Packaging structure, imaging module, and camera

Abstract

The present application relates to the technical field of cameras, and specifically relates to a packaging structure, an imaging module, and a camera. The packaging structure comprises a circuit board, a photosensitive chip, and a heat dissipation member. The photosensitive chip is disposed on the circuit board and is electrically connected to the circuit board via connecting wires, and the photosensitive chip comprises a photosensitive surface and a heat dissipation surface which are disposed opposite to one another, wherein at least part of the heat dissipation member is attached to the heat dissipation surface. In the packaging structure, the imaging module, and the camera provided in the embodiments of the present application, the provision of the heat dissipation member attached to the heat dissipation surface of the photosensitive chip improves the heat dissipation efficiency of the photosensitive chip and ameliorates the heat dissipation problem of the photosensitive chip.

Description

Packaging structure, imaging module and camera Technical Field

[0001] The present application relates to the field of camera technology, and in particular to a packaging structure, an imaging module and a camera. Background Art

[0002] The camera mainly includes an ISP (Image Signal Processor), a sensor, and a lens. Among them, the sensor is usually packaged in a COB (Chips on Board), that is, the sensor is directly soldered to a PCB (Printed Circuit Board). However, in the prior art, PCB boards are usually made of FR4 material (glass fiber reinforced epoxy resin laminate), which has a low thermal conductivity. The sensor generates a large amount of heat when working, which will cause heat accumulation in the sensor and increase the temperature. When the temperature of the sensor rises, it will cause the sensor to overheat and trigger the over-temperature protection mechanism, affecting the normal operation of the camera; it will also cause local high-temperature spots in the camera, affecting the user experience.

[0003] Summary of the Invention

[0004] The embodiments of the present application provide a packaging structure, an imaging module, and a camera, which can at least improve the heat dissipation problem of the photosensitive chip.

[0005] In a first aspect, embodiments of the present application provide a packaging structure comprising a circuit board, a photosensitive chip, and a heat sink. The photosensitive chip is disposed on the circuit board and electrically connected to the circuit board via a connecting wire. The photosensitive chip includes a photosensitive surface and a heat sink disposed oppositely. The heat sink is at least partially in contact with the heat sink.

[0006] In some embodiments, the heat sink is attached to a surface of the circuit board, and the photosensitive chip is attached to a side of the heat sink facing away from the circuit board.

[0007] In some embodiments, the heat dissipation element is provided with a connection hole, and the connection hole is used for the connection line to pass through.

[0008] In some embodiments, the circuit board is provided with a through hole, the heat sink is attached to a surface of the circuit board and covers at least a portion of the through hole, and the photosensitive chip is attached to the side of the heat sink facing the circuit board in the through hole.

[0009] In some embodiments, the circuit board is provided with a through hole, and the heat sink includes a sheet portion and a raised portion, the sheet portion is adhered to a surface of the circuit board and covers at least a portion of the through hole, and the raised portion is connected to the sheet portion in the through hole; the photosensitive chip is at least partially adhered to the side of the raised portion facing away from the sheet portion.

[0010] In some embodiments, when viewed along a depth direction of the through hole, the protrusion matches the through hole.

[0011] In some embodiments, when viewed along the depth direction of the through hole, the through hole matches the photosensitive chip.

[0012] In some embodiments, along the extension direction of the through hole, the height of the protrusion is equal to the depth of the through hole.

[0013] In some embodiments, a portion of the photosensitive chip is in contact with the raised portion, and another portion is in contact with a side of the circuit board that is away from the sheet portion.

[0014] In some embodiments, the heat dissipation element includes a sheet portion and an extension portion, the sheet portion is attached to one surface of the circuit board, and the extension portion extends to the other surface of the circuit board.

[0015] In some embodiments, the circuit board includes a first surface and a second surface opposite to each other, the sheet portion is attached to one of the first surface and the second surface, and the extension portion extends to the other of the first surface and the second surface.

[0016] In some embodiments, the heat dissipation element includes a first layer and a second layer, the first layer is adhered to a surface of the circuit board, and the second layer is adhered to the side of the first layer facing away from the circuit board; the first layer is used to conduct heat from the photosensitive chip; the second layer is used to conduct heat in the first layer.

[0017] In some embodiments, the heat dissipation element includes an extension portion, which is formed by extending from the second layer and extending to another surface of the circuit board, and the bending performance of the second layer is better than that of the first layer.

[0018] In some embodiments, the circuit board is provided with a through hole, the photosensitive chip is disposed in the through hole, and the heat sink is adhered to the heat dissipation surface.

[0019] In some embodiments, the heat dissipation surface is provided with thermal conductive adhesive.

[0020] In a second aspect, embodiments of the present application further provide an imaging module comprising a lens mount, a lens, and a packaging structure as described in any one of the preceding items. The lens mount has a light-transmitting hole extending through both ends; the lens cover is disposed at one end of the lens mount, and the lens is configured to transmit light into the light-transmitting hole; the packaging structure is disposed at the other end of the lens mount and enables the photosensitive chip to receive light transmitted by the lens.

[0021] In some embodiments, the imaging module further includes a filter, which is at least partially disposed between the lens and the photosensitive chip.

[0022] In some embodiments, the filter cover is disposed on the packaging structure, and a sealed cavity is formed between the filter and the packaging structure, and the photosensitive chip is located in the sealed cavity.

[0023] In a third aspect, an embodiment of the present application further provides a camera, which includes the packaging structure or imaging module as described in any one of the above items.

[0024] Different from the related art, the packaging structure, imaging module and camera provided in the embodiments of the present application can accelerate the heat dissipation efficiency of the photosensitive chip and improve the heat dissipation problem of the photosensitive chip by providing a heat dissipation member that fits the heat dissipation surface of the photosensitive chip.

[0025] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0027] FIG1 is a front view of a packaging structure in the prior art;

[0028] FIG2 is a front view of a packaging structure provided in Example 1 of the present application;

[0029] FIG3 is a top view of a packaging structure provided in Example 1 of the present application;

[0030] FIG4 is a cross-sectional view of a packaging structure provided in Example 2 of the present application;

[0031] FIG5 is a top view of a packaging structure provided in Example 2 of the present application;

[0032] FIG6 is a top view of another packaging structure provided in Example 2 of the present application;

[0033] FIG7 is a cross-sectional view of a packaging structure provided in Example 3 of the present application;

[0034] FIG8 is a top view of a packaging structure provided in Example 3 of the present application;

[0035] FIG9 is a top view of another packaging structure provided in Example 3 of the present application;

[0036] FIG10 is a front view of a packaging structure provided in Example 4 of the present application;

[0037] FIG11 is a front view of another packaging structure provided in Example 4 of the present application;

[0038] FIG12 is a cross-sectional view of a packaging structure provided in Example 4 of the present application;

[0039] FIG13 is a front view of a packaging structure provided in Example 5 of the present application;

[0040] FIG14 is a front view of another packaging structure provided in Example 5 of the present application;

[0041] FIG15 is a cross-sectional view of a packaging structure provided in Example 6 of the present application;

[0042] FIG16 is a top view of a packaging structure provided in Example 6 of the present application;

[0043] FIG17 is a front view of a packaging structure provided in Example 7 of the present application;

[0044] FIG18 is a schematic structural diagram of an imaging module provided in an embodiment of the present application;

[0045] FIG19 is a partially cutaway perspective view of an imaging module provided in an embodiment of the present application;

[0046] FIG20 is a partially cutaway perspective view of another imaging module provided in an embodiment of the present application;

[0047] FIG21 is a schematic structural diagram of a camera provided in an embodiment of the present application.

[0048] The figure numbers in the specific implementation manner are as follows: 100, packaging structure; 1, circuit board; 11, through hole; 2, photosensitive chip; 21, photosensitive surface; 22, heat dissipation surface; 3, connecting line; 4, heat dissipation component; 41, connecting hole; 42, sheet layer; 43, raised portion; 44, extension portion; 45, first layer; 46, second layer; 5, thermal conductive adhesive; 200, imaging module; 201, lens holder; 2011, light-transmitting hole; 202, lens; 203, filter; 204, sealed cavity; 300, camera. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. The description of at least one exemplary embodiment below is actually only illustrative and is in no way intended to limit the present application, its application, or use.

[0050] In the description of this application, it should be noted that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0051] In the description of this application, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0052] An embodiment of the present application provides a packaging structure 100, which is used for a shooting device, such as a camera. As shown in Figure 1, the packaging structure 100 includes a circuit board 1 and a photosensitive chip 2. The photosensitive chip 2 is arranged on the circuit board 1 and is electrically connected to the circuit board 1 through a connecting line 3. The photosensitive chip 2 includes a photosensitive surface 21. A CMOS (Complementary Metal-Oxide Semiconductor) or a CCD (Charge Coupled Device) is provided on the photosensitive surface 21 to convert the optical signal into an electrical signal, which is then processed by the camera's processor to form an image.

[0053] Among them, the shape of the circuit board 1 and the shape of the photosensitive chip 2 are not limited, as long as the photosensitive chip 2 can be set on the circuit board 1 and the photosensitive surface 21 is not blocked; the way the photosensitive chip 2 and the circuit board 1 are connected through the connecting wire 3 is not limited, as long as the circuit board 1 and the photosensitive chip 2 can be connected.

[0054] It should be noted that in the prior art, as shown in FIG1 , the photosensitive chip 2 is typically directly attached to the circuit board 1 , which is typically made of FR4 material, which has a low thermal conductivity and is not conducive to heat dissipation of the photosensitive chip 2 . To improve this problem, as shown in FIG2 , FIG4 , FIG7 and FIG15 , the package structure 100 of the embodiment of the present application is further provided with a heat sink 4 , which is bonded to a portion of the surface of the photosensitive chip 2 to transfer heat to the heat sink 4 , thereby accelerating the heat dissipation efficiency of the photosensitive chip 2 and improving the heat dissipation problem of the photosensitive chip 2 . It is understood that the thermal conductivity of the heat sink 4 is greater than that of the circuit board 1 .

[0055] For ease of description, the present embodiment is described using the circuit board 1, photosensitive chip 2, and heat sink 4 as rectangular thin sheets. The surface facing the same direction as the photosensitive surface 21 is defined as the front surface, the surface facing away from the photosensitive surface 21 is defined as the back surface, and the remaining surfaces are defined as side surfaces. In practice, the circuit board 1, photosensitive chip 2, and heat sink 4 may also have other shapes, such as blocks or strips.

[0056] It can be understood that the back side of the photosensitive chip 2 has a larger heat-conducting area than the side side, and therefore has a better heat dissipation effect. Therefore, in the embodiment of the present application, the back side of the photosensitive chip 2 is defined as the heat dissipation surface 22, that is, the photosensitive chip 2 includes a photosensitive surface 21 and a heat dissipation surface 22 arranged relatively to each other. The heat dissipation surface 22 is fitted with the heat sink 4 as an example for explanation, that is, the heat sink 4 is at least partially fitted with the heat dissipation surface 22 to further enhance the heat dissipation effect of the photosensitive chip 2.

[0057] In the following embodiments of the present application, the specific structures of the circuit board 1 and the heat sink 4, as well as the specific matching relationship between the circuit board 1, the photosensitive chip 2 and the heat sink 4 are mainly described.

[0058] In Example 1, as shown in FIG2 , a heat sink 4 is attached to one surface of a circuit board 1, and a photosensitive chip 2 is attached to the side of the heat sink 4 facing away from the circuit board 1. For example, the heat sink 4 is attached to the front surface of the circuit board 1, and the photosensitive chip 2 is attached to the front surface of the heat sink 4, so that the heat sink 4 can quickly transfer the heat of the photosensitive chip 2, thereby improving the heat dissipation problem of the photosensitive chip 2.

[0059] In this embodiment, since the heat sink 4 separates the photosensitive chip 2 from the circuit board 1, it hinders the electrical connection between the photosensitive chip 2 and the circuit board 1 via the connecting wires 3. To improve this problem, as shown in Figure 3, the heat sink 4 can be provided with connecting holes 41 for the connecting wires 3 to pass through. This eliminates the need for the connecting wires 3 between the photosensitive chip 2 and the circuit board 1 to extend around the heat sink 4, thereby reducing additional manufacturing costs. Optionally, the connecting holes 11 can be elongated to allow multiple connecting wires 3 to pass through.

[0060] In Example 2, as shown in FIG4 , a through hole 11 is formed in the circuit board 1, a heat sink 4 is attached to a surface of the circuit board 1 and covers at least a portion of the through hole 11, and a photosensitive chip 2 is attached to the side of the heat sink 4 facing the circuit board 1 within the through hole 11. For example, the heat sink 4 is attached to the back of the circuit board 1 and completely covers the through hole 11, the photosensitive chip 2 is attached to the heat sink 4, and the heat dissipation surface 22 of the photosensitive chip 2 is located within the through hole 11. Compared to Example 1, the height of the photosensitive chip 2 protruding from the circuit board 1 in this embodiment is lower, which helps to shorten the distance between the lens 202 and the circuit board 1, thereby reducing the size of the camera.

[0061] Among them, when observed along the depth direction of the through hole 11, the through hole 11 can match the photosensitive chip 2. For example, as shown in Figure 5, when observed along the depth direction of the through hole 11, the shape and size of the through hole 11 are the same as the shape and size of the photosensitive chip 2, so that the photosensitive chip 2 can be embedded in the through hole 11, so that the through hole 11 can play the role of fixing the photosensitive chip 2, and the photosensitive chip 2 is in contact with the inner wall of the through hole 11, which can conduct heat to the circuit board 1, further improving the heat dissipation effect of the photosensitive chip 2. For example, as shown in Figure 6, when observed along the depth direction of the through hole 11, the shape of the through hole 11 is the same as the shape of the photosensitive chip 2, but the size of the through hole 11 is slightly larger than the size of the photosensitive chip 2, so that there is a certain gap between the photosensitive chip 2 and the inner wall of the through hole 11, which facilitates the installation of the photosensitive chip 2 in the through hole 11.

[0062] In the third embodiment, as shown in FIG7 , the circuit board 1 is provided with a through hole 11, and the heat sink 4 includes a sheet portion 42 and a raised portion 43. The sheet portion 42 is attached to a surface of the circuit board 1 and covers at least a portion of the through hole 11, and the raised portion 43 is connected to the sheet portion 42 in the through hole 11; the photosensitive chip 2 is at least partially attached to the side of the raised portion 43 facing away from the sheet portion 42. For example, the sheet portion 42 is attached to the back of the circuit board 1 and completely covers the through hole 11, the raised portion 43 is attached to the front of the sheet portion 42, and the photosensitive chip 2 is attached to the front of the raised portion 43. Compared with the second embodiment, the heat sink 4 of this embodiment includes a raised portion 43, and the photosensitive chip 2 is arranged on the raised portion 43, which can increase the height of the photosensitive chip 2 protruding from the circuit board 1 and improve the problem of the edge of the through hole 11 blocking light.

[0063] As shown in FIG8 , the protrusion 43 can match the through-hole 11. For example, when viewed along the depth direction of the through-hole 11, the shape and size of the protrusion 43 are identical to those of the through-hole 11. Thus, when the protrusion 43 is inserted into the through-hole 11, the through-hole 11 can limit the protrusion 43 and the heat sink 4, facilitating the positioning of the heat sink 4 when mounted on the circuit board 1. Furthermore, friction can be generated between the inner wall of the through-hole 11 and the protrusion 43 to enhance the connection strength between the heat sink 4 and the circuit board 1.

[0064] Optionally, along the extension direction of through-hole 11, the height of raised portion 43 is equal to the depth of through-hole 11; and photosensitive chip 2 is at least partially in contact with the side of raised portion 43 facing away from sheet portion 42. Because the height of raised portion 43 is equal to the depth of through-hole 11, the height of photosensitive chip 2 protruding from circuit board 1 is the same as that of conventional package structure 100. Therefore, there is no need to change the distance between lens 202 and circuit board 1. In other words, other components of a camera having conventional package structure 100 can be directly applied, which helps reduce production costs.

[0065] As shown in FIG9 , when the height of the raised portion 43 is equal to the depth of the through hole 11, a portion of the photosensitive chip 2 can be attached to the raised portion 43, and the other portion can be attached to the side of the circuit board 1 facing away from the layer portion 42. For example, a portion of the photosensitive chip 2 is attached to the front surface of the raised portion 43, and the other portion is attached to the front surface of the circuit board 1.

[0066] Optionally, the height of the raised portion 43 along the extension direction of the through hole 11 can be greater or less than the depth of the through hole 11. This allows the height of the photosensitive chip 2 protruding from the circuit board 1 to be raised or lowered. When the distance between the lens 202 and the photosensitive chip 2 needs to be adjusted, only the height of the raised portion 43 needs to be adjusted, without having to modify other camera components, which helps reduce production costs. Furthermore, when the height of the raised portion 43 is less than the depth of the through hole 11, the photosensitive chip 2 is partially or completely located within the through hole 11, and the through hole 11 can serve to limit the position of the photosensitive chip 2.

[0067] When the height of the raised portion 43 is equal to or greater than the depth of the through hole 11, the through hole 11 and the photosensitive chip 2 can match each other when viewed along the depth direction of the through hole 11. For example, when viewed along the depth direction of the through hole 11, the shape and size of the through hole 11 are the same as the shape and size of the photosensitive chip 2, so that the raised portion 43 can completely cover the heat dissipation surface 22 of the photosensitive chip 2, thereby maximizing the contact area between the heat sink 4 and the photosensitive chip 2, which is beneficial to improving the heat dissipation effect. The through hole 11 and the photosensitive chip 2 do not need to match each other, as long as the raised portion 43 can pass through the through hole 11.

[0068] Among them, when the height of the protrusion 43 is less than the depth of the through hole 11, the through hole 11 needs to match the photosensitive chip 2 so that the photosensitive chip 2 can be installed in the through hole 11. For example, as shown in Figure 5, when observed along the depth direction of the through hole 11, the shape and size of the through hole 11 are the same as the shape and size of the photosensitive chip 2, so that the photosensitive chip 2 can be partially or completely embedded in the through hole 11, so that the through hole 11 can play the role of fixing the photosensitive chip 2, and the photosensitive chip 2 is in contact with the inner wall of the through hole 11, which can conduct heat to the circuit board 1, further improving the heat dissipation effect of the photosensitive chip 2. For example, as shown in Figure 6, when observed along the depth direction of the through hole 11, the shape of the through hole 11 is the same as the shape of the photosensitive chip 2, but the size of the through hole 11 is slightly larger than the size of the photosensitive chip 2, so that there is a certain gap between the photosensitive chip 2 and the inner wall of the through hole 11, which facilitates the installation of the photosensitive chip 2 in the through hole 11.

[0069] Optionally, the raised portion 43 is formed by extending from the middle of the sheet portion 42 , so that welding or bonding between the raised portion 43 and the sheet portion 42 is not required, thereby simplifying the processing technology of the heat sink 4 and facilitating the manufacture of the heat sink 4 .

[0070] In Example 4, as shown in FIG10 , the heat sink 4 includes a sheet portion 42 and an extension portion 44. The sheet portion 42 is attached to one surface of the circuit board 1, and the extension portion 44 extends to the other surface of the circuit board 1. For example, the sheet portion 42 is attached to the front surface of the circuit board 1, and the extension portion 44 extends to the side surface of the circuit board 1 or to the back surface of the circuit board 1, thereby increasing the surface area of ​​the heat sink 4, improving the heat dissipation efficiency of the heat sink 4, and indirectly improving the heat dissipation efficiency of the photosensitive chip 2.

[0071] Furthermore, the circuit board 1 includes a first surface and a second surface disposed opposite each other, with the laminar portion 42 being attached to one of the first and second surfaces, and the extension portion 44 extending to the other of the first and second surfaces. For example, as shown in FIG11 , the laminar portion 42 is attached to the front surface of the circuit board 1, while the extension portion 44 extends to the back surface of the circuit board 1. Since the front and back surfaces of the circuit board 1 have relatively large areas, extending the extension portion 44 to the back surface of the circuit board 1 can substantially increase the surface area of ​​the heat sink 4 and improve heat dissipation efficiency. The extension portion 44 can also extend to the camera housing to conduct heat there, further improving heat dissipation efficiency.

[0072] Optionally, as shown in FIG11 , there are multiple extensions 44 , which are spaced apart from each other, so that the extensions 44 can wrap around the circuit board 1 from multiple directions, further increasing the surface area of ​​the heat sink 4 and improving heat dissipation efficiency.

[0073] Optionally, the extension portion 44 is formed by extending from the edge of the sheet portion 42 , so that there is no need to weld or bond the extension portion 44 to the sheet portion 42 , thereby simplifying the processing technology of the heat sink 4 and facilitating the manufacture of the heat sink 4 .

[0074] In the above-mentioned embodiments 1 to 4, the heat sink 4 is made of metal, such as copper, aluminum, stainless steel, copper alloy, aluminum alloy, magnesium alloy, etc., which has excellent thermal conductivity.

[0075] Furthermore, in another example, as shown in FIG12 , the sheet portion 42 is attached to the back of the circuit board 1 , and the extension portion 44 extends to the front of the circuit board 1 ; the circuit board 1 is provided with a through hole 11 , and the heat sink 4 further includes a raised portion 43 , which is connected to the sheet portion 42 within the through hole 11 , and the photosensitive chip 2 is attached to the front of the raised portion 43 ; and along the extension direction of the through hole 11 , the height of the raised portion 43 is greater than the depth of the through hole 11 , and the portion of the raised portion 43 protruding from the through hole 11 is connected to the extension portion 44 . Thus, the raised portion 43 can conduct heat directly to the extension portion 44 , improving the heat dissipation efficiency of the raised portion 43 , and thereby improving the heat dissipation efficiency of the photosensitive chip 2 .

[0076] In Example 5, as shown in FIG13 , the heat sink 4 includes a first layer 45 and a second layer 46 . The first layer 45 is attached to one surface of the circuit board 1 , and the second layer 46 is attached to the side of the first layer 45 facing away from the circuit board 1 . The first layer 45 is used to conduct heat from the photosensitive chip 2 , and the first layer 45 can be a heat conducting layer. The second layer 46 is used to conduct heat in the first layer 45 , thereby transferring the heat in the first layer 45 and reducing the temperature difference in the first layer 45 . The second layer 46 can be a heat spreader. For example, the first layer 45 is attached to the front surface of the circuit board 1 , and the second layer 46 is attached to the front surface of the first layer 45 . The first layer 45 is a metal plate, and the second layer 46 is a heat spreader.

[0077] It should be noted that the heat spreader can be a heat pipe. By attaching the heat spreader to the metal plate, the efficiency of heat conduction on the metal plate can be improved, so that the temperature difference on the metal plate is reduced, thereby reducing the temperature at the point where the metal plate and the photosensitive chip 2 are attached, and then the temperature difference between the photosensitive chip 2 and the metal plate is increased, which is beneficial to improving the heat conduction efficiency of the photosensitive chip 2 to the metal plate.

[0078] It can be understood that the second layer 46 can be other heat-dissipating layers with a heat-dissipating effect, and the first layer 45 can also be other heat-conducting layers with a heat-conducting effect. Therefore, in this embodiment, by setting the heat sink 4 as a first layer 45 and a second layer 46 that are bonded to each other, the heat dissipation efficiency of the heat sink 4 to the photosensitive chip 2 can be improved.

[0079] In this embodiment, as shown in FIG14 , the heat sink 4 may further include an extension portion 44, which is formed by extending from the second layer 46, and the extension portion 44 extends to the other surface of the circuit board 1. The structure and beneficial effects of the extension portion 44 of this embodiment can refer to that of Example 4. The difference between the extension portion 44 of this embodiment and the extension portion 44 of Example 4 is that the extension portion 44 of this embodiment is formed by extending from the second layer 46, while the extension portion 44 of Example 4 is formed by extending from the sheet portion 42. Furthermore, the bending performance of the second layer 46 is better than that of the first layer 45, so that the second layer 46 is easier to bend than the first layer 45, that is, the extension portion 44 is easier to bend. Among them, the bending performance can also be reflected by ductility, and good ductility means good bending performance.

[0080] In this embodiment, the first layer 45 is made of a metal, such as copper, aluminum, stainless steel, copper alloy, aluminum alloy, magnesium alloy, etc., which has excellent thermal conductivity. The second layer 46 is made of graphite, graphene, a heat pipe, a VC (Vapor Chamber) heat sink, a heat storage material, an annular liquid cold plate, etc., which has excellent heat dissipation performance. Only when the second layer 46 is made of a bendable material such as graphite, graphene, or a heat storage material can the extension portion 44 extend and / or bend from one surface of the circuit board 1 to the other surface of the circuit board 1. Preferably, the second layer 46 is made of graphene, which has excellent bending resistance and excellent heat dissipation performance.

[0081] In Example 6, as shown in FIG15 , a through hole 11 is formed in the circuit board 1, the photosensitive chip 2 is disposed in the through hole 11, and the heat sink 4 is attached to the heat dissipation surface 22. For example, the photosensitive chip 2 is embedded in the through hole 11, the heat sink 4 is attached to the heat dissipation surface 22, and the other side of the heat sink 4 is used to contact the camera to conduct heat to the camera portion other than the packaging structure 100, thereby achieving heat dissipation of the photosensitive chip 2. In this embodiment, the heat sink 4 can be a TIM material (thermal interface material), specifically a thermally conductive gel, and no other glue is required between the TIM material and the heat dissipation surface 22 to adhere the TIM material to the heat dissipation surface 22.

[0082] As shown in FIG16 , when viewed along the depth direction of the through hole 11, the through hole 11 can match the photosensitive chip 2. For example, when viewed along the depth direction of the through hole 11, the shape and size of the through hole 11 are the same as those of the photosensitive chip 2, so that the photosensitive chip 2 can be embedded in the through hole 11, so that the through hole 11 can play a role in fixing the photosensitive chip 2, and the photosensitive chip 2 contacts the inner wall of the through hole 11, which can conduct heat to the circuit board 1, further improving the heat dissipation effect of the photosensitive chip 2.

[0083] In Example 7, as shown in FIG17 , a heat-dissipating surface 22 is provided with a thermally conductive adhesive 5. Providing the thermally conductive adhesive 5 on the heat-dissipating surface 22 improves the efficiency of heat dissipation from the photosensitive chip 2 to the heat sink 4. The thermally conductive adhesive 5 also adheres the photosensitive chip 2 to the heat sink 4. The thermally conductive adhesive 5 may be silver adhesive.

[0084] Based on the same technical concept, the embodiment of the present application also provides an imaging module 200. As shown in FIG18 , the imaging module 200 includes a lens base 201, a lens 202, and the aforementioned packaging structure 100. The lens base 201 is provided with a light-transmitting hole 2011 extending through both ends; the lens 202 is mounted on one end of the lens base 201 and is used to transmit light into the light-transmitting hole 2011; the packaging structure 100 is disposed on the other end of the lens base 201 and enables the photosensitive chip 2 to receive the light transmitted by the lens 202. The imaging module 200 has the structural features and beneficial effects of the packaging structure 100 and will not be further described here.

[0085] The structures of the lens holder 201 and the lens 202 are not limited herein. It is sufficient that the lens holder 201 can fix the relative position between the lens 202 and the packaging structure 100, and that the lens 202 can focus light onto the photosensitive surface 21 of the photosensitive chip 2. The lens 202 can be a straight lens 202 or a folding fisheye lens 202. The lens holder 201 can be made of metal or plastic. The lens 202 and the lens assembly can be connected by adhesive or snap-fit.

[0086] Furthermore, as shown in Figures 19 and 20, the imaging module 200 also includes a filter 203, which is at least partially disposed between the lens 202 and the photosensitive chip 2. The filter 203 can filter out light of a specific wavelength to reduce the impact of stray light on imaging. Optionally, the filter 203 is adhered to the packaging structure 100 by adhesive. Optionally, the filter 203 is an infrared filter 203, which is used to absorb infrared light to reduce illumination and filter light reflected from the lens 202 to improve imaging clarity.

[0087] Furthermore, as shown in Figures 19 and 20, the optical filter 203 is covered on the packaging structure 100, and a sealed cavity 204 is formed between the optical filter 203 and the packaging structure 100. The photosensitive chip 2 is located in the sealed cavity 204. By sealing the photosensitive chip 2 in the sealed cavity 204, the photosensitive chip 2 is protected from external moisture and pollutants, thereby providing a sealed protection for the photosensitive chip 2.

[0088] Optionally, as shown in Figure 19, when the heat sink 4 is arranged on the back of the circuit board 1, the mirror base 201 is connected to the circuit board 1; as shown in Figure 20, when the heat sink 4 is arranged on the front of the circuit board 1, the mirror base 201 is connected to the heat sink 4.

[0089] Based on the same technical concept, as shown in FIG21 , an embodiment of the present application further provides a camera 300, which includes the aforementioned packaging structure 100 or imaging module 200. The camera 300 has the structural features and beneficial effects of the imaging module 200 or packaging structure 100, which will not be described in detail here.

[0090] The packaging structure 100, imaging module 200 and camera of the embodiment of the present application can accelerate the efficiency of heat dissipation of the photosensitive chip 2 and improve the problem of heat dissipation of the photosensitive chip 2 by providing a heat sink 4 that is in contact with the heat dissipation surface 22 of the photosensitive chip 2. The heat sink 4 includes a protrusion 43, which is arranged in the through hole 11 of the circuit board 1 and can change the height of the photosensitive chip 2 protruding from the circuit board 1 to adapt to different needs. The heat sink 4 includes an extension 44, which can increase the surface area of ​​the heat sink 4, improve the heat dissipation efficiency of the heat sink 4, and indirectly improve the heat dissipation efficiency of the photosensitive chip 2. The heat sink 4 includes a first layer 45 and a second layer 46. The first layer 45 is a heat-conducting layer, and the second layer 46 is a heat-dissipating layer, which can improve the heat conduction efficiency of the photosensitive chip 2 to the metal plate. The extension 44 is formed by extending from the second layer 46, and the ductility of the second layer 46 is better than that of the first layer 45, so that the second layer 46 is easier to bend than the first layer 45.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Based on the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations in different aspects of the present application as described above. For the sake of simplicity, they are not provided in detail. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A packaging structure, characterized in that: include: Circuit boards; A photosensitive chip is arranged on the circuit board and is electrically connected to the circuit board through a connecting wire, and the photosensitive chip includes a photosensitive surface and a heat dissipation surface arranged opposite to each other; as well as The heat sink is at least partially in contact with the heat dissipation surface.

2. The packaging structure according to claim 1, characterized in that: The heat sink is attached to a surface of the circuit board, and the photosensitive chip is attached to a side of the heat sink that is away from the circuit board.

3. The packaging structure according to claim 2, characterized in that: The heat sink is provided with a connection hole, and the connection hole is used for the connection line to pass through.

4. The packaging structure according to claim 1, characterized in that: The circuit board is provided with a through hole, the heat sink is attached to a surface of the circuit board and covers at least a portion of the through hole, and the photosensitive chip is attached to a side of the heat sink facing the circuit board in the through hole.

5. The packaging structure according to claim 1, characterized in that: The circuit board is provided with a through hole, and the heat sink includes a sheet portion and a protruding portion. The sheet portion is adhered to a surface of the circuit board and covers at least a portion of the through hole, and the protruding portion is connected to the sheet portion in the through hole; the photosensitive chip is at least partially adhered to a side of the protruding portion facing away from the sheet portion.

6. The packaging structure according to claim 5, characterized in that: When viewed along the depth direction of the through hole, the protrusion matches the through hole.

7. The packaging structure according to claim 5, characterized in that: Observing along the depth direction of the through hole, the through hole matches the photosensitive chip.

8. The packaging structure according to claim 5, characterized in that: Along the extending direction of the through hole, the height of the protrusion is equal to the depth of the through hole.

9. The packaging structure according to claim 8, characterized in that: A portion of the photosensitive chip is in contact with the raised portion, and another portion is in contact with a side of the circuit board that is away from the sheet portion.

10. The packaging structure according to any one of claims 2 to 9, characterized in that: The heat sink comprises a sheet portion and an extension portion. The sheet portion is attached to one surface of the circuit board, and the extension portion extends to the other surface of the circuit board.

11. The packaging structure according to claim 10, characterized in that: The circuit board includes a first surface and a second surface that are arranged opposite to each other, the sheet portion is attached to one of the first surface and the second surface, and the extension portion extends to the other of the first surface and the second surface.

12. The packaging structure according to any one of claims 2 to 9, characterized in that: The heat sink includes a first layer and a second layer, wherein the first layer is attached to a surface of the circuit board, and the second layer is attached to a side of the first layer facing away from the circuit board; the first layer is used to conduct the heat of the photosensitive chip; and the second layer is used to conduct the heat in the first layer.

13. The packaging structure according to claim 12, characterized in that: The heat sink includes an extension portion, which is formed by extending from the second layer and extending to another surface of the circuit board, and the bending performance of the second layer is better than that of the first layer.

14. The packaging structure according to claim 1, characterized in that: The circuit board is provided with a through hole, the photosensitive chip is arranged in the through hole, and the heat sink is arranged on the heat dissipation surface.

15. The packaging structure according to claim 1, characterized in that: The heat dissipation surface is provided with heat conductive glue.

16. An imaging module, characterized in that: include: The mirror base is provided with light-transmitting holes running through both ends; A lens, which is covered at one end of the lens base and is used to transmit light into the light-transmitting hole; as well as The packaging structure according to any one of claims 1 to 15, wherein the packaging structure is arranged at the other end of the lens holder, and enables the photosensitive chip to receive the light transmitted by the lens.

17. The imaging module according to claim 16, characterized in that: The imaging module also includes a filter, and the filter is at least partially arranged between the lens and the photosensitive chip.

18. The imaging module according to claim 17, characterized in that: The filter cover is arranged on the packaging structure, and a sealed cavity is formed between the filter and the packaging structure, and the photosensitive chip is located in the sealed cavity.

19. A camera, characterized in that: include: The packaging structure according to any one of claims 1 to 15; Or it includes the imaging module as described in any one of claims 16 to 18.

Images