Components for electrical energy storage devices

Abstract

The present disclosure is directed to a component of an electrical energy storage device, wherein the component is formed from a metal sheet or coil and comprises a first surface; and a dielectric coating on the first surface. Also disclosed are methods of making a component of an electrical energy storage device, and electrical energy storage devices that comprise such components.

Description

COMPONENTS FOR ELECTRICAL ENERGY STORAGE DEVICESFIELD

[0001] The present disclosure is directed towards components for electrical energy storage devices that include a dielectric coating, methods of making such components, and electrical energy storage devices that include such components.BACKGROUND

[0002] Substrates, such as metal substrates including metal electrical components and batteries, are often protected with a high dielectric strength material to provide insulating properties. For example, components have been coated with a dielectric tape to provide insulating properties. Dielectric tapes are pre-formed films that are adhered to a substrate with an adhesive. While dielectric tapes can provide insulating properties, they can be difficult to apply uniformly to substrates. In addition, it can be difficult to obtain good insulating properties at low coating film thicknesses.SUMMARY

[0003] The present disclosure provides a component of an electrical energy storage device, wherein the component is formed from a metal sheet or coil and comprises a first surface and a dielectric coating on the first surface.

[0004] The present disclosure also provides a method of making a component of an electrical energy storage device comprising applying a dielectric coating composition onto a first surface of a metal sheet or coil by a coil coating operation to form a dielectric coating and forming the metal sheet or coil to form the component.

[0005] The present disclosure further provides an electrical energy storage device comprising the component described herein.DETAILED DESCRIPTION

[0006] The present disclosure is directed to a component of an electrical energy storage device, wherein the component is formed from a metal sheet or coil and comprises a first surface; and a dielectric coating on the first surface.

[0007] As used herein, the term “dielectric coating” refers to a film, layer, or the like, derived from a coating composition that provides electrical insulation to an underlying substrate to which it is applied.

[0008] The dielectric coating may have a dielectric strength of at least 1 kV at any of the dry film thicknesses described herein as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test, such as at least 2 kV, such as at least 2.5 kV, such as at least 5kV, such as at least 7kV, such as at least 8kV, such as at least lOkV, such as at least 12kV, or higher. The dielectric coating may have a dielectric strength of at least 1 kV at a dry film thickness of 40 microns or less, as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test, such as at least 2 kV, such as at least 2.5 kV, such as at least 5kV, such as at least 7kV, such as at least 8kV, such as at least lOkV, such as at least 12kV, or higher. The dielectric coating may have a dielectric strength of at least 1 kV at a dry film thickness of 30 microns or less, as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test, such as at least 2 kV, such as at least 2.5 kV, such as at least 5kV, such as at least 7kV, such as at least 8kV, such as at least lOkV, such as at least 12kV, or higher.

[0009] The dielectric coating may be applied from a dielectric coating composition. As used herein, the term “coating composition” refers to a composition comprising a solution, a mixture, or a dispersion, that, in an at least partially dried or cured state, is capable of producing a film, layer, or the like on at least a portion of a substrate surface. As used herein, the term “dielectric coating composition” refers to a coating composition that forms a dielectric coating.

[0010] The coating composition used for forming the dielectric coating comprises a filmforming binder. The film-forming binder is not limited and may comprise any suitable filmforming binder. The film-forming binder may comprise an organic film-forming binder, such as a curable organic film-forming binder, such as a thermoset organic film-forming binder, or alternatively a thermoplastic organic film-forming binder. Thermoset coating compositions may comprise film-forming binders that cure or crosslink under ambient conditions or with exposure to heat, radiation, including electron beam radiation, or other energy sources. Curing refers to bond formation, such as between a polymer and crosslinker, or self-crosslinking, resulting in the formation of a crosslinked coating film. Ambient conditions refer to temperatures that are typically found in the room or area in which a coating composition is being applied to a substrate, for example, from 60 to 90°F (15.6 to 32.2°C), such as a typical room temperature, 72°F (22.2°C), and atmospheric pressure, while thermal or bake conditions are temperatures that are above ambient temperature. Thermoplastic coating compositions may comprise film-forming binders that coalesce and / or dry to form a film upon evaporation of water and / or solvents.

[0011] The thermosetting coating composition may comprise a film-forming binder comprising (a) an organic resin component and (b) an optional curing agent. Some thermosetting coating compositions may self-crosslink, for example, wherein the composition comprises a polymer containing ethylenic unsaturation or olefinic double bonds that may cure by, for example, exposure to radiation, or to oxygen in the air.

[0012] The film-forming binder may comprise a curable, organic film-forming binder.

[0013] As used herein, the term “curable”, “thermoset” or “thermosetting” and like terms refers to compositions that undergo a reaction in which they “set” irreversibly, such as when the components of the composition react with each other and the polymer chains of the polymeric components are joined together by covalent bonds. This property is usually associated with a crosslinking reaction of the composition constituents often induced by heat or radiation. See Hawley, Gessner G., The Condensed Chemical Dictionary, Ninth Edition., page 856; Surface Coatings, vol. 2, Oil and Colour Chemists' Association, Australia, TAFE Educational Books (1974). Curing or crosslinking reactions also may be carried out under ambient conditions.Once cured or crosslinked, a thermosetting resin will not melt upon the application of heat and is insoluble in solvents.

[0014] Alternatively, the coating composition and film-forming binder may be thermoplastic. As used herein, the term “thermoplastic” refers to compositions that do not undergo a reaction in which they “set” irreversibly, and instead coalesce and / or dry to form a film upon evaporation of water and / or solvents.

[0015] As used herein, the term “organic film-forming binder” refers to carbon-based materials (resins, crosslinkers and the like, such as those further described below) that comprise less than 50 wt% of inorganic materials, based on the total weight of the binder. The organic film- forming binder may comprise a mixture of organic and inorganic polymers and / or resins so long as the organic content comprises more than 50 wt% of the total weight of the organic filmforming binder, such as more than 60 wt%, such as more than 70 wt%, such as more than 80 wt%, such as more than 90 wt%. As used herein, “organic content” refers to carbon atoms as well as any hydrogen, oxygen, and nitrogen atoms that are bonded to a carbon atom.

[0016] The organic film-forming resins that may be used in the coating compositions include polyester, alkyd, urethane, isocyanate, polyurea, epoxy, acrylic, polyether, polysulfide, polyamine, polyamide, polyvinyl chloride, polyolefin, polyvinylidene fluoride, polyvinyl chloride, polyolefin, polysiloxane, and derivatives or combinations thereof. The resins may be aliphatic, aromatic, or a combination thereof. For curable, organic film-forming binders, the functional groups on the organic resin component optionally may be selected so as to be reactive with those on a curing agent. The organic resin component may comprise a polymer having hydroxyl functional groups, such as a hydroxyl functional polyester, a hydroxyl functional polyurethane, or a hydroxyl functional acrylic.

[0017] The organic film-forming resin may have a weight average molecular weight of at least 1,500 g / mol, such as at least 3,000 g / mol, such as at least 4,000 g / mol. The organic filmforming resin may have a weight average molecular weight of no more than 50,000 g / mol, such as no more than 25,000 g / mol, such as no more than 15,000 g / mol, such as no more than 10,000 g / mol. The organic film-forming resin may have a weight average molecular weight of 1 ,500 to 50,000 g / mol, such as 1,500 to 25,000 g / mol, such as 1,500 to 15,000 g / mol, such as 1,500 to 10,000 g / mol, such as 3,000 to 50,000 g / mol, such as 3,000 to 25,000 g / mol, such as 3,000 to 15,000 g / mol, such as 3,000 to 10,000 g / mol, such as 4,000 to 50,000 g / mol, such as 4,000 to 25,000 g / mol, such as 4,000 to 15,000 g / mol, such as 4,000 to 10,000 g / mol.

[0018] As used herein, unless otherwise stated, the term “weight average molecular weight (Mw)” means the weight average molecular weight (Mw) as determined by Gel Permeation Chromatography using Waters 2695 separation module with a Waters 410 differential refractometer (RI detector), polystyrene standards having molecular weights of from approximately 500 g / mol to 900,000 g / mol, dimethylformamide (DMF) with 0.05 M lithium bromide (LiBr) as the eluent at a flow rate of 0.5 mL / min, and one Asahipak GF-510 HQ column for separation.

[0019] The organic film-forming resin may have a hydroxyl value of at least 1 mg KOH / gram resin, such as at least 10 mg KOH / gram resin, such as at least 20 mg KOH / gram resin, such as at least 30 mg KOH / gram resin. The organic film-forming resin may have a hydroxyl value of no more than 180 mg KOH / gram resin, such as no more than 100 mg KOH / gram resin, such as no more than 70 mg KOH / gram resin, such as no more than 55 mg KOH / gram resin. The organic film-forming resin may have a hydroxyl value of 1 to 180 mgKOH / gram resin, such as 1 to 100 mg KOH / gram resin, such as 1 to 70 mg KOH / gram resin, such as 1 to 55 mg KOH / gram resin, such as 10 to 180 mg KOH / gram resin, such as 10 to 100 mg KOH / gram resin, such as 10 to 70 mg KOH / gram resin, such as 10 to 55 mg KOH / gram resin, such as 20 to 180 mg KOH / gram resin, such as 20 to 100 mg KOH / gram resin, such as 20 to 70 mg KOH / gram resin, such as 20 to 55 mg KOH / gram resin, such as 30 to 180 mg KOH / gram resin, such as 30 to 100 mg KOH / gram resin, such as 30 to 70 mg KOH / gram resin, such as 30 to 55 mg KOH / gram resin. As used herein, the term “hydroxyl value” refers to the number of milligrams of potassium hydroxide (KOH) required to neutralize the acetic acid taken up on acetylation of one gram of a chemical substance that contains free hydroxyl groups and was herein determined by a theoretical calculation of the number of free hydroxyl groups theoretically present in one gram of the organic film-forming resin.

[0020] The organic film-forming resin may have an acid value of at least 0.1 , such as at least 1 mg KOH / gram resin, such as at least 2 mg KOH / gram resin, such as at least 3 mg KOH / gram resin, such as at least 4 mg KOH / gram resin. The organic film-forming resin may have an acid value of no more than 30 mg KOH / gram resin, such as no more than 15 mg KOH / gram resin, such as no more than 10 mg KOH / gram resin. The organic film-forming resin may have an acid value of 0.1 to 30 mg KOH / gram resin, such as 0.1 to 15 mg KOH / gram resin, such as 0.1 to 10 mg KOH / gram resin, such as 1 to 30 mg KOH / gram resin, such as 1 to 15 mg KOH / gram resin, such as 1 to 10 mg KOH / gram resin, such as 2 to 30 mg KOH / gram resin, such as 2 to 15 mg KOH / gram resin, such as 2 to 10 mg KOH / gram resin, such as 3 to 30 mg KOH / gram resin, such as 3 to 15 mg KOH / gram resin, such as 3 to 10 mg KOH / gram resin. The acid value is determined by ASTM 974-87.

[0021] The organic film-forming resin may have a glass transition temperature (“Tg”) of at least 0°C, such as at least 5°C, such as at least 10°C. The organic film-forming resin may have a glass transition temperature of no more than 50°C, such as no more than 30°C, such as no more than 20°C. The organic film-forming resin may have a glass transition temperature of 0°C to 50°C, such as 0° to 30°C, such as 0°C to 20°C, such as 5°C to 50°C, such as 5° to 30°C, such as 5°C to 20°C, such as 10°C to 50°C, such as 10° to 30°C, such as 10°C to 20°C. The glass transition temperature of the resin may be measured using differential scanning calorimetry (DSC) with a Discovery DSC 2500 from TA Instruments.

[0022] The amount of organic resin component (a) in the film-forming binder may be in an amount of at least 10% by weight, such as at least 20% by weight, such as at least 30% by weight, based on the total weight of resin solids in the coating composition. The amount of organic resin component (a) in the film-forming binder may be in an amount up to 100% by weight, such as no more than 90% by weight, such as no more than 80% by weight, such as no more than 75% by weight, based on the total weight of resin solids in the coating composition. The amount of organic resin component (a) in the film-forming binder may be in an amount of 10% to 90% by weight, such as 10% to 80% by weight, such as 10% to 75% by weight, such as20% to 90% by weight, such as 20% to 80% by weight, such as 20% to 75% by weight, such as30% to 90% by weight, such as 30% to 80% by weight, such as 30% to 75% by weight, based on the total weight of resin solids in the coating composition.

[0023] As used herein, the “resin solids” include the components of the film-forming binder of the coating composition. The resin solids includes the components of the film-forming binder such as the organic resin component, the curing agent, and any additional resinous component(s) present in the coating composition.

[0024] The film- forming binder may optionally further comprise a curing agent (b). The terms “curing agent” “crosslinking agent” and “crosslinker” are herein used interchangeably and refer to a molecule capable of forming a covalent linkage between polymers or between two different regions of the same polymer. The curing agent (b) may react with the reactive functional groups of the organic resin component (a) to effectuate cure of the coating composition to form a cured coating. As used herein, the term “cure”, “cured” or similar terms, as used in connection with the coating compositions described herein, is consistent with the term “curable” as defined above and means that at least a portion of the components that form the film-forming binder are crosslinked to form a coating. Additionally, curing of the coating composition refers to subjecting said composition to curing conditions leading to the reaction of the reactive functional groups of the components of the coating composition, and resulting in the crosslinking of the components of the composition and formation of an at least partially cured coating.

[0025] The curing agent may comprise polyisocyanates, at least partially blocked polyisocyanates, aminoplast resins, phenoplast resins, polyacids, epoxy, polyamines, polyamides, polythiols, polyols, polyenes, derivatives, and combinations thereof. As mentioned,for self-crosslinking coating compositions, the film-forming polymer and the curing agent may both comprise the same components and / or functionality such as cthylcnic unsaturation or olefinic double bonds that may cure by exposure to electron beam radiation, or to oxygen in the air.

[0026] Suitable polyamides may be prepared utilizing poly acids and poly amines. Suitable polyacids include, for example, adipic, succinic, sebacic, azelaic, and dodecanedioic acid and others, and polyamines may be comprise, for example, ethylene diamine, 1,2- diaminopropane, 1,4-diaminobutane, 1,3-diaminopentane, 1,6-diaminohexane, 2-methyl-l,5- pentane diamine, 2,5-diamino-2,5-dimethylhexane, 2,2,4- and / or 2,4,4-trimethyl-l,6-diamino- hexane, 1,11 -diaminoundecane, 1,12-diaminododecane, 1,3- and / or 1 ,4-cyclohexane diamine, 1- amino-3,3,5-trimethyl-5-aminomethyl-cyclohexane, 2,4- and / or 2,6-hexahydrotoluylene diamine, 2,4'- and / or 4,4'-diamino-dicyclohexyl methane and 3,3'-dialkyl4,4'-diamino-dicyclohexyl methanes (such as 3,3'-dimethyl-4,4'-diamino-dicyclohexyl methane and 3,3'-diethyl-4,4'- diamino-dicyclohexyl methane), 2,4- and / or 2,6-diaminotoluene and 2,4'- and / or 4,4'- diaminodiphenyl methane.

[0027] As an example, the coating composition may comprise any suitable organic resin component comprising a polymer having epoxy groups, such as, but not limited to, EPON 828, EPON 862, EPON 1001, or EPON 8111, all available from Westlake Epoxy, or combinations thereof, and the curing agent may comprise a crosslinker having amino groups such as, but not limited to Ancamine 2432, Ancamide 2569, Ancamine 2672, Ancamine 2686, or Ancamine K- 54, all available from Evonik, and / or combinations thereof.

[0028] The curing agent may comprise one or more polyisocyanates and / or at least partially blocked polyisocanates. Blocked polyisocyanates refer to polyisocyanates wherein the isocyanate groups have been reacted with a compound, such as an alcohol, such that the resultant blocked isocyanate group is stable to active hydrogens at ambient temperature, but reactive with active hydrogens at elevated temperature.

[0029] The curing agent may comprise an aminoplast resin. Nonlimiting examples of suitable aminoplast resins are CYMEL 303, CYMEL 385, CYMEL 1130, and CYMEL 1156, all commercially available from Allnex, and RESIMENE 747, RESIMENE 750, and RESIMENE 753, all available from Prefere Resins. Phenoplast resins, such as phenol formaldehyde condensates including allyl ether derivatives thereof, such as curing agents in the PHENODURproduct line from Allnex that are suitable for coating compositions may also be useful in the coating composition.

[0030] The curing agent may comprise a polythiol curing agent. As used herein, a “polythiol curing agent” refers to a chemical compound having at least two thiol functional groups ( — SH) that may be used to “cure” a composition by reacting with epoxide functional groups of an epoxy-containing compound to form a polymeric matrix.

[0031] The polythiol curing agent may be present in the composition in an amount such that the ratio of the epoxide equivalent weight of epoxy-containing compound to the thiol equivalent weight of the poly thiol curing agent may be at least 1:30, such as at least 1:12, and may be no more than 10:1, such as no more than 4:1. The polythiol curing agent may be present in the composition in an amount such that the ratio of the epoxide equivalent weight of epoxy compounds to the thiol equivalent weight of the polythiol curing agent may be 1:30 to 10:1, such as 1:12 to 4:1.

[0032] The curing agent may optionally comprise a high molecular weight volatile group. As used herein, the term “high molecular weight volatile group” refers to blocking agents and other organic byproducts that are released or produced and volatilized during the curing reaction of the coating composition having a molecular weight of at least 70 g / mol, such as at least 125 g / mol, such as at least 160 g / mol, such as at least 195 g / mol, such as at least 400 g / mol, such as at least 700 g / mol, such as at least 1000 g / mol, or higher, and may range from 70 to 1,000 g / mol, such as 160 to 1,000 g / mol, such as 195 to 1,000 g / mol, such as 400 to 1,000 g / mol, such as 700 to 1,000 g / mol. The organic byproducts may include alcoholic byproducts resulting from the reaction of the film-forming polymer and an aminoplast or phenoplast curing agent. A methylated melamine-formaldehyde curing agent comprising a butyl carbitol (2-(2- butoxyethoxy) ethanol), or other high molecular weight volatile group, may be useful as a curing agent with high molecular weight volatile groups. The organic byproducts may include alcoholic byproducts of the blocking agents, used to block isocyanato groups of polyisocyanates that are unblocked during cure. For clarity, the high molecular weight volatile groups are covalently bound to the curing agent prior to cure, and explicitly exclude any organic solvents that may be present in the coating composition.

[0033] Appropriate mixtures of crosslinking agents may also be used.

[0034] The curing agent (b) may be present in an amount of at least 10% by weight, such as at least 20% by weight, such as at least 25% by weight, based on the total weight of resin solids in the coating composition. The curing agent (b) may be present in an amount of no more than 90% by weight, such as no more than 80% by weight, such as no more than 70% by weight, based on the total weight of resin solids in the coating composition. The curing agent (b) may be present in an amount of 10% to 90% by weight, such as 10% to 80% by weight, such as 10% to70% by weight, such as 20% to 90% by weight, such as 20% to 80% by weight, such as 20% to70% by weight, such as 25% to 90% by weight, such as 25% to 80% by weight, such as 25% to70% by weight, based on the total weight of resin solids in the coating composition.

[0035] The coating composition may comprise an electron beam radiation curable, coating composition. As used herein, an “electron beam radiation curable, coating composition” refers to a composition that may be cured by exposure to electron beam radiation, and, in an at least partially cured state, is capable of producing a film, layer, or the like on at least a portion of a substrate surface. The electron beam radiation curable, coating composition may comprise monomers, oligomers, or prepolymers comprising unsaturated groups. The electron beam radiation curable, coating composition may comprise (meth) acrylate monomers, (meth)acrylate oligomers, or (meth)acrylate prepolymers. As used herein, the term “(meth)acrylate” and like terms is intended to include acrylates, methacrylates and their mixtures. The (meth)acrylate monomer may comprise a polyalkylene glycol di(meth)acrylate such as ethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, or 1,6- hexanediol di(meth)acrylate; pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, glycerol di(meth)acrylate, glycerol allyloxy di(meth)acrylate, 1,1,1 -tris(hydroxymethyl)ethane di(meth)acrylate, 1,1,1 -tris(hydroxymethyl)ethane tri(meth)acrylate, l,l,l-tris(hydroxymethyl)propane di(meth)acrylate, 1,1,1- tris(hydroxymethyl)propane tri(meth)acrylate, triallyl cyanurate, triallyl isocyanurate, triallyl trimellitate, diallyl phthalate, diallyl terephthalate, divinyl benzene, methylol (meth)acrylamide, triallylamine, and methylenebis (meth) acrylamide, and combination thereof.

[0036] The coatings composition may optionally comprise additional components commonly used in such compositions. The composition may further comprise a hindered aminelight stabilizer for UV degradation resistance. Such hindered amine light stabilizers include those disclosed in U.S. Patent Number 5,260,135. When they arc used, they arc typically present in the composition in an amount of 0.1 to 2 percent by weight, based on the total weight of resin solids in the film-forming composition. Other optional additives may be included such as pigments, colorants, plasticizers, abrasion-resistant particles, corrosion inhibitors, film strengthening particles, flow control agents, thixotropic agents, rheology modifiers, fillers, catalysts, antioxidants, biocides, defoamers, surfactants, wetting agents, dispersing aids, adhesion promoters, UV light absorbers, a stabilizing agent, organic cosolvents, reactive diluents, grind vehicles, and other customary auxiliaries, or combinations thereof. The term “colorant”, as used herein is as defined in U.S. Patent Publication No. 2012 / 0149820, paragraphs 29 to 38, the cited portion of which is incorporated herein by reference.

[0037] The coating composition and resulting dielectric coating may optionally further comprise a fire-retardant material. As used herein, “fire-retardant material” refers to a material that slows down or stops the spread of fire or reduces its intensity in comparison to the same coating composition not comprising said material, or the like. Fire-retardant materials may be available as powders that may be mixed with a composition, a foam, or a gel. When the compositions of the present disclosure include a fire-retardant material, such compositions may form a fire-retardant, dielectric coating.

[0038] As set forth in more detail below, a fire-retardant material can include a mineral, an organic compound, an organohalogen compound, an organophosphorous compound, or a combination thereof.

[0039] The mineral may comprise huntite, hydromagnesite, various hydrates, red phosphorous, boron compounds such as borates, carbonates such as calcium carbonate and magnesium carbonate, and combinations thereof.

[0040] The organohalogen compound may comprise organochlorines such as chlorendic acid derivatives and chlorinated paraffins; organobromines such as decabromodiphenyl ether (decaBDE), decabromodiphenyl ethane (a replacement for decaBDE), polymeric brominated compounds such as brominated polystyrenes, brominated carbonate oligomers (BCOs), brominated epoxy oligomers (BEOs), tetrabromophthalic anyhydride, tetrabromobisphenol A (TBBPA), and hexabromocyclododecane (HBCD). Such halogenated fire-retardant materialsmay be used in conjunction with a synergist to enhance their efficiency, such as antimony trioxidc, antimony pcntaoxidc, and sodium antimonate.

[0041] The organophosphorous compound may comprise triphenyl phosphate (TPP), resorcinol bis(diphenylphosphate) (RDP), bisphenol A diphenyl phosphate (BADP), and tricresyl phosphate (TCP); phosphonates such as dimethyl methylphosphonate (DMMP); and phosphinates such as aluminum diethyl phosphinate.

[0042] The fire-retardant material may comprise a compound containing both phosphorus and a halogen. Such compounds include tris(2,3-dibromopropyl) phosphate (brominated tris) and chlorinated organophosphates such as tris(l,3-dichloro-2-propyl)phosphate (chlorinated tris or TDCPP) and tetrakis(2-chlorethyl)dichloroisopentyldiphosphate (V6).

[0043] The organic compound may comprise a carboxylic acid, a dicarboxylic acid, melamine, and organonitrogen compounds.

[0044] The fire-retardant material may comprise ammonium polyphosphate and / or barium sulfate.

[0045] The fire-retardant material may be in the form of a pigment. The fire-retardant material pigment may have any particle shape or geometry, such as a regular or irregular shape, and may be spherical, ellipsoidal, cubical, platy, acicular (elongated or fibrous), rod-shaped, disk-shaped, prism-shaped, flake-shaped, irregular, rock-like, etc., agglomerates thereof, and any combination thereof.

[0046] The pigment may have a reported average particle size in at least one dimension of at least 0.01 microns, as reported by the manufacturer, such as at least 2 microns, such as at least 10 microns. The pigment may have a reported average particle size in at least one dimension of up to 100 microns or more, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than 25 microns. The pigment may have a reported average particle size in at least one dimension of 0.01 microns to 100 microns as reported by the manufacturer, such as 0.01 microns to 50 microns, such as 0.01 microns to 40 microns, such as 0.01 microns to 25 microns, such as 2 microns to 100 microns, such as 2 microns to 50 microns, such as 2 microns to 40 microns, such as 2 microns to 25 microns, such as 10 micron to 100 microns, such as 10 microns to 50 microns, such as 10 microns to 40 microns, such as 10 microns to 25 microns. Suitable methods of measuringaverage particle size include, for example, measurement using an instrument such as the Quanta 250 FEG SEM or an equivalent instrument.

[0047] The coating composition may comprise a liquid medium including water and / or organic solvents. Suitable organic solvents include glycols, glycol ether alcohols, alcohols, ketones, and aromatics, such as xylene and toluene, acetates, mineral spirits, naphthas and / or mixtures thereof. “Acetates” include the glycol ether acetates. The liquid medium can be a nonaqueous medium or organic solvent-based medium such that the composition is solventborne. “Non-aqueous medium,” “solventborne,” and like terms means that less than 50 wt% of the liquid medium is water with the balance being organic solvent(s), with the wt% based on the total weight of the liquid medium. For example, less than 10 wt%, or less than 5 wt%, or less than 2 wt%, of the liquid medium can be water, based on the total weight of the liquid medium. It will be understood that mixtures of solvents, including water in an amount of less than 50 wt% or containing no water, can constitute a “non-aqueous medium” and a “solventborne” composition. The composition may alternatively be aqueous or water-based or waterborne. This means that more than 50 wt% of the liquid medium is water, based on the total weight of the liquid medium. Such compositions have less than 50 wt%, such as less than 20 wt%, less than 10 wt%, less than 5 wt% or less than 2 wt% of organic solvent(s), based on the total weight of the liquid medium.

[0048] The coating composition, and resulting dielectric coating, may optionally further comprise a chromium-containing material. As used herein, the term “chromium-containing material” refers to materials that include a chromium in a +6 oxidation state such as, for example, a chromium trioxide group, CrOa, a chromate anion, CrO42', or a dichromate anion, CnCE2’. The chromium-containing material may comprise chromic acid, chromium trioxide, chromic acid anhydride, dichromate salts, such as ammonium dichromate, sodium dichromate, potassium dichromate, and calcium, barium, magnesium, zinc, cadmium, and strontium dichromate.

[0049] Alternatively, the coating composition, and resulting dielectric coating, may be substantially free, essentially free, or completely free of chromium-containing material. As used herein, the term “substantially free” with respect to chromium-containing material means that the material is present in the composition or resulting dielectric coating, if at all, an in amount of less than 2% by weight, based on the total solids weight of the coating composition or on the totalweight of the cured dielectric coating. As used herein, the term “essentially free” with respect to chromium-containing material means that the material is present in the composition or resulting dielectric coating, if at all, an in amount of less than 0.05% by weight, based on the total solids weight of the coating composition or on the total weight of the cured dielectric coating. As used herein, the term “completely free” means that the material is not present in the composition or resulting dielectric coating at a detectable amount.

[0050] The metal sheet or coil comprise metal or metal alloys that may include, but are not limited to tin, steel, cold rolled steel, hot rolled steel, steel coated with zinc metal, zinc metal, zinc alloys, electrogalvanized steel, hot-dipped galvanized steel, galvalume, steel plated with zinc alloy such as zinc-aluminum alloy or zinc-aluminum-magnesium alloy, stainless steel, zincaluminum alloy, magnesium alloy coated steel, zinc-aluminum alloys, aluminum, aluminum alloys, such as those of the 2XXX, 3XXX, 4XXX, 5XXX, 6XXX, or 7XXX series, clad aluminum alloys, cast aluminum alloys such as of the A356 series, aluminum plated steel, aluminum alloy plated steel, steel coated with a zinc-aluminum alloy, magnesium, magnesium alloys such as alloys of the AZ31B, AZ91C, AM60B, or EV31A series, nickel, nickel plating, bronze, tinplate, clad, titanium, titanium alloys, brass, copper, copper alloys, silver, gold, cast or forged metals and alloys, or combinations thereof.

[0051] The metal sheet or coil may have a thickness of 150 to 2,000 microns, such as 200 to 1,500 microns, such as 300 to 1,000 microns.

[0052] The metal sheet or coil can undergo various treatments prior to application of the dielectric coating composition. For instance, the metal sheet or coil can be alkaline cleaned, deoxidized, mechanically cleaned, ultrasonically cleaned, solvent wiped, roughened, plasma cleaned or etched, exposed to chemical vapor deposition, treated with an adhesion promoter, plated, acid pickled, plasma treated, laser treated, or ion vapor deposition (IVD) treated, anodized, annealed, cladded, or any combination thereof prior to application of the dielectric coating composition. The metal sheet or coil can be treated using any of the previously described methods prior to application of the dielectric coating composition such as by dipping the metal sheet or coil in a cleaner and / or deoxidizer bath prior to applying the dielectric coating composition. The metal sheet or coil can also be plated prior to applying the dielectric coating composition. As used herein, “plating” refers to depositing a metal over a surface of the metal sheet or coil.

[0053] It will also be understood that the metal sheet or coil may be pretreated with a pretreatment solution to result in the formation of a pretreatment layer on the metal sheet or coil. Non-limiting examples of a pretreatment solution include a zinc phosphate pretreatment solution such as those described in U.S. Patent Nos. 4,793,867 and 5,588,989, a zirconium containing pretreatment solution such as those described in U.S. Patent Nos. 7,749,368 and 8,673,091. Other pretreatment solutions include those comprising trivalent chromium, hexavalent chromium, lithium salts, permanganate, rare earth metals, such as yttrium, or lanthanides, such as cerium. Another surface pretreatment solution is a solgel, such as those comprising alkoxysilanes, alkoxy-zirconates, and / or alkoxy-titanates. Alternatively, the metal sheet or coil may be a non-pretreated substrate, such as a bare substrate, that is not pretreated by a pretreatment solution. By “bare” is meant a virgin metal substrate that has not been treated with any pretreatment compositions such as conventional phosphating baths, heavy metal rinses, etc.

[0054] The coating composition is applied to the metal sheet or coil by a coil coating method or operation. The coating may be applied onto a portion or all of the first surface of the metal sheet or coil. The coil coating method is not limited and any suitable method may be used.

[0055] In a coil coating operation, as will be appreciated by those skilled in the art, the metal coil passes through a coil coating line at a speed adapted to the application and curing properties of the coatings that are employed. The speed may therefore vary very widely from one coating process to another. In examples, the line speed may be from 10 to 200, such as 12 to 150, 16 to 120, or from 20 to 100 m / min. The coating composition may be applied to the moving coil in any suitable manner, such as, for example, spraying, flow coating, or roller coating. If two or more coatings and / or coating compositions are applied during the coil coating operation, this is carried out in an appropriately configured line, in which two or more applications and, where appropriate, curing stations are interposed in series. Alternatively, following application and curing of the first coating material, the coated coil is wound up again and is then provided on one or both sides with second, third, etc. coatings in a second, third, etc. coil coating line.

[0056] Following the production of the coated coils, they can be wound up and then processed further at another place; alternatively, they can be processed further as they come directly from the coil coating operation.

[0057] The dielectric coating may have a dry film thickness of at least 5 microns, such as at least 10 microns, such as at least 15 microns, such as at least 20 microns, such as at least 30 microns, such as at least 35 microns, such as at least 50 microns, such as at least 75 microns, The dielectric coating may have a dry film thickness of no more than 500 microns, such as no more than 400 microns, such as no more than 300 microns, such as no more than 200 microns, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than no more than 30 microns, such as no more than 25 microns, such as no more than 20 microns. The dielectric coating may have a dry film thickness of 5 to 500 microns, such as 5 to 400 microns, such as 5 to 300 microns, such as 5 to 200 microns, such as 5 to 100 microns, such as 5 to 50 microns, such as 5 to 40 microns, such as 5 to 30 microns, such as 5 to 25 microns, such as 5 to 20 microns, such as 10 to 500 microns, such as 10 to 400 microns, such as 10 to 300 microns, such as 10 to 200 microns, such as 10 to 100 microns, such as 10 to 50 microns, such as 10 to 40 microns, such as 10 to 30 microns, such as 10 to 25 microns, such as 10 to 20 microns, such as 15 to 500 microns, such as 15 to 400 microns, such as 15 to 300 microns, such as 15 to 200 microns, such as 15 to 100 microns, such as 15 to 50 microns, such as 15 to 40 microns, such as 15 to 30 microns, such as 15 to 25 microns, such as 15 to 20 microns, such as 20 to 500 microns, such as 20 to 400 microns, such as 20 to 300 microns, such as 20 to 200 microns, such as 20 to 100 microns, such as 20 to 50 microns, such as 20 to 40 microns, such as 20 to 30 microns, such as 20 to 25 microns, such as 25 to 500 microns, such as 25 to 400 microns, such as 25 to 300 microns, such as 25 to 200 microns, such as 25 to 100 microns, such as 25 to 50 microns, such as 25 to 40 microns, such as 25 to 30 microns, such as 30 to 500 microns, such as 30 to 400 microns, such as 30 to 300 microns, such as 30 to 200 microns, such as 30 to 100 microns, such as 30 to 50 microns, such as 30 to 40 microns, such as 35 to 500 microns, such as 35 to 400 microns, such as 35 to 300 microns, such as 35 to 200 microns, such as 35 to 100 microns, such as 35 to 50 microns, such as 35 to 40 microns, such as 50 to 500 microns, such as 50 to 400 microns, such as 50 to 300 microns, such as 50 to 200 microns, such as 50 to 100 microns, such as 75 to 500 microns, such as 75 to 400 microns, such as 75 to 300 microns, such as 75 to 200 microns, such as 75 to 100 microns.

[0058] The dielectric coating may be a monolayer coating comprising a single coating layer. The monolayer coating may comprise any chemistry discussed above such as, an organic resin component, such as, an aromatic polyester resin, an aliphatic polyester resin, or an epoxyresin, and optionally a curing agent, such as, a blocked or unblocked polyisocyanate or melamine resin. The dry film thickness of the monolayer coating may be at least 5 microns, such as at least 10 microns, such as at least 15 microns, such as at least 20 microns, such as at least 30 microns, such as at least 35 microns, such as at least 50 microns, such as at least 75 microns. The dry film thickness of the monolayer may be no more than 200 microns, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than no more than 30 microns, such as no more than 25 microns, such as no more than 20 microns. The dry film thickness of the monolayer may be 5 to 200 microns, such as 5 to 100 microns, such as 5 to 50 microns, such as 5 to 40 microns, such as 5 to 30 microns, such as 5 to 25 microns, such as 5 to 20 microns, such as 10 to 200 microns, such as 10 to 100 microns, such as 10 to 50 microns, such as 10 to 40 microns, such as 10 to 30 microns, such as 10 to 25 microns, such as 10 to 20 microns, such as such as 15 to 200 microns, such as 15 to 100 microns, such as 15 to 50 microns, such as 15 to 40 microns, such as 15 to 30 microns, such as 15 to 25 microns, such as 15 to 20 microns, such as 20 to 200 microns, such as 20 to 100 microns, such as 20 to 50 microns, such as 20 to 40 microns, such as 20 to 30 microns, such as 20 to 25 microns, such as 25 to 200 microns, such as 25 to 100 microns, such as 25 to 50 microns, such as 25 to 40 microns, such as 25 to 30 microns, such as 30 to 200 microns, such as 30 to 100 microns, such as 30 to 50 microns, such as 30 to 40 microns, such as 35 to 200 microns, such as 35 to 100 microns, such as 35 to 50 microns, such as 35 to 40 microns, such as 50 to 200 microns, such as 50 to 100 microns, such as 75 to 200 microns, such as 75 to 100 microns.

[0059] The dielectric coating may comprise a multi-layer coating stack comprising two or more coating layers. The multi-layer coating stack may comprise a first coating layer comprising a basecoat; a second coating layer comprising a first clearcoat; optionally a third coating layer comprising a second clearcoat; further optionally a fourth coating layer comprising a third clearcoat; and optionally further coating layers. Each of the coating layers may have the same of different organic resin components than the other coating layer(s). The first coating layer may comprise a basecoat having one chemistry and each successive coating layer may have a chemistry that is the same or different than the basecoat and the same as the other coating laycr(s). The first coating layer may comprise a basecoat comprising a polyester resin, and each successive coating layer may comprise a clearcoat comprising a polyester resin. The first coating layer may comprise a basecoat comprising an aromatic polyester resin, and eachsuccessive coating layer may comprise a clearcoat comprising an aliphatic polyester resin. The first coating layer may comprise a thermosetting coating layer and the second coating layer may comprise an electron beam-curing coating layer. The multi-layer coating stack may comprise at least one thermosetting coating layer and at least one electron beam-curing coating layer. Each of the coating layers of the multi-layer coating stack may have a dry film thickness of at least 5 microns, such as at least 10 microns, such as at least 15 microns, such as at least 20 microns, such as at least 30 microns, such as at least 35 microns, such as at least 50 microns, such as at least 75 microns. Each of the coating layers of the multi-layer coating stack may have a dry film thickness of no more than 200 microns, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than no more than 30 microns, such as no more than 25 microns, such as no more than 20 microns. Each of the coating layers of the multi-layer coating stack may have a dry film thickness of 5 to 200 microns, such as 5 to 100 microns, such as 5 to 50 microns, such as 5 to 40 microns, such as 5 to 30 microns, such as 5 to 25 microns, such as 5 to 20 microns, such as 10 to 200 microns, such as 10 to 100 microns, such as 10 to 50 microns, such as 10 to 40 microns, such as 10 to 30 microns, such as 10 to 25 microns, such as 10 to 20 microns, such as such as 15 to 200 microns, such as 15 to 100 microns, such as 15 to 50 microns, such as 15 to 40 microns, such as 15 to 30 microns, such as 15 to 25 microns, such as 15 to 20 microns, such as 20 to 200 microns, such as 20 to 100 microns, such as 20 to 50 microns, such as 20 to 40 microns, such as 20 to 30 microns, such as 20 to 25 microns, such as 25 to 200 microns, such as 25 to 100 microns, such as 25 to 50 microns, such as 25 to 40 microns, such as 25 to 30 microns, such as 30 to 200 microns, such as 30 to 100 microns, such as 30 to 50 microns, such as 30 to 40 microns, such as 35 to 200 microns, such as 35 to 100 microns, such as 35 to 50 microns, such as 35 to 40 microns, such as 50 to 200 microns, such as 50 to 100 microns, such as 75 to 200 microns, such as 75 to 100 microns.

[0060] The component may be free of any additional organic coating layers between the surface of the metal sheet or coil and the dielectric coating.

[0061] The component may be formed from the metal sheet or coil comprising a first surface and a dielectric coating, as described above, on the first surface. The method of forming the component is not limited and may include stamping, pressing, bending, flanging, hydroforming, punching, deep drawing, shear forming, cutting, roll forming, and the like.

[0062] The component may comprise part of an electrical energy storage device, such as an electrochemical electrical energy storage device. The electrical energy storage device may comprise a cell, a battery, a battery pack, a secondary battery, a capacitor, or a supercapacitor. The electrical energy storage device may be a lithium ion battery. The end use of the electrical energy storage device is not limited and may include batteries for automotive vehicles (including, but not limited to full electric and hybrid vehicles), aerospace vehicles, industrial equipment, tools, stationary storage, or consumer electronics. The substrate may comprise a battery or battery component. The component may comprise a battery cell, a battery shell, a battery module, a battery pack, a battery box, a battery cell casing, a pack shell, a battery lid and tray, a thermal management system, an inverter, a battery housing, a module housing, a module racking, a battery side plate, a battery cell enclosure, a cooling module, a cooling tube, a cooling fin, a cooling plate, cold plate assembly, a bus bar, a battery frame, an electrical connection, or any pail of a stationary energy storage system.

[0063] As used herein, “vehicle” or variations thereof include civilian, commercial, and military aircraft and / or land vehicles, such as airplanes, helicopters, cars, motorcycles, electric bikes, and / or trucks.

[0064] After the component is formed, the component includes the first surface at least partially coated with the dielectric coating, and the component may be included in an electrical energy storage device by any suitable method known in the art. The component may optionally further comprise at least one edge that is not coated with the dielectric coating. An adhesive may be applied over the uncoated edge to bind the component to a second component of the electrical energy storage device or to a second component that is not part of the electrical energy storage device. The second component may optionally also comprise the dielectric coating on a surface thereof.

[0065] The present disclosure is also directed to a method of making a component of an electrical energy storage device comprising applying a dielectric coating composition onto a first surface of a metal sheet or coil by a coil coating operation to form a dielectric coating and forming the metal sheet or coil to form the component. The method optionally may comprise applying the dielectric coating to the first surface of the metal sheet or coil before forming the metal sheet or coil to form the component. The method may further comprise exposing the dielectric coating applied to the first surface of the metal sheet or coil to a thermal energy sourceor an electron beam source to cure the dielectric. The curing of the dielectric coating may occur before or after forming the metal sheet or coil to form the component.

[0066] The present disclosure is also directed to an electrical energy storage device comprising the component described herein. The component may comprise at least one edge that is not coated with the dielectric coating, and an adhesive may be applied over the edge in order to bind the component to a second component. The second component may be part of the electrical energy storage device or a component that is not part of the electrical energy storage device.

[0067] For purposes of this detailed description, it is to be understood that the disclosure may assume alternative variations and sequences, except where expressly specified to the contrary.

[0068] The numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard variation found in their respective testing measurements.

[0069] Also, it should be understood that any numerical range recited herein is intended to include all sub-ranges subsumed therein. For example, a range of “1 to 10” is intended to include all sub-ranges between (and including) the recited minimum value of 1 and the recited maximum value of 10, that is, having a minimum value equal to or greater than 1 and a maximum value of equal to or less than 10.

[0070] As used herein, “including,” “containing” and like terms arc understood in the context of this application to be synonymous with “comprising” and are therefore open-ended and do not exclude the presence of additional undescribed or unrecited elements, materials, ingredients or method steps. Nevertheless, they also include the more restrictive terms “consisting of’ and “consisting essentially of’. As used herein, “consisting of’ is understood in the context of this application to exclude the presence of any unspecified element, ingredient or method step. As used herein, “consisting essentially of’ is understood in the context of this application to include the specified elements, materials, ingredients or method steps “and those that do not materially affect the basic and novel characteristic(s)” of what is being described.

[0071] In this application, the use of “or” means “and / or” unless specifically stated otherwise, even though “and / or” may be explicitly used in certain instances.

[0072] Whereas specific aspects of the disclosure have been described in detail, it will be appreciated by those skilled in the ait that various modifications and alternatives to those details could be developed in light of the overall teachings of the disclosure. Accordingly, the particular arrangements disclosed are meant to be illustrative only and not limiting as to the scope of the disclosure which is to be given the full breadth of the claims appended and any and all equivalents thereof.ASPECTS

[0073] Aspect 1. A component of an electrical energy storage device, wherein the component is formed from a metal sheet or coil and comprises: a first surface; and a dielectric coating on the first surface.

[0074] Aspect 2. The component of aspect 1 , wherein the component formed from the metal sheet or coil is formed by stamping.

[0075] Aspect 3. The component of any of the preceding aspects, wherein the dielectric coating comprises a monolayer coating.

[0076] Aspect 4. The component of aspect 1 or 2, wherein the dielectric coating comprises a multi-layer coating stack comprising: a first coating layer comprising a basecoat; and a second coating layer comprising a clearcoat.

[0077] Aspect 5. The component of aspect 4, wherein the multi-coating layer coating stack further comprises a third coating layer comprising a clearcoat and optionally a fourth coating layer comprising a clearcoat.

[0078] Aspect 6. The component of aspect 5, wherein the second coating layer, third coating layer and optional fourth coating layer are the same.

[0079] Aspect 7. The component of any of aspects 4-6, wherein the basecoat comprises a polyester resin, and each clearcoat comprises a polyester resin.

[0080] Aspect 8. The component of any of aspects 4-6, wherein the basecoat comprises an aromatic polyester resin, and each clearcoat comprises an aromatic polyester resin.

[0081] Aspect 9. The component of any of the preceding aspects, wherein the organic film-forming resin has a weight average molecular weight of 1 ,500 to 50,000 g / mol, such as 1,500 to 25,000 g / mol, such as 1,500 to 15,000 g / mol, such as 1,500 to 10,000 g / mol, such as 3,000 to 50,000 g / mol, such as 3,000 to 25,000 g / mol, such as 3,000 to 15,000 g / mol,such as 3,000 to 10,000 g / mol, such as 4,000 to 50,000 g / mol, such as 4,000 to 25,000 g / mol, such as 4,000 to 15,000 g / mol, such as 4,000 to 10,000 g / mol.

[0082] Aspect 10. The component of any of the preceding aspects, wherein the organic film-forming resin has a weight average molecular weight of 4,000 to 10,000 g / mol.

[0083] Aspect 11. The component of any of the preceding aspects, wherein the organic film- forming resin has a hydroxyl value of 1 to 180 mg KOH / gram resin, such as 1 to 100 mg KOH / gram resin, such as 1 to 70 mg KOH / gram resin, such as 1 to 55 mg KOH / gram resin, such as 10 to 180 mg KOH / gram resin, such as 10 to 100 mg KOH / gram resin, such as 10 to 70 mg KOH / gram resin, such as 10 to 55 mg KOH / gram resin, such as 20 to 180 mg KOH / gram resin, such as 20 to 100 mg KOH / gram resin, such as 20 to 70 mg KOH / gram resin, such as 20 to 55 mg KOH / gram resin, such as 30 to 180 mg KOH / gram resin, such as 30 to 100 mg KOH / gram resin, such as 30 to 70 mg KOH / gram resin, such as 30 to 55 mg KOH / gram resin.

[0084] Aspect 12. The component of any of the preceding aspects, wherein the organic film-forming resin has a hydroxyl value of 20 to 70 mg KOH / gram resin.

[0085] Aspect 13. The component of any of the preceding aspects, wherein the organic film-forming resin may have an acid value of 0.1 to 30 mg KOH / gram resin, such as 0.1 to 15 mg KOH / gram resin, such as 0.1 to 10 mg KOH / gram resin, such as 1 to 30 mg KOH / gram resin, such as 1 to 15 mg KOH / gram resin, such as 1 to 10 mg KOH / gram resin, such as 2 to 30 mg KOH / gram resin, such as 2 to 15 mg KOH / gram resin, such as 2 to 10 mg KOH / gram resin, such as 3 to 30 mg KOH / gram resin, such as 3 to 15 mg KOH / gram resin, such as 3 to 10 mg KOH / gram resin.

[0086] Aspect 14. The component of any of the preceding aspects, wherein the organic film-forming resin may have an acid value of 3 to 10 mg KOH / gram resin.

[0087] Aspect 15. The component of any of the preceding aspects, wherein the organic film-forming resin may have a glass transition temperature of 0°C to 50°C, such as 0° to 30°C, such as 0°C to 20°C, such as 5°C to 50°C, such as 5° to 30°C, such as 5°C to 20°C, such as 10°C to 50°C, such as 10° to 30°C, such as 10°C to 20°C.

[0088] Aspect 16. The component of any of the preceding aspects, wherein the organic film-forming resin may have a glass transition temperature of 10° to 30°C.

[0089] Aspect 17. The component of any of the preceding aspects, wherein the dielectric coating further comprises a pigment.

[0090] Aspect 18. The component of aspect 17, wherein the basecoat and / or one or more of the clearcoat layers comprise the pigment.

[0091] Aspect 19. The component of any of the preceding aspects, wherein the dielectric coating further comprises a fire-retardant pigment.

[0092] Aspect 20. The component of any of aspects 3-19, wherein the monolayer coating or the first coating layer of the multi-layer coating stack has a dry film thickness of at least 5 microns, such as at least 10 microns, such as at least 15 microns, such as at least 20 microns, such as at least 30 microns, such as at least 35 microns, such as at least 50 microns, such as at least 75 microns, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than no more than 30 microns, such as no more than 25 microns, such as no more than 20 microns, such as 5 to 200 microns, such as 5 to 100 microns, such as 5 to 50 microns, such as 5 to 40 microns, such as 5 to 30 microns, such as 5 to 25 microns, such as 5 to 20 microns, such as 10 to 200 microns, such as 10 to 100 microns, such as 10 to 50 microns, such as 10 to 40 microns, such as 10 to 30 microns, such as 10 to 25 microns, such as 10 to 20 microns, such as such as 15 to 200 microns, such as 15 to 100 microns, such as 15 to 50 microns, such as 15 to 40 microns, such as 15 to 30 microns, such as 15 to 25 microns, such as 15 to 20 microns, such as 20 to 200 microns, such as 20 to 100 microns, such as 20 to 50 microns, such as 20 to 40 microns, such as 20 to 30 microns, such as 20 to 25 microns, such as 25 to 200 microns, such as 25 to 100 microns, such as 25 to 50 microns, such as 25 to 40 microns, such as 25 to 30 microns, such as 30 to 200 microns, such as 30 to 100 microns, such as 30 to 50 microns, such as 30 to 40 microns, such as 35 to 200 microns, such as 35 to 100 microns, such as 35 to 50 microns, such as 35 to 40 microns, such as 50 to 200 microns, such as 50 to 100 microns, such as 75 to 200 microns, such as 75 to 100 microns.

[0093] Aspect 21. The component of any of aspects 4-20, wherein the second coating layer, optional third coating layer, and / or optional fourth coating layer each independently have a dry film thickness of at least 5 microns, such as at least 10 microns, such as at least 15 microns, such as at least 20 microns, such as at least 30 microns, such as at least 35 microns, such as at least 50 microns, such as at least 75 microns, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than no more than 30microns, such as no more than 25 microns, such as no more than 20 microns, such as 5 to 200 microns, such as 5 to 100 microns, such as 5 to 50 microns, such as 5 to 40 microns, such as 5 to 30 microns, such as 5 to 25 microns, such as 5 to 20 microns, such as 10 to 200 microns, such as 10 to 100 microns, such as 10 to 50 microns, such as 10 to 40 microns, such as 10 to 30 microns, such as 10 to 25 microns, such as 10 to 20 microns, such as such as 15 to 200 microns, such as 15 to 100 microns, such as 15 to 50 microns, such as 15 to 40 microns, such as 15 to 30 microns, such as 15 to 25 microns, such as 15 to 20 microns, such as 20 to 200 microns, such as 20 to 100 microns, such as 20 to 50 microns, such as 20 to 40 microns, such as 20 to 30 microns, such as 20 to 25 microns, such as 25 to 200 microns, such as 25 to 100 microns, such as 25 to 50 microns, such as 25 to 40 microns, such as 25 to 30 microns, such as 30 to 200 microns, such as 30 to 100 microns, such as 30 to 50 microns, such as 30 to 40 microns, such as 35 to 200 microns, such as 35 to 100 microns, such as 35 to 50 microns, such as 35 to 40 microns, such as 50 to 200 microns, such as 50 to 100 microns, such as 75 to 200 microns, such as 75 to 100 microns.

[0094] Aspect 22. The component of any of the preceding aspects, wherein the dielectric coating has a dry film thickness of at least 5 microns, such as at least 10 microns, such as at least 15 microns, such as at least 20 microns, such as at least 30 microns, such as at least 35 microns, such as at least 50 microns, such as at least 75 microns, such as no more than 500 microns, such as no more than 400 microns, such as no more than 300 microns, such as no more than 200 microns, such as no more than 100 microns, such as no more than 50 microns, such as no more than 40 microns, such as no more than no more than 30 microns, such as no more than 25 microns, such as no more than 20 microns, such as 5 to 500 microns, such as 5 to 400 microns, such as 5 to 300 microns, such as 5 to 200 microns, such as 5 to 100 microns, such as 5 to 50 microns, such as 5 to 40 microns, such as 5 to 30 microns, such as 5 to 25 microns, such as 5 to 20 microns, such as 10 to 500 microns, such as 10 to 400 microns, such as 10 to 300 microns, such as 10 to 200 microns, such as 10 to 100 microns, such as 10 to 50 microns, such as 10 to 40 microns, such as 10 to 30 microns, such as 10 to 25 microns, such as 10 to 20 microns, such as 15 to 500 microns, such as 15 to 400 microns, such as 15 to 300 microns, such as 15 to 200 microns, such as 15 to 100 microns, such as 15 to 50 microns, such as 15 to 40 microns, such as 15 to 30 microns, such as 15 to 25 microns, such as 15 to 20 microns, such as 20 to 500 microns, such as 20 to 400 microns, such as 20 to 300 microns, such as 20 to 200 microns, suchas 20 to 100 microns, such as 20 to 50 microns, such as 20 to 40 microns, such as 20 to 30 microns, such as 20 to 25 microns, such as 25 to 500 microns, such as 25 to 400 microns, such as 25 to 300 microns, such as 25 to 200 microns, such as 25 to 100 microns, such as 25 to 50 microns, such as 25 to 40 microns, such as 25 to 30 microns, such as 30 to 500 microns, such as 30 to 400 microns, such as 30 to 300 microns, such as 30 to 200 microns, such as 30 to 100 microns, such as 30 to 50 microns, such as 30 to 40 microns, such as 35 to 500 microns, such as 35 to 400 microns, such as 35 to 300 microns, such as 35 to 200 microns, such as 35 to 100 microns, such as 35 to 50 microns, such as 35 to 40 microns, such as 50 to 500 microns, such as 50 to 400 microns, such as 50 to 300 microns, such as 50 to 200 microns, such as 50 to 100 microns, such as 75 to 500 microns, such as 75 to 400 microns, such as 75 to 300 microns, such as 75 to 200 microns, such as 75 to 100 microns.

[0095] Aspect 23. The component of any of the preceding aspects, wherein the dielectric coating has a dry film thickness of 30 to 60 microns.

[0096] Aspect 24. The component of any of the preceding aspects, further comprising a pretreatment layer between the metal sheet and the dielectric coating.

[0097] Aspect 25. The component of aspect 24, wherein the pretreatment layer is substantially free, essentially free, or completely free of chromium-containing material.

[0098] Aspect 26. The component of any of the preceding aspects, wherein there is no organic coating layer between the surface of the metal sheet or coil and the dielectric coating.

[0099] Aspect 27. The component of any of the preceding aspects, wherein the metal sheet or coil comprises aluminum, an aluminum alloy, cold-rolled steel, galvanized steel, or steel plated with a zinc alloy.

[0100] Aspect 28. The component of any of the preceding aspects, wherein the metal sheet or coil comprises a 3000 series aluminum alloy.

[0101] Aspect 29. The component of any of the preceding aspects, wherein the metal sheet or coil has a thickness of 150 to 2,000 microns.

[0102] Aspect 30. The component of any of the preceding aspects, wherein the metal sheet or coil has an edge that is not coated with the dielectric coating.

[0103] Aspect 31. The component of any of the preceding aspects, wherein the dielectric coating stack is applied by a coil coating operation.

[0104] Aspect 32. The component of any of the preceding aspects, wherein the dielectric coating is applied from an electron beam radiation curable, coating composition.

[0105] Aspect 33. The component of any of the preceding aspects, wherein the dielectric coating has a dielectric strength of at least 1 kV at a dry film thickness of 40 microns or less, as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test, or at least 2 kV, or at least 2.5 kV, or at least 5kV, or at least 7kV, or at least 8kV, or at least lOkV, or at least 12kV.

[0106] Aspect 34. The component of any of the preceding aspects, wherein the dielectric coating has a dielectric strength of at least 5 kV at a dry film thickness of 40 microns or less, as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test.

[0107] Aspect 35. The component of any of the preceding aspects, wherein the dielectric coating has a dielectric strength of at least 7 kV at a dry film thickness of 40 microns or less, as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test.

[0108] Aspect 36. The component of any of the preceding aspects, wherein the electrical energy storage device is an electrochemical electrical energy storage device.

[0109] Aspect 37. The component of any of the preceding aspects, wherein the component comprises a battery cell, a battery shell, a battery module, a battery pack, a battery box, a battery cell casing, a pack shell, a battery lid and tray, a thermal management system, an inverter, a battery housing, a module housing, a module racking, a battery side plate, a battery cell enclosure, a cooling module, a cooling tube, a cooling fin, a cooling plate, cold plate assembly, a bus bar, a battery frame, an electrical connection, or any part of a stationary electrical energy storage system.

[0110] Aspect 38. The component of any of the preceding aspects, wherein the component comprises a battery tray.

[0111] Aspect 39. A method of making the component of any of the preceding aspects, the method comprising: applying a dielectric coating composition onto the first surface of the metal sheet or coil by a coil coating operation to form the dielectric coating; and forming the metal sheet or coil to form the component.

[0112] Aspect 40. The method of aspect 39, wherein the dielectric coating is applied before forming the metal sheet or coil to form the component.

[0113] Aspect 41. The method of aspect 39 or 40, wherein the method further comprises exposing the dielectric coating to an electron beam source to cure the dielectric coating.

[0114] Aspect 42. The method of aspects 39-41, wherein the method further comprises exposing the dielectric coating to a thermal energy source to cure the dielectric coating.

[0115] Aspect 43. The method of any of the preceding aspects 39-42, wherein forming the metal sheet or coil comprises stamping the metal sheet or coil.

[0116] Aspect 44. The method of any of the preceding aspects 39-42, wherein forming the metal sheet or coil comprises stamping, pressing, bending, flanging, hydroforming, punching, deep drawing, shear forming, cutting, or roll forming.

[0117] Aspect 45. An electrical energy storage device comprising the component of any of the preceding aspects 1-38.

[0118] Aspect 46. The electrical energy storage device of aspect 45, wherein the component comprises an edge that is not coated with the dielectric coating, and further comprises an adhesive over the edge that binds the component to a second component of the electrical energy storage device.

[0119] Illustrating the disclosure are the following examples, which, however, are not to be considered as limiting the disclosure to their details. Unless otherwise indicated, all parts and percentages in the following examples, as well as throughout the specification, are by weight.EXAMPLESExample 1

[0120] A exemplary component comprising a two-layer dielectric coating was prepared as follows: A 0.5 mm thick aluminum coil was coil coated using a drawdown coating method with a first basecoat coating composition that included a hydroxyl-functional polyester resin and a melamine curing agent. The coating was cured at 232°C to form a basecoat layer having a dry film thickness of 20 microns. The first basecoat coating composition had the following formula:169% solids, Mwof 4,000, Tg 18-20°C, hydroxyl value of 47-53 mg KOH / mg resin; acid value of 5-8 mg KOH / mg resin.270% solids, Mwof 7,500, Tg 14-16°C, hydroxyl value of 30-38 mg KOH / mg resin; acid value of 6-8 mg KOH / mg resin.3Bisphenol A based epoxy resin having an epoxide equivalent weight of 184-190 g / equivalent of epoxide functional group.

[0121] Next, a clcarcoat coating composition that included a hydroxyl-functional polyester resin and a melamine curing agent was coil coated onto the basecoat layer and cured at 241 °C to form a clearcoat layer having a dry film thickness of 20 microns. The clearcoat coating composition had the following formula:169% solids, Mwof 4,000, Tg 18-20°C, hydroxyl value of 47-53 mg KOH / mg resin; acid value of 5-8 mg KOH / mg resin.

[0122] The two-layer dielectric coating had a total thickness of 40 microns.

[0123] The dielectric strength of the dielectric coating of the component was measured using a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 149-09 Hipot test. The dielectric strength of three separate panels coated according to this procedure was measured3 times each and averaged over the nine values to result in a dielectric strength of 7 kV.

[0124] It will be appreciated by skilled artisans that modifications and variations are possible in light of the above disclosure without departing from the concepts described andexemplified herein. Accordingly, it is therefore to be understood that the foregoing disclosure is merely illustrative of various exemplary aspects of this application and that modifications and variations can be readily made by skilled artisans which are within the spirit and scope of this application and the accompanying claims.

Claims

What is claimed is:

1. A component of an electrical energy storage device, wherein the component is formed from a metal sheet or coil and comprises: a first surface; and a dielectric coating on the first surface.

2. The component of claim 1, wherein the component formed from the metal sheet or coil is formed by stamping.

3. The component of any of the preceding claims, wherein the dielectric coating is a monolayer coating.

4. The component of claim 1 or 2, wherein the dielectric coating is a multi-layer coating stack comprising: a first coating layer comprising a basecoat; and a second coating layer comprising a first clearcoat.

5. The component of claim 4, wherein the multi-coating layer coating stack further comprises a third coating layer comprising a second clearcoat and optionally a fourth coating layer comprising a third clearcoat.

6. The component of any of claims 4 or 5, wherein the basecoat comprises a polyester resin, and each clearcoat comprises a polyester resin.

7. The component of any of claims 4 or 5, wherein the basecoat comprises an aromatic polyester resin and an aromatic polyester resin, and each clearcoat comprises an aromatic polyester resin.

8. The component of any of the preceding claims, wherein the dielectric coating further comprises a pigment.

9. The component of claim 8, wherein the basecoat and / or one or more of the clcarcoat layers comprise the pigment.

10. The component of any of the preceding claims, wherein the dielectric coating further comprises a fire-retardant material.

11. The component of any of the preceding claims, further comprising a pretreatment layer between the first surface and the dielectric coating.

12. The component of any of the preceding claims, wherein the metal sheet or coil comprises a 3000 series aluminum alloy.

13. The component of any of the preceding claims, wherein the metal sheet or coil has an edge that is not coated with the dielectric coating.

14. The component of any of the preceding claims, wherein the dielectric coating is applied by a coil coating operation.

15. The component of any of the preceding claims, wherein the dielectric coating comprises an electron beam radiation curable, coating composition.

16. The component of any of the preceding claims, wherein the dielectric coating has a dielectric strength of at least 1 kV at a dry film thickness of 30 microns or less, as measured by a Sefelec Dielectrimeter RMG12AC-DC and in accordance ASTM D 1 9-09 Hipot test, or at least 2 kV, or at least 2.5 kV, or at least 5kV, or at least 7kV, or at least 8kV, or at least lOkV, or at least 12kV.

17. The component of any of the preceding claims, wherein the dielectric coating has a dry film thickness of at least 5 microns.

18. The component of any of the preceding claims, wherein the component comprises a battery cell, a battery shell, a battery module, a battery pack, a battery box, a battery cell casing, a pack shell, a battery lid and tray, a thermal management system, an inverter, a battery housing, a module housing, a module racking, a battery side plate, a battery cell enclosure, a cooling module, a cooling tube, a cooling fin, a cooling plate, cold plate assembly, a bus bar’, a battery frame, an electrical connection, or any part of a stationary electrical energy storage system.

19. A method of making the component of any of claims 1-18 comprising; applying a dielectric coating composition onto the first surface of the metal sheet or coil by a coil coating operation to form the dielectric coating; and forming the metal sheet or coil to form the component.

20. An electrical energy storage device comprising the component of any of the preceding claims 1-18.

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