Isolated power supply chip and power conversion apparatus

Abstract

Provided in the present application are an isolated power supply chip and a power conversion apparatus. The isolated power supply chip comprises a transformer, a transmitting module and a plurality of receiving modules, wherein the transformer, the transmitting module and the plurality of receiving modules are packaged in the same housing; the transformer comprises a primary coil and a plurality of secondary coils; the transmitting module is used for transmitting to each secondary coil, by means of the primary coil, electric energy provided by a power supply; and each receiving module is used for transmitting the electric energy to a load by means of the connected secondary coil. Using the present application can provide multiple output ends that satisfy electrical isolation, and can achieve a high space utilization rate, improve the integration level and applicability of an apparatus, and reduce design costs.

Description

Isolation power chips and power conversion equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 13, 2023, with application number 202311184595.6, and priority to the Chinese patent application entitled "Isolated Power Supply Chip and Power Conversion Device", all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of power electronics technology, and in particular to an isolated power supply chip and a power conversion device. Background Art

[0003] In the field of power electronics technology, a chip with an electrical isolation function (for example, an isolated power supply chip) is usually required to isolate the electrical connection between the power supply end and the load end. This chip with an electrical isolation function includes a device with an electrical isolation function, such as a transformer, which can transmit energy through the primary coil and the secondary coil of the transformer, and can maintain isolation from the load end when the voltage at the power supply end is very high. The inventors of this application found in the process of research and practice that in the prior art, the isolated voltage chip usually only provides one output end that meets the requirements of electrical isolation. When multiple outputs are required, the layout area is large and the space utilization rate is low, which is not conducive to further realizing modular integration.

[0004] Summary of the Invention

[0005] The present application provides an isolated power supply chip and a power conversion device, which can provide multiple output terminals that meet electrical isolation requirements, have high space utilization, improve the integration and applicability of the equipment, and reduce design costs.

[0006] In a first aspect, the present application provides an isolated power supply chip, which may include a transformer, a transmitting module, and multiple receiving modules. Here, the transformer, the transmitting module, and the multiple receiving modules are encapsulated in the same housing, and the transformer may include a primary coil and multiple secondary coils. Here, the input end of the transmitting module is used to connect to the power supply, the output end of the transmitting module is connected to the primary coil, the input end of each receiving module is respectively connected to a secondary coil, and the output end of each receiving module is used to connect to the load. The transmitting module here can be used to transmit the electrical energy provided by the power supply to each secondary coil through the primary coil. Each receiving module here can be used to transmit electrical energy to the load through the connected secondary coil.

[0007] In the present application, the transformer in the isolated power supply chip includes a primary coil and multiple secondary coils. The transmitting module can transfer electric energy to multiple secondary coils through the primary coil in the transformer. The receiving modules corresponding to these secondary coils can respectively receive the electric energy transmitted by the transformer, and then transmit the electric energy to the load in multiple outputs. Here, when multiple secondary coils supply power to the load, the output voltage transmitted to the load can be the same or different, and the output current transmitted to the load can be the same or different. It can be understood that in the isolated power supply chip, due to the electrical isolation between the primary coil and the multiple secondary coils, the isolation capability with the load end can be maintained when the voltage at the power supply end is very high. While meeting the safety power supply requirements, multiple power outputs can be provided to the load respectively to adapt to different application scenarios, and to improve the integration of the chip, save board space, and reduce design costs.

[0008] In conjunction with the first aspect, in a first possible implementation, the multiple receiving modules may include at least one feedback receiving module, and the isolated power supply chip may further include an isolation module. The feedback receiving module is connected to the transmitting module via the isolation module. The feedback receiving module may also be configured to generate a feedback signal based on the input current and / or input voltage of the secondary coil to which it is connected, and transmit the feedback signal to the transmitting module via the isolation module. The transmitting module may also be configured to adjust the transmitting current and / or transmitting voltage of the primary coil based on the feedback signal. The feedback receiving module in the receiving module may provide feedback while receiving electrical energy. The feedback receiving module may generate a feedback signal based on input parameters such as the amplitude of the input current and / or input voltage of the secondary coil to which it is connected, and transmit the feedback signal to the transmitting module via the isolation module. The transmitting module or other control modules at the power transmitting end may then adjust transmission parameters such as the transmitting current or transmitting voltage of the primary coil based on the feedback signal. In other words, the feedback receiving module may generate a corresponding feedback signal based on the input parameters of the secondary coil to which it is connected, and then adjust the transmission parameters of the primary coil based on the feedback signal. This improves power supply efficiency and stability while meeting safe power supply requirements.

[0009] In conjunction with the first aspect or the first possible implementation of the first aspect, in a second possible implementation, the primary coil and the multiple secondary coils of the transformer may be planar coils. Here, the coils in the transformer are planar coils and can be arranged in one or multiple planes, which can further improve chip integration, save board space, and reduce design costs.

[0010] In combination with the first aspect or any possible implementation of the first aspect, in a third possible implementation, the primary coil and the multiple secondary coils are arranged on the same plane. Here, when this plane is a circuit board or other plate-type structure with a front and back side, the primary coil and the secondary coil in the transformer can be arranged on the front or back side of this plane, or on the front and back sides of this plane. Here, the multiple secondary coils can be arranged symmetrically with the primary coil as the center, or arranged based on the corresponding coupling coefficient obtained based on the application scenario, which can further improve the integration of the chip, save board space, and reduce design costs.

[0011] In combination with the first aspect or any possible implementation manner of the first aspect, in a fourth possible implementation manner, the primary coil may be arranged on one plane, and multiple secondary coils may be arranged on another plane. In the present application, the primary coil may be arranged on a layer of circuit board or a certain plate-type structure, and multiple secondary coils may be arranged on another layer of circuit board or other plate-type structures. It can be understood that multiple secondary coils may be arranged on the front or back of the plane where the secondary coil is located, or on the front and back of this plane. Here, multiple secondary coils may be arranged symmetrically with the projection of the primary coil as the center, or may be arranged based on the corresponding coupling coefficient obtained based on the application scenario, which can further improve the integration of the chip, save board space, and reduce design costs.

[0012] In combination with the first aspect or any possible embodiment of the first aspect, in a fifth possible embodiment, the primary coil may be arranged on a plane, one or more secondary coils among the multiple secondary coils may be arranged on multiple other planes, and each of the multiple other planes is provided with one or more secondary coils. That is, if the number of secondary coils in the transformer is n, then k of the n secondary coils may be arranged on k layers of circuit boards or k plate structures, respectively, where k is less than or equal to n. When k is less than n, the other nk secondary coils may be arranged on j layers of circuit boards or j layers of plate structures, where any layer of the j layers of circuit boards or j plate structures includes at least two secondary coils. Here, the center point of the secondary coil on the k layers of circuit boards or k plate structures may be arranged to coincide with the center point of the projection of the primary coil, and the secondary coil on the j layers of circuit boards or j plate structures may be arranged symmetrically with the projection of the primary coil as the center, or arranged based on the corresponding coupling coefficient obtained based on the application scenario, which can further improve the integration of the chip, save board space, and reduce design costs.

[0013] In combination with the first aspect or any possible implementation manner of the first aspect, in a sixth possible implementation manner, the transformer may further include a magnetic core, which may be arranged around the primary coil and the plurality of secondary coils. Here, the magnetic core arranged around the primary coil and the secondary coils can prevent leakage of the magnetic field in the coils, further improving power transmission efficiency.

[0014] In combination with the first aspect or any possible embodiment of the first aspect, in a seventh possible embodiment, the magnetic core here can be a magnetic core of an integral structure or a magnetic core composed of a combination of multiple partial structures. Here, the magnetic core can be selected according to different specifications such as the coil size arrangement method, thereby selecting a corresponding one-piece magnetic core or a magnetic core composed of a combination of multiple partial structures. Here, the outer surface of the magnetic core can be flat or curved, or a combination of flat and curved surfaces, which can be specifically set based on the application scenario to enhance applicability.

[0015] In combination with the first aspect or any possible implementation manner of the first aspect, in an eighth possible implementation manner, the isolation module may include at least one of a transformer, an optocoupler, or a capacitor. Here, the isolation module may provide electrical isolation between the feedback receiving module and the transmitting module when the feedback receiving module transmits a feedback signal to the transmitting module, thereby ensuring power supply safety.

[0016] In a second aspect, the present application provides a power conversion device, which may include an isolated power supply chip, a drive circuit, and a power conversion circuit as described in the first aspect or any possible embodiment of the first aspect. Here, the output ends of the multiple receiving modules are used to connect to the power conversion circuit through the drive circuit, and the output end of the power conversion circuit is used to connect to the load. Here, the drive circuit can be used to receive the electrical energy provided by the isolated power supply chip and drive the power conversion circuit to perform power conversion. Here, the isolated power supply chip can maintain isolation from the drive circuit when the voltage at the power supply end is very high. While meeting the safety power supply requirements, it can provide multiple drive voltages to the drive circuit separately to adapt to different application scenarios and improve the chip's integration. The drive circuit can then transmit a corresponding drive signal to the power conversion circuit, so that the power conversion circuit performs corresponding power conversion on the electrical energy and then supplies power to the load. Here, the electrical energy received by the power conversion circuit can be electrical energy directly provided by the power supply or electrical energy provided by other functional modules, or electrical energy provided by other power supplies. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG1 is a schematic diagram of an application scenario of an isolated power supply chip provided in an embodiment of the present application;

[0018] FIG2 is a schematic structural diagram of an isolated power supply chip provided in an embodiment of the present application;

[0019] FIG3 is a schematic structural diagram of a transformer provided in an embodiment of the present application;

[0020] FIG4 is another schematic structural diagram of a transformer provided in an embodiment of the present application;

[0021] FIG5 is another schematic structural diagram of a transformer provided in an embodiment of the present application;

[0022] FIG6 is another schematic structural diagram of a transformer provided in an embodiment of the present application;

[0023] FIG7 is another schematic structural diagram of a transformer provided in an embodiment of the present application;

[0024] FIG8 is another schematic structural diagram of a transformer provided in an embodiment of the present application;

[0025] FIG9 is another schematic structural diagram of a transformer provided in an embodiment of the present application;

[0026] FIG10 is another schematic structural diagram of an isolated power supply chip provided in an embodiment of the present application;

[0027] FIG11 is a schematic structural diagram of a power conversion device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The isolated power supply chip provided in this application can be applied to a variety of application fields such as the field of new energy power generation, the field of peak and frequency regulation of traditional power generation, and the field of power supply for important equipment. The specific application can be determined according to the actual application scenario and is not limited here. The power conversion equipment provided in this application can be applied to different scenarios such as large-scale photovoltaic power stations, industrial and commercial photovoltaic power generation, and household photovoltaic power generation, and is not limited here. The following will take the industrial and commercial power supply environment as an example of the application scenario of the isolated power supply chip, and will not be repeated below.

[0029] Please refer to Figure 1, which is a schematic diagram of the application scenario of the isolated power supply chip provided in an embodiment of the present application. In the power supply system, as shown in Figure 1, the power supply system includes a power supply 1, an isolated power supply chip 2 and a load 3. Here, the input end of the isolated power supply chip 2 can be used to connect to the power supply 1, and the multiple output ends of the isolated power supply can be used to connect to the load 3. In some feasible embodiments, the isolated power supply chip 2 can transmit the electric energy provided by the power supply 1 to the load 3 under the condition of meeting electrical isolation, and convert the output parameters such as the voltage or current of the output electric energy into a size that matches the load 3. Here, the isolated power supply chip 2 may include a transformer 11, a transmitting module TX and multiple receiving modules RX. The transmitting module TX can transmit the electric energy input by the power supply 1 to multiple receiving modules RX such as receiving module RXa to receiving module RXn through the transformer 11 under the condition of meeting electrical isolation. The multiple receiving modules RX such as receiving module RXa to receiving module RXn can receive the electric energy output by the transformer, and output the received electric energy in multiple ways to the load 3. It can be understood that the power supply 1 provided in the present application is suitable for powering base station equipment in remote areas where there is no mains electricity or the mains electricity is poor, or for powering household appliances (such as refrigerators, air conditioners, etc.) and other application scenarios for powering various types of electrical equipment. The specific application scenario can be determined according to the actual application scenario and is not limited here. It can be further understood that the load 3 in Figure 1 may include electrical equipment or power transmission equipment such as transmission lines, power transfer stations, communication base stations or household appliances. The load 3 here is only used as an example to represent an electrical equipment or electrical circuit that can be connected to the output end of the isolation power supply chip 2. Different receiving modules RX can output electrical energy to different ports of a load 3, or can output electrical energy to different loads in the load 3. The specific application scenario can be determined according to the actual application scenario and is not limited here.

[0030] In some application scenarios, the load side may require an isolated power supply chip 2 to provide multiple power outputs to the load side while ensuring electrical isolation. The output parameters of these multiple outputs can be the same or different. For example, a charging station for a new energy vehicle can be equipped with multiple charging guns to charge different vehicles. The output parameters of the power outputs from these charging guns can be the same or different. As another example, in the power management system within a new energy vehicle, it is often necessary to provide power with different output voltages or output currents to different functional circuits, such as functional circuits for vehicle performance testing and drive circuits for power drive. Traditional chips with isolation functions typically only provide one output terminal that meets electrical isolation requirements. When multiple outputs are required, the board area is large, space utilization is low, and it is not conducive to further modular integration. To address this problem, the present application provides an isolated power supply chip with multiple outputs. For details, please refer to Figure 2, which is a schematic diagram of the structure of an isolated power supply chip provided in an embodiment of the present application. As shown in Figure 2, the isolated power supply chip 2 may include a transformer 11, a transmitting module TX, and multiple receiving modules RX, such as receiving modules RXa to RXn. Here, the transformer 11, transmitter module TX, and multiple receiver modules RX are encapsulated in the same housing. The transformer 11 may include a primary coil 101 and multiple secondary coils 102, such as secondary coils 102a through 102n. Each of the multiple secondary coils 102 corresponds one-to-one to each of the multiple receiver modules RX. Here, the input of the transmitter module TX can be connected to the power supply 1, the output of the transmitter module TX can be connected to the primary coil 101, the output of each receiver module RX can be connected to a load 3, and the input of each receiver module RX can be connected to the corresponding secondary coil 102 of each receiver module RX. The transmitter module TX can be used to transmit electrical energy provided by the power supply to each secondary coil 102 via the primary coil 101. Each receiver module RX can be used to transmit electrical energy to the load 3 via the connected secondary coil 102. The specific direction of electrical energy transmission can be shown by the black arrows in the figure. In some application scenarios, the load can also transmit information or energy to the isolated power supply chip 2. The direction of such information or energy transmission can be shown by the gray arrows in the figure. The specific direction can be determined based on the application scenario and is not limited here.

[0031] In the present application, the transformer 11 in the isolated power supply chip 2 includes a primary coil 101 and multiple secondary coils 102, such as secondary coils 102a to 102n. The transmitting module TX can transfer electrical energy to the multiple secondary coils 102 through the primary coil 101 in the transformer 11. The receiving modules RX connected to these secondary coils 102 can respectively receive the electrical energy transmitted by the transformer 11, and then transmit the electrical energy to the load 3 in multiple outputs. Here, when the multiple secondary coils 102 supply power to the load 3, the output voltage transmitted to the load 3 can be the same or different, and the output current transmitted to the load 3 can be the same or different. It can be understood that in the isolated power supply chip 2, due to the electrical isolation between the primary coil 101 and the multiple secondary coils 102, the isolation capability from the load end can be maintained when the voltage at the power supply end is very high. While meeting the safe power supply requirements, multiple power outputs can be provided to the load 3 respectively to adapt to different application scenarios, improve the chip's integration, save board space, and reduce design costs.

[0032] In some feasible embodiments, the primary coil 101 and the multiple secondary coils 102 of the transformer 11 can be planar coils and can be arranged in one or more planes, which can further improve the chip's integration, save board space, and reduce design costs. The following describes the structure of the transformer in the isolated power supply chip provided by this application with reference to Figures 3 to 9.

[0033] In some feasible implementations, please refer to Figure 3, which is a structural schematic diagram of a transformer provided in an embodiment of the present application. As shown in Figure 3, the primary coil 101 and the secondary coils 102a to 102n can be arranged in the same plane. Here, the plane where the primary coil 101 and the secondary coils 102a to 102n are located can be a layer of circuit board or other plate-shaped structure with two front and back sides. The primary coil 101 and the secondary coils 102a to 102n in the transformer 11 can all be arranged on the front side of this plane or all on the back side of this plane; or part of the coils can be arranged on the front side of this plane and the other part of the coils can be arranged on the back side of this plane. Here, the secondary coils 102a to 102n can be arranged symmetrically with the primary coil 101 as the center, that is, the angle between two adjacent secondary coils 102 about the center of the primary coil 101 is 360 / n, where n is the number of secondary coils. Here, the secondary coils 102a to 102n can also be arranged based on corresponding coupling coefficients obtained based on application scenarios, which can further improve the integration of the chip, save board space, and reduce design costs.

[0034] It can be understood that the primary coil 101 and the secondary coil 102 here can also be multi-layer planar coils, and one or several layers of the multi-layer planar coil can be arranged on the front side of the plane where the coil is located, and another layer or several layers of the multi-layer planar coil can be arranged on the back side of the plane where the coil is located. It can be further understood that the coil in the transformer mentioned in this application can be a single-layer planar coil or a multi-layer planar coil. In this application, only a single-layer planar coil is used as an example to illustrate the coil structure in the transformer. The specific setting can be based on the application scenario, and will not be repeated here. At the same time, in this application, only a square coil is used as an example to introduce the positional relationship of each coil in the transformer. Each coil in the transformer mentioned in this application can be a square planar coil, a circular planar coil, or a planar coil of other shapes. It can also be a part of a certain planar coil and the other part of another planar coil. The specific setting can be based on the application scenario, and will not be repeated here. At the same time, it can be understood that the front and back of a plane, a circuit board or a planar structure mentioned here are just one side and the other side of the plane, the circuit board or the planar structure, which can be set according to the application scenario and will not be repeated below.

[0035] In some feasible implementations, please refer to Figure 4, which is another structural schematic diagram of the transformer provided in an embodiment of the present application. As shown in Figure 4, the primary coil 101 can be arranged on one plane, and the secondary coils 102a to 102n can be arranged on another plane. In the present application, the primary coil 101 can be arranged on a layer of circuit board or a certain plate-type structure, and the secondary coils 102a to 102n can be arranged on another layer of circuit board or other plate-type structures. It can be understood that the secondary coils 102a to 102n can be arranged on the front or back of a plane at the same time, or a part of the secondary coils 102 can be arranged on the front of this plane, and the other part of the secondary coils 102 can be arranged on the back of this plane. Here, secondary coils 102a through 102n can be arranged symmetrically around primary coil 101. Specifically, the angle between two adjacent secondary coils 102 about the center of primary coil 101 is 360 / n, where n is the number of secondary coils. Secondary coils 102a through 102n can also be arranged based on the coupling coefficient determined based on the application scenario, further improving chip integration, saving board space, and reducing design costs.

[0036] In some feasible implementations, please refer to Figure 5, which is another structural schematic diagram of the transformer provided in an embodiment of the present application. As shown in Figure 5, the primary coil 101 can be arranged on a plane, and each secondary coil 102 from the secondary coils 102a to the secondary coils 102n can be arranged on n other planes, and the n other planes correspond one-to-one to the multiple secondary coils 102, where n is the number of secondary coils. In the present application, the primary coil 101 can be arranged on a layer of circuit board or a certain plate-type structure, and the secondary coils 102a to the secondary coils 102n can be arranged on other n layers of circuit boards or other n plate-type structures. Here, the center point of each secondary coil 102 from the secondary coils 102a to the secondary coils 102n can be arranged to coincide with the center point of the projection of the primary coil 101 on the plane where the secondary coil 102 is located, or the corresponding coupling coefficient can be obtained based on the application scenario for arrangement, which can further improve the integration of the chip, save board space, and reduce design costs.

[0037] In some feasible embodiments, please refer to FIG6 , which is another structural schematic diagram of a transformer provided in an embodiment of the present application. As shown in FIG6 , the primary coil 101 can be arranged on a plane, and one or more secondary coils 102 from the secondary coils 102a to the secondary coils 102n can be arranged on one or more other planes, respectively, and any other plane can include one or more secondary coils 102. That is, if the number of secondary coils 102 in the transformer 11 is n, then k of the n secondary coils 102 (e.g., secondary coils 102a to 102k) can be arranged on k layers of circuit boards or k plate structures, respectively, and the other n k secondary coils 102 (e.g., secondary coils 102i to 102n) can be arranged on j layers of circuit boards or j layers of plate structures, where any layer on the j layers of circuit boards or j plate structures includes at least two secondary coils 102. Here, the center point of the secondary coil 102 on the k-layer circuit board or k-plate structure can be arranged to coincide with the center point of the projection of the primary coil 101, and the secondary coil 102 on the j-layer circuit board or j-plate structure can be arranged symmetrically with the projection of the primary coil 101 as the center, or arranged based on the corresponding coupling coefficient obtained in the application scenario, which can further improve the integration of the chip, save board space, and reduce design costs. It can be understood that the k-layer circuit board or k-plate structure here can be arbitrarily arranged above and / or below the plane where the primary coil 101 is located. It can also be understood that the j-layer circuit board or j-plate structure here can be arbitrarily arranged above and / or below the plane where the primary coil 101 is located. It can be specifically set based on the application scenario and the coupling coefficient between the coils, and is not limited here.

[0038] In some feasible embodiments, the transformer 11 may further include a magnetic core, which may be arranged around the primary coil 101 and the multiple secondary coils 102. For details, please refer to Figure 7, which is another schematic structural diagram of a transformer provided in an embodiment of the present application. As shown in Figure 7, the transformer 11 also includes a magnetic core 103, which may be arranged around the primary coil 101 and the multiple secondary coils 102. Here, the magnetic core 103 is arranged in a "mouth" shape around the primary coil 101 and the multiple secondary coils 102, which can prevent the magnetic field in the coils from leaking out, further improving the efficiency of power transmission. Here, the shading represents the plane where the primary coil 101 and the secondary coils 102a to 102n are located, and the specific coil structure is not shown. It is understood that in some application scenarios where it is necessary to further prevent the magnetic field in the coils from leaking out, the magnetic core 103 can also be arranged on both sides of the "mouth"-shaped magnetic core in Figure 7, while reserving an interface for each coil routing, which can further enhance the magnetic shielding performance of the transformer.

[0039] In some feasible embodiments, the magnetic core in the transformer can also be of other shapes, please refer to Figure 8, which is another structural schematic diagram of the transformer provided in an embodiment of the present application. As shown in Figure 8, here, the magnetic core 103 is arranged in a "C" shape on the periphery of the primary coil 101 and multiple secondary coils 102, which can prevent the magnetic field in the coil from leaking out and further improve the efficiency of power transmission. Here, the shadow represents the plane where the primary coil 101, the secondary coil 102a to the secondary coil 102n are located, and the specific coil structure is not shown.

[0040] In some feasible embodiments, the magnetic core in the transformer can also be of other shapes, please refer to Figure 9, which is another structural schematic diagram of the transformer provided in an embodiment of the present application. As shown in Figure 9, here, the magnetic core 103 is arranged in a "two" shape around the periphery of the primary coil 101 and multiple secondary coils 102, which can prevent the magnetic field in the coil from leaking out and further improve the efficiency of power transmission. Here, the shadow represents the plane where the primary coil 101, the secondary coil 102a to the secondary coil 102n are located, and the specific coil structure is not shown.

[0041] In some feasible embodiments, the magnetic core 103 can be a magnetic core with an integral structure or a magnetic core composed of a plurality of partial structures. Here, the magnetic core 103 can be selected as a corresponding integral magnetic core or a magnetic core composed of a plurality of partial structures according to different specifications such as the coil size and arrangement. Here, the outer surface of the magnetic core 103 can be flat or curved, or a combination of flat and curved surfaces, and can be set based on the application scenario to enhance applicability.

[0042] In some feasible embodiments, the receiving module in the isolated power supply chip also has a feedback function, specifically referring to Figure 10, Figure 10 is another structural diagram of the isolated power supply chip provided in an embodiment of the present application. As shown in Figure 10, among the N receiving modules RX from receiving module RXa to receiving module RXn, at least one feedback receiving module RX may be included (for example, receiving module RXa is a feedback receiving module, that is, receiving module RXa is a receiving module with feedback function). Here, the isolated power supply chip 2 may also include an isolation module 12, and the receiving module RXa can be connected to the transmitting module TX through the isolation module 12. The feedback receiving module RX here can also be used to generate a feedback signal based on the input current and / or input voltage of the secondary coil 102 to which the feedback receiving module RX is connected, and transmit the feedback signal to the transmitting module TX through the isolation module 12. The transmitting module TX here can also be used to adjust the emission current and / or emission voltage of the primary coil 101 based on the feedback signal. Here, the feedback receiving module RX in the receiving module RX can have a feedback function while receiving electric energy. The feedback receiving module RX here can generate a feedback signal based on input parameters such as the amplitude of the input current and / or the amplitude of the input voltage of the secondary coil 102 to which it is connected, and transmit the feedback signal to the transmitting module TX through the isolation module 12. Then, the transmitting module TX or other control modules at the electric energy transmitting end can adjust the transmission parameters such as the transmission current or transmission voltage of the primary coil 101 based on the feedback signal. For example, when the input current and / or input voltage of the secondary coil 102a connected to the receiving module RXa is lower than the input current threshold or input voltage threshold required by the load 3 connected to the receiving module RXa, the receiving module RXa can generate a feedback signal and transmit it to the transmitting module TX through the isolation module 12. When the transmitting module receives the feedback signal, the transmitting module TX or other control modules at the electric energy transmitting end can increase the transmission parameters such as the transmission current or transmission voltage of the primary coil 101 based on the indication of the feedback signal. For another example, when the input current and / or input voltage of the secondary coil 102a connected to the receiving module RXa is higher than the input current threshold or input voltage threshold required by the load 3 connected to the receiving module RXa, the receiving module RXa can generate a feedback signal and transmit it to the transmitting module TX through the isolation module 12. When the transmitting module receives the feedback signal, the transmitting module TX or other control modules at the power transmitting end can reduce the transmitting parameters such as the transmitting current or transmitting voltage of the primary coil 101 based on the indication of the feedback signal. In other words, the feedback receiving module RX here can generate a corresponding feedback signal based on the input parameters of the secondary coil 102 to which it is connected, and then adjust the transmitting parameters of the primary coil 101 based on the feedback signal, which can improve the power supply efficiency and power supply stability while meeting the safety power supply requirements.

[0043] In some feasible embodiments, the isolation module 12 may include at least one of a transformer, an optocoupler, or a capacitor to implement electrical isolation. Here, the isolation module 12 may provide electrical isolation between the feedback receiving module RX and the transmitting module TX when the feedback receiving module RX transmits a feedback signal to the transmitting module TX, thereby ensuring power supply safety.

[0044] In the present application, the composition of the functional modules in the isolated power supply chip is diverse and flexible, which can adapt to different application scenarios, improve the diversity of the application scenarios of the isolated power supply chip, and enhance the adaptability of the isolated power supply chip. At the same time, any of the isolated power supply chips shown in Figures 1 to 10 above can provide multiple output terminals that meet the requirements of electrical isolation, with high space utilization, improving the integration and applicability of the equipment, and reducing design costs. The present application also provides a power conversion device, which may include multiple isolated power supply chips as shown in Figures 1 to 10 above.

[0045] Please refer to Figure 11 for details. Figure 11 is a structural diagram of a power conversion device provided in an embodiment of the present application. As shown in Figure 11, the power conversion device 1000 may include an isolated power supply chip 2, a drive circuit 4, and a power conversion circuit 5 as in any possible embodiment of Figures 1 to 10. Here, the input end of the isolated power supply chip 2 can be used to connect to the power supply 1, the output end of the multiple receiving modules RX can be used to connect to the power conversion circuit 5 through the drive circuit 4, and the output end of the power conversion circuit 5 can be used to connect to the load 3. Here, the drive circuit 4 can be used to receive the electric energy provided by the isolated power supply chip 2 and drive the power conversion circuit 5 to perform power conversion. Here, the isolated power supply chip 2 can maintain isolation from the drive circuit 4 when the power supply voltage is very high. While meeting the safety power supply requirements, it can provide multiple drive voltages to the drive circuit 4 respectively to adapt to different application scenarios and improve the integration of the chip. Then, the drive circuit 4 can transmit a corresponding drive signal to the power conversion circuit 5, so that the power conversion circuit 5 performs corresponding power conversion on the electric energy and then supplies power to the load 3. Here, the electric energy received by the power conversion circuit 5 can be the electric energy directly provided by the power supply 1 or the electric energy provided by other functional modules, or the electric energy provided by other power supplies. For example, the load 3 can be an electric car, and the isolated power supply chip 2 can convert the higher voltage provided by the power supply 1 (for example, the power grid) into a lower chip-level voltage, and provide some lower driving reference voltages for the drive circuit 4 to provide the drive circuit 4 with the electric energy required by the drive circuit 4. Here, the drive circuit 4 can generate a drive signal, and then drive the power conversion circuit 5 through the drive signal, so that the power conversion circuit 5 can perform corresponding power conversion on the electric energy transmitted by the power supply 1 or other power sources according to the drive signal, and transmit the power-converted electric energy to the load 3, for example, to provide power for the electric car. It can be understood that the above examples are only some feasible implementation methods provided by this application. The power conversion device 1000 and the isolated power supply chip 2 provided by this application can be applied to any application scenario that needs to meet electrical isolation requirements and requires multi-channel power output, and are not limited here.

[0046] In this application, the isolated power supply chip can provide multiple output terminals that meet electrical isolation requirements, have high space utilization, improve the integration and applicability of the equipment, and reduce design costs.

[0047] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An isolated power chip, characterized in that: The isolated power chip includes a transformer, a transmitting module and a plurality of receiving modules, wherein the transformer, the transmitting module and the plurality of receiving modules are packaged in the same housing, and the transformer includes a primary coil and a plurality of secondary coils; The input end of the transmitting module is used to connect to a power source, the output end of the transmitting module is connected to the primary coil, the input end of each receiving module is respectively connected to one of the secondary coils, and the output end of each receiving module is used to connect to a load; The transmitting module is used to transmit the electric energy provided by the power supply to each of the secondary coils through the primary coil; Each of the receiving modules is used to transmit electrical energy to the load through the connected secondary coil.

2. The isolated power chip according to claim 1, characterized in that: The multiple receiving modules include at least one feedback receiving module, the isolated power chip also includes an isolation module, and the feedback receiving module is connected to the transmitting module through the isolation module; The feedback receiving module is further used to generate a feedback signal based on the input current and / or input voltage of the secondary coil connected to the feedback receiving module, and transmit the feedback signal to the transmitting module through the isolation module; The transmitting module is further used to adjust the transmitting current and / or transmitting voltage of the primary coil based on the feedback signal.

3. The isolated power chip according to claim 1 or 2, characterized in that: The primary coil and the plurality of secondary coils of the transformer are planar coils.

4. The isolated power chip according to any one of claims 1 to 3, characterized in that: The primary coil and the plurality of secondary coils are arranged on the same plane.

5. The isolated power chip according to any one of claims 1 to 3, characterized in that: The primary coil is arranged on one plane, and the plurality of secondary coils are arranged on another plane.

6. The isolated power chip according to any one of claims 1 to 3, characterized in that: The primary coil is arranged on one plane, and the plurality of secondary coils are arranged on a plurality of other planes respectively, and each of the plurality of other planes is arranged with one or more secondary coils.

7. The isolated power chip according to any one of claims 1 to 6, characterized in that: The transformer further includes a magnetic core, which is arranged on the periphery of the primary coil and the plurality of secondary coils.

8. The isolated power chip according to claim 7, characterized in that: The magnetic core is a magnetic core of an integral structure or a magnetic core composed of a plurality of partial structures.

9. The isolated power chip according to any one of claims 1 to 8, characterized in that: The isolation module includes at least one of a transformer, an optical coupler or a capacitor.

10. A power conversion device, characterized in that: The power conversion device comprises the isolated power supply chip, the drive circuit and the power conversion circuit according to any one of claims 1 to 9, the output ends of the plurality of receiving modules are used to connect the power conversion circuit through the drive circuit, and the output end of the power conversion circuit is used to connect the load; The driving circuit is used to receive the electric energy provided by the isolated power chip and drive the power conversion circuit to perform power conversion.

Images