Antenna module mounted on vehicle

Abstract

This antenna module mounted on a vehicle comprises: a PCB having at least one antenna element disposed on a first surface thereof; a second PCB having a first surface coupled to a second surface of the PCB, a first electronic component disposed on the first surface, and a second electronic component disposed on the second surface; a first heat sink disposed to be in contact with the first electronic component disposed on the first surface of the second PCB; a second heat sink disposed to be in contact with the second electronic component disposed on the second surface of the second PCB; and a hole region formed in the central portion of the PCB to accommodate the first electronic component.

Description

Antenna module mounted on a vehicle

[0001] The present invention relates to an antenna module mounted on a vehicle. A specific embodiment relates to an antenna module comprising a plurality of communication modules and a heat dissipation structure, and a vehicle including the same.

[0002] Electronic devices can be categorized into mobile / portable terminals and stationary terminals based on their mobility. Recently, wireless communication systems utilizing LTE technology have been commercialized, providing a variety of services. Furthermore, wireless communication systems utilizing 5G technology are expected to be commercialized in the future, offering a variety of services. Meanwhile, some LTE frequency bands may be allocated to provide 5G services.

[0003] In this regard, mobile terminals can be configured to provide 5G communication services across various frequency bands. Recently, attempts have been made to provide 5G communication services using the Sub6 band below 6 GHz. However, in the future, 5G communication services are expected to be provided using the millimeter wave (mmWave) band in addition to the Sub6 band for faster data speeds.

[0004] Recently, the need to provide these communication services through vehicles has been increasing. Meanwhile, the need for next-generation communication services, such as 5G communication services, is also emerging, in addition to existing communication services like LTE (Long Term Evolution).

[0005] Meanwhile, the vehicle body and roof are made of metal, which poses a problem of radio wave blocking. Accordingly, a separate antenna module can be placed on the upper portion of the vehicle body or roof. Alternatively, if the antenna module is placed on the lower portion of the vehicle body or roof, the portion of the vehicle body or roof corresponding to the antenna placement area can be formed of a non-metallic material.

[0006] However, from a design perspective, the vehicle body or roof needs to be formed as one piece. In such cases, the exterior of the vehicle body or roof may be formed of metal. Consequently, there is a risk that the vehicle body or roof may significantly reduce antenna efficiency.

[0007] Additionally, the antenna module mounted on the vehicle may include electronic components, including multiple communication modules. The electronic components may be arranged on different substrates or on different surfaces of the same substrate. An optimal heat dissipation structure is required, taking into account the arrangement of the electronic components on different substrates or on different surfaces of the same substrate.

[0008] The present specification aims to solve the aforementioned problems and other problems. The purpose of the present specification is to provide an antenna module for a vehicle equipped with multiple communication modules and a heat dissipation structure.

[0009] The purpose of this specification is to implement an optimal heat dissipation structure by considering the arrangement structure of electronic components placed on both sides of a substrate or on different substrates.

[0010] The purpose of this specification is to provide an antenna module having multiple communication modules and a heat dissipation structure in a vehicle.

[0011] The purpose of this specification is to provide an optimal heat dissipation structure that takes into account the optimal shape and arrangement structure of multiple covers and heat sinks.

[0012] The purpose of this specification is to optimize the heat dissipation structure for each electronic component placed on multiple surfaces of a PCB.

[0013] The purpose of this specification is to improve heat dissipation performance while minimizing the overall height of the antenna module.

[0014] The purpose of this specification is to improve antenna performance while maintaining the height of an antenna module mounted on a vehicle below a certain level.

[0015] The purpose of this specification is to apply a heat dissipation structure to a vehicle that takes into account the arrangement structure of antennas and electronic components capable of operating in a wide band to support various communication systems.

[0016] The purpose of this specification is to efficiently dissipate heat generated from electronic components to the outside of an antenna module through multiple heat sink structures.

[0017] The purpose of this specification is to provide an optimized heat dissipation structure that takes into account the heat transfer path along the signal path within the antenna module.

[0018] In order to achieve the above or other purposes, an antenna module mounted on a vehicle according to one aspect of the present specification includes a PCB having at least one antenna element disposed on a first surface; a second PCB having a first surface coupled to a second surface of the PCB, a first electronic component disposed on the first surface, and a second electronic component disposed on the second surface; a first heat sink disposed to be in contact with the first electronic component disposed on the first surface of the second PCB; a second heat sink disposed to be in contact with the second electronic component disposed on the second surface of the second PCB; and a hole region formed in a central portion of the PCB to accommodate the first electronic component.

[0019] According to an embodiment, a first width of a lower end of the first heat sink may be formed narrower than a width of the hole area so that at least a portion of the first heat sink is inserted into the hole area. At least a portion of the inserted first heat sink may be configured to contact the first electronic component accommodated in the hole area to release heat generated from the first electronic component. A second width of the second heat sink may be formed wider than a width of the second PCB so as to release heat generated from the second electronic component.

[0020] According to an embodiment, the antenna module may further include a first cover configured to be coupled with a side portion of an upper region of the first heat sink. A third width of an opening region of the first cover into which the first heat sink is inserted may be formed to be wider than a first width of a lower portion of the first heat sink.

[0021] According to an embodiment, the first cover may include a horizontal region formed parallel to a horizontal plane, a first inclined region formed inclined at a predetermined angle with respect to the horizontal plane, and a second inclined region. The first heat sink may be arranged in the horizontal region of the first cover.

[0022] According to an embodiment, the first heat sink may include a first metal structure formed with a first width and a first height such that at least a portion thereof is inserted into the hole area of ​​the PCB; a second metal structure connected to the first metal structure and formed with a second height in an upper area of ​​the first metal structure in the Z-axis direction; and a third metal structure connected to the second metal structure and formed with a third height in an upper area of ​​the second metal structure in the Z-axis direction, the side surface of which is coupled to the first cover. The third height of the third metal structure may be formed to be greater than the second height of the second metal structure. The second height of the second metal structure may be formed to be greater than the first height of the first metal structure.

[0023] According to an embodiment, the third metal structure may include a plurality of metal members spaced apart in parallel in the horizontal axis direction and arranged in the Z-axis direction. The width of the second metal structure may be formed to be the same as the third width of the third metal structure. The first width of the first metal structure may be formed to be narrower than the third widths of the second metal structure and the third metal structure.

[0024] According to an embodiment, the antenna module may further include a thermoelectric element disposed between the second electronic component and the second heat sink disposed on the second surface of the second PCB to absorb heat generated from the second electronic component. The first electronic component disposed on the first surface of the second PCB may be coupled to a lower end of the first heat sink through a thermoelectric material. A first surface of the thermoelectric element may be in contact with the second electronic component through the thermoelectric material, and a second surface of the thermoelectric element may be in contact with the second heat sink.

[0025] According to an embodiment, the second heat sink may be disposed in the horizontal region of the first cover so as to overlap the first heat sink in the Z-axis direction. The second heat sink may include a fourth metal structure that is in contact with the thermoelectric element and formed with the second width and the fourth height; and a fifth metal structure that is connected to the fourth metal structure and formed with the second width and the fifth height. The fourth metal structure may include a plurality of second metal members that are spaced apart in parallel in the horizontal axis direction and arranged in the Z-axis direction. The fourth height of the fourth metal structure may be formed higher than the fifth height of the fifth metal structure.

[0026] According to an embodiment, the first electronic component may include at least one of a modem, an RF transceiver, a power management chip, and a first power amplifier. The second electronic component may include a DC / DC converter and a second power amplifier. The first power amplifier may operate in a low band (LB), and the second power amplifier may operate in a mid band (MB) and a high band (HB). Heat generated in the first power amplifier may be dissipated through the first heat sink, and heat generated in the second power amplifier may be dissipated through the second heat sink.

[0027] According to another aspect of the present disclosure, a vehicle is provided having an antenna module mounted thereon. The vehicle includes an antenna module disposed under a roof of the vehicle; and a telematics module operably coupled with the antenna module and configured to communicate with at least one of an adjacent vehicle, a Road Side Unit (RSU), and a base station. The antenna module includes a PCB having at least one antenna element disposed on a first surface; a second PCB having a first surface coupled with a second surface of the PCB, a first electronic component disposed on the first surface, and a second electronic component disposed on the second surface; a first heat sink disposed in contact with the first electronic component disposed on the first surface of the second PCB; a second heat sink disposed in contact with the second electronic component disposed on the second surface of the second PCB; and a hole region formed in a central portion of the PCB to accommodate the first electronic component.

[0028] According to an embodiment, a first width of a lower end of the first heat sink may be formed narrower than a width of the hole area so that at least a portion of the first heat sink is inserted into the hole area. At least a portion of the inserted first heat sink may be configured to contact the first electronic component accommodated in the hole area to release heat generated from the first electronic component. A second width of the second heat sink may be formed wider than a width of the second PCB so as to release heat generated from the second electronic component.

[0029] The technical effects of the antenna module mounted on such a vehicle and the vehicle including the same are described as follows.

[0030] According to the present specification, an antenna module having a plurality of communication modules and a heat dissipation structure can be provided in a vehicle.

[0031] According to this specification, an optimal heat dissipation structure can be implemented through the optimal shape and arrangement structure of multiple covers and heat sinks.

[0032] According to the present specification, the metal structures of the first and second heat sinks can be shaped in multiple areas to optimize the heat dissipation structure for each electronic component placed on multiple surfaces of the PCB.

[0033] According to the present specification, a first heat sink can be arranged to be coupled to the upper cover to improve heat dissipation performance while minimizing the overall height of the antenna module.

[0034] According to the present specification, heat generated from an electronic component can be released to the upper region and the lower region through a first heat sink coupled to the upper cover and a second heat sink disposed in the lower region of the lower cover.

[0035] According to this specification, an optimized heat dissipation structure can be proposed by considering the heat transfer path along the signal path from a power amplifier to antenna elements capable of operating in a wide band.

[0036] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0037] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0038] FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted within a vehicle including an antenna module mounted on a vehicle according to the present specification.

[0039] Figure 3 is a configuration diagram of a vehicle according to an embodiment of the present specification.

[0040] FIG. 4 shows structures of a second PCB, which is an NAD substrate, according to embodiments that can be laminated with a first PCB, which is a main PCB.

[0041] Figure 5 shows an enlarged view and a cross-sectional view of the laminated structure of the PCB and the second PCB.

[0042] FIG. 6 illustrates a cross-sectional view of a vehicle antenna module including a plurality of heat sinks according to the present specification.

[0043] Fig. 7 shows the structure of the first and second heat sinks of Fig. 6 and the combined structure of the PCB and the second PCB.

[0044] Fig. 8 shows an exploded perspective view of the vehicle antenna module of Fig. 6.

[0045] Fig. 9 shows a perspective view of a vehicle antenna module having a first cover formed with a horizontal structure and an inclined structure.

[0046] Fig. 10 shows a cross-sectional view of an antenna module in line AA' including first and second heat sinks.

[0047] Fig. 11 shows a cross-sectional view of an antenna module in the BB' line including a second heat sink.

[0048] FIG. 12 illustrates electronic components arranged on the first and second surfaces of a second PCB arranged in an antenna module according to the present specification.

[0049] Figure 13 shows the electronic components arranged on the first and second surfaces of the second PCB of Figure 12 and the power consumption values ​​at a specific temperature.

[0050] Figure 14 illustrates a conceptual diagram of a heat dissipation mechanism for electronic components on a PCB and a second PCB having multiple heat sources.

[0051] Fig. 15 shows a configuration diagram of a vehicle including an antenna module according to the present specification.

[0052] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and the technical ideas disclosed in this specification are not limited by the attached drawings, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and technical scope of this specification.

[0053] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.

[0054] When a component is referred to as being "connected" or "connected" to another component, it should be understood that it may be directly connected or connected to that other component, but that there may be other components intervening. Conversely, when a component is referred to as being "directly connected" or "connected" to another component, it should be understood that there are no other components intervening.

[0055] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0056] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0057] Below, an antenna module according to the present specification is described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.

[0058] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).

[0059] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.

[0060] The above antenna may be placed on the glass of the vehicle (1). The antenna may be coupled or attached to a front windshield (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the antenna may be a transparent antenna. As another example, the antenna may be placed in an area where a roof (110) is formed on the upper portion of the vehicle (1).

[0061] Meanwhile, FIGS. 2A and 2B illustrate a structure in which an antenna module can be mounted within a vehicle including an antenna module mounted on a vehicle according to the present specification.

[0062] Referring to Figures 2a and 2b, the present specification proposes a planar antenna that does not protrude, replacing the existing shark fin antenna, to improve the appearance of an automobile (vehicle) and preserve telematics performance in the event of a collision. Furthermore, the present specification proposes an antenna that integrates an LTE antenna and a 5G antenna, taking into account 5th generation (5G) communications, along with the provision of existing mobile communication services (LTE).

[0063] Referring to Fig. 2a, an antenna module (1000) is placed on a formed roof of a vehicle (1). In Fig. 2a, a radome (110a) may surround the antenna system (1000) to protect the antenna module (1000) from the external environment and external impacts during vehicle operation. The radome (110a) may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure structures such as base stations or other vehicles may be transmitted.

[0064] Referring to FIG. 2b, the antenna module (1000) may be arranged within the roof structure (110b) of the vehicle (1), and may be configured such that at least a portion of the roof structure (110b) is implemented as a non-metal. At this time, at least a portion of the roof structure (110b) of the vehicle may be implemented as a non-metal, and may be made of a dielectric material through which radio signals transmitted / received between the antenna system (1000) and infrastructure such as a base station or other vehicles may be transmitted.

[0065] Meanwhile, referring to FIGS. 2a and 2b, the region where a beam pattern is formed by an antenna provided in an antenna module (1000) mounted on a vehicle needs to be formed from a horizontal region to an upper region by a predetermined angle.

[0066] In this regard, the peak of the elevation beam pattern of the antenna provided in the antenna module (1000) does not need to be formed at the bore site. Therefore, the peak of the elevation beam pattern of the antenna needs to be formed from the horizontal region to an upper region by a predetermined angle. For example, the elevation beam pattern of the antenna may be formed in a hemisphere shape as shown in FIGS. 2A and 2B. In addition, since the beam peak is formed within a low elevation angle range (e.g., 30 degrees), the elevation beam pattern of the antenna may be referred to as a low elevation beam pattern.

[0067] FIG. 3 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 3, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations in addition to the above configurations, or may omit some of the above configurations.

[0068] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415), and / or an infrared sensor (416).

[0069] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transceiver unit (426), and / or an ITS communication unit (427).

[0070] The user interface device (431) may be a device for interaction between the vehicle (1) and a user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).

[0071] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the status of the vehicle (1).

[0072] The interface unit (437) can serve as a passageway for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the units of the vehicle (1), control data for controlling the operation of the units, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an ECU (Electronic Control Unit) and / or a TCU (Telematics Control Unit).

[0073] Meanwhile, referring to FIGS. 1 to 3, the antenna system mounted on a vehicle may be positioned inside the vehicle, on the vehicle roof, inside the roof, or inside the roof frame. In this regard, the antenna system disclosed in this specification may be configured to operate in the low band (LB), mid band (MB), and high band (HB) of a 4G LTE system and the SUB6 band of a 5G NR system.

[0074] Meanwhile, a vehicle antenna module according to the present specification is described. The substrates arranged inside the vehicle antenna module can have electronic components arranged on both the first and second surfaces, thereby reducing the size occupied by the substrates. In particular, the NAD (Network Access Device) substrate, in which electronic components for 5G wireless communication are arranged, can be implemented as a double-sided substrate. The NAD substrate implemented as a double-sided substrate can be formed with a double-sided heat dissipation structure. Meanwhile, the reduced-size NAD substrate can be arranged in an optimal layout on the main PCB.

[0075] In this regard, Fig. 4 illustrates structures of a second PCB, which is an NAD substrate, according to embodiments that can be laminated with a first PCB, which is a main PCB. Fig. 4(a) illustrates a structure in which electronic components are arranged only on a first surface (S1b) of the second PCB (1200b). Ball grids for electrical connection with the PCB, which is a main substrate, can be formed on a second surface (S2b) of the second PCB (1200b).

[0076] Fig. 4(b) illustrates a second structure in which first electronic components are arranged on a first surface (S1b) of a second PCB (1200b) and second electronic components are arranged on a second surface (S2b). In Fig. 4(b), the second PCB (1200b) may be formed with a first width (W1p). The second electronic components may be arranged at the center of the second surface (S2b) of the second PCB (1200b). Ball grids for electrical connection with the PCB, which is a main substrate, may be formed on one side and the other side of the second surface (S2b) of the second PCB (1200b).

[0077] Fig. 4(c) shows a third structure in which first electronic components are arranged on a first surface (S1b) of a second PCB (1200b) and second electronic components are arranged on a second surface (S2b). The structure of Fig. 4(c) is a structure in which some of the electronic components arranged on the first surface (S1b) of Fig. 4(b) are arranged on the second surface (S2b). The second electronic components may be arranged at the center of the second surface (S2b) of the second PCB (1200b). Ball grids for electrical connection with the PCB, which is a main substrate, may be formed on one side and the other side of the second surface (S2b) of the second PCB (1200b). In Fig. 4(c), the second PCB (1200b) may be formed with a second width (W2p) that is narrower than the first width (W1p). Therefore, the third structure of Fig. 4(c) is easy to place within the free space of the PCB, which is the main substrate, as the width is reduced by ΔWp compared to the second structure of Fig. 4(b).

[0078] Meanwhile, in the vehicle antenna module according to the present specification, the PCB, which is the main substrate, and the second PCB, which is the NAD substrate, may be formed in a laminated structure. In this regard, FIG. 5 shows an enlarged view and a cross-sectional view of the laminated structure of the PCB and the second PCB. FIG. 5(a) shows an enlarged view of the laminated structure of the PCB (1200) and the second PCB (1200b). Referring to FIG. 5(a), the first surface (S1a) or the second surface (S2a) of the PCB (1200) and the second surface (S1b) of the second PCB (1200b) may be combined. The first surface (S1b) of the second PCB (1200b) may be arranged to protrude from the second surface (S2a) or the first surface (S1a) of the PCB (1200).

[0079] Fig. 5(b) shows a cross-sectional view of a laminated structure of a PCB (1200) and a second PCB (120b) in which a hole area (HR) is formed to allow a second electronic component (1220) to be inserted. Referring to Fig. 5(b), a first surface (S1a) of the PCB (1200) and a second surface (S2b) of the second PCB (1200b) can be joined by a ball grid structure.

[0080] A vehicle antenna module including a plurality of heat sinks according to the present specification is described. In this regard, FIG. 6 shows a cross-sectional view of a vehicle antenna module including a plurality of heat sinks according to the present specification. FIG. 7 shows the structure of the first and second heat sinks of FIG. 6 and the combined structure of a PCB and a second PCB. FIG. 7(a) shows a structure in which a first heat sink (1500a) having first to third metal structures (1510a, 1520a, 1530a) is combined with a first cover (1310). FIG. 7(b) shows first and second heat transfer paths (HP1, HP2) from one side and the other side of the second PCB (1200b) to the first and second antennas (ANT1, ANT2) in the combined structure of the PCB (1200) and the second PCB (1200b). Figure 7(c) illustrates a second heat sink (1500b) having fourth and fifth metal structures (1510b, 1520b).

[0081] Meanwhile, Fig. 8 illustrates an exploded perspective view of the vehicle antenna module of Fig. 6. Referring to Figs. 6 to 8, a vehicle antenna module including a plurality of heat sinks according to the present disclosure will be described. In this regard, an antenna module including a plurality of communication modules and a heat dissipation structure may be provided in a vehicle. An optimal heat dissipation structure can be implemented by considering the arrangement structure of electronic components arranged on both sides of a board or on different boards. An antenna module including a plurality of communication modules and a heat dissipation structure may be provided in a vehicle. An optimal heat dissipation structure can be provided by considering the optimal shapes and arrangement structures of a plurality of covers and heat sinks. The heat dissipation structure can be optimized for each electronic component arranged on multiple surfaces of a PCB. Heat dissipation performance can be improved while minimizing the overall height of the antenna module. Antenna performance can be improved while maintaining the height of the antenna module mounted on a vehicle below a certain level. To support various communication systems, a heat dissipation structure that considers the arrangement structure of antennas and electronic components capable of operating in a wide band can be applied to a vehicle. Heat generated from electronic components can be efficiently dissipated to the exterior of the antenna module through multiple heat sink structures. An optimized heat dissipation structure can be provided by considering heat transfer paths along signal paths within the antenna module.

[0082] Referring to FIGS. 6 to 8, the antenna module (1000) may include a PCB (1200), a second PCB (1200b), a first heat sink (1500a), and a second heat sink (1500b). The antenna module (1000) may further include a hole area (HR) formed in the PCB (1200).

[0083] PCB (1200) may have at least one antenna element arranged on a first surface. A first surface (S1b) of a second PCB (1200b) may be coupled to a second surface of PCB (1200). The second PCB (1200b) may have a first electronic component (1210) arranged on the first surface (S1b) and a second electronic component (1220) arranged on the second surface (S2b). The second PCB (1200b) may have electronic components arranged for 5G wireless communication and may be referred to as a Network Access Device (NAD) board.

[0084] The power consumed by the first electronic component (1210) disposed on the first surface (S1b) of the second PCB (1200b) may be a first power value. The power consumed by the second electronic component (1220) disposed on the second surface (S2b) of the second PCB (1200b) may be a second power value. The second power value may be set to a value greater than the first power value. For example, the first power value may be 1.5 W and the second power value may be 1.8 W. Therefore, the first and second heat sinks (1500a, 1500b) need to be designed so that the second heat discharged through the second surface (S2b) of the second PCB (1200b) is discharged more effectively than the first heat discharged through the first surface (S1b).

[0085] The first heat sink (1500a) may be positioned to contact the first electronic component (1210) disposed on the first surface (S1b) of the second PCB (1200b). The second heat sink (1500b) may be positioned to contact the second electronic component (1220) disposed on the second surface (S2b) of the second PCB (1200b). A hole area (HR) may be formed in the center portion of the PCB (1200b) to accommodate the first electronic component (1210).

[0086] A first width (W1) of a lower end of the first heat sink (1500a) may be formed narrower than a width (Wh) of the hole area (HR) so that at least a portion of the first heat sink (1500a) is inserted into the hole area (HR). At least a portion of the first heat sink (1500a) inserted into the hole area (HR) may be in contact with a first electronic component (1210) disposed on a first surface (S1b) of a second PCB (1200b) accommodated in the hole area (HR). The heat generated in the first electronic component (1210) disposed on the first surface (S1b) of the second PCB (1200b) may be dissipated by at least a portion of the first heat sink (1500a) inserted into the hole area (HR). Meanwhile, the second width (W2) of the second heat sink (1500b) may be formed wider than the width (Wp) of the second PCB (1200b) to release heat generated from the second electronic component (1220) placed on the second surface (S2b) of the second PCB (1200b).

[0087] The first width (W1) of the lower portion of the first heat sink (1500a) is formed to be narrower than the hole area (HR) of the PCB (1200), and the second width (W2) of the second heat sink (1500b) is formed to be wider than the width (Wp) of the second PCB (1200b). Accordingly, the first heat generated from the first electronic component (1210) arranged on the first surface (S1b) of the second PCB (1200b) can be intensively released through the hole area (HR) of the PCB (1200), which is the main board, through the first heat sink (1500a). In addition, the second heat through the second electronic component (1220) arranged on the second surface (S2b) of the second PCB (1200b) can be released through the second heat sink (1500b).

[0088] The antenna module (1000) may further include a first cover (1310) and a second cover (1320) coupled with a first heat sink (1500a) and a second heat sink (1500b). The first cover (1310) and the second cover (1320) may be referred to as an upper cover and a lower cover, respectively. The first cover (1310) may be configured to be coupled with a side portion of an upper region of the first heat sink (1500a). A third width (W3) of an opening region of the first cover (1310) into which the first heat sink (1500a) is inserted may be formed to be wider than a first width (W1) of a lower portion of the first heat sink (1500a).

[0089] Meanwhile, the first cover, which is the upper cover of the vehicle antenna module according to the present specification, may be formed in a streamlined or inclined structure corresponding to the roof shape of the vehicle. In this regard, Fig. 9 shows a perspective view of a vehicle antenna module having a first cover formed in a horizontal structure and an inclined structure. Fig. 10 shows a cross-sectional view of the antenna module along line AA' including first and second heat sinks. Fig. 11 shows a cross-sectional view of the antenna module along line BB' including the second heat sink.

[0090] Referring to FIG. 9, the first cover (1310) may include a horizontal region (1311), a first inclined region (1312), and a second inclined region (1313). The horizontal region (1311) of the first cover (1310) may be formed parallel to a horizontal plane. The first inclined region (1312) and the second inclined region (1313) may be formed to be inclined at a predetermined angle with respect to a horizontal plane formed parallel to the horizontal region (1311) of the first cover (1310). A first heat sink (1500a) may be arranged in the horizontal region (1311) of the first cover (1310). A second heat sink (1500b) may be arranged in the horizontal region (1311) of the first cover (1310).

[0091] The first inclined region (1312) of the first cover (1310) may be formed to be inclined so that the height decreases from one end of the horizontal region (1311) to the end of the first inclined region (1312). The second inclined region (1313) of the first cover (1310) may be formed to be inclined so that the height decreases from the other end of the horizontal region (1311) to the end of the second inclined region (1313). The first and second inclined regions (1312, 1313) may be formed to have a first height (h1c) from the lower end to the upper end at the first and second points where the one end and the other end are formed. The first and second inclined regions (1312, 1313) may be formed at the third and fourth points connected to the horizontal region (1311) to have a second height (h2c) from the lower end to the upper end. The horizontal region (1311) may be formed at the second height (h2c) from the lower end to the upper end. The second height (h2c) may be formed to be greater than the first height (h1c).

[0092] Referring to FIGS. 9 and 10, the antenna module may have first and second heat sinks (1500a, 1500b) arranged on a cross-section of line AA'. The first heat sink (1500a) may be in contact with a first electronic component on a first surface of a second PCB (1200b) through a thermoelectric material (TIM) of a first thermoelectric layer (1511). The second heat sink (1500b) may be in contact with a second electronic component on a second surface of the second PCB (1200b) through a thermoelectric material (TIM) of a second and third thermoelectric layers (1512, 1513). Among the second electronic components on the second surface of the second PCB (1200b), the NAD may function as a heat source.

[0093] Referring to FIGS. 9 and 11, the antenna module may have a second heat sink (1500a, 1500b) disposed on the cross-section of the BB' line. The second heat sink (1500b) may be in contact with electronic components on the second surface of the PCB (1200) through a thermoelectric material (TIM) of the second and third thermoelectric layers (1512, 1513). Among the electronic components on the second surface of the PCB (1200b), an AP module, a Wi-Fi module, and a V2x module may act as a heat source.

[0094] Referring to FIGS. 6 to 11, a cover structure and a heat sink structure of a vehicle antenna module according to the present specification will be described. A second cover (1320) may have a recessed area (RA) formed to insert a second heat sink (1500b). The second cover (1320) may be coupled to a metal structure inside a vehicle roof through a first area (1321) on one side of the recessed area (RA) and a second area (1322) on the other side. The first area (1310R1) and the second area (1310R2) of the first cover (1310) adjacent to one side and the other side of the first heat sink (1500a) may be formed of a dielectric material through which radio waves pass. The second cover (1320), which is coupled to a metal structure inside a vehicle roof, may be formed of a metal material to improve heat dissipation characteristics.

[0095] The first heat sink (1500a) may be formed of a plurality of metal structures. The first heat sink (1500a) may be configured to include a first metal structure (1510a), a second metal structure (1520a), and a third metal structure (1530a).

[0096] The first metal structure (1510a) may be formed with a first width (W1) and a first height (h1) so that at least a portion thereof is inserted into a hole area (HR) of the PCB (1200). The second metal structure (1520a) may be connected to the first metal structure (1510a). The second metal structure (1520a) may be formed with a second height (h2) in an upper region of the first metal structure (1510a) in the Z-axis direction. The third metal structure (1530a) may be connected to the second metal structure (1520a). The third metal structure (1530a) may be formed with a third height (h3) in an upper region of the second metal structure (1520a) in the Z-axis direction. The third metal structure (1530a) may have a side surface coupled to the first cover (1310). The third height (h3) of the third metal structure (1530a) can be formed to be larger than the thickness of the first cover (1310).

[0097] The third metal structure (1530a) may include a plurality of metal members spaced apart in parallel in the horizontal axis direction and arranged in the Z-axis direction. A third height (h3) of the third metal structure (1530a) may be formed to be greater than a second height (h2) of the second metal structure (1520a). Accordingly, the first heat generated in the first electronic component (1210) may be discharged to the outside of the first cover (1310) through the plurality of metal members of the third metal structure (1530a). The first heat transfer path of the first heat may be increased by the third metal structure (1530a) including a plurality of metal members having a third height (h3) formed to be greater than the second height (h2). Therefore, the first heat generated in the first electronic component (1210) may be effectively discharged to the outside of the first cover (1310).

[0098] The second height (h2) of the third metal structure (1520a) may be formed to be greater than the first height (h1) of the first metal structure (1510a). Accordingly, the first metal structure (1510a) of the first heat sink (1500a) may be inserted into the hole area (HR) of the PCB (1200), thereby minimizing the overall height of the first heat sink (1500a).

[0099] Meanwhile, the width (W3) of the second metal structure (1520a) of the first heat sink (1500a) may be formed to be the same as the third width (W3) of the third metal structure (1530a). It may be formed to be narrower than the first width (W1) of the first metal structure (1510a) and the third widths (W3) of the second metal structure (1520a) and the third metal structure (1523a).

[0100] Meanwhile, the vehicle antenna module according to the present specification can optimize the heat dissipation structure through a thermoelectric element. In this regard, the second PCB (1200b) implemented with an NAD substrate consumes more power than the PCB (1200). Therefore, the second PCB (1200b) can be coupled to the second heat sink (1500b) through a thermoelectric element (TEC). The vehicle antenna module (1000) can further include a thermoelectric element (TEC).

[0101] A thermoelectric element (TEC) may be disposed between a second electronic component (1220) disposed on a second surface (S2b) of a second PCB (1200b) and a second heat sink (1500b). The thermoelectric element (TEC) may be formed to absorb second heat generated from the second electronic component (1220) disposed on the second surface (S2b) of the second PCB (1200b). A first electronic component (1210) disposed on a first surface (S1b) of the second PCB (1200b) may be coupled to a lower portion of the first heat sink (1500a) through a thermoelectric material of the first thermoelectric layer (1511).

[0102] A second electronic component arranged on a second surface (S2b) of a second PCB (1200b) can improve heat dissipation performance through a thermoelectric element (TEC) and a thermoelectric material of a second thermoelectric layer (1512). A first surface (S1c) of the thermoelectric element (TEC) can be in contact with the second electronic component (1220) through the thermoelectric material of the second thermoelectric layer (1512). A second surface (S2c) of the thermoelectric element (TEC) can be in contact with a second heat sink (1500b).

[0103] The second heat sink (1500b) may also be formed of a plurality of metal structures, similar to the first heat sink (1500a). The second heat sink (1500b) may be positioned in the horizontal region (1311) of the first cover (1310) so as to overlap with the first heat sink (1500a) in the Z-axis direction.

[0104] The second heat sink (1500b) may be configured to include a fourth metal structure (1510b) and a fifth metal structure (1520b). The fourth metal structure (1510b) may be in contact with a thermoelectric element (TEC) and may be formed with a second width (W2) and a fourth height (h4). The fifth metal structure (1520b) may be connected to the fourth metal structure (1510b). The fifth metal structure (1520b) may be formed with a second width (W2) and a fifth height (h5). The fourth metal structure (1510b) may include a plurality of second metal members spaced parallel to each other in the horizontal axis direction and arranged in the Z-axis direction. The fourth height (h4) of the fourth metal structure (1510b) may be formed higher than the fifth height (h5) of the fifth metal structure (1520b).

[0105] Meanwhile, the electronic components arranged on the first side (S1b) and the second side (S2b) of the second PCB (1200b) corresponding to the NAD substrate are described below. In this regard, Fig. 12 shows electronic components arranged on the first and second sides of the second PCB arranged in the antenna module according to the present specification. Fig. 13 shows electronic components arranged on the first and second sides of the second PCB of Fig. 12 and their power consumption values ​​at a specific temperature.

[0106] Referring to FIGS. 6 to 13, a first electronic component (1210) disposed on a first surface (S1b) of a second PCB (1200b) may include at least one of a modem (S1), an RF transceiver (S4), a power management chip (S3), and a first power amplifier (S8, S10, S11). The first electronic component (1210) may further include a memory (S2) and DRX ICs (S13, S14, S15). The modem (S1) and the power management chip (S3) disposed in a lower region of the first surface (S1b) of the second PCB (1200b) may operate at a temperature of about 120 degrees. The RF transceiver (S4) disposed in the center of the first surface (S1b) of the second PCB (1200b) may also operate at a temperature of about 120 degrees. The power consumed by the modem (S1) and the power management chip (S3) is greater than 0.8 W and 0.6 W, respectively, so that the heat generated by the modem (S1) and the power management chip (S3) needs to be dissipated. The first power amplifier (S8, S10, S11) of the first surface (S1b) of the second PCB (1200b) can operate at a temperature of approximately 160 degrees.

[0107] The second electronic component (1220) disposed on the second side (S2b) of the second PCB (1200b) may include a DC / DC converter (S5, S6) and a second power amplifier (S7, S9, S12). The second PCB (1200b) may be disposed within an area of ​​a predetermined size. For example, the second PCB (1200b) may be disposed within a limited area of ​​38 mm X 43 mm.

[0108] The first power amplifier (S8) may be configured to operate in the low band (LB), which is a first frequency band of 4G / 5G wireless communication. The first power amplifier (S10) may be configured to operate in the n77 / n79 band of 5G wireless communication. The first power amplifier (S11) may be configured to operate in the n79 / n79 band of 5G wireless communication. The first frequency band, the low band (LB), may be set to 617 to 960 MHz, but is not limited thereto and may vary depending on the application. The n77 band of 5G wireless communication may be set to 3300-4200 MHz, but is not limited thereto and may vary depending on the application. The n79 band of 5G wireless communication may be set to 4400-5000 MHz, but is not limited thereto and may vary depending on the application.

[0109] The second power amplifier (S7) may be configured to operate in the GSM frequency band. The second power amplifier (S9) may be configured to operate in the mid-band (MB) and high-band (HB) of 5G wireless communications. The second frequency band, the mid-band (MB), may be set to 1520 to 4500 MHz, but is not limited thereto, and may vary depending on the application. The third frequency band, the high-band (HB), may be set to 4500 to 6000 MHz, but is not limited thereto, and may vary depending on the application. The second power amplifier (S12) may be configured to operate in the n41 band of 5G wireless communications. The n41 band of 5G wireless communications may be set to 2496 to 2690 MHz, but is not limited thereto, and may vary depending on the application.

[0110] The DC / DC converters (S5, S6) can operate at a temperature of about 125 degrees. The second power amplifier (S7) can operate at a temperature of about 135 degrees. The second power amplifiers (S9, S12) can operate at a temperature of about 160 degrees. The power consumed by the second power amplifier (S9) operating in the mid-band (MB) and high-band (HB) of 5G wireless communication is about 1.1-1.3 W, so the heat generated by the second power amplifier (S9) needs to be dissipated.

[0111] Accordingly, heat generated from the first power amplifier (S8, S10, S11) disposed on the first surface (S1b) of the second PCB (1200b) can be dissipated through the first heat sink (1500a). Heat generated from the second power amplifier (S7, S9, S12) disposed on the second surface (S2b) of the second PCB (1200b) can be dissipated through the second heat sink (1500b).

[0112] Meanwhile, in the antenna module according to the present specification, antenna elements arranged in different areas of the PCB corresponding to one side and the other side of the first heat sink may emit heat while radiating signals in different ways. In this regard, a first antenna element (ANT1) may be arranged in a first area (1200R1) of the PCB (1200) corresponding to a first area (1310a) of the first cover (1310). A second antenna element (ANT2) may be arranged in a second area (1200R2) of the PCB (1200) corresponding to a second area (1310b) of the first cover (1310).

[0113] In this regard, when the first and second antenna elements (ANT2) operate simultaneously in different frequency bands, more heat may be generated. Therefore, when the first and second antenna elements (ANT2) operate simultaneously in different frequency bands, the heat dissipation mechanism may be configured as follows.

[0114] The first antenna element (ANT1) can receive and / or transmit signals in a low band by being coupled with the first power amplifier (S8) disposed on the first surface (S1b) of the second PCB (1200b). The second antenna element (ANT2) can receive and / or transmit signals in a mid band or a high band simultaneously by being coupled with the second power amplifier (S9) disposed on the second surface (S2b) of the second PCB (1200b). In this regard, heat generated in the first power amplifier (S8) can be dissipated through the first heat sink (1500a), while heat generated in the second power amplifier (S9) can be dissipated through the second heat sink (1500b).

[0115] The antenna module may be designed to dissipate heat transferred from the first electronic component (1210) to the first antenna element (ANT1) and heat transferred from the second electronic component (1220) to the second antenna element (ANT2). To this end, the second width (W2) of the second heat sink (1500b) may be formed to be wider than the distance (G1) from the end of the first antenna element (ANT1) to the end of the second antenna element (ANT2). In this regard, a first heat transfer path (HP1) may be formed from the second PCB (1200b) through the PCB (1200) to the end of the first antenna element (ANT1). In addition, a second heat transfer path (HP2) may be formed from the second PCB (1200b) through the PCB (1200) to the end of the second antenna element (ANT2). A distance (G1) from the end of the antenna element (ANT1) to the end of the second antenna element (ANT2) can be formed to include the first and second heat transfer paths (HP1, HP2). Accordingly, the second width (W2) of the second heat sink (1500b) can be formed to be longer than the length of the first and second heat transfer paths (HP1, HP2), so that heat generated in the first and second power amplifiers (S8, S9) can be effectively dissipated.

[0116] Meanwhile, the PCB (1200) and the second PCB (1200b) of the vehicle antenna module according to the present specification may be implemented as a multilayer PCB laminated in multiple layers in the Z-axis direction. In this regard, the first layer, the second layer, the third layer, and the fourth layer of the second PCB (1200) may each have a communication block for 5G communication, a first ground layer, an RF signal path, and a second ground layer. An NAD module and a power management chip (PMIC) may be arranged as a communication block on the first layer. The communication block including the NAD module and the power management chip (PMIC) may be arranged inside a shield can.

[0117] A first ground layer and a second ground layer may be arranged in the second and fourth layers, which are the upper and lower regions of the RF signal path of the third layer, so that the RF signal path may be formed in a strip line structure. The first ground layer may be arranged in the second layer to isolate a signal radiated from the oscillating element. An SMPS power line may be designed and arranged in the third layer. The RF signal path of the transceiver block may be arranged in the third layer.

[0118] The fifth, sixth, seventh, and eighth layers of the second PCB (1200) may be provided with RF signal paths, a third ground layer, a signal path of a GNSS antenna, and a fourth ground layer. Power lines, data lines through which memory data is transmitted, and an RF signal path of a transceiver block may be provided on the fifth layer. Power lines of a signal output from an inverter and a third ground layer may be provided on the sixth layer. LDO power lines, SDR differential signal lines, and signal lines connected to a GNSS antenna may be provided on the seventh layer. A fourth ground layer may be provided on the eighth layer.

[0119] A power amplifier, a fifth ground layer, signal paths of the first and second antennas, and a low-noise amplifier module may be disposed on the ninth, tenth, eleventh, and twelfth layers of the second PCB (1200). Power lines of the power amplifier module and the inverter, and high-speed data lines such as PCI-E and / or USB may be disposed on the ninth layer. Power lines of the first variable power amplifier and a fifth ground layer, which is a ground layer for baseband signals, may be disposed on the tenth layer. Signal lines connected to the first and second antennas, which are main antennas, and power lines of the second variable power amplifier may be disposed on the eleventh layer. The first variable power amplifier may be configured to operate in a low-frequency band, and the second variable power amplifier may be configured to operate in a high-frequency band. Ball grid structures for solder connections and a low-noise amplifier module may be disposed on the twelfth layer.

[0120] Meanwhile, a vehicle antenna module equipped with multiple heat sinks according to the present specification may implement a heat dissipation structure using different mechanisms for each of the multiple heat sources. In this regard, Fig. 14 illustrates a conceptual diagram of a heat dissipation mechanism for electronic components on a PCB and a second PCB equipped with multiple heat sources.

[0121] Referring to FIGS. 6 to 14, a PCB (1200) is placed within an internal space formed by a first cover (1310) and a second cover (1320). A second PCB (1200b) is placed within a hole area of ​​the PCB (1200). Heat emitted through an NAD module placed on the second PCB (1200b) in the first area may be disposed outside the first cover (1310) and the second cover (1320) through the first and second heat sinks (1500a, 1500b). The NAD module may be placed inside a separate shield can to prevent interference with external interference signals. A thermoelectric element (TEC) may be placed between the second heat sink (1500b) and the NAD module.

[0122] The first heat sink (1500a) can be placed in the first region. For example, the first heat sink (1500a) can be 7.3 cm 3 The second heat sink (1500b) may be arranged to cover the first to third regions. For example, the second heat sink (1500b) may be arranged to cover the first to third regions. 3 It can be placed in an area covering the first to third areas.

[0123] Heat emitted from an AP module disposed on a PCB (1200) in a second region may be disposed into a lower region of a second cover (1320) through a second heat sink (1500b). The AP module may be disposed within a recessed space of the second cover (1320). Heat emitted from the AP module may be emitted between the recessed space of the second cover (1320) and the second heat sink (1500b). In addition, heat emitted from the AP module may be emitted into a lower space through the second heat sink (1500b).

[0124] In the third region, heat emitted from a communication module disposed on a PCB (1200) may be disposed into a lower region of a second cover (1320) through a second heat sink (1500b). The communication module may be disposed within a recessed space of the second cover (1320). For example, the communication module may be an Ethernet communication module, but is not limited thereto and may be changed depending on the application. The heat emitted from the communication module may be dissipated between the recessed space of the second cover (1320) and the second heat sink (1500b). Additionally, the heat emitted from the communication module may be dissipated into a lower space through the second heat sink (1500b).

[0125] The above describes a vehicle antenna module according to one aspect of the present specification. Below, a vehicle equipped with an antenna module according to another aspect of the present specification will be described. In this regard, Fig. 15 illustrates a configuration diagram of a vehicle including an antenna module according to the present specification. In this regard, the descriptions of the aforementioned antenna module can be applied to the following vehicles.

[0126] Referring to FIGS. 1 to 15, the antenna module (1000) can perform short-range communication, wireless communication, V2X communication, etc., by itself or through a communication device (400). To this end, the processor (1400) can control the antenna module (1000) to receive signals from or transmit signals to adjacent vehicles, RSUs, and base stations.

[0127] The processor (1400) can control the communication device (400) to receive signals from or transmit signals to adjacent vehicles, RSUs, adjacent objects, and base stations. Here, information about adjacent objects can be obtained through object detection devices such as a camera (531), radar (532), lidar (533), and sensors (534, 535) of the vehicle (1). Alternatively, the processor (1400) can control the communication device (400) and the antenna module (1000) to receive signals from or transmit signals to adjacent vehicles, RSUs, adjacent objects, and base stations.

[0128] A vehicle (1) may include an antenna module (1000) and a telematics module (300). The telematics module (300) may be disposed on the second surface of a PCB (1200), but is not limited thereto and may be changed depending on the application. The telematics module (300) may be configured to include a RFIC, which is a transceiver circuit, and a processor (1400). The antenna module (1000) may be disposed under the roof of the vehicle (1). The telematics module (300) may be operatively coupled with the antenna module (1000). The telematics module (300) may be configured to communicate with at least one of an adjacent vehicle, an RSU (Road Side Unit), and a base station.

[0129] The antenna module (1000) may include a PCB (1200), a second PCB (1200b), a first heat sink (1500a), and a second heat sink (1500b). The antenna module (1000) may further include a hole area (HR) formed in the PCB (1200).

[0130] PCB (1200) may have at least one antenna element arranged on a first surface. A first surface (S1b) of a second PCB (1200b) may be coupled to a second surface of PCB (1200). The second PCB (1200b) may have a first electronic component (1210) arranged on the first surface (S1b) and a second electronic component (1220) arranged on the second surface (S2b). The second PCB (1200b) may have electronic components arranged for 5G wireless communication and may be referred to as a Network Access Device (NAD) board.

[0131] The power consumed by the first electronic component (1210) disposed on the first surface (S1b) of the second PCB (1200b) may be a first power value. The power consumed by the second electronic component (1220) disposed on the second surface (S2b) of the second PCB (1200b) may be a second power value. The second power value may be set to a value greater than the first power value. For example, the first power value may be 1.5 W and the second power value may be 1.8 W. Therefore, the first and second heat sinks (1500a, 1500b) need to be designed so that the second heat discharged through the second surface (S2b) of the second PCB (1200b) is discharged more effectively than the first heat discharged through the first surface (S1b).

[0132] The first heat sink (1500a) may be positioned to contact the first electronic component (1210) disposed on the first surface (S1b) of the second PCB (1200b). The second heat sink (1500b) may be positioned to contact the second electronic component (1220) disposed on the second surface (S2b) of the second PCB (1200b). A hole area (HR) may be formed in the center portion of the PCB (1200b) to accommodate the first electronic component (1210).

[0133] A first width (W1) of a lower end of the first heat sink (1500a) may be formed narrower than a width (Wh) of the hole area (HR) so that at least a portion of the first heat sink (1500a) is inserted into the hole area (HR). At least a portion of the first heat sink (1500a) inserted into the hole area (HR) may be in contact with a first electronic component (1210) disposed on a first surface (S1b) of a second PCB (1200b) accommodated in the hole area (HR). The heat generated in the first electronic component (1210) disposed on the first surface (S1b) of the second PCB (1200b) may be dissipated by at least a portion of the first heat sink (1500a) inserted into the hole area (HR). Meanwhile, the second width (W2) of the second heat sink (1500b) may be formed wider than the width (Wp) of the second PCB (1200b) to release heat generated from the second electronic component (1220) placed on the second surface (S2b) of the second PCB (1200b).

[0134] The first width (W1) of the lower portion of the first heat sink (1500a) is formed to be narrower than the hole area (HR) of the PCB (1200), and the second width (W2) of the second heat sink (1500b) is formed to be wider than the width (Wp) of the second PCB (1200b). Accordingly, the first heat generated from the first electronic component (1210) arranged on the first surface (S1b) of the second PCB (1200b) can be intensively released through the hole area (HR) of the PCB (1200), which is the main board, through the first heat sink (1500a). In addition, the second heat through the second electronic component (1220) arranged on the second surface (S2b) of the second PCB (1200b) can be released through the second heat sink (1500b).

[0135] The antenna module (1000) may further include a first cover (1310) and a second cover (1320) coupled with a first heat sink (1500a) and a second heat sink (1500b). The first cover (1310) and the second cover (1320) may be referred to as an upper cover and a lower cover, respectively. The first cover (1310) may be configured to be coupled with a side portion of an upper region of the first heat sink (1500a). A third width (W3) of an opening region of the first cover (1310) into which the first heat sink (1500a) is inserted may be formed to be wider than a first width (W1) of a lower portion of the first heat sink (1500a).

[0136] The first heat sink (1500a) may be formed of a plurality of metal structures. The first heat sink (1500a) may be configured to include a first metal structure (1510a), a second metal structure (1520a), and a third metal structure (1530a).

[0137] The first metal structure (1510a) may be formed with a first width (W1) and a first height (h1) so that at least a portion thereof is inserted into a hole area (HR) of the PCB (1200). The second metal structure (1520a) may be connected to the first metal structure (1510a). The second metal structure (1520a) may be formed with a second height (h2) in an upper region of the first metal structure (1510a) in the Z-axis direction. The third metal structure (1530a) may be connected to the second metal structure (1520a). The third metal structure (1530a) may be formed with a third height (h3) in an upper region of the second metal structure (1520a) in the Z-axis direction. The third metal structure (1530a) may have a side surface coupled to the first cover (1310).

[0138] The third metal structure (1530a) may include a plurality of metal members spaced apart in parallel in the horizontal axis direction and arranged in the Z-axis direction. A third height (h3) of the third metal structure (1530a) may be formed to be greater than a second height (h2) of the second metal structure (1520a). Accordingly, the first heat generated in the first electronic component (1210) may be discharged to the outside of the first cover (1310) through the plurality of metal members of the third metal structure (1530a). The first heat transfer path of the first heat may be increased by the third metal structure (1530a) including a plurality of metal members having a third height (h3) formed to be greater than the second height (h2). Therefore, the first heat generated in the first electronic component (1210) may be effectively discharged to the outside of the first cover (1310).

[0139] The second height (h2) of the third metal structure (1520a) may be formed to be greater than the first height (h1) of the first metal structure (1510a). Accordingly, the first metal structure (1510a) of the first heat sink (1500a) may be inserted into the hole area (HR) of the PCB (1200), thereby minimizing the overall height of the first heat sink (1500a).

[0140] Meanwhile, the width (W3) of the second metal structure (1520a) of the first heat sink (1500a) may be formed to be the same as the third width (W3) of the third metal structure (1530a). It may be formed to be narrower than the first width (W1) of the first metal structure (1510a) and the third widths (W3) of the second metal structure (1520a) and the third metal structure (1523a).

[0141] Meanwhile, a vehicle according to the present specification can optimize its heat dissipation structure through a thermoelectric element. In this regard, a second PCB (1200b) implemented with an NAD substrate consumes more power than the PCB (1200). Therefore, the second PCB (1200b) can be coupled to a second heat sink (1500b) through a thermoelectric element (TEC). The vehicle antenna module (1000) can further include a thermoelectric element (TEC).

[0142] A thermoelectric element (TEC) may be disposed between a second electronic component (1220) disposed on a second surface (S2b) of a second PCB (1200b) and a second heat sink (1500b). The thermoelectric element (TEC) may be formed to absorb second heat generated from the second electronic component (1220) disposed on the second surface (S2b) of the second PCB (1200b). A first electronic component (1210) disposed on a first surface (S1b) of the second PCB (1200b) may be coupled to a lower portion of the first heat sink (1500a) through a thermoelectric material of the first thermoelectric layer (1511).

[0143] A second electronic component arranged on a second surface (S2b) of a second PCB (1200b) can improve heat dissipation performance through a thermoelectric element (TEC) and a thermoelectric material of a second thermoelectric layer (1512). A first surface (S1c) of the thermoelectric element (TEC) can be in contact with the second electronic component (1220) through the thermoelectric material of the second thermoelectric layer (1512). A second surface (S2c) of the thermoelectric element (TEC) can be in contact with a second heat sink (1500b).

[0144] The second heat sink (1500b) may also be formed of a plurality of metal structures, similar to the first heat sink (1500a). The second heat sink (1500b) may be positioned in the horizontal region (1311) of the first cover (1310) so as to overlap with the first heat sink (1500a) in the Z-axis direction.

[0145] The second heat sink (1500b) may be configured to include a fourth metal structure (1510b) and a fifth metal structure (1520b). The fourth metal structure (1510b) may be in contact with a thermoelectric element (TEC) and may be formed with a second width (W2) and a fourth height (h4). The fifth metal structure (1520b) may be connected to the fourth metal structure (1510b). The fifth metal structure (1520b) may be formed with a second width (W2) and a fifth height (h5). The fourth metal structure (1510b) may include a plurality of second metal members spaced parallel to each other in the horizontal axis direction and arranged in the Z-axis direction. The fourth height (h4) of the fourth metal structure (1510b) may be formed higher than the fifth height (h5) of the fifth metal structure (1520b).

[0146] The above describes an antenna module mounted on a vehicle and a vehicle including the same. The technical effects of such an antenna module mounted on a vehicle and a vehicle including the same are described below.

[0147] According to the present specification, an antenna module having a plurality of communication modules and a heat dissipation structure can be provided in a vehicle.

[0148] According to this specification, an optimal heat dissipation structure can be implemented through the optimal shape and arrangement structure of multiple covers and heat sinks.

[0149] According to the present specification, the metal structures of the first and second heat sinks can be shaped in multiple areas to optimize the heat dissipation structure for each electronic component placed on multiple surfaces of the PCB.

[0150] According to the present specification, a first heat sink can be arranged to be coupled to the upper cover to improve heat dissipation performance while minimizing the overall height of the antenna module.

[0151] According to the present specification, heat generated from an electronic component can be released to the upper region and the lower region through a first heat sink coupled to the upper cover and a second heat sink disposed in the lower region of the lower cover.

[0152] According to this specification, an optimized heat dissipation structure can be proposed by considering the heat transfer path along the signal path from a power amplifier to antenna elements capable of operating in a wide band.

[0153] Further scope of the applicability of the present invention will become apparent from the detailed description below. However, since various modifications and variations within the spirit and scope of the present invention will become apparent to those skilled in the art, it should be understood that the detailed description and specific examples, such as preferred embodiments of the present invention, are given by way of example only.

[0154] In relation to the present invention described above, the antenna module mounted on a vehicle and the control operation thereof may be implemented using software, firmware, or a combination thereof. Meanwhile, the design of the antenna module mounted on the vehicle and the configuration for performing control of the antenna module can be implemented as computer-readable code on a medium having a program recorded thereon. The computer-readable medium includes all types of recording devices that store data that can be read by a computer system. Examples of the computer-readable medium include hard disk drives (HDDs), solid state disks (SSDs), silicon disk drives (SDDs), ROMs, RAMs, CD-ROMs, magnetic tapes, floppy disks, optical data storage devices, etc., and also includes media implemented in the form of carrier waves (e.g., transmission via the Internet). In addition, the computer may include a control unit of a terminal or a vehicle, i.e., a processor. Therefore, the above detailed description should not be construed as limiting in all respects and should be considered as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention.

Claims

1. In an antenna module mounted on a vehicle, A PCB having at least one antenna element disposed on a first surface; A second PCB having a first side joined to a second side of the PCB, a first electronic component disposed on the first side, and a second electronic component disposed on the second side; A first heat sink arranged to be in contact with the first electronic component arranged on the first surface of the second PCB; A second heat sink arranged to be in contact with the second electronic component arranged on the second surface of the second PCB; and An antenna module comprising a hole area formed in the center of the PCB to accommodate the first electronic component.

2. In paragraph 1, The first width of the lower end of the first heat sink is formed narrower than the width of the hole area so that at least a portion of the first heat sink is inserted into the hole area, At least a portion of the inserted first heat sink is configured to contact the first electronic component accommodated in the hole area and to release heat generated from the first electronic component, An antenna module in which the second width of the second heat sink is formed wider than the width of the second PCB so as to dissipate heat generated from the second electronic component.

3. In paragraph 2, Further comprising a first cover configured to be coupled to a side surface of the upper region of the first heat sink; An antenna module, wherein a third width of the opening area of ​​the first cover into which the first heat sink is inserted is formed wider than a first width of the lower portion of the first heat sink.

4. In paragraph 3, The first cover includes a horizontal area formed parallel to a horizontal plane, a first inclined area formed to be inclined at a predetermined angle to the horizontal plane, and a second inclined area, An antenna module wherein the first heat sink is disposed in the horizontal area of ​​the first cover.

5. In paragraph 4, The above first heat sink, A first metal structure formed with a first width and a first height so that at least a portion of the metal structure is inserted into the hole area of ​​the PCB; A second metal structure connected to the first metal structure and formed with a second height in the upper region of the first metal structure in the Z-axis direction; and A third metal structure is connected to the second metal structure, is formed in the upper region of the second metal structure in the Z-axis direction at a third height, and has a side portion that is coupled to the first cover. The third height of the third metal structure is formed to be greater than the second height of the second metal structure, An antenna module in which the second height of the second metal structure is formed to be greater than the first height of the first metal structure.

6. In paragraph 5, The above third metal structure includes a plurality of metal members spaced parallel to the horizontal axis and arranged in the Z-axis direction, The width of the second metal structure is formed to be the same as the third width of the third metal structure, An antenna module in which the first width of the first metal structure is formed narrower than the third widths of the second metal structure and the third metal structure.

7. In paragraph 6, Further comprising a thermoelectric element disposed between the second electronic component and the second heat sink disposed on the second surface of the second PCB to absorb heat generated from the second electronic component; The first electronic component arranged on the first surface of the second PCB is coupled to the bottom of the first heat sink through a thermoelectric material, An antenna module, wherein a first side of the thermoelectric element is in contact with the second electronic component through the thermoelectric material, and a second side of the thermoelectric element is in contact with the second heat sink.

8. In paragraph 7, The second heat sink is arranged in the horizontal area of ​​the first cover so as to overlap with the first heat sink in the Z-axis direction, The above second heat sink, A fourth metal structure in contact with the thermoelectric element and formed with the second width and the fourth height; and A fifth metal structure connected to the fourth metal structure and formed with the second width and the fifth height, The fourth metal structure includes a plurality of second metal members spaced parallel to the horizontal axis and arranged in the Z-axis direction, An antenna module in which the fourth height of the fourth metal structure is formed higher than the fifth height of the fifth metal structure.

9. In paragraph 7, The first electronic component includes at least one of a modem, an RF transceiver, a power management chip, and a first power amplifier, The second electronic component includes a DC / DC converter and a second power amplifier, The first power amplifier operates in the low band (LB), and the second power amplifier operates in the middle band (MB) and high band (HB). An antenna module, wherein heat generated from the first power amplifier is released through the first heat sink, and heat generated from the second power amplifier is released through the second heat sink.

10. In paragraph 3, A second cover having a recessed area formed to allow the second heat sink to be inserted, and configured to be coupled to a metal structure inside the vehicle roof through a first area on one side of the recessed area and a second area on the other side, The first and second regions of the first cover adjacent to one side and the other side of the first heat sink are formed of a dielectric material through which radio waves pass, The above second cover is an antenna module formed of a metal material.

11. In paragraph 10, A first antenna element is arranged in a first area of ​​the PCB corresponding to the first area of ​​the first cover, An antenna module in which a second antenna element is arranged in a second area of ​​the PCB corresponding to the second area of ​​the first cover.

12. In paragraph 11, The first antenna element is coupled with the first power amplifier to receive a signal in a low band, and the second antenna element is coupled with the second power amplifier to simultaneously receive a signal in a mid band or a high band. An antenna module in which heat generated from the first power amplifier is released through the first heat sink, while heat generated from the second power amplifier is simultaneously released through the second heat sink.

13. In paragraph 12, An antenna module in which the second width of the second heat sink is formed wider than the distance from the end of the first antenna element to the end of the second antenna element so as to dissipate heat transferred from the first electronic component to the first antenna element and heat transferred from the second electronic component to the second antenna element.

14. In paragraph 1, The above PCB and the second PCB are implemented as a multilayer PCB laminated in multiple layers in the Z-axis direction, The first, second, third and fourth layers of the above second PCB are respectively arranged with a communication block for 5G communication, a first ground layer and an RF signal path and a second ground layer, The fifth, sixth, seventh and eighth layers of the second PCB are arranged with an RF signal path, a third ground layer, a signal path of a GNSS antenna and a fourth ground layer. An antenna module in which the 9th, 10th, 11th and 12th layers of the above second PCB are arranged with a power amplifier, a 5th ground layer, signal paths of the first and second antennas and a low-noise amplifier module.

15. In a vehicle equipped with an antenna module, An antenna module placed under the roof of the vehicle; and A telematics module operatively coupled to the antenna module and configured to communicate with at least one of an adjacent vehicle, a Road Side Unit (RSU), and a base station, The above antenna module, A PCB having at least one antenna element disposed on a first surface; A second PCB having a first side joined to a second side of the PCB, a first electronic component disposed on the first side, and a second electronic component disposed on the second side; A first heat sink arranged to be in contact with the first electronic component arranged on the first surface of the second PCB; and A second heat sink arranged to be in contact with the second electronic component arranged on the second surface of the second PCB; and A vehicle comprising a hole area formed in the center of the PCB to accommodate the first electronic component.

16. In paragraph 15, The first width of the lower end of the first heat sink is formed narrower than the width of the hole area so that at least a portion of the first heat sink is inserted into the hole area, At least a portion of the inserted first heat sink is configured to contact the first electronic component accommodated in the hole area and to release heat generated from the first electronic component, A vehicle in which the second width of the second heat sink is formed wider than the width of the second PCB to dissipate heat generated from the second electronic component.

17. In paragraph 16, a first cover configured to be coupled to a side surface of the upper region of the first heat sink; and A second cover having a recessed area formed to allow the second heat sink to be inserted, and configured to be coupled to a metal structure inside the vehicle roof through a first area on one side of the recessed area and a second area on the other side, The first and second regions of the first cover adjacent to one side and the other side of the first heat sink are formed of a dielectric material through which radio waves pass, The vehicle, wherein the second cover is formed of a metal material.

18. In paragraph 17, The above first heat sink, A first metal structure formed with a first width and a first height so that at least a portion of the metal structure is inserted into the hole area of ​​the PCB; A second metal structure connected to the first metal structure and formed with a second height in the upper region of the first metal structure in the Z-axis direction; and A third metal structure is connected to the second metal structure, is formed in the upper region of the second metal structure in the Z-axis direction at a third height, and has a side portion that is coupled to the first cover. The above third metal structure includes a plurality of metal members spaced parallel to the horizontal axis and arranged in the Z-axis direction, The third height of the third metal structure is formed to be greater than the second height of the second metal structure, The second height of the second metal structure is formed to be greater than the first height of the first metal structure, The width of the second metal structure is formed to be the same as the third width of the third metal structure, A vehicle formed to be narrower than the first width of the first metal structure and the third width of the third metal structure.

19. In paragraph 18, Further comprising a thermoelectric element disposed between the second electronic component and the second heat sink disposed on the second surface of the second PCB to absorb heat generated from the second electronic component; The first electronic component arranged on the first surface of the second PCB is coupled to the bottom of the first heat sink through a thermoelectric material, A vehicle, wherein a first side of the thermoelectric element is in contact with the second electronic component through the thermoelectric material, and a second side of the thermoelectric element is in contact with the second heat sink.

20. In paragraph 19, The second heat sink is arranged in the horizontal area of ​​the first cover so as to overlap with the first heat sink in the Z-axis direction, The above second heat sink, A fourth metal structure in contact with the thermoelectric element and formed with the second width and the fourth height; and A fifth metal structure connected to the fourth metal structure and formed with the second width and the fifth height, The fourth metal structure includes a plurality of second metal members spaced parallel to the horizontal axis and arranged in the Z-axis direction, A vehicle in which the fourth height of the fourth metal structure is formed higher than the fifth height of the fifth metal structure.

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