Compression molding device and compression molding method

Abstract

The present invention addresses the problem of providing a compression molding device and a compression molding method that are capable of preventing the occurrence of molding defects caused by scattering unevenness, residual gas, and dust generation during molding, and that are capable of preventing the formation of thin burrs of a sealing resin at an exposed portion of a molded product. As a solution, provided is a compression molding device (1) that processes a workpiece (W) into a molded product (Wp) by sealing the workpiece (W) with a sealing resin (R) by using a sealing mold (202) provided with a first mold (204) and second mold (206) of which one serves as an upper mold and the other serves as a lower mold. The sealing resin (R) is formed into a lattice shape having through holes (Rh). The first mold (204) has a cavity (208) configured as a recess having bottom sections formed by cavity pieces (226). The second mold (206) includes a workpiece holding part (205) that holds the workpiece (W).

Description

Compression molding device and compression molding method

[0001] The present invention relates to a compression molding apparatus and a compression molding method.

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and resin sealing method for sealing a workpiece having electronic components mounted on a substrate with sealing resin to process it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a resin-encapsulating technique in which a predetermined amount of encapsulating resin is supplied to an encapsulation area (cavity) provided in an encapsulating mold comprising an upper mold and a lower mold, a workpiece is placed in the encapsulating area, and the upper and lower molds are clamped together to encapsulate the workpiece. For example, when using an encapsulating mold with a cavity in the upper mold, a technique is known in which the encapsulating resin is supplied all at once to the center of the workpiece for molding. On the other hand, when using an encapsulating mold with a cavity in the lower mold, a technique is known in which the encapsulating resin is supplied and molded together with a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity (see Patent Document 1: International Publication WO 2015 / 159743).

[0004] International Publication No. WO2015 / 159743

[0005] Conventionally, the compression molding method, in which the workpiece is held in the upper mold, a cavity is created in the lower mold, and the sealing resin (granular resin, for example) is supplied into the cavity, has been widely adopted, as it was thought to have advantages in terms of preventing deformation of the workpiece due to the flow and contact of the sealing resin.

[0006] However, in a configuration in which a workpiece is held in an upper mold and a cavity is provided in a lower mold, there are issues such as difficulty in holding the workpiece in the upper mold when the workpiece is thin or large, making it prone to falling. Furthermore, when granular resin is used as the encapsulating resin, there are issues such as dust generation during molding due to friction between resin particles, difficulty in handling, and difficulty in evenly supplying (spraying) the encapsulating resin over the entire area of ​​the cavity provided in the lower mold, which can easily result in uneven spreading. Furthermore, there is an issue of molding defects easily occurring, such as air trapped in the gaps between the particles during spraying and gas components degassed from the encapsulating resin during melting remaining as voids in the molded product.

[0007] On the other hand, regardless of the arrangement of the cavities, when forming a molded product in which electronic components such as a heat sink or a flip-chip connected chip are exposed, there is a problem that thin burrs of the sealing resin are likely to form on the exposed parts of the molded product (for example, on the top surface of the electronic components), resulting in incomplete exposure.

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding apparatus and a compression molding method that can prevent molding defects caused by uneven sprinkling, residual gas, and dust generation during molding, and that can prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] In one embodiment, the sealing resin is a compression molding device that uses a sealing mold having a first mold and a second mold, one of which is an upper mold and the other is a lower mold, to seal a workpiece with sealing resin and process it into a molded product, and the sealing resin is formed in a lattice shape with through holes, the first mold has a cavity configured as a recess with a cavity piece forming the bottom, and the second mold has a work holding portion that holds the workpiece.

[0011] The sealing resin is preferably a solid resin formed by tableting a powder resin, or a sheet-like resin.

[0012] Furthermore, it is preferable that the first mold further has a movable piece that is arranged inside the cavity at a position corresponding to the through hole in the sealing resin and is movable up and down, and that when the sealing mold is closed, the movable piece enters the through hole and abuts against the upper surface of the workpiece.

[0013] Furthermore, it is preferable that the workpiece has a configuration in which electronic components are mounted on a base material, the sealing resin has a configuration in which a heat sink is fixed to block the through holes, and a member having elasticity and thermal conductivity is provided between the surface of the electronic components of the workpiece facing the heat sink and the surface of the sealing resin of the heat sink placed on the workpiece or inside the cavity facing the electronic components.

[0014] Furthermore, one embodiment of a compression molding method is a compression molding method for sealing a workpiece with sealing resin and processing it into a molded product using a sealing mold comprising a first mold and a second mold, one of which is an upper mold and the other is a lower mold, wherein the sealing resin is a sealing resin formed in a lattice pattern with through holes, and the method comprises: a work holding step for holding the workpiece in the second mold; a resin placing step for placing the sealing resin on the workpiece if the first mold is the upper mold, or placing the sealing resin inside the cavity of the first mold if the first mold is the lower mold; and a mold closing step for closing the sealing mold to seal the workpiece with the sealing resin and process it into the molded product.

[0015] The compression molding device and compression molding method of the present invention can prevent molding defects caused by uneven sprinkling, residual gas, and dust generated during molding, and can also prevent the formation of thin burrs in the sealing resin on exposed areas of the molded product.

[0016] FIG. 1 is a plan view showing an example of a compression molding apparatus according to an embodiment of the present invention. FIG. 2 is a side view showing an example of a press device of a compression molding apparatus according to a first embodiment of the present invention. FIG. 3 is a front sectional view showing an example of a sealing mold of a compression molding apparatus according to a first embodiment of the present invention. FIG. 4 is an explanatory view illustrating an example of a compression molding method using a compression molding apparatus equipped with the press device shown in FIG. 2 and the sealing mold shown in FIG. 3. FIG. 5 is an explanatory view continuing from FIG. 4. FIG. 6 is an explanatory view continuing from FIG. 5. FIG. 7 is an explanatory view continuing from FIG. 6. FIG. 8 is an explanatory view continuing from FIG. 7. FIG. 9 is an explanatory view continuing from FIG. 8. FIG. 10 is a front sectional view showing another example of a sealing mold of the compression molding apparatus according to the first embodiment of the present invention. FIG. 11 is an explanatory view explaining an example of a compression molding method using a compression molding apparatus equipped with the press device shown in FIG. 2 and the sealing mold shown in FIG. 10. FIG. 12 is an explanatory view continuing from FIG. 11. FIG. 13 is an explanatory view continuing from FIG. 12. FIG. 14 is an explanatory view continuing from FIG. 13. FIG. 15 is a side view showing an example of a press device of a compression molding apparatus according to a second embodiment of the present invention. FIG. 16 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to a second embodiment of the present invention. FIG. 17 is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus equipped with the press apparatus shown in FIG. 15 and the sealing mold shown in FIG. 16. FIG. 18 is an explanatory diagram continuing from FIG. 17. FIG. 19 is an explanatory diagram continuing from FIG. 18. FIG. 20 is an explanatory diagram continuing from FIG. 19. FIG. 21 is an explanatory diagram continuing from FIG. 20. FIG. 22 is an explanatory diagram continuing from FIG. 21. FIG. 23 is a front cross-sectional view showing another example of a sealing mold of a compression molding apparatus according to a second embodiment of the present invention. FIG. 24 is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus equipped with the press apparatus shown in FIG. 15 and the sealing mold shown in FIG. 23. FIG. 25 is an explanatory diagram continuing from FIG. 24. FIG. 26 is an explanatory diagram continuing from FIG. 25. FIG. 27 is an explanatory diagram continuing from FIG. 26. FIG. 28 is a perspective view showing an example of a workpiece that serves as a molded article in the compression molding apparatus and compression molding method according to an embodiment of the present invention. FIG. 29 is a perspective view showing an example of a sealing resin used in the compression molding apparatus and compression molding method according to an embodiment of the present invention. FIG. 30 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG.Fig. 31 is a perspective view showing another example of a sealing resin used in the compression molding apparatus and compression molding method according to the embodiment of the present invention, and Fig. 32 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in Fig. 31.

[0017] [First embodiment] A compression molding apparatus 1 according to this embodiment is an apparatus for resin-encapsulating (compression-molding) a workpiece (molded product) W using a sealing mold 202 including a first mold (in this embodiment, an upper mold) 204 and a second mold (in this embodiment, a lower mold) 206. Hereinafter, as the compression molding apparatus 1, a compression molding apparatus will be described as an example in which the workpiece W is held by a workpiece holding portion 205 provided on the lower mold 206, a cavity 208 (including a part of the mold surface 204a) provided on the upper mold 204 in a corresponding arrangement is covered with a release film F, and the upper mold 204 and the lower mold 206 are clamped together to encapsulate the workpiece W with encapsulating resin R.

[0018] The workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa (see FIG. 28 ). More specifically, examples of the substrate Wa include plate-shaped components such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of the electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive materials, spacers, and coil sheets (note that the workpiece W may be configured solely from electronic components Wb). The shape of the substrate Wa is typically rectangular (strip-shaped), square, circular, or the like. The number of electronic components Wb mounted on one substrate Wa is set to one or more.

[0019] Examples of methods for mounting electronic components Wb on the substrate Wa include flip-chip mounting and wire bonding. Alternatively, in a configuration in which the substrate (glass or metal carrier plate) Wa is peeled from the molded product Wp after resin sealing, the electronic components Wb can be attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that hardens when exposed to ultraviolet light. In this embodiment, an example is described in which the electronic components Wb are flip-chip connected to the substrate Wa via bumps We, but this is not limiting. Alternatively, a partial region of the substrate Wa can be exposed and resin-sealed, and the electronic components Wb can be mounted on the exposed region after resin sealing.

[0020] A thermosetting resin (for example, but not limited to, an epoxy resin containing a filler) is used as the sealing resin R. The sealing resin R is formed as a solid resin having a predetermined shape whose overall shape corresponds to the shape of the workpiece W. Usually, one resin constitutes the "whole" amount of sealing required (one amount per workpiece W), but it may also be configured so that several pieces (for example, two or three pieces) are divided into pieces to constitute the "whole" amount of sealing required.

[0021] The "predetermined shape" refers to a grid-like shape that is generally plate-like and has through-holes Rh penetrating the surface of the main body portion Ra (see FIG. 29). Here, the term "grid-like" in this application refers to a matrix shape, including a single column, but is not limited thereto. It may also be a matrix shape with multiple rows or columns, or a random shape. By performing resin encapsulation (compression molding) using the encapsulating resin R (hereinafter sometimes referred to as "R1"), it is possible to prevent the formation of thin burrs on the top surface Wbf of the electronic component Wb and form a molded product Wp (see FIG. 30) in which the top surface Wbf is reliably exposed (details of the encapsulating method will be described later). The through-holes Rh must be slightly larger than the individual electronic components Wb and have the same shape as the electronic components Wb. Furthermore, the resin volume (height) of the encapsulating resin R (R1) must be sufficient to allow the resin to penetrate under the electronic components Wb and seal them properly.

[0022] Furthermore, the term "solid" does not refer to a completely solid state, but rather includes a state melted to the so-called B stage or a state immediately before melting. A solid resin formed by tableting a powder resin is preferably used as the solid encapsulating resin R. This allows for extremely accurate adjustment and supply of the resin amount compared to tableted resins formed using granular or crushed resins. However, the present invention is not limited to powder resins; granular resins, crushed resins, solid resins, liquid resins, or a combination of these may also be used. Furthermore, sheet-like resins are also preferably used as the solid encapsulating resin R. Compared to conventional granular resins, the use of solid encapsulating resin R can solve the problems of dust generation during molding, difficult handling, and uneven distribution. Furthermore, the suppression of voids allows for reliable mold underfill, particularly for flip-chip-connected electronic components Wb.

[0023] As examples of the film F, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride, are preferably used.

[0024] Next, an overview of the compression molding apparatus 1 according to this embodiment will be described. As shown in FIG. 1 , the compression molding apparatus 1 mainly includes a supply unit 10A that supplies the workpieces W and the sealing resin R, a press unit 10B that seals the workpieces W with the sealing resin R and processes them into molded products Wp, and a storage unit 10C that stores the molded products Wp. As an example, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in FIG. 1 . However, the above configuration is not limited to this, and the equipment configuration within the units, the number of units, and the order in which the units are arranged may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in reverse in the X direction, or may be aggregated in one position (not shown). Furthermore, a configuration including units other than those described above may also be used (not shown).

[0025] Furthermore, the compression molding apparatus 1 has a guide rail 20 linearly arranged between each unit, and a conveying device (first loader) 22 for conveying the workpiece W and the encapsulating resin R (which may also be used for conveying items other than the workpiece W and the encapsulating resin R) and a conveying device (second loader) 24 for conveying the molded product Wp (which may also be used for conveying items other than the molded product Wp) are arranged to be movable between predetermined units along the guide rail 20. However, the configuration is not limited to the above, and a configuration may also be provided with a common (single) conveying device (loader) for conveying the workpiece W, the encapsulating resin R, the molded product Wp, etc. (not shown). Furthermore, the conveying device may be configured to include a robot hand or the like instead of a loader.

[0026] In addition, in the compression molding apparatus 1, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (although it may be disposed in another unit).

[0027] (Supply Unit) Next, the supply unit 10A provided in the compression molding apparatus 1 will be described in detail.

[0028] The supply unit 10A includes a work supply magazine 12 that stores a plurality of workpieces W. Here, a known stack magazine, slit magazine, or the like is used as the work supply magazine 12. The supply unit 10A may also be configured to include a work stage (not shown) or the like on which the workpieces W taken out from the work supply magazine 12 are placed.

[0029] The supply unit 10A also includes a resin supply section 14 that supplies the sealing resin R. Here, a known stack magazine, slit magazine, or the like is used as the resin supply section 14. The supply unit 10A may also be configured to include a resin stage (not shown) on which the sealing resin R removed from the resin supply section 14 is placed. The resin supply section 14 may also be configured to be disposed in the press unit 10B or the storage unit 10C (not shown). Alternatively, as another example, the resin supply section 14 may be disposed outside the compression molding apparatus 1 and transported into the apparatus using a transport device such as a belt conveyor or a robot hand (not shown).

[0030] The workpiece W and the sealing resin R are held by the first loader 22 and carried into the press unit 10B, and set at a predetermined position in the sealing mold 202. In this embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower mold 206, and the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (details of this process will be described later). Note that the holding mechanism for the workpiece W and the sealing resin R in the first loader 22 uses a known holding mechanism (for example, a clamping configuration with holding claws, a suction configuration with suction holes communicating with a suction device, etc.) (not shown).

[0031] As a variation of the above-described conveying device, instead of the first loader 22 that moves in the X and Y directions, a configuration may be adopted in which a conveying device (loader) that moves in the X direction to convey between units and a conveying device (loader) that moves in the Y direction to carry in and set into the sealing mold 202 are separately provided (not shown).

[0032] The supply unit 10A also includes a preheater (not shown) that preheats the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used as the preheater. This allows the workpiece W and the sealing resin R to be preheated before being carried into the sealing mold 202. Note that a configuration without a preheater is also possible. Furthermore, instead of or in addition to the preheater, a configuration in which a preheating heater (not shown) is provided in the first loader 22 may also be used.

[0033] (Press Unit) Next, the press unit 10B included in the compression molding apparatus 1 will be described in detail.

[0034] In this embodiment, two press units 10B (three or more or one press unit) are provided. The press unit 10B includes a sealing mold 202 having a pair of molds that can be opened and closed (for example, a mold block made of alloy tool steel, a mold plate, a mold pillar, and other components assembled together). The press unit 10B also includes a press device 250 that opens and closes the sealing mold 202 to seal the workpiece W with resin. As an example, the press unit 10B is configured to include one press device 250, but multiple press devices (not shown) may also be provided. FIG. 2 shows a side view (schematic) of the press device 250 provided in the press unit 10B, and FIG. 3 shows a front cross-sectional view (schematic) of the sealing mold 202.

[0035] 2 , the press device 250 includes a pair of platens 254, 256, a plurality of tie bars 252 between which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device includes a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (but is not limited to this). In this embodiment, the upper platen 254 in the vertical direction is configured as a fixed platen (a platen fixed to the tie bars 252), and the lower platen 256 is configured as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, the present invention is not limited to this configuration, and the platens may be configured upside down, i.e., the upper platen may be configured as a movable platen and the lower platen as a fixed platen, or both the upper and lower platens may be configured as movable platens (all not shown).

[0036] 3, the sealing mold 202 includes a first mold (upper mold) 204 (204A) and a second mold (lower mold) 206 as a pair of molds disposed between the pair of platens 254, 256 in the press device 250. The upper mold 204 (204A) is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper mold 204 (204A) and the lower mold 206 move toward and away from each other to close and open the mold (the mold opening and closing direction is the vertical direction (up and down direction)).

[0037] In addition, in this embodiment, as an example, a film supply mechanism 211 is provided that transports (supplies) a roll-shaped film F into the sealing mold 202. Depending on the configuration of the workpiece W, the film F may be in the form of a strip instead of a roll.

[0038] Next, a detailed description will be given of the lower mold 206 of the sealing mold 202. As shown in Fig. 3, the lower mold 206 includes a second chase 240, a second plate 242 held by the second chase, and the like.

[0039] In this embodiment, a workpiece holding portion 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the second plate 242. As an example, the workpiece holding portion 205 includes a workpiece guide pin (not shown) and a suction passage (e.g., a hole or groove) that penetrates the second plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage leads to the die surface 206a of the lower mold 206, and the other end connects to a suction device disposed outside the lower mold 206. This allows the suction device to be driven to suck the workpiece W through the suction passage, thereby suctioning and holding the workpiece W to the die surface 206a (here, the upper surface of the second plate 242). Instead of or in addition to the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of workpiece holding portions 205 provided on one lower mold 206 are appropriately determined depending on the shape and number of workpieces W (one or multiple).

[0040] Furthermore, in this embodiment, a lower die heating mechanism (not shown) is provided that heats the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the second chase 240 and is configured to apply heat to the entire lower die 206 and the workpiece W held by the workpiece holding unit 205. The heater heats the lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0041] Next, the upper mold 204 (204A) of the sealing mold 202 will be described in detail. As shown in Fig. 3, the upper mold 204 (204A) includes a first chase 210, a cavity piece 226 held by the first chase 210, a clamper 228, etc. The first chase 210 is fixed to the lower surface of a support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface (the surface facing the lower mold 206) of the upper mold 204 (204A).

[0042] The clamper 228 is configured in an annular shape to surround the cavity piece 226, and is assembled to be spaced (floating) from the underside of the support plate 214 and movable up and down via a push pin 222 and a clamper spring (a biasing member such as a coil spring) 224 (however, this assembly structure is not limited to this). The cavity piece 226 forms the inner part (bottom) of the cavity 208, and the clamper 228 forms the side part of the cavity 208. The shape and number of cavities 208 provided in one upper mold 204 (204A) are set appropriately (one or multiple) depending on the shape and number of workpieces W.

[0043] Here, a movable piece 236 is provided in the cavity piece 226 (inside the cavity 208) at a position corresponding to the through hole Rh of the sealing resin R (R1) held by the work holder 205. The movable piece 236 is supported in a state where it is biased toward the lower mold 206 by a movable piece spring 234 via a pushing pin 232, and is configured to be movable in the mold opening and closing direction. Furthermore, as an example, the movable piece 236 is configured to have an outer diameter that is a predetermined dimension larger than the outer shape of the electronic component Wb in a plan view. That is, when the mold is closed, the movable piece 236 enters the through hole Rh of the sealing resin R (R1) and abuts against the entire top surface Wbf of the electronic component Wb. This allows for the formation of a molded product Wp in which the top surface Wbf of the electronic component Wb is exposed.

[0044] In addition, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the underside of the clamper 228 and at the boundary between the clamper 228 and the cavity piece 226. This allows the film F supplied from the film supply mechanism 211 to be sucked and held on the mold surface 204a, including the inner surface of the cavity 208. In addition, the cavity 208 can be evacuated when the mold is closed and resin sealing is performed.

[0045] In this embodiment, an upper die heating mechanism (not shown) is provided that heats the upper die 204 (204A) to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the first chase 210 and is configured to apply heat to the entire upper die 204 (204A) and the sealing resin R contained in the cavity 208. The heater heats the upper die 204 (204A) to a predetermined temperature (e.g., 100°C to 300°C).

[0046] (Storage Unit) Next, the storage unit 10C provided in the compression molding apparatus 1 will be described in detail.

[0047] The molded product Wp is held by the second loader 24, removed from the sealing mold 202, and transported to the storage unit 10C. Note that the second loader 24 uses a known holding mechanism (for example, a clamping mechanism with holding claws, a suction mechanism with suction holes communicating with a suction device, etc.) as a holding mechanism for the molded product Wp (not shown).

[0048] As a variation of the above-described conveying device, instead of the second loader 24 that moves in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to unload from the sealing mold 202 may be provided (not shown).

[0049] The storage unit 10C includes a storage magazine 18 that stores a plurality of molded products Wp. Here, a known stack magazine, slit magazine, or the like is used as the storage magazine 18. The storage unit 10C may also include a molded product stage (not shown) on which the molded products Wp transported from the press unit 10B are placed.

[0050] (Compression molding method) Next, we will explain the steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1. Here, Figures 4 to 9 are explanatory views of each step, and are illustrated as front cross-sectional views in the same direction as Figure 3.

[0051] First, as a preparation step, a heating step (upper die heating step) is performed in which the upper die 204 (204A) is heated to a predetermined temperature (e.g., 100°C to 300°C) using an upper die heating mechanism. Also, a heating step (lower die heating step) is performed in which the lower die 206 is heated to a predetermined temperature (e.g., 100°C to 300°C) using a lower die heating mechanism. Also, a film supply step is performed in which the film supply mechanism 211 is operated to supply new film F and adsorb it onto the mold surface 204a of the upper die 204 (204A) so as to cover a predetermined area of ​​the mold surface 204a, including the inner surface of the cavity 208.

[0052] After the preparation step, a workpiece W is held by the workpiece holding portion 205 of the lower mold 206 (see FIG. 4). Specifically, the workpiece W supplied from the workpiece supply magazine 12 is held by the first loader 22 and carried into the sealing mold 202, where it is held by the workpiece holding portion 205 of the second plate 242 (mold surface 206 a).

[0053] After the workpiece holding step, a resin placing step is performed in which the sealing resin R (R1) is placed on the workpiece W held by the workpiece holding unit 205 (see FIG. 5 ). Specifically, the sealing resin R (R1) supplied from the resin supply unit 14 is held by the first loader 22 (or another conveying device may be used), carried into the sealing mold 202, and placed on the workpiece W held by the workpiece holding unit 205. When forming a molded product Wp in which the top surfaces Wbf of the electronic components Wb are exposed, the workpiece W and the sealing resin R are positioned relative to each other and placed so that the electronic components Wb are accommodated in the through holes Rh of the sealing resin R (R1).

[0054] Alternatively, as another example of the resin placing step, the sealing resin R (R1) may be placed on the workpiece W before the workpiece holding step. In this case, the workpiece holding step is a step of holding the workpiece W with the sealing resin R (R1) placed thereon in the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R (R1) placed thereon, carries it into the sealing mold 202, and holds it in the workpiece holding section 205. In this case, there is an advantage in that the workpiece W and the sealing resin R (R1) are carried into the sealing mold 202 at one time, rather than being carried out separately.

[0055] After the resin placing step, a mold closing step is carried out in which the workpiece W is sealed with sealing resin R (R1) and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is relatively lowered within the cavity 208 surrounded by the clamper 228, and the sealing resin R (R1) is heated and pressurized against the workpiece W.

[0056] More specifically, the upper mold 204 (204A) and the lower mold 206 are moved closer to each other. At this time, the movable piece 236 enters the through-hole Rh of the sealing resin R (R1) and abuts against the upper surface Wbf of the electronic component Wb of the workpiece W, covering the entire upper surface Wbf (see FIG. 6). Next, the clamper 228 abuts against the base material Wa of the workpiece W via the film F, clamping the workpiece W (see FIG. 7). These steps may be performed in the reverse order or simultaneously. Next, the lower surface of the cavity piece 226 (the area where the movable piece 236 is not provided) abuts against the sealing resin R (R1) placed on the base material Wa of the workpiece W and further pressurizes it. This thermally hardens the sealing resin R (R1), completing resin sealing (compression molding) (see FIG. 8).

[0057] As a subsequent step following the mold closing step, the sealing mold 202 is opened, and the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 9 ). In this embodiment, as described above, resin sealing is performed with the movable piece 236 covering the entire top surface Wbf (whole surface) of the electronic component Wb of the workpiece W. This prevents the formation of thin burrs on the top surface Wbf of the electronic component Wb, and a molded product Wp is formed with the entire top surface Wbf reliably exposed. As a modified example, it is also possible to set only a partial area of ​​the top surface Wbf of the electronic component Wb as the exposed portion (not shown). It is also possible to set only a partial area of ​​the substrate Wa as the exposed portion, and then mount the electronic component Wb on the exposed portion after resin sealing (not shown).

[0058] After the mold opening step, a molded product carrying-out step is carried out in which the second loader 24 carries out the molded product Wp from inside the sealing mold 202 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 18. After or in parallel with the molded product carrying-out step, a step is carried out in which the film supply mechanism 211 is operated to feed out the used film F from inside the sealing mold 202 and feed and set a new film F into the sealing mold 202.

[0059] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 202 is provided. However, the above order of steps is one example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0060] As another example, the workpiece W can be compression molded using a differently configured encapsulating resin R (hereinafter, sometimes referred to as "R2"). Specifically, the encapsulating resin R (R2) has a lattice-like structure with through-holes Rh, with a heat sink H fixed to one side to block the through-holes Rh (all or part) (see FIG. 31). The heat sink H is, for example, a plate-like member formed of a metal material (e.g., copper alloy, aluminum alloy, etc.) with a thickness of approximately 0.1 mm to several mm, but is not limited thereto. By performing resin encapsulation (compression molding) using the encapsulating resin R (R2), a molded product Wp (see FIG. 32) can be easily formed with the heat sink H exposed on the upper surface (details of the forming method will be described later).

[0061] When forming a molded product Wp in which the heat sink H is exposed using the above-mentioned sealing resin R (R2), an upper mold 204B (see FIG. 10) having a general configuration without a movable piece may be used as the upper mold 204, instead of the upper mold 204A (see FIG. 3) having the above-mentioned movable piece 236. The steps of the compression molding method carried out in this case will be described with reference to FIGS.

[0062] First, as preparation steps, an upper mold heating step, a lower mold heating step, and a film supplying step are carried out.

[0063] After the preparation step, a workpiece holding step is carried out in which the workpiece W is held by the workpiece holding portion 205 of the lower mold 206 .

[0064] After the workpiece holding step, a resin placing step is performed in which the sealing resin R (R2) is placed on the workpiece W held by the workpiece holding portion 205. Alternatively, as another example of the resin placing step, before the above-described workpiece holding step, it may be performed as a step of placing the sealing resin R (R2) on the workpiece W. By using the sealing resin R2, it is not necessary to separately carry the sealing resin R and the heat sink H into the sealing die 202 (that is, since they can be carried in as one member in one step), simplification of the process and reduction of time can be achieved.

[0065] After the resin placing step, a mold closing step is performed in which the workpiece W is sealed with the sealing resin R (R2) and processed into a molded product Wp. Specifically, an operation is performed to bring the upper mold 204 (204B) and the lower mold 206 closer to each other. At this time, the clamper 228 abuts against the base material Wa of the workpiece W via the film F, and the workpiece W is held in a sandwiched state (see FIG. 11). Next, the lower surface of the cavity insert 226 abuts against the upper surface of the heat sink H of the sealing resin R (R2) placed on the base material Wa of the workpiece W, covering the entire surface of the heat sink H (see FIG. 12). These may be set to occur simultaneously. Next, the lower surface of the heat sink H in contact with the cavity insert 226 presses the sealing resin R (R2) placed on the base material Wa of the workpiece W. As a result, the sealing resin R (R2) thermally cures and the resin sealing (compression molding) is completed (see FIG. 13). In this example, the sealing resin R2 with the heat sink H having the shape shown in FIG. 31 is used, but it does not necessarily have to have a heat sink H. In that case, the workpiece holding step is performed, then a resin placing step of placing the sealing resin R1 without a heat sink having the shape shown in FIG. 29 on the workpiece W is performed, then a heat sink placing step of placing the heat sink H on the sealing resin R1 is performed, and then the mold closing step is performed to achieve the same molding.

[0066] As a step following the mold closing step, the sealing mold 202 is opened to separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 14). As described above, resin sealing is performed with the cavity piece 226 covering the upper surface (entire surface) of the heat sink H of the sealing resin R (R2), so that thin burrs are prevented from being formed on the upper surface of the heat sink H, and a molded product Wp (see FIG. 32) is formed with the upper surface (entire surface) reliably exposed.

[0067] Here, an elastic thermally conductive resin sheet S may be placed between the surface of the electronic component Wb mounted on the workpiece W facing the heat sink H and the surface of the heat sink H of the sealing resin R (R2) placed on the workpiece facing the electronic component Wb. This fills the gap between the electronic component Wb and the heat sink H, preventing the top surface of the electronic component Wb from being resin-encapsulated. Furthermore, the sealing resin R (R2) can be pressed down and pressurized via the heat sink H, and the clamping force during mold closing can be absorbed, preventing damage to the electronic component Wb. The elastic thermally conductive resin sheet S may be provided (e.g., attached) to the workpiece W (electronic component Wb) in advance, or may be supplied onto the workpiece W (electronic component Wb) before resin encapsulation using an elastic thermally conductive resin sheet supply unit (e.g., supply unit 10A) within the device (not shown).

[0068] After the mold opening step, a molded product carrying-out step is carried out in which the second loader 24 carries out the molded product Wp from the sealing mold 202 and transports it to the storage unit 10C. After or in parallel with the molded product carrying-out step, a step is carried out in which the film supply mechanism 211 is operated to feed out the used film F from the sealing mold 202 and feed and set a new film F into the sealing mold 202.

[0069] Second Embodiment Next, a second embodiment of the present invention will be described. The compression molding apparatus 1 and compression molding method according to this embodiment have the same basic configuration as the first embodiment described above, but differ in the configuration of the press unit 10B (particularly the configuration of the press apparatus and the sealing mold) and the process performed mainly by the press unit 10B. The following description of this embodiment will focus on these differences.

[0070] The press unit 10B according to this embodiment includes a sealing mold 302 having a pair of molds that can be opened and closed (for example, a combination of multiple mold blocks, mold plates, mold pillars, and other components made of alloy tool steel). The press unit 10B also includes a press device 350 that opens and closes the sealing mold 302 to seal the workpiece W with resin. While one press device 350 is shown as an example, multiple press devices (not shown) may also be included. A side view (schematic) of the press device 350 provided in the press unit 10B is shown in FIG. 15 , and a front cross-sectional view (schematic) of the sealing mold 302 is shown in FIG. 16 .

[0071] 16 , the press device 350 includes a pair of platens 354, 356, a plurality of tie bars 352 between which the pair of platens 354, 356 are supported, and a drive device for moving (raising and lowering) the platen 356. Specifically, the drive device includes a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 362 (but is not limited to this). In this embodiment, the upper platen 354 in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 352), and the lower platen 356 is set as a movable platen (a platen slidably held by the tie bars 352 and raised and lowered). However, the present invention is not limited to this configuration, and the platens may be set upside down, i.e., the upper platen may be set as a movable platen and the lower platen as a fixed platen, or both the upper and lower platens may be set as movable platens (all not shown).

[0072] 16 , the sealing mold 302 includes a first mold (lower mold) 306 and a second mold (upper mold) 304 as a pair of molds disposed between the pair of platens 354, 356 in the press device 350. The upper mold 304 is assembled to the upper platen (in this embodiment, the fixed platen 354), and the lower mold 306 is assembled to the lower platen (in this embodiment, the movable platen 356). The upper mold 304 and the lower mold 306 move toward and away from each other to close and open the mold (the mold opening and closing direction is the vertical direction (up and down direction)).

[0073] In addition, in this embodiment, as an example, a film supply mechanism 313 is provided that transports (supplies) a roll-shaped film F into the sealing mold 302. Depending on the configuration of the workpiece W, the film F may be in the form of a strip instead of a roll.

[0074] Next, a detailed description will be given of the upper mold 304 of the sealing mold 302. As shown in Fig. 16, the upper mold 304 includes a second chase 340, a second plate 342 held by the second chase, and the like.

[0075] In this embodiment, a workpiece holding portion 305 is provided to hold the workpiece W at a predetermined position on the underside of the second plate 342. As an example, the workpiece holding portion 305 includes a workpiece guide pin (not shown) and a suction passage (e.g., a hole or groove) that penetrates the second plate 342 and communicates with a suction device (not shown). Specifically, one end of the suction passage leads to the die surface 304a of the upper die 304, and the other end connects to a suction device disposed outside the upper die 304. This allows the suction device to be driven to suck the workpiece W through the suction passage, thereby suctioning and holding the workpiece W to the die surface 304a (here, the underside of the second plate 342). Instead of or in addition to the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of workpiece holding portions 305 provided on one upper die 304 are appropriately determined depending on the shape and number of workpieces W (one or multiple).

[0076] In this embodiment, an upper die heating mechanism (not shown) is provided that heats the upper die 304 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the second chase 340 and is configured to apply heat to the entire upper die 304 and the workpiece W held by the workpiece holding unit 305. The heater heats the upper die 304 to a predetermined temperature (e.g., 100°C to 300°C).

[0077] Next, the lower mold 306 (306A) of the sealing mold 302 will be described in detail. As shown in Fig. 16, the lower mold 306 (306A) includes a first chase 310, a cavity piece 326 held by the first chase 310, a clamper 328, etc. The first chase 310 is fixed to the lower surface of a support plate 314 via a support pillar 312. A cavity 308 is provided on the upper surface of the lower mold 306 (306A) (the surface facing the upper mold 304).

[0078] The clamper 328 is configured in an annular shape to surround the cavity piece 326, and is assembled to the lower surface of the support plate 314 via a push pin 322 and a clamper spring (a biasing member such as a coil spring) 324 so as to be spaced apart (floating) and movable up and down (however, this assembly structure is not limited to this). The cavity piece 326 forms the inner part (bottom) of the cavity 308, and the clamper 328 forms the side part of the cavity 308. The shape and number of cavities 308 provided in one lower mold 306 (306A) are set appropriately (one or multiple) depending on the shape and number of workpieces W.

[0079] Here, a movable piece 336 is provided in the cavity piece 326 (inside the cavity 308) at a position corresponding to the through hole Rh of the sealing resin R (R1) held by the work holder 305. The movable piece 336 is supported in a state where it is biased toward the upper mold 304 by a movable piece spring 334 via a pushing pin 332, and is configured to be movable in the mold opening and closing direction. Furthermore, as an example, the movable piece 336 is configured to have an outer diameter that is a predetermined dimension larger than the outer shape of the electronic component Wb in a plan view. That is, when the mold is closed, the movable piece 336 enters the through hole Rh of the sealing resin R (R1) and abuts against the entire top surface Wbf of the electronic component Wb. This allows the formation of a molded product Wp in which the top surface Wbf of the electronic component Wb is exposed.

[0080] Furthermore, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the upper surface of the clamper 328 and at the boundary between the clamper 328 and the cavity piece 326. This allows the film F supplied from the film supply mechanism 313 to be sucked and held on the mold surface 306a, including the inner surface of the cavity 308. Furthermore, the cavity 308 can be evacuated when the mold is closed and resin sealing is performed.

[0081] In this embodiment, a lower die heating mechanism (not shown) is provided that heats the lower die 306 (306A) to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the first chase 310 and is configured to apply heat to the entire lower die 306 (306A) and the sealing resin R contained in the cavity 308. The heater heats the lower die 306 (306A) to a predetermined temperature (e.g., 100°C to 300°C).

[0082] Next, we will explain the steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1. Here, Figures 17 to 22 are explanatory views of each step, and are illustrated as front cross-sectional views taken in the same direction as Figure 16.

[0083] First, as a preparation step, a heating step (upper die heating step) is performed in which the upper die 304 is heated to a predetermined temperature (e.g., 100°C to 300°C) using an upper die heating mechanism. Also, a heating step (lower die heating step) is performed in which the lower die 306 (306A) is heated to a predetermined temperature (e.g., 100°C to 300°C) using a lower die heating mechanism. Also, a film supply step is performed in which a new film F is supplied by operating the film supply mechanism 313 and adsorbed onto the mold surface 306a of the lower die 306 (306A) so as to cover a predetermined area of ​​the mold surface 306a, including the inner surface of the cavity 308.

[0084] After the preparation step, a workpiece W is held by the workpiece holding portion 305 of the upper mold 304 (see FIG. 17). Specifically, the workpiece W supplied from the workpiece supply magazine 12 is held by the first loader 22 and carried into the sealing mold 302, where it is held by the workpiece holding portion 305 of the second plate 342 (mold surface 304 a).

[0085] After or in parallel with the workpiece holding step, a resin placing step is performed in which the sealing resin R (R1) is placed (accommodated) in the cavity 308 of the lower mold 306 (306A) (see FIG. 18 ). Specifically, the sealing resin R (R1) supplied from the resin supply unit 14 is held by the first loader 22 (or another conveying device may be used) and carried into the sealing mold 302, and is accommodated in the cavity 308 of the lower mold 306 (306A) (specifically, placed on the upper surface of the cavity piece 326). When forming a molded product Wp in which the upper surfaces Wbf of the electronic components Wb are exposed, the workpiece W and the sealing resin R (R1) are aligned and placed so that the electronic components Wb are accommodated in the through holes Rh of the sealing resin R (R1).

[0086] After the resin placing step, a mold closing step is carried out in which the workpiece W is sealed with sealing resin R (R1) and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is relatively lowered within the cavity 308 surrounded by the clamper 328, and the sealing resin R is heated and pressurized against the workpiece W.

[0087] More specifically, the upper mold 304 and the lower mold 306 (306A) are moved toward each other. At this time, the movable piece 336 enters the through-hole Rh of the sealing resin R (R1) and abuts against the upper surface Wbf (facing downward) of the electronic component Wb of the workpiece W, covering the entire upper surface Wbf (see FIG. 19). Next, the clamper 328 abuts against the base material Wa of the workpiece W via the film F, clamping the workpiece W (see FIG. 20). These steps may be performed in the reverse order or simultaneously. Next, the sealing resin R (R1) is pressed between the upper surface of the cavity piece 326 (the area where the movable piece 336 is not provided) and the base material Wa of the workpiece W. This thermally hardens the sealing resin R (R1), completing resin sealing (compression molding) (see FIG. 21).

[0088] As a subsequent step following the mold closing step, the sealing mold 302 is opened, and the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 22 ). In this embodiment, as described above, resin sealing is performed with the movable piece 336 covering the entire top surface Wbf (whole surface) of the electronic component Wb of the workpiece W. This prevents the formation of thin burrs on the top surface Wbf of the electronic component Wb, and a molded product Wp is formed with the entire top surface Wbf reliably exposed. As a modified example, it is also possible to set only a partial area of ​​the top surface Wbf of the electronic component Wb as the exposed portion (not shown). It is also possible to set only a partial area of ​​the substrate Wa as the exposed portion, and then mount the electronic component Wb on the exposed portion after resin sealing (not shown).

[0089] After the mold opening step, a molded product carrying-out step is carried out in which the second loader 24 carries out the molded product Wp from inside the sealing mold 302 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 18. After or in parallel with the molded product carrying-out step, a step is carried out in which the film supply mechanism 313 is operated to feed out the used film F from inside the sealing mold 302 and feed and set a new film F into the sealing mold 302.

[0090] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 302 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0091] As another example, compression molding of the workpiece W can be performed using a sealing resin R (R2) having a different configuration. When forming a molded product Wp in which the heat sink H is exposed using the sealing resin R (R2), a lower mold 306B (see FIG. 23) having a general configuration without a movable piece can be used as the lower mold 306, instead of the lower mold 306A (see FIG. 16) having the above-mentioned movable piece 336. The steps of the compression molding method performed in this case will be described with reference to FIGS. 24 to 27.

[0092] First, as preparation steps, an upper mold heating step, a lower mold heating step, and a film supplying step are carried out.

[0093] After the preparation step, a workpiece holding step is carried out in which the workpiece W is held by the workpiece holding portion 305 of the upper mold 304 .

[0094] After or in parallel with the workpiece holding step, a resin placing step is carried out in which the sealing resin R (R2) is placed (accommodated) in the cavity 308 of the lower mold 306 (306B). By using the sealing resin R2, it is not necessary to separately carry the sealing resin R and the heat sink H into the sealing mold 302 (i.e., they can be carried in as a single component in a single step), which simplifies the process and reduces the time required.

[0095] After the resin placement process, a mold closing process is performed in which the workpiece W is sealed with sealing resin R (R2) and processed into a molded product Wp. Specifically, the upper mold 304 and the lower mold 306 (306B) are moved toward each other. At this time, the clamper 328 contacts the base material Wa of the workpiece W via the film F, clamping the workpiece W (see FIG. 24). Next, the base material Wa of the workpiece W contacts the upper surface of the sealing resin R (R2) (the surface to which the heat sink H is not attached) (see FIG. 25). These steps may be performed simultaneously. Next, the sealing resin R (R2) is pressed by the heat sink H, which is in contact with the cavity piece 326, and the base material Wa of the workpiece W. This thermally hardens the sealing resin R (R2), completing resin sealing (compression molding) (see FIG. 26). Note that while this example uses sealing resin R2 with a heat sink H as shown in FIG. 31, the heat sink H does not necessarily have to be attached. In this case, the same molding can be achieved by carrying out a workpiece holding step, then a heat sink placing step in which the heat sink H is simply placed in the cavity 308 of Fig. 23, then a resin placing step in which the sealing resin R1 without a heat sink having the shape of Fig. 29 is placed on the heat sink H, and then a mold closing step. However, the workpiece holding step and the heat sink placing step may be carried out in the reverse order or simultaneously.

[0096] As a step following the mold closing step, the sealing mold 302 is opened to separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 27). As described above, resin sealing is performed with the cavity piece 326 covering the upper surface (entire surface) of the heat sink H of the sealing resin R (R2), so that thin burrs are prevented from being formed on the upper surface of the heat sink H, and a molded product Wp (see FIG. 32) is formed with the upper surface (entire surface) reliably exposed.

[0097] Here, an elastic heat-conductive resin sheet S may be placed between the surface of the electronic component Wb mounted on the workpiece W facing the heat sink H and the surface of the heat sink H of the sealing resin R (R2) placed on the workpiece facing the electronic component Wb. This fills the gap between the electronic component Wb and the heat sink H, preventing the top surface of the electronic component Wb from being resin-sealed. In addition, the sealing resin R (R2) can be pressed down and pressurized via the heat sink H, and the clamping force when the mold is closed can be absorbed, preventing damage to the electronic component Wb.

[0098] After the mold opening step, a molded product carrying-out step is carried out in which the second loader 24 carries out the molded product Wp from the sealing mold 302 and transports it to the storage unit 10C. After or in parallel with the molded product carrying-out step, a step is carried out in which the film supply mechanism 313 is operated to feed out the used film F from the sealing mold 302 and feed and set a new film F into the sealing mold 302.

[0099] As described above, the molding apparatus and molding method according to the present invention can prevent molding defects caused by uneven distribution, residual gas, and dust generated during molding, and can prevent the formation of thin burrs in the encapsulating resin at exposed portions of the molded product. It also facilitates handling before resin encapsulation. Furthermore, by using a lattice-shaped solid encapsulating resin with a heat sink attached, it is possible to easily form a molded product with an exposed heat sink on the upper surface, and it is possible to simplify the compression molding process and reduce the time required.

[0100] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

Claims

1. A compression molding device that uses a sealing mold comprising a first mold and a second mold, one of which serves as an upper mold and the other as a lower mold, to seal a workpiece with sealing resin and process it into a molded product, characterized in that the sealing resin is formed in a lattice shape with through holes, the first mold has a cavity configured as a recess with a cavity piece forming the bottom, and the second mold has a work holding portion that holds the workpiece.

2. The compression molding device according to claim 1, characterized in that the sealing resin is a solid resin formed by compressing powder resin into tablets, or a sheet-like resin.

3. The compression molding device according to claim 2, wherein the first mold further has a movable piece disposed inside the cavity at a position corresponding to the through hole in the sealing resin and movable up and down, and when the sealing mold is closed, the movable piece enters the through hole and abuts against the upper surface of the workpiece.

4. A compression molding apparatus as described in claim 2 or claim 3, characterized in that: the workpiece has a configuration in which electronic components are mounted on a base material; the sealing resin has a configuration in which a heat sink is fixed to block the through holes; and a member having elasticity and thermal conductivity is provided between a surface of the electronic components of the workpiece facing the heat sink and a surface of the sealing resin of the heat sink placed on the workpiece or inside the cavity facing the electronic components.

5. A compression molding method in which a workpiece is sealed with sealing resin and processed into a molded product using a sealing mold comprising a first mold and a second mold, one of which is an upper mold and the other is a lower mold, the method comprising: a work holding step of holding the workpiece in the second mold; a resin placing step of placing the sealing resin on the workpiece when the first mold is the upper mold, and placing the sealing resin inside the cavity of the first mold when the first mold is the lower mold; and a mold closing step of closing the sealing mold to seal the workpiece with the sealing resin and process it into the molded product.

6. The compression molding method according to claim 5, characterized in that the sealing resin is a solid resin formed by tableting powder resin, or a sheet-like resin.

7. A compression molding method as claimed in claim 5 or claim 6, characterized in that it comprises a heat sink placing step of placing a heat sink on the sealing resin after the resin placing step when the first mold is an upper mold, and a heat sink placing step of placing the heat sink inside the cavity of the first mold before the resin placing step when the first mold is a lower mold.

8. The compression molding method according to claim 6, characterized in that the mold closing step includes a step in which, when the sealing mold is closed, a movable piece which is disposed inside the cavity of the first mold at a position corresponding to the through hole in the sealing resin and which can move up and down enters the through hole and comes into contact with the upper surface of the workpiece.

9. A compression molding method according to claim 6, characterized in that: as the workpiece, a workpiece having a configuration in which electronic components are mounted on a substrate is used; as the sealing resin, a sealing resin having a configuration in which a heat sink is fixed to block the through holes is used; and a member having elasticity and thermal conductivity is provided between a surface of the electronic components of the workpiece facing the heat sink and a surface of the sealing resin of the heat sink placed on the workpiece or inside the cavity facing the electronic components.

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