Light-emitting substrate, backlight module, and display device

Abstract

A light-emitting substrate comprises a circuit board, an electronic component, a first reflective layer and a first adhesive layer. The electronic component and the first reflective layer are arranged on the circuit board, and the first adhesive layer is arranged on the surface of the first reflective layer close to the circuit board. The first reflective layer comprises a hollowed-out area and first slit groups arranged around the hollowed-out area. The orthographic projection of the electronic component on the circuit board is located within the orthographic projection of the hollowed-out areas on the circuit board. Each first slit group comprises a plurality of first slits arranged at intervals. The sum of the length of each first slit and the length of the connection line between another first slit adjacent to said first slit is a first length, and the ratio of the first length to the perimeter of a first closed figure is 1 / 4-1 / 3; and the first closed figure is formed by sequentially connecting a plurality of first slits belonging to the same first slit group end to end in a clockwise or counterclockwise direction.

Description

Light-emitting substrate, backlight module and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module, and a display device. Background Art

[0002] With the development of light-emitting diode (LED) technology, light-emitting substrates using submillimeter or even micron-scale light-emitting diodes (LEDs) have become widely used. This allows products such as liquid crystal displays (LCDs) to achieve contrast levels comparable to those of organic light-emitting diode (OLED) displays while retaining the technical advantages of LCDs. This improves display quality and provides users with a superior visual experience.

[0003] Summary of the Invention

[0004] In one aspect, a light-emitting substrate is provided. The light-emitting substrate includes a circuit board, an electronic component, a first reflective layer, and a first adhesive layer. The electronic component and the first reflective layer are disposed on the circuit board, and the first adhesive layer is disposed on the surface of the first reflective layer closest to the circuit board. The first reflective layer includes a hollow region and a first slit group surrounding the hollow region. The orthographic projection of the electronic component on the circuit board is located within the orthographic projection of the hollow region on the circuit board. The first slit group includes a plurality of first slits spaced apart.

[0005] The sum of the length of the first slit and the length of the line connecting another first slit adjacent to the first slit is the first length, and the ratio of the first length to the perimeter of the first closed figure is 1 / 4 to 1 / 3; the first closed figure is composed of multiple first slits belonging to the same first slit group connected end to end in a clockwise or counterclockwise direction.

[0006] In some embodiments, a ratio of the length of the first slit to the length of a line connecting another first slit adjacent to the first slit is 2-3.

[0007] In some embodiments, the first reflective layer includes a plurality of first slit groups, and at least two of the first slit groups are disposed around the same hollow area.

[0008] In some embodiments, the geometric centers of at least two first closed figures corresponding to at least two first slit groups arranged around the same hollow area coincide with the geometric center of the hollow area.

[0009] In some embodiments, the distance between two first closed figures corresponding to any two adjacent first slit groups is a first distance; among at least two first slit groups arranged around the same hollow area, the distance between the first slit group closest to the hollow area and the hollow area is a second distance; the first distance and the second distance are approximately equal.

[0010] In some embodiments, the distance between two first closed figures corresponding to any two adjacent first slit groups is greater than or equal to 0.5 mm.

[0011] In some embodiments, along the first direction, a line connecting two adjacent first slits in any first slit group is arranged opposite to a first slit in at least one first slit group; the first direction is perpendicular to the boundary of the hollow area and parallel to the plane where the circuit board is located.

[0012] In some embodiments, in two adjacent first slit groups, the length of a first slit in any first slit group is greater than or equal to the length of a line connecting two adjacent first slits in any first slit group.

[0013] In some embodiments, the outer boundary of the orthographic projection of the hollow area on the circuit board is a second closed figure; and the first closed figure and the second closed figure are similar figures.

[0014] In some embodiments, the first closed figure and the second closed figure are any one of a circle, an ellipse and a polygon.

[0015] In some embodiments, the plurality of electronic components include a plurality of light-emitting devices arranged in multiple rows and columns. The first reflective layer includes a central region and an edge region surrounding the central region. The first reflective layer also includes a second slit group disposed in the edge region, the second slit group including a plurality of second slits spaced apart from each other, the plurality of second slits being located between two adjacent rows or columns of light-emitting devices.

[0016] In some embodiments, a ratio of the length of the second slit to the length of a line connecting two adjacent second slits is 2-3.

[0017] In some embodiments, the first reflective layer includes a plurality of second slit groups, which are divided into a plurality of row slit groups and a plurality of column slit groups; the row slit groups are located between two adjacent rows of light-emitting devices, and the column slit groups are located between two adjacent columns of light-emitting devices.

[0018] In some embodiments, the first reflective layer has a first axis extending along a row direction and a second axis extending along a column direction; the plurality of row slit groups are symmetrical about the first axis, and the plurality of column slit groups are symmetrical about the second axis.

[0019] In some embodiments, the distance between the two ends of the second slits at both ends of the second slit group is equal to the distance between the two ends of adjacent hollow areas in a row or column located in the edge area.

[0020] In some embodiments, along the second direction, a line connecting two adjacent second slits in any second slit group is arranged opposite to a second slit in at least one second slit group; and the second direction is perpendicular to the second slits in the second slit group.

[0021] In some embodiments, in two adjacent second slit groups, the length of the second slits in any second slit group is greater than or equal to the length of a line connecting two adjacent second slits in any second slit group.

[0022] In some embodiments, the distances between the second slit group and two adjacent rows or columns of hollow areas are substantially equal.

[0023] In some embodiments, a radial length of a boundary line between the edge region and the central region is greater than or equal to 300 mm.

[0024] In another aspect, a backlight module is provided, comprising: a light-emitting substrate as described in any of the above embodiments; and a plurality of optical films, wherein the light-emitting substrate has a light-emitting side and a non-light-emitting side opposite to each other, and the plurality of optical films are disposed on the light-emitting side of the light-emitting substrate.

[0025] In another aspect, a display device is provided, comprising: the backlight module and a display panel as described in the above embodiment, wherein the display panel is disposed on a side of the plurality of optical films in the backlight module away from the light-emitting substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0027] FIG1 is a structural diagram of a display device according to some embodiments;

[0028] FIG2 is a structural diagram of another display device according to some embodiments;

[0029] FIG3 is a cross-sectional view of a display device according to some embodiments;

[0030] FIG4 is a circuit diagram of a light emitting substrate according to some embodiments;

[0031] FIG5 is a schematic diagram illustrating interference generated between a first reflective layer and an electronic component according to some embodiments;

[0032] FIG6 is a schematic diagram of a package portion cracking according to some embodiments;

[0033] FIG7 is a top view of a light emitting substrate according to some embodiments;

[0034] FIG8 is a partial enlarged view of a hollow area of ​​a light-emitting substrate according to some embodiments;

[0035] FIG9 is a partial enlarged view of a hollow area of ​​another light-emitting substrate according to some embodiments;

[0036] FIG10 is a cross-sectional view taken along section line AA′ in FIG8 ;

[0037] FIG11 is a partially enlarged view of a first reflective layer according to some embodiments;

[0038] FIG12 is a top view of a first reflective layer according to some embodiments;

[0039] FIG13 is a top view of another first reflective layer according to some embodiments;

[0040] FIG14 is a top view of yet another first reflective layer according to some embodiments;

[0041] FIG. 15 is a top view of yet another first reflective layer according to some embodiments. DETAILED DESCRIPTION

[0042] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0043] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0044] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0045] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0046] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0047] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0048] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0049] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0050] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0051] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0052] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0053] As shown in FIG. 1 , some embodiments of the present disclosure provide a display device 1000 , which may be any device that displays an image, whether in motion (eg, video) or stationary (eg, still image), and whether textual or graphic.

[0054] For example, referring to Figures 1 and 2, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, a virtual reality (VR) device, etc.

[0055] For example, as shown in FIG1 , the display device 1000 may be a portable display product; for example, the display device 1000 may be the mobile phone shown in FIG1 . For another example, referring to FIG2 , the display device 1000 may be a wearable device; for example, the display device 1000 may be the watch shown in FIG2 .

[0056] It should be noted that, depending on different application scenarios, the shape of the display surface of the display device 1000 is not unique. The shape of the display surface of the display device 1000 can be any one of a circle, an ellipse, a polygon or an irregular shape, which is not specifically limited in the embodiments of the present disclosure.

[0057] In some embodiments, referring to FIG. 3 , the display device 1000 may be a liquid crystal display (LCD).

[0058] 3 , the display device 1000 includes a backlight module 100 , a display panel 200 and a cover plate 300 . The display panel 200 is disposed on a side of the backlight module 100 from which light is emitted, and the cover plate 300 is disposed on a side of the display panel 200 away from the backlight module 100 .

[0059] Referring to FIG3 , the backlight module 100 includes a light-emitting substrate 110 having a light-emitting side and a non-light-emitting side. The light-emitting side refers to the side of the light-emitting substrate 110 from which light is emitted (the upper side of the light-emitting substrate 110 in FIG3 ), while the non-light-emitting side refers to the side opposite the light-emitting side (the lower side of the light-emitting substrate 110 in FIG3 ). The display panel 200 is disposed on the light-emitting side of the light-emitting substrate 110.

[0060] In some embodiments, referring to FIG. 3 , the backlight module 100 further includes a plurality of optical films 120 , which are disposed on the light-emitting side of the light-emitting substrate 110 .

[0061] The light emitted from the light-emitting substrate 110 passes through the optical film 120 and then is emitted toward the display panel 200. That is, the display panel 200 is disposed on the side of the optical film 120 that is away from the light-emitting substrate 110. It should be noted that the optical film 120 modulates the wavelength and / or propagation direction of the light emitted from the light-emitting substrate 110.

[0062] As shown in FIG3 , the light-emitting substrate 110 can directly emit white light, which is then modulated in its propagation direction after passing through the multiple optical films 120 and then emitted toward the display panel 200. Alternatively, the light-emitting substrate 110 can also emit light of other colors (e.g., blue light), which is then modulated in its wavelength and / or propagation direction after passing through the multiple optical films 120 and then emitted toward the display panel 200.

[0063] For example, referring to FIG3 , the plurality of optical films 120 include a scattering layer 121, a color conversion layer 122, a diffuser 123, and a composite film 124. The scattering layer 121, the color conversion layer 122, the diffuser 123, and the composite film 124 can be sequentially positioned away from the display panel 200. Specifically, the diffuser 123 can be positioned on the light-emitting side of the light-emitting substrate 110, the composite film 124 can be positioned on the side of the diffuser 123 away from the light-emitting substrate 110, the scattering layer 121 and the color conversion layer 122 can be positioned on the side of the diffuser 123 closer to the light-emitting substrate 110, and the display panel 200 can be positioned on the side of the composite film 124 away from the light-emitting substrate 110.

[0064] The scattering layer 121 blurs the light emitted by the light-emitting substrate 110 and provides support for the color conversion layer 122, the diffuser 123, and the composite film 124. The color conversion layer 122, when stimulated by light of a certain color emitted by the light-emitting substrate 110, converts that light into white light, thereby improving the utilization of the light energy of the light-emitting substrate 110. The diffuser 123 evens out the light passing through it. The composite film 124 improves the light extraction efficiency of the light-emitting substrate 110, thereby increasing the brightness of the display device 1000.

[0065] It should be noted that the composite film 124 may include a brightness enhancement film (BEF) and a dual brightness enhancement film (DBEF), which utilizes the principles of total reflection, refraction, and polarization to increase the light flux within a certain angle range to improve the brightness of the display device 1000.

[0066] For example, as shown in FIG3 , the light-emitting substrate 110 emits blue light. The color conversion layer 122 may include a red quantum dot material, a green quantum dot material, and a transparent material. When the blue light emitted by the light-emitting substrate 110 passes through the red quantum dot material, it is converted into red light; when the blue light passes through the green quantum dot material, it is converted into green light; the blue light can directly pass through the transparent material; then, the blue light, red light, and green light are mixed and superimposed in a certain proportion to present white light. Finally, the scattering layer 121 and the diffuser 123 can modulate the incident light of different propagation directions and emit it in a more uniform state, thereby improving the light shadow produced by the light-emitting substrate 110 and improving the display quality of the display device 1000.

[0067] In some embodiments, referring to FIG3 , the display device 1000 further includes a support frame 400 that surrounds the periphery of the light-emitting substrate 110 to provide protection. Furthermore, the support frame 400 is provided with two support protrusions 410 : one support protrusion 410 is located between the display panel 200 and the cover plate 300 , and the other support protrusion 410 is located between the optical film 120 and the light-emitting substrate 110 , thereby providing support for the cover plate 300 and the optical film 120 , respectively.

[0068] In some embodiments, referring to FIG. 3 , the light emitting substrate 110 includes a circuit board 10 , a plurality of electronic components 20 and a first reflective layer 30 .

[0069] In some examples, referring to FIG. 3 , circuit board 10 may be an FR4-type printed circuit board (PCB) or a flexible PCB that is easily deformable. For example, the material of circuit board 10 may include one or more ceramic materials such as silicon nitride, AlN, and Al2O3, or may include a metal or metal compound, such as a metal core printed circuit board (Metal Core PCB) or a metal copper clad laminate (MCCL).

[0070] In some examples, referring to Figures 3 and 10, circuit board 10 may include a substrate 101 and a circuit layer 102. Circuit layer 102 is disposed on substrate 101 and includes at least one conductive layer 103 and at least one insulating layer 104. For example, as shown in Figure 10, circuit layer 102 includes a first insulating layer 1041, a second insulating layer 1042, and a first conductive layer 1031. First insulating layer 1041 is located between first conductive layer 1031 and substrate 101 to provide an insulating buffer. Second insulating layer 1042 is located on a side of first conductive layer 1031 away from substrate 101 to provide insulation and oxidation protection.

[0071] As shown in FIG3 , substrate 101 can be a rigid substrate or a flexible substrate. The material of the rigid substrate includes at least one of glass, quartz, sapphire, ceramic, and polymethyl methacrylate (PMMA). The material of the flexible substrate includes at least one of epoxy resin, triazine, silicone resin, and polyimide. The material of the conductive layer 103 includes at least one of copper, molybdenum-niobium alloy, nickel, and indium tin oxide.

[0072] As shown in Figures 3 and 4, circuit board 10 includes pads 13 and circuit traces 14. Circuit traces 14 are connected to pads 13 to transmit circuit signals. Electronic components 20 can be fixed to circuit board 10 via pads 13 and electrically connected to circuit board 10. Referring to Figure 10, pads 13 can be, for example, portions of first conductive layer 1031 exposed by second insulating layer 1042.

[0073] In some examples, as shown in Figures 3 and 4, multiple electronic components 20 are disposed on a circuit board 10. The electronic components 20 have pin structures 201 connected to external circuit structures (e.g., pads 13). For example, the electronic components 20 can be electrically connected to the circuit board 10 by soldering the pin structures 201 to the pads 13 using solder S to receive drive signals. It should be noted that the pin structures 201 are typically made of a metal or alloy material with good electrical conductivity.

[0074] 3 and 4 , the electronic component 20 may include a light-emitting device 21 and a microchip 22. The pin structure 201 of a light-emitting device 21 may include, for example, two pins 202, which are respectively connected to two pads 13, and the pin structure 201 of a microchip 22 may include, for example, four pins 202, which are respectively connected to four pads 13.

[0075] It should be noted that the pin structure 201 of a microchip 22 may also include 8 pins 202 or 10 pins 202 , depending on the actual circuit design, and is not specifically limited in the embodiment of the present disclosure.

[0076] As shown in FIG3 and FIG4 , the light emitting device 21 may include one or more of a micro light emitting diode (Micro Light Emitting Diode, referred to as Micro LED) and / or a sub-millimeter light emitting diode (Mini Light Emitting Diode, referred to as Mini LED).

[0077] It should be noted that the size (e.g., length) of a Micro LED is less than 50 microns, for example, 10 to 50 microns. The size (e.g., length) of a Mini LED is 50 to 150 microns, for example, 80 to 120 microns.

[0078] As shown in FIG3 and FIG4 , the microchip 22 may include a sensor chip and / or a driver chip. The sensor chip may be, for example, a light sensor chip or a heat sensor chip, etc. The driver chip is used to provide a driving signal to the light emitting device 21 .

[0079] In some examples, as shown in FIG3 , a first reflective layer 30 is disposed on the circuit board 10 , and the first reflective layer 30 is configured to reflect light emitted from the light-emitting device 21 toward the circuit board 10 , so that more light emitted by the light-emitting device 21 is emitted toward the display panel 200 , thereby improving the light extraction efficiency of the light-emitting substrate 110 and improving the display effect.

[0080] It should be noted that the material of the first reflective layer 30 includes a polyester material, which may be doped with reflective ions. Exemplarily, the material of the first reflective layer 30 includes a polymer obtained by polycondensation of a polyol and a polyacid; for example, the material of the first reflective layer 30 includes at least one linear thermoplastic resin such as polyethylene terephthalate, polybutylene terephthalate, and polyarylate.

[0081] The first reflective layer 30 is connected to the circuit board 10 through a bonding process. In other words, the light-emitting substrate 110 further includes a first adhesive layer 40, which is disposed on the surface of the first reflective layer 30 near the circuit board 10 to adhere and secure the first reflective layer 30 to the circuit board 10. It should be noted that the orthographic projection of the first adhesive layer 40 on the circuit board 10 substantially overlaps with the orthographic projection of the first reflective layer 30 on the circuit board 10.

[0082] In some embodiments, referring to Figures 3, 5, and 6, the first reflective layer 30 has a plurality of hollow regions 301, and the orthographic projections of the electronic components 20 on the circuit board 10 are located within the orthographic projections of the hollow regions 301 on the circuit board 10. For example, one electronic component 20 is located within one hollow region 301 and is connected to the pad 13 via the pin structure 201.

[0083] It should be noted that the outer boundary of the positive projection of the hollow area 301 on the circuit board 10 is the second closed figure S2, and the second closed figure S2 is roughly any one of an ellipse, a circle and a polygon. The following uses the second closed figure S2 being roughly a circle as an example to exemplify some embodiments of the present disclosure, but the implementation methods of the present disclosure are not limited to this.

[0084] As used herein, "substantially circular or elliptical" means that the shape is generally circular or elliptical, but is not limited to a perfect circle or ellipse. Specifically, "circular or elliptical" includes not only substantially circular or elliptical shapes but also shapes similar to circles or ellipses. For example, a circle or ellipse may have a portion of its boundaries formed by straight lines.

[0085] In this document, "substantially polygonal" means that the shape is generally polygonal, but is not limited to a standard polygon. Specifically, "polygonal" includes not only basic polygonal shapes but also shapes similar to polygons. For example, a polygon with curved corners, i.e., a polygon with smooth corners and rounded corners.

[0086] The maximum radial dimension of the hollow area 301 is less than or equal to 2.5 mm. For example, the orthographic projection of the hollow area 301 on the circuit board 10 is substantially circular, and the diameter of the hollow area 301 is 1.4 mm to 2.2 mm. For example, the diameter of the hollow area 301 is any one of 1.4 mm, 1.5 mm, 1.6 mm, 1.8 mm, 2 mm, 2.1 mm, and 2.2 mm.

[0087] In this case, the aperture of the hollow area 301 is smaller, so that more light emitted by the light emitting device 21 can be directed toward the display panel 200, thereby improving the light extraction efficiency of the light emitting substrate 110 and enhancing the display effect.

[0088] It should be understood that the shapes of the hollow areas 301 corresponding to different electronic components 20 may be the same or different; the areas of the hollow areas 301 corresponding to different electronic components 20 may be equal or unequal.

[0089] For example, referring to Figures 3, 5 and 6, the electronic component 20 includes a light-emitting device 21 and a microchip 22, the hollow area 301 includes a first hollow area 3011 and a second hollow area 3012, the orthographic projection of the light-emitting device 21 on the circuit board 10 is located within the orthographic projection of the first hollow area 3011 on the circuit board 10, and the orthographic projection of the microchip 22 on the circuit board 10 is located within the orthographic projection of the second hollow area 3012 on the circuit board 10.

[0090] On this basis, the area of ​​the hollow region 301 can be positively correlated with the area of ​​the corresponding electronic component 20 , and the shape of the hollow region 301 can be similar to the outline of the positive projection of the corresponding electronic component 20 on the circuit board 10 .

[0091] For example, the shape of the first hollow area 3011 is similar to the outline of the orthographic projection of the light emitting device 21 on the circuit board 10 ; the shape of the second hollow area 3012 is similar to the outline of the orthographic projection of the microchip 22 on the circuit board 10 .

[0092] The following takes the example that the first hollow area 3011 and the second hollow area 3012 are both circular and have equal areas to exemplarily illustrate some embodiments of the present disclosure, but the implementation methods of the present disclosure are not limited thereto.

[0093] In some embodiments, as shown in Figures 3, 5, and 6, the light-emitting substrate 110 further includes a plurality of spaced-apart encapsulation portions 50. Each encapsulation portion 50 encapsulates at least one electronic component 20 to protect the electronic component 20. This helps improve the waterproofness and corrosion resistance of the light-emitting substrate 110 and enhances the light extraction efficiency of the light-emitting substrate 110. Furthermore, one encapsulation portion 50 can, for example, cover one hollow area 301. That is, the orthographic projection of the hollow area 301 on the circuit board 10 is within the range of the orthographic projection of the encapsulation portion 50 on the circuit board 10.

[0094] It should be noted that a highly thixotropic glue can be sprayed onto the electronic component 20 by a dispensing machine, and then a packaging part 50 is formed through a curing process; and the packaging part 50 can be a spherical segment or a semi-ellipsoidal sphere, which is not specifically limited in the embodiments of the present disclosure.

[0095] It should be understood that the material of the packaging portion 50 should be adjusted accordingly for different types of electronic components 20. For example, if the electronic component 20 is an optical component, the packaging portion 50 should be made of a transparent material. If the electronic component 20 is a non-optical component, the packaging portion 50 does not require light transmission and can be made of a transparent material, a reflective material, or a light-absorbing material.

[0096] It should be noted that the transparent material may include transparent silicone, the reflective material may include at least one of white ink, white resin and silicone white glue, and the light-absorbing material may include at least one of black ink, black resin and silicone black glue.

[0097] Exemplarily, referring to FIG3 , FIG5 and FIG6 , the electronic component 20 includes a light emitting device 21 and a microchip 22 , and the packaging portion 50 includes a first packaging portion 51 and a second packaging portion 52 . The first packaging portion 51 encapsulates the light emitting device 21 , and the second packaging portion 52 encapsulates the microchip 22 .

[0098] On this basis, the material of the first encapsulation portion 51 can be, for example, a transparent material. The material of the second encapsulation portion 52 can be the same as that of the first encapsulation portion 51. In this way, the first encapsulation portion 51 and the second encapsulation portion 52 can be formed simultaneously, thereby reducing the number of process steps and simplifying the process flow. The material of the second encapsulation portion 52 can also be different from that of the first encapsulation portion 51. For example, the material of the second encapsulation portion 52 can be a reflective material or a light-absorbing material.

[0099] However, in related technologies, the encapsulation portion requires a curing process at a temperature between 100°C and 170°C, which generates shrinkage stress in the first reflective layer. When the shrinkage stress of the first reflective layer exceeds the adhesion between the first adhesive layer and the circuit board, the first reflective layer shrinks, causing interference with the electronic components (see FIG5 ) and / or cracking of the encapsulation portion (see FIG6 ). This reduces the reliability or even failure of the electronic components, leading to a decrease in product yield.

[0100] Based on this, as shown in Figures 7 to 10, in the light-emitting substrate 110 provided in some embodiments of the present disclosure, the first reflective layer 30 further includes a first slit group 310 arranged around the hollow area 301, and the first slit group 310 includes a plurality of first slits 311 arranged at intervals.

[0101] It should be noted that the orthographic projection of the packaging portion 50 on the circuit board 10 can, for example, be located within the range of the orthographic projection of the first slit group 310 on the circuit board 10. In this way, when the first reflective layer 30 shrinks at the first slit 311, the packaging portion 50 does not exist on the first slit 311, and the packaging portion 50 will not be pulled by the shrinkage stress in two opposite directions, thereby preventing the packaging portion 50 from cracking at the first slit 311.

[0102] In this case, when the shrinkage stress of the first reflective layer 30 is greater than the adhesion between the first adhesive layer 40 and the circuit board 10, the first reflective layer 30 can shrink at the first slit 311 to release the stress, thereby reducing the tendency of relative movement between the first reflective layer 30 and the circuit board 10 in the hollow area 301. This reduces the amount of shrinkage of the first reflective layer 30 in the hollow area 301, reduces the risk of the first reflective layer 30 interfering with the electronic component 20 and the packaging portion 50, and reduces the risk of failure of the electronic component 20, thereby improving product yield.

[0103] In addition, the first reflective layer 30 contracts at the first slit 311 to release stress, which can reduce the amount of contraction of the edge of each hollow area 301 of the first reflective layer 30 toward the center of the first reflective layer 30, reduce the accumulated displacement of the edge of the first reflective layer 30, and disperse the tension of the first reflective layer 30 on the circuit board 10, thereby reducing the stretching of the first reflective layer 30 on the circuit board 10 and reducing the warping of the circuit board 10 (light-emitting substrate 110).

[0104] 8 and 9 , the shape of the first slit 311 is approximately rectangular, L-shaped or fan-shaped. The following takes the shape of the first slit 311 being approximately fan-shaped as an example to exemplify some embodiments of the present disclosure. However, the embodiments of the present disclosure are not limited to this, and the shape of the first slit 311 being approximately rectangular can also be considered, as long as the same technical idea is applied.

[0105] In this document, "substantially rectangular, L-shaped, or fan-shaped" means that the overall shape is rectangular or fan-shaped, but is not limited to a standard rectangular, L-shaped, or fan-shaped shape. Specifically, "rectangular, L-shaped, or fan-shaped" encompasses not only basic rectangular, L-shaped, or fan-shaped shapes, but also shapes similar to rectangular, L-shaped, or fan-shaped shapes, taking into account process conditions. For example, the corners or short sides of a rectangle may be curved; the corners or short sides of an L-shaped shape may be curved; and the corners or short sides of a fan-shaped shape may be curved.

[0106] It should be understood that the longer the length L11 of the first slit 311 is, the better the stress release effect is. The longer the length L12 of the line connecting two adjacent first slits 311 is, the lower the risk of the first reflective layer 30 being broken is.

[0107] 8 and 9 , the sum of the length L11 of the first slit 311 and the length L12 of the line connecting another first slit 311 adjacent to the first slit 311 is the first length L1, and the ratio of the first length L1 to the perimeter of the first closed figure S1 is 1 / 4 to 1 / 3.

[0108] It should be noted that the first closed figure S1 is formed by a plurality of first slits 311 belonging to the same first slit group 310 connected end to end in a clockwise or counterclockwise direction.

[0109] Here, referring to FIG. 8 and FIG. 9 , the length L11 of a first slit 311 and the length of a line L12 connecting another first slit 311 adjacent to the first slit 311 are both average lengths of the first slit 311 along the extending direction thereof.

[0110] Exemplarily, as shown in FIG8 , the shape of the first slit 311 is roughly a fan ring, the length of the first slit 311 is the average of the inner arc length and the outer arc length of the fan ring, and the length of the connecting line L12 between the first slit 311 and another adjacent first slit 311 is the average arc length of the two arcs connecting the inner arc and the outer arc of the two adjacent fan rings along the extension direction.

[0111] For example, referring to Figure 9, the shape of at least one first slit 311 is roughly rectangular, the length L11 of the first slit 311 is the length of the long side of the rectangle, and the length of the line L12 between the first slit 311 and another adjacent first slit 311 is the length of the line between the two adjacent rectangles, and the line can be L-shaped.

[0112] Exemplarily, referring to Figure 9, the shape of at least one first slit 311 is roughly L-shaped, the length L11 of the first slit 311 is the length of the long side of the L-shape, and the length of the line L12 between the first slit 311 and another adjacent first slit 311 is the length of the line between the two adjacent L-shapes.

[0113] When the ratio of the first length L1 to the perimeter of the first closed figure S1 is 1 / 4 to 1 / 3, by designing the ratio of the length of the first slit 311 to the length of the line connecting two adjacent first slits 311, a better stress release effect can be achieved while avoiding breakage of the first reflective layer 30.

[0114] For example, referring to Figures 8 and 9 , the ratio of the length L11 of a first slit 311 to the length L12 of a line connecting two adjacent first slits 311 is 2 to 3. In this case, the structural strength between two adjacent first slits 311 is greater, the risk of fracture of the first reflective layer 30 is reduced, and the multiple first slits 311 in the first slit group 310 provide a better stress relief effect. This significantly reduces the shrinkage of the first reflective layer 30 in the hollow area 301 while preventing fracture of the first reflective layer 30, thereby preventing the first reflective layer 30 from interfering with cracking of the electronic component 20 and the packaging portion 50. Furthermore, the shrinkage of the edge of the first reflective layer 30 toward the center is significantly reduced, thereby reducing the warping of the circuit board 10 (light-emitting substrate 110).

[0115] 8 and 9 , the length L11 of the first slit 311 is 1 mm to 3.5 mm. For example, the length L11 of the first slit 311 is any one of 1 mm, 1.2 mm, 1.4 mm, 1.5 mm, 1.8 mm, 2 mm, 2.3 mm, 2.5 mm, 2.6 mm, 2.8 mm, 3 mm, 3.1 mm, 3.2 mm, 3.4 mm, and 3.5 mm.

[0116] For example, as shown in Figures 8 and 9, the length L12 of the line connecting the first slit 311 and the adjacent first slit 311 is 0.5 mm to 1.5 mm. For example, the length L12 of the line connecting the first slit 311 and the adjacent first slit 311 is any one of 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, and 1.5 mm.

[0117] 8 , 9 and 10 , the larger the width W1 of the first slit 311 , the better the stress release effect. The smaller the width W1 of the first slit 311 , the smaller the risk of the first reflective layer 30 being broken.

[0118] Based on this, referring to Figures 8, 9, and 10, the width W1 of the first slit 311 is 0.05 mm to 0.2 mm. For example, the width W1 of the first slit 311 is any one of 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.17 mm, and 0.2 mm, so as to achieve a good stress release effect while preventing the first reflective layer 30 from breaking.

[0119] In some embodiments, as shown in Figures 8 and 9 , the first closed figure S1 and the second closed figure S2 can be similar figures. In this case, the distance between the first closed figure S1 and the second closed figure S2 can be substantially equal in any direction parallel to the plane of the circuit board 10. This allows the first reflective layer 30 to be evenly stressed by the contraction stress between the first closed figure S1 and the second closed figure S2. This prevents the first reflective layer 30 from being locally stressed by excessive contraction stress and causing fracture.

[0120] It should be noted that the plane where the circuit board 10 is located refers to the plane where the surface of the circuit board 10 away from the first reflective layer 30 is located.

[0121] In some embodiments, as shown in Figures 8 and 9, the first reflective layer 30 includes multiple first slit groups 310, with at least two first slit groups 310 disposed around the same hollow region 301. This arrangement forms multiple stress release zones around each hollow region 301. This allows the first reflective layer 30 to release stress sequentially through the multiple stress release zones around the hollow region 301, thereby further reducing the amount of shrinkage of the first reflective layer 30 in the hollow region 301. This further reduces the risk of the first reflective layer 30 interfering with the electronic component 20 and the packaging portion 50, causing cracking, and further reduces the risk of failure of the electronic component 20, thereby improving product yield.

[0122] On this basis, referring to Figures 8, 9, and 10, the distance between two first closed patterns S1 corresponding to any two adjacent first slit groups 310 surrounding the same hollow area 301 is a first distance D1. First distance D1 is greater than or equal to 0.5 mm to reduce the risk of fracture of the first reflective layer 30. For example, as shown in Figures 8, 9, and 10, first distance D1 is 0.5 mm to 2 mm. For example, first distance D1 is any one of 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm, 1.7 mm, and 2 mm.

[0123] 8 and 9 , the geometric centers of at least two first closed figures S1 corresponding to at least two first slit groups 310 disposed around the same hollow area 301 coincide with the geometric center of the hollow area 301. For example, the geometric centers of the first closed figures S1 corresponding to all first slit groups 310 disposed around the same hollow area 301 coincide with the geometric center of the hollow area 301.

[0124] In this way, the distance D1 between the two first closed patterns S1 corresponding to any two adjacent first slit groups 310 surrounding the same hollow area 301 is substantially equal. The shrinkage stress experienced by the portion of the first reflective layer 30 located between the two adjacent first slit groups 310 is evenly distributed, thereby preventing the portion of the first reflective layer 30 located between the two adjacent first slit groups 310 from being locally subjected to excessive shrinkage stress and causing fracture.

[0125] In some embodiments, as shown in Figures 8, 9, and 10, among the at least two first slit groups 310 disposed around the same hollow region 301, the distance between the first slit group 310 closest to the hollow region 301 and the hollow region 301 is a second distance D2. The first distance D1 and the second distance D2 are substantially equal to reduce the number of parameters involved in the process of forming the first slits 311 and thus lower the process difficulty.

[0126] In some embodiments, as shown in Figures 8 and 9 , along a first direction, a line connecting two adjacent first slits 311 in any first slit group 310 is disposed opposite to a first slit 311 in at least one first slit group 310. For example, a line connecting two adjacent first slits 311 in one first slit group 310 in two adjacent first slit groups 310 is disposed opposite to a first slit 311 in another first slit group 310. The first direction is perpendicular to the boundary of the hollow region 301 and parallel to the plane of the circuit board 10.

[0127] On this basis, as shown in FIG8 and FIG9 , in two adjacent first slit groups 310 , the length of the first slit 311 in any first slit group 310 is greater than or equal to the length of the line connecting the two adjacent first slits 311 in any first slit group 310 .

[0128] In this way, there is at least one first slit 311 in any direction around the hollow area 301. In this case, the first reflective layer 30 is subjected to contraction stress, and the first slits 311 exist in any direction parallel to the plane of the circuit board 10 to relieve the stress, thereby preventing adjacent first slits 311 in the first slit group 310 from being subjected to excessive contraction stress and causing breakage.

[0129] It should be understood, referring to Figures 7 and 11 , that the first reflective layer 30 shrinks toward the center, with the edges of the first reflective layer 30 shrinking even more. Therefore, the first reflective layer 30 includes a central region M1 and an edge region M2 surrounding the central region M1. The first reflective layer 30 also includes a second slit group 320 disposed in the edge region M2. The second slit group 320 includes a plurality of second slits 302 spaced apart from each other. The second slits 302 are located between two adjacent electronic components 20. It should be noted that the shape of the boundary between the central region M1 and the edge region M2 is similar to that of the first reflective layer 30.

[0130] In this case, both the central area M1 and the edge area M2 of the first reflective layer 30 can shrink and deform at the multiple second slits 302 in the second slit group 320 to release stress, thereby reducing the displacement accumulation of the edge area M2 of the first reflective layer 30 and the shrinkage of the edge area M2 of the first reflective layer 30, thereby reducing the stretching of the circuit board 10 by the edge area M2 of the first reflective layer 30 and reducing the warping of the circuit board 10 (substrate 210); and reducing the risk of partial interference between the edge area M2 of the first reflective layer 30 and the cracking of the electronic component 20 and the packaging part 50, reducing the failure risk of the electronic component 20, and improving the product yield.

[0131] In addition, when the maximum length of the first reflective layer 30 is less than or equal to the preset value, the shrinkage of the edge of the first reflective layer 30 is less than 0.1 mm. When the maximum length of the first reflective layer 30 is greater than the preset value, the shrinkage of the edge of the first reflective layer 30 increases proportionally.

[0132] Based on this, the area of ​​the first reflective layer 30 where the maximum length is less than or equal to the preset value may be, for example, the central area M1 , and the area where the maximum length is greater than the preset value may be, for example, the edge area M2 .

[0133] Exemplarily, referring to FIG. 7 and FIG. 12 , the radial length of the boundary line between the edge region M2 and the central region M1 is greater than or equal to 300 mm.

[0134] For example, as shown in FIG12 , the first reflective layer 30 is substantially circular, and the radial length of the boundary between the edge region M2 and the central region M1 is 300 mm. In this case, the central region M1 is a circle with a diameter of 300 mm, and the edge region M2 is a ring outside the central region M1, with an inner diameter of 300 mm.

[0135] For another example, as shown in Figures 13, 14, and 15, the first reflective layer 30 is roughly rectangular in shape. The boundary between the edge region M2 and the center region M1 can also be a rectangle, with a length of 600 mm and a width of 300 mm. In this case, the center region M1 is a rectangle with a length of 600 mm and a width of 300 mm, while the edge region M2 is a frame-shaped portion outside the center region M1, with the inner side of the frame being 600 mm long and 300 mm wide.

[0136] The following uses the example of the first reflective layer 30 being approximately rectangular to exemplify some embodiments of the present disclosure. However, the embodiments of the present disclosure are not limited thereto, and the shape of the first reflective layer 30 may be any other shape as long as the same technical concept is applied.

[0137] 11 , the second slit 302 is substantially rectangular in shape. It should be understood that the longer the length L21 of the second slit 302 is, the better the stress release effect is, and the longer the length L22 of the line connecting two adjacent second slits 302 is, the lower the risk of the first reflective layer 30 breaking.

[0138] Based on this, referring to FIG11 , the ratio of the length L21 of a second slit 302 to the length L22 of a line connecting two adjacent second slits 302 is 2 to 3. In this case, the structural strength between two adjacent second slits 302 is greater, the risk of fracture of the first reflective layer 30 is reduced, and the multiple second slits 302 in the second slit group 320 provide a better stress relief effect. This significantly reduces the shrinkage of the edge region M2 of the first reflective layer 30 while preventing fracture of the first reflective layer 30, further reducing the stretching of the circuit board 10 by the edge region M2 of the first reflective layer 30, and reducing the warpage of the circuit board 10 (substrate 210). Furthermore, the risk of partial interference between the edge region M2 of the first reflective layer 30 and the packaging portion 50, which could cause cracking, is avoided.

[0139] 11 , the length L21 of the second slit 302 is 2 mm to 5 mm. For example, the length L21 of the second slit 302 is approximately any one of 2 mm, 2.2 mm, 2.4 mm, 2.5 mm, 2.8 mm, 3 mm, 3.3 mm, 3.5 mm, 3.8 mm, 4 mm, 4.2 mm, 4.5 mm, 4.8 mm, and 5 mm.

[0140] For example, as shown in FIG11 , the length L22 of the line connecting the second slit 302 and another adjacent second slit 302 is 0.7 mm to 2.5 mm. For example, the length L22 of the line connecting the second slit 302 and another adjacent second slit 302 is any one of 0.7 mm, 0.8 mm, 1 mm, 1.1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2 mm, 2.2 mm, and 2.5 mm.

[0141] 11 , the larger the width W2 of the second slit 302 is, the better the stress release effect is. The smaller the width W2 of the second slit 302 is, the smaller the risk of the first reflective layer 30 being broken is.

[0142] Based on this, as shown in FIG11 , the width W2 of the second slit 302 is 0.05 mm to 0.2 mm. For example, the width W2 of the second slit 302 is any one of 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.14 mm, 0.15 mm, 0.17 mm, and 0.2 mm, so as to achieve a good stress release effect while preventing the first reflective layer 30 from breaking.

[0143] In some embodiments, referring to FIG7 , the plurality of electronic components 20 include a plurality of light-emitting devices 21, which are arranged in multiple rows and columns, with each row including at least two light-emitting devices 21 arranged along a row direction X, and each column including at least two light-emitting devices 21 arranged along a column direction Y. In other words, referring to FIG7 and FIG11 , the first hollow regions 3011 are arranged in multiple rows and columns, with each row including at least two first hollow regions 3011 arranged along a row direction X, and each column including at least two first hollow regions 3011 arranged along a column direction Y.

[0144] The multiple second slits 302 of the second slit group 320 are located between two adjacent rows of light-emitting devices 21 or two adjacent columns of light-emitting devices 21. That is, they are located between two adjacent rows of first hollow areas 3011 or two adjacent columns of first hollow areas 3011. This arrangement reduces the difficulty of forming the second slit group 320 because the gap between two adjacent rows of light-emitting devices 21 or two adjacent columns of light-emitting devices 21 is relatively large. The multiple second slits 302 of the second slit group 320 are arranged between two adjacent rows of light-emitting devices 21 along the row direction X or between two adjacent columns of light-emitting devices 21 along the column direction Y.

[0145] For example, as shown in FIG7 , the light-emitting substrate 110 includes a plurality of light-emitting units 130, each of which includes a plurality of light-emitting devices 21 connected in series and / or in parallel and at least one microchip 22. For example, the light-emitting unit 130 includes four light-emitting devices 21 connected in series and one microchip 22. Of course, the light-emitting unit 130 may also include five, six, seven, or eight light-emitting devices 21. Moreover, the connection mode of the plurality of light-emitting devices 21 in the light-emitting unit 130 is not limited to series connection; it may also be parallel connection. The embodiments of the present disclosure are not limited thereto.

[0146] On this basis, as shown in FIG7 , the plurality of second slits 302 of the second slit group 320 can be located between two adjacent light-emitting units 130. With this arrangement, the deformation and contraction of the first reflective layer 30 in each light-emitting unit 130 are substantially the same, resulting in a substantially uniform distribution of the light-emitting centers of each light-emitting unit 130. This improves the uniformity of the brightness distribution of the display device 1000 (see FIG1 ) and enhances the display effect.

[0147] In some embodiments, as shown in Figures 7 and 11, the first reflective layer 30 includes a plurality of second slit groups 320, which are divided into a plurality of row slit groups 321 and a plurality of column slit groups 322. Furthermore, the row slit groups 321 are located between two adjacent rows of light-emitting devices 21, and the column slit groups 322 are located between two adjacent columns of light-emitting devices 21.

[0148] It can be understood that the contraction stress experienced by the first reflective layer 30 can be primarily decomposed into contraction stress along the row direction X and contraction stress along the column direction Y. The contraction stress along the row direction X can be relieved by the multiple second slits 302 of the column slit group 322, thereby reducing the cumulative displacement of the edge region M2 of the first reflective layer 30 in the row direction X. The contraction stress along the column direction Y can be relieved by the multiple second slits 302 of the row slit group 321, thereby reducing the cumulative displacement of the edge region M2 of the first reflective layer 30 in the column direction Y. This can further reduce the amount of contraction in the edge region M2 of the first reflective layer 30, thereby further reducing the warpage of the circuit board 10 (substrate 210); and further reduce the risk of cracking of the electronic component 20 and the packaging portion 50 caused by the partial interference of the edge region M2 of the first reflective layer 30.

[0149] It should be noted that one row slit group 321 or multiple row slit groups 321 may be provided between two adjacent rows of light emitting devices 21 , and one column slit group 322 or multiple column slit groups 322 may be provided between two adjacent columns of light emitting devices 21 .

[0150] Referring to Figure 13, when a row slit group 321 is set between two adjacent rows of light-emitting devices 21 (the four row slit groups 321 in Figure 13 are closer to the center area M1), and when a column slit group 322 is set between two adjacent columns of light-emitting devices 21 (the four column slit groups 322 in Figure 13 are closer to the center area M1), the distance between the second slit group 320 and the two adjacent rows or columns of hollow areas 301 is roughly equal. In this way, the shrinkage amount at the two rows or columns of hollow areas 301 adjacent to the second slit group 320 is roughly equal, which is beneficial to improving the uniformity of the brightness distribution of the light-emitting substrate 110.

[0151] Referring to FIG. 13 , when multiple row slit groups 321 (four row slit groups 321 located farther from the center region M1 in FIG. 13 ) are provided between two adjacent rows of light-emitting devices 21, and when multiple column slit groups 322 (four column slit groups 322 located farther from the center region M1 in FIG. 13 ) are provided between two adjacent columns of light-emitting devices 21, the multiple row slit groups 321 are symmetrical about the axis between the two adjacent rows of light-emitting devices 21, and the multiple column slit groups 322 are symmetrical about the axis between the two adjacent columns of light-emitting devices 21. This allows the shrinkage in the two rows or columns of hollow areas 301 adjacent to the second slit group 320 to be approximately equal, which helps improve the uniformity of the brightness distribution of the light-emitting substrate 110.

[0152] The present disclosure is exemplified below by taking an example where a row slit group 321 is provided between two adjacent rows of light emitting devices 21 and a column slit group 322 is provided between two adjacent columns of light emitting devices 21 , but the embodiments of the present disclosure are not limited thereto.

[0153] Furthermore, referring to Figures 13, 14, and 15, the first reflective layer 30 has a first axis Z1 extending along the row direction X and a second axis Z2 extending along the column direction Y. Furthermore, the multiple row slit groups 321 are symmetrical about the first axis Z1, and the multiple column slit groups 322 are symmetrical about the second axis Z2. This arrangement ensures that the first reflective layer 30 contracts approximately equally on both sides of the row direction X. The hollowed-out regions 301 symmetrical about the first axis Z1 and symmetrical about the second axis Z2 also contract approximately equally, which helps improve the uniformity of the brightness distribution of the light-emitting substrate 110.

[0154] It can be understood that, referring to Figures 13, 14 and 15, the distance between the two ends of the second slits 302 located at both ends in the second slit group 320 can be less than the distance between the two ends of an adjacent row or column of hollow areas 301 located in the edge area M2, or it can be greater than or equal to the distance between the two ends of an adjacent row or column of hollow areas 301 located in the edge area M2.

[0155] For example, as shown in Figure 13, the distance between the two distal ends of the second slits 302 in all second slit groups 320 on the first reflective layer 30 is smaller than the distance between the distal ends of adjacent rows or columns of hollowed-out areas 301 in the edge region M2. For example, as shown in Figure 13, the ends of the row slit groups 321 and column slit groups 322 in multiple second slit groups 320 intersect to surround the central region M1. This arrangement enhances the strength of the first reflective layer 30 and reduces the risk of fracture.

[0156] For example, as shown in FIG14 , the distance between the two ends of the second slits 302 in all second slit groups 320 on the first reflective layer 30 is greater than or equal to the distance between the two ends of adjacent rows or columns of hollowed-out areas 301 in the edge region M2. This arrangement provides excellent stress relief in the edge region M2 of the first reflective layer 30 and simplifies the process.

[0157] For example, as shown in FIG15 , the distance between the distal ends of the second slits 302 located at the ends of a portion of the second slit groups 320 on the first reflective layer 30 is less than the distance between the distal ends of adjacent rows or columns of hollowed-out areas 301 located in the edge region M2. The distance between the distal ends of the second slits 302 located at the ends of another portion of the second slit groups 320 is greater than or equal to the distance between the distal ends of adjacent rows or columns of hollowed-out areas 301 located in the edge region M2. This arrangement increases the strength of the first reflective layer 30, reduces the risk of fracture, and provides improved stress relief in the edge region M2 of the first reflective layer 300.

[0158] In some embodiments, referring to FIG. 11 and FIG. 14 , along the second direction, a line connecting two adjacent second slits 302 in any second slit group 320 is disposed opposite to a second slit 302 in at least one second slit group 320. For example, in two adjacent second slit groups 320, a line connecting two adjacent second slits 302 in one second slit group 320 is disposed opposite to a second slit 302 in another second slit group 320. The second direction is perpendicular to the second slits 302 in the second slit group 320 and parallel to the plane of the circuit board 10.

[0159] On this basis, as shown in FIG. 11 , in two adjacent second slit groups 320 , the length of the second slits 302 in any second slit group 320 is greater than or equal to the length of the line connecting the two adjacent second slits 302 in any second slit group 320 .

[0160] In this way, the shrinkage stress in the area between two adjacent second slits 302 in any second slit group 320 can be relieved by the corresponding second slit 302 in another adjacent second slit group 320, thereby preventing the first reflective layer 30 from being locally broken due to excessive shrinkage stress between two adjacent second slits 302 in the second slit group 320.

[0161] In summary, the distance between the hollow area 301 of the first reflective layer 30 and the electronic component 20 can be reduced by 0.3 mm compared to the prior art, and the luminous efficiency of the light-emitting substrate 110 can be increased by 10%.

[0162] 3 and 10 , the light emitting substrate 110 further includes a second reflective layer 60 disposed between the first reflective layer 30 and the circuit board 10. The second reflective layer 60 can be directly disposed on the circuit board 10 using a coating process.

[0163] It should be noted that the material of the second reflective layer 60 may include white ink and / or silicone white glue. For example, the material of the second reflective layer 60 may include resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and an organic solvent (e.g., dipropylene glycol methyl ether).

[0164] In addition, as shown in FIG. 10 , a plurality of openings 601 are defined on the second reflective layer 60 . The orthographic projections of the electronic components 20 on the circuit board 10 are located within the openings 601 , and the orthographic projections of the openings 601 on the circuit board 10 are located within the hollow region 301 .

[0165] Exemplarily, in a direction perpendicular to the boundary of the opening 601 and parallel to the plane where the circuit board 10 is located, the ratio of the length of the opening 601 to the length of the hollow area 301 ranges from 0.15 to 0.30.

[0166] In this case, the light emitted by the light emitting device 21 toward the space between the hollow area 301 and the opening 601 can be reflected by the second reflective layer 60 to the display panel 200 , thereby further improving the light extraction efficiency of the substrate 210 and enhancing the display effect.

[0167] In some embodiments, as shown in FIG3 , the backlight module 100 further includes a plurality of support columns 70 , which are spaced apart and, for example, arranged in multiple rows and columns. The support columns 70 are used to provide the optical distance (OD) required by the backlight module 100 , i.e., one end of the support column 70 abuts against the light-emitting substrate 110 , and the other end abuts against the surface of the optical film 120 closest to the light-emitting substrate 110 , so that a light mixing distance exists between the first reflective layer 30 in the light-emitting substrate 110 and the optical film 120 , thereby improving the light shadow produced by the light-emitting substrate 110 and enhancing the display quality of the display device 1000 .

[0168] It should be noted that the support column 70 can be any one of a pyramid, a prism, a cone, a frustum and a cylinder, and the embodiment of the present disclosure does not make any specific limitation here.

[0169] On this basis, the first reflective layer 30 may further be provided with a plurality of through holes (not shown in FIG3 ). The through holes are used to correspond to the areas where the support pillars 70 are provided on the light-emitting substrate 110. The arrangement pattern of the through holes is at least the same as the arrangement pattern of the support pillars 70 on the light-emitting substrate 110. Furthermore, the through holes do not interfere with any of the first slit group 310, the second slit group 320, and the hollow area 301.

[0170] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting substrate, include: Circuit board; Electronic components are arranged on the circuit board; A first reflective layer is arranged on the circuit board; the first reflective layer includes a hollow area and a first slit group arranged around the hollow area; the orthographic projection of the electronic component on the circuit board is located within the orthographic projection of the hollow area on the circuit board; the first slit group includes a plurality of first slits arranged at intervals; wherein the sum of the length of the first slit and the length of the line connecting another first slit adjacent to the first slit is the first length, and the ratio of the first length to the perimeter of the first closed figure is 1 / 4 to 1 / 3; the first closed figure is composed of a plurality of first slits belonging to the same first slit group connected end to end in a clockwise or counterclockwise direction; The first adhesive layer is arranged on a surface of the first reflective layer close to the circuit board.

2. The light-emitting substrate according to claim 1, in, The ratio of the length of the first slit to the length of a line connecting another first slit adjacent to the first slit is 2-3.

3. The light-emitting substrate according to claim 1 or 2, in, The first reflective layer includes a plurality of first slit groups, and at least two of the first slit groups are arranged around the same hollow area.

4. The light-emitting substrate according to claim 3, in, The geometric centers of at least two first closed figures corresponding to at least two first slit groups arranged around the same hollow area coincide with the geometric center of the hollow area.

5. The light-emitting substrate according to claim 3 or 4, in, The distance between two first closed figures corresponding to any two adjacent first slit groups is the first distance; among at least two first slit groups arranged around the same hollow area, the distance between the first slit group closest to the hollow area and the hollow area is the second distance; the first distance is approximately equal to the second distance.

6. The light-emitting substrate according to any one of claims 3 to 5, in, The distance between two first closed figures corresponding to any two adjacent first slit groups is a first distance, and the first distance is greater than or equal to 0.5 mm.

7. The light-emitting substrate according to any one of claims 1 to 6, in, Along the first direction, a line connecting two adjacent first slits in any first slit group is arranged opposite to a first slit in at least one first slit group; the first direction is perpendicular to the boundary of the hollow area and parallel to the plane where the circuit board is located.

8. The light-emitting substrate according to claim 7, in, In two adjacent first slit groups, the length of a first slit in any first slit group is greater than or equal to the length of a line connecting two adjacent first slits in any first slit group.

9. The light-emitting substrate according to any one of claims 1 to 8, in, The outer boundary of the orthographic projection of the hollow area on the circuit board is a second closed figure; the first closed figure and the second closed figure are similar figures.

10. The light-emitting substrate according to any one of claims 1 to 9, in, The first closed figure and the second closed figure are any one of a circle, an ellipse and a polygon.

11. The light-emitting substrate according to any one of claims 1 to 10, in, The plurality of electronic components include a plurality of light emitting devices, and the plurality of light emitting devices are arranged in a plurality of rows and columns; the first reflective layer includes a central area and an edge area surrounding the central area; The first reflective layer further includes a second slit group disposed in the edge region, the second slit group includes a plurality of second slits disposed at intervals, and the plurality of second slits are located between two adjacent rows of light emitting devices or two adjacent columns of light emitting devices.

12. The light-emitting substrate according to claim 11, in, The ratio of the length of the second slit to the length of a line connecting two adjacent second slits is 2-3.

13. The light-emitting substrate according to claim 11 or 12, in, The first reflective layer includes a plurality of second slit groups, which are divided into a plurality of row slit groups and a plurality of column slit groups; the row slit groups are located between two adjacent rows of light emitting devices, and the column slit groups are located between two adjacent columns of light emitting devices.

14. The light-emitting substrate according to claim 13, in, The first reflective layer has a first axis extending in a row direction and a second axis extending in a column direction; the plurality of row slit groups are symmetrical about the first axis, and the plurality of column slit groups are symmetrical about the second axis.

15. The light emitting substrate according to any one of claims 11 to 14, in, In the second slit group, the distance between the two ends of the second slits located at the two ends is greater than or equal to the distance between the two ends of the adjacent row or column of hollow areas located in the edge area.

16. The light-emitting substrate according to any one of claims 11 to 15, in, Along the second direction, a line connecting two adjacent second slits in any second slit group is arranged opposite to a second slit in at least one second slit group; and the second direction is perpendicular to the second slits in the second slit group.

17. The light-emitting substrate according to claim 16, in, In two adjacent second slit groups, the length of the second slits in any second slit group is greater than or equal to the length of a line connecting two adjacent second slits in any second slit group.

18. The light emitting substrate according to any one of claims 11 to 17, in, The distances between the second slit group and two adjacent rows or columns of hollow areas are substantially equal.

19. The light-emitting substrate according to any one of claims 11 to 18, in, The radial length of the boundary line between the edge area and the central area is greater than or equal to 300 mm.

20. A backlight module, include: The light-emitting substrate according to any one of claims 1 to 19, wherein the light-emitting substrate has a light-emitting side and a non-light-emitting side opposite to each other; A plurality of optical films are arranged on the light emitting side of the light emitting substrate.

21. A display device, include: The backlight module as claimed in claim 20; The display panel is arranged on a side of the plurality of optical films in the backlight module away from the light-emitting substrate.

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