Epoxy resin composition for molding

Abstract

The present invention relates to: an epoxy resin composition and a semiconductor device molded using same, the epoxy resin composition comprising an epoxy resin, a curing agent, a filler and an organopolysiloxane, wherein the organopolysiloxane has an epoxy group at both ends thereof and includes a C5-C8 aryl group at a side chain thereof.

Description

Epoxy resin composition for molding

[0001] The present invention relates to an epoxy resin composition for molding and a semiconductor device molded using the same.

[0002]

[0003] A resin composition for sealing is used as a material to seal semiconductor devices such as integrated circuits (ICs), large scale integrated circuits (LSIs), transistors, and diodes, thereby improving the characteristics and reliability of semiconductor devices. Recently, with the trend toward miniaturization, weight reduction, and higher performance of electronic devices, the integration of semiconductors has accelerated, and research is continuing in various fields to improve the performance of materials used for sealing semiconductor devices. For example, Japanese Patent Application Laid-Open No. 2017-197620 relates to an epoxy resin composition for semiconductor sealing, which includes an epoxy resin, a phenol resin curing agent, and a filler, and discloses a technology for improving electrical connection reliability by controlling the content of the filler and the thermoelastic modulus of the cured product of the epoxy resin composition.

[0004] However, conventional resin compositions for semiconductor encapsulation have the problem of not providing sufficient properties to satisfy the compression fluidity, low shrinkage characteristics, and swelling suppression characteristics required when manufacturing epoxy molding compounds (EMCs). Therefore, there is a need for the development of an epoxy resin composition for molding that exhibits excellent compression fluidity, low shrinkage characteristics, and swelling suppression characteristics.

[0005]

[0006] The present invention provides an epoxy resin composition for molding having excellent fluidity, low shrinkage properties, and swelling suppression properties upon compression, and a semiconductor device molded using the same.

[0007]

[0008] The present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent, a filler, and an organopolysiloxane, wherein the organopolysiloxane has an epoxy group at both terminals and an aryl group having 5 to 8 carbon atoms in a side chain.

[0009]

[0010] The present invention provides an epoxy resin composition for molding, which exhibits excellent fluidity, low shrinkage properties, and swelling suppression properties upon compression. The epoxy resin composition according to the present invention is applicable to compression molding, and in particular, due to its excellent swelling suppression properties, it can be applied as a granular epoxy molding compound (EMC).

[0011]

[0012] The present invention will be described in detail below. However, it is not limited to the following description, and each component may be modified or selectively mixed as needed. Therefore, it should be understood that all modifications, equivalents, and alternatives included within the spirit and technical scope of the present invention are included.

[0013] The “softening point” used herein is measured by a conventional method known in the art, and can be measured, for example, using a dropping point system calorimetry DP70 from Mettler Toledo. The “particle size (D50)” is measured by a conventional method known in the art, and can be measured, for example, using a laser particle size analyzer.

[0014]

[0015] Epoxy resin composition

[0016] An epoxy resin composition according to the present invention comprises an epoxy resin, a curing agent, a filler, and an organopolysiloxane. The present invention provides an epoxy resin composition for sealing having excellent fluidity, low shrinkage properties, and swelling suppression properties upon compression by using an organopolysiloxane having epoxy groups at both terminals and an aryl group having 5 to 8 carbon atoms in a side chain.

[0017] The epoxy resin composition of the present invention can be manufactured in a liquid, powder, granule, or sheet form, and can be used as a sealant (EMC, epoxy molding compound) for semiconductor devices or as a molding material or fixing material for various electronic components and automotive components. For example, the epoxy resin composition for molding of the present invention can be applied for sealing a large-area semiconductor package that is large in size and thin in thickness, and can be manufactured as a granule-type EMC applicable to a compression type molding process, a C-molding process, or a lamination process.

[0018]

[0019] epoxy resin

[0020] The epoxy resin composition of the present invention comprises an epoxy resin. The epoxy resin is used as a main resin, and upon reaction with a curing agent and curing, forms a three-dimensional network structure, thereby imparting strong and solid adhesion properties to an adherend and heat resistance.

[0021] As the above epoxy resin, an epoxy resin commonly used in the relevant technical field can be used. Non-limiting examples of usable epoxy resins include bisphenol A type epoxy resins, alicyclic epoxy resins, cresol novolac epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, naphthalene type epoxy resins, anthracene epoxy resins, tetramethyl biphenyl type epoxy resins, phenol novolac epoxy resins, bisphenol A novolac epoxy resins, bisphenol S novolac epoxy resins, biphenyl novolac epoxy resins, naphthol novolac epoxy resins, naphthol phenol cocondensed novolac epoxy resins, naphthol cresol cocondensed novolac epoxy resins, aromatic hydrocarbon formaldehyde resin modified phenol resin epoxy resins, triphenyl methane type epoxy resins, tetraphenyl ethane type epoxy resins, dicyclopentadiene type epoxy resins, dicyclopentadiene phenol addition reaction epoxy resins, biphenyl type epoxy resins, phenol aralkyl type epoxy resins, multifunctional phenol resins, and naphthol. There are aralkyl type epoxy resins, etc., and one or more of these may be included.

[0022] For example, the epoxy resin may include a polymer with formaldehyde, 1,1'-biphenyl and phenol, glycidyl ether, 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl), 2,7-naphthalenediol polymer with 2-(chloromethyl)oxirane, ar-benzyl derivs, or a mixture thereof.

[0023] For example, the epoxy resin may include a polymer of formaldehyde, 1,1'-biphenyl and phenol, a polymer of glycidyl ether, 4,4-bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl) and 2-(chloromethyl)oxirane, and a 2,7-naphthalenediol polymer of an ar-benzyl derivative. In this case, the high fluidity required during compression molding can be more effectively secured.

[0024] The above epoxy resin may be used having an epoxy equivalent weight (EEW) of 100 to 500 g / eq, for example, 150 to 300 g / eq. If the epoxy equivalent weight is less than the above-mentioned range, the cured density may increase, resulting in poor moisture resistance reliability. If the epoxy equivalent weight exceeds the above-mentioned range, the curing property may be poor.

[0025] The above epoxy resin may be used with a softening point of 30 to 150°C, for example, 50 to 130°C. If the softening point is below the above-mentioned range, caking properties may be poor, and if it exceeds the above-mentioned range, uneven distribution may occur during manufacturing.

[0026] Based on the total weight of the epoxy resin composition, the content of the epoxy resin may be 2 to 20 wt%, for example, 5 to 15 wt%. If the content of the epoxy resin is less than the above-mentioned range, adhesion, flowability, and moldability may be reduced, and if it exceeds the above-mentioned range, the reliability of the semiconductor may be deteriorated due to an increase in moisture absorption, and the strength may be reduced due to a relative decrease in the filler content.

[0027]

[0028] hardener

[0029] The epoxy resin composition of the present invention includes a curing agent. The curing agent reacts with the epoxy resin to promote curing of the composition.

[0030] The curing agent may be any curing agent known in the art that undergoes a curing reaction with an epoxy resin. The curing agent may be a phenol-based compound having two or more phenolic hydroxyl groups in one molecule. Non-limiting examples of usable curing agents include phenol novolac resins, cresol novolac resins, phenol aralkyl resins, and multifunctional phenol compounds, and the curing agent may include one or more of these.

[0031] For example, the curing agent may include a phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl, a phenol polymer with hydroxybenzaldehyde, or a mixture thereof.

[0032] The above-mentioned hardener may be used having a hydroxyl equivalent of 90 to 300 g / eq, for example, 100 to 200 g / eq. If the hydroxyl equivalent is less than the above-mentioned range, moisture resistance reliability may be deteriorated, and if it exceeds the above-mentioned range, curing property may be deteriorated.

[0033] The above-mentioned hardener may be one having a softening point of 50 to 120°C, for example, 55 to 90°C. If the softening point is below the above-mentioned range, the caking property may be poor, and if it exceeds the above-mentioned range, the fluidity may be poor.

[0034] Based on the total weight of the epoxy resin composition, the content of the curing agent may be 2 to 20 wt%, for example, 2 to 10 wt%. If the content of the curing agent is less than the above-mentioned range, curability and formability may be reduced, and if it exceeds the above-mentioned range, the reliability of the semiconductor may be deteriorated and the strength may be reduced due to an increase in moisture absorption.

[0035]

[0036] filling

[0037] The epoxy resin composition of the present invention includes a filler. The filler improves the mechanical properties (e.g., strength) of the epoxy resin composition and reduces moisture absorption.

[0038] As the above-mentioned filler, any inorganic filler commonly used in the field of electronic materials can be used without any particular restrictions. For example, inorganic fillers such as silica, silica nitride, alumina, aluminum nitride, and boron nitride can be used, and these can be used alone or in combination of two or more.

[0039] The shape of the above filler is not particularly limited, and both angular and spherical shapes can be used. Non-limiting examples of fillers that can be used in the present invention include natural silica, synthetic silica, and fused silica, and for example, spherical silica particles can be used.

[0040] The above filler may include two or more types of fillers having different particle sizes. In this case, the moldability and workability of the epoxy resin composition can be further improved. For example, the filler may include a first filler having an average particle size (D50) of 3.5 to 20 um, for example, 3.5 to 15 um, and a second filler having an average particle size (D50) of 0.1 to 3 um, for example, 0.1 to 1 um.

[0041] Based on the total weight of the epoxy resin composition, the content of the filler may be 50 to 90 wt%, for example, 70 to 90 wt%. If the content of the filler is less than the aforementioned range, the moisture absorption of the cured product may increase, which may lower the reliability of the semiconductor device. If the content exceeds the aforementioned range, the fluidity may be reduced, resulting in poor formability.

[0042]

[0043] organopolysiloxane

[0044] The epoxy resin composition of the present invention includes organopolysiloxane. The organopolysiloxane serves to impart excellent compression fluidity, low shrinkage properties, and swelling suppression properties to the epoxy resin composition.

[0045] The above organopolysiloxane may be an organopolysiloxane having an epoxy group at both terminals and an aryl group having 5 to 8 carbon atoms in the side chain. For example, an organopolysiloxane having an epoxy group at both terminals and a phenyl group (an aryl group having 6 carbon atoms) in the side chain may be used. Due to the epoxy groups located at both terminals of the organopolysiloxane, good compatibility with the epoxy resin can be ensured, and due to the aryl group having a rigid structure located at the side chain, shrinkage of the resin structure can be reduced during heat curing or when cooled to room temperature after curing.

[0046] The above organopolysiloxane can be represented by the following chemical formula 1.

[0047] [Chemical Formula 1]

[0048]

[0049] In the above formula,

[0050] EP is an epoxy group,

[0051] R1 is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms,

[0052] R2 is an aryl group having 5 to 8 carbon atoms,

[0053] R3 is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, an aryl group having 5 to 8 carbon atoms, or a cycloalkyl group having 5 to 10 carbon atoms,

[0054] R4 is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms,

[0055] n is an integer from 1 to 50,

[0056] m is an integer from 0 to 50.

[0057] For example, in the above formula, EP is an epoxy group, R1 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, or an alkoxy group having 1 to 3 carbon atoms, R2 is a phenyl group, R3 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, a phenyl group, or a cycloalkyl group having 5 to 8 carbon atoms, R4 is a substituted or unsubstituted alkyl group having 1 to 3 carbon atoms, or an alkoxy group having 1 to 3 carbon atoms, n is an integer from 1 to 50, and m is an integer from 0 to 50.

[0058] For example, in the above formula, EP is an epoxy group, R1 is a methyl group or a methoxy group, R2 is a phenyl group, R3 is a methyl group, a phenyl group, or a cycloalkyl group having 5 to 8 carbon atoms, R4 is a methyl group or a methoxy group, n is an integer from 1 to 50, and m is an integer from 0 to 50.

[0059] For example, in the above formula, EP is an epoxy group, R1 is a methyl group or a methoxy group, R2 is a phenyl group, R3 is a phenyl group, R4 is a methyl group or a methoxy group, n is an integer from 1 to 50, and m is an integer from 0 to 50.

[0060] The above organopolysiloxane may be used having a viscosity (at 25°C) of 1,000 to 50,000 mPa.s and an epoxy equivalent of 1,000 to 5,000 g / mol. If the viscosity or equivalent is below the above-mentioned range, sufficient swelling characteristics may not be secured, and if it exceeds the above-mentioned range, fluidity may be poor during compression.

[0061] Based on the total weight of the epoxy resin composition, the content of the organopolysiloxane may be 0.1 to 10 wt%, for example, 0.1 to 3 wt%. If the content of the organopolysiloxane is less than the above-mentioned range, the epoxy resin composition may not be provided with sufficient fluidity, low shrinkage properties, and swelling suppression properties, and if it exceeds the above-mentioned range, the curability and strength may be inferior.

[0062]

[0063] additives

[0064] The epoxy resin composition of the present invention may additionally include additives commonly used in such compositions. Non-limiting examples of usable additives include catalysts, coupling agents, ion catchers, colorants, and release agents.

[0065] The catalyst promotes the curing reaction, and examples thereof include imidazole compounds, naphthalene-based latent catalysts, amine compounds, organometallic compounds, organophosphorus compounds, and boron compounds. The coupling agent promotes the bonding between inorganic and organic substances, and examples thereof include amino silanes and epoxy silanes. The ion catcher captures and removes impurity ions to reduce corrosion, and examples thereof include inorganic ion exchangers such as magnesium aluminum hydroxide carbonate hydrate. The coloring agent is added to provide color to the resin composition, and examples thereof include carbon black and bengala. The releasing agent is added to secure releasability between the EMC and the mold, and examples thereof include paraffin wax, carnauba wax, polyethylene wax, and ester wax.

[0066] The above additives may be added within a content range known in the relevant technical field, and for example, may be included in an amount of 0.01 to 5 wt%, respectively, based on the total weight of the epoxy resin composition, but is not limited thereto.

[0067]

[0068] The epoxy resin composition according to the present invention can be produced by a conventional method known in the art, for example, a melt mixing method using a semi-batch mixer, a kneader, a roll, a single-screw or twin-screw extruder, and a con-kneader.

[0069] The epoxy resin composition of the present invention can be manufactured in powder form, granule form, etc. In particular, the epoxy resin composition according to the present invention has excellent swelling inhibition properties, so it can be manufactured in granule form and applied to a compression molding method.

[0070] For example, in the case of a powder-type or granular epoxy resin composition, the components as described above are uniformly mixed, melted and mixed at a temperature of 80 to 130°C using a heat kneader, cooled to room temperature, pulverized into a powder state, and then subjected to a sieving process, but the present invention is not limited thereto.

[0071]

[0072] Semiconductor devices and automotive components

[0073] The present invention provides a semiconductor device molded using the epoxy resin composition described above. The semiconductor device may be a transistor, a diode, a microprocessor, a semiconductor memory, a power semiconductor, or the like.

[0074] In addition, the present invention provides a vehicle component molded using the epoxy resin composition described above. For example, the epoxy resin composition described above can be used as a molding material to fix and seal components within the vehicle component. Specifically, a permanent magnet can be inserted into a hollow space formed within a rotor core of a vehicle motor, and the epoxy resin composition of the present invention can be filled between the hollow space and the permanent magnet to fix the permanent magnet within the rotor core.

[0075] A method for molding a semiconductor device or a vehicle part using the epoxy resin composition of the present invention can be appropriately selected and performed according to a conventional method in the relevant technical field, such as transfer molding, compression molding, or injection molding.

[0076]

[0077] Hereinafter, the present invention will be described in more detail through examples. However, the following examples are intended only to aid understanding of the present invention and are not intended to limit the scope of the present invention in any way.

[0078]

[0079] [Example 1-2]

[0080] After mixing each component according to the composition described in Table 1 below, the mixture was melt-mixed at a temperature of 100 to 130°C using a melt kneader, cooled to room temperature, pulverized into a powder state, and then subjected to a sieving process to produce a granular epoxy resin composition of each example.

[0081]

[0082] [Comparative Example 1-3]

[0083] Each granular epoxy resin composition of a comparative example was prepared in the same manner as in the examples, except that the compositions were as described in Table 1 below.

[0084]

[0085]

[0086]

[0087] Epoxy resin 1: Crystalline epoxy resin (4,4-Bis(2,3-epoxypropoxy)-3,3,5,5-tetramethyl(1,1-biphenyl), Cas no. 0085954-11-6, Mw 354 g / mol)

[0088] Epoxy resin 2: Multi-aromatic epoxy resin (Formaldehyde, polymer with 1,1'-biphenyl and phenol, glycidyl ether, Cas no. 1201169-35-8, Mw 8,397 g / mol)

[0089] Epoxy resin 3: Epoxy resin containing a naphthalene skeleton (2,7-Naphthalenediol polymer with 2-(chloromethyl)oxirane, ar-benzyl derivs, Cas no. 1394035-93-8, viscosity (150 ℃) 50 mPa.s)

[0090] Hardener 1: Multi-aromatic phenol resin (Phenol polymer with hydroxybenzaldehyde, Cas no. 0205830-20-2, viscosity (150 ℃) 105 mPa.s)

[0091] Curing agent 2: Polyfunctional phenol resin (Phenol polymer with 4,4-bis(methoxymethyl)1,1-bisphenyl, Cas no. 0106466-55-1, Mw 521 g / mol)

[0092] Filler 1: Silicon dioxide (spherical silica, D50: 12 ㎛)

[0093] Filler 2: Silicon dioxide (spherical silica, D50: 0.6 ㎛)

[0094] Organopolysiloxane 1: Modified siloxane having epoxy groups at both ends and a phenyl group in the side chain (viscosity (25 ℃) 1,280 mPa.s, epoxy equivalent 1,250 g / mol, MOMEMTIVE XF42-D0027 LV cut)

[0095] Organopolysiloxane 2: Modified siloxane having epoxy groups at both ends and a phenyl group in the side chain (viscosity (25°C) 45,000 mPa.s, epoxy equivalent 4,320 g / mol, MOMEMTIVE XF42-D0027-HH)

[0096] Organopolysiloxane 3: Polyether-modified siloxane containing an epoxy group in the side chain (viscosity (25°C) 4,500, mPa.s, epoxy equivalent 4,300 g / mol, SHIN-ETSU KF-1002)

[0097] Organopolysiloxane 4: Modified siloxane having epoxy groups at both ends (viscosity (25°C) 120 mPa.s, epoxy equivalent 2,700 g / mol, SHIN-ETSU X-22-163C)

[0098] Organopolysiloxane 5: Modified siloxane containing a phenyl group in the side chain (viscosity (25 ℃) 3,000, mPa.s, SHIN-ETSU F5W-0-3,000cs)

[0099] Catalyst: 5-Methyl-2-phenylimidazole-4-methanol

[0100] Coupling agent 1: N-Phenyl-3-aminopropyltrimethoxysilane

[0101] Coupling agent 2: (3-Mercaptopropyl)trimethoxysilane

[0102] Ion catcher: Magnesium aluminum hydroxide carbonate hydrate

[0103] Colorant: Carbon Black

[0104] Ester wax

[0105]

[0106] [Physical property evaluation]

[0107] The physical properties of the epoxy resin compositions manufactured in each example and comparative example were measured as follows, and the results are shown in Table 2 below.

[0108]

[0109] spiral flow

[0110] The epoxy resin compositions manufactured according to each example and comparative example were molded using a spiral flow mold in a heat transfer molding machine (pressure 70 kg / cm2, temperature 175°C, curing time 200 seconds), and then the flowability of the product was measured.

[0111]

[0112] gelation time

[0113] A small amount of the epoxy resin composition manufactured according to each example and comparative example was spread widely and evenly on a gel timer, and the gelation time of the composition was measured.

[0114]

[0115] Flexural strength

[0116] Measured according to ASTM D638, D256, D790.

[0117]

[0118] Flexural modulus

[0119] The epoxy resin compositions manufactured according to each example and comparative example were molded using a specimen manufacturing mold (width 125 mm, length 12.5 mm, thickness 6 mm) in a heat transfer molding machine (pressure 70 kg / cm2, temperature 175°C, curing time 120 seconds), and then post-cured in an oven at 175°C for 4 hours, and then measured using a UTM (Universal Testing Machine).

[0120]

[0121] Mold Shrinkage

[0122] The epoxy resin compositions manufactured according to each example and comparative example were molded using a specimen manufacturing mold (width 125 mm, length 12.5 mm, thickness 6 mm) in a heat transfer molding machine (pressure 70 kg / cm2, temperature 175°C, curing time 120 seconds), and then post-cured in an oven at 175°C for 4 hours. The length of the shrunken specimen was measured using a Vernier Caliper.

[0123]

[0124] Swelling

[0125] The epoxy resin compositions manufactured according to each example and comparative example were left on a hot plate at 175°C and 640 (torr) in a vacuum for 5 minutes, and the height at which the sample in the vial (2.0 g) swelled was measured to evaluate the rate of change.

[0126]

[0127] Fluidity when compressed

[0128] The epoxy resin composition (5 g) manufactured according to each example and comparative example was placed on a hot plate at 165°C, and a load of 1,074 g was applied for 5 minutes. Then, the spread area of ​​the epoxy resin composition was checked to evaluate the fluidity upon compression.

[0129]

[0130]

[0131]

[0132] As shown in Table 2 above, the epoxy resin compositions of Examples 1 and 2 containing the organopolysiloxane (organopolysiloxane 1, 2) according to the present invention exhibited excellent physical properties across all measured items. On the other hand, the epoxy resin compositions of Comparative Examples 1 to 3, each of which used an organopolysiloxane (organopolysiloxane 3 to 5) outside the scope of the present invention, exhibited inferior physical properties across all measured items compared to the examples.

[0133] Specifically, the epoxy resin compositions of Comparative Example 1, which included a polyether-modified siloxane (organopolysiloxane 3) containing an epoxy group in a side chain rather than at a terminal, and Comparative Example 2, which included an epoxy-modified siloxane (organopolysiloxane 4) not containing a phenyl group in a side chain, exhibited severe shrinkage and swelling upon molding. In addition, the epoxy resin composition of Comparative Example 3, which included a phenyl-modified siloxane (organopolysiloxane 5) not having an epoxy group at either terminal, exhibited poor fluidity upon compression.

[0134]

[0135] The present invention provides an epoxy resin composition for molding having excellent fluidity, low shrinkage properties, and swelling suppression properties upon compression, and a semiconductor device molded using the same.

Claims

1. Contains epoxy resin, hardener, filler and organopolysiloxane. An epoxy resin composition wherein the above organopolysiloxane has an epoxy group at both terminals and an aryl group having 5 to 8 carbon atoms in a side chain.

2. An epoxy resin composition according to claim 1, wherein the epoxy resin has an epoxy equivalent weight (EEW) of 100 to 500 g / eq and a soft point of 30 to 150°C.

3. An epoxy resin composition according to claim 1, wherein the hydroxyl equivalent of the curing agent is 90 to 300 g / eq and the softening point is 50 to 120°C.

4. In the first paragraph, the organopolysiloxane is an epoxy resin composition represented by the following chemical formula 1: [Chemical Formula 1] In the above formula, EP is an epoxy group, R1 is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, R2 is an aryl group having 5 to 8 carbon atoms, R3 is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, an aryl group having 5 to 8 carbon atoms, or a cycloalkyl group having 5 to 10 carbon atoms, R4 is a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, n is an integer from 1 to 50, m is an integer from 0 to 50.

5. An epoxy resin composition in which the viscosity (25°C) of the organopolysiloxane in the first paragraph is 1,000 to 50,000 mPa.s and the epoxy equivalent is 1,000 to 5,000 g / mol.

6. An epoxy resin composition comprising, based on the total weight of the epoxy resin composition in paragraph 1, 2 to 20 wt% of the epoxy resin, 2 to 20 wt% of the curing agent, 50 to 90 wt% of the filler, and 0.1 to 10 wt% of the organopolysiloxane.

7. A semiconductor device molded using an epoxy resin composition according to any one of claims 1 to 6.

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