Magnet assembly and electronic device comprising same

Abstract

According to an embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may comprise a magnet assembly comprising: a housing comprising a first surface, a second surface facing a direction opposite to that of the first surface, a side surface surrounding the space formed between the first surface and the second surface, and a first through-hole formed in the side surface; a display disposed on the first surface of the housing; a digitizer disposed in the housing and facing the display; a pen accommodation part extending in a first axial direction from the first through-hole and disposed between the digitizer and the second surface of the housing; and a magnet assembly comprising multiple magnetic regions arranged around the pen receiving part in the first axial direction. Polarities of the neighboring magnetic regions are opposite to each other. The magnetic force of one of the two neighboring magnetic regions, which is disposed closer to the first through-hole, may be equal to or less than the magnetic force of the other magnetic region.

Description

Magnet assembly and electronic device including same

[0001] Examples disclosed in this document relate to a magnet assembly and an electronic device including the same.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment features like gaming, multimedia functions like music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing including a first surface and a second surface facing in an opposite direction to the first surface, a side surface surrounding a space formed between the first surface and the second surface, and a first through hole formed in the side surface, a display disposed on the first surface of the housing, a digitizer disposed within the housing to face the display, a pen receiving portion extending in a first axial direction from the first through hole and disposed between the digitizer and the second surface of the housing, and a magnet assembly including a plurality of magnetic regions arranged in the first axial direction around the pen receiving portion. Polarities of the adjacent magnetic regions may be opposite to each other, and a magnetic force of a magnetic region disposed closer to the first through hole among two adjacent magnetic regions may be equal to or less than a magnetic force of the other magnetic region.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first surface and a second surface facing in an opposite direction to the first surface, a display disposed on the first surface of the housing, a digitizer disposed within the housing to face the display, and a magnet assembly disposed between the digitizer and the second surface of the housing. The magnet assembly may include a plurality of magnetic regions arranged in a first axial direction. Polarities of the adjacent magnetic regions may be opposite to each other, and a magnetic force of a magnetic region disposed closer to a first through hole among two adjacent magnetic regions may be equal to or less than a magnetic force of the other magnetic region.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment disclosed in this document.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment disclosed in this document.

[0010] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 6 is a drawing for explaining the operation of a digital pen according to one embodiment of the present disclosure.

[0013] FIG. 7 is a block diagram illustrating a digital pen according to one embodiment of the present disclosure.

[0014] FIG. 8 is a perspective view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 9A is a cross-sectional side view taken along line AA of FIG. 8A according to one embodiment.

[0016] FIG. 9b is a side cross-sectional view taken along line AA of FIG. 8a according to one embodiment of the pen. FIG. 9a is a side cross-sectional view taken along line AA of FIG.

[0017] Fig. 10a is a drawing for explaining the magnetic field by the magnet assembly of Fig. 9a.

[0018] Figure 10b is a drawing for explaining the magnetic field by the magnet assembly of Figure 9b.

[0019] FIG. 11 is a cross-sectional side view illustrating a magnet assembly of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 12 is a flowchart illustrating a method for manufacturing the magnet assembly of FIG. 11 according to one embodiment.

[0021] FIG. 13 is a cross-sectional side view illustrating a magnet assembly of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 14 is a flowchart illustrating a method for manufacturing the magnet assembly of FIG. 13 according to one embodiment.

[0023] FIG. 15 is a cross-sectional side view illustrating a magnet assembly of an electronic device according to one embodiment of the present disclosure.

[0024] FIGS. 16A and 16B are diagrams showing the arrangement of magnetic regions and magnetic field strength of a magnet assembly according to one embodiment of the present disclosure.

[0025] FIG. 17 is a drawing showing the arrangement of magnetic regions and magnetic field strength of a magnet assembly according to one embodiment of the present disclosure.

[0026] FIG. 18 is a drawing showing the arrangement of magnetic regions and magnetic field strength of a magnet assembly according to one embodiment of the present disclosure.

[0027] FIG. 19A is a drawing for explaining the distribution of a magnetic member arranged in an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 19b is a plan view illustrating a magnet assembly and a digital pen arranged within an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 20 is a plan view showing a magnet assembly and a digital pen according to one embodiment of the present disclosure.

[0030] FIG. 21 is a drawing for explaining the magnetic field distribution of a magnet assembly according to one embodiment of the present disclosure.

[0031] FIG. 22a is a drawing for explaining a magnet assembly and magnetic field distribution according to one embodiment of the present disclosure.

[0032] FIG. 22b is a side cross-sectional view of the magnet assembly of FIG. 22a according to one embodiment of the present disclosure.

[0033] FIG. 23a is a drawing for explaining a magnet assembly and magnetic field distribution according to one embodiment of the present disclosure.

[0034] FIG. 23b is a cross-sectional side view of the magnet assembly of FIG. 23a according to one embodiment of the present disclosure.

[0035] FIG. 24 is a drawing for explaining a demagnetization device and a digital pen of an electronic device according to one embodiment of the present disclosure.

[0036] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0037] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0038] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0039] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0040] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0041] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0042] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0043] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0044] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0045] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0046] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0047] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0048] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0049] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0050] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0051] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0052] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0053] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0054] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0055] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0056] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0057] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0058] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0059] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0060] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0061] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0062] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0063] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the one embodiment disclosed in this document. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0064] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0065] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0066] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0067] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0068] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0069] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0070] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0071] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0072] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) can receive at least a portion of light incident on the first side (210A) (or front) of the electronic device (101) through the display (210) inside the electronic device (101).

[0073] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received through a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or processor (e.g., processor (180) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0074] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0075] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0076] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0077] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0078] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side bezel structure (or side bezel structure) (222), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one printed circuit board (or board assembly) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear of FIG. 3). It may include a plate (211)). According to one embodiment, when including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit boards (240a, 240b) may include a first circuit board (240a) positioned above the battery (245) (e.g., in the +Y-axis direction) and a second circuit board (240b) positioned below the battery (245) (e.g., in the -Y-axis direction), and the flexible printed circuit board (240c) may electrically connect the first circuit board (240a) and the second circuit board (240b).

[0079] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible printed circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0080] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed inside the electronic device (101) and connected to or formed integrally with the side bezel structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side bezel structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the printed circuit board (240a, 240b) may be disposed on the other side.

[0081] In one embodiment, the support structure (221) and the side bezel structure (222) may be combined and referred to as a front case or housing (220). In one embodiment, the housing (220) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or batteries (245). In one embodiment, the housing (220) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side bezel structure (222), a front plate (202), and / or a back plate (290). In one embodiment, the front or back of the housing (220) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) disposed to be exposed to the outside through at least a portion of the display (201).

[0082] In one embodiment, the camera module (230) may include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIGS. 4 and 5. In one embodiment, the camera module (230) may be disposed on a portion of the support structure (221) adjacent to the printed circuit board (240a, 240b). In one embodiment, the camera module (230) may be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) may receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).

[0083] According to one embodiment, a circuit device (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electrical / electronic components implemented in the form of an integrated circuit chip may be disposed on the printed circuit board (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In some embodiments, the printed circuit board (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).

[0084] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0085] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., a first circuit board (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first circuit board (240a) interposed therebetween.

[0086] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed. In one embodiment, electrical / electronic components, such as interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional printed circuit board (not shown). In this case, the lower rear case (250b) can be placed to surround the additional printed circuit board (not shown) together with another part of the support structure (221). For example, the interfaces placed on the additional printed circuit board (not shown) or the lower rear case (250b) (not shown) can be placed corresponding to the sound hole (207) or the connector holes (208, 209) of FIG. 2.

[0087] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side bezel structure (222).

[0088] FIG. 6 is a diagram illustrating the operation of a digital pen according to one embodiment of the present disclosure. FIG. 7 is a block diagram illustrating a digital pen according to one embodiment of the present disclosure.

[0089] Referring to FIG. 6, the electronic device (101) may include a display (310), a digitizer (320), and a metal sheet (330). The configuration of the electronic device (101) and the display (310) of FIG. 6 may be all or part of the same as the configuration of the electronic device (101) and the display (201; 220) of FIGS. 2 to 5.

[0090] According to one embodiment, the digitizer (320) may be a panel for detecting an input of a digital pen (400) (e.g., an electromagnetic inductor). The digitizer (320) may be referred to as an electromagnetic induction panel. The digital pen (400) may provide an input to the electronic device (101) using an electro-magnetic resonance (EMR), an active electrical stylus (AES), or an electric coupled resonance (ECR) method. The digital pen (400) may be referred to as a stylus. For example, the digitizer (320) may include a circuit board (e.g., a printed circuit board or a flexible printed circuit board) and a plurality of coils positioned within the circuit board. The plurality of coils of the digitizer (320) may generate a magnetic field. The digital pen (400) may resonate based on the magnetic field generated from the digitizer, and a magnetic field may be formed in the coils of the digital pen (400) by the resonance. By a magnetic field formed from the digital pen (400), current can be output from the coils of the digitizer (320). The electronic device (101) can confirm (or detect) the position of the digital pen (400) based on the size of the current (e.g., converted digital values) per channel output from the multiple coils of the digitizer (320).

[0091] According to one embodiment, the digitizer (320) may include a pattern layer having a transmission pattern formed thereon and a pattern layer having a reception pattern formed thereon. The transmission pattern and the reception pattern layers may be laminated to generate or detect an electromagnetic field. The electronic device (101) may use the digitizer (320) to detect a magnetic field generated from the digital pen (400) through an EMR method and may detect various motions, such as approaching, clicking, or dragging the digital pen (400). According to one embodiment, the digitizer (320) may include coils that may generate a magnetic field based on the movement of the digital pen (400). For example, the digitizer (320) may include coils facing the display (310) and coils facing an absorber layer of a metal sheet (e.g., the metal sheet (300) of FIG. 6). According to one embodiment, the digitizer (320) may be referred to as a part of the display (310). For example, the display (310) and digitizer (320) may be provided as a single modular component (e.g., a display assembly).

[0092] In one embodiment, the metal sheet (330) can provide uniform inductance. For example, the metal sheet (330) can include a metal (e.g., copper) and can reduce destructive interference due to eddy currents. For example, the metal sheet (330) can reduce eddy currents generated in the digitizer (320) by allowing at least a portion of a magnetic field passing through the digitizer (320) to flow within the metal sheet (330). For example, the metal sheet (330) can support the display (310) and / or the digitizer (320). For example, the metal sheet (330) may also be referred to as a support sheet or a support plate.

[0093] In one embodiment, the metal sheet (330) may include an absorber layer to enhance the sensitivity for detecting an input (e.g., proximity) of the digital pen (400). For example, the absorber layer may be located below (in the -Z direction) the digitizer (320). For example, the absorber layer may increase the inductance of the coil (401) of the digital pen (400). For example, the absorber layer may have a specified permeability and / or thickness to increase the inductance of the coil (401). In one embodiment, the absorber layer may reduce electromagnetic interference of the digitizer (320). For example, the absorber layer may include magnetic metal powder. For example, the absorber layer may be referred to as a layer of magnetic metal powder applied below the digitizer (320). The absorber layer can reduce the magnitude of the magnetic field of the electronic components located within the housing (e.g., the housing (201) of FIG. 4) transmitted to the digitizer (320) in addition to the signal input from the digital pen. By reducing the magnetic field of the electronic components located within the electronic device (101) transmitted to the digitizer (320), noise of the digitizer (320) can be reduced. According to one embodiment, the absorber layer can be referred to as a high-frequency absorber layer.

[0094] According to one embodiment, the digital pen (400) can react to a magnetic field generated by the digitizer (320). For example, the digital pen (400) can include a coil (401) configured to resonate based on the magnetic field generated by the digitizer (320). The digital pen (400) can generate a magnetic field by utilizing the resonance of the coil (401). The digitizer (320) can output a current based on the magnetic field generated by the digital pen (400). For example, the coil (401) can be in the form of a wire wound around a ferrite material.

[0095] According to one embodiment, the digital pen (400) may store power using a capacitor. For example, the digital pen (400) may include at least one variable capacitor (402) and at least one fixed capacitor (403).

[0096] According to one embodiment, the memory (e.g., the memory (130) of FIG. 1) of the electronic device (101) can store a calibration value for the operation of the digital pen (400) in a state of no interference. The processor (e.g., the processor (120) of FIG. 1) of the electronic device (101) can determine the input of the digital pen (400) using the calibration value stored in the memory (130). However, if magnetic field interference due to an external magnetic field occurs in the digital pen (400), the accuracy of the position determination of the digital pen (400) by the processor (120) of the electronic device (101) may decrease. In the present disclosure, the magnetic field interference occurring in the digital pen (400) occurs when the inductance of the coil (401) is changed by a magnetic field external to the digital pen (400). It can be defined as a phenomenon in which a digital pen (400) malfunctions due to a change in the resonant frequency defined as . Here, the external magnetic field to which the digital pen (400) is exposed may refer to a magnetic field generated from a surrounding magnet, such as a magnet existing in the electronic device (101).

[0097] For example, the inductance value of the coil (401) of the digital pen (400) may be determined according to the shape in which the coil (401) is wound on a ferrite material and / or the permeability of the surrounding material (e.g., ferrite and metal sheet (330)). For example, if the inductance increases due to magnetic field interference, it may be detected that the capacitance has increased, which may cause a malfunction in which input is made without clicking or writing with the digital pen (400) on the digitizer (320). Conversely, if the inductance decreases due to magnetic field interference, it may be detected that the capacitance has decreased, which may cause a malfunction in which input is not made even when writing with the digital pen (400) on the digitizer (320). For example, an error occurring in the coil (401) of the digital pen (400) may be perceptible to the user if it exceeds about 0.2 uH. For example, the processor (120) of the electronic device (101) can compensate for a deviation of about 0.2 uH to about 1 uH using a calibration value stored in a memory (e.g., memory (130) of FIG. 1).

[0098] For example, the coil (401) of the digital pen (400) (e.g., the ferrite of the coil (401)) may be magnetized when it is adjacent to a surrounding magnet and then separated from it. For example, when the coil (401) is in a magnetized state and then comes into proximity to a surrounding magnet again, the magnetic field interference due to the magnetization of the coil (401) and the resulting malfunction of the digital pen (400) may be intensified. For example, when the coil (401) is exposed to an external magnetic field having the same polarity as the magnetized polarity (e.g., N pole or S pole), the magnetic field interference may be intensified. When the magnetic field of the surrounding magnet is in the same direction as the magnetized polarity of the coil (401), the magnetic field interference may be greater.

[0099] For example, the coil (401) can be demagnetized by alternately applying magnetic fields of gradually decreasing strength in the + and - directions to the magnetized coil (401) (e.g., the ferrite of the coil (401)). Specifically, for example, by alternately applying magnetic fields in opposite directions, such as applying a magnetic field that magnetizes the coil (401) with a strength of +10 to -9, a magnetic field that magnetizes it by +8, and a magnetic field that magnetizes it by -7, the coil (401) can be demagnetized so that the residual magnetism approaches 0. As described below, according to one embodiment of the present disclosure, the electronic device (101) may include a magnet assembly (e.g., the magnet assembly (370) of FIGS. 9A and 9B) for demagnetizing the residual magnetization of the digital pen (400).

[0100] FIG. 7 is a block diagram illustrating a digital pen according to one embodiment of the present disclosure. Referring to FIG. 7, the digital pen (400) may include a processor (460), a memory (470), a resonant circuit (487), a charging circuit (488), a battery (489), a communication circuit (490), an antenna (497), and / or a trigger circuit (498). In some embodiments, the processor (460), at least a portion of the resonant circuit (487), and / or at least a portion of the communication circuit (490) of the digital pen (400) may be configured on a printed circuit board or in the form of a chip. The processor (460), the resonant circuit (487), and / or the communication circuit (490) may be electrically connected to the memory (470), the charging circuit (488), the battery (489), the antenna (497), or the trigger circuit (498). According to one embodiment, the digital pen (400) may be composed of only a resonant circuit (487) and a button.

[0101] The processor (460) may include a generic processor configured to execute a customized hardware module or software (e.g., an application program). The processor may include hardware components (functions) or software elements (programs) including at least one of various sensors provided in the digital pen (400), a data measurement module, an input / output interface, a module for managing the status or environment of the digital pen (400), or a communication module. The processor (460) may include, for example, one or a combination of two or more of hardware, software, or firmware. According to one embodiment, the processor (460) may receive a proximity signal corresponding to an electromagnetic field signal generated from a digitizer (320) included in a display module (e.g., the display module (160) of FIG. 1) of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 6) through a resonant circuit (487). When the above proximity signal is confirmed, the resonant circuit (487) can be controlled to transmit an electromagnetic resonance (EMR) input signal to the electronic device (101).

[0102] The above memory (470) can store information related to the operation of the digital pen (400). For example, the information can include information for communication with the electronic device (101) and frequency information related to the input operation of the digital pen (400).

[0103] The resonant circuit (487) may include at least one of a coil, an inductor, or a capacitor. The resonant circuit (487) may be used by the digital pen (400) to generate a signal including a resonant frequency. For example, to generate the signal, the digital pen (400) may use at least one of an electromagnetic resonance (EMR) method, an active electrostatic (AES) method, or an electrically coupled resonance (ECR) method. When the digital pen (400) transmits a signal using the EMR method, the digital pen (400) may generate a signal including a resonant frequency based on an electromagnetic field generated from an inductive panel of the electronic device (101). When the digital pen (400) transmits a signal using the AES method, the digital pen (400) can generate a signal using capacitive coupling with the electronic device (101). When the digital pen (400) transmits a signal using the ECR method, the digital pen (400) can generate a signal including a resonant frequency based on an electric field generated from a capacitive device of the electronic device (101). According to one embodiment, the resonant circuit (487) can be used to change the intensity or frequency of the electromagnetic field according to the user's manipulation state. For example, the resonant circuit (487) can provide a frequency for recognizing a hovering input, a drawing input, a button input, or an erasing input.

[0104] The above charging circuit (488) can, when connected to the resonant circuit (487) based on a switching circuit, rectify the resonant signal generated from the resonant circuit (487) into a DC signal and provide it to the battery (489). According to one embodiment, the digital pen (400) can use the voltage level of the DC signal detected by the charging circuit (488) to determine whether the digital pen (400) is inserted into a protective cover (e.g., the protective cover (300) of FIG. 5).

[0105] The battery (489) may be configured to store power required for the operation of the digital pen (400). The battery may include, for example, a lithium-ion battery or a capacitor, and may be rechargeable or replaceable. According to one embodiment, the battery (489) may be charged using power (e.g., a direct current signal (direct current power)) provided from the charging circuit (488).

[0106] The above communication circuit (490) may be configured to perform a wireless communication function between a communication module (e.g., the communication module (190) of FIG. 1) of a digital pen (400) and an electronic device (e.g., the electronic device (101) of FIG. 1). According to one embodiment, the communication circuit (490) may transmit status information and input information of the digital pen (400) to the electronic device (101) using a short-range communication method. For example, the communication circuit (490) may transmit direction information (e.g., motion sensor data) of the digital pen (400) obtained through a trigger circuit (498), voice information input through a microphone, or remaining battery (489) information to the electronic device (101). As an example, the short-range communication method may include at least one of Bluetooth, BLE (Bluetooth low energy), or wireless LAN.

[0107] The antenna (497) may be used to transmit or receive signals or power to or from an external source (e.g., the electronic device (101)). According to one embodiment, the digital pen (400) may include a plurality of antennas (497), and among these, at least one antenna (497) suitable for a communication method may be selected. Through the selected at least one antenna (497), the communication circuit (490) may exchange signals or power with an external electronic device.

[0108] The trigger circuit (498) may include at least one button or sensor circuit. According to one embodiment, the processor (460) may check the input method (e.g., touch or press) or type (e.g., EMR button or BLE button) of the button of the digital pen (400). According to one embodiment, the sensor circuit may generate an electric signal or data value corresponding to the internal operating state or external environmental state of the digital pen (400). For example, the sensor circuit may include at least one of a motion sensor, a battery level detection sensor, a pressure sensor, a light sensor, a temperature sensor, a geomagnetic sensor, and a biometric sensor. According to one embodiment, the trigger circuit (498) may transmit a trigger signal to the electronic device (101) using an input signal of a button or a signal through a sensor. The configuration of the resonant circuit (487) and battery (489) of FIG. 7 may be all or part of the same as the configuration of the coil (401) and capacitor (402, 403) of FIG. 6.

[0109] FIG. 8 is a perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 9A is a side cross-sectional view taken along line AA of FIG. 8A according to an embodiment. FIG. 9B is a pen. FIG. 9A is a side cross-sectional view taken along line AA of FIG. 8A according to an embodiment. FIG. 10A is a drawing for explaining a magnetic field by the magnet assembly of FIG. 9A. FIG. 10B is a drawing for explaining a magnetic field by the magnet assembly of FIG. 9B.

[0110] All or part of the configuration of the electronic device (101) of FIG. 8 may be identical to or similar to the configuration of the electronic device (101) of FIGS. 1 to 6.

[0111] Referring to FIGS. 8 through 9B, in one embodiment, the electronic device (101) may include a housing (340) (e.g., the housing (210) of FIGS. 2 and 3 , the housing (220) of FIGS. 4 and 5 , and / or the housing (330) of FIG. 6 ), a display (310) (e.g., the display (201) of FIGS. 2 through 5 ), a digitizer (320) (e.g., the digitizer (320) of FIG. 6 ), a metal sheet (330) (e.g., the metal sheet (330) of FIG. 6 ), and a pen receiving portion (350) and a magnet assembly (370). The digital pen (400) (e.g., the digital pen (400) of FIG. 6 ) may be magnetized by a surrounding magnet during use. As described below, according to one embodiment of the present disclosure, during the process of storing or separating the magnetized digital pen (400) from the pen receiving portion (350), the digital pen (400) may be demagnetized by being exposed to the magnetic field (or attenuating magnetic field) of the magnet assembly (370). According to the demagnetization function of the digital pen (400) by the magnet assembly (370), an input malfunction of the digital pen (400) due to magnetic field interference of the magnetized digital pen (400) may be suppressed.

[0112] According to one embodiment, a housing (340) of an electronic device (101) may include a first side (340A) (e.g., the first side (210A) of FIG. 2), a second side (340B) facing in an opposite direction from the first side (340A) (e.g., the second side (210B) of FIG. 3), and a side surface (340C) surrounding a space between the first side (340A) and the second side (340B). According to one embodiment, the housing (340) may include a front plate (e.g., the front plate (202) of FIG. 2) (e.g., a glass plate including various coating layers, or a polymer plate) at least partially transparent, and the first side (340A) may be formed by the front plate. According to one embodiment, the housing (340) may include a back plate (e.g., the back plate (211) of FIG. 3), and the second side (340B) may be formed by the back plate. According to one embodiment, the housing (340) may include a support structure (341) that is disposed inside the electronic device (101) and supports electrical / electronic components (e.g., a printed circuit board) of the electronic device (101).

[0113] According to one embodiment, the side structure (342) is a side of the housing (340). According to one embodiment, the housing (340) may include a first through hole (341a) formed in the side surface (340C). The first through hole (341a) may be connected to the pen receiving portion (350) of the electronic device (101). In FIG. 8, the first through hole (341a) is illustrated as being located at the upper portion of the electronic device (101) (e.g., the +Y direction side surface (340C)), but the position of the first through hole (341a) may be changed in the present disclosure. For example, the first through hole (341a) may be located at the left and right ends of the electronic device (101) (e.g., the X-axis direction side surface (340C)).

[0114] According to one embodiment, the pen receiving portion (350) of the electronic device (101) may be formed to receive a digital pen (400) outside the electronic device (101). For example, the digital pen (400) may be received in the pen receiving portion (350) or separated from the pen receiving portion (350) in the direction of the arrow in FIG. 9A. According to one embodiment, the pen receiving portion (350) may be disposed between the digitizer (320) (or the metal sheet (330)) and the second surface (340B) of the housing (340). According to one embodiment, the pen receiving portion (350) may be formed in the support structure (341) of the housing (340). The pen receiving portion (350) may be a space formed to extend from the first through hole (341a) to the support structure (341) in a first axial direction (e.g., Y-axis direction). The arrangement and shape of the pen receiving portion (350) in the present disclosure may be changed. For example, the first through hole (341a) may be located at the left and right ends of the electronic device (101) (e.g., the X-axis direction side (340C)), and the pen receiving portion (350) may be extended in a lateral direction (e.g., the X-axis direction).

[0115] According to one embodiment, the magnet assembly (370) of the electronic device (101) may include a plurality of magnetic regions (371, 372, 373) arranged or lined up in the first axial direction (e.g., Y-axis direction) around the pen receiving portion. According to one embodiment, the polarities (e.g., N pole or S pole) of the adjacent magnetic regions (371, 372, 373) of the magnet assembly (370) may be opposite to each other. The magnetic force of the magnetic region (371, 372) that is arranged closer to the first through hole (341a) of the housing (340) among the two adjacent magnetic regions (371, 372, 373) may be equal to or smaller than the magnetic force of the other magnetic region (372, 373).

[0116] In one embodiment, the magnetic regions (371, 372, 373) of the magnet assembly (370) can be positioned between the pen receiving portion (350) and the second surface (340B) of the housing (340). For example, as the magnetic regions (371, 372, 373) of the magnet assembly (370) are positioned away from the digitizer (320), magnetic field interference with the digitizer (320) caused by the magnetic regions (371, 372, 373) can be reduced or prevented.

[0117] Referring to FIGS. 9A and 9B , according to one embodiment, the magnetic regions (371, 372, 373) of the magnet assembly (370) may include a first magnetic region (371) disposed furthest from the first through hole (341a) of the housing (340), a third magnetic region (373), and a second magnetic region (372) disposed between the first magnetic region (371) and the third magnetic region (373). According to one embodiment, the strength of the magnetic force or magnetic field may gradually increase as one moves toward the third magnetic region (373), the second magnetic region (372), and the first magnetic region (371). According to one embodiment, the magnetism of the first magnetic region (371) may be opposite to the magnetism of the second magnetic region (372), and the magnetism of the second magnetic region (372) may be opposite to the magnetism of the third magnetic region (372). For example, the magnetic regions (371, 372, 373) may be spaced apart from each other. For example, the spacing distance between the magnetic regions (371, 372, 373) may be constant or may be set to vary. In the present disclosure, the number, shape, and arrangement of the magnetic regions (371, 372, 373) are not limited and may be changed.

[0118] According to one embodiment, the digital pen (400) (e.g., the digital pen (400) of FIG. 6) may be magnetized by a surrounding magnet, and may be demagnetized by a magnet assembly (370) when the digital pen (400) is stored in or removed from the pen receiving portion (350) in a magnetized state. According to one embodiment, the digital pen (400) may be demagnetized by being exposed to a magnetic field (or a damping magnetic field) of the magnet assembly (370) when moved within the pen receiving portion (350). The damping magnetic field of the magnet assembly (370) may alternate in a + direction and a - direction and may gradually increase in magnitude as it moves away from the first through hole (341a) of the housing (340). The residual magnetism of the coil (401) approaches 0 and may be demagnetized.

[0119] Referring to FIG. 9B, according to one embodiment, the magnet assembly (370) may further include an additional magnetic region (374) (or a fourth magnetic region) adjacent to the first magnetic region (371). The additional magnetic region (374) may at least partially face the first magnetic region (371). According to one embodiment, the magnetization of the additional magnetic region (374) may be opposite to the magnetization of the first magnetic region (371). According to one embodiment, the magnetic force (or the strength of the magnetic field) of the additional magnetic region (374) of the magnet assembly (370) may be less than the magnetic force (or the strength of the magnetic field) of the first magnetic region (371). For example, the additional magnetic region (374) may be aligned or overlapped with the first magnetic region (371) with respect to a first axial direction (e.g., the Y-axis direction).

[0120] FIGS. 10A and 10B are schematic diagrams for explaining changes in the magnetic field of the first magnetic region (371) depending on the presence or absence of an additional magnetic region (374). Referring to FIG. 10A, the first magnetic region (371) may have the greatest magnetic force (or magnetic field strength) among the magnetic regions (371, 372, 373), and accordingly, may have a relatively greater influence of magnetic field interference on surrounding electric / electronic components such as the digitizer (320) compared to the second magnetic region (372) and the third magnetic region (373). For example, the digitizer (320) may be located above (in the +Z direction) the magnetic regions (371, 372, 373) based on FIGS. 10A and 10B, and the magnetic field of the first magnetic region (371) may act toward the digitizer (320). Referring to FIG. 10B, a portion of the magnetic field of the first magnetic region (371) may act toward the additional magnetic region (374), thereby suppressing or reducing the influence of the magnetic field of the first magnetic region (371) toward the digitizer (320). Referring to FIGS. 10A and 10B, according to one embodiment, when the magnet assembly (370) includes the additional magnetic region (374), the influence or magnetic field interference of the magnetic field of the first magnetic region (371) on the digitizer (320) may be reduced compared to when the magnet assembly (370) does not include the additional magnetic region (374), and malfunction of the digitizer (320) may be prevented.

[0121] FIG. 11 is a side cross-sectional view illustrating a magnet assembly of an electronic device according to one embodiment of the present disclosure. FIG. 12 is a flowchart illustrating a method for manufacturing the magnet assembly of FIG. 11 according to one embodiment. FIG. 13 is a side cross-sectional view illustrating a magnet assembly of an electronic device according to one embodiment of the present disclosure. FIG. 14 is a flowchart illustrating a method for manufacturing the magnet assembly of FIG. 13 according to one embodiment.

[0122] The support structure (341) of FIGS. 11, 13, and 14 may be referred to as the support structure (341) of FIGS. 9a and 9b. The magnet assembly (370) of FIGS. 11 and 13 may be referred to as the magnet assembly (370) of FIGS. 9a to 10b.

[0123] Referring to FIGS. 11 and 12, according to one embodiment, the magnetic regions (371, 372, 373) of the magnet assembly (370) may be different magnetic elements. For example, the first magnetic region (371) (or first magnetic element), the second magnetic region (372) (or second magnetic element), and the third magnetic region (373) (or third magnetic element) may be spaced apart from each other at a predetermined interval. The mounting portion (e.g., the pen receiving portion (350) of FIGS. 9A and 9B) and the digital pen (400) (e.g., the digital pen (400) of FIGS. 9A and 9B) may be positioned above (e.g., in the +Z axis direction) the magnetic regions (371, 372, 373), similar to the embodiment of FIGS. 9A and 9B, although not illustrated in FIGS. 11 and 12. The strength of the magnetic field exerted by the magnetic areas (371, 372, 373) (or magnetic members) on the digital pen (400) (e.g., the digital pen (400) of FIGS. 9A and 9B) can be set by adjusting the size of the magnetic areas (371, 372, 373) as in the embodiment of FIG. 11, or by adjusting the distance of the areas (371, 372, 373) to the digital pen (400) as in the embodiment of FIG. 12.

[0124] Referring to FIG. 11, according to one embodiment, for example, the size of the second magnetic region (372) may be larger than the size of the third magnetic region (373) and smaller than the size of the first magnetic region (371). Referring to FIG. 11, according to one embodiment, the support structure (341) of the housing (340) (e.g., the housing (340) of FIGS. 9A and 9B) may include accommodation parts (3411, 3412, 3413). According to one embodiment, the magnetic regions (371, 372, 373) of the magnet assembly (370) may be disposed in the accommodation parts (3411, 3412, 3413).

[0125] According to one embodiment, a sealing member (391) may be disposed on one surface (e.g., a +Z direction surface) of the magnetic regions (371, 372, 373). The sealing member (391) may be understood as a component included in the electronic device (101) or the magnet assembly (370). For example, the sealing member (391) may cover together the surface (e.g., a +Z direction surface) of the support structure (341) positioned between the magnetic regions (371, 372, 373). For example, the sealing member (391) may protect the magnetic regions (371, 372, 373) and secure the magnetic regions (371, 372, 373) to the mounting portions (3411, 3412, 3413).

[0126] Referring to FIG. 12, a method for manufacturing a magnet assembly (370) may include an operation of preparing (or manufacturing) a housing (340) (or a support structure (341)) including mounting portions (3411, 3412, 3413) (e.g., operation (11) of preparing a housing of FIG. 12). The manufacturing method may include an operation of arranging magnetic regions (371, 372, 373) (or magnetic members or magnets) in the mounting portions (3411, 3412, 3413) of the housing (340) (e.g., operation (12) of arranging magnets in the mounting portions of the housing of FIG. 12). The above manufacturing method may include an operation of forming, applying or placing a sealing member (391) on the surface (e.g., +Z direction surface) of the above-described mounting portions (3411, 3412, 3413) and magnetic regions (371, 372, 373) (e.g., surface sealing operation (13) of FIG. 12).

[0127] Referring to FIG. 13, according to one embodiment, the magnet assembly (370) may further include a case (360) (or casing) that supports magnetic regions (371, 372, 373). According to one embodiment, the case (360) may include mounting portions (361, 362, 363) on which the magnetic regions (371, 372, 373) (or magnetic members) are arranged. According to one embodiment, the depth or height (e.g., the Z-direction depth or height) of the mounting portions (361, 362, 363) of the case (360) may be different from each other. According to one embodiment, the depth (e.g., Z-direction depth) of the second seating portion (362) in which the second magnetic region (372) is arranged may be greater than the depth (e.g., Z-direction depth) of the first seating portion (361) in which the first magnetic region (371) is arranged and may be less than the depth (e.g., Z-direction depth) of the third seating portion (363) in which the third magnetic region (373) is arranged. In this case, for example, the first magnetic region (371), the second magnetic region (372), and the third magnetic region (373) may have similar or substantially the same sizes. However, in the present disclosure, the depth, shape, and sizes of the seating portions (361, 362, 363) of the case (360) and the magnetic regions (371, 372, 373) are not limited and may be changed.

[0128] According to one embodiment, a sealing member (391) may be disposed on one surface (e.g., a +Z direction surface) of the magnetic regions (371, 372, 373). The sealing member (391) may be understood as a component included in the electronic device (101) or the magnet assembly (370). For example, the sealing member (391) may cover together the surface (e.g., a +Z direction surface) of the support structure (341) located between the magnetic regions (371, 372, 373). For example, the sealing member (391) may protect the magnetic regions (371, 372, 373) and secure the magnetic regions (371, 372, 373) to the mounting portions (361, 362, 363) of the case (360).

[0129] Referring to FIG. 14, according to one embodiment, a method of manufacturing a magnet assembly (370) may include an operation of preparing (or manufacturing) a case (360) including mounting portions (361, 362, 363) (e.g., operation (21) of preparing a case of FIG. 14). The manufacturing method may include an operation of arranging magnetic regions (371, 372, 373) (or magnetic members or magnets) in the mounting portions (361, 362, 363) of the case (360) (e.g., operation (22) of arranging magnets in the mounting portions of the case of FIG. 14). The manufacturing method may include an operation of forming, applying, or arranging a sealing member (391) on the surface (e.g., +Z direction surface) of the mounting portions (361, 362, 363) and / or the magnetic regions (371, 372, 373) of the case (360) (e.g., surface sealing operation (23) of FIG. 14). The manufacturing method may include an operation of arranging a magnet assembly (370) including the case (360) and the magnetic regions (371, 372, 373) in a housing (e.g., housing (340) of FIGS. 9A and 9B) (or support structure (341)) of an electronic device (e.g., electronic device (101) of FIGS. 1 to 8) (e.g., operation (24) of arranging a magnet assembly in a housing of FIG. 14).

[0130] FIG. 15 is a cross-sectional side view of a magnet assembly of an electronic device according to an embodiment of the present disclosure. FIG. 16A and FIG. 16B are diagrams illustrating the arrangement of magnetic regions and magnetic field strength of a magnet assembly according to an embodiment of the present disclosure. FIG. 17 is a diagram illustrating the arrangement of magnetic regions and magnetic field strength of a magnet assembly according to an embodiment of the present disclosure. FIG. 18 is a diagram illustrating the arrangement of magnetic regions and magnetic field strength of a magnet assembly according to an embodiment of the present disclosure.

[0131] The support structure (341) of FIG. 15 may be referred to as the support structure (341) of FIGS. 9A and 9B. It may be referred to as the magnet assembly (370) of FIGS. 9A to 10B. All or part of the configuration of the magnet assembly (370) of the embodiments of FIGS. 15 to 18 may be identical or similar to the configuration of the magnet assembly (370) of the embodiments of FIGS. 9A to 14.

[0132] Referring to FIG. 15, according to one embodiment, the magnet assembly (370) may include a single magnetic member comprising magnetic regions (371, 372, 373). For example, the single magnetic member may be formed to extend in a first axial direction (e.g., the Y-axis direction).

[0133] In one embodiment, the magnet assembly (370) can include a plurality of magnetic regions (371, 372, 373) and non-magnetic regions (384, 385) disposed between the magnetic regions (371, 372, 373). For example, the magnetic regions (371, 372, 373) of the magnet assembly (370) can be formed by multipolar magnetization of different regions of a single magnetic member. In one embodiment, the polarities (e.g., N pole or S pole) of adjacent magnetic regions (371, 372, 373) of the magnetic regions (371, 372, 373) of the magnet assembly (370) can be opposite to each other. The non-magnetic regions (384, 385) may be located between the magnetic regions (371, 372, 373) and may be sections where no magnetic field is formed. According to one embodiment, the magnet assembly (370) may include a first non-magnetic region (384) disposed between the first magnetic region (371) and the second magnetic region (372) and a second non-magnetic region (376) disposed between the second magnetic region (372) and the third magnetic region (373). According to one embodiment, a first axial direction (e.g., Y-axis direction) length (d2) of the second magnetic region (372) may be greater than a first axial direction (e.g., Y-axis direction) length (d3) of the third magnetic region (373) and may be less than a first axial direction (e.g., Y-axis direction) length (d1) of the first magnetic region (371).

[0134] In one embodiment, the support structure (341) may include a seating area (3415) for accommodating the single magnetic member. In one embodiment, a sealing member (391) may be disposed on one surface (e.g., a +Z direction surface) of the support structure (341) and / or the magnetic areas (371, 372, 373). The sealing member (391) may be understood as a component included in the electronic device (101) or the magnet assembly (370). For example, the sealing member (391) may protect the magnetic areas (371, 372, 373) and secure them to the seating portion (3415) of the support structure (341).

[0135] According to one embodiment, a digital pen (400) (e.g., the digital pen (400) of FIGS. 6, 9A, and 9B) for applying an input signal to a digitizer (e.g., the digitizer (320) of FIGS. 9A and 9B) of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 8) may be magnetized by a surrounding magnet. According to one embodiment of the present disclosure, during a process of storing or separating the magnetized digital pen (400) from or to the pen receiving portion (350), the digital pen (400) may be demagnetized by being exposed to a magnetic field (or a damping magnetic field) of a magnet assembly (370). By the demagnetization function of the digital pen (400) by the magnet assembly (370), an input malfunction of the digital pen (400) due to magnetic field interference of the magnetized digital pen (400) may be suppressed. Referring to the graphs of FIGS. 16A to 18, according to one embodiment, the attenuating magnetic field of the magnet assembly (370) may alternate in the + and - directions and gradually increase in strength as it moves away from the first through hole (e.g., the first through hole (341a) of FIGS. 9A and 9B) (or as it moves in the -Y direction).

[0136] The lengths (d1, d2, d3) and spacings (t1, t2) of the magnetic regions (371, 372, 373) of the magnet assembly (370) of FIG. 15 can be adjusted to form a magnetic field strength suitable for demagnetization of a digital pen (e.g., the digital pen (400) of FIGS. 9A and 9B). In the following description, the lengths (d1, d2, d3) of the magnetic regions (371, 372, 373) may refer to lengths in the first axial direction (e.g., the Y-axis direction), and the spacings (t1, t2) between the magnetic regions (371, 372, 373) may refer to spacings in the first axial direction (e.g., the Y-axis direction). For example, the spacing (t1, t2) between the magnetic regions (371, 372, 373) may mean the length of the non-magnetic regions (375, 376) in the first axial direction (e.g., Y-axis direction).

[0137] FIGS. 16A to 18 are drawings for explaining changes in the intensity of a magnetic field according to the lengths (d1, d2, d3) and spacings (t1, t2) of the magnetic regions (371, 372, 373) of the magnet assembly (370) of FIG. 15. The graphs in FIGS. 16A to 18 may represent the distribution and intensity of the magnetic field of the magnet assembly (370) of the graphs in FIGS. 16A to 18. The vertical axis of the graphs in FIGS. 16A to 18 may represent the intensity of the magnetic field, and the horizontal axis may represent the positions of the third magnetic region (373), the second non-magnetic region (376), the second magnetic region (372), the first non-magnetic region (375), and the first magnetic region (371) sequentially arranged from left to right. In FIGS. 16A to 18, a1, a2, and a3 of the graphs may represent the maximum values ​​of the magnetic field strength of the first magnetic region (371), the second magnetic region (372), and the third magnetic region (373), respectively, and may be changed according to the length (d1, d2, d3) and / or the interval (t1, t2) of the magnetic regions (371, 372, 373).

[0138] Referring to FIGS. 16a and 16b, according to one embodiment, the spacing (t1, t2) of the magnetic regions (371, 372, 373) may be kept constant, and the strength of the magnetic field may be adjusted by changing the lengths (d1, d2, d3) of the magnetic regions (371, 372, 373). For example, the first axial direction (e.g., Y-axis direction) length (d2) of the second magnetic region (372) may be greater than the first axial direction (e.g., Y-axis direction) length (d3) of the third magnetic region (373) and less than the first axial direction (e.g., Y-axis direction) length (d1) of the first magnetic region (371).

[0139] Referring to FIG. 17, according to one embodiment, the strength of the magnetic field can be controlled by changing the lengths (d1, d2, d3) of the magnetic regions (371, 372, 373) and the spacing (t1, t2) of the magnetic regions (371, 372, 373). For example, the first axial direction (e.g., Y-axis direction) length (d2) of the second magnetic region (372) may be greater than or equal to the first axial direction (e.g., Y-axis direction) length (d3) of the third magnetic region (373) and less than or equal to the first axial direction (e.g., Y-axis direction) length (d1) of the first magnetic region (371). For example, the first spacing (t1) may be smaller than the second spacing (t2).

[0140] Referring to FIG. 18, according to one embodiment, the lengths (d1, d2, d3) of the magnetic regions (371, 372, 373) are kept constant, and the strength of the magnetic field can be adjusted by changing the spacing (t1, t2) of the magnetic regions (371, 372, 373). For example, the first spacing (t1) can be smaller than the second spacing (t2).

[0141] FIG. 19A is a diagram for explaining the distribution of a magnetic member disposed within an electronic device according to an embodiment of the present disclosure. FIG. 19B is a plan view illustrating a magnet assembly and a digital pen disposed within an electronic device according to an embodiment of the present disclosure. FIG. 20 is a plan view illustrating a magnet assembly and a digital pen according to an embodiment of the present disclosure. FIG. 21 is a diagram for explaining the magnetic field distribution of a magnet assembly according to an embodiment of the present disclosure. FIG. 22A is a diagram for explaining a magnet assembly and a magnetic field distribution according to an embodiment of the present disclosure. FIG. 22B is a side cross-sectional view of the magnet assembly of FIG. 22A according to an embodiment of the present disclosure. FIG. 23A is a diagram for explaining a magnet assembly and a magnetic field distribution according to an embodiment of the present disclosure. FIG. 23B is a side cross-sectional view of the magnet assembly of FIG. 23A according to an embodiment of the present disclosure.

[0142] The description of the magnet assembly (370) of the embodiment of FIGS. 8 to 18b may be applied identically or similarly to the magnet assembly (570) of the embodiment of FIGS. 19a to 23b. Hereinafter, the magnet assembly (570) according to the embodiment of FIGS. 19a to 23b may be described focusing on the differences from the magnet assembly (370) of the embodiment of FIGS. 8 to 18b, and common details may be omitted.

[0143] FIG. 19A may schematically illustrate the locations of existing magnetic elements built into an electronic device (101) (e.g., a tablet PC). The existing magnetic elements may be built into the electronic device (101) for the purpose of mounting accessories such as a cover or input device. In one embodiment, the magnet assembly (570) of FIGS. 19A to 23B may be one of the existing magnetic elements of FIG. 19A.

[0144] Referring to FIG. 19B, in one embodiment, the electronic device (101) may include a housing (540), a display (501), a pen receptacle (550), and a magnet assembly (570). According to one embodiment, the display (501) may include a digitizer (e.g., digitizer (320) of FIGS. 6, 9A, and 9B) and a metal sheet (e.g., metal sheet (330) of FIGS. 6, 9A, and 9B). The digital pen (400) (e.g., digital pen (400) of FIGS. 6, 9A, and 9B) may be magnetized by a surrounding magnet during use. According to one embodiment, during the process of storing or separating the magnetized digital pen (400) from the pen receiving portion (550), the digital pen (400) may be demagnetized by being exposed to the magnetic field (or attenuating magnetic field) of the magnet assembly (570). According to the demagnetization function of the digital pen (400) by the magnet assembly (570), an input malfunction of the digital pen (400) due to magnetic field interference of the magnetized digital pen (400) may be suppressed.

[0145] According to one embodiment, a digital pen (400) (e.g., the digital pen (400) of FIGS. 6, 9A, and 9B) for applying an input signal to a digitizer (e.g., the digitizer (320) of FIGS. 9A and 9B) of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 8) may be magnetized by a surrounding magnet. According to one embodiment of the present disclosure, during a process of storing or separating the magnetized digital pen (400) from or to the pen receiving portion (350), the digital pen (400) may be demagnetized by being exposed to a magnetic field (or a damping magnetic field) of a magnet assembly (570). By the demagnetization function of the digital pen (400) by the magnet assembly (570), an input malfunction of the digital pen (400) due to magnetic field interference of the magnetized digital pen (400) may be suppressed.

[0146] Referring to the graphs of FIGS. 16A to 18, according to one embodiment, the magnetic field (attenuating magnetic field) generated from the magnet assembly (570) may alternate in the + direction and the - direction. According to one embodiment, the magnetic field (attenuating magnetic field) generated from the magnet assembly (570) may gradually increase in strength toward the inward direction (+Y direction) of the electronic device (101) or the inward direction (+Y direction) of the pen receiving portion (350) in at least some sections.

[0147] Referring to FIGS. 16A to 18, according to one embodiment, a third magnetic region (573) (e.g., the third magnetic region (373) of FIGS. 9A to 10B, FIG. 11, FIG. 13, and FIG. 15) is sequentially arranged in the inward direction (+Y direction) of the electronic device (101) of the magnet assembly (570) or in the inward direction (+Y direction) of the pen receiving portion (350), a second magnetic region (572) (e.g., the second magnetic region (372) of FIGS. 9A to 10B, FIG. 11, FIG. 13, and FIG. 15), a first magnetic region (571) (e.g., the first magnetic region (371) of FIGS. 9A to 10B, FIG. 11, FIG. 13, and FIG. 15) and a fourth magnetic region (574) (e.g., the first magnetic region (371) of FIGS. 9A to 10B, FIG. 11, FIG. 13, and FIG. 15) are sequentially arranged in the inward direction (+Y direction) of the electronic device (101) or in the inward direction (+Y direction) of the pen receiving portion (350). 11, may include additional magnetic regions (374) of FIGS. 13 and 15.

[0148] According to one embodiment, each of the magnetic regions (571, 572, 573, 574) may include regions having different polarities (e.g., N pole, S pole). According to one embodiment, the polarities of adjacent magnetic regions among the magnetic regions (571, 572, 573, 574) may be opposite to each other. According to one embodiment, the magnetic force (or magnetic field strength) of the second magnetic region (572) may be greater than the magnetic force (or magnetic field strength) of the third magnetic region (573) and less than or equal to the magnetic force (or magnetic field strength) of the first magnetic region (571). According to one embodiment, the magnetic force (or magnetic field strength) of the first magnetic region (571) may be greater than the magnetic force (or magnetic field strength) of the fourth magnetic region (574).

[0149] According to one embodiment, the first magnetic region (571) may have the greatest magnetic force (or magnetic field strength) among the magnetic regions (571, 572, 573, 574), and thus may have a greater influence of magnetic field interference on surrounding electrical / electronic components, such as a digitizer (e.g., the digitizer (320) of FIGS. 6, 9A, and 9B), than the second magnetic region (572) and the third magnetic region (573). For example, the digitizer may be located above (in the +Z direction) the magnetic regions (571, 572, 573). A portion of the magnetic field of the first magnetic region (571) acts toward the fourth magnetic region (574), thereby suppressing or reducing the influence of the magnetic field of the first magnetic region (571) toward the digitizer (e.g., the digitizer (320) of FIG. 6, FIG. 9A, and FIG. 9B), and preventing malfunction of the digitizer.

[0150] In one embodiment, the magnet assembly (570) may further include a shielding member (579) facing the magnetic regions (571, 572, 573, 574). For example, the shielding member (579) may reduce the influence of magnetic field interference of the magnet assembly (570) on surrounding electrical / electronic components. For example, the shielding member (579) may be formed of a material suitable for electromagnetic shielding, such as cold rolled commercial steel plate.

[0151] FIGS. 22A and 22B may illustrate examples in which the magnetic assembly (570) of FIG. 21 further includes a guide member (576) and / or an additional shielding member (578) to control the distribution or intensity of the magnetic fields of the magnetic regions (571, 572, 573, 574). Referring to the graph of FIG. 21, the magnetic field intensity by the fourth magnetic region (584) is about +4, and the magnetic field intensity by the first magnetic region (571) is about -10, so that a secondary damping magnetic field can be formed in which the + and - directions alternate and the intensity gradually decreases. Or, referring to the graph of Fig. 21, a secondary damping magnetic field can be formed in which the magnetic field strength by the third magnetic region (583) is about -4 and the magnetic field strength by the second magnetic region (572) is about +10, with the + and - directions alternating and the strength gradually decreasing.

[0152] Referring to FIGS. 22A and 22B, according to one embodiment, the magnet assembly (570) may further include a guide member (576) that faces the first magnetic region (571) and the shielding member (579) with each other. Referring to FIG. 22B, for example, a side surface (e.g., an X-axis direction side) of the guide member (576) may be arranged to intersect or be perpendicular to a side surface (e.g., an X-axis direction side) of the shielding member (579). For example, the guide member (576) may include a steel plate cold commercial or a soft magnetic material with high permeability (e.g., sendust, ferrite, stainless steel, nano crystal, amorphous material).

[0153] According to one embodiment, the guide member (576) may be configured to increase or strengthen the strength of the magnetic field of the first magnetic region (571). Referring to the graph of FIG. 22a, the magnetic field strength by the third magnetic region (583) is about -4, the magnetic field strength by the second magnetic region (572) is about +10, and the magnetic field strength by the first magnetic region (571) and the guide member (576) is about -15, so that a tertiary attenuating magnetic field may be formed in which the + and - directions alternate and the strength gradually decreases. According to one embodiment, the guide member (576) strengthens the magnetic field of the first magnetic region (571), thereby forming the secondary attenuating magnetic field of the magnet assembly (570) of FIG. 21 into a tertiary attenuating magnetic field, thereby strengthening the demagnetizing function of the digital pen (400) of the magnet assembly (570).

[0154] Referring to FIGS. 23A and 23B, according to one embodiment, the magnet assembly (570) may further include an additional shielding member (578) facing the second magnetic region (571) with the shielding member (579) interposed therebetween. The additional shielding member (578) may shield a portion of the magnetic field of the second magnetic region (571). Referring to FIG. 23B, for example, a side surface (e.g., an X-axis direction side surface) of the additional shielding member (578) may be arranged parallel to a side surface (e.g., an X-axis direction side surface) of the shielding member (579). For example, the additional shielding member (578) may be arranged spaced apart from the shielding member (579). For example, the guide member (576) may include cold rolled steel plate (cold commercial) or a high permeability soft magnetic material (e.g., sendust, ferrite, stainless steel, nano crystal, amorphous material).

[0155] Referring to the graph of Fig. 23a, the magnetic field strength by the third magnetic region (583) is about -4, the magnetic field strength by the second magnetic region (572) and the additional shielding member (578) is about +7, and the magnetic field strength by the first magnetic region (571) and the guide member (576) is about -15, so that a tertiary attenuating magnetic field can be formed in which the + and - directions alternate and the strength gradually decreases. The strength of the magnetic field of the graph of Fig. 23a can represent the strength of the magnetic field applied within the pen receiving portion (550). According to one embodiment, the additional shielding member (578) shields a portion of the magnetic field of the second magnetic region (572), thereby forming the secondary attenuating magnetic field of the magnet assembly (570) of Fig. 21 into a tertiary attenuating magnetic field, thereby enhancing the demagnetization function of the digital pen (400) of the magnet assembly (570).

[0156] FIG. 24 is a drawing for explaining a demagnetization device and a digital pen of an electronic device according to one embodiment of the present disclosure. All or part of the configuration of the electronic device (101) of FIG. 24 may be referred to as the electronic device (101) of FIGS. 1 to 8.

[0157] Referring to FIG. 24, according to one embodiment, the electronic device (101) may include a demagnetization module (or demagnetization module) (602) and a pen receiving portion (650) (e.g., the pen receiving portion (350) of FIGS. 9A and 9B, the pen receiving portion (550) of FIG. 19B) for receiving a digital pen (e.g., the digital pen (400) of FIGS. 6, 7, 9A, and 9B). According to one embodiment, the demagnetization module (602) may include a coil (630) surrounding the pen receiving portion (650) and wires (610, 620) (or circuits) connected to the coil (630). When current flows through the wires (610, 620) to the coil (630) of the demagnetization module (602), a magnetic field may be formed around the coil (630).

[0158] According to one embodiment, the digital pen (400) may be magnetized by a surrounding magnet during use. As described below, according to one embodiment of the present disclosure, during the process of storing or separating the magnetized digital pen (400) from or to the pen receiving portion (650), the digital pen (400) may be demagnetized by being exposed to a magnetic field (or a damping magnetic field) provided to the demagnetization module (602). According to the demagnetization function of the digital pen (400) by the demagnetization module (602), an input malfunction of the digital pen (400) due to magnetic field interference of the magnetized digital pen (400) may be suppressed.

[0159] According to one embodiment, the demagnetization module (602) can apply a damping magnetic field (or damping AC magnetic field) that alternately applies a magnetic field of gradually decreasing strength in the + and - directions to the digital pen (400) (or coil (e.g., ferrite of coil (401) of FIG. 6)) using the coil (630).

[0160] Specifically, for example, the demagnetizing magnetic field can be demagnetized so that the residual magnetism of the digital pen (400) becomes 0 or approaches 0 by alternately applying a magnetic field in the opposite direction, such as applying a magnetic field that magnetizes the digital pen (400) (or the coil (e.g., the ferrite of the coil (401) of FIG. 6)) magnetized to a magnitude of +10 to -9, a magnetic field that magnetizes it by +8, and a magnetic field that magnetizes it by -7. According to one embodiment, the demagnetizing module (602) can generate a demagnetizing magnetic field by detecting and operating an induced current when the digital pen (400) is inserted or removed from the pen receiving portion (650). For example, the demagnetizing module (602) can operate only temporarily when the digital pen (400) is inserted or removed, thereby generating a demagnetizing magnetic field, which is more effective than a permanent magnet that constantly generates a magnetic field, by the demagnetizing magnetic field. The influence of magnetic field interference on surrounding electric / electronic components, such as the digitizer (320) of FIG. 9b, may be reduced.

[0161] However, the challenges addressed by this disclosure may be determined in various ways, as long as they do not deviate from the spirit and scope of this disclosure. The benefits achieved by this disclosure are not limited to those mentioned above, and various other benefits may be provided, directly or indirectly, through this document.

[0162] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device comprises a housing (210; 220; 340; 540) including a first surface (210A; 340A), a second surface (210B; 340B) facing in an opposite direction to the first surface, a side surface (210C; 340C) surrounding a space formed between the first surface and the second surface, and a first through hole (341a) formed on the side surface, a display (201; 310; 501) disposed on the first surface of the housing, a digitizer (320) disposed within the housing to face the display, a pen receiving portion (350; 550) formed to extend in a first axial direction from the first through hole and disposed between the digitizer and the second surface of the housing, and a plurality of magnetic regions (371, 372, 373; 571, 572, 573) disposed around the pen receiving portion in the first axial direction. A magnet assembly (370) may be included. The polarities of the adjacent magnetic regions are opposite to each other, and the magnetic force of the magnetic region that is positioned closer to the first through hole among the two adjacent magnetic regions may be equal to or less than the magnetic force of the other magnetic region.

[0163] In one embodiment, the magnet assembly can be disposed between the digitizer and the second surface of the housing.

[0164] According to one embodiment, the magnet assembly may further include an additional magnetic region (375; 574) disposed at least partially facing the first magnetic region disposed furthest from the first through hole among the plurality of magnetic regions.

[0165] In one embodiment, the magnetic force of the additional magnetic region may be less than the magnetic force of the first magnetic region.

[0166] In one embodiment, the additional magnetic region can be aligned in the first axial direction with respect to the first magnetic region.

[0167] According to one embodiment, the magnet assembly may further include a shielding member (579) facing the plurality of magnetic regions.

[0168] According to one embodiment, the plurality of magnetic regions of the magnet assembly may include a first magnetic region (371; 571) disposed furthest from the first through hole, a third magnetic region (373; 573), and a second magnetic region (372; 572) disposed between the first magnetic region and the third magnetic region.

[0169] According to one embodiment, the magnet assembly further includes a guide member (576) facing the first magnetic region and the shielding member, wherein the guide member can be configured to increase the strength of a magnetic field generated by the first magnetic region.

[0170] According to one embodiment, the magnet assembly further includes an additional shielding member (578) facing the second magnetic region with the second magnetic region and the shielding member interposed therebetween, wherein the additional shielding member can be configured to shield a portion of the magnetic field.

[0171] According to one embodiment, the strength of the magnetic field of the area of ​​the pen receiving portion corresponding to the second magnetic region may be smaller than the strength of the magnetic field of the area of ​​the pen receiving portion corresponding to the first magnetic region and larger than the strength of the magnetic field of the area of ​​the pen receiving portion corresponding to the third magnetic region.

[0172] According to one embodiment, the magnet assembly further includes a plurality of magnetic elements spaced apart from each other, wherein the plurality of magnetic elements can correspond to the plurality of magnetic regions.

[0173] According to one embodiment, at least one of the first axial length of the magnetic elements or the spacing between adjacent magnetic elements may be constant.

[0174] According to one embodiment, the magnetic members may be arranged so that the distance from the pen receiving portion decreases as they move away from the first through hole.

[0175] According to one embodiment, the magnet assembly includes a magnet extending in the first axial direction, and the plurality of magnetic regions can be formed in different regions of the magnet.

[0176] According to one embodiment, the magnet assembly may be configured such that the residual magnetization of the digital pen (400) is demagnetized by the magnetic field of the magnet assembly when the digital pen (400) is stored in or taken out of the pen receiving portion.

[0177] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (210; 220; 340; 540) including a first surface (210A; 340A) and a second surface (210B; 340B) facing in an opposite direction to the first surface, a display (201; 310; 501) disposed on the first surface of the housing, a digitizer (320) disposed within the housing to face the display, and a magnet assembly (370; 5570) disposed between the digitizer and the second surface of the housing. The magnet assembly may include a plurality of magnetic regions (371, 372, 373; 571, 572, 573) arranged in a first axial direction. The polarities of the adjacent magnetic regions are opposite to each other, and the magnetic force of the magnetic region that is positioned closer to the first through hole among the two adjacent magnetic regions may be equal to or less than the magnetic force of the other magnetic region.

[0178] According to one embodiment, the magnet assembly further includes an additional magnetic region (375; 574) disposed at least partially facing a first magnetic region disposed farthest from the first through hole among the plurality of magnetic regions, wherein a magnetic force of the additional magnetic region may be less than a magnetic force of the first magnetic region.

[0179] According to one embodiment, the magnet assembly further includes a shielding member (579) facing the plurality of magnetic regions; and a guide member (576) facing the first magnetic region and the shielding member, wherein the guide member can be configured to increase the strength of a magnetic field generated by the first magnetic region.

[0180] According to one embodiment, the magnet assembly further includes a second magnetic region adjacent to the first magnetic region; and an additional shielding member (578) facing the second magnetic region with the second magnetic region and the shielding member interposed therebetween, wherein the additional shielding member can be configured to shield a portion of a magnetic field.

[0181] According to one embodiment, the housing may further include a side surface (210C; 340C) surrounding a space formed between the first surface and the second surface, and a first through hole (341a) formed in the side surface.

[0182] The electronic device may further include a pen receiving portion (350; 550) extending in the first axial direction from the first through hole and positioned between the digitizer and the second surface of the housing.

[0183] The magnet assembly of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0184] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0185] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0186] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0187] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0188] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0189] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0190] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A housing (210; 220; 340; 540) including a first surface (210A; 340A), a second surface (210B; 340B) facing in the opposite direction to the first surface, a side surface (210C; 340C) surrounding a space formed between the first surface and the second surface, and a first through hole (341a) formed in the side surface A display (201; 310; 501) arranged on the first surface of the housing; A digitizer (320) positioned facing the display within the housing; A pen receiving portion (350; 550) formed to extend in the first axial direction from the first through hole and arranged between the digitizer and the second surface of the housing; and A magnet assembly (370; 570) comprising a plurality of magnetic regions (371, 372, 373; 571, 572, 573) arranged in the first axial direction around the pen receiving portion, An electronic device wherein the polarities of the adjacent magnetic regions are opposite to each other, and the magnetic force of the magnetic region located closer to the first through hole among the two adjacent magnetic regions is equal to or smaller than the magnetic force of the other magnetic region.

2. In paragraph 1, An electronic device wherein the magnet assembly is disposed between the digitizer and the second surface of the housing.

3. In paragraph 1 or 2, An electronic device, wherein the magnet assembly further comprises an additional magnetic region (375; 574) disposed at least partially facing a first magnetic region disposed farthest from the first through hole among the plurality of magnetic regions.

4. In paragraph 3, An electronic device wherein the magnetic force of the additional magnetic region is smaller than the magnetic force of the first magnetic region.

5. In clause 3 or 4, An electronic device wherein said additional magnetic region is aligned in said first axial direction with respect to said first magnetic region.

6. In any one of paragraphs 1 to 5, An electronic device, wherein the magnet assembly further includes a shielding member (579) facing the plurality of magnetic regions.

7. In paragraph 6, An electronic device, wherein the plurality of magnetic regions of the magnet assembly include a first magnetic region (371; 571) disposed farthest from the first through hole, a third magnetic region (373; 573), and a second magnetic region (372; 572) disposed between the first magnetic region and the third magnetic region.

8. In paragraph 7, An electronic device wherein the magnet assembly further includes a guide member (576) facing the first magnetic region and the shielding member, the guide member being configured to increase the strength of a magnetic field generated by the first magnetic region.

9. In clause 7 or 8, An electronic device wherein the magnet assembly further includes an additional shielding member (578) facing the second magnetic region with the second magnetic region and the shielding member interposed therebetween, the additional shielding member being configured to shield a portion of a magnetic field.

10. In any one of paragraphs 7 to 9, An electronic device wherein the strength of the magnetic field of the area of ​​the pen receiving portion corresponding to the second magnetic region is smaller than the strength of the magnetic field of the area of ​​the pen receiving portion corresponding to the first magnetic region and larger than the strength of the magnetic field of the area of ​​the pen receiving portion corresponding to the third magnetic region.

11. In any one of paragraphs 1 to 10, An electronic device, wherein the magnet assembly further includes a plurality of magnetic elements spaced apart from each other, the plurality of magnetic elements corresponding to the plurality of magnetic regions.

12. In paragraph 11, An electronic device, wherein at least one of the first axial lengths of the magnetic elements or the spacing between adjacent magnetic elements is constant.

13. In any one of paragraphs 1 to 10, An electronic device wherein the magnet assembly includes a magnet having a shape extending in the first axial direction, and the plurality of magnetic regions are formed in different regions of the magnet.

14. In any one of paragraphs 1 to 13, An electronic device in which the magnetic assembly is configured such that the residual magnetization of the digital pen (400) is demagnetized by the magnetic field of the magnetic assembly when the digital pen (400) is stored in or taken out of the pen receiving portion.

15. In an electronic device (101), A housing (210; 220; 340; 540) comprising a first face (210A; 340A) and a second face (210B; 340B) facing in the opposite direction to the first face; A display (201; 310; 501) arranged on the first surface of the housing; A digitizer (320) positioned facing the display within the housing and A magnet assembly (370; 5570) disposed between the digitizer and the second surface of the housing, comprising a plurality of magnetic regions (371, 372, 373; 571, 572, 573) arranged in a first axial direction, An electronic device wherein the polarities of the adjacent magnetic regions are opposite to each other, and the magnetic force of the magnetic region located closer to the first through hole among the two adjacent magnetic regions is equal to or smaller than the magnetic force of the other magnetic region.

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