Liquid cooling apparatus and electronic device

Abstract

Disclosed in the embodiments of the present application is a liquid cooling apparatus, which uses first heat conduction structures to achieve thermal contact between a first cold plate and heat conduction piece fixing assemblies, the heat conduction piece fixing assemblies being used to be in thermal contact with a VR power supply module; a plurality of second heat conduction structures are detachably provided on the heat conduction piece fixing assemblies at intervals, the second heat conduction structures being used for clamping a memory module so as to dissipate heat of the memory module. In this way, heat generated by the VR power supply module is transferred to the first cold plate by means of the heat conduction piece fixing assemblies and the second heat conduction structures for dissipation, and heat generated by the memory module is transferred to the first cold plate by means of the second heat conduction structures, the heat conduction piece fixing assemblies and the first heat conduction structures for dissipation, so as to achieve heat dissipation of the VR power supply module and the memory module without the need for flow channels, and reduce the difficulty in configuring flow channels and the risk of liquid leakage, thus simplifying the structural layout of the liquid cooling apparatus, and improving the convenience of memory maintenance and the reliability of the liquid cooling apparatus. Also disclosed in the present application is an electronic device.

Description

Liquid cooling device and electronic equipment

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on the Chinese patent application with application number "202311237649.0" and application date of September 22, 2023, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated into this application by introduction. Technical Field

[0003] The present application belongs to the technical field of heat dissipation of electronic equipment, and in particular relates to a liquid cooling device and electronic equipment. Background Art

[0004] Data centers are globally coordinated networks of specialized equipment used to transmit, accelerate, display, compute, and store data on the internet infrastructure. The emergence of data centers has shifted our understanding from a quantitative, structured world to an uncertain, unstructured one. Like transportation and network communications, data centers have gradually become a part of modern social infrastructure, positively impacting numerous industries.

[0005] Currently, data centers require a large number of servers and other electronic equipment for normal operation. The heat generated by these servers can negatively impact their performance and lifespan. Traditional air cooling technology is increasingly unable to meet the rapidly growing heat dissipation needs of data centers. Liquid cooling, with its higher cooling efficiency, is gradually replacing traditional air cooling and becoming the mainstream cooling technology for data centers. Liquid cooling replaces air with a cooling medium for heat dissipation. This medium efficiently exchanges heat with the servers, conserving electricity and meeting the societal trends and requirements for energy conservation and emission reduction.

[0006] However, current liquid cooling devices still have problems such as complex overall pipeline design, difficult layout and high risk of leakage, which are not conducive to the installation and maintenance of liquid cooling devices.

[0007] Summary of the Invention

[0008] The purpose of the embodiments of the present application is to provide a liquid cooling device and an electronic device, simplify the structural layout of the liquid cooling device, and improve the convenience of memory maintenance and the reliability of the liquid cooling device.

[0009] To solve the above technical problems, the first aspect of the present application provides a liquid cooling device, comprising:

[0010] A liquid inlet pipe is used to transport cooling liquid; a first cold plate has a liquid containing cavity connected to the liquid inlet pipe, the liquid containing cavity is used to receive the cooling liquid, and the first cold plate is used to dissipate heat for the CPU; a plurality of first heat-conducting structures are arranged at intervals along a first direction with the first cold plate, and the plurality of first heat-conducting structures are in thermal contact with the first cold plate; a plurality of heat-conducting member fixing assemblies are arranged at intervals along the first direction with the first cold plate, the heat-conducting member fixing assemblies are in thermal contact with the first heat-conducting structures in a one-to-one correspondence, and the heat-conducting member fixing assemblies are used to be in thermal contact with the VR power supply module to dissipate heat for the VR power supply module; a plurality of second heat-conducting structures are arranged at intervals along the first direction with the first cold plate, the second heat-conducting structures are in one-to-one correspondence and are detachably fixed to the heat-conducting member fixing assemblies, and the second heat-conducting structures are used to clamp and fix the memory module and dissipate heat for the memory module.

[0011] Optionally, there are two first heat-conducting structures, and the two first heat-conducting structures are respectively arranged on opposite sides of the first cold plate along the first direction and in thermal contact with the first cold plate; there are two heat-conducting component fixing assemblies, and the two heat-conducting component fixing assemblies are respectively arranged on opposite sides of the first cold plate along the first direction and fixedly connected to the two first heat-conducting structures; there are two second heat-conducting structures, and the two second heat-conducting structures are respectively arranged on opposite sides of the first cold plate along the first direction and are respectively detachably fixed to the heat-conducting component fixing assemblies.

[0012] Optionally, the first heat-conducting structure includes two first heat-conducting components, and the two first heat-conducting components are respectively arranged on opposite sides of the first cold plate along the second direction; the heat-conducting member fixing component includes two heat-conducting member fixing seats, and the two heat-conducting member fixing seats are spaced apart along the second direction, and the two first heat-conducting components and the two heat-conducting member fixing seats are connected one-to-one; the second heat-conducting structure includes multiple second heat-conducting members, and the multiple second heat-conducting members are spaced apart along the first direction and detachably fixed to the two heat-conducting member fixing seats, and any two second heat-conducting members are used to clamp the memory module; the first cold plate dissipates heat to the memory module via the first heat-conducting component, the heat-conducting member fixing seat and the second heat-conducting member, and the first direction and the second direction are arranged at an angle within the extension plane of the first cold plate.

[0013] Optionally, the first heat-conducting structure further includes a fixed plate, the first heat-conducting assembly includes a plurality of first heat-conducting parts, one end of the plurality of first heat-conducting parts is fixed to the fixed plate, and the other end of the plurality of first heat-conducting parts is fixed to the heat-conducting part fixing seat; the fixed plate is also fixed to the first cold plate, and the first heat-conducting parts are in thermal contact with the first cold plate via the fixed plate.

[0014] Optionally, the heat conductor fixing seat is provided with a plurality of fixing grooves, and a plurality of second heat conductors are respectively embedded in the fixing grooves of the two heat conductor fixing seats at both ends along the first direction, and the surface portion of the second heat conductor facing the inner wall of the fixing groove is provided with an anti-scratch film.

[0015] Optionally, two second cold plates are further included, and the two second cold plates are respectively arranged on opposite sides of the first cold plate along the second direction. The two second cold plates are adjacent to and thermally contact the first cold plate, and the two second cold plates are used to dissipate heat for the VR power supply module.

[0016] Optionally, the first cold plate includes a cold plate fixing plate, a cold plate cover plate and a cold plate base plate, the cold plate cover plate and the cold plate base plate are arranged on opposite sides of the cold plate fixing plate, and the cold plate fixing plate, the cold plate cover plate and the cold plate base plate form the liquid containing cavity; the opposite surfaces of the cold plate cover plate and the cold plate base plate are provided with heat dissipation fins.

[0017] Optionally, a thermal pad is attached to a surface portion of the second heat conducting member facing the memory module.

[0018] Optionally, a clamping member is further included, which is provided on the second heat-conducting structure and is used to clamp and fix a plurality of the second heat-conducting members.

[0019] A second aspect of the present application provides an electronic device, comprising:

[0020] The device body and the liquid cooling device described in the first aspect, wherein the liquid cooling device is arranged on the device body.

[0021] Compared to the related art, the liquid cooling device provided by the present application utilizes a first heat-conducting structure to bring the first cold plate and the heat-conducting member fixing assembly into thermal contact. The heat-conducting member fixing assembly is used to make thermal contact with the VR power supply module. At the same time, a plurality of second heat-conducting structures are detachably arranged at intervals on the heat-conducting member fixing assembly. The second heat-conducting structures are used to clamp the memory module to dissipate heat from the memory module. In this way, the heat generated by the VR power supply module is transferred to the first cold plate through the heat-conducting member fixing assembly and the second heat-conducting structure and dissipated, while the heat generated by the memory module is transferred to the first cold plate through the second heat-conducting structure, the heat-conducting member fixing assembly, and the first heat-conducting structure and dissipated. This can achieve flow channel-free heat dissipation for the VR power supply module and the memory module, reducing the difficulty of flow channel setting and the risk of liquid leakage, thereby simplifying the structural layout of the liquid cooling device, improving the convenience of memory maintenance, and improving the reliability of the liquid cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] FIG1 is a top view of a liquid cooling device according to an embodiment of the present application;

[0024] FIG2 is a side view of FIG1;

[0025] FIG3 is a top view of a first heat-conducting structure and a second heat-conducting structure according to an embodiment of the present application;

[0026] FIG4 is a side view of FIG3;

[0027] FIG5 is a top view of a pressing plate according to an embodiment of the present application;

[0028] Figure 6 is a front view of Figure 5;

[0029] FIG7 is a side view of FIG5;

[0030] FIG8 is a top view of a first cold plate and a second cold plate according to an embodiment of the present application;

[0031] FIG9 is a cross-sectional view of FIG8 along line AA';

[0032] FIG10 is a cross-sectional view taken along line BB' of FIG8;

[0033] FIG11 is a schematic structural diagram of a second heat conducting member according to an embodiment of the present application;

[0034] FIG12 is a schematic structural diagram of another second heat conducting member according to an embodiment of the present application. DETAILED DESCRIPTION

[0035] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, each embodiment of the present application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will appreciate that many technical details are provided in each embodiment of the present application to help readers better understand the present application. However, even without these technical details and various variations and modifications based on the following embodiments, the technical solutions claimed in the present application can still be implemented.

[0036] In the embodiments of the present application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" to indicate positions or locations are based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe the present application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0037] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to express a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0038] Furthermore, the terms "installed," "set," "provided with," "opened," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0039] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0040] The normal operation of a data center requires the use of a large number of servers and other electronic equipment. The heat generated by the operation of a large number of servers will have a negative impact on their own performance and service life. Currently, the heat dissipation of servers is mainly carried out through air cooling. However, air cooling has problems with cleanliness and low heat dissipation efficiency, and the continuous operation of air cooling equipment itself will also generate huge energy consumption. Therefore, compared with air cooling, liquid cooling is a better choice. Currently, servers that use heat exchange by injecting coolant into the interior of the equipment to remove the heat of the server are called liquid-cooled servers, among which cold plate liquid cooling technology is the most widely used. However, the existing cold plate liquid cooling technology generally dissipates heat for the server's CPU, and the heat dissipation design for other heat-generating devices inside the server has problems such as complex structure, difficult disassembly and assembly, and low heat dissipation efficiency.

[0041] In order to solve the above technical problems, an embodiment of the present application provides a liquid cooling device, including: a liquid inlet pipe for conveying cooling liquid; a first cold plate having a liquid containing cavity connected to the liquid inlet pipe, the liquid containing cavity for receiving the cooling liquid, and the first cold plate for dissipating heat to the CPU; a plurality of first heat-conducting structures and the first cold plate are arranged at intervals along a first direction, and the plurality of first heat-conducting structures are in thermal contact with the first cold plate; a plurality of heat-conducting member fixing assemblies and the first cold plate are arranged at intervals along the first direction, the heat-conducting member fixing assemblies and the first heat-conducting structures are in thermal contact one-to-one correspondence, and the heat-conducting member fixing assemblies are used to thermally contact with a VR power supply module to dissipate heat to the VR power supply module; a plurality of second heat-conducting structures and the first cold plate are arranged at intervals along the first direction, the second heat-conducting structures are in one-to-one correspondence and are detachably fixed to the heat-conducting member fixing assemblies, and the second heat-conducting structures are used to clamp and fix memory modules and dissipate heat to the memory modules.

[0042] One embodiment of the present application provides an electronic device, including: a device body and the above-mentioned liquid cooling device.

[0043] Compared to the prior art, the liquid cooling device of this embodiment utilizes a first heat-conducting structure to bring the first cold plate and the heat-conducting member fixing assembly into thermal contact. The heat-conducting member fixing assembly is used to make thermal contact with the VR power supply module. At the same time, multiple second heat-conducting structures are detachably arranged at intervals on the heat-conducting member fixing assembly. The second heat-conducting structures are used to clamp the memory module to dissipate heat from the memory module. In this way, the heat generated by the VR power supply module is transferred to the first cold plate through the heat-conducting member fixing assembly and the second heat-conducting structure for dissipation, while the heat generated by the memory module is transferred to the first cold plate through the second heat-conducting structure, the heat-conducting member fixing assembly, and the first heat-conducting structure for dissipation. This allows for flow-free heat dissipation of the VR power supply module and the memory module, reducing the difficulty of flow channel setting and the risk of leakage, thereby simplifying the structural layout of the liquid cooling device and improving the convenience of memory maintenance and the reliability of the liquid cooling device.

[0044] The implementation details of the liquid cooling device of this embodiment are described in detail below. The following content is only provided for ease of understanding and is not necessary for implementing this solution.

[0045] The schematic structural diagram of the liquid cooling device 100 of this embodiment is shown in Figures 1 to 7 , and includes: a liquid inlet pipe 101 for transporting coolant; a first cold plate 102 having a liquid receiving cavity 1021 connected to the liquid inlet pipe 101, the liquid receiving cavity 1021 for receiving the coolant, and the first cold plate 102 for dissipating heat from the CPU 200. A plurality of first heat-conducting structures 103 are spaced apart from the first cold plate 102 along a first direction P1, and the plurality of first heat-conducting structures 103 are in thermal contact with the first cold plate 102. A plurality of heat-conducting member fixing assemblies 104 are spaced apart from the first cold plate 102 along the first direction P1, and the heat-conducting member fixing assemblies 104 are in one-to-one thermal contact with the first heat-conducting structures 103. The heat-conducting member fixing assemblies 104 are in thermal contact with the VR power supply module 300 to dissipate heat from the VR power supply module 300. Multiple second heat-conducting structures 105 are arranged at intervals along the first direction P1 along the first cold plate 102. The second heat-conducting structures 105 correspond one-to-one and are detachably fixed to the heat-conducting component fixing assembly 104. The second heat-conducting structures 105 are used to clamp and fix the memory module 400 and dissipate heat for the memory module 400.

[0046] It should be noted that the solid arrows in FIG. 1 schematically illustrate the flow path of the coolant in the cooling channel of the liquid cooling device 100 .

[0047] With this arrangement, the heat generated by the VR power supply module 300 is transferred to the first cold plate 102 through the heat conductive member fixing assembly 104 and the second heat conductive structure 105 and dissipated, while the heat generated by the memory module 400 is transferred to the first cold plate 102 through the second heat conductive structure 105, the heat conductive member fixing assembly 104 and the first heat conductive structure 103 and dissipated. This can achieve flow channel-free heat dissipation for the VR power supply module 300 and the memory module 400, reducing the difficulty of flow channel setting and the risk of liquid leakage, thereby simplifying the structural layout of the liquid cooling device, improving the convenience of memory maintenance and the reliability of the liquid cooling device.

[0048] Referring to FIG8 and FIG10 , in some embodiments, the first cold plate 102 includes a cold plate fixing plate 1022, a cold plate cover plate 1023, and a cold plate base plate 1024. The cold plate cover plate 1023 and the cold plate base plate 1024 are disposed on opposite sides of the cold plate fixing plate 1022. The cold plate fixing plate 1022, the cold plate cover plate 1023, and the cold plate base plate 1024 enclose the liquid containing cavity 1021. Heat dissipation fins 1025 are disposed on opposing surfaces of the cold plate cover plate 1023 and the cold plate base plate 1024.

[0049] Specifically, a liquid inlet connector 1023a and a liquid outlet connector 1023b are provided on the side of the cold plate cover 1023 facing away from the cold plate base 1024. The liquid inlet pipe 101 is connected to the liquid inlet connector 1023a, and the coolant enters the liquid holding cavity 1021 via the liquid inlet connector 1023a from the liquid inlet pipe 101, thereby achieving liquid cooling and heat dissipation. The cold plate cover 1023 and the cold plate base 1024 are both provided with heat dissipation fins 1025 on the opposing surfaces thereof, i.e., the inner wall surfaces forming the liquid holding cavity 1021. The heat dissipation fins 1025 can further increase the contact area between the coolant and the cold plate cover 1023 and the cold plate base 1024, thereby improving heat dissipation efficiency. More specifically, the cold plate cover 1023 is connected to the first heat-conducting structure 103 to dissipate heat from the VR power supply module 300 via the first heat-conducting structure 103, and dissipate heat from the memory module 400 via the first heat-conducting structure 103 and the second heat-conducting structure 105. The CPU 200 is attached to a side of the cold plate base plate 1024 facing away from the cold plate cover 1023, and the cold plate base plate 1024 dissipates heat from the CPU 200.

[0050] Please refer to FIG. 10 again. In some feasible solutions, the cold plate fixing plate 1022 is provided with reinforcing ribs 1026 , which can improve the pressure resistance of the first cold plate 102 .

[0051] Referring again to Figures 1 and 8 , the liquid cooling device further includes a liquid cooling head 106 and a liquid outlet pipe 107. The liquid inlet pipe 101 and the liquid outlet pipe 107 are both connected to the liquid cooling head 106. The liquid outlet pipe 107 is also connected to the liquid outlet connector 1023b. The liquid cooling head 106 is connected to an external liquid supply device to receive the coolant, allowing the coolant to enter the liquid receiving chamber 1021 through the liquid inlet pipe 101. The liquid outlet pipe 107 is used to drain the coolant, allowing the coolant to flow from the liquid receiving chamber 1021 to the liquid cooling head 106 and then enter the external liquid supply device, thereby achieving circulating liquid cooling.

[0052] It can be understood that the liquid cooling head 106 is a dual-channel liquid cooling head, that is, the channel of the liquid cooling head 106 connected to the liquid inlet pipe 101 and the channel connected to the liquid outlet pipe 107 are independent of each other.

[0053] To ensure the sealing of the first cold plate 102, the cold plate fixing plate 1022, the cold plate cover plate 1023, and the cold plate base plate 1024 can be welded together by vacuum brazing or friction stir welding. Similarly, the liquid inlet connector 1023a and the liquid outlet connector 1023b can also be welded to the cold plate cover plate 1023 using the same welding method.

[0054] In some other feasible solutions, considering that the power consumption of the memory module 400 is smaller than that of the CPU 200, the heat dissipation fins 1025 of the cold plate cover 1023 are replaced by a traditional serpentine flow channel design. The serpentine flow channel can be formed by CNC processing, which can reduce the manufacturing difficulty of the liquid cooling device.

[0055] Referring again to FIG. 1 , in some embodiments, there are two first heat-conducting structures 103, each disposed on opposite sides of the first cold plate 102 along the first direction P1 and in thermal contact with the first cold plate 102. There are two heat-conducting member fixing assemblies 104, each disposed on opposite sides of the first cold plate 102 along the first direction P1 and fixedly connected to the first heat-conducting structures 103. There are two second heat-conducting structures 105, each disposed on opposite sides of the first cold plate 102 along the first direction P1 and detachably fixed to the heat-conducting member fixing assemblies 104.

[0056] Specifically, the liquid cooling device 100 is arranged in a symmetrical layout, which makes the overall layout of the liquid cooling device 100 more beautiful and simple, and is conducive to the installation and maintenance of the liquid cooling device 100.

[0057] It is understandable that when there are other needs, more of the first heat-conducting structure 103, the heat-conducting component fixing assembly 104 and the second heat-conducting structure 105 can be provided, and the number of the first heat-conducting structures 103 located on the opposite sides of the first cold plate 102 can be the same or different, and the same applies to the heat-conducting component fixing assembly 104 and the second heat-conducting structure 105.

[0058] Please refer again to Figures 3 and 5. In some embodiments, the first heat-conducting structure 103 includes two first heat-conducting components 1031, which are respectively arranged on opposite sides of the first cold plate 102 along the second direction P1. The heat-conducting member fixing component 104 includes two heat-conducting member fixing seats 1041, which are spaced apart along the second direction P2. The two first heat-conducting components 1031 and the two heat-conducting member fixing seats 1041 are connected in a one-to-one correspondence. The second heat-conducting structure 105 includes a plurality of second heat-conducting members 1051, which are spaced apart along the first direction P1 and detachably fixed to the two heat-conducting member fixing seats 1041. Any two second heat-conducting members 1051 are used to clamp the memory module 400. The first cold plate 102 dissipates heat from the memory module 400 via the first heat conducting assembly 1031 , the heat conducting member fixing seat 1041 and the second heat conducting member 1051 . The first direction P1 and the second direction P2 are arranged at an angle within the extension plane of the first cold plate 102 .

[0059] Specifically, the bottom surface of the heat conducting member fixing base 1041 can be used to fix the VR power supply module 300. The heat generated by the VR power supply module 300 during operation is transferred to the first heat conducting component 1031 through the heat conducting member fixing base 1041, and then transferred to the cold plate cover 1023 by the first heat conducting component 1031, and finally carried away by the coolant. The second heat conducting member 1051 can be plate-shaped or sheet-shaped, and its two ends can be detachably fixed to the two heat conducting member fixing bases 1041, and any two adjacent second heat conducting members 1051 can clamp and fix a memory stick. The heat generated by the memory stick during operation is transferred to the second heat conducting member 1051, and then transferred to the cold plate cover 1023 through the heat conducting member fixing base 1041 and the first heat conducting component 1031. In order to improve the heat conduction efficiency, a thermal conductive gasket 1041a can be provided on the surface where the thermal conductive member fixing seat 1041 contacts the VR power supply module 300 to fill the gap between the thermal conductive member fixing seat 1041 and the VR power supply module 300. Similarly, a thermal conductive gasket can also be provided on the surface where the second thermal conductive member 1051 contacts the memory stick, that is, the surface facing the memory module 400.

[0060] Please refer to Figures 11 and 12 . Furthermore, a groove can be provided on the side wall of the second heat conducting member 1051 that contacts the memory module, and a heat pipe 1051a can be embedded in the groove. The heat pipe can be flattened or can be a vapor chamber. This can improve the heat dissipation efficiency of the memory module 400. Figures 11 and 12 illustrate two different ways of disposing the heat pipe 1051a.

[0061] Preferably, the first direction P1 and the second direction P2 are perpendicular to each other, and a plurality of second heat-conducting structures 105 are respectively disposed on opposite sides of the first cold plate 102 , so that interference between different first heat-conducting structures 103 can be avoided as much as possible.

[0062] Referring again to Figures 5 to 8 , in some embodiments, the first heat-conducting structure 103 further includes a fixing plate 1032, and the first heat-conducting assembly 1031 includes a plurality of first heat-conducting members 1031a, one end of each of the plurality of first heat-conducting members 1031a being fixed to the fixing plate 1032, and the other end of each of the plurality of first heat-conducting members 1031a being fixed to the heat-conducting member fixing seat 1041. The fixing plate 1032 is also fixed to the first cold plate 102, and the first heat-conducting members 1031a are in thermal contact with the first cold plate 102 via the fixing plate 1032.

[0063] Specifically, the first heat conducting member 1031a can be L-shaped, with one end thereof facing the cold plate cover 1023 being attached to the fixing plate 1032. The fixing plate 1032 is attached to and fixed to the cold plate cover 1023. The fixing plate 1032 increases the contact area between the first heat conducting member 1031a and the cold plate cover 1023, thereby improving heat dissipation efficiency. Furthermore, in order to prevent the first heat conducting member 1031a from separating from the fixing plate 1032, a pressing plate 1033 can be provided and fixed to the cold plate cover 1023. The overlapping end of the first heat conducting member 1031a and the cold plate cover 1023, as well as the fixing plate 1032, are both sandwiched between the pressing plate 1033 and the cold plate cover 1023. The pressing plate 1033 and the cold plate cover 1023 can be fixed by screws, rivets, or the like. More specifically, in order to avoid the liquid inlet connector 1023a and the liquid outlet connector 1023b, the pressure plate 1033 can be designed to be H-shaped, and the arms extending at both ends can be used to press the first heat conductor 1031a and the fixed plate 1032, while the gap between the two arms on the same side can avoid the connector.

[0064] Optionally, the first heat conductor 1031a may be a flat heat pipe or a temperature equalizing plate, so that flow-channel-free cooling and heat dissipation can be achieved, the risk of liquid leakage can be reduced, and the reliability of the liquid cooling device 100 can be improved.

[0065] Please refer to Figures 5 and 6 again. In some feasible solutions, the heat conductive member fixing seat 1041 is provided with a plurality of fixing grooves 1041b, and a plurality of second heat conductive members 1051 are respectively embedded in the fixing grooves 1041b of the two heat conductive member fixing seats 1041 at both ends along the first direction P1, and the surface portion of the second heat conductive member 1051 facing the inner wall of the fixing groove 1041b is provided with an anti-scratch film.

[0066] Specifically, the heat conducting member fixing seat 1041 is provided with a plurality of mutually spaced fixing grooves 1041b, each of which extends along the second direction P2. Each fixing groove 1041b is embedded with an end portion of the second heat conducting member 1051. Because the second heat conducting member 1051 needs to be plugged in and out when maintaining the memory module 400, an anti-scratch film can be provided on the surface of the second heat conducting member 1051 embedded in the fixing groove 1041b to prevent damage to the second heat conducting member 1051 during repeated plugging and unplugging. The anti-scratch film can be a PI film, a metal film, or the like. Furthermore, the anti-scratch film is provided on the side of the thermal pad on the second heat conducting member 1051 facing away from the second heat conducting member 1051.

[0067] It is understood that the electronic device includes a memory slot for fixing and electrically connecting the memory module 400. When the memory module 400 is fixed to the memory slot, the second heat conductor 1051 dissipates heat by the portion of the memory module 400 exposed outside the memory slot. Therefore, the height of the heat conductor fixing seat 1041 can be raised by providing a bracket 108, thereby raising the height of the second heat conductor 1051. Based on heat dissipation and comprehensive consideration of the electronic device, the bracket 108 can be used to enable the liquid cooling device 100 to support a server with a height of 1U (1U = 4.445 cm).

[0068] Please refer to Figure 3 again. In some feasible solutions, since a second heat-conducting structure 105 includes multiple second heat-conducting parts 1051, in order to make each second heat-conducting part 1051 fit tightly with the memory module 400 so that the second heat-conducting part 1051 can effectively dissipate heat from the memory module 400, the liquid cooling device 100 may further include a clamping part 109, which is provided on the second heat-conducting structure 105 and is used to clamp and fix the multiple second heat-conducting parts.

[0069] For example, the clamping member 109 may be a fastener or a clip for clamping a plurality of the second heat conducting members 1051 , and each of the second heat conducting members 1051 may be tightly clamped to the memory module 400 by applying force from both sides toward the middle of the second heat conducting structure 105 .

[0070] Please refer to Figure 8 again. In some feasible solutions, two second cold plates 110 are further included. The two second cold plates 110 are respectively arranged on opposite sides of the first cold plate 102 along the second direction P2. The two second cold plates 110 are adjacent to and thermally contact the first cold plate 102. The two second cold plates 110 are used to dissipate heat for the VR power supply module 300.

[0071] In fact, the number of the VR power supply modules 300 can be adjusted according to actual needs. When one VR power supply module 300 is added on opposite sides of the CPU 200 along the second direction P2, heat dissipation needs to be performed through the newly added second cold plate 110.

[0072] In the present application, the coolant can be deionized water, propylene glycol aqueous solution, ethylene glycol aqueous solution or other coolants. The first cold plate 102, the first heat-conducting structure 103, the heat-conducting component fixing seat 1041, and the second heat-conducting structure 105 can be made of aluminum, copper, aluminum alloy or other metals with good thermal conductivity. The specific material selection can be determined according to the coolant used. It should be noted that, since among these heat dissipation structures, only the first cold plate 102 is in direct contact with the coolant, the heat dissipation structures other than the first cold plate 102 do not need to consider compatibility with the coolant.

[0073] It should be noted that all the above feasible solutions can be set up separately, or can be arbitrarily combined according to actual conditions without conflicting with each other. The specific combination method can be adjusted according to actual needs under the guidance of this application and will not be elaborated here.

[0074] The liquid cooling device 100 provided in this application has at least one of the following beneficial effects:

[0075] 1. The first heat-conducting structure 103 , the heat-conducting member fixing seat 1041 , and the second heat-conducting structure 105 are used to concentrate the heat generated by the VR power supply module 300 and the memory module 400 to the first cold plate 102 for heat dissipation, thereby reducing the risk of liquid leakage and improving the reliability of the liquid cooling device 100 .

[0076] 2. The pipeline layout of the liquid cooling device is simple. The first cold plate 102 adopts a double-sided liquid cooling design with a compact structure, fewer pipe joints, easy installation and maintenance, and reduced leakage costs.

[0077] 3. The second heat-conducting structure 105 is pluggably disposed on the heat-conducting member fixing seat 1041 , which can improve the convenience of maintaining the memory module 400 .

[0078] 4. The liquid cooling device 100 can support the cooling requirements of a 1U server, increase the liquid cooling ratio, and reduce PUE (Power Usage Effectiveness, data center energy efficiency).

[0079] Another embodiment of the present application provides an electronic device, comprising: a device body and the liquid cooling device 100 described in the above embodiment, wherein the liquid cooling device is arranged on the device body.

[0080] The electronic device in this application may be a server, a computer, or other electronic device that uses the liquid cooling device 100 provided in this application, and is not specifically limited here.

[0081] The above is a detailed introduction to the liquid cooling device and electronic equipment provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the ideas of the present application. There may be changes in the specific embodiments and application scope. In summary, the contents of this specification should not be understood as limiting the present application.

Claims

1. A liquid cooling device, characterized in that: include: A liquid inlet pipe, used for conveying coolant; A first cold plate, having a liquid containing cavity connected to the liquid inlet pipe, the liquid containing cavity is used to receive the cooling liquid, and the first cold plate is used to dissipate heat for the CPU; A plurality of first heat-conducting structures are arranged at intervals along a first direction with the first cold plate, and the plurality of first heat-conducting structures are in thermal contact with the first cold plate; A plurality of heat-conducting member fixing assemblies are arranged at intervals with the first cold plate along the first direction, the heat-conducting member fixing assemblies are in thermal contact with the first heat-conducting structure in a one-to-one correspondence, and the heat-conducting member fixing assemblies are used to be in thermal contact with the VR power supply module to dissipate heat from the VR power supply module; A plurality of second heat-conducting structures are arranged at intervals along the first direction with the first cold plate, the second heat-conducting structures correspond one to one and are detachably fixed to the heat-conducting member fixing assembly, and the second heat-conducting structures are used to clamp and fix the memory module and dissipate heat for the memory module.

2. The liquid cooling device according to claim 1, characterized in that: There are two first heat-conducting structures, and the two first heat-conducting structures are respectively arranged on opposite sides of the first cold plate along the first direction and in thermal contact with the first cold plate; there are two heat-conducting component fixing assemblies, and the two heat-conducting component fixing assemblies are respectively arranged on opposite sides of the first cold plate along the first direction and are respectively fixedly connected to the two first heat-conducting structures; there are two second heat-conducting structures, and the two second heat-conducting structures are respectively arranged on opposite sides of the first cold plate along the first direction and are respectively detachably fixed to the heat-conducting component fixing assemblies.

3. The liquid cooling device according to claim 2, characterized in that: The first heat-conducting structure comprises two first heat-conducting components, which are respectively arranged on opposite sides of the first cold plate along the second direction; the heat-conducting member fixing component comprises two heat-conducting member fixing seats, which are arranged at intervals along the second direction, and the two first heat-conducting components and the two heat-conducting member fixing seats are connected one by one; the second heat-conducting structure comprises a plurality of second heat-conducting members, which are spaced along the first direction and detachably fixed to the two heat-conducting member fixing seats, and any two of the second heat-conducting members are used to clamp the memory module; The first cold plate dissipates heat from the memory module via the first heat-conducting component, the heat-conducting member fixing seat and the second heat-conducting member, and the first direction and the second direction are arranged at an angle within an extension plane of the first cold plate.

4. The liquid cooling device according to claim 3, characterized in that: The first heat-conducting structure also includes a fixing plate, the first heat-conducting assembly includes a plurality of first heat-conducting parts, one end of the plurality of first heat-conducting parts is fixed to the fixing plate, and the other end of the plurality of first heat-conducting parts is fixed to the heat-conducting part fixing seat; the fixing plate is also fixed to the first cold plate, and the first heat-conducting parts are in thermal contact with the first cold plate via the fixing plate.

5. The liquid cooling device according to claim 3, characterized in that: The heat conducting member fixing seat is provided with a plurality of fixing grooves, and the two ends of the plurality of second heat conducting members along the first direction are respectively embedded in the fixing grooves of the two heat conducting member fixing seats, and the surface of the second heat conducting member facing the inner wall of the fixing groove is partially provided with an anti-scratch film.

6. The liquid cooling device according to claim 3, characterized in that: It also includes two second cold plates, which are respectively arranged on opposite sides of the first cold plate along the second direction, the two second cold plates are adjacent to and thermally contact the first cold plate, and the two second cold plates are used to dissipate heat for the VR power supply module.

7. The liquid cooling device according to claim 1, characterized in that: The first cold plate comprises a cold plate fixing plate, a cold plate cover plate and a cold plate base plate, wherein the cold plate cover plate and the cold plate base plate are arranged on opposite sides of the cold plate fixing plate, and the cold plate fixing plate, the cold plate cover plate and the cold plate base plate surround the liquid containing cavity; The surfaces opposite to the cold plate cover and the cold plate base are both provided with heat dissipation fins.

8. The liquid cooling device according to any one of claims 3 to 7, characterized in that: A thermal conductive pad is attached to a surface portion of the second heat conducting member facing the memory module.

9. The liquid cooling device according to any one of claims 3 to 7, characterized in that: It also includes a clamping member, which is arranged on the second heat-conducting structure and is used to clamp and fix a plurality of the second heat-conducting members.

10. An electronic device, characterized in that: It comprises a device body and a liquid cooling device as described in any one of claims 1 to 9, wherein the liquid cooling device is arranged on the device body.

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