Systems and methods for waterproofing an electronics device

Abstract

Devices and methods are provided for a portable electronics device having an improved sealing arrangement. The portable electronics devices can include an internal electronics assembly having a communications module and a battery in electrical communication with the communications module. An internal boot at least partially enclosing the internal electronics assembly can function to seal and prevent water or other external contaminants from contacting the internal electronics assembly. An outer shell having at least two apertures can at least partially enclose the internal boot. The internal boot can be configured to compress between the outer shell and the internal electronics assembly in order to prevent water passing through either of the two apertures from entering the internal boot enclosure. By relying on the internal boot to seal multiple apertures, the portable electronics device can have less design constraints and improved functionality, among other advantages.

Description

SYSTEMS AND METHODS FOR WATERPROOFING AN ELECTRONICS DEVICECROSS-REFERENCE TO RELATED APPLICATIONS

[0001] The present application claims priority to U.S. Patent Application No. 18 / 465,428, filed September 12, 2023, which is incorporated herein by reference in its entirety.BACKGROUND

[0002] Communications devices play a critical role in ensuring effective and efficient communication between individuals conducting various tasks, including emergency responders (e g., firefighters). For example, emergency responders will often utilize communications devices for real-time communication and coordination among team members, enabling them to share vital information, coordinate their actions, and make informed decisions in the field. In many such emergency situations, clear and reliable communication is paramount for the safety and success of many emergency response operations.

[0003] Often times, communication devices will be used to provide a lifeline for emergency responders operating in hazardous environments. For instance, these devices, which are often handheld or attached to the emergency responder’s equipment or clothing, may allow a user to stay connected with an incident command center, providing essential updates on their location, progress, and potential dangers they encounter. This two-way communication between the command center and individual responders ensures that commanders can closely monitor the situation, provide guidance, and deploy necessary resources promptly. Additionally, in the event of distress or injury, personal communications devices allow emergency responders to call for help, enhancing their personal safety.

[0004] Given their specialized usage, emergency responder communications devices often include specialized features designed for their specific needs. For instance, the communication devicesmay include noise-canceling technology to minimize background noise and enhance clarity and may also integrate with other equipment such as thermal imaging cameras or air supply systems. In particular, because of the extreme conditions that emergency responder communication devices are often subjected to, they are typically created to have increased durability to temperature variations and water exposure, ensuring they remain operational in the challenging conditions encountered by first responders. Various jurisdictions have developed specific testing requirements for emergency responders, which often subject the devices to high temperatures, water exposure, or both, and then test their ability to remain functional and provide clear communication. Emergency responder communication devices often rely on heat-resistant materials and specially-designed seals to meet the durability requirements of these tests.SUMMARY

[0005] Systems and methods are provided for electronics devices, such as a communication device, that may utilize an internal boot for sealing and waterproofing. In some aspects, a single internal boot seals internal electronics at multiple potential leakage points (e g., speakers, buttons, charging port). By relying on a single component to seal multiple leakage points, rather than including individual seals for each interaction point, numerous structural and functional improvements can be achieved by the electronics devices. For instance, and among other advantages achieved by utilizing an internal boot, the compression force required to connect the components of the outer shell of the electronics device may be reduced, allowing for different shell connection types to be used. Additionally, in some aspects, the internal boot may maintain a consistent, impermeable form near some potential leakage points (e.g., buttons, microphone locations), which may reduce the total number of actual leakage points that the electronics device has. Yet another advantage of relying on an internal boot instead of numerous seals is that it allowsfor simplified manufacturing, testing, and repair of the electronics devices. Further still, the internal boot may allow for unwanted water to drain away from areas where sound transfer is desired (e.g., on top of a speaker) while still remaining within an electronics device, which can allow for reduced water accumulation at these points and overall improved sound quality from the electronics device.

[0006] In one aspect, the present disclosure provides a portable electronics device. The electronics device may include an internal electronics assembly, an internal boot at least partially enclosing the internal electronics assembly, and an outer shell at least partially enclosing the internal boot, the outer shell having at least two apertures, wherein the internal boot is configured to compress to prevent at least one of water or another contaminant from passing through the at least two apertures and entering the internal boot enclosure.

[0007] In another aspect, the present disclosure provides a portable electronics device. The electronics device may include an internal electronics assembly including a switch configured to receive an input from a user. The electronics device may further include an internal boot at least partially enclosing the internal electronics assembly, the internal boot having a button section with a top surface and a bottom surface, wherein the button section is configured to receive a downward force from a user on the top surface and apply the force with the bottom surface to contact and activate the switch. The electronics device may additionally include an outer shell at least partially enclosing the internal boot, wherein the internal boot is configured to compress to prevent at least one of water or another contaminant from entering the internal boot enclosure.

[0008] In one aspect, the present disclosure provides a portable electronics device. The electronics device may include an internal electronics assembly including a communications module, a battery in electrical communication with the communications module, and a speaker configured to providean audio signal to a user based on a communication signal received by the communications module. The electronics device may further include an internal boot at least partially enclosing the internal electronics assembly, wherein the internal boot has a speaker aperture configured to provide acoustic energy transfer to the speaker. The electronics device may additionally include an outer shell at least partially enclosing the internal boot, and wherein the internal boot is configured to permit water to drain away from the speaker aperture between the internal boot and the outer shell.

[0009] In another aspect, the present disclosure provides a method of assembling a portable electronics device. The method may include assembling an internal electronics assembly, enclosing the internal electronics assembly within an internal boot by inserting the internal electronics assembly into an aperture of the internal boot, and enclosing the internal boot within an outer shell, wherein the internal boot is configured to compress to prevent at least one of water or another contaminant from entering the internal boot enclosure.BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1A is a diagram depicting a perspective view of an electronics device.

[0011] FIG. IB is a diagram depicting a right-side, partially-exploded view of the electronics device of FIG. 1A, depicting an internal electronics assembly, an internal boot, and an outer shell.

[0012] FIG. 1C is a diagram depicting a left-side, partially-exploded view of the electronics device of FIGs. 1A-B, depicting an internal electronics assembly, an internal boot, and an outer shell.

[0013] FIG. 2A is a diagram depicting a front view of the outer shell of the electronics device of FIGs. 1A-1C.

[0014] FIG. 2B is a diagram depicting a right-side view of the outer shell of the electronics device of FIGs. 1A-1C.

[0015] FIG. 2C is a diagram depicting a left-side view of the outer shell of the electronics device ofFIGs. 1A-1C.

[0016] FIG. 2D is a diagram depicting a top, perspective view of the outer shell of the electronics device ofFIGs. 1A-1C.

[0017] FIG. 2E is a diagram depicting a bottom, perspective view of the outer shell of the electronics device ofFIGs. 1A-1C.

[0018] FIG. 2F is a diagram depicting a rear view of the outer shell of the electronics device of FIGs. 1A-1C.

[0019] FIG. 3 is a diagram depicting a partially exploded view of the outer shell of the electronics device ofFIGs. 1A-1C, wherein four threaded fasteners are shown distanced from four respective apertures in the outer shell.

[0020] FIG. 4 is a diagram depicting a sectional view of the internal boot positioned within the outer shell of FIGs. 1A-1C.

[0021] FIG. 5A is a diagram depicting a front view of the internal boot ofFIGs. 1A-1C.

[0022] FIG. 5B is a diagram depicting a rear view of the internal boot ofFIGs. 1 A-1C.

[0023] FIG. 5C is a diagram depicting a front, perspective view of the internal boot ofFIGs. 1A- 1C.

[0024] FIG. 5D is a diagram depicting a right-side, perspective view of the internal boot ofFIGs. 1A-1C.

[0025] FIG. 6A is a diagram depicting a front, perspective view of the internal electronics assembly of FIGs. 1A-1C.

[0026] FIG. 6B is a diagram depicting a rear, perspective view of the internal electronics assembly ofFIGs. 1A-1C.

[0027] FIG. 6C is a diagram depicting an exploded view of the internal electronics assembly ofFIGs. 1A-1C.

[0028] FIG. 7 is a diagram depicting a partial sectional view of a microphone aperture in an electronics device.

[0029] FIG. 8A is a diagram depicting a button arrangement in an electronics device in an uncompressed (i.e., inactivated state).

[0030] FIG. 8B is a diagram depicting a button arrangement in an electronics device in a compressed (i.e., activated state).

[0031] FIG. 9A is a diagram depicting a sectional view of the electronics device of FIGs. 1A-1C, including a speaker subsystem.

[0032] FIG. 9B is a diagram depicting a sectional view of the speaker subsystem of FIG. 9A.

[0033] FIG. 10 is a flowchart depicting a method of manufacturing a portable electronics device.DETAILED DESCRIPTION

[0034] Traditional molded enclosures for electronic devices, such as communication devices, rely on a variety of techniques to seal their enclosures and thereby prevent water and other contaminants (e.g., smoke, dust, dirt, etc.) from contacting internal electronics. While some methods of joining, such as ultrasonic welding, are effective at creating a robust seal, they also prevent a device from being re-opened for factory repair or service (e.g., replacement of a damaged button). Therefore, because it is advantageous to make electronic devices serviceable in many applications, it is common to provide a perimeter gasket between two or more molded enclosure parts (e.g., molded shells), where the gasket is compressed into sealing engagement by threaded fasteners or similar hardware.

[0035] Unfortunately, among other disadvantages, the perimeter gasket design approach requires a relatively large perimeter volume that can limit the area for internal electronics, or otherwiserequire the device size to be increased. Furthermore, many devices have numerous interaction points (e.g., buttons, microphones, speakers, battery access, peripheral connectors, etc.) that can serve as potential penetration points for water or other contaminants to enter the electronics device and cause damage. In a traditional device, each of these interaction points must be sealed if the device is to function properly following water or contaminant exposure. Including all of these seals for the various interaction points can limit design flexibility, add undesired volume, and complicate the process of preventing leaks during manufacturing and use of the electronics device. When specifically designing emergency responder communication devices, such as those described above, these issues are often exacerbated, since such devices are required to withstand substantially more water and contaminant exposure than other electronics devices.

[0036] In order to address these deficiencies, the present disclosure provides, in part, systems and methods that utilize an alternative sealing technique. In some aspects, an internal boot may be positioned between an outer shell and internal electronics to seal multiple interaction points in an electronics device. As discussed above, this approach offers a host of potential advantages over a device that employs individual seals for each potential leakage point. For example, the internal boot may provide a sealing solution with a smaller perimeter volume in order to improve device size and electronics functionality. This sealing arrangement may also enable various structural and functional enhancements for the electronics device. For instance, by relying on a single component for multiple seals, the compression force required from the device's outer shell may be reduced, thereby improving design options. Additionally, the internal boot may allow buttons and microphone locations to be redesigned so that they are no longer potential leakage points, which may reduce the risk of leaks and further simplify design considerations while retaining functionality. Furthermore, the internal boot may facilitate the drainage of unwanted water awayfrom areas where sound transmission is desired, such as on top of a speaker. This feature may help prevent water accumulation at these points, leading to improved sound quality from the device. Further yet, utilizing an internal boot instead of multiple seals may simplify the manufacturing, testing, and repair processes for the electronics device. As will be further discussed, these are only a few of the advantages that the present disclosure provides, and a skilled artisan will readily recognize further benefits to employing the systems and techniques described herein.

[0037] Although the example systems and methods discussed herein primarily relate to handheld emergency responder communications devices, a skilled artisan should readily appreciate that the techniques described herein can be applied to other electronics devices, including but not limited to, communication devices (e.g., cellular phones, two-way radios, pagers), medical devices (e.g., implantable medical devices, surgical devices, insulin pumps), or other personal electronics (e.g., computers, tablets, drones, smartwatches, cameras, speakers, calculators, dive watches) that require sealing to prevent damage from water or other contaminants.

[0038] FIGs. 1A-1C depict a handheld communications device 100. As shown in FIGs. 1B-1C, the handheld electronics device 100 is generally formed of three subsections: an outer shell 200, an internal boot 300, and an internal electronics assembly 400. As will be further described, the internal boot 300 may at least partially enclose the internal electronics assembly 400, which may include a number of electronics components that help provide the functionality of the electronics device 100. The outer shell 200 may at least partially enclose both the internal boot 300 and the internal electronics assembly 400. As shown, the outer shell 200 may have several apertures that serve as interaction points, and the internal boot 300 may be configured to compress at various points to prevent water or other contaminants from passing through the apertures and entering the internal boot 300. For instance, the internal boot 300 may be configured to compress between theouter shell 200 and the internal electronics assembly 400. In this manner, the internal boot 300 may function to seal off the internal electronics assembly 400, preventing unwanted exposure.

[0039] FIGs. 2A-2F depict the outer shell 200 of the electronics device 100 of FIGs. 1A-1C in further detail. As shown, the outer shell 200 may have a top shell 202 and a bottom shell 204. The top shell 202 and bottom shell 204 may interact and connect to define an enclosed space wherein the internal boot 300 and the internal electronics assembly 400 are located. The top shell 202 and the bottom shell 204 may be formed of several walls or surfaces, and may be specifically sized and configured to be easily and securely held by a user. For instance, the outer shell 200 may specifically be sized to be a handheld device, and may have a length, width, and height that are all less than eight inches. The top shell 202 may have a similar size and shape as the bottom shell 204, at least near points at which they interact, which can help these two subcomponents to connect to one another. Although a top shell 202 and a bottom shell 204 are depicted, it should be readily appreciated that other forms (e.g., left shell and right shell, three-component arrangements, etc.) of outer shells may be utilized.

[0040] The top shell 202 and the bottom shell 204 may contain a surface configured to contact each other. The outer shell 200 may be formed of a rigid material, such as a plastic or a composite material. The top shell 202 may be configured to interact with the bottom shell 204 in a manner that the connection point between the two is not waterproof or contaminant proof (i.e., the connection point may permit a liquid to freely pass between the two shells). In other words, the connection between the top shell 202 and the bottom shell 204 may be specifically designed to not be watertight or airtight, and the electronics device 100 may instead rely primarily on the internal boot 300 to prevent water or contaminants from accessing the internal electronics assembly 400.

[0041] The outer shell 200 may include a plurality of interaction points (also referred to herein as “leakage points” or “access points”), including one or more speaker apertures 206 configured to provide audio access to a speaker subsystem (not depicted) of the internal electronics assembly 400. As shown, the speaker apertures 206 may take the form of apertures within the top shell 202. In the depicted example, three sections of the top shell 202 are positioned over the speaker apertures 206 to help prevent damage from occurring to the speaker subsystem positioned within the electronics device 100. The depicted outer shell 200 may also include six microphone apertures, including a top-left microphone aperture 210, a top-center microphone aperture 212, a top-right microphone aperture 214, a bottom -left microphone aperture 216, a bottom-center microphone aperture 218, and a bottom-right microphone aperture 220. Similar to the speaker apertures 206, the microphone apertures 210-218 may function to provide audio access through the outer shell 200.

[0042] The outer shell 200 may also include a number of components which allow a user to physically interact with electronics device 100. For instance, the outer shell 200 may include a number of buttons or button apertures, such as a top-left button aperture 230, top-right button aperture 232, and a primary side button 234, a top-center aperture 236, and a front aperture 238. Although not depicted, each button aperture may include a button cap that may be integrated with the outer shell 200. The button and button apertures 230-238 may allow a user to interact with the electronics device 100 by, for example, powering it on, adjusting device volume, adjusting a communication channel, activating a transmit mode, activating a receive mode, and / or sending an emergency alert signal. The outer shell 200 may also include a number of other interaction points, including a charging port aperture 240, an attachment connector 242, a physical interface port 244 (e g., USB port), and a light aperture 246. In order to provide a mechanism for attaching the topshell 202 to the bottom shell 204, the outer shell may include various attachment means, such as a top-left fastener aperture 250, a top-right fastener aperture 252, a bottom-left fastener aperture 254, and a bottom-right fastener aperture 256.

[0043] FIG. 3 depicts the outer shell 300 of the electronics device 100 of FIGs. 1A-1C with four threaded fasteners 260, 262, 264, 266 shown distanced from the four respective apertures 250, 252, 254, 256 in the outer shell 200. These threaded fasteners may function to connect the top shell 202 to the bottom shell 204 in a secure manner. Although threaded fasteners are depicted, because the electronics device primarily relies on the internal boot 300 for sealing purposes, alternative connection techniques can be used, including ones that provide a less secure attachment. For instance, clamp connectors, hook connectors, or other mechanical connectors may be utilized. The connection means may be positioned on or near the contact points between the top shell 202 and the lower shell 204. Additionally, because the need for uniform pressure around the contact point between the top shell 202 and the bottom shell 204 is less important with this design, the number of threaded fasteners may be reduced. For instance, there may specifically be four or less attachment mechanisms used to connect the top shell 202 to the bottom shell 204.

[0044] FIG. 4 is a diagram depicting a sectional view of the internal boot 300 positioned within the outer shell 200. As shown, the internal boot 300 may function as a barrier that prevents water or other contaminants that have penetrated the outer shell 200 from contacting the internal electronics assembly 400. Similar to the outer shell 200, the internal boot 300 may be formed of several exterior walls that define an enclosed space. As shown, the internal boot 300 may take a geometric form that substantially matches the outer shell 200, which can help to maximize the enclosed space in which the internal electronics assembly 400 is positioned. The internal boot 300 may generally have a six-sided geometry. The volume of the space enclosed by the internal boot300 may specifically be at least 70%, at least 80%, or at least 90% of the volume of the space enclosed by the outer shell 200. The internal boot 300 may be configured to and have a size that allows it to contact the outer shell 200 at various locations, which may help to prevent internal movement or rotation of either the internal boot 300 or the internal electronics assembly 400. In order to maximize the enclosure volume in which the internal electronics assembly 400 may be positioned, the internal boot 300 may have an average wall thickness of less than 1 millimeter, less than 0.8 millimeter, or specifically about 0.5 millimeter.

[0045] FIGs. 5A-5D depict the internal boot 300 of the electronics device 100 of FIGs. 1A-1C in further detail. The internal boot 300 may be configured to compress in order to provide a seal against the outer shell 200, the internal electronics assembly 400, or between both. As shown, the internal boot 300 may include several apertures, at least some of which may be specifically designed to at least partially overlap the apertures in the outer shell 200. Specifically, the internal boot may include a speaker aperture 306, a charging port aperture 340, and a physical interface port 344, which respectively correspond to the speaker apertures 206, charging port aperture 240, and physical interface port 244 of the outer shell 200. The internal boot may also include a battery aperture 348. Accordingly, the internal boot 300 may have substantially fewer leakage points than the outer shell 200. Specifically, the internal boot 300 may have less than six, less than five, less than four, or specifically less than three apertures or water / contaminant access points.

[0046] The internal boot 300 may be formed of a single component body such as walled shell or case with an enclosed internal volume. The internal boot 300 may specifically comprise an elastomer. For instance, the internal boot 300 may comprise, consist essentially of, or consist of silicone. In order to permit light transfer, the internal boot may be at least partially translucent. As far as durability, which may be particularly useful for emergency responder applications, theinternal boot 300 may be formed of a material that has heat-resistant properties, and may specifically be configured to substantially maintain its intended geometry up to at least 350 degrees Fahrenheit.

[0047] As will be further described, the internal boot 300 may provide a uniform wall (i.e., a wall without an aperture) near some of the interaction points, and instead rely on the transfer of sound, light, or physical force through the internal boot 300 itself to provide the intended interaction. For instance, as shown in FIGs. 5A-5D, the internal boot 300 may have continuous, impermeable surfaces near several of the openings in the outer shell 200, including the microphone apertures, the button apertures, and the light apertures. Such continuous surface sections may be particularly suitable for the transfer of light, sound, or physical force in a consistent manner.

[0048] The internal boot 300 may have a specific geometry that allows for the top shell 202 to connect to the bottom shell 204. For instance, the internal boot 300 may have a several recesses 350, 352, 354, 356 in which fastener apertures 250, 252, 254, 256 are respectively positioned. In this manner, the internal boot 300 may avoid having any apertures within its uniform body for providing the attachment of the top shell 202 to the bottom shell 204.

[0049] FIGs. 6A-6C depict the internal electronics assembly 400 of the electronics device 100 of FIGs. 1A-1C in further detail. As shown in this example electronics device 100, the internal electronics assembly 400 may be at least partially surrounded or enclosed by the internal boot 300. For instance, the internal boot 300 may at least partially surround three geometric sides, four geometric sides, five geometric sides, or specifically all six geometric sides of the internal electronics assembly 400. The internal electronics assembly 400 may be specifically configured to fit within the enclosure created by the internal boot 300. Furthermore, the internal electronicsassembly 400 may be configured to be inserted into an aperture of the internal boot 300, such as the battery aperture 348, which can allow for simplified assembly.

[0050] The internal electronics assembly 400 may include at least one printed circuit board (PCB) 402, or comparable circuitry. The PCB 402 may include various components that allow for the functionality of the electronics device 100. Among other components the PCB 402 may connect to a speaker 404, various sensors (e.g., microphones), a battery 406, as well as button components (e.g., push button switches). For instance, the internal electronics assembly 400 may include a topleft button 430, top-right button 432, primary side button 434, a top-center button 436, and a front button 438, which may respectively correspond to the top-left button aperture 230, top-right button aperture 232, a primary side button 234, top-center aperture 236, and front aperture 238 of the outer shell 200. Similarly, a charging connector 440 and a physical interface hub 444 may each be positioned directly adjacent to the charging port aperture 240 and the physical interface port 244 of the outer shell 200. The internal electronics assembly 400 may have various structural features configured to keep these components properly positioned relative to each other. For instance, as shown, the internal electronics assembly 400 may include a structural case 408 which may be held together using several threaded fasteners 410. It should be readily appreciated that the internal electronics assembly 400 can include alternate components configured to provide different functionality depending on the intended application of the electronics device 100.

[0051] The internal electronics assembly 400 may further include a communications module 412, which may be in electrical communication with the battery 406 as well as other components of the internal electronics assembly 400, such as the PCB 402. The communications module 412 may be configured to transmit and / or receive wireless communication signals, or to provide communication signals through a direct communication line if the electronics device 100 ispresently attached to one. The communications module 412 may specifically include atransmitter configured to wirelessly transmit a communication signal to at least one second electronics device and a receiver configured to receive a communication signal from the second electronics device. The communications module 412 may be configured to specifically transmit and receive radio frequency signals, although alternative forms of communication are possible.

[0052] FIG. 7 depicts a partial sectional view of a microphone aperture 722 in an electronics device. As shown, the microphone aperture 722 may be positioned in an outer shell 720 of the electronics device. An internal boot 730 may be positioned between the outer shell 720 and an internal microphone sensor 740. In order to facilitate the transfer of sound through the internal boot 730, the internal boot 730 may include a microphone recess 732, which produces a thinner internal boot wall and therefore a smaller distance that the sound waves must travel through the internal boot 730. As shown, the recess 732 may be directly adjacent to the microphone aperture 722, and may entirely cover the internal space directly inward from the microphone aperture 722. This arrangement can allow the internal boot 730 to retain a uniform, water-proof layer near the microphone aperture 722, while still providing sufficient transfer of sound waves through the microphone aperture 722 to the microphone sensor 740. The internal boot 730 may specifically have a thickness of less than 0.8 millimeter, less than 0.5 millimeter, or specifically about 0.3 millimeter at the microphone recess 732.

[0053] Similar to the microphone recess, the internal boot described in the systems and methods herein may contain other recesses or features configured to control sound or light transfer through the internal boot. For instance, the internal electronics assembly may include a light-emitting component (e.g., a light-emitting diode) instead of the microphone sensor 740, which may be configured to, for example, provide information to a user of the device. Alternatively oradditionally, the internal electronics assembly may include a light-receiving component (e.g., a light sensor), which may allow the device to make adjustments to device settings (e.g., modifying a screen brightness level). The outer shell may include an adjacent light aperture similar to the microphone recess 732. Interposed between the outer shell and the internal electronics assembly may be a section of the internal boot that includes a light recess.

[0054] The light recess may be positioned at least partially between the light-emitting or lightreceiving component and the light aperture and may be configured to either transmit a visible amount of the light emitted from the light-emitting component or to transmit environmental light to the light-receiving component. The light recess may have a form that allows for a controlled emission of light compared to a flat surface with no recess. For instance, the light recess may have at least one sidewall that is substantially orthogonal to the surface of the internal boot adjacent to the light recess. The at least one sidewall may help to prevent light bleed, thereby providing controlled light transfer through the internal boot. The internal boot may specifically have a thickness of less than 0.8 millimeter, less than 0.5 millimeter, or specifically about 0.3 millimeter at the light recess.

[0055] Instead of a light recess, the internal boot may include a light tab (i.e., a thicker region) that is at least partially between the light-emitting or light-receiving component and the light aperture and may be configured to either transmit a visible amount of the light emitted from the lightemitting component or to transmit environmental light to the light-receiving component. The light tab may allow for greater diffusion of light, particularly when emitted from a light-emitting component. The light tab may be sized and shaped to extend through an aperture of the outer shell, thereby simplifying light transmission to or from the device. For instance, the light tab may take the shape of a protruding safety triangle, and may extend at least partially through a triangular-shaped aperture of the outer shell. Relatedly, in order to control the transmission of light through the internal boot, the light tab may have at least one sidewall that is substantially orthogonal to the surface of the internal boot adjacent to the light recess. The light tab may therefore allow for greater control of the light transmission through the internal boot.

[0056] FIG. 8A depicts a button arrangement 800 in an electronics device in an uncompressed (i.e., inactivated state). The button arrangement 800 may be configured to receive an input from a user. As shown, an external button cover 820 (also referred to as a “button cap”), which may be attached to and part of an outer shell, may be positioned adjacent to a button sensor 840 (i.e., switch), with an internal boot 830 interposed therebetween. The button sensor 840 may be a momentary operation switch, a pushbutton switch, dome switch, or a comparable component. The button cover 820 may take a variety of forms, such as a hinged surface, provided that it is configured to move in the direction of the button sensor 840 when subjected to a driving force (e.g., a finger pushing down on it).

[0057] FIG. 8B depicts the button arrangement 800 in an electronics device in a compressed (i.e., activated state). Compared to FIG. 8A, the button cover 820 (i.e., button cap) has moved in an inward direction, forcing the adjacent section of the internal boot 830 to bend and also move in an inward direction toward the button sensor 840. The internal boot 830 is shown contacting the button sensor 840, which may activate the button sensor, thereby allowing a user to interact with the electronics device through the button arrangement 800. Accordingly, the internal boot 830 may have a button section with a top surface and a bottom surface, and this button section may be configured to receive a downward force from a user on the top surface and apply the force with the bottom surface to contact and activate an internal button switch or sensor 840. In order toprevent water or contaminant penetration into the internal electronics area, the button section of the internal boot 830 may be a solid surface without apertures, as shown.

[0058] The button cover 820 and / or the internal boot 830 may have a form that allows for the contact with the button sensor 840 to easily occur. For instance, the internal boot 830 may have a protrusion or an increased thickness in the section between the button cover 820 and the button sensor 840. For instance, rather than having a flat surface as shown, a projection may extend from the bottom or top surface of the internal boot 830. After activation of the button sensor 840, the internal boot 830 and the button cover 820 may be configured to return to their original, uncompressed positions. The internal boot 830 may help facilitate this return movement through a material elasticity (i.e., the internal boot 830 may naturally exist in the uncompressed state and have a material memory configured to return to this state). The button cover 820 may return to this initial state by interacting with the internal boot 830, or may use alternative mechanical techniques, such as by utilizing a spring or comparable component. The button sensor 840 itself may specifically not include a mechanical spring.

[0059] It should be readily appreciated that the electronic devices described herein may include numerous different button arrangements. For instance, electronic devices may include numerous button switches in their internal electronics assemblies, each of which is configured to receive an input from a user. For each button switch there may be a corresponding button section of the internal boot, with each button section having a top surface and a bottom surface that are configured to receive a downward force from a user on the top surface and to apply a force to contact and activate an adjacent switch. These various button sections of the internal boot may be positioned on different geometric surfaces and / or they may positioned adjacent to and on the same geometric surface of the internal boot.

[0060] FIG. 9A depicts a sectional view of the electronics device 100 of FIGs. 1 A-1C, including the speaker subsystem 438 associated with the internal electronics assembly (not depicted) and the internal boot 300. The speaker subsystem 438 may be configured to provide controlled sound to a user based on, for example, a communication signal received by the communications module or a device command. FIG. 9B depicts a sectional view of the speaker subsystem 438, which may include a speaker diaphragm section 439 having a top surface 441 and a side surface 443. Relatedly, the internal boot 300 may include a gasket 372 configured to provide a seal between a side surface 443 and the internal boot 300.

[0061] Since the electronics device 100 may be designed to permit water penetration through the outer shell 200, the top surface 441 of the speaker diaphragm section 439 may define a maximum height at which water may accumulate on the speaker subsystem 438. The internal boot and outer shell may be configured to provide a gap for water to drain away from the speaker aperture once it surpasses the top surface 441. In other words, the internal boot 300 may be configured to permit water to drain away from the speaker subassembly 438, while remaining within the outer shell 200. The internal boot 300 may specifically include one or more channels or structural features on its exterior surface to help drain water away from the speaker subsystem 438. The height between the lowest point where water may collect on the speaker diaphragm 439 and its top surface 441 may be less than 10 millimeters, less than 8 millimeters, or specifically less than 5 millimeters. Advantageously, this may allow less water to accumulate on the speaker subsystem 438 than if the water was forced to reach the height of the outer shell before draining away.

[0062] Pressure differences between the internal electronics enclosure (i.e., the sealed portion) of electronics devices and the surrounding environment can cause various issues, including reduced quality of sound from device speakers. In order to address this issue, in some aspects, the internalboot of the systems and methods described herein may include an intentional expansion section. The expansion section may allow the enclosure volume of the internal boot to change in order to reduce the pressure differential relative to the surrounding environment of the device. In other words, the expansion section may allow the enclosure volume of the boot to passively expand or contract. The expansion section may include various forms; for example, the expansion section may have a wall thickness thinner than the surrounding wall thickness of the internal boot, and may be configured to grow or shrink the enclosure volume of the internal boot in order to reduce pressure changes within the internal boot. Alternatively, the expansion section may have a dome, bellows, or corrugated structure form.

[0063] The electronic devices described herein may be specifically configured to pass various temperature, pressure, and mechanical tests. As discussed above, emergency responder communication devices in particular are often subjected to high temperatures and extensive water exposure. Accordingly, the electronics devices described herein may be constructed using particular materials and design techniques to remain functional in extreme conditions. The electronics devices may be configured satisfy the heat and immersion requirements outlined in the U.S. National Fire Protection Association (NFPA) 1802, Section 8.3 and / or the water drainage requirements outlined in NFPA 1802 (2021 Edition), Section 8.13.

[0064] FIG. 10 depicts a method 1000 of manufacturing a portable electronics device, such as the electronics devices described herein. At 1002, an internal electronics assembly may be assembled, the internal electronics assembly may include a communications module and a battery in electrical communication with the communications module.

[0065] At 1004, the internal electronics assembly may be enclosed within an internal boot by inserting the internal electronics assembly into an aperture of the internal boot. The internal bootmay comprise a deformable material, and inserting the internal electronics assembly may include stretching a section of the internal boot over the internal electronics assembly. Accordingly, in order to allow for this manufacturability, the internal boot may include at least one aperture or section through which the internal electronics assembly may be inserted (e.g., a battery access aperture).

[0066] At 1006, the internal boot may be enclosed within and outer shell. The internal boot may be configured to compress between the outer shell and the internal electronics assembly to prevent water or other contaminants from entering the internal boot enclosure. The outer shell may include a top shell and a bottom shell, and enclosing the internal boot within the outer shell may include connecting the top shell and the bottom shell using a plurality of threaded fasteners.

[0067] The method 1000 may include additional steps related to testing the electronics device. For instance, the internal electronics assembly may include one or more switches configured to receive an input from a user, and the method 1000 may further include testing the one or more switches to ensure that they are operational prior to enclosing the internal electronics assembly within the internal boot. Advantageously, if switches or other components within the electronics assembly discovered to be not functioning properly during testing, any such problems can be addressed prior to enclosing the device in the internal boot and the outer shell. In devices that rely on, for example, overmolding or alternative direct sealing techniques, the internal electronics assembly may not be easily removed or tested in this manner, thereby limiting a manufacturer’s ability to properly test functionality early in the assembly process.

[0068] Accordingly, in one aspect, the present disclosure provides a portable electronics device that may include an internal electronics assembly, an internal boot at least partially enclosing the internal electronics assembly, and an outer shell at least partially enclosing the internal boot. Theouter shell may have at least two apertures, and the internal boot may be configured to compress to prevent at least one of water or another contaminant from passing through the at least two apertures from entering the internal boot enclosure. The internal boot may include no more than four apertures. The internal boot may be configured to substantially maintain its intended geometry up to at least 350 degrees Fahrenheit.

[0069] In this aspect, the electronics device of may further include a light-emitting component as a component of the internal electronics assembly, and a light aperture in the outer shell. The electronics device may further include a light recess within the internal boot, the light recess being positioned at least partially between the light-emitting component and the light aperture. The light recess may be configured to transmit a visible amount of the light emitted from the light-emitting component. The internal boot may have a thickness of 0.5 millimeter or less at the light recess. The electronics device may further comprise a light tab protruding from the internal boot and being positioned at least partially within the light aperture, wherein the light tab may be configured to transmit a visible amount of the light emitted from the light-emitting component. The light tab may have at least one sidewall that is substantially orthogonal to a surface of the internal boot adjacent to the light recess. The internal boot may have a thickness of 1 millimeter or more at the light tab. Furthermore, the electronics device may also include a light-receiving component as a component of the internal electronics assembly, a light aperture in the outer shell; and a light recess within the internal boot. The light recess may be positioned at least partially between the lightreceiving component and the light aperture, wherein the light recess may be configured to transmit a visible amount of the light to the light-receiving component.

[0070] Additionally, the internal boot of the electronics device may have an expansion section, and the expansion section may have a wall thickness that is thinner than the surrounding wallthickness of the internal boot. The expansion section may be configured to grow or shrink the enclosure volume of the internal boot in order to reduce pressure changes within the internal boot. The outer shell of the electronics device may include a top shell and a bottom shell. The top shell and the bottom shell may be connected by a clip connection. Alternatively or additionally, the top shell and the bottom shell may be connected by a connection type selected from the group consisting of threaded fasteners, snap fits, interference fits, heat stakes, weld joints, rivets, and adhesive bonds. The connection point between the top shell and the bottom shell may not be waterproof. The electronics device may be configured to satisfy the heat and immersion requirements outlined in the U.S. National Fire Protection Association (NFPA) 1802, section 8.3.

[0071] In another aspect, the present disclosure provides a portable electronics device that may include an internal electronics assembly including a switch configured to receive an input from a user, an internal boot at least partially enclosing the internal electronics assembly, the internal boot may have a button section with a top surface and a bottom surface, wherein the button section may be configured to receive a downward force from a user on the top surface and apply the force with the bottom surface to contact and activate the switch, and an outer shell at least partially enclosing the internal boot, wherein the internal boot may be configured to compress to prevent at least one of water or another contaminant from entering the internal boot enclosure. The button section of the internal boot may be a solid surface without apertures. The button section of the internal boot may include a projection extending from the internal boot, wherein the top surface of the button section may be positioned on the projection.

[0072] In this aspect, the electronics device may further have a second switch included in the internal electronics assembly, the second switch configured to receive an input from a user, and a second button section with a top surface and a bottom surface, wherein the second button sectionmay be configured to receive a downward force from a user on the top surface and to apply a force with the bottom surface to contact and activate the second switch. The second button section may be positioned on a different geometric surface of the internal boot than the first button section. The second button section may be positioned adjacent to and on the same geometric surface of the internal boot as the first button section. The outer shell may include a button cap positioned above the second surface of the button section of the internal boot, wherein at least a portion of the button cap may be configured to receive the downward force from the user and to transfer this downward force to the second surface of the button section. The switch may be a momentary operation switch. Alternatively, the switch may be a pushbutton switch. Alternatively, the switch may be a dome switch. The switch may specifically not include a mechanical spring. The button section of the internal boot may comprise silicone. The internal boot may be formed of a single component body. The internal boot may comprise an elastomer. The internal boot may at least partially surround each geometric side of the internal electronics assembly. The internal electronics assembly may further include a communications module, and a battery in electrical communication with the communications module. The communications module may include a transmitter configured to wirelessly transmit a communication signal to a second device, and a receiver configured to receive a communication signal from the second device. The transmitter may be configured to transmit radio frequency signals and the receiver may be configured to receive radio frequency signals.

[0073] In another aspect, the present disclosure provides a portable electronics device which may include an internal electronics assembly having a communications module, a battery in electrical communication with the communications module, and a speaker configured to provide an audio signal to a user based on a communication signal received by the communications module. The electronics device may also include an internal boot at least partially enclosing the internalelectronics assembly, wherein the internal boot may have a speaker aperture configured to provide acoustic energy transfer to the speaker, and an outer shell at least partially enclosing the internal boot, and wherein the internal boot may be configured to permit water to drain away from the speaker aperture between the internal boot and the outer shell.

[0074] In this aspect, the internal boot and outer shell may be configured to provide a gap for water to drain away from the speaker aperture. The internal boot may include a channel on an exterior surface, the channel may be configured to drain water away from the speaker gap. The speaker may include a speaker diaphragm having a top surface and a side surface, and wherein the internal boot may include a gasket configured to contact the side surface of the speaker diaphragm to provide a seal between the speaker and the internal boot. The gasket and the outer shell may be configured to provide a gap for water to drain away from the speaker aperture. The height between the lowest point on the exterior of the diaphragm and the top surface of the diaphragm may be less than 10 millimeters. The outer shell may include a speaker aperture configured to provide acoustic energy transfer to the speaker. The internal boot may be configured to compress between the outer shell and the speaker to prevent water from entering the internal boot enclosure. The internal boot may be formed of a single component body. The internal boot may comprise an elastomer. The internal boot may comprise silicone. The internal electronics assembly may further include a communications module, and a battery in electrical communication with the communications module. The communications module may include a transmitter configured to wirelessly transmit a communication signal to a second device, and a receiver configured to receive a communication signal from the second device. The transmitter may be configured to transmit radio frequency signals and the receiver may be configured to receive radio frequency signals.

[0075] While the disclosure has been described in detail and with reference to specific embodiments thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit of the embodiments. Thus, it is intended that the present disclosure cover the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.

Claims

It is claimed:

1. A portable electronics device comprising: an internal electronics assembly; an internal boot at least partially enclosing the internal electronics assembly; and an outer shell at least partially enclosing the internal boot, the outer shell having at least two apertures, wherein the internal boot is configured to compress to prevent at least one of water or another contaminant from passing through the at least two apertures and entering the internal boot enclosure.

2. The electronics device of claim 1, wherein the internal boot at least partially surrounds each geometric side of the internal electronics assembly.

3. The electronics device of claim 1, wherein the internal boot includes at least two apertures, the two apertures of the internal boot at least partially overlapping the two apertures of the outer shell.

4. The electronics device of claim 1, wherein internal boot is configured to compress between the outer shell and the internal electronics assembly.

5. The electronics device of claim 1, wherein the internal boot includes no more than six apertures.

6. The electronics device of claim 1, wherein the internal boot is formed of a single component body.

7. The electronics device of claim 1, wherein the internal boot comprises an elastomer.

8. The electronics device of claim 1, wherein the internal boot comprises silicone.

9. The electronics device of claim 1, wherein the at least two apertures in the outer shell include a speaker aperture configured to provide acoustic energy transfer to a speaker of the internal electronics assembly and a charging port aperture configured to provide access to a charging port of the internal electronics assembly.

10. The electronics device of claim 1, further comprising: a microphone as a component of the internal electronics assembly; a microphone aperture in the outer shell, the microphone aperture configured to provide acoustic energy transfer to the microphone; and a microphone recess within the internal boot, the microphone recess being positioned at least partially between the microphone and the microphone aperture.

11. The electronics device of claim 10, wherein the internal boot has a thickness of0.5 millimeter or less at the microphone recess.

12. The electronics device of claim 1, further comprising: a light-emitting component as a component of the internal electronics assembly; and a light aperture in the outer shell.

13. The electronics device of claim 12, further comprising: a light recess within the internal boot, the light recess being positioned at least partially between the light-emitting component and the light aperture, wherein the light recess is configured to transmit a visible amount of the light emitted from the light-emitting component.

14. The electronics device of claim 13, wherein the light recess has at least one sidewall that is substantially orthogonal to a surface of the internal boot adjacent to the light recess.

15. The electronics device of claim 1, wherein the internal electronics assembly includes: a communications module; and a battery in electrical communication with the communications module.

16. The electronics device of claim 15, wherein the communications module includes: a transmitter configured to wirelessly transmit a communication signal to a second device; and a receiver configured to receive a communication signal from the second device, wherein the transmitter is configured to transmit radio frequency signals and the receiver is configured to receive radio frequency signals.

17. A method of manufacturing a portable electronics device, the method comprising: assembling an internal electronics assembly; enclosing the internal electronics assembly within an internal boot by inserting the internal electronics assembly into an aperture of the internal boot; and enclosing the internal boot within an outer shell, wherein the internal boot is configured to compress to prevent at least one of water or another contaminant from entering the internal boot enclosure.

18. The method of claim 17, wherein the internal boot comprises a deformable material, and wherein inserting the internal electronics assembly includes stretching a section of the internal boot over the internal electronics assembly.

19. The method of claim 17, wherein the outer shell includes a top shell and a bottom shell and enclosing the internal boot within the outer shell includes connecting the top shell and the bottom shell.

20. The method of claim 17, wherein the internal electronics assembly includes a switch configured to receive an input from a user, and wherein the method further comprises: testing the switch to ensure that it is operational prior to enclosing the internal electronics assembly within the internal boot.

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