube body and the second transmitting cover plate in the optical module according to an embodiment of the present disclosure;

[0033] FIG23 is another assembly diagram of the transceiver tube body and the second transmitting cover plate in the optical module according to an embodiment of the present disclosure;

[0034] FIG24 is an exploded view of a light receiving component in an optical module according to an embodiment of the present disclosure;

[0035] FIG25 is an exploded view of an optical receiver and a transceiver tube body in an optical module according to an embodiment of the present disclosure;

[0036] FIG26 is a cross-sectional view of an optical transceiver component in an optical module according to an embodiment of the present disclosure;

[0037] FIG27 is a schematic diagram of an optical path offset plate in an optical module according to an embodiment of the present disclosure;

[0038] FIG28 is an assembly diagram of a turning prism and a fourth lens group in an optical module according to an embodiment of the present disclosure;

[0039] FIG29 is a light path diagram of an optical receiver in an optical module according to an embodiment of the present disclosure;

[0040] FIG30 is a light path diagram of an optical receiver in an optical module provided in accordance with an embodiment of the present disclosure at another viewing angle;

[0041] FIG31 is an assembly diagram of an optical receiver and a receiving substrate in an optical module according to an embodiment of the present disclosure;

[0042] FIG32 is another structural diagram of a receiving substrate in an optical module provided according to an embodiment of the present disclosure;

[0043] FIG33 is another assembly diagram of an optical receiver and a receiving substrate in an optical module according to an embodiment of the present disclosure;

[0044] FIG34 is an assembly diagram of an optical receiver and a transceiver tube body in an optical module according to an embodiment of the present disclosure;

[0045] FIG35 is a structural diagram of a transceiver tube body in an optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0046] FIG36 is a structural diagram of a second receiving cover plate in an optical module according to an embodiment of the present disclosure;

[0047] FIG37 is an assembly diagram of a transceiver tube body and a second receiving cover plate in an optical module according to an embodiment of the present disclosure;

[0048] FIG38 is a structural diagram of the second receiving cover plate in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0049] FIG39 is an assembly diagram of the transceiver tube body and the second receiving cover plate in the optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0050] FIG40 is a structural diagram of a transceiver tube body in an optical module provided in accordance with an embodiment of the present disclosure from another perspective;

[0051] FIG41 is a structural diagram of a fixing member in an optical module according to an embodiment of the present disclosure;

[0052] FIG42 is another assembly diagram of the optical receiver and the transceiver tube body in the optical module provided according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0053] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0054] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "equal", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0055] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0056] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0057] Figure 1 is a partial structural diagram of an optical communication system according to an embodiment of the present disclosure. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0058] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0059] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0060] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0061] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0062] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0063] Figure 2 is a partial structural diagram of a host computer provided according to an embodiment of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0064] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0065] Figure 3 is a structural diagram of an optical module according to an embodiment of the present disclosure, and Figure 4 is an exploded view of an optical module according to an embodiment of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and an optical transceiver component 900.

[0066] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0067] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0068] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0069] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, configured to receive an external optical fiber 101, so that the optical fiber 101 can connect to the optical transceiver component 900 in the optical module 200.

[0070] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of the circuit board 300, the optical transceiver 900, and the like within the housing, which provides encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300 and the optical transceiver 900, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0071] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0072] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0073] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0074] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0075] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0076] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0077] As shown in FIG4 , a fiber optic connector assembly 800 is disposed within the housing, and the fiber optic connector assembly 800 is connected to the optical transceiver component 900. In some embodiments, the fiber optic connector assembly 800 includes a plurality of first fiber optic connectors and a plurality of second fiber optic connectors, wherein the first fiber optic connectors and the second fiber optic connectors are stacked one above the other. The first fiber optic connectors are fiber optic connectors connected to the optical transmitter of the optical transceiver component 900, and the second fiber optic connectors are fiber optic connectors connected to the optical receiver of the optical transceiver component 900. The first fiber optic connectors are connected to the optical transmitter of the optical transceiver component 900 via optical fibers, and the second fiber optic connectors are connected to the optical receiver of the optical transceiver component 900 via optical fibers.

[0078] In some embodiments, an electrical chip having a transimpedance amplifier function is disposed on the top surface of the circuit board 300. The electrical chip has an equal spacing between two adjacent first electrical connection points of the electrical chip. For example, the electrical chip is a DSP chip, which has a TIA chip integrated therein. If the first electrical connection points of the DSP chip are regularly arranged, then the spacing between two adjacent first electrical connection points of the DSP chip is equal, and the first electrical connection points of the DSP chip correspond to the TIA chip within the DSP.

[0079] In some embodiments of the present disclosure, an optical path offset plate group is provided behind the wave splitter group, and the optical path offset plate group is used to shorten the distance between the optical paths emitted from two adjacent light outlets between two adjacent wave splitters. The two adjacent light outlets between two adjacent wave splitters refer to the light outlet of the first wave splitter of the two adjacent wave splitters that is closest to the second wave splitter and the light outlet of the second wave splitter of the two adjacent wave splitters that is closest to the first wave splitter, that is, the light outlet of the first wave splitter of the two adjacent wave splitters that is closest to the second wave splitter and the light outlet of the second wave splitter of the two adjacent wave splitters that is closest to the first wave splitter, and the first electrical connection point of the electrical chip is wire-bonded to the first pad of the optical receiving chip group.

[0080] Figure 5 is an assembly diagram of the optical transceiver component and the circuit board in the optical module provided according to an embodiment of the present disclosure, from another perspective. Figure 6 is an exploded view of the optical transceiver component and the circuit board in the optical module provided according to an embodiment of the present disclosure, from another perspective. Figure 7 is another exploded view of the optical transceiver component and the circuit board in the optical module provided according to an embodiment of the present disclosure, from another perspective. As shown in Figures 5, 6, and 7, in some embodiments, a first notch 911 is provided at the first end of the optical transceiver component 900, that is, the first notch 911 is provided at the end of the optical transceiver component 900 that is close to the circuit board 300, and the circuit board 300 is snapped into the first notch 911 to achieve a fixed connection between the optical transceiver component 900 and the circuit board 300.

[0081] In some examples, the optical transceiver component 900 may also be connected to the circuit board 300 through a flexible circuit board. That is, the circuit board 300 and the optical transceiver component 900 may not be fixedly connected, but the electrical signal on the circuit board 300 may be transmitted to the optical transceiver component 900 through the flexible circuit board, and the electrical signal is converted into an optical signal in the optical transceiver component 900; or the optical transceiver component 900 converts the optical signal into an electrical signal, and the electrical signal is transmitted to the circuit board 300 through the flexible circuit board, and then transmitted to the host computer through the circuit board 300.

[0082] In some embodiments, the optical transceiver component 900 includes a transceiver tube body 901, a transmitting cover plate 904, and a receiving cover plate 905. The transmitting cover plate 904 covers the lower surface of the transceiver tube body 901 (using the perspective of FIG. 7 as an example, in the embodiments of the present disclosure, it may refer to the upper surface of the transceiver tube body 901 in FIG. 7) and the lower surface of the circuit board 300 to form a transmitting cavity. The receiving cover plate 905 covers the upper surface of the transceiver tube body 901 (using the perspective of FIG. 7 as an example, in the embodiments of the present disclosure, it may refer to the lower surface of the transceiver tube body 901 in FIG. 7) and the upper surface of the circuit board 300 to form a receiving cavity. A transmitting slot 912 is provided in the transmitting cavity, that is, the lower surface of the transceiver tube body 901 (the side of the transceiver tube body 901 facing the transmitting cover plate 904) is provided with a transmitting slot 912. The transmitting slot 912 contains an optical transmitter 902 to transmit an optical signal.

[0083] Figure 8 is another exploded view of the optical transceiver components and circuit board in an optical module according to an embodiment of the present disclosure, and Figure 9 is another exploded view of the optical transceiver components and circuit board in an optical module according to an embodiment of the present disclosure. As shown in Figures 8 and 9, in some embodiments of the present disclosure, a receiving cavity is provided with a receiving slot 913, that is, the upper surface of the transceiver tube body 901 (the side of the transceiver tube body 901 facing the receiving cover plate 905) is provided with a receiving slot 913, and a portion of the optical receiver 903 is disposed in the receiving slot 913 to enable optical signal reception.

[0084] As shown in FIG8 , in some embodiments, a light receiving chipset group 937 is disposed on the upper surface of the circuit board 300. The light receiving chipset group 937 converts received optical signals into electrical signals. The light receiving chipset group 937 includes a plurality of light receiving chips arranged in parallel, with the first solder pads of adjacent light receiving chips spaced evenly apart. For example, the light receiving chipset group 937 includes eight light receiving chips arranged in parallel, with the first solder pads of adjacent light receiving chips spaced evenly apart, d2.

[0085] As shown in Figure 8, a digital signal processing (DSP) chip 302 is also mounted on the top surface of circuit board 300. DSP chip 302 is wired to optical transmitter 902 and optical receiver 903. The host computer transmits electrical signals to DSP chip 302 via gold finger connectors. DSP chip 302 processes the electrical signals. The laser driver chip generates a driving current based on the processed electrical signals. Optical transmitter 902 receives the driving current and then emits an optical signal. Optical receiver 903 converts the received optical signals into electrical signals. DSP chip 302 processes the electrical signals, and the processed signals are then transmitted to the host computer via gold finger connectors.

[0086] In some embodiments, the DSP chip 302 is integrated with a TIA chip, and the power supply circuit that powers the TIA chip can also power other devices in the DSP chip 302, reducing the power supply circuit inside the DSP chip 302 and effectively reducing power consumption.

[0087] The DSP chip 302 is integrated with a TIA chip, and the first electrical connection points of the DSP chip 302 are arranged in a regular pattern. Therefore, the spacing between two adjacent first electrical connection points of the DSP chip 302 is equal. For example, the spacing between two adjacent first electrical connection points of the DSP chip 302 is d1, and the spacing between the first pads of two adjacent optical receiving chips of the optical receiving chipset 937 is d1. However, since the spacing between the first pads of optical receiving chips can currently only be d2, the spacing between the first pads of any two adjacent optical receiving chips of the optical receiving chipset 937 can be set to d2. In this way, the spacing between the first pads of two adjacent optical receiving chips of the optical receiving chipset 937 is equal, thereby shortening the bonding distance between the first electrical connection points of the DSP chip 302 and the first pads of the optical receiving chipset 937, reducing the loss of high-frequency signals in the bonding wires, and thus ensuring the high-frequency performance of the optical module.

[0088] In some embodiments, the DSP chip 302 may be a flip chip, that is, the DSP chip 302 and the circuit board 300 may be connected via solder balls. For example, a solder ball layer may be provided on the lower surface of the DSP chip 302. The solder ball layer may include multiple solder balls, one of which is a first solder ball corresponding to the TIA chip. A second solder pad is provided on the upper surface of the circuit board 300. The second solder pad is connected to the other solder balls in the solder ball layer except the first solder ball.

[0089] Since the DSP chip 302 is integrated with a TIA chip, the connection between the optical receiving chipset 937 and the TIA chip becomes a connection between the optical receiving chipset 937 and the first solder balls of the DSP chip 302. The distance between two adjacent first electrical connection points of the DSP chip 302 is the distance between two adjacent first solder balls of the DSP chip 302. For example, the distance between two adjacent first solder balls of the DSP chip 302 is d1.

[0090] Figure 10 is an exploded view of the optical transceiver component in an optical module provided according to an embodiment of the present disclosure, from another perspective. Figure 11 is an exploded view of the optical transmitter and transceiver tube body in an optical module provided according to an embodiment of the present disclosure. Figure 12 is a cross-sectional view of the optical transceiver component and circuit board in an optical module provided according to an embodiment of the present disclosure, from another perspective. As shown in Figures 10, 11, and 12, in some embodiments, the optical transmitter 902 includes a laser chip group 921, a first lens group 922, a combiner group 923, a second lens group 924, and a transmitting fiber adapter group 700. The first lens group 922 is located between the laser chip group 921 and the combiner group 923, and the second lens group 924 is located between the combiner group 923 and the transmitting fiber adapter group 700.

[0091] In some embodiments, laser chipset 921 includes multiple laser chips arranged in parallel. For example, laser chipset 921 includes eight parallel laser chips, each of which is a 100G EML chip (this is merely an illustration of the distance in this disclosure and does not constitute a specific limitation on the laser chips). Each 100G EML chip transmits a 100G optical signal based on the drive current, causing laser chipset 921 to transmit eight 100G optical signals of different wavelengths. This means that laser chipset 921 transmits an 800G optical signal.

[0092] In some embodiments, first lens group 922 includes multiple collimating lenses arranged in parallel. For example, first lens group 922 includes eight collimating lenses arranged in parallel, with the collimating lenses corresponding to the laser chips. Eight 100G optical signals of different wavelengths emitted by laser chipset 921 are collimated by first lens group 922.

[0093] In some embodiments, combiner group 923 includes multiple combiners arranged in parallel. For example, combiner group 923 includes two combiners arranged in parallel, with one combiner corresponding to four laser chips and four collimating lenses. Eight 100G collimated optical signals are combined into two 400G optical signals by combiner group 923.

[0094] In some embodiments, the second lens group 924 includes a plurality of focusing lenses arranged in parallel. For example, the second lens group 924 includes two focusing lenses arranged in parallel.

[0095] In some embodiments of the present disclosure, the transmitting fiber adapter assembly 700 includes multiple transmitting fiber adapters arranged in parallel. For example, the transmitting fiber adapter assembly 700 includes two transmitting fiber adapters arranged in parallel, with the combiner, focusing lens, and transmitting fiber adapters arranged in correspondence. The second lens assembly 924 focuses the two 400G optical signals onto the transmitting fiber adapter assembly 700.

[0096] As shown in Figures 11 and 12, in some embodiments of the present disclosure, the light emitting slot 912 includes a first emitting slot portion 9121, a second emitting slot portion 9122 and a third emitting slot portion 9123. The second emitting slot portion 9122 is located between the first emitting slot portion 9121 and the third emitting slot portion 9123. The first emitting slot portion 9121 is closer to the circuit board 300 than the other emitting slot portions, and the third emitting slot portion 9123 is farther away from the circuit board 300 than the other emitting slot portions. The laser chip group 921 and the first lens group 922 are both placed in the first emitting slot portion 9121, the combiner group 923 is placed in the second emitting slot portion 9122, and the second lens group 924 is placed in the third emitting slot portion 9123.

[0097] In some embodiments of the present disclosure, the laser chips of laser chipset 921 are packaged using a chip-on-carrier (COC) package, which can also be referred to as a chip-on-ceramic substrate. Therefore, the side profiles of the laser chips in laser chipset 921 are relatively regular, such as rectangular.

[0098] To control the temperature of the laser chipset 921 and stabilize the optical signal emitted by the laser chipset 921, in some embodiments of the present disclosure, a thermal electric cooler (TEC) is disposed within the first emission slot 9121. An emission substrate is disposed on the TEC, upon which the laser chipset 921 and the first lens assembly 922 are placed. The TEC is located below the laser chipset 921 (using the orientation shown in FIG. 11 as an example; in some examples, the TEC can also be understood as being located within the first emission slot 9121, with the laser chipset 921 facing the first emission slot 9121) to regulate the temperature of the laser chipset 921.

[0099] In some embodiments, the combiner assembly 923 is bonded to the second launch slot 9122. To facilitate control of the glue between the combiner assembly 923 and the second launch slot 9122, a circular glue dispensing groove is provided on the upper surface of the second launch slot 9122. Dispensing glue in the circular glue dispensing groove not only facilitates control of the glue amount, but also the glue stress.

[0100] In order to improve the coupling efficiency, in some embodiments, the height of the first transmitting slot portion 9121 (exemplified by the height direction shown in FIG11 ) is smaller than the second transmitting slot portion 9122 (as shown in FIG11 , that is, the depth of the first transmitting slot portion 9121 recessed from the surface of the transceiver tube body 901 is greater than the depth of the recess of the second transmitting slot portion 9122), so that the central axis of the first lens group 922 placed in the first transmitting slot portion 9121 coincides with the light entrance of the combiner group 923 placed in the second transmitting slot portion 9122, thereby allowing the combiner group 923 to receive as much light signal collimated by the first lens group 922 as possible, thereby improving the coupling efficiency.

[0101] In order to improve the coupling efficiency, in some embodiments, the height of the second transmitting slot portion 9122 (exemplified by the height direction shown in FIG11 ) is greater than the height of the third transmitting slot portion 9123 (in other words, the depth of the second transmitting slot portion 9122 recessed from the surface of the transceiver tube body 901 is less than the recessed depth of the second transmitting slot portion 9122), so that the light outlet of the combiner group 923 disposed in the second transmitting slot portion 9122 coincides with the central axis of the second lens group 924 disposed in the third transmitting slot portion 9123, thereby enabling the second lens group 924 to receive as many optical signals as possible emitted by the combiner group 923, thereby improving the coupling efficiency.

[0102] In order to improve the coupling efficiency, in some embodiments, the height of the third transmitting slot portion 9123 (specifically illustrated by the height direction shown in Figure 11 as a specific example) is greater than the height of the first transmitting slot portion 9121 (in other words, the depth of the third transmitting slot portion 9123 recessed from the surface of the transceiver tube body 901 is less than the recessed depth of the first transmitting slot portion 9121), so that the height of the central axis of the first lens group 922 of the first transmitting slot portion 9121, the light entrance of the combiner group 923 located in the second transmitting slot portion 9122, and the central axis of the second lens group 924 located in the third transmitting slot portion 9123 coincide with each other, so that the second lens group 924 receives as much light signal emitted by the laser chip group 921 as possible, thereby improving the coupling efficiency.

[0103] As shown in FIG11 , in some embodiments of the present disclosure, a carrier 916 is provided along the length of the transceiver tube body 901 (e.g., as shown in FIG11 , where the direction indicated by arrows AB in FIG11 is the length of the transceiver tube body 901). The carrier 916 is located between two combiners to support the combiner group 923. Specifically, two opposing sides of the carrier 916 each support a combiner. For example, one side of the carrier 916 supports one combiner of the combiner group 923, while the other side of the carrier 916 supports another combiner of the combiner group 923. The one side of the carrier 916 and the other side of the carrier 916 are arranged opposite each other. The provision of the carrier 916 not only facilitates identification of the mounting position of the combiner group 923 but also facilitates mounting of the combiner group 923, thereby improving mounting accuracy, preventing the combiner group 923 from deviating from its preset position, and enhancing coupling efficiency. As shown in FIG11 , in some embodiments, a through hole 914 is provided at the second end of the transceiver tube body 901. This through hole 914 is configured to accommodate a transmitting fiber adapter (see FIG12 ). This through hole 914 corresponds to the focusing lens of the second lens assembly 924 , allowing the transmitting fiber adapter to receive the optical signal coupled by the focusing lens of the second lens assembly 924 .

[0104] As shown in FIG11 , in some embodiments, two opposing sidewalls of the transceiver body 901 are recessed toward the direction away from the circuit board 300 to form a first notch 911. The first notch 911 includes a bottom surface 9111, a first side surface 9112, and a second side surface. The first side surface 9112 and the second side surface are disposed opposite each other, and the first side surface 9112, the bottom surface 9111, and the second side surface form a U-shaped groove to facilitate insertion of the circuit board 300. When the circuit board 300 is inserted into the first notch 911 of the transceiver body 901, the upper surface of the circuit board 300 (i.e., the side of the circuit board 300 facing the transmitting slot 912) contacts and connects with the first side surface 9112, while the lower surface of the circuit board 300 (i.e., the side of the circuit board 300 facing away from the transmitting slot 912) contacts and connects with the second side surface, thereby achieving a fixed connection between the circuit board 300 and the transceiver body 901.

[0105] The first notch 911 divides the end face of the first end of the transceiver tube body 901 into a first end face 9113 and a second end face 9114. The first end face 9113 is connected to the second side face, and the first end face 9113 is located below the first notch 911 (it can be understood here that when the optical module provided by the embodiment of the present disclosure is in normal use, the first end face 9113 is located below the first notch 911, wherein Figure 11 is used as an example for illustration. As shown in Figure 11, the first end face 9113 can be located above the first notch 911 in Figure 11), and the second end face 9114 is connected to the first side face 9112, and the second end face 9114 is located above the first notch 911. Above the notch 911 (this can be understood as when the optical module provided in the embodiment of the present disclosure is in normal use, the first end surface 9113 is located above the first notch 911, wherein FIG11 is used as an example for illustration, and as shown in FIG11 , the first end surface 9113 can be located below the first notch 911 in FIG11 ), an outwardly protruding support member 918 is provided on the second end surface 9114. The side of the support member 918 facing the circuit board 300 is flush with the first side surface 9112. The side of the support member 918 facing the circuit board 300 and the first side surface 9112 of the first notch 911 are respectively connected to the upper surface of the circuit board 300. In this way, the contact area between the first side surface 9112 and the circuit board 300 can be increased, which can effectively improve the stability of the connection between the circuit board 300 and the transceiver tube body 901.

[0106] As shown in FIG11 , in some embodiments, a first engaging surface 915 is provided on the lower surface of the transceiver tube body 901 (located at the upper side in the vertical direction shown in FIG11 ). The first engaging surface 915 is formed by recessing the side walls of the transceiver tube body 901 toward the transmitting slot 912 . The first engaging surface 915 and the side walls of the transceiver tube body 901 form a first limiting notch. In other words, the first engaging surface 915 and the side walls of the transceiver tube body 901 extending from the first engaging surface 915 form the first limiting notch.

[0107] In some embodiments, the launch cover 904 is an integrally formed structure. To facilitate the processing and assembly of the transmitting cover 904, as shown in Figure 12, the transmitting cover 904 includes a first transmitting cover 941 and a second transmitting cover 942. The first end of the first transmitting cover 941 is covered on the first clamping surface 915 on the lower surface of the transmitting and receiving tube body 901, and the side of the first transmitting cover 941 is clamped on the inner surface of the side wall of the transmitting and receiving tube body 901, so that the first transmitting cover 941 is clamped at the first limiting notch; the second end of the first transmitting cover 941 is covered on the first end of the second transmitting cover 942, and the second transmitting cover 942 has a second notch. The first end surface of the side wall below the first notch 911 in the transmitting and receiving tube body 901 and the inner surface of the side wall below the first notch 911 in the transmitting and receiving tube body 901 are clamped in the second notch, and the second end of the second transmitting cover 942 is covered on the lower surface of the circuit board 300, so that the transmitting cover 904 is covered on the transmitting and receiving tube body 901 and the circuit board 300. Among them, the first end of the side wall below the first notch 911 in the transceiver tube body 901 refers to the end of the side wall below the first notch 911 in the transceiver tube body 901 (in the upper and lower positions shown in Figure 11, it can be located above the first notch 911) away from the storage hole 914.

[0108] To seal the first transmitting cover plate 941 to the transceiver tube body 901, in some embodiments, the shape of the first transmitting cover plate 941 matches the shape of the first engaging surface 915. For example, the shape of the first transmitting cover plate 941 is the same as, close to, or similar to the shape of the first engaging surface 915.

[0109] In order to avoid the electronic components on the circuit board 300, as shown in Figure 12, in some embodiments of the present disclosure, the end of the second transmitting cover 942 (as shown in Figure 12, in the embodiments of the present disclosure, the end may refer to the end of the second transmitting cover 942 facing the circuit board 300, or may also refer to the end of the second transmitting cover 942 facing away from the storage through hole 914) extends out of the end of the side wall of the transceiver tube body 901, and the side of the second transmitting cover 942 facing the circuit board 300 is recessed inward to form a first avoidance groove, and the depth of the first avoidance groove corresponds to the size of the corresponding electronic component on the circuit board 300, or, in some examples, the depth of the first avoidance groove may also be greater than the size of the corresponding electronic component on the circuit board 300, so as to avoid the electronic components on the circuit board 300.

[0110] As shown in FIG11 , in some embodiments, a repair opening 917 is provided on a side wall of the transceiver tube body 901. The height of the repair opening 917 is lower than the height of the first engaging surface 915. In other words, when the repair opening 917 is recessed from the surface of the transceiver tube body 901, the depth of the recess is greater than the distance between the first engaging surface 915 and the surface of the transceiver tube body 901. Thus, after the first transmitting cover 941 is engaged with the first engaging surface 915 (or alternatively, it can be understood as engaged with the first limiting notch), a certain gap exists between the repair opening 917 and the inner surface of the first transmitting cover 941, making it easier to pry the first transmitting cover 941 open through the repair opening 917. The repair opening 917 serves as a reserved prying point to facilitate repair of the optical transceiver component 900.

[0111] Figure 13 is a light path diagram of an optical transmitter in an optical module provided according to an embodiment of the present disclosure. As shown in Figure 13, in some embodiments of the present disclosure, the laser chip group 921 transmits eight 100G optical signals. In the embodiments of the present disclosure, eight optical signals are used as a specific example. It can be understood that in some examples, the optical signals can also be other multiple channels, and the embodiments of the present disclosure do not limit this. The eight 100G optical signals are collimated by the first lens group 922. The collimated eight 100G optical signals are incident on the combiner group 923. The combiner group 923 combines the eight 100G optical signals after the position change into two 400G optical signals. The two 400G optical signals are focused and coupled to the transmitting fiber adapter group 700 through the second lens group 924.

[0112] In order to fix the circuit board 300 at the first notch 911 , as shown in FIG11 , in some embodiments, the first side surface 9112 of the first notch 911 and the side of the support member 918 facing the circuit board 300 are both provided with glue grooves, and glue is placed in the glue grooves to fix the circuit board 300 at the first notch 911 .

[0113] FIG14 is a structural diagram of a transceiver tube body in an optical module according to an embodiment of the present disclosure. As shown in FIG14 , in order to secure the circuit board 300 to the first notch 911, in some embodiments, a first glue groove 9115 is provided on the first side surface 9112 of the first notch 911 of the transceiver tube body 901, and a second glue groove 9182 is provided on the side of the support member 918 facing the circuit board 300. Glue is injected into both the first glue groove 9115 and the second glue groove 9182. After the circuit board 300 is inserted into the first notch 911, the glue in the first glue groove 9115 and the second glue groove 9182 adheres the circuit board 300 to the first notch 911, thereby achieving a fixed connection between the circuit board 300 and the first notch 911.

[0114] In order to avoid electronic components on the circuit board 300 , in some embodiments, avoidance recesses 9181 are provided on both sides of the support member 918 . The avoidance recesses 9181 are recessed in the support member 918 to avoid electronic components on the circuit board 300 .

[0115] Figure 15 is a structural diagram of a second transmitting cover plate in an optical module according to an embodiment of the present disclosure, and Figure 16 is an assembly diagram of a transceiver tube body and the second transmitting cover plate in an optical module according to an embodiment of the present disclosure. As shown in Figures 15 and 16, in some embodiments of the present disclosure, the first surface of the second transmitting cover plate 942, near one end of the transceiver tube body 901, is recessed to form a support recess 9421. This support recess 9421 gives the first surface of the second transmitting cover plate 942 a stepped shape. The second surface of the second end of the first transmitting cover plate 941 rests on the support recess 9421 to support the first transmitting cover plate 941, thereby sealingly connecting the first transmitting cover plate 941 with the second transmitting cover plate 942. This support recess 9421 is configured not only to support the first transmitting cover plate 941 but also to define the position of the first transmitting cover plate 941, facilitating placement of the first transmitting cover plate 941 and improving placement accuracy. The first surface of the second transmitting cover plate 942 is a surface away from the transceiver tube body 901 , and the second surface of the second transmitting cover plate 942 is a surface close to the transceiver tube body 901 .

[0116] As shown in Figures 15 and 16, in some embodiments of the present disclosure, second notches 9423 are provided on both sides of the second transmitting cover plate 942, and the first side surface of the second notch 9423 and the second side surface of the second notch 9423 form an L-shaped notch, and the first side surface of the L-shaped notch is connected to the first end surface 9113 of the transceiver tube body 901, and the second side surface of the L-shaped notch is connected to the inner surface of the side wall below the first notch 911 in the transceiver tube body 901, so as to realize a sealed connection between the transceiver tube body 901 and the second transmitting cover plate 942.

[0117] As shown in Figures 14 and 16, in some embodiments, the end of the first engaging surface 915 proximal to the circuit board 300 is further recessed to form a second engaging surface 9151. The second engaging surface 9151 and the sidewall of the transceiver tube body 901 define a second retaining notch. The first end of the second transmitting cover plate 942 is secured to the second engaging surface 9151. The side surfaces of the second transmitting cover plate 942 correspond to the sidewalls of the transceiver tube body 901, allowing the second transmitting cover plate 942 to engage with the second retaining notch.

[0118] Figure 17 illustrates the structure of the second transmitting cover plate in an optical module according to an embodiment of the present disclosure from another perspective, and Figure 18 illustrates the assembly of the transceiver tube body and the second transmitting cover plate in an optical module according to an embodiment of the present disclosure from another perspective. As shown in Figures 17 and 18, in some embodiments, the second surface of the second transmitting cover plate 942, distal from the end of the first transmitting cover plate 941, protrudes outward to form a support protrusion 9422, which contacts and connects with the lower surface of the circuit board 300. The support protrusion 9422 ensures that only a portion of the lower surface of the second transmitting cover plate 942 contacts and connects with the lower surface of the circuit board 300, thereby avoiding the electronic components on the circuit board 300.

[0119] It can be understood that in other examples of the present disclosure, the support protrusion 9422 can also be set on the circuit board 300, and the protruding height of the support protrusion 9422 on the circuit board 300 is greater than or equal to the protruding height of the electronic components on the circuit board 300. In this way, the support protrusion 9422 can be supported on the side surface of the second launch cover 942 facing the circuit board 300, so that the second launch cover 942 avoids the electronic components on the circuit board 300.

[0120] As shown in Figures 17 and 18, in some embodiments, the second launch cover plate 942 protrudes outward on both sides of one end close to the first launch cover plate 941 to form a first support boss 9425. The first support boss 9425 protrudes from the second surface, and the first support boss 9425 is in contact and connected with the second clamping surface 9151.

[0121] As shown in Figures 17 and 18, in some embodiments of the present disclosure, the depth of the first avoidance groove 9424 is shallow at both ends and deep in the middle, that is, the shape of the first avoidance groove 9424 is U-shaped to avoid electronic components on the circuit board 300.

[0122] As shown in FIG17 , in some embodiments, a second surface of the second emission cover plate 942 close to one end of the first emission cover plate 941 is provided with an avoidance surface 9426 , and the avoidance surface 9426 has a first preset angle to prevent collision with the laser chip of the laser chip group 921 when assembling the optical module.

[0123] Figure 19 is another structural diagram of the second transmitting cover plate in the optical module provided according to an embodiment of the present disclosure, Figure 20 is another structural diagram of the second transmitting cover plate in the optical module provided according to an embodiment of the present disclosure, Figure 21 is another structural diagram of the transceiver tube body in the optical module provided according to an embodiment of the present disclosure, Figure 22 is another assembly diagram of the transceiver tube body and the second transmitting cover plate in the optical module provided according to an embodiment of the present disclosure, and Figure 23 is another assembly diagram of the transceiver tube body and the second transmitting cover plate in the optical module provided according to an embodiment of the present disclosure.

[0124] As shown in Figures 19-23, in some embodiments of the present disclosure, the second transmitting cover plate 942 can be engaged with the transceiver tube body 901 only through the second notch 9423 to achieve a sealed connection between the second transmitting cover plate 942 and the transceiver tube body 901. That is, the first end of the second transmitting cover plate 942 is suspended in the air, and the first end of the second transmitting cover plate 942 no longer covers the second engaging surface 9151.

[0125] As shown in Figures 19 to 23, the second transmitting cover plate 942 is provided with a supporting recess 9421. The length of the supporting recess 9421 of the second transmitting cover plate 942 extending toward the transceiver tube body 901 is relatively short, so that the second transmitting cover plate 942 is away from the top of the laser chip group 921, thereby reducing the second transmitting cover plate 942 from colliding with the wire bonding between the laser chip group 921 and the DSP chip 302 on the circuit board 300.

[0126] As shown in Figures 19 to 23, the second launch cover 942 is provided with a support protrusion 9422, which extends from the first end of the second launch cover 942 to the second end of the second launch cover 942, so that only a part of the second surface of the second launch cover 942 is in contact with the lower surface of the circuit board 300 to avoid the electronic components on the circuit board 300.

[0127] As shown in FIG. 19 to FIG. 23 , the second emission cover plate 942 is provided with a first avoidance groove 9424 . The first avoidance groove 9424 is in a stepped shape to avoid electronic components on the circuit board 300 .

[0128] As shown in FIG. 20 , in some embodiments of the present disclosure, both sides of the support member 918 do not need to avoid the recess. A plurality of third glue grooves 9116 are provided on the first side surface 9112 of the first notch 911 and the side of the support member 918 facing the circuit board 300. These third glue grooves 9116 form a grid-like structure around the first side surface 9112 of the first notch 911 and the side of the support member 918 facing the circuit board 300. Glue is placed in the third glue grooves 9116 within the grid-like structure, and each grid within the grid-like structure is also coated with glue. The plurality of third glue grooves 9116 form a grid-like structure around the first side surface 9112 of the first notch 911 and the side of the support member 918 facing the circuit board 300. This not only ensures a sufficient amount of glue between the circuit board 300 and the transceiver tube body 901, but also increases the contact area between the circuit board 300 and the transceiver tube body 901, thereby enhancing the bonding strength between the circuit board 300 and the transceiver tube body 901.

[0129] Figure 24 is an exploded view of the optical receiving component in the optical module provided according to an embodiment of the present disclosure, Figure 25 is an exploded view of the optical receiver and the transceiver tube body in the optical module provided according to an embodiment of the present disclosure, and Figure 26 is a cross-sectional view of the optical transceiver component in the optical module provided according to an embodiment of the present disclosure. As shown in Figures 24-26, in some embodiments of the present disclosure, the optical receiver 903 includes a fiber collimator group, a wave splitter group 933, a turning prism 935, a fourth lens group 936, and a light receiving chip group 937. The wave splitter group 933 is located between the fiber collimator group and the turning prism 935. The fiber collimator group is used to collimate the two received optical signals. The wave splitter group 933 splits the collimated two optical signals into eight optical signals. The collimated eight optical signals are reflected by the turning prism 935. The fourth lens group 936 converges the collimated eight optical signals. The light receiving chip group 937 converts the eight received optical signals into electrical signals.

[0130] In some examples of the embodiments of the present disclosure, the optical receiver 903 may not be provided with the fourth lens group 936, that is, the eight optical signals after being turned by the turning prism 935 are emitted from the exit surface of the turning prism 935 and received by the optical receiving chip group 937, and the optical receiving chip group 937 converts the received eight optical signals into electrical signals.

[0131] In some embodiments, the fiber collimator assembly includes a plurality of fiber collimators. For example, the fiber collimator assembly includes two fiber collimators arranged in parallel, one fiber collimator collimating the received 400G optical signal. The two fiber collimators collimate the received 400G optical signal respectively.

[0132] In some embodiments of the present disclosure, the fiber collimator is an integrated fiber collimator.

[0133] In other embodiments of the present disclosure, the fiber collimator is a combined fiber collimator formed by combining a fiber array and a collimating lens.

[0134] In other embodiments of the present disclosure, the fiber collimator is a combined fiber collimator formed by combining a fiber adapter and a collimating lens. A fiber adapter receives a 400G optical signal, and a collimating lens collimates the 400G optical signal received by the fiber adapter.

[0135] Since the fiber collimator can be a standard fiber collimator or a structural component formed by combining a fiber adapter and a collimating lens, the fiber collimator set can be two integrated fiber collimators arranged in parallel, two combined fiber collimators arranged in parallel, or one integrated fiber collimator and one combined fiber collimator arranged in parallel.

[0136] As shown in Figures 24 and 25, the fiber collimator group includes a dual fiber array 701 and a third lens group 932. The dual fiber array 701 refers to two parallel optical fibers installed on a substrate at a specified interval. The third lens group 932 includes two parallel third lenses. The third lens is a collimating lens. A collimating lens collimates the 400G optical signal transmitted by an optical fiber.

[0137] In some embodiments, the splitter group 933 includes a plurality of splitters arranged in parallel. For example, the splitter group 933 includes two splitters arranged in parallel, where one splitter splits the collimated 400G optical signal into four 100G optical signals of different wavelengths.

[0138] The wave splitter can be a z-block type wave splitter or an awg (arrayed waveguide grating) type wave splitter. In a specific example of the embodiment of the present disclosure, the wave splitter takes a z-block type wave splitter as a specific example.

[0139] In some embodiments of the present disclosure, bonding multiple parallel wave splitters not only reduces the space occupied by the wave splitter group 933 in the width direction of the transceiver tube body 901, thereby reducing the width of the transceiver tube body 901, but also shortens the distance between all light output ports of the wave splitter group 933 and the central axis of the wave splitter group 933, thereby shortening the distance between two adjacent light output ports at the connection between two wave splitters. The width direction of the transceiver tube body 901 refers to the CD direction of the transceiver tube body 901 (for example, refer to the direction shown by CD in Figure 11).

[0140] In some embodiments of the present disclosure, the incident surface and the output surface of the splitter are arranged parallel to each other, so that the multi-path optical signals split by the splitter are output in parallel and collimated manner with equal spacing.

[0141] In other embodiments of the present disclosure, the turning prism 935 includes an incident surface, a turning surface and an exit surface. The incident surface of the turning prism 935 faces the splitter group 933, and the exit surface of the turning prism 935 faces the light receiving chip group 937. The turning surface of the turning prism 935 is located behind the incident surface of the turning prism 935 and above the exit surface of the turning prism 935. The inclination angle of the turning surface of the turning prism 935 is a second preset angle so that the optical signal incident on the turning surface of the turning prism 935 can be emitted vertically.

[0142] In some embodiments, the second preset angle is less than 45° to reduce the return of light signals along the original path. For example, the second preset angle is between 39° and 43°. In some examples, the second preset angle can be 39°, 40°, 41°, 42°, or 43°. It should be understood that the specific value of the second preset angle in the embodiments of the present disclosure is merely provided as an example and does not limit the specific value of the second preset angle.

[0143] It should be noted here that the numerical values ​​and numerical ranges involved in the embodiments of the present disclosure are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors. Those skilled in the art may consider this part of the error to be negligible.

[0144] In some embodiments of the present disclosure, as shown in FIG24 , the fourth lens group 936 includes a plurality of focusing lenses arranged in parallel. For example, the fourth lens group 936 includes eight focusing lenses arranged in parallel.

[0145] A DSP chip is provided on the upper surface of the circuit board 300, and a TIA (transimpedance amplifier chip) is integrated in the DSP chip. The first electrical connection points in the DSP chip 302 are arranged in a regular pattern, so the spacing between the two adjacent first electrical connection points of the DSP chip 302 is equal. In order to ensure the high-frequency performance of the optical module, the first electrical connection point of the DSP chip 302 is required to be at the shortest wire bonding distance to the first soldering pad of the optical receiving chip group 937. That is, the spacing between the first soldering pads of the two adjacent optical receiving chips in the optical receiving chip group 937 is required to be equal and the second fixed value. However, since the spacing between the first soldering pads of the two adjacent optical receiving chips in the optical receiving chip group 937 can only be the first fixed value for the time being, the spacing between the first soldering pads of the two adjacent optical receiving chips in the optical receiving chip group 937 is required to be the first fixed value. The spacing between the two adjacent light output ports of a single splitter is equal and equal to the spacing between the first soldering pads of the two adjacent optical receiving chips. However, when two wave splitters form a wave splitter group, the distance between two adjacent light outlets between the two wave splitters (in some examples, referred to as the second distance) is greater than the distance between two adjacent light outlets of a single wave splitter (in some examples, referred to as the first distance), so that the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters is greater than the distance between the light paths emitted from two adjacent light outlets of a single wave splitter, that is, the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters is greater than the distance between the first solder pads of two adjacent light receiving chips in the light receiving chip group. In order to solve this problem, in some embodiments, the wave splitter can be adjusted to shorten the distance between the light paths emitted from two adjacent light outlets between two adjacent wave splitters. However, this requires re-customizing a new wave splitter to achieve this, which greatly increases the production cost.

[0146] To address this issue, in some embodiments, an optical path offset plate group 934 is used to shorten the spacing between light paths emitted from two adjacent light outlets between two adjacent wave splitters. For example, the optical path offset plate group 934 shortens the spacing between light paths emitted from two adjacent light outlets between two adjacent wave splitters, thereby ensuring that the spacing between adjacent light paths in all offset light paths is equal and a first constant value. Specifically, the optical path offset plate group 934 is disposed behind the wave splitter group 933 and is located between the wave splitter group 933 and the turning prism 935. The light paths are offset after being refracted by the optical path offset plate group 934. After the offset, the spacing between adjacent light paths in all offset light paths is equal, close, or approximately the same. The offset multi-path optical signals are then reflected by the turning prism 935 and emitted vertically.

[0147] In some embodiments, the central axis of the optical path offset plate group 934 coincides with the central axis of the splitter group 933, so that all light paths after splitting by the splitter group 933 can be received by the optical path offset plate group 934 and are all offset by the optical path offset plate group 934, thereby improving the coupling efficiency.

[0148] In some embodiments of the present disclosure, the optical path shifting plate set 934 includes at least one optical path shifting plate. For example, the optical path shifting plate set 934 includes one optical path shifting plate, which shifts eight 100G optical signals of different wavelengths toward the central axis of the optical path shifting plate set 934.

[0149] In other embodiments of the present disclosure, the optical path shifting plate set 934 includes at least two parallel optical path shifting plates, one optical path shifting plate corresponding to one wavelength splitter, and one optical path shifting plate shifts four 100G optical signals of different wavelengths toward the central axis of the optical path shifting plate set 934. In some examples, the optical path shifting plate set 934 includes two parallel optical path shifting plates, one optical path shifting plate corresponding to one wavelength splitter.

[0150] In some embodiments, the incident surface of the optical path offset plate is parallel or approximately parallel to the exit surface of the splitter, so that the optical signals incident on the optical path offset plate are equidistant and parallel to each other, avoiding interference between two adjacent optical signals incident on the optical path offset plate.

[0151] In other embodiments, the incident surface and the exit surface of the optical path offset plate group 934 are parallel to each other, so that the light signal incident to the incident surface of the optical path offset plate group 934 and the light signal exiting to the exit surface of the optical path offset plate group 934 are parallel to each other, without changing the direction of the light path, and only reducing the distance between the light path and the center axis of the optical path offset plate group 934.

[0152] In some embodiments, the optical path offset plates arranged in parallel are bonded together, which can not only reduce the space occupied by the optical path offset plate group 934 in the width direction of the transceiver tube body 901, thereby reducing the width size of the transceiver tube body 901; it can also shorten the distance between each optical signal after demultiplexing by the demultiplexer group 933 and the central axis of the optical path offset plate group 934, thereby shortening the distance between the two adjacent optical paths at the connection of the two optical path offset plates to match the optical receiving chip group 937.

[0153] FIG27 is a schematic diagram of a light path shifting plate in an optical module according to an embodiment of the present disclosure. As shown in FIG27 , the light path is shifted after being refracted by the light path shifting plate. The light path shift amount d is in a preset relationship with the refractive index n2 of the light path shifting plate, the thickness h of the light path shifting plate, and the incident angle α1 of the light path. The preset relationship is: Where d is the optical path offset, h is the thickness of the optical path offset plate, α1 is the incident angle, n2 is the refractive index of the optical path offset plate, and n1 is the refractive index of air.

[0154] In some embodiments of the present disclosure, the optical module includes a circuit board and an optical transceiver component, which is connected to the circuit board. An electrical chip and an optical receiving chip group are provided on the circuit board, the electrical chip is connected to the optical receiving chip group, and the spacing between two adjacent first electrical connection points of the electrical chip is equal. In order to ensure the high-frequency performance of the optical module, it is required that the spacing between the first solder pads of two adjacent optical receiving chips of the optical receiving chip group connected to the first electrical connection point of the electrical chip is equal. The optical receiving component includes an optical receiver, the optical receiver includes a wave splitter group, a turning prism and an optical receiving chip group, the turning prism is located above the optical receiving chip group, the optical receiving chip group includes a plurality of optical receiving chips arranged in parallel, and the spacing between the first solder pads of two adjacent optical receiving chips is equal. The wavelength splitter group includes at least two wavelength splitters. The spacing between two adjacent light output ports of a single wavelength splitter is equal to the spacing between the first pads of two adjacent optical receiving chips. The spacing between two adjacent light output ports between two adjacent wavelength splitters is greater than the spacing between two adjacent light output ports of a single wavelength splitter, that is, the spacing between two adjacent light output ports between two adjacent wavelength splitters is greater than the spacing between the first pads of two adjacent optical receiving chips, resulting in the multi-path optical signal after being beamed by the wavelength splitter group being unable to be fully coupled to the corresponding optical receiving chip, thereby reducing the coupling efficiency.

[0155] To avoid this problem, an optical path offset plate group is provided after the wave splitter group. The optical path offset plate group is located between the wave splitter group and the turning prism. The optical path offset plate group is used to shorten the spacing of the light paths emitted from two adjacent light outlets between two adjacent wave splitters, so that the spacing between two adjacent light paths in all offset light paths is equal to the spacing between the first pads of two adjacent light receiving chips in the light receiving chip group. This allows the offset light paths to be coupled to the corresponding light receiving chips as much as possible after reflection by the turning prism, thereby improving the coupling efficiency. The adjacent two light outlets between two adjacent wave splitters refer to the light outlet of the first wave splitter of the two adjacent wave splitters that is closest to the second wave splitter and the light outlet of the second wave splitter of the two adjacent wave splitters that is closest to the first wave splitter.

[0156] In some embodiments, the distance between the light paths emitted from two adjacent light outlets between two adjacent splitters is shortened by an optical path offset plate group, so that the distance between the two adjacent light paths after offset is equal to the distance between the first pads of two adjacent light receiving chips in the light receiving chip group, thereby improving the coupling efficiency.

[0157] Figure 28 is an assembly diagram of the turning prism and the fourth lens group in the optical module according to an embodiment of the present disclosure, Figure 29 is an optical path diagram of the optical receiver in the optical module according to an embodiment of the present disclosure, and Figure 30 is an optical path diagram of the optical receiver in the optical module according to an embodiment of the present disclosure from another perspective. As shown in Figures 28-30, in some embodiments of the present disclosure, the fourth lens group 936 is located between the turning prism 935 and the optical path offset plate group 934. The fourth lens group 936 converges the offset optical signal onto the turning prism 935. The fourth lens group 936 can be mounted on the surface of the turning prism 935 facing the optical path offset plate group 934; it can also be placed on the receiving slot 913 without contacting the turning prism 935.

[0158] In some embodiments of the present disclosure, a fourth lens group 936 is positioned between the turning prism 935 and the light receiving chipset group 937. The fourth lens group 936 converges the reflected light signal onto the light receiving chipset group 937 to enable light signal reception. The fourth lens group 936 can be mounted on the side of the turning prism 935 facing the light receiving chipset group 937, or it can be placed on the circuit board 300 via a support frame and not in contact with the turning prism 935.

[0159] As shown in Figure 28 , in the disclosed embodiment, the fourth lens group 936 is mounted on the side of the turning prism 935 facing the light receiving chipset 937. This reflects and converges the collimated light, reducing optical path loss and improving coupling efficiency. Furthermore, the fourth lens group 936 is mounted on the side of the turning prism 935 facing the light receiving chipset 937, shortening the distance between the turning prism 935 and the light receiving chipset 937, thereby reducing the height of the transceiver tube 901.

[0160] In order to improve the coupling efficiency, as shown in Figures 8 and 30, in some embodiments, a storage groove 301 is provided on the upper surface of the circuit board 300, and a storage substrate 311 is provided in the storage groove 301. A light receiving chip group 937 is placed on the storage substrate 311. The vertical distance between the fourth lens group 936 and the light receiving chip group 937 is the focal length of the fourth lens group 936, so that the light spot after the fourth lens group 936 converges falls exactly on the light receiving chip group 937, thereby improving the coupling efficiency.

[0161] It can be understood that in some examples, the optical receiving chip group 937 can also be set on the surface of the circuit board 300. Accordingly, the fourth lens group 936 is supported toward the side facing away from the circuit board 300 by setting a gasket or a support member, so that the vertical distance between the fourth lens group 936 and the receiving chip group 937 is the focal length of the fourth lens group 936.

[0162] In other examples, a storage groove 301 may be provided on the upper surface of the circuit board, and the optical receiving chip group 937 may be provided in the storage groove 301. That is, no storage substrate 311 is provided in the storage groove 301. Accordingly, the fourth lens group 936 is supported toward the side facing away from the circuit board 300 by providing a gasket or a support member, so that the vertical distance between the fourth lens group 936 and the receiving chip group 937 is the focal length of the fourth lens group 936.

[0163] The DSP chip 302 is connected to the solder pad on the circuit board 300 through the second solder ball, and the optical receiving chip group 937 is placed on the placement substrate 311, shortening the wiring distance between the first solder ball of the DSP chip 302 and the optical receiving chip, reducing the loss of high-frequency signals, and improving the high-frequency performance of the optical module.

[0164] As shown in Figures 29 and 30, in some embodiments, the 800G optical signal is collimated by the third lens group 932, and the collimated 800G optical signal is divided into eight 100G optical signals by the splitter group 933. The eight 100G optical signals are offset by the optical path offset plate group 934, and the offset eight 100G optical signals are reflected by the turning prism 935. The reflected eight 100G optical signals are converged to the optical receiving chip group 937 through the fourth lens group 936, and the optical receiving chip group 937 converts the eight 100G optical signals into eight 100G electrical signals.

[0165] Figure 31 illustrates an assembly diagram of an optical receiver and a receiving substrate in an optical module according to an embodiment of the present disclosure. As shown in Figures 26 and 31 , in some embodiments, the central axes of the dual-fiber array 701, the third lens group 932, and the wave splitter group 933 coincide. The dual-fiber array 701, the third lens group 932, the wave splitter group 933, the optical path offset plate group 934, and the turning prism 935 are all secured to the receiving substrate 906. The receiving substrate 906 is secured within the receiving slot 913 and extends beyond the end of the receiving slot 913.

[0166] In some embodiments, the central axes of the dual fiber array 701 , the third lens group 932 , and the wave splitter group 933 coincide, and the dual fiber array 701 , the third lens group 932 , and the wave splitter group 933 are directly fixed in the receiving slot 913 .

[0167] In order to improve the coupling efficiency of the dual-fiber array 701, the third lens group 932 and the wave splitter group 933, in some embodiments of the present disclosure, a plurality of supporting bosses of successively increasing heights are provided at the positions of the receiving slot 913 corresponding to the dual-fiber array 701, the third lens group 932 and the wave splitter group 933, so that the central axes of the dual-fiber array 701 and the third lens group 932 coincide with the central axis of the light entrance of the wave splitter group 933, thereby improving the coupling efficiency.

[0168] Figure 32 is another structural diagram of a receiving substrate in an optical module according to an embodiment of the present disclosure, Figure 33 is another assembly diagram of an optical receiver and a receiving substrate in an optical module according to an embodiment of the present disclosure, and Figure 34 is another assembly diagram of an optical receiver and a transceiver tube in an optical module according to an embodiment of the present disclosure. As shown in Figures 32-34, in some embodiments of the present disclosure, a receiving substrate 906 is disposed on a receiving slot 913. The receiving substrate 906 is provided with a dual-fiber array 701, a third lens group 932, a wave splitter group 933, and an optical path shifting plate group 934. A turning prism 935 is disposed within the receiving slot 913. The receiving substrate 906 is provided with support surfaces of successively increasing heights along the propagation direction of the receiving light path, so that the central axes of the dual-fiber array 701, the central axes of the third lens group 932, and the central axes of the light entrance of the wave splitter group 933 coincide with each other, thereby improving coupling efficiency.

[0169] For example, the upper surface of the receiving substrate 906 is provided with a first supporting surface 961, a second supporting surface 962, and a third supporting surface 963 along the propagation direction of the receiving light path. The heights of the first supporting surface 961, the second supporting surface 962, and the third supporting surface 963 are increased in sequence. The dual-fiber array 701 is placed on the first supporting surface 961, the third lens group 932 is placed on the second supporting surface 962, and the wave splitter group 933 and the optical path offset plate group 934 are placed on the third supporting surface 963, so that the central axes of the dual-fiber array 701 and the third lens group 932 coincide with the central axis of the light entrance port of the wave splitter group 933, thereby improving the coupling efficiency.

[0170] As shown in FIG34 , in some embodiments, the receiving slot 913 includes a first receiving slot portion 9131 and a second receiving slot portion 9132. The receiving substrate 906 is placed on the first receiving slot portion 9131. The dual-fiber array 701, the third lens group 932, the splitter group 933, and the optical path offset plate group 934 are placed on the receiving substrate 906. The end of the first receiving slot portion 9131 extends out of the end of the side wall of the transceiver tube body 901. The turning prism 935 is not placed on the receiving substrate 906. The turning prism 935 is placed on the receiving substrate 906. At the end of the first receiving groove 9131 of the slot 913, the optical fiber connected to the dual-fiber array 701 is placed in the second receiving groove 9132. The second receiving groove 9132 is higher than the first receiving groove 9131. In other words, the depth of the second receiving groove 9132 recessed from the transceiver tube body 901 is less than the depth of the first receiving groove 9131. This ensures that the central axis of the optical fiber connected to the dual-fiber array 701 coincides with the central axis of the dual-fiber array 701, thus preventing damage to the optical fiber connected to the dual-fiber array 701. The term "end of the first receiving groove 9131" refers to the end of the first receiving groove 9131 away from the second receiving groove 9132, and the term "end of the side wall of the transceiver tube body 901" refers to the end of the side wall of the transceiver tube body 901 away from the second receiving groove 9132.

[0171] In some examples, the turning prism 935 can also be placed on the end of the receiving substrate 906 facing the circuit board 300, and the end of the receiving substrate 906 facing the circuit board 300 can extend outside the first receiving groove 9131. It is understood that the surface of the receiving substrate 906 where the turning prism 935 is placed can be lower than the surface where the dual-optical path offset plate assembly 934 is placed.

[0172] As shown in FIG32 , in some embodiments, a third engaging surface 919 is provided on the upper surface of the transceiver tube body 901. The third engaging surface 919 is formed by an inward depression of the sidewall of the transceiver tube body 901. The third engaging surface 919 and the sidewall of the transceiver tube body 901 form a third limiting notch. For example, the third engaging surface 919 and the sidewall of the transceiver tube body 901 extending from the third engaging surface 919 form the third limiting notch.

[0173] As shown in FIG32 , in some embodiments, a fourth engaging surface 9191 is provided at one end of the transceiver tube body 901 proximal to the circuit board 300. The fourth engaging surface 9191 faces the circuit board 300. The fourth engaging surface 9191, the bottom surface of the receiving slot 913, and the sidewalls of the transceiver tube body 901 form a fourth limiting notch. For example, the fourth engaging surface 9191, the bottom surface of the receiving slot 913, and the sidewalls of the transceiver tube body 901 extending beyond the bottom surface of the receiving slot 913 form the fourth limiting notch.

[0174] In some embodiments, a limiting surface is provided on the side wall of the transceiver tube body 901 , and the limiting surface is used to define the position of the receiving substrate 906 .

[0175] FIG35 is a structural diagram of the transceiver tube body in an optical module according to an embodiment of the present disclosure from another perspective, FIG36 is a structural diagram of the second receiving cover plate in an optical module according to an embodiment of the present disclosure, and FIG37 is an assembly diagram of the transceiver tube body and the second receiving cover plate in an optical module according to an embodiment of the present disclosure. As shown in FIG35-37, the side wall of the transceiver tube body 901 has a third limiting surface 9194. The third limiting surface 9194 is located between two parallel surfaces of the side wall of the transceiver tube body 901. The receiving substrate 906 is connected to the third limiting surface 9194. The third limiting surface 9194 is a curved surface. The two third limiting surfaces 9194 are symmetrically arranged along the length of the transceiver tube body 901. The two third limiting surfaces 9194 gradually reduce the distance between the side walls of the transceiver tube body 901 from closer to the circuit board 300 to farther away from the circuit board 300, thereby limiting the position of the receiving substrate 906 within the receiving slot 913 and facilitating the placement of the receiving substrate 906.

[0176] As shown in Figures 36 and 37, in order to facilitate the installation of the receiving cover plate 905, in some embodiments of the present disclosure, the receiving cover plate 905 includes a first receiving cover plate 951 and a second receiving cover plate 952 (for example, as shown in Figure 24), the first end of the first receiving cover plate 951 is covered on the third clamping surface 919, and the side wall of the first end of the first receiving cover plate 951 is clamped on the inner surface of the side wall of the transceiver tube body 901, so that the first receiving cover plate 951 is clamped on the third limiting notch; the second end of the first receiving cover plate 951 is covered on the second receiving cover plate 95 2, so that the first receiving cover plate 951 and the second receiving cover plate 952 are sealed and connected; the first end of the second receiving cover plate 952 covers the bottom surface of the receiving groove 913, the first end surface of the second receiving cover plate 952 is clamped on the fourth clamping surface 9191, and the side surface of the second receiving cover plate 952 is clamped on the side wall of the transceiver tube body 901, so that the second receiving cover plate 952 is clamped in the fourth limiting notch; the lower surface of the second end of the second receiving cover plate 952 is clamped on the circuit board 300, so that the second receiving cover plate 952 is connected to the circuit board 300.

[0177] The second end of the second receiving cover 952 is not located at the end of the side wall of the transceiver tube body 901, but extends out of the end of the side wall of the transceiver tube body 901, so that the optical receiver 903 is placed in the receiving cavity formed by the receiving cover 905, the transceiver tube body 901 and the circuit board 300.

[0178] To seal the first receiving cover plate 951 to the transceiver tube body 901, in some embodiments, the shape of the first receiving cover plate 951 matches the shape of the third engaging surface 919. For example, the shape of the first receiving cover plate 951 is the same as or similar to the shape of the third engaging surface 919.

[0179] In some embodiments, one end of the second receiving cover 952 is clamped in the receiving groove 913 of the transceiver tube body 901, and the other end of the second receiving cover 952 is clamped on the circuit board 300 to achieve a sealed connection between the second receiving cover 952 and the transceiver tube body 901 and the circuit board 300.

[0180] To facilitate securing the second receiving cover plate 952 to the receiving slot 913 and the circuit board 300, in some embodiments, the second receiving cover plate 952 is bent so that one end of the second receiving cover plate 952 is parallel to the circuit board 300 and the other end of the second receiving cover plate 952 is perpendicular to the circuit board 300. The second receiving cover plate 952 is bent so that the first end of the second receiving cover plate 952 is secured to the receiving slot 913 and the second end of the second receiving cover plate 952 is secured to the circuit board 300.

[0181] In order to seal the second receiving cover plate 952 with the transceiver tube body 901 and the circuit board 300, in some embodiments, a snap-fit ​​notch 9524 (see FIG. 36 ) is provided on the lower surface of the second receiving cover plate 952. One side surface of the snap-fit ​​notch 9524 contacts and connects with the end surface of the receiving groove 913, so that the second receiving cover plate 952 is snap-fitted to the receiving groove 913 of the transceiver tube body 901, thereby sealing the second receiving cover plate 952 with the transceiver tube body 901 and the circuit board 300.

[0182] In some embodiments, the two side surfaces surrounding the snap-fitting notch 9524 are respectively contacted and connected with the end face of the receiving groove 913 and the bottom face of the receiving groove 913, so that the second receiving cover 952 is snapped onto the receiving groove 913 of the transceiver tube body 901, thereby sealingly connecting the second receiving cover 952 to the transceiver tube body 901 and the circuit board 300.

[0183] To achieve a sealed connection between the first receiving cover plate 951 and the second receiving cover plate 952, in some embodiments, the upper surface of the second receiving cover plate 952 has a fourth support surface 9527, which is arranged parallel to the first receiving cover plate 951. The second end of the first receiving cover plate 951 is placed on the fourth support surface 9527 to achieve a sealed connection between the first receiving cover plate 951 and the second receiving cover plate 952.

[0184] In some embodiments, the second receiving cover plate 952 includes a support arm 9521 and a clamping arm 9522, the clamping arm 9522 is close to the first receiving cover plate 951, and the support arm 9521 is away from the first receiving cover plate 951, the clamping arm 9522 has a clamping notch 9524, and the thickness of the clamping arm 9522 is smaller than the thickness of the support arm 9521, so that the clamping arm 9522 is clamped on the receiving groove 913, and the support arm 9521 is fixed on the circuit board 300.

[0185] In order to reserve a sufficient safety distance for the turning prism 935, in some embodiments of the present disclosure, the second receiving cover 952 is provided with a first avoidance gap 9523, which exposes the top surface of the turning prism 935 so that a sufficient safety distance is left between the top surface of the turning prism 935 and the first receiving cover 951.

[0186] In some optional examples, the first avoidance notch 9523 may be a half-hole structure as shown in Figure 36. It is understood that in some examples, a groove or a through hole (e.g., a full hole) may be provided at a position on the second receiving cover plate 952 corresponding to the turning prism 935 to avoid the turning prism 925.

[0187] In other embodiments of the present disclosure, the second receiving cover plate 952 is provided with a second avoidance groove 9528 (see FIG. 38 ). The second avoidance groove 9528 is located at the bottom of the first avoidance notch 9523 . The second avoidance groove 9528 is provided corresponding to the turning surface of the turning prism 935 . The minimum vertical distance between the second avoidance groove 9528 and the turning prism 935 is greater than a preset distance to avoid the turning surface of the turning prism 935 and thereby prevent wear of the turning prism 935 .

[0188] For example, the second avoidance groove 9528 and the turning surface of the turning prism 935 have the same or similar inclination angle. That is, the second avoidance groove 9528 and the turning surface of the turning prism 935 can be parallel or approximately parallel, and the vertical distance between the second avoidance groove 9528 and the turning surface of the turning prism 935 is greater than the preset distance, so as to avoid the turning prism 935 and thereby prevent wear of the turning prism 935. In some examples, the preset distance can be designed according to actual production needs, for example, according to the volume and size requirements of the optical module provided in the embodiments of the present disclosure; in some examples, the preset distance can be 0.5 mm, 1.0 mm, or 1.5 mm, etc. It will be understood that the specific value of the preset distance in the embodiments of the present disclosure is merely an illustration of the distance and does not specifically limit the preset distance.

[0189] The second receiving cover 952 includes a support arm 9521 and two clamping arms 9522. The two clamping arms 9522 are respectively connected to the two ends of the support arm 9521 so that the top view of the second receiving cover 952 is U-shaped. The two clamping arms 9522 and the support arm 9521 form a first avoidance opening 9523, and the lower surface of the support arm 9521 is recessed inward to form a second avoidance groove 9528.

[0190] As shown in Figure 37, the bottom surface of the clamping arm 9522 is in contact with the bottom surface of the first receiving groove 9131, one side wall of the clamping arm 9522 is in contact with one side of the fourth limiting notch, and the end face of the clamping arm 9522 is in contact with the fourth clamping face 9191, so as to realize a sealed connection between the clamping arm 9522 and the fourth limiting notch.

[0191] Figure 38 is a structural diagram of the second receiving cover plate in an optical module provided in accordance with an embodiment of the present disclosure, viewed from another perspective. Figure 39 is an assembly diagram of the transceiver tube body and the second receiving cover plate in an optical module provided in accordance with an embodiment of the present disclosure, viewed from another perspective. As shown in Figures 38 and 39, in some embodiments, the lower surface of the second end of the second receiving cover plate 952 is provided with a second relief notch 9526 and a second support boss 9525. The second relief notch 9526 is located between the two second support bosses 9525. The second support bosses 9525 are in contact with the upper surface of the circuit board 300, with a gap between the second relief notch 9526 and the upper surface of the circuit board 300. The second relief notch 9526 is configured to provide clearance for electronic components on the circuit board 300. Specifically, the vertical distance between the second relief notch 9526 and the upper surface of the circuit board 300 is greater than the vertical distance between the second support bosses 9525 and the upper surface of the circuit board 300, so that the second relief notch 9526 clears the electronic components on the circuit board 300.

[0192] FIG40 is a structural diagram of a transceiver tube body in an optical module provided according to an embodiment of the present disclosure from another perspective, FIG41 is a structural diagram of a fixing member in an optical module provided according to an embodiment of the present disclosure, and FIG42 is another assembly diagram of an optical receiver and a transceiver tube body in an optical module provided according to an embodiment of the present disclosure. As shown in FIG40-42, in some embodiments of the present disclosure, the receiving slot 913 of the transceiver tube body 901 includes a first receiving slot portion 9131, a second receiving slot portion 9132, and a third receiving slot portion 9134. The third receiving slot portion 9134, the first receiving slot portion 9131, and the second receiving slot portion 9132 are arranged in sequence along the length direction of the transceiver tube body 901. The second receiving slot portion 9132 is used to place an optical fiber connected to the dual optical fiber array 701. The first receiving slot portion 9131 is used to place a receiving substrate 906. No turning prism 935 is placed on the receiving substrate 906. The third receiving slot portion 9134 is used to place a turning prism 935. The third receiving slot portion 9134, the first receiving slot portion 9131, and the second receiving slot portion 9132 are used to place an optical fiber connected to the dual optical fiber array 701. The height of the receiving groove portion 9132 is gradually increased, which not only allows the central axis of the optical fiber connected to the dual-fiber array 701 to coincide with the central axis of the dual-fiber array 701, thereby avoiding damage to the optical fiber connected to the dual-fiber array 701; it also allows the output surface of the optical path offset plate group 934 to be located on the projection of the turning prism 935. In other words, all light emitted from the output surface of the optical path offset plate group 934 is projected onto the turning prism 935, and the photosensitive surface of the optical receiving chip group 937 is located within the projection area of ​​the turning surface 9351 of the turning prism 935, so that all optical signals offset by the optical path offset plate group 934 are reflected by the turning prism 935 and then received by the optical receiving chip group 937, thereby improving the coupling efficiency.

[0193] In some examples, the receiving slot 913 may include only a first receiving slot portion 9131 and a second receiving slot portion 9132. When the end of the first receiving slot portion 9131 extends out of the side wall end of the transceiver tube body 901, the end of the first receiving slot portion 9131 and the support member 918 may be one structural member; or they may be two structural members.

[0194] In other examples, the receiving slot 913 may also include a first receiving slot portion 9131, a second receiving slot portion 9132 and a third receiving slot portion 9134, and the third receiving slot portion 9134 and the support member 918 may be one structural member; or they may be two structural members.

[0195] In order to prevent glue from overflowing onto the receiving substrate 906, in some embodiments, an overflow glue groove 9133 is provided in the first receiving groove portion 9131. The overflow glue groove 9133 is located at the edge of the first receiving groove portion 9131. The height of the overflow glue groove 9133 is lower than the height of the first receiving groove portion 9131, so that the glue after bonding enters the overflow glue groove 9133 to prevent glue from overflowing onto the receiving substrate 906.

[0196] In order to achieve the limiting and fixing of the receiving substrate 906, in some embodiments, the transceiver tube body 901 is provided with a first limiting surface 9192 and a second limiting surface 9193, and the first limiting surface 9192 and the second limiting surface 9193 are both facing the circuit board 300. The first limiting surface 9192 is located on one side wall of the transceiver tube body 901, and the second limiting surface 9193 is located on the other side wall of the transceiver tube body 901. The first limiting surface 9192 is closer to the circuit board 300 than the second limiting surface 9193. The receiving substrate 906 stops at the first limiting surface 9192 to facilitate limiting the position of the receiving substrate 906 in the receiving groove 913; the overflow glue groove 9133 stops at the second limiting surface 9193 to increase the area of ​​the overflow glue groove 9133, increase the capacity of the overflow glue groove 9133 to accommodate glue, and further prevent the glue from overflowing onto the receiving substrate 906.

[0197] To further define the position of the receiving substrate 906 within the receiving groove 913, in some embodiments, the width of the first receiving groove 913 matches the width of the receiving substrate 906. For example, the width of the first receiving groove 913 is greater than or equal to the width of the receiving substrate 906. For example, the width of the first receiving groove 913 is equal to the width of the receiving substrate 906.

[0198] To secure the dual-fiber array 701, as shown in Figures 41 and 42 , in some embodiments, a fixing member 907 is disposed above the dual-fiber array 701, and the fixing member 907 is stopped at a first limiting surface 9192. The fixing member 907 is provided with a fixing groove 971, which engages with the top of the dual-fiber array 701 to secure the dual-fiber array 701.

[0199] In some embodiments, the upper surface of the optical path offset plate group 934 is lower than the top of the turning surface 9351 of the turning prism 935, and the lower surface of the optical path offset plate group 934 is higher than the bottom of the turning surface 9351 of the turning prism 935, that is, the exit surface of the optical path offset plate group 934 is located between the bottom of the turning surface 9351 of the turning prism 935 and the top of the turning surface 9351 of the turning prism 935, so that all the light paths emitted by the optical path offset plate group 934 enter the turning prism 935 and are reflected by the turning prism 935; the photosensitive surfaces of the light receiving chip group 937 are all located directly below the turning surface 9351 of the turning prism 935, that is, the photosensitive surfaces of the light receiving chip group 937 are located between the projection area of ​​the top of the turning surface 9351 of the turning prism 935 and the projection area of ​​the lower end of the turning surface 9351, so that all the light signals of the converged light after reflection by the turning prism 935 are received by the photosensitive surface of the light receiving chip group 937. Therefore, the turning prism 935 can be fixed on the receiving substrate 906, as shown in Figure 31; the turning prism 935 can also be fixed on the end of the first receiving groove portion 9131 of the receiving groove 913, as shown in Figure 34; the turning prism 935 can also be fixed on the third receiving groove portion 9134 of the receiving groove 913, as shown in Figure 42.

[0200] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: A circuit board, on which an electric chip and a light receiving chip group are arranged; the electric chip is connected to the light receiving chip group, and the distances between two adjacent first electrical connection points of the electric chip are equal; The optical transceiver component comprises a transceiver tube body, wherein a first notch is provided at one end of the transceiver tube body facing the circuit board, and the circuit board is clamped at the first notch; The upper surface of the transceiver tube body is provided with a receiving groove, and the receiving groove includes a first receiving groove part and a second receiving groove part, wherein a receiving substrate and an optical receiver are arranged in the first receiving groove part; the second receiving groove part is configured to place an optical fiber, and the height of the first receiving groove part is lower than the height of the second receiving groove part; The optical receiver includes a fiber collimator group, a wave splitter group, an optical path offset plate group and a turning prism, wherein the fiber collimator group is connected to the optical fiber, wherein the fiber collimator group, the wave splitter group and the optical path offset plate group are arranged on the receiving substrate, and the optical path offset plate group is located between the wave splitter group and the turning prism; the turning prism is located above the optical receiving chip group, the optical receiving chip group includes a plurality of optical receiving chips arranged in parallel, and the first pads of the plurality of optical receiving chips are arranged at equal intervals, the wave splitter group includes at least two wave splitters, the wave splitter has a plurality of light outlets, any two adjacent light outlets of the plurality of light outlets have a first spacing, one of the light outlets of the wave splitter is adjacent to one of the light outlets of an adjacent wave splitter, and has a second spacing; the second spacing is greater than the first spacing; the optical path offset plate group is configured to shorten the second spacing between the light paths emitted from the two adjacent light outlets between the two adjacent wave splitters.

2. The optical module according to claim 1, wherein: The optical path is offset after being refracted by the optical path offset sheet group, and the distance between two adjacent optical paths in all the offset optical paths is equal to the distance between the first pads of two adjacent optical receiving chips; the optical path offset amount is in a preset relationship with the refractive index of the optical path offset sheet group, the thickness of the optical path offset sheet group and the incident angle of the optical path.

3. The optical module according to claim 1, wherein: The optical receiver also includes a fourth lens group; the splitter group is located between the optical fiber collimator group and the optical path offset plate group, the fourth lens group is fixedly connected to a side of the turning prism facing the optical receiving chip group, a placement groove is provided on the circuit board, a placement substrate is provided in the placement groove, and the optical receiving chip group is placed on the placement substrate.

4. The optical module according to claim 3, wherein: The optical fiber collimator group includes a dual optical fiber array and a third lens group; The receiving substrate is provided with a first supporting surface, a second supporting surface and a third supporting surface, the first supporting surface is provided with the dual optical fiber array, the second supporting surface is provided with the third lens group, the third supporting surface is provided with a wave splitter group and the optical path offset plate group, the heights of the first supporting surface, the second supporting surface and the third supporting surface are increased in sequence, wherein the third lens group is located between the dual optical fiber array and the wave splitter group.

5. The optical module according to any one of claims 1 to 4, wherein: The end of the first receiving groove portion extends out of the end of the side wall of the transceiver tube body, and the end of the first receiving groove portion is configured to fix the turning prism.

6. The optical module according to any one of claims 1 to 4, wherein: The end of the first receiving groove portion extends out of the end of the side wall of the transceiver tube body to form a third receiving groove portion, the height of the third receiving groove portion is lower than the height of the first receiving groove portion, and the third receiving groove portion is configured to fix the turning prism.

7. The optical module according to any one of claims 1 to 4, wherein: A limiting surface is provided on the upper surface of the transceiver tube body, and the limiting surface is configured to limit the position of the receiving substrate; The limiting surface includes a first limiting surface and a second limiting surface, the first limiting surface is located on one side wall of the transceiver tube body, the second limiting surface is located on the other side wall of the transceiver tube body, the first limiting surface and the second limiting surface are both facing the circuit board, the first limiting surface is closer to the circuit board than the second limiting surface, and the receiving substrate stops at the first limiting surface; Alternatively, the limiting surface includes two third limiting surfaces, the third limiting surfaces are located on a side wall of the transceiver tube body, and the distance between the two third limiting surfaces gradually decreases along the length direction of the transceiver tube body.

8. The optical module according to any one of claims 1 to 4, wherein: The optical transceiver component further comprises a receiving cover plate, the receiving cover plate covers the upper surface of the transceiver tube body; A third clamping surface is provided on the upper surface of the transceiver tube body, and the third clamping surface and the side wall of the transceiver tube body form a third limiting notch; a fourth clamping surface is provided on the end of the transceiver tube body facing the circuit board, and the fourth clamping surface and the side wall of the transceiver tube body and the bottom surface of the receiving groove form a fourth limiting notch; the receiving cover plate includes a first receiving cover plate and a second receiving cover plate, the first end of the first receiving cover plate is clamped at the third limiting notch, the second end of the first receiving cover plate is covered on the first end of the second receiving cover plate, the first end of the second receiving cover plate is clamped at the fourth limiting notch, and the second end of the second receiving cover plate is clamped at the upper surface of the circuit board.

9. The optical module according to claim 8, wherein: A first avoidance gap is provided at the first end of the second receiving cover plate, and the first avoidance gap is configured to avoid the turning prism in the receiving groove; a second avoidance groove is provided at the bottom of the first avoidance gap, and the second avoidance groove is arranged corresponding to the turning surface of the turning prism, and the vertical distance between the second avoidance groove and the turning surface of the turning prism is greater than a preset distance.

10. The optical module according to claim 8, wherein: A clamping notch is provided on the lower surface of the second receiving cover plate, and one side of the clamping notch is in contact with and connected to the terminal end surface of the receiving groove.

11. The optical module according to claim 10, wherein: The other side of the clamping notch is in contact with and connected to the bottom surface of the receiving groove.

12. The optical module according to claim 8, wherein: The lower surface of the second end of the second receiving cover plate is provided with a second supporting boss and a second avoidance gap, the second supporting boss is in contact with and connected to the upper surface of the circuit board, there is a gap between the second avoidance gap and the upper surface of the circuit board, the second avoidance gap is located between the two second supporting bosses, and the second avoidance gap is configured to avoid electronic components on the circuit board.

13. The optical module according to any one of claims 1 to 4, wherein: A transmitting slot is provided on the lower surface of the transceiver tube body, and a light emitter is provided in the transmitting slot. The light emitter includes a laser chip group, a first lens group, a combiner group and a second lens group. The transmitting slot includes a first transmitting slot portion, a second transmitting slot portion and a third transmitting slot portion. The laser chip group and the first lens group are fixed to the first transmitting slot portion, the combiner group is fixed to the second transmitting slot portion, and the second lens group is fixed to the third transmitting slot portion. The heights of the second transmitting slot portion, the third transmitting slot portion and the first transmitting slot portion are increased in sequence.

14. The optical module according to claim 13, wherein: The optical transmitter further comprises a transmitting optical fiber adapter group, the first lens group is located between the laser chip group and the combiner group, and the second lens group is located between the combiner group and the transmitting optical fiber adapter group; The laser chipset comprises a plurality of laser chips arranged in parallel, wherein the laser chips are configured to emit optical signals; The first lens group includes a plurality of collimating lenses arranged in parallel, and the collimating lenses are configured to collimate the optical signal; The combiner group includes a plurality of combiners arranged in parallel, and the combiners are configured to combine multiple collimated lights into one beam of collimated light; The second lens group includes a plurality of focusing lenses arranged in parallel, and the focusing lenses are configured to converge the collimated light; The transmitting optical fiber adapter group is arranged corresponding to the second lens group, and includes two transmitting optical fiber adapters arranged in parallel. The transmitting optical fiber adapter is arranged corresponding to the focusing lens.

15. The optical module according to claim 13, wherein: The lower surface of the transceiver tube body is provided with a first clamping surface, and the first clamping surface and the side wall of the transceiver tube body form a first limiting notch; the transmitting cover plate includes a first transmitting cover plate and a second transmitting cover plate, the first end of the first transmitting cover plate is clamped in the first limiting notch, the second end of the first transmitting cover plate is covered on the first end of the second transmitting cover plate, and the second end of the second transmitting cover plate is clamped in the lower surface of the circuit board; a second notch is provided on one side of the first end of the second transmitting cover plate, and the second notch is clamped in the terminal end surface of the side wall of the transceiver tube body and the inner surface of the side wall of the transceiver tube body.

16. The optical module according to claim 15, wherein: The second emitting cover plate is provided with a supporting protrusion and a first avoiding groove on a side facing the circuit board, the supporting protrusion is in contact with the lower surface of the circuit board, and the depth of the first avoiding groove is set corresponding to the thickness of the corresponding electronic component on the circuit board.

17. The optical module according to claim 15, wherein: A second clamping surface is provided on one end of the lower surface of the transceiver tube body facing the circuit board, and the second clamping surface and the side wall of the transceiver tube body form a second limiting notch; The second transmitting cover plate protrudes outwardly toward one side of the circuit board to form a first supporting boss, the first supporting boss is in contact and connected with the second clamping surface, and the side surface of the second transmitting cover plate is correspondingly arranged with the side wall of the transceiver tube body so that the second transmitting cover plate is clamped in the second limiting notch.

18. The optical module according to claim 13, wherein: A bearing member is disposed in the transceiver tube body along the length direction of the transceiver tube body, and the bearing member is located on the second transmitting slot portion; the combiner group is fixed on the bearing member.

19. The optical module according to any one of claims 1 to 4, wherein: The first notch includes a bottom surface, a first side surface and a second side surface. The first side surface and the second side surface are arranged opposite to each other. The first side surface is in contact with and connected to the upper surface of the circuit board. A glue placement groove is arranged on the first side surface, and the glue placement groove is configured to place glue.

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