Transparent member manufacturing method, and lid member

Abstract

This transparent member manufacturing method comprises: a step S1 for forming a plurality of through holes 18 in a transparent substrate MG by machining; a step S2 for polishing a main surface MGa of the transparent substrate MG; and a step S3 for etching the plurality of through holes 18.

Description

Manufacturing method of transparent member and lid member

[0001] The present invention relates to a method for manufacturing a transparent member and a lid member.

[0002] For example, Patent Document 1 discloses an airtight package including a substrate on which a light-emitting element (LED element) is mounted, and a transparent lid member fixed to the base so as to cover the light-emitting element.

[0003] The substrate of the package is rectangular in plan view. The lid member (transparent body) of the package includes a plate-shaped frame (brim) and a dome-shaped protrusion (convex lid) protruding from the frame. The frame is rectangular in plan view to correspond to the shape of the substrate (see paragraphs 0014 and 0019 and Figures 1 and 2 of the same document).

[0004] A desirable method for efficiently manufacturing a lid member is, for example, to divide a large transparent substrate into a plurality of pieces and use each of the divided pieces as a lid member. For example, Patent Document 2 discloses a method for manufacturing a transparent member, which includes a first step of forming a plurality of through holes in the transparent substrate and a second step of dividing the transparent substrate along imaginary lines connecting the centers of the plurality of through holes to obtain transparent members (see claim 1 of the same document).

[0005] Specifically, the first step includes a step of providing modified portions by irradiating laser light onto positions of the transparent substrate where through holes are to be formed, and a step of forming through holes by etching the positions of the transparent substrate where the modified portions are to be formed (see claim 3 of the same document). Furthermore, the through holes have a polygonal planar shape, and the second step includes dividing the transparent substrate along imaginary lines connecting the vertices of the polygons of the multiple through holes (see claim 2 of the same document).

[0006] International Publication No. 2021 / 251102 International Publication No. 2023 / 095734

[0007] As a method for forming a through hole in a transparent substrate, in addition to the irradiation of laser light as in the first step described above, the transparent substrate may be machined. In this case, chipping or microcracks may occur in the through hole due to the machining, and these defects may cause damage to the transparent substrate or the lid member.

[0008] The present invention has been made in view of the above circumstances, and has as its technical object to prevent damage to a transparent member caused by through holes formed by machining.

[0009] (1) The method for manufacturing a transparent member according to the present invention is intended to solve the above-mentioned problems, and is characterized by comprising the steps of forming a plurality of through holes in a transparent substrate by mechanical processing, polishing a main surface of the transparent substrate, and etching the plurality of through holes.

[0010] According to this configuration, by performing the polishing process and the etching process on the transparent substrate having a plurality of through holes formed therein, chipping and microcracks formed in the through holes by mechanical processing can be reliably removed, thereby preventing damage to the transparent substrate caused by the through holes.

[0011] (2) The method for manufacturing a transparent member according to (1) above may further include, after the step of etching the plurality of through holes, a step of dividing the transparent substrate along imaginary lines connecting the plurality of through holes.

[0012] According to this configuration, by dividing the transparent substrate along the imaginary line, it is possible to efficiently manufacture a plurality of transparent members.

[0013] (3) In the method for manufacturing a transparent member according to (1) or (2) above, after the step of etching the plurality of through holes, a step of heat-forming the transparent substrate so that a portion of the main surface of the transparent substrate becomes convex may be included.

[0014] According to this configuration, by forming a part of the transparent substrate into a convex shape, it is possible to form a space for accommodating the light emitting element of the package.

[0015] (4) In the method for manufacturing a transparent member according to any one of (1) to (3) above, the machining may include a blasting process.

[0016] (5) In the method for manufacturing a transparent member described in any one of (1) to (4) above, the through hole may be configured to have a polygonal shape in a planar view, the through hole may have a plurality of corners, and the corners of the through hole may be configured to have a curved shape in a planar view.

[0017] According to this configuration, by forming the corners of the through-hole in a curved shape, it is possible to prevent the transparent substrate from being damaged by these corners.

[0018] (6) In the method for manufacturing a transparent member according to any one of (1) to (5), the size of the through holes may not be substantially changed in the step of etching the plurality of through holes. With this configuration, the transparent member can be manufactured with high precision.

[0019] (7) In the method for manufacturing a transparent member according to any one of (1) to (6) above, a step of forming a film on the main surface of the transparent substrate may be provided after the step of forming the plurality of through holes and before the step of dividing the transparent substrate.

[0020] According to this configuration, by forming a film on the main surface of the transparent substrate before the step of dividing the transparent substrate, a transparent member having a film can be efficiently manufactured.

[0021] (8) In the method for manufacturing a transparent member according to any one of (2) to (7) above, the step of dividing the transparent substrate may include a dicing process.

[0022] (9) The present invention is intended to solve the above-mentioned problems, and is a transparent glass lid member used for a package including a light-emitting element, the lid member comprising a plate-shaped frame portion and a protrusion protruding from the frame portion, the frame portion comprising a first main surface, a second main surface located opposite the first main surface, and a side surface connecting the first main surface and the second main surface, the frame portion comprising a plurality of corners and a plurality of sides in a planar view, the side surface at the plurality of corners being an etched surface, and the side surface at at least one of the plurality of sides being a diced surface.

[0023] According to the present invention, it is possible to prevent damage to the transparent member caused by through holes formed by machining.

[0024] 1 is a perspective view of a package; 2 is a cross-sectional view of a package; 3 is a cross-sectional view of a base; 4 is a plan view of a base; 5 is a cross-sectional view of a lid member; 6 is a bottom view of a lid member; 7 is a plan view of a mother glass plate used in manufacturing the lid member; 8 is a flowchart showing a method for manufacturing the lid member; 9 is a cross-sectional view showing a drilling step; 10 is a plan view of a mother glass plate with through holes formed therein; 11 is a plan view of through holes formed in a mother glass plate; 12 is a side view showing a polishing step; 13 is a cross-sectional view showing an etching step; 14 is a cross-sectional view showing a forming step; 15 is a cross-sectional view showing a forming step; 16 is a plan view of a mother glass plate after the forming step; 17 is a cross-sectional view showing a film-forming step; 18 is a cross-sectional view showing a cutting step; 19 is a plan view of a lid member after the cutting step; 19 is a cross-sectional view showing a bonding step.

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings. Figures 1 to 20 show an embodiment of a package including a transparent lid member according to the present invention and a method for manufacturing the same. The present invention is not limited to lid members and can also be applied to the manufacture of other transparent members.

[0026] As shown in Figures 1 and 2, the package 1 includes a base 2, a light-emitting element 3 supported by the base 2, a lid member 4 that covers the base 2 and the light-emitting element 3, and a sealing portion 5 that hermetically joins the base 2 and the lid member 4.

[0027] 3 and 4 show the base 2 before the lid member 4 is bonded. The base 2 is configured in a quadrangular shape in a plan view. The base 2 has a first main surface 2a that supports the light-emitting element 3, a second main surface 2b located opposite the first main surface 2a, and a metal layer 6 formed on the first main surface 2a.

[0028] The base 2 also has a plurality of linear sides 2c and a plurality of corners 2d. The corners 2d are chamfered. As a result, the corners 2d have flat chamfered surfaces 2d1. The shape of the chamfered surfaces 2d1 is not limited to that of the present embodiment, and may be curved or have other shapes.

[0029] Examples of materials for the substrate 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics with glass powder, glass, and alloys such as Fe—Ni—Co alloy, Cu—W alloy, and Kovar (registered trademark).

[0030] 4, the metal layer 6 has a frame shape surrounding the light-emitting element 3. The metal layer 6 is rectangular, but is not limited to this shape. The metal layer 6 may be circular, for example, so as to surround the light-emitting element 3.

[0031] The metal layer 6 includes three layers, namely, an underlayer, an intermediate layer, and a surface layer, in that order from the first main surface 2a side. Examples of metals used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. Examples of metals used for the intermediate layer include Ni, Pt, and Pd. Examples of metals used for the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used for the metal layer 6 may be a single metal or an alloy.

[0032] Examples of methods for forming the metal layer 6 on the first main surface 2a of the substrate 2 include film formation methods such as sputtering, vacuum deposition, ion-assisted or ion-plating vacuum deposition, and CVD.

[0033] The light-emitting element 3 is fixed to the first main surface 2 a of the base 2. In this embodiment, the package 1 using an ultraviolet irradiating LED as the light-emitting element 3 is exemplified, but the light-emitting element 3 according to the present invention is not limited to this embodiment, and an infrared LED or a visible light LED can also be used.

[0034] 5 and 6 show the lid member 4 before being bonded to the base 2. The glass used for the lid member 4 is preferably alkali-free glass, borosilicate glass, aluminosilicate glass, quartz glass, or crystallized glass. Alkali-free glass, borosilicate glass, or aluminosilicate glass can achieve both high transmittance and high processability during molding. Quartz glass can have significantly high transmittance in the ultraviolet range while maintaining processability during molding. Crystallized glass can achieve both high transmittance and high breaking strength.

[0035] When the glass is borosilicate glass, aluminosilicate glass, or alkali-free glass, the glass composition preferably contains, in mass %, 50-75% SiO2, 1-25% Al2O3, 1-30% BO3, 0-20% Li2O + Na2O + KO, and 0-20% MgO + CaO + SrO + BaO. Glass compositions within the above ranges qualify as these glass systems. In the present invention, "Li2O + Na2O + KO" refers to the total amount of Li2O, Na2O, and KO, and "MgO + CaO + SrO + BaO" refers to the total amount of MgO, CaO, SrO, and BaO.

[0036] In the case of glass-ceramics, the glass composition preferably contains, in mass %, SiO2: 60 to 80%, Al2O3: 3 to 30%, Li2O+Na2O+KO: 1 to 20%, and MgO+CaO+SrO+BaO: 5 to 20%, and is a low-thermal-expansion glass-ceramics in which β-quartz solid solution or β-spodumene precipitates as crystals from the inside of the glass. Here, low thermal expansion means a thermal expansion coefficient of -10×10 in the temperature range of 30 to 300°C. -7 ~20 x 10 -7 / ℃.

[0037] 2 and 5, the lid member 4 includes a plate-shaped frame portion 7, a dome-shaped protruding portion 8 protruding from the frame portion 7, and a connecting portion 9 connecting the frame portion 7 and the protruding portion 8. The lid member 4 may also include a first anti-reflection coating 10a and a second anti-reflection coating 10b.

[0038] The frame 7 has, for example, a constant thickness, but is not limited to this embodiment. The thickness of the frame 7 is, for example, 0.2 mm or more and 2 mm or less. The frame 7 has a first main surface 7 a, a second main surface 7 b located on the opposite side of the first main surface 7 a, and a side surface 7 c connecting the first main surface 7 a and the second main surface 7 b.

[0039] As shown in FIG. 6 , the frame 7 is configured to have a rectangular shape, but is not limited to this shape. The frame 7 has multiple linear sides 7d and multiple corners 7e. The length of the sides 7d is, for example, 2.5 mm or more and 100 mm or less. The corners 7e are chamfered. As a result, the corners 7e have flat chamfered surfaces 7e1. The shape of the chamfered surfaces 7e1 is not limited to this embodiment and may be curved or have other shapes. The chamfered surfaces 7e1 are formed as part of the side surfaces 7c, extending from the first main surface 7a to the second main surface 7b.

[0040] The protrusion 8 is for forming a space for accommodating the light-emitting element 3 together with the first main surface 2a of the base 2. As shown in Figures 5 and 6, the protrusion 8 is formed at the center of the frame 7, but is not limited to this. The protrusion 8 has an inner surface 8a configured as a concave curved surface, an outer surface 8b configured as a convex curved surface, and an opening 8c formed on the inner surface 8a side.

[0041] The protruding portion 8 includes a base portion 11, a middle portion 12, and a top portion 13. The base portion 11 is integrally formed with the connecting portion 9. The middle portion 12 is located between the base portion 11 and the top portion 13. The inner surface 8a and the outer surface 8b of the protruding portion 8 are formed as continuous curved surfaces from the base portion 11 to the top portion 13.

[0042] The opening 8c of the protrusion 8 is for inserting the light emitting element 3 provided on the base 2 into the inside of the protrusion 8 when the cover member 4 is fixed to the base 2. As shown in Fig. 6, the opening 8c of the protrusion 8 is configured in a circular shape, but is not limited to this shape.

[0043] 2 and 5 , the connecting portion 9 has a curved shape to connect the base 11 and the frame portion 7. The connecting portion 9 has a first curved surface 9a that connects the first main surface 7a of the frame portion 7 and the inner surface 8a of the protruding portion 8, and a second curved surface 9b that connects the outer surface 8b of the protruding portion 8 and the second main surface 7b of the frame portion 7.

[0044] The first antireflection coating 10a is formed on the inner surface 8a of the protrusion 8 and the first main surface 7a of the frame 7. The first antireflection coating 10a preferably has a multilayer structure including, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film, alternately.

[0045] In the first antireflection film 10a, a portion 10a1 formed on the inner surface 8a of the protrusion 8 (hereinafter referred to as the "antireflection portion") is configured so that the thickness gradually decreases from the top 13 to the base 11 of the protrusion 8. That is, the antireflection portion 10a1 is thickest at the portion formed on the top 13 and thinnest at the portion formed on the base 11.

[0046] In the first antireflection coating 10a, a portion 10a2 (hereinafter referred to as the "buffer portion") formed on the first main surface 7a of the frame portion 7 has a constant film thickness. In addition to the function of preventing reflection of ultraviolet rays, the buffer portion 10a2 also has the function of alleviating stress acting on the frame portion 7 when the lid member 4 is bonded to the base 2.

[0047] The second anti-reflection film 10b is formed on the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame 7. The second anti-reflection film 10b preferably has a multilayer structure that alternately includes, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film.

[0048] In the second antireflection film 10b, a portion 10b1 formed on the outer surface 8b of the protrusion 8 (hereinafter referred to as the "antireflection portion") is configured so that the thickness gradually decreases from the top 13 toward the base 11. That is, the antireflection portion 10b1 is thickest at the portion formed on the top 13 and thinnest at the portion formed on the base 11.

[0049] 2, 5, and 6, the buffer portion 10a2 of the first antireflection coating 10a includes a metal layer 14 and a bonding portion 15. The Young's modulus of the buffer portion 10a2 is preferably 250 GPa or less, more preferably 200 GPa or less, even more preferably 150 GPa or less, and particularly preferably 100 GPa or less. Specifying the upper limit in this manner can enhance the cushioning properties of the buffer portion 10a2 and can effectively alleviate stress caused by the difference in thermal expansion coefficient between the bonding portion 15 and the cover member 4 (frame portion 7).

[0050] As shown in Figures 5 and 6, the metal layer 14 is formed so as to overlap the buffer section 10a2. The metal layer 14 is formed on the surface of the buffer section 10a2 opposite to the surface of the buffer section 10a2 that contacts the first main surface 7a of the frame section 7. As shown in Figure 6, the metal layer 14 has a rectangular frame shape corresponding to the shape of the metal layer 6 of the base 2. The shape of the metal layer 14 is not limited to this embodiment. The metal layer 14 may have various frame shapes such as a circular shape. The metal layer 14 includes three layers: an underlayer, an intermediate layer, and a surface layer, in that order from the buffer section 10a2 side.

[0051] Examples of metals used for the underlayer include Cr, Ta, W, Ti, Mo, Ni, and Pt. When Cr is used for the underlayer, the Young's modulus of the underlayer is preferably 279 GPa or less. Examples of metals used for the intermediate layer include Ni, Pt, and Pd. Examples of metals used for the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used for the metal layer 14 may be a single metal or an alloy.

[0052] 5 and 6, the bonding portion 15 is configured in a layered form so as to overlap the metal layer 14. As shown in Fig. 5, the bonding portion 15 contacts a portion of the metal layer 14 opposite to the portion in contact with the buffer portion 10a2. As shown in Fig. 6, the bonding portion 15 has a rectangular frame shape so as to correspond to the shapes of the buffer portion 10a2 and the metal layer 14. The shape of the bonding portion 15 is not limited to that of this embodiment, and may be a circle or any other frame shape.

[0053] The joint 15 is made of a metallic joint material. Commercially available solder materials and brazing filler metals can be used as the metallic joint material. Examples of metallic joint materials include Au—Sn alloys, Pb—Sn alloys, Au—Ge alloys, and Sn—Ni alloys. By making the width of the joint 15 narrower than the width of the buffer portion 10a2, the influence of stress due to the difference in thermal expansion coefficient between the joint 15 and the lid member 4 can be reduced.

[0054] The sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 14 of the lid member 4 at a joint 15 .

[0055] Next, a description will be given of a method for manufacturing the package 1. This method includes a preparation step of preparing the base body 2 and the lid member 4, and a joining step of joining the base body 2 and the lid member 4 together.

[0056] In the preparation step, after the metal layer 6 is formed on the first main surface 2a of the base 2, the light emitting element 3 is mounted on this first main surface 2a.

[0057] In addition, in the preparation process, multiple lid members 4 are manufactured from a large mother glass plate, which is a transparent substrate. A method for manufacturing the lid members 4 will be described below with reference to FIGS. 7 to 19 . As shown in FIG. 7 , the mother glass plate MG is configured to have a rectangular shape, but this shape is not limited. In FIG. 7 , the lid members 4 that can be manufactured from the mother glass plate MG are indicated by imaginary lines CL. In this example, nine lid members 4 can be manufactured from the mother glass plate MG, but the number of lid members 4 manufactured from the mother glass plate MG is not limited to this embodiment.

[0058] As shown in FIG. 8, the method for manufacturing the cover member 4 includes a drilling step S1, a polishing step S2, an etching step S3, a molding step S4, a film forming step S5, and a cutting step S6.

[0059] The drilling step S1 is a step of forming a plurality of through holes in the mother glass plate MG by machining. In this embodiment, sandblasting is exemplified as the machining, but the machining is not limited thereto, and the mother glass plate MG may be processed by various processes such as drilling. As shown in Figure 9, the mother glass plate MG has a first main surface MGa corresponding to the inner surface 8a of the protrusion 8 of the lid member 4 and the first main surface 7a of the frame portion 7, and a second main surface MGb corresponding to the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame portion 7.

[0060] As shown in Fig. 9 , in the drilling step S1, a mask member 16 is fixed to the first main surface MGa of the mother glass plate MG. The mask member 16 has openings 16a having shapes corresponding to the through holes to be formed in the mother glass plate MG. In the drilling step S1, compressed air containing sand is sprayed from above the mask member 16 toward the mother glass plate MG by a blasting device 17, as shown by the arrows in Fig. 9 . This forms through holes 18 in the mother glass plate MG having shapes corresponding to the shapes of the openings 16a in the mask member 16.

[0061] As shown in Fig. 10, the through holes 18 formed in the mother glass plate MG are formed in portions corresponding to the corners 7e of the frame portion 7 of the lid member 4. Although the through holes 18 are configured to have a rectangular shape in a plan view, the shape is not limited to this. The through holes 18 may have various shapes, such as a polygonal shape other than a rectangular shape, a circular shape, an elliptical shape, or the like. The spacing (pitch) between the multiple through holes 18 is, for example, 2.5 mm or more and 100 mm or less.

[0062] As shown in FIG. 11 , the through hole 18 has a plurality of linear sides 19 and a plurality of corners 20. The sides 19 are formed so as to be inclined at a predetermined angle with respect to the sides 7d of the frame 7 of the cover member 4. The length of the sides 19 is, for example, 0.3 mm or more and 10 mm or less. The corners 20 are chamfered. As a result, the corners 20 are configured to have a curved shape (e.g., an arc shape) in a plan view. Specifically, the corners 20 have a curved chamfered surface. The radius of curvature of the chamfered surface is preferably 0.3 mm or more and 5 mm or less, and more preferably 0.5 mm or more and 3 mm or less.

[0063] At the end of the drilling step S1, chipping occurs at the edge of the through-hole 18, and microcracks occur on the inner surface of the through-hole 18.

[0064] 12 , the polishing step S2 is a step of polishing each of the main surfaces MGa and MGb of the mother glass plate MG by a polishing device 21. The polishing device 21 includes a rotating table (polishing surface plate) 22, a polishing pad 23 provided on the rotating table 22, and a pressing member 24 that presses the mother glass plate MG against the polishing pad 23.

[0065] 12 , in the polishing step S2, the first main surface MGa of the mother glass plate MGa is brought into contact with a polishing pad 23, and the mother glass plate MG is pressed from the second main surface MGb side by a pressing member 24. In this state, the first main surface MGa of the mother glass plate MG is polished by rotating the turntable 22 while supplying slurry to the polishing pad 23. After this polishing is completed, the second main surface MGb of the mother glass plate MG is also polished in the same manner. This makes it possible to remove chipping formed in the through holes 18 in the drilling step S1.

[0066] As shown in Figure 13, in the etching step S3, the mother glass sheet MG is immersed in an etching bath 26 containing an etching solution 25. This etches the entire surface of the mother glass sheet MG and the inner surfaces of the through holes 18. This makes it possible to remove microcracks formed on the inner surfaces of the through holes 18 in the drilling step S1. Alternatively, in the etching step S3, instead of immersing the mother glass sheet MG, the etching solution 25 can be poured into the through holes 18 of the mother glass sheet MG to etch the inner surfaces of the through holes 18. This makes it possible to remove microcracks formed on the inner surfaces of the through holes 18 in the drilling step S1.

[0067] In this etching step S3, it is preferable that the etching treatment be performed so as not to substantially change the size of the through-hole 18. Here, "not substantially changing the size of the through-hole 18" means that the maximum dimension of the through-hole 18 (e.g., the distance between a pair of opposing side portions 19) does not change by 50 μm or more.

[0068] The forming step S4 is a step of heat-forming the main surfaces MGa and MGb of the mother glass plate MG so that parts of the main surfaces MGa and MGb are convex. The convex parts formed on the mother glass plate MG correspond to the protrusions 8 of the lid member 4.

[0069] 14 and 15 show a forming device used in the forming step S4. The forming device 27 includes a support table 28 that supports the mother glass plate MG, a plurality of heating sources 29 that thermally deform a portion of the mother glass plate MG to form the protrusion 8 of the lid member 4, and an external force generating device 30 that applies an external force to a portion of the mother glass plate MG.

[0070] The support base 28 has a plurality of fixing portions 31 that fix the mother glass plate MG and a plurality of spaces 32 that allow thermal deformation of parts of the mother glass plate MG. In addition, the support base 28 has a plurality of openings 28a surrounded by the fixing portions 31 and a plurality of suction portions 28b that suck parts of the mother glass plate MG. Examples of materials that form the support base 28 include metals and ceramics.

[0071] The fixing portion 31 of the support base 28 has a support surface 31a that supports the mother glass plate MG and a suction portion 31b that sucks the mother glass plate MG. The support surface 31a is configured as a flat surface facing upward. The suction portion 31b of the fixing portion 31 is formed so as to be exposed on a part of the support surface 31a. The suction portion 31b is connected to the external force generator 30.

[0072] The space 32 of the support base 28 is formed inside a recess having a bottom. The space 32 of the support base 28 is configured so that the entire protrusion 8 of the lid member 4 is molded in a non-contact state.

[0073] Opening 28a of support base 28 has a circular opening edge in a plan view, but is not limited thereto and may have an opening edge of a polygonal shape such as a triangular or rectangular shape, an elliptical shape, or the like. Suction portion 28b of support base 28 is formed at the bottom of the recess of support base 28 and communicates with space 32. Suction portion 28b is connected to external force generator 30 together with suction portion 31b of fixed portion 31. In other words, external force generator 30 can perform suction by suction portion 28b and suction by suction portion 31b of fixed portion 31 using a common suction device.

[0074] The configuration is not limited to the above, and in order to form the shape of the lid member 4 with high precision, a support jig for supporting the mother glass sheet MG may be provided in the space 32. The support jig is made of metal or ceramics. As described above, it is preferable to form the entire protrusion 8 of the lid member 4 in a non-contact state. However, by improving the quality of the surface of the support jig that comes into contact with the mother glass sheet MG (reducing surface roughness and surface waviness), the lid member 4 can be formed with high precision even when a support jig is used.

[0075] As shown in FIG. 14 , the heating source 29 is disposed above the support table 28. In this embodiment, each heating source 29 is a burner that sprays a flame FL toward the mother glass sheet MG. By using a burner, the mother glass sheet MG can be softened relatively quickly. The heating method of the heating source 29 may be, for example, resistance heating, laser heating, or heating using superheated steam. Here, superheated steam refers to high-temperature steam obtained by further heating saturated steam generated by boiling water. The heating source 29 may also be configured by combining heating sources of different heating methods.

[0076] As the external force generator 30, for example, a suction device (exhaust device) can be used. The suction device creates a negative pressure in the space 32 of the support base 28 by discharging gas present in the space 32 of the support base 28. This causes a portion of the mother glass sheet MG to be sucked into the space 32 of the support base 28, thereby promoting thermal deformation of the portion of the mother glass sheet MG. As the suction device, for example, a pump using a Venturi mechanism is suitable.

[0077] 14 , in the forming step S4, the mother glass plate MG is placed on the fixing portion 31 of the support base 28 with the external force generator 30 stopped. This brings the second main surface MGb of the mother glass plate MG into contact with the support surface 31a of the fixing portion 31. Next, the external force generator 30 is activated, and the mother glass plate MG is fixed to the fixing portion 31. In this forming step S4, suction by the suction portion 28b of the support base 28 and suction by the suction portion 31b of the fixing portion 31 can be performed simultaneously. In this case, the suction direction D1 of the mother glass plate MG by the suction portion 28b and the suction direction D2 of the mother glass plate MG by the suction portion 31b of the fixing portion 31 can be the same direction.

[0078] Thereafter, the mother glass plate MG is heated from above the support base 28 by the heating source 29. Due to suction by the suction unit 28b, a portion of the mother glass plate MG is thermally deformed as shown in FIGS. 15 and 16 , thereby forming a plurality of protrusions 8. Furthermore, a portion corresponding to the frame portion 7 of the lid member 4 is formed around the protrusions 8. As a result, a plurality of portions corresponding to the lid members 4 are formed on the mother glass plate MG. Furthermore, in the forming step S4, it is preferable to also heat the portion corresponding to the frame portion 7 in order to suppress warping of this portion. When the mother glass plate MG is heated from above the support base 28 by the heating source 29, if microcracks exist on the inner surface of the through-hole 18, an external force may be applied to the periphery of the through-hole 18, causing the cracks to grow around the periphery of the through-hole 18, potentially resulting in damage to the mother glass plate MG. In the present invention, since the microcracks formed on the inner surface of the through-hole 18 are removed, even when the mother glass plate MG is heated from above the support base 28 by the heat source 29, the cracks do not propagate around the through-hole 18. This reduces breakage of the mother glass plate MG.

[0079] The film formation process S5 includes a first film formation process for forming anti-reflection films 10a, 10b on the main surfaces MGa, MGb of the mother glass plate MG, and a second film formation process for forming a metal layer 14 on the portion corresponding to the frame portion 7 of the lid member 4 after the first film formation process.

[0080] 17 shows a film formation apparatus used in the film formation step S5. In this embodiment, a sputtering apparatus such as a magnetron sputtering apparatus is exemplified as the film formation apparatus, but the present invention is not limited to this configuration, and a film formation apparatus that performs other physical vapor deposition methods such as vacuum evaporation may also be used.

[0081] As shown in FIG. 17, the film forming apparatus 33 includes a vacuum chamber 34 and targets 35a and 35b for scattering particles that will be the film forming materials for the anti-reflection films 10a and 10b.

[0082] The targets 35a and 35b are accommodated in the vacuum chamber 34. The interior space of the vacuum chamber 34 is set to a predetermined vacuum level by a vacuum pump. An inert gas such as argon gas can be supplied into the vacuum chamber 34.

[0083] The targets 35a, 35b include a first target 35a that forms a first anti-reflection film 10a on the first main surface MGa of the mother glass plate MG, and a second target 35b that forms a second anti-reflection film 10b on the second main surface MGb of the mother glass plate MG.

[0084] The first target 35a and the second target 35b include a plurality of targets for forming the first film (SiO 2 ) and the second film (HfO 2 ) of the first anti-reflection coating 10a and the second anti-reflection coating 10b.

[0085] 17 , in the first film formation step, the mother glass plate MG is placed in a vacuum chamber 34. Then, particles scattered from the first target 35a are caused to adhere to the first main surface MGa of the mother glass plate MG, thereby forming a first antireflection film 10a. Similarly, particles scattered from the second target 35b are caused to adhere to the second main surface MGb of the mother glass plate MG, thereby forming a second antireflection film 10b.

[0086] In the second film formation process, after the first film formation process, a metal layer 14 is formed so as to overlap the first antireflection film 10a. Specifically, a mask member for forming the metal layer 14 is fixed to the first main surface MGa of the mother glass plate MG. The mask member has an opening corresponding to a predetermined position (a position where the metal layer 14 is to be formed) in a portion of the mother glass plate MG that corresponds to the frame portion 7.

[0087] Furthermore, a target for forming the metal layer 14 is placed in the vacuum chamber 34, and particles scattered from the target are deposited on the first main surface MGa of the mother glass plate MG through the openings in the mask member, thereby forming a frame-shaped metal layer 14 with a constant thickness at a predetermined position on the mother glass plate MG.

[0088] Thereafter, the bonding portion 15 is formed so as to overlap the metal layer 14. The bonding portion 15 is formed by a process (coating process) in which, for example, a paste-like metal-based bonding material is coated on the metal layer 14 so as to overlap the metal layer 14. Specific examples of the coating process include a printing method using a mask (screen printing method) and a coating method using a dispenser.

[0089] The bonding portion 15 may be formed by, for example, arranging a molded body of a metal-based bonding material formed in advance into a predetermined frame shape so as to overlap the metal layer 14 .

[0090] Once the metal-based bonding material for the bonding portion 15 is applied to the first main surface MGa of the mother glass plate MG, a heat treatment process is carried out to fix the metal-based bonding material to the metal layer 14. The heat treatment process includes a heating process and a cooling process.

[0091] In the heating step, the mother glass plate MG is heated using a heating device such as a reflow furnace to melt the metal bonding material. The heating step may be performed, for example, in a furnace filled with nitrogen. In the heating step, the mother glass plate MG is heated to a temperature of 300° C. or higher.

[0092] In the cooling step, the metal-based bonding material melted on the first main surface MGa of the mother glass plate MG is cooled and solidified. The cooling step is preferably performed by slow cooling at a cooling rate of 50°C / min. In the cooling step, stress is generated in the mother glass plate MG due to the difference in thermal expansion coefficient between the mother glass plate MG and the bonding portion 15, but the first antireflection film 10a can relieve this stress.

[0093] Furthermore, since chipping around the through-holes 18 and microcracks on the inner surfaces of the through-holes 18 have been removed from the mother glass plate MG by the polishing process S2 and the etching process S3, the mother glass plate MG will not break even if the above-mentioned stress acts on it.

[0094] The cutting step S6 is a step of dividing the mother glass plate MG to form a plurality of lid members 4. In this embodiment, an example is shown in which the mother glass plate MG is subjected to a dicing process in the cutting step S6. The cutting step S6 is not limited to this embodiment, and the mother glass plate MG may be cut by scribing or laser irradiation.

[0095] 18 , in the cutting step S6, the mother glass plate MG is cut by a dicing blade 36 along imaginary cutting lines CL set on the mother glass plate MG. Note that, as shown in FIG. 16 , the cutting lines CL are set linearly so as to connect the plurality of through holes 18. Specifically, the cutting lines CL are set so as to pass through the corners 20 of each through hole 18.

[0096] 19 , a plurality of lid members 4 are formed from the mother glass plate MG in the cutting step S6. By cutting the mother glass plate MG along the planned cutting lines CL as described above, the sides 19 of the through holes 18 are configured as corners 7 e of the frame portions 7 of each lid member 4.

[0097] In the lid member 4 manufactured as described above, the side surfaces 7c of the sides 7d of the frame 7 serve as dicing surfaces, and the chamfered surfaces 7e1 of the corners 7e of the frame 7 serve as etching surfaces. The surface roughness (arithmetic mean roughness) Ra of the dicing surfaces is 1 μm or more and 100 μm or less. The surface roughness (arithmetic mean roughness) Ra of the etching surfaces is 0.5 nm or more and 100 nm or less.

[0098] 20 , in the joining step, the lid member 4 manufactured through the preparation step is laid on the base body 2. Specifically, the first main surface 7 a of the frame portion 7 of the lid member 4 is placed opposite the base body 2, and the joining portion 15 is brought into contact with the metal layer 6 formed on the first main surface 2 a of the base body 2.

[0099] Thereafter, the metal layer 6 and the bonding portion 15 are heated in a pressure-welded state (heating step), whereby the metal-based bonding material of the bonding portion 15 is melted.

[0100] The molten metal-based bonding material is then cooled and solidified (cooling process). During the cooling process, stress is generated in the frame 7 due to the difference in thermal expansion coefficient between the base 2 and the frame 7 of the lid member 4. In this case, the buffer portion 10a2 of the first anti-reflection coating 10a deforms to relieve this stress, thereby preventing damage to the frame 7. Furthermore, in the polishing process S2 and the etching process S3, chipping and microcracks associated with the through-holes 18 have been removed from the mother glass plate MG of the lid member 4. Therefore, even if the above-mentioned stress acts on the lid member 4, the corners 7e of the lid member 4 will not be damaged.

[0101] When the cooling step is completed, the sealing portion 5 is formed by integrally joining the metal layer 6 of the base 2 and the metal layer 14 of the lid member 4 at the joint 15. In this way, the package 1 that maintains airtightness is completed.

[0102] According to the present embodiment described above, by performing the polishing step S2 and the etching step S3 on the mother glass plate MG having the plurality of through holes 18 formed therein, it is possible to reliably remove chipping and microcracks formed in the through holes 18 by mechanical processing (blasting). This makes it possible to prevent damage to the mother glass plate MG and the lid member 4 caused by the through holes 18.

[0103] The present invention is not limited to the configuration of the above-described embodiment, nor is it limited to the above-described effects. The present invention can be modified in various ways without departing from the spirit of the present invention.

[0104] In the above embodiment, the lid member 4 and the mother glass plate MG are shown to have the first anti-reflection coating 10a and the second anti-reflection coating 10b formed thereon, but the present invention is not limited to this configuration. The lid member 4 and the mother glass plate MG according to the present invention may have only the first anti-reflection coating 10a or only the second anti-reflection coating 10b. Furthermore, the anti-reflection coatings 10a and 10b may be omitted.

[0105] In the above embodiment, the cover member 4 has one protrusion 8 , but is not limited to this, and may have a plurality of protrusions 8 .

[0106] REFERENCE SIGNS LIST 1 package 3 light emitting element 4 lid member 7 frame portion 7a first main surface of frame portion 7b second main surface of frame portion 7c side surface of frame portion 7d side portion of frame portion 7e corner portion of frame portion 8 protrusion portion 18 through hole 20 corner portion of through hole CL planned cutting line (imaginary line) MG mother glass plate (transparent substrate) MGa first main surface of mother glass plate MGb second main surface of mother glass plate S1 drilling step S2 polishing step S3 etching step S4 shaping step S5 film forming step S6 cutting step

Claims

1. A method for manufacturing a transparent member, comprising the steps of: forming a plurality of through holes in a transparent substrate by machining; polishing a main surface of the transparent substrate; and etching the plurality of through holes.

2. A method for manufacturing a transparent member as described in claim 1, further comprising a step of dividing the transparent substrate along imaginary lines connecting the plurality of through holes after the step of etching the plurality of through holes.

3. A method for manufacturing a transparent member as described in claim 1 or 2, characterized in that after the step of etching the plurality of through holes, a step of heat-forming the main surface of the transparent substrate so that a portion of the main surface becomes convex.

4. The method for manufacturing a transparent member according to claim 1 or 2, wherein the mechanical processing includes a blasting process.

5. A method for manufacturing a transparent member as described in claim 1 or 2, characterized in that the through hole is configured in a polygonal shape when viewed in a plane, the through hole has a plurality of corners, and the corners of the through hole are configured in a curved shape when viewed in a plane.

6. A method for manufacturing a transparent member as described in claim 1 or 2, characterized in that in the step of etching the plurality of through holes, the size of the through holes does not substantially change.

7. A method for manufacturing a transparent member as described in claim 2, characterized in that it comprises a step of forming a film on the main surface of the transparent substrate after the step of forming the plurality of through holes and before the step of dividing the transparent substrate.

8. The method for manufacturing a transparent member according to claim 2, wherein the step of dividing the transparent substrate includes a dicing process.

9. A transparent glass lid member used for a package including a light-emitting element, comprising: a plate-shaped frame portion; and a protrusion protruding from the frame portion; the frame portion has a first main surface, a second main surface located opposite the first main surface, and a side surface connecting the first main surface and the second main surface; the frame portion has a plurality of corners and a plurality of sides in a planar view; the side surface at the plurality of corners is an etched surface; and the side surface at at least one of the plurality of sides is a diced surface.

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