Process chamber gas inlet apparatus, semiconductor device, mounting method, and dismounting method

Abstract

A process chamber gas inlet apparatus, a semiconductor device, a mounting method, and a dismounting method, relating to the technical field of semiconductor processing and aiming to solve the problem in the prior art of poor uniformity of a process gas entering a process chamber. The process chamber gas inlet apparatus is applied to a semiconductor device, and comprises: a spray head cover plate (110) provided with first gas flow through holes (111); and a flow guide assembly, wherein a space between the flow guide assembly and the spray head cover plate (110) forms a first spray cavity (110b), the first spray cavity (110b) is communicated with the first gas flow through holes (111), second gas flow through holes (310) are formed on the side wall of the first spray cavity (110b), and the second gas flow through holes (310) are used for communicating the first spray cavity (110b) with the process chamber; the assembly comprises a temperature control disc (200), and the temperature control disc (200) is located below the spray head cover plate (110) and is arranged corresponding to the first gas flow through holes (111). The process chamber gas inlet apparatus can improve the uniformity of a process gas entering a process chamber.

Description

Process chamber air intake device, semiconductor equipment, installation method and disassembly method Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a process chamber air intake device, semiconductor equipment, an installation method, and a disassembly method. Background Art

[0002] With the development of semiconductor equipment, the requirements for the stability and uniformity of plasma processing processes are becoming increasingly higher. Taking the etching process as an example, plasma is generated inside the chamber through inductive coupling of the upper electrode coil, and it etches the wafer uniformly. At this time, the better the uniformity of the process gas entering the chamber system structure, the more uniform the ambient temperature, and the better the uniformity of the wafer etching. However, in related technologies, the uniformity of the process gas entering the process chamber is not ideal, which leads to unstable process results.

[0003] Summary of the Invention

[0004] The first object of the present application is to provide a process chamber gas inlet device to solve the technical problem of poor uniformity when process gas enters the process chamber in the prior art.

[0005] The process chamber air intake device provided in this application is applied to semiconductor equipment, including:

[0006] The shower head cover is provided with a first air flow hole;

[0007] A drainage component, wherein the space between the drainage component and the shower head cover forms a first spray chamber, the first spray chamber is connected to the first air flow hole, and the side wall of the first spray chamber is provided with a second air flow hole, and the second air flow hole is used to connect the first spray chamber with the process chamber; the drainage component includes a temperature control disk, which is located below the shower head cover and is arranged corresponding to the first air flow hole.

[0008] In some technical solutions, the drainage assembly also includes a spray ring, the second air flow hole is arranged in the spray ring, the spray ring is sealedly connected to the spray head cover plate and the temperature control disk, and the spray ring, the spray head cover plate and the temperature control disk form the first spray chamber.

[0009] In some technical solutions, the spray ring is detachably connected to the temperature control disk and the spray head cover.

[0010] In some technical solutions, the temperature control disk and the spray head cover respectively clamp the spray ring from two opposite ends of the spray ring.

[0011] In some technical solutions, the spray ring is provided with a stepped hole, the stepped hole has a stepped end surface, the stepped end surface is sealed to the upper surface of the temperature control disk, and the upper end surface of the spray ring is sealed to the lower surface of the spray head cover.

[0012] In some technical solutions, the air inlet end of the second air flow hole is located on the inner circumference of the spray ring to connect to the first spray chamber, and the air outlet end of the second air flow hole is located on the end surface of the spray ring away from the spray head cover plate or the outer circumference of the spray ring to spray into the process chamber, and the second air flow holes are evenly distributed along the circumference of the spray ring; along the direction from the air inlet end to the air outlet end of the second air flow hole, the second air flow holes gradually move away from the center of the temperature control disk.

[0013] In some technical solutions, a sprinkler head cover plate is sealed and connected to the top of the sprinkler head cover plate, and the space between the sprinkler head cover plate and the sprinkler head cover plate forms a second sprinkler chamber, the upper end of the first air flow hole is connected to the second sprinkler chamber, and the lower end of the first air flow hole is connected to the first sprinkler chamber.

[0014] In some technical solutions, from an air inlet end to an air outlet end of the first air flow hole, the first air flow hole gradually moves away from the center of the shower head cover plate.

[0015] In some technical solutions, the temperature control disk is provided with a refrigerant inlet and outlet shaft, and the refrigerant inlet and outlet shaft passes through the shower head cover plate and cooperates with the shower head cover plate.

[0016] In some technical solutions, a first boss is provided on the upper surface of the temperature control disk, the first boss is sealed to the spray head cover, and each of the refrigerant inlet and outlet shafts is respectively provided on one of the first bosses.

[0017] In some technical solutions, a second boss is provided on the upper surface of the temperature control disk. The second boss has the same shape and size as the first boss, and the second boss and the first boss are evenly distributed along the circumference of the temperature control disk.

[0018] In some technical solutions, the two first bosses are arranged collinearly with the center of the temperature control disk.

[0019] In some technical solutions, the refrigerant inlet and outlet shaft has a radial protrusion, which is located above the spray head cover plate. The air intake device also includes a mounting block, which is used when it is necessary to fix the axial position of the refrigerant inlet and outlet shaft relative to the spray head cover plate. When in use, the lower end of the mounting block abuts against the upper end surface of the spray head cover plate, and the upper end of the mounting block abuts against the lower end surface of the radial protrusion to support the radial protrusion.

[0020] In some technical solutions, the refrigerant inlet and outlet shaft has a radial protrusion, which is located above the sprinkler head cover plate. The top end of the refrigerant inlet and outlet shaft is used to connect the fluid inlet pipe or the fluid outlet pipe through a first clamping block and a second clamping block fixedly connected to each other. The first clamping block abuts against the lower surface of the radial protrusion, and the second clamping block is sealed and connected to the upper surface of the refrigerant inlet and outlet shaft.

[0021] A second object of the present application is to provide a process chamber to solve the technical problem of poor uniformity of process gas when entering the process chamber in the prior art.

[0022] The process chamber provided in the present application includes the above-mentioned process chamber air intake device provided in the present application, and the process chamber air intake device is located at the top of the process chamber.

[0023] By arranging the above-mentioned process chamber air intake device provided by the present application in the process chamber, the process chamber accordingly has all the advantages of the above-mentioned process chamber air intake device, which will not be described in detail here.

[0024] In some technical solutions, the process chamber includes a cavity and a dielectric cylinder and a coil arranged on the top of the cavity, the coil is arranged radially outside the dielectric cylinder, and the air intake device is arranged on the dielectric cylinder.

[0025] A third object of the present application is to provide an installation method for the process chamber air inlet device provided in the present application, the installation method comprising:

[0026] Pass the two refrigerant inlet and outlet shafts through the spray head cover;

[0027] Utilize the mounting block to abut against the upper end surface of the shower head cover and support the radial protrusion of the refrigerant inlet and outlet shaft;

[0028] Tightening the threaded connector for fastening the other first boss to the shower head cover;

[0029] Remove the mounting block and secure the remaining first boss with a threaded connector.

[0030] A fourth object of the present application is to provide a disassembly method for the process chamber air inlet device provided in the present application, the disassembly method comprising:

[0031] Loosening a threaded connection piece for fastening the first boss and the sprinkler head cover;

[0032] Utilize the mounting block to abut against the upper end surface of the shower head cover and support the radial protrusion of the refrigerant inlet and outlet shaft;

[0033] Loosen the threaded connection piece used to fasten the other first boss and the shower head cover plate;

[0034] Remove the installation block and separate the sprinkler head cover from the temperature control plate.

[0035] The beneficial effects brought about by the process chamber air intake device provided by the first object of the present application and the semiconductor equipment provided by the second object are:

[0036] The space between the flow guide assembly, including the temperature control disk, and the showerhead cover plate forms a first spray chamber. After passing through the first airflow holes in the showerhead cover plate, the airflow enters the first spray chamber. Guided by the second airflow holes in the temperature control disk, it flows radially outward, exits through the second airflow holes, and enters the process chamber. In this air intake device, the gas undergoes two buffering steps and two circumferential diffusion cycles, resulting in a substantially stable gas velocity, improving the consistency and uniformity of the gas outflow rate. The temperature control disk is used to control the temperature of the process gas entering the process chamber so that the temperature of the process gas entering the process chamber is the temperature required by the process. Moreover, after the plasma in the process chamber contacts the shower head cover and the temperature control disk, heat is generated, which causes the gas temperature to rise. Since the temperature of the cooling fluid in the temperature control disk is consistent with the temperature required by the process, when the gas flows on the surface of the temperature control disk, the heat generated by the plasma is carried away by the cooling fluid. This can be controlled in the air intake device, and the temperatures of the temperature control disk and the shower head cover are as consistent as possible, thereby improving the uniformity of the gas temperature in the air intake device, improving the temperature stability, and improving the process effect.

[0037] The beneficial effects of the installation method provided by the third object of this application are:

[0038] Using the above-mentioned installation method, after passing the two refrigerant inlet and outlet shafts through the spray head cover, you can use the installation block to temporarily fix one refrigerant inlet and outlet shaft and the spray head cover. This not only frees your hands to tighten the threaded connection used to fix the other first boss and the spray head cover, improving the convenience of installation, but also allows the temperature control disk to remain in the precise position when it is fixed relative to the spray head cover when fixing the other first boss, thereby improving the installation accuracy.

[0039] The beneficial effects of the disassembly method provided by the fourth object of this application are:

[0040] Using the above-mentioned disassembly method, first loosen the threaded connection used to fasten a first boss, and then use the installation block to temporarily fix the other refrigerant inlet and outlet shaft and the spray head cover. This not only frees your hands to loosen the threaded connection used to fix the other first boss and the spray head cover, but also prevents the temperature control disk from falling off the spray head cover, thereby improving the convenience of disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments or background technologies of the present application, the following briefly introduces the drawings required for use in the embodiments or background technology descriptions. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0042] FIG1 is a schematic structural diagram of an air inlet device for a process chamber provided in Example 1 of the present application;

[0043] FIG2 is a partial schematic diagram of an air inlet device for a process chamber provided in Example 1 of the present application;

[0044] 3 is a schematic diagram of a cooling fluid flow channel of a temperature control disk in an air inlet device for a process chamber provided in Example 1 of the present application;

[0045] FIG4 is a schematic diagram of an air intake route of an air intake device for a process chamber provided in Example 1 of the present application;

[0046] FIG5 is a perspective view of a spray ring in an air inlet device for a process chamber provided in Example 1 of the present application;

[0047] FIG6 is a perspective view of a spray ring in an air inlet device for a process chamber provided in Example 1 of the present application;

[0048] FIG7 is a cross-sectional view of a spray ring in an air inlet device for a process chamber provided in Example 1 of the present application;

[0049] FIG8 is a partial cross-sectional view of a spray ring in an air inlet device for a process chamber provided in Example 1 of the present application;

[0050] FIG9 is a partial schematic diagram of the installation structure of the spray ring in the process chamber air inlet device provided in Example 1 of the present application;

[0051] FIG10 is a perspective view of a temperature control disk in an air inlet device for a process chamber provided in Example 1 of the present application;

[0052] FIG11 is a cross-sectional view of a temperature control disk in an air inlet device for a process chamber provided in Example 1 of the present application;

[0053] FIG12 is a schematic diagram of the installation process of the temperature control disk in the process chamber air inlet device provided in Example 1 of the present application;

[0054] FIG13 is a schematic diagram of the current flow in the process chamber air inlet device provided in Example 1 of the present application

[0055] FIG14 is a schematic diagram of a process chamber provided in Example 2 of the present application.

[0056] Description of reference numerals:

[0057] 110 - spray head cover; 111 - first air flow hole; 110a - second spray chamber; 110b - first spray chamber;

[0058] 200 - temperature control plate; 210 - refrigerant inlet and outlet shaft; 210a - inlet channel; 210b - outlet channel; 211 - radial protrusion; 213 - necking portion; 220 - first boss; 230 - second boss; 240 - cooling channel; 250 - fluid inlet; 260 - fluid outlet;

[0059] 300-spray ring; 310-second air flow hole; 320-step end surface;

[0060] 400-Sprinkler head cover;

[0061] 500-intake block;

[0062] 610-Sprinkler head bracket; 611-Lifting unit; 620-Dielectric cylinder; 630-Coil; 640-Upper electrode coil base plate;

[0063] 710-installation block; 720-first clamping block; 730-second clamping block;

[0064] 810- chamber; 820- wafer carrying device;

[0065] 910-conductive groove; 920-sealing groove. DETAILED DESCRIPTION

[0066] In order to make the above-mentioned objectives, features and advantages of the present application more clearly understood, the following detailed description of the specific embodiments of the present application is given in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0067] Example 1:

[0068] Figure 1 is a structural schematic diagram of the process chamber air intake device provided in Example 1 of the present application; Figure 2 is a partial schematic diagram of the process chamber air intake device provided in Example 1 of the present application; as shown in Figures 1-2, the process chamber air intake device provided in Example 1 of the present application is applied to semiconductor equipment, including: a shower head cover 110 and a drainage component, wherein the shower head cover 110 is provided with a first air flow hole 111; the space between the drainage component and the shower head cover 110 forms a first spray chamber 110b, the first spray chamber 110b is connected to the first air flow hole 111, and the side wall of the first spray chamber 110b is provided with a second air flow hole 310, the second air flow hole 310 is used to connect the first spray chamber 110b with the process chamber; the drainage component includes a temperature control disk 200, which is located below the shower head cover 110 and is arranged corresponding to the first air flow hole 111. During the process, the plasma generated in the process chamber contacts the gas inlet device, which will increase the temperature of the gas inlet device. The temperature control disk 200 is used to control the temperature of the process gas entering the process chamber so that the temperature of the process gas entering the process chamber is the temperature required by the process.

[0069] Specifically, in this embodiment, the top of the spray head cover plate 110, for example, at the center, is sealed with the spray head cover plate 400. More specifically, the edge of the spray head cover plate 400 is fixedly connected to the spray head cover plate 110 by a male threaded connector such as a screw or bolt. The sealing ring between the spray head cover plate 400 and the spray head cover plate 110 is provided on the inner side of the male threaded connector. The air intake block 500 is sealed at the top center of the spray head cover plate 400. The space between the spray head cover plate 400 and the spray head cover plate 110 forms the second spray chamber 110a. Furthermore, an upward recessed area is provided in the middle of the lower surface of the spray head cover plate 400, and correspondingly, a downward recessed area is provided at the top center of the spray head cover plate 110. The space between the two recessed areas is the above-mentioned second spray chamber 110a.

[0070] The upper end of the first air flow hole 111 is connected to the second spray chamber 110a, and the lower end of the first air flow hole 111 is connected to the first spray chamber 110b. In some embodiments, from the air inlet end to the air outlet end of the first air flow hole 111, that is, from top to bottom, the first air flow hole 111 gradually moves away from the center of the showerhead cover plate 110. In other words, the air flow has already diffused radially outward when passing through the first air flow hole 111, and can enter the first spray chamber 110b more evenly.

[0071] In order to control the temperature of the process gas entering the process chamber and in the air intake device, the temperature of the temperature control disk 200 and the shower head cover plate 110 is as consistent as possible, thereby improving the uniformity of the gas temperature in the air intake device, improving the temperature stability, and improving the process effect. The temperature control disk 200 can have a variety of structures. In some embodiments, a cooling channel 240 is provided in the temperature control disk 200. The fluid inlet and fluid outlet of the cooling channel 240 are used to connect to a cold source for providing cooling fluid through a fluid inlet pipe and a fluid outlet pipe, respectively. The cold source introduces cooling fluid into the cooling channel 240 through the fluid inlet pipe, and the cooling fluid in the cooling channel 240 returns to the cold source through the fluid outlet pipe, thereby realizing the circulation of the cooling fluid. The cooling fluid is, for example, a cooling liquid or a cooling gas, and the cooling liquid is, for example, water. It should be noted that in actual applications, the temperature control disk 200 can also adopt other cooling structures to control the temperature of the process gas entering the process chamber, and control the temperature of the temperature control disk 200 and the shower head cover plate 110 in the air intake device to be as consistent as possible.

[0072] Specifically, Figure 3 is a schematic diagram of the cooling fluid flow channels of the temperature control disk in the process chamber air inlet device provided in Example 1 of the present application. As shown in Figure 3, the temperature control disk 200 is generally circular, and the cooling flow channels 240 are distributed in a serpentine shape within the temperature control disk 200. In this embodiment, the cooling channel 240 can be distributed as follows: the fluid inlet 250 of the cooling channel 240 is arranged at a relatively outer position of the temperature control disk 200 on a certain diameter, and after the cooling fluid enters the cooling channel 240 through the fluid inlet 250, it first flows along the first radius in the clockwise direction of Figure 3 for about 1 / 4 circle, then flows radially toward the center, then flows clockwise along the second radius for about 3 / 4 circle and then flows to an area with a larger radial position, then flows counterclockwise along the third radius for about 1 / 2 circle and flows to the position of the fourth radius, then flows counterclockwise along the fourth radius for about 1 / 3 circle and then flows radially to the position of the fifth radius, then flows clockwise along the fifth radius for about 3 / 8 circle and then flows to the position of the sixth radius, then flows clockwise along the sixth radius for 1 / 2 circle and then flows to the position of the seventh radius, then flows counterclockwise along the seventh radius for 1 / 2 circle and then flows to the position of the eighth radius, and then flows along the eighth radius for nearly a full circle and then flows out from the fluid outlet 260. Here, the second radius < the first radius ≤ the third radius < the fourth radius ≤ the sixth radius < the fifth radius ≤ the seventh radius < the distance between the fluid inlet 250 and the center of the temperature control disk 200 = the distance between the fluid outlet 260 and the center of the temperature control disk 200 < the eighth radius. In other words, upon entering the temperature control disk 200, the cooling fluid flows in a gradually increasing radius. The area of ​​the temperature control disk 200 with a smaller radius is the area directly opposite the first air flow hole 111. Therefore, the cooling fluid first flows through the area with a smaller radius directly opposite the first air flow hole 111. Since the distance traveled is short, the cooling fluid temperature is relatively low, allowing it to cool the gas that has passed through the showerhead cover plate 400 and the first air flow hole 111 first. Since this portion of gas increases in temperature after contacting the showerhead cover plate 400 and the showerhead cover plate 110, the relatively low-temperature cooling fluid cools this portion of gas first, improving cooling efficiency.

[0073] By forming a first spray chamber 110b in the space between the flow guide assembly including the temperature control disk 200 and the shower head cover plate 110, the airflow passes through the first airflow hole 111 of the shower head cover plate 110 and enters the first spray chamber 110b. It is then guided by the second airflow hole 310 in the temperature control disk 200, flows radially outward, exits through the second airflow hole 310, and enters the process chamber. In this air intake device, the gas undergoes two stages of buffering (i.e., buffering in the first spray chamber 110b and the second spray chamber 110a) and two stages of diffusion in the circumferential direction (i.e., diffusion in the first airflow hole 111 and the second airflow hole 310). The gas velocity is essentially stable, thereby improving the consistency and uniformity of the gas outflow rate. The temperature control disk 200 is used to control the temperature of the process gas entering the process chamber so that the temperature of the process gas entering the process chamber is the temperature required by the process. Moreover, after the plasma in the process chamber contacts the shower head cover 110 and the temperature control disk 200, heat is generated to increase the gas temperature. Since the temperature of the cooling fluid in the temperature control disk 200 is consistent with the temperature required by the process, when the gas flows on the surface of the temperature control disk 200, the heat generated by the plasma is taken away by the cooling fluid. This can control the temperatures of the temperature control disk 200 and the shower head cover 110 in the process chamber air inlet device to be as consistent as possible, thereby improving the uniformity of the gas temperature in the process chamber air inlet device, improving the temperature stability, and improving the process effect.

[0074] Figure 4 is a schematic diagram of the air intake route of the process chamber air intake device provided in Example 1 of the present application; Figure 5 is a three-dimensional diagram of the spray ring in the process chamber air intake device provided in Example 1 of the present application; as shown in Figures 1, 2, 4 and 5, preferably, the drainage assembly also includes a spray ring 300, and the second air flow hole 310 is arranged in the spray ring 300. The spray ring 300 is sealedly connected to the spray head cover plate 110 and the temperature control disk 200. The spray ring 300, the spray head cover plate 110 and the temperature control disk 200 form a first spray chamber 110b.

[0075] By providing a spray ring 300 that is sealingly connected to the showerhead cover plate 110 and the temperature control disk 200, the sealing of the first spray chamber 110b is ensured, preventing gas from leaking between the spray ring 300 and the temperature control disk 200, or between the spray ring 300 and the showerhead cover plate 110. Furthermore, since the spray ring 300 is provided separately, a spray ring 300 having a suitable distribution density, aperture, position, and orientation of the second gas flow holes 310 can be selected as needed. This allows the spray ring 300 to be replaced independently without having to replace the showerhead cover plate 110, the temperature control disk 200, and the spray ring 300 together, thereby reducing production costs. It is easy to understand that the spray ring 300 serves as the sidewall of the first spray chamber 110b, meaning that the space enclosed by the spray ring 300, between the lower surface of the showerhead cover plate 110 and the upper surface of the temperature control disk 200, constitutes the first spray chamber 110b.

[0076] In another implementation, an upward annular protrusion may be provided on the edge of the temperature control disk 200. This annular protrusion serves as the side wall of the first spray chamber 110b. A second air flow hole 310 is provided in this annular protrusion. The top of the annular protrusion is sealed and connected to the lower surface of the shower head cover 110. In fact, the spray ring 300 can be considered to be the annular protrusion and is integrally connected to the temperature control disk 200. Alternatively, a downwardly protruding annular protrusion may be provided on the lower surface of the shower head cover 110. This annular protrusion serves as the side wall of the first spray chamber 110b. The second air flow hole 310 is provided in this annular protrusion. The lower surface of the annular protrusion is sealed and connected to the upper surface of the temperature control disk 200. Alternatively, an upward annular protrusion may be provided on the edge of the temperature control disk 200, and a downwardly protruding annular protrusion may be provided on the lower surface of the spray head cover 110, and the two annular protrusions are sealed and connected and serve together as the side wall of the first spray chamber 110b.

[0077] As shown in FIG. 1 , FIG. 2 , FIG. 4 and FIG. 5 , preferably, the spray ring 300 is detachably connected to the temperature control disk 200 and the spray head cover plate 110 .

[0078] By detachably connecting the spray ring 300 to the temperature control disk 200 and the spray head cover 110, the spray ring 300 can be easily replaced to change the size, angle, position, distribution density and other parameters of the second air flow hole 310, so that the process chamber air intake device can more accurately adapt to different process requirements and obtain different process effects.

[0079] As shown in FIG. 1 , FIG. 2 , FIG. 4 and FIG. 5 , preferably, the temperature control plate 200 and the spray head cover plate 110 respectively clamp the spray ring 300 from two opposite ends of the spray ring 300 .

[0080] Specifically, in this embodiment, the upper surface of the spray ring 300 is directly and sealably connected to the lower surface of the showerhead cover plate 110. In other words, the two are in contact via a sealing structure. The temperature control plate 200 applies force to the spray ring 300 from bottom to top. Specifically, the temperature control plate 200 clamps the spray ring 300 from its lower end, and the showerhead cover plate 110 clamps the spray ring 300 from its upper end. There are no direct fastener connections between the spray ring 300, the temperature control plate 200, and the showerhead cover plate 110.

[0081] By clamping the spray ring 300 from opposite ends of the spray ring 300 through the temperature control disk 200 and the spray head cover 110, there is no need to set up a separate connection structure between the spray ring 300 and the two, thereby ensuring the connection strength while reducing the number of parts that need to be disassembled and assembled, thereby improving the convenience of replacing the spray ring 300.

[0082] In another embodiment, the spray ring 300 can be directly fixedly connected to the showerhead cover plate 110 via a male threaded connector such as a screw or bolt, and a sealing structure, such as a sealing ring, between the spray ring 300 and the showerhead cover plate 110 is provided radially inward of the male threaded connector. That is, the connection between the spray ring 300 and the showerhead cover plate 110 is independent of the connection between the temperature control disk 200 and the showerhead cover plate 110.

[0083] Alternatively, a conical surface or step structure with a larger top and a smaller bottom can be provided on the inner wall surface of the spray ring 300, so as to utilize the fixed connection between the spray ring 300 and the spray head cover plate 110, and apply a force from the spray ring 300 to the temperature control disk 200 from bottom to top to fix the temperature control disk 200.

[0084] FIG6 is a perspective view of a spray ring in a process chamber air intake device according to a first embodiment of the present application; FIG7 is a cross-sectional view of a spray ring in a process chamber air intake device according to a first embodiment of the present application; FIG8 is a partial cross-sectional view of a spray ring in a process chamber air intake device according to a first embodiment of the present application; and FIG9 is a partial schematic view of the installation structure of a spray ring in a process chamber air intake device according to a first embodiment of the present application. As shown in FIG6-9, preferably, the spray ring 300 is provided with a stepped hole, the stepped hole having a stepped end surface 320, the stepped end surface 320 being sealed to the upper surface of the temperature control disk 200, and the upper end surface of the spray ring 300 being sealed to the lower surface of the spray head cover plate 110.

[0085] In this embodiment, the axis of the stepped hole, which is smaller at the top and larger at the bottom, aligns with the axis of the spray ring 300, while the stepped end surface 320 is perpendicular to the stepped hole. Accordingly, the shape of the edge of the temperature control disk 200 corresponds to the stepped hole. Specifically, the outer circumference of the edge of the temperature control disk 200 is provided with a radially protruding annular flange. The outer circumference of this annular flange mates with the inner circumference of the larger diameter portion of the stepped hole. The upper surface of the annular flange is sealed to the stepped end surface 320. More specifically, a sealing groove 920 can be provided on the stepped end surface 320 and / or the upper surface of the annular flange to accommodate a sealing ring, such as an O-ring.

[0086] A sealing groove 920 is provided on at least one of the upper surface of the spray ring 300 and the lower surface of the shower head cover 110 to accommodate a sealing ring such as an O-ring to achieve a sealed connection between the two.

[0087] By providing a stepped hole on the spray ring 300, the fixed connection between the temperature control disk 200 and the spray head cover plate 110 can be utilized to provide a force to clamp the spray ring 300 between the temperature control disk 200 and the spray head cover plate 110. Moreover, the inner circumference of the stepped hole with a larger diameter can also cooperate with the temperature control disk 200 (i.e., the outer circumference of the annular flange) to achieve horizontal positioning of the spray ring 300. The spray ring 300 is arranged concentrically with the center of the first spray chamber 110b, and the inner circumference of the spray ring 300 is at the same distance from the center of the first spray chamber 110b. Then, the distance that the airflow flows radially in the first spray chamber 110b is consistent, which can improve the uniformity of the airflow. In addition, the sealing structure that realizes the sealed connection can provide a rebound force, so that the connection between the spray head cover plate 110 and the temperature control disk 200 is tight and firm and not easy to loosen.

[0088] In another implementation, the outer peripheral surface of the temperature control disk 200 can be a conical surface that is smaller at the top and larger at the bottom, and the corresponding part of the inner hole of the spray ring 300 is also a conical hole corresponding to the cone angle of the conical surface, which can also play the role of positioning and transmitting an upward force to the spray ring 300.

[0089] As shown in Figures 6 to 9, preferably, the air inlet end of the second air flow hole 310 is located on the inner circumferential surface of the spray ring 300 to connect to the first spray chamber 110b, and the air outlet end of the second air flow hole 310 is located on the end surface of the spray ring 300 facing away from the spray head cover plate 110 or the outer circumferential surface of the spray ring 300 to spray into the process chamber, and the second air flow holes 310 are evenly distributed along the circumference of the spray ring 300; along the direction from the air inlet end to the air outlet end of the second air flow hole 310, the second air flow holes 310 gradually move away from the center of the temperature control disk 200.

[0090] Specifically, in this embodiment, the second air flow holes 310 can be configured to first extend radially from the upper portion of the inner circumference of the spray ring 300 and then extend obliquely downward and radially outward. In this embodiment, the outlet end of the second air flow holes 310 can be located on the lower end surface of the spray ring 300. In another embodiment, the outlet end of the second air flow holes 310 can be located on the outer circumference of the spray ring 300.

[0091] In this embodiment, the wafer supporting device for supporting the wafer may be an electrostatic chuck, which can support the wafer and provide a downward bias voltage. In another implementation, the wafer supporting device may also be a vacuum adsorption chuck or a mechanical chuck.

[0092] In a process chamber using the process chamber air inlet device provided in this embodiment, the lower end surface of the shower head cover plate 110 is also used to be mounted on the dielectric cylinder 620, and the shower head cover plate 110 is sealed and connected to the dielectric cylinder 620. The dielectric cylinder 620 can be made of, for example, quartz material, and its shape can be, for example, a cone with a small top and a large bottom. A coil 630 is provided on the radial outer side of the dielectric cylinder 620, and a shower head bracket 610 is provided on the radial outer side of the coil 630. The shower head cover plate 110 is mounted on the top of the shower head bracket 610. If the outlet end of the second air flow hole 310 is set on the lower end surface of the spray ring 300, the distance from the inner circumference of the dielectric cylinder 620 is slightly larger, and the airflow uniformity is stronger than the solution in which the outlet end is set on the outer circumference of the spray ring 300.

[0093] By configuring the second airflow holes 310 in this manner, the airflow ejected from the second airflow holes 310 can quickly flow to an area close to the coil 630. If the coil 630 is operating at this time, ignition is achieved, and the plasma performs processes such as etching the wafer. Furthermore, due to the buffering of the first spray chamber 110b and the second spray chamber 110a, the gas ejection velocity is more consistent and stable upon entering the vacuum chamber. Furthermore, due to the diffusion of the gas through the first airflow holes 111 and the second airflow holes 310, the second airflow holes 310 of the spray ring 300 are evenly distributed along the circumference. Ultimately, the airflow is evenly ejected through the spray ring 300 and can flow to the vicinity of the dielectric cylinder 620.

[0094] Figure 10 is a three-dimensional view of the temperature control disk in the process chamber air intake device provided in Example 1 of the present application; Figure 11 is a cross-sectional view of the temperature control disk in the process chamber air intake device provided in Example 1 of the present application; as shown in Figures 2, 4 and 9-11, preferably, the temperature control disk 200 is provided with a refrigerant inlet and outlet shaft 210, and the refrigerant inlet and outlet shaft 210 passes through the spray head cover plate 110 and cooperates with the spray head cover plate 110.

[0095] Specifically, in this embodiment, two refrigerant inlet and outlet shafts 210 are provided on the temperature control disk 200. Each refrigerant inlet and outlet shaft 210 passes through the spray head cover 110 and is used to connect to the fluid inlet pipe or the fluid outlet pipe. The circumferential surface of the refrigerant inlet and outlet shaft 210 cooperates with the through hole provided on the spray head cover 110. It is easy to understand that, as shown in Figure 2, one of the refrigerant inlet and outlet shafts 210 is provided with an inlet channel 210a whose two ends are respectively connected to the fluid inlet pipe and the fluid inlet 250 of the cooling channel 240, and the other refrigerant inlet and outlet shaft 210 is provided with an outlet channel 210b whose two ends are respectively connected to the fluid outlet pipe and the fluid outlet 260 of the cooling channel 240.

[0096] The refrigerant inlet and outlet shaft 210 passes through the shower head cover plate 110, eliminating the need to pass through the outer peripheral surface or bottom of the temperature control plate 200. This does not affect the movement of the airflow after leaving the second air flow holes 310, does not interfere with the movement of the airflow in this area, and also avoids interference with the coil 630. In addition, the refrigerant inlet and outlet shaft 210 cooperates with the shower head cover plate 110 to achieve horizontal guidance and positioning of the temperature control plate 200 and the shower head cover plate 110, thereby allowing the temperature control plate 200 to be concentrically arranged with the shower head cover plate 110, and further allowing the spray ring 300 to be concentrically arranged with the shower head cover plate 110, thereby improving the uniformity of the airflow.

[0097] As shown in Figures 2, 4, 10 and 11, preferably, a first boss 220 is provided on the upper surface of the temperature control disk 200, the first boss 220 is sealed with the spray head cover 110, and each refrigerant inlet and outlet shaft 210 is respectively provided on a first boss 220.

[0098] In this embodiment, the upper end surface of the first boss 220 can be sealed with the lower surface of the shower head cover 110. Specifically, a sealing groove 920 can be provided on the upper end surface of the first boss 220 and / or the corresponding area of ​​the lower surface of the shower head cover 110 to accommodate a sealing ring. More specifically, in this embodiment, a local depression is provided in the area corresponding to the first boss 220 on the lower surface of the shower head cover 110. Of course, it should be understood by those skilled in the art that a hole connected to the inlet channel 210a or the outlet channel 210b in the refrigerant inlet and outlet shaft 210 is also provided in the first boss 220 to connect the inlet channel or the outlet channel in the refrigerant inlet and outlet shaft 210 with the cooling channel 240 in the temperature control disk 200.

[0099] By providing a sealed connection between the first boss 220 and the spray head cover 110 , leakage of air from the refrigerant inlet and outlet shaft 210 can be prevented, ensuring that the gas can only be ejected outward from the second air flow hole 310 after entering the first spray chamber 110 b .

[0100] In another implementation, sealing can also be achieved between the lower surface of the shower head cover 110 and the peripheral wall of the recessed portion in the corresponding area of ​​the first boss 220 and the outer peripheral surface of the first boss 220. Furthermore, a sealing groove 920 can be provided on the outer peripheral surface of the first boss 220 and / or the peripheral wall of the recessed portion to accommodate a sealing ring.

[0101] As shown in Figures 2, 4, 10 and 11, preferably, a second boss 230 is provided on the upper surface of the temperature control disk 200. Different from the first boss 220, the second boss 230 is a dummy boss. The second boss 230 has the same shape and size as the first boss 220, and the second boss 230 and the first boss 220 are evenly distributed along the circumference of the temperature control disk 200.

[0102] Specifically, in this embodiment, there are two first bosses 220, and correspondingly, there are also two second bosses 230. Furthermore, the distance between the second bosses 230 and the center of the temperature control disk 200 is equal to the distance between the first bosses 220 and the center of the temperature control disk 200. More specifically, in this embodiment, the two first bosses 220 and the two second bosses 230 are arranged on the same circumference, with each adjacent boss being spaced 90° apart. The center of this circle is the center of the temperature control disk 200.

[0103] Since the gas flows into the first spray chamber 110b, the first boss 220 on the temperature control disk 200 will affect the flow of gas along the upper surface of the temperature control disk 200. By setting the second boss 230 to have the same shape and size as the first boss 220 and to be evenly distributed, a plurality of evenly distributed bosses with the same shape and size can be formed on the upper surface of the temperature control disk 200, so that the airflow is affected more evenly, thereby avoiding the serious impact on the uniformity of the airflow due to the setting of the first boss 220.

[0104] Of course, in this embodiment, two second bosses 230 are provided. In other implementations, three or four second bosses 230 may also be provided. Correspondingly, the first bosses 220 and the second bosses 230 may be distributed on the same circumference with a central angle of 72° or 60° between adjacent first and second bosses 220 and 230. Furthermore, the number of second bosses 230 should not be excessive. Although excessive number of second bosses 230 may improve uniformity, it will severely hinder the flow of gas on the upper surface of the temperature control disk 200, thereby severely reducing flow efficiency. Those skilled in the art can select the number of second bosses 230 according to their needs, and this application does not need to elaborate on this.

[0105] As shown in FIG. 2 , FIG. 4 , FIG. 10 and FIG. 11 , preferably, the two first bosses 220 are arranged collinearly with the center of the temperature control disk 200 .

[0106] In this embodiment, the two first bosses 220 are collinearly arranged with the center of the temperature control disk 200, and correspondingly, the two second bosses 230 are also collinearly arranged with the center of the temperature control disk 200. For example, the line connecting the two second bosses 230 is perpendicular to the line connecting the two first bosses 220, and the intersection is the center of the temperature control disk 200.

[0107] The two first bosses 220 are arranged collinearly with the center of the temperature control disk 200, and the two refrigerant inlet and outlet shafts 210 can be used to cooperate with the hole axis of the spray head cover 110 to perform positioning at two relatively distant positions of the temperature control disk 200. This can improve the positioning stability, avoid the occurrence of a cantilever beam positioning structure, improve the installation accuracy, and reduce the possibility of a reduction in the force between the spray ring 300 and the spray head cover 110 and a weakening of the sealing performance due to the deformation of the temperature control disk 200.

[0108] As shown in Figures 9 to 11, preferably, a threaded blind hole is provided on the upper surface of the first boss 220, and the threaded blind hole is threadedly engaged with the threaded connector passing through the spray head cover plate 110. The threaded blind hole is located between the sealing structure between the first boss 220 and the spray head cover plate 110 and the refrigerant inlet and outlet shaft 210.

[0109] In this embodiment, two, four, or six threaded blind holes can be evenly arranged on the upper surface of each first boss 220 to facilitate connection with male threaded connectors, such as screws or bolts, that pass through the cover plate. The sealing structure between the first boss 220 and the showerhead cover plate 110 can include a sealing groove 920 disposed in corresponding areas on the upper surface of the first boss 220 and / or the lower surface of the showerhead cover plate 110. The sealing groove 920 accommodates a sealing ring to achieve a seal between the two.

[0110] A threaded blind hole is provided on the first boss 220 to allow for a fixed connection via a threaded connector that passes through the showerhead cover plate 110. Once the first boss 220 is connected, the temperature control disk 200 can be secured to the showerhead cover plate 110, facilitating installation. Because the threaded blind hole is located between the first boss 220 and the sealing structure of the showerhead cover plate 110 and the refrigerant inlet and outlet shaft 210—that is, the threaded blind hole is located inwardly while the sealing structure is located outwardly—the provision of a sealing structure isolates the threaded connector from the first spray chamber 110b, thereby preventing leakage from the first spray chamber 110b between the first boss 220 and the showerhead cover plate 110. Furthermore, because the threaded connector is located within the sealing structure, it does not interfere with the flow of air along the upper surface of the temperature control disk 200, ensuring that airflow uniformity is not compromised.

[0111] Figure 12 is a schematic diagram of the temperature control disk installation process in the process chamber air intake device provided in Example 1 of the present application; as shown in Figures 9 to 12, preferably, the refrigerant inlet and outlet shaft 210 has a radial protrusion 211, and the radial protrusion 211 is located above the spray head cover 110. The air intake device also includes a mounting block 710. The mounting block 710 is used when it is necessary to fix the axial position of the refrigerant inlet and outlet shaft 210 relative to the spray head cover 110, and when in use, the lower end of the mounting block 710 abuts against the upper end surface of the spray head cover 110, and the upper end of the mounting block 710 abuts against the lower end surface of the radial protrusion 211 to support the radial protrusion 211.

[0112] Among them, the mounting block 710 can be a cylindrical part that is cut in half along the plane where the axis is located, that is, the mounting block 710 includes a first mounting sub-block and a second mounting sub-block that are cut along the plane where the axis is located, that is, the first mounting sub-block and the second mounting sub-block are both roughly semi-cylindrical. The first mounting sub-block and the second mounting sub-block can be connected by a male threaded connector such as a screw or a bolt. When it is necessary to use the mounting block 710 to fix the axial position of the refrigerant inlet and outlet shaft 210 relative to the spray head cover 110, the first mounting sub-block and the second mounting sub-block can be brought close to each other along the radial direction of the refrigerant inlet and outlet shaft 210. After the two are in contact, the two can be fastened using a male threaded connector, or the two cannot be in contact as long as it is ensured that the top ends of the two are in contact with the lower surface of the radial protrusion 211.

[0113] Furthermore, to reduce the overall size and weight of the refrigerant inlet / outlet shaft 210, a constricted portion 213 may be provided below the radial protrusion 211 of the refrigerant inlet / outlet shaft 210, thereby reducing the radial protrusion 211 from being too large and also reducing the weight of the mounting block 710.

[0114] In this embodiment, the radial protrusion 211 may be a complete flange portion of the entire circumference. In fact, in another implementation, the radial protrusion 211 may also be three radial flanges, each corresponding to a 60° central angle and arranged at intervals of 60°.

[0115] By providing the radial protrusion 211 to be supported by the mounting block 710, when installing the temperature control disk 200 to the shower head cover 110, the two refrigerant inlet and outlet shafts 210 can be first passed through the shower head cover 110. Then, the mounting block 710 can be used to cover one of the refrigerant inlet and outlet shafts 210 and support the radial protrusion 211. This can prevent the refrigerant inlet and outlet shaft 210 on this side from exiting the shower head cover 110, thereby temporarily securing the temperature control disk 200 and facilitating the tightening of the male threaded connector on the other first boss 220. This mounting structure improves operational efficiency and ensures installation accuracy.

[0116] As shown in Figures 2, 4, and 9, preferably, the top end of the refrigerant inlet / outlet shaft 210 is used to connect to a fluid inlet pipe or a fluid outlet pipe via a first clamping block 720 and a second clamping block 730 that are fixedly connected to each other. The first clamping block 720 abuts against the lower surface of the radial protrusion 211, and the second clamping block 730 is sealed to the upper surface of the refrigerant inlet / outlet shaft 210. The first clamping block 720 and the second clamping block 730 can be fixed, for example, by a threaded connection.

[0117] Among them, the shape and size of the middle area of ​​the upper surface of the first clamping block 720 match the radial protrusion 211, and the second clamping block 730 has a flange portion and a sleeve portion. The flange portion of the second clamping block 730 cooperates with the first clamping block 720, and the sleeve portion of the second clamping block 730 can be connected to the fluid inlet and outlet pipes.

[0118] In this embodiment, the radial protrusion 211 is a flange portion with a full circumference. Therefore, the specific implementation method for sealing the second clamping block 730 and the refrigerant inlet and outlet shaft 210 is to provide a sealing groove 920 on the lower surface of the second clamping block 730 and / or the upper surface of the radial protrusion 211. The sealing groove 920 accommodates a sealing ring to achieve sealing. If, in another implementation method, the radial protrusion 211 is not a complete flange portion, the sealing groove 920 is provided at a non-radially protruding position on the refrigerant inlet and outlet shaft 210 and / or a sealing groove 920 is provided in a corresponding area on the lower surface of the second clamping block 730 to accommodate a sealing ring to achieve sealing.

[0119] By providing the first clamping block 720 and the second clamping block 730 , the fluid inlet and outlet pipes can be connected, thereby supplying cooling fluid to the temperature control disk 200 to ensure the temperature of the cooling fluid in the temperature control disk 200 .

[0120] Furthermore, the RF circuit in this embodiment is shown in Figure 13. Once the plasma is ignited, the current flows as follows: wafer carrier 820 - spray ring 300 - temperature control plate 200 - showerhead cover 110 - showerhead bracket 610 - upper electrode coil base plate 640 - process chamber ground. Conductive slots 910 are provided between all contacting components to accommodate the inductive coil 630, ensuring electrical conductivity. Furthermore, the spray ring 300 and temperature control plate 200 undergo surface treatment to prevent plasma corrosion.

[0121] Example 2:

[0122] As shown in FIG14 , the process chamber provided in the second embodiment of the present application, the semiconductor equipment includes the process chamber air intake device provided in the above embodiment of the present application, and the process chamber air intake device is located at the top of the process chamber (ie, the cavity 810 ).

[0123] By arranging the above-mentioned process chamber air intake device in the process chamber, the process chamber accordingly has all the advantages of the above-mentioned process chamber air intake device, which will not be described in detail here.

[0124] Preferably, the process chamber includes a cavity 810 and a dielectric cylinder 620 and a coil 630 arranged on the top of the cavity 810 . The coil 630 is arranged radially outside the dielectric cylinder 620 , and the above-mentioned process chamber air intake device is arranged on the dielectric cylinder 620 .

[0125] Specifically, in this embodiment, the dielectric tube 620 may be a tapered quartz tube. In another implementation, the dielectric tube may also be cylindrical, and the material of the dielectric tube is not limited to quartz.

[0126] Such an arrangement allows the airflow of the process chamber air inlet device to quickly flow to an area close to the coil 630. If the coil 630 is working at this time and ignited, the plasma will etch the wafer.

[0127] Example 3:

[0128] As shown in FIG12 , a third embodiment of the present application provides an installation method for the process chamber air inlet device provided in the embodiment of the present application. The installation method includes:

[0129] Pass the two refrigerant inlet and outlet shafts 210 through the shower head cover 110;

[0130] The mounting block 710 is used to abut against the upper end surface of the shower head cover 110 and support the radial protrusion 211 of the refrigerant inlet and outlet shaft 210;

[0131] Tighten the threaded connector for fastening the other first boss 220 (i.e., the other first boss 220 other than the first boss 220 corresponding to the mounting block 710 ) and the shower head cover 110 ;

[0132] The mounting block 710 is removed, and the remaining first boss 220 (ie, the first boss 220 corresponding to the mounting block 710 ) is fixed using a threaded connector.

[0133] By adopting the above-mentioned installation method, after the two refrigerant inlet and outlet shafts 210 are passed through the spray head cover 110, the installation block 710 can be used to temporarily fix one refrigerant inlet and outlet shaft 210 and the spray head cover 110. This not only frees up hands to tighten the threaded connection used to fix the other first boss 220 and the spray head cover 110, thereby improving the convenience of installation, but also allows the temperature control disk 200 to be maintained in the precise position when fixed relative to the spray head cover 110 when fixing the other first boss 220, thereby improving the installation accuracy.

[0134] Example 4:

[0135] As shown in FIG12 , a disassembly method provided in the fourth embodiment of the present application is used for the process chamber air inlet device provided in the embodiment of the present application. The disassembly method includes:

[0136] Loosen the threaded connection piece used to fasten the first boss 220 and the shower head cover plate 110;

[0137] The mounting block 710 is used to abut against the upper end surface of the shower head cover 110 and support the radial protrusion 211 of the refrigerant inlet and outlet shaft 210;

[0138] Loosen the threaded connection piece used to fasten the other first boss 220 and the shower head cover plate 110;

[0139] Remove the mounting block 710 and separate the shower head cover 110 from the temperature control plate 200 .

[0140] Using the above-mentioned disassembly method, first loosen the threaded connection used to fasten a first boss 220, and then use the installation block 710 to temporarily fix the other refrigerant inlet and outlet shaft 210 and the spray head cover 110. This not only frees up your hands to loosen the threaded connection used to fix the other first boss 220 and the spray head cover 110, but also prevents the temperature control disk 200 from falling off the spray head cover 110, thereby improving the convenience of disassembly.

[0141] In addition, as shown in FIG1 , a hoisting portion 611 is provided on the top outer edge of the sprinkler head bracket 610 in the present application at a relative position along the circumference. Specifically, the hoisting portion 611 in this embodiment can be a downwardly extending column. By hanging a cable or lifting belt on the column, the sprinkler head bracket 610 can be hoisted. The disassembly method further specifically includes:

[0142] First, remove the air inlet block 500, the first clamping block 720, and the second clamping block 730. Then, hoist the spray head bracket 610, the spray head cover plate 110, the spray ring 300, the temperature control plate 200, and the spray head upper cover plate 400 together. Then, use the above-mentioned disassembly method to separate the spray head cover plate 110 from the temperature control plate 200. Slowly pull the temperature control plate 200 downward, and the spray ring 300 and temperature control plate 200 can be removed together. The spray ring 300 can be replaced by separating it from the temperature control plate 200. Because the spray ring 300 has small parts and low cost, the process parameters can be adjusted by replacing the spray ring 300 with a different second air flow hole 310, thereby improving the adaptability of the process.

[0143] Although the present application is disclosed as above, the present application is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims.

[0144] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0145] In the above embodiments, the descriptions of directions such as “upper” and “lower” are all based on the drawings.

[0146] The above description of the disclosed embodiments is intended to enable those skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application.

[0147] Thus, the present application will not be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A process chamber air intake device, characterized in that: Applied to semiconductor equipment, including: The shower head cover plate is provided with a first air flow hole; A drainage component, wherein the space between the drainage component and the spray head cover plate forms a first spray chamber, the first spray chamber is connected to the first air flow hole, and the side wall of the first spray chamber is provided with a second air flow hole, and the second air flow hole is used to connect the first spray chamber with the process chamber; the drainage component includes a temperature control disk, and the temperature control disk is located below the spray head cover plate and is arranged corresponding to the first air flow hole.

2. The process chamber air inlet device according to claim 1, characterized in that: The drainage assembly also includes a spray ring, the second air flow hole is arranged in the spray ring, the spray ring is sealed and connected to the spray head cover plate and the temperature control disk, and the spray ring, the spray head cover plate and the temperature control disk form the first spray chamber.

3. The process chamber air intake device according to claim 2, characterized in that: The spray ring is detachably connected to the temperature control disk and the spray head cover plate.

4. The process chamber air inlet device according to claim 3, characterized in that: The temperature control disk and the spray head cover plate clamp the spray ring from two opposite ends of the spray ring respectively.

5. The process chamber air inlet device according to claim 4, characterized in that: The spray ring is provided with a step hole, the step hole has a step end surface, the step end surface is sealed and connected to the upper surface of the temperature control disk, and the upper end surface of the spray ring is sealed and connected to the lower surface of the spray head cover plate.

6. The process chamber air inlet device according to claim 2, characterized in that: The air inlet end of the second air flow hole is located on the inner circumference of the spray ring to connect with the first spray chamber, the air outlet end of the second air flow hole is located on the end surface of the spray ring away from the spray head cover plate or the outer circumference of the spray ring to spray into the process chamber, and the second air flow holes are evenly distributed along the circumference of the spray ring; along the direction from the air inlet end to the air outlet end of the second air flow hole, the second air flow holes gradually move away from the center of the temperature control disk.

7. The process chamber air inlet device according to claim 1, characterized in that: A spray head upper cover plate is sealed and connected to the top of the spray head cover plate, and the space between the spray head upper cover plate and the spray head cover plate forms a second spray chamber, the upper end of the first air flow hole is connected to the second spray chamber, and the lower end of the first air flow hole is connected to the first spray chamber.

8. The process chamber air inlet device according to claim 1, characterized in that: From the air inlet end to the air outlet end of the first air flow hole, the first air flow hole gradually moves away from the center of the shower head cover plate.

9. The process chamber air inlet device according to any one of claims 1 to 8, characterized in that: The temperature control disk is provided with a refrigerant inlet and outlet shaft, and the refrigerant inlet and outlet shaft passes through the spray head cover plate and cooperates with the spray head cover plate.

10. The process chamber air inlet device according to claim 9, characterized in that: A first boss is provided on the upper surface of the temperature control disk, the first boss is sealed and connected to the spray head cover plate, and each of the refrigerant inlet and outlet shafts is respectively arranged on one of the first bosses.

11. The process chamber air inlet device according to claim 10, characterized in that: A second boss is disposed on the upper surface of the temperature control disk. The second boss has the same shape and size as the first boss, and the second boss and the first boss are evenly distributed along the circumference of the temperature control disk.

12. The process chamber air inlet device according to claim 11, characterized in that: The two first bosses are arranged colinearly with the center of the temperature control disk.

13. The process chamber air inlet device according to claim 10, characterized in that: The refrigerant inlet and outlet shaft has a radial protrusion, and the radial protrusion is located above the spray head cover plate; the air intake device also includes a mounting block, and the mounting block is used when it is necessary to fix the axial position of the refrigerant inlet and outlet shaft relative to the spray head cover plate, and when in use, the lower end of the mounting block abuts against the upper end surface of the spray head cover plate, and the upper end of the mounting block abuts against the lower end surface of the radial protrusion to support the radial protrusion.

14. The process chamber air inlet device according to claim 9, characterized in that: The refrigerant inlet and outlet shaft has a radial protrusion, which is located above the spray head cover plate. The top end of the refrigerant inlet and outlet shaft is used to connect the fluid inlet pipe or the fluid outlet pipe through a first clamping block and a second clamping block fixedly connected to each other. The first clamping block abuts against the lower surface of the radial protrusion, and the second clamping block is sealed and connected to the upper surface of the refrigerant inlet and outlet shaft.

15. A process chamber, comprising the process chamber air inlet device according to any one of claims 1 to 14, wherein the process chamber air inlet device is located at the top of the process chamber.

16. The process chamber according to claim 15, characterized in that: The process chamber comprises a cavity, a dielectric cylinder and a coil arranged on the top of the cavity, the coil is arranged on the radial outer side of the dielectric cylinder, and the process chamber air intake device is arranged on the dielectric cylinder.

17. An installation method, characterized in that: For installing the process chamber air inlet device of claim 13, the installation method comprises: Pass the two refrigerant inlet and outlet shafts through the spray head cover plate; The mounting block is used to abut against the upper end surface of the shower head cover plate and support the radial protrusion of the refrigerant inlet and outlet shaft; Tightening the threaded connector for fastening the other first boss to the shower head cover plate; The installation block is removed, and the remaining first boss is fixed by a threaded connector.

18. A disassembly method, characterized in that: For disassembling the process chamber air inlet device of claim 13, the disassembly method comprising: Loosen a threaded connector for fastening the first boss and the shower head cover plate; The mounting block is used to abut against the upper end surface of the shower head cover plate and support the radial protrusion of the refrigerant inlet and outlet shaft; Loosen the threaded connector for fastening the other first boss and the shower head cover plate; Remove the installation block and separate the spray head cover plate from the temperature control plate.

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